Electronic device including sensor assembly

Abstract

According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include: a housing including a first through-hole; a sensor assembly received in the first through-hole, the sensor assembly including a first surface visually exposed to the outside of the housing, a second surface opposite the first surface, and a lateral surface for connecting the first surface and the second surface; a substrate assembly disposed to face the second surface of the sensor assembly; and a switch disposed to face one surface of the substrate assembly. The substrate assembly may include a printed circuit board electrically connected to the sensor assembly. The printed circuit board may include a first area overlapping the sensor assembly when the sensor assembly is viewed from above, a second area at a periphery of the first area, which does not overlap the sensor assembly, and a conductive area disposed on at least a portion of the first area. Various other embodiments are possible.

Description

Electronic device comprising a sensor assembly

[0001] Examples disclosed in this document relate to electronic devices including a sensor assembly.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first through hole, a sensor assembly accommodated in the first through hole, the sensor assembly including a first surface visually exposed to the outside of the housing, a second surface opposite the first surface, and a side surface connecting the first surface and the second surface, a substrate assembly disposed facing the second surface of the sensor assembly, and a switch disposed facing one surface of the substrate assembly. The substrate assembly may include a printed circuit board electrically connected to the sensor assembly. The printed circuit board may include a first region overlapping the sensor assembly when the sensor assembly is viewed from above, a second region surrounding the first region not overlapping the sensor assembly, and a conductive region disposed on at least a portion of the first region.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first through hole, a sensor assembly accommodated in the first through hole, the sensor assembly including a first surface visually exposed to the outside of the housing, a second surface opposite the first surface, and a side surface connecting the first surface and the second surface, a substrate assembly facing the second surface of the sensor assembly, and a switch facing one surface of the substrate assembly. The substrate assembly may include a printed circuit board electrically connected to the sensor assembly. The side surface of the sensor assembly may face a surface of the first through hole with an air gap therebetween.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0008] FIG. 2 is a perspective view showing an electronic device according to one embodiment of the present disclosure.

[0009] Fig. 3 is a cross-sectional view of a switch sensor structure of a comparative example.

[0010] FIG. 4 is a cross-sectional side view of a switch sensor structure according to one embodiment of the present disclosure.

[0011] FIG. 5 is a perspective view of a switch sensor structure according to one embodiment of the present disclosure.

[0012] FIG. 6 is a side view of a switch sensor structure according to one embodiment of the present disclosure.

[0013] FIG. 7 is a perspective view of a switch sensor structure according to one embodiment of the present disclosure.

[0014] FIG. 8 is a plan view illustrating a printed circuit board of a substrate assembly according to one embodiment of the present disclosure.

[0015] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0016] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of one embodiment of the present disclosure as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0017] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of one embodiment of this document is provided solely for illustrative purposes, not for the purpose of limiting the disclosure, which is defined by the appended claims and their equivalents.

[0018] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0019] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard (or keypad), a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device or the housing (e.g., the housing (202-1, 202-2) of FIG. 2) may be referred to, and the longitudinal direction may be understood as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction in which the components are oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front (or top) of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back (or bottom) may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. This is based on the rectangular coordinate system described in the drawings for the sake of brevity of explanation, and it should be noted that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, in FIG. 2, the rectangular coordinate system exemplifies the longitudinal direction, the width direction, and / or the thickness direction of the housing (202-1, 202-2), and depending on the inclination angle with respect to the housing (202-1, 202-2), the longitudinal direction, the width direction, and / or the thickness direction of the second housing (202) may be understood differently from the rectangular coordinate system.

[0043] FIG. 2 is a perspective view illustrating an electronic device according to one embodiment of the present disclosure. FIG. 3 is a plan view illustrating some components arranged within a first housing according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIG. 2 may be all or partly identical or similar to the configuration of the electronic device (101) of FIG. 1.

[0044] Referring to FIG. 2, in one embodiment, the electronic device (101) may be, for example, a laptop-type PC. According to one embodiment, the electronic device (101) may include a first housing (202-1) and a second housing (202-2) that are rotatably coupled to each other. For example, the first housing (202-1) and the second housing (202-2) may be rotatably coupled via a hinge device (206). For example, the first housing (202-1) and the second housing (202-2) may be unfolded from a position where they are folded facing each other to a position where they are inclined and opened relative to each other at an arbitrary angle. For example, the first housing (202-1) and the second housing (202-2) may be unfolded to a position where they form an angle of approximately 180 degrees. For example, the keyboard (207) and the display (205) of FIG. 2 (e.g., the display module (160) of FIG. 1) can be folded so that they face opposite directions to each other.

[0045] According to one embodiment, the first housing (202-1) may include a main circuit board having various electronic components such as a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), a communication module (e.g., a communication module (190) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), and / or a battery (e.g., a battery (189) of FIG. 1) mounted thereon. In one embodiment, an input device (e.g., an input module (150) of FIG. 1) such as a keyboard (207) and / or a touch pad (208) may be disposed on one surface (e.g., a first surface (202A)) of the first housing (202-1) (e.g., an upper surface facing the +Z direction). According to one embodiment, the keyboard (207) and / or the touch pad (208) may be visually exposed to the outside of the electronic device (101) through the first surface (202A) of the first housing (202-1) when the electronic device (101) is unfolded. For example, when the electronic device (101) is in a closed state or folded state, the display (205) and the keyboard (207) may be arranged to face each other and may not be visually exposed to the outside of the electronic device (101). According to one embodiment, connection terminal(s) (e.g., connection terminal(s) (e.g., connection terminal(s) (178) of FIG. 1)) for connection with other external devices (e.g., external electronic device (102) of FIG. 1) such as a power connector, a USB connector, and an HDMI connector may be disposed within the first housing (202-1). For example, the first housing (202-1) may include a side surface (202C) surrounding a space between a first surface (202A) and an opposite side surface of the first surface (202A). For example, the side surface (202C) of the first housing (202-1) may have a connector hole formed therein that is connected to a connection terminal(s) (e.g., a connection terminal (178) of FIG. 1) disposed within the first housing (202-1).

[0046] According to one embodiment, a display (205) and / or a camera device (209) (e.g., the camera module (180) of FIG. 1) may be disposed in the second housing (202-2). For example, when the electronic device (101) is in an open state or unfolding state, the display (205) may be visually exposed to the outside through the second surface (202B) of the second housing (202-2). In one embodiment, the display (205) may include a touch panel or a digitizer, in which case the display (205) may be utilized as an input device together with the keyboard (207) while outputting visual information. For example, when the electronic device (101) includes a touch pad (208), the touch panel or digitizer may be omitted. The camera device (209) can perform shooting in the direction of the screen output of the display (205), and can detect information for the usage environment (e.g., illumination) of the electronic device (101) or user authentication (e.g., facial recognition) according to a program or command installed in the electronic device (101).

[0047] In the above-described embodiment, the unfolded state and the closed state between the first housing (202-1) and the second housing (202-2) have been described. In the unfolded state, the first surface (202A) of the first housing (202-1) and the second surface (202B) of the second housing (202-2) can form a predetermined angle greater than approximately 0 degrees and less than 360 degrees. In the closed state, the first surface (202A) of the first housing (202-1) and the second surface (202B) of the second housing (202-2) can face each other. For example, in the closed state, the first surface (202A) of the first housing (202-1) and the second surface (202B) of the second housing (202-2) can form an angle of 0 degrees. Here, the above-mentioned "angle" is merely an example and is not necessarily limited thereto. Considering the tolerance of use, the angle may vary in each state. For example, if the display (205) is a flexible display, the angle in the closed state may be formed between -10 degrees and +10 degrees, taking into account the curvature of the flexible display. Various other embodiments may be applied.

[0048] Fig. 3 is a cross-sectional view of a switch sensor structure of a comparative example.

[0049] Referring to FIG. 3, an electronic device (e.g., a laptop, a tablet PC, a smart phone) may include a switch sensor structure (1) and a bezel structure (2) disposed around the switch sensor structure (1) and supporting the switch sensor structure (1). The switch sensor structure (1) may include a sensor assembly (10), a substrate assembly (20), a support plate (30), an adhesive member (40), a flexible circuit board (50), and a switch (60). For example, the substrate assembly (20), the support plate (30), the adhesive member (40), and the flexible circuit board (50) may be sequentially stacked and disposed between the sensor assembly (10) and the switch (60). For example, the substrate assembly (20) may include a printed circuit board electrically connected to the sensor assembly (10), and a reinforcing plate (e.g., an epoxy stiffener) disposed on a back surface of the printed circuit board. The switch sensor structure (1) and the bezel structure (2) of FIG. 3 may be disposed on, for example, a portion of a first surface (202A) of a first housing (202-1) of an electronic device (e.g., the electronic device (101) of FIG. 2) and may be visually exposed to the outside of the electronic device (101). For example, the switch sensor structure (1) and the bezel structure (2) may be disposed on a keyboard (207) or a touch pad (208) or around the keyboard (207) or the touch pad (208). For example, the bezel structure (2) may be visually distinct from the first surface (202A) of the first housing (202-1) or a structure (e.g., a keyboard (207) or a touch pad (208)) around the bezel structure (2), thereby providing a sense of heterogeneity. For example, when the bezel structure (2) is included, the lateral (e.g., X-axis direction and / or Y-axis direction) accommodation space of the switch sensor structure (1) may be limited by the accommodation space occupied by the bezel structure (2), and this limitation may increase the overall height (e.g., Z-axis direction height) of the switch sensor structure (1).According to one embodiment described below with reference to FIGS. 4 to 8, at least a portion of the bezel structure (e.g., the bezel structure (2) of FIG. 3) around the switch sensor structure (200) may be omitted.

[0050] FIG. 4 is a cross-sectional side view of a switch sensor structure according to an embodiment of the present disclosure. FIG. 5 is a perspective view of a switch sensor structure according to an embodiment of the present disclosure. FIG. 6 is a side view of a switch sensor structure according to an embodiment of the present disclosure. FIG. 7 is a perspective view of a switch sensor structure according to an embodiment of the present disclosure.

[0051] Referring to FIGS. 4 to 7, in one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1 or FIG. 2) may include a housing (201) (e.g., housing (202-1, 202-2) of FIG. 2) and a switch sensor structure (200). According to one embodiment, a first through hole (2011) may be formed in a portion of the housing (201) (e.g., housing (202-1) of FIG. 2). For example, the electronic device (101) may be configured to perform a user's biometric information (e.g., fingerprint) and / or a specified function (e.g., power operation) based on an input signal (e.g., touch signal or click signal) received by the sensor assembly (210) of the switch sensor structure (200). According to one embodiment, the switch sensor structure (200) may include a sensor assembly (210), a substrate assembly (220), and a switch (230). Referring to FIG. 4, according to one embodiment, the switch sensor structure (200) may further include a switch bracket (250) that supports the switch (230).

[0052] According to one embodiment, a housing (201) (e.g., housing (202-1, 202-2) of FIG. 2) may include a first surface (201a) (e.g., first surface (202A) of FIG. 2) that forms at least a portion of an exterior of an electronic device (e.g., electronic device (101) of FIG. 2), and a second surface (201b) facing in an opposite direction from the first surface (201a). For example, a first through hole (2011) may be formed penetrating from a portion of the first surface (201a) to the second surface (201b).

[0053] According to one embodiment, the first through hole (2011) may include a stepped structure in which a portion adjacent to or connected to the second surface (201b) of the housing (201) is further extended laterally (e.g., in the X-axis direction and / or the Y-axis direction) than a portion adjacent to or connected to the first surface (201a) of the housing (201). For example, the surfaces (2011a, 2011b, 2011c) of the first through hole (2011) may at least partially face the switch sensor structure (200). The surfaces (2011a, 2011b, 2011c) of the first through hole (2011) may be spaced apart from the sensor assembly (210) and / or the substrate assembly (220) of the switch sensor structure (200) with an air gap therebetween. For example, the first through hole (2011) may include a first hole surface (2011a), a second hole surface (2011b), and a third hole surface (2011c). For example, the first hole surface (2011a) may face the sensor assembly (210) of the switch sensor structure (200). For example, the second hole surface (2011b) may face the substrate assembly (220). The third hole surface (2011c) may face a part of the sensor assembly (210) of the switch sensor structure (200) and the substrate assembly (220). However, the shape of the first through hole (2011) is not limited, and for example, the surfaces (2011a, 2011b, 2011c) of the first through hole (2011) may be formed as a plane without a step structure.

[0054] According to one embodiment, the switch sensor structure (200) may be disposed in the first through hole (2011) of the housing (201). According to one embodiment, the switch sensor structure (200) may be visually exposed on one surface (e.g., the first surface (202A) of FIG. 2) of the housing (201) (e.g., the first housing (202-1) of FIG. 2) of the electronic device (e.g., the electronic device (101) of FIG. 2). For example, the first through hole (2011) and the switch sensor structure (200) may be disposed in a portion of the keyboard (207) or the touch pad (208), or around the keyboard (207) or the touch pad (208). However, the positions of the first through hole (2011) and the switch sensor structure (200) in the electronic device (101) are not limited to those described above and may be changed.

[0055] According to one embodiment, the sensor assembly (210) of the switch sensor structure (200) may include a first surface (210a), a second surface (210b) facing in an opposite direction to the first surface (210a), and a side surface (210c) connecting the first surface (210a) and the second surface (210b). For example, the first surface (210a) may be visually exposed to the outside of an electronic device (e.g., the electronic device (101) of FIG. 2) through a first through hole (2011). For example, the sensor assembly (210) may include a casing (211) defining a space in which a sensor element is disposed, and the first surface (210a), the second surface (210b), and the side surface (210c) of the sensor assembly (210) of the present disclosure may refer to a surface of the casing (211).

[0056] According to one embodiment, the sensor assembly (210) of the switch sensor structure (200) may be configured to detect biometric information (e.g., a fingerprint) of a user based on an input signal (e.g., a touch signal and / or a click signal) received through a surface (e.g., the first surface (210a)) exposed through the first through hole (2011). For example, the sensor assembly (210) may include at least one of a touch sensor and a fingerprint sensor. For example, the input signal detected by the sensor assembly (210) may be stored in a storage medium of the substrate assembly (220) or transmitted to a main circuit board of an electronic device (e.g., the electronic device (101) of FIGS. 1 and 2) or a processor (e.g., the processor (120) of FIG. 1) disposed on the main circuit board via the substrate assembly (220).

[0057] According to one embodiment, the sensor assembly (210) can be spaced apart from a surface of the first through hole (2011) (e.g., the first hole surface (2011a)) by a predetermined distance. According to one embodiment, a side surface (210c) of the sensor assembly (210) can face the surface of the first through hole (2011) (e.g., the first hole surface (2011a)) with an air gap therebetween. For example, the distance between the sensor assembly (210) and the first through hole (2011) can be set to a minimum distance that prevents interference between the sensor assembly (210) and the first through hole (2011) when the switch sensor structure (200) is moved in one axial direction (e.g., the Z-axis direction) by an external signal (e.g., a click signal). According to one embodiment, the switch sensor structure (200) can be mounted on the housing (201) without a surrounding bezel structure (e.g., the bezel structure (2) of FIG. 3), and by omitting the bezel structure, the cost can be reduced and the external design of the electronic device can be improved.

[0058] In one embodiment, the substrate assembly (220) of the switch sensor structure (200) may be disposed between the sensor assembly (210) and the switch (230). In one embodiment, the substrate assembly (220) may be connected to and / or disposed to face the second surface (210b) of the sensor assembly (210). In one embodiment, the printed circuit board (221) may further protrude laterally (e.g., in the X-axis direction and / or the Y-axis direction) compared to the sensor assembly (210). For example, when the sensor assembly (210) is viewed from above (e.g., in the -Z direction), an edge region of the printed circuit board (221) (e.g., the second region (2213) of FIG. 8) may not overlap with the sensor assembly (210). In one embodiment, at least a portion of the substrate assembly (220) can be spaced apart from a surface of the first through hole (2011) (e.g., the second hole surface (2011b) and / or the third hole surface (2011c)) by a predetermined distance. In one embodiment, the substrate assembly (220) can face a surface of the first through hole (2011) (e.g., the second hole surface (2011b) and / or the third hole surface (2011c)) with an air gap therebetween.

[0059] According to one embodiment, the switch sensor structure (200) can be placed in the first through hole (2011) of the housing (201) without the bezel structure (2), unlike the switch sensor structure (1) of the comparative example of FIG. 3. The substrate assembly (220) of the switch sensor structure (200) can be expanded laterally (e.g., in the X-axis direction and / or the Y-axis direction) as the bezel structure (e.g., the bezel structure (2) of FIG. 3) is omitted. As the substrate assembly (220) is expanded laterally (e.g., in the X-axis direction and / or the Y-axis direction), the height (e.g., the Z-axis direction height) can be reduced. For example, the height (e.g., height in the Z-axis direction) of the substrate assembly (220) of the switch sensor structure (200) according to one embodiment in which the bezel structure is omitted may be smaller than the height (e.g., height in the Z-axis direction) of the sequentially stacked substrate assembly (20), the support plate (30), the adhesive member (40), and the flexible circuit board (50) of the switch sensor structure (1) of FIG. 3. The substrate assembly (220) according to one embodiment has a structure in which a printed circuit board (221) and a flexible circuit board (222) are stacked, and the configuration may be simplified and the height (e.g., height in the Z-axis direction) may be reduced compared to the structure in which the substrate assembly (20), the support plate (30), the adhesive member (40), and the flexible circuit board (50) are sequentially stacked in FIG. 3. As the height (e.g., height in the Z-axis direction) of the substrate assembly (220) is reduced, the height (e.g., height in the Z-axis direction) of the switch sensor structure (200) may be reduced. Reducing the height of the switch sensor structure (200) can contribute to miniaturization and thinning of an electronic device (e.g., laptop, tablet PC, smart phone) in which the switch sensor structure (200) is placed.

[0060] In one embodiment, the substrate assembly (220) may include a printed circuit board (221) electrically connected to the sensor assembly (210), and a flexible circuit board (222) electrically connected to the printed circuit board (221) and the switch (230). In one embodiment, the flexible circuit board (222) may protrude further laterally (e.g., in the X-axis direction and / or the Y-axis direction) than the sensor assembly (210). For example, when the sensor assembly (210) is viewed from above (e.g., in the -Z direction), an edge region of the flexible circuit board (222) may not overlap with the sensor assembly (210).

[0061] According to one embodiment, the flexible circuit board (222) can be electrically connected to a main circuit board of an electronic device (e.g., the electronic device (101) of FIGS. 1 and 2). Referring to FIG. 7, for example, the flexible circuit board (222) can include a first portion (2221) at least partially disposed between the switch (230) and the printed circuit board (221) and a second portion (2223) extending from the first portion (2221). According to one embodiment, the second portion (2223) of the flexible circuit board (222) can include a connector (260) for connecting to the main circuit board of the electronic device (e.g., the electronic device (101) of FIGS. 1 and 2).

[0062] In one embodiment, the switch (230) may be configured to receive a pressing force applied to the first surface (210a) of the sensor assembly (210) and detect it as a click signal. For example, at least a portion of the sensor assembly (210), the substrate assembly (220), and the switch (230) may be provided to be movable in a click direction (e.g., in the Z-axis direction). For example, when a user presses the first surface (210a) of the sensor assembly (210) with a finger, the switch sensor structure (200) may detect the user's fingerprint, touch signal, and / or click signal. As an example, the switch (230) of the switch sensor structure (200) may constitute a power button of an electronic device (e.g., the electronic device (101) of FIG. 2).

[0063] In one embodiment, the switch sensor structure (200) may further include a support member (240). In one embodiment, the support member (240) may be disposed on a back surface (e.g., a -Z direction surface) of the substrate assembly (220) (e.g., a flexible circuit board (221)). For example, the support member (240) may reinforce the rigidity of the printed circuit board (221) and / or the flexible circuit board (222).

[0064] FIG. 8 is a plan view illustrating a printed circuit board of a substrate assembly according to one embodiment of the present disclosure.

[0065] Referring to FIG. 8, according to one embodiment, the printed circuit board (221) may include a first region (2211) that overlaps the sensor assembly (210) when viewed from above (in the -Z direction) and a second region (2213) around the first region (2211) that does not overlap the sensor assembly (210). According to one embodiment, the outermost edge of the printed circuit board (221) or the edge of the second region (2213) may be located outside the edge of the first through hole (2011) of the housing (201). In other words, the size of the printed circuit board (221) may be larger than the size of the first through hole (2011).

[0066] According to one embodiment, the printed circuit board (221) may include a conductive region (2215) disposed or formed on at least a portion of the first region (2211). For example, the conductive region (2215) may include at least one of a signal line, a conductive pattern, or a ground region, and an electrical / electronic component may be disposed on the conductive region (2215). The conductive region (2215) may not be formed in the second region (2213). For example, the second region (2213) may include a non-conductive material.

[0067] According to one embodiment, in the printed circuit board (221), an edge of the conductive region (2215) may be spaced apart from an edge of the second region (2213). For example, referring to FIG. 8, an edge of the conductive region (2215) may be spaced apart from an outermost or external edge of the second region (2213) by a specified distance (e.g., d1, d2 and / or d3 of FIG. 8). For example, a width (e.g., an X-axis width or a Y-axis width) of the second region (2213) may be substantially equal to or less than the specified distance (e.g., d1, d2 and / or d3 of FIG. 8). For example, the first specified distance (d1), the second specified distance (d2) and / or the third specified distance (d3) may be different from or similar to each other. According to one embodiment, in the printed circuit board (221), the conductive region (2215) may be formed in a portion of the first region (2211), and an edge of the conductive region (2215) may be located inward of an edge of the first region (2211). In other words, the edge of the conductive region (2215) may be spaced inward from the edge of the first region (2211). In the present disclosure, the shape of the conductive region (2215) may be changed. Although FIG. 8 illustrates that the conductive region (2215) is formed inward of an edge of the first region (2211) of the printed circuit board (221), for example, the conductive region (2215) may be formed in the entire first region (2211), or at least a portion of an edge of the conductive region (2215) may coincide with an edge of the first region (2211).

[0068] According to one embodiment, a structure in which a conductive region (2215) is formed on a first region (2211) of a printed circuit board (221) can reduce an electrostatic discharge (ESD) phenomenon caused by static electricity flowing into the printed circuit board (221) through an air gap between the housing (201) and the switch sensor structure (200), compared to a structure in which a conductive region (2215) is also formed on a second region (2213). For example, the first specified distance (d1), the second specified distance (d2), and / or the third specified distance (d3) of FIG. 8 can be set to be equal to or greater than the minimum distance capable of reducing the electrostatic discharge phenomenon.

[0069] In general, a bezel structure may be arranged around the switch sensor structure to support the switch sensor structure. For example, the bezel structure may visually distinguish the surrounding structures, giving a sense of heterogeneity and hindering the exterior design. For example, the lateral accommodation space of the switch sensor structure may be limited by the accommodation space occupied by the bezel structure, and this limitation may increase the overall height of the switch sensor structure. According to one embodiment described below with reference to FIGS. 4 to 8, the bezel structure (e.g., the bezel structure (2) of FIG. 3) around the switch sensor structure (200) may be omitted.

[0070] Aspects of the present disclosure are intended to solve at least the problems and / or disadvantages described above and to provide at least the advantages described below.

[0071] According to an embodiment disclosed in the present document, a slimmed down switch sensor structure can be provided, which includes a substrate assembly having a reduced height and expanded into a lateral space secured by omitting a bezel structure around the switch sensor structure.

[0072] However, the challenges addressed by this disclosure are not limited to the aforementioned challenges, and may be determined in various ways without departing from the spirit and scope of this disclosure. The benefits achieved by this disclosure are not limited to the aforementioned benefits, and various benefits may be provided, directly or indirectly, through this document.

[0073] The switch sensor assembly of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person having ordinary skill in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0074] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (201) including a first through hole (2011), a sensor assembly (210) accommodated in the first through hole, the sensor assembly including a first surface (210a) visually exposed to the outside of the housing, a second surface (210b) opposite the first surface, and a side surface (210c) connecting the first surface and the second surface, a substrate assembly (220) disposed facing the second surface of the sensor assembly, and a switch (230) disposed facing one surface of the substrate assembly. The substrate assembly may include a printed circuit board electrically connected to the sensor assembly. The printed circuit board (221) may include a first region (2211) overlapping the sensor assembly when viewed from above, a second region (2213) around the first region that does not overlap the sensor assembly, and a conductive region (2215) disposed on at least a portion of the first region.

[0075] In one embodiment, at least a portion of the edge of the conductive region may be spaced inwardly from the edge of the first region.

[0076] In one embodiment, the second region of the printed circuit board is formed non-conductively and can surround an edge of the first region.

[0077] In one embodiment, the conductive region may include at least one of a signal line, a conductive pattern, or a ground region.

[0078] In one embodiment, the edge of the second region may be located outside the edge of the first through hole.

[0079] In one embodiment, the side surface of the sensor assembly may face the surface of the first through hole with an air gap therebetween.

[0080] In one embodiment, at least a portion of the substrate assembly may face the surface of the first through hole with an air gap therebetween.

[0081] According to one embodiment, the housing includes a first surface (201a) forming an outer appearance of the electronic device, a second surface (202b) facing in an opposite direction to the first surface, and the first through hole can be formed to penetrate from a portion of the first surface to a portion of the second surface.

[0082] According to one embodiment, the substrate assembly may further include a reinforcing member (240) disposed on an opposite side of a side of the sensor assembly facing the second side.

[0083] According to one embodiment, the housing may further include a main circuit board disposed within the housing. The substrate assembly may further include a flexible circuit board (222) connecting the printed circuit board to the main circuit board.

[0084] In one embodiment, the switch may be electrically connected to the flexible circuit board.

[0085] According to one embodiment, the switch bracket (250) may further be included, and at least a portion of the switch may be positioned between the substrate assembly and the switch bracket.

[0086] In one embodiment, the substrate assembly can be at least partially disposed between the switch and the sensor assembly.

[0087] According to one embodiment, the sensor assembly may include at least one of a fingerprint sensor or a touch sensor.

[0088] According to one embodiment, the sensor assembly may be configured such that pressing the first surface of the sensor assembly causes a click signal to be applied from the sensor assembly to the switch.

[0089] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (201) including a first through hole (2011), a sensor assembly (210) accommodated in the first through hole, the sensor assembly including a first surface (210a) visually exposed to the outside of the housing, a second surface (210b) opposite the first surface, and a side surface (210c) connecting the first surface and the second surface, a substrate assembly (220) disposed facing the second surface of the sensor assembly, and a switch (230) disposed facing one surface of the substrate assembly. The substrate assembly may include a printed circuit board electrically connected to the sensor assembly. The side surface of the sensor assembly may face a surface of the first through hole with an air gap therebetween.

[0090] In one embodiment, at least a portion of the substrate assembly may face the surface of the first through hole with an air gap therebetween.

[0091] According to one embodiment, the printed circuit board (221) may include a first region (2211) overlapping the sensor assembly when viewed from above, a second region (2213) around the first region that does not overlap the sensor assembly, and a conductive region (2215) disposed on at least a portion of the first region.

[0092] In one embodiment, at least a portion of the edge of the conductive region may be spaced inwardly from the edge of the first region.

[0093] In one embodiment, the second region of the printed circuit board may be formed non-conductively and surround an edge of the first region, and the edge of the second region may be located outside an edge of the first through hole.

[0094] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0095] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0096] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0097] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0098] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0099] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0100] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (201) including a first through hole (2011); A sensor assembly (210) accommodated in the first through hole, comprising a first surface (210a) visually exposed to the outside of the housing, a second surface (210b) opposite the first surface, and a side surface (210c) connecting the first surface and the second surface; A substrate assembly (220) facing the second surface of the sensor assembly, the substrate assembly including a printed circuit board (221) electrically connected to the sensor assembly; and It includes a switch (230) positioned facing one side of the above substrate assembly, An electronic device, wherein the printed circuit board comprises: a first region (2211) overlapping the sensor assembly when viewed from above; a second region (2213) around the first region that does not overlap the sensor assembly; and a conductive region (2215) disposed on at least a portion of the first region.

2. In paragraph 1, An electronic device, wherein at least a portion of an edge of the challenge region is spaced inwardly from an edge of the first region.

3. In paragraph 1 or 2, An electronic device, wherein the second region of the printed circuit board is formed non-conductively and surrounds an edge of the first region.

4. In any one of paragraphs 1 to 3, An electronic device, wherein the conductive region comprises at least one of a signal line, a conductive pattern, or a ground region.

5. In any one of paragraphs 1 to 4, An electronic device wherein the edge of the second region is located outside the edge of the first through hole.

6. In any one of paragraphs 1 to 5, An electronic device wherein the side surface of the sensor assembly faces the surface of the first through hole with an air gap therebetween.

7. In any one of paragraphs 1 to 6, An electronic device, wherein at least a portion of the substrate assembly faces the surface of the first through hole with an air gap therebetween.

8. In any one of paragraphs 1 to 7, An electronic device, wherein the housing includes a first surface (201a) forming an outer appearance of the electronic device, a second surface (202b) facing in an opposite direction to the first surface, and the first through hole is formed penetrating from a portion of the first surface to a portion of the second surface.

9. In any one of paragraphs 1 to 8, An electronic device further comprising a reinforcing member (240) disposed on an opposite side of a side of the sensor assembly of the substrate assembly facing the second side.

10. In any one of paragraphs 1 to 9, Further comprising a main circuit board arranged within the housing, An electronic device, wherein the substrate assembly further includes a flexible circuit board (222) configured to connect the printed circuit board to the main circuit board and electrically connected to the switch.

11. In Article 10, An electronic device further comprising a switch bracket (250), wherein at least a portion of the switch is disposed between the substrate assembly and the switch bracket.

12. In any one of paragraphs 1 to 11, An electronic device wherein the substrate assembly is at least partially disposed between the switch and the sensor assembly.

13. In any one of paragraphs 1 to 12, An electronic device, wherein the sensor assembly comprises at least one of a fingerprint sensor and a touch sensor.

14. In any one of paragraphs 1 to 13, An electronic device configured such that when the first surface of the sensor assembly is pressed, a click signal is applied from the sensor assembly to the switch.

15. In an electronic device (101), A housing (201) including a first through hole (2011); A sensor assembly (210) accommodated in the first through hole, comprising a first surface (210a) visually exposed to the outside of the housing, a second surface (210b) opposite the first surface, and a side surface (210c) connecting the first surface and the second surface; A substrate assembly (220) facing the second surface of the sensor assembly, the substrate assembly including a printed circuit board (221) electrically connected to the sensor assembly; and It includes a switch (230) positioned facing one side of the above substrate assembly, An electronic device wherein the side surface of the sensor assembly faces the surface of the first through hole with an air gap therebetween.

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