Electronic device comprising printed circuit board

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a printed circuit board; and a capacitor disposed on the printed circuit board. The printed circuit board may comprise: a conductive layer including at least one slit formed in an area adjacent to the capacitor; and an insulating layer disposed on the conductive layer and including a portion disposed in the at least one slit. The at least one slit may be disposed adjacent to at least one side surface of the capacitor and spaced apart from the at least one side surface of the capacitor by a first distance or less. The slit may not be arranged to overlap underneath the capacitor.

Description

Electronic devices including printed circuit boards

[0001] One embodiment of the present invention relates to an electronic device including a printed circuit board.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with multiple functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, calendar management, or electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure may include a printed circuit board and a capacitor disposed on the printed circuit board. The printed circuit board may include a conductive layer including at least one slit formed in a region adjacent to the capacitor, and an insulating layer disposed on the conductive layer and including a portion disposed within the at least one slit. The at least one slit may be disposed adjacent to at least one side of the capacitor and spaced apart from the at least one side of the capacitor by a first distance or less. The slit may not be disposed so as to overlap below the capacitor.

[0006] An electronic device according to one embodiment of the present disclosure may include a printed circuit board and a capacitor disposed on the printed circuit board. The printed circuit board may include a first conductive layer including a first slit layer formed in a region adjacent to the capacitor, a first insulating layer disposed on the first conductive layer and including a first portion disposed within the first slit layer, a second conductive layer disposed on the first insulating layer and including a second slit layer formed in a region adjacent to the capacitor, and a second insulating layer disposed on the second conductive layer and including a second portion disposed within the second slit layer. The slits constituting the first slit layer and the second slit layer may be disposed parallel to at least one side surface of the capacitor and spaced apart from the at least one side surface of the capacitor by a first distance or less.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment disclosed in this document.

[0009] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment disclosed in this document.

[0010] FIG. 4A is a front exploded perspective view of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0011] FIG. 4b is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0012] FIG. 5 is a cross-sectional view of the printed circuit board of FIG. 4a taken along line A-A' according to one embodiment disclosed in this document.

[0013] FIG. 6 is a top view of a capacitor and a printed circuit board according to one embodiment disclosed in this document.

[0014] FIG. 7 is a drawing of a capacitor viewed from above according to one embodiment disclosed in this document.

[0015] FIG. 8 is a top view of a printed circuit board including a slit according to one embodiment disclosed in this document.

[0016] FIG. 9 is a drawing of a printed circuit board according to one embodiment disclosed in this document, viewed from above, and an enlarged view of a slit.

[0017] Fig. 10 is a graph showing the degree of noise reduction according to the first distance according to one embodiment disclosed in this document.

[0018] Fig. 11 is a graph showing the degree of noise reduction according to the second length according to one embodiment disclosed in this document.

[0019] Fig. 12 is a graph showing the degree of noise reduction according to the slit arrangement according to one embodiment disclosed in this document.

[0020] FIG. 13 is a top view of a capacitor and a printed circuit board according to one embodiment disclosed in this document.

[0021] FIG. 14 is a top view of a printed circuit board including a slit according to one embodiment disclosed in this document.

[0022] FIG. 15 is a side view of a capacitor and a printed circuit board according to one embodiment disclosed in this document.

[0023] FIG. 16 is a side view of a capacitor and a printed circuit board according to one embodiment disclosed in this document.

[0024] FIG. 17 is a side view of a capacitor and a printed circuit board according to one embodiment disclosed in this document.

[0025] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.

[0026] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0027] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0028] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0029] The memory (130) can store data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0030] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0031] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0032] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0033] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0034] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0035] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0037] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0039] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0040] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0041] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0043] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0044] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0045] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0046] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0047] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] An electronic device according to one embodiment disclosed in this document may be a device of one type. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0049] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0050] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0051] Embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0052] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0053] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0054] FIG. 2 is a perspective view showing the front of an electronic device (101) according to one embodiment disclosed in this document.

[0055] FIG. 3 is a perspective view showing the rear side of the electronic device (101) illustrated in FIG. 2 according to one embodiment disclosed in this document.

[0056] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0057] In one embodiment, the first side (110A) may be formed by a front plate (122) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (122) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0058] In one embodiment, the front plate (122) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (122) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (122)) at one edge of the first surface (110A). In one embodiment, the front plate (122) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (122) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0059] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (124), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (128), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include other components.

[0060] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (122)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (122) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (122). In one embodiment (not shown), in order to expand the area in which the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (122) may be formed to be substantially the same.

[0061] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (115), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (115). In one embodiment (not shown), the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0062] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0063] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (124) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (115)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (124).

[0064] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0065] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0066] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0067] According to one embodiment, the connector hole (e.g., the first connector hole (128), the second connector hole (109)) may include a first connector hole (128) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0068] FIG. 4A is a front view of an electronic device (101) illustrated in FIG. 2, in an exploded perspective view according to one embodiment disclosed in this document.

[0069] FIG. 4b is an exploded perspective view showing the rear side of the electronic device (101) illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0070] Referring to FIGS. 4A and 4B , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 , 2 , or 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (122) of FIG. 2 ), a display (230) (e.g., the display (115) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0071] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0072] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0073] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear side of the housing (201)' may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0074] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0075] According to one embodiment, the memory may include volatile memory or non-volatile memory.

[0076] According to one embodiment, the interface may include a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0077] According to one embodiment, the second support member (260) may include an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (260b) may be arranged corresponding to an audio module (e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107) or a call receiver hole (114))) or a connector hole (e.g., a first connector hole (128) or a second connector hole (109)) of FIG. 2.

[0078] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be arranged substantially on the same plane as the printed circuit board (240). For example, the battery (250) may be arranged integrally within the electronic device (101), or may be arranged to be detachably attached to the electronic device (101).

[0079] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0080] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0081] FIG. 5 is a cross-sectional view of the printed circuit board of FIG. 4A (e.g., the printed circuit board (240) of FIG. 4A) taken along line A-A' according to one embodiment disclosed in the present document. FIG. 6 is a top view of a capacitor and a printed circuit board according to one embodiment disclosed in the present document. FIG. 7 is a top view of a capacitor according to one embodiment disclosed in the present document. FIG. 8 is a top view of a printed circuit board including a slit according to one embodiment disclosed in the present document.

[0082] Referring to FIGS. 5 to 8, the electronic device may include a printed circuit board (310) and a capacitor (320) disposed on the printed circuit board (310). The configuration of the printed circuit board (310) of FIGS. 5 to 8 may be identical to all or part of the configuration of the printed circuit board (240) of FIGS. 2 to 4B. The structure of FIGS. 5 to 8 may be optionally combined with the structure of FIGS. 2 to 4B.

[0083] According to one embodiment, the capacitor (320) may refer to a device that stores electric capacity as electric potential energy on a circuit board. For example, the capacitor (320) may be any one of a thin film capacitor, a ceramic capacitor, a silicon capacitor, or an aluminum electrolytic capacitor. For example, the capacitor (320) may be a multilayer ceramic capacitor (MLCC). The multilayer ceramic capacitor (320) may be a component that controls current to flow constantly on a circuit board of an electronic device. The multilayer ceramic capacitor (320) (MLCC: multi-layered ceramic capacitor), which is one of the multilayer chip electronic components, can be used in various electronic devices due to its advantages of being small in size, ensuring high capacity, and being easy to mount. A multilayer ceramic capacitor (320) can be used as a chip-type capacitor that is mounted on a printed circuit board of various electronic products, such as video devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, personal digital assistants (PDAs), and mobile phones, and plays a role in charging or discharging electricity.

[0084] According to one embodiment, the multilayer ceramic capacitor (320) may have a structure in which a plurality of dielectric layers and internal electrodes of different polarities are alternately arranged between the dielectric layers. At this time, since the dielectric layers have piezoelectricity, when a direct current or alternating current voltage is applied to the multilayer ceramic capacitor (320), a piezoelectric phenomenon may occur between the internal electrodes, thereby causing the volume of the ceramic body to expand and contract depending on the frequency and generating periodic vibrations. This vibration may be transmitted to the printed circuit board (310) through the external electrodes of the multilayer ceramic capacitor (320) and the solder connecting the external electrodes and the printed circuit board (310), so that the entire printed circuit board (310) may become a sound reflective surface, thereby generating a vibrational sound that becomes noise. This vibrational sound may correspond to an audible frequency in the range of about 20 to 20,000 Hz, which is unpleasant to humans, and such a vibrational sound that is unpleasant to humans is called acoustic noise. One embodiment of the present disclosure can reduce noise in the audible frequency band by allowing vibration energy of a capacitor (320) to pass through a printed circuit board (310) having a laminated structure including a slit (330) and having a different density medium, thereby attenuating the energy. Hereinafter, the structure of the printed circuit board (310) and its relationship with the capacitor (320) will be described in detail.

[0085] According to one embodiment, the capacitor (320) may be disposed on the printed circuit board (310). According to one embodiment, the capacitor (320) may have, for example, a rectangular shape. For example, the capacitor (320) may include a first side (320a) facing the left direction (-X direction, first direction), a second side (320b) facing the right direction (+X direction, second direction), a third side (320c) facing the front direction (+Y direction, third direction), and a fourth side (320d) facing the rear direction (-Y direction, fourth direction). The capacitor (320) may include a plurality of side surfaces (e.g., a first side surface (320a), a second side surface (320b), a third side surface (320c), or a fourth side surface (320d)) and an upper surface (320e) that is vertically arranged and faces upward (+Z direction), and a lower surface (320f) that faces downward (-Z direction). The lower surface (320f) of the capacitor (320) may face the printed circuit board (310). However, the shape of the capacitor (320) is not limited to the above embodiment, and may be designed in various ways.

[0086] According to one embodiment, the electronic device may include at least one solder pad (321, 322) disposed between the capacitor (320) and the printed circuit board (310). The solder pad (321, 322) may be attached to a lower surface (320f) of the capacitor (320) and may enable the capacitor (320) to be fixed and electrically connected on the printed circuit board (310). For example, the at least one solder pad (321, 322) may include a first solder pad (321) attached to a left side (-X direction, first direction) of the lower surface (320f) of the capacitor (320), and a second solder pad (322) attached to a right side (+X direction, second direction) of the lower surface (320f) of the capacitor (320).

[0087] According to one embodiment, the first solder pad (321) may have a rectangular shape. However, the shape of the first solder pad (321) is not limited to the above embodiment and may be designed in various ways. According to one embodiment, the second solder pad (322) may have, for example, a rectangular shape. However, the shape of the second solder pad (322) is not limited to the above embodiment and may be designed in various ways.

[0088] According to one embodiment, the printed circuit board (310) may include an insulating layer (311) and a conductive layer (312).

[0089] According to one embodiment, the conductive layer (312) may be formed of a conductor (copper foil) and may have a circuit pattern formed on at least a portion thereof. For example, the conductive layer (312) may be formed by a method such as casting, laminating, or sputtering.

[0090] According to one embodiment, the conductive layer (312) may include at least one slit (330) formed in an area adjacent to the capacitor (320). For example, the slit (330) may be formed to be recessed downward (in the -Z direction) from one surface of the conductive layer (312). For example, the thickness (length in the Z-axis direction) of the slit (330) may be thinner than or equal to the thickness of the conductive layer (312). For example, when the thickness of the slit (330) is equal to the thickness of the conductive layer (312), a portion of the conductive layer (312) may be removed or penetrated to form the slit (330). According to one embodiment, the conductive layer (312) may be a conductive layer disposed in the uppermost direction (in the +Z direction) among a plurality of conductive layers.

[0091] According to one embodiment, the insulating layer (311) may be disposed on the conductive layer (312). For example, the insulating layer (311) may include a prepreg. For example, the insulating layer (311) may include a resin, a filler, and a glass fabric. According to one embodiment, the insulating layer (311) may include a portion (340) disposed within at least one slit (330). For example, the portion (340) may be formed to protrude downward (in the -Z direction) from where the conductive layer (312) is disposed. According to one embodiment, the insulating layer (311) may be an insulating layer disposed in the uppermost direction (in the +Z direction) among a plurality of insulating layers.

[0092] According to one embodiment, with reference to FIG. 5, the printed circuit board (310) may include lower layers (301) disposed in the lower direction (-Z direction) of the conductive layer (312) (e.g., a portion encompassing the remaining layers disposed in the lower direction (-Z direction) of the printed circuit board, such as the conductive layer and the insulating layer).

[0093] According to one embodiment, at least one slit (330) can be disposed adjacent to at least one side (320a, 320b, 320c, 320d) of the capacitor (320). For example, at least one slit (330) can be disposed parallel to at least one side (320a, 320b, 320c, 320d) of the capacitor (320). For example, at least one slit (330) can be disposed adjacent to and / or parallel to a first side (320a) of the capacitor (320). For example, at least one slit (330) can be disposed adjacent to and / or parallel to a second side (320b) of the capacitor (320). According to one embodiment, at least one slit (330) may include a first slit (331) disposed in the left direction (-X direction, first direction) of the capacitor (320) and adjacent to and / or parallel to the first side (320a), a second slit (332) disposed in the right direction (+X direction, second direction) of the capacitor (320) and adjacent to and / or parallel to the second side (320b), a third slit (333) disposed in the front direction (+Y direction, third direction) of the capacitor (320) and adjacent to and / or parallel to the third side (320c), and a fourth slit (334) disposed in the rear direction (-Y direction, fourth direction) of the capacitor (320) and adjacent to and / or parallel to the fourth side (320d).

[0094] According to one embodiment, at least one slit (330) may be positioned below the lower surface (320f) of the capacitor (320). For example, the at least one slit (330) may further include a fifth slit (330) positioned to face the lower surface (320f) of the capacitor (320).

[0095] According to one embodiment, at least one slit (330) may be arranged parallel to at least one side of at least one solder pad (321). For example, the first slit (331) may be arranged adjacent to the left side (-X direction, first direction) of the first solder pad (321). For example, the second slit (332) may be arranged adjacent to the right side (+X direction, second direction) of the second solder pad (322). For example, the third slit (333) may be arranged adjacent to the front side (+Y direction, third direction) of the first solder pad (321) and / or the second solder pad (322). For example, the fourth slit (334) may be arranged adjacent to the back side (-Y direction, fourth direction) of the first solder pad (321) and / or the second solder pad (322). For example, the fifth slit (335) may be positioned in the right direction (+X direction, second direction) of the first solder pad (321) and in the left direction (-X direction, first direction) of the second solder pad (322). For example, the fifth slit (335) may be positioned between the first solder pad (321) and the second solder pad (322).

[0096] FIG. 9 is a top view of a printed circuit board according to one embodiment disclosed in the present document and an enlarged view of a slit. FIG. 10 is a graph showing the degree of noise reduction according to a first distance according to one embodiment disclosed in the present document. FIG. 11 is a graph showing the degree of noise reduction according to a second length according to one embodiment disclosed in the present document. FIG. 12 is a graph showing the degree of noise reduction according to a slit arrangement according to one embodiment disclosed in the present document.

[0097] Referring to FIGS. 9 to 12, the electronic device may include a printed circuit board (310) and a capacitor (320) disposed on the printed circuit board (310). The configuration of the printed circuit board (310) and the capacitor (320) of FIGS. 9 to 12 may be the same as all or part of the configuration of the printed circuit board (310) and the capacitor (320) of FIGS. 5 to 8. The structure of FIGS. 9 to 12 may be optionally combined with the structure of FIGS. 5 to 8.

[0098] According to one embodiment, at least one slit (330) can be spaced apart from at least one side of the capacitor (320) and / or at least one solder pad (321) by a first distance (d1) or less. For example, the first slit (331) can be spaced apart from the first side (320a) of the capacitor (320) by a first distance (d1) or less. For example, the second slit (332) can be spaced apart from the second side (320b) of the capacitor (320) by a first distance (d1) or less. For example, the third slit (333) can be spaced apart from the third side (320c) of the capacitor (320) by a first distance (d1) or less. For example, the fourth slit (334) can be spaced apart from the fourth side (320d) of the capacitor (320) by a first distance (d1) or less.

[0099] FIG. 10 is a graph showing the degree of noise reduction according to the first distance according to one embodiment disclosed in the present document. According to one embodiment, referring to FIG. 10, the shorter the first distance (d1), the greater the noise reduction rate. For example, the first distance (d1) may be about 0.05 mm or more and about 0.2 mm or less. For example, when the first distance (d1) is 1.0 mm, the noise may be 0.87. For example, when the first distance (d1) is 0.8 mm, the noise may be 0.82. For example, when the first distance (d1) is 0.6 mm, the noise may be 0.75. For example, when the first distance (d1) is 0.4 mm, the noise may be 0.64. For example, when the first distance (d1) is 0.2 mm, the noise may be 0.53.

[0100] In one embodiment, the first distance (d1) may be 1.0 mm or less. For example, the first distance (d1) may be 0.2 mm or less. For example, the first distance (d1) may be 0.1 mm or more and 0.2 mm or less.

[0101] According to one embodiment, the third length (d3), which is the length of the side perpendicular to the side of the capacitor (320) adjacent to the slit (330), may be formed shorter than the second length (d2). The longer the third length (d3), the greater the noise reduction rate, but the mounting may be performed taking into consideration the mounting space of the printed circuit board (310). The third length (d3) may be, for example, equal to or longer than about 0.1 mm.

[0102] FIG. 11 is a graph showing the degree of noise reduction according to the second length according to one embodiment disclosed in the present document. According to one embodiment, referring to FIG. 11, the longer the second length (d2), which is the length of the side parallel to the side of the capacitor (320) adjacent to the slit (330), the greater the noise reduction rate. For example, when the vertical length (Y-axis length) of the capacitor (320) is 1.0 mm, the noise may be 0.79 when the second length (d2) is 1.0 mm. For example, when the second length (d2) is 1.2 mm, the noise may be 0.72. For example, when the second length (d2) is 1.4 mm, the noise may be 0.66. For example, when the second length (d2) is 1.6 mm, the noise may be 0.61. For example, when the second length (d2) is 1.8 mm, the noise may be 0.58. For example, when the second length (d2) is 2.0 mm, the noise may be 0.53.

[0103] According to one embodiment, the second length (d2), which is the length of the side of the slit (330) parallel to the side of the capacitor (320), may be longer than the length of the capacitor (320). For example, when the vertical length (Y-axis length) of the capacitor (320) is 1.0 mm, the second length (d2) may be 1.0 mm or more. For example, when the vertical length (Y-axis length) of the capacitor (320) is 1.0 mm, the second length (d2) may be equal to or greater than 2.0 mm. For example, the second length (d2) may be 1.0 mm or more and 2.0 mm or less.

[0104] Fig. 12 is a graph showing the degree of noise reduction according to the slit arrangement according to one embodiment disclosed in this document. According to one embodiment, noise (A) when the slit (330) is arranged to correspond to the lower surface (320f) of the capacitor (320), noise (B) when the slit (330) is arranged adjacent to and / or parallel to the left and / or right sides of the capacitor (320), and noise (C) when the slit (330) is arranged adjacent to and / or parallel to the front and / or back sides of the capacitor (320) can be compared and examined.

[0105] For example, in the case of a typical printed circuit board (310), when the noise is 1.0, if the slit (e.g., the fifth slit (335)) is arranged to correspond to the lower surface (320f) of the capacitor (320) (A), the noise may be 0.68. If the slit (e.g., the first slit (331) or the second slit (332)) is arranged adjacent to and / or parallel to the left and / or right sides of the capacitor (320) (B), the noise may be 0.53. If the slit (e.g., the third slit (331), the fourth slit (332)) is arranged adjacent to and / or parallel to the front and / or rear sides of the capacitor (320) (C), the noise may be 0.98. The experimental results show that noise is reduced in all cases where the slit (330) is arranged adjacent to the capacitor (320). The experimental results show that the noise reduction rate is greatest when the slit (330) is arranged adjacent to and / or parallel to the left and / or right sides of the capacitor (320). The portion where the solder pads (321, 322) of the capacitor (320) are arranged may be an area where vibration of the capacitor (320) is concentrated, which is an edge portion of the capacitor (320). As the capacitor (320) contracts and / or expands, the printed circuit board is bent upward or downward, and at this time, the vibration of the printed circuit board may be concentrated on the outer portion of the solder pads (321, 322). Therefore, when the slit (e.g., the first slit (331) or the second slit (332)) is arranged adjacent to and / or parallel to the left and / or right sides of the capacitor (320), which are the portions where vibration of the printed circuit board is concentrated (B), noise generation can be relatively greatly reduced.

[0106] FIG. 13 is a top view of a capacitor and a printed circuit board according to one embodiment disclosed in the present document. FIG. 14 is a top view of a printed circuit board including a slit according to one embodiment disclosed in the present document.

[0107] Referring to FIGS. 13 and 14 , the electronic device may include a printed circuit board (410), a capacitor (420) disposed on the printed circuit board (410), and a slit (430). The configuration of the printed circuit board (410), the capacitor (420), the solder pads (421, 422), and the slit (430) of FIGS. 13 and 14 may be the same as all or part of the configuration of the printed circuit board (310), the capacitor (320), the solder pads (321, 322), and the slit (330) of FIGS. 5 and 12 . The structure of FIGS. 13 and 14 may be optionally combined with the structure of FIGS. 5 and 12 .

[0108] In one embodiment, at least a portion of the slit (440) may be arranged parallel to at least one side (420a, 420b, 420c, 420d) of the capacitor (420). For example, at least a portion of the slit (430) may be arranged parallel to the first side (420a) of the capacitor (420). For example, at least a portion of the slit (430) may be arranged parallel to the fourth side (420c) of the capacitor (420).

[0109] According to one embodiment, the slit (430) may include a first portion (431) disposed in the front direction (+Y direction, third direction) of the capacitor (420) and substantially parallel to the third side surface (420c), a second portion (432) disposed in the rear direction (-Y direction, fourth direction) of the capacitor (420) and substantially parallel to the fourth side surface (420d), and a third portion (433) substantially vertically connected to the first portion (431) and the second portion (432) and disposed between the first solder pad (421) and the second solder pad (422). For example, the slit may be in the shape of a capital letter 'I'. According to one embodiment, the third portion (433) may be disposed below the lower surface (420f) of the capacitor (420). For example, the third portion (433) may be positioned to face the lower surface (420f) of the capacitor (420).

[0110] According to one embodiment, at least a portion of the slit (430) may be arranged substantially parallel to at least one side of at least one solder pad (421, 422). For example, the first portion (431) may be arranged adjacent to the front direction (+Y direction, fourth direction) of the first solder pad (421) and / or the second solder pad (422). For example, the second portion (432) may be arranged adjacent to the back direction (-Y direction, fourth direction) of the first solder pad (421) and / or the second solder pad (422). For example, the third portion (433) may be arranged between the first solder pad (421) and the second solder pad (422).

[0111] FIG. 15 is a side view of a capacitor and a printed circuit board according to one embodiment disclosed in the present document. FIG. 16 is a side view of a capacitor and a printed circuit board according to one embodiment disclosed in the present document. FIG. 17 is a side view of a capacitor and a printed circuit board according to one embodiment disclosed in the present document.

[0112] Referring to FIGS. 15 to 17, the electronic device may include a printed circuit board (510), a capacitor (520) disposed on the printed circuit board (510), and a slit (530). The configuration of the printed circuit board (510), the capacitor (520), the solder pads (521, 522), and the slit (530) of FIGS. 15 to 17 may be the same as all or part of the configuration of the printed circuit board (510), the capacitor (320), the solder pads (321, 322), and the slit (350) of FIGS. 5 to 14. The structure of FIGS. 15 to 17 may be optionally combined with the structure of FIGS. 5 to 14.

[0113] According to one embodiment, the printed circuit board (510) may be a printed circuit board (510) including a plurality of layers. The printed circuit board (510) may have a structure in which a plurality of insulating layers (511) (e.g., 511a, 511b, 511c, 511d) and a plurality of conductive layers (512) (e.g., 512a, 512b, 512c, 512d) are alternately stacked. For example, each of the conductive layers (512a, 512b, 512c, 512d) included in the plurality of conductive layers (512) may be disposed between each of the insulating layers (511a, 511b, 511c, 511d) included in the plurality of insulating layers (511).

[0114] In one embodiment, for example, the printed circuit board (510) may include a first conductive layer (512a), a first insulating layer (511a) disposed on the first conductive layer (512a), a second conductive layer (512b) disposed on the first insulating layer (511a), and a second insulating layer (511b) disposed on the second conductive layer (512b). In one embodiment, the printed circuit board (510) may include a third conductive layer (512c) disposed on the second insulating layer (511b), a third insulating layer (511c) disposed on the third conductive layer (512c), a fourth conductive layer (512d) disposed on the third insulating layer (511c), or a fourth insulating layer (511d) disposed on the fourth conductive layer (512d).

[0115] According to one embodiment, the first conductive layer (512a) may include at least one first-layer slit (530a) formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, when the printed circuit board (510) is viewed from above (in the +Z-axis direction), the first-layer slit (530a) may be formed in the first conductive layer (512a) so as to overlap with an area adjacent to the capacitor (520). According to one embodiment, the second conductive layer (512b) may include at least one second-layer slit (530b) formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, when the printed circuit board (510) is viewed from above (in the +Z-axis direction), the second-layer slit (530b) may be formed in the second conductive layer (512b) so as to overlap with an area adjacent to the capacitor (520). According to one embodiment, the third conductive layer (512c) may include at least one third-layer slit (530c) formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, when the printed circuit board (510) is viewed from above (in the +Z-axis direction), the third-layer slit (530c) may be formed in the third conductive layer (512c) so as to overlap with an area adjacent to the capacitor (520). According to one embodiment, the fourth conductive layer (512d) may include at least one fourth-layer slit (530d) formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, when the printed circuit board (510) is viewed from above (in the +Z-axis direction), the fourth-layer slit (530d) may be formed in the fourth conductive layer (512d) so as to overlap with an area adjacent to the capacitor (520).

[0116] According to one embodiment, the slit (530a) of the first layer may include at least one slit formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, the slit (530a) of the first layer may include at least one first-layer first slit (5301a) (e.g., the first slit (331) of FIG. 6) arranged in a left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530a) of the first layer may include at least one first-layer second slit (5302a) (e.g., the second slit (332) of FIG. 6) arranged in a right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530a) of the first layer may include at least one first layer third slit (5303a) (e.g., the third slit (333) of FIG. 6) arranged in at least one of the front direction (+Y direction, third direction), the rear direction (-Y direction, fourth direction), and the downward direction (-Z direction, fifth direction) of the capacitor (320).

[0117] According to one embodiment, the slit (530b) of the second layer may include at least one slit formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, the slit (530b) of the second layer may include at least one second-layer first slit (5301b) (e.g., the first slit (331) of FIG. 6) arranged in a left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530b) of the second layer may include at least one second-layer second slit (5302b) (e.g., the second slit (332) of FIG. 6) arranged in a right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530b) of the second layer may include at least one second layer third slit (5303b) (e.g., the third slit (333) of FIG. 6) arranged in at least one of the front direction (+Y direction, third direction), the rear direction (-Y direction, fourth direction), and the downward direction (-Z direction, fifth direction) of the capacitor (320).

[0118] According to one embodiment, the slit (530c) of the third layer may include at least one slit formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, the slit (530c) of the third layer may include at least one third-layer first slit (5301c) (e.g., the first slit (331) of FIG. 6) arranged in a left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530c) of the third layer may include at least one third-layer second slit (5302c) (e.g., the second slit (332) of FIG. 6) arranged in a right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530c) of the third layer may include at least one third layer third slit (5303c) (e.g., the third slit (333) of FIG. 6) arranged in at least one of the front direction (+Y direction, third direction), the rear direction (-Y direction, fourth direction), and the downward direction (-Z direction, fifth direction) of the capacitor (320).

[0119] According to one embodiment, the slit (530d) of the fourth layer may include at least one slit formed in an area adjacent to the capacitor (520) in the X-axis and / or Y-axis direction. For example, the slit (530d) of the fourth layer may include at least one fourth-layer first slit (5301d) (e.g., the first slit (331) of FIG. 6) arranged in the left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530d) of the fourth layer may include at least one fourth-layer second slit (5302d) (e.g., the second slit (332) of FIG. 6) arranged in the right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530d) of the fourth layer may include at least one fourth layer third slit (5303d) (e.g., the third slit (333) of FIG. 6) arranged in at least one of the front direction (+Y direction, third direction), the rear direction (-Y direction, fourth direction), and the downward direction (-Z direction, fifth direction) of the capacitor (320).

[0120] According to one embodiment, the first layer first slit (5301a), the second layer first slit (5301b), the third layer first slit (5301c), and the fourth layer first slit (5301d) may be arranged so that at least some of them overlap in the Z-axis direction. According to one embodiment, the first layer second slit (5302a), the second layer second slit (5302b), the third layer second slit (5302c), and the fourth layer second slit (5302d) may be arranged so that at least some of them overlap in the Z-axis direction. According to one embodiment, the first layer third slit (5303a), the second layer third slit (5303b), the third layer third slit (5303c), and the fourth layer third slit (5303d) may be arranged so that at least some of them overlap in the Z-axis direction.

[0121] In one embodiment, the slit (530a) of the first layer, the slit (530b) of the second layer, the slit (530c) of the third layer, and / or the slit (530d) of the fourth layer may include slits having substantially the same shape and / or arrangement. For example, the slits constituting the slit (530a) of the first layer, the slit (530b) of the second layer, the slit (530c) of the third layer, and / or the slit (530d) of the fourth layer may be formed in substantially the same shape. In one embodiment, the slit (530a) of the first layer, the slit (530b) of the second layer, the slit (530c) of the third layer, and / or the slit (530d) of the fourth layer may include slits having different shapes and / or arrangements.

[0122] According to one embodiment, the lengths of the slits that overlap in the Z-axis direction among the slits constituting the slit (530a) of the first layer, the slit (530b) of the second layer, the slit (530c) of the third layer, and / or the slit (530d) of the fourth layer may be substantially the same. For example, referring to FIG. 15, the X-axis direction lengths of the first-layer third slit (5303a) among the slits (530a) of the first layer, the second-layer third slit (5303b) among the slits (530b) of the second layer, the third-layer third slit (5303c) among the slits (530c) of the third layer, and the fourth-layer third slit (5303d) among the slits (530d) of the fourth layer, which overlap in the Z-axis direction, may be a first length (d1). The first length (d1) may be shorter than the length of the capacitor (520) in the X-axis direction.

[0123] According to one embodiment, the lengths of the slits that overlap in the Z-axis direction among the slits constituting the slit (530a) of the first layer, the slit (530b) of the second layer, the slit (530c) of the third layer, and / or the slit (530d) of the fourth layer may be different from each other. For example, referring to FIG. 16, the length in the X-axis direction of the first-layer third slit (5303a) among the slits (530a) of the first layer may be a second length (d2). The second length (d2) may be substantially the same as or similar to the length of the capacitor (520) in the X-axis direction. For example, the second-layer third slit (5303b) among the slits (530b) of the second layer may be configured in multiple numbers. The second-layer third slit (5303b) among the slits (530b) of the second layer may be a plurality of slits arranged at regular intervals in the X-axis direction. The X-axis direction lengths of the plurality of second-layer third slits (5303b) may each be a third length (d3). The X-axis direction lengths of the plurality of second-layer third slits (5303b) may be substantially the same as or different from each other. The total X-axis direction lengths of the plurality of second-layer third slits (5303b) arranged at regular intervals in the X-axis direction may be substantially the same as the second length (d2). For example, the X-axis direction length of the third-layer third slit (5303c) among the third-layer slits (530c) may be a fourth length (d4). The fourth length (d4) may be substantially the same as or similar to the X-axis direction length of the capacitor (520). The fourth length (d4) may be substantially the same as or similar to the second length (d2). For example, the length in the X-axis direction of the third slit (5303d) of the fourth layer among the slits (530d) of the fourth layer may be a fifth length (d5). The fifth length (d5) may be shorter than the length in the X-axis direction of the capacitor (520). The fifth length (d5) may be substantially the same as or similar to the third length (d3).The configuration, structure, and arrangement of the slits are not limited to the above embodiments and can be designed in various ways, and can be configured in various combinations taking into account the size of the printed circuit board and the performance of the capacitor.

[0124] According to one embodiment, with reference to FIG. 17, the slit may not be arranged in the lower direction (-Z direction, fifth direction) of the capacitor (520). For example, the slit (530a) of the first layer, the slit (530b) of the second layer, the slit (530c) of the third layer, and / or the slit (530d) of the fourth layer may not have the slit arranged in the lower direction (-Z direction, fifth direction) of the capacitor (320). For example, the slit (530a) of the first layer may include at least one first layer first slit (5301a) (e.g., the first slit (331) of FIG. 6) arranged in the left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530a) of the first layer may include at least one first layer second slit (5302a) (e.g., the second slit (332) of FIG. 6) arranged in the right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530b) of the second layer may include at least one second layer first slit (5301b) (e.g., the first slit (331) of FIG. 6) arranged in the left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530b) of the second layer may include at least one second layer second slit (5302b) (e.g., the second slit (332) of FIG. 6) arranged in the right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530c) of the third layer may include at least one third-layer first slit (5301c) (e.g., the first slit (331) of FIG. 6) arranged in the left direction (-X direction, first direction) of the capacitor (320). For example, the slit (530c) of the third layer may include at least one third-layer second slit (5302c) (e.g., the second slit (332) of FIG. 6) arranged in the right direction (+X direction, second direction) of the capacitor (320). For example, the slit (530d) of the fourth layer may include at least one fourth-layer first slit (5301d) (e.g., the first slit (331) of FIG. 6) arranged in the left direction (-X direction, first direction) of the capacitor (320).For example, the slit (530d) of the fourth layer may include at least one fourth layer second slit (5302d) (e.g., the second slit (332) of FIG. 6) arranged in the right direction (+X direction, second direction) of the capacitor (320).

[0125] An electronic device according to one embodiment of the present disclosure includes a printed circuit board (e.g., a printed circuit board (310) of FIG. 5), and a capacitor (e.g., a capacitor (320) of FIG. 6) disposed on the printed circuit board, wherein the printed circuit board includes a conductive layer (e.g., a conductive layer (312) of FIG. 5) including at least one slit (e.g., a slit (330) of FIG. 5) formed in a region adjacent to the capacitor), and an insulating layer (e.g., an insulating layer (311) of FIG. 5) disposed on the conductive layer and including a portion (e.g., a portion (340) of FIG. 5) disposed within the at least one slit, wherein the at least one slit is disposed adjacent to at least one side surface of the capacitor and is spaced apart from the at least one side surface of the capacitor by a first distance (e.g., a first distance (d1) of FIG. 9) or less, and wherein the slit may not be disposed to overlap below the capacitor.

[0126] According to one embodiment, the capacitor may be a multi-layer ceramic capacitor (MLCC).

[0127] According to one embodiment, the capacitor may include a first side facing a first direction (-X direction), a second side facing a second direction (+X direction) opposite to the first direction, a third side facing a third direction (+Y direction) perpendicular to the first and second directions, and a fourth side facing a fourth direction (-Y direction) opposite to the third direction, a lower surface disposed perpendicular to the side surfaces and facing a downward direction (-Z direction) toward the printed circuit board, and an upper surface facing an upward direction (+Z direction) opposite to the downward direction.

[0128] According to one embodiment, the device may further include at least one solder pad (e.g., solder pads (321, 322) of FIG. 8) disposed between the capacitor and the printed circuit board.

[0129] According to one embodiment, the at least one solder pad may include a first solder pad attached in the first direction of the lower surface of the capacitor (e.g., the first solder pad (321) of FIG. 8), and a second solder pad attached in the second direction of the lower surface of the capacitor (e.g., the second solder pad (322) of FIG. 8).

[0130] According to one embodiment, the at least one slit may be formed to be recessed downward from one surface of the conductive layer in contact with the insulating layer.

[0131] In one embodiment, the thickness of the at least one slit may be thinner than or equal to the thickness of the conductive layer.

[0132] According to one embodiment, the at least one slit may include a first slit (e.g., the first slit (331) of FIG. 8) arranged parallel to the first side of the capacitor, and a third slit (e.g., the third slit (333) of FIG. 8) arranged perpendicular to the first slit and parallel to the third side of the capacitor.

[0133] In one embodiment, the at least one slit comprises a first side that is parallel to an adjacent side of the at least one side of the capacitor and has a second length (e.g., the second length (d2) in FIG. 9), and a second side that extends perpendicular to the first side and has a third length (e.g., the third length (d3) in FIG. 9), wherein the second length may be twice or greater than a length of the adjacent side of the at least one side of the capacitor.

[0134] According to one embodiment, the at least one slit may include a first slit (e.g., the first slit (331) of FIG. 8) disposed in the first direction of the capacitor and adjacent to the first side, and a second slit (e.g., the second slit (332) of FIG. 8) disposed in the second direction of the capacitor and adjacent to the second side.

[0135] According to one embodiment, the at least one slit may include a third slit (e.g., the third slit (333) of FIG. 8) disposed in the third direction of the capacitor and adjacent to the third side, and a fourth slit (e.g., the fourth slit (334) of FIG. 8) disposed in the fourth direction of the capacitor and adjacent to the fourth side.

[0136] According to one embodiment, the at least one slit may include a fifth slit (e.g., the fifth slit (335) of FIG. 8) arranged to face the lower surface of the capacitor.

[0137] In one embodiment, the first length may be 0.2 mm or less.

[0138] In one embodiment, the portion may be formed to protrude in the downward direction and fill the slit.

[0139] According to one embodiment, the at least one slit (e.g., 430 of FIG. 13) may include a first portion (e.g., 431 of FIG. 13) disposed in the third direction of the capacitor and parallel to the third side surface, a second portion (e.g., 432 of FIG. 13) disposed in the fourth direction of the capacitor and parallel to the fourth side surface, and a third portion (e.g., 433 of FIG. 13) vertically connected to the first portion and the second portion and disposed to face the lower surface of the capacitor.

[0140] An electronic device according to one embodiment of the present disclosure includes a printed circuit board (e.g., 510 of FIG. 15); and a capacitor (e.g., 520 of FIG. 15) disposed on the printed circuit board, the printed circuit board comprising: a first conductive layer (e.g., 512a of FIG. 15) including a first layer of a slit (e.g., 530a of FIG. 15) formed in an area adjacent to the capacitor; a first insulating layer (e.g., 511a of FIG. 15) disposed on the first conductive layer and including at least one portion (340) disposed within the first slit layer; a second conductive layer (e.g., 512b of FIG. 15) disposed on the first insulating layer and including a second layer of a slit (e.g., 530b of FIG. 15) formed in an area adjacent to the capacitor; And a second insulating layer (e.g., 511b of FIG. 15) disposed on the second conductive layer and including at least one second portion (340) disposed within the second slit layer; wherein the slits constituting the first slit layer and the second slit layer are disposed parallel to at least one side surface of the capacitor and may be spaced apart from the at least one side surface of the capacitor by a first length (e.g., d1 of FIG. 15) or less.

[0141] According to one embodiment, the capacitor may be a multi-layer ceramic capacitor (MLCC).

[0142] According to one embodiment, at least one slit constituting the first slit layer may be substantially identical to a slit constituting the second slit layer.

[0143] According to one embodiment, the slits constituting the first slit layer may be different from the slits constituting the second slit layer.

[0144] According to one embodiment, the first slit layer and the second slit layer may include at least one of a first slit (331) disposed in the first direction of the capacitor and adjacent to the first side, a second slit (332) disposed in the second direction of the capacitor and adjacent to the second side, a third slit (333) disposed in the third direction of the capacitor and adjacent to the third side, a fourth slit (334) disposed in the fourth direction of the capacitor and adjacent to the fourth side, and a fifth slit (335) disposed to face the lower surface of the capacitor.

[0145] An electronic device according to one embodiment of the present disclosure may include a printed circuit board and a capacitor disposed on the printed circuit board. The printed circuit board may include a conductive layer including at least one slit formed in a region adjacent to the capacitor, and an insulating layer disposed on the conductive layer and including a portion disposed within the at least one slit. The at least one slit may be disposed adjacent to at least one side of the capacitor and spaced apart from the at least one side of the capacitor by a first distance or less. The slit may not be disposed so as to overlap below the capacitor.

[0146] In one embodiment, the at least one slit includes a side having a second length extending parallel to the at least one side surface of the capacitor, the second length being at least 1.4 times longer than a length of the at least one side surface of the capacitor.

[0147] According to one embodiment, the at least one slit may include a first slit extending in the third direction and positioned adjacent to the first side, and a second slit extending in the third direction and positioned adjacent to the second side.

[0148] According to one embodiment, the at least one slit may include a third slit extending in the first direction and positioned adjacent to the third side, and a fourth slit extending in the first direction and positioned adjacent to the fourth side.

[0149] When charging and / or discharging a capacitor (e.g., 320 in FIG. 6) (MLCC) used in an electronic device, vibration may occur due to the shrinkage and expansion of the capacitor (MLCC). The vibration of the capacitor (MLCC) may be transmitted to the printed circuit board (310), causing the printed circuit board (e.g., 310 in FIG. 6) to vibrate, thereby generating noise in the audible frequency band.

[0150] The printed circuit board of the present disclosure can reduce noise in the audible frequency band by allowing vibration energy of a capacitor to be attenuated as it passes through a printed circuit board having a medium with different densities through a change in the laminated structure.

Claims

1. In electronic devices, printed circuit board (310); and including a capacitor (320) on the printed circuit board; The above printed circuit board, A conductive layer (312) including at least one slit (330) in an area adjacent to the capacitor; and Including an insulating layer (311) including a portion (340) within at least one slit on the above-mentioned challenging layer; The at least one slit is parallel to at least one side of the capacitor and is spaced apart from the at least one side of the capacitor by a first distance (d1) or less, An electronic device wherein at least a portion of said slit does not overlap said capacitor when viewed from above.

2. In paragraph 1, An electronic device wherein said at least one slit comprises a side having a second length (d2) extending parallel to said at least one side surface of said capacitor, said second length (d2) being at least 1.4 times longer than a length of said at least one side surface of said capacitor.

3. In either of paragraphs 1 and 2, The above capacitor is an electronic device that is a multi layer ceramic capacitor (MLCC).

4. In any one of paragraphs 1 to 3, At least one side of said capacitor, An electronic device comprising a first side facing a first direction, a second side facing a second direction opposite to the first direction, a third side facing a third direction perpendicular to the first direction and the second direction, and a fourth side facing a fourth direction opposite to the third direction.

5. In paragraph 4, Further comprising at least one solder pad (321, 322) between the capacitor and the printed circuit board, wherein the at least one solder pad comprises: An electronic device comprising a first solder pad (321) coupled to the first direction of the lower surface of the capacitor, and a second solder pad (322) coupled to the second direction of the lower surface of the capacitor.

6. In any one of paragraphs 1 to 5, An electronic device in which at least one slit is recessed downward from a surface of the conductive layer in contact with the insulating layer.

7. In any one of paragraphs 1 to 6, An electronic device wherein the thickness of at least one slit is thinner than or equal to the thickness of the conductive layer.

8. In paragraph 3, An electronic device wherein said at least one slit comprises a first slit (331) parallel to the first side of the capacitor, and a third slit (333) perpendicular to the first slit and parallel to the third side of the capacitor.

9. In any one of paragraphs 1 to 8, The at least one slit comprises a first side having a second length and being parallel to an adjacent side of the at least one side of the capacitor, and a second side extending perpendicularly to the first side and having a third length, An electronic device wherein said second length is at least twice the length of an adjacent side among said at least one side of said capacitor.

10. In clauses 3 to 9, An electronic device wherein the at least one slit includes a first slit (331) extending in the third direction and adjacent to the first side, and a second slit (332) extending in the third direction and adjacent to the second side.

11. In clauses 3 to 10, An electronic device wherein the at least one slit further includes a third slit (333) extending in the first direction and adjacent to the third side, and a fourth slit (334) extending in the first direction and adjacent to the fourth side.

12. In any one of paragraphs 3 to 11, An electronic device wherein said at least one slit includes a fifth slit (335) facing the lower surface of said capacitor.

13. In any one of paragraphs 1 to 12, An electronic device wherein the first distance is 0.2 mm or less.

14. In any one of paragraphs 3 to 13, An electronic device in which the above portion protrudes in the downward direction and fills the slit.

15. In any one of paragraphs 1 to 14, At least one slit (430) above, An electronic device comprising a first portion (431) parallel to the third side surface in the third direction of the capacitor, a second portion (432) parallel to the fourth side surface in the fourth direction of the capacitor, and a third portion (433) vertically connected to the first portion and the second portion and facing the lower surface of the capacitor.

Images