Cooling structure, power unit, energy storage system, and electric device

Abstract

The present application discloses a cooling structure (10), a power unit (100), an energy storage system (1000), and an electric device. The cooling structure (10) is applied to the power unit (100); the power unit (100) comprises power modules (1001) oppositely arranged on two sides of the cooling structure (10), and cooling requirements of the power modules (1001) on the two sides of the cooling structure (10) are different; the cooling structure (10) comprises a main plate (11); the main plate (11) comprises two side surfaces opposite to each other; the two side surfaces are each provided with a flow channel; the main plate (11) is provided with a connection portion (116) passing through the main plate (11); the flow channels on the two side surfaces are communicated by means of the connection portion (116). According to the cooling structure provided by the present technical solution, a liquid medium flows on the two sides by means of the connection portion, and uses the remaining cooling efficiency on one side to cool the device on the other side, so that the cooling functions provided by the two sides are more adapted to the actual cooling requirements of the devices on the two sides; thus, the cooling effect is improved, and the cooling efficiency of the liquid medium is fully utilized.

Description

A cooling structure, power unit, energy storage system and power device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 14, 2023, with application number 202311021651.4 and invention name “A cooling structure, power unit, energy storage system and electrical device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of liquid cooling technology, and more specifically, to a cooling structure, a power unit, an energy storage system, and an electrical device. Background Art

[0003] The cold plate cools the device to be cooled from two opposite sides.

[0004] The cooling liquid flow distribution on both sides of the cold plate is consistent, and the cooling effect tends to be uniform. However, existing cold plates are unable to meet the inconsistent heat flux density distribution of devices on opposite sides. In other words, the cooling effect provided by existing cold plates on both sides is difficult to adapt to the actual cooling needs of the devices on both sides, resulting in poor cooling effect.

[0005] Summary of the Invention

[0006] The purpose of the embodiments of the present application is to provide a cooling structure, a power unit, an energy storage system and an electrical device, including but not limited to solving the problem that the cooling effect provided on both sides of the existing cold plate is difficult to adapt to the actual cooling needs of the devices on both sides, resulting in poor cooling effect.

[0007] The technical solution adopted in the embodiment of this application is:

[0008] In a first aspect, a cooling structure is provided, which is applied to a power unit. The power unit includes power modules relatively arranged on both sides of the cooling structure, and the cooling requirements of the power modules on both sides of the cooling structure are different. The cooling structure includes a main board, and the main board includes two relatively arranged side surfaces, and the two side surfaces are respectively provided with flow channels, and the flow channels on the two side surfaces are connected to form a fluid path.

[0009] The cooling structure provided by the present technical solution has a liquid medium flowing on both sides through the connecting part, and the remaining cooling efficiency on one side is used to cool the devices on the other side, so that the cooling effect provided by the two sides is more adapted to the actual cooling requirements of the devices on both sides, thereby improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0010] In some embodiments, the main board is provided with a connecting portion penetrating the main board, and the flow channels on the two side surfaces are connected through the connecting portion.

[0011] The flow channels on the two sides are connected by the connecting portion penetrating the main board, thereby improving the convenience of the fluid path.

[0012] In some embodiments, on one of the fluid paths, the difference between the sum of the number of the flow channels on the two side surfaces and the number of the connecting portions is equal to one.

[0013] The difference between the sum of the number of flow channels on the two side surfaces and the number of connecting parts is equal to one, so that the two side surfaces can be connected in series one-to-one or one-to-many through the connecting parts. The liquid medium flows between the two side surfaces to complete heat exchange, which has a better cooling effect on the devices on both sides and makes more full use of the cooling efficiency of the liquid medium.

[0014] In some embodiments, the main board is provided with at least two fluid paths connected in parallel.

[0015] The liquid medium is allowed to flow between the two sides through multiple fluid paths, thereby further improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0016] In some embodiments, the flow channels on the two side surfaces are connected in series one to one.

[0017] The liquid medium first flows in the flow channel on one side, cools the device on that side, and then enters the flow channel on the other side through the connecting part to cool the device on the other side. The series connection realizes the sequence of flow, improves the cooling effect, and fully utilizes the cooling efficiency of the liquid medium.

[0018] In some embodiments, the flow channel includes a third flow channel provided on one side of the main board and a fourth flow channel provided on the other side of the main board, and the number of at least one of the third flow channel and the fourth flow channel is multiple; on one of the fluid paths, the third flow channel and the fourth flow channel are alternately connected in series.

[0019] The third flow channel and the fourth flow channel are alternately connected in series, and the liquid medium flows alternately on the two sides, which has a better cooling effect on the devices on both sides and a more uniform cooling effect of the cooling structure.

[0020] In some embodiments, on one fluid path, the number of the third flow channels is two, and the number of the fourth flow channel is one.

[0021] The liquid medium enters the fourth flow channel from the third flow channel through the connecting flow channel, flows through the third flow channel and then enters the fourth flow channel through the connecting flow channel, that is, it flows from one side through the other side and then back to one side, simplifying the flow channel structure and improving the cooling effect.

[0022] In some embodiments, the flow channel on at least one side of the main board is spirally arranged.

[0023] The flow channel is spirally arranged to make the flow of the liquid medium smoother, thereby reducing the flow resistance and facilitating the layout of the flow channel in the center of the mainboard.

[0024] In some embodiments, the two side surfaces are respectively provided with a first flow channel and a second flow channel, the first flow channel and the second flow channel are both spirally arranged, and the inner end of the first flow channel is connected to the inner end of the second flow channel.

[0025] The first flow channel and the second flow channel on both sides are spirally arranged, and the flow smoothness of the liquid medium on the entire path is better. The inner ends of the flow channels on the two sides are connected, that is, they are connected in the central area of ​​the area where the flow channels are located, which is beneficial to improving the cooling effect of the components to be cooled corresponding to the central area.

[0026] In some embodiments, a first flow channel and a second flow channel are respectively provided on each side of the main board, and the first flow channel and the second flow channel on the same side are spirally arranged in parallel.

[0027] The first flow channel and the second flow channel on the same side are mutually embedded in each other through parallel spirals, which can perform high-density cooling on the component to be cooled, thereby improving the cooling effect.

[0028] In some embodiments, the flow channel includes two third flow channels provided on one side of the main board and one fourth flow channel provided on the other side of the main board, and the third flow channels and the fourth flow channels are alternately connected in series;

[0029] The two third flow channels are arranged in parallel in a spiral manner, and the fourth flow channel is arranged in a spiral manner. The fourth flow channel is arranged on the inner side of the two third flow channels, and the inner ends of the two third flow channels are respectively connected to the two outer ends of the fourth flow channel.

[0030] The two first flow channels are mutually embedded in parallel spirals, and the second flow channel is spirally arranged, which can perform high-density cooling on the cooling component, improve the cooling effect, and facilitate the layout of the second flow channel with the center of the first flow channel.

[0031] In some embodiments, the fourth flow channel includes two sub-flow channels arranged in parallel spirally, the inner ends of the two sub-flow channels are connected, and the outer ends of the two sub-flow channels are connected to the inner ends of the two third flow channels respectively.

[0032] The two sub-flow channels are interlocked by parallel spirals, which can perform high-density cooling on the component to be cooled and improve the cooling effect.

[0033] In some embodiments, the flow channel includes two sections, which are arranged in parallel to form parallel flow channel sections; at least two parallel flow channel sections are provided on one side of the main board, and in different parallel flow channel sections, the spacing between adjacent flow channel walls on the two sections is different.

[0034] Due to the varying distribution densities and cooling requirements of components to be cooled, the spacing between adjacent flow channel walls in different parallel flow channel sections is set differently, resulting in designs with varying densities to accommodate the varying distribution densities and cooling requirements of the components to be cooled. For example, if the distribution density of components to be cooled is high or the cooling requirement is high, the spacing between adjacent flow channel walls will be designed to be smaller; if the distribution density of components to be cooled is low or the cooling requirement is low, the spacing between adjacent flow channel walls will be designed to be larger.

[0035] In some embodiments, the location where the flow channels on the two side surfaces are connected is located in the middle area of ​​the main board; the distance between adjacent flow channel walls on two sections in the parallel flow channel section close to the middle area is smaller than the distance between adjacent flow channel walls on two sections in the parallel flow channel section away from the middle area.

[0036] The components to be cooled corresponding to the middle area of ​​the mainboard have a high density or high cooling demand, while the components to be cooled corresponding to the outer area of ​​the mainboard have a low density or low cooling demand. This makes the flow channel design of the middle area and the outer area more adapted to the distribution density or cooling demand of the corresponding components to be cooled, thereby further improving the cooling efficiency and making full use of the cooling performance of the liquid medium.

[0037] In some embodiments, the flow channel is spirally arranged, and along the spiral direction of the flow channel from the outside to the inside, the distance between adjacent flow channel walls on the two sections gradually decreases.

[0038] The spacing between the flow channel walls gradually decreases, the tightness of the flow channel gradually increases, the cooling effect gradually increases, and the cooling effect shows a gradual trend, making it more adaptable to the gradually changing cooling requirements of the components to be cooled.

[0039] In some embodiments, the two sections are separated by a main rib, and the two adjacent flow channel walls are respectively arranged on both sides of the main rib.

[0040] Flow channels are formed between adjacent main fins, and the main fins are used to transfer heat and improve the cooling efficiency of the liquid medium.

[0041] In some embodiments, the main board is provided with a first port and a second port, the flow channel on at least one of the side surfaces is connected to the first port, and the flow channel on at least one of the side surfaces is connected to the second port; wherein the first port and the second port are axially symmetrical structures with each other.

[0042] The first port and the second port are axially symmetrical structures with each other, so there is no need to distinguish between the first port and the second port during assembly, thereby improving the assembly flexibility and maintainability of the motherboard.

[0043] In some embodiments, the main board further includes a peripheral wall surface, the peripheral wall surface connects the two side surfaces, and the peripheral wall surface is configured with the first port and the second port.

[0044] The first port and the second port are arranged on the peripheral wall surface. The space provided on the side of the peripheral wall surface can be used for convenient maintenance of the first port and the second port, and is also conducive to the first port and the second port being connected to the external system of the liquid medium using the space.

[0045] In some embodiments, the two side surfaces are respectively configured with the first opening and the second opening.

[0046] By flipping the motherboard, the first port and the second port can be interchanged. That is, there is no need to distinguish between the first port and the second port when assembling the motherboard, which improves the assembly flexibility and maintainability of the motherboard.

[0047] In some embodiments, at least a section of the flow channel is provided with a partition rib, and the partition rib divides the section into two parallel branch flow channels.

[0048] The dividing rib divides at least a portion of the flow channel into two parallel branch flow channels, thereby increasing the area of ​​the flow channel and improving the cooling efficiency per unit time.

[0049] In some embodiments, the cooling structure includes two cover plates, which are respectively disposed on two sides of the main board and respectively adhered to the two side surfaces to seal the flow channels on the two side surfaces.

[0050] The flow channels on both sides are sealed by two cover plates, thereby improving the sealing performance of the flow channels and improving the reliability of the cooling structure.

[0051] In a second aspect, a power unit is provided, comprising the cooling structure as described above, and power modules arranged on both sides of the cooling structure.

[0052] Since the power unit provided in the embodiment of the present application adopts the cooling structure provided in the embodiment of the present application, the cooling structure can fully utilize the cooling efficiency of the liquid medium, and the cooling efficiency provided is high, which can meet the heat dissipation requirements of large-capacity power units, thereby improving the working efficiency and use safety of the power unit, and extending the service life of the power unit.

[0053] In a third aspect, an energy storage system is provided, wherein the energy storage system includes the power unit described above.

[0054] Since the energy storage system provided in this application adopts the power unit provided in this application, the cooling structure in the power unit can fully utilize the cooling efficiency of the liquid medium, and the provided cooling efficiency is high, which can meet the heat dissipation requirements of large-capacity energy storage systems.

[0055] In a fourth aspect, an electrical device is provided, wherein the electrical device includes the energy storage system as described above, and the energy storage system further includes a battery electrically connected to the power unit.

[0056] The electrical device provided in the embodiment of the present application adopts the energy storage system provided in the embodiment of the present application. Its beneficial effects compared with the existing technology are consistent with the beneficial effects of the energy storage system compared with the existing technology, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0058] FIG1 is a schematic diagram of a mainboard provided in some embodiments of the present application;

[0059] FIG2 is a schematic diagram of a mainboard provided in some embodiments of the present application;

[0060] FIG3 is a schematic diagram of a mainboard provided in some embodiments of the present application;

[0061] FIG4 is a cross-sectional view of the main board provided in FIG3 with one right angle removed;

[0062] FIG5 is a cross-sectional view of the main board provided in FIG3 , taken longitudinally along the thickness direction;

[0063] FIG6 is a schematic diagram of the direction of the fluid path of a liquid cooling plate;

[0064] FIG7 is a schematic diagram of the direction of the fluid path provided by some embodiments of the present application;

[0065] FIG8 is a schematic diagram of a mainboard provided in some embodiments of the present application;

[0066] FIG9 is a schematic diagram showing the flow channels of the main board provided in FIG8 being alternately connected in series;

[0067] FIG10 is a schematic diagram of a mainboard provided in some embodiments of the present application;

[0068] FIG11 is a schematic diagram of a disassembled cooling structure provided by some embodiments of the present application;

[0069] FIG12 is a schematic diagram of a mainboard provided in some embodiments of the present application;

[0070] FIG13 is a schematic diagram of the adaptation of a cooling structure to a power device according to some embodiments of the present application;

[0071] FIG14 is a schematic diagram of a power unit provided in some embodiments of the present application;

[0072] FIG15 is a schematic diagram of an energy storage system provided in some embodiments of the present application.

[0073] Among them, the reference numerals in the figures are:

[0074] 10. Cooling structure; 100. Power unit; 1000. Energy storage system;

[0075] 11. Main plate; 12. Cover plate; 111. First side surface; 112. Second side surface; 113. Peripheral wall; 114a. First flow channel; 114b. Second flow channel; 115a. Third flow channel; 115b. Fourth flow channel; 116. Connecting portion; 117. First port; 118. Second port; 119. Branch flow channel; 1110. Sub-flow channel; 1111. Separating rib; 1112. Separating rib; 1113. Main rib; 1161. First connecting portion; 1162. Second connecting portion; 1163. Third connecting portion; 1164. Fourth connecting portion; 1111a. First flow channel wall; 1111b. Second flow channel wall.

[0076] a, first parallel flow channel section; a1, first section; a2, second section;

[0077] b, second parallel flow channel section; b1, third section; b2, fourth section;

[0078] 1001, power module; 1001a, power device;

[0079] 10001. Battery. DETAILED DESCRIPTION

[0080] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit this application.

[0081] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0082] In order to illustrate the technical solution provided by this application, a detailed description is given below with reference to specific drawings and embodiments.

[0083] The term "and / or" in this application simply describes an association between related objects, indicating that three possible relationships exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the related objects are in an "or" relationship.

[0084] In the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components in different embodiments are omitted. It should be understood that the thickness, length, width, and other dimensions of the various components in the embodiments of this application, as well as the overall thickness, length, width, and other dimensions of the integrated device shown in the drawings are merely illustrative and should not constitute any limitation on this application.

[0085] With the rapid development of large-capacity energy storage devices, the demand for high-voltage, high-power IGBTs (Insulated Gate Bipolar Transistors) is increasing, and the requirements for the capacity and reliability of power devices are becoming increasingly higher.

[0086] Power devices generate significant amounts of heat during operation. The amount of heat generated depends on the capacity of the IGBT (Insulated Gate Bipolar Transistor). Larger capacities require higher heat dissipation requirements. Heat dissipation issues not only affect operating efficiency but also directly impact reliability and service life. Batteries, as large-capacity energy storage devices, rely on power devices for charge and discharge control strategies. Heat dissipation issues associated with these devices also impact battery reliability.

[0087] Typically, power devices are cooled using liquid cooling, for example using a liquid cooling plate. The plate has two channels on opposite sides, each cooling the components. The channels are symmetrically arranged, providing consistent cooling.

[0088] However, in practical applications, the power device losses on either side of the liquid cooling plate are asymmetric. For example, to accommodate the power charge and discharge characteristics of ultra-high voltage energy storage batteries, adapted power devices are placed on both sides of the liquid cooling plate. Heat dissipation on one side can reach approximately 5kW, while heat dissipation on the other side is only a few hundred watts. Existing liquid cooling plates have symmetrical flow channels on both sides. This results in insufficient cooling efficiency on the side with high heat flux density, making it difficult to meet the actual heat dissipation requirements on that side. On the other hand, the cooling efficiency on the side with low heat flux density is redundant, exceeding the actual heat dissipation requirements on that side and preventing full utilization of the cooling efficiency on that side.

[0089] Based on the above considerations, in order to enable the devices on both sides with different heat flux densities to obtain corresponding cooling efficiency and respectively meet the actual heat dissipation needs of the devices on both sides, a cooling structure is designed. The cooling structure includes a main board, and the main board includes two side surfaces arranged opposite to each other. The two side surfaces are respectively provided with flow channels, and the flow channels on the two side surfaces are connected to form a fluid path.

[0090] The cooling structure provided by the present technical solution has a liquid medium flowing on both sides through the connecting part, and the remaining cooling efficiency on one side is used to cool the devices on the other side, so that the cooling efficiency provided by the two sides is more adapted to the actual cooling requirements of the devices on both sides, thereby improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0091] The cooling structure provided in the embodiments of the present application can be used, but is not limited to, in electrical devices such as vehicles, ships, or aircraft. A power unit equipped with the cooling structure provided in the embodiments of the present application can be used to form an energy storage system, and an energy storage system equipped with the power unit provided in the embodiments of the present application can be used to form a power supply system for an electrical device. This helps improve the cooling effect on the power unit and the energy storage system, effectively improving the safety and reliability of the energy storage system during use, and also helps extend the service life of the power unit and the energy storage system.

[0092] In some embodiments, the energy storage system may be a battery. A battery refers to a physical module comprising one or more battery cells that provides voltage and capacitance. For example, it may include battery cells, battery modules, or battery packs. Generally, a battery comprises a single cell and a housing for housing the single cells. The housing houses and encapsulates one or more battery cells or battery modules. The housing protects the battery cells and prevents liquids or other foreign matter from affecting the charging or discharging of the battery cells.

[0093] Battery cells may include lithium-ion secondary batteries, lithium-ion primary batteries, lithium-sulfur batteries, sodium-lithium-ion batteries, sodium-ion batteries, or magnesium-ion batteries, etc., and the present application does not limit this. Battery cells may be cylindrical, flat, rectangular, or other shapes, etc., and the present application does not limit this. Battery cells are divided into three types based on the packaging method: cylindrical battery cells, prismatic battery cells, and soft-pack battery cells, and the present application does not limit this.

[0094] A battery cell is the smallest unit that makes up a battery. A battery can contain multiple cells, which can be connected in series, parallel, or in a hybrid configuration. A hybrid configuration refers to a combination of series and parallel connections. Multiple cells can be connected directly in series, parallel, or in a hybrid configuration, and then the entire battery system is housed within a housing. Alternatively, a battery can be constructed by first connecting multiple cells in series, parallel, or in a hybrid configuration to form a battery module. Multiple modules are then connected in series, parallel, or in a hybrid configuration to form a single unit, which is then housed within a housing.

[0095] The electrical devices provided in the embodiments of the present application may be, but are not limited to, mobile phones, tablets, laptop computers, electric toys, electric tools, battery-powered vehicles, electric cars, ships, spacecraft, etc. The electric toys may include fixed or mobile electric toys, such as game consoles, electric car toys, electric ship toys, and electric airplane toys, etc., and the spacecraft may include airplanes, rockets, space shuttles, and spacecraft, etc.

[0096] Among them, the vehicle can be a fuel vehicle, a gas vehicle or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. A battery is provided inside the vehicle, and the battery can be provided at the bottom, head or tail of the vehicle. The battery can be used to power the vehicle, for example, the battery can be used as an operating power source for the vehicle. The vehicle may also include a controller and a motor, and the controller is used to control the battery to power the motor, for example, for starting, navigating and driving the vehicle. In some embodiments, the battery can not only serve as the operating power source of the vehicle, but also as the driving power source of the vehicle, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle.

[0097] The cooling structure 10, power unit 100, energy storage system 1000 and electrical device provided in the embodiment of the present application are now described.

[0098] 1 to 12 , a first aspect of the present application is to provide a cooling structure 10. The cooling structure 10 includes a main board 11, which includes two opposing side surfaces, each of which is provided with a flow channel, and the flow channels on the two side surfaces are connected to form a fluid path.

[0099] The main board 11 is a plate-like structure having a certain thickness and two side surfaces arranged opposite to each other along the thickness direction. The two side surfaces each have a certain extension area, and the ratio of the extension area of ​​the side surfaces to the thickness of the main board is relatively large.

[0100] Generally, the thickness of the main board 11 is uniform, that is, the thickness of each part of the main board 11 is the same. The thickness of the main board 11 can also be non-uniform, that is, the thickness of each part of the main board 11 is inconsistent, or changes regularly.

[0101] Generally, the two sides are of equal shape and equal area. The area and shape of the two sides can also be different. Wherein, the shape of the mainboard 11 is not limited, including but not limited to polygonal, circular, other regular shapes or irregular shapes.

[0102] The flow channel refers to a groove-shaped structure integrally opened on the side, which is recessed from the side toward the interior of the main board 11. The groove-shaped structure has a certain length, width and depth, with a large ratio of length to width and a large ratio of length to depth.

[0103] Alternatively, a flow channel refers to a conduit within a tubular structure, which is disposed on a side surface, thereby forming a lateral flow channel. Generally, the tubular structure has a specific length and radial dimension, with a large ratio between the length and radial dimensions. The cross-sectional shape of the tubular structure includes, but is not limited to, polygonal, circular, elliptical, or other regular shapes. For example, in some embodiments, a circular groove is disposed on the side of the mainboard, and the circular tubular structure is spirally wound and embedded within the groove.

[0104] Typically, the flow channel is arranged on the side surface in a predetermined manner, such as in a spiral arrangement, an S-shaped arrangement, or a plurality of nested U-shaped arrangements, with the plurality of U-shaped arrangements being sequentially connected. The flow channel can be formed by sequentially connecting a plurality of straight segments, a plurality of curved segments, or a plurality of straight segments and a plurality of curved segments alternately connected.

[0105] A fluid path refers to a conductive path for fluid to flow through.

[0106] Referring to Figure 6, a liquid cooling plate is shown in which a liquid medium enters both sides of a motherboard, flows through both sides of the motherboard, and then flows out of the motherboard from both sides. The parallel solid and dashed lines in the figure respectively represent the liquid medium flowing through both sides of the motherboard.

[0107] As shown in Figure 7, compared to the liquid cooling plate shown in Figure 6, the cooling structure 10 provided in this embodiment has the liquid medium flow along both sides, utilizing the remaining cooling efficiency on one side to cool the components on the other side. This makes the cooling provided by both sides more compatible with the actual cooling needs of the components on both sides, improving the cooling effect while fully utilizing the cooling efficiency of the liquid medium. The intersecting solid and dashed lines in the figure each represent a fluid path for the liquid medium, each of which flows from one side of the motherboard to the other side.

[0108] In some embodiments, the intersection does not mean that the two fluid paths actually intersect, but that the two fluid paths are actually independent. The intersection merely indicates that the two fluid paths flow through the two side surfaces from different directions.

[0109] In some embodiments, intersection may also refer to the actual intersection of two fluid paths, which can also achieve the purpose of fluid reaching from one side to the other.

[0110] In some embodiments, by removing any one of the fluid paths represented by the solid line or the dotted line and leaving only one fluid path, it is also possible to achieve fluid flow from one side of the mainboard to the other side.

[0111] In some embodiments, as shown in Figures 13 and 14, the cooling structure 10 is applied to a power unit 100. The power unit 100 includes power modules 1001 disposed on opposite sides of the cooling structure 10. The power modules 1001 may include one or more power devices 1001a. The power devices 1001a may be IGBT devices or diodes. The power module 1001 may include only IGBT devices, only diodes, or both IGBT devices and diodes. The IGBT devices generate more heat, while the diodes generate less heat.

[0112] Therefore, different power modules 1001 contain different types, quantities or distribution densities of power devices 1001a, and different power modules 1001 have different cooling requirements, that is, the cooling requirements of the power modules 1001 arranged on both sides of the cooling structure 10 may be different, which requires that both sides of the cooling structure 10 can provide cooling performance adapted to different power modules 1001.

[0113] In some embodiments, the power unit 100 is applied to an energy storage system 1000 , such as an electric energy storage system, and the charging and discharging of the battery 10001 is controlled by continuously switching the switching states of at least some power devices 1001 a .

[0114] For example, the battery charging process is initiated by turning on the power device 1001a, or the battery 10001 is discharged by turning off the power device 1001a. When the power device 1001a is in the on state, the heat generated is high and the cooling requirement is large. When the power device 1001a is in the off state, the heat generated is low and the cooling requirement is small. Therefore, when the same or different power modules 1001 arranged on both sides of the cooling structure 10 are in different operating states, their cooling requirements are also different. This requires that both sides of the cooling structure 10 can provide cooling performance that is adapted to the cooling requirements of the power modules 1001.

[0115] In some embodiments, in a power unit 100, power modules 1001 are disposed on both sides of a cooling structure 10, with one power module 1001 disposed directly opposite one side of a mainboard 11, and the other power module 1001 disposed directly opposite the other side of the mainboard 11. If one of the power modules 1001 has a high cooling requirement, for example, if the power devices 1001a on the power module 1001 have a high distribution density and a high heat flux density, then the corresponding actual cooling requirement is high. If the other power module 1001 has a low cooling requirement, for example, if the power devices 1001a on the power module 1001 have a low distribution density and a low heat flux density, then the corresponding actual cooling requirement is low.

[0116] In some embodiments, the liquid medium first flows through the flow channel on one side to cool one of the power modules 1001 , and then flows into the flow channel on the other side to cool the other power module 1001 .

[0117] One of the power modules 1001 has a large cooling requirement, and most of the cooling efficiency of the liquid medium is used. A small amount of cooling efficiency remains in the liquid medium, which just meets the cooling requirement of the other power module 1001. This improves the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing the redundancy of the cooling efficiency of the liquid medium.

[0118] In some embodiments, the liquid medium first flows in the flow channel on the other side to cool the other power module 1001 , and then flows into the flow channel on one side to cool one power module 1001 .

[0119] The cooling requirement of the other power module 1001 is small, and a small part of the cooling efficiency of the liquid medium is used. The liquid medium has most of the remaining cooling efficiency, which just meets the cooling requirement of one of the power modules 1001. This improves the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing the redundancy of the cooling efficiency of the liquid medium.

[0120] In some embodiments, in a power unit 100, power modules 1001 are arranged on both sides of the cooling structure 10, one power module 1001 is arranged opposite one side of the mainboard 11, and the other power module 1001 is arranged opposite the other side of the mainboard 11, and the actual cooling requirements of one power module 1001 and the other power module 1001 tend to be consistent.

[0121] In some embodiments, the liquid medium first flows through the flow channel on one side to cool one power module 1001 directly opposite the one side, and then flows into the flow channel on the other side to cool the other power module 1001 directly opposite the other side. One power module 1001 uses approximately half of the cooling efficiency of the liquid medium, leaving the remaining half, which just meets the cooling needs of the other power module 1001. This improves the cooling effect while fully utilizing the cooling efficiency of the liquid medium and reduces the redundancy of the cooling efficiency of the liquid medium.

[0122] In some embodiments, the main board 11 is provided with a connecting portion 116 penetrating the main board, and the flow channels on the two side surfaces are connected through the connecting portion 116 .

[0123] The connecting portion 116 refers to a structure that connects the two side surfaces and is provided on the main board 11. Penetrating the main board 11 refers to a structure that removes part of the material of the main board 11 along the thickness direction. The structure formed after the material is removed is the connecting portion 116. The connecting portion 116 can connect the two side surfaces or be a structure configured on the two side surfaces.

[0124] The structure of the connecting portion 116 is not limited. It can penetrate the main board 11 in a straight path along the thickness direction, or in a curved path along the thickness direction. The connecting portion 116 meets the connection requirements by penetrating from one side to the other.

[0125] The flow channels on the two sides are connected by the connecting portion 116 that passes through the main board, thereby improving the convenience of the fluid path.

[0126] In some embodiments, the flow channels on the two sides are connected in series one to one.

[0127] Series connection refers to a manner in which the structures are connected one by one in sequence, that is, the flow channel on one side, the connecting portion 116, and the flow channel on the other side are connected one by one in sequence.

[0128] The liquid medium first flows in the flow channel on one side, cools the device on that side, and then enters the flow channel on the other side through the connecting part 116 to cool the device on the other side. The flow sequence is achieved by connecting in series, thereby improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0129] In some embodiments, the flow channels on the two sides can also be connected in series in other ways. For example, the two sides of the main board 11 are distinguished as a first side 111 and a second side 112. The first side 111 is provided with at least one flow channel, and the second side 112 is provided with at least two flow channels.

[0130] In some embodiments, one flow channel is provided on the first side 111 , multiple flow channels on the second side 112 are connected in parallel, and one flow channel on the first side 111 is connected in series with multiple flow channels on the second side 112 .

[0131] For example, through a connecting portion 116 connected in series, one end of the connecting portion 116 is connected to a flow channel of the first side surface 111 , and the other end opposite to the one end is connected to multiple flow channels of the second side surface 112 .

[0132] Alternatively, multiple connecting parts 116 are connected in series, one end of the multiple connecting parts 116 is connected to a flow channel on the first side 111, and the other end of the multiple connecting parts 116 opposite to the one end is respectively connected to multiple flow channels on the second side 112.

[0133] In some embodiments, the first side 111 is provided with multiple flow channels, the multiple flow channels of the first side 111 are connected in parallel, the multiple flow channels of the second side 112 are connected in parallel, and the multiple flow channels of the first side 111 and the multiple flow channels of the second side 112 are connected in series.

[0134] For example, a connecting portion 116 is connected in series, one end of the connecting portion 116 is connected to multiple flow channels on the first side 111, and the other end opposite to the one end is connected to multiple flow channels on the second side 112. The number of flow channels on the first side 111 and the number of flow channels on the second side 112 can be the same or different.

[0135] Alternatively, the plurality of communicating portions 116 may be connected, with one end of each of the plurality of communicating portions 116 being at least partially interconnected, and each of the plurality of one ends being connected to the plurality of flow channels on the first side 111. The plurality of other ends of the plurality of communicating portions 116, opposite to the one end, may be at least partially interconnected, and each of the plurality of other ends being connected to the plurality of flow channels on the second side 112. The number of flow channels on the first side 111 and the number of flow channels on the second side 112 may be the same or different, and the number of communicating portions 116 may be less than or equal to the number of flow channels on the first side 111, or less than or equal to the number of flow channels on the second side 112.

[0136] In some embodiments, on a fluid path, the difference between the sum of the number of flow channels on two side surfaces and the number of connecting portions is equal to one.

[0137] For example, a connecting portion 116 is connected between two adjacent flow channels, and a flow channel is connected between adjacent connecting portions 116, so that multiple flow channels on the two sides can be connected in series in sequence through the connecting portion 116. The liquid medium can flow back and forth between the two sides to complete multiple heat exchanges, thereby achieving a better cooling effect on the devices on both sides and making more full use of the cooling efficiency of the liquid medium.

[0138] In some embodiments, on a fluid path, the flow channels on the first side 111 and the flow channels on the second side 112 are connected in series one-to-one through the connecting portions 116 , and the difference between the sum of the number of flow channels on the two sides and the number of connecting portions is equal to one.

[0139] In some embodiments, on a single fluid path, the flow channels on the first side 111 and the flow channels on the second side 112 are connected in series in a one-to-many manner via the connecting portions 116. For example, the number of flow channels on the first side 111 is one, the number of flow channels on the second side 112 is multiple, the number of connecting portions 116 is multiple, and the number of flow channels on the second side 112 is the same as the number of connecting portions 116. One end of the connecting portion 116 is connected to the one flow channel on the first side 111, and the other end opposite the one end is connected to the multiple flow channels on the second side 112. The difference between the sum of the number of flow channels on the two sides and the number of connecting portions is equal to one.

[0140] In some embodiments, on a fluid path, the difference between the sum of the number of flow channels on two side surfaces and the number of connecting portions is greater than one.

[0141] In some embodiments, one flow channel on the first side 111 is connected to multiple flow channels on the second side 112 through one connecting portion 116 , and the difference between the sum of the number of flow channels on the two sides and the number of connecting portions 116 is greater than one.

[0142] In some embodiments, the plurality of flow channels on the first side 111 are connected to the plurality of flow channels on the second side 112 via a connecting portion 116 , and the difference between the sum of the number of flow channels on the two sides and the number of connecting portions 116 is greater than one.

[0143] In some embodiments, multiple flow channels on the first side 111 are connected to multiple flow channels on the second side 112 through multiple connecting portions 116. The number of flow channels on the first side 111 and the number of flow channels on the second side 112 may be the same or different. The number of connecting portions 116 may be less than or equal to the number of flow channels on the first side 111, or less than or equal to the number of flow channels on the second side 112. The difference between the sum of the number of flow channels on the two sides and the number of connecting portions 116 is greater than one.

[0144] In some embodiments, the main board 11 is provided with at least two parallel fluid paths.

[0145] Parallel connection refers to a method in which at least two identical or different flow paths are independently provided, and the at least two flow paths can allow liquid media to flow in parallel without interfering with each other during the flow process.

[0146] The liquid medium is allowed to flow between the two sides through multiple fluid paths, thereby further improving the cooling effect and making full use of the cooling efficiency of the liquid medium.

[0147] In some embodiments, the flow channel includes a first flow channel 114a provided on one side of the main board 11 and a second flow channel 114b provided on the other side of the main board 11. In one fluid path, there is only one first flow channel 114a and one second flow channel 114b.

[0148] The liquid medium enters the second flow channel 114b from the first flow channel 114a, or the liquid medium enters the first flow channel 114a from the second flow channel 114b, which simplifies the flow channel structure and improves the cooling effect.

[0149] In some embodiments, the first flow channel 114a and the second flow channel 114b are connected through the connecting portion 116, and the liquid medium enters the second flow channel 114b from the first flow channel 114a through the connecting portion 116, or enters the first flow channel 114a from the second flow channel 114b through the connecting portion 116.

[0150] In some embodiments, the main board 11 is provided with two parallel fluid paths. A first flow channel 114a and a second flow channel 114b are provided on each side of the main board 11. A fluid path includes the first flow channel 114a on one side of the main board and the second flow channel 114b on the other side of the main board.

[0151] By setting up a dual path, the cooling effect is further improved, and the cooling efficiency of the liquid medium is further fully utilized.

[0152] The mainboard 11 is distinguished by two side surfaces, namely a first side surface 111 and a second side surface 112. In some embodiments, the first side surface 111 is configured with a first flow channel 114a and a second flow channel 114b, and the second side surface 112 is configured with a first flow channel 114a and a second flow channel 114b, thereby forming a dual fluid path on the mainboard 11 to further improve cooling efficiency.

[0153] The first flow channel 114a of the first side surface 111 and the second flow channel 114b of the second side surface 112 are connected through a connecting portion 116, which may be a first connecting portion 1161. The second flow channel 114b of the first side surface 111 and the first flow channel 114a of the first side surface 111 are connected through a connecting portion 116, which may be a second connecting portion 1162.

[0154] In some embodiments, the main board 11 is of a regular shape, such as a square plate. The first connecting portion 1161 and the second connecting portion 1162 can be spaced apart along a radial direction of the main board 11 and can be symmetrically arranged about the center of the main board 11.

[0155] In some embodiments, the first flow channel 114a and the second flow channel 114b on the same side are spirally arranged in parallel, and the inner ends of the first flow channel 114a and the second flow channel 114b are connected to the first connecting portion 1161 and the second connecting portion 1162 respectively.

[0156] A spiral refers to a structure that rotates around a center in a plane and continuously approaches the center. In some embodiments, the flow channel is arranged in a spiral manner on the side, and the center of the spiral can be close to the center of the main board 11 or coincide with the center of the main board 11.

[0157] Parallel helices refer to two structures that are parallel and spiral in the same direction.

[0158] The inner end refers to the port located on the inner side of the spirally arranged flow channel.

[0159] The flow channel is spirally arranged to make the flow of the liquid medium smoother, thereby reducing the flow resistance, and the spiral arrangement facilitates the overall layout of the flow channel.

[0160] In some embodiments, the flow channel includes a third flow channel 115a provided on one side of the main board 11 and a fourth flow channel 115b provided on the other side of the main board 11. At least one of the third flow channel 115a and the fourth flow channel 115b is provided in multiple numbers. In a fluid path, the third flow channel 115a and the fourth flow channel 115b are alternately connected in series.

[0161] As shown in Figure 9, alternating series connection refers to a manner in which at least two different structures are connected one by one in an alternating order, that is, they are connected one by one in the manner of the third flow channel 115a, the fourth flow channel 115b, the third flow channel 115a, the fourth flow channel 115b, and so on, or they are connected one by one in the manner of the fourth flow channel 115b, the third flow channel 115a, the fourth flow channel 115b, the third flow channel 115a, and so on.

[0162] The third flow channel 115a and the fourth flow channel 115b are alternately connected in series, and the liquid medium flows alternately on the two sides, which has a better cooling effect on the components on both sides and a more uniform cooling effect of the cooling structure.

[0163] In some embodiments, the third flow channel 115a and the fourth flow channel 115b are connected through the connecting portion 116, and the liquid medium enters the fourth flow channel 115b from the third flow channel 115a through the connecting portion 116, and then enters the third flow channel 115a from the fourth flow channel 115b through the connecting portion 116.

[0164] In some embodiments, on one fluid path, the number of the third flow channels 115 a is two, and the number of the fourth flow channel 115 b is one.

[0165] The liquid medium enters the fourth flow channel 115b from the third flow channel 115a, flows through the fourth flow channel 115b and then enters the third flow channel 115a, that is, it flows from one side through the other side and then back to one side, simplifying the flow channel structure and improving the cooling effect.

[0166] In some embodiments, the main board 11 is distinguished into two side surfaces, namely a first side surface 111 and a second side surface 112. The first side surface 111 is provided with two third flow channels 115a and one fourth flow channel 115b, and the second side surface 112 is provided with two third flow channels 115a and one fourth flow channel 115b.

[0167] The two ends of the fourth flow channel 115b of the first side 111 are connected to the two third flow channels 115a of the second side 112 through two connecting portions 116 to form a fluid path. The two connecting portions 116 are respectively a first connecting portion 1161 and a second connecting portion 1162.

[0168] The two ends of the fourth flow channel 115b of the second side 112 are connected to the two third flow channels 115a of the first side 111 through two connecting parts, thereby forming a fluid path. The two connecting parts 116 are the third connecting part 1163 and the fourth connecting part 1164 respectively.

[0169] In some embodiments, the connecting portion 116 is located in the middle region of the mainboard 11, and the fourth flow channel 115b is located in the region between two connected connecting portions 116. Placing the connecting portion 116 in the middle region of the mainboard 11 and the fourth flow channel 115b in the region between the two connecting portions 116 improves the cooling effect on the components to be cooled in the middle region. The two connecting portions 116 can be spaced radially apart on the mainboard 11 and can be symmetrically arranged about the center of the mainboard 11.

[0170] For example, as shown in Figure 13, in power module 1001, the front face of power device 1001a located in the middle region faces the flow channel, and its side faces are surrounded by other power devices 1001a located in the periphery. Power device 1001a located in the middle region dissipates heat from its front face. Power device 1001a located in the peripheral region has its front face facing the flow channel, and some of its side faces outward. These outward-facing sides are not surrounded by other devices, so the peripheral devices dissipate heat from their front faces and some of their side faces.

[0171] Therefore, the heat flux density of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area. That is, the cooling requirement of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area.

[0172] The fourth flow channel 115b is arranged in the area between the two connecting parts 116. The liquid medium enters the fourth flow channel 115b from one third flow channel 115a through the connecting part 116, flows through the fourth flow channel b, and then enters the other third flow channel 115a through the connecting part 116. After the cooling efficiency provided by the liquid medium when flowing through the fourth flow channel 115b is used to cool the devices in the middle area, some of the cooling efficiency can be left for use when entering the other third flow channel 115a. Therefore, when the liquid medium flows through the fourth flow channel 115b, it can fully cool the devices in the middle area to meet their cooling needs.

[0173] In some embodiments, the two third flow channels 115a are arranged in parallel spirally, and the fourth flow channel 115b includes two sub-flow channels 1110 arranged in parallel spirally, the inner ends of the two sub-flow channels 1110 are connected, and the outer ends of the two sub-flow channels 1110 are respectively connected to the inner ends of the two third flow channels 115a.

[0174] The outer end refers to the port on the outer side of the spirally arranged flow channel.

[0175] The two third flow channels 115a are interlocked by being arranged in parallel spirals, and the two sub-flow channels 1110 are interlocked by being arranged in parallel spirals, which can perform high-density cooling on the component to be cooled and improve the cooling effect.

[0176] In some embodiments, the first connecting portion 1161 , the second connecting portion 1162 , the third connecting portion 1163 and the fourth connecting portion 1164 are disposed in a central region of the main board 11 , and the two third flow channels 115 a are disposed in regions between the four connecting portions 116 .

[0177] In some embodiments, as shown in FIG8 , two through-hole structures can be provided through the thickness of the mainboard 11. Separation ribs 1112 are provided in each of the through-hole structures. One separation rib 1112 separates one through-hole structure into a first connection portion 1161 and a third connection portion 1163. The other separation rib 1112 separates the other through-hole structure into a second connection portion 1162 and a fourth connection portion 1164. The two through-hole structures can be spaced apart radially along the mainboard 11 and can be symmetrically arranged about the center of the mainboard 11.

[0178] In some embodiments, the flow channel on at least one side of the main board 11 is spirally arranged.

[0179] The flow channels are spirally arranged to improve the flow smoothness of the liquid medium, thereby reducing the flow resistance and facilitating the layout of the flow channels in the center of the main board 11 .

[0180] As shown in FIG3 , in some embodiments, a first flow channel 114 a and a second flow channel 114 b are respectively provided on the two sides. The first flow channel 114 a and the second flow channel 114 b are both spirally arranged, and the inner end of the first flow channel 114 a is connected to the inner end of the second flow channel 114 b.

[0181] The first flow channel 114a and the second flow channel 114b on both sides are spirally arranged, and the flow smoothness of the liquid medium on the entire path is better. The inner ends of the flow channels on the two sides are connected, that is, they are connected in the central area of ​​the area where the flow channels are located, which is beneficial to improve the cooling effect of the components to be cooled corresponding to the central area.

[0182] In some embodiments, the flow channels on both sides are spirally arranged, the outer ends of the flow channels on the two sides are connected, and the liquid medium flows into or out of the flow channel at the center of the flow channel.

[0183] As shown in FIG8 , in some embodiments, a first flow channel 114 a and a second flow channel 114 b are respectively provided on each side of the main board 11 , and the first flow channel 114 a and the second flow channel 114 b on the same side are spirally arranged in parallel.

[0184] The first flow channel 114a and the second flow channel 114b on the same side are interlocked by being arranged in parallel spirals, which can perform high-density cooling on the component to be cooled, thereby improving the cooling effect.

[0185] In some embodiments, the flow channels include two third flow channels 115a disposed on one side of the main plate 11 and one fourth flow channel 115b disposed on the other side of the main plate 11. The third flow channels 115a and the fourth flow channels 115b are alternately connected in series. The two third flow channels 115a are arranged in parallel spirally, and the fourth flow channel 115b is arranged in a spiral. The fourth flow channel 115b is disposed inside the two third flow channels 115a. The inner ends of the two third flow channels 115a are connected to the two outer ends of the fourth flow channel 115b.

[0186] The two third flow channels 115a are mutually embedded in parallel spirals, and the fourth flow channel 115b is spirally arranged, which can perform high-density cooling on the cooling component, improve the cooling effect, and facilitate the layout of the fourth flow channel 115b with the center of the third flow channel 115a.

[0187] In some embodiments, the fourth flow channel 115b includes two sub-flow channels 1110 arranged in parallel spirally, the inner ends of the two sub-flow channels 1110 are connected, and the outer ends of the two sub-flow channels 1110 are respectively connected to the inner ends of the two third flow channels 115a.

[0188] The two sub-channels 1110 are interlocked by being arranged in parallel spirals, which can perform high-density cooling on the component to be cooled and improve the cooling effect.

[0189] In some embodiments, the flow channel includes two sections, which are arranged in parallel to form parallel flow channel sections. At least two parallel flow channel sections are provided on one side of the main board. In different parallel flow channel sections, the spacing between adjacent flow channel walls on the two sections is different.

[0190] Due to the varying distribution densities and cooling requirements of components to be cooled, the spacing between adjacent flow channel walls in different parallel flow channel sections is set differently, resulting in designs with varying densities to accommodate the varying distribution densities and cooling requirements of the components to be cooled. For example, if the distribution density of components to be cooled is high or the cooling requirement is high, the spacing between adjacent flow channel walls will be designed to be smaller; if the distribution density of components to be cooled is low or the cooling requirement is low, the spacing between adjacent flow channel walls will be designed to be larger.

[0191] In some embodiments, the location where the flow channels on the two sides are connected is set in the middle area of ​​the main board 11; the distance between the adjacent flow channel walls on two sections in the parallel flow channel section close to the middle area is smaller than the distance between the adjacent flow channel walls on two sections in the parallel flow channel section away from the middle area.

[0192] The components to be cooled corresponding to the middle area of ​​the main board 11 have a high density or high cooling demand, while the components to be cooled corresponding to the outer area of ​​the main board 11 have a low density or low cooling demand. This makes the flow channel design of the middle area and the outer area more adapted to the distribution density or cooling demand of the corresponding components to be cooled, thereby further improving the cooling efficiency and making full use of the cooling performance of the liquid medium.

[0193] In some embodiments, the flow channel is spirally arranged, and along the spiral direction of the flow channel from the outside to the inside, the distance between adjacent flow channel walls in two sections gradually decreases.

[0194] The spacing between the flow channel walls gradually decreases, the tightness of the flow channel gradually increases, the cooling effect gradually increases, and the cooling effect shows a gradual trend, making it more adaptable to the gradually changing cooling requirements of the components to be cooled.

[0195] In some embodiments, the two sections are separated by a main fin 1113 , and two adjacent flow channel walls are disposed on both sides of the main fin 1113 .

[0196] As shown in FIG3 and FIG12 , in some embodiments, a first flow channel 114 a and a second flow channel 114 b are provided on one side of the main board, and the first flow channel 114 a and the second flow channel 114 b are spirally arranged in parallel.

[0197] Along the spiral direction of the flow channel from outside to inside, in the area located on the outside, that is, away from the middle area, in the flow channel section between the two dotted lines, a partial section of the first flow channel 114a serves as the first section a1, and a partial section of the second flow channel 114b serves as the second section a2. The first section a1 and the second section a2 are arranged side by side to form a first parallel flow channel section a. The first parallel flow channel section a is formed by separating the main ribs 1113. The two adjacent flow channel walls on the first section a1 and the second section a2 are the first flow channel walls 1111a, and the distance between the two first flow channel walls 1111a is L1.

[0198] In the inner area, that is, close to the middle area, in the flow channel section between the two dotted lines, a partial section of the first flow channel 114a serves as the third section b1, and a partial section of the second flow channel 114b serves as the fourth section b2. The third section b1 and the fourth section b2 are arranged in parallel to form a second parallel flow channel section b. The second parallel flow channel section b is separated by the main fins 1113. The two adjacent flow channel walls on the third section b1 and the fourth section b2 are second flow channel walls 1111b. The distance between the two second flow channel walls 1111b is L2, and L1>L2.

[0199] In some embodiments, the flow channel extends continuously in a spiral direction, and the distance between the two flow channel walls changes continuously and gradually. For example, as shown in FIG12 , the distance between the two flow channel walls decreases continuously along the spiral direction from the outside to the inside of the flow channel.

[0200] In some embodiments, the distance between two channel walls can be reduced in a gradient manner along the spiral direction from the outside to the inside of the channel. For example, there are multiple parallel channel sections in sequence along the spiral direction from the outside to the inside, and the distance between two channel walls in the multiple parallel channel sections decreases successively.

[0201] Flow channels are formed between adjacent main fins 1113 , and the main fins 1113 are used to transfer heat and improve the cooling efficiency of the liquid medium.

[0202] In some embodiments, main fins 1113 are provided between adjacent flow channels. As the flow channels spiral from outside to inside, the spacing between the two opposing side walls of the main fins 1113 gradually decreases. These side walls are the flow channel walls of the flow channels. The spacing between the two opposing side walls of the main fins 1113 gradually decreases, and the flow channels become tighter in the center of the spiral. Under the same cooling effect, compared to the unchanged spacing of the main fins 1113, the spacing of the main fins 1113 gradually decreases, significantly reducing the length of the flow channel and lowering the flow resistance of the liquid medium, thereby meeting the purpose of matching the center of the spiral with devices with high heat flux density.

[0203] For example, as shown in Figure 13, in power module 1001, power device 1001a located in the middle region has its front facing the flow channel and its side faces surrounded by other power devices located on the periphery. Power device 1001a located in the middle region dissipates heat from its front face. Power device 1001a located in the peripheral region has its front facing the flow channel and some of its side faces outward. These outward-facing sides are not surrounded by other devices, so the peripheral devices dissipate heat from their front faces and some of their side faces.

[0204] Therefore, the heat flux density of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area, that is, the cooling requirement of the power device 1001a in the middle area is higher than that of the power device 1001a in the peripheral area.

[0205] As the flow channel spirals from outside to inside, the distance between the two opposing sidewalls of the main fin 1113 gradually decreases. This means that the flow channel design in the center of the spiral is relatively compact, resulting in high cooling efficiency and suitable for the cooling needs of power devices located in the central area. In contrast, the flow channel design in the peripheral area is relatively loose, resulting in low cooling efficiency and suitable for the cooling needs of power devices located in the peripheral area.

[0206] In some embodiments, the main board 11 is provided with a first port 117 and a second port 118, and at least one side channel is connected to the first port 117, and at least one side channel is connected to the second port 118. The first port 117 and the second port 118 are axially symmetrical structures.

[0207] The first port 117 and the second port 118 are axially symmetrical structures with each other, so there is no need to distinguish between the first port 117 and the second port 118 during assembly, thereby improving the assembly flexibility and maintainability of the motherboard.

[0208] In some embodiments, the main board 11 is of a regular shape and has an axis of symmetry, and the first opening 117 and the second opening 118 are symmetrically arranged about the axis of symmetry. For example, the main board 11 is a quadrilateral and has a central axis that bisects the main board 11, and the central axis serves as the axis of symmetry.

[0209] In some embodiments, the main board 11 further includes a peripheral wall surface 113 . The peripheral wall surface 113 connects the two side surfaces and is configured with a first opening 117 and a second opening 118 .

[0210] The peripheral wall surface 113 refers to the outer surface of the main board 11 that connects the two side surfaces, and also refers to the outer surface of the main board 11 that extends in the thickness direction. The two side surfaces and the peripheral wall surface 113 constitute the entire outer surface of the main board 11.

[0211] The first port 117 and the second port 118 are arranged on the peripheral wall surface 113. The space provided on the side of the peripheral wall surface 113 can be used for convenient maintenance of the first port 117 and the second port 118, and it is also beneficial for the first port 117 and the second port 118 to use the space to connect with the external system of the liquid medium.

[0212] In some embodiments, the peripheral wall surface 113 is a regular annular surface having an axis of symmetry, and the first opening 117 and the second opening 118 are symmetrically arranged about the axis of symmetry. For example, the peripheral wall surface 113 is a square annular surface having a central axis that bisects the peripheral wall surface 113, and the central axis serves as the axis of symmetry.

[0213] In some embodiments, the two side surfaces are respectively configured with a first opening 117 and a second opening 118 .

[0214] By flipping the mainboard, the first port 117 and the second port 118 can be interchangeably assembled. That is, when assembling the mainboard, there is no need to distinguish between the first port 117 and the second port 118, thereby improving the assembly flexibility and maintainability of the mainboard.

[0215] In some embodiments, the first opening 117 and the second opening 118 are respectively disposed on two side surfaces, and along the thickness direction of the main board, one of the first opening 117 and the second opening 118 is projected onto the other.

[0216] In some embodiments, as shown in FIG. 10 , the first opening 117 and the second opening 118 are respectively disposed on two side surfaces and staggered. By flipping the main board 11 along the central axis, the first opening 117 and the second opening 118 can be interchanged.

[0217] In some embodiments, when the main board 11 is configured with one fluid path, two third flow channels 115 a are configured on the same side, one third flow channel 115 a is connected to the first port 117 , and the other third flow channel 115 a is connected to the second port 118 .

[0218] As shown in FIG. 8 , in some embodiments, when the main board 11 is configured with two fluid paths, one of the third flow channels 115 a on both sides is connected to the first port 117 , and the other third flow channels 115 a on both sides are connected to the second port 118 .

[0219] As shown in Figures 1 and 2, in some embodiments, when the main board 11 is configured with a fluid path, a first flow channel 114a and a second flow channel 114b are respectively configured on two side surfaces. The first flow channel 114a on one side communicates with the first port 117, and the second flow channel 114b on the other side communicates with the second port 118.

[0220] As shown in FIG3 , in some embodiments, when the main board 11 is configured with two fluid paths, a first flow channel 114 a and a second flow channel 114 b are configured on one side. The first flow channels 114 a on both sides are connected to the first port 117 , and the second flow channels 114 b on both sides are connected to the second port 118 .

[0221] In some embodiments, at least a section of the flow channel is provided with a partition rib 1112 , and the partition rib 1112 divides the section into two parallel branch channels 119 .

[0222] The partition rib 1112 divides at least a portion of the flow channel into two parallel branch channels 119 to increase the area of ​​the flow channel and improve the cooling efficiency per unit time.

[0223] In some embodiments, the cooling structure 10 includes two cover plates 12 . The two cover plates 12 are disposed on both sides of the main board 11 and are respectively attached to the two side surfaces to seal the flow channels on the two side surfaces.

[0224] The two cover plates 12 are used to seal the flow channels on the two sides, thereby improving the sealing performance of the flow channels and increasing the reliability of the cooling structure.

[0225] In some embodiments, the sides of the cover plate 12 and the main board 11 that are in contact with each other are connected and sealed by welding. In some embodiments, based on the welding method, the cover plate 12 and the main board 11 are welded face to face, so that the connection reliability and sealing between the two are better.

[0226] 13 and 14 , a second aspect of the present application aims to provide a power unit 100 , which includes the cooling structure 10 as described above.

[0227] Since the power unit 100 provided in the embodiment of the present application adopts the cooling structure 10 provided in the embodiment of the present application, the cooling structure 10 can fully utilize the cooling efficiency of the liquid medium, and the cooling efficiency provided is high, which can meet the heat dissipation requirements of the large-capacity power unit 100, thereby improving the working efficiency and use safety of the power unit 100, and extending the service life of the power unit 100.

[0228] As shown in FIG14 , in some embodiments, a power unit 100 includes at least two power modules 1001 and at least one cooling structure 10, which are alternately arranged. Each power module 1001 has two opposing sides, each of which is equipped with one or more power devices 1001a.

[0229] A cooling structure 10 is configured between two power modules 1001, and a power module 1001 is configured between the two cooling structures 10. The power device 1001a on the opposite side of a power module 1001 is cooled by the opposite sides of the two adjacent cooling structures 10. The flow channel on the opposite side of a cooling structure 10 is used to cool the opposite sides of the two adjacent power modules 1001.

[0230] The at least two power modules 1001 may be at least partially identical or completely different, and the operating timings of the at least two power modules 1001 may be at least partially identical or completely different. In a power module 1001, the number, type, and layout of power devices 1001a on opposite sides may be the same or different.

[0231] For example, on a power module 1001, the number, type and layout of the power devices 1001a on opposite sides are the same. In one embodiment, the power devices 1001a on opposite sides of the power module 1001 are symmetrically arranged, that is, the structures on both sides of the power module 1001 are the same.

[0232] For another example, on a power module 1001 , at least one of the number, type, and layout of the power devices 1001 a on opposite sides is different. In one embodiment, the power devices 1001 a on opposite sides of the power module 1001 are asymmetrically arranged.

[0233] In some embodiments, when the power devices 1001 a on two opposite sides of two adjacent power modules 1001 are consistent, the actual cooling requirements of the power devices 1001 a on the two opposite sides tend to be consistent.

[0234] The cooling structure 10 is arranged between the two adjacent power modules 1001. The liquid medium flows in the flow channel on one side thereof, cools the power device 1001a opposite to the one side, and then enters the flow channel on the other side through the connecting portion 116 and flows therein, cooling the power device 1001a opposite to the other side.

[0235] The power device 1001a facing the one side uses nearly half of the cooling efficiency of the liquid medium, and the liquid medium retains the other half of the cooling efficiency, which just meets the needs of the power device 1001a facing the other side, thereby improving the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing or avoiding the redundancy of the cooling efficiency of the liquid medium.

[0236] In other embodiments, when the power devices 1001a on opposite sides of two adjacent power modules 1001 are inconsistent, the actual cooling requirements of the power devices 1001a on the opposite sides tend to be inconsistent, the heat flux density of the power device 1001a on one side is higher, and the corresponding actual cooling requirement is high, while the heat flux density of the power device 1001a on the other side is low, and the corresponding actual cooling requirement is low.

[0237] The cooling structure 10 is arranged between the two adjacent power modules 1001. The liquid medium flows in the flow channel on one side, cools the power device 1001a on one side, and then enters the flow channel on the other side through the connecting portion 116 and flows therein to cool the power device 1001a on the other side.

[0238] The power device 1001a on one side uses most or a small part of the cooling efficiency of the liquid medium, and the liquid medium has a small or large part of the remaining cooling efficiency, which just meets the needs of the power device 1001a on the other side, thereby improving the cooling effect while making full use of the cooling efficiency of the liquid medium and reducing or avoiding the redundancy of the cooling efficiency of the liquid medium.

[0239] In some embodiments, as shown in Figures 13 and 14, the cooling structure 10 is applied to a power unit 100. The power unit 100 includes power modules 1001 disposed on opposite sides of the cooling structure 10. The power modules 1001 may include one or more power devices 1001a. The power devices 1001a may be IGBT devices or diodes. The power module 1001 may include only IGBT devices, only diodes, or both IGBT devices and diodes. The IGBT devices generate more heat, while the diodes generate less heat.

[0240] Therefore, different power modules 1001 contain different types, quantities or distribution densities of power devices 1001a, and different power modules 1001 have different cooling requirements, that is, the cooling requirements of the power modules 1001 arranged on both sides of the cooling structure 10 may be different, which requires that both sides of the cooling structure 10 can provide cooling performance adapted to different power modules 1001.

[0241] In some embodiments, the power unit 100 is applied to an energy storage system 1000 , such as an electric energy storage system, and the charging and discharging of the battery 10001 is controlled by continuously switching the switching states of at least some power devices 1001 a .

[0242] For example, the battery charging process is initiated by turning on the power device 1001a, or the battery 10001 is discharged by turning off the power device 1001a. When the power device 1001a is in the on state, the heat generated is high and the cooling requirement is large. When the power device 1001a is in the off state, the heat generated is low and the cooling requirement is small. Therefore, when the same or different power modules 1001 arranged on both sides of the cooling structure 10 are in different operating states, their cooling requirements are also different. This requires that both sides of the cooling structure 10 can provide cooling performance that is adapted to the cooling requirements of the power modules 1001.

[0243] As shown in FIG15 , the third aspect of the present application aims to provide an energy storage system 1000 , which includes the power unit 100 as described above.

[0244] Since the energy storage system 1000 provided in the embodiment of the present application adopts the power unit 100 provided in the embodiment of the present application, the cooling structure 10 in the power unit 100 can fully utilize the cooling efficiency of the liquid medium, provide high cooling efficiency, and meet the heat dissipation requirements of the large-capacity energy storage system 1000.

[0245] As shown in FIG15 , in some embodiments, the energy storage system 1000 includes a battery 10001 . The power module 1001 in the power unit 100 may include one or more power devices 1001 a . For example, the power device 1001 a may be a three-terminal semiconductor switching device. The power module 1001 controls the switching and working state of the battery 10001 through one or more power devices 1001 a .

[0246] The fourth aspect of the present application aims to provide an electrical device, which includes the energy storage system 1000 as described above, and the energy storage system 1000 further includes a battery 10001 electrically connected to the power unit 100.

[0247] The electrical device provided in the embodiment of the present application adopts the energy storage system provided in the embodiment of the present application. Its beneficial effects compared with the existing technology are consistent with the beneficial effects of the energy storage system compared with the existing technology, and will not be repeated here.

[0248] The above are merely optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A cooling structure, applied to a power unit, wherein the power unit comprises power modules arranged on both sides of the cooling structure, and the cooling requirements of the power modules on both sides of the cooling structure are different, wherein: The cooling structure comprises a main board, and the main board comprises two side surfaces arranged opposite to each other; The two side surfaces are respectively provided with flow channels, and the flow channels on the two side surfaces are connected to form a fluid path.

2. The cooling structure according to claim 1, wherein: The main board is provided with a connecting portion penetrating the main board, and the flow channels on the two side surfaces are connected through the connecting portion.

3. The cooling structure according to claim 2, wherein: On one of the fluid paths, a difference between a sum of the numbers of the flow channels on the two side surfaces and a number of the communication portions is equal to one.

4. The cooling structure according to any one of claims 1 to 3, wherein: The main board is provided with at least two fluid paths connected in parallel.

5. The cooling structure according to any one of claims 1 to 4, wherein: On one of the fluid paths, the flow channels on the two side surfaces are connected in series one by one.

6. The cooling structure according to any one of claims 1 to 5, wherein: The flow channel includes a third flow channel provided on one side of the main board and a fourth flow channel provided on the other side of the main board, and at least one of the third flow channel and the fourth flow channel is multiple in number; On one of the fluid paths, the third flow passages and the fourth flow passages are alternately connected in series.

7. The cooling structure according to claim 6, wherein: On one of the fluid paths, the number of the third flow channels is two, and the number of the fourth flow channel is one.

8. The cooling structure according to any one of claims 1 to 5, wherein: The flow channel on at least one side of the main board is spirally arranged.

9. The cooling structure according to claim 8, wherein: The two side surfaces are respectively provided with a first flow channel and a second flow channel, the first flow channel and the second flow channel are both spirally arranged, and the inner end of the first flow channel is connected with the inner end of the second flow channel.

10. The cooling structure according to claim 9, wherein: A first flow channel and a second flow channel are respectively provided on each side of the main board, and the first flow channel and the second flow channel on the same side are arranged in parallel and spirally.

11. The cooling structure according to claim 8, wherein: The flow channel includes two third flow channels arranged on one side of the main board and a fourth flow channel arranged on the other side of the main board, and the third flow channel and the fourth flow channel are alternately connected in series; The two third flow channels are arranged in parallel in a spiral manner, the fourth flow channel is arranged in a spiral manner, the fourth flow channel is arranged on the inner side of the two third flow channels, and the inner ends of the two third flow channels are respectively connected to the two outer ends of the fourth flow channel.

12. The cooling structure according to claim 11, wherein: The fourth flow channel includes two sub-flow channels which are arranged in parallel spirally, the inner ends of the two sub-flow channels are connected, and the outer ends of the two sub-flow channels are connected to the inner ends of the two third flow channels respectively.

13. The cooling structure according to any one of claims 1 to 12, wherein: The flow channel comprises two sections, and the two sections are arranged in parallel to form a parallel flow channel section; At least two parallel flow channel sections are provided on one side of the main board, and in different parallel flow channel sections, the distances between adjacent flow channel walls on the two sections are different.

14. The cooling structure according to claim 13, wherein: The position where the flow channels on the two side surfaces communicate is set in the middle area of ​​the main board; The distance between adjacent flow channel walls on two sections of the parallel flow channel section close to the middle area is smaller than the distance between adjacent flow channel walls on two sections of the parallel flow channel section away from the middle area.

15. The cooling structure according to claim 14, wherein: The flow channel is arranged in a spiral, and along the spiral direction of the flow channel from the outside to the inside, the distance between adjacent flow channel walls on the two sections gradually decreases.

16. The cooling structure according to any one of claims 13 to 15, wherein: The two sections are separated and formed by a main fin, and the two adjacent flow channel walls are arranged on both sides of the main fin.

17. The cooling structure according to any one of claims 1 to 16, wherein: The main board is provided with a first port and a second port, the flow channel of at least one of the side surfaces is connected to the first port, and the flow channel of at least one of the side surfaces is connected to the second port; Wherein, the first port and the second port are axisymmetric structures with respect to each other.

18. The cooling structure according to claim 17, wherein: The main board further includes a peripheral wall surface, the peripheral wall surface connects the two side surfaces, and the peripheral wall surface is configured with the first port and the second port.

19. The cooling structure according to claim 17, wherein: The two side surfaces are respectively configured with the first opening and the second opening.

20. The cooling structure according to any one of claims 1 to 19, wherein: At least a section of the flow channel is provided with a partition rib, and the partition rib divides the section into two parallel branch flow channels.

21. The cooling structure according to any one of claims 1 to 20, wherein: The cooling structure comprises two cover plates, which are respectively arranged on two sides of the main board and respectively adhered to the two side surfaces to seal the flow channels on the two side surfaces.

22. A power unit, wherein: The power unit comprises a cooling structure as claimed in any one of claims 1 to 21, and power modules arranged on both sides of the cooling structure.

23. An energy storage system, wherein: The energy storage system comprises the power unit as claimed in claim 22.

24. An electrical device, wherein: The electrical device comprises the energy storage system as claimed in claim 23; The energy storage system also includes a battery electrically connected to the power unit.

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