Non-contact wafer clamp suitable for thin wafer

Abstract

A non-contact wafer clamp suitable for a thin wafer, comprising a clamp base, a first arm, a second arm and a third arm. A thin pneumatic component is provided on the first arm; an extended pneumatic component is provided on the third arm; by means of airflow, the thin pneumatic component and the extended pneumatic component form a high-pressure area in an enclosed area of the thin pneumatic component and the extended pneumatic component, the high-pressure area being used for supporting wafers. The beneficial effects are: for the problem in the prior art that the method of using grippers to clamp is prone to wafer damage, the present solution respectively provides on a wafer clamp a thin pneumatic component and an extended pneumatic component, under the cooperation of the thin pneumatic component and the extended pneumatic component, forms a high-pressure area below wafers by means of airflow, and uses a cushioning component to limit wafer movement in the horizontal direction, thus implementing effective wafer gripping processes and avoiding the problem of wafer damage caused by the clamp gripping wafers.

Description

A non-contact wafer clamp suitable for thin wafers

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 14, 2023, with application number 202311027223.2 and invention name “A non-contact wafer clamp for thin wafers”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of wafer processing equipment, and in particular to a non-contact wafer clamp suitable for thin wafers. Background Art

[0003] The wafer manufacturing and processing process often involves a series of steps such as grinding, etching, cleaning, and polishing to shape the wafer surface into a specific integrated circuit structure. To execute these various processes, wafers need to be transported between different processing equipment and placed on various processing tables.

[0004] In the existing technology, a robotic arm is usually used in conjunction with a wafer clamp to achieve the wafer clamping process. This type of technical solution is equipped with different wafer clamps according to the size and thickness of the processed wafer. The wafer can be grabbed from the top or supported from the bottom of the side of the wafer to achieve the wafer grabbing process, thereby enabling the robotic arm to transfer the wafer between different processing areas.

[0005] However, during the actual implementation process, the inventors found that the wafer clamps in the prior art usually select several clamping parts at the edge of the wafer and fix the wafer by applying pressure on the clamping parts. This leads to the problem that the wafer may crack at the edge due to pressure during the transfer process, thereby reducing the product yield.

[0006] Summary of the Invention

[0007] In view of the above problems existing in the prior art, a non-contact wafer clamp suitable for thin wafers is provided.

[0008] The specific technical solutions are as follows:

[0009] A non-contact wafer clamp suitable for thin wafers, comprising:

[0010] A fixture base, the fixture base being fixedly connected to external production equipment;

[0011] a first support arm, the first support arm being fixedly connected to the fixture base, and a thin pneumatic component being provided on an end point of the first support arm;

[0012] a second support arm, the second support arm being fixedly connected to the clamp base, the second support arm being located below the first support arm and arranged parallel to the first support arm;

[0013] A plurality of buffer components are distributed on the second arm, and the buffer components are used to limit the position of the wafer;

[0014] a third arm, the third arm being fixedly connected to the clamp base, the third arm being located below the second arm and arranged parallel to the second arm;

[0015] An extended pneumatic component is provided on the distal end of the third arm;

[0016] The upper surfaces of the thin pneumatic component and the extended pneumatic component are located on the same horizontal plane. The thin pneumatic component and the extended pneumatic component form a high-pressure area in the enclosed area of ​​the thin pneumatic component and the extended pneumatic component through airflow, and the high-pressure area is used to support the wafer.

[0017] On the other hand, the clamp base includes a fixing portion and a separating portion, and the separating portion changes its distance from the fixing portion under the push of the cylinder;

[0018] The first support arm and the second support arm are arranged on the fixing portion, and the third support arm is arranged on the separating portion;

[0019] The separation portion changes its distance from the fixing portion under the push of the cylinder, so that the wafer has a certain inclination angle relative to the horizontal position under the action of the extended pneumatic assembly and the thin pneumatic assembly, so as to separate the wafer from the non-contact wafer clamp.

[0020] On the other hand, the second arm is in the shape of a three-quarter ring when viewed from above, and an arm fixing portion is provided in the middle of the second arm, and the arm fixing portion is fixedly connected to the clamp base;

[0021] A buffer assembly is respectively provided on both sides of the support arm fixing portion;

[0022] A buffer assembly is respectively provided on the two distal end points of the second support arm.

[0023] On the other hand, the first arm is Y-shaped when viewed from above, and the first end point of the first arm is fixedly connected to the upper surface of the fixing portion;

[0024] The thin pneumatic components are respectively arranged on the second end point of the first support arm and the third end point of the first support arm;

[0025] In a top view, the thin pneumatic component is located in a region between the two buffer components on the support arm fixing portion.

[0026] On the other hand, the second arm is further provided with a first reinforcing rib;

[0027] The first reinforcing rib is X-shaped when viewed from above;

[0028] The first reinforcing rib is distributed on one side of the enclosed area of ​​the second arm close to the arm fixing portion;

[0029] The first reinforcing rib is provided with a plurality of through holes.

[0030] On the other hand, the third arm comprises:

[0031] an arm extension portion, the arm extension portion being fixedly connected to the fixture base;

[0032] a circular ring portion, wherein the middle position of the circular ring portion is connected to the support arm extension portion, and the circular ring portion is three-quarter circular in a plan view;

[0033] One of the extended pneumatic components is respectively provided on the two distal ends of the annular portion;

[0034] The distance between the extended pneumatic assembly and the clamp base is farther than the distance between the buffer assembly at the distal end of the second arm and the clamp base.

[0035] On the other hand, a second reinforcing rib is further provided on the third arm;

[0036] The second reinforcing rib is X-shaped when viewed from above;

[0037] The second reinforcing rib is distributed on one side of the enclosed area of ​​the third arm close to the arm extension portion;

[0038] The second reinforcing rib is provided with a plurality of through holes.

[0039] On the other hand, the second arm and the third arm are provided with a spacing area of ​​4.5-5.5 mm in height;

[0040] The second arm is provided with a spacing area of ​​20.5-20.9 mm in height relative to the clamping position of the wafer.

[0041] On the other hand, the first arm, the second arm and the third arm are made of carbon fiber reinforced polymer composite material.

[0042] On the other hand, the enclosed area between the buffer components is a circle with a diameter of 300.5 mm.

[0043] The above technical solution has the following advantages or beneficial effects:

[0044] In order to address the problem that the clamping method using grippers in the existing technology can easily cause damage to the wafer, this solution arranges a thin pneumatic component and an extended pneumatic component on the wafer clamp respectively. Through the cooperation of the thin pneumatic component and the extended pneumatic component, a high-pressure area is formed under the wafer through airflow, and a buffer component is used to limit the wafer in the horizontal direction, thereby realizing an effective grasping process of the wafer and avoiding the problem of damage to the wafer caused by the clamp grasping the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The embodiments of the present invention will be described more fully with reference to the accompanying drawings, which are provided for illustration and description only and are not intended to limit the scope of the present invention.

[0046] FIG1 is an overall schematic diagram of an embodiment of the present invention;

[0047] FIG2 is a schematic top view of an embodiment of the present invention;

[0048] FIG3 is a side view of an embodiment of the present invention in a closed state;

[0049] FIG4 is a side view of an embodiment of the present invention in an open state;

[0050] FIG5 is a schematic diagram of a second supporting arm in an embodiment of the present invention;

[0051] FIG6 is a schematic diagram of a third support arm in an embodiment of the present invention;

[0052] FIG7 is a schematic diagram of a buffer assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0054] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0055] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0056] The present invention comprises:

[0057] A non-contact wafer clamp suitable for thin wafers, as shown in FIG1 , comprises:

[0058] The fixture base 1 is fixedly connected to the external production equipment;

[0059] A first arm 2, the first arm 2 is fixedly connected to the fixture base 1, and a thin pneumatic component 3 is provided on the end point of the first arm 2;

[0060] The second arm 4 is fixedly connected to the clamp base 1 and is located below the first arm 2 and parallel to the first arm 2;

[0061] A plurality of buffer components 5 are distributed on the second arm 4, and the buffer components 5 are used to limit the position of the wafer;

[0062] The third arm 6 is fixedly connected to the clamp base 1 and is located below the second arm 4 and parallel to the second arm 4;

[0063] An extended pneumatic assembly 7 is provided on the distal end of the third arm 6;

[0064] The upper surfaces of the thin pneumatic component 3 and the extended pneumatic component 7 are located on the same horizontal plane. The thin pneumatic component 3 and the extended pneumatic component 7 form a high-pressure area in the enclosed area of ​​the thin pneumatic component 3 and the extended pneumatic component 7 through airflow, and the high-pressure area is used to support the wafer.

[0065] Specifically, to address the problem in the prior art that wafer clamps may cause cracks due to pressure on the wafer when in contact with the wafer, in this embodiment, a first arm 2 and a third arm 6 extending forward are respectively provided on the clamp base 1, and a thin pneumatic component 3 is provided at the end point of the first arm 2, and an extended pneumatic component 7 is provided at the end point of the third arm 6. The upper surfaces of the thin pneumatic component 3 and the extended pneumatic component 7 are located on the same horizontal plane, slightly lower than the lower surface of the wafer. By injecting a high-speed airflow into the enclosed area, a high-pressure zone with a specific pressure is formed in the area, thereby suspending the wafer and preventing it from directly contacting the clamp, thereby avoiding the problem of the wafer contacting the clamp and being damaged by pressure during the clamping process.

[0066] Furthermore, in order to address the problem that thin wafers are more easily damaged during the clamping process, in this embodiment, the clamp body is adjusted and a thin pneumatic component 3, a buffer component 5 and an extended pneumatic component 7 are respectively set up using a first arm 2, a second arm 4 and a third arm 6 arranged in parallel. Among them, the buffer component 5 is only used to limit the wafer when the wafer is displaced on the horizontal plane, and the wafer suspension is controlled only by the thin pneumatic component 3 and the extended pneumatic component 7, thereby avoiding the problem of wafer breakage caused by interference between the components and the wafer.

[0067] During implementation, as shown in Figure 2, the buffer assembly 5 is symmetrically distributed relative to the thin pneumatic assembly 3 and the extended pneumatic assembly 7. The thin pneumatic assembly 3 and the extended pneumatic assembly 7 together form an isosceles trapezoid, with the four vertices of the isosceles trapezoid distributed on the circumcircle of the wafer; the buffer assembly 5 also forms an isosceles trapezoid with larger upper and lower bases, so that the buffer assembly 5 is distributed laterally outside the isosceles trapezoid formed by the thin pneumatic assembly 3 and the extended pneumatic assembly 7.

[0068] In one embodiment, the clamp base includes a fixing portion 11 and a separating portion 12 , and the separating portion 12 changes its distance from the fixing portion 11 under the push of a cylinder;

[0069] The first arm 2 and the second arm 4 are arranged on the fixed portion, and the third arm 6 is arranged on the separating portion;

[0070] The separation portion 12 changes its distance from the fixing portion 11 under the push of the cylinder, so that the wafer has a certain inclination angle relative to the horizontal position under the action of the extended pneumatic component 7 and the thin pneumatic component 3, which is used to separate the wafer from the non-contact wafer clamp.

[0071] Specifically, to achieve a better wafer separation effect, in this embodiment, by providing a detachable fixing portion 11 and a separating portion 12 on the fixture base 1, and adjusting the positions of the first arm 2, the second arm 4, and the third arm 6, when the third arm 6 moves up and down driven by the separating portion 12, the extended pneumatic component 7 can push the wafer to a certain inclination angle, thereby detaching it from the fixture, achieving a better separation effect. Because in this process, the wafer is pushed only by the airflow blown by the pneumatic component, the problem of pressure damage to the wafer that may be caused by grasping and deflecting the wafer by the gripper in the prior art is avoided.

[0072] During implementation, when the clamp is in a closed state, as shown in FIG2 , the fixing portion 11 and the separating portion 12 are spaced apart in the side view direction, and the thin pneumatic component 3 and the extended pneumatic component 7 are located on the same horizontal line. At this time, the wafer is placed in a horizontal state.

[0073] When the clamp is in the expanded state, as shown in FIG3 , the distance between the fixing portion 11 and the separating portion 12 is shortened when viewed from the side, and the height of the extended pneumatic assembly 7 is slightly lower than that of the thin pneumatic assembly 3 . This allows the wafer to tilt at a certain angle under the support of the extended pneumatic assembly 7 after the height is lowered, thereby facilitating its release from the clamp. At this time, the wafer can be grasped or supported by an external gripper, pneumatic platform, etc., and the clamp is then moved away from the wafer in another direction. In one embodiment, to achieve a more stable release effect and prevent the wafer from falling, the tilt angle is controlled within 1 degree.

[0074] To achieve the above process, a slide rail extends from the lower surface of the fixing portion 11 on the fixture base, and the separating portion 12 slides freely on the slide rail to achieve height changes. The fixing portion 11 is fixedly connected to an external production device.

[0075] In one embodiment, when the non-contact wafer clamp is closed, the enclosed area between the buffer assembly 5 and the extended pneumatic assembly 7 is a circle with a diameter of 300 mm;

[0076] When the non-contact wafer clamp is opened, the enclosed area between the buffer assembly 5 and the extended pneumatic assembly 7 is a circle with a diameter of 312 mm.

[0077] Specifically, to achieve better wafer placement and pick-up effects, in this embodiment, for 12-inch wafers, after multiple clamping and disengagement experiments and statistics on the correct wafer placement rate, the enclosed area between the buffer assembly 5 and the extended pneumatic assembly 7 is determined to be a circle with a diameter of 300 mm when the clamp is closed, and the enclosed area between the buffer assembly 5 and the extended pneumatic assembly 7 is determined to be a circle with a diameter of 312 mm when the clamp is open, thereby achieving better pick-up and placement effects. It should be noted that when the clamp is closed, the circle corresponding to the enclosed area is on the horizontal plane; when the clamp is open, the circle corresponding to the enclosed area has a certain inclination angle relative to the horizontal plane.

[0078] In one embodiment, the first arm 2 , the second arm 4 and the third arm 6 are made of carbon fiber reinforced polymer composite material.

[0079] Specifically, in order to achieve a better clamping effect on thin wafers, in this embodiment, the first arm 2, the second arm 4 and the third arm 6 are prepared by selecting carbon fiber as an auxiliary material and resin polymer as a base material to form a composite material structure arm with a stress-reinforcing effect, thereby achieving a lighter clamp mass, structural strength, and high buckling strength. It can effectively address the key problem of stress deformation that may occur when clamping wafers with thin structures, effectively avoid problems such as excessive displacement caused by large inertia when external production equipment moves heavier traditional clamps, and reduce the risk of wafers being impacted.

[0080] In one embodiment, as shown in FIG4 , the second arm 4 is in the shape of a three-quarter ring when viewed from above, and an arm fixing portion 41 is provided in the middle of the second arm 4 , and the arm fixing portion 41 is fixedly connected to the clamp base 1 ;

[0081] A buffer assembly 5 is provided on each side of the arm fixing portion 41;

[0082] A buffer assembly 5 is also provided on each of the two distal end points of the second arm 4 .

[0083] Specifically, in order to achieve a better limiting effect on the wafer and a lower clamp mass, in this embodiment, according to the approximate size of a 12-inch wafer, the outer contour of the second arm 4 is set to a three-quarter circular ring that is slightly larger than the outer diameter of the wafer. The middle section of the three-quarter circular ring is provided with a wider arm fixing portion 41. The arm fixing portion 41 is fixedly connected to the clamp base 1, and two buffer components 5 are respectively provided on the arm fixing portion 41. Here, the buffer component 5 is located on the outside of the thin pneumatic component 3 in the top view, close to the transition between the arm fixing portion 41 and the circular portion, so as to achieve a better limiting effect. In addition, a buffer component 5 is also provided at the two distal end points of the second arm 4. Since the second arm 4 has been pre-determined to have a slightly larger circular ring structure according to the approximate size of the wafer, the buffer component 5 on the far end point is located on the outside of the wafer, and together with the two buffer components 5 on the arm fixing part 41, forms an isosceles trapezoid. The vertex of the isosceles trapezoid is located on the circumscribed circle that is co-centered with the wafer, thereby achieving a better limiting effect on the wafer in all directions.

[0084] In one embodiment, the enclosed area between the buffer components 5 is a circle with a diameter of 300.5 mm.

[0085] Specifically, in order to achieve better wafer clamping safety and avoid the problem of the buffer component 5 pressing on the wafer and causing damage to the wafer, in this embodiment, for 12-inch wafers, after multiple transmission and transfer experiments and statistics on the damage of the wafers, the enclosed area between the three buffer components 5 is determined to be a circle with a diameter of 300.5 mm, and the center of the circle is the same as the center of the wafer, so as to achieve a better buffering effect.

[0086] In one embodiment, as shown in FIG5 , a first reinforcing rib 42 is further provided on the second arm 4 ;

[0087] The first reinforcing rib 42 is X-shaped when viewed from above;

[0088] The first reinforcing rib 42 is distributed on one side of the enclosed area of ​​the second arm 4 close to the arm fixing portion 41;

[0089] The first reinforcing rib 42 is provided with a plurality of through holes.

[0090] Specifically, to achieve a lighter fixture, this embodiment further reduces the thickness of the second arm 4 and adds a first reinforcing rib 42, thereby reducing its weight while maintaining its rigidity. In this process, the X-shaped first reinforcing rib 42 effectively secures the two distal ends of the second arm 4. Furthermore, because the first reinforcing rib 42 is located only on one side of the enclosed area of ​​the second arm 4, near the arm fixing portion 41, interference with external equipment is avoided when the distal ends need to interact with the equipment. Furthermore, to further reduce weight, multiple through-holes are provided in the first reinforcing rib 42 to reduce mass.

[0091] In one embodiment, the first arm 2 is Y-shaped when viewed from above, and the first end point of the first arm 2 is fixedly connected to the upper surface of the fixing portion 11;

[0092] The thin pneumatic assembly 3 is respectively arranged on the second end point of the first arm 2 and the third end point of the first arm 2;

[0093] In a top view, the thin pneumatic component 3 is located in the area between the two buffer components 4 on the support arm fixing portion 41 .

[0094] Specifically, in order to achieve a better supporting effect on the wafer, in this embodiment, the first arm 2 is set as a Y-shaped branch and fixed to the upper surface of the fixed part 11; then, the second end point and the third end point of the Y-shaped branch extend from the fixed part 11 to the top of the second arm 4, and a thin pneumatic component 3 is set, thereby achieving effective support for the wafer on the side away from the clamp base 1.

[0095] In one embodiment, as shown in FIG6 , the third arm 6 includes:

[0096] The support arm extension portion 61 is fixedly connected to the clamp base 1;

[0097] The annular portion 62, the middle position of the annular portion 62 is connected to the support arm extension portion 61, and the annular portion 62 is three-quarters of a circle in a plan view;

[0098] An extended pneumatic assembly 7 is provided at each of the two distal ends of the annular portion 62;

[0099] The distance between the extended pneumatic assembly 7 and the clamp base 1 is farther than the distance between the buffer assembly 5 at the distal end of the second arm 4 and the clamp base.

[0100] Specifically, in order to achieve a better support effect for the wafer, in this embodiment, after determining the outline of the second arm 4, the third arm 6 is further configured as a slightly smaller three-quarter circular ring, and an extended pneumatic component 7 is arranged to cooperate with the thin pneumatic component 3 to achieve effective support for the wafer. Specifically, the third arm 6 includes an arm extension 61, which is rectangular in a top view and is used to control the distance of the circular ring portion 62 relative to the clamp base 1; the circular ring portion 62 is a three-quarter circular ring with a smaller diameter than the second arm 4, and an extended pneumatic component 7 is respectively provided at its distal end. The distance between the extended pneumatic component 7 and the clamp base 1 is farther than the distance between the buffer component 5 at the distal end of the second arm 4 and the clamp base, thereby achieving a better support effect for the distal portion of the wafer.

[0101] In one embodiment, as shown in FIG6 , a second reinforcing rib 63 is further provided on the third arm 6 ;

[0102] The second reinforcing rib 63 is X-shaped when viewed from above;

[0103] The second reinforcing rib 63 is distributed on one side of the enclosed area of ​​the third arm 6 close to the arm extension portion 61;

[0104] The second reinforcing rib 63 is provided with a plurality of through holes.

[0105] Specifically, to achieve a lighter fixture, this embodiment further reduces the thickness of the third arm 6 and adds a second reinforcing rib 63, thereby reducing its weight while maintaining its rigidity. In this process, the X-shaped second reinforcing rib 63 effectively secures the two distal ends of the third arm 6. Furthermore, because the second reinforcing rib 63 is located only on one side of the enclosed area of ​​the third arm 6, near the arm extension 61, interference with external equipment is avoided when the distal end requires interaction. Furthermore, to further reduce weight, multiple through-holes are provided in the second reinforcing rib 63 to reduce mass.

[0106] In one embodiment, the second arm 4 and the third arm 6 are provided with a spacing area of ​​4.5-5.5 mm in height, preferably 5 mm;

[0107] The second arm 4 is provided with a spacing area of ​​20.5-20.9 mm in height relative to the clamping position of the wafer, preferably 20.7 mm.

[0108] In one embodiment, as shown in FIG7 , the buffer assembly 5 includes:

[0109] The support base 51 is cylindrical and is perpendicular to the third arm 6;

[0110] A buffer spring 52 is disposed inside the support base 51 , and a first end of the buffer spring 52 is fixedly connected to the support base 51 ;

[0111] The buffer seat 53 is arranged above the support base 51 and includes:

[0112] A first truncated platform 531, the lower surface of which is fixedly connected to the buffer spring 52;

[0113] a buffer column 532 , wherein a first end of the buffer column 532 is disposed on an upper surface of the first truncated platform 531 ;

[0114] A second truncated platform 533, the lower surface of which is fixedly connected to the second end of the buffer column 532;

[0115] The conical surfaces of the first truncated cone 531 and the second truncated cone 533 face each other.

[0116] Specifically, in order to achieve a better blocking effect on the wafer, in this embodiment, the buffer component 5 is improved and the buffer component is configured to be connected to the buffer seat by arranging a buffer spring 52 in the support base 51, so that when the buffer seat 53 contacts the wafer, it can generate a certain distance of displacement in the horizontal direction relative to the support base 51, and the buffer spring 52 generates a certain damping to block the wafer, thereby avoiding the problem of wafer breakage caused by rigid contact with the wafer.

[0117] Furthermore, in order to achieve a better limiting effect on the wafer, in this embodiment, the shape of the buffer seat 53 is further adjusted. Specifically, the buffer seat 53 is composed of a first truncated cone 531, a buffer column 532 and a second truncated cone 533. Among them, the buffer column 532 is a column with a certain length, and its coverage range corresponds to the approximate position of the wafer under normal suspension; the positions corresponding to the first truncated cone 531 and the second truncated cone 533 are lower and higher relative to the normal suspension height of the wafer, and their conical surfaces point to the normal suspension height of the wafer. The above settings are used to achieve a better limiting effect on the wafer under different circumstances. For example, when the wafer is at a normal suspension height, if it is displaced in the horizontal direction, it will need to move a relatively long distance before interfering with the buffer column 532; when the suspension height of the wafer is lower than the normal suspension height, if it is displaced in the horizontal direction, it will interfere with the conical surface of the first truncated table 531 after moving a slightly shorter distance, and as the suspension height of the wafer gradually decreases and the degree of deviation from the normal suspension height increases, the distance will gradually shorten. Similarly, when the suspension height of the wafer is higher than the normal suspension height, as the degree of deviation from the normal suspension height increases, the distance at which the wafer interferes with the second truncated table 533 when it is horizontally displaced will also gradually shorten. The above-mentioned settings can achieve a better constraint effect on the displacement of the wafer under different working conditions, reducing the risk of the wafer accidentally detaching from the fixture.

[0118] The above are only preferred embodiments of the present invention and do not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A non-contact wafer clamp suitable for thin wafers, characterized in that: include: A fixture base, wherein the fixture base is fixedly connected to an external production device; A first support arm, wherein the first support arm is fixedly connected to the fixture base, and a thin pneumatic component is disposed on an end point of the first support arm; A second support arm, wherein the second support arm is fixedly connected to the clamp base, and the second support arm is located below the first support arm and is arranged parallel to the first support arm; A plurality of buffer components are distributed on the second arm, and the buffer components are used to limit the position of the wafer; A third arm, the third arm is fixedly connected to the clamp base, the third arm is located below the second arm and is arranged parallel to the second arm; An extended pneumatic component is provided on the distal end of the third arm; The upper surfaces of the thin pneumatic component and the extended pneumatic component are located on the same horizontal plane, and the thin pneumatic component and the extended pneumatic component form a high-pressure area in the enclosed area of ​​the thin pneumatic component and the extended pneumatic component through airflow, and the high-pressure area is used to support the wafer.

2. The non-contact wafer clamp according to claim 1, characterized in that: The clamp base includes a fixing portion and a separation portion, and the separation portion changes its distance from the fixing portion under the push of the cylinder; The first support arm and the second support arm are arranged on the fixing portion, and the third support arm is arranged on the separating portion; The separation part changes the distance from the fixing part under the push of the cylinder, so that the wafer has a certain inclination angle relative to the horizontal position under the action of the extended pneumatic component and the thin pneumatic component, so as to separate the wafer from the non-contact wafer clamp.

3. The non-contact wafer clamp according to claim 1, characterized in that: The second support arm is in the shape of a three-quarter ring when viewed from above, and a support arm fixing portion is provided in the middle of the second support arm, and the support arm fixing portion is fixedly connected to the clamp base; One of the buffer components is respectively disposed on both sides of the support arm fixing portion; A buffer assembly is also respectively disposed on two distal end points of the second support arm.

4. The non-contact wafer clamp according to claim 3, characterized in that: The first support arm is Y-shaped in a top view, and a first end point of the first support arm is fixedly connected to an upper surface of the fixing portion; The thin pneumatic components are respectively arranged on the second end point of the first support arm and the third end point of the first support arm; In a top view, the thin pneumatic component is located in a region between the two buffer components on the support arm fixing portion.

5. The non-contact wafer clamp according to claim 3, characterized in that: The second arm is also provided with a first reinforcing rib; The first reinforcing rib is X-shaped in a top view direction; The first reinforcing rib is distributed on one side of the enclosed area of ​​the second support arm close to the support arm fixing portion; The first reinforcing rib is provided with a plurality of through holes.

6. The non-contact wafer clamp according to claim 1, characterized in that: The third arm comprises: An arm extension portion, the arm extension portion being fixedly connected to the fixture base; A circular ring portion, the middle position of which is connected to the arm extension portion, and the circular ring portion is three-quarters circular in a top view; One of the extended pneumatic components is respectively disposed on two distal ends of the annular portion; The distance between the extended pneumatic assembly and the clamp base is farther than the distance between the buffer assembly at the distal end of the second arm and the clamp base.

7. The non-contact wafer clamp according to claim 6, characterized in that: The third arm is also provided with a second reinforcing rib; The second reinforcing rib is X-shaped in a top view; The second reinforcing rib is distributed on one side of the enclosed area of ​​the third arm close to the arm extension portion; The second reinforcing rib is provided with a plurality of through holes.

8. The non-contact wafer clamp according to claim 1, characterized in that: The second arm and the third arm are provided with a spacing area of ​​4.5-5.5 mm in height; The second arm is provided with a spacing area of ​​20.5-20.9 mm in height relative to the clamping position of the wafer.

9. The non-contact wafer clamp according to claim 1, characterized in that: The first arm, the second arm and the third arm are made of carbon fiber reinforced polymer composite material.

10. The non-contact wafer clamp according to claim 1, characterized in that: The enclosed area between the buffer components is a circle with a diameter of 300.5 mm.

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