Laser irradiation device having hybrid pulse scanner and method for processing microholes in vacuum plate by using same

Abstract

The present invention relates to a laser irradiation device having a hybrid pulse scanner for processing super-microholes having improved roundness, cylindricity, and inner-surface roughness in a vacuum plate. The laser irradiation device having a hybrid pulse scanner comprises: a laser oscillator for emitting a femtosecond laser and a nanosecond laser; an optic portion for converting the path of a laser beam; and a hybrid pulse scanner for adjusting the size of the incident angle of a laser beam in real time by using (5 +1) axes, and motion-controlling the adjusted irradiation angle of the laser beam in 5-axis directions, thereby processing microholes. The method for processing microholes in a vacuum plate comprises: a step (S10) of simultaneously or selectively emitting a nanosecond laser and a femtosecond laser at a location at which a microhole is to be processed, thereby aging same; a step (S20) of emitting a femtosecond laser at the aged location, thereby processing a preliminary microhole; a step (S30) of boring a microhole in the processed preliminary microhole while controlling the irradiation angle of the nanosecond laser beam through (5 +1) axis motion control; and a step (S40) of deburring the inner surface while emitting the nanosecond laser beam through (5 +1) axis motion control.

Description

Laser irradiation device equipped with a hybrid pulse scanner and method for processing microholes in a vacuum plate using the same

[0001] The present invention relates to a laser irradiation device equipped with a hybrid pulse scanner for processing ultra-fine micro holes with improved circularity, cylindricality and inner roughness in a vacuum plate used when transporting or stacking a thin film sheet using a single laser irradiation device, and a method for processing micro holes in a vacuum plate using the same.

[0002] In general, a vacuum plate is used for the purpose of adsorbing and transporting thin film ceramic sheets, thin film metal sheets, thin film coating films, etc., and sequentially stacking them in precise positions.

[0003] This vacuum plate has thousands to hundreds of thousands of ultra-fine microholes that can be formed to adsorb thin film sheets or release the thin film sheets by a blower. This is applied to the lamination process for manufacturing laminated electronic components such as laminated ceramic capacitors, laminated ceramic varistors, and laminated ceramic actuators, as well as the lamination process for manufacturing laminated batteries used in various electronic devices including electric vehicles.

[0004] Looking at the process of stacking thin film sheets, the thin film sheets supplied from the take-up roll first move along the conveyor and are cut to a set size when they reach a set location.

[0005] On the upper side of the conveyor, a vacuum plate is installed that can move along a rail. The vacuum plate comes into contact with the surface of the cut thin film sheet through a downward motion, and sucks the thin film sheet through vacuum pressure, and moves the sucked thin film sheet to a lower mold placed on one side.

[0006] The vacuum plate is lowered from above the lower mold (laminated plate mold). When the thin film sheet comes into contact with the lower mold, the vacuum pressure is released to place the thin film sheet on the lower mold, thereby forming a laminate. This process is repeated until the set number of thin film sheets is reached.

[0007] The vacuum plate has thousands to hundreds of thousands of ultra-fine microholes formed for adsorption and separation.

[0008] There are two methods for processing microholes formed in a vacuum plate: a mechanical method using a drilling machine and a method using chemical etching. However, since both methods have poor surface roughness and large variations in hole diameter, most ultra-fine microholes of less than 150㎛ are processed using a laser.

[0009] Specific methods for processing microholes using a laser include single pulse drilling, repetitive pulse drilling, trepanning drilling, and helical drilling, but the trepanning drilling method is the most widely used.

[0010] The trepanning drilling method is a hole processing method that irradiates a laser beam to the center of the microhole to be processed to penetrate it, and then rotates the lower stage to the diameter of the desired hole.

[0011] However, the processing method using the laser as above has the following problems.

[0012] First, since the above laser processing is a thermal processing that proceeds by melting the material, molten protrusions and fragmented particles are generated around the hole, and a secondary grinding process such as ELID (ELectrolytic In-process Dressing) must be performed to remove them. However, because the microholes are so small, nano-sized fine particles remain on the rough surface inside the hole even after the grinding process, and the hole may be blocked by repeated suction, or the thin film sheet may be pressed or torn as the fine particles are discharged between the thin film sheets on which they are stacked.

[0013] Second, a post-process (deburring) must be performed using a dedicated, separately prepared device to remove burrs inside the processed microhole and obtain a clear roughness inside.

[0014] Third, the conventional laser method as above cannot control the incident angle (spot) of the irradiated laser beam in real time, and especially, since it is irradiated only at the initially set incident angle, there is a limit to the irradiation angle of the beam compared to the incident angle of the laser beam, so the maximum aspect ratio of the micro hole processed in the current vacuum plate is 1:10. If the diameter of the laser beam is set small from the beginning and processed, processing is possible with an aspect ratio of 1:10 or higher, but conversely, there is a problem that the quality of the inner surface of the processed hole is not secured.

[0015] The present invention has been devised to solve the above problems and technical biases, and the purpose of the present invention is to provide a laser irradiation device equipped with a hybrid pulse scanner that does not require a post-process using a separate dedicated device to remove burrs existing around and inside a processed microhole through a single dedicated device that controls the incident angle (spot) of the irradiated laser beam in real time, and a microhole processing method of a vacuum plate using the same.

[0016] In order to achieve the above object, the present invention provides a laser irradiation device equipped with a hybrid pulse scanner, comprising: a laser oscillation unit that simultaneously or selectively emits femtosecond laser beams and nanosecond laser beams; an optical unit equipped with a first reflector and a second reflector that change the path of a laser beam incident from the laser oscillation unit; and a hybrid pulse scanner that adjusts the incident angle size of the laser beam incident from the optical unit in real time using 5+1 axes (X, Y, Xθ, Yθ, Z + Z-WD), and controls the irradiation angle of the adjusted laser beam in the 5-axis (X, Y, Xθ, Yθ, Z) direction while aging a position where a microhole is to be processed, processing a preliminary microhole at the aged position, drilling the processed preliminary microhole, and deburring the inner surface of the drilled microhole.

[0017] Here, the hybrid pulse scanner is preferably provided with: an incident angle adjustment module that adjusts the incident angle size of the incident laser beam as a Z-WD (Z-Working Distance) to expand or narrow the available range (WD); a focusing module that moves the incident angle position of the laser beam that has passed through the incident angle adjustment module in the Z-axis direction as a 5-axis; a galvanometer scanner composed of an X-axis galvanometer, a Y-axis galvanometer, an Xθ-axis galvanometer, and a Yθ-axis galvanometer so that the laser beam that has passed through the focusing module can be selectively irradiated in a 2D or 3D shape; a beam reflector that reflects the laser beam that has passed through the galvanometer scanner in the Z-axis direction; and a lens that is disposed below the beam reflector and focuses the incident angle of the reflected laser beam to a position where a microhole is processed.

[0018] At this time, it is preferable to age the position where the microhole is to be processed by irradiating the nanosecond laser beam, selectively irradiate the femtosecond laser beam in a 2D shape and a 3D shape to the aged position, and process a preliminary microhole, and to drill a microhole while selectively irradiating the nanosecond laser beam in a 2D shape and a 3D shape through the 5+1 axis motion control while controlling the irradiation angle of the nanosecond laser beam to the processed preliminary microhole, and to deburr the inner surface while irradiating the inner surface of the processed microhole in a 3D shape along the irradiation angle of the nanosecond laser beam through the 5+1 axis motion control.

[0019] In addition, it is preferable that the femtosecond laser and nanosecond laser to be investigated for the preliminary microhole processing and microhole drilling have a 2D spiral shape and a 3D helical shape, respectively, through X,Y motion combination or X,Y,Z motion combination control among the 5 axes of the hybrid pulse scanner.

[0020] Meanwhile, the incident angle adjustment module adjusts the incident angle size of the laser beam in real time by adjusting the spacing between a pair of concave lenses, and it is preferable to narrow the incident angle by widening the diameter of the femtosecond laser beam so that the available range of the laser beam can be narrowed and focused processing can be performed when machining a preliminary micro-hole, and to narrow the diameter of the nanosecond laser beam so that the available range of the laser beam can be widened and the molten pool method of melting the processing area can be performed when drilling a micro-hole in a preliminary micro-hole.

[0021] A method for processing microholes in a vacuum plate using a laser irradiation device includes a step (S10) of aging by simultaneously or selectively irradiating a nanosecond laser and a femtosecond laser to a position where a microhole in the vacuum plate is to be processed; a step (S20) of processing a preliminary microhole while irradiating a femtosecond laser beam to the aged position in a 2D shape and a 3D shape; a step (S30) of drilling a microhole while selectively irradiating the nanosecond laser beam in a 2D shape and a 3D shape while controlling the irradiation angle of the nanosecond laser beam through 5+1 axes (X, Y, Xθ. Yθ, Z + Z-WD) motion control to the processed preliminary microhole; and a step (S40) of deburring the inner surface while irradiating the nanosecond laser beam along the inner surface of the microhole in a 3D shape through the 5+1 axes (X, Y, Xθ. Yθ, Z + Z-WD) motion control.

[0022] And, in the above step S20, it is preferable that the irradiation of the femtosecond laser beam is performed by widening the diameter of the beam and narrowing the incident angle so that focused processing can be performed while narrowing the available range.

[0023] At this time, in the step S20, it is preferable that the femtosecond laser pulse length is 100 fs to 10,000 fs (10 ps).

[0024] In addition, in the above step S30, it is preferable to narrow the diameter of the nanosecond laser beam so that the preliminary micro-hole can be perforated in a molten pool manner by controlling the irradiation angle of the nanosecond laser beam and expanding the available range of the incident angle to melt the processing area.

[0025] In addition, in the above step S40, it is preferable to control the irradiation angle of the beam so that only the widened incident angle can be focused on the inner surface of the microhole by narrowing the diameter of the nanosecond laser beam and widening the incident angle according to the control of the incident angle adjustment module, which is the Z-WD axis, and to deburr in a helical shape, which is a 3D shape, along the inner surface of the microhole.

[0026] At this time, in the step S30, it is preferable that the nanosecond laser pulse length is 1 ns to 200 ns.

[0027] Lastly, it is preferable that the femtosecond laser and nanosecond laser, which are respectively investigated in the above steps S20 and S30, are repeatedly irradiated in a 2D spiral shape and a 3D helical shape, respectively, through X,Y motion combination or X,Y,Z motion combination control among the 5 axes of the hybrid pulse scanner.

[0028] According to the laser irradiation device equipped with the hybrid pulse scanner of the present invention having the above configuration and the micro-hole processing method of the vacuum plate using the same,

[0029] By controlling the incident angle (spot) of the beam in real time along with the 5-axis motion control of the laser beam while simultaneously or selectively irradiating femtosecond laser and nanosecond laser through a single dedicated device, the aspect ratio of the microhole can be processed deeper than 1:10, and deburring can be performed immediately after drilling the microhole, thereby ensuring precise, high-quality roundness and cylindricality of the microhole in the vacuum plate, which has an excellent effect of improving the quality of the vacuum plate.

[0030] In addition, since a femtosecond laser beam is irradiated to process a microhole to process a preliminary microhole, there is an effect of not forming a burr around the hole.

[0031] In addition, since the machining area is aged in a single dedicated device, a femtosecond laser beam and a nanosecond laser beam are sequentially and continuously irradiated to form and perforate preliminary micro holes, and the inner surface of the perforated hole is immediately deburred, the machining time is shortened, and above all, there is the effect of not needing a separate post-process for burr removal and deburring as in the past.

[0032] Figure 1 is a schematic drawing showing a laser irradiation device according to the present invention.

[0033] Figure 2 is a drawing showing a hybrid pulse scanner among the configurations of a laser irradiation device according to the present invention.

[0034] Figure 3 is a schematic diagram showing the structure of a hybrid pulse scanner.

[0035] Figure 4 is a schematic diagram showing the process of perforating a microhole by a laser beam.

[0036] Figure 5 is a schematic diagram showing the process of deburring the inner surface of a microhole perforated by a laser beam.

[0037] Figure 6 is a process diagram showing the process of processing a microhole using a laser irradiation device according to the present invention.

[0038] Figure 7 is a flowchart showing the process of processing microholes.

[0039] As shown in FIGS. 1 to 7, a laser irradiation device (100) equipped with a hybrid pulse scanner (30) of the present invention comprises: a laser oscillation unit (10) that simultaneously or selectively emits femtosecond laser (11) and nanosecond laser (12) beams; an optical unit (20) equipped with a first reflector (21) and a second reflector (22) that convert the path of a laser beam (B) incident from the laser oscillation unit (10); And it includes a hybrid pulse scanner (30) that adjusts the incident angle size of the laser beam (B) incident from the optical unit (20) in real time using 5+1 axes (X, Y, Xθ. Yθ, Z + Z-WD), and controls the irradiation angle of the adjusted laser beam (B) in the 5-axis (X, Y, Xθ, Yθ, Z) direction while aging a position where a micro hole (H2) is to be processed, processing a preliminary micro hole (H1) at the aged position, perforating the processed preliminary micro hole (H1), and deburring the inner surface of the perforated micro hole (H2).

[0040] Before the explanation, the characteristic of the laser irradiation device (100) of the present invention is that it can control the 5-axis motion of the irradiated laser beam (B) and the incident angle of the laser beam (B) in real time using a single dedicated device, thereby enabling the aspect ratio of the initial hole to be 1:10 or more when machining a micro hole (H2) while increasing the surface roughness around the machining hole and simultaneously enabling machining and deburring to be implemented through a single process.

[0041] In addition, it goes without saying that the motion of the laser beam (B) and the respective drives of the laser oscillation unit (10), optical unit (20), and hybrid pulse scanner (30) of the laser irradiation device (100) are controlled by a controller not shown.

[0042] The laser irradiation device (100) processes thousands to hundreds of thousands of ultra-fine microholes (H2) on the surface of a vacuum plate (P) that adsorbs and laminates thin film ceramic sheets, thin film metal sheets, thin film coating films, etc. for the production of MLCC, for the purpose of adsorbing and separating the sheets.

[0043] As shown in Fig. 1, the laser oscillation unit (10) emits two lasers (nanosecond laser and femtosecond laser) simultaneously or selectively to the target (microhole (H2)) of the vacuum plate (P), and a femtosecond laser (11) and a nanosecond laser (12) are respectively arranged inside.

[0044] At this time, the femtosecond laser (11) in the present embodiment preferably has a pulse length in the range of 100 fs to 10,000 fs (10 ps) so as to cause physical detachment while minimizing thermal deformation on the aged vacuum plate (P) target surface, and the nanosecond laser (12) preferably has a pulse length in the range of 1 ns to 200 ns so as to age the position where the microhole (H2) is to be processed or melt the microhole (H2) to be processed in a molten pool manner by raising or lowering the energy focus according to the adjustment of the incident angle of the laser beam (B) irradiated in the process of processing the microhole (H2) described later.

[0045] Accordingly, the laser oscillation unit (10) adjusts the incident angle of the selected femtosecond laser (11) or nanosecond laser (12) beam in real time according to the aging, perforation, and deburring stages when machining a microhole (H2) in the vacuum plate (P).

[0046] The optical unit (20) changes the path of the laser beam (B) so that the laser beam (B) selected and incident from the laser oscillation unit (10) can be changed in the direction of the hybrid pulse scanner (30) described later.

[0047] As shown in Fig. 1, at least two first and second reflectors (21, 22) may be provided inside the optical section (20), and the incident laser beam (B) is changed in a perpendicular direction through the first reflector (21) and the second reflector (22) and is emitted to the hybrid pulse scanner (30) described later.

[0048] Here, the first reflector (21) and the second reflector (22) are positioned to reflect the beams of the femtosecond laser (11) and the nanosecond laser (12), respectively.

[0049] At this time, it is preferable that the second reflector (22) that emits the laser beam (B) as a hybrid pulse scanner (30) in the drawing be a combine mirror so that the femtosecond laser (11) and the nanosecond laser (12) can be simultaneously emitted or selectively emitted.

[0050] The combine mirror is designed to transmit and reflect a laser beam (B) simultaneously. One side is coated with metal to a thickness of half the wavelength of the laser beam (B) to transmit it, and the other side is coated with metal to a thickness of 1 / 4 the wavelength of the laser beam (B) to reflect it.

[0051] Accordingly, as shown in the drawing, the femtosecond laser (11) passes through the first reflector (21) and is reflected by the second reflector (22) and is emitted to the hybrid pulse scanner (30), and the nanosecond laser (12) passes through the second reflector (22) and is emitted to the hybrid pulse scanner (30).

[0052] That is, the optical unit (20) can simultaneously or selectively emit femtosecond laser (11) and nanosecond laser (12).

[0053] In this embodiment, the beams of the femtosecond laser (11) and the nanosecond laser (12) are shown to be emitted through the second reflector (22), but it is obvious that the position of the second reflector (22) can be changed depending on the beam emission position.

[0054] The hybrid pulse scanner (30) irradiates the laser beam (B) incident from the optical section (20) to the vacuum plate (P) for processing a micro hole (H2), and adjusts the size of the incident angle (spot) of the incident laser beam (B) in real time using 5+1 axes (X, Y, Xθ. Yθ, Z + Z-WD), and improves the precision of processing while controlling the irradiation angle of the adjusted laser beam (B) in the 5-axis (X-axis, Y-axis, Xθ-axis, Yθ-axis, Z-axis) direction, thereby processing a micro hole (H2) with secured circularity and cylindricality.

[0055] The hybrid pulse scanner (30) comprises, as illustrated in FIG. 2, an incident angle adjustment module (40) that adjusts the size of the incident angle (spot) by adjusting the diameter of the laser beam (B) incident from the optical unit (20) as a Z-WD (Z-Working Distance) to expand or narrow the available range (Working Distance) of the laser beam (B); a focusing module (51) that is arranged in the same line as the incident angle adjustment module (40) as a 5-axis and moves the incident angle (spot) position of the laser beam (B) whose incident angle has been adjusted by the incident angle adjustment module (40) in the Z-axis direction in the drawing; and a galvanometer scanner (50) that is composed of an X-axis galvanometer (52), a Y-axis galvanometer (53), an Xθ-axis galvanometer (54), and a Yθ-axis galvanometer (55) so that the laser beam (B) passing through the focusing module (51) can be selectively irradiated in a 2D or 3D shape; It may be composed of a beam reflector (60) that reflects the direction of the laser beam (B) that has passed through the galvanometer scanner (50) in the Z-axis direction; and a lens (70) that is placed below the beam reflector (60) and focuses the incident angle of the reflected laser beam (B) to a position where a microhole (H2) is processed.

[0056] In addition, a folding mirror (80) is provided on one side of the incident angle adjustment module (40) to change the path of the laser beam (B) incident from the optical unit (20) so that it can be directed toward the incident angle adjustment module (40).

[0057] The incident angle adjustment module (40) adjusts the incident angle size of the beam in real time by adjusting the spacing between a pair of concave lenses (41, 42) of different sizes along the Z-WD (Z-Working Distance) axis, as shown in FIG. 3.

[0058] That is, the diameter of the laser beam (B) is adjusted by moving one concave lens (41, 42) or each concave lens (41, 42) until the set incidence angle of the laser beam (B) is formed.

[0059] This incident angle control module (40) controls the incident angle size of each laser beam (B) so that the available range of the laser beam (B) can be narrowed and the incident angle (spot) can be narrowed when processing a preliminary micro-hole (H1) that is first processed for processing a micro-hole (H2) so that focused processing can be performed, and the incident angle size of each laser beam (B) is controlled so that the available range of the laser beam (B) can be narrowed and the incident angle directed in the Z-axis can be widened so that a molten pool method that melts the processing area can be performed when drilling a micro-hole (H2) in the preliminary micro-hole (H1).

[0060] In addition, when deburring the inside of a perforated microhole (H2), the incident angle of the nanosecond laser (12) beam is focused on the inside by 5-axis motion control, thereby widening the incident angle of the nanosecond laser (12) beam to increase the processing area, thereby enabling the burr to be removed along with the surface roughness of the inside of the hole.

[0061] For reference, the angle of incidence of the laser beam (B) is adjusted so that as the diameter of the laser beam (B) decreases, the angle of incidence widens and the energy concentration area increases, so the focusing speed decreases, and conversely, as the diameter of the laser beam (B) increases, the angle of incidence narrows and the energy concentration area decreases, so the focusing speed increases.

[0062] Therefore, in order to improve the machinability of the microhole (H2), the diameter of the beam must be increased, and conversely, in order to improve the smooth machinability of the inside of the hole, the diameter of the beam must be decreased.

[0063] As shown in Fig. 2, the galvanometer scanner (50) is a 5-axis scanner, and the laser beam (B) irradiated for processing a micro hole (H2) passes through a focusing module (51), an X-axis galvanometer (52), a Y-axis galvanometer (53), an Xθ-axis galvanometer (54), and a Yθ-axis galvanometer (55), thereby allowing the laser beam to be irradiated in a 2D shape (spiral), a 3D shape (helical), and the X, Yθ axes.

[0064] Here, the galvanometer of each axis is a technology commonly applied in the field of optics, so a detailed description will be omitted.

[0065] The hybrid pulse scanner (30) as above, when machining a micro hole (H2) in a vacuum plate (P) through 5+1 axes, ages the position where the micro hole (H2) is to be machined to a predetermined temperature, machines a preliminary micro hole (H1) in the aged position, perforates the machined preliminary micro hole (H1) to form a micro hole (H2), and adjusts the incidence angle of each laser beam (B) irradiated through the incidence angle adjustment module (40) in real time so that the inner surface of the perforated micro hole (H2) can be deburred.

[0066] The location where the microhole (H2) is to be processed is aged by irradiation with a nanosecond laser (12) beam.

[0067] And, the preliminary microhole (H1) is processed by selectively irradiating the aged location with a femtosecond laser (11) beam in a 2D shape and a 3D shape.

[0068] And, by controlling the irradiation angle of the nanosecond laser (12) beam through the 5+1 axis motion control in the processed preliminary microhole (H1), a microhole (H2) having a set depth is drilled by selectively irradiating it in a 2D shape and a 3D shape. At this time, the irradiation angle of the nanosecond laser (12) beam irradiated is controlled according to the depth of the microhole (H2). This is to control the irradiation angle so that the laser beam (B) processing the microhole (H2) does not interfere with the entrance of the microhole (H2), as shown in Fig. 4, so that the inner surface of the microhole (H2) can be processed vertically.

[0069] If it is desired to drill a deeper microhole (H2), this can be done by adjusting the diameter of the laser beam (B) to be smaller. In this case, the larger the aspect ratio of the microhole (H2), the more numerous the laser beam (B) is reflected inside the hole being processed, which also has the effect of shortening the processing time.

[0070] Meanwhile, the femtosecond laser (11) and nanosecond laser (12) being irradiated for the above preliminary microhole (H1) processing and microhole (H2) drilling are controlled through the X,Y motion combination or X,Y,Z motion combination control among the 5 axes of the hybrid pulse scanner (30), and are in the form of a 2D spiral shape and a 3D helical shape, respectively, and more specifically, this is achieved through the motion combination of the X-axis galvanometer (52) and the Y-axis galvanometer (53) of the galvanometer scanner (50) and the focusing module (51) that moves the incident angle position of the laser beam (B) in the Z-axis direction.

[0071] And, the inner surface of the perforated microhole (H2) is deburred by irradiating the inner surface of the microhole (H2) processed into a 3D shape along the irradiation angle control of the nanosecond laser (12) beam through the 5+1 axis motion control of the hybrid pulse scanner (30).

[0072] At this time, the nanosecond laser (12) being investigated is irradiated in a helical shape, which is a 3D shape, through a motion combination of the X-axis galvanometer (52) and the Y-axis galvanometer (53), which are 5+1 axes as described above, and the focusing module (51) that moves the incident angle position of the laser beam (B) in the Z-axis direction, and the irradiation angle is an angle having a slope such that only the incident angle (spot) of the laser beam (B) can be focused on the inside of the microhole (H2), as shown in FIG. 5.

[0073] Meanwhile, the irradiation angle of the laser beam (B) controlled during drilling and deburring in the microhole (H2) processing is controlled so that the axis of the laser beam (B) is tilted so that only the incident angle of the irradiated laser beam (B) can be focused on the inside of the microhole (H2).

[0074]

[0075] Hereinafter, with reference to the attached drawings, a process for processing a micro hole (H2) in a vacuum plate (P) using a laser irradiation device (100) equipped with a hybrid pulse scanner (30) according to the present invention will be described.

[0076] A method for processing a microhole (H2) using a laser irradiation device (100) comprises: a step (S10) of aging the vacuum plate (P) by irradiating the microhole (H2) at the position where the vacuum plate (P) is to be processed with a nanosecond laser (12) and a femtosecond laser (11) simultaneously or selectively; a step (S20) of processing a preliminary microhole (H1) while irradiating the aged position with a femtosecond laser (11) beam in a 2D shape and a 3D shape; a step (S30) of drilling a microhole (H2) while selectively irradiating the processed preliminary microhole (H1) with a nanosecond laser (12) beam in a 2D shape and a 3D shape while controlling the irradiation angle through a 5+1 axis (X, Y, Xθ. Yθ, Z + Z-WD) motion control; And it includes a step (S40) of deburring the inner surface while irradiating the nanosecond laser (12) beam along the inner surface of the microhole (H2) in a 3D shape through the above 5+1 axis (X, Y, Xθ. Yθ, Z + Z-WD) motion control.

[0077] First, the vacuum plate (P) to be processed is placed on a stage not shown.

[0078] This stage can move in the X and Y axes.

[0079] Then, the hybrid pulse scanner (30) is lowered to the height set above the three-piece mold.

[0080] The step (S10) of aging by simultaneously or selectively irradiating a nanosecond laser (12) and a femtosecond laser (11) to the position where the microhole (H2) of the vacuum plate (P) is to be processed is to age the position where the microhole (H2) placed on the stage is to be processed.

[0081] In this step, the nanosecond laser (12) and the femtosecond laser (11) can be irradiated simultaneously or selectively, but it will be described as being irradiated simultaneously.

[0082] First, a nanosecond laser (12) and a femtosecond laser (11) are simultaneously irradiated toward the position where the microhole (H2) of the vacuum plate (P) is to be processed in a hybrid pulse scanner (30).

[0083] At this time, the nanosecond laser (12) and the femtosecond laser (11) are irradiated with different outputs.

[0084] For example, when the nanosecond laser (12) is 100 W and the femtosecond laser (11) is 100 W, assuming that the processing critical point of the vacuum plate (P) is 50 W, by setting the nanosecond laser (12) to 10 W, which is lower than the processing critical point, and setting the femtosecond laser (11) to 50 W, which is at least equal to the processing critical point, among the simultaneously irradiated laser beams (B), the nanosecond laser (12) ages the position where the microhole (H2) is to be processed, and at the same time, the femtosecond laser (11), which will be described later, heats the aged position to process the microhole (H2).

[0085] Meanwhile, the incident angle of the nanosecond laser beam (12) being investigated is positioned at a depth set inside the vacuum plate (P) as shown in Fig. 6 (a), and since it is investigated with an output lower than the processing critical point, a hole is not processed, but the processing position is aged.

[0086] At this time, it is desirable that the aging temperature of the vacuum plate (P), which is a metal material, be aging at 80 degrees or higher, which is higher than room temperature (around 20 degrees). This is to improve the quality of circularity and cylindricality while preventing the generation of fragmentary particles around the processed microhole (H2) through reduction of heat influence by processing the aged position using a femtosecond laser (11) described later.

[0087] If processing is to be performed using a nanosecond laser (12), the energy concentration can be increased so that the energy per unit area reaches a critical value. In this way, processing using a nanosecond laser (12) can be performed by melting using heat.

[0088] However, in this stage, the threshold has been lowered as aging is the goal.

[0089] The step (S20) of processing a preliminary micro-hole (H1) while irradiating a femtosecond laser (11) beam in a 2D shape and a 3D shape to an aged position is to process a preliminary micro-hole (H1) at a set depth in the aged processing position in order to perforate a micro-hole (H2).

[0090] The femtosecond laser (11) irradiated simultaneously with the nanosecond laser (12) processes a preliminary microhole (H1) having a set depth while irradiating the position alternately in a 2D spiral shape and a 3D helical shape through the motion combination of the X-axis galvanometer (52), the Y-axis galvanometer (53) and the focusing module (51). The depth is not limited as long as it is sufficient so that the molten material does not overflow when drilling the microhole (H2) described later.

[0091] At this time, the nanosecond laser (12) can maintain a continuous irradiation state so that the preliminary microhole (H1) processing through the femtosecond laser (11) can be stably performed.

[0092] Here, since the femtosecond laser (11) physically removes the aged processing location and processes a preliminary micro hole (H1) as shown in Fig. 6(b), a femtosecond laser (11) having a pulse length of 100 fs to 10,000 fs (10 ps) and a pulse length of 700 fs to 800 fs is used to minimize thermal deformation on the surface of the processing location.

[0093] In addition, the femtosecond laser (11) is repeatedly irradiated in a 2D spiral shape and a 3D helical shape, respectively, through the motion combination control of the X-axis galvanometer (52) and the Y-axis galvanometer (53) or the motion combination control of the X-axis galvanometer (52) and the Y-axis galvanometer (53) and the focusing module (51) as shown in the arrow direction of Fig. 6(b) among the 5 axes of the hybrid pulse scanner (30).

[0094] In addition, the femtosecond laser (11) being investigated is irradiated with a narrowed incident angle by widening the diameter of the beam by the incident angle adjustment module (40) so that focused processing can be performed while the available range of the beam is narrowed, so that molten protrusions, fragmented particles, and burrs are not formed around the processed preliminary microhole (H1), thereby enabling clear processing that does not require a post-process.

[0095] The step (S30) of drilling a microhole (H2) while selectively irradiating the nanosecond laser (12) beam in a 2D shape and a 3D shape through 5+1 axis (X, Y, Xθ. Yθ, Z + Z-WD) motion control on the processed preliminary microhole (H1) and controlling the irradiation angle is to process the microhole (H2) in the preliminary microhole (H1).

[0096] First, while the preliminary microhole (H1) is being processed, the femtosecond laser (11) is blocked, and the output of the nanosecond laser (12) is set higher than the processing threshold to increase the energy concentration per unit area and irradiate it into the preliminary microhole (H1).

[0097] Nanosecond laser (12) forms a microhole (H2) by irradiating a preliminary microhole (H1) as shown in (c) of Fig. 6 and melting the inside of the preliminary microhole (H1) and perforating the preliminary microhole (H1) by descending in the direction of the dotted line shown in (c) of Fig. 6 in a molten pool manner.

[0098] At this time, the nanosecond laser (12) is alternately irradiated in a 2D spiral shape and a 3D helical shape through a motion combination of the 5-axis X-axis galvanometer (52), Y-axis galvanometer (53), Xθ-axis galvanometer (54), Yθ-axis galvanometer (55) and focusing module (51) and the +1-axis incident angle adjustment module (40), thereby gradually moving the incident angle in the Z-axis direction in the drawing.

[0099] At the same time, the incident angle control module (40) reduces the diameter of the nanosecond laser (12) beam in real time when the nanosecond laser (12) is irradiated and moves in the Z-axis direction by the focusing module (51) so that the irradiated beam does not interfere with the entrance of the microhole (H2), and the 5-axis controls the irradiation angle of the nanosecond laser (12) whose beam diameter has been narrowed in real time (see FIG. 4).

[0100] In detail, the irradiation angle of the nanosecond laser (12) beam is controlled through the 5+1 axis focusing module (51), X-axis galvanometer (52), Y-axis galvanometer (53), Xθ-axis galvanometer (54), and Yθ-axis galvanometer (55), and the available range of the nanosecond laser (12) beam incidence angle is expanded through the incidence angle adjustment module (40) to enable drilling a preliminary micro hole (H1) in a molten pool method that melts the processing area, thereby narrowing the diameter of the nanosecond laser (12) beam in real time.

[0101] In addition, as the diameter and irradiation angle of the nanosecond laser (12) beam are controlled through the 5+1 axis above, the inner surface of the microhole (H2) being drilled can be processed vertically as shown in Fig. 4.

[0102] At the same time, the nanosecond laser (12) is repeatedly irradiated in a 2D spiral shape and a 3D helical shape, respectively, through the motion combination control of the X-axis galvanometer (52) and the Y-axis galvanometer (53) or the motion combination control of the X-axis galvanometer (52) and the Y-axis galvanometer (53) and the focusing module (51) in the direction of the arrow in Fig. 6(c) among the 5 axes of the hybrid pulse scanner (30).

[0103] At this time, it is preferable that the pulse length of the nanosecond laser (12) beam being investigated for microhole (H2) perforation is in the range of 1 ns to 200 ns.

[0104] The step (S40) of deburring the inner surface while irradiating the nanosecond laser (12) beam along the inner surface of the microhole (H2) in a 3D shape through 5+1 axis (X, Y, Xθ. Yθ, Z + Z-WD) motion control is a step of completing the processing of the microhole (H2) through deburring.

[0105] First, the irradiation angle of the nanosecond laser (12) that perforated the microhole (H2) is tilted to a predetermined angle as shown in Fig. 5 through motion control by driving the 5-axis focusing module (51), X-axis galvanometer (52), Y-axis galvanometer (53), Xθ-axis galvanometer (54), and Yθ-axis galvanometer (55).

[0106] At the same time, the nanosecond laser (12) narrows the diameter of the nanosecond laser (12) beam and widens the incident angle (spot) according to the control of the incident angle adjustment module (40), which is the Z-WD axis among the 5+1 axes.

[0107] In this case, only the incident angle of the nanosecond laser (12), which has widened as the nanosecond laser (12) is tilted, is focused on the inner surface of the microhole (H2) as shown in FIG. 5, and in this state, the nanosecond laser (12) moves in the Z-axis direction in a helical shape, which is a 3D shape, along the inner surface of the microhole (H2) as shown by the arrow in FIG. 6(d) through 5-axis motion control, thereby deburring the inner surface.

[0108] Deburring is completed by progressing to the entrance of the microhole (H2), thereby completing the processing of the microhole (H2) with high-quality roundness and cylindricality guaranteed as in Fig. 6(e).

[0109] At this time, it is preferable that the pulse length of the nanosecond laser (12) beam being investigated for deburring is in the range of 1 ns to 200 ns, such as in step (S30).

[0110] Afterwards, when the microhole (H2) processing is completed, the stage on which the vacuum plate (P) is mounted is moved for the next microhole (H2) processing, and multiple microholes (H2) are processed by repeatedly performing the method described above.

[0111] As described so far, the laser irradiation device equipped with a hybrid pulse scanner of the present invention and the micro-hole processing method of a vacuum plate using the same simultaneously or selectively irradiate femtosecond laser and nanosecond laser through a single dedicated device, and the incident angle (spot) of the beam can be controlled in real time together with the motion control of the five-axis direction of the laser beam, thereby enabling the aspect ratio of the micro-hole to be processed deeper than 1:10, and deburring to be performed immediately after the micro-hole is drilled, thereby ensuring precise, high-quality roundness and cylindricality in the vacuum plate, thereby having an excellent effect of improving the quality of the vacuum plate.

[0112] In addition, since a femtosecond laser beam is irradiated to process a microhole to process a preliminary microhole, there is an effect of not forming a burr around the hole.

[0113] In addition, since the machining area is aged in a single dedicated device, a femtosecond laser beam and a nanosecond laser beam are sequentially and continuously irradiated to form and perforate preliminary micro holes, and the inner surface of the perforated hole is immediately deburred, the machining time is shortened, and above all, there is the effect of not needing a separate post-process for burr removal and deburring as in the past.

Claims

1. In a laser irradiation device (100) equipped with a hybrid pulse scanner (30) that processes ultra-fine micro holes (H2) in a vacuum plate (P) that absorbs and transports and laminates thin-film ceramic sheets, thin-film metal sheets, thin-film coating films, etc., A laser oscillation unit (10) that simultaneously or selectively emits femtosecond laser (11) and nanosecond laser (12) beams; An optical unit (20) equipped with a first reflector (21) and a second reflector (22) that change the path of a laser beam (B) incident from the laser oscillation unit (10); and It includes a hybrid pulse scanner (30) that adjusts the incident angle size of the laser beam (B) incident from the optical section (20) in real time using 5+1 axes (X, Y, Xθ. Yθ, Z + Z-WD), and controls the irradiation angle of the adjusted laser beam (B) in the 5-axis (X, Y, Xθ, Yθ, Z) direction while aging the position where the micro hole (H2) is to be processed, processing a preliminary micro hole (H1) at the aged position, perforating the processed preliminary micro hole (H1), and deburring the inner surface of the perforated micro hole (H2). The hybrid pulse scanner (30) above comprises: an incident angle adjustment module (40) that adjusts the incident angle size of an incident laser beam (B) as a Z-WD (Z-Working Distance) to expand or narrow the available range (WD); a focusing module (51) that moves the incident angle position of the laser beam (B) passing through the incident angle adjustment module (40) in the Z-axis direction as a 5-axis; a galvanometer scanner (50) composed of an X-axis galvanometer (52), a Y-axis galvanometer (53), an Xθ-axis galvanometer (54), and a Yθ-axis galvanometer (55) so that the laser beam (B) passing through the focusing module (51) can be selectively irradiated in a 2D or 3D shape; a beam reflector (60) that reflects the laser beam (B) passing through the galvanometer scanner (50) in the Z-axis direction; A laser irradiation device equipped with a hybrid pulse scanner, characterized in that it is equipped with a lens (70) arranged below the beam reflector (60) to focus the incident angle of the reflected laser beam (B) to a position where a micro hole (H2) is processed.

2. In paragraph 1, The location where the above micro hole (H2) is to be processed is aged by irradiating with a nanosecond laser (12) beam. In the aged location, a preliminary micro hole (H1) is processed by selectively irradiating the femtosecond laser (11) beam in 2D and 3D shapes. By selectively irradiating the nanosecond laser (12) beam in 2D and 3D shapes with the irradiation angle control through the 5+1 axis motion control on the processed preliminary microhole (H1), a microhole (H2) is drilled. A laser irradiation device equipped with a hybrid pulse scanner characterized by deburring the inner surface while irradiating the inner surface in a 3D shape along the inner surface of a machined microhole (H2) with the irradiation angle control of the nanosecond laser (12) beam through the above 5+1 axis motion control.

3. In paragraph 2, A laser irradiation device equipped with a hybrid pulse scanner, characterized in that the femtosecond laser (11) and nanosecond laser (12) irradiated for the above preliminary microhole (H1) processing and microhole (H2) perforation are each in a 2D spiral shape and a 3D helical shape through the X,Y motion combination or X,Y,Z motion combination control among the 5 axes of the hybrid pulse scanner (30).

4. In paragraph 2, The above incident angle adjustment module (40) adjusts the incident angle size of the laser beam (B) in real time by adjusting the spacing between a pair of concave lenses (41, 42). When machining a preliminary micro hole (H1), the diameter of the femtosecond laser (11) beam is widened to narrow the incident angle so that focused processing can be performed by narrowing the available range of the laser beam (B). A laser irradiation device equipped with a hybrid pulse scanner characterized by narrowing the diameter of a nanosecond laser (12) beam and widening the angle of incidence so that a molten pool method can be achieved by expanding the available range of the laser beam (B) when drilling a microhole (H2) in a preliminary microhole (H1) to melt the processing area.

5. A method for processing micro holes in a vacuum plate using a laser irradiation device equipped with a hybrid pulse scanner as described in any one of clauses 1 to 4, A step (S10) of aging by simultaneously or selectively irradiating a nanosecond laser (12) and a femtosecond laser (11) to the location where the micro hole (H2) of the above vacuum plate (P) is to be processed; Step (S20) of processing a preliminary micro hole (H1) while irradiating a femtosecond laser (11) beam in 2D and 3D shapes to the aged location; Step (S30) of drilling a microhole (H2) while selectively irradiating the nanosecond laser (12) beam in a 2D shape and a 3D shape by controlling the irradiation angle of the nanosecond laser (12) beam through the 5+1 axis (X, Y, Xθ. Yθ, Z + Z-WD) motion control on the processed preliminary microhole (H1); and It includes a step (S40) of deburring the inner surface while irradiating the nanosecond laser (12) beam along the inner surface of a microhole (H2) in a 3D shape through the above 5+1 axis (X, Y, Xθ. Yθ, Z + Z-WD) motion control; In the above step S30, a method for processing microholes in a vacuum plate is characterized in that the diameter of the nanosecond laser (12) beam is narrowed so that a preliminary microhole (H1) can be perforated in a molten pool manner by melting the processing area while controlling the irradiation angle of the nanosecond laser (12) beam to expand the available range of incidence angles.

6. In paragraph 5, In the above step S20, A method for processing microholes in a vacuum plate, characterized in that the irradiation of a femtosecond laser (11) beam is performed by widening the diameter of the beam and narrowing the angle of incidence so that focused processing can be performed while narrowing the available range.

7. In paragraph 5, A method for processing microholes in a vacuum plate, characterized in that in the above step S20, the pulse length of the femtosecond laser (11) is 100 fs to 10,000 fs (10 ps).

8. In paragraph 5, In the above step S40, A method for processing microholes in a vacuum plate, characterized in that the diameter of a nanosecond laser (12) beam is narrowed and the incident angle is widened according to the control of the incident angle adjustment module (40) which is the Z-WD axis, and the beam irradiation angle is controlled so that only the widened incident angle can be focused on the inner surface of the microhole (H2), while deburring in a helical shape which is a 3D shape along the inner surface of the microhole (H2).

9. In paragraph 5, A method for processing microholes in a vacuum plate, characterized in that in the above steps S30 and S40, the pulse length of the nanosecond laser (12) is 1 ns to 200 ns.

10. In paragraph 5, A method for processing microholes in a vacuum plate, characterized in that the femtosecond laser (11) and the nanosecond laser (12) irradiated in the above steps S20 and S30 are repeatedly irradiated in a 2D spiral shape and a 3D helical shape, respectively, through X, Y motion combination or X, Y, Z motion combination control among the 5 axes of the hybrid pulse scanner (30).

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