Real-time wafer inspection and cleaning apparatus, using method, and inspection method

Abstract

The present invention belongs to the technical field of wafer cleaning, and particularly relates to a real-time wafer inspection and cleaning apparatus, comprising: a clamping portion; a plurality of spray arms, which are rotatably disposed above the clamping portion, wherein spray nozzles are disposed at end portions of the spray arms; a salvage portion, which is rotatably disposed above the clamping portion; a plurality of first inspection portions, wherein the first inspection portions are disposed on the spray arms, and are suitable for inspecting a liquid spray state of the spray nozzles; a second inspection portion, wherein the second inspection portion is disposed above the clamping portion, and is suitable for inspecting a cleaning state of a wafer body on the clamping portion; and a terminal controller, wherein the terminal controller is electrically connected to a driving device of the spray arms, a driving device of the salvage portion, and the first inspection portions and the second inspection portion, respectively. In the event of an anomaly, the terminal controller can control the salvage portion to spray out a salvage medium to remediate the wafer body.

Description

Real-time detection wafer cleaning equipment, use method and detection method Technical Field

[0001] The present invention belongs to the technical field of wafer cleaning, and in particular relates to a real-time detection wafer cleaning device, a use method and a detection method. Background Art

[0002] With the continuous development of domestic high-end chip manufacturing technology, chip materials are constantly iterating, and the process requirements for chip raw materials - wafers are becoming higher and higher. During the process of etching and cleaning the wafer body, the wafer body is rotated in a horizontal position while the processing liquid is spitted from the nozzle to the surface of the wafer body. Among them, a variety of cleaning media need to be used for cleaning. Due to the high control requirements for the reaction solution, if the following situations occur during the process: the cleaning nozzle leaks, the temperature of the reaction solution does not meet the standard, the solution switching fails, and the wafer body deviates, the wafer body will become a defective product, causing losses to the producer.

[0003] Therefore, it is necessary to provide a real-time detection wafer cleaning device, a use method and a detection method that can detect the spray nozzle and the wafer body in real time. Summary of the Invention

[0004] The purpose of the present invention is to provide a real-time detection wafer cleaning device, a use method and a detection method.

[0005] In order to solve the above technical problems, the present invention provides a real-time detection wafer cleaning device, including: a clamping part; a plurality of spray arms rotatably arranged above the clamping part, and a spray nozzle is arranged at the end of the spray arm; a rescue part rotatably arranged above the clamping part; a plurality of first detection parts, the first detection part is arranged on the spray arm, and the first detection part is suitable for detecting the spraying state of the spray nozzle; a second detection part, the second detection part is arranged above the clamping part, and the second detection part is suitable for detecting the cleaning state of the wafer body on the clamping part; a terminal controller, the terminal controller is electrically connected to the clamping part, the driving device of the spray arm, the driving device of the rescue part, the first detection part and the second detection part respectively, wherein, when the first detection part detects that the spray nozzle has unexpected liquid leakage, the terminal controller receives a signal from the first detection part, controls the spray arm to stop spraying liquid, and controls the rescue part to spray a rescue medium to the wafer body.

[0006] Preferably, the terminal controller includes: an input part, which is suitable for receiving data from the first detection part and the second detection part; a storage part, which stores normal data; comparing the data obtained by the input part with the stored normal data, and setting the obtained data that exceeds the normal data range as an abnormal state; a control part, which is suitable for obtaining the comparison result of the storage part and controlling the driving device of the spray arm and the driving device of the rescue part when an abnormal state occurs; an alarm part, which is suitable for receiving a signal from the control part and issuing an alarm in an abnormal state.

[0007] Preferably, the first detection unit detects the spray nozzle that is spraying, generates temperature spectrum image data of the cleaning medium sprayed from the spray nozzle and transmits it to the input unit; the first detection unit detects the spray nozzle that has finished spraying, generates image data of the unexpected cleaning medium dripping from the spray nozzle and transmits it to the input unit.

[0008] Preferably, the second detection unit detects the wafer body on the clamping part, and generates temperature spectrum data of different cleaning media sprayed on the wafer surface by different spray arms and transmits it to the input part, and the second detection unit can generate image data of the wafer position status of the wafer clamping part and transmit it to the input part.

[0009] Preferably, the spray arm is "L"-shaped, the vertical rod of the spray arm is connected to a drive motor, and the encoder of the drive motor is electrically connected to the control unit.

[0010] Preferably, the first detection part includes a fixing clamp, a detector body and a nitrogen connector; the fixing clamp is clamped on the cross bar of the spray arm, the detector body is rotatably arranged at the bottom of the fixing clamp, the rotation axis of the detector body is perpendicular to the cross bar of the spray arm, and the nitrogen connector is arranged at one end of the detector body away from the spray nozzle; a nitrogen connection hole adapted to the nitrogen connector is provided on the detector body, the nitrogen connector is inserted into the nitrogen connection hole, and the nitrogen connector is suitable for receiving nitrogen to be blown into the interior of the detector body.

[0011] Preferably, the cargo salvage unit comprises a cargo salvage nozzle, and the cargo salvage nozzle is suitable for spraying a cargo salvage medium.

[0012] The present invention also provides a method for using a real-time detection wafer cleaning device:

[0013] S1, the clamping part starts to rotate after clamping the wafer body, and the second detection part continuously generates image data of the position of the wafer body and transmits it to the terminal controller, and the second detection part continuously generates temperature spectrum data of the temperature of the surface of the wafer body and transmits it to the terminal controller;

[0014] S2, the first spray arm rotates to above the clamping portion, and the spray arm sprays a cleaning medium to clean the wafer body in the clamping portion;

[0015] S3, the first detection unit detects the cleaning medium sprayed from the spray nozzle, generates temperature spectrum image data and transmits it to the terminal controller;

[0016] S4, when the first spray arm completes spraying, it returns to the initial position, and at the same time, the first detection unit starts to detect the unexpected dripping of the cleaning medium from the spray nozzle and transmits the data to the terminal controller;

[0017] S5. The plurality of spray arms work one by one to complete the cleaning of the wafer body.

[0018] The present invention also provides a detection method for real-time detection of wafer cleaning equipment:

[0019] S10, the spray arm rotates from the initial position to the working position to start spraying, and returns to the initial position after spraying ends, and the first detection unit performs real-time detection on the spray nozzle;

[0020] First, the first detection unit detects unexpected dripping of the cleaning medium from the spray nozzle and feeds back to the terminal controller. When unexpected dripping of the cleaning medium occurs, the terminal controller sends a signal to the driving device of the spray arm and alarms, so that the spray arm stops working and returns to the initial position. At the same time, the terminal controller sends a signal to the driving device of the rescue nozzle, so that the rescue nozzle rotates to the rescue position and sprays the rescue medium, thereby completing the rescue of the wafer body.

[0021] S20, during the wafer body cleaning process, the second detection unit performs real-time detection on the wafer body;

[0022] First, the second detection unit detects the position of the wafer body in real time. When the position of the wafer body is shifted or broken, the second detection unit feeds back to the terminal controller, and the terminal controller sends a signal to the clamping unit and alarms, so that the clamping unit stops rotating.

[0023] At the same time, the second detection unit detects the surface temperature of the wafer body in real time;

[0024] When the surface temperature of the wafer body is abnormal, the terminal controller sends a signal to the driving device of the spray arm and alarms, so that the spray arm stops working and returns to the initial position. At the same time, the terminal controller sends a signal to the driving device of the rescue nozzle, so that the rescue nozzle rotates to the rescue position and sprays the rescue medium to complete the rescue of the wafer body;

[0025] When the surface temperature of the wafer body does not change, the terminal controller sends a signal to the clamping part and the spray arm to stop the clamping part from rotating and the spray arm from working.

[0026] Beneficial effects of the present invention:

[0027] 1. The first detection unit can detect the spraying status of the spray nozzle and detect whether there is unexpected leakage of the spray nozzle;

[0028] 2. The second detection unit can detect the temperature of the wafer surface (i.e., the temperature of the cleaning medium) and can also detect the position of the wafer or whether it is cracked;

[0029] 3. Through the terminal controller, when an abnormality occurs, the rescue unit can be controlled to spray out the rescue medium to achieve the recovery of the wafer body.

[0030] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present invention.

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] FIG1 is a front view of a real-time detection wafer cleaning device according to the present invention;

[0034] FIG2 is a perspective view of the spray arm and the detection unit of the present invention;

[0035] FIG3 is a front view of the spray arm and the detection unit of the present invention;

[0036] FIG4 is a schematic diagram of the internal structure of the detection unit of the present invention;

[0037] FIG5 is a block diagram of a terminal controller according to the present invention.

[0038] In the picture:

[0039] 100, clamping portion;

[0040] 200, spray arm; 201, spray nozzle; 202, drive motor;

[0041] 300, Cargo Rescue Department; 301, Cargo Rescue Nozzle;

[0042] 400, first detection part; 401, fixing clamp; 402, detector body; 403, nitrogen connector; 404, nitrogen connection hole;

[0043] 500. Second detection unit. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention. Example 1

[0045] As shown in Figures 1-5, the present invention provides a real-time detection wafer cleaning device, including: a clamping part 100; a plurality of spray arms 200 rotatably arranged above the clamping part 100, and a spray nozzle 201 is arranged at the end of the spray arm 200; a rescue part 300 rotatably arranged above the clamping part 100; a plurality of first detection parts 400, the first detection parts 400 are arranged on the spray arm 200, and the first detection parts 400 are suitable for detecting the spraying state of the spray nozzle 201; in short, the first detection parts 400 can detect the spraying state of the spray nozzle 201, and can detect whether the spray nozzle 201 has unexpected leakage; a second detection part 500, the second detection part 500 is arranged above the clamping part 100, and the second detection part 500 is suitable for detecting the wafer body on the clamping part 100. Cleaning state; further, the second detection part 500 can detect the temperature of the surface of the wafer body (that is, the temperature of the cleaning medium), and can detect the position of the wafer body or whether it is broken; the terminal controller, the terminal controller is electrically connected to the clamping part 100, the driving device of the spray arm 200, the driving device of the rescue part 300, the first detection part 400 and the second detection part 500 respectively, wherein, when the first detection part 400 detects that the spray nozzle 201 has unexpected liquid leakage, the terminal controller receives the signal from the first detection part 400, controls the spray arm 200 to stop spraying liquid, and controls the rescue part 300 to spray the rescue medium to the wafer body; in short, through the terminal controller, when an abnormality occurs, the rescue part 300 can be controlled to spray the rescue medium to achieve the remedy of the wafer body.

[0046] The terminal controller includes: an input part, which is suitable for receiving data from the first detection part 400 and the second detection part 500; a storage part, which stores normal data; comparing the data obtained by the input part with the stored normal data, and setting the obtained data that exceeds the normal data range as an abnormal state; a control part, which is suitable for obtaining the comparison result of the storage part, and controlling the driving device of the spray arm 200 and the driving device of the rescue part 300 when an abnormal state occurs; an alarm part, which is suitable for receiving a signal from the control part and issuing an alarm in an abnormal state.

[0047] The first detection unit 400 detects the spray nozzle 201 that is spraying, and generates temperature spectrum image data of the cleaning medium sprayed by the spray nozzle 201 and transmits it to the input unit; in short, the first detection unit 400 feeds back the status of the cleaning medium sprayed by the spray nozzle 201 to the input unit in the form of generated temperature spectrum image data (various cleaning media have different temperatures, and the status of the cleaning medium is judged by judging the temperature of the sprayed medium) and after comparison by the storage unit, it is controlled by the control unit; the first detection unit 400 detects the spray nozzle 201 that has finished spraying, and generates image data of the unexpected dripping of the cleaning medium from the spray nozzle 201 and transmits it to the input unit; further, the dripping of the cleaning medium that occurs when the spray arm 200 rotates to the working position and the initial position is detected. When unexpected leakage occurs, the wafer body is salvaged by the rescue unit 300.

[0048] The second detection part 500 detects the wafer body on the clamping part 100, and transmits temperature spectrum data generated by different cleaning media sprayed on the wafer surface by different spray arms 200 to the input part, and the second detection part 500 can generate image data of the wafer position status of the wafer clamping part 100 and transmit it to the input part; in short, the second detection part 500 detects the temperature of the wafer body, and when the spray arm 200 switches incorrectly, resulting in the spraying of different cleaning media, the wafer body is rescued by the rescue part 300, and when the spray medium has not been sprayed, an alarm is issued by the alarm part; further, the second detection part 500 can detect the position of the wafer body, and when the position of the wafer body is offset or broken, an alarm is issued by the alarm part to notify the staff to handle it.

[0049] The spray arm 200 is "L"-shaped, and the vertical rod of the spray arm 200 is connected to the drive motor 202, and the encoder of the drive motor 202 is electrically connected to the control unit; in short, the encoder of the drive motor 202 can enable the control unit to obtain the position of the spray arm 200 in time to determine whether the leakage of the spray nozzle 201 occurs in an unexpected position (that is, dripping on the wafer body that has been cleaned), and when the leakage occurs in an unexpected position, there is no need to rescue.

[0050] The first detection part 400 includes a fixing clamp 401, a detector body 402 and a nitrogen connector 403; the fixing clamp 401 is clamped on the crossbar of the spray arm 200, the detector body 402 is rotatably arranged at the bottom of the fixing clamp 401, the rotation axis of the detector body 402 is perpendicular to the crossbar of the spray arm 200, and the nitrogen connector 403 is arranged at one end of the detector body 402 away from the spray nozzle 201; the detector body 402 is provided with a nitrogen connector 403. 3 is adapted to the nitrogen connection hole 404, the nitrogen connector 403 is inserted into the nitrogen connection hole 404, and the nitrogen connector 403 is suitable for receiving nitrogen to be blown into the interior of the detector body 402; in short, the detector body 402 of the first detection part 400 uses an infrared CCD detector, and by passing nitrogen into the interior of the detector body, a positive pressure can be maintained in the detector body 402 to prevent the cleaning medium from splashing into the detector body 402; and the second detection part 500 also uses an infrared CCD detector.

[0051] The salvaging unit 300 includes a salvaging nozzle 301 , which is suitable for spraying a salvaging medium; in short, the salvaging nozzle 301 is suitable for spraying pure water to salvage the wafer body. Example 2

[0052] The present invention also provides a method for using a real-time detection wafer cleaning device:

[0053] S1, the clamping part 100 starts to rotate after clamping the wafer body, and the second detection part 500 continuously generates image data of the position of the wafer body and transmits it to the terminal controller, and at the same time, the second detection part 500 continuously generates temperature spectrum data of the temperature of the surface of the wafer body and transmits it to the terminal controller;

[0054] S2, the first spray arm 200 rotates to above the clamping part 100, and the spray arm 200 sprays a cleaning medium to clean the wafer body in the clamping part 100;

[0055] S3, the first detection unit 400 detects the cleaning medium sprayed by the spray nozzle 201, generates temperature spectrum image data and transmits it to the terminal controller;

[0056] S4, when the first spray arm 200 completes spraying, it returns to the initial position, and at the same time, the first detection unit 400 starts to detect the unexpected dripping of the cleaning medium from the spray nozzle 201 and transmits the data to the terminal controller;

[0057] S5. The spray arms 200 work one by one to complete the cleaning of the wafer body. Example 3

[0058] The present invention also provides a detection method for real-time detection of wafer cleaning equipment:

[0059] S10, the spray arm 200 rotates from the initial position to the working position to start spraying, and returns to the initial position after spraying is completed. The first detection unit 400 performs real-time detection on the spray nozzle 201;

[0060] First, the first detection unit 400 detects unexpected dripping of the cleaning medium from the spray nozzle 201 and feeds back the detected dripping to the terminal controller. When unexpected dripping of the cleaning medium occurs, the terminal controller sends a signal to the drive device of the spray arm 200 and alarms, so that the spray arm 200 stops working and returns to its initial position. At the same time, the terminal controller sends a signal to the drive device of the rescue nozzle 301, so that the rescue nozzle 301 rotates to the rescue position and sprays the rescue medium, thereby completing the rescue of the wafer body.

[0061] S20, during the wafer body cleaning process, the second detection unit 500 performs real-time detection on the wafer body;

[0062] First, the second detection unit 500 detects the position of the wafer body in real time. When the position of the wafer body is shifted or broken, the second detection unit 500 provides feedback to the terminal controller, which then sends a signal to the clamping unit 100 and issues an alarm, causing the clamping unit 100 to stop rotating.

[0063] At the same time, the second detection unit 500 detects the surface temperature of the wafer body in real time;

[0064] When the surface temperature of the wafer body is abnormal, the terminal controller sends a signal to the drive device of the spray arm 200 and alarms, so that the spray arm 200 stops working and returns to the initial position. At the same time, the terminal controller sends a signal to the drive device of the rescue nozzle 301, so that the rescue nozzle 301 rotates to the rescue position and sprays the rescue medium to complete the rescue of the wafer body.

[0065] When the surface temperature of the wafer body does not change, the terminal controller sends a signal to the clamping part 100 and the spray arm 200 to stop the clamping part 100 from rotating and the spray arm 200 from working.

[0066] All components used in this application (parts whose specific structures are not described) are standard components or components known to those skilled in the art. Their structures and principles are readily known to those skilled in the art through technical manuals or routine experimental methods. Furthermore, the software programs referred to in this application are all prior art, and this application does not involve any improvements to the software programs.

[0067] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0068] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0069] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. There may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interface, indirect coupling or communication connection of devices or units, which may be electrical, mechanical or other forms.

[0070] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0071] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0072] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A real-time detection wafer cleaning device, characterized in that: include: Clamping part; A plurality of spray arms rotatably arranged above the clamping portion, wherein the ends of the spray arms are provided with spray nozzles; Rotating the cargo-saving part disposed above the clamping part; A plurality of first detection parts, wherein the first detection parts are arranged on the spray arm, and the first detection parts are suitable for detecting the spraying state of the spray nozzle; a second detection part, the second detection part being arranged above the clamping part, and the second detection part being suitable for detecting a cleaning state of the wafer body on the clamping part; A terminal controller, wherein the terminal controller is electrically connected to the clamping part, the driving device of the spray arm, the driving device of the cargo rescue part, the first detection part and the second detection part, respectively, wherein When the first detection unit detects unexpected leakage from the spray nozzle, the terminal controller receives a signal from the first detection unit, controls the spray arm to stop spraying, and controls the rescue unit to spray a rescue medium onto the wafer body.

2. The real-time detection wafer cleaning device according to claim 1, characterized in that: The terminal controller comprises: an input unit, the input unit being adapted to receive data from the first detection unit and the second detection unit; A storage unit storing normal data; comparing the data acquired by the input unit with the stored normal data, and setting the acquired data beyond the normal data range as an abnormal state; A control unit, the control unit is adapted to obtain the comparison result of the storage unit, and control the driving device of the spray arm and the driving device of the cargo rescue unit when an abnormal state occurs; The alarm unit is adapted to receive a signal from the control unit and issue an alarm in an abnormal state.

3. The real-time detection wafer cleaning device according to claim 2, characterized in that: The first detection unit detects the spray nozzle that is spraying, and generates temperature spectrum image data of the cleaning medium sprayed from the spray nozzle and transmits it to the input unit; The first detection unit detects the spray nozzle that has finished the spraying operation, and generates image data of unexpected dripping of the cleaning medium from the spray nozzle and transmits it to the input unit.

4. The real-time detection wafer cleaning device according to claim 3, characterized in that: The second detection unit detects the wafer body on the clamping unit, generates temperature spectrum data of different cleaning media sprayed on the wafer surface by different spray arms and transmits it to the input unit, and The second detection unit can generate image data of the wafer position state of the wafer clamping unit and transmit it to the input unit.

5. The real-time detection wafer cleaning device according to claim 4, characterized in that: The spray arm is "L"-shaped, the vertical rod of the spray arm is connected to a drive motor, and the encoder of the drive motor is electrically connected to the control unit.

6. The real-time detection wafer cleaning device according to claim 5, characterized in that: The first detection part includes a fixing clamp, a detector body and a nitrogen connector; The fixing clamp is clamped on the cross bar of the spray arm, the detector body is rotatably arranged at the bottom of the fixing clamp, the rotation axis of the detector body is perpendicular to the cross bar of the spray arm, and the nitrogen joint is arranged at one end of the detector body away from the spray nozzle; The detector body is provided with a nitrogen connection hole adapted to the nitrogen connector, the nitrogen connector is inserted into the nitrogen connection hole, and The nitrogen connector is suitable for receiving nitrogen and blowing it into the detector body.

7. The real-time detection wafer cleaning device according to claim 6, characterized in that: The cargo salvage unit comprises a cargo salvage nozzle, and the cargo salvage nozzle is suitable for spraying a cargo salvage medium.

8. The method for using the real-time detection wafer cleaning device according to claim 7, characterized in that: S1, the clamping part starts to rotate after clamping the wafer body, and the second detection part continuously generates image data of the position of the wafer body and transmits it to the terminal controller, and at the same time, the second detection part continuously generates temperature spectrum data of the temperature of the surface of the wafer body and transmits it to the terminal controller; S2, the first spray arm rotates to above the clamping part, and the spray arm sprays a cleaning medium to clean the wafer body in the clamping part; S3, the first detection unit detects the cleaning medium sprayed from the spray nozzle, generates temperature spectrum image data and transmits it to the terminal controller; S4, when the first spray arm completes spraying, it returns to the initial position, and at the same time, the first detection unit starts to detect the unexpected dripping of the cleaning medium from the spray nozzle and transmits the data to the terminal controller; S5. The plurality of spray arms work one by one to complete the cleaning of the wafer body.

9. The detection method for real-time detection of wafer cleaning equipment according to claim 7, characterized in that: S10, the spray arm rotates from the initial position to the working position to start spraying, and returns to the initial position after spraying ends, and the first detection unit performs real-time detection on the spray nozzle; First, the first detection unit detects unexpected dripping of the cleaning medium from the spray nozzle and feeds back to the terminal controller. When unexpected dripping of the cleaning medium occurs, the terminal controller sends a signal to the driving device of the spray arm and alarms, so that the spray arm stops working and returns to the initial position. At the same time, the terminal controller sends a signal to the driving device of the rescue nozzle, so that the rescue nozzle rotates to the rescue position and sprays the rescue medium, thereby completing the rescue of the wafer body. S20, during the wafer body cleaning process, the second detection unit performs real-time detection on the wafer body; First, the second detection unit detects the position of the wafer body in real time. When the position of the wafer body is offset or broken, the second detection unit feeds back to the terminal controller, and the terminal controller sends a signal to the clamping part and alarms, so that the clamping part stops rotating; At the same time, the second detection unit detects the surface temperature of the wafer body in real time; When the surface temperature of the wafer body is abnormal, the terminal controller sends a signal to the driving device of the spray arm and alarms, so that the spray arm stops working and returns to the initial position. At the same time, the terminal controller sends a signal to the driving device of the rescue nozzle, so that the rescue nozzle rotates to the rescue position and sprays the rescue medium to complete the rescue of the wafer body. When the surface temperature of the wafer body has not changed, the terminal controller sends a signal to the clamping part and the spray arm to stop the rotation of the clamping part and the spray arm to stop working.

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