Wafer non-contact transfer system for wafer back cleaning

Abstract

A wafer non-contact transfer system for wafer back cleaning, comprising: a wafer transfer apparatus, comprising a first manipulator capable of moving axially along a first horizontal direction, a clamp of the first manipulator being provided with a first air outlet oriented in a set direction, and a wafer sheet being provided on the clamp of the first manipulator in a suspended mode on the basis of an air flow ejected from the first air outlet; and a wafer cleaning apparatus, comprising a wafer cleaning platform and a reversible second manipulator disposed on one side of the wafer cleaning platform, the second manipulator transferring the wafer sheet on the first manipulator to the wafer cleaning platform. According to the present invention, by providing an aerodynamics-based non-contact wafer transfer apparatus to transfer the wafer sheet from one device to another device for cleaning and providing a non-contact wafer carrying table for connection, the efficiency and accuracy of wafer transfer are improved.

Description

Non-contact wafer transfer system for backside cleaning

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 14, 2023, with application number 202311020019.8 and invention name “Non-contact wafer transfer system suitable for backside cleaning”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of wafer transfer, and in particular to a wafer non-contact transfer system. Background Art

[0003] When performing wafer cleaning or etching and other related processes, double-sided cleaning of the wafer is required, especially the single-wafer cleaning process and related equipment, which are different from the tank-type wet process equipment. The difference in wet process is that the tank-type wet equipment is a whole-wafer immersion type, while the single-wafer wet equipment is a single-sided cleaning type. The current single-wafer wet process equipment has become the main core wet process demand aspect of wafer products. With a limited number of cleaning modules configured within a fixed equipment volume, the demand for effective double-sided cleaning of wafers is also increasing. However, the equipment requirements for single wafer cleaning increase the difficulty of wafer transfer. The existing wafer transfer is difficult to control within the time limit required by wafer stability. The direct contact between the mechanized transfer device and the wafer surface causes contamination of the wafer surface, or long-term stay causes the adhesion of dust and particles, which will affect the etching quality of the cleaned batch wafers, resulting in poor wafer quality stability.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to provide a non-contact wafer transfer system suitable for wafer backside cleaning to solve the above technical problems;

[0006] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0007] Non-contact wafer transfer system for backside cleaning, including:

[0008] A wafer transfer device, comprising a first manipulator capable of axial movement along a first horizontal direction, a gripper of the first manipulator being provided with a first air outlet facing a set direction, the first air outlet being connected to a first pneumatic component, and a wafer being suspended on the gripper of the first manipulator based on airflow ejected from the first air outlet;

[0009] A wafer cleaning device includes a wafer cleaning platform and a flip-up second robot arranged on one side of the wafer cleaning platform. The second robot is provided with a second air outlet connected to a second pneumatic component. The wafer can be suspended and attached to the second robot based on the airflow ejected from the second air outlet. The second robot moves the wafer on the first robot to the wafer cleaning platform.

[0010] Preferably, the first manipulator comprises:

[0011] a linear transmission device, wherein the linear transmission device is provided with a motion structure capable of axial movement along the first horizontal direction;

[0012] The gripper is provided on the motion structure, and a plurality of load-bearing pins are provided on the gripper. The top of the load-bearing pins is provided with the first air outlet. The load-bearing pins are connected to the first pneumatic component. The first pneumatic component generates flowing gas based on the principle of internal and external air pressure difference and ejects it from the first air outlet.

[0013] Preferably, the first air outlet takes the center of the wafer as the initial point and is evenly distributed at a radius distance set from the initial point. The gripper of the first manipulator is also provided with a support component for supporting the wafer, and there is an adjustable distance between the wafer and the first air outlet.

[0014] Preferably, the first robot is further provided with a first positioning sensor for monitoring the movement of the wafer and a second positioning sensor for monitoring the relative position of the wafer, and the second positioning sensors are distributed along a ring on the first robot.

[0015] Preferably, the wafer transfer device further includes a transfer mechanism, the first robot is arranged on the transfer mechanism, and the transfer mechanism is used to drive the first robot to move axially in a vertical direction and / or axially in a second horizontal direction.

[0016] Preferably, the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0017] Preferably, the transfer mechanism includes:

[0018] base;

[0019] A support frame is provided on the base, and a vertical first slide rail is provided on the inner side wall of the support column of the support frame;

[0020] The support plate is slidably arranged on the slide rail, and the first manipulator is arranged on the support plate.

[0021] Preferably, the transfer mechanism further includes a second slide rail arranged along the second horizontal direction, and the base can be slidably arranged on the second slide rail.

[0022] Preferably, the wafer cleaning device includes:

[0023] A lifting device is provided on one side of the wafer cleaning platform, and a first driving electric cylinder is provided on the lifting device;

[0024] The rotating device is arranged on the liftable slide block of the lifting device. The rotating device is provided with a second driving electric cylinder. The second manipulator is connected to the rotating device.

[0025] Preferably, it includes a plurality of the wafer transfer devices, which transfer the wafers on the path from an external wafer storage cabinet (92) to the wafer cleaning device, and a wafer carrier is provided between each two adjacent wafer transfer devices. A third air outlet connected to a third pneumatic component is provided on the supporting surface of the wafer carrier, and the wafer can be suspended on the supporting surface of the wafer carrier based on the airflow ejected from the third air outlet.

[0026] Beneficial effects of the present invention: Due to the adoption of the above technical solution, the present invention places the wafer from one device into another device for cleaning by setting up a non-contact wafer transfer device based on aerodynamics, and provides a non-contact wafer carrier for connection, thereby improving the efficiency and accuracy of wafer transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a schematic structural diagram of a first robot transferring a wafer to a wafer cleaning device according to an embodiment of the present invention;

[0028] FIG2 is a schematic structural diagram of a wafer transfer device according to an embodiment of the present invention;

[0029] FIG3 is a side view of the structure of a wafer transfer device according to an embodiment of the present invention;

[0030] FIG4 is a top view of the structure of a wafer transfer device according to an embodiment of the present invention;

[0031] FIG5 is a rear view of the structure of a wafer transfer device according to an embodiment of the present invention;

[0032] FIG6 is a schematic structural diagram of the initial state of the manipulator in an embodiment of the present invention;

[0033] FIG7 is a schematic structural diagram of a wafer reaching the final position of a robot according to an embodiment of the present invention;

[0034] FIG8 is a schematic diagram of a system application of a wafer non-contact transfer system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0037] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0038] The wafer non-contact transfer system suitable for wafer backside cleaning, as shown in Figures 1 to 7, includes:

[0039] The wafer transfer device 1 includes a first manipulator 5 that can move axially along a first horizontal direction. A gripper 53 of the first manipulator 5 is provided with a first air outlet facing a set direction. The first air outlet is connected to a first pneumatic component. The wafer 8 can be suspended on the gripper 53 of the first manipulator 5 based on the airflow ejected from the first air outlet.

[0040] A wafer cleaning device 2 includes a wafer cleaning platform 4 and a flip-up second robot 3 arranged on one side of the wafer cleaning platform 4. The second robot 35 is provided with a second air outlet 31 connected to a second pneumatic component. The wafer 8 can be suspended and attached to the second robot 3 based on the airflow ejected from the second air outlet 31. The second robot 3 moves the wafer 8 on the first robot 5 to the wafer cleaning platform 4.

[0041] Specifically, the high-transmission-efficiency non-contact wafer transfer system provided by the present invention is mainly used in the process of cleaning or etching from the wafer delivery to the cleaning process section. In conjunction with the rest of the subsequent wafer cleaning device 2, it can be configured to effectively perform double-sided cleaning. Through non-contact wafer clamping and transmission technology, the wafers are alternately connected, and can be used to transfer wafers 8 from one device to another for wafer cleaning.

[0042] In a preferred embodiment, the first manipulator 5 includes:

[0043] A linear transmission device 51 is provided with a motion structure 52 that can move axially along a first horizontal direction;

[0044] The gripper 53 is provided on the motion structure 52. A plurality of bearing pins are provided on the gripper 53. A first air outlet is provided on the top of the bearing pins. The bearing pins are connected to the first pneumatic component. The first pneumatic component generates flowing gas based on the principle of internal and external air pressure difference and ejects it from the first air outlet.

[0045] Specifically, the gripper 53 of the first robot 5 of the present invention uses the suspension force generated by the air resistance formed by the pneumatic components to form a non-contact clamping action on the wafer 8, and is matched with the linear transmission device 51 that can move linearly to realize the first robot 5 of non-contact wafer transmission by linear transmission.

[0046] Specifically, the gripper 53 of the present invention is a fork-shaped gripper 53 , and four points are provided on the gripper 53 to connect to the air outlet of the first pneumatic component respectively. The gas ejected from the first air outlet is used to suspend and clamp the wafer based on the principle of air resistance.

[0047] Furthermore, the present invention utilizes air resistance pneumatic elements, i.e., pneumatic components, to generate effective air resistance based on the principle of generating an internal and external air pressure difference, and configures four relative positions, with the center of the circle as the starting point and the relative positions configured with a spacing difference of 1 mm relative to the wafer size. For example, the diameter of a 12-inch wafer is 300 mm, and the relative positions of the components are 301 to 303 mm.

[0048] In a preferred embodiment, the first air outlet takes the center of the wafer 8 as the initial point and is evenly distributed at a radius set from the initial point. The clamp 53 of the first robot 5 is also provided with a support component for supporting the wafer 8, and there is an adjustable distance between the wafer 8 and the first air outlet.

[0049] Specifically, the wafer 8 has an adjustable distance from the first gas outlet and / or the second gas outlet and / or the third gas outlet based on the air pressure resistance of the ejected gas.

[0050] Furthermore, the third air outlet and the third pneumatic component of the non-contact wafer carrier 91 are also equipped with a support component. The support component has an up and down micro-movement and spin deflection configuration, which can make the wafer 8 perform a slow, alternating and stable movement transfer during the carrying process. In addition, the support component is used in the non-contact transfer process corresponding to different wafer thicknesses, and the fully differentiated spacing is only 0.05 to 0.1 mm, so that the wafer 8 can fully correspond to the carrying process, especially the possible buckling and deflection stress of thin wafers.

[0051] In a preferred embodiment, the first robot 5 is also provided with a first positioning sensor for monitoring the movement of the wafer 8 and a second positioning sensor 54 for monitoring the relative position of the wafer 8. The second positioning sensor 54 is distributed in a ring on the first robot 5.

[0052] Specifically, the first positioning sensor configures the wafer transport action along the first horizontal direction, and the configured positions include: relative limit position, relative wafer initial position, wafer center position, wafer end position, limit position, etc.;

[0053] The wafer needs to be transferred to a central position during horizontal movement. A second ring-shaped positioning sensor 54 is configured at the central position to effectively detect whether the specific relative position of the entire wafer has reached a valid arrangement position. The second positioning sensor 54 is configured as a reflective sensor.

[0054] In this embodiment, the process of the wafer 8 entering the wafer cleaning device 2 is as follows:

[0055] In step A1, the external hatch of the wafer cleaning device 2 is opened after receiving information notification. A hatch positioning sensor is provided inside the hatch to detect whether the hatch is effectively moved.

[0056] In step A2, the first manipulator 5 is moved along the first horizontal X-axis direction by the linear transmission device 51, and the first positioning sensor performs position scanning contact, including five positions: extreme position, initial position, middle position, end position, and extreme position, and then the first manipulator 5 is moved to the end position;

[0057] Step A3, fine-tuning the height of the first robot 5 according to the relative height position of the clamped wafer 8 and the difference in height between the wafer thickness and the distance between the support assembly and the temporary wafer supporting area;

[0058] Step A4: The first robot 5 is equipped with a non-contact gripper 53, which is equipped with a first air outlet, and is ready to adjust the air pressure of the first pneumatic component to perform non-contact wafer loading and unloading with the wafer cleaning platform 4 of the wafer cleaning device 2;

[0059] In step A5, the gripper 53 is ready to grip the wafer. Pure air is input into the gripper 53 for air inflating, generating air resistance flow, so that the first air outlets around the corresponding parts of the wafer 8 release air at the same time, generating an upper and lower air pressure resistance, so that the wafer 8 is lifted, and there are axial corresponding sensors to detect the relative height of the wafer, as well as a pressure detection sensor built into the first pneumatic component.

[0060] Step A6, determining the relative height position of the wafer 8 to be clamped, and fine-tuning the height difference relative to the thickness of the wafer and the height difference between the support assembly and the movable height of the second manipulator 3;

[0061] In step A7 , the second robot arm 3 clamps the wafer 8 in a non-contact manner and flips the wafer onto the wafer cleaning platform 4 .

[0062] In a preferred embodiment, the wafer transfer device 1 further includes a transfer mechanism 6, the first robot 5 is disposed on the transfer mechanism 6, and the transfer mechanism 6 is used to drive the first robot 5 to move axially in a vertical direction and / or axially in a second horizontal direction.

[0063] In a preferred embodiment, the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0064] Specifically, the first horizontal direction and the second horizontal direction in the present invention are described with respect to a single wafer transfer device, and are relative to the X-axis direction and the Y-axis direction of the single wafer transfer device, and do not specify directions in the entire system.

[0065] In a preferred embodiment, the transfer mechanism 6 includes:

[0066] Base 61;

[0067] The support frame 62 is provided on the base 61, and a vertical first slide rail is provided on the inner side wall of the support column of the support frame 62;

[0068] The support plate 63 is slidably disposed on the slide rail, and the first manipulator 5 is disposed on the support plate 63 .

[0069] In a preferred embodiment, the transfer mechanism 6 further includes a second slide rail 64 arranged along a second horizontal direction, and the base 61 is slidably disposed on the second slide rail 64 .

[0070] In a preferred embodiment, it includes multiple wafer transfer devices 1, which transfer wafers 8 on the path from an external wafer storage cabinet 92 to a wafer cleaning device 2. A wafer carrier 91 is provided between each two adjacent wafer transfer devices 1. A third air outlet connected to a third pneumatic component is provided on the supporting surface of the wafer carrier 91. The wafer 8 can be suspended on the supporting surface of the wafer carrier 91 based on the airflow ejected from the third air outlet.

[0071] Specifically, the present invention is provided with N wafer transfer devices 1, each wafer transfer device 1 includes a first robot 5 that can move axially along a first horizontal direction, a gripper 53 of the first robot 5 is provided with a first air outlet facing a set direction, the first air outlet is connected to a first pneumatic component, and a wafer 8 can be suspended on the gripper 53 of the first robot 5 based on the airflow ejected from the first air outlet;

[0072] The first manipulator 5 is provided on a transfer mechanism 6, and the transfer mechanism 6 is used to drive the first manipulator 5 to move axially in a vertical direction and / or in a second horizontal direction;

[0073] The device further includes N-1 liftable wafer carriers 91, one wafer carrier 91 being provided between each two adjacent wafer transfer devices 1, a second air outlet connected to a second pneumatic component being provided on a carrying surface of the wafer carrier 91, and a wafer 8 being suspended on the carrying surface of the wafer carrier 91 based on the airflow ejected from the second air outlet;

[0074] Wherein N is a natural number greater than 1.

[0075] Furthermore, the present invention also includes a non-contact wafer carrier 91, which can rotate and lift, and has a non-contact wafer carrying action, which can realize wafer carrying and matching the entire wafer. The first robot 5 and the wafer carrier 91 in the system control the suspension and movement of the wafer 8 through aerodynamics. The wafer carrier 91 provides a connection function between the wafer transfer device 1. The entire system aims to improve the efficiency and accuracy of wafer transfer.

[0076] In this embodiment, the wafer transfer device 1 includes a first wafer transfer device 11 located on one side of an external wafer storage cabinet 92 and a second wafer transfer device 12 located on one side of an external wafer cleaning device 2. The axial movement direction of the first robot 5 of the first wafer transfer device 11 is set toward the wafer storage cabinet 92 for deeply grasping the wafer 8, and the axial movement direction of the first robot 5 of the second wafer transfer device 12 is set toward the wafer cleaning device 2 for transferring the wafer 8 to the wafer cleaning device 2 for post-cleaning process.

[0077] Specifically, as shown in FIG8 , the present invention is exemplified by two wafer transfer devices 1, i.e., N=2, including a first wafer transfer device 11 near a wafer storage cabinet 92 and a second wafer transfer device 12 near a wafer cleaning device 2. A liftable wafer stage 91 is provided between the first wafer transfer device 11 and the second wafer transfer device 12. The specific implementation process of the system in this embodiment is as follows:

[0078] Step S1, the first wafer transfer device 11 goes to the wafer storage cabinet 92 to take out the wafer 8;

[0079] Step S2: the first wafer transfer device 11 places the taken-out wafer 8 on the wafer stage 91;

[0080] Step S3, the second wafer transfer device 12 moves to the wafer stage 91 to take out the wafer 8;

[0081] In step S4 , the second wafer transfer device 12 places the taken-out wafer 8 onto the wafer cleaning device 2 .

[0082] Specifically, step S1 includes:

[0083] Step S101: The first robot 5 is configured with a first pneumatic assembly to float and carry the wafer 8 and prepare for removal of the wafer 8;

[0084] Step S102 , using the four contact angles around the wafer 8 and the centrally located second positioning sensor 54 and the reflective sensor to perform real-time detection of the movement of the wafer 8 ;

[0085] Step S103, the first manipulator 5 performs a preparatory action for grasping according to the system information transmission;

[0086] Step S104: the first manipulator 5 performs a second horizontal Y-axis linear movement to reach a specified relative position;

[0087] Step S105: The first manipulator 5 moves in a vertical Z-axis linear motion to a specified relative position corresponding to the relative height of the gripper 53 to the wafer 8.

[0088] Step S106 , the first robot 5 fine-adjusts the relative height position of the wafer to be clamped, relative to the thickness of the wafer 8 and the height difference between the first air outlet and the wafer cabinet 92 ;

[0089] In step S107, the first robot 5 is moved along the first horizontal X-axis direction via the linear transmission device 51, and the first sensor performs position scanning contact, including five positions: extreme position, initial position, middle position, end position, and extreme position. The single-axis robot is then moved to a position relative to the end position, that is, a vertically overlapping position relative to the wafer 8 to be moved.

[0090] In step S108, the non-contact wafer gripper 53 is slightly raised in the Z-axis direction; the first robot 5 drives the vertical opening and closing mechanism built into the non-contact gripper 53 to slightly adjust the opening and closing movement, preparing to adjust the relative height difference of the wafer 8.

[0091] In step S109, the gripper 53 is ready to grip the wafer. Pure air is input into the gripper 53 for air inflating, generating air resistance flow, so that the first air outlet around the wafer 8 releases air at the same time, generating an upper and lower air pressure resistance, so that the wafer 8 is lifted, and there are axial corresponding sensors to detect the relative height of the wafer, as well as a pressure detection sensor built into the air resistance element.

[0092] In step S120 , the first robot 5 drives the vertical opening and closing mechanism built into the gripper 53 to slightly adjust the opening and closing movement, in preparation for adjusting the relative height difference of the wafer 8 ;

[0093] In step S121 , the first robot 5 drives the gripper 53 to return to the initial position.

[0094] Step S2 includes,

[0095] Step S21: The first robot 5 of the first wafer transfer device 11 moves linearly in the Y-axis direction to a designated position.

[0096] Step S22: the first manipulator 5 moves linearly in the Z-axis direction to a designated position;

[0097] In step S23, the first robot 5 receives the information and moves linearly in the X-axis direction to the end position detected by the first sensor, that is, the vertical overlapping position relative to the wafer stage 91 to be placed.

[0098] In step S24 , the first robot 5 moves linearly in the Y-axis direction to the wafer stage 91 to place the wafer 8 .

[0099] In step S3, the second wafer transfer device 12 performs the operation of taking the wafer 8, which is consistent with the operation of taking the wafer 8 performed by the first wafer transfer device 11 in step S1, and will not be repeated here; in step S4, the second wafer transfer device 12 performs the operation of placing the wafer 8, which is consistent with the early position of the operation of placing the wafer 8 performed by the first wafer transfer device 11 in step S1. After arriving at the wafer cleaning device 2, it also includes:

[0100] Step S41 , the first robot 5 of the second wafer transfer device 12 is further provided with a rotation mechanism, which rotates at a certain angle to reach a position relative to the wafer cleaning device 2 ;

[0101] Step S42: After the first robot 5 completes the relative positioning, the system immediately notifies the user of the information, opens the hatch of the cleaning device, and prepares to transport the wafer 8 to the wafer cleaning device 2 for wet processing;

[0102] In step S43, the hatch of the cleaning device is opened after the information notification, and a positioning sensor is configured inside the hatch to detect that the hatch has effectively moved;

[0103] Step S44: the first robot 5 moves in the X-axis direction to the end position relative to the first sensor, that is, the vertical overlapping position relative to the wafer to be moved.

[0104] In step S45, the non-contact wafer gripper 53 configured for the first robot 5 and the first pneumatic component configured thereon receive the sensor detection information for preparing to transfer the wafer, and prepare to adjust the air pressure of the first pneumatic component, and perform non-contact wafer carrying replacement with the wafer carrying platform or the internal flipping mechanism configured for the wafer cleaning device 2, so as to realize the transfer of the wafer 8 by the entire system.

[0105] In a preferred embodiment, the wafer cleaning device 2 further includes:

[0106] The lifting device 32 is provided on one side of the wafer cleaning platform 4, and a first driving electric cylinder is provided on the lifting device 32;

[0107] The rotating device 33 is provided on the liftable slide block of the lifting device 32 . The rotating device 33 is provided with a second driving electric cylinder. The second manipulator 3 is connected to the rotating device.

[0108] In a preferred embodiment, the thickness of the wafer 8 is 240um-260um or 90um-160um.

[0109] Preferably, the present invention can correspond to different wafer thicknesses, such as general wafer thickness of 250um (±2.5mm) or thin wafer thickness of 100~150um (±1.0~1.5mm) and other types of wafers to achieve different non-contact carrying configurations for wafer carrying, which can effectively solve the carrying use corresponding to different wafer thicknesses, and perform non-contact transfer actions for different wafer thicknesses, which requires adaptability to different thicknesses to effectively deal with the stress problem of aerodynamic floating caused by excessive spacing between the wafer and the component, and the problem of particle residue caused by the possibility of gap problems.

[0110] The above description is only a preferred embodiment of the present invention and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer non-contact transfer system suitable for wafer backside cleaning, characterized in that: include, A wafer transfer device (1), the wafer transfer device (1) comprising a first manipulator (5) capable of axial movement along a first horizontal direction, a gripper (53) of the first manipulator (5) being provided with a first air outlet facing a set direction, the first air outlet being connected to a first pneumatic component, and a wafer (8) being suspended on the gripper (53) of the first manipulator (5) based on an airflow ejected from the first air outlet; A wafer cleaning device (2) comprises a wafer cleaning platform (4) and a second reversible robot (3) arranged on one side of the wafer cleaning platform (4); the second robot (35) is provided with a second air outlet (31) connected to a second pneumatic component; the wafer (8) can be suspended and attached to the second robot (3) based on the airflow ejected from the second air outlet (31); the second robot (3) moves the wafer (8) on the first robot (5) to the wafer cleaning platform (4).

2. The wafer non-contact transfer system according to claim 1, characterized in that: The first manipulator (5) comprises: A linear transmission device (51), wherein the linear transmission device (51) is provided with a moving structure (52) capable of axial movement along the first horizontal direction; The gripper (53) is arranged on the moving structure (52), and a plurality of bearing pins are arranged on the gripper (53). The top of the bearing pins is provided with the first air outlet, and the bearing pins are connected to the first pneumatic component. The first pneumatic component generates flowing gas based on the principle of internal and external air pressure difference, and the flowing gas is ejected from the first air outlet.

3. The wafer non-contact transfer system according to claim 2, characterized in that: The first air outlet is evenly distributed with the center of the wafer (8) as an initial point at a radius distance set from the initial point, and the gripper (53) of the first robot (5) is also provided with a support component for supporting the wafer (8), and an adjustable distance is provided between the wafer (8) and the first air outlet.

4. The wafer non-contact transfer system according to claim 1, characterized in that: The first robot (5) is also provided with a first positioning sensor for monitoring the movement of the wafer (8) and a second positioning sensor (54) for monitoring the relative position of the wafer (8); the second positioning sensors (54) are distributed in a ring shape on the first robot (5).

5. The wafer non-contact transfer system according to claim 1, characterized in that: The wafer transfer device (1) further comprises a transfer mechanism (6), the first robot (5) being arranged on the transfer mechanism (6), and the transfer mechanism (6) being used to drive the first robot (5) to move axially in a vertical direction and / or to move axially in a second horizontal direction.

6. The wafer non-contact transfer system according to claim 5, characterized in that: The first horizontal direction and the second horizontal direction are perpendicular to each other.

7. The wafer non-contact transfer system according to claim 5, characterized in that: The transfer mechanism (6) comprises: Base (61); A support frame (62) is arranged on the base (61), and a vertical first slide rail is arranged on the inner side wall of the support column of the support frame (62); A support plate (63) is slidably disposed on the slide rail, and the first manipulator (5) is disposed on the support plate (63).

8. The wafer non-contact transfer system according to claim 7, characterized in that: The transfer mechanism (6) further comprises a second slide rail (64) arranged along the second horizontal direction, and the base (61) can be slidably arranged on the second slide rail (64).

9. The wafer non-contact transfer system according to claim 1, characterized in that: The wafer cleaning device (2) further comprises: A lifting device (32) is arranged on one side of the wafer cleaning platform (4), and a first driving electric cylinder is arranged on the lifting device (32); The rotating device (33) is arranged on the liftable slide block of the lifting device (32), the rotating device (33) is provided with a second driving electric cylinder, and the second manipulator (3) is connected to the rotating device.

10. The wafer non-contact transfer system according to claim 1, characterized in that: The invention comprises a plurality of the wafer transfer devices (1), which transfer the wafer (8) on a path from an external wafer storage cabinet (92) to the wafer cleaning device (2); a wafer carrier (91) is provided between each two adjacent wafer transfer devices (1); a third air outlet connected to a third pneumatic component is provided on the bearing surface of the wafer carrier (91); and the wafer (8) can be suspended on the bearing surface of the wafer carrier (2) based on the airflow ejected from the third air outlet.

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