Electronic device including sensor assembly

Abstract

According to an embodiment disclosed herein, an electronic device may comprise: a housing that includes a first surface and a second surface facing the opposite direction as the first surface; a printed circuit board disposed in a space between the first surface and the second surface; a sensor assembly including at least one sensor, which is disposed between the first surface and the printed circuit board, and first contact members, which include conductive materials disposed on surfaces facing the printed circuit board; an elastic member including an elastic material and disposed between the printed circuit board and the sensor assembly; and a conductive plate disposed between the printed circuit board and the elastic member. In an embodiment, at least one of the first contact members can be electrically connected to the printed circuit board.

Description

Electronic device comprising a sensor assembly

[0001] The present disclosure relates to electronic devices, and for example, to electronic devices including a sensor assembly.

[0002] With the advancement of electronics, information, and communication technologies, a single electronic device is incorporating diverse functions. For example, smartphones, in addition to communication functions, include functions such as audio playback, imaging, and electronic notebooks. Furthermore, the installation of additional applications can enable even more diverse functions. Electronic devices can not only execute pre-installed applications or stored files, but also access servers or other electronic devices via wired or wireless means to receive a variety of information in real time.

[0003] As electronic devices become more sophisticated and miniaturized, carrying them around and using them is becoming more commonplace, and portable electronic devices are now available in a variety of forms. For example, a single user can carry and use multiple portable electronic devices, such as smartphones, tablet PCs, smart watches, wireless earphones, and / or smart glasses. As electronic device use becomes more prevalent, these devices can selectively utilize more frequency bands, reducing power consumption while maintaining a constant online state and providing users with an optimized user experience based on their current operating conditions.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to an exemplary embodiment of the present disclosure, an electronic device may include a housing including a first side and a second side opposite to the first side, a printed circuit board disposed in a space between the first side and the second side, at least one sensor disposed between the first side and the printed circuit board, the sensor assembly including first contact members including a conductive material disposed on a side facing the printed circuit board, an elastic member including an elastic material disposed between the printed circuit board and the sensor assembly, and an electrically conductive plate disposed between the printed circuit board and the elastic member. In one embodiment, at least one of the first contact members may be electrically connected to the printed circuit board.

[0006] According to an exemplary embodiment of the present disclosure, a wearable electronic device may include a housing including a front plate, a rear plate facing in an opposite direction of the front plate, and a side bezel at least partially surrounding a space between the front plate and the rear plate, at least one wearing member including a strap detachably provided on the housing, a printed circuit board disposed in the space between the front plate and the rear plate, a sensor assembly including at least one sensor disposed between the front plate and the printed circuit board, the sensor assembly including first contact members comprising a conductive material disposed on a surface facing the printed circuit board, at least one processor including a processing circuit configured to individually and / or collectively determine information about an operating environment within the housing using the sensor assembly, an elastic member comprising an elastic material disposed between the printed circuit board and the sensor assembly, and a conductive plate disposed between the printed circuit board and the elastic member. In one embodiment, at least one of the first contact members may be electrically connected to the printed circuit board.

[0007] The above-described or other aspects, configurations and / or advantages of one embodiment of the present disclosure may become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to various embodiments.

[0009] FIG. 2 is a front perspective view showing an electronic device according to various embodiments.

[0010] FIG. 3 is a rear perspective view illustrating the electronic device of FIG. 2 according to various embodiments.

[0011] FIG. 4 is an exploded perspective view showing an electronic device according to various embodiments.

[0012] FIG. 5 is an exploded perspective view illustrating a sensor assembly of an electronic device according to various embodiments.

[0013] FIG. 6 is a drawing showing the bottom surface of the sensor assembly of FIG. 5 according to various embodiments.

[0014] FIG. 7 is a drawing showing a plan view of the sensor assembly of FIG. 5 according to various embodiments.

[0015] FIG. 8 is an exploded perspective view showing a conductive plate of an electronic device according to various embodiments.

[0016] FIG. 9 is a perspective view showing an exemplary arrangement of a conductive plate of an electronic device according to various embodiments.

[0017] FIG. 10 is a perspective view showing the arrangement of conductive plates of an electronic device according to various embodiments.

[0018] FIG. 11 is a drawing showing an exemplary arrangement of a sensor assembly of an electronic device according to various embodiments.

[0019] FIG. 12 is a drawing showing a plan view of a rear plate of an electronic device according to various embodiments.

[0020] FIG. 13 is a cross-sectional view showing a portion of an electronic device according to various embodiments, taken along line A-A' of FIG. 5.

[0021] FIG. 14 is a perspective view showing an exemplary arrangement of a conductive plate of an electronic device according to various embodiments.

[0022] FIG. 15 is a cross-sectional view showing an exemplary arrangement of a conductive plate of an electronic device according to various embodiments.

[0023] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0024] As electronic devices become more advanced and miniaturized or lightweight enough to be worn on the body, their manufacturing and operating environments can deteriorate. For example, when equipped with antennas corresponding to various frequency bands, it can be difficult to achieve a stable communication environment while suppressing electromagnetic interference with other antennas or electronic components within a miniaturized electronic device. To detect operating conditions at the time of use (e.g., temperature, humidity, air pressure, user movement or posture, and / or current spatial brightness), electronic devices can include various types of sensors. However, arranging multiple sensors within a miniaturized electronic device can be challenging. In structures where the sensor(s) are assembled or arranged separately from the main circuit board, arranging connectors or wiring for connection to the main circuit board can be even more challenging.

[0025] An exemplary embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and at least provide the advantages described below, and can provide an electronic device including a sensor assembly that can increase the degree of design freedom in the arrangement of various components in an internal space.

[0026] An exemplary embodiment of the present disclosure may provide an electronic device including a sensor assembly that is easy to place in a narrow space.

[0027] An exemplary embodiment of the present disclosure may provide an electronic device including a sensor assembly that can be easily connected to a main circuit board without utilizing a connector or wiring.

[0028] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0029] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. The various exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, but are not intended to limit the present disclosure. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and technical spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0031] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0032] FIG. 1 is a block diagram of an exemplary electronic device (101) within a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In various embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In various embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may include various processing circuits and / or multiple processors. For example, the term "processor" as used herein, including in the claims, may include various processing circuits including at least one processor, one or more of which may be configured to individually and / or collectively perform the various functions described herein in a distributed manner. As used herein, where "processor," "at least one processor," and "one or more processors" are described as being configured to perform various functions, these terms may encompass, for example, without limitation, a situation where a single processor performs some of the enumerated functions, other processor(s) perform other of the enumerated functions, and / or a situation where a single processor can perform all of the enumerated functions. Additionally, the at least one processor may include a combination of processors that perform the various functions enumerated / disclosed, for example, in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions. The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134).According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0055] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0056] The term "module" used in embodiments of the present disclosure may include a unit implemented with hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrally formed component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0057] Embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, a 'non-transitory' storage medium is a tangible device and may not include a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0058] According to one embodiment, a method according to the embodiment(s) of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0059] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front of the electronic device and / or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device and / or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the rectangular coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from that in the present disclosure.

[0061] FIG. 2 is a front perspective view illustrating an electronic device (200) (e.g., the electronic device (101) of FIG. 1) according to various embodiments. FIG. 3 is a rear perspective view illustrating the electronic device (200) of FIG. 2 according to various embodiments.

[0062] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (220) including a first side (or front side) (220A), a second side (or back side) (220B), and a side surface (220C) surrounding a space between the first side (220A) and the second side (220B), and at least one wearing member (250, 260) (e.g., a strap or band) connected to at least a portion of the housing (220) and configured to allow the electronic device (200) or the housing (220) to be worn on a part of the user's body (e.g., a wrist, an ankle, etc.). For example, the electronic device (200) may be utilized as a wearable electronic device by including the wearing member (250, 260). In one embodiment (not shown), the housing may refer to a structure forming a portion of the first side (220A), the second side (220B), and the side surface (220C) of FIG. 2. According to one embodiment, the first side (220A) may be formed by a front plate (201) that is at least partially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second side (220B) may be formed by a back plate (207) that is substantially opaque. In one embodiment, when the electronic device includes a sensor module (211) disposed on the second side (220B), the back plate (207) may include an at least partially transparent area. The back plate (207) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (220C) may be formed by a side bezel structure (or “side member”) (206) that is coupled to the front plate (201) and / or the back plate (207) and comprises a metal and / or polymer. In one embodiment, the back plate (207) and the side bezel structure (206) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).The above-mentioned wearing member (250, 260) may be formed of various materials and shapes. A single unit or multiple unit links may be formed to be movable with respect to each other using woven fabric, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the above-mentioned materials.

[0063] According to one embodiment, the electronic device (200) may include at least one of a display (320, see FIG. 4), an audio module (205, 208), a sensor module (211), a key input device (202, 203, 204), and a connector hole (209). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the key input device (202, 203, 204), the connector hole (209), or the sensor module (211)) or may additionally include other components.

[0064] A display (e.g., display (320) of FIG. 4) may be visible, for example, through a significant portion of the front plate (201). The shape of the display (320) may correspond to the shape of the front plate (201), and may have various shapes such as a circle, an oval, or a polygon. The display (320) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0065] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). The microphone hole (205) may have a microphone positioned therein for acquiring external sounds, and in one embodiment, multiple microphones may be positioned therein to detect the direction of sounds. The speaker hole (208) may be used as an external speaker and a receiver for calls. In one embodiment, a speaker may be included without a speaker hole (e.g., a piezo speaker).

[0066] The sensor module (211) can generate an electric signal or data value corresponding to the internal operating state of the electronic device (200) or the external environmental state. The sensor module (211) can include, for example, a biometric sensor module (e.g., an HRM sensor) arranged on the second surface (220B) of the housing (220). The electronic device (200) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0067] The key input devices (202, 203, 204) may include a wheel key (202) disposed on a first side (220A) of the housing (220) and rotatable in at least one direction, and / or a side key button (203, 204) disposed on a side surface (220C) of the housing (220). The wheel key (202) may have a shape corresponding to the shape of the front plate (201). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (202, 203, 204), and the key input devices (202, 203, 204) that are not included may be implemented in another form, such as a soft key, on the display (320). The connector hole (209) can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and can include another connector hole (not shown) for receiving a connector for transmitting and receiving audio signals with the external electronic device. The electronic device (200) can further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (209) and blocks the inflow of external foreign substances into the connector hole.

[0068] Each of the wearing members (250, 260) can be removably fastened to at least a portion of the housing (220) using a locking member (251, 261). The locking members (251, 261) can include a fastening component such as a pogo pin, and can be replaced with a protrusion(s) or recess(es) formed in the wearing members (250, 260) according to an embodiment. For example, the wearing members (250, 260) can be coupled in a manner of engaging with the grooves or protrusions formed in the housing (220). The wearing members (250, 260) can include one or more of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fixing ring (255).

[0069] The fixing member (252) may be configured to fix the housing (220) and the wearing member (250, 260) to a part of the user's body (e.g., wrist, ankle, etc.). The fixing member fastening hole (253) may correspond to the fixing member (252) to fix the housing (220) and the wearing member (250, 260) to a part of the user's body. The band guide member (254) may be configured to limit the range of movement of the fixing member (252) when the fixing member (252) is fastened to the fixing member fastening hole (253), thereby allowing the wearing member (250, 260) to be fastened in close contact with a part of the user's body. The band fixing ring (255) may limit the range of movement of the wearing member (250, 260) when the fixing member (252) and the fixing member fastening hole (253) are fastened.

[0070] FIG. 4 is an exploded perspective view showing an electronic device (300) (e.g., the electronic device (101, 200) of FIGS. 1 to 3) according to various embodiments.

[0071] Referring to FIG. 4, the electronic device (200, 300) may include a side bezel structure (310), a wheel key (330), a front plate (301) (e.g., the front plate (201) of FIG. 2), a display (320), a support member (360) (e.g., a bracket), a battery (not shown), a printed circuit board (380) (e.g., a main circuit board), a rear plate (393), and a wearing member (e.g., the wearing member (250, 260) of FIG. 2 or 3). The wearing member (250, 260) may be fastened between fastening arms (319) provided in the side bezel structure (310), and it is noted that the wearing member (250, 260) is omitted in FIG. 4. At least one of the components of the electronic device (200, 300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2 or FIG. 3, and any overlapping descriptions will be omitted below.

[0072] The support member (360) may be disposed inside the electronic device (200, 300) and connected to the side bezel structure (310), or may be formed integrally with the side bezel structure (310). The support member (360) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The support member (360) may have a display (320) coupled to one surface and a printed circuit board (380) coupled to the other surface. The printed circuit board (380) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a communication module (e.g., the communication module (190) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a GPU (graphics processing unit), an application processor sensor processor, or a communication processor.

[0073] The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200, 300) to an external electronic device, and may include, for example, a USB connector, an SD card / MMC connector, or an audio connector.

[0074] The battery, which is not shown, may be a device for supplying power to at least one component of the electronic device (200, 300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery may be accommodated in a space provided by the support member (360), for example, or may be arranged substantially on the same plane as the printed circuit board (380). The battery (370) may be integrally arranged within the electronic device (200, 300), or may be arranged to be detachably attached to the electronic device (200, 300).

[0075] In one embodiment, the electronic device (200, 300) may include a plurality of antennas (331; 331a, 331b, 331c, 331d). For example, the electronic device (200, 300) may perform wireless communication with an external electronic device (e.g., the electronic device (102, 104) of FIG. 1) or a server (e.g., the server (108) of FIG. 1) and may wirelessly transmit power. In one embodiment, when the side bezel structure (310) or the support member (360) includes a metal material, the electronic device (200, 300) may be configured such that at least a portion of the side bezel structure (310) and / or the support member (360) functions as an additional antenna or may be utilized as a radiation conductor in combination with any one of the plurality of antennas (331). For example, a processor (e.g., processor (120) of FIG. 1) or a communication module (e.g., communication module (190) of FIG. 1) may be configured to perform wireless communication using at least a portion of the side bezel structure (310) and / or the support member (360).

[0076] According to one embodiment, the first antenna (331a) among the antennas (331) may be implemented by a conductive pattern provided on the support member (360). The conductive pattern may be, for example, formed by processing a metal plate and attaching it to the support member, or may be formed by a laser direct structuring (LDS) method. In one embodiment, when a portion of the side bezel structure (310) includes a conductive material, the first antenna (331a) may form an electromagnetic coupling with the side bezel structure (310), so that the portion of the side bezel structure (310) may function as an antenna. The side bezel structure (310) including the conductive material may function as an antenna for accessing a commercial communication network (e.g., a 4th generation mobile communication network), and may be utilized as an antenna for short-range wireless communication such as Bluetooth communication or Wi-Fi by forming an electromagnetic coupling with the first antenna (331a).

[0077] According to one embodiment, the second antenna (331b) and / or the third antenna (331c) among the antennas (331) may be implemented based on a flexible printed circuit board and may be provided on the rear plate (393). In one embodiment, the second antenna (331b) and / or the third antenna (331c) may be implemented by an LDS pattern on the inner surface of the rear plate (393). In one embodiment, the second antenna (331b) and / or the third antenna (331c) may function as an antenna for commercial communication network connection or an antenna for short-range wireless communication, and / or may be provided as a ground for another antenna to stabilize wireless communication performance.

[0078] According to one embodiment, the fourth antenna (331d) among the antennas (331) may include a radiation conductor implemented by a conductive sheet (or conductive plate) processed into a curved or semicircular shape, and may be provided on the inner surface of the rear plate (393). In one embodiment, the fourth antenna (331d) may be implemented based on a flexible printed circuit board or may be implemented in an LDS pattern. In one embodiment, the fourth antenna (33d) may function as an ultra-wideband antenna and / or may be provided as a ground for an antenna for short-range wireless communication.

[0079] According to one embodiment, the electronic devices (200, 300) and / or the antennas (331) may further include an additional antenna (e.g., an antenna indicated as '331e' in FIG. 12, hereinafter referred to as a 'fifth antenna') not illustrated in FIG. 4. The fifth antenna (331e) may be implemented based on, for example, a flexible printed circuit board, or may be implemented with a conductive sheet and / or an LDS pattern, and may be provided on the inner surface of the rear plate (393). In one embodiment, the fifth antenna (331e) may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the fifth antenna (331e) may perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. In one embodiment, the fifth antenna (331e) can function as an antenna for accessing a commercial communication network or an antenna for short-range wireless communication, and can stabilize wireless communication performance by providing a ground to antennas of other frequency bands.

[0080] In the above-described embodiment, the communication bands assigned to the antennas (331) have been exemplarily mentioned, but it should be noted that the embodiment(s) of the present disclosure are not limited thereto. For example, the above-described mention exemplifies that the electronic device (200, 300) can perform wireless communication in various frequency bands, and the communication bands assigned to the antennas (331) may be appropriately changed depending on the specifications of the electronic device (200, 300) to be actually manufactured and the design of the internal space.

[0081] According to one embodiment, the rear plate (393) may include a first cover plate (393a) and a second cover plate (393b) arranged to surround at least a portion of the first cover plate (393a). In one embodiment, the first cover plate (393a) may be coupled to an outer surface (e.g., a surface facing the -Z direction) of the second cover plate (393b), and a sensor module (e.g., the sensor module (176, 393c) of FIG. 1 or 13) may be arranged between the first cover plate (393a) and the second cover plate (393b). The sensor module arranged on the rear plate (393) may be formed of, for example, a combination of a light-emitting element and a light-receiving element, and may detect user biometric information. In one embodiment, when the sensor module disposed on the rear plate (393) includes a light-emitting element and a light-receiving element, at least a portion of the first cover plate (393a) may include a material that can transmit light. In the illustrated embodiment, the second cover plate (393b) has a substantially circular shape when viewed in the Z-axis direction, but the present disclosure is not limited thereto, and the second cover plate (393b) may have a polygonal shape. In one embodiment, the first cover plate (393a) may be coupled to the second cover plate (393b) by an adhesive material such as a double-sided tape or a sealing material, thereby forming a sealing structure or a waterproof structure between the first cover plate (393a) and the second cover plate (393b).

[0082] Although not shown, the electronic device (200, 300) may include a waterproofing member positioned between the side bezel structure (310) and the rear plate (393). The waterproofing member may be configured to block moisture and foreign substances from entering the space surrounded by the side bezel structure (310) and the rear plate (393) from the outside, for example. In one embodiment, the sealing member may include a double-sided tape positioned between the side bezel structure (310) and the front plate (301), and / or an O-ring made of a rubber material provided between the side bezel structure (310) and the rear plate (393).

[0083] According to one embodiment, the electronic device (200, 300) may include a sensor assembly (305) as one of the sensor modules for detecting an operating environment (e.g., the sensor module (176) of FIG. 1), and may include an elastic member (359) and a conductive plate (383) in the arrangement of the sensor assembly (305). The sensor assembly (305) may be arranged between a first surface (e.g., the first surface (220A) of FIG. 2) (e.g., the front plate (301)) of the electronic device (200, 300) and a printed circuit board (380). In one embodiment, the elastic member (359) may be arranged between the sensor assembly (305) and the printed circuit board (380), and the conductive plate (383) may be arranged between the elastic member (359) and the printed circuit board (380). In one embodiment, the support member (360) can be disposed between the printed circuit board (380) and the first surface (220A) to secure the sensor assembly (305) on the printed circuit board (380). In one embodiment, the placement of the support member (360) allows the elastic member (359) to be deformed into a more compressed shape than its initially manufactured state. The elastic member (359) can include, for example, at least one of rubber, silicone, or urethane, and can be easily cut into a shape having a relatively thin thickness (e.g., a thickness of approximately 1 mm or less) and width (e.g., a width of approximately 2 mm or less) by having a specified elastic modulus. In one embodiment, when the elastic member (359) is made of silicone, it can be easily cut into a size having a thickness of approximately 0.2 mm and a width of approximately 0.8 mm. In one embodiment, when the elastic member (359) is made of an elastic material such as rubber, silicone or urethane, it can stably support the sensor assembly (305) (e.g., substrate (351)) while being compressed to a specified size when exposed to an external force (e.g., water pressure or air pressure) and can have durability against repeated compression or restoration.When exposed to an external force, the sensor assembly (305) flows and the elastic member (359) is compressed, and depending on the change in the external force, the elastic member (359) can be further compressed or restored to its pre-compression shape. The elastic member (359) has a specified elastic coefficient, so that it can be durable while allowing the flow of the sensor assembly (305) and suppressing contact with other structures. In one embodiment, the elastic member (359) has a specified elastic coefficient, so that it can allow the flow of the sensor assembly (305) and suppress excessive friction of the sealing member (357) or detachment (or separation) of the sealing member (357) due to the flow of the sensor assembly (305), which will be described later.

[0084] In one embodiment, the sensor assembly (305) may be configured to detect at least one of air pressure, water pressure, temperature, user movement (e.g., displacement, direction, and / or speed), and / or brightness of the current space, for example, within the housing (220) or the side bezel structure (310). An embodiment of the sensor assembly (305) will be discussed in more detail below with reference to FIGS. 5 to 7.

[0085] FIG. 5 is an exploded perspective view illustrating a sensor assembly (305) (e.g., the sensor assembly (305) of FIG. 4) of an electronic device (e.g., the electronic devices (101, 200, 300) of FIGS. 1 to 4) according to various embodiments. FIG. 6 is a view illustrating a bottom surface of the sensor assembly (305) of FIG. 5 according to various embodiments. FIG. 7 is a view illustrating a top surface of the sensor assembly (305) of FIG. 5 according to various embodiments.

[0086] Referring further to FIGS. 5-7, along with FIG. 4, the sensor assembly (305) may include first contact members (355) disposed on a surface facing the printed circuit board (380), and the first contact members (355) may be electrically connected to the printed circuit board (380). In one embodiment, the printed circuit board (380) may include second contact members (381) corresponding to the first contact members (355). For example, the sensor assembly (305) may be electrically connected to the printed circuit board (380) via the first contact members (355) and / or the second contact members (381). For example, the sensor assembly (305) may be electrically connected to the printed circuit board (380) by being disposed substantially at least partially facing the printed circuit board (380) without a separate connector or wiring. By omitting the connector or wiring for connecting the sensor assembly (305), more space for arranging other electronic components can be secured inside the electronic device (200, 300) (e.g., the housing (220) or the side bezel structure (310)). For example, compared to a structure in which a sensor assembly including a connector or wiring is arranged, the electronic device (200, 300) can have an expanded battery capacity. The space secured by omitting the connector or wiring can be utilized, for example, for arranging additional antennas or expanding the ground for the antenna.

[0087] According to one embodiment, the first contact members (355) may be implemented with a plate spring structure such as a C-clip, in which case the second contact members (381) may be implemented with electrically conductive pads. In one embodiment, the first contact members (355) may be implemented with conductive pads, in which case the second contact members (381) may be implemented with a plate spring structure. In one embodiment, the first contact members (355) and the second contact members (381) may be implemented with a plate spring structure. Here, the 'plate spring structure' may refer to a structure that, when in contact with an object and an external force is applied, deforms and / or moves to a specified degree, accumulates elastic force, and maintains a state of being in contact with the object by utilizing the accumulated elastic force.

[0088] According to one embodiment, the sensor assembly (305) may include a substrate (351) and / or sensor elements (353), and the first contact members (355) may be understood to be disposed on one side of the substrate (351). The sensor elements (353) may include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, depending on the information to be detected, and may be disposed on the other side of the substrate (351).

[0089] In one embodiment, the elastic member (359) and / or the conductive plate (383) may be disposed between the printed circuit board (380) and the sensor assembly (305) (e.g., the substrate (351)). FIG. 6 illustrates an example of the elastic member (359) being disposed on the substrate (351). For example, the elastic member (359) may be disposed in an area between the first contact members (355), thereby providing an environment in which the first contact members (355) are disposed to directly face the printed circuit board (380) (e.g., the second contact members (381)). In one embodiment, when the elastic member (359) is disposed, the first contact members (355) may be understood to be disposed symmetrically with respect to each other with respect to the elastic member (359) as the center. As will be described later, the conductive plate (383) may have a different size than the elastic member and may be positioned similarly to the elastic member (359) on the sensor assembly (305).

[0090] According to one embodiment, when the sensor assembly (305) is configured to detect air pressure or water pressure, the sensor assembly (305) may be connected to an external space of the electronic device (200, 300) through a receiving hole (361) provided in the support member (360) and / or a ventilation hole (311) provided in the side bezel structure (310). In one embodiment, a portion of the sensor assembly (305) (e.g., the sensor element (353)) is received in the receiving hole (361), and the ventilation hole (311) may be connected to the receiving hole (361) by penetrating the side bezel structure (310) from the external space of the electronic device (200, 300). In one embodiment, the sensor assembly (305) may further include a sealing member (357) (e.g., a seal) provided around the sensor element (353). When the sensor element (353) is at least partially accommodated in the receiving hole (361), the sealing member (357) may be brought into close contact with the inner wall of the receiving hole (361). For example, the sealing member (357) may contact the inner wall of the receiving hole (361) along a closed loop trajectory, thereby sealing or closing the gap between the outer surface of the sensor element (353) and the inner wall of the receiving hole (361). In one embodiment, when the sensor assembly (305) is configured to detect air pressure or water pressure, the sealing member (357) may suppress or block moisture or foreign substances from entering the internal space of the electronic device (200, 300), while providing an environment in which the sensor element is connected to the external space via the receiving hole and the ventilation hole. The arrangement of the sensor assembly (305) and the connection structure to the external space will be described again with reference to FIG. 13.

[0091] FIG. 8 is an exploded perspective view showing a conductive plate (e.g., the conductive plate (383) of FIG. 4) of an electronic device (e.g., the electronic devices (101, 200, 300) of FIGS. 1 to 4) according to various embodiments. FIG. 9 is a perspective view showing an exemplary appearance of a conductive plate (383) of an electronic device (200, 300) according to various embodiments. FIG. 10 is a perspective view showing an exemplary appearance of a conductive plate (383) of an electronic device (200, 300) according to various embodiments.

[0092] With further reference to FIGS. 8 through 10, along with FIG. 4, the conductive plate (383) may include a plate member (383a) disposed on one surface of the printed circuit board (380). For example, the plate member (383a) may be understood as a structure disposed between the elastic member (359) and the printed circuit board (380). In one embodiment, the conductive plate (383) (e.g., the plate member (383a)) may be disposed substantially in an area between the first contact members (355) and / or an area between the second contact members (381). For example, the conductive plate (383) (e.g., the plate member (383a)) may be understood as being disposed substantially coplanar with the first contact members (355) and / or the second contact members (381) at least partially.

[0093] According to one embodiment, the conductive plate (383) may further include a contact pole (383b) extending from one surface (e.g., one surface of the plate member (383a)) and / or a contact protrusion (383c) provided on the contact pole (383b). As will be described below, the contact pole (383b) may have a pogo-pin structure, in which case the contact protrusion (383c) may be replaced with a contact end (e.g., a contact end (583c) of FIG. 15) retractably disposed at an end of the contact pole (383b). In one embodiment, the conductive plate (383) may be disposed on the printed circuit board (380) by a surface mounting process, and the contact pole (383b) may protrude through the printed circuit board (380) toward the second surface (e.g., the second surface (220B) of FIG. 3). For example, when the conductive plate (383) is defined as being disposed on the front surface of the printed circuit board (380), the contact pole (383b) may be understood as being disposed on the back surface of the printed circuit board (380). In one embodiment, the conductive plate (383) (e.g., the contact pole (383b)) may electrically connect at least one of the antennas (331) (e.g., the fourth antenna (331d)) to the printed circuit board (380). For example, the conductive plate (383) can stabilize wireless communication performance by connecting at least one of the antennas (331) to a ground provided on the printed circuit board (380).

[0094] According to one embodiment, when the sensor assembly (305) is configured to be exposed to external pressure (e.g., air pressure or water pressure), the elastic member (359) and / or the conductive plate (383) can suppress displacement of the sensor assembly (305). For example, even if an external force is applied to the sensor assembly (305), the elastic member (359) and / or the conductive plate (383) can stably support the sensor assembly (305). In one embodiment, since the position of the sensor assembly (305) can be stably maintained, the sealing structure provided by the sealing member (357) can be stably maintained. In one embodiment, even if the position of the sensor assembly (305) is slightly changed due to the external force, the external force can be suppressed from being transmitted to another structure (e.g., the printed circuit board (380)) by the elastic member (359).

[0095] FIG. 11 is a drawing showing an exemplary arrangement of a sensor assembly (e.g., a sensor assembly (305) of FIGS. 4 to 7) of an electronic device (e.g., an electronic device (101, 200, 300) of FIGS. 1 to 4) according to various embodiments.

[0096] Referring further to FIG. 11, when the sensor assembly (305) is disposed on the printed circuit board (380), the first contact members (355) and the corresponding second contact members (381)(s) may be electrically and / or mechanically contacted even without a separate connector or wiring. In the illustrated embodiment, it may be understood that the first contact members (355) are implemented as circular conductive pads, and the second contact members (381) are implemented as plate spring structures (e.g., C clips). In one embodiment, when the conductive plate (383) (e.g., plate member (383a)) is electrically connected to the printed circuit board (380), an elastic member (359) may be disposed between the conductive plate (383) and the sensor assembly (305). In one embodiment, when the conductive plate (383) is not electrically connected to the printed circuit board (380), the elastic member (359) may be placed between the conductive plate (383) and the printed circuit board (380).

[0097] In one embodiment, the elastic member (359) may be manufactured to be smaller in length or width than the conductive plate (383) (e.g., the plate member (383a)). For example, since the thickness, length, and / or width of the elastic member (359) may change when an external force is applied, the elastic member (359) may be smaller than the conductive plate (383) that substantially maintains its initially manufactured shape. However, the embodiment(s) of the present disclosure are not limited thereto, and the elastic member (359) may be manufactured to be larger than the conductive plate (383) depending on the specifications of the electronic device (200, 300) or sensor assembly (305) to be actually manufactured. For example, when the gap between the elastic member (359) and the first contact members (355) and / or the gap between the conductive plate (383) and the first contact members (355) are sufficiently secured, the elastic member (359) may be manufactured to be larger than the conductive plate (383). In one embodiment, the relative sizes of the elastic member (359) and the conductive plate (383) may be determined by taking into account the spacing between the elastic member (359) and the second contact members (381), and / or the spacing between the conductive plate (383) and the second contact members (381).

[0098] FIG. 12 is a plan view of a rear plate (e.g., the rear plate (393) of FIG. 4) of an electronic device (e.g., the electronic devices (101, 200, 300) of FIGS. 1 to 4) according to various embodiments. FIG. 13 is a cross-sectional view showing a portion of an electronic device (200, 300) according to various embodiments, taken along line A-A' of FIG. 5.

[0099] Fig. 12 illustrates the arrangement of antennas (331; 331b, 331c, 331d, 331e) arranged on the inner surface of the rear plate (393) (e.g., the first cover plate (393b)), which may be similar to the embodiment of Fig. 4, and thus a detailed description thereof may not be repeated hereinafter. The antennas (331; 331b, 331c, 331d, 331e) may perform wireless communications with different functions in different frequency bands (or similar frequency bands), and in one embodiment, may be configured to provide a ground to other antenna(s).

[0100] Referring further to FIGS. 12 and 13, the support member (360) may be substantially fixed to the side bezel structure (310) and may provide a structure for placing or fixing internal components (e.g., a sensor assembly (305) and / or a printed circuit board (380)). The sensor assembly (305) may be placed on one surface (e.g., a surface facing the +Z direction) of the printed circuit board (380) and may be supported by an elastic member (359) and a conductive plate (383) (e.g., a plate member (383a)). In one embodiment, the elastic member (359) and the conductive plate (383) may be disposed in an area between the first contact members (e.g., the first contact members (355) of FIG. 6 or FIG. 11) of the sensor assembly (305) and / or an area between the second contact members (e.g., the second contact members (381) of FIG. 4 or FIG. 11) of the printed circuit board (380), thereby allowing the sensor assembly (305) to be electrically connected to the printed circuit board (380). For example, the sensor assembly (305) may be connected to the printed circuit board (380) without a separate connector or wiring, thereby improving the degree of design freedom within the electronic device (200, 300) and / or facilitating expansion of the capacity of the battery.

[0101] According to one embodiment, at least a portion of the sensor assembly (305), for example, the sensor element (353), is accommodated in a support member (360) (e.g., a receiving hole (361)) along the +Z direction, and the receiving hole (361) may be connected to a ventilation hole (311) in a direction intersecting the Z axis. As mentioned above, the ventilation hole (311) is connected to the receiving hole (361) by penetrating the side bezel structure (310) from an external space, for example. When the sensor assembly (305) is a structure exposed to an external pressure (P) (e.g., air pressure or water pressure), the elastic member (359) and the conductive plate (383) may prevent, suppress and / or injibit the sensor assembly (305) from being displaced. For example, the sealing member (357) can prevent foreign substances from entering the electronic device (200, 300) from the outside by stably maintaining a state of close contact with the inner wall of the receiving hole (361).

[0102] According to one embodiment, in order to prevent the inflow of external foreign substances, the electronic device (200, 300) and / or the side bezel structure (310) may further include a screen member (310a). The screen member (310a) may be disposed, for example, on the ventilation hole (311) on the outer circumferential surface of the side bezel structure (310). When the sensor assembly (305) is configured to detect air pressure or water pressure, the screen member (310a) may transmit the external pressure to the inside of the ventilation hole (311) and / or the receiving hole (361), while preventing or blocking foreign substances such as dust from being inflowed into the ventilation hole (311) and / or the receiving hole (361). In one embodiment, the screen member (310a) illustrated in FIG. 13 may be omitted if an unillustrated screen member is additionally disposed in the boundary area (BA) between the ventilation hole (311) and the receiving hole (361), or if an unillustrated screen member is disposed in the boundary area (BA). In one embodiment, the screen member (310a) may be understood to be substantially a part of the side bezel structure (310) and / or a part of the support member (360).

[0103] In one embodiment, a portion of the conductive plate (383) (e.g., the contact pole (383b) and / or the contact protrusion (383c) of FIG. 8) may be disposed in a direction toward the back plate (393) from one side (e.g., the side facing the -Z direction) of the printed circuit board (380). In one embodiment, when the conductive plate (383) further includes the contact pole (383b) and / or the contact protrusion (383c), the conductive plate (383) may electrically connect at least one of the antennas (331) (e.g., the fourth antenna (331d)) to the printed circuit board (380). For example, the conductive plate (383) may provide power to at least one of the antennas (331) or connect it to a ground of the printed circuit board (380). In this way, when the electronic device (200, 300) is a wearable electronic device that is miniaturized or lightweight enough to be worn on a user's body, the conductive plate (383) may be useful in stabilizing the operating environment of the antenna(s) placed in a narrow space. In one embodiment, when the conductive plate (383) electrically connects at least one of the antennas (331) to the printed circuit board (380), the contact protrusion (383c) may have a semi-spherical shape. For example, by providing the contact protrusion (383c) in a semi-spherical shape, the conductive plate (383) can stably contact at least one of the antennas (331).

[0104] According to one embodiment, the rear plate (393) may incorporate a sensor module (393c) for detecting user biometric information. For example, the sensor module (393c) is accommodated in a space between the first cover plate (393a) and the second cover plate (393b) and may detect user biometric information. For example, when the electronic device (200, 300) is worn on the user's body, the rear plate (393) (e.g., the first cover plate (393a)) may substantially come into contact with the user's skin, and thus the sensor module (393c) may easily detect user biometric information.

[0105] FIG. 14 is a perspective view showing an exemplary appearance of a conductive plate (483) (e.g., a conductive plate (383) of FIG. 4 or FIG. 8) arranged in an electronic device (e.g., an electronic device (101, 200, 300) of FIGS. 1 to 4) according to various embodiments.

[0106] When the above-described conductive plate (383) is defined as being single, the embodiment of FIG. 14 can be understood as providing a plurality of conductive plates (483). For example, the conductive plate (484) may include a plurality of plate members (483a) and a plurality of contact poles (383b). The contact poles (383b) may each extend from one of the plate members (483a) and may penetrate the printed circuit board (380) to contact at least one of the antennas (e.g., the fourth antenna (331d)) (e.g., the antennas (331; 331b, 331c, 331d, 331e) of FIG. 4 or FIG. 12). The conductive plates (483) (e.g., plate members (483a)) can be disposed substantially on one side of the printed circuit board (380) in an area between the second contact members (381) (or the first contact members (355)). Depending on the position and number of contacts made by the conductive plates (483) (e.g., contact poles (383b)), for example, depending on the position or number of electrical paths provided by the conductive plates (483) to the printed circuit board (380), the frequency of a signal transmitted and received through at least one of the antennas (331) (e.g., the fourth antenna (331d)) can be adjusted. In one embodiment, depending on the position and number of contacts made by the conductive plates (483), at least one of the antennas (331) (e.g., the fourth antenna (331d)) can perform wireless communication in multiple frequency bands. In one embodiment, the conductive plate (483) may function as a ground for an antenna for short-range wireless communication (e.g., Wi-Fi or Bluetooth), and an unillustrated conductive member may be provided to function as a sub-antenna for ultra wide band (UWB) wireless communication.

[0107] FIG. 15 is a cross-sectional view showing an exemplary appearance of an electronic device (e.g., an electronic device (101, 200, 300) of FIGS. 1 to 4) in which a conductive plate (583) (e.g., a conductive plate (383, 483) of FIG. 4, FIG. 8, or FIG. 14) is arranged according to various embodiments.

[0108] Referring to FIG. 15, the structure of the above-described contact protrusion (e.g., the contact protrusion (383c) of FIG. 8) may be replaced with a contact end (583c) that is arranged to be retractable from the end of the contact pole (583b). For example, the conductive plate (583) may include a pogo pin structure. In one embodiment, the pogo pin structure may be understood as one of the above-described plate spring structures. For example, the conductive plate (583) may be a component that accumulates elastic force by being deformed or displaced to a specified degree when an external force is applied by contacting a counterpart (e.g., at least one of the antennas (331)), and maintains a state of being in contact with the counterpart by utilizing the accumulated elastic force.

[0109] According to one embodiment, the conductive plate (583) may include a plate member (383a), a tube-shaped contact pole (583b), a spring member (583d) accommodated in the contact pole (583b), and / or a contact end (583c) accommodated in the contact pole (583b) and supported by the spring member (583d). The spring member (583d) may be, for example, a coil spring, and a support pin (583e) may be provided inside the contact pole (583b) to support the shape or position of the spring member (583d).

[0110] In one embodiment, the contact end (583c) can be maintained in a protruding state from the end of the contact pole (583b) by the elastic force of the spring member (583d), and can be retracted in a direction accommodated by the contact pole (583b) by an external force. When the external force is not applied, the contact end (583c) can be retracted to the end of the contact pole (583b) by the elastic force of the spring member (583d). In one embodiment, when the contact end (583c) is provided to be retractable to the end of the contact pole (583b) while being provided with an elastic force, the conductive plate (583) can be brought into more stable contact with at least one of the antennas (331). For example, even if there is a manufacturing tolerance or an external impact, the conductive plate (583) can stably maintain a state in which at least one of the antennas (331) is electrically connected to the printed circuit board (380).

[0111] As described above, electronic devices according to various exemplary embodiments (e.g., electronic devices (101, 200, 300) of FIGS. 1 to 4) can be easily placed in narrow spaces and have greater design freedom in the arrangement of various components since separate connectors or wiring can be omitted when connecting a sensor assembly (e.g., sensor assembly (305) of FIGS. 4 to 7) to a printed circuit board (e.g., printed circuit board (380) of FIG. 4)). In one embodiment, since connectors or wiring are omitted, performance or function expansion can be easily achieved by arranging additional components, and battery capacity can be easily expanded. In one embodiment, a conductive plate (e.g., conductive plate (383) of FIGS. 4 and / or 8) supporting a sensor assembly can be useful for stabilizing wireless communication performance in a miniaturized electronic device by providing a path for electrically connecting antenna(s) to a printed circuit board.

[0112] The effects obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0113] According to an exemplary embodiment of the present disclosure, an electronic device (e.g., an electronic device (101, 200, 300) of FIGS. 1 to 4) comprises a housing (e.g., a housing (220) of FIG. 2) having a first surface (e.g., a first surface (220A) of FIG. 2) and a second surface (e.g., a second surface (220B) of FIG. 3) opposite to the first surface, a printed circuit board (380) of FIG. 4) disposed in a space between the first surface and the second surface, a sensor assembly comprising first contact members including at least one sensor (e.g., a sensor assembly (305) of FIGS. 4 to 7) disposed between the first surface and the printed circuit board and including an electrically conductive material (e.g., a first contact member (355) of FIG. 6) disposed on a surface facing the printed circuit board, and an elastic material (e.g., The printed circuit board may include an elastic member (e.g., an elastic member (359) of FIG. 4 and / or FIG. 6), and an electrically conductive plate (e.g., a conductive plate (383) of FIG. 4 and / or FIG. 8) disposed between the printed circuit board and the elastic member. In one embodiment, at least one of the first contact members may be electrically connected to the printed circuit board.

[0114] In one exemplary embodiment, the printed circuit board may include second contact members comprising a conductive material (e.g., the second contact member (381) of FIG. 4 and / or FIG. 11) configured to contact one of the first contact members. In one exemplary embodiment, the sensor assembly may be electrically connected to the printed circuit board via the first contact members and the second contact members.

[0115] According to an exemplary embodiment, at least one of the elastic member or the conductive plate may be disposed at least partially in a region between the first contact members.

[0116] According to an exemplary embodiment, the electronic device may further include a support (e.g., support member (360) of FIG. 4) disposed between the first surface and the printed circuit board. In an exemplary embodiment, the support may be configured to secure the sensor assembly on the printed circuit board.

[0117] According to an exemplary embodiment, the sensor assembly may further include a substrate (e.g., substrate (351) of FIGS. 5 to 7) and a sensor element (e.g., sensor element (353) of FIGS. 5 to 7) disposed on one surface of the substrate. In an exemplary embodiment, the first contact members may be disposed on the other surface of the substrate.

[0118] In one exemplary embodiment, the conductive plate may further include a contact pole extending from one surface (e.g., contact pole (383b) of FIG. 8). In one exemplary embodiment, the contact pole may protrude through the printed circuit board toward the second surface.

[0119] According to an exemplary embodiment, the electronic device may further include a back plate (e.g., back plate (393) of FIG. 4) disposed between the second surface and the printed circuit board, and a radiation conductor (e.g., one of the antennas (331; 331b, 331c, 331d, 331e) of FIG. 12) disposed on a side of the back plate facing the printed circuit board. In an exemplary embodiment, the contact pole or the conductive plate may electrically connect the radiation conductor to the printed circuit board.

[0120] According to an exemplary embodiment, the conductive plate may further include a contact protrusion in the shape of a semi-sphere protruding from an end of the contact pole (e.g., a contact protrusion (383c) of FIG. 8) or a contact end retractably arranged at an end of the contact pole (e.g., a contact end (583c) of FIG. 15).

[0121] According to an exemplary embodiment, the first contact members may include conductive pads.

[0122] According to an exemplary embodiment, the elastic material of the elastic member may include at least one of rubber, silicone, or urethane.

[0123] According to an exemplary embodiment, the electronic device may further include at least one processor comprising a processing circuit (e.g., processor (120) of FIG. 1) configured to individually and / or collectively determine air pressure or water pressure within the interior of the housing using the sensor assembly.

[0124] According to an exemplary embodiment, the electronic device may further include a side bezel (e.g., a side bezel structure (310) of FIG. 4) that at least partially surrounds a space between the first side and the second side, a support member disposed between the first side and the printed circuit board and configured to secure the sensor assembly on the printed circuit board, a receiving hole provided in the support member to receive a portion of the sensor assembly (e.g., a receiving hole (361) of FIG. 4 and / or FIG. 13), and a ventilation hole (e.g., a ventilation hole (311) of FIG. 4 and / or FIG. 13) that penetrates the side bezel and is connected to the receiving hole.

[0125] According to an exemplary embodiment, the sensor assembly may further include a substrate, a sensor element disposed on one surface of the substrate, and a seal (e.g., a sealing member (357) of FIG. 5) provided around the sensor element. In an exemplary embodiment, the seal may be in contact with an inner wall of the receiving hole.

[0126] In one exemplary embodiment, the seal may contact the inner wall of the receiving hole along a closed loop trajectory.

[0127] According to an exemplary embodiment of the present disclosure, a wearable electronic device (e.g., an electronic device (101, 200, 300) of FIGS. 1 to 4) comprises a housing (e.g., a housing (220) of FIG. 2) including a front plate (e.g., a first side (220A) of FIG. 2 or a front plate (301) of FIG. 4), a rear plate (e.g., a second side (220B) of FIG. 3 or a rear plate (393) of FIG. 4) facing in an opposite direction of the front plate, and a side bezel (e.g., a side bezel structure (310) of FIG. 4) at least partially surrounding a space between the front plate and the rear plate, at least one wearing member comprising a strap or band (e.g., a wearing member (250, 260) of FIGS. 2 and / or 3) detachably provided to the housing, a printed circuit board (e.g., a printed circuit board (380) of FIG. 4) disposed in the space between the front plate and the rear plate, A sensor assembly may include at least one sensor disposed between a front plate and the printed circuit board (e.g., a sensor assembly (305) of FIGS. 4 to 7), first contact members comprising a conductive material (e.g., a first contact member (355) of FIG. 6) disposed on a side facing the printed circuit board, at least one processor comprising a processing circuit (e.g., a processor (120) of FIG. 1) configured to individually and / or collectively ascertain information about an operating environment within the housing using the sensor assembly, an elastic member comprising an elastic material (e.g., an elastic member (359) of FIGS. 4 and / or 6) disposed between the printed circuit board and the sensor assembly, and a conductive plate (e.g., a conductive plate (383) of FIGS. 4 and / or 8) disposed between the printed circuit board and the elastic member. In an exemplary embodiment, at least one of the first contact members may be electrically connected to the printed circuit board.

[0128] According to an exemplary embodiment, the sensor assembly may further include a substrate (e.g., substrate (351) of FIGS. 5 to 7) and a sensor element (e.g., sensor element (353) of FIGS. 5 to 7) disposed on one surface of the substrate. In an exemplary embodiment, the first contact members may be disposed on the other surface of the substrate.

[0129] In one exemplary embodiment, the conductive plate may further include a contact pole extending from one side (e.g., contact pole (383b) of FIG. 8). In one exemplary embodiment, the contact pole may penetrate the printed circuit board and protrude from the printed circuit board toward the back plate.

[0130] According to an exemplary embodiment, the wearable electronic device may further include a radiating conductor (e.g., one of the antennas (331; 331b, 331c, 331d, 331e) of FIG. 12) disposed on a surface of the back plate facing the printed circuit board. In an exemplary embodiment, the contact pole or the conductive plate may electrically connect the radiating conductor to the printed circuit board.

[0131] According to an exemplary embodiment, the conductive plate may further include a hemispherical contact protrusion protruding from an end of the contact pole (e.g., a contact protrusion (383c) of FIG. 8) or a contact end configured to be retractable from an end of the contact pole (e.g., a contact end (583c) of FIG. 15).

[0132] According to an exemplary embodiment, the electronic device may further include a support (e.g., a support member (360) of FIG. 4) disposed between the front plate and the printed circuit board and configured to secure the sensor assembly on the printed circuit board, a receiving hole (e.g., a receiving hole (361) of FIG. 4 and / or FIG. 13) provided in the support to receive a portion of the sensor assembly, and a ventilation hole (e.g., a ventilation hole (311) of FIG. 4 and / or FIG. 13) penetrating the side bezel and connected to the receiving hole.

[0133] While the present disclosure has been illustrated and described with reference to various exemplary embodiments, it is to be understood that the various exemplary embodiments are for illustrative purposes only and not limiting. It will be further understood by those skilled in the art that various changes in form and detail may be made without departing from the true spirit and scope of the present disclosure, including the appended claims and their equivalents. It will also be understood that any embodiment(s) described in the present disclosure may be used in conjunction with any other embodiment(s) described in the present disclosure.

Claims

1. In an electronic device (101; 200; 300), A housing (220) including a first side (220A) and a second side (220B) facing opposite to the first side; A printed circuit board (380) positioned in the space between the first surface and the second surface; A sensor assembly (305) comprising at least one sensor disposed between the first surface and the printed circuit board, the first contact members (355) comprising a conductive material disposed on a surface facing the printed circuit board; An elastic member (359) comprising an elastic material disposed between the printed circuit board and the sensor assembly; and An electrically conductive plate (383; 483; 583) is disposed between the printed circuit board and the elastic member, An electronic device wherein at least one of the first contact members is electrically connected to the printed circuit board.

2. In the first paragraph, the printed circuit board includes second contact members (381) including a conductive material configured to contact one of the first contact members, An electronic device in which the sensor assembly is electrically connected to the printed circuit board through the first contact members and the second contact members.

3. An electronic device according to any one of claims 1 to 2, wherein at least one of the elastic member or the conductive plate is disposed at least partially in a region between the first contact members.

4. In any one of paragraphs 1 to 3, Further comprising a support (360) arranged between the first surface and the printed circuit board, The above support is an electronic device configured to secure the sensor assembly onto the printed circuit board.

5. In any one of claims 1 to 4, the sensor assembly further includes a substrate (351) and a sensor element (353) arranged on one surface of the substrate, An electronic device wherein the first contact members are arranged on the other surface of the substrate.

6. In any one of clauses 1 to 5, the conductive plate further includes a contact pole (383b; 583b) extending from one side, An electronic device in which the contact pole penetrates the printed circuit board and protrudes toward the second surface on the printed circuit board.

7. In paragraph 6, A back plate (393) positioned between the second surface and the printed circuit board; and In the above rear plate, a radiation conductor (331) is further included, which is arranged on a surface facing the printed circuit board. An electronic device wherein the contact pole or the conductive plate electrically connects the radiating conductor to the printed circuit board.

8. An electronic device according to any one of claims 6 to 7, wherein the conductive plate further includes a contact protrusion (383c) having a semi-sphere shape protruding from an end of the contact pole or a contact end (583c) configured to be protrusible from an end of the contact pole.

9. An electronic device according to any one of claims 1 to 8, wherein the first contact members include conductive pads.

10. An electronic device according to any one of claims 1 to 9, wherein the elastic material of the elastic member comprises at least one of rubber, silicone, and urethane.

11. In any one of paragraphs 1 to 10, An electronic device further comprising at least one processor (120) comprising a processing circuit configured to individually and / or collectively determine air pressure or hydraulic pressure within the interior of the housing using said sensor assembly.

12. In paragraph 11, A side bezel (310) at least partially surrounding the space between the first side and the second side; A support disposed between the first surface and the printed circuit board and configured to secure the sensor assembly on the printed circuit board; A receiving hole (361) provided on the support and configured to receive a portion of the sensor assembly; and An electronic device further comprising a ventilation hole (311) penetrating the side bezel and connected to the receiving hole.

13. In the 12th paragraph, the sensor assembly further includes a substrate, a sensor element arranged on one surface of the substrate, and a seal (357) provided around the sensor element. The above seal is an electronic device in contact with the inner wall of the receiving hole.

14. In the 13th paragraph, the electronic device in contact with the inner wall of the receiving hole along a closed loop trajectory.

15. In any one of paragraphs 1 to 14, An electronic device further comprising at least one wearing member (250, 260) comprising a strap or band detachably provided on the housing.

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