Electronic device including support area for supporting sealing member

Abstract

This electronic device includes: a housing forming a side surface, which at least partially surrounds an inner space, and including a front frame that is disposed in the inner space, forms at least a portion of the side surface, and includes a sound hole for transmitting sound from outside the electronic device to the inner space and a sound conduit communicating with the sound hole; a printed circuit board supported by the front frame and including a first substrate surface, a second substrate surface opposite the first substrate surface, and an opening; a sound module disposed directly or indirectly on the first substrate surface so as to overlap the opening; and a sealing member for sealing between the front frame and the printed circuit board. The front frame includes a support area supporting the sealing member along the circumferential direction of the sealing member.

Description

An electronic device comprising a support area for supporting a sealing member

[0001] Certain embodiments relate to an electronic device comprising a support area for supporting a sealing member.

[0002] Electronic devices, including smartphones, wearable devices, tablet PCs, and the like, may include an acoustic module for generating sound or receiving sound generated from outside the electronic device. The acoustic module is mounted on a housing of the electronic device and can emit or receive sound through an acoustic hole formed in the housing. The electronic device may include a sealing member for preventing or reducing waterproofing or foreign matter ingress into the acoustic module. The housing of the electronic device may include a supporting structure to prevent or reduce damage to the sealing member during the process of directly or indirectly mounting a printed circuit board supporting the acoustic module to the housing.

[0003] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0004] In one embodiment, the electronic device may include a housing having a front surface, a rear surface opposite the front surface, and a side surface surrounding an internal space between the front surface and the rear surface, the housing including a front frame disposed in the internal space and forming at least a portion of the side surface, the front frame having an acoustic hole for transmitting sound from the outside of the electronic device to the internal space, and an acoustic conduit communicating with the acoustic hole formed therein; a printed circuit board supported by the front frame and including a first substrate surface, a second substrate surface opposite the first substrate surface, and an opening formed through the first substrate surface and the second substrate surface so as to overlap with the acoustic conduit; an acoustic module including a microphone electrically connected to the printed circuit board and directly or indirectly disposed on the first substrate surface so as to overlap with the opening; and a sealing member sealing between the front frame and the printed circuit board, transmitting sound between the acoustic conduit and the opening, and including a sealing material. The above front frame may include a support area that supports the sealing member along the circumferential direction of the sealing member.

[0005] In one embodiment, the electronic device may include a housing having a front surface, a rear surface opposite the front surface, and a side surface surrounding an internal space between the front surface and the rear surface, the housing including a front frame disposed in the internal space and forming at least a portion of the side surface, the front frame having an acoustic hole for transmitting sound from the outside of the electronic device to the internal space, and an acoustic conduit communicating with the acoustic hole formed therein; a printed circuit board supported by the front frame, the printed circuit board including a first substrate surface, a second substrate surface opposite the first substrate surface, and an opening formed through the first substrate surface and the second substrate surface so as to overlap with the acoustic conduit; an acoustic module including a microphone electrically connected to the printed circuit board and directly or indirectly disposed on the first substrate surface so as to overlap with the opening; and a sealing member sealing between the front frame and the printed circuit board, transmitting sound between the acoustic conduit and the opening, and having an inclined shape with respect to a state in which the second substrate surface is viewed, the sealing member including a sealing material. The front frame may include a support area that supports the sealing member along the circumferential direction of the sealing member. The support area may include a first support surface that is formed to be inclined with respect to the height direction of the housing from the front side of the housing toward the rear side, and a second support surface that is formed to extend from the first support surface to form a first inclination angle with the first support surface.

[0006] In one embodiment, the electronic device may include a housing having a front surface, a rear surface opposite the front surface, and a side surface surrounding an internal space between the front surface and the rear surface, the housing including a front frame disposed in the internal space and forming at least a portion of the side surface, the front frame having an acoustic hole for transmitting sound from the outside of the electronic device to the internal space, and an acoustic conduit communicating with the acoustic hole formed therein; a printed circuit board supported by the front frame, the printed circuit board including a first substrate surface, a second substrate surface opposite the first substrate surface, and an opening formed through the first substrate surface and the second substrate surface so as to overlap with the acoustic conduit; an acoustic module including a microphone electrically connected to the printed circuit board and directly or indirectly disposed on the first substrate surface so as to overlap with the opening; and a sealing member sealing between the front frame and the printed circuit board, transmitting sound between the acoustic conduit and the opening, and having an inclined shape with respect to a state in which the second substrate surface is viewed. The front frame may include a support area that supports the sealing member along a circumferential direction of the sealing member. The support area may include a first support surface formed to be inclined with respect to a height direction of the housing from the front side of the housing toward the rear side, and a second support surface formed to extend from the first support surface to form a first inclination angle with respect to the first support surface. The sealing member may include an attachment surface attached to the second substrate surface, a first sealing surface having an inclination parallel to the first support surface and directly or indirectly disposed on the first support surface, and a second sealing surface formed to extend from the first sealing surface to form a second inclination angle substantially equal to the first inclination angle with respect to the first sealing surface, having an inclination parallel to the second support surface, and directly or indirectly disposed on the second support surface.

[0007] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2 is a block diagram of an audio module of an electronic device according to one embodiment.

[0010] FIG. 3A is a front perspective view of an electronic device according to one embodiment.

[0011] FIG. 3b is a rear perspective view of an electronic device according to one embodiment.

[0012] Figure 4 is an exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 5A is a partially exploded perspective view of an electronic device illustrating a support area of ​​a front frame, a sealing member, a printed circuit board, and an acoustic module according to one embodiment.

[0014] FIG. 5b is a partial perspective view showing a state before a printed circuit board according to one embodiment is assembled to a front frame.

[0015] Figure 5c is a cross-sectional view taken along line A-A' of Figure 5b.

[0016] FIG. 5d is a partial perspective view showing another printed circuit board in one embodiment with the front frame assembled.

[0017] Figure 5e is a cross-sectional view taken along line B-B' of Figure 5d.

[0018] FIG. 5f is a cross-sectional view of a front frame, a printed circuit board, an acoustic module, and a sealing member according to one embodiment.

[0019] FIG. 6a is a perspective view illustrating a first sealing surface and a second sealing surface of a sealing member according to one embodiment.

[0020] FIG. 6b is a perspective view illustrating an attachment surface of a sealing member according to one embodiment.

[0021] Hereinafter, specific embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0022]

[0023] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a wireless power transmission / reception module (187), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may include one or more other components. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into one component (e.g., display module (160)).

[0025] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC). The wireless power transmission / reception module (187) can be configured to wirelessly transmit and receive power.

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (e.g., the external electronic devices (102 and / or 104) and the server (108)). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (104) or server (108) may be included in the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0047] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a (e.g., first) component is referred to as "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through at least a third component(s).

[0048] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC). Accordingly, each "module" in this document may include a circuit.

[0049] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., a foldable electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., the foldable electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0050] Each "processor" herein may include a processing circuit or may include multiple processors. For example, as used herein, including in the claims, the term "processor" may include various processing circuits including at least one processor, one or more of which may be individually and / or collectively configured to perform various functions described herein. When "processor," "at least one processor," and "one or more processors" are described herein as being configured to perform multiple functions, these terms include, but are not limited to, situations where one processor performs some of the recited functions and another processor performs other of the recited functions, and situations where a single processor may perform all of the recited functions. Furthermore, the at least one processor may include a combination of processors that perform various recited / disclosed functions, for example, in a distributed manner. The at least one processor may execute program instructions to achieve or perform various functions.

[0051] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0052] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0053]

[0054] FIG. 2 is a block diagram of an audio module of an electronic device according to one embodiment.

[0055] Referring to FIG. 2, the audio module (170) may include, for example, an audio input interface (210), an audio input mixer (220), an analog to digital converter (ADC) (230), an audio signal processor (240), a digital to analog converter (DAC) (250), an audio output mixer (260), or an audio output interface (270).

[0056] The audio input interface (210) can receive an audio signal corresponding to a sound acquired from outside the electronic device (201) (e.g., the electronic device (101) of FIG. 1) via a microphone (e.g., a dynamic microphone, a condenser microphone, or a piezo microphone) configured as part of the input module (150) or separately from the electronic device (201) (e.g., the electronic device (101) of FIG. 1). For example, when the audio signal is acquired from an external electronic device (e.g., the external electronic device (102) of FIG. 1) (e.g., a headset or a microphone), the audio input interface (210) can be directly connected to the external electronic device (102) via a connection terminal (178) or wirelessly (e.g., Bluetooth communication) via a wireless communication module (192) to receive the audio signal. According to one embodiment, the audio input interface (210) may receive a control signal (e.g., a volume control signal received through an input button) related to an audio signal obtained from the external electronic device (102). The audio input interface (210) may include a plurality of audio input channels, and may receive a different audio signal for each corresponding audio input channel among the plurality of audio input channels. According to one embodiment, additionally or alternatively, the audio input interface (210) may receive an audio signal from another component of the electronic device (201) (e.g., the processor (120) or the memory (130) of FIG. 1).

[0057] The audio input mixer (220) can synthesize a plurality of input audio signals into at least one audio signal. For example, according to one embodiment, the audio input mixer (220) can synthesize a plurality of analog audio signals input through the audio input interface (210) into at least one analog audio signal.

[0058] The ADC (230) can convert an analog audio signal into a digital audio signal. For example, according to one embodiment, the ADC (230) can convert an analog audio signal received through the audio input interface (210), or additionally or alternatively, an analog audio signal synthesized through the audio input mixer (220), into a digital audio signal.

[0059] The audio signal processor (240) may perform various processing on a digital audio signal input through the ADC (230) or a digital audio signal received from another component of the electronic device (201). For example, according to one embodiment, the audio signal processor (240) may change a sampling rate, apply one or more filters, perform interpolation processing, amplify or attenuate all or part of a frequency band, process noise (e.g., noise or echo reduction), change a channel (e.g., switching between mono and stereo), mix, or extract a specified signal on one or more digital audio signals. According to one embodiment, one or more functions of the audio signal processor (240) may be implemented in the form of an equalizer.

[0060] The DAC (250) can convert a digital audio signal into an analog audio signal. For example, according to one embodiment, the DAC (250) can convert a digital audio signal processed by an audio signal processor (240) or a digital audio signal obtained from another component of the electronic device (201) (e.g., a processor (120) or a memory (130)) into an analog audio signal.

[0061] The audio output mixer (260) can synthesize a plurality of audio signals to be output into at least one audio signal. For example, according to one embodiment, the audio output mixer (260) can synthesize an audio signal converted into analog through the DAC (250) and another analog audio signal (e.g., an analog audio signal received through the audio input interface (210)) into at least one analog audio signal.

[0062] The audio output interface (270) can output an analog audio signal converted by the DAC (250), or additionally or alternatively, an analog audio signal synthesized by the audio output mixer (260), to the outside of the electronic device (201) through the audio output module (155). The audio output module (155) can include, for example, a speaker such as a dynamic driver or a balanced armature driver, or a receiver. According to one embodiment, the audio output module (155) can include a plurality of speakers. In this case, the audio output interface (270) can output an audio signal having a plurality of different channels (e.g., stereo or 5.1 channels) through at least some of the speakers among the plurality of speakers. According to one embodiment, the audio output interface (270) can be directly connected to an external electronic device (102) (e.g., an external speaker or headset) through a connection terminal (178) or wirelessly through a wireless communication module (192) to output an audio signal.

[0063] According to one embodiment, the audio module (170) can generate at least one digital audio signal by synthesizing a plurality of digital audio signals using at least one function of the audio signal processor (240) without separately having an audio input mixer (220) or an audio output mixer (260).

[0064] According to one embodiment, the audio module (170) may include an audio amplifier (not shown) (e.g., a speaker amplifier circuit) capable of amplifying an analog audio signal input through an audio input interface (210) or an audio signal to be output through an audio output interface (270). According to one embodiment, the audio amplifier may be configured as a separate module from the audio module (170).

[0065]

[0066] FIG. 3a is a front perspective view of an electronic device according to one embodiment, FIG. 3b is a rear perspective view of an electronic device according to one embodiment, and FIG. 4 is an exploded perspective view of an electronic device according to one embodiment.

[0067] Referring to FIGS. 3a, 3b, and 4, an electronic device (301) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a front surface (310a) (e.g., a first surface), a rear surface (310b) (e.g., a second surface), and a side surface (311c) (e.g., a third surface) enclosing an internal space between the front surface (310a) and the rear surface (310b).

[0068] In one embodiment, the front surface (310a) may be formed by a first plate (311a) that is at least partially substantially transparent. For example, the first plate (311a) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back surface (310b) may be formed by a second plate (311b) that is substantially opaque. For example, the second plate (311b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination thereof. The side surface (311c) may be formed by a frame (320) that is directly or indirectly joined to the first plate (311a) and the second plate (311b), and may comprise a metal and / or a polymer. In one embodiment, the second plate (311b) and the frame (320) may be formed seamlessly as one body. In one embodiment, the second plate (311b) and the frame (320) may be formed of substantially the same material (e.g., aluminum).

[0069] In one embodiment, the first plate (311a) may include a plurality of first edge regions (312a-1) that are rounded from at least a portion of the front surface (310a) in a direction toward the second plate (311b) and extend in one direction (e.g., + / - Y-axis direction), a plurality of second edge regions (312a-2) that are rounded from at least a portion of the front surface (310a) in a direction toward the second plate (311b) and extend in another direction (e.g., + / - X-axis direction), and a plurality of third edge regions (312a-3) between the plurality of first edge regions (312a-1) and the plurality of second edge regions (312a-2) that are rounded from at least a portion of the front surface (310a) in a direction toward the second plate (311b).

[0070] In one embodiment, the second plate (311b) may include a plurality of fourth edge regions (312b-1) that are rounded in a direction toward the first plate (311a) from at least a portion of the rear surface (310b) and extend in one direction (e.g., + / - Y-axis direction), a plurality of fifth edge regions (312b-2) that are rounded in a direction toward the first plate (311a) from at least a portion of the rear surface (310b) and extend in another direction (e.g., + / - X-axis direction), and a plurality of sixth edge regions (312b-3) between the plurality of fourth edge regions (312b-1) and the plurality of fifth edge regions (312b-2) that are rounded in a direction toward the first plate (311a) from at least a portion of the rear surface (310b).

[0071] In one embodiment, the frame (320) may surround at least a portion of the interior space between the front (310a) and the rear (310b). The frame (320) may include a first support area (441) disposed on at least a portion of the side (311c), and a second support area (442) connected to the first support area (441) and forming a space for arranging components of the electronic device (301).

[0072] In one embodiment, the first support area (441) may connect the edges of the first plate (311a) and the second plate (311b) and surround the space between the first plate (311a) and the second plate (311b) to form a side surface (311c) of the housing (310).

[0073] In one embodiment, the second support area (442) may be disposed inside (or on the body) of the electronic device (301). The second support area (442) may be formed integrally with the first support area (441) or may be formed separately and connected to the first support area (441). In one embodiment, a printed circuit board (431, 432), such as a PCB, may be disposed in the second support area (442). The second support area (442) may be connected to, for example, a ground of the printed circuit board (431, 432).

[0074] In one embodiment, a display (361) may be positioned on one surface of the second support area (442) (e.g., the lower surface (+Z-axis direction surface) of FIG. 4), and a second plate (311b) may be positioned on the other surface of the second support area (442) (e.g., the upper surface (-Z-axis direction surface) of FIG. 4).

[0075] In one embodiment, the frame (320) may be formed at least in part from a conductive material. For example, the first support region (441) may be formed from a metal and / or a conductive polymer material. In one embodiment, the second support region (442) may be formed from a metal and / or a conductive polymer material, similar to the first support region (441).

[0076] In one embodiment, the frame (320) may be formed with an acoustic conduit (e.g., an acoustic conduit (521) of FIG. 5c) for transmitting sound between the outside and inside of the housing (310). In one embodiment, the acoustic conduit formed in the frame (320) may be connected to an external acoustic hole (313, 315, 355) of the electronic device (301). In one embodiment, sound from outside the electronic device (301) may be transmitted to an internal space, for example, a microphone of an acoustic module (440) (e.g., a microphone disposed in an acoustic module (540) of FIG. 5c)) through the acoustic hole (313) and the acoustic conduit.

[0077] In one embodiment, the electronic device (301) may include a display (361) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (361) may be positioned on the front surface (310a). In one embodiment, the display (361) may be exposed through at least a portion of the first plate (311a) (e.g., a plurality of first edge regions (312a-1), a plurality of second edge regions (312a-2), and a plurality of third edge regions (312a-3)).

[0078] In one embodiment, the edge of the display (361) may substantially coincide with the outer rim of the first plate (311a). In one embodiment, the display (361) may include a touch sensing circuit, a pressure sensor capable of sensing the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0079] In one embodiment, the display (361) may include a screen display area (361a) that is visually exposed and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (361a) may include a sensing area (361a-1) and a camera area (361a-2). In this case, the sensing area (361a-1) may overlap with at least a portion of the screen display area (361a). The sensing area (361a-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1). The sensing area (361a-1) may display content similarly to a screen display area (361a) that does not overlap the sensing area (361a-1). For example, the sensing area (361a-1) may display content while the sensor module (376) is not operating. The camera area (361a-2) may overlap with at least a portion of the screen display area (361a).

[0080] In one embodiment, the electronic device (301) may include an audio module (440) (e.g., the audio module (170) of FIG. 1). The audio module (440) may obtain sound from the outside of the electronic device (301). For example, the audio module (440) may be located in the internal space of the housing (310). In one embodiment, the audio module (440) may obtain sound through at least one audio hole (313).

[0081] In one embodiment, the electronic device (301) may include a sensor module (376). The sensor module (376) may sense a signal applied to the electronic device (301). The sensor module (376) may be located, for example, on the front surface (310a) of the electronic device (301). The sensor module (376) may form a sensing area (361a-1) in at least a portion of the screen display area (361a). The sensor module (376) may receive an input signal passing through the sensing area (361a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include a signal related to a user's biometric information (e.g., the user's fingerprint, voice, etc.).

[0082] In one embodiment, the electronic device (301) may include a camera module (380a, 380b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (380a, 380b) may include a first camera module (380a), a second camera module (380b), and a flash (380c). In one embodiment, the first camera module (380a) may be positioned to be exposed through the front side (310a) of the housing (310), and the second camera module (380b) and the flash (380c) may be positioned to be exposed through the back side (310b) of the housing (310). In one embodiment, at least a portion of the first camera module (380a) may be positioned in the housing (310) so as to be covered through the display (361). In one embodiment, the first camera module (380a) may receive an optical signal passing through the camera area (361a-2). In one embodiment, the second camera module (380b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (380c) may include a light-emitting diode or a xenon lamp.

[0083] In one embodiment, the electronic device (301) may include an external sound hole (315, 355). The external sound hole (315, 355) may output sound to the outside of the electronic device (301), and the electronic device (301) may include a plurality of external sound holes (315, 355). In one embodiment, the electronic device (301) may include an sound hole (313) through which sound from outside the electronic device (301) may be input into the inside.

[0084] For example, the first external sound hole (315) may be formed adjacent to a side surface (311c) in one direction (e.g., +Y direction) of the housing (310), and specifically, may be formed adjacent to a camera area (361a-2) of the first camera module (380a) or the display (361). The second external sound hole (355) may be at least one hole formed on a side surface (311c) in one direction (e.g., -Y direction) of the housing (310). The electronic device (301) may output three-dimensional sound to the outside of the electronic device (301) through the first external sound hole (315) and the second external sound hole (355).

[0085] In one embodiment, an engraved area of ​​a first external sound hole (315) may be provided on the outer edge of the first plate (311a), and the first plate (311a) and the display (361) may be directly or indirectly coupled, and the engraved area may be implemented as the first external sound hole (315).

[0086] According to one embodiment, the electronic device (301) may output sound directly to the outside through the sound hole (362) without including the first external sound hole (315). The display (361) of one embodiment may include a notch structure in which the sound hole (362) and the first camera module (380a) are located.

[0087] In one embodiment, the electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may receive a user's manipulation signal. The input module (350) may include, for example, at least one key input device that is positioned so as to be exposed on a side surface (311c) of the housing (310).

[0088] In one embodiment, the electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (378) may be disposed on a side surface (311c). For example, when the electronic device (301) is viewed in one direction (e.g., the +Y axis direction of FIG. 3a), the connection terminal (378) may be disposed in the center of the side surface (311c), and an external sound hole (355) may be disposed in one direction (e.g., the right direction) based on the connection terminal (378).

[0089] In one embodiment, the electronic device (301) may include one or more printed circuit boards (431, 432) and a battery (489) (e.g., battery (189) of FIG. 1). In one embodiment, the printed circuit boards (431, 432) may include a first printed circuit board (431) and a second printed circuit board (432). In this case, the first printed circuit board (431) may be accommodated in a first substrate slot (442a) of a second support area (442), and the second printed circuit board (432) may be accommodated in a second substrate slot (442b) of a second support area (442). In one embodiment, the battery (489) may be accommodated in the battery slot (445) of the second support area (442) formed between the first substrate slot (442a) and the second substrate slot (442b).

[0090] In one embodiment, an electrical circuit for transmitting an electrical signal may be formed on the printed circuit board (431, 432). In one embodiment, one or more electrical components for achieving a function of the electronic device (301) may be arranged (e.g., mounted) on the surface of the printed circuit board (431, 432). For example, the electrical components may be components for performing a function within the electronic device (301), such as an application processor (AP), a graphics processing unit (GPU), or a power management IC (PMIC). In one embodiment, an opening (433) that is partially open to penetrate the surface may be formed on the second printed circuit board (432). In one embodiment, an acoustic module (440) for performing an acoustic function may be arranged on the printed circuit board (431, 432).

[0091] In one embodiment, a processor (e.g., a processor (120) of FIG. 1) may be disposed on the printed circuit board (431, 432). The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on the printed circuit board (431, 432). The wireless communication circuit may communicate with, for example, an external device (e.g., an electronic device (104) of FIG. 1). The electronic device (301) may include an antenna structure (e.g., an antenna module (197) of FIG. 1), and the wireless communication circuit may be electrically connected to the antenna structure. In one embodiment, the wireless communication circuit may generate a signal to be transmitted through the antenna structure or detect a signal received through the antenna structure. In one embodiment, the printed circuit board (431, 432) includes a ground, and the ground of the printed circuit board (431, 432) can function as a ground of an antenna structure implemented using a wireless communication circuit.

[0092] In one embodiment, the electronic device (301) may include an acoustic module (440) including one or more microphones. In one embodiment, the acoustic module (440) may generate an electrical signal according to an externally transmitted sound. In another embodiment, the acoustic module (440) may include a speaker and may generate a sound according to an electrical signal. In one embodiment, an acoustic module (440) including a microphone and an acoustic module (440) including a speaker may be individually provided within the electronic device (301). In one embodiment, one acoustic module (440) may include both a microphone and a speaker. Hereinafter, a description will be given assuming that the acoustic module (440) includes a microphone, but the embodiments of the disclosure are not limited thereto. In one embodiment, the acoustic module (440) may be directly or indirectly electrically connected to the second printed circuit board (432) and may generate an electrical signal according to a sound received through the microphone. The second printed circuit board (432) may be formed with an opening (433) that is open to penetrate at least a portion of the surface to allow sound to travel between the microphone of the acoustic module (440) and the acoustic pipe (e.g., the acoustic pipe (521) of FIG. 5C). In one embodiment, the acoustic module (440) may be arranged on the second printed circuit board (432) such that the microphone is positioned in the opening (433) of the second printed circuit board (432). In one embodiment, sound waves that enter the acoustic pipe from outside the electronic device (301) through the acoustic hole (313) may pass through the opening (433) of the second printed circuit board (432) and be input to the microphone of the acoustic module (440).

[0093] In one embodiment, the electronic device (301) may include a sealing member (450) including a sealing material. In one embodiment, the sealing member (450) may seal a gap between the frame (320) and the second printed circuit board (432) to prevent or reduce sound leak. In one embodiment, the sealing member (450) may be disposed on the second printed circuit board (432) opposite to the acoustic module (440). In one embodiment, the sealing member (450) may be directly or indirectly disposed on the second printed circuit board (432) so as to overlap the acoustic module (440) and the opening (433) of the second printed circuit board (432) with respect to the height direction of the electronic device (301) (e.g., the Z-axis direction of FIG. 4).

[0094]

[0095] FIG. 5A is a partial exploded perspective view of an electronic device for illustrating a support area of ​​a front frame, a sealing member including a sealing material, a printed circuit board, and an acoustic module according to one embodiment, FIG. 5B is a partial perspective view illustrating a state before the printed circuit board according to one embodiment is assembled to the front frame, FIG. 5C is a cross-sectional view taken along line A-A' of FIG. 5B, FIG. 5D is a partial perspective view illustrating a state in which another printed circuit board according to one embodiment is assembled to the front frame, FIG. 5E is a cross-sectional view taken along line B-B' of FIG. 5D, and FIG. 5F is a cross-sectional view of the front frame, the printed circuit board, the acoustic module, and the sealing member according to one embodiment.

[0096] Referring to FIGS. 5A to 5F, an electronic device (501) according to an embodiment (e.g., the electronic device (301) of FIG. 3A) may include a housing (510) (e.g., the housing (310) of FIG. 3A) including a front frame (520) (e.g., the frame (320) of FIG. 4) in which an acoustic conduit (521) is formed, a printed circuit board (532) (e.g., the second printed circuit board (432) of FIG. 4)) disposed in an internal space (511) of the housing (510), an acoustic module (540) electrically connected to the printed circuit board (532) (e.g., the acoustic module (440) of FIG. 4), and a sealing member (550) (e.g., the sealing member (450) of FIG. 4) disposed between the front frame (520) and the printed circuit board (532).

[0097] In one embodiment, the housing (510) may form the exterior of the electronic device (501). In one embodiment, the housing (510) may form an interior space (511). In one embodiment, an acoustic hole (e.g., an acoustic hole (313) of FIG. 3A) may be formed on the exterior surface of the housing (510). For example, the acoustic hole may be formed on a side surface (511c) of the housing (510). In one embodiment, a display (e.g., a display (361) of FIG. 3A) may be arranged on the front surface of the housing (510) (e.g., the front surface (310a) of FIG. 3A). In one embodiment, a front frame (520) in which an acoustic conduit (521) is formed may be arranged on the interior space (511) of the housing (510).

[0098] In one embodiment, the front frame (520) may be disposed in the interior space (511) of the housing (510). For example, the front frame (520) may surround at least a portion of the interior space (511) between the front (e.g., the front (310a) of FIG. 3A) and the rear (e.g., the rear (310b) of FIG. 3B) of the housing (510). For example, at least a portion of the front frame (520) may be provided to be close to a side surface (511c) of the housing (510) where an acoustic hole is formed. In one embodiment, the front frame (520) may be formed separately from the housing (510), but may also be formed integrally with the housing (510). For example, the front frame (520) may form at least a portion of the side surface (511c) of the housing (510).

[0099] In one embodiment, an acoustic conduit (521) for sound to travel may be formed in the front frame (520). In one embodiment, the acoustic conduit (521) may be formed to penetrate the interior of the front frame (520) and may function as a path for sound to travel. In one embodiment, based on the path formed by the acoustic conduit (521), one end of the acoustic conduit (521) may be connected to an acoustic hole formed in the housing (510). In one embodiment, the acoustic conduit (521) may include an open area (521a) formed in the front frame (520) so as to be open in the internal space (511) of the housing (510). In one embodiment, the open area (521a) may be formed to be open toward an acoustic module (540) described below.

[0100] In one embodiment, the front frame (520) may include an open area (521a). For example, the open area (521a) may be formed in a support area (522) of the front frame (520). In one embodiment, the open area (521a) may be formed to be open in a direction (e.g., in the -Z-axis direction) toward the second substrate surface (532b) of the printed circuit board (532). For example, the support area (522) may be connected to the acoustic pipe (521) through the open area (521a).

[0101] In one embodiment, the front frame (520) may include a support area (522). In one embodiment, a sealing member (550) may be arranged in the support area (522). In one embodiment, the support area (522) of the front frame (520) may support at least a portion of the sealing member (550), thereby fixing the position of the sealing member (550) within the electronic device (501). In one embodiment, the support area (522) may be formed in a recess shape on a surface of the front frame (520) (e.g., a surface facing the -Z direction). For example, the support area (522) may be formed to be inclined with respect to a height direction of the housing (510) (e.g., the +Z axis direction) from the front to the rear of the housing (510).

[0102] In one embodiment, the support area (522) may include a first support surface (522a) formed to be inclined with respect to the height direction (e.g., Z-axis direction) of the housing (510) and a second support surface (522b) formed to extend and form a first inclination angle (A1) with respect to the first support surface (522a). In one embodiment, the first support surface (522a) and the second support surface (522b) may support a sealing member (550) including a sealing material.

[0103] In one embodiment, the first support surface (522a) may be formed to be inclined with respect to the height direction (e.g., Z-axis direction) of the housing (510) from the front to the rear of the housing (510). In one embodiment, the first support surface (522a) may support the acoustic module (540), the printed circuit board (532), and the sealing member (550) arranged on the first support surface (522a) in a first support direction (D1) perpendicular to the first support surface (522a).

[0104] In one embodiment, the second support surface (522b) may be formed to extend from the first support surface (522a) and may be formed to be inclined with respect to the height direction (e.g., Z-axis direction) of the housing (510). In one embodiment, the second support surface (522b) may be formed to form a first inclination angle (A1) with respect to the first support surface (522a). In one embodiment, the second support surface (522b) may support an acoustic module (540), a printed circuit board (532), and a sealing member (550) disposed on the second support surface (522b) in a second support direction (D2) perpendicular to the second support surface (522b).

[0105] In one embodiment, the load of the printed circuit board (532) and the acoustic module (540) may be distributed and applied to the first support surface (522a) and the second support surface (522b) of the front frame (520) through the inclination formed by the first sealing surface (550a) and the second sealing surface (550b) and the inclination formed by the first support surface (522a) and the second support surface (522b) of the front frame (520). For example, the first support direction (D1) of the first support surface (522a) and the second support direction (D2) of the second support surface (522b) may not be parallel. In one embodiment, the first support surface (522a) and the second support surface (522b) are formed so that their respective support directions are not parallel, thereby evenly supporting the loads of the acoustic module (540), the printed circuit board (532), and the sealing member (550), thereby improving the stability of the structure.

[0106] In one embodiment, the printed circuit board (532) may be disposed in the internal space (511) of the housing (510). In one embodiment, the printed circuit board (532) may be disposed opposite the display (e.g., the display (361) of FIG. 3A) with the front frame (520) interposed therebetween. In one embodiment, the printed circuit board (532) may be assembled to the front frame (520) in an inclined direction (e.g., the inclined direction of the printed circuit board (532) of FIG. 5B) with respect to the height direction (e.g., the Z-axis direction) of the front frame (520) to prevent or reduce foreign substances from entering the acoustic module (540). In one embodiment, in the process of assembling the printed circuit board (532) to the front frame (520) in an inclined direction, the printed circuit board (532) may be mounted on the front frame (520) so as to be horizontal with respect to the longitudinal direction (e.g., Y-axis direction) of the front frame (520) by the inclined structure of each of the sealing member (550) and the front frame (520) described below (e.g., the inclined structure formed by the first support surface (522a) and the second support surface (522b) of the front frame (520), and the inclined structure formed by the first sealing surface (550a) and the second sealing surface (550b) of the sealing member (550).

[0107] In one embodiment, the printed circuit board (532) may include a first substrate surface (532a) and a second substrate surface (532b) opposite the first substrate surface (532a). In one embodiment, the printed circuit board (532) may be secured to the front frame (520) such that the second substrate surface (532b) contacts at least a portion of a surface of the front frame (520). In one embodiment, the printed circuit board (532) may include an opening (533) that is at least partially open to penetrate the surface of the printed circuit board (532). In one embodiment, the opening (533) of the printed circuit board (532) may overlap at least a portion of the sound conduit (521), for example, an open area (521a) of the sound conduit (521), with respect to the central axis (C) (e.g., in the Z-axis direction) perpendicular to the second substrate surface (532b). In one embodiment, sound input to the sound conduit (521) may pass through the opening (533) via the open area (521a).

[0108] In one embodiment, the acoustic module (540) can receive sound introduced from the outside of the electronic device (501) into the internal space (511) of the electronic device (501). In one embodiment, the acoustic module (540) can include at least one microphone for receiving sound. In one embodiment, the acoustic module (540) can be disposed on a printed circuit board (532). For example, the acoustic module (540) can be mounted on a surface of the printed circuit board (532) and electrically connected to an electrical circuit formed on the printed circuit board (532). In one embodiment, the acoustic module (540) can be disposed on a first substrate surface (532a) of the printed circuit board (532). For example, the sound module (540) may be placed on the first substrate surface (532a) of the printed circuit board (532) so as to overlap with the opening (533) of the printed circuit board (532) with respect to the central axis (C) perpendicular to the first substrate surface (532a) of the printed circuit board (532).

[0109] In one embodiment, when the printed circuit board (532) is connected to the front frame (520), the acoustic module (540) may face the front frame (520). In one embodiment, the microphone of the acoustic module (540), the opening (533) of the printed circuit board (532), and the open area (521a) of the acoustic conduit (521) may overlap each other with respect to a central axis (C) perpendicular to the first substrate surface (532a) of the printed circuit board (532). In one embodiment, sound input from the outside of the electronic device (501) to the acoustic conduit (521) may be transmitted to the microphone of the acoustic module (540) through the opening (533) of the printed circuit board (532). For example, a sound transmission path can be formed from the outside of the electronic device (501) to the microphone of the sound module (540) through the sound hole, the sound pipe (521), and the opening (533) of the printed circuit board (532). The microphone of the sound module (540) can receive sound transmitted from the outside through the sound pipe (521).

[0110] In one embodiment, the sealing member (550) is disposed between the printed circuit board (532) and the front frame (520), and can transmit sound transmitted from the sound conduit (521) to the microphone. In one embodiment, the sealing member (550) may include a vibration membrane (553) for transmitting vibration generated by sound. In one embodiment, the sealing member (550) may be formed with a through hole (552) that communicates with the opening (533) of the front frame (520). In one embodiment, the vibration membrane (553) of the sealing member (550) vibrates by sound waves (e.g., sound waves) input through the sound conduit (521), and can transmit sound waves generated by the vibration to the sound module (540). The vibration membrane (553) may cover the opening (533) of the printed circuit board (532). In one embodiment, the vibration membrane (553) may be an acoustic membrane. In one embodiment, the vibration membrane (553) may prevent or reduce malfunction of the microphone of the acoustic module (540) due to dust and water ingress. In one embodiment, the vibration membrane (553) may include a material that allows gases such as air or sound to pass through, but does not allow liquids or dust to pass through. For example, the vibration membrane (553) may include at least one material among polytetrafluoroethylene (PTFE), expanded PTFE (ePTFE), and polyvinylidene fluoride (PVDF). However, this is only one example, and the material of the vibration membrane (553) may include various materials according to the embodiment.

[0111] In one embodiment, the sealing member (550) may overlap the open area (521a) of the sound pipe (521) and the opening (533) of the printed circuit board (532) with respect to the central axis (C) perpendicular to the first substrate surface (532a) of the printed circuit board (532). In one embodiment, the sealing member (550) may seal the gap formed between the front frame (520) and the printed circuit board (532) along the perimeter of the open area (521a) of the sound pipe (521) and the opening (533) of the printed circuit board (532), thereby preventing or reducing the occurrence of sound leak during the sound transmission process. The sealing member (550) can prevent or reduce foreign substances including moisture from entering the open area (521a) of the sound pipe (521) and the opening (533) of the printed circuit board (532).

[0112] In one embodiment, the sealing member (550) may be secured to the support area (522) of the front frame (520). In one embodiment, when the sealing member (550) is secured to the support area (522) of the front frame (520), at least a portion of an edge of the sealing member (550) may be supported by the support area (522). In one embodiment, at least a portion of the sealing member (550) may include a compressible material. For example, the sealing member (550) may be formed of at least one material among rubber and silicone. In one embodiment, the sealing member (550) may seal a gap between the front frame (520) and the printed circuit board (532) while being compressed in the thickness direction (e.g., the Z-axis direction) of the sealing member (550) during the process of fixing the printed circuit board (532) to the front frame (520). In one embodiment, the sealing member (550) is formed to have a compression thickness that substantially corresponds to the gap between the printed circuit board (532) and the front frame (520) close to the opening (533) based on the state in which the printed circuit board (532) is fixed to the front frame (520), thereby ensuring ease of assembly of the front frame (520) and the printed circuit board (532).

[0113] In one embodiment, the sealing member (550) may have an inclined shape based on a state in which the second substrate surface (532b) of the printed circuit board (532) is viewed. In one embodiment, the sealing member (550) may include an attachment surface (550c) attached to the printed circuit board (532), a first sealing surface (550a) disposed on the front frame (520), and a second sealing surface (550b). In one embodiment, the attachment surface (550c) of the sealing member (550) may be attached to the second substrate surface (532b) of the printed circuit board (532). In one embodiment, an adhesive member (e.g., double-sided tape) for attachment to the second substrate surface (532b) may be disposed on the attachment surface (550c) of the sealing member (550). In one embodiment, the attachment surface (550c) of the sealing member (550) may be formed of a material having high adhesive strength or frictional strength to prevent or reduce the sealing member (550) from being detached from the printed circuit board (532). For example, the attachment surface (550c) of the sealing member (550) may be formed of a waterproof mesh material.

[0114] In one embodiment, the first sealing surface (550a) of the sealing member (550) may be directly or indirectly disposed on the first support surface (522a) of the front frame (520). In one embodiment, the first sealing surface (550a) and the second sealing surface (550b) of the sealing member (550) may each be formed to be inclined with respect to the thickness direction (e.g., Z-axis direction) of the sealing member (550). In one embodiment, the second sealing surface (550b) of the sealing member (550) may be formed to extend from the first sealing surface (550a). In one embodiment, the second sealing surface (550b) may be formed to form a second inclination angle (A2) with the first sealing surface (550a). In one embodiment, the second sealing surface (550b) of the sealing member (550) may be directly or indirectly disposed on the second support surface (522b) of the front frame (520). In one embodiment, the first sealing surface (550a) and the second sealing surface (550b) may be formed to have an incline parallel to the first support surface (522a) and the second support surface (522b) of the front frame (520), respectively. For example, the second incline angle (A2) formed by the first sealing surface (550a) and the second sealing surface (550b) and the first incline angle (A1) formed by the first support surface (522a) and the second support surface (522b) may be substantially the same. In one embodiment, since the inclined structures formed on the sealing member (550) and the front frame (520) each have corresponding shapes, the front frame (520) can support the sealing member (550) so as to surround at least a portion of the sealing member (550). In one embodiment, when the printed circuit board (532) is assembled in an inclined direction with respect to the front frame (520), the first sealing surface (550a) of the sealing member (550) attached to the second substrate surface (532b) of the printed circuit board (532) is connected to the first support surface (522a) of the front frame (520), so that the printed circuit board (532) can be directly or indirectly mounted on the front frame (520).In one embodiment, the second sealing surface (550b) of the sealing member (550) is directly or indirectly disposed on the second support surface (522b) of the front frame (520), and the second sealing surface (550b) is supported by the second support surface (522b), so that the printed circuit board (532) can be prevented or reduced from being pushed in a direction opposite to the entry direction (e.g., a direction substantially parallel to the -Y-axis direction) with respect to the front frame (520) (e.g., a direction substantially parallel to the -Y-axis direction).

[0115] Referring to FIG. 5F, in one embodiment, a guide portion (534) and a protrusion portion (551) may be formed on the printed circuit board (532) and the sealing member (550), respectively. In one embodiment, the protrusion portion (551) of the sealing member (550) may be formed to protrude in a direction from the first sealing surface (550a) or the second sealing surface (550b) toward the second substrate surface (532b) of the printed circuit board (532). In one embodiment, the protrusion portion (551) of the sealing member (550) may fit into the printed circuit board (532), thereby preventing or reducing the sealing member (550) from being separated from the printed circuit board (532) and fixing the position of the sealing member (550) with respect to the printed circuit board (532). In one embodiment, a guide portion (534) for accommodating a protrusion (551) of a sealing member (550) may be formed on the printed circuit board (532). In one embodiment, the guide portion (534) of the printed circuit board (532) may include an accommodation space (534a) and a mounting portion (534b). In one embodiment, the accommodation space (534a) of the guide portion (534) may be formed to penetrate at least a portion of the printed circuit board (532) in a direction from the second substrate surface (532b) of the printed circuit board (532) toward the first substrate surface (532a) (e.g., the -Z-axis direction in FIG. 5f). In one embodiment, the mounting portion (534b) of the guide portion (534) is located within the receiving space (534a) of the guide portion (534), and the protrusion (551) of the sealing member (550) can be directly or indirectly mounted on the mounting portion (534b). In one embodiment, the protrusion (551) of the sealing member (550) can pass through the second substrate surface (532b) of the printed circuit board (532) through the receiving space (534a) formed in the printed circuit board (532) and be directly or indirectly mounted on the mounting portion (534b) of the guide portion (534).

[0116]

[0117] FIG. 6a is a perspective view illustrating a first sealing surface and a second sealing surface of a sealing member according to one embodiment, and FIG. 6b is a perspective view illustrating an attachment surface of a sealing member according to one embodiment.

[0118] Referring to FIGS. 6A and 6B, in one embodiment, a sealing member (650) (e.g., sealing member (550) of FIG. 5A) may include a first sealing surface (650a) (e.g., first sealing surface (550a) of FIG. 5C) and a second sealing surface (650b) (e.g., second sealing surface (550b) of FIG. 5C) formed to be inclined with respect to the thickness direction (e.g., Z-axis direction) of the sealing member (650), and an attachment surface (650c) (e.g., attachment surface (550c) of FIG. 5C) for attachment to a printed circuit board (e.g., printed circuit board (532) of FIG. 5A).

[0119] Each embodiment of this document may be used in combination with other embodiment(s) described in this document.

[0120] In one embodiment, a protruding portion (654) may be formed on the first sealing surface (650a) of the sealing member (650). In one embodiment, the protruding portion (654) may be formed along at least a portion of the circumferential direction of the first sealing surface (650a), and may be formed to protrude in a direction (e.g., +Z-axis direction) toward the first support surface (e.g., the first support surface (522a) of FIG. 5e) of the front frame (e.g., the front frame (520) of FIG. 5e) from the first sealing surface (650a). In one embodiment, the protruding portion (654) of the sealing member (650) may be formed of a different material from the first sealing surface (650a). For example, the protruding portion (654) may be formed by embossing. In one embodiment, the protruding portion (654) can prevent or reduce damage to the sealing member (650) during the process of the printed circuit board being mounted on the front frame. In one embodiment, the protruding portion (654) of the sealing member (650) overlaps with the front frame while the printed circuit board is mounted on the front frame, sealing the gap between the sealing member and the front frame and performing a waterproofing and / or dustproofing function from the outside.

[0121] In one embodiment, a through hole (652) may be formed in the sealing member (650). In one embodiment, the through hole (652) may be formed by penetrating at least a portion of the sealing member (650) along the thickness direction of the sealing member (650) (e.g., the Z-axis direction). For example, the through hole (652) of the sealing member (650) may be formed by penetrating from the first sealing surface (650a) and the second sealing surface (650b) of the sealing member (650) to the vibrating membrane (e.g., the vibrating membrane (553) of FIG. 5C) of the sealing member (650). In one embodiment, the through hole (652) may serve as an acoustic path that allows sound introduced into the sealing member (650) from the acoustic conduit to travel to the acoustic module via the vibrating membrane.

[0122]

[0123] In one embodiment, the electronic device (101; 201; 301; 501) comprises a housing (310; 510) that forms a front surface (310a), a rear surface (310b) opposite to the front surface (310a), and a side surface (311c; 511c) that surrounds an internal space (511) between the front surface (310a) and the rear surface (310b), and a front frame (320; 520) that is disposed in the internal space (511) and forms at least a portion of the side surface (311c; 511c), and in which an acoustic hole (313; 315; 355) for transmitting sound from the outside of the electronic device (101; 201; 301; 501) to the internal space (511) and an acoustic conduit (521) that is connected to the acoustic hole (313; 315; 355) are formed. A housing (310; 510); a printed circuit board (432; 532) supported by the front frame (320; 520) and including a first substrate surface (532a) and a second substrate surface (532b) opposite to the first substrate surface (532a) and an opening (533) formed through the first substrate surface (532a) and the second substrate surface (532b) so as to overlap with the acoustic conduit (521); an acoustic module (440; 540) including a microphone electrically connected to the printed circuit board (432; 532) and directly or indirectly disposed on the first substrate surface (532a) so as to overlap with the opening (533); And it includes a sealing member (450; 550; 650) that seals between the front frame (320; 520) and the printed circuit board (432; 532) and transmits sound between the sound conduit (521) and the opening (533), and the front frame (320; 520) may include a support area (522) that supports the sealing member (450; 550; 650) along the circumferential direction of the sealing member (450; 550; 650).

[0124] In one embodiment, the support area (522) includes a first support surface (522a) that is formed to be inclined with respect to the height direction of the housing (310; 510) from the front surface (310a) of the housing (310; 510) toward the rear surface (310b); and a second support surface (522b) that is formed to extend from the first support surface (522a) to form a first inclination angle (A1) with the first support surface (522a), and the sealing member (450; 550; 650) can be mounted on the first support surface (522a) and the second support surface (522b).

[0125] In one embodiment, the support area (522) can support the sealing member (450; 550; 650) directly or indirectly disposed on the first support surface (522a) in a first support direction (D1) perpendicular to the first support surface (522a), and can support the sealing member (450; 550; 650) directly or indirectly disposed on the second support surface (522b) in a second support direction (D2) perpendicular to the second support surface (522b).

[0126] In one embodiment, the first support direction (D1) and the second support direction (D2) may be non-parallel to each other.

[0127] In one embodiment, the sealing member (450; 550; 650) may include an attachment surface (550c; 650c) attached to the second substrate surface (532b); a first sealing surface (550a; 650a) directly or indirectly disposed on the first support surface (522a); and a second sealing surface (550b; 650b) extending from the first sealing surface (550a; 650a) to form a second inclination angle (A2) with the first sealing surface (550a; 650a) and directly or indirectly disposed on the second support surface (522b).

[0128] In one embodiment, the first sealing surface (550a; 650a) may have an incline parallel to the first support surface (522a), and the second sealing surface (550b; 650b) may have an incline parallel to the second support surface (522b).

[0129] In one embodiment, the first inclination angle (A1) and the second inclination angle (A2) may be substantially equal.

[0130] In one embodiment, the sealing member (450; 550; 650) may further include a protruding portion (654) formed along the circumferential direction of at least a portion of the first sealing surface (550a; 650a) and protruding from the first sealing surface (550a; 650a) toward the first support surface (522a).

[0131] In one embodiment, the front frame (320; 520) has a longitudinal direction, and the printed circuit board (432; 532) can be substantially horizontal to the longitudinal direction of the front frame (320; 520) based on the state in which the sealing member (450; 550; 650) is mounted on the front frame (320; 520).

[0132] In one embodiment, the front frame (320; 520) includes an open area (521a) that is formed to be open in a direction toward the second substrate surface (532b) of the printed circuit board (432; 532), and the sound pipe (521) can communicate with the opening (533) through the open area (521a).

[0133] In one embodiment, the sealing member (450; 550; 650) may further include a through hole (552; 652) formed through the thickness direction of the sealing member (450; 550; 650) and overlapping with the opening (533) when looking at the first substrate surface (532a).

[0134] In one embodiment, the printed circuit board (432; 532) further includes a guide portion (534) to prevent or reduce detachment of the sealing member (450; 550; 650), and the sealing member (450; 550; 650) may include a protrusion (551) to be fitted into the guide portion (534).

[0135] In one embodiment, the guide portion (534) includes an accommodation space (534a) that is formed at least partially through the second substrate surface (532b) toward the first substrate surface (532a) and a mounting portion (534b) on which the protrusion (551) is mounted, and the protrusion (551) can pass through the second substrate surface (532b) through the accommodation space (534a) and be mounted on the mounting portion (534b).

[0136] In one embodiment, the sealing member (450; 550; 650) may include a vibration membrane (553) that covers the opening (533) and has sound transmission, waterproofing, and dustproofing functions.

[0137] In one embodiment, the sealing member (450; 550; 650) may include at least one of a rubber material and a silicone material.

[0138] In one embodiment, the electronic device (101; 201; 301; 501) comprises a housing (310; 510) that forms a front surface (310a), a rear surface (310b) opposite to the front surface (310a), and a side surface (311c; 511c) that surrounds an internal space (511) between the front surface (310a) and the rear surface (310b), and a front frame (320; 520) that is disposed in the internal space (511) and forms at least a portion of the side surface (311c; 511c), and in which an acoustic hole (313; 315; 355) for transmitting sound from the outside of the electronic device (101; 201; 301; 501) to the internal space (511) and an acoustic conduit (521) that is connected to the acoustic hole (313; 315; 355) are formed. A housing (310; 510); a printed circuit board (432; 532) supported by the front frame (320; 520) and including a first substrate surface (532a) and a second substrate surface (532b) opposite to the first substrate surface (532a) and an opening (533) formed through the first substrate surface (532a) and the second substrate surface (532b) so as to overlap with the acoustic conduit (521); an acoustic module (440; 540) including a microphone electrically connected to the printed circuit board (432; 532) and directly or indirectly disposed on the first substrate surface (532a) so as to overlap with the opening (533); And a sealing member (450; 550; 650) that seals between the front frame (320; 520) and the printed circuit board (432; 532), transmits sound between the sound conduit (521) and the opening (533), and has an inclined shape based on a state in which the second substrate surface (532b) is viewed, and the front frame (320; 520) includes a support area (522) that supports the sealing member (450; 550; 650) along the circumferential direction of the sealing member (450; 550; 650), and the support area (522) is formed from the front side (310a) of the housing (310; 510) toward the rear side (310b).It may include a first support surface (522a) formed to be inclined with respect to the height direction of the first support surface (510); and a second support surface (522b) formed to extend from the first support surface (522a) to form a first inclined angle (A1) with the first support surface (522a).

[0139] In one embodiment, based on the state in which the load of the printed circuit board (432; 532) and the acoustic module (440; 540) acts on the front frame (320; 520), the load of the printed circuit board (432; 532) and the acoustic module (440; 540) may be distributed and act on the first support surface (522a) and the second support surface (522b), respectively.

[0140] In one embodiment, the sealing member (450; 550; 650) may include an attachment surface (550c; 650c) attached to the second substrate surface (532b); a first sealing surface (550a; 650a) directly or indirectly disposed on the first support surface (522a); and a second sealing surface (550b; 650b) extending from the first sealing surface (550a; 650a) to form a second inclination angle (A2) with the first sealing surface (550a; 650a) and directly or indirectly disposed on the second support surface (522b).

[0141] In one embodiment, the slope formed by the first sealing surface (550a; 650a) and the second sealing surface (550b; 650b) may have a shape corresponding to the slope formed by the first support surface (522a) and the second support surface (522b).

[0142] In one embodiment, the electronic device (101; 201; 301; 501) comprises a housing (310; 510) that forms a front surface (310a), a rear surface (310b) opposite to the front surface (310a), and a side surface (311c; 511c) that surrounds an internal space (511) between the front surface (310a) and the rear surface (310b), and a front frame (320; 520) that is disposed in the internal space (511) and forms at least a portion of the side surface (311c; 511c), and in which an acoustic hole (313; 315; 355) for transmitting sound from the outside of the electronic device (101; 201; 301; 501) to the internal space (511) and an acoustic conduit (521) that is connected to the acoustic hole (313; 315; 355) are formed. A housing (310; 510); a printed circuit board (432; 532) supported by the front frame (320; 520) and including a first substrate surface (532a) and a second substrate surface (532b) opposite to the first substrate surface (532a) and an opening (533) formed through the first substrate surface (532a) and the second substrate surface (532b) so as to overlap with the acoustic conduit (521); an acoustic module (440; 540) including a microphone electrically connected to the printed circuit board (432; 532) and directly or indirectly disposed on the first substrate surface (532a) so as to overlap with the opening (533); And a sealing member (450; 550; 650) that seals between the front frame (320; 520) and the printed circuit board (432; 532), transmits sound between the sound conduit (521) and the opening (533), and has an inclined shape based on a state in which the second substrate surface (532b) is viewed, and the front frame (320; 520) includes a support area (522) that supports the sealing member (450; 550; 650) along the circumferential direction of the sealing member (450; 550; 650), and the support area (522) is formed from the front side (310a) of the housing (310; 510) toward the rear side (310b).A first support surface (522a) formed to be inclined with respect to the height direction of the first support surface (510); and a second support surface (522b) formed to extend from the first support surface (522a) to form a first inclined angle (A1) with the first support surface (522a), wherein the sealing member (450; 550; 650) comprises: an attachment surface (550c; 650c) attached to the second substrate surface (532b); a first sealing surface (550a; 650a) having an incline parallel to the first support surface (522a) and directly or indirectly disposed on the first support surface (522a); And it may include a second sealing surface (550b; 650b) that is formed to extend from the first sealing surface (550a; 650a) so as to form a second inclination angle (A2) that is substantially the same as the first inclination angle (A1) with respect to the first sealing surface (550a; 650a), has an inclination parallel to the second support surface (522b), and is directly or indirectly disposed on the second support surface (522b).

[0143] While this disclosure has been illustrated and described with reference to various embodiments, it is to be understood that the various embodiments are intended to be illustrative, not limiting. Those skilled in the art will appreciate that various changes in form and detail may be made without departing from the true spirit and scope of the present disclosure, including the appended claims and their equivalents. It is also to be understood that any embodiment(s) described herein may be used in conjunction with any other embodiment(s) described herein.

Claims

1. In electronic devices (101; 201; 301; 501), A housing (310; 510) including a front side (310a), a rear side (310b) opposite to the front side (310a), and a side side (311c; 511c) at least partially surrounding an internal space (511) between the front side (310a) and the rear side (310b), The housing (310;510) including a front frame (320;520) in which an acoustic hole (313;315;355) is formed and is arranged in the internal space (511) and forms at least a part of the side surface (311c;511c) and configured to transmit sound from the outside of the electronic device (101;201;301;501) to the internal space (511) and an acoustic conduit (521) is formed and configured to communicate with the acoustic hole (313;315;355); A printed circuit board (432; 532) supported at least by the front frame (320; 520) and including a first substrate surface (532a), a second substrate surface (532b) opposite to the first substrate surface (532a), and an opening (533) formed through the first substrate surface (532a) and the second substrate surface (532b) so as to overlap with the acoustic conduit (521); An acoustic module (440; 540) including a microphone electrically connected to the printed circuit board (432; 532) and positioned on the first substrate surface (532a) so as to overlap the opening (533); and It includes a sealing member (450; 550; 650) that seals between the front frame (320; 520) and the printed circuit board (432; 532) and transmits sound between the sound conduit (521) and the opening (533), and includes a sealing material. An electronic device (101;201;301;501), wherein the front frame (320;520) includes a support area (522) that supports the sealing member (450;550;650) along the circumferential direction of the sealing member (450;550;650).

2. In paragraph 1, The above support area (522) is, A first support surface (522a) inclined in the height direction of the housing (310;510) from the front side (310a) of the housing (310;510) toward the rear side (310b); and It includes a second support surface (522b) extending from the first support surface (522a) to form a first inclination angle (A1) with the first support surface (522a), An electronic device (101; 201; 301; 501), in which the sealing member (450; 550; 650) is mounted on the first support surface (522a) and the second support surface (522b).

3. In paragraph 1 or 2, The above support area (522) is, The sealing member (450; 550; 650) placed on the first support surface (522a) is supported in a first support direction (D1) substantially perpendicular to the first support surface (522a), An electronic device (101; 201; 301; 501) that supports the sealing member (450; 550; 650) positioned on the second support surface (522b) in a second support direction (D2) substantially perpendicular to the second support surface (522b).

4. In any one of paragraphs 1 to 3, The first support direction (D1) and the second support direction (D2) are non-parallel to each other, electronic device (101; 201; 301; 501).

5. In any one of paragraphs 1 to 4, The above sealing member (450; 550; 650) is An attachment surface (550c; 650c) attached to the second substrate surface (532b); A first sealing surface (550a; 650a) arranged on the first support surface (522a); and An electronic device (101; 201; 301; 501) comprising a second sealing surface (550b; 650b) extending from the first sealing surface (550a; 650a) to form a second inclination angle (A2) with the first sealing surface (550a; 650a) and arranged on the second support surface (522b).

6. In any one of paragraphs 1 to 5, The above first sealing surface (550a; 650a) has a slope parallel to the above first support surface (522a), An electronic device (101; 201; 301; 501), wherein the second sealing surface (550b; 650b) has an incline parallel to the second support surface (522b).

7. In any one of paragraphs 1 to 6, The first inclination angle (A1) and the second inclination angle (A2) are substantially the same, electronic device (101;201;301;501).

8. In any one of paragraphs 1 to 7, The above sealing member (450; 550; 650) is An electronic device (101; 201; 301; 501) further comprising a protruding portion (654) formed along at least a portion of the circumferential direction of the first sealing surface (550a; 650a) and protruding from the first sealing surface (550a; 650a) to the first support surface (522a).

9. In any one of paragraphs 1 to 8, The above front frame (320; 520) has a longitudinal direction, The above printed circuit board (432; 532) is an electronic device (101; 201; 301; 501) which is substantially horizontal to the longitudinal direction of the front frame (320; 520) based on the state in which the sealing member (450; 550; 650) is secured to the front frame (320; 520).

10. In any one of paragraphs 1 to 9, The above front frame (320; 520) includes an open area (521a) that is formed to be open in a direction toward the second substrate surface (532b) of the printed circuit board (432; 532), The above sound conduit (521) is an electronic device (101; 201; 301; 501) that communicates with the opening (533) through the open area (521a).

11. In any one of paragraphs 1 to 10, The above sealing member (450; 550; 650) is An electronic device (101; 201; 301; 501) further comprising a through hole (552; 652) formed to penetrate in the thickness direction of the sealing member (450; 550; 650) and overlap with the opening (533) when looking at the first substrate surface (532a).

12. In any one of paragraphs 1 to 11, The above printed circuit board (432; 532) further includes a guide portion (534), An electronic device (101; 201; 301; 501), wherein the sealing member (450; 550; 650) includes a protrusion (551) configured to be fitted into the guide member (534).

13. In any one of paragraphs 1 to 12, The above guide portion (534) includes an accommodation space (534a) configured to allow at least a portion of the printed circuit board (532) to pass through from the second substrate surface (532b) toward the first substrate surface (532a) and a mounting portion (534b) on which the protrusion (551) is mounted. The electronic device (101; 201; 301; 501) in which the protrusion (551) passes through the second substrate surface (532b) through the receiving space (534a) and is mounted on the mounting portion (534b).

14. In any one of paragraphs 1 to 13, The above sealing member (450; 550; 650) is An electronic device (101; 201; 301; 501) comprising a vibration membrane (553) configured to cover the opening (533), transmit sound, and have waterproof and dustproof functions.

15. In any one of paragraphs 1 to 14, An electronic device (101; 201; 301; 501), wherein the sealing member (450; 550; 650) comprises at least one of a rubber material and a silicone material.

Images