Temperature control apparatus and method, and semiconductor processing device

Abstract

The present application provides a temperature control apparatus and method, and a semiconductor processing device. In the apparatus, a first supply unit is used for providing a fluid having a first temperature; a second supply unit is used for providing a fluid having a second temperature; a liquid pump is connected to an output end of a fluid channel; and a fluid control unit is used for conveying to the fluid channel the fluid provided by the first supply unit, and / or the fluid provided by the second supply unit, and / or a fluid outputted by the liquid pump, detecting in real time a first temperature value of a fluid outputted to an input end of the fluid channel by the fluid control unit, and, on the basis of the first temperature value and a preset target temperature value, adjusting in real time the ratio of flows conveyed to the fluid channel by the first supply unit, and / or the second supply unit, and / or the liquid pump, so that the first temperature value is equal to the target temperature value. According to the present solution, the heating rate and the refrigeration rate of an electrostatic chuck can be improved.

Description

Temperature control device, method and semiconductor process equipment Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a temperature control device, method and semiconductor process equipment. Background Art

[0002] Currently, wafer temperature control in semiconductor processing equipment is achieved through the combined action of a cooling unit and a heating unit within the electrostatic chuck. The cooling unit typically uses a refrigerant at a predetermined temperature to flow through the cooling pipes, removing heat and cooling the wafer. The heating element, through the applied current, generates heat to heat the wafer.

[0003] In existing technology, increasing the wafer temperature requires increasing the power applied to the heating element. Lowering the wafer temperature requires stopping the heating element and allowing the refrigerant flowing through the cooling unit to remove heat and cool the wafer. The refrigerant's temperature and flow rate determine the cooling rate of the cooling unit. Consequently, to shorten process execution time and increase production capacity, it's necessary to simultaneously increase the heating and cooling rates of the electrostatic chuck.

[0004] However, if the heating rate needs to be increased, the power loaded on the heating element will inevitably increase, which will not only increase the design difficulty of the electrostatic chuck, but also require the addition of larger-sized filter devices to adapt to the higher heating power. The presence of the filter device will also increase the space occupied by the equipment. At the same time, the cooling unit cannot adjust the flow rate and temperature of the refrigerant flowing through it in real time, that is, the temperature and flow rate of the refrigerant entering the cooling unit are constant. The cooling efficiency can only be improved by increasing the temperature and reducing the flow rate before the refrigerant enters the cooling unit. However, since the refrigerant will continue to flow into the cooling unit at any time, this will cause the heat generated by the heating element during operation to be taken away more by the refrigerant, resulting in a significant reduction in the heating rate. Therefore, the existing temperature control device cannot increase both the heating rate and the cooling rate of the electrostatic chuck.

[0005] Summary of the Invention

[0006] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a temperature control device, method and semiconductor process equipment, which can improve the heating rate and cooling rate of the controlled components.

[0007] To achieve the purpose of this application, a temperature control device is provided for use in semiconductor process equipment, comprising:

[0008] a first supply unit, configured to provide a fluid at a first temperature;

[0009] a second supply unit, configured to provide a fluid at a second temperature, wherein the second temperature is greater than the first temperature;

[0010] a liquid pump connected to an output end of a fluid channel in a controlled component of the semiconductor process equipment, and configured to extract the fluid in the fluid channel; and

[0011] A fluid control unit is connected to the first supply unit, the second supply unit, the liquid pump and the input end of the fluid channel, and is used to deliver the fluid provided by the first supply unit, and / or the fluid provided by the second supply unit, and / or the fluid output by the liquid pump to the fluid channel, and to detect in real time the first temperature value of the fluid output by the fluid control unit to the input end of the fluid channel, and to adjust in real time the flow ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel according to the first temperature value and a preset target temperature value, so that the first temperature value is equal to the target temperature value.

[0012] In some embodiments, the fluid control unit is capable of switching between a cooling mode, a heating mode, and a constant temperature mode;

[0013] In the cooling mode, the fluid control unit is used to divert the fluid provided by the first supply unit to the fluid channel and the first supply unit, and divert the fluid output by the liquid pump to the first supply unit and the input end of the fluid channel;

[0014] In the heating mode, the fluid control unit is used to divert the fluid provided by the second supply unit to the fluid channel and the second supply unit, and divert the fluid output by the liquid pump to the second supply unit and the input end of the fluid channel;

[0015] In the constant temperature mode, the fluid control unit is used to divert the fluid provided by the first supply unit to the fluid channel and the first supply unit, and at the same time divert the fluid provided by the second supply unit to the fluid channel and the second supply unit, and at the same time divert the fluid output by the liquid pump to the first supply unit, the second supply unit and the input end of the fluid channel.

[0016] In some embodiments, in the constant temperature mode, the fluid control unit is further used to divert the fluid output by the liquid pump to the first supply unit and the input end of the fluid channel when the fluid stored in the first supply unit is lower than a first liquid level; or, when the fluid stored in the second supply unit is lower than a second liquid level, divert the fluid output by the liquid pump to the second supply unit and the input end of the fluid channel.

[0017] In some embodiments, in the constant temperature mode, the fluid control unit is further used to divert the fluid output by the liquid pump to the first supply unit and the input end of the fluid channel before switching to the cooling mode; or, before switching to the heating mode, to divert the fluid output by the liquid pump to the second supply unit and the input end of the fluid channel.

[0018] In some embodiments, the fluid control unit comprises:

[0019] a first temperature sensor, configured to detect the first temperature value in real time;

[0020] A first control unit is configured to enter the cooling mode when the absolute value of the difference between the first temperature value and the target temperature value is greater than or equal to a preset temperature threshold and the target temperature value is less than the first temperature value; or enter the heating mode when the absolute value is greater than or equal to the preset temperature threshold and the target temperature value is greater than the first temperature value; or enter the constant temperature mode when the absolute value is less than the preset temperature threshold.

[0021] In some embodiments, the fluid control unit further comprises:

[0022] a second temperature sensor, configured to detect in real time a second temperature value at an output end of the first supply unit;

[0023] a third temperature sensor, configured to detect in real time a third temperature value at an output end of the second supply unit;

[0024] a fourth temperature sensor, configured to detect in real time a fourth temperature value at an output end of the liquid pump;

[0025] The first control unit is also used to adjust the flow ratio of the first supply unit and the liquid pump to the fluid channel in real time in the cooling mode according to the first temperature value, the second temperature value, the third temperature value and the fourth temperature value, as well as the target temperature value; or, in the heating mode, to adjust the flow ratio of the second supply unit and the liquid pump to the fluid channel in real time; or, in the constant temperature mode, to adjust the flow ratio of the first supply unit, the second supply unit and the liquid pump to the fluid channel in real time.

[0026] In some embodiments, the fluid control unit further comprises:

[0027] A flow detection unit, configured to detect a flow value at an input end of the fluid channel in real time;

[0028] The second control unit is configured to control the pumping speed of the liquid pump when the detected flow value exceeds a preset flow range, until the detected flow value is within the preset flow range.

[0029] In some embodiments, the fluid control unit comprises:

[0030] a first supply flow path, one end of which is connected to the output end of the first supply unit and the other end of which is connected to the input end of the fluid channel; a first flow regulating valve and a first on-off valve are provided on the first supply flow path;

[0031] a second supply flow path, one end of which is connected to the output end of the second supply unit and the other end of which is connected to the input end of the fluid channel; a second flow regulating valve and a second on-off valve are provided on the second supply flow path;

[0032] a third supply flow path, one end of which is connected to the output end of the liquid pump and the other end of which is connected to the input end of the fluid channel; a third flow regulating valve is provided on the third supply flow path;

[0033] a first reflux flow path, one end of which is connected to the output end of the first supply unit and the other end of which is connected to the input end of the first supply unit; a fourth flow regulating valve is provided on the first reflux flow path;

[0034] a second return flow path, one end of which is connected to the output end of the second supply unit and the other end of which is connected to the input end of the second supply unit; a fifth flow regulating valve is provided on the second return flow path; and

[0035] A third reflux flow path, a first reflux branch and a second reflux branch, one end of the third reflux flow path is connected to the output end of the liquid pump, and the other end is respectively connected to one end of the first reflux branch and one end of the second reflux branch; a sixth flow regulating valve is provided on the third reflux flow path; the other end of the first reflux branch and the other end of the second reflux branch are respectively connected to the input end of the first supply unit and the input end of the second supply unit; a third on-off valve and a fourth on-off valve are respectively provided on the first reflux branch and the second reflux branch.

[0036] In some embodiments, the fluid control unit further includes a first liquid mixing unit, a second liquid mixing unit, and a third liquid mixing unit, wherein:

[0037] The first liquid mixing unit has an output end and three input ends, the output end of the first liquid mixing unit is connected to the input end of the fluid channel; the other end of the first supply flow path, the other end of the second supply flow path, and the other end of the third supply flow path are respectively connected to the three input ends of the first liquid mixing unit;

[0038] The other end of the first reflux branch is connected to the first reflux flow path downstream of the fourth flow regulating valve, and the second liquid mixing unit is provided on the first reflux flow path and is located at the connection between the first reflux flow path and the other end of the first reflux branch;

[0039] The other end of the second reflux branch is connected to the second reflux path downstream of the fifth flow regulating valve. The third liquid mixing unit is arranged on the second reflux path and is located at the connection between the second reflux path and the other end of the second reflux branch.

[0040] In some embodiments, a seventh regulating valve is provided on the first reflux flow path and located between the second liquid mixing part and the input end of the first supply unit; an eighth regulating valve is provided on the second reflux flow path and located between the third liquid mixing part and the input end of the second supply unit.

[0041] As another technical solution, the present application also provides a temperature control method, which is applied to the above-mentioned temperature control device provided in the present application, and the method includes:

[0042] delivering the fluid provided by the first supply unit, and / or the fluid provided by the second supply unit, and / or the fluid output by the liquid pump to the fluid channel, and detecting in real time a first temperature value of the fluid output to the input end of the fluid channel;

[0043] According to the first temperature value and the preset target temperature value, the flow ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel is adjusted in real time to make the first temperature value equal to the target temperature value.

[0044] In some embodiments, adjusting in real time the flow ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel based on the first temperature value and a preset target temperature value so that the first temperature value is equal to the target temperature value includes:

[0045] When the absolute value of the difference between the first temperature value and the target temperature value is greater than a preset temperature threshold, and the target temperature value is less than the first temperature value, a cooling mode is entered; in the cooling mode, the fluid provided by the first supply unit is diverted and delivered to the fluid channel and the first supply unit, and the fluid output by the liquid pump is diverted and delivered to the first supply unit and the input end of the fluid channel;

[0046] When the absolute value is greater than the preset temperature threshold and the target temperature value is greater than the first temperature value, a temperature rise mode is entered; in the temperature rise mode, the fluid provided by the second supply unit is split and delivered to the fluid channel and the second supply unit, and the fluid output by the liquid pump is split and delivered to the second supply unit and the input end of the fluid channel;

[0047] When the absolute value is less than or equal to the preset temperature threshold, the constant temperature mode is entered; in the constant temperature mode, the fluid provided by the first supply unit is diverted and transported to the fluid channel and the first supply unit, and the fluid provided by the second supply unit is diverted and transported to the fluid channel and the second supply unit, and the fluid output by the liquid pump is diverted and transported to the first supply unit, the second supply unit and the input end of the fluid channel.

[0048] In some embodiments, the method further comprises:

[0049] Real-time detection of a flow rate value at an input end of the fluid channel;

[0050] When the detected flow value exceeds a preset flow range, the pumping speed of the liquid pump is controlled until the detected flow value is within the preset flow range.

[0051] As another technical solution, the present application also provides a semiconductor process equipment, including a process chamber and a base arranged in the process chamber, the base is used to support a wafer, the base is provided with a fluid channel for controlling the temperature of the wafer, and also includes the above-mentioned temperature control device provided in the present application, which is used to control the fluid temperature in the fluid channel.

[0052] This application has the following beneficial effects:

[0053] In the technical solution of the temperature control device and method provided in the present application, the fluid provided by the first supply unit, and / or the fluid provided by the second supply unit, and / or the fluid output by the liquid pump are delivered to the fluid channel, and the first temperature value of the fluid output by the fluid control unit to the input end of the fluid channel is detected in real time, and the flow ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel is adjusted in real time according to the first temperature value and the preset target temperature value, so that the temperature of the fluid provided to the fluid channel of the controlled component can be controlled in real time. Since the present solution utilizes fluid to heat or cool the controlled component regardless of heating or cooling, compared with the devices in the prior art that utilize fluid cooling and heating elements for heating, there is no problem of the heat generated by the heating element during operation being carried away by the refrigerant, thereby improving both the heating rate and the cooling rate of the controlled component.

[0054] The semiconductor process equipment provided in the present application can improve both the heating rate and the cooling rate of the electrostatic chuck by adopting the above-mentioned temperature control device provided in the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] FIG1 is a schematic diagram of a temperature control device provided in an embodiment of the present application;

[0056] FIG2 is a schematic diagram of another temperature control device provided in an embodiment of the present application;

[0057] FIG3 is a schematic diagram of two closed-loop controls used in an embodiment of the present application;

[0058] FIG4 is a structural diagram of a temperature control device provided in an embodiment of the present application;

[0059] 5 is a graph showing the temperature at the output end of the first supply unit, the temperature at the output end of the second supply unit, and the temperature at the input end of the fluid channel;

[0060] FIG6A is a flow chart of a temperature control method provided in an embodiment of the present application;

[0061] FIG6B is a flow chart of specific steps of the temperature control method provided in an embodiment of the present application;

[0062] FIG7 is a flow chart of another temperature control method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] In order to enable those skilled in the art to better understand the technical solution of the present application, the temperature control device, method and semiconductor process equipment provided by the present application are described in detail below with reference to the accompanying drawings.

[0064] The temperature control device provided in the embodiment of the present application is applied to semiconductor process equipment, specifically for delivering a fluid such as a coolant or cooling water to a fluid channel in a controlled component of the semiconductor process equipment, and recovering the fluid flowing out of the fluid channel, thereby realizing the circulation of the fluid, and in the process of the fluid flow, controlling the temperature of the fluid flowing into the fluid channel to achieve heating, cooling and constant temperature of the fluid. The above-mentioned controlled component is, for example, a chuck for carrying a wafer, such as an electrostatic chuck, and the chuck is provided with the above-mentioned fluid channel. The fluid flowing in the fluid channel indirectly controls the temperature of the wafer by heat exchange with the chuck to meet the process requirements for the wafer temperature. Of course, in actual applications, the above-mentioned controlled component can also be other components in the semiconductor process equipment that need to be temperature controlled, and the embodiment of the present application has no special restrictions on this.

[0065] Specifically, referring to Figure 1, the temperature control device provided in the embodiment of the present application includes: a first supply unit 1, a second supply unit 2, a liquid pump 3 and a fluid control unit 4, wherein the first supply unit 1 is used to provide a fluid at a first temperature; the second supply unit 2 is used to provide a fluid at a second temperature; the first supply unit 1 and the second supply unit 2 are, for example, chillers, used to store fluids and are equipped with a pressure source (such as a compressor) capable of driving the flow of the fluid. The above-mentioned second temperature is greater than the first temperature, that is, the first supply unit 1 is used for cooling and the second supply unit 2 is used for heating, the first temperature is, for example, below 30°C, and the second temperature is, for example, above 80°C. The above-mentioned first temperature and second temperature are the temperatures of the fluids stored in the first supply unit 1 and the second supply unit 2, respectively.

[0066] The liquid pump 3 is connected to the output end of the fluid channel (not shown) in the controlled component 5 and is used to pump fluid from the fluid channel. The liquid pump 3 is used to provide a driving force for the circulation of the fluid in the fluid channel. In some embodiments, the speed of the liquid pump 3 is adjustable to adjust the pumping speed of the liquid pump 3, thereby adjusting the fluid flow rate at the input end of the fluid channel.

[0067] The fluid control unit 4 is connected to the first supply unit 1, the second supply unit 2, the liquid pump 3 and the input end of the fluid channel, and is used to deliver the fluid provided by the first supply unit 1, and / or the fluid provided by the second supply unit 2, and / or the fluid output by the liquid pump 3 to the fluid channel, and to detect in real time the first temperature value of the fluid output by the fluid control unit 4 to the input end of the fluid channel, and to adjust in real time the flow ratio of the first supply unit 1 and / or the second supply unit 2 and / or the liquid pump 3 delivered to the fluid channel based on the first temperature value and the preset target temperature value, so that the above-mentioned first temperature value is equal to the target temperature value.

[0068] By delivering the fluid provided by the first supply unit 1, and / or the fluid provided by the second supply unit 2, and / or the fluid output by the liquid pump 3 to the fluid channel, and detecting in real time the first temperature value of the fluid output by the fluid control unit 4 to the input end of the fluid channel, and adjusting in real time the flow ratio of the first supply unit 1 and / or the second supply unit 2 and / or the liquid pump 3 delivered to the fluid channel according to the first temperature value and the preset target temperature value, the temperature of the fluid provided to the fluid channel of the controlled component can be controlled in real time. Since this scheme uses fluid to heat or cool the controlled component regardless of heating or cooling, compared with the devices in the prior art that use fluid cooling and heating elements for heating, there is no problem of the heat generated by the heating element during operation being carried away by the refrigerant, thereby improving both the heating rate and the cooling rate of the controlled component.

[0069] In some embodiments, the fluid control unit 4 can switch between a cooling mode, a heating mode, and a constant temperature mode. In the cooling mode, the fluid control unit 4 is used to divert the fluid provided by the first supply unit 1 to the fluid channel and the first supply unit 1, and at the same time divert the fluid output by the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel. In other words, the fluid provided by the first supply unit 1 can be delivered entirely to the fluid channel, or can be returned entirely to the first supply unit 1, or a portion can be delivered to the fluid channel and the other portion can be returned to the first supply unit 1. The fluid output by the liquid pump 3 can be delivered entirely to the first supply unit 1, or can be delivered entirely to the input end of the fluid channel, or a portion can be delivered to the first supply unit 1 and the other portion can be delivered to the input end of the fluid channel.

[0070] In the heating mode, the fluid control unit 4 is used to divert the fluid provided by the second supply unit 2 to the fluid channel and the second supply unit 2, while diverting the fluid output by the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel. Similar to the cooling mode described above, in the heating mode, the fluid provided by the second supply unit 2 can be delivered entirely to the fluid channel, or returned entirely to the second supply unit 2, or partially delivered to the fluid channel and the remaining portion returned to the second supply unit 2. The fluid output by the liquid pump 3 can be delivered entirely to the second supply unit 2, or entirely to the input end of the fluid channel, or partially delivered to the second supply unit 2 and the remaining portion delivered to the input end of the fluid channel.

[0071] In constant temperature mode, the fluid control unit 4 is configured to split the fluid supplied by the first supply unit 1 and deliver it to the fluid channel and the first supply unit 1, while simultaneously splitting the fluid supplied by the second supply unit 2 and delivering it to the fluid channel and the second supply unit 2. Furthermore, the fluid output by the liquid pump 3 is configured to split the fluid supplied by the first supply unit 1, the second supply unit 2, and the input end of the fluid channel. In constant temperature mode, the fluid supplied by the first supply unit 1 can be delivered entirely to the fluid channel, or partially to the fluid channel, with the remaining portion returned to the first supply unit 1. The fluid supplied by the second supply unit 2 can be delivered entirely to the fluid channel, or partially to the fluid channel, with the remaining portion returned to the second supply unit 2. The fluid output by the liquid pump 3 can be delivered entirely to the first supply unit 1, entirely to the second supply unit 2, entirely to the input end of the fluid channel, partially to the first supply unit 1 and the remaining portion to the input end of the fluid channel, partially to the second supply unit 2 and the remaining portion to the input end of the fluid channel, or partially to the first supply unit 1, partially to the second supply unit 2, and the remaining portion to the input end of the fluid channel.

[0072] In some embodiments, in the cooling mode, the ratio of the fluid flow rate of the fluid provided by the first supply unit 1 delivered to the fluid channel to the fluid flow rate returned to the first supply unit 1 is a first flow rate ratio; the ratio of the fluid flow rate of the fluid output by the liquid pump 3 delivered to the first supply unit 1 to the fluid flow rate delivered to the input end of the fluid channel is a second flow rate ratio. In the heating mode, the ratio of the fluid flow rate of the fluid provided by the second supply unit 2 delivered to the fluid channel to the fluid flow rate returned to the second supply unit 2 is a third flow rate ratio; the ratio of the fluid flow rate of the fluid output by the liquid pump 3 delivered to the second supply unit 2 to the fluid flow rate delivered to the input end of the fluid channel is a fourth flow rate ratio. In the constant temperature mode, the ratio of the fluid flow rate of the fluid provided by the first supply unit 1 delivered to the fluid channel to the fluid flow rate returned to the first supply unit 1 is a fifth flow rate ratio; the ratio of the fluid flow rate of the fluid provided by the second supply unit 2 delivered to the fluid channel to the fluid flow rate returned to the second supply unit 2 is a sixth flow rate ratio; and the ratio of the fluid flow rates of the fluid output by the liquid pump 3 delivered to the first supply unit 1, the fluid flow rate delivered to the second supply unit 2, and the fluid flow rate delivered to the input end of the fluid channel is a seventh flow rate ratio.

[0073] The flow ratio corresponding to the current mode among the above-mentioned first to seventh flow ratios can be specifically calculated based on the temperature at the output end of the first supply unit 1, the temperature at the output end of the second supply unit 2, the temperature at the output end of the liquid pump 3, the temperature at the input end of the fluid channel and at least one of the target temperature values, using a corresponding closed-loop control algorithm (such as a PID control algorithm) to obtain the flow ratio corresponding to the current mode among the above-mentioned first to seventh flow ratios, and output it to the fluid control unit 4 so that it can divert the fluid provided by the first supply unit 1 and / or the second supply unit 2 and the fluid output by the liquid pump 3 according to the flow ratio, thereby realizing control of the fluid flow delivered to the fluid channel and the fluid flow returned to the first supply unit 1 and / or the second supply unit 2.

[0074] The temperature control device provided in the embodiment of the present application can control the temperature of the fluid provided to the fluid channel of the controlled component in real time by switching between the cooling mode, the heating mode and the constant temperature mode through the fluid control unit 4, so as to achieve heating, cooling and constant temperature of the fluid. Since the controlled component is heated or cooled by the fluid regardless of heating or cooling, compared with the devices in the prior art that use fluid cooling and heating elements for heating, there is no problem of the heat generated by the heating element during operation being carried away by the refrigerant, thereby improving both the heating rate and the cooling rate of the controlled component.

[0075] On this basis, in each of the cooling mode, the heating mode and the constant temperature mode, the fluid provided by the first supply unit 1 and / or the second supply unit 2 and the fluid output by the liquid pump 3 can be respectively diverted according to the corresponding flow ratio by the fluid control unit 4 to control the fluid flow delivered to the fluid channel and the fluid flow returned to the first supply unit 1 and / or the second supply unit 2. Compared with only controlling the fluid flow output by the first supply unit 1 and / or the second supply unit 2, not only can the flow at the output end of the first supply unit 1 and / or the second supply unit 2 and the output end of the liquid pump 3 change by controlling the return flow, but also the fluid flow at the output end of the first supply unit 1 and / or the second supply unit 2 can be diverted by the fluid control unit 4 according to the corresponding flow ratio. The fluid flow rate returned to the first supply unit 1 and / or the second supply unit 2 is controlled to ensure that the flow resistance at the output end of the first supply unit 1 and / or the second supply unit 2 and the output end of the liquid pump 3 remains constant, thereby avoiding the influence of pressure fluctuations on the control accuracy; moreover, the fluid flow rate returned to the first supply unit 1 and / or the second supply unit 2 can be controlled to ensure that the fluid level in the first supply unit 1 and / or the second supply unit 2 meets the requirements, avoid the risk of liquid shortage, and ensure stable operation of the equipment. In addition, the liquid reserve of the first supply unit 1 or the second supply unit 2 can be increased as needed to meet the requirements of continuous temperature control.

[0076] Since the structures of the supply circuits of the first supply unit 1, the second supply unit 2, the liquid pump 3, and the fluid channel, as well as the return circuits returning to the first supply unit 1 and the second supply unit 2, are not completely identical, the flow resistances in different circuits are also different. This will result in differences in flow rates in different flow paths under the condition that the driving pressure of the first supply unit 1 and the second supply unit 2 is the same, resulting in inconsistent fluid levels in the first supply unit 1 and the second supply unit 2 after a period of operation. In severe cases, the fluid level stored in one of the supply units may be insufficient to maintain normal operation of the device. To address this problem, in some embodiments, in the constant temperature mode, the fluid control unit 4 is further configured to divert the fluid output by the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel when the fluid stored in the first supply unit 1 is lower than a first liquid level; or to divert the fluid output by the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel when the fluid stored in the second supply unit 2 is lower than a second liquid level. That is to say, in the constant temperature mode, if the fluid level stored in the first supply unit 1 is too low, only at least a portion of the fluid output by the liquid pump 3 is delivered to the first supply unit 1, and not to the second supply unit 2, so as to increase the fluid flow delivered to the first supply unit 1. If the fluid level stored in the second supply unit 2 is too low, only at least a portion of the fluid output by the liquid pump 3 is delivered to the second supply unit 2, and not to the first supply unit 1, so as to increase the fluid flow delivered to the second supply unit 2, thereby compensating for the liquid level of the first supply unit 1 or the second supply unit 2 and maintaining the normal operation of the equipment.

[0077] Because the temperature of the fluids output from the first supply unit 1 and the second supply unit 2 changes after participating in heat exchange, for example, T0 is the temperature at the input end of the fluid channel; T1 is the temperature at the output end of the first supply unit 1; and T2 is the temperature at the output end of the second supply unit 2. The three curves corresponding to temperatures T0, T1, and T2 are shown in Figure 5. The temperature T0 at the input end of the fluid channel changes from 20°C to 50°C and then back to 20°C. During the temperature increase process (starting from the 20th second) when temperature T0 is adjusted to 50°C, the fluid stored in the second supply unit 2 is consumed. The output fluid cools down after flowing through the controlled object. This cool fluid, upon returning to the second supply unit 2, causes the temperature of the fluid stored in the second supply unit 2 to drop, causing temperature T2 to deviate from the second temperature (60°C in Figure 5), thus generating a downward fluctuation. During the cooling process (starting from the 60th second) in which the temperature T0 is adjusted to 20°C, the fluid stored in the first supply unit 1 will be consumed, and the output fluid will increase in temperature after flowing through the controlled object. The fluid with increased temperature will cause the temperature of the fluid stored in the first supply unit 1 to increase after returning to the first supply unit 1, causing the temperature T1 to deviate from the first temperature (the first temperature is 10°C in Figure 5), that is, an upward fluctuation will occur. FIG5 only illustrates a single heating and cooling process. If this process is repeated multiple times, the fluid reserves in the first supply unit 1 and the second supply unit 2, where the temperature remains unchanged, will be exhausted. At this point, the temperature T2 will deviate significantly from the second temperature, and the temperature T1 will deviate significantly from the first temperature, making it impossible to continue heating or cooling. Therefore, if it is necessary to delay the exhaustion of the fluid reserves where the temperature remains unchanged and increase the number of continuous temperature control (heating or cooling) cycles, it is necessary to increase the fluid reserves in the corresponding supply unit before continuous temperature control to reduce the temperature change rate of the fluid output by the supply unit. Although temperature deviations may still occur, increasing the fluid reserves can increase the number of continuous temperature control cycles and delay the occurrence of temperature fluctuations. Therefore, in order to increase the fluid reserves in the corresponding supply unit before continuous temperature control, in some embodiments, the fluid control unit 4 is further configured to, in the constant temperature mode, divert the fluid output from the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel before switching to the cooling mode; or, to divert the fluid output from the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel before switching to the heating mode. That is, before entering the cooling mode and performing continuous cooling, at least a portion of the fluid output by the liquid pump 3 can be delivered to the first supply unit 1 instead of the second supply unit 2, so as to increase the reserve amount of fluid delivered to the first supply unit 1. Similarly, before entering the heating mode and performing continuous heating, at least a portion of the fluid output by the liquid pump 3 can be delivered to the second supply unit 2 instead of the first supply unit 1, so as to increase the reserve amount of fluid delivered to the second supply unit 2.

[0078] In some embodiments, referring to FIG. 2 , the fluid control unit 4 includes a first temperature sensor 61 and a first control unit 8 , wherein the first temperature sensor 61 is configured to detect the first temperature value in real time; the first control unit 8 is configured to enter a cooling mode when the absolute value of the difference between the first temperature value and a preset target temperature value is greater than or equal to a preset temperature threshold, and the target temperature value is less than the first temperature value; or to enter a heating mode when the absolute value is greater than or equal to the preset temperature threshold, and the target temperature value is greater than the first temperature value; or to enter a constant temperature mode when the absolute value is less than the preset temperature threshold. Thus, the fluid control unit 4 can automatically switch between the cooling mode, the heating mode, and the constant temperature mode based on the first temperature value and the preset temperature threshold, thereby achieving automated control and improving temperature control accuracy.

[0079] Further, in some embodiments, please continue to refer to Figure 2, the fluid control unit 4 also includes: a second temperature sensor 62, a third temperature sensor 63 and a fourth temperature sensor 64, wherein the second temperature sensor 62 is used to detect the second temperature value at the output end of the first supply unit 1 in real time; the third temperature sensor 63 is used to detect the third temperature value at the output end of the second supply unit 2 in real time; and the fourth temperature sensor 64 is used to detect the fourth temperature value at the output end of the liquid pump 3 in real time. The first control unit 8 is also used to adjust the flow ratio of the first supply unit 1 and the liquid pump 3 delivered to the fluid channel in real time according to the first temperature value, the second temperature value, the third temperature value and the fourth temperature value, as well as the target temperature value in the cooling mode, that is, adjust the first flow ratio and the second flow ratio; or, in the heating mode, adjust the flow ratio of the second supply unit 2 and the liquid pump 3 delivered to the fluid channel in real time, that is, adjust the third flow ratio and the fourth flow ratio; or, in the constant temperature mode, adjust the flow ratio of the first supply unit 1, the second supply unit 2 and the liquid pump 3 delivered to the fluid channel in real time, that is, adjust the fifth flow ratio, the sixth flow ratio and the seventh flow ratio. In this way, after entering the corresponding mode, the first control unit 8 can use the corresponding closed-loop control algorithm (such as PID control algorithm) to calculate the flow ratio corresponding to the current mode based on the above-mentioned first temperature value, second temperature value, third temperature value and fourth temperature value, as well as the target temperature value, and adjust the flow ratio of the first supply unit 1 and / or the second supply unit 2 and / or the liquid pump 3 delivered to the fluid channel in real time so that the above-mentioned first temperature value is equal to the target temperature value, thereby realizing automatic control and improving the temperature control accuracy.

[0080] In some embodiments, please continue to refer to FIG2 . In order to ensure that the fluid flow in the fluid channel remains stable, the fluid control unit 4 also includes: a flow detection unit 7 and a second control unit 9, wherein the flow detection unit 7 is used to detect the detection flow value at the input end of the fluid channel in real time; the second control unit 9 is used to control the pumping speed of the liquid pump 3 when the detection flow value exceeds the preset flow range until the detection flow value is within the preset flow range. With the help of the flow detection unit 7 and the second control unit 9, the pumping speed of the liquid pump 3 can be calculated based on the detection flow value using a corresponding closed-loop control algorithm (such as a PID control algorithm), so that the detection flow value can be controlled within the preset flow range to ensure that the fluid flow in the fluid channel remains stable. Please refer to FIG3 . The above-mentioned second control unit 9 and the first control unit 8 can each independently implement two closed-loop controls, that is, the first control unit 8 can implement closed-loop control of temperature and flow; the second control unit can implement closed-loop control of the pumping speed and flow of the liquid pump 3.

[0081] In some embodiments, please refer to Figure 4, the fluid control unit 4 includes: a first supply flow path 41a, a second supply flow path 41b, a third supply flow path 41c, a first return flow path 42a, a second return flow path 42b, a third return flow path 42c, a first return branch 43a and a second return branch 43b, wherein one end of the first supply flow path 41a is connected to the output end of the first supply unit 1, and the other end is connected to the input end of the fluid channel; a first flow regulating valve 45a and a first on-off valve 44a are provided on the first supply flow path 41a; one end of the second supply flow path 41b is connected to the output end of the second supply unit 2, and the other end is connected to the input end of the fluid channel; a second flow regulating valve 45b and a second on-off valve 44b are provided on the second supply flow path 41b; one end of the third supply flow path 41c is connected to the output end of the liquid pump 3, and the other end is connected to the input end of the fluid channel; a third flow regulating valve 45c is provided on the third supply flow path 41c ; One end of the first return flow path 42a is connected to the output end of the first supply unit 1, and the other end is connected to the input end of the first supply unit 1; a fourth flow regulating valve 45d is provided on the first return flow path 42a; one end of the second return flow path 42b is connected to the output end of the second supply unit 2, and the other end is connected to the input end of the second supply unit 2; a fifth flow regulating valve 45e is provided on the second return flow path 42b; one end of the third return flow path 42c is connected to the output end of the liquid pump 3, and the other end is respectively connected to one end of the first return branch 43a and one end of the second return branch 43b; a sixth flow regulating valve 45f is provided on the third return flow path 42c; the other end of the first return branch 43a and the other end of the second return branch 43b are respectively connected to the input end of the first supply unit 1 and the input end of the second supply unit 2; a third on-off valve 44c and a fourth on-off valve 44d are respectively provided on the first return branch 43a and the second return branch 43b. The first to fourth on-off valves 44a to 44d may be, for example, stop valves, used to open or close their respective flow paths. When the flow paths are open, fluid can pass through the stop valves; when the flow paths are closed, the fluid is blocked by the stop valves. The first to sixth flow control valves 45a to 45f may be, for example, servo valves, which can adjust the valve opening size (i.e., opening degree) according to a control signal, thereby regulating the fluid flow in their respective flow paths.

[0082] When the first on-off valve 44a and the third on-off valve 44c are opened, and the second on-off valve 44b and the fourth on-off valve 44d are closed, the mode can be switched to the cooling mode, and in the cooling mode, the first flow rate ratio is adjusted by adjusting the first flow regulating valve 45a and the fourth flow regulating valve 45d, and the second flow rate ratio is adjusted by adjusting the third flow regulating valve 45c and the sixth flow regulating valve 45f; when the second on-off valve 44b and the fourth on-off valve 44d are opened, and the first on-off valve 44a and the third on-off valve 44c are closed, the mode can be switched to the heating mode, and in the heating mode, the second flow rate ratio is adjusted by adjusting the second flow regulating valve 45b and the fifth flow regulating valve The third flow ratio is adjusted by adjusting the throttle valve 45e, and the fourth flow ratio is adjusted by adjusting the third flow regulating valve 45c and the sixth flow regulating valve 45f. When the first on-off valve 44a, the third on-off valve 44c, the second on-off valve 44b and the fourth on-off valve 44d are opened, the constant temperature mode can be switched. In the constant temperature mode, the fifth flow ratio is adjusted by adjusting the first flow regulating valve 45a and the fourth flow regulating valve 45d, the sixth flow ratio is adjusted by adjusting the second flow regulating valve 45b and the fifth flow regulating valve 45e, and the seventh flow ratio is adjusted by adjusting the third flow regulating valve 45c and the sixth flow regulating valve 45f. In this way, switching between the cooling mode, the heating mode and the constant temperature mode can be achieved.

[0083] In the cooling mode, the fluid output by the first supply unit 1 flows not only through the first flow control valve 45a but also through the fourth flow control valve 45d. The fluid output by the liquid pump 3 flows not only through the third flow control valve 45c but also through the sixth flow control valve 45f. In this case, when the opening of the first flow control valve 45a changes, the flow resistance of the first supply flow path 41a (i.e., the ratio of the flow rate flowing through the valve port to the pressure difference across the valve) changes accordingly. At this time, the flow resistance of the first return flow path 42a can be adjusted by adjusting the opening of the fourth flow control valve 45d, so that it changes with the change in the flow resistance of the first supply flow path 41a, thereby compensating for the change in the flow resistance of the first return flow path 42a. This ensures that the flow resistance at the output end of the first supply unit 1 remains constant, thereby preventing the impact of pressure fluctuations on control accuracy. When the opening of third flow control valve 45c changes, the flow resistance of third supply flow path 41c changes accordingly. At this point, the flow resistance of third return flow path 42c can be adjusted by adjusting the opening of sixth flow control valve 45f, so that it changes with the change in the flow resistance of third supply flow path 41c, thereby compensating for the change in the flow resistance of third return flow path 42c. This ensures that the flow resistance at the output of liquid pump 3 remains constant, thereby preventing pressure fluctuations from affecting control accuracy. In cooling mode, since second on-off valve 44b and fourth on-off valve 44d are closed, the fluid output from second supply unit 2 returns to the second supply unit 2 through second return flow path 42b.

[0084] Similar to the cooling mode, in the heating mode, when the opening of the second flow control valve 45b changes, the flow resistance of the second return flow path 42b can be adjusted by adjusting the opening of the fifth flow control valve 45e, so that it changes with the change in the flow resistance of the second supply flow path 41b, thereby compensating for the change in the flow resistance of the second return flow path 42b. The purpose is to ensure that the flow resistance at the output end of the second supply unit 2 remains constant, thereby preventing the impact of pressure fluctuations on control accuracy. In the heating mode, because the first on-off valve 44a and the third on-off valve 44c are closed, the fluid output from the first supply unit 1 will return to the first supply unit 1 through the first return flow path 42a.

[0085] In some embodiments, in order to avoid the problem that the fluid levels stored in the first supply unit 1 and the second supply unit 2 are inconsistent after running for a period of time, which in severe cases may cause the fluid level stored in one of the supply units to be insufficient to maintain the normal operation of the equipment, in the constant temperature mode, when the fluid stored in the first supply unit 1 is lower than the first liquid level, the fourth on-off valve 44d is closed, and the third flow regulating valve 45c and the sixth flow regulating valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel; when the fluid stored in the second supply unit 2 is lower than the second liquid level, the third on-off valve 44c is closed, and the third flow regulating valve 45c and the sixth flow regulating valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel. That is to say, in the constant temperature mode, if the fluid level stored in the first supply unit 1 is too low (lower than the first liquid level), the fourth on-off valve 44d is closed, so that at least a portion of the fluid output by the liquid pump 3 is delivered to the first supply unit 1 instead of to the second supply unit 2, so as to increase the fluid flow rate delivered to the first supply unit 1; if the fluid level stored in the second supply unit 2 is too low (lower than the second liquid level), the third on-off valve 44c is closed, and only at least a portion of the fluid output by the liquid pump 3 is delivered to the second supply unit 2 instead of to the first supply unit 1, so as to increase the fluid flow rate delivered to the second supply unit 2, thereby compensating for the liquid level of the first supply unit 1 or the second supply unit 2 and maintaining the normal operation of the equipment.

[0086] In some embodiments, in order to increase the fluid reserve of the corresponding supply unit before continuous temperature control (heating or cooling) to ensure that it is sufficient to achieve continuous temperature increase or cooling control, in the constant temperature mode, before switching to the cooling mode, the fourth on-off valve 44d is closed, and the third flow control valve 45c and the sixth flow control valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel; before switching to the heating mode, the third on-off valve 44c is closed, and the third flow control valve 45c and the sixth flow control valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel. In other words, before entering the cooling mode and performing continuous temperature reduction, the fourth on-off valve 44d can be closed to divert at least a portion of the fluid output by the liquid pump 3 to the first supply unit 1 instead of the second supply unit 2, thereby increasing the fluid reserve delivered to the first supply unit 1. Similarly, before entering the heating mode and performing continuous heating, the third on-off valve 44c can be closed to deliver at least a portion of the fluid output by the liquid pump 3 to the second supply unit 2 instead of to the first supply unit 1, so as to increase the fluid reserve delivered to the second supply unit 2.

[0087] In some embodiments, the fluid control unit 4 further includes: a first liquid mixing unit 46a, a second liquid mixing unit 46b and a third liquid mixing unit 46c, wherein the first liquid mixing unit 46a has an output end and three input ends, and the output end of the first liquid mixing unit 46a is connected to the input end of the fluid channel; the other end of the first supply flow path 41a, the other end of the second supply flow path 41b and the other end of the third supply flow path 41c are respectively connected to the three input ends of the first liquid mixing unit 46a; the first liquid mixing unit 46a is used to fully mix the fluid from at least one of the first supply flow path 41a, the second supply flow path 41b and the third supply flow path 41c, store it, and output it to the fluid channel.

[0088] In some embodiments, the other end of the first return flow path 42a is connected to the input of the first supply unit 1, and the other end of the first return flow branch 43a is connected to the first return flow path 42a downstream of the fourth flow control valve 45d. A second liquid mixing unit 46b is provided on the first return flow path 42a at the connection between the first return flow path 42a and the other end of the first return flow branch 43a. The second liquid mixing unit 46b is used to fully mix the fluid from at least one of the first return flow path 42a and the first return flow branch 43a, store the mixed fluid, and output it to the first supply unit 1. The other end of the second return flow path 42b is connected to the input of the second supply unit 2, and the other end of the second return flow branch 43b is connected to the second return flow path 42b downstream of the fifth flow control valve 45e. A third liquid mixing unit 46c is provided on the second return flow path 42b at the connection between the second return flow path 42b and the other end of the second return flow branch 43b. The third liquid mixing section 46c is used to fully mix the fluid from at least one of the second return flow path 42b and the second return branch 43b, store the mixed fluid, and output the mixed fluid to the second supply unit 2. The first liquid mixing section 46a, the second liquid mixing section 46b, and the third liquid mixing section 46c may include, for example, cavities or pipes.

[0089] In some embodiments, a seventh regulating valve 47a is provided on the first return flow path 42a, between the second liquid mixing section 46b and the input end of the first supply unit 1; an eighth regulating valve 47b is provided on the second return flow path 42b, between the third liquid mixing section 46c and the input end of the second supply unit 2. The seventh regulating valve 47a and the eighth regulating valve 47b are used to regulate the flow rate of fluid returning to the first supply unit 1 and the second supply unit 2, respectively. The seventh regulating valve 47a and the eighth regulating valve 47b are, for example, manual regulating valves.

[0090] As another technical solution, referring to FIG. 6A , an embodiment of the present application further provides a temperature control method, which is applied to the temperature control device provided in the embodiment of the present application. The method includes:

[0091] S1. delivering the fluid provided by the first supply unit 1, and / or the fluid provided by the second supply unit 2, and / or the fluid output by the liquid pump 3 to the fluid channel, and detecting in real time a first temperature value of the fluid output to the input end of the fluid channel;

[0092] S2. According to the above-mentioned first temperature value and the preset target temperature value, the flow ratio of the first supply unit 1 and / or the second supply unit 2 and / or the liquid pump 3 delivered to the fluid channel is adjusted in real time to make the first temperature value equal to the target temperature value.

[0093] In some embodiments, as shown in FIG6B and FIG7 , the above step S2 specifically includes:

[0094] S21. When the absolute value of the difference between the first temperature value T0 and the preset target temperature value Tsp is greater than or equal to the preset temperature threshold value Tm, and the target temperature value Tsp is less than the first temperature value T0, entering the cooling mode; in the cooling mode, the fluid provided by the first supply unit 1 is diverted and delivered to the fluid channel and the first supply unit 1, and the fluid output by the liquid pump 3 is diverted and delivered to the first supply unit 1 and the input end of the fluid channel;

[0095] S22. When the absolute value is greater than or equal to the preset temperature threshold Tm and the target temperature value Tsp is greater than the first temperature value T0, the temperature rise mode is entered. In the temperature rise mode, the fluid provided by the second supply unit 2 is diverted and delivered to the fluid channel and the second supply unit 2, and the fluid output by the liquid pump 3 is diverted and delivered to the second supply unit 2 and the input end of the fluid channel.

[0096] S23. When the absolute value is less than the preset temperature threshold Tm, the constant temperature mode is entered; in the constant temperature mode, the fluid provided by the first supply unit 1 is diverted and transported to the fluid channel and the first supply unit 1, and the fluid provided by the second supply unit 2 is diverted and transported to the fluid channel and the second supply unit 2, and the fluid output by the liquid pump 3 is diverted and transported to the first supply unit 1, the second supply unit 2 and the input end of the fluid channel.

[0097] In some embodiments, the above temperature control method is applied to the temperature control device shown in FIG4 . On this basis, the method includes:

[0098] Open the first on-off valve 44a and the third on-off valve 44c, and close the second on-off valve 44b and the fourth on-off valve 44d to switch to the cooling mode. In the cooling mode, the first flow ratio is adjusted by adjusting the first flow regulating valve 45a and the fourth flow regulating valve 45d, and the second flow ratio is adjusted by adjusting the third flow regulating valve 45c and the sixth flow regulating valve 45f. The first flow ratio is the ratio of the flow rate of the fluid provided by the first supply unit 1 delivered to the fluid channel to the flow rate delivered to the first supply unit 1 in the cooling mode. The second flow ratio is the ratio of the flow rate of the fluid output by the liquid pump 3 delivered to the first supply unit 1 to the flow rate delivered to the input end of the fluid channel in the cooling mode.

[0099] The second on-off valve 44b and the fourth on-off valve 44d are opened, and the first on-off valve 44a and the third on-off valve 44c are closed to switch to the heating mode. In the heating mode, the third flow ratio is adjusted by adjusting the second flow regulating valve 45b and the fifth flow regulating valve 45e, and the fourth flow ratio is adjusted by adjusting the third flow regulating valve 45c and the sixth flow regulating valve 45f. The third flow ratio is the ratio of the flow rate of the fluid provided by the second supply unit 2 delivered to the fluid channel to the flow rate delivered to the second supply unit 2 in the heating mode. The fourth flow ratio is the ratio of the flow rate of the fluid output by the liquid pump 3 delivered to the second supply unit 2 to the flow rate delivered to the input end of the fluid channel in the heating mode.

[0100] Open the first on-off valve 44a, the third on-off valve 44c, the second on-off valve 44b and the fourth on-off valve 44d to switch to the heating mode, and in the constant temperature mode, adjust the fifth flow ratio by adjusting the first flow regulating valve 45a and the fourth flow regulating valve 45d, adjust the sixth flow ratio by adjusting the second flow regulating valve 45b and the fifth flow regulating valve 45e, and adjust the seventh flow ratio by adjusting the third flow regulating valve 45c and the sixth flow regulating valve 45f; the fifth flow ratio is the ratio of the flow rate of the fluid provided by the first supply unit 1 delivered to the fluid channel to the flow rate delivered to the first supply unit 1 in the constant temperature mode; the sixth flow ratio is the ratio of the flow rate of the fluid provided by the second supply unit 2 delivered to the fluid channel to the flow rate delivered to the second supply unit 2 in the constant temperature mode; the seventh flow ratio is the ratio of the flow rate of the fluid output by the liquid pump 3 delivered to the first supply unit 1, the flow rate of the second supply unit 2 and the flow rate delivered to the input end of the fluid channel in the constant temperature mode.

[0101] In some embodiments, referring to FIG. 7 , in the constant temperature mode, the method further includes:

[0102] When the fluid stored in the first supply unit 1 is lower than the first liquid level, the fourth on-off valve 44d is closed, and the third flow regulating valve 45c and the sixth flow regulating valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel;

[0103] When the fluid stored in the second supply unit 2 is lower than the second liquid level, the third on-off valve 44c is closed, and the third flow regulating valve 45c and the sixth flow regulating valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel.

[0104] In some embodiments, referring to FIG. 7 , in the constant temperature mode, the method further includes:

[0105] Before switching to the cooling mode, the liquid level needs to be adjusted, that is, the fourth on-off valve 44d is closed, and the third flow regulating valve 45c and the sixth flow regulating valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the first supply unit 1 and the input end of the fluid channel;

[0106] Before switching to the heating mode, the liquid level needs to be adjusted, that is, the third on-off valve 44c is closed, and the third flow regulating valve 45c and the sixth flow regulating valve 45f are adjusted to divert the fluid output by the liquid pump 3 to the second supply unit 2 and the input end of the fluid channel.

[0107] In some embodiments, the method further comprises:

[0108] Real-time detection of the flow rate value at the input end of the fluid channel;

[0109] When the detected flow rate value exceeds the preset flow rate range, the pumping speed of the liquid pump 3 is controlled until the detected flow rate value is within the preset flow rate range.

[0110] Specifically, when the detected flow value exceeds the preset flow range, for example, in the cooling mode, if the detected flow value is lower than the preset flow range, the pumping speed of the liquid pump 3 can be increased. At this time, the pressure difference between the input end and the output end of the liquid pump 3 increases, and the pressure at the input end of the third supply flow path 41c will increase accordingly. Since the response time of the liquid pressure change is shorter than the response time of the third flow control valve 45c, it can be considered that the third flow control valve 45c has not responded yet and its flow coefficient remains unchanged, which makes the fluid flow rate Q in the third supply flow path 41c C As the pressure increases, the flow rate Q of the fluid output from the first supply flow path 41a to the first liquid mixing unit 46a increases. A Since the fluid pressure output by the first supply unit 1 is constant and the opening of the first flow regulating valve 45a is constant, the flow rate Q at the input end of the fluid channel remains unchanged. G =Q A +QC It can be seen that Q G Will follow Q C As the pressure increases, the detected flow rate value can be controlled within a preset flow rate range to ensure that the fluid flow in the fluid channel remains stable.

[0111] As for the method embodiment, since it is basically similar to the device embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the device embodiment.

[0112] As another technical solution, an embodiment of the present application also provides a semiconductor process equipment, including a process chamber and a base arranged in the process chamber, the base is used to support a wafer, a fluid channel for controlling the temperature of the wafer is provided in the base, and also includes the above-mentioned temperature control device provided in the embodiment of the present application, which is used to control the fluid temperature in the fluid channel.

[0113] The semiconductor process equipment provided in the embodiment of the present application can improve both the heating rate and the cooling rate of the electrostatic chuck by adopting the above-mentioned temperature control device provided in the embodiment of the present application.

[0114] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A temperature control device, applied to semiconductor process equipment, characterized in that: include: A first supply unit, configured to provide a fluid at a first temperature; a second supply unit, configured to provide a fluid at a second temperature; The second temperature is greater than the first temperature; A liquid pump connected to an output end of a fluid channel in a controlled component of the semiconductor process equipment, and used to extract the fluid in the fluid channel; as well as A fluid control unit is connected to the first supply unit, the second supply unit, the liquid pump and the input end of the fluid channel, and is used to deliver the fluid provided by the first supply unit, and / or the fluid provided by the second supply unit, and / or the fluid output by the liquid pump to the fluid channel, and to detect in real time a first temperature value of the fluid output by the fluid control unit to the input end of the fluid channel, and to adjust in real time, based on the first temperature value and a preset target temperature value, the flow ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel so that the first temperature value is equal to the target temperature value.

2. The temperature control device according to claim 1, characterized in that: The fluid control unit can switch between a temperature reduction mode, a temperature increase mode and a constant temperature mode; In the cooling mode, the fluid control unit is used to transfer the fluid provided by the first supply unit to the fluid channel and the first supply unit, and transfer the fluid output by the liquid pump to the first supply unit and the input end of the fluid channel; In the heating mode, the fluid control unit is used to transfer the fluid provided by the second supply unit to the fluid channel and the second supply unit, and transfer the fluid output by the liquid pump to the second supply unit and the input end of the fluid channel; In the constant temperature mode, the fluid control unit is used to transfer the fluid provided by the first supply unit to the fluid channel and the first supply unit, and to transfer the fluid provided by the second supply unit to the fluid channel and the second supply unit. The fluid output by the pump is divided and delivered to the first supply unit, the second supply unit and the input end of the fluid channel.

3. The temperature control device according to claim 2, characterized in that: In the constant temperature mode, the fluid control unit is also used to divert the fluid output by the liquid pump to the first supply unit and the input end of the fluid channel when the fluid stored in the first supply unit is lower than a first liquid level; or, when the fluid stored in the second supply unit is lower than a second liquid level, divert the fluid output by the liquid pump to the second supply unit and the input end of the fluid channel.

4. The temperature control device according to claim 2, characterized in that: In the constant temperature mode, the fluid control unit is also used to divert the fluid output by the liquid pump to the first supply unit and the input end of the fluid channel before switching to the cooling mode; or, before switching to the heating mode, divert the fluid output by the liquid pump to the second supply unit and the input end of the fluid channel.

5. The temperature control device according to claim 2, characterized in that: The fluid control unit comprises: A first temperature sensor, used for detecting the first temperature value in real time; A first control unit is used to enter the cooling mode when the absolute value of the difference between the first temperature value and the target temperature value is greater than or equal to a preset temperature threshold, and the target temperature value is less than the first temperature value; or to enter the heating mode when the absolute value is greater than or equal to the preset temperature threshold, and the target temperature value is greater than the first temperature value; or to enter the constant temperature mode when the absolute value is less than the preset temperature threshold.

6. The temperature control device according to claim 5, characterized in that: The fluid control unit also includes: a second temperature sensor, used for detecting a second temperature value at an output end of the first supply unit in real time; a third temperature sensor, used for detecting a third temperature value at an output end of the second supply unit in real time; a fourth temperature sensor, used for detecting a fourth temperature value at the output end of the liquid pump in real time; The first control unit is also used to adjust in real time the flow ratio of the first supply unit and the liquid pump to the fluid channel in the cooling mode according to the first temperature value, the second temperature value, the third temperature value and the fourth temperature value, and the target temperature value; or, in real time, adjust in real time the flow ratio of the second supply unit and the liquid pump to the fluid channel in the heating mode; or, in real time, adjust in real time the flow ratio of the first supply unit, the second supply unit and the liquid pump to the fluid channel in the constant temperature mode.

7. The temperature control device according to any one of claims 1 to 6, characterized in that: The fluid control unit also includes: A flow detection unit, used for detecting a flow value at an input end of the fluid channel in real time; The second control unit is used to control the pumping speed of the liquid pump when the detected flow value exceeds the preset flow range, until the detected flow value is within the preset flow range.

8. The temperature control device according to any one of claims 1 to 6, characterized in that: The fluid control unit comprises: a first supply flow path, one end of which is connected to the output end of the first supply unit, and the other end of which is connected to the input end of the fluid channel; a first flow regulating valve and a first on-off valve are arranged on the first supply flow path; a second supply flow path, one end of which is connected to the output end of the second supply unit and the other end of which is connected to the input end of the fluid channel; a second flow regulating valve and a second on-off valve are arranged on the second supply flow path; a third supply flow path, one end of which is connected to the output end of the liquid pump and the other end of which is connected to the input end of the fluid channel; a third flow regulating valve is provided on the third supply flow path; a first reflux flow path, one end of which is connected to the output end of the first supply unit, and the other end of which is connected to the input end of the first supply unit; a fourth flow regulating valve is arranged on the first reflux flow path; a second return flow path, one end of which is connected to the output end of the second supply unit, and the other end of which is connected to the input end of the second supply unit; a fifth flow regulating valve is provided on the second return flow path; and A third reflux flow path, a first reflux branch and a second reflux branch, one end of the third reflux flow path is connected to the output end of the liquid pump, and the other end is respectively connected to one end of the first reflux branch and one end of the second reflux branch; a sixth flow regulating valve is arranged on the third reflux flow path; the other end of the first reflux branch and the other end of the second reflux branch are respectively connected to the input end of the first supply unit and the input end of the second supply unit; a third on-off valve and a fourth on-off valve are respectively arranged on the first reflux branch and the second reflux branch.

9. The temperature control device according to claim 8, characterized in that: The fluid control unit further includes a first liquid mixing unit, a second liquid mixing unit and a third liquid mixing unit, wherein: The first liquid mixing unit has an output end and three input ends, the output end of the first liquid mixing unit is connected to the input end of the fluid channel; the other end of the first supply flow path, the other end of the second supply flow path and the other end of the third supply flow path are respectively connected to the three input ends of the first liquid mixing unit; The other end of the first reflux branch is connected to the first reflux flow path at a location downstream of the fourth flow regulating valve, and the second liquid mixing unit is disposed on the first reflux flow path and is located at a location where the first reflux flow path and the other end of the first reflux branch are connected; The other end of the second reflux branch is connected to the second reflux flow path at the downstream of the fifth flow regulating valve, and the third liquid mixing unit is arranged on the second reflux flow path and is located at the The connection between the second return flow path and the other end of the second return branch.

10. The temperature control device according to claim 9, characterized in that: A seventh regulating valve is provided on the first reflux flow path and between the second liquid mixing part and the input end of the first supply unit; an eighth regulating valve is provided on the second reflux flow path and between the third liquid mixing part and the input end of the second supply unit.

11. A temperature control method, characterized in that: Applicable to the temperature control device according to any one of claims 1 to 10, the method comprising: Delivering the fluid provided by the first supply unit, and / or the fluid provided by the second supply unit, and / or the fluid output by the liquid pump to the fluid channel, and detecting in real time a first temperature value of the fluid output to the input end of the fluid channel; According to the first temperature value and the preset target temperature value, the flow ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel is adjusted in real time to make the first temperature value equal to the target temperature value.

12. The temperature control method according to claim 11, characterized in that: The method of adjusting the flow rate ratio of the first supply unit and / or the second supply unit and / or the liquid pump delivered to the fluid channel in real time according to the first temperature value and the preset target temperature value so that the first temperature value is equal to the target temperature value includes: When the absolute value of the difference between the first temperature value and the target temperature value is greater than a preset temperature threshold, and the target temperature value is less than the first temperature value, a cooling mode is entered; in the cooling mode, the fluid provided by the first supply unit is diverted and transported to the fluid channel and the first supply unit, and the fluid output by the liquid pump is diverted and transported to the first supply unit and the input end of the fluid channel; When the absolute value is greater than the preset temperature threshold and the target temperature value is greater than the first temperature value, the temperature rise mode is entered; in the temperature rise mode, the temperature provided by the second supply unit is The fluid is diverted and delivered to the fluid channel and the second supply unit, and the fluid output by the liquid pump is diverted and delivered to the second supply unit and the input end of the fluid channel; When the absolute value is less than or equal to the preset temperature threshold, the constant temperature mode is entered; in the constant temperature mode, the fluid provided by the first supply unit is diverted and transported to the fluid channel and the first supply unit, and the fluid provided by the second supply unit is diverted and transported to the fluid channel and the second supply unit, and the fluid output by the liquid pump is diverted and transported to the first supply unit, the second supply unit and the input end of the fluid channel.

13. The temperature control method according to claim 11, characterized in that: The method further comprises: Real-time detection of a flow rate value at an input end of the fluid channel; When the detected flow value exceeds a preset flow range, the pumping speed of the liquid pump is controlled until the detected flow value is within the preset flow range.

14. A semiconductor process equipment, comprising a process chamber and a susceptor disposed in the process chamber, wherein the susceptor is used to carry a wafer, and a fluid channel for controlling the temperature of the wafer is disposed in the susceptor, wherein: It also comprises the temperature control device according to any one of claims 1 to 10, which is used to control the temperature of the fluid in the fluid channel.

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