Semiconductor process device and process tail gas separation apparatus therefor

Abstract

A process tail gas separation apparatus for a semiconductor process device, for use in separating non-gaseous by-products in process tail gas discharged from a process chamber (20) of the semiconductor process device. The process tail gas separation apparatus comprises: a condensation assembly, comprising a condenser (110), wherein the condenser (110) is used for condensing the process tail gas, so that the process tail gas is condensed to separate out non-gaseous by-products, and the condenser (110) comprises a condensation chamber (111) used for containing the process tail gas; and a scraper assembly (200) provided in the condensation chamber (111), wherein the scraper assembly (200) is used for scraping off the non-gaseous by-products separated on the inner wall surface of the condensation chamber (111) after the process tail gas is condensed, so that the non-gaseous by-products can be prevented from being accumulated on the inner wall surface of the condensation chamber (111). Thus, the smoothness of the process tail gas discharge channel is maintained, the safety in use of the process tail gas separation apparatus is improved, and the maintenance period of the process tail gas separation apparatus is prolonged.

Description

Semiconductor process equipment and process tail gas separation device Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular, to a semiconductor process equipment and a process tail gas separation device thereof. Background Art

[0002] With the rapid development of optical communication technology, the transmission rate of optical communication is getting faster and faster. Photodetector chips are the core chips in optical communication systems. This chip often uses polyimide as the dielectric layer.

[0003] Polyimide films are made by polycondensing pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in highly polar solvents (water and γ-butyrolactone), casting them into films, and then imidizing them. Polyimide is widely used in semiconductor packaging due to its excellent temperature resistance, dielectric strength, radiation resistance, and adhesion. During the packaging process, after the polyimide liquid is cured by vacuum heating to form a polyimide film, it is typically subjected to polyimide curing (PIQ) in a vertical furnace. The polyimide film is heated at temperatures above 250°C, and nitrogen is introduced into the chamber to promote uniform heating. The high temperature evaporates the solvent in the polyimide film, producing water vapor and gaseous γ-butyrolactone, which then cures the polyimide film. After the process is completed, the nitrogen, water vapor, and gaseous γ-butyrolactone are discharged from the process chamber as process waste gas.

[0004] However, when a separation device is used in the related art to separate gaseous water and oil mist-like γ-butyrolactone, the separated by-products accumulate in the separation device and cannot be discharged in time, resulting in blockage of the exhaust pipe of the process chamber and increased exhaust pressure, causing the device to shut down.

[0005] Summary of the Invention

[0006] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor process equipment and a process exhaust gas separation device thereof, which are used to solve the technical problem that the pipeline is easily blocked during process exhaust gas separation.

[0007] To achieve the purpose of the present application, a process tail gas separation device for semiconductor process equipment is provided, which is used to separate non-gaseous by-products from the process tail gas discharged from the process chamber of the semiconductor process equipment. The process tail gas separation device includes:

[0008] A condensation component, comprising a condenser, the condenser being used to condense the process tail gas so as to separate the non-gaseous by-products after condensing the process tail gas; wherein the condenser comprises a condensation cavity for accommodating the process tail gas;

[0009] A scraper assembly is disposed in the condensation chamber, and is used to scrape off the non-gaseous by-products separated from the inner wall of the condensation chamber after the process tail gas is condensed.

[0010] Furthermore, the scraper assembly includes:

[0011] a rotating member rotatably disposed in the condensing chamber;

[0012] The first plate portion is connected to the rotating member, and is used for scraping off the non-gaseous by-products on the inner wall surface of the condensation chamber when the rotating member rotates.

[0013] Furthermore, the rotating member includes:

[0014] a tube body, disposed in the condensing cavity, the tube body being provided with a first through hole extending through the thickness thereof;

[0015] an end plate connected to one end of the tube body, the end plate being provided with a second through hole extending through the thickness thereof;

[0016] Wherein, the first plate portion is arranged on the outer wall surface of the tube body facing the condensation cavity.

[0017] Furthermore, it also includes:

[0018] a buffer assembly connected to the condensing assembly, the buffer assembly being provided with an air inlet and an air outlet, the air inlet being used to allow the process tail gas to enter, the air outlet being used to discharge the gaseous by-products separated after the process tail gas is condensed, and the buffer assembly being used to reduce the flow rate of the process tail gas entering through the air inlet;

[0019] In which, the buffer component is arranged in the condensation cavity, and a condensation cavity is formed between the outer wall surface of the buffer component and the inner wall surface of the condensation cavity, and the condensation cavity is connected to the air outlet; the scraper assembly is arranged in the condensation cavity, and the scraper assembly is also used to scrape off the non-gaseous by-products separated on the outer wall surface of the buffer component after the process exhaust gas is condensed.

[0020] Furthermore, the buffer assembly includes a buffer pipe arranged in the condensation cavity, a buffer cavity connected to the air inlet is formed in the buffer pipe, and the condensation cavity is formed between the outer wall surface of the buffer pipe and the inner wall surface of the condensation cavity.

[0021] Furthermore, the scraper assembly further comprises:

[0022] The second plate body is connected to the rotating member, and is used to scrape off non-gaseous by-products on the outer wall surface of the buffer assembly when the rotating member rotates.

[0023] Furthermore, the first plate body and the second plate body each include a plurality of scrapers, and the orthographic projections of the scrapers on the plane where the rotation axis of the rotating member is located form a preset angle with the first plane; the first plane is perpendicular to the rotation axis of the rotating member.

[0024] Furthermore, the plurality of scrapers are divided into a plurality of scraper groups according to different circumferential positions, and the preset angles of the plurality of scrapers in the plurality of scraper groups are the same;

[0025] The plurality of scrapers of any two adjacent scraper groups in the first plate body are staggered along the rotation axis of the rotating member;

[0026] The plurality of scrapers of any two adjacent scraper groups of the second plate body are staggeredly arranged along the rotation axis of the rotating member.

[0027] Furthermore, the buffer assembly further includes:

[0028] a mounting plate connected to the inner wall of the buffer pipe, the mounting plate being arranged opposite to the air inlet, and the mounting plate being provided with a through hole extending through the thickness thereof for allowing the process exhaust gas to pass through the through hole and enter the buffer pipe;

[0029] a mounting post connected to the mounting plate and disposed in the buffer cavity along the axial direction of the buffer cavity;

[0030] A plurality of buffer plates are connected to the mounting column, and the plurality of buffer plates are spaced apart in the axial direction of the buffer cavity. Each buffer plate is tilted downward, and two adjacent buffer plates are staggered in the axial direction of the buffer cavity, so as to change the flow direction of the process exhaust gas in the buffer cavity to reduce the flow rate of the process exhaust gas in the buffer cavity.

[0031] Furthermore, a driving motor is included, and the output shaft of the driving motor is connected to the rotating member through a transmission assembly, and the transmission assembly includes:

[0032] a transmission shaft, with both ends connected to the output shaft and the rotating member, respectively, and the transmission shaft is used to transmit the rotational force output by the drive motor to the rotating member to rotate the rotating member;

[0033] a pair of bearings, spaced apart on the transmission shaft in the axial direction of the transmission shaft;

[0034] An outer sleeve forming an accommodation space for accommodating the two bearings;

[0035] The inner sleeve is arranged in the accommodating space and located between the two bearings.

[0036] Furthermore, it also includes:

[0037] The separation component is connected to the condensation component, and the separation component includes a separation chamber. The separation chamber is used to collect the non-gaseous by-products scraped by the scraper component and discharge the non-gaseous by-products.

[0038] Furthermore, the separation component further comprises:

[0039] A cooling component is sleeved around the separation chamber and is used to cool the collected non-gaseous by-products and the transmission component. The transmission component is arranged in the cooling component.

[0040] The present application also provides a semiconductor process equipment, comprising a process chamber and a process exhaust gas separation device of the semiconductor process equipment as described above, which is connected to the exhaust port of the process chamber.

[0041] This application has the following beneficial effects:

[0042] The process exhaust gas separation device of the semiconductor process equipment in the present application is provided with a scraper assembly in the condensation chamber. The scraper assembly is used to scrape off non-gaseous by-products separated on the inner wall of the condensation chamber after the process exhaust gas is condensed, such as the oily γ-butyrolactone by-product. This can prevent the non-gaseous by-products from accumulating on the inner wall of the condensation chamber, keep the process exhaust gas discharge channel smooth, and avoid the downtime caused by the by-products clogging the exhaust pipe of the process chamber in the related technology, thereby improving the safety of the process exhaust gas separation device and extending the maintenance cycle of the process exhaust gas separation device.

[0043] Other objects and features of the present application will become clear by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0045] FIG. 1 is a schematic structural diagram of semiconductor process equipment in the related art.

[0046] FIG2 is a structural schematic diagram of the connection between the process chamber and the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present application.

[0047] FIG. 3 is a view of section AA in FIG. 2 .

[0048] FIG4 is an enlarged view of a portion B in FIG2 .

[0049] FIG5 is an enlarged view of a portion C in FIG2 .

[0050] FIG6 is a structural schematic diagram of the connection between the end plate and the transmission shaft in the process tail gas separation device of the semiconductor process equipment according to the embodiment of the present application.

[0051] FIG. 7 is a side view of FIG. 6 .

[0052] FIG. 8 is a top view of FIG. 6 .

[0053] FIG9 is a structural schematic diagram of the connection between the scraper assembly, the transmission assembly, and the drive motor of the process exhaust gas separation device of the semiconductor process equipment according to the embodiment of the present application.

[0054] FIG10 is an enlarged view of a portion D in FIG9 .

[0055] Description of main component symbols:

[0056] 1. Reaction chamber; 2. Condensation chamber; 3. Separation chamber; 4. Collection chamber; 5. Exhaust valve;

[0057] 110, condenser; 111, condensation cavity; 1121, condensation outer cavity; 1122, first liquid inlet; 1123, first liquid outlet; 121, first condensation flange; 122, second condensation flange;

[0058] 200, scraper assembly; 210, rotating member; 211, tube body; 2111, first through hole; 212, end plate; 2121, second through hole; 220, first plate body; 230, second plate body; 231, scraper;

[0059] 300, buffer assembly; 310, air inlet; 320, air outlet; 330, buffer pipe; 340, mounting plate; 350, mounting column; 360, buffer plate; 370, buffer flange;

[0060] 400, drive motor;

[0061] 500, transmission assembly; 510, transmission shaft; 520, bearing; 530, outer sleeve; 540, inner sleeve;

[0062] 600, separation assembly; 610, separation chamber; 611, second drain pipe; 612, electric drain valve; 621, cooling outer chamber; 622, second liquid inlet; 623, second liquid outlet; 630, separation flange;

[0063] 700, second storage component;

[0064] 800, first storage assembly; 801, first discharge pipe;

[0065] 20. Process chamber; 201. Exhaust pipe. DETAILED DESCRIPTION

[0066] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0067] FIG1 is a schematic structural diagram of a semiconductor process equipment according to related art. Referring to FIG1 , the semiconductor process equipment according to related art includes a reaction chamber 1, a condensation chamber 2, a separation chamber 3, a collection chamber 4, and an exhaust valve 5. The workpiece undergoes a polyimide curing process within the reaction chamber 1. After the process, the reaction chamber 1 discharges high-temperature process waste gas through an exhaust pipe. The high-temperature process waste gas includes high-temperature nitrogen, water vapor, and an oily mist-like γ-butyrolactone byproduct. The exhaust pipe is connected to the condensation chamber 2 to introduce the above-mentioned process waste gas into the condensation chamber 2. The high-temperature nitrogen, water vapor, and oily mist-like γ-butyrolactone byproduct are separated into medium-temperature gas, water, and an oily γ-butyrolactone byproduct, respectively, under the cooling effect of the condensation chamber 2. The separated medium-temperature gas, water, and greasy γ-butyrolactone by-product continue to enter the separation chamber 3. Due to the different densities of the various separated products, the various separated products can be directed to different recovery systems. For example, water and greasy γ-butyrolactone by-products flow into the collection chamber 4 through the discharge valve, while the medium-temperature gas and part of the water vapor flow into the plant service system through the exhaust valve 5.

[0068] However, over time, more and more greasy γ-butyrolactone byproducts enter separation chamber 3. The decrease in temperature causes the fluidity of the greasy γ-butyrolactone byproducts to deteriorate. Even increasing the opening of exhaust valve 5 cannot completely discharge the greasy γ-butyrolactone byproducts from separation chamber 3. This can ultimately cause the gas flow cross-section of separation chamber 3 to become increasingly smaller, potentially blocking the exhaust pipe connecting reaction chamber 1 to condensation chamber 2, leading to increased pressure in reaction chamber 1 and possible shutdown.

[0069] In order to solve the above technical problems, the present application proposes a process exhaust gas separation device for semiconductor process equipment, which is used to separate non-gaseous by-products in the process exhaust gas discharged from the process chamber of the semiconductor process equipment. The embodiment of the present application can improve the smoothness of the flow of process exhaust gas in the process exhaust gas separation device of the semiconductor process equipment.

[0070] 2 is a schematic structural diagram of the connection between the process chamber 20 and the process tail gas separation device of the semiconductor process equipment according to an embodiment of the present application. Referring to FIG2 , the process tail gas separation device includes a condensing assembly and a scraper assembly 200 .

[0071] The condensation assembly includes a condenser 110. The condenser 110 is used to condense the process tail gas so that non-gaseous by-products can be separated from the process tail gas after condensation. The condenser 110 includes a condensation chamber 111 for accommodating the process tail gas.

[0072] The scraper assembly 200 is disposed in the condensation chamber 111 to scrape off non-gaseous by-products separated from the inner wall of the condensation chamber 111 after the process exhaust gas is condensed, so as to prevent the non-gaseous by-products from accumulating on the inner wall of the condensation chamber 111.

[0073] In some embodiments, the condenser 110 further includes a condensing element disposed around the condensing chamber 111 and configured to cool the process off-gas discharged from the process chamber 20 into the condensing chamber 111, thereby separating the process off-gas into non-gaseous by-products after condensation. When the process off-gas includes high-temperature nitrogen, water vapor, and an oily mist-like γ-butyrolactone by-product, the condensing element condenses the process off-gas into a medium-temperature gas, water, and an oily, greasy γ-butyrolactone by-product. These separated products have different densities, facilitating further separation and collection.

[0074] Specifically, the condensation component may include an outer condensation cavity 1121, which is sleeved around the condensation cavity 111, and is provided with a first liquid inlet 1122 and a first liquid outlet 1123. The first liquid inlet 1122 can be connected to a cooling medium source (not shown in the figure) to guide the cooling medium provided by the cooling medium source into the space between the outer condensation cavity 1121 and the condensation cavity 111, and the first liquid outlet 1123 is used to allow the cooling medium to flow out so that the cooling medium can maintain fluidity in the space between the outer condensation cavity 1121 and the condensation cavity 111. The cooling medium exchanges heat with the condensation cavity 111, which can cool the condensation cavity 111, thereby cooling and condensing the process exhaust gas in the condensation cavity 111 to separate non-gaseous by-products.

[0075] Preferably, referring to FIG2 , the first liquid inlet 1122 can be located below the first liquid outlet 1123, that is, the first liquid inlet 1122 is lower than the first liquid outlet 1123, so that the cooling medium flows into the condensation outer cavity 1121 from the bottom and flows out from the top of the condensation outer cavity 1121. In this way, the cooling medium can flow through the entire space between the condensation outer cavity 1121 and the condensation cavity body 111 to fill the entire space between the condensation outer cavity 1121 and the condensation cavity body 111, thereby improving the condensation effect of the condensation component on the process exhaust gas. In addition, preferably, the first liquid inlet 1122 and the first liquid outlet 1123 are located on different sides of the condensation outer cavity 1121, such as opposite sides. This can further facilitate the cooling medium to flow through the entire space between the condensation outer cavity 1121 and the condensation cavity body 111 to fill the entire space between the condensation outer cavity 1121 and the condensation cavity body 111.

[0076] The process tail gas separation device in this embodiment is provided with a scraper assembly 200 in the condensation chamber 111. The scraper assembly 200 is used to scrape off non-gaseous by-products separated on the inner wall surface of the condensation chamber 111 after the process tail gas is condensed, such as the greasy γ-butyrolactone by-product. This can prevent the non-gaseous by-products from accumulating on the inner wall surface of the condensation chamber 111, maintain the smoothness of the process tail gas discharge channel, improve the safety of the process tail gas separation device, and extend the maintenance period of the process tail gas separation device.

[0077] Figure 3 is a view of section AA in Figure 2. Figure 4 is an enlarged view of part B in Figure 2. Referring to Figures 3 and 4, the process tail gas separation device also includes a buffer assembly 300. The buffer assembly 300 is connected to the condensation assembly. The buffer assembly 300 is provided with an air inlet 310 and an air outlet 320. The air inlet 310 is used to allow the process tail gas to pass through, and the air outlet 320 is used to discharge the gaseous by-products separated after the process tail gas is condensed. The buffer assembly 300 is used to reduce the flow rate of the process tail gas introduced from the air inlet 310. The buffer assembly 300 is arranged in the condensation cavity 111, and a condensation cavity is formed between the outer wall surface of the buffer assembly 300 and the inner wall surface of the condensation cavity 111, and the condensation cavity is connected to the air outlet 320.

[0078] In some embodiments, the buffer assembly 300 that implements the aforementioned functions includes, for example, a buffer pipe 330. The buffer pipe 330 is disposed within the condensation chamber 111 to reduce the overall installation space of the process off-gas separation device. A buffer chamber is formed within the buffer pipe 330, communicating with the air inlet 310. The condensation chamber is formed between the outer wall of the buffer pipe 330 and the inner wall of the condensation chamber 111.

[0079] It is understood that the buffer pipe 330 is disposed in the condensing cavity 111 and is used to separate the condensing cavity 111 into a communicating buffer cavity and a condensing cavity. Therefore, the condensing cavity 111 includes a condensing cavity and a buffer cavity.

[0080] The condenser 110 is used to condense the process off-gas in the condensation chamber, so that the process off-gas passes through the buffer chamber and flows upward in the condensation chamber at a relatively low flow rate. Non-gaseous by-products separated from the process off-gas after condensation may adhere to the inner wall of the condensation chamber 111 and the outer wall of the buffer pipe 330. A scraper assembly 200 is disposed in the condensation chamber. In addition to scraping off non-gaseous by-products separated from the inner wall of the condensation chamber 111, the scraper assembly 200 can also be used to scrape off non-gaseous by-products separated from the outer wall of the buffer pipe 330 after condensation of the process off-gas.

[0081] 2 , the scraper assembly 200 includes a rotating member 210 and a first plate portion 220. The rotating member 210 is rotatably disposed within the condensation chamber 111. The first plate portion 220 is connected to the rotating member 210. The first plate portion 220 is used to scrape non-gaseous byproducts from the inner wall surface of the condensation chamber 111 when the rotating member 210 rotates.

[0082] In some embodiments, the scraper assembly 200 further includes a second plate portion 230. The second plate portion 230 is connected to the rotating member 210 and is used to scrape off non-gaseous by-products on the outer wall of the buffer pipe 330 when the rotating member 210 rotates.

[0083] In some embodiments, the first plate portion 220 and the second plate portion 230 are both connected to the rotating member 210. When the condensing component of the condenser 110 condenses the process exhaust gas in the condensation chamber, the process exhaust gas may separate into non-gaseous by-products on the inner wall surface of the condensation chamber 111 and the outer wall surface of the buffer pipe 330. To address this, the first plate portion 220 can scrape off the non-gaseous by-products on the inner wall surface of the condensation chamber 111 when the rotating member 210 rotates, and the second plate portion 230 can scrape off the non-gaseous by-products on the outer wall surface of the buffer pipe 330 when the rotating member 210 rotates.

[0084] In some embodiments, as shown in FIG2 , the process tail gas separation device further includes a first storage assembly 800 , which is connected to the gas outlet 320 via a first drain pipe 801 . The first storage assembly 800 is used to collect the separated gaseous by-products.

[0085] Referring to Figure 2 , rotating member 210 includes a tube body 211 and an end plate 212. Tube body 211 is disposed within condensing chamber 111. Referring to Figure 6 , tube body 211 is provided with a first through-hole 2111 extending through its thickness. End plate 212 is connected to one end of tube body 211. End plate 212 is provided with a second through-hole 2121 extending through its thickness.

[0086] The first plate portion 220 is disposed on the outer wall of the tube 211 facing the condensation chamber 111 , so that the first plate portion 220 can scrape off non-gaseous byproducts on the inner wall of the condensation chamber 111 when the tube 211 rotates.

[0087] Specifically, the second plate portion 230 is disposed on the inner wall surface of the tube body 211 facing the buffer pipe 330 , so that the second plate portion 230 can scrape off non-gaseous byproducts on the outer wall surface of the buffer pipe 330 when the tube body 211 rotates.

[0088] 2 and 5 , the first through hole 2111 provided on the tube body 211 is used to allow part of the process exhaust gas flowing from the buffer cavity into the tube body 211 to flow out of the tube body 211 through the first through hole 2111 to divert the decelerated process exhaust gas.

[0089] The second through hole 2121 provided on the end plate 212 is used to allow the non-gaseous by-products scraped off by the second plate body 230 to enter the separation chamber 610 of the separation assembly 600 through the second through hole 2121 .

[0090] Specifically, the tube body 211 is provided with 16 first through holes 2111 evenly distributed along the circumferential direction, and the end plate 212 is provided with 6 second through holes 2121 evenly distributed along the circumferential direction.

[0091] FIG6 is a structural schematic diagram of the connection between the end plate 212 and the drive shaft 510 in the process exhaust gas separation device of the semiconductor process equipment according to an embodiment of the present application. FIG7 is a side view of FIG6. Referring to FIG6 and FIG7, the drive shaft 510 is connected to the end plate 212 of the scraper assembly 200. The first plate body 220 and the second plate body 230 each include a plurality of scrapers 231. The orthographic projection of the scraper 231 on the plane where the rotation axis of the rotating member 210 is located is arranged at a preset angle to the first plane so as to be able to scrape non-gaseous by-products. The preset angle is any angle not equal to 0°, and the first plane is perpendicular to the rotation axis of the rotating member 210. For example, the preset angle can be 30°, or 40°, or 50°, or 60°, or 120°.

[0092] In some embodiments, the multiple scrapers 231 are divided into multiple scraper groups based on their circumferential positions, and the multiple scrapers 231 in the multiple scraper groups have the same preset angle. The multiple scrapers 231 in any two adjacent scraper groups in the first plate body 220 are staggered along the rotation axis of the rotating member 210 to prevent the first plate body 220 from omitting non-gaseous by-products on the inner wall of the condensation chamber 111 during rotation. The multiple scrapers 231 in any two adjacent scraper groups in the second plate body 230 are staggered along the rotation axis of the rotating member 210 to prevent the second plate body 230 from omitting non-gaseous by-products on the outer wall of the buffer pipe 330 during rotation.

[0093] Figure 8 is a top view of Figure 6. Referring to Figure 8, the first plate portion 220 includes two scraper blades, which are located on the same diameter of the tube 211. Similarly, the second plate portion 230 also includes two scraper blades, which are also located on the same diameter of the tube 211.

[0094] 4 , the buffer assembly 300 further includes a mounting plate 340 , mounting posts 350 , and a plurality of buffer plates 360 .

[0095] The mounting plate 340 is connected to the inner wall of the buffer pipe 330. The mounting plate 340 is arranged opposite to the air inlet 310, and is provided with a through hole running through the thickness thereof for the process exhaust gas to enter the buffer pipe 330 through the through hole.

[0096] The mounting post 350 is connected to the mounting plate 340 and is disposed in the buffer cavity along the axial direction of the buffer cavity.

[0097] Multiple buffer plates 360 are connected to the mounting post 350. The buffer plates 360 are spaced apart axially within the buffer chamber, each buffer plate 360 ​​being tilted downward. Adjacent buffer plates 360 are staggered (at least partially staggered) axially within the buffer chamber to redirect the flow of process exhaust within the buffer chamber, thereby reducing the flow rate of the process exhaust within the buffer chamber. Preferably, one of the adjacent buffer plates 360 tilts downward from left to right, while the other tilts downward from right to left. This ensures that the process exhaust flows downwardly along each buffer plate 360 ​​in sequence.

[0098] In some embodiments, the mounting plate 340 is fixedly connected to the inner wall of the buffer pipe 330. A plurality of buffer plates 360 are threadedly connected to the mounting posts 350 for easy adjustment.

[0099] Preferably, the mounting post 350 is installed concentrically with the buffer pipe 330 .

[0100] Figure 9 is a schematic structural diagram illustrating the connection between the scraper assembly 200, transmission assembly 500, and drive motor 400 of a process exhaust gas separation device for semiconductor processing equipment according to an embodiment of the present application. Figure 10 is an enlarged view of detail D in Figure 9 . Referring to Figures 9 and 10 , the process exhaust gas separation device further includes a drive motor 400. The output shaft of the drive motor 400 is connected to the rotating member 210 via the transmission assembly 500. The transmission assembly 500 includes a drive shaft 510, a pair of bearings 520, an outer sleeve 530, and an inner sleeve 540.

[0101] The transmission shaft 510 is connected at both ends to the output shaft of the drive motor 400 and the rotating member 210, respectively. The transmission shaft 510 is used to transmit the rotational force output by the drive motor 400 to the rotating member 210, thereby rotating the rotating member 210. A pair of bearings 520 are arranged on the transmission shaft 510 at intervals along the axis of the transmission shaft 510 to provide support for the transmission shaft 510, reduce friction during rotation of the transmission shaft 510, and ensure that the transmission shaft 510, the output shaft of the drive motor 400, the buffer pipe 330, and the condensation chamber 111 are coaxial.

[0102] The outer sleeve 530 forms a space for accommodating the pair of bearings 520, ensuring that the bearings 520 are securely positioned along the axis of the transmission shaft 510. An inner sleeve 540 is disposed within the space and positioned between the pair of bearings 520. The inner sleeve 540 and outer sleeve 530 are, for example, concentrically arranged. The inner sleeve 540 supports the upper bearing of the pair of bearings 520 for ease of installation. Specifically, the inner sleeve 540 is supported between the pair of bearings 520 to limit their position.

[0103] Specifically, the outer sleeve 530 is fixedly connected to the cooling outer cavity 621 .

[0104] FIG5 is an enlarged view of section C in FIG2 . Referring to FIG5 , the process tail gas separation apparatus further includes a separation assembly 600. Separation assembly 600 is connected to the condensation assembly and includes a separation chamber 610. Non-gaseous by-products fall into separation chamber 610 due to gravity. Separation chamber 610 is used to collect and discharge the non-gaseous by-products scraped by scraper assembly 200.

[0105] This embodiment adopts a modular design for the process tail gas separation device, which includes a condensation component, a scraper component 200, a buffer component 300, a transmission component 500, a separation component 600, and a second storage component 700. The modular design facilitates the installation and removal of each component module, improving maintenance convenience.

[0106] In some embodiments, the condensation assembly further includes a first condensation flange 121 and a second condensation flange 122 spaced apart in the vertical direction. The buffer assembly 300 includes a buffer flange 370 provided with an air inlet 310 and an air outlet 320. The separation assembly 600 includes a separation flange 630. The buffer flange 370 is located above the first condensation flange 121, and the buffer flange 370 is connected to the first condensation flange 121 by fasteners, and a sealing ring can also be provided at the connection to improve sealing. The second condensation flange 122 is located above the separation flange 630, and the second condensation flange 122 is connected to the separation flange 630 by fasteners, and a sealing ring can also be provided at the connection to improve sealing. The outlet end of the exhaust pipe 201 connected to the exhaust port of the process chamber 20 is welded to the buffer flange 370 of the process separation device and is connected to the air inlet 310. The above arrangement can ensure the sealing of the process tail gas separation device and prevent leakage of the process tail gas.

[0107] 5 , the separation assembly 600 further includes a cooling component. The cooling component is disposed around the separation chamber 610 and is used to cool the collected non-gaseous byproducts and the transmission assembly 500. The transmission assembly 500 is disposed within the cooling component.

[0108] In some embodiments, the cooling component may include a cooling outer chamber 621, which is sleeved around the separation chamber 610 and is provided with a second liquid inlet 622 and a second liquid outlet 623. The second liquid inlet 622 may be connected to a cooling medium source (not shown in the figure, and may be the same as or different from the cooling medium source of the first liquid inlet 1122), and is used to guide the cooling medium provided by the cooling medium source into the space between the cooling outer chamber 621 and the separation chamber 610. The second liquid outlet 623 is used to allow the cooling medium in the cooling outer chamber 621 to flow out, so that the cooling medium can circulate in the space between the cooling outer chamber 621 and the separation chamber 610. The cooling medium exchanges heat with the separation chamber 610 in the cooling outer chamber 621, thereby cooling the separation chamber 610 and the pair of bearings 520 of the transmission assembly 500, further reducing the temperature of the non-gaseous byproducts in the separation chamber 610 and the bearings 520.

[0109] Preferably, referring to FIG5 , the second liquid inlet 622 can be located below the second liquid outlet 623, that is, the second liquid inlet 622 is lower than the second liquid outlet 623, so that the cooling medium flows into the cooling outer cavity 621 from the bottom and flows out from the top of the cooling outer cavity 621. In this way, the cooling medium can flow through the entire space between the cooling outer cavity 621 and the separation cavity 610, filling the entire space between the cooling outer cavity 621 and the separation cavity 610, thereby improving the cooling effect of the cooling component. In addition, preferably, the second liquid inlet 622 and the second liquid outlet 623 are located on different sides of the cooling outer cavity 621, for example, the second liquid inlet 622 is located on the bottom side of the cooling outer cavity 621, and the second liquid outlet 623 is located on the right side of the cooling outer cavity 621. This can further facilitate the cooling medium to flow through the entire space between the cooling outer cavity 621 and the separation cavity 610, filling the entire space between the cooling outer cavity 621 and the separation cavity 610.

[0110] In some embodiments, the separation chamber 610 is connected to a second drain pipe 611, which is arranged to extend downwardly and obliquely through the cooling outer cavity 621. One end of the second drain pipe 611 is fixedly connected to the bottom of the separation chamber 610 and communicates with the interior of the separation chamber 610. The other end of the second drain pipe 611 communicates with the second storage assembly 700 to discharge non-gaseous by-products into the second storage assembly 700. An electric drain valve 612 can be provided on the second drain pipe 611 to achieve automated control of the pipeline's on-off and discharge volume. The valve can be opened when the process tail gas separation device is idle to discharge non-gaseous by-products, reducing labor costs and extending maintenance cycles.

[0111] As can be understood, the process exhaust gas entering the process exhaust gas separation device through the air inlet 310 first enters the buffer chamber, where it flows to the condensation chamber after the high-temperature flow rate is reduced, ensuring high fluidity of the process exhaust gas in the buffer chamber. In the condensation chamber, the process exhaust gas contacts the inner wall surface of the condensation chamber 111 and the outer wall surface of the buffer pipe 330, thereby condensing and accelerating the separation of non-gaseous by-products and gaseous by-products. The non-gaseous by-products and gaseous by-products are separated under the influence of the scraper assembly 200 and gravity. Finally, the gaseous by-products leave the process exhaust gas separation device through the air outlet 320, while the non-gaseous by-products further enter the separation chamber 610 and then leave the process exhaust gas separation device through the second discharge pipe 611. In some embodiments, the process exhaust gas separation device also includes a second storage assembly 700, which is connected to the outlet end of the second discharge pipe 611. The second storage assembly 700 is used to collect the separated non-gaseous by-products.

[0112] 2 , a semiconductor process equipment is used for performing a polyimide curing process. The semiconductor process equipment includes a process chamber 20 and a process tail gas separation device according to any of the above embodiments. The exhaust port of the process chamber 20 is connected to the process tail gas separation device.

[0113] The process chamber 20 is used to provide a place for performing a polyimide curing process on a workpiece at a certain process temperature and after a certain proportion of process gas is introduced.

[0114] In some embodiments, the process chamber 20 can be connected to the condensation chamber 111 of the process exhaust gas separation device via an exhaust pipe 201 to provide process exhaust gas after the polyimide curing process to the condensation chamber 2. Specifically, the air inlet end of the exhaust pipe 201 is connected to the exhaust port of the process chamber 20, and the air outlet end of the exhaust pipe 201 is connected to the air inlet 310. It will be understood that the process exhaust gas includes at least high-temperature nitrogen, water vapor, and oil mist-like γ-butyrolactone byproduct.

[0115] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0116] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0117] In the description of this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0118] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0119] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A process tail gas separation device for semiconductor process equipment, used for separating non-gaseous byproducts in the process tail gas discharged from the process chamber of the semiconductor process equipment, characterized in that: The process tail gas separation device comprises: A condensation component, comprising a condenser, wherein the condenser is used to condense the process tail gas so as to separate the non-gaseous by-products after condensing the process tail gas; wherein the condenser comprises a condensation cavity for accommodating the process tail gas; A scraper assembly is disposed in the condensation chamber, and is used to scrape off the non-gaseous by-products separated from the inner wall of the condensation chamber after the process tail gas is condensed.

2. The process tail gas separation device according to claim 1, characterized in that: The scraper assembly comprises: A rotating member is rotatably disposed in the condensing chamber; The first plate body is connected to the rotating member, and is used to scrape off the non-gaseous by-products on the inner wall surface of the condensation chamber when the rotating member rotates.

3. The process tail gas separation device according to claim 2, characterized in that: The rotating member comprises: A tube body is disposed in the condensation cavity, and the tube body is provided with a first through hole penetrating the thickness of the tube body; an end plate connected to one end of the tube body, the end plate being provided with a second through hole penetrating through the thickness thereof; Wherein, the first plate portion is arranged on the outer wall surface of the tube body facing the condensation cavity.

4. The process tail gas separation device according to claim 2, characterized in that: The process tail gas separation device also includes: A buffer component is connected to the condensing component, and the buffer component is provided with an air inlet and an air outlet. The air inlet is used to introduce the process tail gas, the air outlet is used to discharge the gaseous by-products separated after the process tail gas is condensed, and the buffer component is used to reduce the flow rate of the process tail gas introduced from the air inlet; Wherein, the buffer component is arranged in the condensation cavity, and a condensation cavity is formed between the outer wall surface of the buffer component and the inner wall surface of the condensation cavity, and the condensation cavity is connected with the gas outlet; the scraper component is arranged in the condensation cavity, and the scraper component is also used to scrape off the non-gaseous by-products separated on the outer wall surface of the buffer component after the process exhaust gas is condensed.

5. The process tail gas separation device according to claim 4, characterized in that: The buffer assembly includes a buffer pipe disposed in the condensation cavity, a buffer cavity communicated with the air inlet is formed in the buffer pipe, and the condensation cavity is formed between the outer wall surface of the buffer pipe and the inner wall surface of the condensation cavity.

6. The process tail gas separation device according to claim 4, characterized in that: The scraper assembly also includes: The second plate body is connected to the rotating member, and the second plate body is used to scrape off the non-gaseous by-products on the outer wall surface of the buffer assembly when the rotating member rotates.

7. The process tail gas separation device according to claim 6, characterized in that: The first plate body and the second plate body both include a plurality of scrapers, and the orthographic projections of the scrapers on the plane where the rotation axis of the rotating member is located form a preset angle with the first plane; the first plane is perpendicular to the rotation axis of the rotating member.

8. The process tail gas separation device according to claim 7, characterized in that: The plurality of scrapers are divided into a plurality of scraper groups according to different circumferential positions, and the plurality of scrapers in the plurality of scraper groups have the same preset angle; The plurality of scrapers of any two adjacent scraper groups in the first plate body are arranged along the rotation The rotation axes of the rotating parts are arranged in a staggered manner; The plurality of scrapers of any two adjacent scraper groups of the second plate body are staggeredly arranged along the rotation axis of the rotating member.

9. The process tail gas separation device according to claim 5, characterized in that: The buffer assembly also includes: A mounting plate connected to the inner wall of the buffer pipe, the mounting plate being arranged opposite to the air inlet, and the mounting plate being provided with a through hole penetrating along the thickness thereof, so that the process tail gas can pass through the through hole and enter the buffer pipe; A mounting column connected to the mounting plate and disposed in the buffer cavity along the axial direction of the buffer cavity; A plurality of buffer plates are connected to the mounting column, and the plurality of buffer plates are spaced apart and distributed in the axial direction of the buffer cavity. Each of the buffer plates is tilted downward, and two adjacent buffer plates are staggered in the axial direction of the buffer cavity, so as to change the flow direction of the process exhaust gas in the buffer cavity to reduce the flow velocity of the process exhaust gas in the buffer cavity.

10. The process tail gas separation device according to claim 2, characterized in that: It also includes a driving motor, the output shaft of which is connected to the rotating member through a transmission assembly, and the transmission assembly includes: A transmission shaft, two ends of which are respectively connected to the output shaft and the rotating member, and the transmission shaft is used to transmit the rotational force output by the driving motor to the rotating member to rotate the rotating member; a pair of bearings, arranged on the transmission shaft at intervals in the axial direction of the transmission shaft; An outer sleeve, forming a receiving space for receiving the two bearings; The inner sleeve is arranged in the accommodating space and located between the two bearings.

11. The process tail gas separation device according to claim 10, characterized in that: Also includes: A separation component is connected to the condensation component, and the separation component includes a separation chamber, and the separation chamber is used to collect the non-gaseous by-products scraped by the scraper component and condense the non-gaseous by-products. Discharge of substances.

12. The process tail gas separation device according to claim 11, characterized in that: The separation assembly further comprises: A cooling component is sleeved around the separation chamber and is used to cool the collected non-gaseous by-products and the transmission component, and the transmission component is arranged in the cooling component.

13. A semiconductor process equipment, characterized in that: A process tail gas separation device for semiconductor process equipment according to any one of claims 1 to 12 comprises a process chamber and the device is connected to an exhaust port of the process chamber.

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