Semiconductor device

Abstract

The present invention improves reliability. A semiconductor device according to an embodiment which comprises a first member having a side wall surrounding an opening part for housing an electronic component and a receiving part provided so as to protrude from the side wall toward the opening part, and a second member which extends in a first direction, has an engagement part for mating with the receiving part, and covers at least part of the opening part, wherein: the engagement part has an extension part extending in the first direction, and a pair of engaging claws which project from the extension part at the bottom end thereof toward one end side and another end side in a second direction orthogonal to the first direction; each of the engaging claws has a first engagement surface that is angled relative to the first direction and is continuous with a side surface of the extension part that intersects the first direction; the receiving part has a pair of projecting parts that are provided so as to face each of the first engagement surfaces and include a projection surface which is angled relative to the first direction; and the lower side of the first engagement surfaces and the lower side of the projection surfaces are angled so as to become increasingly higher in a direction toward the side wall in a third direction which is orthogonal to both the first direction and the second direction.

Description

Semiconductor Devices

[0001] The embodiments relate to a semiconductor device.

[0002] A semiconductor module having a housing for housing electronic components and a cover for the housing is known as a semiconductor device, and the electronic components disposed within the housing are protected in such a semiconductor device.

[0003] Japanese Patent Publication No. 6-033597 Japanese Patent No. 6141807 Japanese Patent No. 6480990 Japanese Patent Publication No. 2021-90009

[0004] The reliability of the semiconductor device is improved.

[0005] The semiconductor device according to the embodiment comprises a first member having side walls surrounding an opening for accommodating an electronic component and a receiving portion protruding from the side walls toward the opening, and a second member extending in a first direction and having an engaging portion that fits into the receiving portion, covering at least a portion of the opening, wherein the engaging portion has an extension portion extending in the first direction and a pair of engaging claws that protrude from a lower end of the extension portion to one end side and the other end side in a second direction perpendicular to the first direction, each of the engaging claws having a first engaging surface that is continuous with a side surface of the extension portion that intersects with the first direction and is inclined with respect to the first direction, the receiving portion has a pair of protrusions that are arranged opposite each of the first engaging surfaces and include protruding surfaces inclined with respect to the first direction, and the lower edge of the first engaging surface and the lower edge of the protruding surface are inclined so as to be higher in a third direction perpendicular to the first direction and the second direction.

[0006] FIG. 1 is a perspective view illustrating an example of the structure of a semiconductor device according to an embodiment. FIG. 2 is a perspective view illustrating an example of the structure of a semiconductor device according to an embodiment. FIG. 3 is a perspective view illustrating an example of the structure of a receiving portion and an engaging portion of a semiconductor device according to an embodiment. FIG. 4 is a plan view illustrating an example of the structure of a receiving portion of a semiconductor device according to an embodiment, as viewed from the X direction. FIG. 5 is a plan view illustrating an example of the structure of a portion included in a receiving portion of a semiconductor device according to an embodiment, as viewed from the Y direction. FIG. 6 is a plan view illustrating an example of the structure of an engaging portion of a semiconductor device according to an embodiment, as viewed from the X direction. FIG. 7 is a plan view illustrating an example of the structure of an engaging portion of a semiconductor device according to an embodiment, as viewed from the Y direction. FIG. 8 is a perspective view illustrating an example of the structure of a receiving portion and an engaging portion of a semiconductor device according to an embodiment. FIG. 9 is a perspective view illustrating an example of the structure of an engaging portion of a semiconductor device according to a modification, as viewed from the X direction. FIG. 10 is a plan view illustrating an example of the structure of an engaging portion of a semiconductor device according to a modification, as viewed from the Y direction. Embodiment

[0007] Hereinafter, embodiments will be described with reference to the drawings. In the following description, components having the same functions and configurations are denoted by the same reference numerals. Furthermore, the dimensions and proportions of the drawings are not necessarily the same as those in reality.

[0008] 1. Embodiment A semiconductor device according to an embodiment will be described.

[0009] The semiconductor device according to the embodiment is, for example, a semiconductor module including electronic components, and more specifically, a power module semiconductor device including power semiconductor elements.

[0010] An example of the overall structure of a semiconductor device according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a perspective view for explaining an example of the structure of a semiconductor device according to an embodiment.

[0011] In the following description, the Z direction corresponds to, for example, a direction perpendicular to the surface of the semiconductor device on which the cover is provided, the X direction is a direction parallel to the surface, and the Y direction is a direction parallel to the surface and perpendicular to the X direction.

[0012] The semiconductor device 1 includes a housing 10, covers 20 and 30, and terminals T1, T2, and T3. In the following description, of the side of the semiconductor device 1 on which the covers 20 and 30 are provided and the side covered by the housing, the side on which the covers 20 and 30 are provided will be referred to as the upper side. Also, of the side on which the covers 20 and 30 are provided and the side covered by the housing, the side covered by the housing will be referred to as the lower side.

[0013] The housing 10 protects, for example, the side and bottom surfaces of the electronic components included in the semiconductor device 1. The housing 10 includes, for example, a synthetic resin. Terminals T1 and T2, for example, are provided on the housing 10. Each of the terminals T1 and T2 has, for example, a connection terminal and a screw hole for screwing a bus bar. For example, power and signals for driving the semiconductor device 1 are supplied to the terminals T1 and T2 from outside the semiconductor device 1. Note that, in the example of the embodiment, an example in which two types of terminals T1 and T2 are provided on the housing 10 is shown, but this is not limited thereto. The number of types of terminals provided on the housing 10 may be zero, one, or three or more. In the following description, the terminal T1 side of the terminals T1 and T2 is referred to as one end side in the Y direction. In addition, the terminal T2 side of the terminals T1 and T2 is referred to as the other end side in the Y direction.

[0014] The covers 20 and 30 are provided, for example, so as to cover at least a part of the top surface of the housing 10. The covers 20 and 30 are provided, for example, so as to be aligned in the Y direction. The covers 20 and 30 include, for example, a synthetic resin.

[0015] For example, a terminal T3 is provided on the cover 20. The structure of the terminal T3 is similar to the structures of the terminals T1 and T2. Like the terminals T1 and T2, the terminal T3 receives power and signals for driving the semiconductor device 1 from outside the semiconductor device 1. Note that, in the example according to the embodiment, the terminal T3 is provided on the cover 20 and no terminal is provided on the cover 30, but this is not limiting. Each of the covers 20 and 30 may or may not have a terminal.

[0016] Next, an example of the overall structure of the semiconductor device according to the embodiment will be described with reference to Fig. 2. Fig. 2 is a perspective view for explaining the example of the structure of the semiconductor device according to the embodiment. Fig. 2 illustrates the semiconductor device 1 with the covers 20 and 30 removed.

[0017] The housing 10 further includes a sidewall 12. The housing 10 is provided with an opening 11 that is surrounded by the sidewall 12 and is open at the top. A semiconductor unit 40, on which multiple semiconductor elements are mounted, is housed within the opening 11. The housing 10 further includes receiving portions 50-1 and 50-2 that protrude from the sidewall 12 and are used to secure the cover 20. In the following description, when the receiving portions 50-1 and 50-2 are not distinguished from each other, they will each be simply referred to as a receiving portion 50. The structure of the receiving portion 50 will be described in detail later. In the following description, the side of the receiving portions 50-1 and 50-2 on which the receiving portion 50-1 is provided will be referred to as one end in the X direction. The side of the receiving portions 50-1 and 50-2 on which the receiving portion 50-2 is provided will be referred to as the other end in the X direction.

[0018] The housing 10 also includes connecting portions 13 and 14. The connecting portions 13 and 14 are made of, for example, a conductor including a metal. The connecting portion 13 is provided to electrically connect the semiconductor portion 40 to the terminal T1. The connecting portion 14 is provided to electrically connect the semiconductor portion 40 to the terminal T2. Note that FIG. 2 shows only a portion of the structure of each of the connecting portions 13 and 14.

[0019] The cover 20 further includes engaging portions 60-1 and 60-2. The engaging portions 60-1 and 60-2 are provided corresponding to the receiving portions 50-1 and 50-2 of the housing 10, respectively. The engaging portions 60-1 and 60-2 are made of, for example, synthetic resin. The synthetic resin includes, for example, polyamide. The cover 20 is fixed to the housing 10 by fitting the engaging portions 60-1 and 60-2 into the receiving portions 50-1 and 50-2, respectively. In the following description, when there is no need to distinguish between the engaging portions 60-1 and 60-2, each of the engaging portions 60-1 and 60-2 will simply be referred to as an engaging portion 60. The structure of the engaging portion 60 will be described in detail later.

[0020] The cover 20 further includes, for example, a connection portion 21. The connection portion 21 is made of, for example, a conductor including a metal. The connection portion 21 is electrically connected to the terminal T3 in a region not shown. The connection portion 21 is provided to electrically connect the semiconductor portion 40 and the terminal T3.

[0021] The cover 30 is fixed to the housing 10 by, for example, an adhesive member (not shown). Also, although not shown, the cover 30 may include an engaging portion for fixing the cover 30 to the housing 10, similar to the cover 20. In this case, the housing 10 further includes a receiving portion corresponding to the engaging portion of the cover 30.

[0022] Next, the structure of the receiving portion 50 according to the embodiment will be described. The receiving portions 50-1 and 50-2 are provided symmetrically with respect to the YZ plane, for example. Therefore, the structure of the receiving portion 50-1 will be described below using FIGS. 3, 4, and 5, and a description of the structure of the receiving portion 50-2 will be omitted. FIG. 3 is a perspective view showing an example of the structure of the receiving portion and the engagement portion of the semiconductor device according to the embodiment. FIG. 4 is a plan view showing an example of the structure of the receiving portion of the semiconductor device according to the embodiment, as viewed from the X direction. FIG. 5 is a plan view showing an example of the structure of a portion included in the receiving portion 50 according to the embodiment, as viewed from the Y direction. More specifically, FIG. 4 shows the structure of the receiving portion 50-1 according to the embodiment, as viewed from the other end toward one end in the X direction. FIG. 5 also shows the structure of a portion included in one end of the receiving portion 50-1 according to the embodiment, as viewed from the other end toward one end in the Y direction.

[0023] The receiving portion 50 is provided so as to protrude in the X direction from the side wall 12 toward the opening 11. Furthermore, two guide portions 70 are provided on the side wall 12, protruding in the X direction from the side wall 12 toward the opening 11. The receiving portion 50 is sandwiched between the two guide portions 70 in the Y direction. More specifically, the receiving portion 50 is sandwiched between the side surfaces of the two guide portions 70, one on one end side and the other on the other end side in the Y direction, which face each other in the Y direction. Note that in FIG. 3 , of the two guide portions 70, the guide portion 70 on the other end side in the Y direction is indicated by a dotted line.

[0024] The receiving portion 50 includes a wall portion 51, two protrusions 52, two first slope portions 53, and a second slope portion 54. Note that the wall portion 51 and the second slope portion 54 are not shown in FIG. 5 .

[0025] The wall portion 51 has a plane that is aligned with the YZ plane, for example. The plane contacts side surfaces of one end and the other end of the guide portion 70 in the X direction.

[0026] Of the two protrusions 52, the protrusion 52 at one end in the Y direction contacts, for example, a side surface of the guide portion 70 at one end in the Y direction. Of the two protrusions 52, the protrusion 52 at the other end in the Y direction contacts, for example, a side surface of the guide portion 70 at the other end in the Y direction. The protrusions 52 are provided, for example, to protrude from the wall portion 51. As shown in FIG. 5 , the protrusions 52 have a thickness W1 in the X direction. The thickness W1 is, for example, 1 mm or more. Furthermore, the thickness W1 is smaller than the thickness W2 of the portion of the guide portion 70 included on the other end side in the X direction of the wall portion 51, as shown in FIG. 3 . Note that the two protrusions 52 are provided symmetrically with respect to the XZ plane. For this reason, the following description will mainly focus on the structure of the protrusion 52 at one end in the Y direction, and a description of the structure of the protrusion 52 at the other end in the Y direction will be omitted.

[0027] The protrusion 52 has protrusion surfaces 52a and 52b. The protrusion surface 52a has, for example, a flat surface along the YZ plane. As shown in FIG. 4 , the protrusion surface 52a has, for example, a triangular shape having a side along the Y direction, a side along the Z direction connected to the side surface of the guide portion 70, and a hypotenuse intersecting the Y and Z directions. In the protrusion surface 52a, the angle between the side along the Z direction and the hypotenuse forms an angle θ1, as shown in FIG. 4 . The angle θ1 is, for example, smaller than 90°. With the above-described configuration, the two protrusions 52 on the receiving portion 50 are arranged so that the width of the region sandwiched between the two protrusions 52 increases from top to bottom. The protrusion surface 52b has, for example, a flat surface inclined with respect to the Y direction. As shown in FIG. 5 , the protrusion surface 52b has, for example, a rectangular shape when viewed from the Y direction, two sides along the Z direction, and upper and lower sides that intersect with the Z direction. The upper and lower sides increase in height from one end to the other end in the X direction. More specifically, the protrusion surface 52b has, for example, a parallelogram shape. The acute angle θ2 formed by the lower side of the protrusion surface 52b and the X direction is, for example, 5° to 20° (5≦θ2≦20). The protrusion surface 52b is roughened by mechanical polishing, chemical treatment using chemicals, or treatment of the corresponding surface portion of the inner surface of the mold used to mold the receiving portion 50. As a result, the surface roughness (Ra) of the protrusion surface 52b is, for example, 10 μm (micrometers) or more. Furthermore, the protrusion surface 52b is rougher (has a greater surface roughness) than the other surfaces included in the receiving portion 50.

[0028] The two first slope portions 53 are provided corresponding to the two protrusions 52, respectively. Each first slope portion 53 is connected to the upper end of the corresponding one of the two protrusions 52. The first slope portion 53 at one end of the two first slope portions 53 in the Y direction contacts the side surface of the guide portion 70 at one end of the Y direction. The first slope portion 53 at the other end of the two first slope portions 53 in the Y direction contacts the side surface of the guide portion 70 at the other end of the Y direction. Each of the two first slope portions 53 is provided, for example, to protrude from the wall portion 51. The two first slope portions 53 are provided such that the regions sandwiched between the two first slope portions 53 are spaced apart in the Y direction by a distance W3. The distance W3 is, for example, approximately 10 mm. The two first slope portions 53 are provided symmetrically with respect to the XZ plane. Therefore, the following description will mainly focus on the structure of the first slope portion 53 at one end in the Y direction, and will omit a description of the structure of the first slope portion 53 at the other end in the Y direction.

[0029] The first slope portion 53 has slope surfaces 53a and 53b. As shown in FIG. 4 , the slope surface 53a has, for example, a rectangular shape. As shown in FIG. 5 , the slope surface 53a has, for example, a plane along a plane obtained by rotating the YZ plane by a predetermined angle in the Y direction. More specifically, the slope surface 53a inclines from bottom to top so as to approach the side wall 12. For example, the lower end of the slope surface 53a is connected to the upper end of the protrusion surface 52a. The slope surface 53a is also connected to a side surface of the guide portion 70 on one end side in the Y direction. The slope surface 53b has, for example, a plane along the XZ plane. The slope surface 53b has, for example, a triangular shape. The lower end of the slope surface 53b is connected to the upper end of the protrusion surface 52b.

[0030] The second slope portion 54 has a slope surface 54a. The slope surface 54a is, for example, a plane that is aligned with a YZ plane rotated by a predetermined angle in the Y direction. When the YZ plane is used as a reference, the rotation angle of the slope surface 54a in the Y direction is, for example, equal to the rotation angle of the slope surface 53a in the Y direction. The lower end of the slope surface 54a is connected to the upper end of the slope surface 53a at one end and the other end along the Y direction. The slope surface 54a has, for example, a rectangular shape. With the above configuration, the slope surface 54a is integrally formed with the two slope surfaces 53a. The second slope portion 54 is, for example, provided on one end side of the X direction relative to the two protrusions 52 and the two first slope portions 53, similar to the wall portion 51. Furthermore, the slope surface 54a is connected to the side surfaces of the two guide portions 70 at one end side and the other end side in the Y direction.

[0031] Next, the engaging portion 60 according to the embodiment will be described. The engaging portions 60-1 and 60-2 are provided symmetrically with respect to the YZ plane, for example. Therefore, the structure of the engaging portion 60-1 will be described below using FIGS. 3, 6, and 7, and a description of the structure of the engaging portion 60-2 will be omitted. FIG. 6 is a plan view showing an example of the structure of the engaging portion of the semiconductor device 1 according to the embodiment, as viewed from the X direction. FIG. 7 is a plan view showing an example of the structure of the engaging portion of the semiconductor device according to the embodiment, as viewed from the Y direction. More specifically, FIG. 6 shows the structure of the engaging portion 60-1 according to the embodiment, as viewed from the other end toward one end in the X direction. FIG. 7 also shows the structure of the engaging portion 60-1 according to the embodiment, as viewed from one end toward the other end in the Y direction.

[0032] The engaging portion 60 has a plate-like structure with a flat surface along the YZ plane. As shown in FIG. 7 , the engaging portion 60 has a thickness W4 in the X direction. The thickness W4 is, for example, equal to or less than the thickness W1. The thickness W4 is, for example, about 1 mm.

[0033] The engaging portion 60 includes an extending portion 61 and a pair of engaging claws 62. The structure of the engaging portion 60 is, for example, symmetrical with respect to the XZ plane.

[0034] As shown in Fig. 6, the extension portion 61 has a rectangular shape when viewed in the X direction. The extension portion 61 is the portion surrounded by the dotted line in Fig. 6. The width W5 of the extension portion 61 in the Y direction is equal to or less than the interval W3.

[0035] The engagement claws 62 are provided to protrude symmetrically from one end and the other end in the Y direction from the extension portion 61. With this configuration, the engagement portion 60 has a spatula-like shape that is symmetrical with respect to the XZ plane. As a result, the width W6 in the Y direction of the lower side of the engagement portion 60 in the portion including the two engagement claws 62 is wider than the distance W3 and the width W5. Due to the symmetrical structure of the engagement claws 62 as described above, the following will mainly describe the structure of the engagement claw 62 on one end side in the Y direction, and will omit a description of the structure of the engagement claw 62 on the other end side in the Y direction.

[0036] The engagement claw 62 has, for example, an engagement surface 62a along the YZ plane, and engagement surfaces 62b and 62c that intersect with the YZ plane.

[0037] The engagement surface 62a has a trapezoidal shape including two sides along the Z direction, a side along the Y direction, and a hypotenuse that intersects with the Y and Z directions. The engagement surface 62a on one end side in the Y direction is provided so that its width in the Z direction narrows from the other end side in the Y direction toward the one end side. An angle θ3 formed between the hypotenuse of the engagement surface 62a and the boundary line of the engagement claw 62 and the extension portion 61 along the Z direction is equal to, for example, angle θ1.

[0038] The engagement surface 62b is connected to a side surface of the extension portion 61 along the XZ plane. Furthermore, as described above, the inclined hypotenuse of the engagement surface 62a causes the engagement surface 62b to have a plane inclined with respect to the Y direction, similar to the protrusion surface 52b. As shown in FIG. 7 , the engagement surface 62b has, for example, two sides along the Z direction and upper and lower sides that intersect with the Z direction, and has a rectangular shape in which the upper and lower sides become higher from the other end to one end in the X direction. More specifically, the engagement surface 62b has, for example, a parallelogram shape. The angle θ4 formed by the lower side of the engagement surface 62b and the X direction is greater than 0°. The angle θ4 is, for example, between 5° and 20° (5≦θ4≦20). The angle θ4 is, for example, equal to the angle θ2. The engagement surface 62b is a roughened surface that has been subjected to a mechanical polishing process, a chemical treatment using chemicals, or a treatment of the portion of the inner surface of the mold corresponding to the engagement surface when molding the engagement portion 60. As a result, the surface roughness (Ra) of the engagement surface 62b is, for example, 10 μm or more. Furthermore, the engagement surface 62b is rougher (has a larger surface roughness) than the other surfaces included in the engagement portion 60. Furthermore, as shown in FIG. 7 , the engagement surface 62c has, for example, a rectangular shape with two sides along the Z direction, one side along the X direction, and one side intersecting the X and Z directions.

[0039] Next, a structure in which the engaging portion 60 is fixed to the receiving portion 50 in the semiconductor device 1 according to the embodiment will be described with reference to Fig. 8. Fig. 8 is a perspective view showing an example of the structure of the receiving portion and the engaging portion of the semiconductor device according to the embodiment.

[0040] In the semiconductor device 1 according to the embodiment, the engaging portion 60 is fixed to the receiving portion 50 by sliding the engaging portion 60 downward. More specifically, as the engaging portion 60 slides downward, the engaging portion 60 deforms along the planes of the protruding surface 52 a, the sloped surface 53 a, and the second sloped portion 54. Then, for example, when the engaging portion 60 is slid further downward so that the engaging claw 62 is positioned below the first sloped portion 53, the engaging portion 60 returns to its original shape. At the same time, portions of the engaging portion 60 are positioned between the two protruding portions 52 and the two first sloped portions 53.

[0041] Due to the configuration of the receiving portion 50 and the engaging portion 60 as described above, when the engaging portion 60 is fitted into the receiving portion 50, the engaging surface 62b can be in contact with the entire protruding surface 52a.

[0042] According to the embodiment, the reliability of the semiconductor device can be improved. The improvement in reliability achieved by the semiconductor device 1 according to the embodiment will be described below.

[0043] The semiconductor device 1 according to the embodiment includes a housing 10 having an opening 11 for accommodating a semiconductor portion 40 and a receiving portion 50 that protrudes from a sidewall 12 inside the opening 11 and into which an engaging portion 60 fits, and a cover 20 having the engaging portion 60 extending in the Z direction. The engaging portion 60 has an extension 61 and a pair of engaging claws 62 that protrude from the lower end of the extension 61 in the Y direction from the extension 61. Each engaging claw 62 has an engaging surface 62b that is continuous with a side surface of the extension 61 and is inclined with respect to the Z direction. The receiving portion 50 has a protrusion 52 that is disposed opposite the engaging surface 62b and has a protruding surface 52b inclined with respect to the Z direction. The lower edges of the engaging surface 62b and the protruding surface 52b are inclined along the X direction so as to become higher the closer they are to the sidewall. With this configuration, when the engaging portion 60 is fixed to the receiving portion 50, it is possible to prevent the engaging portion 60 from coming off from the receiving portion 50 due to the engaging surface 62b shifting toward the opening 11. Therefore, by preventing the cover 20 of the semiconductor device 1 from coming off, it is possible to improve the reliability of the semiconductor device 1.

[0044] Additionally, if the protruding surface of the receiving portion is rectangular, as viewed from the Y direction, with its bottom edge aligned with the X direction, the engaging surface of the engaging portion that contacts the protruding surface is also rectangular, as viewed from the Y direction, with its bottom edge aligned with the X direction. In such a case, the application of force to the cover and misalignment of the receiving portion and the engaging portion when the engaging portion is fixed to the receiving portion can disrupt the balance of the forces acting on the engaging portion and the receiving portion, causing the engaging surface to shift toward the opening of the housing. This can cause the engaging portion to come off the receiving portion. As a result, for example, the cover of the semiconductor device can come off even though no force sufficient to physically break the engaging portion has been applied.

[0045] According to the embodiment, the protrusion surface 52b of the receiving portion 50 and the engagement surface 62b of the engagement portion 60 each have a parallelogram shape with, for example, two sides along the Z direction when viewed from the Y direction. Furthermore, the lower sides of the protrusion surface 52b and the engagement surface 62b are each configured to rise toward the side wall 12 when viewed from the Y direction. With this configuration, when the engagement portion 60 is fixed to the receiving portion 50, for example, the balance between the support force of the receiving portion 50 and the tensile force of the engagement portion 60 is lost, which prevents the engagement portion 60 from coming off the receiving portion 50.

[0046] Furthermore, the protrusion surface 52b and the engagement surface 62b are roughened surfaces. This prevents a decrease in the coefficient of friction between the protrusion surface 52b and the engagement surface 62b, and improves the frictional force acting between the protrusion surface 52b and the engagement surface 62b. This creates an anchor effect, preventing the engagement portion 60 from coming off the receiving portion 50.

[0047] Furthermore, the angle θ2 formed by the lower edge of the protrusion surface 52b and the X direction and the angle θ4 formed by the lower edge of the engagement surface 62b and the X direction are equal to each other. This allows the engagement surface 62b to come into contact with the protrusion surface 52b entirely. This effectively improves the frictional force acting between the protrusion surface 52b and the engagement surface 62b.

[0048] Furthermore, in the semiconductor device 1 according to the embodiment, the angles θ2 and θ4 are each 5° or greater and 20° or less. If the angles θ2 and θ4 are 5° or greater, the engagement portion 60 is effectively prevented from coming off the receiving portion 50. If the angles θ2 and θ4 are 20° or less, damage to the receiving portion 50 and the engagement portion 60 due to a decrease in strength or the like is effectively prevented.

[0049] 2. Modifications Next, semiconductor devices according to modifications will be described. In the following, the description of the same configuration as the embodiment will be omitted, and the description will be focused on the configuration that differs from the embodiment.

[0050] In the above embodiment, the engaging claw 62 of the engaging portion 60 includes one engaging surface 62b and one engaging surface 62c when viewed from the Y direction, but this is not limiting. The engaging claw 62 of the engaging portion 60 may include two engaging surfaces 62b when viewed from the Y direction.

[0051] In the semiconductor device 1 according to the modified example, the configurations of the housing 10 including the receiving portion 50, the terminal T3 and the connection portion 21 in the cover 20, and the cover 30 are the same as those of the embodiment. Below, the structure of the engaging portion 60 included in the semiconductor device 1 according to the modified example, which differs from the structure of the engaging portion 60 included in the semiconductor device 1 according to the embodiment, will be described with reference to FIGS. 9 and 10 . FIG. 9 is a perspective view showing an example of the structure of the engaging portion of the semiconductor device according to the modified example as viewed from the X direction. FIG. 10 is a plan view showing an example of the structure of the engaging portion of the semiconductor device according to the modified example as viewed from the Y direction. More specifically, FIG. 10 shows the structure of the engaging portion 60-1 according to the modified example as viewed from one end toward the other end in the Y direction. Note that the structure of the engaging portion of the semiconductor device according to the modified example as viewed from the X direction can be substantially similar to the structure of the engaging portion of the semiconductor device according to the embodiment as viewed from the X direction, as described with reference to FIG. 6 , and therefore description thereof will be omitted.

[0052] The structure of the extension portion 61 of the engagement portion 60 according to the modified example is substantially the same as the structure of the extension portion 61 of the engagement portion 60 according to the embodiment.

[0053] In this modified example, the engagement claw 62 has engagement surfaces 62b1, 62b2, and 62c that intersect the YZ plane. The engagement surfaces 62b1 and 62b2 are roughened by mechanical polishing, chemical treatment using chemicals, or treatment of the corresponding portions of the inner surface of the mold used to mold the engagement portion 60. As a result, the surface roughness (Ra) of the engagement surfaces 62b1 and 62b2 is, for example, 10 μm or more. Furthermore, the engagement surfaces 62b1 and 62b2 are rougher (have greater surface roughness) than the other surfaces included in the engagement portion 60. The engagement surface 62b1 is provided to correspond to the protrusion surface 52b. As shown in FIG. 10 , the engagement surface 62b1 has, for example, two sides along the Z direction and upper and lower sides that intersect with the Z direction, and has a rectangular shape in which the upper and lower sides become higher from the other end to one end in the X direction. More specifically, the engagement surface 62b1 has, for example, a parallelogram shape. The angle between the lower side of the engagement surface 62b1 and the X direction is θ4. The engagement surface 62b2 is provided symmetrically to the engagement surface 62b1 with respect to the YZ plane, as shown in FIG. 10 . Due to the configuration of the engagement surfaces 62b1 and 62b2 as described above, the engagement surface 62c has, for example, a pentagon shape including a side along the X direction, two sides along the Z direction, and two sides intersecting the X and Z directions.

[0054] The reliability of the semiconductor device 1 can be improved by the modified example as well, similarly to the embodiment.

[0055] Furthermore, according to this modification, the engagement surfaces 62b1 and 62b2 are provided symmetrically with respect to the YZ plane, which improves versatility. That is, for example, the cover 20 can be manufactured without distinguishing the orientation of the engagement portions 60-1 and 60-2.

[0056] 3. Other Although several embodiments have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments may be embodied in various other forms, and various omissions, substitutions, and modifications may be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the accompanying claims.

Claims

1. A semiconductor device comprising: a first member having side walls surrounding an opening for accommodating an electronic component and a receiving portion protruding from the side walls toward the opening; and a second member having an engaging portion extending in a first direction and fitted into the receiving portion, covering at least a portion of the opening, wherein the engaging portion has an extension portion extending in the first direction and a pair of engaging claws protruding at a lower end of the extension portion to one end and the other end sides of the extension portion in a second direction perpendicular to the first direction, each of the engaging claws having a first engaging surface that is continuous with a side surface of the extension portion that intersects with the first direction and is inclined with respect to the first direction, the receiving portion has a pair of protrusions that are provided opposite each of the first engaging surfaces and include a protrusion surface inclined with respect to the first direction, and a lower edge of the first engaging surface and a lower edge of the protrusion surface are inclined in a third direction perpendicular to the first direction and the second direction so as to be higher the closer to the side walls.

2. The semiconductor device according to claim 1, wherein a lower side of said first engagement surface and a lower side of said protruding surface are inclined at an angle of 5° to 20° with respect to said third direction.

3. The semiconductor device according to claim 1, wherein the first engagement surface and the protruding surface are roughened surfaces.

4. The semiconductor device according to claim 3, wherein the surface roughness of said first engagement surface and the surface roughness of said protruding surface are 10 micrometers or more.

5. The semiconductor device according to claim 1, wherein the engagement claw further has a second engagement surface that is continuous with a side surface of the extension portion and is inclined with respect to the first direction, and a lower edge of the second engagement surface is inclined with respect to the third direction so as to become higher the further it is away from the side wall.

6. The semiconductor device according to claim 5, wherein the engaging portion is symmetrical with respect to a plane including the first direction and the second direction.

7. The semiconductor device according to claim 1, wherein said engaging portion is symmetrical with respect to a plane including said first direction and said third direction.

8. The semiconductor device according to claim 1, wherein the electronic component is a power semiconductor.

9. A semiconductor device comprising: a first member having side walls surrounding an opening for accommodating an electronic component and a receiving portion provided so as to protrude from the side walls towards the opening; and a second member extending in a first direction and having an engaging portion that fits into the receiving portion, covering at least a portion of the opening, wherein the engaging portion has an extension portion extending in the first direction and a pair of engaging claws protruding at a lower end of the extension portion from the extension portion to one end side and the other end side in a second direction perpendicular to the first direction, each of the engaging claws having an engaging surface that is continuous with a side surface of the extension portion that intersects with the first direction and is inclined with respect to the first direction, the receiving portion has a pair of protrusions provided so as to face each of the engaging surfaces and including a protruding surface inclined with respect to the first direction, and the engaging surface and the protruding surface are surfaces that have been roughened.

10. The semiconductor device according to claim 9, wherein the surface roughness of said engagement surface and the surface roughness of said protruding surface are 10 micrometers or more.

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