Circuit board, circuit board assembly, and computer device

Abstract

Embodiments of the present application relate to the technical field of heat dissipation of chips, and provide a circuit board, a circuit board assembly, and a computer device, used for dissipating heat of an electronic device, and having a simple structure. The circuit board comprises: a first circuit substrate, comprising a first wiring layer and a first electrically conductive column, the first electrically conductive column being electrically connected to the first wiring layer, and the first electrically conductive column being led out to a first side of the first circuit substrate; a first heat dissipation plate, stacked on a second side of the first circuit substrate, the second side being the opposite side of the first side; and a heat dissipation column, connected to the first heat dissipation plate and passing through a first through hole on the first circuit substrate so as to extend to the first side of the first circuit substrate. The circuit board provided by the embodiments of the present application has a simple structure, and can dissipate heat for chips of different heights at the same time.

Description

Circuit board, circuit board assembly and computer equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on July 25, 2023, with application number 202310927342.7 and application name “A circuit board, circuit board assembly and computer equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of chip heat dissipation technology, and in particular to a circuit board, a circuit board assembly, and a computer device. Background Art

[0003] Cold plate liquid cooling is a currently mainstream liquid cooling technology. It places a liquid cooling plate on top of a high-power chip and removes the heat generated by the chip through the flow of liquid inside the liquid cooling plate.

[0004] When using cold plate liquid cooling technology, in order to improve the heat dissipation capacity of the chip, the liquid cooling plate needs to be flatly attached to the chip surface. However, due to the different heights of different chips, multiple liquid cooling plates need to be set up to dissipate heat for chips of different heights, which leads to the problem of complex heat dissipation structure.

[0005] Summary of the Invention

[0006] The purpose of the embodiments of the present application is to provide a circuit board, a circuit board assembly and a computer device for dissipating heat from electronic devices, and the structure is relatively simple.

[0007] In order to achieve the above objectives, the present invention provides the following solutions:

[0008] On the one hand, a circuit board is provided, comprising: a first circuit substrate, comprising a first wiring layer and a first conductive column, the first conductive column being electrically connected to the first wiring layer, and the first conductive column being led out to the first side of the first circuit substrate; a first heat dissipation plate stacked on the second side of the first circuit substrate, the second side being the opposite side of the first side; and a heat dissipation column connected to the first heat dissipation plate and passing through a first through hole on the first circuit substrate to extend to the first side of the first circuit substrate.

[0009] The circuit board provided in the embodiment of the present application is provided with a heat dissipation column and a first heat dissipation plate. The heat dissipation column can be used to directly or indirectly contact the electronic device (such as a chip) mounted on the first side of the first circuit substrate, so that the heat from the electronic device can be transferred to the first heat dissipation plate through the heat dissipation column, and then the heat can be dissipated by the first heat dissipation plate. When the first heat dissipation plate is a liquid cooling plate, the flow of liquid cooling medium in the liquid cooling plate can remove the heat transferred from the heat dissipation column to the liquid cooling plate, thereby achieving a good heat dissipation effect. Since the circuit board in the embodiment of the present application has the first heat dissipation plate stacked on the second side of the first circuit substrate and the heat dissipation column passes through the first circuit substrate to dissipate heat for the electronic device (such as a chip) located on the first side of the first circuit substrate, it can simultaneously accommodate chips of different sizes (such as heights) (i.e., it can simultaneously dissipate heat for chips of different sizes (such as heights)). Compared with the related art, there is no need to separately set up multiple printed circuit boards (PCBs) and multiple liquid cooling plates, which reduces space occupation, and has a simple structure, low cost, and good heat dissipation effect.

[0010] In some embodiments, the first heat sink comprises a liquid cooling plate, the liquid cooling plate comprising a cooling medium channel having an inlet and an outlet. By introducing liquid cooling medium into the cooling medium channel, the first heat sink can have a good heat dissipation capacity.

[0011] In some embodiments, the circuit board further includes: a second circuit substrate, located on a side of the first heat sink facing away from the first circuit substrate; the second circuit substrate includes a second wiring layer and a second conductive post, the second conductive post being electrically connected to the second wiring layer; the second conductive post extending through a second through hole on the first heat sink to connect to the first wiring layer, or the second conductive post extending through a second through hole on the first heat sink and a third through hole on the first circuit substrate to extend to the first side of the first circuit substrate. With this arrangement, the surface of the second circuit substrate facing away from the first heat sink can also be used to mount electronic components. In this case, a heat sink can also be provided on the side of the first heat sink closer to the second circuit substrate. The specific arrangement can be found in the previous description. This arrangement can also simultaneously dissipate heat for electronic components on the second circuit substrate.

[0012] In some embodiments, there are multiple heat dissipation posts, at least one of which is connected to the first heat dissipation plate and extends through a through hole in the second circuit substrate to a side of the second circuit substrate facing away from the first heat dissipation plate. This arrangement allows the first heat dissipation plate and the heat dissipation posts to dissipate heat for electronic devices disposed on the second circuit substrate.

[0013] In some embodiments, the circuit board includes a plurality of first heat dissipation plates and a plurality of second circuit substrates alternately stacked. This arrangement can provide a stronger heat dissipation capability through the plurality of first heat dissipation plates.

[0014] In some embodiments, the circuit board further includes: an insulating material filled between the second conductive pillar and the wall of the second through hole. This configuration can improve the signal transmission quality of the second conductive pillar.

[0015] In some embodiments, the insulating material also covers the edge of the second through hole. This configuration can better improve the signal transmission quality of the second conductive pillar 1042.

[0016] In some embodiments, the insulating material includes at least one of glass fiber material, resin material, and rubber material, all of which have good insulating effects.

[0017] In some embodiments, the heat dissipation column and the first heat dissipation plate are both made of metal. This configuration not only increases the heat transfer coefficient of the heat dissipation column and the first heat dissipation plate, but also provides electrical conductivity, for example, for transmitting a ground signal (GND).

[0018] In another aspect, a circuit board assembly is provided, comprising: the circuit board of any of the aforementioned embodiments; an electronic device mounted on a first side of the first circuit substrate; the electronic device electrically connected to the first conductive pillars, and the electronic device in contact with the heat dissipation pillars. With this arrangement, the heat dissipation pillars and the first heat sink can be used to dissipate heat from the electronic device.

[0019] In some embodiments, the ground pin of the electronic device is in electrical contact with the heat dissipation column. This arrangement allows the heat dissipation column and the first heat dissipation plate to dissipate heat from the electronic device and transmit a ground signal of the electronic device.

[0020] In some embodiments, the electronic components are multiple, including a first electronic component and a second electronic component, wherein the first electronic component has a higher power than the second electronic component. The circuit board assembly further includes a second heat sink disposed on a side of the first electronic component facing away from the first circuit substrate. This arrangement can provide greater heat dissipation for the higher-power first electronic component, for example, achieving double-sided heat dissipation of the first electronic component.

[0021] In some embodiments, the electronic device includes a chip. Multiple chips of different types and heights can be mounted on the first circuit substrate of the circuit board assembly. The heat dissipation columns and the first heat dissipation plate are used to simultaneously dissipate heat from the multiple mounted chips.

[0022] In yet another aspect, a computer device is provided, comprising: the circuit board assembly of any of the preceding embodiments. The computer device provided in the embodiments of the present application, because it includes the circuit board assembly of any of the preceding embodiments, exhibits all of the aforementioned beneficial effects. This reduces the likelihood of overheating in the computer device, such as severe heating of certain chips and reduced operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a structural block diagram of a computer device provided in an embodiment of the present application;

[0024] FIG2 is a structural diagram of a circuit board assembly in the related art;

[0025] FIG3 is a structural diagram of a circuit board assembly in the related art;

[0026] FIG4 is a structural diagram of a circuit board assembly in FIG1 ;

[0027] FIG5 is a structural diagram of a liquid cooling plate connected to a cooling structure according to an embodiment of the present application;

[0028] FIG6 is a structural diagram of another circuit board assembly in FIG1 ;

[0029] FIG7 is a structural diagram of another circuit board assembly in FIG1 ;

[0030] FIG8 is a schematic diagram of heat dissipation of the low-power chip in FIG6 ;

[0031] FIG9 is a schematic diagram of heat dissipation of the high-power chip in FIG6 . DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0033] In the following, the terms "first," "second," etc., are used for descriptive convenience only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0034] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "electrical connection" can refer to a direct electrical connection or an indirect electrical connection through an intermediate medium, and "electrical contact" can refer to a direct electrical contact or an indirect electrical contact through an intermediate medium.

[0035] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0036] In the embodiments of the present application, "and / or" describes the association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0037] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, used to explain the structure and movement of various components of the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0038] An embodiment of the present application provides a computer device, which may be a personal computer, a router, a switch, a server, an in-vehicle device, etc. FIG1 is a structural block diagram of a computer device 1000 in an embodiment of the present application, wherein the computer device 1000 includes a circuit board assembly 300, and the circuit board assembly 300 includes a circuit board 100 and an electronic device 200. The electronic device 200 can be installed on the circuit board to implement functions such as processing and calculation. In some examples, the electronic device 200 can be, for example, a chip, such as a processing chip, a memory chip, etc. In other examples, the electronic device 200 can also be, for example, an electronic component such as a resistor or a capacitor. The circuit board 100 can be used to dissipate heat for the electronic device 200, and the structure of the circuit board 100 is relatively simple.

[0039] FIG. 2 is a structural diagram of a circuit board assembly 400 in the related art.

[0040] The circuit board assembly 400 includes a printed circuit board (PCB) 401, a plurality of chips 402 and a plurality of liquid cooling plates 403. The plurality of chips 402 are mounted on one side surface of the printed circuit board, and the heights of the plurality of chips 402 are different (two are used as an example in the figure). The plurality of liquid cooling plates 403 can be attached to the surfaces of the plurality of chips 402 in a one-to-one correspondence to dissipate heat for the corresponding chips 402. Among them, due to the different heights of the plurality of chips 402, the distances between the plurality of liquid cooling plates 403 and the printed circuit board 401 are different. The above scheme can be called a liquid cooling plate floating heat dissipation scheme, that is, the printed circuit board 401 is a fixed whole plate, and the plurality of liquid cooling plates for dissipating heat for the plurality of chips 402 float to different height positions. Since the floating liquid cooling plate scheme requires multiple liquid cooling plates 403, there is a problem of complex structure.

[0041] FIG3 is a structural diagram of a circuit board assembly 500 in the related art.

[0042] The circuit board assembly 500 includes multiple printed circuit boards (PCBs) 501, multiple chips 502, and an integrated liquid cooling plate 503. Multiple chips 502 can be installed on multiple printed circuit boards 501 in a one-to-one correspondence, and each chip 502 contacts the integrated liquid cooling plate 503 with the surface facing away from the corresponding installed printed circuit board 501, so that the integrated liquid cooling plate 503 can be used to dissipate heat for the multiple chips 502. Among them, due to the different heights of the multiple chips 402, the distances from the multiple printed circuit boards 501 to the liquid cooling plate 403 are different. The above scheme can be called a floating heat dissipation scheme for printed circuit boards, that is, the liquid cooling plate 503 does not float to different height positions, and an integrated liquid cooling plate 503 is used to dissipate heat for the multiple chips 502, and the multiple printed circuit boards float to different height positions. Since the floating printed circuit board scheme requires multiple printed circuit boards 501, there is also a problem of complex structure.

[0043] In the embodiments of Figures 2 and 3, there may be other low-power devices that require heat dissipation using a shell-mounted heat sink or a liquid cooling plate, which further increases the complexity of the circuit board assembly (400, 500). In addition, there may be some low-power chips that cannot be cooled by the designed liquid cooling plate (403, 503). In this case, a separate heat dissipation structure needs to be designed for the low-power chips, which further increases the complexity of the circuit board assembly (400, 500). In addition, in the embodiments of Figures 2 and 3, heat is only dissipated from the side of the chip facing away from the printed circuit board. However, as the power of the chip increases, it becomes increasingly difficult to meet the heat dissipation requirements of high-power chips.

[0044] Based on the above technical problems, the embodiment of the present application further provides a circuit board 100 and a circuit board assembly 300.

[0045] Figure 4 is a structural diagram of a circuit board assembly 300 in Figure 1. Circuit board assembly 300 includes circuit board 100 and electronic device 200. As mentioned above, electronic device 200 can be a chip or other electronic component. Figure 4 illustrates electronic device 200 as chip 201.

[0046] The circuit board 100 includes a first circuit substrate 101 , a first heat dissipation plate 102 and heat dissipation columns 103 .

[0047] The first circuit substrate 101 includes a first wiring layer 1011 and first conductive pillars 1012. The first conductive pillars 1012 are electrically connected to the first wiring layer 1011 and extend to the first side C1 of the first circuit substrate 101. The first circuit substrate 101 also includes an insulating substrate 1010. When the first circuit substrate 101 is a rigid substrate, the insulating substrate 1010 of the first circuit substrate 101 can be made of FR4 material. FR4 material mainly consists of glass fiber and epoxy resin. Glass fiber is an excellent reinforcing material with high strength, high modulus, corrosion resistance, and non-conductivity. Epoxy resin is a polymer material with excellent adhesion, mechanical properties, heat resistance, and electrical properties. The combination of glass fiber and epoxy resin creates FR4 material with excellent overall performance. As a result, the first circuit substrate 101 has excellent mechanical properties (such as high strength, high modulus, and excellent impact resistance, not easy to deform or crack, and can withstand large external forces and pressures), electrical properties (such as good insulation and heat resistance, while also being able to withstand high voltages and currents), chemical properties (such as excellent corrosion resistance and chemical resistance, and can be used in harsh environments such as acids, alkalis, and solvents), and thermal properties (such as good high-temperature resistance, thermal expansion resistance, and thermal conductivity, and can operate stably in high-temperature environments). When the first circuit substrate 101 is a flexible substrate, the insulating base material 1010 of the first circuit substrate 101 can be made of materials such as polyimide (PI) and thermoplastic polyester (PET).

[0048] The first wiring layer 1011 can be located inside or on the surface of the insulating substrate 1010. For example, a first wiring layer 1011 can be sandwiched between two layers of insulating substrate 1010 in a stacked manner. This application does not limit the number of layers of the insulating substrate 1010 or the number of layers of the first wiring layer 1011. When there are multiple layers of first wiring layers 1011, there is no restriction on the connection method of the multiple layers of first wiring layers 1011. The connection method of the multiple layers of first wiring layers 1011 can be designed according to different usage scenarios. The first conductive pillar 1012 is electrically connected to the first wiring layer 1011, and the first conductive pillar 1012 can be led out to the first side C1 of the first circuit substrate 101 (also referred to as the first side of the insulating substrate 1010) through the via on the insulating substrate 1010. Here, the number of first conductive pillars 1012 is also not limited. For example, multiple first conductive pillars 1012 can be connected to different positions of the same first wiring layer 1011, or multiple first conductive pillars 1012 can be connected to different layers of the first wiring layer 1011.

[0049] The first heat sink 102 is stacked on the second side C2 of the first circuit substrate 101, and the second side C2 is the opposite side of the first side C1. The first heat sink 102 can be a liquid cooling plate 1021, an air cooling plate, a heat conducting plate, a temperature averaging plate, or other plate-like structures with a cooling effect. The liquid cooling plate 1021 can remove heat from its surface by the flow of liquid cooling medium inside it, and the air cooling plate can remove heat from its surface by the flow of gas cooling medium inside it. The heat conducting plate can be a hollow or solid plate-like structure made of a material with a high heat transfer coefficient, such as copper. The temperature averaging plate refers to a structure that includes a phase change material inside, and the phase change material inside switches between gas and liquid to achieve heat dissipation. This can improve the local overheating phenomenon of the first circuit substrate 101, thereby facilitating the protection of the electronic devices 200 on the first circuit substrate 101, such as the chip 201.

[0050] Taking the first heat dissipation plate 102 as a liquid cooling plate 1021 as an example, as shown in FIG5 , FIG5 is a structural diagram of a liquid cooling plate connected to a cooling structure provided in an embodiment of the present application. The liquid cooling plate 1021 may include a cooling medium channel 1020 having an inlet a1 and an outlet a2, and a liquid cooling medium, such as water, refrigerant, etc., may flow through the cooling medium channel 1020. The inlet a1 and outlet a2 of the cooling medium channel 1020 may be simultaneously arranged on the side of the liquid cooling plate 1021 (as shown in FIG5 ), or may be simultaneously arranged on other surfaces of the liquid cooling plate 1021, or may be respectively arranged on different surfaces of the liquid cooling plate 1021. In some examples, the liquid cooling plate 1021 can be used in conjunction with the cooling structure 600. For example, the inlet a1 of the cooling medium channel 1020 can be connected to the outlet of the cooling structure 600 through a pipeline, and the outlet a2 of the cooling medium channel 1020 can be connected to the inlet of the cooling structure 600 through a pipeline. The cooling structure 600 can be a cooler or a condenser. For example, the cooler can cool water when water flows through it, and the condenser can change the phase of the refrigerant when the refrigerant flows through it, such as condensation to dissipate heat. The cooling structure 600 can be used as part of the circuit board assembly 300, or the cooling structure 600 can also be used as part of the computer device 1000. When the cooling structure 600 is used as part of the computer device 1000, in addition to being used in conjunction with the liquid cooling plate 1021 in the circuit board assembly 300, other pipelines can also be connected to the liquid cooling plate used to dissipate heat for other components (such as power modules, etc.).

[0051] The heat dissipation column 103 is connected to the first heat dissipation plate 102. The heat dissipation column 103 passes through the first through hole H1 on the first circuit substrate 101 to extend to the first side C1 of the first circuit substrate 101. The first through hole H1 can be understood as a through hole on the insulating substrate 1010. While passing through the first through hole H1, the heat dissipation column 103 can pass through the opening on the first wiring layer 1011 or not, and there is no limitation here. In addition, the heat dissipation column 103 can be a solid structure or a hollow structure with a fluid channel. By extending the heat dissipation column 103 to the first side C1 of the first circuit substrate 101, the heat dissipation column 103 can be used to conduct the heat of the electronic device 200 (such as a chip) installed on the first side C1 of the first circuit substrate 101 to the first heat dissipation plate 102, and then the heat can be dissipated by the first heat dissipation plate 102.

[0052] The circuit board 100 provided in the embodiment of the present application, because it is provided with heat dissipation posts 103 and a first heat dissipation plate 102, can utilize the heat dissipation posts 103 to directly or indirectly (for example, through thermal adhesive, solder, or other thermally conductive connection structures) contact the electronic device 200 (such as a chip) mounted on the first side C1 of the first circuit substrate 101, thereby allowing heat from the electronic device 200 to be transferred to the first heat dissipation plate 102 via the heat dissipation posts 103, and then dissipated by the first heat dissipation plate 102. When the first heat dissipation plate 102 is a liquid cooling plate 1021, the flow of liquid cooling medium in the liquid cooling plate 1021 can remove the heat transferred from the heat dissipation posts 103 to the liquid cooling plate 1021, thereby achieving excellent heat dissipation effect. Since the circuit board 100 in the embodiment of the present application has a first heat sink 102 stacked on the second side C2 of the first circuit substrate 101, and a heat sink 103 passes through the first circuit substrate 101 to dissipate heat for the electronic device 200 (such as a chip) located on the first side C1 of the first circuit substrate 101, it can simultaneously match chips of different sizes (such as heights) (that is, it can dissipate heat for chips of different sizes (such as heights) at the same time). Compared with the related art, there is no need to separately set up multiple PCBs and multiple liquid cooling plates, which reduces space occupancy. In addition, the structure is simple, the cost is low, and the heat dissipation effect is good.

[0053] In addition, in some examples, as shown in FIG4 , the circuit board assembly 100 may also be provided with a second heat sink 90 on the back side (the surface facing away from the first circuit substrate 101) of one or more electronic devices 200. The type of second heat sink 90 may be similar to that of the first heat sink 102, for example, it may also be a liquid cooling plate. This allows heat to be dissipated from both sides of the electronic device 200, better meeting the heat dissipation requirements of high-power electronic devices 200. For example, depending on the heat dissipation requirements of different electronic devices 200, a second heat sink 90 may be provided on the back side of some or all of the electronic devices 200. For example, in the embodiment shown in FIG4 , which includes three chips with increasing power from left to right, a second heat sink 90 may be added only to the back side of the rightmost chip (i.e., the chip with the highest power and the one generating the most heat) to achieve better heat dissipation. Of any two electronic devices, the one with the higher power may be referred to as the first electronic device, and the one with the lower power may be referred to as the second electronic device. In other words, a second heat sink 90 may be added to the side of the first electronic device facing away from the first circuit substrate 101.

[0054] In some embodiments, the heat dissipation column 103 and the first heat dissipation plate 102 are both made of metal. This configuration not only increases the heat transfer coefficient of the heat dissipation column 103 and the first heat dissipation plate 102, but also provides electrical conductivity, for example, for transmitting a ground signal (GND).

[0055] For example, the heat dissipation column 103 and the first heat dissipation plate 102 may be made of copper. This configuration has a good heat dissipation effect.

[0056] In some embodiments, the ground pin 2011 of the electronic device 200 is in electrical contact with the heat dissipation column 103. This arrangement allows the heat dissipation column 103 and the first heat dissipation plate 102 to dissipate heat from the electronic device 200, while also allowing the heat dissipation column 103 and the first heat dissipation plate 102 to transmit a ground signal for the electronic device 200. Of course, in other embodiments, the heat dissipation column 103 may be in contact with other parts of the electronic device to achieve heat dissipation. For example, the bottom surface (i.e., the surface close to the first circuit substrate 101) or side surface of the electronic device 200 may be in contact with the heat dissipation column 103.

[0057] FIG6 is a structural diagram of another circuit board assembly 300 shown in FIG1 . FIG6 differs from FIG4 in that a second circuit substrate 104 is added to the side of the first heat sink 102 facing away from the first circuit substrate 101. In some embodiments, as shown in FIG6 , the second circuit substrate 104 includes an insulating substrate 1010 and a second wiring layer 1041. The configuration of the insulating substrate 1010 and the second wiring layer 1041 can be described in the previous embodiments of the insulating substrate 1010 and the first wiring layer 1011, and will not be further described here. The second circuit substrate 104 also includes a second conductive pillar 1042. The connection between the second conductive pillar 1042 and the second wiring layer 1041 can also be described in the previous embodiments of the first conductive pillar 1012 and the first wiring layer 1011, and will not be further described here. However, in some examples, the second conductive pillar 1042 passes through the second through hole H2 in the first heat sink 102 to connect to the first wiring layer 1011 (e.g., the second conductive pillar 1042 on the right side indicated in FIG6 ). In other examples, the second conductive pillars 1042 extend through the second through holes H2 on the first heat sink 102 and the third through holes H3 on the first circuit substrate 101 to reach the first side C1 of the first circuit substrate 101. Of course, in this case, the second conductive pillars 1042 can also be electrically connected to one or more first wiring layers 1011 while passing through the first circuit substrate 101. Both the first circuit substrate 101 and the second circuit substrate 104 can be PCBs.

[0058] For example, the surface of the second circuit substrate 104 facing away from the first heat sink 102 can also be used to mount an electronic device 200 (not shown). In this case, heat dissipation posts 103 can also be provided on the side of the first heat sink 102 closer to the second circuit substrate 104, as shown in FIG7 . The only difference between FIG7 and FIG6 is the addition of heat dissipation posts 103 passing through the second circuit substrate 104, and the mounting of the electronic device 200 on the second circuit substrate 104 in contact with the heat dissipation posts 103. The specific arrangement can be found in the previous description. In this manner, heat can also be dissipated from the electronic device 200 on the second circuit substrate 104.

[0059] In some other embodiments, there may be multiple first heat dissipation plates 102 and second circuit substrates 104 , for example, they may be alternately stacked in a direction away from the first side C1 of the first circuit substrate 101 .

[0060] In some embodiments, the circuit board further includes an insulating material 105 filled between the second conductive pillar 1042 and the wall of the second through hole H2. This configuration prevents the first heat sink 102 and the cooling medium within the first heat sink 102 from affecting the signal transmitted by the second conductive pillar 1042, thereby improving the signal transmission quality of the second conductive pillar 1042.

[0061] Exemplarily, the insulating material 105 also covers the edge of the second through hole H2. This configuration further prevents the first heat sink 102 and the cooling medium within the first heat sink 102 from affecting the signal transmitted by the second conductive pillar 1042, thereby further improving the signal transmission quality of the second conductive pillar 1042.

[0062] Exemplarily, the insulating material 105 includes at least one of glass fiber material, resin material, and rubber material, all of which have good insulation effects.

[0063] Figure 8 is a schematic diagram of heat dissipation for the low-power chip in Figure 6 . As shown in Figure 8 , when the coolant (i.e., liquid cooling medium) within first heat sink 102 flows from left to right as shown, heat from low-power chip 201 can flow along the dotted arrow lines, sequentially to the pins of chip 201 (e.g., ground pin 2011), heat sink 103, and first heat sink 102, before being carried away by the coolant within first heat sink 102. This eliminates the need for a second heat sink 90 on the back of low-power chip 201, simplifying the structure.

[0064] FIG9 is a schematic diagram of heat dissipation for the high-power chip in FIG6 . As shown in FIG9 , when the coolant (i.e., liquid cooling medium) in the first heat sink 102 flows from left to right as shown in the figure, the heat from the high-power chip 201 can be dissipated along two paths (e.g., two dotted lines with arrows). Path 1: Heat flows sequentially to the pins of the chip 201 (e.g., ground pin 2011), the heat sink 103, and the first heat sink 102 below, and is finally carried away by the coolant in the first heat sink 102 below. Path 2: Heat flows to the second heat sink 90 above (the second heat sink 90 and its configuration can refer to the first heat sink 102, and can also be a liquid cooling plate, for example), and is carried away by the coolant in the second heat sink 90 above. In this way, the heat dissipation capacity for the high-power chip 201 can be increased.

[0065] It should be noted that, in the embodiments of Figures 4, 6-9, the heat dissipation column 103 is shown as an example of contact with the ground pin and / or the vacant pin at the bottom of the chip 201. However, in other embodiments, the heat dissipation column 103 can also be in contact with the bottom surface of the chip 201 (i.e., the surface of the chip 201 close to the first circuit substrate) to dissipate heat, or the heat dissipation column 103 can also be in contact with the side surface of the chip 201 to dissipate heat.

[0066] In some embodiments, multiple heat dissipation columns in contact with the same chip 201 can be evenly spaced within the positive projection range of the chip 201 on the first circuit substrate 101. In this way, the heat on the chip 201 can be better conducted to the first heat dissipation plate 102, thereby dissipating heat faster through the first heat dissipation plate 102.

[0067] In some embodiments, the plurality of chips 201 may be distributed relatively evenly at different positions of the first circuit substrate 101 , thereby facilitating better utilization of the heat dissipation capability of the first heat sink 102 .

[0068] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board, characterized in that: include: A first circuit substrate, comprising a first wiring layer and a first conductive column, wherein the first conductive column is electrically connected to the first wiring layer and the first conductive column is led out to a first side of the first circuit substrate; A first heat dissipation plate, stacked on a second side of the first circuit substrate, the second side being an opposite side to the first side; as well as, The heat dissipation column is connected to the first heat dissipation plate and passes through the first through hole on the first circuit substrate to extend to the first side of the first circuit substrate.

2. The circuit board according to claim 1, characterized in that: Also includes: A second circuit substrate is located on a side of the first heat sink facing away from the first circuit substrate; the second circuit substrate includes a second wiring layer and a second conductive column, and the second conductive column is electrically connected to the second wiring layer; the second conductive column passes through the second through hole on the first heat sink to connect to the first wiring layer, or the second conductive column passes through the second through hole on the first heat sink and the third through hole on the first circuit substrate to extend to the first side of the first circuit substrate.

3. The circuit board according to claim 2, characterized in that: There are multiple heat dissipation columns, at least one of which is connected to the first heat dissipation plate and passes through a through hole on the second circuit substrate to extend to a side of the second circuit substrate away from the first heat dissipation plate.

4. The circuit board according to claim 2, characterized in that: The circuit board includes a plurality of first heat dissipation plates and a plurality of second circuit substrates which are alternately stacked.

5. The circuit board according to claim 2, characterized in that: Also includes: The insulating material is filled between the second conductive column and the hole wall of the second through hole.

6. The circuit board according to claim 5, characterized in that: The insulating material also covers an edge of the second through hole.

7. The circuit board according to claim 5, characterized in that: The insulating material includes at least one of a glass fiber material, a resin material and a rubber material.

8. The circuit board according to any one of claims 1 to 7, characterized in that: The heat dissipation column and the first heat dissipation plate are both made of metal.

9. The circuit board according to any one of claims 1 to 8, characterized in that: The first heat sink plate includes a liquid cooling plate including a cooling medium channel having an inlet and an outlet.

10. A circuit board assembly, characterized in that: include: The circuit board as claimed in any one of claims 1 to 9; An electronic device is mounted on the first side of the first circuit substrate; the electronic device is electrically connected to the first conductive column, and the electronic device is in contact with the heat dissipation column.

11. The circuit board assembly according to claim 10, characterized in that: The ground pin of the electronic device is in electrical contact with the heat dissipation column.

12. The circuit board assembly according to claim 10 or 11, characterized in that: The number of the electronic devices is multiple, the multiple electronic devices include a first electronic device and a second electronic device, and the power of the first electronic device is greater than the power of the second electronic device; The circuit board assembly further includes a second heat sink disposed on a side of the first electronic device away from the first circuit substrate.

13. The circuit board assembly according to any one of claims 10 to 12, characterized in that: The plurality of heat dissipation columns in contact with the same electronic device are evenly spaced and arranged within the range of the orthographic projection of the electronic device on the first circuit substrate.

14. A computer device, characterized in that: include: A circuit board assembly as claimed in any one of claims 10 to 13.

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