Heat dissipation structure for enhancing interfacial heat transfer of carbon fiber oriented thermal interface material

Abstract

The present disclosure relates to the technical field of heat dissipation of electronic elements. Provided is a heat dissipation structure for enhancing interfacial heat transfer of a carbon fiber oriented thermal interface material. The heat dissipation structure for enhancing interface heat transfer of a carbon fiber oriented thermal interface material comprises a carbon fiber oriented thermal interface material layer and an infiltration layer, wherein the infiltration layer comprises a first infiltration layer and a second infiltration layer, the first infiltration layer being provided at the bottom of the carbon fiber oriented thermal interface material layer, and the second infiltration layer being provided at the top of the carbon fiber oriented thermal interface material layer. The technical effect of reducing the number of gaps in the contact surface of a thermal interface is achieved.

Description

Heat dissipation structure for enhancing interface heat transfer of carbon fiber oriented thermal interface materials

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to Chinese patent application No. 202311023916.4 filed with the State Intellectual Property Office of China on August 14, 2023, entitled “Heat dissipation structure for interface heat transfer of reinforced carbon fiber oriented thermal interface material,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation structure for enhancing heat transfer at the interface of a carbon fiber oriented thermal interface material. Background Art

[0004] In recent years, the rise of technologies such as high-performance computing and artificial intelligence has led to an increasing demand for highly integrated, high-performance computing chips, placing higher demands on chip heat dissipation. Traditional thermal interface materials primarily incorporate highly thermally conductive ceramic fillers such as boron nitride, aluminum nitride, and aluminum oxide into a polymer matrix. These materials typically have thermal conductivities ranging from 1W / (m·K) to 5W / (m·K), making them inadequate for addressing the heat dissipation challenges associated with high-power, high-density packaging in the electronics industry. Carbon fiber, with its high thermal conductivity of 1100W / (m·K) along its orientation, is considered a promising filler for manufacturing high-performance TIMs.

[0005] However, the bottleneck in heat dissipation of existing thermal interface materials is often not due to insufficient thermal conductivity of the material itself, but rather to the fact that the contact surface between the thermal interface material and the electronic components / heat dissipation devices (such as heat sink fins) is not completely aligned, resulting in a large number of air-filled gaps at the thermal interface. Air, with a thermal conductivity of only 0.024W / (m·K), is a poor conductor of heat. This results in the thermal interface material not in direct contact with the electronic components and heat dissipation devices failing to perform its heat transfer performance. Ultimately, the contact thermal resistance of the entire thermal interface material is extremely high, and heat cannot be effectively transferred from the electronic components through the thermal interface material to the heat dissipation device.

[0006] Summary of the Invention

[0007] The purpose of the present disclosure is to provide a heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material, so as to alleviate the technical problem of many gaps on the thermal interface contact surface in the prior art.

[0008] In a first aspect, an embodiment of the present disclosure provides a heat dissipation structure for enhancing heat transfer at the interface of a carbon fiber oriented thermal interface material, comprising a carbon fiber oriented thermal interface material layer and an impregnation layer;

[0009] The wetting layer includes a first wetting layer and a second wetting layer;

[0010] The first impregnation layer is provided at the bottom of the carbon fiber oriented thermal interface material layer;

[0011] The second wetting layer is arranged on top of the carbon fiber oriented thermal interface material layer.

[0012] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is an indium metal layer.

[0013] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a grafted metal layer.

[0014] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a tin metal layer.

[0015] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a gold metal layer.

[0016] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a nickel metal layer.

[0017] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is made of liquid gold.

[0018] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is arranged on the carbon fiber oriented thermal interface material layer by an electroplating production method.

[0019] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is arranged on the carbon fiber oriented thermal interface material layer by a sputtering production method.

[0020] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the thickness of the above-mentioned wetting layer is between 0.01 mm and 1 mm.

[0021] In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a silicone layer. Beneficial effects:

[0022] An embodiment of the present disclosure provides a heat dissipation structure for enhancing heat transfer at the interface of a carbon fiber oriented thermal interface material, comprising a carbon fiber oriented thermal interface material layer and a wetting layer; the wetting layer comprises a first wetting layer and a second wetting layer; the first wetting layer is provided at the bottom of the carbon fiber oriented thermal interface material layer; and the second wetting layer is provided at the top of the carbon fiber oriented thermal interface material layer.

[0023] Specifically, the carbon fiber oriented thermal interface material layer and the wetting layer are combined together, and the wetting layer is provided on the top and bottom surfaces of the carbon fiber oriented thermal interface material layer. The wetting layer is used to contact the heat dissipation structure and the chip. The top and bottom surfaces of the wetting layer can wet the top and bottom surfaces of the carbon fiber oriented thermal interface material layer, so that the wetting layer and the carbon fiber oriented thermal interface material layer are in seamless contact, eliminating the gap between the wetting layer and the carbon fiber oriented thermal interface material layer, reducing the contact thermal resistance at the interface, and the wetting layer can eliminate the gap between the heat dissipation structure and the chip, reducing the contact thermal resistance at the interface, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] FIG1 is a schematic diagram of a heat dissipation structure for enhancing heat transfer at the interface of a carbon fiber oriented thermal interface material provided by an embodiment of the present disclosure when in use.

[0026] Icon: 100-carbon fiber oriented thermal interface material layer; 200-wetting layer; 210-first wetting layer; 220-second wetting layer; 300-heat dissipation structure; 400-chip. DETAILED DESCRIPTION

[0027] The technical solutions of the present disclosure are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described are only a portion of the embodiments of the present disclosure, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present disclosure without creative effort are within the scope of protection of the present disclosure.

[0028] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0030] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0031] The present disclosure is further described in detail below through specific embodiments and in conjunction with the accompanying drawings.

[0032] As shown in Figure 1, this embodiment provides a heat dissipation structure for enhancing the interface heat transfer of carbon fiber oriented thermal interface material, including a carbon fiber oriented thermal interface material layer 100 and a wetting layer 200; the wetting layer 200 includes a first wetting layer 210 and a second wetting layer 220; the first wetting layer 210 is provided at the bottom of the carbon fiber oriented thermal interface material layer 100; the second wetting layer 220 is provided at the top of the carbon fiber oriented thermal interface material layer 100.

[0033] Specifically, the carbon fiber oriented thermal interface material layer 100 and the wetting layer 200 are combined together, and the wetting layer 200 is provided on the top and bottom surfaces of the carbon fiber oriented thermal interface material layer 100. The wetting layer 200 is used to contact the heat dissipation structure 300 and the chip 400. The top and bottom surfaces of the wetting layer 200 can wet the top and bottom surfaces of the carbon fiber oriented thermal interface material layer 100, so that the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100 are in seamless contact, eliminating the gap between the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100, reducing the contact thermal resistance at the interface, and the wetting layer 200 can eliminate the gap between the heat dissipation structure 300 and the chip 400, reducing the contact thermal resistance at the interface, thereby improving the heat dissipation efficiency.

[0034] Among them, when the wetting layer 200 contacts the carbon fiber oriented thermal interface material layer 100, the wetting layer 200 can fill the gap between the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100, so that the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100 are completely adhered to each other, reducing the contact thermal resistance of the thermal interface material.

[0035] In addition, when the wetting layer 200 contacts the heat dissipation structure 300 or the chip 400, the wetting layer 200 can fill the gap between the heat dissipation structure 300 or the chip 400, so that the wetting layer 200 and the heat dissipation structure 300 or the chip 400 are completely fitted together, reducing the contact thermal resistance of the thermal interface material.

[0036] Specifically, the wetting layer 200 can be an indium metal layer, and the indium metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the indium metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the indium metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.

[0037] In addition, the wetting layer 200 can be a grafted metal layer, and the grafted metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the grafted metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the grafted metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.

[0038] In addition, the wetting layer 200 can be a tin metal layer, and the tin metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the tin metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the tin metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.

[0039] In addition, the wetting layer 200 can be a gold metal layer, and the gold metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the gold metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the gold metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.

[0040] In addition, the wetting layer 200 can be a nickel metal layer, and the nickel metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the nickel metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the nickel metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.

[0041] In addition, the wetting layer 200 may also be made of liquid gold.

[0042] In addition, the wetting layer 200 may also be a silicone layer.

[0043] Among them, the thickness of the wetting layer 200 can be set to 0.01mm, or the thickness of the wetting layer 200 can be set to 0.02mm, or the thickness of the wetting layer 200 can be set to 0.03mm, or the thickness of the wetting layer 200 can be set to 0.05mm, or the thickness of the wetting layer 200 can be set to 0.1mm, or the thickness of the wetting layer 200 can be set to 0.15mm, or the thickness of the wetting layer 200 can be set to 0.2mm, or the thickness of the wetting layer 200 can be set to 0.25mm, or the thickness of the wetting layer 200 can be set to 0.4mm, or the thickness of the wetting layer 200 can be set to 0.6mm, or the thickness of the wetting layer 200 can be set to 1mm.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure. Industrial Applicability

[0045] The present disclosure provides a heat dissipation structure for enhancing interfacial heat transfer of carbon fiber-oriented thermal interface materials, relating to the technical field of heat dissipation of electronic components. The heat dissipation structure for enhancing interfacial heat transfer of carbon fiber-oriented thermal interface materials comprises a carbon fiber-oriented thermal interface material layer and a wetting layer; the wetting layer comprises a first wetting layer and a second wetting layer; the first wetting layer is disposed at the bottom of the carbon fiber-oriented thermal interface material layer; and the second wetting layer is disposed at the top of the carbon fiber-oriented thermal interface material layer. This achieves the technical effect of reducing the number of voids on the thermal interface contact surface.

[0046] Furthermore, it is understood that the heat dissipation structure of the reinforced carbon fiber oriented thermal interface material disclosed herein is reproducible and can be used in a variety of industrial applications. For example, the heat dissipation structure of the reinforced carbon fiber oriented thermal interface material disclosed herein can be used in the field of electronic component heat dissipation technology.

Claims

1. A heat dissipation structure for strengthening heat transfer at the interface of carbon fiber oriented thermal interface material, characterized in that: It comprises: a carbon fiber oriented thermal interface material layer (100) and a wetting layer (200); The wetting layer (200) comprises a first wetting layer (210) and a second wetting layer (220); The first wetting layer (210) is arranged at the bottom of the carbon fiber oriented thermal interface material layer (100); The second wetting layer (220) is arranged on the top of the carbon fiber oriented thermal interface material layer (100).

2. The heat dissipation structure of reinforced carbon fiber oriented thermal interface material interface heat transfer according to claim 1, characterized in that: The wetting layer (200) is an indium metal layer.

3. The heat dissipation structure of reinforced carbon fiber oriented thermal interface material interface heat transfer according to claim 1, characterized in that: The wetting layer (200) is a grafted metal layer.

4. The heat dissipation structure of reinforced carbon fiber oriented thermal interface material interface heat transfer according to claim 1, characterized in that: The wetting layer (200) is a tin metal layer.

5. The heat dissipation structure of reinforced carbon fiber oriented thermal interface material interface heat transfer according to claim 1, characterized in that: The wetting layer (200) is a gold metal layer.

6. The heat dissipation structure of reinforced carbon fiber oriented thermal interface material interface heat transfer according to claim 1, characterized in that: The wetting layer (200) is a nickel metal layer.

7. The heat dissipation structure of reinforced carbon fiber oriented thermal interface material interface heat transfer according to claim 1, characterized in that: The wetting layer (200) is made of liquid gold.

8. The heat dissipation structure of the reinforced carbon fiber oriented thermal interface material interface heat transfer according to any one of claims 1 to 7, characterized in that: The impregnation layer (200) is arranged on the carbon fiber oriented thermal interface material layer (100) by means of electroplating.

9. The heat dissipation structure of the reinforced carbon fiber oriented thermal interface material interface heat transfer according to any one of claims 1 to 7, characterized in that: The impregnation layer (200) is arranged on the carbon fiber oriented thermal interface material layer (100) by a sputtering production method.

10. The heat dissipation structure for strengthening heat transfer at the interface of carbon fiber oriented thermal interface material according to any one of claims 1 to 7, characterized in that: The wetting layer (200) is a silica gel layer.

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