Blockchain server, power-source heat dissipation method and apparatus therefor and power source thereof, and storage medium

Abstract

Provided in the embodiments of the present application are a blockchain server, a power source heat dissipation method and apparatus therefor and a power source thereof, and a storage medium. The method comprises: determining a first component and a second component, which are included in a power source of a blockchain server, wherein the first component is a component, the service life of which is insensitive to a working temperature, and the second component is a component, the service life of which is sensitive to the working temperature; performing heat dissipation on the first component by means of liquid cooling; and performing heat dissipation on the second component by means of air cooling.

Description

Blockchain server and its power supply heat dissipation method, device, power supply and storage medium

[0001] This application claims priority to Chinese patent application number 2023109691199, filed with the Patent Office of China on August 3, 2023, entitled “Blockchain server and its power supply heat dissipation method, device, power supply and storage medium,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application belongs to the field of information technology, and in particular relates to a blockchain server and its power supply heat dissipation method, device, power supply and storage medium.

[0003] background

[0004] Generally speaking, blockchain technology is a new distributed infrastructure and computing method that utilizes a block-chain data structure to verify and store data, a distributed node consensus algorithm to generate and update data, cryptography to ensure secure data transmission and access, and smart contracts composed of automated script code to program and manipulate data. A blockchain network is a decentralized, peer-to-peer (P2P) network. There are no centralized services or hierarchical structures in a blockchain network; each node is a peer, collectively providing network services. Nodes in a blockchain network act as both clients and servers.

[0005] As blockchain servers grow in power, traditional air cooling methods are no longer sufficient, leading to a shift toward liquid cooling. Server power supplies now feature a standardized liquid cooling structure. When the coolant temperature is high, the internal temperature of the power supply also increases. However, the various components in a power supply have different heat generation and heat resistance characteristics. Using a standardized liquid cooling method could adversely affect specific components (for example, those with lower heat generation and / or lower temperature tolerance), thereby reducing the overall lifespan of the power supply.

[0006] Technical content

[0007] The present application provides a power supply heat dissipation method for a blockchain server, which is executed by the blockchain server and includes:

[0008] Determining a first component and a second component included in a power supply of a blockchain server, wherein the first component is a component whose service life is insensitive to an operating temperature, and the second component is a component whose service life is sensitive to an operating temperature;

[0009] dissipating heat from the first component using a liquid cooling method;

[0010] The second component is cooled by air cooling.

[0011] In some embodiments, determining the first component and the second component included in the power supply of the blockchain server includes:

[0012] Determining the heating power of components of the power supply;

[0013] Determine a component whose heat generation power is greater than or equal to a predetermined heat generation power threshold value as the first component;

[0014] A component whose heat generation power is less than the heat generation power threshold value is determined as the second component.

[0015] In some embodiments, determining the first component and the second component included in the power supply of the blockchain server includes:

[0016] determining temperature coefficients of components of the power supply;

[0017] Determine a component whose temperature coefficient is less than or equal to a predetermined temperature coefficient threshold value as the first component;

[0018] A component having a temperature coefficient greater than the temperature coefficient threshold value is determined as the second component.

[0019] In some embodiments, determining the first component and the second component included in the power supply of the blockchain server includes:

[0020] Determining the heating power and temperature coefficient of components of the power supply;

[0021] Determine a component having a temperature coefficient less than or equal to a predetermined temperature coefficient threshold value and a heating power greater than or equal to a predetermined heating power threshold value as the first component;

[0022] A component whose temperature coefficient is greater than the temperature coefficient threshold value and whose heat generation power is less than the heat generation power threshold value is determined as the second component.

[0023] In some embodiments, the heat dissipation of the first component by liquid cooling includes:

[0024] placing the first component on a liquid cooling plate via a heat conducting medium;

[0025] The heat dissipation of the second component by air cooling includes:

[0026] arranging the second component separately from the first component, wherein the second component has no heat exchange connection with the liquid cooling plate;

[0027] An air-cooling heat dissipation channel is provided for the second component.

[0028] In some embodiments, the first component includes at least one of the following:

[0029] Field effect transistor; transformer; inductor; insulated gate bipolar transistor; rectifier diode;

[0030] The second component includes at least one of the following:

[0031] Controller; electrolytic capacitor.

[0032] The present application provides a power supply heat dissipation device for a blockchain server, comprising:

[0033] a determination module, configured to determine a first component and a second component included in a power supply of a blockchain server, wherein the first component is a component whose service life is insensitive to an operating temperature, and the second component is a component whose service life is sensitive to an operating temperature;

[0034] a liquid cooling module, configured to cool the first component using liquid cooling;

[0035] The air-cooling heat dissipation module is used to dissipate heat from the second component by air cooling.

[0036] The present application provides a power supply for a blockchain server, including:

[0037] a first component, wherein the service life of the first component is insensitive to the operating temperature, and the first component is arranged on a liquid cooling plate, wherein the liquid cooling plate is configured to dissipate heat from the first component by liquid cooling;

[0038] a second component arranged separately from the first component, the second component having no heat exchange connection with the liquid cooling plate, and a service life of the second component being sensitive to operating temperature;

[0039] The air-cooling heat dissipation channel is used to dissipate heat from the second component by air cooling.

[0040] In some embodiments, the first component and the second component are included in the same functional module of the power supply.

[0041] The present application also provides a blockchain server, including:

[0042] a liquid cooling plate containing a cooling liquid;

[0043] a chip board comprising a plurality of chips, wherein the chip board has a heat exchange connection with the liquid cooling plate;

[0044] Control panel;

[0045] The chip board has a signal connection with the control board via a signal connection interface, and the chip board has a power connection with the power supply as described in any one of the above items via a power connection interface.

[0046] An embodiment of the present application also provides a computer-readable storage medium storing computer-readable instructions for executing the power supply heat dissipation method for a blockchain server as described in any one of the above items.

[0047] An embodiment of the present application also provides a computer program product, including a computer program, which is stored in a computer-readable storage medium; when a processor of a server reads the computer program from the computer-readable storage medium, the processor executes the computer program, so that the server executes the power supply heat dissipation method of the blockchain server described in any embodiment of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] FIG1 is a schematic diagram of a power supply and heat dissipation structure of a blockchain server in related art.

[0049] FIG2 is a flow chart of a power supply heat dissipation method for a blockchain server according to an embodiment of the present application.

[0050] FIG3 is a side view of the power supply heat dissipation structure of the blockchain server according to an embodiment of the present application.

[0051] FIG4 is a top view of the power supply heat dissipation structure of the blockchain server according to an embodiment of the present application.

[0052] FIG5 is a structural diagram of a power supply heat dissipation device of a blockchain server according to an embodiment of the present application.

[0053] FIG6 is a structural diagram of a power supply heat dissipation device of a blockchain server having a memory-processor architecture according to an embodiment of the present application.

[0054] FIG7 is a structural diagram of a blockchain server according to an embodiment of the present application.

[0055] Implementation Method

[0056] In order to make the description concise and intuitive, the solution of the present application is explained below by describing several representative implementation methods. A large number of details in the implementation methods are only used to help understand the solution of the present application. However, it is obvious that the technical solution of the present application may not be limited to these details when it is implemented. In order to avoid unnecessarily blurring the solution of the present application, some implementation methods are not described in detail, but only a framework is given. In the following, "including" means "including but not limited to", and "according to..." means "at least according to..., but not limited to only according to...". Due to the language habits of Chinese, when the number of a component is not specifically specified below, it means that the component can be one or more, or can be understood as at least one.

[0057] The temperature of the coolant (e.g., water) after dissipating heat for the blockchain server is usually high. The coolant after dissipating heat can be used to provide a heat source for heating systems or industrial applications, thereby realizing secondary utilization of energy.

[0058] In related technologies, when the coolant temperature is high, the internal temperature of the server power supply also increases, thus affecting the lifespan of the server power supply. Furthermore, currently, a unified liquid cooling method is typically used for each component in a blockchain server power supply. This unified liquid cooling method may have an adverse effect on specific components (e.g., those with low heat generation and / or low temperature tolerance), thereby affecting the overall lifespan of the power supply.

[0059] The following describes an exemplary heat dissipation structure of the power supply of the blockchain server in the related art in conjunction with Figure 1. Figure 1 is a schematic diagram of the heat dissipation structure of the power supply of the blockchain server in the related art. In Figure 1, the power supply housing 11 contains many components, including: a filter 21, an inductor 22, a metal insulated gate field effect transistor (MOSFET) 23, a controller chip 12, an electrolytic capacitor 13, a transformer 24 and a sampling chip 14. Among them: the filter 21, the inductor 22, the MOSFET23, the controller chip 12, the electrolytic capacitor 13, the transformer 24 and the sampling chip 14 are respectively poured onto the liquid cooling plate 10 through their respective thermal conductive glues 15, and are respectively connected to the liquid cooling plate 10 for heat exchange, thereby forming a unified liquid cooling heat dissipation method.

[0060] However, for components that generate less heat and / or have lower temperature tolerance values ​​(e.g., the controller chip 12, the electrolytic capacitor 13, and the sampling chip 14), this unified liquid cooling method has an adverse effect and may affect the service life of the components. For example, the coolant temperature at the inlet of the liquid cooling plate 10 may be high (e.g., 70 degrees), while the ideal operating temperature of the electrolytic capacitor 13 may be 20 to 30 degrees. At this time, the temperature of the electrolytic capacitor 13 that is heat-exchanging with the liquid cooling plate 10 will be unexpectedly significantly increased. If the temperature of the electrolytic capacitor 13 increases by 10 degrees, the life of the electrolytic capacitor 13 is reduced to approximately half of its original life, thereby affecting the service life of the electrolytic capacitor 13, and further affecting the life of the server power supply and the entire server.

[0061] Based on this, the components inside the power supply can be divided into two categories based on the characteristics of the various components: the first category is: components whose service life is not sensitive to the operating temperature; the second category is: components whose service life is sensitive to the operating temperature. For the first category of components, liquid cooling is used to dissipate heat, which not only ensures the heat dissipation performance of the components, but also fully increases the temperature of the coolant at the outlet to facilitate the subsequent comprehensive utilization of heat energy; for the second category of components, air cooling is used, which is independent of the liquid cooling method. In other words, the second category of components no longer exchange heat with the liquid cooling plate, but are independently cooled by air cooling. Compared with the unified liquid cooling method, the temperature of the second category of components can be significantly reduced, thereby improving the service life and stability of the second category of components.

[0062] FIG2 is a flow chart of a power supply heat dissipation method for a blockchain server provided in an embodiment of the present application. As shown in FIG2 , the method includes:

[0063] Step 101: Determine a first component and a second component included in a power supply of a blockchain server, wherein the first component is a component whose service life is insensitive to an operating temperature, and the second component is a component whose service life is sensitive to an operating temperature.

[0064] The heat generated by components in a blockchain server power supply during operation has an increasing relationship with their heat output. Considering that components with higher heat output typically have a greater temperature tolerance, heat output can be used directly as the criterion for distinguishing between the first and second components.

[0065] In some embodiments, step 101 includes: determining the heating power of the components of the power supply; determining the components whose heating power is greater than or equal to a predetermined heating power threshold value as the first component; and determining the components whose heating power is less than the heating power threshold value as the second component.

[0066] For example, assuming that the components of a power supply include components A, B, C, D, E, and F, a heating power threshold value can be determined based on empirical values ​​or test results. In some embodiments, the heating power threshold value is adjustable. The heating power of components A, B, C, D, E, and F can be determined separately by looking up a table or performing a test. Assume that the heating power of components A, B, and C is greater than or equal to the heating power threshold value, while the heating power of components D, E, and F is less than the heating power threshold value.

[0067] By comparing the respective heating powers of components A, B, C, D, E and F with the heating power threshold values, the components whose heating power is greater than or equal to the heating power threshold value (i.e., components A, B and C) are determined as first components, and the components whose heating power is less than the heating power threshold value (i.e., components D, E and F) are determined as second components.

[0068] In the embodiment of the present application, the heating power is directly used to distinguish the first component from the second component, so that the user can determine the heating power of each component by simply looking up the table or performing a test, and the components of the power supply can be divided into two categories according to the heating power, which has the advantage of convenient implementation.

[0069] The temperature coefficient of components in blockchain server power supplies can be used as a measure of their temperature tolerance. The temperature coefficient is the rate at which a component's physical properties change with temperature. For example, for a capacitor, the temperature coefficient is the ratio of the change in capacitance per 1°C change in temperature over a given temperature interval to the nominal capacitance at that temperature. For an inductor, the temperature coefficient is the ratio of the change in inductance per 1°C change in temperature over a given temperature interval to the nominal inductance at that temperature. Components with smaller temperature coefficients experience slower changes in their physical properties with temperature, resulting in generally better temperature tolerance and a service life that is less affected by temperature fluctuations.

[0070] In some embodiments of the present application, step 101 includes: determining the temperature coefficient of the components of the power supply; determining the components whose temperature coefficient is less than or equal to the temperature coefficient threshold value as the first component; and determining the components whose temperature coefficient is greater than the predetermined temperature coefficient threshold value as the second component.

[0071] For example, assuming that the components of a power supply include components A, B, C, D, E, and F, a temperature coefficient threshold value can be determined based on empirical values ​​or test results. In some embodiments, the temperature coefficient threshold value is adjustable. The temperature coefficients of components A, B, C, D, E, and F can be determined individually by looking up a table or performing a test. Assume that the determined temperature coefficients of components A, B, C, and D are greater than the temperature coefficient threshold value, while the temperature coefficients of components E and F are less than or equal to the temperature coefficient threshold value.

[0072] By comparing the respective temperature coefficients of components A, B, C, D, E and F with the temperature coefficient threshold value, the components whose temperature coefficients are greater than the temperature coefficient threshold value (that is, components A, B, C and D) are determined as second components, and the components whose temperature coefficients are less than the heat power threshold value (that is, components E and F) are determined as first components.

[0073] In the embodiment of the present application, the temperature coefficient is directly used to distinguish the first component from the second component, so that the user can determine the temperature coefficient of each component by simply looking up a table or performing a test, and the components of the power supply can be divided into two major categories based on the temperature coefficient, which also has the advantage of easy implementation.

[0074] In some embodiments of the present application, the first component and the second component can be distinguished by using the heat generation power used to characterize the amount of heat generated during operation and the temperature coefficient used to characterize the temperature tolerance.

[0075] In one embodiment, step 101 includes: determining the heating power and temperature coefficient of the components of the power supply; determining the component whose temperature coefficient is less than or equal to the temperature coefficient threshold value and the heating power is greater than or equal to the predetermined heating power threshold value as the first component; and determining the component whose temperature coefficient is greater than the temperature coefficient threshold value and the heating power is less than the heating power threshold value as the second component.

[0076] For example, assuming that the components of a power supply include components A, B, C, D, E, and F, the temperature coefficient threshold value and the heat generation coefficient threshold value can be determined based on empirical values ​​or test results. In some embodiments, the temperature coefficient threshold value and the heat generation coefficient threshold value are adjustable. The temperature coefficient and heat generation power of components A, B, C, D, E, and F can be determined by looking up a table or performing a test.

[0077] Assume that the determined heating power of components A, B, and C is less than the heating power threshold value, while the heating power of components D, E, and F is greater than or equal to the heating power threshold value. Assume that the determined temperature coefficients of components A, B, C, and D are greater than the temperature coefficient threshold value, while the temperature coefficients of components E and F are less than or equal to the temperature coefficient threshold value.

[0078] By comparing the temperature coefficients of components A, B, C, D, E, and F with the temperature coefficient threshold values, and comparing the heating powers of components A, B, C, D, E, and F with the heating power threshold values, the components (i.e., components E and F) whose own temperature coefficients are less than or equal to the temperature coefficient threshold value and whose own heating powers are greater than or equal to the heating power threshold value are determined as first components. The components (i.e., components A, B, and C) whose own temperature coefficients are greater than the temperature coefficient threshold value and whose own heating powers are less than the heating power threshold value are determined as second components. For components that cannot be classified as first components or second components (e.g., component D), liquid cooling or air cooling can be used for heat dissipation, and the embodiments of the present application do not limit this.

[0079] In this embodiment, the first component and the second component are distinguished by using both the heat generation power and the temperature coefficient, so that the components of the power supply can be more accurately divided into two categories: the first component and the second component.

[0080] Step 102: dissipate heat from the first component using a liquid cooling method.

[0081] Step 103: dissipate heat from the second component using air cooling.

[0082] In the process shown in FIG1 , there is no specific requirement for the order in which steps 102 and 103 are performed. That is, step 102 may be performed first, followed by step 103. Alternatively, step 103 may be performed first, followed by step 102. Alternatively, steps 102 and 103 may be performed simultaneously.

[0083] In some embodiments of the present application, the first component and the second component are included in the same functional module of the power supply. Therefore, after applying the embodiments of the present application, different heat dissipation methods can be used for components with different characteristics within the power supply, even for different components within the same functional module. This achieves refined heat dissipation and improves the service life and stability of the second component.

[0084] For example, a power supply usually includes a direct current-direct current (DC-DC) functional module. In related technologies, all components in the DC-DC functional module (e.g., filter capacitors and transformers) use the same liquid cooling method. After applying the embodiments of the present application, the filter capacitor can be determined as the second component and air cooling is used for heat dissipation, and the transformer can be determined as the first component and liquid cooling is used for heat dissipation, thereby achieving refined heat dissipation within the functional module, thereby improving the service life and stability of the second component.

[0085] In some embodiments of the present application, step 102 includes: placing a first component on a liquid cooling plate via a heat transfer medium; step 103 includes: placing a second component separately from the first component, wherein the second component has no heat exchange connection with the liquid cooling plate; and providing an air cooling heat dissipation channel for the second component. For example, the heat transfer medium may be thermally conductive adhesive. Thus, by placing the second component separately from the first component, heat generated by the first component can be prevented from being transferred to the second component, thereby preventing an undesirable increase in the temperature of the second component.

[0086] In one embodiment, the first component includes at least one of the following: a field effect transistor (FET); a transformer; an inductor; an insulated gate bipolar transistor (IGBT); a rectifier diode, etc.; the second component includes at least one of the following: a controller chip; an electrolytic capacitor; a sampling chip; a driver chip, etc.

[0087] For example, FET can be implemented as a junction field effect transistor (JFET) and a metal-oxide-semiconductor field-effect-transistor (MOSFET); the controller chip can be implemented as a digital signal processing (DSP) chip; the sampling chip can be implemented as a voltage sampling chip or a current sampling chip, and so on.

[0088] The above embodiments describe specific examples of the first component and the second component. Those skilled in the art will appreciate that such descriptions are merely exemplary and are not intended to limit the scope of protection of the embodiments of the present application.

[0089] In an embodiment of the present invention, a first component and a second component included in the power supply of the blockchain server are determined, wherein the first component is a component whose service life is insensitive to the operating temperature, and the second component is a component whose service life is sensitive to the operating temperature; liquid cooling is used to dissipate heat for the first component; and air cooling is used to dissipate heat for the second component. It can be seen that by adopting different heat dissipation methods for each component with different characteristics inside the power supply, an overall optimization of the heat dissipation effect and energy utilization effect can be achieved. For example: for components whose service life is sensitive to the operating temperature, the use of air cooling to dissipate heat can significantly reduce the operating temperature and increase the life of the component. For components whose service life is not sensitive to the operating temperature, the use of liquid cooling can not only ensure the heat dissipation performance of the component, but also fully increase the temperature of the coolant at the outlet, so as to facilitate the subsequent comprehensive utilization of thermal energy.

[0090] The following describes the power supply heat dissipation structure according to the embodiment of the present application.

[0091] Figure 3 is a side view of the power supply heat dissipation structure of the blockchain server according to an embodiment of the present application. Figure 4 is a top view of the power supply heat dissipation structure of the blockchain server according to an embodiment of the present application.

[0092] As shown in Figures 3 and 4, the power supply housing 11 includes many components, including: a filter 21, an inductor 22, a MOSFET 23, a controller chip 12, an electrolytic capacitor 13, a transformer 24, and a sampling chip 14. Among them:

[0093] The filter 21, inductor 22, MOSFET 23, and transformer 24 are classified as first components whose service life is insensitive to operating temperature. Specific classification criteria for the first components may include any of the following: (1) the heat generation power is greater than or equal to a predetermined heat generation power threshold; (2) the temperature coefficient is less than or equal to a temperature coefficient threshold; (3) the temperature coefficient is less than or equal to the temperature coefficient threshold and the heat generation power is greater than or equal to the heat generation power threshold.

[0094] The controller chip 12, the electrolytic capacitor 13, and the sampling chip 14 are classified as second components whose service life is sensitive to the operating temperature. Specific classification criteria corresponding to the second components may include any one of the following: (1): the heat generation power is less than a predetermined heat generation power threshold value; (2): the temperature coefficient is greater than a predetermined temperature coefficient threshold value; (3): the heat generation power is less than a predetermined heat generation power threshold value and the temperature coefficient is greater than a predetermined temperature coefficient threshold value.

[0095] The filter 21, inductor 22, MOSFET 23, and transformer 24 are each poured onto the liquid cooling plate 10 via respective thermally conductive adhesives 15 and are each heat exchange connected to the liquid cooling plate 10. Liquid cooling of the filter 21, inductor 22, MOSFET 23, and transformer 24 is performed via the liquid cooling plate 10.

[0096] Any of the controller chip 12, the electrolytic capacitor 13 and the sampling chip 14 is not in thermal contact with any of the filter 21, the inductor 22, the MOSFET 23 and the transformer 24. Moreover, the controller chip 12, the electrolytic capacitor 13 and the sampling chip 14 have their own air-cooling heat dissipation channels. For example, air enters the housing 11 through the inlet 17 and flows through the controller chip 12 in the direction of arrow S1 to dissipate heat for the controller chip 12; air enters the housing 11 through the inlet 17 and flows through the electrolytic capacitor 13 in the direction of arrow S2 to dissipate heat for the electrolytic capacitor 13; air enters the housing 11 through the inlet 20 and flows through the sampling chip 14 in the direction of arrow S3 to dissipate heat for the sampling chip 14. Moreover, after being heated, the air flowing through each air-cooling heat dissipation channel is uniformly discharged from the housing 11 through the fan 18.

[0097] It can be seen that compared to the unified liquid cooling heat dissipation method in the related art, the controller chip 12, electrolytic capacitor 13 and sampling chip 14 do not have a heat exchange connection with the liquid cooling plate 10, thereby preventing the controller chip 12, electrolytic capacitor 13 and sampling chip 14 from being heated unexpectedly. Moreover, the controller chip 12, electrolytic capacitor 13 and sampling chip 14 are not in contact with the first component (filter 21, inductor 22, MOSFET 23 and transformer 24), preventing them from being heated by the first component. In addition, the controller chip 12, electrolytic capacitor 13 and sampling chip 14 all omit their respective thermal conductive adhesives 15.

[0098] FIG5 is a structural diagram of a power supply heat dissipation device of a blockchain server according to an embodiment of the present application. As shown in FIG5 , the power supply heat dissipation device 500 includes:

[0099] A determination module 501 is configured to determine a first component and a second component included in a power supply of a blockchain server, wherein the first component is a component whose service life is insensitive to an operating temperature, and the second component is a component whose service life is sensitive to an operating temperature;

[0100] A liquid cooling module 502 is configured to cool the first component using liquid cooling;

[0101] The air cooling module 503 is used to dissipate heat from the second component by air cooling.

[0102] In some embodiments, the determination module 501 is used to determine the heating power of the components of the power supply; determine the components whose heating power is greater than or equal to the predetermined heating power threshold value as the first component; and determine the components whose heating power is less than the heating power threshold value as the second component.

[0103] In some embodiments, the determination module 501 is used to determine the temperature coefficient of the components of the power supply; determine the component with a temperature coefficient less than or equal to a predetermined temperature coefficient threshold value as the first component; and determine the component with a temperature coefficient greater than the temperature coefficient threshold value as the second component.

[0104] In some embodiments, the determination module 501 is used to determine the heating power and temperature coefficient of the components of the power supply; a component whose temperature coefficient is less than or equal to a predetermined temperature coefficient threshold value and whose heating power is greater than or equal to a predetermined heating power threshold value is determined as a first component; and a component whose temperature coefficient is greater than the temperature coefficient threshold value and whose heating power is less than the heating power threshold value is determined as a second component.

[0105] In some embodiments, a liquid cooling heat dissipation module 502 is used to arrange the first component on a liquid cooling plate via a heat conducting medium; an air cooling heat dissipation module 503 is used to arrange the second component separately from the first component, wherein the second component does not have a heat exchange connection with the liquid cooling plate; and an air cooling heat dissipation channel is set for the second component.

[0106] The present application also provides a power supply for a blockchain server. The power supply comprises: a first component, the service life of which is insensitive to operating temperature, disposed on a liquid cooling plate that dissipates heat from the first component; a second component, disposed separately from the first component and not connected to the liquid cooling plate for heat exchange, the service life of which is sensitive to operating temperature; and an air-cooled heat dissipation channel for dissipating heat from the second component using air cooling.

[0107] In one embodiment, the first component and the second component are included in the same functional module of the power supply, thereby achieving refined heat dissipation within the functional module.

[0108] FIG6 is a structural diagram of a power supply heat dissipation device of a blockchain server having a memory-processor architecture according to an embodiment of the present application.

[0109] As shown in Figure 6, the power cooling device of the blockchain server includes: a processor 601 and a memory 602. The memory 602 stores an application program executable by the processor 601, which is used to enable the processor 601 to execute any of the power cooling methods for the blockchain server described above. The memory 602 can be implemented as a variety of storage media, such as an electrically erasable programmable read-only memory (EEPROM), a flash memory (Flash memory), or a programmable read-only memory (PROM). The processor 601 can be implemented as one or more central processing units (CPUs) or one or more field programmable gate arrays (FPGAs), wherein the FPGAs integrate one or more CPU cores. Specifically, the CPU or CPU core can be implemented as a CPU, an MCU, or a digital signal processor (DSP).

[0110] The present application also proposes a blockchain server. FIG7 is a structural diagram of the blockchain server of the present application. As shown in FIG7, the blockchain server includes:

[0111] Liquid cooling plate 704, wherein the liquid cooling plate 704 contains cooling liquid;

[0112] Chip board 701, wherein the chip board 701 has a heat exchange relationship with the liquid cooling plate 704 (for example, the liquid cooling plate 704 and the chip board 701 are in direct contact or in contact through a heat conducting medium to achieve heat exchange);

[0113] The control board 702 includes a memory and a processor. For example, the memory may store an application program executable by the processor, which enables the processor to execute any of the above methods for dissipating power supply heat for a blockchain server. The chip board 701 forms a signal connection with the control board 702 via a signal connection interface, and the chip board 701 forms an electrical connection with the power supply 703 as described above via a power connection interface.

[0114] It should be noted that not all steps and modules in the above-mentioned processes and structure diagrams are required, and certain steps or modules may be omitted based on actual needs. The order in which the steps are executed is not fixed and may be adjusted as needed. The division of the modules is merely for the purpose of describing the functional divisions employed. In actual implementation, a module may be implemented by multiple modules, and the functions of multiple modules may be implemented by the same module. These modules may be located in the same device or in different devices. The hardware modules in each embodiment may be implemented mechanically or electronically. For example, a hardware module may include a specially designed permanent circuit or logic device (such as a dedicated processor, such as an FPGA or ASIC) to perform a specific operation. A hardware module may also include a programmable logic device or circuit (such as a general-purpose processor or other programmable processor) temporarily configured by software to perform a specific operation. Whether to implement the hardware module mechanically, using a dedicated permanent circuit, or using a temporarily configured circuit (such as one configured by software) can be determined based on cost and time considerations.

[0115] The application also provides a machine-readable storage medium, which stores instructions for making a machine perform a method as described in the application. Specifically, a system or device equipped with a storage medium can be provided, on which a software program code for realizing the function of any one of the embodiments described above is stored, and the computer (or CPU or MPU) of the system or device is read out and executes the program code stored in the storage medium. In addition, the operating system etc. operated on the computer can be made to complete part or all of the actual operations by the instructions based on the program code. The program code read out from the storage medium can also be written to the memory provided in the expansion board inserted into the computer or to the memory provided in the expansion unit connected to the computer, and then the CPU etc. installed on the expansion board or expansion unit are made to perform part and all of the actual operations based on the instructions of the program code, thereby realizing the function of any one of the embodiments described above. The storage medium implementation for providing the program code includes a floppy disk, a hard disk, a magneto-optical disk, an optical disk (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a non-volatile memory card and a ROM. Alternatively, the program code may be downloaded from a blockchain server computer or the cloud via a communications network.

[0116] In this document, "schematic" means "serving as an example, instance or illustration", and any diagram or embodiment described as "schematic" in this document should not be interpreted as a more preferred or more advantageous technical solution. In order to keep the drawings concise, each figure only schematically shows the parts related to the present application, and does not represent its actual structure as a product. In addition, in order to keep the drawings concise and easy to understand, in some figures, only one of the components with the same structure or function is schematically drawn, or only one of them is marked. In this document, "one" does not mean that the number of relevant parts of the present application is limited to "only one", and "one" does not mean excluding the situation where the number of relevant parts of the present application is "more than one". In this document, "upper", "lower", "front", "back", "left", "right", "inside", "outside" and the like are only used to indicate the relative positional relationship between the relevant parts, rather than to limit the absolute positions of these relevant parts.

[0117] The above description is only a preferred embodiment of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A power cooling method for a blockchain server, executed by the blockchain server, comprising: Determine a first component and a second component included in a power supply of a blockchain server, wherein the first component is a component whose service life is not sensitive to an operating temperature, and the second component is a component whose service life is sensitive to an operating temperature; Using liquid cooling to dissipate heat from the first component; The second component is cooled by air.

2. The method according to claim 1, wherein: The determining of a first component and a second component included in a power supply of the blockchain server includes: Determining the heating power of components of the power supply; Determine a component whose heat generation power is greater than or equal to a predetermined heat generation power threshold value as the first component; A component whose heat generation power is less than the heat generation power threshold value is determined as the second component.

3. The method according to claim 1, wherein: The determining of a first component and a second component included in a power supply of the blockchain server includes: determining temperature coefficients of components of the power supply; Determine a component whose temperature coefficient is less than or equal to a predetermined temperature coefficient threshold value as the first component; A component whose temperature coefficient is greater than the temperature coefficient threshold value is determined as the second component.

4. The method according to claim 1, wherein: The determining of a first component and a second component included in a power supply of the blockchain server includes: Determining the heating power and temperature coefficient of components of the power supply; Determine a component whose temperature coefficient is less than or equal to a predetermined temperature coefficient threshold value and whose heating power is greater than or equal to a predetermined heating power threshold value as the first component; A component whose temperature coefficient is greater than the temperature coefficient threshold value and whose heat generation power is less than the heat generation power threshold value is determined as the second component.

5. The method according to any one of claims 1 to 4, wherein: The heat dissipation of the first component by liquid cooling includes: Arranging the first component on a liquid cooling plate via a heat conducting medium; Wherein, the heat dissipation of the second component by air cooling includes: Arranging the second component separately from the first component, wherein the second component has no heat exchange connection with the liquid cooling plate; and An air cooling channel is provided for the second component.

6. The method according to any one of claims 1 to 4, wherein: The first component includes at least one of the following: Field effect tube; transformer; inductor; insulated gate bipolar transistor; rectifier diode; The second component includes at least one of the following: a controller chip; an electrolytic capacitor; a sampling chip; and a driving chip.

7. A power cooling device for a blockchain server, comprising: A determination module, configured to determine a first component and a second component included in a power supply of a blockchain server, wherein the first component is a component whose service life is not sensitive to an operating temperature, and the second component is a component whose service life is sensitive to an operating temperature; A liquid cooling module, used for cooling the first component by liquid cooling; The air-cooling heat dissipation module is used to dissipate heat for the second component by air cooling.

8. A power supply for a blockchain server, comprising: A first component, the service life of the first component is insensitive to the operating temperature, and the first component is arranged on a liquid cooling plate, wherein the liquid cooling plate is used to perform heat dissipation on the first component in a liquid cooling manner; a second component, arranged separately from the first component, the second component having no heat exchange connection with the liquid cooling plate, and a service life of the second component being sensitive to an operating temperature; The air-cooling heat dissipation channel is used to dissipate heat for the second component by air cooling.

9. The power supply according to claim 8, wherein: The first component and the second component are included in the same functional module of the power supply.

10. A blockchain server, comprising: a liquid cooling plate, wherein the liquid cooling plate contains a cooling liquid; a chip board, comprising a plurality of chips, wherein the chip board has a heat exchange connection with the liquid cooling plate; Control panel; The chip board has a signal connection with the control board via a signal connection interface, and the chip board has a power connection with a power supply as described in any one of claims 8 to 9 via a power connection interface.

11. A computer-readable storage medium, wherein computer-readable instructions are stored, and the computer-readable instructions are used to execute the power heat dissipation method of the blockchain server as described in any one of claims 1 to 6.

12. A computer program product, comprising a computer program, wherein the computer program is stored in a computer-readable storage medium; when a processor of a server reads the computer program from the computer-readable storage medium, the processor executes the computer program, so that the server executes the power supply heat dissipation method of the blockchain server described in any one of claims 1 to 6.

Images