Tongue-and-groove surface sealing structure and semiconductor container

Abstract

A tongue-and-groove surface sealing structure and a semiconductor container. The tongue-and-groove surface sealing structure comprises: a first connecting mechanism (210), a second connecting mechanism (220), and a sealing mechanism (230), the first connecting mechanism (210) being provided with at least one first groove-shaped structure (211), the second connecting mechanism (220) being provided with at least one first protruding structure (221), the sealing mechanism (230) being disposed in the first groove-shaped structure (211), and when the first connecting mechanism (210) is bonded to the second connecting mechanism (220), the first protruding structure (221) being at least partially arranged in the first groove-shaped structure (211), the sealing mechanism (230) being located between the first protruding structure (221) and the first groove-shaped structure (211), the sealing mechanism (230) being capable of deforming under the pressure of an external force, and the sealing mechanism (230) fitting with a first groove surface of the first groove-shaped structure (211) and a first tenon surface of the first protruding structure (221) without a gap. The structure is applicable to vacuum working conditions, high-pressure working conditions and high-temperature working conditions; in addition, the problems of seal failure caused by corrosion and damage by a semiconductor medium and pollution to the semiconductor medium in a container body can be prevented.

Description

[Corrected 08.11.2023 according to Rule 26] Tongue-and-groove surface sealing structure and semiconductor container

[0001] This application is based on and claims priority from the Chinese patent application number 202311027388X filed on August 15, 2023, and entitled “Tongue and Groove Surface Sealing Structure and Semiconductor Container”. Technical Field

[0002] The present application particularly relates to a tongue-and-groove surface sealing structure and a semiconductor container, belonging to the technical field of semiconductor containers. Background Art

[0003] FIG1 is a schematic diagram of a semiconductor cylinder flange sealing structure in the prior art; FIG2 is a schematic diagram of a semiconductor cylinder flange sealing structure in the prior art after the sealing ring has been corroded and damaged. The sealing gaskets in the current semiconductor cylinder flange sealing structure shown in FIG1 are mostly O-rings. During use, solid-state source semiconductor cylinders often require continuous high-temperature heating to vaporize and output the solid source. Although the O-ring material (mostly rubber) is designed to meet the operating temperature, under continuous pressure and heating, the elasticity and high-temperature resistance of the O-ring will rapidly decrease, carbonizing or even melting (as shown in FIG2). This will lead to: problems with the sealing of the cylinder, resulting in leakage; carbonization and melting of the O-ring will become a source of contamination, causing product problems and even damage to the machine, resulting in huge losses. In addition, the structure in FIG1 basically only allows the use of O-ring gaskets, which limits the choice of gaskets. In some working conditions, soft gaskets cannot meet the operating temperature requirements, and metal gaskets cannot be used to achieve sealing.

[0004] Application Contents

[0005] The main purpose of the present application is to provide a tongue-and-groove surface sealing structure and a semiconductor container, thereby overcoming the deficiencies in the prior art.

[0006] To achieve the aforementioned application objectives, the technical solutions adopted in this application include:

[0007] On the one hand, the present application provides a tongue and groove surface sealing structure, including: a first connecting mechanism, a second connecting mechanism and a sealing mechanism, the first connecting mechanism is provided with at least one first groove-shaped structure, the second connecting mechanism is provided with at least one first protrusion structure, the sealing mechanism is arranged in the first groove-shaped structure, when the first connecting mechanism is combined with the second connecting mechanism, at least part of the first protrusion structure is arranged in the first groove-shaped structure, the sealing mechanism is located between the first protrusion structure and the first groove-shaped structure, the sealing mechanism can be deformed under the pressure of external force, the surface of the sealing mechanism forms a contour structure that imitates the first groove surface of the first groove-shaped structure and the first tongue surface of the first protrusion structure, the sealing mechanism is fitted with the first groove surface of the first groove-shaped structure and the first tongue surface of the first protrusion structure without a gap, wherein the external force is generated when the first connecting mechanism and the second connecting mechanism are combined.

[0008] On the other hand, the present application provides a semiconductor container, including a container body and a container cover, and the semiconductor container also includes the tongue and groove surface sealing structure, the first connecting mechanism is fixedly arranged on the container body, and the second connecting mechanism is fixedly arranged on the container cover.

[0009] Compared with the prior art, the advantages of this application include:

[0010] 1) The tongue and groove surface sealing structure provided in the present application has a variety of working condition options and is suitable for vacuum working conditions, high pressure working conditions, and high temperature working conditions. The sealing mechanism can also be selected according to different working conditions to select metal gaskets and non-metallic gaskets, thereby avoiding the problem of the sealing mechanism being corroded or damaged by the semiconductor medium, resulting in sealing failure and contamination of the semiconductor medium in the container body.

[0011] 2) The tongue and groove surfaces of the tongue and groove surface sealing structure provided in the present application have better compatibility. During operation, the first protrusion structure and the first groove structure can not only play a sealing role, but also serve as positioning structures for the first connecting mechanism and the second connecting mechanism, thereby making it easier to confirm whether the first connecting mechanism and the second connecting mechanism are properly matched. The sealing mechanism is arranged in the first groove structure, and the situation in which the plane position repeatedly moves and damages the sealing structure will not occur.

[0012] 3) The present application provides a tongue and groove surface sealing structure, in which a sealing mechanism is arranged in a first groove-shaped structure, the installation of the sealing mechanism is more concentric, the thickness of the sealing mechanism is less than the depth of the first groove-shaped structure, and the sealing mechanism is clamped between the first protrusion structure and the first groove-shaped structure. When compressed, the sealing mechanism will not be squeezed out, and the compression area and force of the sealing structure are more uniform, thereby making the overall sealing effect better. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG1 is a schematic structural diagram of a semiconductor cylinder flange sealing structure in the prior art;

[0014] FIG2 is a schematic structural diagram of a semiconductor cylinder flange sealing structure in the prior art after the sealing ring is corroded and damaged;

[0015] FIG3 is a schematic structural diagram of a semiconductor container provided in Example 1 of the present application;

[0016] FIG4 is a schematic structural diagram of a semiconductor container provided in Example 2 of the present application. DETAILED DESCRIPTION

[0017] In view of the shortcomings of the existing technology, the applicant of this case has proposed the technical solution of this application after long-term research and extensive practice. The following will further explain this technical solution, its implementation process and principles.

[0018] On the one hand, the present application provides a tongue and groove surface sealing structure, including: a first connecting mechanism, a second connecting mechanism and a sealing mechanism, the first connecting mechanism is provided with at least one first groove-shaped structure, the second connecting mechanism is provided with at least one first protrusion structure, the sealing mechanism is arranged in the first groove-shaped structure, when the first connecting mechanism is combined with the second connecting mechanism, at least part of the first protrusion structure is arranged in the first groove-shaped structure, the sealing mechanism is located between the first protrusion structure and the first groove-shaped structure, the sealing mechanism can be deformed under the pressure of external force, the surface of the sealing mechanism forms a contour structure that imitates the first groove surface of the first groove-shaped structure and the first tongue surface of the first protrusion structure, the sealing mechanism is fitted with the first groove surface of the first groove-shaped structure and the first tongue surface of the first protrusion structure without a gap, wherein the external force is generated when the first connecting mechanism and the second connecting mechanism are combined.

[0019] Furthermore, the first trough-like structure includes a first part and a second part arranged in sequence along its own axial direction, the bottom of the first trough-like structure is located in the second part, the notch of the first trough-like structure is located in the first part, and the sealing mechanism is arranged in the second part. When the first connecting mechanism is combined with the second connecting mechanism, the sealing mechanism is in close contact with the bottom and wall of the first trough-like structure.

[0020] Furthermore, the outline shape of the first protruding structure is the same as the outline shape of the first portion.

[0021] Furthermore, the first protrusion structure and the first groove structure have the same outline shape.

[0022] Furthermore, in the radial direction of the first groove-shaped structure, the first protrusion structure, the sealing mechanism and the first groove-shaped structure are all clearance-fitted.

[0023] Furthermore, when the first connecting mechanism is combined with the second connecting mechanism, a closed air chamber is formed between the first connecting mechanism, the second connecting mechanism, the first protruding structure, the first groove structure and the sealing mechanism.

[0024] Furthermore, the first protruding structure, the sealing mechanism and the first groove-shaped structure are all prismatic structures, and the radial width of the first groove-shaped structure is greater than the radial width of the sealing mechanism and greater than the radial width of the first protruding structure.

[0025] Furthermore, the difference between the radial width of the first groove structure and the radial width of the sealing mechanism is 0.5 mm.

[0026] Furthermore, the difference between the radial width of the first groove-shaped structure and the radial width of the first protrusion structure is 1 mm.

[0027] Furthermore, the first protrusion structure and the first groove-shaped structure are both prism structures, the sealing mechanism is a prismatic structure, the radial width of the first protrusion structure gradually decreases in the direction away from the second connecting mechanism, and the radial width of the first groove-shaped structure gradually increases in the direction away from the first connecting mechanism, the maximum radial width of the first protrusion structure is greater than the minimum radial width of the first groove-shaped structure but smaller than the maximum radial width of the first groove-shaped structure, and the minimum radial width of the first groove-shaped structure is equal to the radial width of the sealing mechanism but greater than the minimum radial width of the first protrusion structure.

[0028] Furthermore, the difference between the average radial width of the first groove-shaped structure and the average radial width of the first protrusion structure is 1 mm.

[0029] Furthermore, a plurality of second protrusion structures are provided on the bottom of the first groove-shaped structure and / or the surface of the first protrusion structure, and the sealing mechanism is in contact with the second protrusion structure. When the first connecting mechanism is combined with the second connecting mechanism, the sealing mechanism is deformed under the pressure of the external force, and a second groove-shaped structure imitating the second protrusion structure is formed in the surface area corresponding to the second protrusion structure.

[0030] Furthermore, the sealing mechanism is a shapeable metal gasket or non-metal gasket.

[0031] Furthermore, the surface of the second protruding structure is a continuous arc-shaped surface.

[0032] Furthermore, the second protrusion structure is an annular structure continuously arranged along the circumference of the first groove-shaped structure.

[0033] Furthermore, the first connecting mechanism has a first assembly surface, the first groove-shaped structure is arranged on the first assembly surface, and the second connecting mechanism has a second assembly surface, the first protrusion structure is arranged on the second assembly surface.

[0034] Furthermore, the first connecting mechanism is an annular component.

[0035] Furthermore, the first protruding structure and the first groove-shaped structure are both annular structures.

[0036] Furthermore, the first connecting mechanism is a flange, and the second connecting mechanism is a flange cover.

[0037] Furthermore, the axial cross-section of the sealing mechanism is a polygonal structure.

[0038] Furthermore, the axial cross-section of the first protrusion structure is a polygonal structure.

[0039] Furthermore, the axial cross-section of the first groove-shaped structure is a polygonal structure.

[0040] Another aspect of the present application provides a semiconductor container, comprising a container body and a container cover, and the semiconductor container further comprises the tongue and groove surface sealing structure, wherein the first connecting mechanism is fixedly arranged on the container body, and the second connecting mechanism is fixedly arranged on the container cover.

[0041] The following will further explain the technical solution, its implementation process and principles in conjunction with the accompanying drawings and specific implementation cases. Unless otherwise specified, the sealing mechanism, flange, flange cover, etc. used in the embodiments of the present application can be obtained through processing known to those skilled in the art.

[0042] Example 1

[0043] Please refer to Figure 3, a semiconductor container includes a container body 100, a container cover and a tongue and groove surface sealing structure. The tongue and groove surface sealing structure is mainly used to achieve a sealed fit between the container cover and the container body 100 to prevent leakage of the semiconductor medium in the container body 100.

[0044] In this embodiment, the tongue and groove surface sealing structure includes a first connecting mechanism 210, a second connecting mechanism 220 and a sealing mechanism 230. The first connecting mechanism 210 is fixedly arranged on the container body 100, the second connecting mechanism 220 is fixedly arranged on the container cover, and the sealing mechanism 230 is arranged on the first connecting mechanism 210. When the container cover is closed on the container body 100 and the first connecting mechanism 210 is combined with the second connecting mechanism 220, the sealing mechanism 230 is clamped between the first connecting mechanism 210 and the second connecting mechanism 220, and the sealing mechanism 230 is sealed with the first connecting mechanism 210 and the second connecting mechanism 220, thereby realizing a sealed combination between the first connecting mechanism 210 and the second connecting mechanism 220, and further realizing a sealed combination between the container cover and the container body 100.

[0045] It should be noted that the first connecting mechanism 210 is seamlessly sealed with the container body 100, and the second connecting mechanism 220 is seamlessly sealed with the container lid. The structures and methods of the connection between the first connecting mechanism 210 and the container body 100, and the second connecting mechanism 220 and the container lid, can adopt structures and methods known to those skilled in the art and are not specifically limited here. Of course, as a typical preferred embodiment, the second connecting mechanism 220 and the container lid can be integrally provided.

[0046] In this embodiment, the first connecting mechanism 210 has a first assembly surface, the second connecting mechanism 220 has a second assembly surface, the first assembly surface and the second assembly surface are arranged opposite to each other, and the sealing mechanism 230 is arranged between the first assembly surface and the second assembly surface, and is in sealing contact with the first assembly surface and the second assembly surface, thereby realizing sealing cooperation between the sealing mechanism 230 and the first connecting mechanism 210 and the second connecting mechanism 220.

[0047] In this embodiment, a first groove-like structure 211 is provided on the first assembly surface, and the first groove-like structure 211 has a first groove surface (it can be understood that the first groove surface is the side wall and groove bottom of the first groove-like structure 211, and can also be collectively referred to as groove wall). The sealing mechanism 230 is provided in the first groove-like structure 211, and the sealing mechanism 230 is in close contact with the groove surface of the first groove-like structure 211. When the first connecting mechanism 210 and the second connecting mechanism 220 are combined, the sealing mechanism 230 is clamped between the second assembly surface and the first groove surface.

[0048] In this embodiment, the sealing mechanism 230 is a plastic metal gasket or non-metallic gasket. For example, the sealing mechanism 230 can be a copper gasket or an aluminum gasket. When the sealing mechanism 230 is clamped between the first groove surface and the second assembly surface, the sealing mechanism 230 can be deformed under the pressure of external force, so that the sealing mechanism 230 is in contact with the first groove surface and the second assembly surface without gaps, thereby achieving sealing between the two. It should be noted that the external force is generated when the first connecting mechanism 210 and the second connecting mechanism 220 are combined.

[0049] In this embodiment, a first protruding structure 221 is further provided on the second assembly surface, and the first protruding structure 221 has a first tenon surface. The sealing mechanism 230 is provided between the first tenon surface and the first groove surface. The sealing mechanism 230 can be deformed under external pressure, and the surface of the sealing mechanism 230 forms a contour structure that imitates the first groove surface of the first groove-shaped structure 211 and the first tenon surface of the first protruding structure 221. The sealing mechanism 230 fits seamlessly with the first groove surface of the first groove-shaped structure 211 and the first tenon surface of the first protruding structure 221.

[0050] It should be noted that the first groove-like structure 211 can be formed by the first assembly surface being recessed inward along the thickness direction of the first connecting mechanism 210, and the first protruding structure 221 can be fixedly set on the second assembly surface of the second connecting mechanism 220. Of course, the first protruding structure 221 can also be integrally set with the second connecting mechanism 220, that is, the first protruding structure 221 is formed by a partial protrusion of the second connecting mechanism 220.

[0051] In this embodiment, the first groove-shaped mechanism and the first protrusion structure 221 are both annular structures. It can be understood that, taking the first groove-shaped structure 211 as an example, the first groove-shaped structure 211 is arranged around the periphery of the opening of the container body 100 along the radial direction of the container body 100.

[0052] In this embodiment, the first trough-like structure 211 includes a first part and a second part arranged in sequence along its own axial direction, the bottom of the first trough-like structure 211 is located in the second part, the notch of the first trough-like structure 211 is located in the first part, and the sealing mechanism 230 is arranged in the second part. When the first connecting mechanism 210 is combined with the second connecting mechanism 220, the sealing mechanism 230 is in close contact with the bottom and wall of the first trough-like structure 211.

[0053] In this embodiment, the contour shape of the first protrusion structure 221 and the contour shape of the first groove-like structure 211 are the same, and in the radial direction of the first groove-like structure 211, the first protrusion structure 221, the sealing mechanism 230 and the first groove-like structure 211 are all clearance-fitted. When the first connecting mechanism 210 and the second connecting mechanism 220 are combined, a closed air chamber is formed between the first connecting mechanism 210, the second connecting mechanism 220, the first protrusion structure 221, the first groove-like structure 211 and the sealing mechanism 230. The air chamber can isolate the space on both sides of it, thereby further improving the sealing effect between the first connecting mechanism 210 and the second connecting mechanism 220.

[0054] In this embodiment, the first protruding structure 221, the sealing mechanism 230 and the first groove-shaped structure 211 are all prismatic structures. The radial width of the first groove-shaped structure 211 is greater than the radial width of the sealing mechanism 230, which is greater than the radial width of the first protruding structure 221. Specifically, the difference between the radial width of the first groove-shaped structure 211 and the radial width of the sealing mechanism 230 is 0.5 mm, and the difference between the radial width of the first groove-shaped structure 211 and the radial width of the first protruding structure 221 is 1 mm. That is, the side wall portion of the groove surface of the first groove-shaped structure in this embodiment is greater than the radial width of the first groove-shaped structure 211. It is divided into a vertical structure, and a flat gasket is used to achieve sealing. The difference between the radial width of the first groove structure 211 and the radial width of the sealing mechanism 230 is 0.5mm. This structure is conducive to the smooth installation of the gasket into the first groove structure. The difference between the radial width of the first groove structure 211 and the radial width of the first protruding structure 221 is 1mm, which makes it easier to position when the first connecting mechanism and the second connecting mechanism are assembled. The tenon surface of the first protruding structure is pressed on the gasket, which can fill the first groove structure and be in close contact with the groove surface of the first groove structure, thereby having a better sealing effect.

[0055] In this embodiment, the bottom of the first groove structure 211 and / or the surface of the first protrusion structure 221 are further provided with a plurality of second protrusion structures, and the sealing mechanism 230 is in contact with the second protrusion structure. When the first connecting mechanism 210 is combined with the second connecting mechanism 220, the sealing mechanism 230 is deformed under the pressure of external force, and a second groove-shaped structure that imitates the second protrusion structure is formed in the surface area corresponding to the second protrusion structure. By providing a plurality of second protrusion structures, a maze structure can be formed between the sealing mechanism 230 and the first groove surface, which reduces the requirements for the surface processing accuracy (mainly surface flatness) of the first connecting mechanism 210 and the second connecting mechanism 220, and the uneven surface structure further improves the sealing effect between the first connecting mechanism 210 and the sealing mechanism 230.

[0056] In this embodiment, the surface of the second protruding structure is a continuous arc-shaped surface. For example, the surface of the second protruding structure may be a cylindrical surface or a spherical surface.

[0057] It can be understood that the second protrusion structure is an annular structure continuously arranged along the circumference of the first groove-like structure 211, and multiple second protrusion structures are arranged in sequence and at intervals along the radial direction of the first groove-like structure 211. It should be noted that the hardness or strength of the first connecting mechanism 210 and the second connecting mechanism 220 is greater than the hardness or strength of the sealing mechanism 230, so that the sealing mechanism 230 can undergo contour deformation when subjected to external force, thereby improving the sealing effect.

[0058] In this embodiment, the axial cross-section of the sealing mechanism 230 , the first protruding structure 221 , and the first groove-shaped structure 211 as a whole is a polygonal structure.

[0059] In this embodiment, please refer to Figure 3 again. The first connecting mechanism 210 and the second connecting mechanism 220 can be fastened together by cooperating with the threaded connecting member through the threaded hole 201. By screwing the threaded connecting member, the first connecting mechanism 210 and the second connecting mechanism 220 can be fastened together along the axial direction of the threaded connecting member, thereby compressing the sealing mechanism 230. Of course, the first connecting mechanism 210 and the second connecting mechanism 220 can also be pressed together through other connection structures and methods.

[0060] Example 2

[0061] Referring to FIG4 , the structure of a semiconductor container in this embodiment is substantially the same as that in Example 1, except that: in this embodiment, the first protruding structure 221 and the first groove-shaped structure 211 are both prism structures, the sealing mechanism 230 is a prismatic structure, the radial width of the first protruding structure 221 gradually decreases in a direction away from the second connecting mechanism 220, and the radial width of the first groove-shaped structure 211 gradually increases in a direction away from the first connecting mechanism 210, the maximum radial width of the first protruding structure 221 is greater than the minimum radial width of the first groove-shaped structure 211 but less than the maximum radial width of the first groove-shaped structure 211, the minimum radial width of the first groove-shaped structure 211 is equal to the radial width of the sealing mechanism 230 but greater than the minimum radial width of the first protruding structure 221, and specifically, the first groove The difference between the average radial width of the protruding structure 211 and the average radial width of the first protruding structure 221 is 1 mm. This structure forms a first protruding structure / first groove-shaped structure that is wide at the top and narrow at the bottom. At the same time, the minimum radial width of the first groove-shaped structure is equal to the radial width of the sealing mechanism. There is no situation where the sealing mechanism (such as a gasket, etc.) is difficult to assemble, and when the tenon surface of the first protruding structure is pressed downward, the sealing mechanism can be deformed to fill the gap at the bottom of the first groove-shaped structure; if the radial size of the first protruding structure is too large, the requirements for processing accuracy will be increased, resulting in direct collision and friction between the tenon surface of the first protruding structure and the groove surface of the first groove-shaped structure, thereby causing damage to the sealing surface; and if the radial size of the first protruding structure is too small, the movement of the first protruding structure in the first groove-shaped structure will increase, and sliding deformation will be produced during the sealing process, which is not conducive to achieving sealing.

[0062] The tongue-and-groove surface sealing structure provided by the present application has a variety of working conditions to choose from, and is suitable for vacuum working conditions, high-pressure working conditions, and high-temperature working conditions. The sealing mechanism can also be selected from metal gaskets and non-metallic gaskets according to different working conditions, thereby avoiding the problem of the sealing mechanism being corroded or damaged by the semiconductor medium, resulting in sealing failure, and contamination of the semiconductor medium in the container body. In addition, the tongue surface and groove surface in the tongue-and-groove surface sealing structure have better matching properties. During operation, the first protrusion structure and the first groove structure can not only play a sealing role, but also serve as positioning structures for the first connecting mechanism and the second connecting mechanism, thereby making it easier to confirm whether the first connecting mechanism and the second connecting mechanism are in place. The sealing mechanism is set in the first groove structure, and the situation where the plane position repeatedly moves and damages the sealing structure will not occur.

[0063] The present application provides a tongue and groove surface sealing structure, in which a sealing mechanism is arranged in a first groove-shaped structure, the installation of the sealing mechanism is more concentric, the thickness of the sealing mechanism is less than the depth of the first groove-shaped structure, and the sealing mechanism is clamped between the first protrusion structure and the first groove-shaped structure. When compressed, the sealing mechanism will not be squeezed out, and the compression area and force of the sealing structure are more uniform, thereby improving the overall sealing effect.

[0064] The present application provides a tongue-and-groove surface sealing structure in which the sealing mechanism does not directly contact the semiconductor medium in the container body, and the influence of medium corrosion and pressure mechanism penetration on the sealing mechanism is very small, so that the tongue-and-groove surface sealing structure can be used in occasions with strict sealing requirements such as vacuum, high pressure, flammable, explosive, and toxic media.

[0065] It should be understood that the above embodiments are merely illustrative of the technical concepts and features of this application. Their purpose is to enable those familiar with the art to understand the content of this application and implement it accordingly. They are not intended to limit the scope of protection of this application. Any equivalent changes or modifications made in accordance with the spirit and substance of this application shall be included within the scope of protection of this application.

Claims

1. A tongue and groove surface sealing structure, characterized in that: include: A first connecting mechanism, a second connecting mechanism and a sealing mechanism, wherein the first connecting mechanism is provided with at least one first groove-shaped structure, the second connecting mechanism is provided with at least one first protrusion structure, and the sealing mechanism is provided in the first groove-shaped structure; When the first connecting mechanism is combined with the second connecting mechanism, at least a portion of the first protrusion structure is arranged in the first groove structure, and the sealing mechanism is located between the first protrusion structure and the first groove structure. The sealing mechanism can be deformed under the pressure of external force, and the surface of the sealing mechanism forms a contour structure that imitates the first groove surface of the first groove structure and the first tenon surface of the first protrusion structure. The sealing mechanism fits the first groove surface of the first groove structure and the first tenon surface of the first protrusion structure without a gap, wherein the external force is generated when the first connecting mechanism and the second connecting mechanism are combined.

2. The tongue and groove surface sealing structure according to claim 1, characterized in that: The first groove-shaped structure comprises a first part and a second part which are sequentially arranged along its own axial direction, the groove bottom of the first groove-shaped structure is located in the second part, the notch of the first groove-shaped structure is located in the first part, the sealing mechanism is arranged in the second part, and when the first connecting mechanism is combined with the second connecting mechanism, the sealing mechanism is in close contact with the groove bottom and groove wall of the first groove-shaped structure; And / or, the contour shape of the first protruding structure is the same as the contour shape of the first portion.

3. The tongue and groove surface sealing structure according to claim 2, characterized in that: The first protrusion structure and the first groove structure have the same contour shape; And / or, in the radial direction of the first groove-shaped structure, the first protrusion structure, the sealing mechanism and the first groove-shaped structure are all clearance-fitted; And / or, when the first connecting mechanism is combined with the second connecting mechanism, a closed air chamber is formed between the first connecting mechanism, the second connecting mechanism, the first protruding structure, the first groove structure and the sealing mechanism.

4. The tongue and groove surface sealing structure according to claim 3, characterized in that: The first protruding structure, the sealing mechanism and the first groove-shaped structure are all prismatic structures, and the radial width of the first groove-shaped structure is greater than the radial width of the sealing mechanism and greater than the radial width of the first protruding structure; and / or, the difference between the radial width of the first groove-shaped structure and the radial width of the sealing mechanism is 0.5 mm; And / or, a difference between a radial width of the first groove-shaped structure and a radial width of the first protrusion structure is 1 mm.

5. The tongue and groove surface sealing structure according to claim 3, characterized in that: The first protrusion structure and the first groove structure are both prism structures, the sealing mechanism is a prism structure, the radial width of the first protrusion structure gradually decreases in a direction away from the second connection mechanism, the radial width of the first groove structure gradually increases in a direction away from the first connection mechanism, the maximum radial width of the first protrusion structure is greater than the minimum radial width of the first groove structure but less than the maximum radial width of the first groove structure, and the minimum radial width of the first groove structure is equal to the radial width of the sealing mechanism but greater than the minimum radial width of the first protrusion structure; And / or, a difference between an average radial width of the first groove-shaped structure and an average radial width of the first protrusion structure is 1 mm.

6. The tongue and groove surface sealing structure according to claim 1, characterized in that: A plurality of second protrusion structures are further provided on the bottom of the first groove-shaped structure and / or the surface of the first protrusion structure, and the sealing mechanism is in contact with the second protrusion structure. When the first connecting mechanism is combined with the second connecting mechanism, the sealing mechanism is deformed under the pressure of the external force, and a second groove-shaped structure conforming to the second protrusion structure is formed in the surface area corresponding to the second protrusion structure; And / or, the sealing mechanism is a plastic metal gasket or a non-metal gasket.

7. The tongue and groove surface sealing structure according to claim 6, characterized in that: The surface of the second protruding structure is a continuous arc-shaped surface; And / or, the second protrusion structure is an annular structure continuously arranged along the circumference of the first groove-shaped structure.

8. The tongue and groove surface sealing structure according to claim 1, characterized in that: The first connecting mechanism has a first assembly surface, the first groove-shaped structure is arranged on the first assembly surface, the second connecting mechanism has a second assembly surface, and the first protrusion structure is arranged on the second assembly surface; And / or, the first connecting mechanism is a ring-shaped member; And / or, the first protrusion structure and the first groove structure are both annular structures; And / or, the first connection mechanism is a flange, and the second connection mechanism is a flange cover.

9. The tongue and groove surface sealing structure according to claim 1 or 8, characterized in that: The axial cross-section of the sealing mechanism is a polygonal structure; and / or, the axial cross-section of the first protrusion structure is a polygonal structure; and / or, the axial cross-section of the first groove structure is a polygonal structure.

10. A semiconductor container, comprising a container body and a container cover, characterized in that: It also includes the tongue and groove surface sealing structure according to any one of claims 1 to 9, wherein the first connecting mechanism is fixedly arranged on the container body, and the second connecting mechanism is fixedly arranged on the container cover.

Images