Structural member and electronic device

Abstract

Embodiments of the present application relate to the technical field of electronic devices, and disclosed are a structural member and an electronic device, for use in solving the technical problem that a carbon fiber composite material is prone to causing ESD. The structural member comprises a structural member body and a conductive portion. The structural member body comprises an insulation member and a carbon fiber, wherein the carbon fiber is embedded in the insulation member, and part of the carbon fiber is exposed out of the insulation member. At least part of the conductive portion comes into contact with and is electrically connected to the exposed carbon fiber. Because the carbon fiber itself has good conductive performance, the conductive portion provided on the structural member body can be electrically connected to the exposed carbon fiber to form a conductive path, thereby enabling the carbon fiber in the structural member to be used as a discharge path of an electro-static current. Moreover, the conductive portion in the structural member can also be used as an electrical connection point. When a large current passes through the structural member, the electro-static current can be discharged by means of the carbon fiber and the conductive portion, thereby reducing the ESD problem.

Description

Structural component and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on August 14, 2023, with application number 202311024753.1 and application name “A Structural Component and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a structural component and electronic equipment. Background Art

[0003] Currently, the midframes or housings of electronic devices such as mobile phones, tablets, and laptops are mostly made of composite materials such as aluminum alloy, magnesium alloy, stainless steel, and titanium alloy, which hinders the lightweighting of these devices. While carbon fiber composites offer high strength, light weight, and excellent flexibility, they have poor electrical conductivity. When high currents flow through them, carbon fiber composites are prone to electrostatic discharge (ESD), which can damage electronic components within these devices.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide a structural component and an electronic device for solving the technical problem that carbon fiber composite materials are prone to ESD.

[0006] To achieve the above objectives, this application adopts the following technical solutions:

[0007] In a first aspect of an embodiment of the present application, a structural member is provided, comprising a structural member body and a conductive portion. The structural member body comprises an insulating member and carbon fiber filaments, wherein the carbon fiber filaments are embedded within the insulating member, with a portion of the carbon fiber filaments exposed outside the insulating member. At least a portion of the conductive portion is in contact with and electrically connected to the exposed carbon fiber filaments.

[0008] As can be seen from the above, the embodiment of the present application is achieved by exposing a portion of the carbon fiber filaments embedded in the insulating part to the outside of the insulating part. At the same time, a conductive part is provided on the structural part body so that at least a portion of the conductive part is in contact with the carbon fiber filaments. In this way, since the carbon fiber filaments themselves have good electrical conductivity, the conductive part provided on the structural part body can be connected to the exposed carbon fiber filaments to form a conductive path, so that the carbon fiber filaments in the structural part can be used as a discharge path for electrostatic current. At the same time, the conductive part in the structural part can also be used as an electrical connection point. When a large current passes through the structural part, the electrostatic current can be discharged outward through the carbon fiber filaments and the conductive part, thereby reducing the problem of ESD.

[0009] In some embodiments, a groove is provided on the surface of the structural member body, and a portion of the carbon fiber filaments is exposed in the groove. At least a portion of the conductive portion is provided in the groove of the structural member body, and the conductive portion is in contact with and electrically connected to the carbon fiber filaments exposed in the groove. Thus, by providing a groove on the surface of the structural member body, a portion of the carbon fiber filaments embedded in the insulating member can be exposed in the groove. At this time, at least a portion of the conductive portion can be provided in the groove and in contact with the exposed carbon fiber filaments, thereby ensuring good contact between the conductive portion and the exposed carbon fiber filaments under the shaping effect of the groove on the conductive portion.

[0010] In some embodiments, a plurality of carbon fiber filaments are provided. The groove includes a groove wall, a groove bottom, and a groove space enclosed by the groove wall and the groove bottom. At least one of the groove wall, the groove bottom, and the groove space is provided with exposed carbon fiber filaments. Thus, the carbon fiber filaments within the groove can be exposed at least one of the groove wall, the groove bottom, and the groove space, allowing the conductive portion to contact the exposed carbon fiber filaments at multiple locations on the structural member body, thereby improving the reliability of the contact between the conductive portion and the carbon fiber filaments.

[0011] In some embodiments, a plurality of grooves are provided on the surface of the structural member body, and the structural member body includes a first wall surface and a second wall surface that are connected. Some grooves are provided on the first wall surface, while others are provided on the second wall surface. Thus, some grooves can be provided on the first wall surface of the structural member body, thereby allowing the conductive portion to be provided on the first wall surface of the structural member body. Another portion of grooves can also be provided on the second wall surface of the structural member body, thereby allowing the conductive portion to be provided on the second wall surface of the structural member body. This increases the number of electrical connection points of the structural member, thereby facilitating electrical connection between the structural member and the electronic device.

[0012] In some embodiments, the outer surface of the exposed carbon fiber filaments protrudes from the bottom of the groove, and the conductive portion contacts and electrically connects to the outer surface of the carbon fiber filaments protruding from the bottom of the groove. Thus, the outer surface of the carbon fiber filaments exposed in the groove can be in a structural form that protrudes from the bottom of the groove, thereby allowing the structural member to be grooved using methods such as ion beam etching or photolithography.

[0013] In some embodiments, the exposed carbon fiber filaments have a first cross-sectional surface that is flush with the groove wall, and the conductive portion contacts and electrically connects to the first cross-sectional surface of the carbon fiber filaments. Thus, the first cross-sectional surface of the carbon fiber filaments exposed in the groove can be flush with the groove wall, thereby allowing the structural member to be grooved using methods such as polishing, grinding, or brushing.

[0014] In some embodiments, the exposed carbon fiber filaments have a second cross-sectional surface that is flush with the groove bottom, and the conductive portion contacts and electrically connects to the second cross-sectional surface of the carbon fiber filaments. Thus, the second cross-sectional surface of the carbon fiber filaments exposed in the groove can be flush with the groove bottom, allowing the structural member to be grooved using methods such as polishing, grinding, or brushing.

[0015] In some embodiments, the groove further includes a partition wall connected to the groove bottom and spaced apart from the groove wall. The exposed carbon fiber filaments have a third cross-sectional plane that is flush with the sidewall of the partition wall, and the conductive portion contacts and electrically connects to the third cross-sectional plane of the carbon fiber filaments. Thus, the third cross-sectional plane of the carbon fiber filaments exposed in the groove can be flush with the sidewall of the partition wall, thereby enabling the structural member to be grooved using methods such as ion beam etching, photolithography, polishing, grinding, or wire drawing.

[0016] In some embodiments, the conductive portion includes a conductive layer and a primer layer. The primer layer is disposed within a groove of the structural member body, and the primer layer is in contact with and electrically connected to the exposed carbon fiber filaments. The conductive layer is filled within the groove of the structural member body, and the conductive layer is in contact with and electrically connected to the primer layer. Thus, the exposed carbon fiber filaments can be in contact with and electrically connected to the primer layer, and the conductive layer can be in contact with and electrically connected to the primer layer, thereby forming a three-layer force-bearing structure of carbon fiber filaments, primer layer, and conductive layer, thereby improving the reliability of the connection between the conductive portion and the carbon fiber filaments and preventing detachment between the conductive portion and the carbon fiber filaments.

[0017] In some embodiments, the exposed carbon fiber filaments have an uneven surface, and the groove includes a groove wall and a groove bottom. The base layer is plated on the groove wall and the groove bottom and contacts the uneven surface of the exposed carbon fiber filaments. In this way, the surface of the carbon fiber filaments can be roughened, making the surface of the carbon fiber filaments uneven, thereby increasing the specific surface area of ​​the carbon fiber filaments and further improving the bonding strength between the base layer and the carbon fiber filaments.

[0018] In some embodiments, the interface between the conductive layer and the primer layer is fused to form an alloy, thereby increasing the bonding strength between the conductive layer and the primer layer, thereby preventing the conductive layer and the primer layer from being easily separated.

[0019] In some embodiments, the conductive layer is made of tin, bismuth, gallium, or indium. Tin, bismuth, gallium, or indium, as low-melting-point metals, can conformally bond with the carbon fiber filaments in a liquid state and fill the grooves in a conformal manner. After hardening and shaping, they can serve as electrical connection points, allowing the structural component to be electrically connected to external electronic devices.

[0020] In some embodiments, the base layer is made of chromium, nickel, titanium, copper, iron, or aluminum, which can be fused with the aforementioned tin, bismuth, gallium, or indium to form an alloy to enhance the bonding strength between the conductive layer and the base layer.

[0021] In some embodiments, the structural member further includes a connector, which is disposed on the conductive portion and electrically connected to the conductive portion. Thus, the provision of the connector facilitates electrical connection between the structural member and an external electronic device.

[0022] In some embodiments, the connector includes a pad, a conductive spring, or a conductive silicone. Thus, different connector structures can be selected according to different electronic device structures.

[0023] In some embodiments, the structural component further includes a metal plating layer, which is disposed on the outer surface of the structural component body, and the conductive portion is electrically connected to the metal plating layer. Thus, the conductive portion is electrically connected to the metal plating layer, so that the metal plating layer of the structural component can serve as a reference ground for the electronic device, thereby allowing the electronic device to be grounded through the metal plating layer.

[0024] In some embodiments, the structural member further comprises graphene, which is embedded in the insulating member and in contact with the carbon fiber filaments. Graphene thus has good thermal conductivity, allowing the structural member to serve as a good thermal conductive medium.

[0025] In some embodiments, the structural member is a middle frame or a back cover of an electronic device. Thus, the structural member can serve as the middle frame or the back cover of the electronic device, thereby electrically connecting the structural member to the electronic components in the electronic device to reduce ESD problems.

[0026] A second aspect of the present application provides an electronic device comprising a circuit board, a connector, and the structural member described in the above embodiment, wherein the connector is electrically connected between the circuit board and the structural member. The structural member of the electronic device has the same technical effects as the structural member of the first aspect described above and is not further described here.

[0027] In some embodiments, the connector is disposed on the circuit board and electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive portion on the structural member. Thus, the connector can be disposed on the circuit board, and the circuit board can be electrically connected to the conductive portion on the structural member via the connector, thereby achieving electrical conduction between the circuit board and the structural member.

[0028] In some embodiments, the electronic device further comprises a middle frame, the middle frame comprising a connected middle plate and a frame, the middle plate and the frame being made of the aforementioned structural members. A conductive portion is disposed on the middle plate, and a connector is disposed in the middle of the circuit board and electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive portion on the middle plate. Thus, the connector can be disposed on the circuit board, and the middle plate can be provided with a conductive portion corresponding to the position of the connector, thereby enabling electrical conduction between the middle plate and the circuit board through the electrical connection between the connector and the conductive portion.

[0029] In some embodiments, the electronic device further includes a middle frame, the middle frame including a connected middle plate and a frame, the middle plate and the frame being made of the aforementioned structural members. A conductive portion is disposed on the frame, and a connector is disposed at an edge of the circuit board and electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive portion on the frame. Thus, the connector can be disposed on the circuit board, and the frame can be provided with a conductive portion corresponding to the position of the connector, thereby enabling electrical conduction between the frame and the circuit board through the electrical connection between the connector and the conductive portion.

[0030] In some embodiments, the connector is disposed on the structural member and electrically connected to the conductive portion. The circuit board is electrically connected to the connector on the structural member. Thus, the connector may also be disposed on the structural member, and the circuit board may be electrically connected to the connector on the structural member, thereby achieving electrical continuity between the circuit board and the structural member.

[0031] In some embodiments, the electronic device further includes a middle frame, which includes a connected middle plate and frame, and the middle plate and frame are made of the aforementioned structural members. A conductive portion is disposed on the middle plate, a connector is disposed on the middle plate and electrically connected to the conductive portion, and the circuit board is electrically connected to the connector on the middle plate. Thus, the connector can also be disposed on the middle plate of the middle frame, so that the circuit board can be electrically connected to the middle plate via the connector and conduct electricity.

[0032] In some embodiments, the electronic device further includes a middle frame, which includes a connected middle plate and a frame, and the middle plate and frame are made of the aforementioned structural members. A conductive portion is disposed on the frame, a connector is disposed on the frame and electrically connected to the conductive portion, and the circuit board is electrically connected to the connector on the frame. Thus, the connector can also be disposed on the frame of the middle frame, thereby enabling electrical connection and conduction between the circuit board and the frame via the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0034] FIG2 is a schematic diagram of the exploded structure of the electronic device in FIG1 ;

[0035] FIG3 is a schematic diagram of the three-dimensional structure of the middle frame of the electronic device in FIG2 ;

[0036] FIG4 is a schematic diagram of a three-dimensional structure of a portion of the middle frame cut out of FIG3 as a structural member;

[0037] FIG5 is a schematic planar structural diagram of the arrangement of carbon fiber filaments within the structural member in FIG4 ;

[0038] FIG6 is a schematic diagram of the three-dimensional structure of the structural member body in FIG4 ;

[0039] FIG7 is a schematic diagram of the AA cross-sectional structure of the structural member body in FIG6 ;

[0040] FIG8 is a second schematic diagram of the AA cross-sectional structure of the structural member body in FIG6;

[0041] FIG9 is a third schematic diagram of the AA cross-sectional structure of the structural member body in FIG6 ;

[0042] FIG10 is a fourth schematic diagram of the AA cross-sectional structure of the structural member body in FIG6;

[0043] FIG11 is a schematic cross-sectional view of the conductive portion filled in the groove of the structural member body in FIG9 ;

[0044] FIG12 is a schematic diagram of a three-dimensional structure of the surface roughening of the carbon fiber filaments in FIG11;

[0045] FIG13 is a second schematic diagram of the three-dimensional structure of the surface roughening of the carbon fiber filaments in FIG11;

[0046] FIG14 is an enlarged structural diagram of point A of the structural member body in FIG11;

[0047] FIG15 is a schematic cross-sectional view of a structure in which a welding pad is provided in a groove of the structural member body in FIG9 ;

[0048] FIG16 is a schematic diagram of a three-dimensional structure of the structure body in FIG9 with a metal coating plated on the surface;

[0049] FIG17 is a schematic diagram of the structure of the mixed weaving of carbon fiber filaments and graphene fibers in the main body of the structural member in FIG16;

[0050] FIG18 is a schematic diagram of an electronic device in use according to an embodiment of the present application;

[0051] FIG19 is a schematic cross-sectional view of a carbon fiber plate in the prior art;

[0052] FIG20 is a first schematic diagram of the three-dimensional structure of the circuit board in the electronic device in FIG18 ;

[0053] FIG21 is a schematic cross-sectional view of an electronic device including the circuit board in FIG20 ;

[0054] FIG22 is an enlarged structural diagram of a portion B of the electronic device in FIG21 ;

[0055] FIG23 is a second schematic diagram of the three-dimensional structure of the circuit board in the electronic device in FIG18;

[0056] FIG24 is a schematic cross-sectional view of an electronic device including the circuit board in FIG23;

[0057] FIG25 is a first schematic diagram of a three-dimensional structure of a structural member provided in an embodiment of the present application;

[0058] FIG26 is a schematic plan view of the structure of the structural member in FIG25 as a mid-plate of an electronic device;

[0059] FIG27 is a second schematic diagram of a three-dimensional structure of a structural member provided in an embodiment of the present application;

[0060] FIG28 is a schematic diagram of the three-dimensional structure of the structural member provided in an embodiment of the present application applied in a laptop computer.

[0061] Reference numerals:

[0062] 01-Electronic device; 02-Structural component; 03-Laptop computer; 100-Midframe; 200-Display screen; 300-Back cover; 400-Circuit board; 500-Battery; 101-Hollow part; 110-Midboard; 120-Frame; 121-Frame antenna; 122-Slot; 123-Break; 130-Local area; 210-Structural component body; 220-Conductive part; 211-Carbon fiber; 212-Insulating component; 213-Groove; 2131-Groove bottom; 2132-Groove wall; 2133-Groove space; 2134-Partition wall; 211a-First cross-section; 211b-Second cross-section Cross-sectional plane; 211c-third cross-sectional plane; 221-conductive layer; 222-base layer; 223-alloy area; 2111-pit; 2112-gap; 230-pad; 240-metal plating; 250-graphene; 410-substrate; 420-chip; 430-memory; 440-shielding cover; 450-connector; 460-wire; 451-conductive silicone; 452-conductive spring; 470-patch antenna; 480-grounding point; 490-feeding point; 210a-first wall; 210b-second wall; 310-computer body; 320-screen; 330-housing. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0064] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0065] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0066] The present embodiment provides an electronic device 01. As shown in FIG1 , the electronic device 01 can be a mobile phone, tablet computer, e-reader, laptop computer, wearable device, drone, or other electronic product. The present embodiment does not impose any particular restrictions on the specific type of electronic device 01. To better illustrate the content of the present embodiment, the following description will take the mobile phone as an example.

[0067] The electronic device 01 mentioned above, as shown in Figure 1, may include a middle frame 100, a display screen 200, and a back cover 300. The display screen 200 may be connected to one side of the middle frame 100 by pasting, and the back cover 300 may be connected to the side of the middle frame 100 facing away from the display screen 200 by screwing, welding, bonding, or snapping. The embodiment of the present application does not impose any special restrictions on the connection method between the various components of the electronic device 01. Among them, as shown in Figure 1, the electronic device 01 may have a length direction, a width direction, and a thickness direction. For the sake of convenience of explanation, the following embodiments will use the X direction as the length direction of the electronic device 01, the Y direction as the width direction of the electronic device 01, and the Z direction as the thickness direction of the electronic device 01. Taking a mobile phone as an example, the outline of the mobile phone may be a rectangle, the direction of the long side may be the length direction of the mobile phone, and the direction of the short side may be the width direction of the mobile phone.

[0068] Figure 2 shows a schematic diagram of the decomposed structure of the above-mentioned electronic device 01. In order to realize the relevant functions of the electronic device 01, the electronic device 01 may further include a circuit board 400 and a battery 500. The circuit board 400 can be electrically connected to multiple chips, memories, antennas and other electronic devices, and the battery 500 can be electrically connected to the circuit board 400 to provide the power required by the circuit board 400. According to the structural design of different electronic devices 01, the circuit board 400 and the battery 500 can be installed between the middle frame 100 and the back cover 300, or between the middle frame 100 and the display screen 200. The embodiment of the present application does not impose any special restrictions on the installation positions of the circuit board 400 and the battery 500.

[0069] In addition, as shown in FIG2 , in order to facilitate the installation of the battery 500, a hollow portion 101 may be provided on the middle frame 100 so that the battery 500 can be installed in the hollow portion 101. The embodiment of the present application does not impose any special restrictions on the internal structure of the electronic device 01. In the following embodiments, for ease of description, hollow components such as slots and holes are marked with arrow-marked lines, while other components are marked with arrow-less lines. The same marking method will be used in the drawings of the following embodiments and will not be repeated here.

[0070] In order to reduce the structural weight of the electronic device 01, the embodiment of the present application provides a structural part 02. For example, the middle frame 100 of the above-mentioned electronic device 01 can adopt the structural part 02 provided by the embodiment of the present application. As shown in Figure 3, it is a schematic diagram of the three-dimensional structure of the middle frame 100 in the electronic device 01 in Figure 2. The middle frame 100 may include a middle plate 110 and a frame 120, and the frame 120 may be connected to the outer periphery of the middle plate 110. Among them, the material of the middle plate 110 and the frame 120 can be selected from carbon fiber composite materials. The middle plate 110 and the frame 120 can be an integrally formed structural part 02, or a structural part 02 formed by bonding, screwing or riveting. In order to better demonstrate the specific structure of the structural part 02, the local area 130 of the middle plate 110, such as the area shown by the dotted line in Figure 2, will be cut out as the structural part 02 for detailed description below.

[0071] Furthermore, the frame 120 of the aforementioned middle frame 100 may also be made of the same structural material as the structural member 02, and the back cover 300 of the aforementioned electronic device 01 may also be made of the same structural material as the structural member 02. This embodiment of the application does not impose any particular restrictions on the specific structural locations in the electronic device 01 where the structural member 02 may be used. The following description only uses the middle plate 110 as an example to illustrate the structure of the structural member 02 in the selected partial area 130.

[0072] Based on this, as shown in FIG4 , it is an enlarged structural schematic diagram of the local area 130 of the middle plate 110 intercepted in FIG3 . The structural member 02 provided in the embodiment of the present application may include a structural member body 210 and a conductive portion 220, and the conductive portion 220 is arranged on the structural member body 210 and connected to the structural member body 210. The structural member body 210 may include carbon fiber filaments 211 and an insulating member 212, and the carbon fiber filaments 211 are embedded in the insulating member 212. A portion of the carbon fiber filaments 211 can be exposed outside the insulating member 212 by means of grooves or holes, so that the carbon fiber filaments 211 and the conductive portion 220 can be in contact and electrically connected, so that the carbon fiber filaments 211 and the conductive portion 220 are conductive, so that the conductive portion 220 can serve as a welding point on the structural member 02 for electrical connection with at least one of the above-mentioned circuit board 400 (shown in FIG2 ) and the battery 500 (shown in FIG2 ). Among them, the insulating part 212 can be an insulating material such as resin or ceramic, and the carbon fiber filaments 211 can be embedded in the insulating part 212 by processes such as brushing glue coating and molding. The embodiment of the present application does not impose special restrictions on the specific material of the insulating part 212 and the preparation process of the structural part body 210. In some embodiments, as shown in Figure 4, a plurality of carbon fiber filaments 211 can be provided, and the plurality of carbon fiber filaments 211 can be arranged along the X direction and arranged along the Y direction. The plurality of carbon fiber filaments 211 can also be arranged in layers along the Z direction. In other embodiments, as shown in Figure 5, the plurality of carbon fiber filaments 211 can also be arranged in a mesh shape in the XY plane. The embodiment of the present application does not impose special restrictions on the specific number and arrangement of the carbon fiber filaments 211 in the insulating part 212.

[0073] The spacing between the carbon fiber filaments 211 shown in Figures 4 and 5 does not represent the actual spacing between the carbon fiber filaments 211 in the carbon fiber composite material. It is only used as a schematic representation of the specific arrangement of the carbon fiber filaments 211 within the insulating member 212. The density of the carbon fiber filaments 211 in the actual carbon fiber composite material is much greater than the density shown in the figure. When the density between the carbon fiber filaments 211 is relatively high, during the process of applying the glue and molding the carbon fiber composite material, the carbon fiber filaments 211 overlap, entangle, and parallel each other, allowing the carbon fiber filaments 211 in the carbon fiber composite material to be electrically connected to each other. At the same time, due to the relatively high density between the carbon fiber filaments 211, the spacing between the carbon fiber filaments 211 is relatively small, resulting in indirect coupling between the carbon fiber filaments 211, which can also allow the carbon fiber filaments 211 in the carbon fiber composite material to be electrically connected to each other.

[0074] On this basis, the structural member 02 provided in the embodiment of the application, as shown in Figure 6, shows the structure of the structural member 02 before the conductive part 220 is set. For example, a groove 213 can be opened on the surface of the structural member body 210, so that a part of the carbon fiber filaments 211 are exposed in the groove 213. The groove 213 may include a groove bottom 2131, a groove wall 2132, and a groove space 2133 surrounded by the groove bottom 2131 and the groove wall 2132. The carbon fiber filaments 211 exposed in the groove 213 can be located at the groove bottom 2131, or at the groove wall 2132, or at the groove space 2133. The embodiment of the present application does not impose any special restrictions on the specific position of the carbon fiber filaments 211 exposed in the groove 213.

[0075] Among them, the method of opening the groove 213 can adopt mechanical equipment through computer numerical control (CNC), polishing, grinding, wire drawing and other process methods, or the groove 213 can be opened on the surface of the structural part body 210 by ion beam etching or photolithography and other methods. Of course, by adopting different processing techniques, grooves 213 of different shapes can be opened on the surface of the structural part body 210. For example, a rectangular groove 213 can be formed by CNC processing. The embodiment of the present application does not impose special restrictions on the processing technology and specific shape of the groove 213. For better explanation, the following embodiment will give examples of the shape of the groove 213 and the carbon fiber filaments 211 exposed in the groove 213.

[0076] For example, as shown in FIG7 , ion beam etching or photolithography can also be used to set the groove 213 (shown in FIG6 ) to an arc shape. Of course, depending on different processing techniques, the carbon fiber filaments 211 exposed in the groove 213 can be in the shape of a cylindrical curved surface or a truncated cross-section. As long as there are exposed carbon fiber filaments 211 in the groove 213, the embodiment of the present application does not impose any special restrictions on the specific shape of the carbon fiber filaments 211 exposed in the groove 213.

[0077] For example, as shown in Figure 8, the shape of the groove 213 (shown in Figure 6) can also be a trapezoid. In some embodiments, the above-mentioned processing technology can be used to remove only the insulating member 212 in the groove 213, while retaining the carbon fiber filaments 211 located at the groove bottom 2131, so that the outer surface of the carbon fiber filaments 211 located at the groove bottom 2131 can protrude from the groove bottom 2131, and the conductive portion 220 can contact and electrically connect with the outer surface of the carbon fiber filaments 211 protruding from the groove bottom 2131. In other embodiments, the above-mentioned processing technology can also be used to simultaneously remove the carbon fiber filaments 211 and the insulating member 212 in the groove 213, so that the carbon fiber filaments 211 located at the groove wall 2132 can have a first cross-sectional surface 211a, and the first cross-sectional surface 211a can be flush with the groove wall 2132, so that the conductive portion 220 can also contact and electrically connect with the first cross-sectional surface 211a of the carbon fiber filaments 211 at the groove wall 2132. Of course, a combination of the above processing techniques may also be used to ensure that the carbon fiber filaments 211 exposed in the groove 213 have both an outer surface protruding from the groove bottom 2131 and a first cross-sectional surface 211 a flush with the groove wall 2132 .

[0078] For example, as shown in FIG9 , the remaining structure is the same as that shown in FIG8 , except that the above-mentioned processing technology can also be used to simultaneously remove the carbon fiber filaments 211 and the insulating member 212 in the groove 213 (shown in FIG6 ), so that the carbon fiber filaments 211 located at the groove bottom 2131 can have a second cross-sectional surface 211b, and the second cross-sectional surface 211b can be flush with the groove bottom 2131, so that the conductive portion 220 can also contact and electrically connect with the second cross-sectional surface 211b of the carbon fiber filaments 211 at the groove bottom 2131. A combination of the above-mentioned processing technologies can also be used to make the carbon fiber filaments 211 exposed in the groove 213 have both a second cross-sectional surface 211b flush with the groove bottom 2131 and a first cross-sectional surface 211a flush with the groove wall 2132.

[0079] For example, as shown in FIG10 , the above-mentioned processing technology can also be used to simultaneously remove a portion of the carbon fiber filaments 211 and a portion of the insulating member 212 in the groove 213 (shown in FIG6 ), so that the remaining carbon fiber filaments 211 and insulating member 212 form a partition wall 2134 connected to the groove bottom 2131. The partition wall 2134 can be spaced apart from the groove wall 2132. The partition wall 2134 can include carbon fiber filaments 211 and insulating member 212. The carbon fiber filaments 211 on the partition wall 2134 can have a third cross-sectional surface 211c. The third cross-sectional surface 211c can be flush with the side wall of the partition wall 2134, so that the conductive portion 220 can also contact and electrically connect with the third cross-sectional surface 211c of the carbon fiber filaments 211 on the side wall of the partition wall 2134. At this time, the exposed carbon fiber filaments 211 are located in the groove space 2133. Of course, there can be multiple partition walls 2134 on the groove bottom 2131, and the embodiment of the present application does not impose any special restrictions on the specific number of partition walls 2134.

[0080] Of course, in order to allow a portion of the carbon fiber filaments 211 embedded in the insulating member 212 to be exposed outside the insulating member 212, a portion of the carbon fiber filaments 211 can also be made to protrude from the surface of the structural member body 210 when the structural member body 210 is manufactured. That is, the surface of the structural member body 210 is provided with carbon fiber filaments 211 and insulating members 212 that protrude relative to the surface of the structural member body 210. For example, a multi-layer carbon fiber filament 211 structure can be used in a local area of ​​the structural member body 210, so that the carbon fiber filaments 211 in this local area protrude from the surface of the structural member body 210 after glue coating or molding. In this case, it is only necessary to directly remove the insulating member 212 that protrudes from the surface of the structural member body 210 through CNC, polishing, grinding, wire drawing, ion beam etching, or photolithography, thereby eliminating the need to provide grooves 213 on the surface of the structural member body 210. This can still achieve the effect of allowing a portion of the carbon fiber filaments 211 embedded in the insulating member 212 to be exposed outside the insulating member 212.

[0081] The above embodiments are examples of the specific shape of the groove 213 and the carbon fiber filaments 211 exposed in the groove 213. The conductive portion 220 provided in the groove 213 will be described in detail below. As shown in Figure 11, the conductive portion 220 may include a conductive layer 221 and a base layer 222. The base layer 222 is provided in the groove 213 (shown in Figure 9), and the base layer 222 is directly connected to the carbon fiber filaments 211 exposed in the groove 213. Among them, the base layer 222 can be plated in the groove 213 by electroplating, chemical plating, etc., so that the base layer 222 is directly connected to the carbon fiber filaments 211. The number of layers of the base layer 222 can be one layer or multiple layers. The embodiment of the present application does not impose any special restrictions on the number of layers of the base layer 222. The conductive layer 221 is filled in the groove 213, and the conductive layer 221 is connected to the base layer 222.

[0082] Furthermore, in more embodiments, along the Z direction, the surface of the conductive portion 220 may protrude from the surface of the insulating member 212, may be flush with the surface of the insulating member 212, or may be lower than the surface of the insulating member 212. The embodiment of the present application does not impose any particular limitation on the surface height of the conductive portion 220 along the Z direction.

[0083] In order to ensure the connection strength between the base layer 222 and the carbon fiber filaments 211 exposed in the groove 213, the surface of the carbon fiber filaments 211 exposed in the groove 213 can be roughened to make the surface of the carbon fiber filaments 211 uneven, so as to increase the specific surface area of ​​the carbon fiber filaments 211, thereby improving the connection strength between the base layer 222 (shown in Figure 11) and the carbon fiber filaments 211. The roughening treatment method can be liquid phase oxidation etching, plasma treatment or irradiation treatment, etc. The embodiment of the present application does not impose special restrictions on the specific method of roughening treatment. Among them, the surface of the roughened carbon fiber filaments 211 can be the outer surface of the carbon fiber filaments 211 protruding from the groove bottom 2131 as shown in Figure 8, or it can be the first cross-sectional plane 211a flush with the groove wall 2132 as shown in Figure 8, or it can be the second cross-sectional plane 211b flush with the groove bottom 2131 as shown in Figure 9, or it can be the third cross-sectional plane 211c on the side wall of the partition wall 2134 as shown in Figure 10.

[0084] In some embodiments, as shown in FIG12 , during the roughening treatment, different roughening treatment processes can form pits 2111 on the surface of the carbon fiber filaments 211, and the shape of the pits 2111 can be various shapes such as triangles, circles, rectangles, etc. The embodiment of the present application does not impose any special restrictions on the specific shape and depth of the pits 2111. The above-mentioned base layer 222 (shown in FIG11 ) can be embedded in the pits 2111, which not only increases the connection area between the carbon fiber filaments 211 and the base layer 222, but also increases the bite force between the base layer 222 and the carbon fiber filaments 211, thereby improving the bonding strength between the base layer 222 and the carbon fiber filaments 211. Among them, the area of ​​the pits 2111 opened on the surface of the carbon fiber filaments 211 can be 1 μm 2 -1mm 2 The depth of the pits 2111 on the surface of the carbon fiber filaments 211 can be 1-1000 μm. If the pits 2111 are too large, the specific surface area of ​​the carbon fiber filaments 211 will be reduced, thereby affecting the bonding strength between the base layer 222 and the carbon fiber filaments 211. If the pits 2111 are too small, the base layer 222 will not be able to fit into the pits 2111, which will also affect the bonding strength between the base layer 222 and the carbon fiber filaments 211.

[0085] In other embodiments, as shown in Figure 13, during the roughening treatment, different roughening treatment processes can also form dense gaps 2112 on the surface of the carbon fiber filaments 211. The embodiment of the present application does not impose any special restrictions on the density of the gaps 2112. Similarly, the above-mentioned base layer 222 (shown in Figure 11) can also be embedded in the gaps 2112 to improve the bonding strength between the base layer 222 and the carbon fiber filaments 211. Among them, the length, width and depth of the gaps 2112 opened on the surface of the carbon fiber filaments 211 can be 1-1000μm. If the size of the gap 2112 is too large, the specific surface area of ​​the carbon fiber filaments 211 will also be reduced, thereby affecting the bonding strength between the base layer 222 and the carbon fiber filaments 211. If the size of the gap 2112 is too small, the base layer 222 cannot be embedded in the gap 2112, which will also affect the bonding strength between the base layer 222 and the carbon fiber filaments 211.

[0086] On this basis, as shown in Figure 14, it is an enlarged structural diagram of point A in Figure 11. For example, the material of the conductive layer 221 can be made of low-melting-point metal tin. The low-melting-point metal tin can be contoured and filled into the above-mentioned groove 213 (shown in Figure 9) when in liquid state, thereby avoiding the presence of a gap between the conductive layer 221 and the groove 213, which affects the connection strength between the conductive layer 221 and the groove 213. After solidification, the metal tin can form a welding surface on the side away from the base layer 222, thereby being used as a welding point. The base layer 222 can be made of metal chromium, and the liquid metal tin can be fused with the metal chromium to form an alloy. That is, an alloy region 223 shown by the dotted line in the figure can be formed between the interface of the conductive layer 221 and the base layer 222, thereby improving the bonding strength between the conductive layer 221 and the base layer 222.

[0087] Of course, the material of the conductive layer 221 can also be gallium, bismuth, indium or other metals with low melting points, and the material of the base layer 222 can also be titanium, nickel, copper, iron or aluminum or alloys thereof, which can also form an alloy between the interface of the conductive layer 221 and the base layer 222. The melting point of the metal can be 50°C-350°C. If the melting point of the metal is too high, it will be difficult to fuse with the base layer 222 to form an alloy, and the insulating part 212 will be easily oxidized. If the melting point of the metal is too low, the stability of the alloy will be affected. The embodiment of the present application does not impose any special restrictions on the specific materials of the conductive layer 221 and the base layer 222.

[0088] In addition, as shown in Figure 15, the structural member 02 may further include a connector 450 (shown in Figure 20). In some embodiments, the connector 450 may include a pad 230. The pad 230 may be provided on the side of the conductive layer 221 away from the base layer 222, and the pad 230 may be electrically connected to the conductive layer 221, so that the structural member 02 may be electrically connected to other electronic devices through the pad 230. The conductive layer 221 may be partially filled in the groove 213 (shown in Figure 9) so that the pad 230 is flush with the surface of the insulating member 212. The conductive layer 221 may also completely fill the groove 213 so that the pad 230 protrudes from the surface of the insulating member 212. The embodiment of the present application does not impose any special restrictions on the relative positional relationship between the pad 230 and the insulating member 212.

[0089] In some embodiments, as shown in FIG16 , the structural component 02 may further include a metal plating layer 240, which is plated on the outer surface of the structural component body 210, and the conductive portion 220 may be electrically connected to the metal plating layer 240. Along the Z direction in the figure, the conductive portion 220 may be flush with the surface of the metal plating layer 240, or the conductive portion 220 may be protruding or recessed relative to the surface of the metal plating layer 240. The embodiment of the present application does not impose any special restrictions on the relative positional relationship between the conductive portion 220 and the metal plating layer 240. For example, when the structural component 02 serves as the middle frame 100 (shown in FIG2 ) of the electronic device 01 (shown in FIG2 ), the structural component body 210 may be plated with the metal plating layer 240 on both sides. When the structural component 02 serves as the back cover 300 (shown in FIG2 ) of the electronic device 01, the structural component body 210 may also be plated with the metal plating layer 240 on one side. The embodiment of the present application does not impose any special restrictions on the position and number of the metal plating layer 240.

[0090] Taking into account the heat dissipation requirements of the electronic device 01 (shown in Figure 2), the structural part 02 may also include graphene 250 in the structural part body 210. In some embodiments, as shown in Figure 17, the graphene 250 can be configured as graphene fibers, and the graphene fibers can be mixed and woven with the carbon fiber filaments 211. In other embodiments, the graphene 250 can also be configured as graphene powder, and the graphene powder can be integrally hot-pressed with the carbon fiber filaments 211 before being embedded in the insulating part 212 (shown in Figure 15), or it can be in-situ composited with the carbon fiber filaments 211 during the process of embedding the insulating part 212. The embodiment of the present application does not impose any special restrictions on the specific way in which the graphene 250 and the carbon fiber filaments 211 are composited. In this way, the structural part 02 can also be used as a good thermal conductive medium.

[0091] In the above embodiment, the environment in which the carbon fiber filaments 211 exposed outside the insulating part 212 are located is different depending on the different scenarios of the structural part 02. For example, when the groove 213 is opened by CNC, polishing, grinding, wire drawing or other methods, the carbon fiber filaments 211 exposed outside the insulating part 212 can be the carbon fiber filaments 211 in contact with the air in the groove 213. When the groove 213 is opened by ion beam etching or photolithography or other methods, since a protective gas is required during the processing, the carbon fiber filaments 211 exposed outside the insulating part 212 can be the carbon fiber filaments 211 in contact with the protective gas in the groove 213. After the conductive part 220 is filled in the groove 213, the carbon fiber filaments 211 exposed outside the insulating part 212 can be the carbon fiber filaments 211 in the groove 213 that are in contact with the conductive part 220 and are electrically connected.

[0092] The above embodiment uses structural component 02 as the middle frame 100 of electronic device 01 as an example, and provides a detailed description of the specific structure of structural component 02. The following describes the operating principle of middle frame 100 in detail, combined with the specific structure of structural component 02. As shown in Figure 18, to reduce the weight of electronic device 01, a high-strength, lightweight, and flexible carbon fiber composite board is typically selected for middle frame 100 (shown in Figure 2) or back cover 300 (shown in Figure 2) of electronic device 01.

[0093] Because carbon fiber inherently absorbs electromagnetic waves, and the carbon fiber composite material formed by combining carbon fiber with insulating materials also exhibits hysteresis, carbon fiber composite materials can suffer from self-absorption and passive intermodulation (PIM) issues. To address this issue, as shown in Figure 19, a metal 2 is typically plated on the surface of a carbon fiber composite plate 1, with insulation 3 between the carbon fiber composite plate 1 and the metal 2. The human body easily generates static electricity during activity, and when holding an electronic device 01, this static electricity is transmitted to the electronic device 01. When a large current passes through the metal 2 (e.g., static electricity), one type of charge (e.g., positive charge) is generated on the surface of the metal 2. At this time, due to the excellent conductivity of the carbon fibers in the carbon fiber composite plate 1, the carbon fibers can be electrostatically induced to generate another type of charge (e.g., negative charge). As a result, with frequent use of the electronic device 01, the carbon fibers in the carbon fiber composite plate 1 continuously accumulate charge. Because the carbon fibers are encapsulated within the insulation 3, they cannot be discharged externally. When the charge reaches a certain threshold, it is directly released to the nearest electronic device, causing damage to the electronic device 01.

[0094] The structural member 02 provided in the embodiment of the present application, as shown in FIG11, is provided with a groove 213 (shown in FIG9) on the surface of the structural member body 210, so that a portion of the carbon fiber filament 211 is exposed in the groove 213, and is directly in contact with the carbon fiber filament 211 through the conductive portion 220. In this way, the conductive portion 220 in the groove 213 can be directly connected to the carbon fiber filament 211 exposed in the groove 213, so that the carbon fiber filament 211 encapsulated in the insulating member 212 can be used as a discharge path for electrostatic current. For example, as shown in FIG16, when the outer surface of the structural member body 210 is plated with a metal coating 240, the metal coating 240 can be used as a reference ground. Since the conductive portion 220 is electrically connected to the metal coating 240, the electrostatic current can finally flow to the metal coating 240 through the carbon fiber filament 211 and the conductive portion 220, thereby avoiding the ESD problem caused by the lack of a discharge path for the electrostatic current.

[0095] In addition, as shown in FIG14 of the aforementioned embodiment, since the surface of the carbon fiber filaments 211 exposed in the groove 213 is roughened, the bonding strength between the base layer 222 and the carbon fiber filaments 211 is improved. At the same time, since the conductive layer 221 made of a low-melting-point metal material can fuse with the base layer 222 to form an alloy in a liquid state, the bonding strength between the conductive layer 221 and the base layer 222 is improved, thereby forming a three-layer force-bearing structure of the carbon fiber filaments 211, the base layer 222, and the conductive layer 221. When the outer surface of the structural component body 210 is plated with a metal coating 240, the conductive layer 221 can also be welded to the metal coating 240 to improve the connection strength of the metal coating 240 on the structural component body 210, thereby avoiding the problem of the metal coating 240 falling off from the structural component body 210 due to the different thermal expansion coefficients of the metal coating 240 and the structural component body 210 when the temperature fluctuates greatly.

[0096] To better illustrate the application of the structural member 02 provided in the embodiment of the present application in the electronic device 01, in some embodiments, as shown in FIG20 , the circuit board 400 in the electronic device 01 may include electronic components such as a substrate 410, a chip 420, a memory 430, a shielding cover 440, a plurality of connectors 450, and a wire 460. The wire 460 is disposed on the substrate 410, and the chip 420, the memory 430, and the shielding cover 440 may be electrically connected to the surface of the substrate 410 by surface mount technology (SMT). The chip 420 and the memory 430 may also be electrically connected by the wire 460.

[0097] Of course, depending on the functional requirements of electronic device 01, circuit board 400 may also include other electronic components such as a fingerprint module, a camera module, and a microphone. Each electronic component may be electrically connected to circuit board 400 individually or electrically connected to each other via wires 460. This embodiment of the application does not impose any specific restrictions on the type, quantity, or connection method of the electronic components on circuit board 400.

[0098] Continuing with Figure 20 , typically, to determine the operating voltage of each electronic device, each electronic device is electrically connected to a reference ground via a connector 450 . For example, the connector 450 can be disposed on the circuit board 400 and electrically connected thereto. The connector 450 can include a conductive silicone rubber 451 and a conductive spring 452 . For example, the conductive silicone rubber 451 can be disposed on the periphery of the shielding cover 440 to ground the shielding cover 440. The conductive spring 452 can be disposed on the periphery of the chip 420 or the memory 430 to ground the chip 420 or the memory 430. Of course, different electronic devices may utilize different types of connectors 450 for grounding. Furthermore, the connector 450 can be disposed on the same side of the circuit board 400 as the electronic device, or on a different side of the circuit board 400. The present embodiment of the application does not impose any specific restrictions on the type of connector 450 selected for grounding the electronic device or on the location of the connector 450 .

[0099] In the above embodiment, the metal plating 240 within the structural member 02 (shown in FIG. 16 ) can serve as a reference ground. As shown in FIG. 21 , the circuit board 400 can be disposed between the middle frame 100 and the display screen 200 of the electronic device 01 , and the connector 450 on the circuit board 400 can be welded to the conductive portion 220 on the middle frame 100 . Since the conductive portion 220 is electrically connected to the metal plating 240 , the electronic components on the circuit board 400 can be grounded through the connector 450 . For example, along the Z direction in the figure, the surface of the conductive portion 220 is lower than the surface of the middle frame 100 facing the circuit board 400 , so that the metal plating 240 can be electrically connected to the conductive portion 220 within the groove 213 (shown in FIG. 6 ), thereby increasing the thickness of the metal plating 240 at the conductive portion 220 along the Z direction. During welding, the problem of the metal plating 240 being too thin causing the metal plating 240 to separate from the conductive portion 220 after welding will not occur, thereby ensuring the quality of welding.

[0100] Of course, as shown in FIG21 , a solder pad 230 may also be provided on the surface of the conductive portion 220 along the Z direction in the figure. The solder pad 230 is electrically connected to the conductive portion 220 and may also be electrically connected to the metal plating layer 240, so that the connector 450 may also be electrically connected to the middle frame 100 via the solder pad 230. The present embodiment of the application does not impose any particular restrictions on whether the solder pad 230 is provided at the location of the conductive portion 220 on the middle frame 100.

[0101] Among them, as shown in Figure 22, it is an enlarged structural diagram of point B in Figure 21. According to the different heights of the connector 450 set along the Z direction, different distances S can be set between the metal plating layer 240 and the conductive part 220, so that the depth of the groove 213 on the structural part body 210 can accommodate the connector 450, so as to reduce the thickness of the electronic device 01 in the Z direction, thereby facilitating the thinning of the electronic device 01. In addition, when the conductive part 220 is used as the point of electrical connection of the circuit board 400, since the conductive part 220 forms a three-layer force-bearing structure of carbon fiber filaments 211, base layer 222 and conductive layer 221, when the conductive part 220 is welded, it can withstand the high-pressure point contact of the connector 450, and the problem of damage to the welding point is not easy to occur, thereby ensuring the welding quality between the structural part body 210 and the circuit board 400.

[0102] For example, in conjunction with Figures 20 and 21, the conductive portion 220 can be provided on the middle plate 110 (shown in Figure 3) of the middle frame 100, and the connector 450 can be provided in the middle position of the circuit board 400 and electrically connected to the circuit board 400. The middle position of the circuit board 400 can be an area outside the range L from the edge of the circuit board 400, 0≤L≤1cm. The embodiment of the present application does not impose any special restrictions on the middle position and edge position of the circuit board 400. In this way, the circuit board 400 can be electrically connected to the conductive portion 220 on the middle plate 110 through the connector 450. Of course, the connector 450 can also be provided on the middle plate 110, and the connector 450 is electrically connected to the conductive portion 220 on the middle plate 110, so that the middle plate 110 can be electrically connected to the middle position of the circuit board 400 through the connector 450. The embodiment of the present application does not impose any special restrictions on whether the connector 450 is provided on the middle plate 110 or on the circuit board 400.

[0103] In some embodiments, as shown in FIG23 , the electronic components on the circuit board 400 may also include a patch antenna 470, a ground point 480, and a feed point 490, with the patch antenna 470 being electrically connected to the ground point 480 and the feed point 490, respectively. The ground point 480 and the feed point 490 may be disposed at the edge of the circuit board 400. Of course, depending on the requirements of different antenna functions, a greater number of patch antennas 470, ground points 480, and feed points 490 may be provided on the circuit board 400. The embodiments of the present application do not impose any particular restrictions on the specific number of patch antennas 470, ground points 480, and feed points 490 on the circuit board 400.

[0104] On this basis, as shown in Figure 24, the conductive part 220 in the above embodiment can be set not only on the middle plate 110 of the middle frame 100, but also on the frame 120 of the middle frame 100. For example, the conductive part 220 can be set on the inner side wall of the frame 120, and the connector 450 can be set on the inner side wall of the frame 120 and electrically connected to the conductive part 220. Of course, the number of connectors 450 set on the inner side wall of the frame 120 can be multiple, and the embodiment of the present application does not impose any special restrictions on the specific number of connectors 450 on the frame 120. In addition, the connector 450 and the circuit board 400 can be either point contact or surface contact. The connector 450 can be set on the circuit board 400, or on the middle plate 110 or the frame 120. The embodiment of the present application also does not impose any special restrictions on the contact form and setting position between the connector 450 and the circuit board 400.

[0105] For example, in combination with Figures 23 and 24, the conductive portion 220 can be set on the frame 120, the connector 450 can be set on the frame 120 and electrically connected to the conductive portion 220, and the frame 120 can be electrically connected to the edge position of the circuit board 400 through the connector 450. The edge position of the circuit board 400 refers to the area within the range L from the edge of the circuit board 400, 0≤L≤1cm. In addition, the connector 450 can also be set at the edge position of the circuit board 400 and electrically connected to the circuit board 400, so that the circuit board 400 can be electrically connected to the conductive portion 220 on the frame 120 through the connector 450. The embodiment of the present application does not impose any special restrictions on the connector 450 being set on the frame 120 or on the circuit board 400.

[0106] In some embodiments, as shown in FIG23 , the grounding point 480 and the feeding point 490 can be set at the edge of the circuit board 400, so that the grounding point 480 and the feeding point 490 can be electrically connected to the connector 450 on the inner wall of the frame 120, respectively, thereby achieving the function of grounding the patch antenna 470 circuit. In addition, when the side of the electronic device 01 has electronic devices such as a data interface, a fingerprint module, and a microphone, the function of grounding the electronic devices such as the data interface, the fingerprint module, and the microphone can also be achieved by providing the connector 450 on the frame 120. The embodiment of the present application does not impose any special restrictions on the electronic devices on the side of the electronic device 01.

[0107] For example, as shown in FIG24 , when the shape of the structural member body 210 is designed to resemble the shape of the frame 100 (shown in FIG3 ) in the above-described embodiment, the structural member body 210 may include a first wall 210a and a second wall 210b connected to each other. In this case, the first wall 210a may be the wall of the middle plate 110 facing the circuit board 400, and the second wall 210b may be the wall of the frame 120 facing the circuit board 400. Furthermore, as shown in FIG25 , the structural member body 210 may also be designed as a plate-like structure, in which case the first wall 210a may be the top surface of the plate structure, and the second wall 210b may be the side surface of the plate structure. The groove 213 in the above-described embodiment may be partially defined on the first wall 210a and partially defined on the second wall 210b. Of course, if the thickness of the structural member body 210 along the Z direction is sufficiently large, the groove 213 may also be entirely defined on the second wall 210b. The present embodiment does not impose any particular limitations on the specific shape of the structural member body 210 or the location of the groove 213.

[0108] Based on this, as shown in FIG26 , the electronic device 01 may further include a middle plate 110, a metal frame antenna 121, and multiple grounding points 480 and feeding points 490. A slot 122 may be provided between the middle plate 110 and the frame antenna 121, and a slit 123 may be provided on the frame antenna 121 to disconnect the frame antenna 121. Multiple grounding points 480 and feeding points 490 are provided between the middle plate 110 and the frame antenna 121. In conjunction with FIG25 , a conductive portion 220 (shown in FIG16 ) may be provided within a groove 213 provided on the second wall 210b of the structural member body 210. Thus, when the structural member body 210 serves as the middle plate 110, multiple conductive portions 220 may be provided on the sidewalls of the middle plate 110, so that multiple grounding points 480 and feeding points 490 can be electrically connected to the conductive portions 220, respectively, thereby achieving the grounding function of the frame antenna 121.

[0109] In addition, as shown in FIG27 , it can be seen from the above embodiment that, according to different functional requirements, multiple conductive parts 220 can be provided on the first wall 210a and the second wall 210b of the structural part body 210. As shown in FIG14 , since each conductive part 220 forms a three-layer stress-bearing structure of carbon fiber filaments 211, a base layer 222, and a conductive layer 221, and the conductive part 220 is connected to the metal plating 240 (shown in FIG16 ), the multiple conductive parts 220 can play a role in fixing the metal plating 240 at different positions. In this way, the conductive part 220 not only meets the requirements of the welding point, but also prevents the metal plating 240 from falling off the surface of the structural part body 210.

[0110] The above embodiment illustrates the application of structural component 02 in electronic device 01, primarily using a mobile phone as an example. Structural component 02 can also be applied to other electronic devices 01. For example, structural component 02 can also be applied to electronic devices 01 such as laptop computers 03, tablet computers, and drones.

[0111] For example, as shown in FIG28 , the laptop computer 03 may include a computer body 310, a screen 320, and a shell 330. The shell 330 may be rotatably connected to the computer body 310 by means of hinges, shafts, and other parts, and the screen 320 may be connected to the side of the shell 330 facing the computer body 310 by means of gluing, snapping, and the like. Among them, the structural member 02 provided in the embodiment of the present application may serve as the shell 330. That is, a plurality of conductive portions 220 (as shown in FIG27 ) in the above-mentioned embodiment may be provided on the side of the shell 330 facing the screen 320, and the screen 320 may be electrically connected to the conductive portion 220 on the shell 330 by means of the connector 450 (as shown in FIG24 ) in the above-mentioned embodiment, thereby realizing the function of grounding the screen 320.

[0112] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A structural member, characterized in that: include: A structural member body, comprising an insulating member and carbon fiber filaments, wherein the carbon fiber filaments are embedded in the insulating member and a portion of the carbon fiber filaments are exposed outside the insulating member; as well as, A conductive portion, at least a portion of which is in contact with and electrically connected to the exposed carbon fiber filaments.

2. The structural member according to claim 1, characterized in that: A groove is provided on the surface of the structural member body, and a portion of the carbon fiber filaments is exposed in the groove; At least a portion of the conductive portion is disposed in the groove of the structural component body, and the conductive portion is in contact with and electrically connected to the carbon fiber filaments exposed in the groove.

3. The structural member according to claim 2, characterized in that: The carbon fiber filaments are provided in plurality; the groove comprises a groove wall, a groove bottom, and a groove space surrounded by the groove wall and the groove bottom; At least one of the groove wall, the groove bottom and the groove space is provided with exposed carbon fiber filaments.

4. The structural member according to claim 2, characterized in that: The surface of the structural member body is provided with a plurality of grooves, and the structural member body comprises a first wall surface and a second wall surface connected to each other; A portion of the grooves is disposed on the first wall surface, and another portion of the grooves is disposed on the second wall surface.

5. The structural member according to claim 3, characterized in that: The exposed outer surface of the carbon fiber filament protrudes from the groove bottom, and the conductive part contacts and is electrically connected to the outer surface of the carbon fiber filament protruding from the groove bottom.

6. The structural member according to claim 3, characterized in that: The exposed carbon fiber filaments have a first section surface, the first section surface is flush with the groove wall, and the conductive portion is in contact with and electrically connected to the first section surface of the carbon fiber filaments.

7. The structural member according to claim 3, characterized in that: The exposed carbon fiber filaments have a second section surface, the second section surface is flush with the groove bottom, and the conductive portion is in contact with and electrically connected to the second section surface of the carbon fiber filaments.

8. The structural member according to any one of claims 1 to 7, characterized in that: The conductive part includes a conductive layer and a primer layer; The bottom layer is arranged in the groove of the structural member body, and the bottom layer is in contact with and electrically connected to the exposed carbon fiber filaments; The conductive layer is filled in the groove of the structural component body, and the conductive layer is in contact with and electrically connected to the base layer.

9. The structural member according to claim 8, characterized in that: The exposed carbon fiber filaments are provided with an uneven surface, and the groove comprises a groove wall and a groove bottom; The primer layer is plated on the groove wall and the groove bottom, and is in contact with the uneven surface of the exposed carbon fiber filaments.

10. The structural member according to claim 8, characterized in that: The conductive layer and the primer layer are fused at their interfaces to form an alloy.

11. The structural member according to claim 8, characterized in that The material of the conductive layer includes tin, bismuth, gallium or indium.

12. The structural member according to claim 8, characterized in that The material of the primer layer includes chromium, nickel, titanium, copper, iron or aluminum.

13. The structural member according to any one of claims 1 to 12, characterized in that: The structural member also includes a connecting member; The connecting member is disposed on the conductive portion and is electrically connected to the conductive portion.

14. The structural member according to claim 13, characterized in that The connecting piece includes a soldering pad, a conductive spring or a conductive silicone.

15. The structural member according to any one of claims 1 to 14, characterized in that: The structural member further comprises a metal coating; The metal plating layer is plated on the outer surface of the structural component body, and the conductive part is electrically connected to the metal plating layer.

16. The structural member according to any one of claims 1 to 14, characterized in that: The structural member further comprises graphene, and the graphene is embedded in the insulating member; The graphene is in contact with the carbon fiber filaments.

17. The structural member according to any one of claims 1 to 16, characterized in that: The structural member is a middle frame or a back cover of an electronic device.

18. An electronic device, characterized in that: include: Circuit boards; The structural member according to any one of claims 1 to 17; as well as, A connecting member is electrically connected between the circuit board and the structural member.

19. The electronic device according to claim 18, characterized in that: The connecting member is disposed on the circuit board and is electrically connected to the circuit board; The connecting member on the circuit board is electrically connected to the conductive portion on the structural member.

20. The electronic device according to claim 18, characterized in that The connecting member is disposed on the structural member and is electrically connected to the conductive part; The circuit board is electrically connected to the connecting member on the structural member.

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