Electronic device

Abstract

Embodiments of the present application relate to the technical field of terminal products, and provide an electronic device. The electronic device comprises a shell assembly, a mainboard, a heating unit, a fan, and a heat dissipation module. The shell assembly has a mounting cavity therein, and the mainboard, the heating unit, and the heat dissipation module are all arranged in the mounting cavity. The mainboard is mounted on the shell assembly, one side of the heating unit is mounted on the mainboard, and the other side of the heating unit is connected to the heat dissipation module. The heat dissipation module is spaced apart from the shell assembly, and a thermal resistance structure is provided between the heat dissipation module and the shell assembly. The shell assembly is provided with an air inlet and an air outlet, the air inlet and the air outlet are both communicated with the mounting cavity, and the fan is used for driving air at at least part of the heat dissipation module to flow out of the mounting cavity by means of the air outlet. In this way, air at the heat dissipation module is driven by the fan to flow out of the shell assembly to dissipate heat, and the thermal resistance structure is provided between the heat dissipation module and the shell assembly, so that the shell assembly is not prone to have the problem of overheating.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 3, 2023, with application number 202310975880.3 and application name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of terminal products, and in particular to an electronic device. Background Art

[0003] As the performance of electronic devices such as mobile phones and tablets continues to improve, the heat generated by the heating units in the housing components of the electronic devices is getting higher and higher. To avoid overheating in the electronic devices, the heat generated by the heating units needs to be dissipated to the external environment more quickly.

[0004] In related technologies, an electronic device may include a housing assembly, a mainboard, and a heating unit. The mainboard and the heating unit are both located in the housing assembly, and the heating unit is installed on the mainboard. The heating unit can be connected to the housing assembly through a thermal interface material (TIM), so that the heat generated by the heating unit can be transferred to the housing assembly more efficiently, so that the heating unit can dissipate the heat to the external environment through the housing assembly.

[0005] However, in the related art, the housing assembly of the electronic device is prone to overheating.

[0006] Summary of the Invention

[0007] An embodiment of the present application provides an electronic device, in which a heat dissipation module and a fan are arranged in a housing assembly of the electronic device, the heat dissipation module is connected to a heating unit, and a thermal resistance structure is provided between the heat dissipation module and the housing assembly. The fan drives air at the heat dissipation module to flow out of the housing assembly to dissipate heat, thereby making it less likely for the housing assembly to overheat.

[0008] The present application provides an electronic device, comprising a housing assembly, a mainboard, a heating unit, a fan and a heat dissipation module. The housing assembly has an installation cavity, and the mainboard, the heating unit and the heat dissipation module are all arranged in the installation cavity. The mainboard is mounted on the housing assembly, one side of the heating unit is mounted on the mainboard, and the other side of the heating unit is connected to the heat dissipation module. The heat dissipation module is spaced apart from the housing assembly, and a thermal resistance structure is provided between the heat dissipation module and the housing assembly. The housing assembly has an air inlet and an air outlet, both of which are connected to the installation cavity, and the fan is used to drive the air at least in part of the heat dissipation module to flow out of the installation cavity through the air outlet.

[0009] In the electronic device of the embodiment of the present application, the heat dissipation module is connected to the heating unit, and the heat generated by the heating unit can be transferred to the heat dissipation module more efficiently. Since there is a thermal resistance structure between the heat dissipation module and the housing assembly, the thermal resistance structure will inhibit the heat from the heat dissipation module from being transferred to the housing assembly, and the heat generated by the heating unit will accumulate in large quantities at the heat dissipation module. After the heat generated by the heating unit is transferred to the heat dissipation module, the heat on the heat dissipation module will be transferred to the surrounding air. The air that has absorbed the heat from the heat dissipation module can flow out of the installation cavity through the air outlet under the drive of the fan, and the heat generated by the heating unit can be dissipated to the external environment. The lower temperature air in the external environment can enter the installation cavity through the air inlet to replace the air flowing out through the air outlet. In this way, the heat generated by the heating unit can be dissipated to the external environment by means of air-cooled heat dissipation module. The temperature of the heat dissipation module is higher, and the efficiency of heat exchange between the heat dissipation module and the surrounding air is higher, which can make the efficiency of heat dissipation of the heating unit through the heat dissipation module higher, so that the heating unit can operate at higher power consumption, which is conducive to the high performance operation of the electronic device. Furthermore, because the thermal resistance structure inhibits the transfer of heat from the heat dissipation module to the housing assembly, the temperature of the heat dissipation module will be higher than that of the housing assembly. Furthermore, the heat from the heat dissipation module can be more efficiently dissipated to the external environment through the air flowing out of the mounting cavity, preventing the heat generated by the heat generating unit from accumulating in large quantities on the housing assembly, making the housing assembly less susceptible to overheating. Furthermore, some of the heat from the heat dissipation module can be transferred to the housing assembly through the thermal resistance structure. When the housing assembly is at a temperature that provides a good user experience and is less likely to affect the performance of components such as the display screen mounted on the surface of the housing assembly, some of the heat generated by the heat generating unit can also be naturally dissipated through the housing assembly, thus assisting in heat dissipation.

[0010] In a possible implementation, the heat dissipation module includes a first heat equalizing unit, the heating unit is connected to the first heat equalizing unit, and the fan is used to drive air in at least a portion of the first heat equalizing unit to flow out of the installation cavity through the air outlet.

[0011] In a possible embodiment, the heat dissipation module includes a first heat dissipation unit and a heat sink. The heating unit is connected to the first heat dissipation unit. The heat sink is arranged on the surface of the first heat dissipation unit. The fan is used to drive the air at the heat sink to flow out of the installation cavity through the air outlet.

[0012] In a possible implementation manner, the heat sink is spaced apart from the mainboard in the length direction or the width direction of the mainboard.

[0013] In a possible implementation, in the thickness direction of the mainboard, the heat generating unit is located between the first heat dissipating unit connected thereto and the mainboard, and the first heat dissipating unit is connected to a surface of the heat generating unit facing away from the mainboard.

[0014] In a possible implementation, the heat sink of the heat dissipation module is disposed on a surface of the first heat dissipation unit facing the mainboard.

[0015] In a possible implementation, the thermal resistance structure includes a gap between the heat dissipation module and the housing assembly.

[0016] In a possible implementation, the thermal resistance structure includes a thermal resistance element disposed between the heat dissipation module and the housing assembly, one side of the thermal resistance element is connected to the heat dissipation module, and the other side of the thermal resistance element is connected to the housing assembly.

[0017] In one possible embodiment, the housing assembly includes a first sidewall and a second heat spreader. The mainboard includes a first side surface, on which a heating unit is mounted. The first sidewall is opposite the first side surface, and the second heat spreader is mounted on an inner wall of the first sidewall. The heat dissipation module is connected to the heating unit mounted on the first side surface. The orthographic projection of the heat dissipation module in the thickness direction of the mainboard at least partially overlaps with the orthographic projection of the second heat spreader in the thickness direction of the mainboard.

[0018] In one possible embodiment, the housing assembly includes an air duct. The mounting cavity includes a ventilation cavity within the air duct and a sealed cavity outside the air duct. The mainboard and the heating unit are disposed within the sealed cavity. The air duct has a through-wall hole, and the heat dissipation module is disposed within the through-wall hole. The heat dissipation module is sealedly connected to the air duct at the through-wall hole to separate the ventilation cavity from the sealed cavity. The air inlet and air outlet are both connected to the ventilation cavity. The portion of the heat dissipation module located within the sealed cavity is connected to the heating unit. A fan is used to drive air from the portion of the heat dissipation module located within the ventilation cavity to flow out of the ventilation cavity through the air outlet.

[0019] In a possible implementation manner, the fan is installed in the installation cavity.

[0020] In a possible implementation, the fan is installed on the heat dissipation module.

[0021] In a possible implementation, the heat dissipation module is installed on the mainboard.

[0022] In a possible implementation, the heat dissipation module is connected to the heat generating unit via a first thermal interface medium.

[0023] In one possible embodiment, the electronic device further includes a controller electrically connected to the fan. The controller is configured to control the fan to be turned off when the temperature of the electronic device is lower than a preset temperature, and to control the fan to be turned on when the temperature of the electronic device is higher than or equal to the preset temperature.

[0024] In a possible embodiment, the mainboard includes a second side surface, the first side surface and the second side surface of the mainboard are arranged opposite to each other, the heating unit is installed on the first side surface, and the second side surface is connected to the inner wall of the shell assembly through a second thermal interface medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic diagram of an electronic device provided in an embodiment of the present application;

[0026] FIG2 is a schematic diagram of another electronic device provided by an embodiment of the present application in a flattened state;

[0027] FIG3 is a schematic diagram of the electronic device in FIG2 in a folded state;

[0028] FIG4 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application;

[0029] FIG5 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application;

[0030] FIG6 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application;

[0031] FIG7 is a schematic diagram of a first side wall structure and a heat dissipation module of another electronic device provided by an embodiment of the present application from a perspective of the first side wall structure facing the mainboard;

[0032] FIG8 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application;

[0033] FIG9 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application;

[0034] FIG10 is a schematic internal diagram of another electronic device provided in an embodiment of the present application;

[0035] FIG11 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application.

[0036] Description of reference numerals:

[0037] 1. Display screen;

[0038] 2. Rotating shaft mechanism;

[0039] 100. Shell assembly;

[0040] 110, middle frame; 120, back cover; 130, air inlet; 140, air outlet; 150, first side wall structure; 151, first side wall; 152, second heat soaking unit; 160, second side wall structure; 161, second side wall; 162, third heat soaking unit; 170, surrounding wall structure;

[0041] 200, heating unit;

[0042] 300, heat dissipation module;

[0043] 310, first heat-sinking unit; 320, heat sink;

[0044] 400, fan;

[0045] 500, air duct;

[0046] 600, mounting cavity;

[0047] 610, sealed cavity; 620, ventilation cavity;

[0048] 710, first gap; 720, thermal resistance element;

[0049] 810, first thermal interface medium; 820, second gap; 830, second thermal interface medium;

[0050] 900, motherboard;

[0051] 910, first side; 920, second side;

[0052] x, thickness direction of the main board. DETAILED DESCRIPTION

[0053] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0054] An embodiment of the present application provides an electronic device, which may include but is not limited to a tablet computer (portable Android device, PAD), a laptop computer, a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self-driving), a wireless terminal in remote medical (remote medical), a wireless terminal in a smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in a smart city (smart city), a wireless terminal in a smart home (smart home) and other mobile terminals or fixed terminals.

[0055] It is understandable that the electronic device may also be referred to as user equipment (UE) or terminal, etc.

[0056] In the embodiments of the present application, an electronic device is taken as an example to be described as a handheld device with a wireless communication function. The handheld device with a wireless communication function may be a mobile phone.

[0057] FIG1 is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0058] As shown in FIG1 , in an embodiment of the present application, an electronic device includes a housing assembly 100, a mainboard 900, a heating unit 200, and a display screen 1. The display screen 1 is mounted on the surface of the housing assembly 100. The housing assembly 100 has a mounting cavity 600 (as shown in FIG4 below). The mainboard 900 and the heating unit 200 are disposed within the mounting cavity 600. The mainboard 900 is mounted on the housing assembly 100. The heating unit 200 is mounted on and electrically connected to the mainboard 900. The display screen 1 can be electrically connected to the mainboard 900 via a cable.

[0059] It is understandable that the heating unit 200 may be installed on only one side of the mainboard 900 , or the heating units 200 may be installed on both sides of the mainboard 900 .

[0060] For example, the display screen 1 can be mounted on the surface of the housing assembly 100 by bonding, clamping, or the like.

[0061] For example, the mainboard 900 may be mounted on the inner wall of the housing assembly 100 by fastener connection, snap connection, or the like.

[0062] Exemplarily, the heating unit 200 may include one or more heating devices, for example, the heating unit 200 may include one or more heating devices such as a chip and a power supply. The chip may be a central processing unit (CPU), a graphics processing unit (GPU), a data processing unit (DPU), etc.

[0063] For example, the thickness direction of the mainboard 900 may be the same as the thickness direction of the housing assembly 100 in which it is located.

[0064] In an embodiment of the present application, the shell assembly 100 may include a middle frame 110 and a back cover 120. The back cover 120 is connected to one side of the middle frame 110 in the thickness direction. The other side of the middle frame 110 in the thickness direction may be installed with a display screen 1. The two sides of the middle frame 110 in the thickness direction may be used to support the display screen 1 and the back cover 120 respectively. An installation cavity 600 is formed between the middle frame 110 and the back cover 120.

[0065] For example, the mainboard 900 may be mounted on the middle frame 110 by fastener connection, snap connection, or the like.

[0066] For example, the display screen 1 can be mounted on the surface of the middle frame 110 by bonding, snapping, or the like.

[0067] For example, the back cover 120 can be mounted on the middle frame 110 by bonding, snapping, fastening, or the like.

[0068] In some examples, the electronic device may include multiple display screens 1 . In addition to the display screen 1 mounted on the middle frame 110 , a display screen 1 may also be mounted on the back cover 120 .

[0069] For example, the display screen 1 located at the back cover 120 can be mounted on the back cover 120 by bonding, snapping, or the like.

[0070] In some embodiments of the present application, the electronic device may be a non-foldable device, for example, the electronic device may be a tablet phone, a tablet computer, etc. When the electronic device is a non-foldable device, the electronic device may include a housing assembly 100 .

[0071] FIG2 is a schematic diagram of another electronic device provided in an embodiment of the present application in a flattened state, and FIG3 is a schematic diagram of the electronic device in FIG2 in a folded state.

[0072] As shown in Figures 2 and 3, in other embodiments of the present application, the electronic device may be a foldable device having a flattened state and a folded state. For example, the electronic device may be a foldable mobile phone, a laptop computer, etc. When the electronic device is a foldable device, the electronic device includes at least two housing assemblies 100 and a hinge mechanism 2 disposed between the two housing assemblies 100. The two adjacent housing assemblies 100 are rotatably connected by the hinge mechanism 2. By rotating the two adjacent housing assemblies 100 toward and away from each other, the electronic device can be switched between the flattened state and the folded state.

[0073] When the electronic device is a foldable device, the electronic device may include two, three, four or more housing assemblies 100 , and the electronic device may be an electronic device that can be folded into two, three, four or more layers.

[0074] When the electronic device is in a flat state, all housing assemblies 100 may be arranged along the length direction or the width direction of the electronic device.

[0075] When the electronic device is a foldable device, part of the housing assembly 100 can be used to install the display screen 1, and part of the housing assembly 100 is not used to install the display screen 1. Alternatively, all of the housing assembly 100 can be used to install the display screen 1.

[0076] When the electronic device is a foldable device, the display screen 1 can be a flexible screen, which can be installed on the surface of multiple shell components 100. Specifically, the flexible screen can be installed on the middle frame 110 of multiple shell components 100, and the flexible screen can be folded and flattened under the drive of the shell component 100.

[0077] When the electronic device is a foldable device, different display screens 1 can be installed on the surfaces of at least two housing components 100 .

[0078] When the electronic device is a foldable device, each housing assembly 100 has a mounting cavity 600, and the mounting cavity 600 of at least one housing assembly 100 is mounted with a motherboard 900 and a heating unit 200. When motherboards 900 are mounted in the mounting cavities 600 of multiple housing assemblies 100, the motherboards 900 in the mounting cavities 600 of different housing assemblies 100 can be connected via a flexible circuit board.

[0079] In related technologies, the heating unit can be connected to the inner wall of the shell assembly through a thermal interface material (TIM), so that the heat generated by the heating unit can be transferred to the shell assembly more efficiently, so that the heat generated by the heating unit can be dissipated into the external environment through the shell assembly.

[0080] In the related art, since the heating unit mainly relies on the shell assembly for heat dissipation, the heat generated by the heating unit needs to be efficiently transferred to the shell assembly. A large amount of heat is likely to accumulate on the shell assembly, which makes the shell assembly prone to overheating. When the shell assembly is overheated, it will affect the user experience and the performance of components such as the display screen mounted on the surface of the shell assembly. In addition, on the basis of good user experience and the performance of components such as the display screen mounted on the surface of the shell assembly is not easily affected, the maximum temperature allowed by the shell assembly will be limited, that is, the temperature of the shell assembly will not be too high. After the maximum temperature allowed by the shell assembly is limited, the temperature difference between the shell assembly and the external environment is small, which makes the efficiency of the heat dissipation of the heating unit through the shell assembly low, resulting in limited power consumption of the heating unit, which is not conducive to the high-performance operation of electronic equipment.

[0081] FIG4 is a schematic internal diagram of another electronic device provided in an embodiment of the present application, wherein the x direction is the thickness direction of the mainboard.

[0082] As shown in FIG4 , and with reference to FIG1 to FIG3 , based on this, in an embodiment of the present application, the electronic device further includes a fan 400 and a heat dissipation module 300 . The heat dissipation module 300 is disposed within the mounting cavity 600 . The mainboard 900 is mounted on the housing assembly 100 , one side of the heat dissipation unit 200 is mounted on the mainboard 900 , and the other side of the heat dissipation unit 200 is connected to the heat dissipation module 300 . The heat dissipation module 300 is spaced apart from the housing assembly 100 , that is, the heat dissipation module 300 and the housing assembly 100 are not in direct contact. A thermal resistance structure is provided between the heat dissipation module 300 and the housing assembly 100 . The housing assembly 100 has an air inlet 130 and an air outlet 140 , both of which are in communication with the mounting cavity 600 . The fan 400 is mounted on the housing assembly 100 , and the fan 400 is used to drive air from at least a portion of the heat dissipation module 300 to flow out of the mounting cavity 600 through the air outlet 140 .

[0083] It is understood that the thermal resistance structure is used to suppress heat transfer between the heat dissipation module 300 and the housing assembly 100. When heat is transferred from the heat dissipation module 300 to the housing assembly 100 through the thermal resistance structure, the temperature of the heat dissipation module 300 is higher than the temperature of the housing assembly 100. When heat is transferred from the housing assembly 100 to the heat dissipation module 300 through the thermal resistance structure, the temperature of the housing assembly 100 is higher than the temperature of the heat dissipation module 300.

[0084] It should be noted that the thermal resistance structure does not completely isolate the heat transfer between the heat dissipation module 300 and the shell assembly 100. When there is a temperature difference between the heat dissipation module 300 and the shell assembly 100, heat can be transferred between the heat dissipation module 300 and the shell assembly 100 at a lower thermal conductivity.

[0085] Exemplarily, the thermal resistance structure may include one or more of a first gap 710 located between the heat dissipation module 300 and the housing assembly 100 , a thermal resistance member 720 (as shown in FIG. 5 below), and the like.

[0086] In this way, the heat dissipation module 300 is connected to the heating unit 200, and the heat generated by the heating unit 200 can be transferred to the heat dissipation module 300 more efficiently. Since there is a thermal resistance structure between the heat dissipation module 300 and the shell assembly 100, the thermal resistance structure will inhibit the heat on the heat dissipation module 300 from being transferred to the shell assembly 100. A large amount of heat generated by the heating unit 200 will accumulate at the heat dissipation module 300. After the heat generated by the heating unit 200 is transferred to the heat dissipation module 300, the heat on the heat dissipation module 300 will be transferred to the surrounding air. The air that has absorbed the heat on the heat dissipation module 300 can flow out of the installation cavity 600 through the air outlet 140 under the drive of the fan 400, and the heat generated by the heating unit 200 can be dissipated to the external environment. The air with lower temperature in the external environment can enter the installation cavity 600 through the air inlet 130 to replace the air flowing out through the air outlet 140. In this way, the heat generated by the heating unit 200 can be dissipated into the external environment through the air-cooled heat dissipation module 300. The temperature of the heat dissipation module 300 is relatively high, and the heat dissipation module 300 and the surrounding air are highly efficient. This allows the heat dissipation efficiency of the heating unit 200 through the heat dissipation module 300 to be relatively high, allowing the heating unit 200 to operate at a relatively high power consumption, which is beneficial for the high-performance operation of the electronic device. In addition, because the thermal resistance structure inhibits the transfer of heat from the heat dissipation module 300 to the housing assembly 100, the temperature of the heat dissipation module 300 will be higher than that of the housing assembly 100, and the heat from the heat dissipation module 300 can be dissipated more efficiently into the external environment through the air flowing out of the mounting cavity 600, so that the heat generated by the heating unit 200 will not accumulate in large quantities on the housing assembly 100, and the housing assembly 100 is less likely to overheat. In addition, part of the heat on the heat dissipation module 300 can be transferred to the shell assembly 100 through the thermal resistance structure. When the shell assembly 100 is at a temperature where the user experience is good and the performance of components such as the display screen 1 mounted on the surface of the shell assembly 100 is not easily affected, part of the heat generated by the heating unit 200 can also be naturally dissipated through the shell assembly 100, and the shell assembly 100 can play a role in auxiliary heat dissipation.

[0087] It is understandable that due to the large thermal resistance of the mainboard 900 , the heat generated by the heating unit 200 is more easily dissipated through the heat dissipation module 300 , and is not easily transferred to the housing assembly 100 through the mainboard 900 .

[0088] It is understood that, except for the portion of the heat dissipation module 300 that is connected to the heating unit 200, the rest of the heat dissipation module 300 and the housing assembly 100 all have a thermal resistance structure. When the heating unit 200 dissipates heat through the heat dissipation module 300, the heat is transferred from the heating unit 200 to the heat dissipation module 300, and the heat on the heat dissipation module 300 is not transferred to the housing assembly 100 through the heating unit 200.

[0089] It is understandable that the thermal resistance structure can be adjusted according to the amount of heat that the heating unit 200 can generate to adjust the thermal resistance between the heat dissipation module 300 and the shell assembly 100, so that the temperature of the shell assembly 100 and the ability of the shell assembly 100 to naturally dissipate the heat generated by the heating unit 200 can be taken into account.

[0090] It is understandable that after the air in the installation cavity 600 that absorbs the heat from the heat dissipation module 300 flows out of the installation cavity 600 from the air outlet 140 , the air with a lower temperature outside the housing assembly 100 will flow into the installation cavity 600 through the air inlet 130 .

[0091] In an embodiment where the housing assembly 100 includes a middle frame 110 and a back cover 120 , at least one of the middle frame 110 and the back cover 120 has an air inlet 130 , and at least one of the middle frame 110 and the back cover 120 has an air outlet 140 .

[0092] For example, the fan 400 may be electrically connected to the mainboard 900 .

[0093] In an embodiment of the present application, the electronic device may further include a controller (not shown), which is electrically connected to the fan 400. The controller may be configured to control the fan 400 to be turned off when the temperature of the electronic device is lower than a preset temperature, and to control the fan 400 to be turned on when the temperature of the electronic device is higher than or equal to the preset temperature.

[0094] In this way, when the temperature of the electronic device is low, the fan 400 can be turned off, and the heat generated by the heating unit 200 can be transferred to the shell assembly 100 by the heat dissipation module 300 through the thermal resistance structure, and the heat is dissipated into the external environment by the natural heat dissipation of the shell assembly 100. After the fan 400 is turned off, the noise and energy consumption of the electronic device can be reduced. When the temperature of the electronic device is high, the fan 400 can be turned on, and the heat generated by the heating unit 200 can be dissipated through the air-cooled heat dissipation module 300, so that the heat generated by the heating unit 200 can be dissipated into the external environment more efficiently, making it less likely that the heating unit 200 and the heat dissipation module 300 will overheat. In addition, the fan 400 is controlled according to the temperature of the electronic device, which is applicable when the temperature of the external environment is high or low. There is no need to adjust the control parameters according to the external ambient temperature, and the control of the fan 400 is simple and convenient.

[0095] It can be understood that the temperature of the electronic device may include one or more of the temperature of the heating unit 200, the temperature of the mainboard 900, the temperature of the shell assembly 100, the temperature of the heat dissipation module 300, the ambient temperature in the installation cavity 600, etc. Correspondingly, the preset temperature may include one or more of the preset temperature of the heating unit 200, the preset temperature of the mainboard 900, the preset temperature of the shell assembly 100, the preset temperature of the heat dissipation module 300, the preset ambient temperature in the installation cavity 600, etc.

[0096] For example, the temperature of the electronic device may include the temperature of the heating unit 200, and correspondingly, the preset temperature includes the preset temperature of the heating unit 200. The controller may be configured to control the fan 400 to turn off when the temperature of the heating unit 200 is lower than the preset temperature of the heating unit 200, and to control the fan 400 to turn on when the temperature of the heating unit 200 is greater than or equal to the preset temperature of the heating unit 200.

[0097] For another example, the temperature of the electronic device may include the ambient temperature within the installation cavity 600. Correspondingly, the preset temperature includes the preset ambient temperature within the installation cavity 600. The controller may be configured to control the fan 400 to turn off when the ambient temperature within the installation cavity 600 is lower than the preset ambient temperature within the heat-generating installation cavity 600, and to control the fan 400 to turn on when the ambient temperature within the installation cavity 600 is greater than or equal to the preset ambient temperature within the installation cavity 600.

[0098] In some examples, the electronic device may further include a temperature sensor (not shown), which is used to obtain the temperature of the electronic device. The temperature sensor is electrically connected to the controller, and the controller is configured to control the switch of the fan 400 based on the temperature of the electronic device obtained by the temperature sensor and a preset temperature.

[0099] When the heating unit 200 includes a processor, the temperature sensor can be electrically connected to the controller through the processor of the heating unit 200. The processor can be used to form a control instruction for controlling the fan 400 based on the temperature of the electronic device obtained by the temperature sensor and the preset temperature, and send the control instruction to the controller. The controller can control the fan 400 according to the control instruction.

[0100] For example, the electronic device may include a first temperature sensor provided at the heating unit 200, the first temperature sensor being used to obtain the temperature of the heating unit 200, the first temperature sensor being electrically connected to the controller, and the controller being configured to control the switch of the fan 400 based on the temperature of the heating unit 200 obtained by the first temperature sensor and the preset temperature of the heating unit 200.

[0101] For another example, the electronic device may include a second temperature sensor provided in the installation cavity 600, the second temperature sensor being used to obtain the ambient temperature in the installation cavity 600, the second temperature sensor being electrically connected to the controller, and the controller being configured to control the switch of the fan 400 based on the ambient temperature in the installation cavity 600 obtained by the second temperature sensor and the preset ambient temperature in the installation cavity 600.

[0102] For example, the controller may be mounted on the mainboard 900 and electrically connected to the mainboard 900 , and the controller may be electrically connected to the fan 400 through the mainboard 900 .

[0103] In the embodiment of the present application, the housing assembly 100 includes a first sidewall structure 150, a second sidewall structure 160, and a surrounding wall structure 170. The first sidewall structure 150 and the second sidewall structure 160 are opposite and spaced apart in the thickness direction of the housing assembly 100. The surrounding wall structure 170 is connected to the first sidewall structure 150 and the second sidewall structure 160 at both ends in the thickness direction of the housing assembly 100, so that a mounting cavity 600 is formed between the first sidewall structure 150, the second sidewall structure 160, and the surrounding wall structure 170. The heat dissipation module 300 is spaced apart from the first sidewall structure 150, the second sidewall structure 160, and the surrounding wall structure 170. In other words, the heat dissipation module 300 does not directly contact the first sidewall structure 150, the second sidewall structure 160, and the surrounding wall structure 170. A thermal resistance structure is provided between the heat dissipation module 300 and the first sidewall structure 150, the second sidewall structure 160, and the surrounding wall structure 170.

[0104] In an embodiment where the housing assembly 100 includes a middle frame 110 and a back cover 120, the middle frame 110 may include a first sidewall structure 150, in which case the back cover 120 includes a second sidewall structure 160. Alternatively, the back cover 120 may include the first sidewall structure 150, in which case the middle frame 110 includes the second sidewall structure 160.

[0105] In some examples, the middle frame 110 includes a surrounding wall structure 170 .

[0106] In other examples, the rear cover 120 includes a surrounding wall structure 170 .

[0107] In some other examples, the surrounding wall structure 170 includes a first part and a second part, the middle frame 110 includes the first part, the back cover 120 includes the second part, and the first part and the second part are spliced ​​to form the surrounding wall structure 170 .

[0108] In the embodiment of the present application, the mainboard 900 includes a first side surface 910 and a second side surface 920. The first side surface 910 and the second side surface 920 are arranged opposite each other in the thickness direction of the mainboard 900. The first side wall structure 150 is opposite the first side surface 910, and the second side wall structure 160 is opposite the second side surface 920. The first side surface 910 is mounted with a heating unit 200. Regarding the heat dissipation module 300 connected to the heating unit 200 mounted on the first side surface 910, the thermal resistance between the heat dissipation module 300 and the first side wall structure 150 is less than the thermal resistance between the heat dissipation module 300 and the second side wall structure 160. The thermal resistance between the heat dissipation module 300 and the first side wall structure 150 is less than the thermal resistance between the heat dissipation module 300 and the surrounding wall structure 170. In other words, the heat dissipation module 300 transfers heat to the housing assembly 100 primarily through the first side wall structure 150. The thermal resistance between the heat dissipation module 300 and the first side wall structure 150 determines the thermal conductivity between the heat dissipation module 300 and the housing assembly 100.

[0109] In the embodiment of the present application, the first sidewall structure 150 includes a first sidewall 151 , the second sidewall structure 160 includes a second sidewall 161 , and the surrounding wall structure 170 is connected to the first sidewall 151 and the second sidewall 161 at both ends in the thickness direction of the shell assembly 100 .

[0110] In some examples, the first side wall 151 is used to mount the display screen 1, at least one of the second side wall 161 and the surrounding wall structure 170 has an air inlet 130, and at least one of the second side wall 161 and the surrounding wall structure 170 has an air outlet 140. In this way, the provided air inlet 130 and air outlet 140 can have a minimal impact on the display screen 1.

[0111] In some examples, the fan 400 is installed on the outer wall of the housing assembly 100 , and the fan 400 can discharge air toward the air inlet 130 , thereby saving installation space in the installation cavity 600 .

[0112] As shown in Figure 4 , in other examples, the fan 400 is installed within the mounting cavity 600 . This facilitates air flow around the heat dissipation module 300 and improves the heat dissipation efficiency of the heat dissipation module 300 . Furthermore, compared to solutions where the fan 400 is mounted on the outer wall of the housing assembly 100 , the housing assembly 100 protects the fan 400, making it less susceptible to damage. Furthermore, this reduces protruding structures on the exterior of the housing assembly 100, making the electronic device more convenient to use and store.

[0113] In some examples of the present application, the housing assembly 100 has an air duct 500. The mounting cavity 600 includes a ventilation cavity 620 located within the air duct 500 and a sealed cavity 610 located outside the air duct 500. The mainboard 900 and the heating unit 200 are arranged in the sealed cavity 610. The air duct 500 has a through-wall hole (not shown). The heat dissipation module 300 is arranged in the through-wall hole. The heat dissipation module 300 is sealed and connected to the air duct 500 at the through-wall hole to separate the ventilation cavity 620 from the sealed cavity 610. The air inlet 130 and the air outlet 140 are both in communication with the ventilation cavity 620. The portion of the heat dissipation module 300 located in the sealed cavity 610 is connected to the heating unit 200. The fan 400 is used to drive the air at the portion of the heat dissipation module 300 located in the ventilation cavity 620 to flow out of the ventilation cavity 620 through the air outlet 140.

[0114] In this way, on the basis of dissipating heat from the heating unit 200 through the air-cooled heat dissipation module 300, it is convenient to seal the cavity where the heating unit 200 and components such as the main board 900 are located, so that water, dust, etc. are not easy to enter the cavity where components such as the main board 900 and the heating unit 200 are located, which is beneficial to the dust-proof and waterproof design of the electronic equipment.

[0115] In the embodiment where the housing assembly 100 has an air duct 500 , the fan 400 may be installed in the ventilation cavity 620 .

[0116] When the fan 400 is installed in the ventilation cavity 620 , the fan 400 may be electrically connected to the mainboard 900 via a cable passing through the air duct 500 , and the cable is sealed and connected to the air duct 500 at the point where it passes through the air duct 500 .

[0117] Exemplarily, the air duct 500 may be formed by splicing structures on the middle frame 110 and the back cover 120 .

[0118] For example, one of the second side wall 161 and the surrounding wall structure 170 has an air inlet 130, and the other of the second side wall 161 and the surrounding wall structure 170 has an air outlet 140. In this way, the air duct 500 can be arranged more easily.

[0119] In other examples of the present application, the air inlet 130 and the air outlet 140 may also be connected to the chamber where the mainboard 900 and the heating unit 200 are located. In this case, the mainboard 900, the heating unit 200, the heat dissipation module 300, and the fan 400 may be located in the same chamber, and the fan 400 may be used to drive the air at the mainboard 900, the heating unit 200, and the heat dissipation module 300 to flow out of the installation chamber 600 through the air outlet 140. In this way, the heat dissipation efficiency of the heating unit 200 can be improved.

[0120] In some examples, the thermal resistance structure can be a first gap 710 located between the heat dissipation module 300 and the housing assembly 100. This simplifies the structure between the heat dissipation module 300 and the housing assembly 100, eliminating the need for additional thermal resistance components at the first gap 710 and reducing the cost of the electronic device. Furthermore, the thermal resistance between the heat dissipation module 300 and the housing assembly 100 can be adjusted by adjusting the size of the first gap 710, making adjustment of the thermal resistance between the heat dissipation module 300 and the housing assembly 100 more convenient.

[0121] It can be understood that the gas located in the first gap 710 can serve as a thermal resistance between the heat dissipation module 300 and the housing assembly 100 to suppress heat transfer between the heat dissipation module 300 and the housing assembly 100 .

[0122] It is understandable that the size of the first gap 710 between the housing assembly 100 and different positions of the heat dissipation module 300 may vary. Specifically, when a heat dissipation unit 200 is mounted on the first side 910, for the heat dissipation module 300 connected to the heat dissipation unit 200 mounted on the first side 910: the first gap 710 between the heat dissipation module 300 and the first sidewall structure 150 is smaller than the first gap 710 between the heat dissipation module 300 and the second sidewall structure 160. When a heat dissipation unit 200 is mounted on the second side 920, for the heat dissipation module 300 connected to the heat dissipation unit 200 mounted on the second side 920: the first gap 710 between the heat dissipation module 300 and the second sidewall structure 160 is smaller than the first gap 710 between the heat dissipation module 300 and the first sidewall structure 150.

[0123] In the embodiment of the present application, the heat dissipation module 300 is connected to the heating unit 200 via the first thermal interface medium 810 , so that the heat generated by the heating unit 200 can be transferred to the heat dissipation module 300 more efficiently.

[0124] FIG5 is an internal schematic diagram of another electronic device provided in an embodiment of the present application.

[0125] As shown in FIG5 , in some examples, the thermal resistance structure includes a thermal resistor 720 disposed between the heat dissipation module 300 and the housing assembly 100, wherein one side of the thermal resistor 720 is connected to the heat dissipation module 300, and the other side of the thermal resistor 720 is connected to the housing assembly 100. In this way, the thermal resistance between the heat dissipation module 300 and the housing assembly 100 at the same distance can be changed by changing the material of the thermal resistor 720. When adjusting the thermal resistance between the heat dissipation module 300 and the housing assembly 100, the relative position between the heat dissipation module 300 and the housing assembly 100 does not need to be changed, and the thermal resistance between the heat dissipation module 300 and the housing assembly 100 is adjusted more flexibly. This facilitates increasing the thermal resistance between the heat dissipation module 300 and the housing assembly 100 when the distance between the heat dissipation module 300 and the housing assembly 100 is small, and reducing the thermal resistance between the heat dissipation module 300 and the housing assembly 100 when the distance between the heat dissipation module 300 and the housing assembly 100 is large.

[0126] For example, the thermal resistor 720 may be made of materials such as silicone, rubber, and plastic.

[0127] Exemplarily, the thermal resistance structure may include a first gap 710 and a thermal resistance member 720, both of which are located between the heat dissipation module 300 and the shell assembly 100, with a first gap 710 between a portion of the heat dissipation module 300 and the shell assembly 100, and a thermal resistance member 720 between a portion of the heat dissipation module 300 and the shell assembly 100.

[0128] In the embodiment of the present application, the heat dissipation module 300 includes a first heat-sinking unit 310, and the heating unit 200 is connected to the first heat-sinking unit 310. Thus, the temperature of each portion of the first heat-sinking unit 310 is relatively uniform, and the heat exchange efficiency between the first heat-sinking unit 310 and the surrounding air is high, which helps to improve the efficiency of heat dissipation from the heating unit 200 through the heat dissipation module 300.

[0129] For example, the first heat dissipation unit 310 may include one or more of a vapor chamber (VC) plate, a heat pipe, and the like.

[0130] In the embodiment where the heat dissipation module 300 includes the first heat dissipation unit 310 , the first heat dissipation unit 310 is connected to the heat generating unit 200 via the first thermal interface medium 810 .

[0131] In some examples, the fan 400 is used to drive air from at least a portion of the first heat averaging unit 310 to flow out of the mounting cavity 600 through the air outlet 140. In this way, heat can be dissipated by exchanging heat between the surface of the first heat averaging unit 310 and the surrounding air. The first heat averaging unit 310 occupies a relatively small space, which facilitates the installation of the heat dissipation module 300 in a relatively narrow space.

[0132] In some embodiments in which an air duct 500 is provided in the shell assembly 100, the first heat equalizing unit 310 of the heat dissipation module 300 is passed through a wall-penetrating hole, and the first heat equalizing unit 310 is sealed and connected to the air duct 500 at the wall-penetrating hole. Part of the first heat equalizing unit 310 is located in the sealed cavity 610 and part is located in the ventilation cavity 620. The part of the first heat equalizing unit 310 located in the sealed cavity 610 is connected to the heating unit 200, and the fan 400 is used to drive the air in the part of the first heat equalizing unit 310 located in the ventilation cavity 620 to flow out of the ventilation cavity 620 through the air outlet 140.

[0133] In the embodiment of the present application, the heating unit 200 is located between the first heat spreader unit 310 to which it is connected and the mainboard 900, along the thickness direction of the mainboard 900. The first heat spreader unit 310 is connected to the surface of the heating unit 200 facing away from the mainboard 900. This reduces interference between the first heat spreader unit 310 and the mainboard 900, making the connection between the first heat spreader unit 310 and the heating unit 200 more convenient. Furthermore, a larger first heat spreader unit 310 is also advantageously arranged, thereby improving the heat dissipation efficiency of the heating unit 200 through the first heat spreader unit 310.

[0134] For example, the first heat soaking unit 310 and the main board 900 may be spaced apart in the thickness direction of the main board 900 , and the first heat soaking unit 310 may extend in a direction perpendicular to the thickness direction of the main board 900 .

[0135] Figure 6 is an internal schematic diagram of another electronic device provided in an embodiment of the present application, and Figure 7 is a schematic diagram of a first side wall structure and a heat dissipation module of another electronic device provided in an embodiment of the present application from the perspective of the first side wall structure toward the mainboard side.

[0136] As shown in Figures 6 and 7, in some examples, the heat dissipation module 300 also includes a heat sink 320, which is arranged on the surface of the first heat dissipation unit 310, and the fan 400 is used to drive the air at the heat sink 320 to flow out of the installation cavity 600 through the air outlet 140.

[0137] In this way, the heat exchange surface between the heat dissipation module 300 and the surrounding air is larger, and the heat exchange efficiency between the heat dissipation module 300 and the surrounding air is higher, which is beneficial to improving the efficiency of heat dissipation of the heating unit 200 through the heat dissipation module 300.

[0138] In some embodiments in which an air duct 500 is provided in the shell assembly 100, the first heat equalization unit 310 is located in the sealed cavity 610, the wall holes are arranged in a one-to-one correspondence with the heat sinks 320, the heat sinks 320 are passed through the corresponding wall holes, and the heat sinks 320 are sealed and connected to the air duct 500 at the corresponding wall holes. The fan 400 is used to drive the air in the portion of the heat sink 320 located in the ventilation cavity 620 to flow out of the ventilation cavity 620 through the air outlet 140.

[0139] As shown in FIG6 , in other embodiments in which an air duct 500 is provided within the housing assembly 100, the first heat-sinking unit 310 of the heat dissipation module 300 is disposed within a through-wall hole. The first heat-sinking unit 310 is sealedly connected to the air duct 500 at the through-wall hole. The portion of the first heat-sinking unit 310 located within the sealed cavity 610 is connected to the heating unit 200. The heat dissipation fins 320 of the heat dissipation module 300 are disposed on the surface of the portion of the first heat-sinking unit 310 located within the ventilation cavity 620. The fan 400 is used to drive air from the heat dissipation fins 320 and the portion of the first heat-sinking unit 310 located within the ventilation cavity 620 to flow out of the ventilation cavity 620 through the air outlet 140. In this way, assembly between the heat dissipation module 300 and the air duct 500 is relatively easy.

[0140] In the embodiment where the heat dissipation module 300 includes the first heat-sink unit 310 and the heat sink 320, the heat sink 320 is spaced apart from the mainboard 900 in the length direction or the width direction of the mainboard 900. This reduces the interference between the heat sink 320 and the mainboard 900, facilitates the placement of larger heat sinks 320 on the surface of the first heat-sink unit 310, and improves the efficiency of heat dissipation from the heating unit 200 through the heat dissipation module 300.

[0141] In an embodiment where the heat dissipation module 300 includes a first heat-sinking unit 310 and a heat sink 320, the heat sink 320 of the heat dissipation module 300 is disposed on the surface of the first heat-sinking unit 310 facing the mainboard 900. This allows at least a portion of the heat sink 320 to be located between the first heat-sinking unit 310 and the mainboard 900 in the thickness direction of the mainboard 900, thereby reducing the size of the housing assembly 100. Furthermore, the larger spacing between the side of the first heat-sinking unit 310 facing the mainboard 900 and the housing assembly 100 facilitates the placement of larger heat sinks 320 on the first heat-sinking unit 310, thereby increasing the efficiency of heat dissipation from the heating unit 200 through the heat dissipation module 300. Furthermore, this facilitates adjusting the thermal resistance structure between the side of the first heat-sinking unit 310 facing away from the mainboard 900 and the housing assembly 100, thereby facilitating control of the thermal conductivity between the heat dissipation module 300 and the housing assembly 100. Furthermore, this also facilitates reducing the spacing between the side of the first heat-sinking unit 310 facing away from the mainboard 900 and the housing assembly 100.

[0142] It is understandable that in the embodiment where the heat sink 320 is provided on the surface of the first heat spreader 310 facing the mainboard 900 , the heat dissipation module 300 mainly transfers heat to the housing assembly 100 through the side of the first heat spreader 310 facing away from the mainboard 900 .

[0143] Illustratively, a plurality of heat sinks 320 spaced apart from each other are arranged in parallel on the surface of the first heat dissipation unit 310 facing the mainboard 900 .

[0144] It is understandable that the heat dissipation module 300 may include the first heat dissipation unit 310 but not the heat dissipation fins 320. The heat dissipation module 300 may also include the first heat dissipation unit 310 and the heat dissipation fins 320.

[0145] In the embodiment of the present application, the fan 400 is mounted on the heat dissipation module 300, so that the fan 400 is mounted on the housing assembly 100 through the heat dissipation module 300. In this way, the heat dissipation module 300 and the fan 400 are assembled more efficiently in the mounting cavity 600, which is conducive to improving the overall assembly efficiency of the electronic device.

[0146] In the embodiment where the heat dissipation module 300 includes the first heat dissipation unit 310, the fan 400 is mounted on the first heat dissipation unit 310. This facilitates installation between the fan 400 and the heat dissipation module 300. Furthermore, when the heat dissipation module 300 also includes heat sinks 320, this facilitates blowing air from the fan 400 toward the heat sinks 320.

[0147] In the embodiment where the first heat-sinking unit 310 is disposed in a wall-penetrating hole, the fan 400 can be installed on the surface of the portion of the first heat-sinking unit 310 located in the ventilation cavity 620. Along the extension direction of the air duct 500, the fan 400 can be located between the heat sink 320 and the air inlet 130.

[0148] In the embodiment of the present application, the heat dissipation module 300 is mounted on the mainboard 900, so that the heat dissipation module 300 is mounted on the housing assembly 100 through the mainboard 900. This facilitates suppressing heat transfer between the heat dissipation module 300 and the housing assembly 100 while ensuring that the heat dissipation module 300 is mounted within the housing assembly 100. Furthermore, the first gap 710 is used to create a thermal barrier between the heat dissipation module 300 and the housing assembly 100.

[0149] It is understandable that the heat dissipation module 300 can be fastened to the mainboard 900 by fasteners, snap-fit ​​structures, etc. The heat dissipation module 300 can also be fastened to the heating unit 200 by fasteners, snap-fit ​​structures, etc., so that the heat dissipation module 300 is installed on the mainboard 900 through the heating unit 200.

[0150] In an embodiment where the heat dissipation module 300 includes a first heat dissipation unit 310 , the first heat dissipation unit 310 is mounted on the mainboard 900 .

[0151] In other examples, the heat dissipation module 300 may be mounted on the inner wall of the housing assembly 100 via a bracket made of a material with low thermal conductivity, and the thermal resistor 720 may include the bracket.

[0152] FIG8 is a schematic internal diagram of another electronic device provided in an embodiment of the present application.

[0153] As shown in FIG8 , and with reference to FIG7 , in this embodiment of the present application, the first sidewall structure 150 further includes a second heat-scaling unit 152. The second heat-scaling unit 152 is provided on the inner wall of the first sidewall 151. This ensures better temperature uniformity across the first sidewall structure 150, thereby improving the efficiency of natural heat dissipation through the housing assembly 100.

[0154] In an embodiment where the second heat-sinking unit 152 is provided on the inner wall of the first sidewall 151, for the heat dissipation module 300 connected to the heating unit 200 mounted on the first side surface 910, the orthographic projection of the heat dissipation module 300 in the thickness direction of the mainboard 900 and the orthographic projection of the second heat-sinking unit 152 in the thickness direction of the mainboard 900 at least partially overlap. In this way, when the housing assembly 100 is at a temperature that provides a good user experience and is not likely to affect the performance of components such as the display screen 1 mounted on the surface of the housing assembly 100, heat from the heat dissipation module 300 is facilitated to be transferred to the first sidewall structure 150, so that the heat generated by the heating unit 200 can be naturally dissipated more efficiently through the housing assembly 100.

[0155] It can be understood that for the heat dissipation module 300 connected to the heating unit 200 installed on the first side 910: the thermal resistance between the heat dissipation module 300 and the first side wall 151 is greater than the thermal resistance between the heat dissipation module 300 and the second heat equalization unit 152, and the heat dissipation module 300 mainly transfers heat to the shell assembly 100 through the second heat equalization unit 152. The thermal resistance between the heat dissipation module 300 and the second heat equalization unit 152 determines the thermal conductivity between the heat dissipation module 300 and the shell assembly 100.

[0156] For example, the second heat spreader 152 may include one or more of a heat spreader, a heat pipe, a graphite sheet, and the like.

[0157] In an embodiment in which the heat dissipation module 300 includes a first heat dissipation unit 310, for the heat dissipation module 300 connected to the heating unit 200 installed on the first side 910: the orthographic projection of the first heat dissipation unit 310 of the heat dissipation module 300 in the thickness direction of the mainboard 900 and the orthographic projection of the second heat dissipation unit 152 in the thickness direction of the mainboard 900 at least partially overlap.

[0158] In some examples, the heating unit 200 is installed on the first side surface 910 . That is, the heating unit 200 is not installed on the second side surface 920 .

[0159] FIG9 is a schematic internal diagram of another electronic device provided in an embodiment of the present application.

[0160] As shown in Figure 9, in some examples where the heating unit 200 is mounted on the first side 910, a second gap 820 is defined between the second side 920 and the inner wall of the housing assembly 100. In other words, a second gap 820 is defined between the second side 920 and the second sidewall structure 160. This simplifies the structure of the electronic device. Furthermore, the thermal resistance between the motherboard 900 and the housing assembly 100 facilitates temperature control of the housing assembly 100, preventing it from overheating.

[0161] FIG10 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application.

[0162] As shown in FIG10 , in other examples in which the heating unit 200 is mounted on the first side surface 910 , the second side surface 920 is connected to the inner wall of the housing assembly 100 via the second thermal interface medium 830 . In other words, the second side surface 920 is connected to the inner wall of the second sidewall structure 160 via the second thermal interface medium 830 . In this way, the heat generated by the heating unit 200 can be transferred to the second sidewall structure 160 via the mainboard 900 and the second thermal interface medium 830 , and an auxiliary heat dissipation path can be formed between the mainboard 900 and the second sidewall structure 160 , thereby improving the heat dissipation efficiency of the heating unit 200 . In addition, by providing the second thermal interface medium 830 between the second side surface 920 and the second sidewall structure 160 , the heat on the mainboard 900 can be transferred to the second sidewall structure 160 more efficiently.

[0163] In some examples where the second side surface 920 is connected to the inner wall of the housing assembly 100 via the second thermal interface medium 830 , the second side surface 920 is connected to the inner wall of the second sidewall 161 via the second thermal interface medium 830 .

[0164] FIG11 is a schematic diagram of the interior of another electronic device provided in an embodiment of the present application.

[0165] As shown in FIG11 , in some other examples where the second side surface 920 is connected to the inner wall of the housing assembly 100 via the second thermal interface medium 830 , the second sidewall structure 160 further includes a third heat-scaling unit 162 , which is provided on the inner wall of the second sidewall 161 . This allows for better temperature uniformity across the second sidewall structure 160 , thereby improving the efficiency of natural heat dissipation through the housing assembly 100 .

[0166] In the embodiment where the third heat-spreading unit 162 is provided on the inner wall of the second sidewall 161 , the second side surface 920 is connected to the third heat-spreading unit 162 via the second thermal interface medium 830 .

[0167] In this way, the heat conduction efficiency between the mainboard 900 and the second sidewall structure 160 is improved, and the heat dissipation efficiency of the heat generated by the heating unit 200 through the housing assembly 100 is improved.

[0168] For example, the third heat-spreading unit 162 may include one or more of a heat-spreading plate, a heat pipe, a graphite sheet, and the like.

[0169] In other examples, a heating unit 200 is mounted on both the first side 910 and the second side 920. For the heat dissipation module 300 connected to the heating unit 200 mounted on the second side 920: the thermal resistance between the heat dissipation module 300 and the second sidewall structure 160 is smaller than the thermal resistance between the heat dissipation module 300 and the first sidewall structure 150, and the thermal resistance between the heat dissipation module 300 and the second sidewall structure 160 is smaller than the thermal resistance between the heat dissipation module 300 and the surrounding wall structure 170. In other words, the heat dissipation module 300 mainly transfers heat to the housing assembly 100 through the second sidewall structure 160, and the thermal resistance between the heat dissipation module 300 and the second sidewall structure 160 determines the thermal conductivity between the heat dissipation module 300 and the housing assembly 100.

[0170] In some examples where the heating unit 200 is mounted on both the first side 910 and the second side 920, the second sidewall structure 160 may include a fourth heat spreader (not shown), and the fourth heat spreader is provided on the inner wall of the second sidewall 161. For the heat dissipation module 300 connected to the heating unit 200 mounted on the second side 920, the orthographic projection of the heat dissipation module 300 in the thickness direction of the mainboard 900 at least partially overlaps with the orthographic projection of the fourth heat spreader in the thickness direction of the mainboard 900.

[0171] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0172] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0173] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: It includes a housing assembly, a mainboard, a heating unit, a fan and a heat dissipation module; The housing assembly has a mounting cavity therein; The mainboard, the heating unit and the heat dissipation module are all arranged in the installation cavity; The mainboard is mounted on the housing assembly, one side of the heating unit is mounted on the mainboard, and the other side of the heating unit is connected to the heat dissipation module; The heat dissipation module is spaced apart from the shell component, and a thermal resistance structure is provided between the heat dissipation module and the shell component; The shell assembly has an air inlet and an air outlet, both of which are connected to the installation cavity, and the fan is used to drive air at least in part of the heat dissipation module to flow out of the installation cavity through the air outlet.

2. The electronic device according to claim 1, characterized in that: The heat dissipation module includes a first heat-saturating unit; The heat generating unit is connected to the first heat averaging unit, and the fan is used to drive air at least in a portion of the first heat averaging unit to flow out of the installation cavity through the air outlet.

3. The electronic device according to claim 1, characterized in that: The heat dissipation module includes a first heat-sinking unit and a heat sink; The heating unit is connected to the first heat-scaling unit, and the heat sink is arranged on the surface of the first heat-scaling unit; The fan is used to drive the air at the heat sink to flow out of the installation cavity through the air outlet.

4. The electronic device according to claim 3, characterized in that: The heat sink is spaced apart from the mainboard in the length direction of the mainboard or in the width direction of the mainboard.

5. The electronic device according to any one of claims 2 to 4, characterized in that: In the thickness direction of the main board, the heat generating unit is located between the first heat balancing unit connected thereto and the main board, and the first heat balancing unit is connected to a surface of the heat generating unit facing away from the main board.

6. The electronic device according to claim 5, characterized in that: The heat sink of the heat dissipation module is arranged on a surface of the first heat equalizing unit facing the mainboard.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The thermal resistance structure includes a gap between the heat dissipation module and the housing assembly.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The thermal resistance structure comprises a thermal resistance element arranged between the heat dissipation module and the shell assembly, one side of the thermal resistance element is connected to the heat dissipation module, and the other side of the thermal resistance element is connected to the shell assembly.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The housing assembly includes a first side wall and a second heat-spreading unit, the mainboard includes a first side surface, and the heating unit is installed on the first side surface; The first side wall is opposite to the first side surface, the second heat equalizing unit is disposed on the inner wall of the first side wall, and the heat dissipation module is connected to the heating unit installed on the first side surface; The orthographic projection of the heat dissipation module in the thickness direction of the mainboard at least partially overlaps with the orthographic projection of the second heat-spreading unit in the thickness direction of the mainboard.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The housing assembly has an air duct therein; The installation cavity includes a ventilation cavity located inside the air duct and a sealing cavity located outside the air duct; The mainboard and the heating unit are arranged in the sealed cavity, the air duct has a through-wall hole, the heat dissipation module is arranged in the through-wall hole, and the heat dissipation module is sealed and connected to the air duct at the through-wall hole, so that the ventilation cavity is separated from the sealed cavity; The air inlet and the air outlet are both connected to the ventilation cavity, the part of the heat dissipation module located in the sealed cavity is connected to the heating unit, and the fan is used to drive the air at the part of the heat dissipation module located in the ventilation cavity to flow out of the ventilation cavity through the air outlet.

11. The electronic device according to any one of claims 1 to 10, characterized in that: The fan is installed in the installation cavity.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The fan is mounted on the heat dissipation module.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The heat dissipation module is mounted on the mainboard.

14. The electronic device according to any one of claims 1 to 13, characterized in that: The heat dissipation module is connected to the heat generating unit via a first thermal interface medium.

15. The electronic device according to any one of claims 1 to 14, characterized in that: The electronic device further comprises a controller, wherein the controller is electrically connected to the fan; The controller is configured to control the fan to be turned off when the temperature of the electronic device is lower than a preset temperature, and to control the fan to be turned on when the temperature of the electronic device is higher than or equal to the preset temperature.

16. The electronic device according to any one of claims 1 to 15, characterized in that: The mainboard includes a second side surface, the first side surface of the mainboard is arranged opposite to the second side surface, the heating unit is installed on the first side surface, and the second side surface is connected to the inner wall of the housing assembly through a second thermal interface medium.

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