Damper structure for increasing initial rigidity of semiconductor FAB structure

Abstract

The present invention relates to a damper structure for increasing the initial rigidity of a semiconductor FAB structure and, more specifically, to a damper structure provided in a building so as to buffer impact and vibration, comprising: a guide frame body for connecting an upper structure and a lower structure of the building to each other; and a damper unit fastened to the guide frame body, and the damper structure supporting a structure comprises the guide frame body and the damper unit, and thus has improved constructability, is easily replaced and maintained, has improved efficiency since the damper unit is composed of a plurality of damper members, can effectively buffer vibration or impact due to earthquakes or external impact, and has improved resistance to shear deformation and axial deformation.

Description

Damper structure for increasing initial stiffness of semiconductor FAB structures

[0001] The present invention relates to an initial stiffness increasing type damper structure for a semiconductor Fab structure, and more specifically, to an initial stiffness increasing type damper structure for a semiconductor Fab structure, which comprises a damper structure supporting the structure with a guide frame body and a damper unit to improve constructability and facilitate replacement and maintenance, comprises a damper unit with a plurality of damper members to improve efficiency, effectively buffer vibrations or shocks caused by earthquakes or external forces, and improves resistance to shear deformation and axial deformation.

[0002]

[0003] When structural members are subjected to horizontal external forces, they experience torsion or similar horizontal movement. Torsion, particularly in building structures or towers, can severely impact the structural integrity or even lead to collapse.

[0004] Dampers play a vital role in protecting building structures, such as houses or similar building structures, and exist in numerous variations. Dampers typically damp motion by friction between two moving parts attached between structural members of a building, or by pressurized fluid flowing between two chambers through a confined tube. Some dampers actively vary their damping effect in response to external conditions, while others are passive dampers with constant damping characteristics.

[0005] However, the conventional dampers mentioned above are expensive to manufacture, and even more so to assemble into a building's structural components. Furthermore, as the friction plates installed to provide friction wear out, their vibration-damping capabilities deteriorate, necessitating the replacement of the entire damper structure, increasing maintenance costs.

[0006] The existing Korean Patent No. 10-1400423 relates to a two-way steel damper and a seismic reinforcement structure using the same. It is possible to flexibly respond to and resist vibration energy acting in and out of the plane, and is also effective in load transfer. It is installed in the middle of a vertical member such as a column or wall and is welded to the middle of the column through the configuration of a two-way steel damper and a horizontal support plate. However, there were problems with constructability and stability.

[0007] Accordingly, there is a need for a damper structure that increases the initial stiffness of a semiconductor Fab structure, which is configured with a guide frame body and a damper unit to improve constructability and facilitate replacement and maintenance, and to improve efficiency by configuring the damper unit with multiple damper members, and to improve resistance to damper shear deformation and axial deformation that can absorb and share lateral load energy caused by earthquakes and winds, and to control shock and vibration generated from semiconductor production equipment as well as seismic reinforcement of buildings.

[0008] The invention described above refers to background technology in the technical field to which the present invention belongs, and does not refer to prior art.

[0009]

[0010] The present invention has been devised to solve the above-mentioned conventional problems, and the purpose of the present invention is to provide a damper structure for increasing initial rigidity of a semiconductor Fab structure, which improves constructability and facilitates replacement and maintenance by configuring a damper structure supporting a structure with a guide frame body and a damper unit, improves efficiency by configuring the damper unit with a plurality of damper members, effectively buffers vibrations or impacts caused by earthquakes or external forces, and improves resistance to shear deformation and axial deformation.

[0011] In addition, the purpose is to provide an initial stiffness increasing damper structure for semiconductor Fab structures that enables not only seismic reinforcement of buildings but also shock and vibration control generated from semiconductor production equipment.

[0012]

[0013] The present invention is a damper structure provided in a building to buffer shock and vibration, comprising a guide frame body that interconnects an upper structure and a lower structure of the building, and a damper unit that is fastened to the guide frame body, wherein the damper unit is characterized by being composed of damper members that are composed of first vertical bars and connecting panels that connect the first vertical bars.

[0014] In addition, the damper unit is characterized by being formed of a folded panel member, a pair of first grating members, and a first diagonal support panel disposed between the first grating members.

[0015] In addition, the damper unit is characterized by comprising a pair of second grating members, second diagonal support panels arranged between the second grating members, and a reinforcing panel arranged between the second diagonal support panels.

[0016] In addition, the guide frame body is further provided with a sensing elastic support means to support the building by elasticity, and the sensing elastic support means is characterized by comprising a lower support coil spring having one end connected and fixed to the inner bottom surface of the guide frame body, a first bracket panel connected and fixed to the upper end of the lower support coil spring, and a pressure cylinder having a lower end connected and fixed to the first bracket panel connected to the lower support coil spring.

[0017] In addition, the sensing elastic support means is characterized in that it comprises a second bracket panel that is connected and fixed to the compression axis of the compression cylinder and is moved by the driving of the compression cylinder, an upper support coil spring whose lower end is connected and fixed to the second bracket panel connected to the compression cylinder and whose upper end is connected and fixed to the inner upper surface of the guide frame body, a position detection sensor that is attached and fixed to the guide frame body and the damper unit and transmits a detection signal to the guide cylinder when the guide frame body and the damper unit move, and a transmitter and receiver that are connected and fixed to the guide frame body and receive the detection signal of the position detection sensor and transmit it to the outside, so that when the guide frame body and the damper unit move due to an external force or an earthquake, the compression cylinder is driven to support the guide frame body by the elasticity of the lower support coil spring and the upper support coil spring.

[0018]

[0019] The initial stiffness increasing type damper structure of the semiconductor Fab structure of the present invention is configured with a damper structure supporting the structure consisting of a guide frame body and a damper unit, thereby improving constructability and facilitating replacement and maintenance, and configuring the damper unit with a plurality of damper members to improve efficiency, and can effectively buffer vibrations or impacts due to earthquakes or external forces, and has the effect of improving resistance to shear deformation and axial deformation.

[0020]

[0021] FIG. 1 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a first embodiment of the present invention.

[0022] FIG. 2 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a first embodiment of the present invention.

[0023] FIG. 3 is a perspective view showing a damper member in an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a first embodiment of the present invention.

[0024] FIG. 4 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a second embodiment of the present invention.

[0025] FIG. 5 is a partially enlarged perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a second embodiment of the present invention.

[0026] FIG. 6 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a third embodiment of the present invention.

[0027] FIG. 7 is a partially enlarged perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a third embodiment of the present invention.

[0028] FIG. 8 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a fourth embodiment of the present invention.

[0029] FIG. 9 is a partially enlarged perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a fourth embodiment of the present invention.

[0030] FIG. 10 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a fifth embodiment of the present invention.

[0031] Figure 11 is a drawing showing a stiffness comparison test of an initial stiffness increasing type damper structure of a semiconductor Fab structure according to the present invention and other dampers.

[0032] Figure 12 is a drawing showing the results of a stiffness comparison between the initial stiffness increasing type damper structure of the semiconductor Fab structure according to the present invention and other dampers.

[0033] Figure 13 is a drawing showing a rigidity comparison test of a guide frame body of an initial rigidity increasing type damper structure of a semiconductor Fab structure according to the present invention and other damper frames.

[0034] Figure 14 is a drawing showing the results of a stiffness comparison between the guide frame body of the initial stiffness increasing type damper structure of the semiconductor Fab structure according to the present invention and other damper frames.

[0035] FIG. 15 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a sixth embodiment of the present invention.

[0036] FIG. 16 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to the seventh embodiment of the present invention.

[0037]

[0038] A damper structure installed in a building to cushion shock and vibration.

[0039] A guide frame body that interconnects the upper and lower structures of the above building; and

[0040] It consists of a damper unit that is attached to the above guide frame body,

[0041] The above damper unit is characterized by an initial stiffness increasing type damper structure of a semiconductor Fab structure, which is composed of damper members including first vertical bars and connecting panels connecting the first vertical bars.

[0042] An initial stiffness increasing type damper structure of a semiconductor Fab structure, characterized in that the above damper unit is made of a folded panel member, and is made of a pair of first grating members and a first diagonal support panel arranged between the first grating members.

[0043] The above damper unit comprises a pair of second grating members,

[0044] Second diagonal support panels arranged between the second grating members,

[0045] An initial stiffness increasing type damper structure of a semiconductor Fab structure characterized by comprising a reinforcing panel arranged between the second diagonal support panels.

[0046] The above guide frame body is further provided with a sensing elastic support means to support the building by elasticity.

[0047] The above sensing elastic support means is,

[0048] A lower support coil spring that is connected and fixed to the inner bottom surface of the above guide frame body,

[0049] A first bracket panel connected and fixed to the upper part of the lower support coil spring,

[0050] An initial stiffness increasing damper structure of a semiconductor Fab structure, characterized in that it includes a pressure cylinder whose lower part is connected and fixed to the first bracket panel connected to the lower support coil spring.

[0051] The above sensing elastic support means is,

[0052] A second bracket panel connected and fixed to the pressure shaft of the above pressure cylinder and moved by the driving of the above pressure cylinder,

[0053] An upper support coil spring whose lower part is connected and fixed to the second bracket panel connected to the above-mentioned pressurized cylinder, and whose upper part is connected and fixed to the inner upper surface of the guide frame body;

[0054] A position detection sensor that is attached and fixed to the above guide frame body and the above damper unit, and transmits a detection signal to the above guide cylinder when the above guide frame body and the above damper unit move;

[0055] It is connected to and fixed to the above guide frame body, and is composed of a transmitter and receiver that receives the detection signal of the position detection sensor and transmits it to the outside.

[0056] An initial stiffness increasing type damper structure of a semiconductor Fab structure, characterized in that when the guide frame body and the damper unit are moved by an external force or an earthquake, the pressurizing cylinder is driven to support the guide frame body by the elasticity of the lower support coil spring and the upper support coil spring.

[0057]

[0058] The description of the present invention is merely an example for structural and functional explanation. Therefore, the scope of the present invention should not be construed as being limited by the embodiments described herein. In other words, since the embodiments are capable of various modifications and may take various forms, the scope of the present invention should be understood to include equivalents that can realize the technical idea.

[0059] FIG. 1 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a first embodiment of the present invention. FIG. 2 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a first embodiment of the present invention. FIG. 3 is a perspective view showing a damper member in an initial stiffness increasing type damper structure of a semiconductor Fab structure according to the first embodiment of the present invention. FIG. 4 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a second embodiment of the present invention. FIG. 5 is a partially enlarged perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a second embodiment of the present invention. FIG. 6 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a third embodiment of the present invention. FIG. 7 is a partially enlarged perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a third embodiment of the present invention. FIG. 8 is a perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a fourth embodiment of the present invention. FIG. 9 is a partially enlarged perspective view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a fourth embodiment of the present invention. FIG. 10 is a view showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a fifth embodiment of the present invention. FIG. 11 is a view showing a stiffness comparison test of an initial stiffness increasing type damper structure of a semiconductor Fab structure according to the present invention with other dampers. FIG. 12 is a view showing a result of a stiffness comparison of an initial stiffness increasing type damper structure of a semiconductor Fab structure according to the present invention with other dampers. FIG. 13 is a view showing a stiffness comparison test of a guide frame body of an initial stiffness increasing type damper structure of a semiconductor Fab structure according to the present invention with frames of other dampers. Figure 14 is a drawing showing the results of a stiffness comparison between the guide frame body of the initial stiffness increasing type damper structure of the semiconductor Fab structure according to the present invention and other damper frames.Fig. 15 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a sixth embodiment of the present invention. Fig. 16 is a drawing showing an initial stiffness increasing type damper structure of a semiconductor Fab structure according to a seventh embodiment of the present invention.

[0060] As shown in the drawing, the initial stiffness increasing type damper structure (10) of the semiconductor Fab structure of the present invention (hereinafter referred to as a damper structure for convenience of explanation) is a damper structure (10) provided in a building to buffer shock and vibration, and such a tamper structure is composed of a guide frame body (20) and a damper unit (30).

[0061] The above guide frame body (20) interconnects the upper structure and lower structure of the building. The above guide frame body (20) is formed as a square or rectangular frame structure, and the lower part of the upper structure is fixed to the upper surface by welding or screwing, and the upper part of the lower structure is fixed to the lower surface by welding or screwing.

[0062] The above damper unit (30) is fitted and fixed to the guide frame body (20). The damper unit (30) is fitted to the guide frame body (20) to support the guide frame body (20) and the upper structure, and cushions external force, shock, and vibration.

[0063] The above damper unit (30) is composed of damper members (31) formed by first vertical bars (311) and connecting panels (312) connecting the first vertical bars (311). The first vertical bar (311) is fixed by welding or screwing to the side of the connecting panel (312), and the damper member (31) is fitted into the guide frame body (20) and then fixed by welding or screwing to the inner surface of the guide frame body (20).

[0064] The above damper member (31) is formed as a pair as shown in the drawing and is fastened to the guide frame body (20). The above damper member (31) may be formed of a metal material or a synthetic resin material. In this case, the connecting panel (312) may also be formed of an elastic synthetic resin material to cushion shock or vibration.

[0065] The above damper member (31) is detachably screw-fastened to the guide frame body, so that it can be replaced when damaged. Here, as shown in FIG. 15, by welding and fixing the guide support bar (313) to the front and back surfaces of the connection panel (312), it is possible to prevent buckling by improving the supporting force and strength, and as shown in FIG. 16, by fixing the guide support angle (314) to the front and back surfaces of the connection panel (312) by screw-fastening, it is also possible to improve the supporting force and strength again.

[0066] In addition, the guide support bar (313) and the guide support angle (314) can be fixed by welding or screwing both ends to the inner surface of the first vertical bar (311). The support and fixing force of the guide fixing frame body (20) and the damper member (31) can be improved by the guide support bar (313) and the guide support angle (314).

[0067] Alternatively, the damper unit (30) can be formed as a folded panel member (32). The folded panel member (32) is fitted into the guide frame body (20) and then fixed by welding or screwing. The folded panel member (32) can be formed of a metal material or a synthetic resin material, and can be formed of an elastic synthetic resin material. The folded panel member (32) is formed in a zigzag-shaped folded structure, thereby improving the support capacity compared to a flat panel structure.

[0068] Alternatively, the damper unit (30) may be formed of a pair of first grating members (33) made up of vertical panels and horizontal panels welded and fixed to the vertical panels connecting the vertical panels, and a first diagonal support panel (34) disposed between the first grating members (33). The first grating member (33) and the first diagonal support panel (34) are welded or screwed to the inner surface of the guide frame body (20). The first grating member (33) is formed of a metal material or a synthetic resin material, and the first diagonal support panel (34) is formed of any one of a metal material, a synthetic resin material, and a synthetic resin material having elasticity.

[0069] The above damper unit (30) is formed by the first grating members (33) and the first diagonal support panel (34) arranged between the first grating members (33), thereby improving the support and buffering power compared to the panel-structured damper unit (30).

[0070] Alternatively, it is also possible to form the damper unit (30) by forming a pair of second grating members (35) made up of vertical panels and horizontal panels welded and fixed to the vertical panels connecting the vertical panels, second diagonal support panels (36) arranged between the second grating members (35), and reinforcing panels (37) arranged between the second diagonal support panels (36).

[0071] The second grating member (35), the second diagonal support panels (36), and the reinforcing panel (37) are fixed to the inner surface of the guide frame body (20) by welding or screwing. The second grating member (35) and the reinforcing panel (37) are formed of a metal material or a synthetic resin material, and the second diagonal support panel (36) is formed of any one of a metal material, a synthetic resin material, and an elastic synthetic resin material.

[0072] The above damper unit (30) is formed by the second grating members (35), the second diagonal support panels (36) arranged between the second grating members (35), and the reinforcing panels (37) arranged between the second diagonal support panels (36), thereby improving the support and buffering power compared to the panel-structured damper unit (30). It is preferable that the second diagonal support panels (36) are arranged so that their diagonal directions intersect each other.

[0073] The above guide frame body (20) is further provided with a sensing elastic support means (40) to support the building by elasticity. The above sensing elastic support means (40) comprises a lower support coil spring (41) having one end welded and fixed to the inner bottom surface of the guide frame body (20), a first bracket panel (42) fixed by screwing to the upper end of the lower support coil spring (41), a pressure cylinder (43) having a lower end screwed and fixed to the first bracket panel (42) connected to the lower support coil spring (41), a second bracket panel (44) fixed by screwing to the pressure shaft of the pressure cylinder (43) and moved by the driving of the pressure cylinder (43), an upper support coil spring (45) having a lower end screwed and fixed to the second bracket panel (44) connected to the pressure cylinder (43) and an upper end welded and fixed to the inner upper surface of the guide frame body (20), and It is composed of a guide frame body (20) and a position detection sensor (46) that is attached and fixed to the damper unit (30) and transmits a detection signal to the guide cylinder when the guide frame body (20) and the damper unit (30) move, and a transmitter / receiver (47) that is fixed by screwing to the guide frame body (20) and receives the detection signal of the position detection sensor (46) and transmits it to the outside, so that when the guide frame body (20) and the damper unit (30) move or sag due to an external force or an earthquake, the pressure cylinder (43) is driven to support the guide frame body (20) by the elasticity of the lower support coil spring (41) and the upper support coil spring (45).

[0074] In addition, the position detection sensor (46) detects the movement of the guide frame body (20) and the damper unit (30) and transmits the detection signal to the transmitter / receiver (47), thereby enabling quick maintenance and preventing safety accidents due to collapse of the building.

[0075] In addition, the support force and fixing force can be improved by the elasticity of the lower support coil spring (41) and the upper support coil spring (45), and the upper part of the guide fixing frame body (20) can be prevented from sagging.

[0076] At this time, as shown in FIGS. 11 to 14, it can be confirmed that the damper structure and guide frame body of the present invention have higher strength than other dampers and frames, and due to the high strength, resistance to external force is improved and durability is improved.

[0077] Meanwhile, the description of the technology disclosed in this specification is merely an example for structural and functional explanation, and therefore, the scope of the rights of the disclosed technology should not be construed as being limited by the embodiments described in the text. That is, since the embodiments can be modified in various ways and can take various forms, the scope of the rights of the disclosed technology should be understood to include equivalents that can realize the technical idea. Furthermore, the purpose or effect presented in the disclosed technology does not mean that a specific embodiment must include all of them or only such effects, and therefore, the scope of the rights of the disclosed technology should not be construed as being limited thereby.

[0078] Furthermore, when a component is said to be "connected" to another component, it should be understood that while it may be directly connected to that other component, there may also be other components intervening. Conversely, when a component is said to be "directly connected" to another component, it should be understood that there are no other intervening components. Similarly, other expressions describing relationships between components, such as "between" and "between," or "adjacent to" and "directly adjacent to," should be interpreted in the same way.

[0079] Singular expressions should be understood to include plural expressions unless the context clearly indicates otherwise, and terms such as “comprises” or “has” should be understood to specify the presence of a described feature, number, step, operation, component, part, or combination thereof, but not to exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0080]

[0081] The present invention is not limited to the specific preferred embodiments described above, and anyone with ordinary skill in the art to which the invention pertains can make various modifications without departing from the gist of the present invention claimed in the claims, and as long as it relates to technical ideas forming such modifications, it is within the scope of the claims.

Claims

1. A damper structure installed in a building to cushion shock and vibration. A guide frame body that interconnects the upper and lower structures of the above building; and It consists of a damper unit that is attached to the above guide frame body, The above damper unit is characterized by an initial stiffness increasing type damper structure of a semiconductor Fab structure, which is composed of damper members including first vertical bars and connecting panels connecting the first vertical bars.

2. In paragraph 1, The above damper unit, It is made of folded panel members, An initial stiffness increasing type damper structure of a semiconductor Fab structure, characterized by comprising a pair of first grating members and a first diagonal support panel disposed between the first grating members.

3. In paragraph 1, The above damper unit A pair of second grating members, and Second diagonal support panels arranged between the second grating members, An initial stiffness increasing type damper structure of a semiconductor Fab structure characterized by comprising a reinforcing panel arranged between the second diagonal support panels.

4. In paragraph 1, The above guide frame body is further provided with a sensing elastic support means to support the building by elasticity. The above sensing elastic support means is, A lower support coil spring that is connected and fixed to the inner bottom surface of the above guide frame body, A first bracket panel connected and fixed to the upper part of the lower support coil spring, An initial stiffness increasing damper structure of a semiconductor Fab structure, characterized in that it includes a pressure cylinder whose lower part is connected and fixed to the first bracket panel connected to the lower support coil spring.

5. In paragraph 4, The above sensing elastic support means is, A second bracket panel connected and fixed to the pressure shaft of the above pressure cylinder and moved by the driving of the above pressure cylinder, An upper support coil spring whose lower part is connected and fixed to the second bracket panel connected to the above-mentioned pressurized cylinder, and whose upper part is connected and fixed to the inner upper surface of the guide frame body; A position detection sensor that is attached and fixed to the above guide frame body and the above damper unit, and transmits a detection signal to the above guide cylinder when the above guide frame body and the above damper unit move; It is connected to and fixed to the above guide frame body, and is composed of a transmitter and receiver that receives the detection signal of the position detection sensor and transmits it to the outside. An initial stiffness increasing type damper structure of a semiconductor Fab structure, characterized in that when the guide frame body and the damper unit are moved by an external force or an earthquake, the pressurizing cylinder is driven to support the guide frame body by the elasticity of the lower support coil spring and the upper support coil spring.

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