Electronic component and component built-in substrate comprising same

Abstract

[Problem] To form a terminal electrode such that an appropriate area is exposed from a magnetic element part. [Solution] The present invention comprises a coil part 111 which is embedded in a magnetic element part M and in which terminal electrodes 121, 122 are respectively exposed at main surfaces 101, 102. A conductor layer L1 includes terminal patterns 141, 142, end surfaces of which are respectively exposed at the main surfaces 101, 102, and a coil pattern C11 which is connected to the terminal pattern 141. A conductor layer L2 includes terminal patterns 143, 144, end surfaces of which are respectively exposed at the main surfaces 101, 102. The end surfaces of the terminal patterns 141, 143 are connected to each other via a via conductor 151 that is exposed at the main surface 101. The end surfaces of the terminal patterns 142, 144 are connected to each other via a via conductor 152 that is exposed at the main surface 102. The terminal electrodes 121, 122 are surrounded by an interlayer insulating film 130 on the main surfaces 101, 102.

Description

Electronic component and component-embedded substrate equipped with the same

[0001] The present disclosure relates to an electronic component and a component-embedded substrate including the electronic component.

[0002] Patent Document 1 discloses a laminated coil array incorporating a plurality of coil conductors.

[0003] Japanese Patent Application Laid-Open No. 2006-032425

[0004] In the laminated coil array described in Patent Document 1, both ends of the coil conductor are connected to external electrodes provided on the surfaces of the magnetic layers. However, if external electrodes are not added, the area of ​​both ends of the coil conductor exposed on the surfaces of the magnetic layers is small, making it difficult to ensure a sufficient connection area when the array is embedded in a component-embedded substrate, for example.

[0005] This disclosure describes a technique for forming electrodes with an appropriate area in an electronic component that incorporates multiple coil portions.

[0006] An electronic component according to one aspect of the present disclosure includes: a magnetic body portion having a first main surface and a second main surface opposite to the first main surface; and a plurality of coil portions embedded in the magnetic body portion, each of which has first terminal electrodes exposed on the first main surface and second terminal electrodes exposed on the second main surface, the plurality of coil portions being arranged in a first direction parallel to the first main surface, and each of the plurality of coil portions having a plurality of conductor layers including first and second conductor layers that are stacked in a second direction perpendicular to the first direction and parallel to the first main surface, the first conductor layer included in each of the plurality of coil portions including a first terminal pattern having an end surface exposed on the first main surface and constituting a first portion of the first terminal electrode, a second terminal pattern having an end surface exposed on the second main surface and constituting a first portion of the second terminal electrode, and a first coil pattern having one end connected to the first terminal pattern, and the second conductor layer included in each of the plurality of coil portions having an end surface exposed on the first main surface and constituting a first terminal electrode. and a fourth terminal pattern exposed on the second main surface and constituting the second portion of the second terminal electrode, wherein the first terminal pattern and the third terminal pattern included in each of the plurality of coil portions have end faces exposed on the first main surface and are connected to each other via a first via conductor that constitutes the third portion of the first terminal electrode, the second terminal pattern and the fourth terminal pattern included in each of the plurality of coil portions have end faces exposed on the second main surface and are connected to each other via a second via conductor that constitutes the third portion of the second terminal electrode, the first conductor layer included in each of the plurality of coil portions and the second conductor layer included in each of the plurality of coil portions are at least partially covered by an insulating film, the first terminal electrode included in each of the plurality of coil portions is surrounded by an interlayer insulating film on the first main surface, and the second terminal electrode included in each of the plurality of coil portions is surrounded by an interlayer insulating film on the second main surface.

[0007] According to the present disclosure, a technique for forming electrodes with appropriate areas in an electronic component incorporating multiple coil portions is provided.

[0008] FIG. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to a first embodiment of the technology disclosed herein. FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1 . FIG. 3 is a schematic cross-sectional view taken along line B-B in FIG. 1 . FIGS. 4( a) and 4(b) are schematic plan views illustrating the structures of terminal electrodes 121 and 122, respectively. FIG. 5 is a schematic plan view illustrating the structure of a first modified example of the terminal electrode 121. FIG. 6 is a schematic plan view illustrating the structure of a second modified example of the terminal electrode 121. FIG. 7 is a schematic cross-sectional view illustrating the structure of a component-embedded substrate 10 incorporating an electronic component 100. FIG. 8 is a schematic cross-sectional view illustrating a first modified example of the coil portion 111. FIG. 9 is a schematic cross-sectional view illustrating a second modified example of the coil portion 111. FIG. 10 is a schematic cross-sectional view illustrating a third modified example of the coil portion 111. FIG. 11 is a schematic cross-sectional view illustrating a fourth modified example of the coil portion 111. FIG. 12 is a schematic cross-sectional view illustrating a fifth modified example of the coil portion 111. FIG. 13 is a schematic cross-sectional view illustrating a sixth modified example of the coil portion 111. FIG. 14 is a schematic perspective view illustrating the appearance of an electronic component 200 according to a second embodiment of the technology disclosed herein. FIG. 15 is a schematic cross-sectional view taken along line A-A in FIG. 14. FIG. 16 is a schematic perspective view illustrating the appearance of an electronic component 300 according to a third embodiment of the technology disclosed herein. FIG. 17 is a schematic cross-sectional view taken along line B-B in FIG. 16. FIGS. 18(a) to 18(d) are schematic plan views illustrating the shapes of conductor patterns located on conductor layers L1 to L4, respectively, in the third embodiment. FIG. 19 is a schematic perspective view illustrating the appearance of an electronic component 400 according to a fourth embodiment of the technology disclosed herein. FIG. 20 is a schematic cross-sectional view taken along line B-B in FIG. 19. FIGS. 21(a) to 21(d) are schematic plan views illustrating the shapes of conductor patterns located on conductor layers L1 to L4, respectively, in the fourth embodiment. FIG. 22 is a schematic perspective view illustrating the appearance of an electronic component 500 according to a fifth embodiment of the technology disclosed herein. Fig. 23 is a schematic cross-sectional view taken along line BB shown in Fig. 22. Figs. 24(a) to 24(d) are schematic plan views showing the shapes of the conductor patterns located on the conductor layers L1 to L4, respectively, in the fifth embodiment.

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] First Embodiment Fig. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to a first embodiment of the technology disclosed herein. Fig. 2 is a schematic cross-sectional view taken along line A-A shown in Fig. 1, and Fig. 3 is a schematic cross-sectional view taken along line B-B shown in Fig. 1.

[0011] 1 to 3, electronic component 100 according to the first embodiment includes a magnetic body part M and multiple coil parts 111 to 118 embedded in magnetic body part M. Magnetic body part M may be made of a composite magnetic material in which magnetic particles made of a high-permeability material such as ferrite or permalloy are solidified with a resin binder. Magnetic body part M has main surfaces 101 and 102 that form an XZ plane and are located opposite each other, side surfaces 103 and 104 that form an XY plane and are located opposite each other, and side surfaces 105 and 106 that form a YZ plane and are located opposite each other.

[0012] The coil portions 111 to 118 are arranged in this order in the X direction, which is the first direction. The coil portions 111 to 118 each have a terminal electrode 121 that forms one end exposed from the main surface 101 of the magnetic body portion M, and a terminal electrode 122 that forms the other end exposed from the main surface 102 of the magnetic body portion M. In the embodiment shown in FIG. 1 , the coil portions 111 to 118 have the same structure, and therefore the following description will focus on the structure of the coil portion 111.

[0013] In the example shown in Figure 3, the coil section 111 has four conductor layers L1 to L4 stacked in the Z direction, which is the second direction. The conductor layers L1 to L4 may all be covered with an interlayer insulating film 130 so as not to come into contact with the magnetic base body section M. The interlayer insulating film 130 is also present between the conductor layers L1 to L4 adjacent to each other in the Z direction, and therefore these conductor layers L1 to L4 are stacked in the Z direction with the interlayer insulating film 130 interposed between them. The conductor layers L1 to L4 are made of a good conductor such as copper (Cu). The interlayer insulating film 130 is made of a resin or the like.

[0014] The conductor layer L1 is located at one end in the Z direction and is formed first during manufacturing. In the example shown in FIG. 3 , the conductor layer L1 includes terminal patterns 141 and 142 and a coil pattern C11. The terminal pattern 141 is a conductor pattern whose XZ end face in the +Y direction is exposed on the main surface 101 of the magnetic body part M, and its width in the X direction is W1. The terminal pattern 142 is a conductor pattern whose XZ end face in the -Y direction is exposed on the main surface 102 of the magnetic body part M, and its width in the X direction is W2. The widths W1 and W2 may be the same. The coil pattern C11 is a linear conductor pattern connecting the terminal patterns 141 and 142, and its width W3 in the X direction is smaller than the widths W1 and W2. The inductance and DC resistance of the coil pattern C11 can be adjusted by adjusting its width W3. For example, if the width W3 is reduced, the inductance can be increased, and if the width W3 is increased, the DC resistance can be reduced.

[0015] The conductor layer L2 is the second conductor layer from one end in the Z direction and is formed after the conductor layer L1 during manufacturing. In the example shown in FIG. 3 , the conductor layer L2 includes terminal patterns 143 and 144 and a coil pattern C12. The planar shapes of the terminal patterns 143 and 144 and the coil pattern C12 as viewed from the Z direction may be the same as the planar shapes of the terminal patterns 141 and 142 and the coil pattern C11 located on the conductor layer L1. The XZ end face of the terminal pattern 143 in the +Y direction is exposed on the main surface 101 of the magnetic body part M, and the XZ end face of the terminal pattern 144 in the -Y direction is exposed on the main surface 102 of the magnetic body part M. The coil pattern C12 is a linear conductor pattern connecting the terminal patterns 143 and 144.

[0016] Terminal patterns 141 and 143 are connected to each other through via conductor 151 provided to penetrate interlayer insulating film 130. Similarly, terminal patterns 142 and 144 are connected to each other through via conductor 152 provided to penetrate interlayer insulating film 130. Via conductors 151 and 152 may be formed simultaneously with conductor layer L2, or may be formed after conductor layer L1 is formed and before conductor layer L2 is formed. In the former case, via conductor 151 is integrated with terminal pattern 143, and via conductor 152 is integrated with terminal pattern 144.

[0017] The conductor layer L3 is the third conductor layer from one end in the Z direction, and is formed after the conductor layer L2 during manufacturing. In the example shown in FIG. 3 , the conductor layer L3 includes terminal patterns 145 and 146. The terminal patterns 145 and 146 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L3. In other words, the conductor layer L3 does not include conductor patterns corresponding to the coil patterns C11 and C12, and only includes the terminal patterns 145 and 146.

[0018] Terminal pattern 143 and terminal pattern 145 are connected to each other through via conductor 153 provided to penetrate interlayer insulating film 130. Similarly, terminal pattern 144 and terminal pattern 146 are connected to each other through via conductor 154 provided to penetrate interlayer insulating film 130. Via conductors 153 and 154 may be formed simultaneously with conductor layer L3, or may be formed after conductor layer L2 is formed and before conductor layer L3 is formed. In the former case, via conductor 153 is integrated with terminal pattern 145, and via conductor 154 is integrated with terminal pattern 146.

[0019] The conductor layer L4 is located at the other end in the Z direction and is formed next to the conductor layer L3 during manufacturing. In the example shown in FIG. 3 , the conductor layer L4 includes terminal patterns 147 and 148. The terminal patterns 147 and 148 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L4. In other words, the conductor layer L4 does not include conductor patterns corresponding to the coil patterns C11 and C12, and only includes the terminal patterns 147 and 148.

[0020] Terminal pattern 145 and terminal pattern 147 are connected to each other through via conductor 155 provided to penetrate interlayer insulating film 130. Similarly, terminal pattern 146 and terminal pattern 148 are connected to each other through via conductor 156 provided to penetrate interlayer insulating film 130. Via conductors 155 and 156 may be formed simultaneously with conductor layer L4, or may be formed after conductor layer L3 is formed and before conductor layer L4 is formed. In the former case, via conductor 155 is integrated with terminal pattern 147, and via conductor 156 is integrated with terminal pattern 148.

[0021] 4(a) and 4(b) are schematic plan views illustrating the structures of the terminal electrodes 121 and 122. In the examples shown in Fig. 4(a) and 4(b), via conductors 151 to 156 are integral with terminal patterns 143 to 148, respectively.

[0022] 4( a), the terminal electrode 121 is composed of a portion consisting of the XZ end faces of the terminal patterns 141, 143, 145, and 147 exposed from the main surface 101 of the magnetic body part M, and a portion consisting of the XZ end faces of the via conductors 151, 153, and 155 exposed from the main surface 101 of the magnetic body part M. The portions of the terminal electrode 121 consisting of the XZ end faces of the terminal patterns 141, 143, and 145 constitute a first portion A1, a second portion A2, and a fourth portion A4, respectively. The portions of the terminal electrode 121 consisting of the XZ end faces of the via conductors 151 and 153 constitute a third portion A3 and a fifth portion A5, respectively. The terminal electrode 121 having such a structure is surrounded by an interlayer insulating film 130 on the main surface 101 of the magnetic body part M. The width W4 in the X direction of the via conductors 151, 153, 155 exposed from the main surface 101 of the magnetic body part M may be ¾ or more of the width W1 in the X direction of the terminal patterns 141, 143, 145, 147 exposed from the main surface 101 of the magnetic body part M. This makes it possible to ensure a sufficient area for the terminal electrode 121.

[0023] The widths W1 of the terminal patterns 141, 143, 145, and 147 do not need to be completely identical to one another, and differences may exist among the terminal patterns 141, 143, 145, and 147. In this case, the widths W1 of the terminal patterns 141, 143, 145, and 147 may be defined by an average value. Similarly, the widths W4 of the via conductors 151, 153, and 155 do not need to be completely identical to one another, and differences may exist among the via conductors 151, 153, and 155. In this case, the widths W4 of the via conductors 151, 153, and 155 may be defined by an average value. There may also be differences in the thicknesses of the terminal patterns 141, 143, 145, and 147 in the Z direction.

[0024] 4( b), the terminal electrode 122 is composed of a portion consisting of the XZ end faces of the terminal patterns 142, 144, 146, and 148 exposed from the main surface 102 of the magnetic body part M, and a portion consisting of the XZ end faces of the via conductors 152, 154, and 156 exposed from the main surface 102 of the magnetic body part M. The portions of the terminal electrode 122 consisting of the XZ end faces of the terminal patterns 142, 144, and 146 constitute a first portion B1, a second portion B2, and a fourth portion B4, respectively. The portions of the terminal electrode 122 consisting of the XZ end faces of the via conductors 152 and 154 constitute a third portion B3 and a fifth portion B5, respectively. The terminal electrode 122 having this structure is surrounded by an interlayer insulating film 130 on the main surface 102 of the magnetic body part M. The width W5 in the X direction of the via conductors 152, 154, 156 exposed from the main surface 102 of the magnetic body part M may be ¾ or more of the width W2 in the X direction of the terminal patterns 142, 144, 146, 148 exposed from the main surface 102 of the magnetic body part M. This makes it possible to ensure a sufficient area for the terminal electrode 122. The width W4 and the width W5 may be the same.

[0025] The widths W2 of the terminal patterns 142, 144, 146, and 148 do not need to be completely identical to one another, and differences may exist among the terminal patterns 142, 144, 146, and 148. In this case, the widths W2 of the terminal patterns 142, 144, 146, and 148 may be defined by average values. Similarly, the widths W5 of the via conductors 152, 154, and 156 do not need to be completely identical to one another, and differences may exist among the via conductors 152, 154, and 156. In this case, the widths W5 of the via conductors 152, 154, and 156 may be defined by average values.

[0026] The surface of the terminal electrode 121 may be flush with the main surface 101 of the magnetic body part M, or may be recessed from the main surface 101 of the magnetic body part M. Similarly, the surface of the terminal electrode 122 may be flush with the main surface 102 of the magnetic body part M, or may be recessed from the main surface 102 of the magnetic body part M.

[0027] FIG. 5 is a schematic plan view for explaining the structure of a first modified example of the terminal electrode 121. In FIG.

[0028] 5 , the terminal patterns 141, 143, 145, and 147 and the via conductors 151, 153, and 155 are made of different conductive materials. As described above, such a structure is obtained by forming the via conductor 151 before forming the terminal pattern 143, forming the via conductor 153 before forming the terminal pattern 145, and forming the via conductor 155 before forming the terminal pattern 147. This allows different characteristics to be imparted to the portions of the terminal electrode 121 consisting of the exposed surfaces of the terminal patterns 141, 143, 145, and 147 and the portions consisting of the exposed surfaces of the via conductors 151, 153, and 155.

[0029] FIG. 6 is a schematic plan view for explaining the structure of the terminal electrode 121 according to a second modified example.

[0030] 6, the positions of the via conductors 151 and 155 in the X direction are different from the position of the via conductor 153 in the X direction. In the example shown in Fig. 6, the positions of the via conductors 151 and 155 in the X direction are offset in the +X direction from the center of the terminal electrode 121, and the position of the via conductor 153 in the X direction is offset in the -X direction from the center of the terminal electrode 121. This makes it possible to improve the adhesion between the terminal electrode 121 and the interlayer insulating film 130 while ensuring the exposed area of ​​the terminal electrode 121.

[0031] As described above, the electronic component 100 according to this embodiment forms a coil array incorporating eight coil portions 111 to 118. The arrangement pitch of the coil portions 111 to 118 in the X direction may be constant, or, as shown in Figures 1 and 2, the coil portions 111 to 114 and the coil portions 115 to 118 may be arranged at a constant pitch in the X direction, with the spacing between the coil portions 114 and 115 in the X direction being wider than the spacing between the other coil portions. By widening the spacing between the coil portions 114 and 115 in the X direction, it is possible to reduce the coupling between the coil portions 114 and 115.

[0032] FIG. 7 is a schematic cross-sectional view illustrating the structure of a component-embedded substrate 10 incorporating an electronic component 100 according to this embodiment.

[0033] 7 includes insulating layers 11 to 15 stacked in this order, a plurality of wiring patterns 20 formed on the surfaces of insulating layers 11 to 15, and an electronic component 100 embedded in insulating layer 13. Wiring pattern 20 includes eight wiring patterns 21 positioned between insulating layer 13 and insulating layer 14, and eight wiring patterns 22 positioned between insulating layer 12 and insulating layer 13. Each of the eight wiring patterns 21 is positioned to overlap a terminal electrode 121 of electronic component 100, and is connected to the corresponding terminal electrode 121 via a substrate via conductor 31. Similarly, each of the eight wiring patterns 22 is positioned to overlap a terminal electrode 122 of electronic component 100, and is connected to the corresponding terminal electrode 122 via a substrate via conductor 32.

[0034] As such, electronic component 100 according to this embodiment can be used embedded in component-embedded substrate 10, rather than being mounted on the surface of a circuit board using solder or the like. When electronic component 100 is used embedded in component-embedded substrate 10, the end faces of terminal patterns 141, 143, 145, and 147 exposed from main surface 101 of magnetic body portion M are used directly as terminal electrode 121, and the end faces of terminal patterns 142, 144, 146, and 148 exposed from main surface 102 of magnetic body portion M are used directly as terminal electrode 122. In this embodiment, not only the end faces of conductor layers L1 and L2 having coil patterns C11 and C12 but also the end faces of conductor layers L3 and L4 having no coil patterns are exposed, making it possible to ensure sufficient area for terminal electrodes 121 and 122.

[0035] Moreover, because not only the end faces of the terminal patterns 141, 143, 145, and 147 but also the end faces of the via conductors 151, 153, and 155 are exposed from the main surface 101 of the magnetic body part M, the terminal electrode 121 is not divided into multiple pieces by the interlayer insulating film 130 on the main surface 101 of the magnetic body part M. Similarly, not only the end faces of the terminal patterns 142, 144, 146, and 148 but also the end faces of the via conductors 152, 154, and 156 are exposed from the main surface 102 of the magnetic body part M, so the terminal electrode 122 is not divided into multiple pieces by the interlayer insulating film 130 on the main surface 102 of the magnetic body part M.

[0036] Furthermore, because the terminal electrodes 121, 122 are surrounded by the interlayer insulating film 130 on the main surfaces 101, 102 of the magnetic body part M, it is possible to increase the dielectric strength voltage between the terminal electrodes 121 adjacent in the X direction, as well as the dielectric strength voltage between the terminal electrodes 122 adjacent in the X direction. Furthermore, if the surface of the terminal electrode 121 is recessed relative to the main surface 101 of the magnetic body part M, the connection reliability between the terminal electrode 121 and the substrate via conductor 31 is also increased. Similarly, if the surface of the terminal electrode 122 is recessed relative to the main surface 102 of the magnetic body part M, the connection reliability between the terminal electrode 122 and the substrate via conductor 32 is also increased.

[0037] FIG. 8 is a schematic cross-sectional view for explaining a first modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0038] The first modified example shown in FIG. 8 differs from the coil portion 111 described above in that a conductor layer L5 is added. The conductor layer L5 is a conductor layer located on the other end side in the Z direction and is formed next to the conductor layer L4 during manufacturing. In the example shown in FIG. 8, the conductor layer L5 includes terminal patterns 149 and 140. The terminal patterns 149 and 140 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L5. In other words, the conductor layer L5 does not include conductor patterns corresponding to the coil patterns C11 and C12, and only includes the terminal patterns 149 and 140.

[0039] Terminal pattern 147 and terminal pattern 149 are connected to each other through via conductor 157 provided to penetrate interlayer insulating film 130. Similarly, terminal pattern 148 and terminal pattern 140 are connected to each other through via conductor 158 provided to penetrate interlayer insulating film 130. Via conductors 157 and 158 may be formed simultaneously with conductor layer L5, or may be formed after conductor layer L4 is formed and before conductor layer L5 is formed. In the former case, via conductor 157 is integrated with terminal pattern 149, and via conductor 158 is integrated with terminal pattern 140.

[0040] The XZ end faces of the terminal pattern 149 and the via conductor 157 are exposed from the main surface 101 of the magnetic body part M, thereby constituting part of the terminal electrode 121. Similarly, the XZ end faces of the terminal pattern 140 and the via conductor 158 are exposed from the main surface 102 of the magnetic body part M, thereby constituting part of the terminal electrode 122.

[0041] 8, the number of conductor layers L3 to L5 on which no coil pattern is formed may be greater than the number of conductor layers L1 and L2 on which the coil pattern is formed, which allows the area of ​​the terminal electrodes 121 and 122 to be further increased.

[0042] FIG. 9 is a schematic cross-sectional view for explaining a second modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0043] 9 differs from the above-described coil portion 111 in that a coil pattern C13 is included on the conductor layer L3. The coil pattern C13 is a linear conductor pattern that connects the terminal pattern 145 and the terminal pattern 146, and its planar shape may be the same as the planar shape of the coil pattern C11 located on the conductor layer L1 and the planar shape of the coil pattern C12 located on the conductor layer L2.

[0044] 9, the number of conductor layers L4 on which no coil pattern is formed may be less than the number of conductor layers L1 to L3 on which coil patterns are formed, which makes it possible to further reduce the DC resistance of the coil portions 111 to 118.

[0045] FIG. 10 is a schematic cross-sectional view for explaining a third modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0046] 10 differs from the above-described electronic component 100 in that the conductor layer L2 does not include the coil pattern C12. That is, the terminal patterns 143 and 144 located on the conductor layer L2 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L2. That is, only the terminal patterns 143 and 144 exist on the conductor layer L2.

[0047] As illustrated in the third modified example shown in FIG. 10, the conductor layer on which the coil pattern is formed may be only one layer depending on the required characteristics.

[0048] FIG. 11 is a schematic cross-sectional view for explaining a fourth modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0049] The fourth modified example shown in Fig. 11 differs from the second modified example shown in Fig. 7 in that the coil pattern C11 is not included in the conductor layer L1. That is, the terminal patterns 141 and 142 located on the conductor layer L1 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L1. That is, only the terminal patterns 141 and 142 exist on the conductor layer L1.

[0050] 11, the portion corresponding to the coil pattern C11 is buried in the interlayer insulating film 130. This is because, when the conductor layer L1 is formed first, some member that serves as the base of the coil pattern C12 may be required depending on the manufacturing method, and in the example shown in FIG.

[0051] 11, a structure may be adopted in which the coil pattern is not formed on the conductor layers L1, L4 located at both ends in the Z direction, which allows the coil pattern to be positioned more centrally in the Z direction of the magnetic base body part M.

[0052] FIG. 12 is a schematic cross-sectional view for explaining a fifth modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0053] The fifth modified example shown in Fig. 12 differs from the fourth modified example shown in Fig. 11 in that the portion corresponding to the base of the coil pattern C12 is made of the magnetic body part M rather than the interlayer insulating film 130. Such a structure can be obtained, for example, by providing a dummy conductor pattern in the portion that will form the base of the coil pattern C12, and then removing the dummy conductor pattern after forming the conductor layers L1 to L4. This increases the volume of the magnetic body part M, making it possible to obtain a larger inductance than the fourth modified example shown in Fig. 11.

[0054] FIG. 13 is a schematic cross-sectional view for explaining a sixth modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0055] The sixth modified example shown in Fig. 13 differs from the first modified example shown in Fig. 8 in that the terminal pattern 149 is omitted. That is, only the terminal pattern 140 is present on the conductor layer L5. As a result, the terminal electrode 121 exposed from the main surface 101 of the magnetic body part M is composed of four layers of terminal patterns 141, 143, 145, and 147 and three via conductors 151, 153, and 155 connecting them, whereas the terminal electrode 122 exposed from the main surface 102 of the magnetic body part M is composed of five layers of terminal patterns 142, 144, 146, 148, and 140 and four via conductors 152, 154, 156, and 158 connecting them. As a result, in the sixth modified example, the size of the terminal electrode 122 in the Z direction is larger than the size of the terminal electrode 121 in the Z direction.

[0056] As illustrated in the sixth modified example shown in FIG. 13, the terminal electrodes 121 and 122 do not need to have the same size, and may be designed to have different sizes depending on the required characteristics.

[0057] Second Embodiment Fig. 14 is a schematic perspective view showing the appearance of an electronic component 200 according to a second embodiment of the technology disclosed herein. Fig. 15 is a schematic cross-sectional view taken along line A-A shown in Fig. 14. The cross-section taken along line B-B shown in Fig. 14 is the same as Fig. 3.

[0058] 14 and 15 , electronic component 200 according to the second embodiment differs from electronic component 100 according to the first embodiment in that coil patterns C11 and C12 included in coil portions 111 to 114 are offset in the −X direction, and coil patterns C11 and C12 included in coil portions 115 to 118 are offset in the +X direction. Since the other basic configuration is the same as that of electronic component 100 according to the first embodiment, the same elements are denoted by the same reference numerals, and redundant explanations will be omitted.

[0059] 14 and 15, the edge positions in the −X direction of the coil patterns C11 and C12 included in the coil portions 111 to 114 coincide with the edge positions in the −X direction of the terminal patterns 141 to 148. In contrast, the edge positions in the +X direction of the coil patterns C11 and C12 included in the coil portions 115 to 118 coincide with the edge positions in the +X direction of the terminal patterns 141 to 148.

[0060] As exemplified by electronic component 200 according to the second embodiment, it is not necessary for coil portions 111 to 118 to all have the same shape. Furthermore, with the configuration of electronic component 200 according to the second embodiment, it is possible to further reduce the coupling between coil portion 114 and coil portion 115.

[0061] 16 is a schematic perspective view showing the appearance of an electronic component 300 according to a third embodiment of the technology disclosed herein. Also, Fig. 17 is a schematic cross-sectional view taken along line BB shown in Fig. 16.

[0062] 16 and 17 , the electronic component 300 according to the third embodiment differs from the electronic component 100 according to the first embodiment in that the coil pattern C11 included in the conductor layer L1 is replaced with a coil pattern C21, and the coil pattern C12 included in the conductor layer L2 is replaced with a coil pattern C22. Since the other basic configuration is the same as that of the electronic component 100 according to the first embodiment, the same elements are denoted by the same reference numerals, and redundant description will be omitted.

[0063] 18A to 18D are schematic plan views showing the shapes of conductor patterns located on the conductor layers L1 to L4, respectively, in the third embodiment.

[0064] In the example shown in FIG. 18( a), the conductor layer L1 includes terminal patterns 141 and 142 and a coil pattern C21, one end of which is connected to the terminal pattern 141. The terminal pattern 142 is provided independently on the surface of the conductor layer L1 without being connected to other conductor patterns. The coil pattern C21 is a loop-shaped conductor pattern that wraps around approximately 3 / 4 turns. In the example shown in FIG. 18( b), the conductor layer L2 includes terminal patterns 143 and 144 and a coil pattern C22, one end of which is connected to the terminal pattern 144. The terminal pattern 143 is provided independently on the surface of the conductor layer L2 without being connected to other conductor patterns. The coil pattern C22 is a loop-shaped conductor pattern that wraps around approximately 3 / 4 turns. The other end of the coil pattern C22 is connected to the other end of the coil pattern C21 via a via conductor 161. As a result, the coil patterns C21 and C22 are connected in series between the terminal patterns 141 and 144.

[0065] The other basic configuration is the same as that of electronic component 100 according to the first embodiment. Therefore, terminal pattern 143 is connected to terminal pattern 141 through via conductor 151. Terminal pattern 144 is connected to terminal pattern 142 through via conductor 152. Terminal pattern 145 is connected to terminal pattern 143 through via conductor 153. Terminal pattern 146 is connected to terminal pattern 144 through via conductor 154. Terminal pattern 147 is connected to terminal pattern 145 through via conductor 155. Terminal pattern 148 is connected to terminal pattern 146 through via conductor 156.

[0066] As exemplified by the electronic component 300 according to the third embodiment, the coil pattern included in the coil portion does not need to be linear and may be loop-shaped. In addition, in this embodiment, the coil patterns C21 and C22 formed on the two conductor layers L1 and L2 are connected in series, which makes it possible to obtain a larger inductance.

[0067] 19 is a schematic perspective view showing the appearance of an electronic component 400 according to a fourth embodiment of the technology disclosed herein. Also, Fig. 20 is a schematic cross-sectional view taken along line BB shown in Fig. 19.

[0068] 19 and 20 , electronic component 400 according to the fourth embodiment differs from electronic component 300 according to the third embodiment in that a coil pattern C23 is added to conductor layer L3 and a coil pattern C24 is added to conductor layer L4. Since the other basic configuration is the same as that of electronic component 300 according to the third embodiment, the same elements are denoted by the same reference numerals and redundant description will be omitted.

[0069] 21A to 21D are schematic plan views showing the shapes of conductor patterns located on the conductor layers L1 to L4, respectively, in the fourth embodiment.

[0070] In the example shown in FIG. 21( c), the conductor layer L3 includes terminal patterns 145 and 146 and a coil pattern C23, one end of which is connected to the terminal pattern 145. The terminal pattern 146 is provided independently on the surface of the conductor layer L3 without being connected to other conductor patterns. The coil pattern C23 is a loop-shaped conductor pattern that wraps around approximately 3 / 4 of a turn and may have the same planar shape as the coil pattern C21 located on the conductor layer L1. In the example shown in FIG. 21( d), the conductor layer L4 includes terminal patterns 147 and 148 and a coil pattern C24, one end of which is connected to the terminal pattern 148. The terminal pattern 147 is provided independently on the surface of the conductor layer L4 without being connected to other conductor patterns. The coil pattern C24 is a loop-shaped conductor pattern that wraps around approximately 3 / 4 of a turn and may have the same planar shape as the coil pattern C22 located on the conductor layer L2. The other end of the coil pattern C24 is connected to the other end of the coil pattern C23 through the via conductor 162. As a result, the coil patterns C23 and C24 are connected in series between the terminal patterns 145 and 148.

[0071] The other basic configuration is the same as that of the electronic component 300 according to the third embodiment. Therefore, the inductor formed by the coil patterns C21 and C22 and the inductor formed by the coil patterns C23 and C24 are connected in parallel between the terminal electrodes 121 and 122. This makes it possible to further reduce the series resistance compared to the electronic component 300 according to the third embodiment.

[0072] Fifth Embodiment Fig. 22 is a schematic perspective view showing the appearance of an electronic component 500 according to a fifth embodiment of the technology disclosed herein. Fig. 23 is a schematic cross-sectional view taken along line BB shown in Fig. 22.

[0073] 22 and 23 , the electronic component 500 according to the fifth embodiment differs from the electronic component 300 according to the third embodiment in that the coil pattern C21 included in the conductor layer L1 is replaced with a coil pattern C31, the coil pattern C22 included in the conductor layer L2 is replaced with a coil pattern C32, and a coil pattern C33 is added to the conductor layer L3. Since the other basic configuration is the same as that of the electronic component 300 according to the third embodiment, the same elements are denoted by the same reference numerals and redundant description will be omitted.

[0074] 24A to 24D are schematic plan views showing the shapes of conductor patterns located on the conductor layers L1 to L4, respectively, in the fifth embodiment.

[0075] In the example shown in FIG. 24( a), the conductor layer L1 includes terminal patterns 141 and 142 and a coil pattern C31, one end of which is connected to the terminal pattern 141. The terminal pattern 142 is provided independently on the surface of the conductor layer L1 without being connected to other conductor patterns. The coil pattern C21 is a loop-shaped conductor pattern that wraps around for approximately one turn. In the example shown in FIG. 24( b), the conductor layer L2 includes terminal patterns 143 and 144 and a coil pattern C32. The terminal patterns 143 and 144 and the coil pattern C32 are all provided independently on the surface of the conductor layer L2 without being connected to other conductor patterns. The coil pattern C32 is a loop-shaped conductor pattern that wraps around for approximately one turn. The other end of the coil pattern C32 is connected to the other end of the coil pattern C31 via a via conductor 163. In the example shown in Figure 24(c), the conductor layer L3 includes terminal patterns 145 and 146 and a coil pattern C33, one end of which is connected to the terminal pattern 146. The terminal pattern 145 is provided independently on the surface of the conductor layer L3 without being connected to other conductor patterns. The coil pattern C33 is a loop-shaped conductor pattern that wraps around for approximately 1 / 2 a turn. The other end of the coil pattern C33 is connected to the other end of the coil pattern C32 via the via conductor 164. As a result, the coil patterns C31, C32, and C33 are connected in series between the terminal pattern 141 and the terminal pattern 146.

[0076] The other basic configuration is the same as that of the electronic component 300 according to the third embodiment. In this embodiment, an inductor formed by the coil patterns C31, C32, and C33 is connected in series between the terminal electrodes 121 and 122, which makes it possible to obtain a larger inductance than the electronic component 300 according to the third embodiment.

[0077] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0078] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0079] An electronic component according to one aspect of the present disclosure includes: a magnetic body portion having a first main surface and a second main surface opposite to the first main surface; and a plurality of coil portions embedded in the magnetic body portion, each of which has first terminal electrodes exposed on the first main surface and second terminal electrodes exposed on the second main surface, the plurality of coil portions being arranged in a first direction parallel to the first main surface, and each of the plurality of coil portions having a plurality of conductor layers including first and second conductor layers that are stacked in a second direction perpendicular to the first direction and parallel to the first main surface, the first conductor layer included in each of the plurality of coil portions including a first terminal pattern having an end surface exposed on the first main surface and constituting a first portion of the first terminal electrode, a second terminal pattern having an end surface exposed on the second main surface and constituting a first portion of the second terminal electrode, and a first coil pattern having one end connected to the first terminal pattern, and the second conductor layer included in each of the plurality of coil portions having an end surface exposed on the first main surface and constituting a first terminal electrode. and a third terminal pattern exposed on the second principal surface and constituting a second portion of the second terminal electrode, wherein the first terminal pattern and the third terminal pattern included in each of the plurality of coil portions have end faces exposed on the first principal surface and are connected to each other via first via conductors that constitute the third portion of the first terminal electrode, the second terminal pattern and the fourth terminal pattern included in each of the plurality of coil portions have end faces exposed on the second principal surface and are connected to each other via second via conductors that constitute the third portion of the second terminal electrode, the first conductor layer included in each of the plurality of coil portions and the second conductor layer included in each of the plurality of coil portions are at least partially covered with an insulating film, the first terminal electrode included in each of the plurality of coil portions is surrounded by an interlayer insulating film on the first principal surface, and the second terminal electrode included in each of the plurality of coil portions is surrounded by an interlayer insulating film on the second principal surface. This makes it possible to form electrodes (first and second terminal electrodes) with appropriate areas. Specifically, for example, the first and second terminal electrodes can be formed so that an appropriate area is exposed from the magnetic body portion.

[0080] In the electronic component, the first and second conductor layers included in each of the plurality of coil portions may be stacked in the second direction with an interlayer insulating film at least partially interposed therebetween, thereby enabling connection between the first and second conductor layers through via conductors provided to penetrate the interlayer insulating film.

[0081] In the electronic component, the third terminal pattern may be provided independently without being connected to other conductor patterns within the plane of the second conductor layer, whereby the third terminal pattern functions as an auxiliary pattern.

[0082] In the electronic component, the fourth terminal pattern may be provided independently without being connected to other conductor patterns within the plane of the second conductor layer, whereby the fourth terminal pattern functions as an auxiliary pattern.

[0083] In the electronic component, the other end of the first coil pattern may be connected to the second terminal pattern, which allows the first coil pattern to be linearly arranged, for example.

[0084] In the electronic component, the second conductor layer may be formed only of the third terminal pattern and the fourth terminal pattern, with the third and fourth terminal patterns functioning as auxiliary patterns.

[0085] In the electronic component, the plurality of conductor layers may further include a third conductor layer, and the third conductor layer included in each of the plurality of coil portions may include a fifth terminal pattern having an end surface exposed on the first principal surface and constituting a fourth portion of the first terminal electrode, and a sixth terminal pattern having an end surface exposed on the second principal surface and constituting the fourth portion of the second terminal electrode, the third terminal pattern and the fifth terminal pattern included in each of the plurality of coil portions may be connected to each other through a third via conductor having an end surface exposed on the first principal surface and constituting the fifth portion of the first terminal electrode, and the fourth terminal pattern and the sixth terminal pattern included in each of the plurality of coil portions may be connected to each other through a fourth via conductor having an end surface exposed on the second principal surface and constituting the fifth portion of the second terminal electrode, thereby making it possible to further increase the areas of the first and second terminal electrodes.

[0086] In the electronic component, the third portion of the first terminal electrode and the fifth portion of the first terminal electrode may be located at different positions in the first direction, thereby improving adhesion between the first terminal electrode and the interlayer insulating film.

[0087] In the above electronic component, the second conductor layer may be formed only of the third and fourth terminal patterns, and the third conductor layer may be formed only of the fifth and sixth terminal patterns, which allows the first coil pattern to be positioned closer to the center of the magnetic base body.

[0088] In the electronic component, the second terminal pattern may be provided independently without being connected to other conductor patterns within the plane of the first conductor layer, and the third terminal pattern may be provided independently without being connected to other conductor patterns within the plane of the second conductor layer, which allows the first coil pattern to have, for example, a loop shape.

[0089] In the electronic component, the second conductor layer included in each of the plurality of coil portions may further include a second coil pattern connected to the fourth terminal pattern, and the first coil pattern included in each of the plurality of coil portions and the second coil pattern included in each of the plurality of coil portions may be connected in series, thereby making it possible to obtain a larger inductance.

[0090] In the electronic component, the plurality of conductor layers may further include a third conductor layer, and the third conductor layer included in each of the plurality of coil portions may include a fifth terminal pattern having an end surface exposed on the first principal surface and constituting a fourth portion of the first terminal electrode, a sixth terminal pattern having an end surface exposed on the second principal surface and constituting the fourth portion of the second terminal electrode, and a third coil pattern, the third terminal patterns and the fifth terminal patterns included in each of the plurality of coil portions may be connected to each other via a third via conductor having an end surface exposed on the first principal surface and constituting the fifth portion of the first terminal electrode, the fourth terminal patterns and the sixth terminal patterns included in each of the plurality of coil portions may be connected to each other via a fourth via conductor having an end surface exposed on the second principal surface and constituting the fifth portion of the second terminal electrode, and the second coil pattern included in each of the plurality of coil portions may be connected to the third coil pattern included in each of the plurality of coil portions in series, thereby making it possible to obtain even greater inductance.

[0091] In the electronic component, the widths in the second direction of the first terminal electrodes included in each of the plurality of coil portions and the widths in the second direction of the second terminal electrodes included in each of the plurality of coil portions may be different from each other, thereby making it possible to satisfy required characteristics such as heat dissipation characteristics.

[0092] In the electronic component, the width of the third portion of the first terminal electrode in the first direction may be at least three-quarters of the width of the first portion of the first terminal electrode in the first direction and the width of the second portion of the first terminal electrode in the first direction, thereby making it possible to ensure a sufficient area for the first terminal electrode.

[0093] In the electronic component, the surfaces of the first terminal electrodes included in each of the plurality of coil portions may be recessed from the first main surface, thereby improving adhesion between the first terminal electrodes and the substrate via conductors when the electronic component is embedded in a component-embedded substrate.

[0094] According to one aspect of the present disclosure, a component-embedded substrate is a substrate having the above-described electronic component embedded therein, the component-embedded substrate including: a plurality of first wiring patterns, a plurality of second wiring patterns, a plurality of first substrate via conductors connecting the plurality of first wiring patterns and first terminal electrodes included in the plurality of coil portions, and a plurality of second substrate via conductors connecting the plurality of second wiring patterns and second terminal electrodes included in the plurality of coil portions, whereby a sufficient contact area can be secured between the first terminal electrodes and the first substrate via conductors, and a sufficient contact area can be secured between the second terminal electrodes and the second substrate via conductors.

[0095] This application claims the benefit of Japanese Patent Application No. 2023-117669, filed on July 19, 2023, the entire disclosure of which is incorporated herein by reference.

[0096] 10 Component-embedded substrate 11 to 15 Insulating layer 20 to 22 Wiring pattern 31, 32 Substrate via conductor 100, 200, 300, 400, 500 Electronic component 101, 102 Main surface 103 to 106 Side surface 111 to 118 Coil portion 121, 122 Terminal electrode 130 Interlayer insulating film 140 to 149 Terminal pattern 151 to 158, 161 to 164 Via conductor A1, B1 First portion A2, B2 Second portion A3, B3 Third portion A4, B4 Fourth portion A5, B5 Fifth portion C11, C12, C21 to C24, C31 to C33 Coil pattern L1 to L5 Conductor layer M Magnetic base portion

Claims

1. A magnetic body part having a first main surface and a second main surface opposite to the first main surface; and a plurality of coil parts embedded in the magnetic body part, each of which has a first terminal electrode exposed to the first main surface and a second terminal electrode exposed to the second main surface, wherein the plurality of coil parts are arranged in a first direction parallel to the first main surface, and each of the plurality of coil parts has a plurality of conductor layers including first and second conductor layers that are stacked in a second direction perpendicular to the first direction and parallel to the first main surface, and the first conductor layer included in each of the plurality of coil parts includes a first terminal pattern having an end surface exposed to the first main surface and constituting a first portion of the first terminal electrode, a second terminal pattern having an end surface exposed to the second main surface and constituting a first portion of the second terminal electrode, and a first coil pattern having one end connected to the first terminal pattern, the second conductor layer included in each of the plurality of coil portions includes a third terminal pattern having an end face exposed on the first main surface and constituting a second portion of the first terminal electrode, and a fourth terminal pattern having an end face exposed on the second main surface and constituting the second portion of the second terminal electrode; the first terminal pattern and the third terminal pattern included in each of the plurality of coil portions are connected to each other via a first via conductor having an end face exposed on the first main surface and constituting a third portion of the first terminal electrode; the second terminal pattern and the fourth terminal pattern included in each of the plurality of coil portions are connected to each other via a second via conductor having an end face exposed on the second main surface and constituting the third portion of the second terminal electrode; at least a portion of the first conductor layer included in each of the plurality of coil portions and the second conductor layer included in each of the plurality of coil portions are each covered by an interlayer insulating film; the first terminal electrode included in each of the plurality of coil portions is surrounded by the interlayer insulating film on the first main surface; and the second terminal electrode included in each of the plurality of coil portions is surrounded by the interlayer insulating film on the second main surface.

2. The electronic component according to claim 1, wherein the first conductor layer and the second conductor layer included in each of the plurality of coil portions are stacked in the second direction with the interlayer insulating film at least partially interposed therebetween.

3. The electronic component according to claim 1, wherein the third terminal pattern is provided independently without being connected to other conductor patterns within the surface of the second conductor layer.

4. The electronic component according to claim 3, wherein the fourth terminal pattern is provided independently without being connected to other conductor patterns within the surface of the second conductor layer.

5. The electronic component according to claim 1, wherein the other end of the first coil pattern is connected to the second terminal pattern.

6. The electronic component according to claim 5, wherein the second conductor layer is made up of only the third terminal pattern and the fourth terminal pattern.

7. The electronic component according to claim 1, wherein the plurality of conductor layers further include a third conductor layer, and the third conductor layer included in each of the plurality of coil portions includes a fifth terminal pattern having an end face exposed on the first main surface and constituting a fourth portion of the first terminal electrode, and a sixth terminal pattern having an end face exposed on the second main surface and constituting the fourth portion of the second terminal electrode, the third terminal pattern and the fifth terminal pattern included in each of the plurality of coil portions are connected to each other via a third via conductor having an end face exposed on the first main surface and constituting the fifth portion of the terminal electrode, and the fourth terminal pattern and the sixth terminal pattern included in each of the plurality of coil portions are connected to each other via a fourth via conductor having an end face exposed on the second main surface and constituting the fifth portion of the second terminal electrode.

8. The electronic component according to claim 7, wherein the third portion of the first terminal electrode and the fifth portion of the first terminal electrode are located at different positions in the first direction.

9. The electronic component according to claim 7, wherein the second conductor layer is made up only of the third terminal pattern and the fourth terminal pattern, and the third conductor layer is made up only of the fifth terminal pattern and the sixth terminal pattern.

10. The electronic component according to claim 1, wherein the second terminal pattern is provided independently without being connected to other conductor patterns within the plane of the first conductor layer, and the third terminal pattern is provided independently without being connected to other conductor patterns within the plane of the second conductor layer.

11. The electronic component described in claim 10, wherein the second conductor layer included in each of the multiple coil sections further includes a second coil pattern connected to the fourth terminal pattern, and the first coil pattern included in each of the multiple coil sections and the second coil pattern included in each of the multiple coil sections are connected in series.

12. The electronic component according to claim 11, wherein the plurality of conductor layers further include a third conductor layer, and the third conductor layer included in each of the plurality of coil portions includes a fifth terminal pattern having an end face exposed on the first main surface and constituting a fourth portion of the first terminal electrode, a sixth terminal pattern having an end face exposed on the second main surface and constituting the fourth portion of the second terminal electrode, and a third coil pattern, the third terminal pattern and the fifth terminal pattern included in each of the plurality of coil portions are connected to each other via a third via conductor having an end face exposed on the first main surface and constituting the fifth portion of the first terminal electrode, the fourth terminal pattern and the sixth terminal pattern included in each of the plurality of coil portions are connected to each other via a fourth via conductor having an end face exposed on the second main surface and constituting the fifth portion of the second terminal electrode, and the second coil pattern included in each of the plurality of coil portions and the third coil pattern included in each of the plurality of coil portions are connected in series.

13. The electronic component according to claim 1, wherein the widths in the second direction of the first terminal electrodes included in each of the plurality of coil portions and the second terminal electrodes included in each of the plurality of coil portions are different from each other.

14. The electronic component described in claim 1, wherein the width in the first direction of the third portion of the first terminal electrode is equal to or greater than 3 / 4 of the width in the first direction of the first portion of the first terminal electrode and the width in the first direction of the second portion of the first terminal electrode.

15. The electronic component according to claim 1, wherein a surface of the first terminal electrode included in each of the plurality of coil portions is recessed from the first main surface.

16. A component-embedded substrate having an electronic component according to any one of claims 1 to 15 embedded therein, comprising: a plurality of first wiring patterns; a plurality of second wiring patterns; a plurality of first substrate via conductors connecting the plurality of first wiring patterns to the first terminal electrodes respectively included in the plurality of coil portions; and a plurality of second substrate via conductors connecting the plurality of second wiring patterns to the second terminal electrodes respectively included in the plurality of coil portions.

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