Precision resistor based on three-layer composite material and manufacturing method therefor

Abstract

A precision resistor based on a three-layer composite material and a manufacturing method therefor. The method comprises: providing a three-layer composite material, wherein the three-layer composite material comprises a resistive alloy, and first red copper and second red copper that are attached to two sides of the resistive alloy; in the side surface direction of the three-layer composite material, performing resistive alloy removal processing and segment cutting on the three-layer composite material to form a plurality of resistive substrates having filling cavities, each resistive substrate comprising a resistor body formed by the resistive alloy and two electrode pins formed by the first red copper and the second red copper; and respectively performing surface treatment on the resistor body and the electrode pins in each resistive substrate to obtain a plurality of target resistors. According to the method, it can be ensured that a precision resistor simultaneously meeting the requirements of ultra-low resistance, small packaging size, low-temperature drift, and high power is manufactured, the universality of the precision resistor is improved, and the precision resistor adapts to more use environments.

Description

Precision resistor based on three-layer composite material and manufacturing method thereof Technical Field

[0001] The present invention relates to the field of electronic component manufacturing, and in particular to a precision resistor based on a three-layer composite material and a manufacturing method thereof. Background Art

[0002] Precision resistors, also known as sampling resistors and shunts, are mainly used to measure and monitor the current or voltage of the circuit in the feedback circuit to ensure the safe and stable operation of the circuit. They are currently widely used in white goods, new energy, automotive electronics, industrial control, energy storage, electricity and other fields that require monitoring, measurement and early warning of the safety and stability of the circuit. Technical issues

[0003] At present, there are mainly the following processing methods for precision resistors:

[0004] 1. The resistor produced by the first processing method is shown in Figure 1. Using vacuum electronic welding technology, the copper electrode pin 1 and the resistor body 2 are welded together to form a precision resistor. However, this process can only be used for resistor products with a package size larger than 1206. It is not applicable to resistor products with a package size of 0805 and below. In other words, this processing technology limits the application of precision resistors in the small package field.

[0005] 2. The resistor produced by the second processing method is shown in Figure 2. The resistor paste is coated or printed on the ceramic substrate 3, and then plastic-sealed to form the resistor body 2 in Figure 2. Finally, the electrode pin 1 is electroplated to form a precision resistor. Although this process can make the package size of the precision resistor as small as 0201 or even 01005, the resistance of the precision resistor produced is generally very high, which is suitable for precision resistors of ohm level and above, and cannot be used in environments requiring ultra-low resistance. In addition, the power of the products produced by this process is often not very high, and they cannot withstand high current impacts. The temperature drift is also generally high, which limits its application in high-power, low-resistance fields.

[0006] 3. The third processing method is similar to the second processing method mentioned above. Precision resistors are formed by attaching metal foil to a ceramic substrate or a metal substrate. This process can be used for small packages (such as 0402) and high-power environments. The temperature drift can also be controlled within ±50ppm / ℃. However, the resistance value is still generally high, which still limits its application in low-resistance applications.

[0007] 4. The resistor produced using the fourth processing method, as shown in Figure 3, is made by electroplating copper on both sides of the pure resistor alloy body 2 to form electrode pins 1. This process can be applied to small packages, low-temperature drift, and high-power applications, but the minimum resistance value is still in the milliohm range, generally greater than 1 milliohm. Processing smaller resistance values ​​is still very difficult.

[0008] Therefore, there is currently no effective manufacturing method that can provide precision resistors that simultaneously meet the requirements of ultra-low resistance, small package, low temperature drift, and high power, which limits the application range of resistors. Technical Solutions

[0009] In view of this, an embodiment of the present invention provides a precision resistor based on a three-layer composite material and a manufacturing method thereof, so as to solve the problem that the existing precision resistor manufacturing technology cannot produce precision resistors that simultaneously meet the requirements of ultra-low resistance, small package, low temperature drift, and high power, thereby limiting the application range of the resistor.

[0010] The present invention provides a method for manufacturing a precision resistor based on a three-layer composite material, comprising:

[0011] Providing a three-layer composite material; the three-layer composite material comprises a resistance alloy and a first copper and a second copper attached to both sides of the resistance alloy;

[0012] The three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side of the three-layer composite material to form a plurality of resistance substrates having a filling cavity; wherein each of the resistance substrates includes a resistance body formed of the resistance alloy near the filling cavity and two electrode pins formed of the first copper and the second copper on both sides of the resistance body;

[0013] The resistor body and the two electrode pins in each resistor substrate are respectively subjected to surface treatment to obtain a plurality of target resistors.

[0014] Optionally, the three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side direction of the three-layer composite material to form a plurality of resistance substrates with filled cavities, including:

[0015] According to preset resistor design parameters, pre-acquire the width of the resistor body in the resistor substrate;

[0016] Calculating the removal width of the resistor alloy according to the width of the resistor body;

[0017] Based on the removal width of the resistor body, the resistor alloy on the side surface of the three-layer composite material is partially removed by cutting or etching from the side surface of the three-layer composite material to form a composite substrate with a concave portion;

[0018] Based on the width of the resistor body, the composite substrate is cut from the side of the three-layer composite material to obtain a first composite material to be processed and a first resistor substrate having the filling cavity; wherein the filling cavity of the resistor substrate is formed corresponding to the recess in the composite substrate;

[0019] Following the same method as that used to obtain the first composite material to be processed and the first resistor substrate having the filling cavity, the composite material to be processed is further subjected to resistance alloy removal processing and segmented cutting from the side of the composite material to be processed, thereby obtaining a second composite material to be processed and a second resistor substrate having the filling cavity;

[0020] In the same manner, a plurality of the resistor substrates having the filling cavities are formed.

[0021] Optionally, the three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side direction of the three-layer composite material to form a plurality of resistance substrates with filled cavities, including:

[0022] According to preset resistor design parameters, pre-acquire the width of the resistor body in the resistor substrate;

[0023] Based on the width of the resistor body, the three-layer composite material is segmented and cut from the side direction of the three-layer composite material to obtain a plurality of segmented composite substrates;

[0024] Calculating the removal width of the resistor alloy according to the width of the resistor body;

[0025] For each of the segmented composite substrates, based on the removal width of the resistance alloy, a cutting or etching process is adopted from the side direction of the segmented composite substrate to partially remove the resistance alloy on the side of each segmented composite substrate, thereby forming a resistance substrate with the filling cavity corresponding to each segmented composite substrate.

[0026] Optionally, for each of the segmented composite substrates, based on the removed thickness of the resistance alloy, before partially removing the resistance alloy from the side of each segmented composite substrate using a cutting or etching process, the three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side of the three-layer composite material to form a plurality of resistance substrates having filled cavities, further comprising:

[0027] After the side surfaces of all the segmented composite substrates are exposed, each segmented composite substrate is fixed on a preset fixture.

[0028] Optionally, the surface treatment of the resistor body and the two electrode pins in each resistor substrate comprises:

[0029] For each resistor substrate, filling the filling cavity with insulating glue, and applying a protective layer on the outer surfaces of the resistor body and the two electrode pins on the side of the resistor substrate facing away from the filling cavity;

[0030] For each resistor substrate coated with the protective layer, a metal layer is electroplated on the outer surfaces of the two electrode pins exposed to the outside.

[0031] Optionally, the metal layer includes any one of a nickel layer, a tin layer and a nickel-tin alloy layer.

[0032] Optionally, providing a three-layer composite material comprises:

[0033] Providing the resistance alloy according to a preset resistance alloy thickness;

[0034] providing the first copper and the second copper respectively according to a preset copper thickness;

[0035] The first red copper and the second red copper are respectively pressed onto two sides of the resistance alloy by using a rolling composite process to obtain the three-layer composite material.

[0036] Optionally, the preset resistance alloy thickness is less than or equal to 3 mm.

[0037] Optionally, the preset copper thickness is greater than or equal to 0.05 mm.

[0038] In addition, the present invention also provides a precision resistor based on a three-layer composite material, which is manufactured using the aforementioned manufacturing method. Beneficial effects

[0039] The subsequent production of the resistor body and electrode pins based on the three-layer composite material of the first copper, the resistor alloy and the second copper can meet the functionality of the resistor and can more accurately control the resistance value and size of the resistor, thereby simultaneously meeting the production requirements of precision resistors with small package and ultra-low resistance; in the production process of the resistor body and the electrode pins, the three-layer composite material is subjected to the resistor alloy removal processing and segmented cutting from the side direction, which can not only ensure the functionality of the resistor alloy, the first copper and the second copper respectively, thereby ensuring the formation of the resistor body and the electrode pins, and realizing the production of the resistor; and can also achieve precise control of the resistance value and size of the resistor through the control of the processing technology, ensuring the production of precision resistors that meet the requirements of ultra-low resistance, small package, low temperature drift and high power, thereby improving the versatility of the precision resistors and adapting to more usage environments; and can also realize mass production of precision resistors with high application value; among them, after the formation of the resistor substrate, the surface treatment of the two electrode pins of the resistor body can ensure the functionality of the resistor body and the two electrode pins, thereby ensuring the functionality of the entire precision resistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present invention in any way. In the accompanying drawings:

[0041] FIG1 shows a cross-sectional structural diagram of a resistor manufactured using a first conventional processing method;

[0042] FIG2 shows a cross-sectional structural diagram of a resistor manufactured using a second conventional processing method;

[0043] FIG3 shows a cross-sectional structural diagram of a resistor manufactured using a fourth conventional processing method;

[0044] FIG4 shows a flow chart of a method for manufacturing a precision resistor based on a three-layer composite material in Example 1 of the present invention;

[0045] FIG5 shows a cross-sectional structural diagram of a three-layer composite material in Example 1 of the present invention;

[0046] FIG6 shows a cross-sectional structural diagram of a composite substrate having a concave portion formed in Example 1 of the present invention;

[0047] FIG7 shows a structural diagram of a cutting groove formed by cutting a composite substrate having a concave portion in Example 1 of the present invention;

[0048] FIG8 shows a cross-sectional structural diagram of the first resistor substrate with a filled cavity obtained by cutting in Example 1 of the present invention;

[0049] FIG9 shows a cross-sectional structural diagram of multiple segmented composite substrates formed in Example 1 of the present invention;

[0050] FIG10 shows a cross-sectional structural diagram of a target resistor obtained in the first embodiment of the present invention.

[0051] The description of each reference numeral is as follows:

[0052] 1. Electrode pin, 2. Resistor body, 3. Ceramic base, 4. Resistor alloy, 5. First copper, 6. Second copper, 7. Recess, 8. Cutting groove, 9. Filling cavity, 10. Insulation glue, 11. Protective layer, 12. Metal layer. Modes for Carrying Out the Invention

[0053] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0054] Example 1: This example provides a method for manufacturing a precision resistor based on a three-layer composite material, as shown in FIG4 , comprising:

[0055] S1: Providing a three-layer composite material; the three-layer composite material includes a resistance alloy and a first copper and a second copper attached to both sides of the resistance alloy;

[0056] S2: performing resistance alloy removal processing and segmented cutting on the three-layer composite material from the side direction of the three-layer composite material to form a plurality of resistance substrates having a filling cavity; wherein each of the resistance substrates includes a resistance body formed by the resistance alloy near the filling cavity and two electrode pins formed by the first copper and the second copper on both sides of the resistance body;

[0057] S3: performing surface treatment on the resistor body and the two electrode pins in each resistor substrate to obtain a plurality of target resistors.

[0058] In this embodiment, the subsequent production of the resistor body and electrode pins based on the three-layer composite material of the first copper, the resistor alloy and the second copper can meet the functionality of the resistor and can more accurately control the resistance value and size of the resistor, thereby simultaneously meeting the production requirements of small-package, ultra-low resistance precision resistors; in the production process of the resistor body and the electrode pins, the three-layer composite material is processed from the side to remove the resistor alloy and cut in sections, which can ensure the functionality of the resistor alloy, the first copper and the second copper respectively, thereby ensuring the formation of the resistor body and the electrode pins, and realizing the production of the resistor; and the control of the processing technology can achieve precise control of the resistance value and size of the resistor, ensuring that the production meets the ultra-low resistance (less than 0.3m Ω, or even μΩ level), small package (referring to package sizes such as 0805 / 0603 / 0402 / 0201 / 01005), low temperature drift (within ±50ppm / ℃, or even within ±10ppm / ℃), and high power (the power of 0805 package size can reach 105W, and the power of 0402 package size can reach 1W) precision resistors can improve the versatility of precision resistors and adapt to more usage environments; it can also realize mass production of precision resistors and have high application value; among them, after forming the resistor base material, the surface treatment of the two electrode pins of the resistor body can ensure the functionality of the resistor body and the two electrode pins, and thus ensure the functionality of the entire precision resistor.

[0059] The following describes in detail each step of the method for manufacturing a precision resistor based on a three-layer composite material.

[0060] This embodiment S1 includes:

[0061] S11: providing the resistance alloy according to a preset resistance alloy thickness;

[0062] S12: providing the first copper and the second copper respectively according to a preset copper thickness;

[0063] S13: using a rolling composite process to press the first copper and the second copper onto both sides of the resistance alloy to obtain the three-layer composite material.

[0064] The resistor alloy is provided according to a preset resistor alloy thickness, and the first copper and the second copper are provided according to a preset copper thickness, respectively, so as to facilitate the subsequent formation of the required three-layer composite material, and further facilitate the control of the resistance value and size of the resistor through the control of the processing technology.

[0065] The cross-sectional structure of the three-layer composite material of this embodiment is shown in FIG5 . In FIG5 , 4 is a resistance alloy, the main material of which includes any one of copper-manganese-nickel alloy, copper-manganese-tin alloy and nickel-chromium alloy; 5 and 6 are the first copper and the second copper, respectively.

[0066] The rolling bonding process in S13 of this embodiment specifically involves plastically deforming the surfaces of the two metals to be bonded under the rolling force of a rolling mill, thereby causing the metal surfaces to fracture. The fresh metals exposed from the fractures come into contact with each other, and under the action of pressure, a metallurgical bond is formed between the metals. The rolling bonding process can be divided into hot rolling and cold rolling depending on the rolling temperature. Conventional operating methods are used for these methods, and the specific details are not further described here.

[0067] Specifically, in S11 of this embodiment, the preset resistance alloy thickness is less than or equal to 3 mm.

[0068] Specifically, in S12 of this embodiment, the preset copper thickness is greater than or equal to 0.05 mm.

[0069] As shown in Figure 5, the three-layer composite material has a stacking structure from top to bottom consisting of a first copper 5, a resistance alloy 4, and a second copper 6. The preset resistance alloy thickness refers to the size of the resistance alloy 4 in the stacking direction shown in Figure 5, that is, the depth d1 between the upper surface of the resistance alloy 4 and its lower surface; the preset copper thickness refers to the size of the copper (including the first copper 5 and the second copper 6) in the stacking direction shown in Figure 5, that is, the depth between the upper surface of the copper and its lower surface (including d2 and d3 in Figure 5).

[0070] It should be understood that the preset copper thickness d2 of the first copper and the preset copper thickness d3 of the second copper in this embodiment can be the same or different (but both are greater than or equal to 0.05 mm). The above-mentioned preset resistor alloy thickness and preset copper thickness are both pre-set and adjusted based on the actual resistor product design, which is understandable to those skilled in the art.

[0071] By using the preset resistor alloy thickness and preset copper thickness within the above-mentioned size range, the characteristics of the copper and resistor alloy themselves can be fully utilized, so that the resistance value, package size, temperature drift and function of the resistor made based on the three-layer composite material formed based on this size can meet the requirements of precision resistors, and expand into products in more fields.

[0072] In a first optional embodiment, S2 includes:

[0073] S211: Pre-acquire the width of the resistor body in the resistor substrate according to preset resistor design parameters;

[0074] S212: Calculating a removal width of the resistor alloy according to the width of the resistor body;

[0075] S213: Based on the removal width of the resistor body, partially remove the resistor alloy from the side surface of the three-layer composite material by cutting or etching, thereby forming a composite substrate having a concave portion.

[0076] S214: Cutting the composite substrate from the side of the three-layer composite material based on the width of the resistor body to obtain a first composite material to be processed and a first resistor substrate having the filling cavity; wherein the filling cavity of the resistor substrate is formed corresponding to the recess in the composite substrate;

[0077] S215: Using the same method as that used to obtain the first composite material to be processed and the first resistor substrate having the filled cavity, continue performing resistance alloy removal processing and segmented cutting on the composite material to be processed from the side of the composite material to be processed, to obtain a second composite material to be processed and a second resistor substrate having the filled cavity;

[0078] S216: Similarly, a plurality of the resistor substrates having the filling cavities are formed.

[0079] The first optional embodiment described above is to first remove the resistor alloy to form a filling cavity, and then cut it into segments to form multiple resistor substrates. This method is used to produce multiple resistor substrates with filling cavities that meet the requirements. The depth of the filling cavity of each resistor substrate and the size of the resistor body and electrode pins in each resistor substrate can be accurately controlled, thereby effectively ensuring the production accuracy of each target resistor formed in the end.

[0080] In S211, the preset resistor design parameters are the actual design parameters preset for the resistor product before the entire production process, including the resistor value and the resistor package size. The resistor value and the resistor package size are closely related to the width of the resistor body. The smaller the resistor value, the wider the resistor body, and the smaller the width of the portion that needs to be removed. Therefore, the preset resistor design parameters also include the width of the resistor body. By extracting these preset resistor design parameters, the width of the resistor body can be obtained. For the three-layer composite material shown in Figure 5, the width of the resistor body refers to the horizontal dimension of the remaining portion of the resistor alloy in the middle layer of the three-layer composite material after removal processing and segmented cutting.

[0081] For different resistor products, the resistor value, resistor package size, and corresponding resistor body width in the preset resistor design parameters may also vary. In this embodiment, the width of the resistor body in each resistor substrate is the same or different, and is obtained according to the corresponding preset resistor design parameters.

[0082] In S212, after the width of the resistor body is obtained, the removal width of the resistor alloy (i.e., the width of the portion to be removed in the subsequent resistor alloy removal process) can be calculated using simulation software. The simulation software is conventional in the art and will not be described in detail here. Similarly, in this embodiment, the removal width of the resistor alloy in each resistor substrate, whether the same or different, is calculated based on the width of the corresponding resistor body.

[0083] The width of the resistor body and the width of the resistor alloy removed obtained through the above steps can facilitate the subsequent control of the manufacturing accuracy of the resistor alloy removal processing and segmented cutting, so as to ensure that each resistor substrate with a filled cavity better meets the requirements of precision resistors.

[0084] In S213 and S214, the side direction of the three-layer composite material is relative to its stacking direction. In the conventional process of resistor products, processing is carried out in a stacking direction from top to bottom or from bottom to top. In this embodiment, the side direction of the three-layer composite material is selected for processing. On the one hand, it can realize the processing of the resistance alloy in the middle layer without affecting the first copper and the second copper on both sides of the resistance alloy. Therefore, on the basis of ensuring the normal production of the resistor base material, the functionality of the resistor alloy, the first copper and the second copper can also be ensured; on the other hand, based on the cutting in the side direction, a plurality of resistor base materials that meet the requirements of precision resistors can be mass-produced.

[0085] In the three-layer composite material shown in FIG5 , since the three-layer composite material has a three-dimensional structure, the lateral directions relative to the stacking direction from top to bottom or from bottom to top include a first lateral direction from left to right or from right to left, and a second lateral direction from front to back or from back to front. In this embodiment, the lateral direction described in S213 refers to the first lateral direction from left to right or from right to left, and the lateral direction described in S214 refers to the second lateral direction from front to back or from back to front.

[0086] In this embodiment, in step S213, a cross-sectional structure of a composite substrate having a recess is formed, as shown in FIG6 . The lateral direction corresponding to the resistor alloy removal process (specifically, the first lateral direction) is the x-direction in FIG6 . l in FIG6 represents the width of the resistor body removed. The z-direction in FIG6 corresponds to the stacking direction of the three-layer composite material. The recess 7 formed after partial removal of the resistor alloy from the lateral direction of the three-layer composite material is shown in FIG6 .

[0087] In this embodiment, in S214, the composite substrate having the recess is cut from a lateral direction (specifically, a second lateral direction, perpendicular to both the x- and y-directions in FIG. 6 , not shown in the figure). Cutting grooves 8 are formed as shown in FIG. The cross-sectional structure of the first resistor substrate having a filling cavity obtained after cutting is shown in FIG. In FIG. 8 , L is the width of the resistor body corresponding to the resistor substrate, and 9 is the filling cavity corresponding to the resistor substrate, formed corresponding to recess 7 in FIG. The cross-sectional structure of the first composite material to be processed after cutting is identical to that of the three-layer composite material shown in FIG. 5 , differing only in the lateral dimensions, which are not detailed here.

[0088] Since the first composite material to be processed has the same structure as the three-layer composite material and only the dimensions in the lateral direction are different, in this embodiment, the same method is adopted to process the first composite material to be processed in S215, and a second resistor substrate with a filled cavity having the same structure as the first resistor substrate with a filled cavity and a second composite material to be processed having the same structure as the first composite material to be processed can be obtained; and so on, multiple resistor substrates with filled cavities can be produced, and their structures are all the same as the structure shown in Figure 8, which are not listed here.

[0089] In a second optional embodiment, S2 includes:

[0090] S221: Pre-acquire the width of the resistor body in the resistor substrate according to preset resistor design parameters;

[0091] S222: Cutting the three-layer composite material into sections along the side direction of the three-layer composite material based on the width of the resistor body to obtain a plurality of sectioned composite substrates;

[0092] S223: Calculating a removal width of the resistor alloy according to the width of the resistor body;

[0093] S224: For each of the segmented composite substrates, based on the removal width of the resistance alloy, a cutting or etching process is adopted from the side direction of the segmented composite substrate to partially remove the resistance alloy on the side of each segmented composite substrate to form a resistance substrate with the filling cavity corresponding to each segmented composite substrate.

[0094] The second optional embodiment mentioned above is to first form multiple segmented composite substrates by segmented cutting, and then perform resistance alloy removal processing to form multiple resistance substrates. This method is used to produce multiple resistance substrates with filled cavities that meet the requirements. It can avoid repeatedly switching between the two processes of resistance alloy removal processing and segmented cutting, and can more quickly mass-produce multiple resistance substrates that meet the requirements of precision resistors, thereby improving production efficiency.

[0095] S221 and S223 are similar to steps S211 and S212 above. The resulting resistor body width and resistor alloy removal width facilitate the subsequent control of the accuracy of the resistor alloy removal process and segmented cutting, ensuring that each resulting resistor substrate with a filled cavity further meets the requirements of a precision resistor. In this embodiment, S223 can be performed either before or after S222, depending on the specific situation.

[0096] In this embodiment S222, the lateral direction is the same as the lateral direction (specifically, the second lateral direction) described in the aforementioned step S214, and the cross-sectional structure of the formed multiple segmented composite substrates is shown in FIG9.

[0097] In this embodiment, in step S224, the resistance alloy removal process can be performed on all segmented composite substrates simultaneously, or each segmented composite substrate can be independently subjected to the resistance alloy removal process. When the resistance alloy removal process is performed on all segmented composite substrates simultaneously, production efficiency can be further improved. The lateral direction described in step S224 is the same as the lateral direction described in step S213 (specifically, the first lateral direction), and will not be repeated here. After step S224, multiple resistor substrates with filled cavities are obtained, and their structures are the same as the structure shown in Figure 8, and will not be repeated here.

[0098] Preferably, in the above second optional embodiment, before S224, the process further includes:

[0099] After the side surfaces of all the segmented composite substrates are exposed, each segmented composite substrate is fixed on a preset fixture.

[0100] The side surfaces of all segmented composite substrates are exposed to facilitate the subsequent partial removal of the resistance alloy in the middle layer of each segmented composite substrate and avoid affecting the copper on both sides of the resistance alloy; after the side surfaces are exposed, each segmented composite substrate is fixed on a preset fixture, which can facilitate the precise resistance alloy removal processing of all segmented composite substrates at the same time, while improving production efficiency and manufacturing accuracy.

[0101] The preset fixture can be a fixture that can accommodate all segmented composite substrates, so that all segmented composite substrates can be secured by only one preset fixture. The preset fixture can also be a fixture configured for each segmented composite substrate and only accommodates one segmented composite substrate, so that all segmented composite substrates can be secured by the same number of preset fixtures as the segmented composite substrates. Alternatively, the preset fixture can be a fixture that can accommodate m (m<n, where n is the total number of segmented composite substrates) segmented composite substrates, so that all segmented composite substrates can be secured by multiple preset fixtures. The choice of preset fixture to secure all segmented composite substrates depends on the specific situation.

[0102] In the two optional embodiments of S2 above, the resistance alloy removal process can be performed using precision machining techniques, such as slotting machines and CNC machine tools, or chemical etching techniques using etching solutions. Segment cutting can be performed using a precision cutting machine (such as a laser cutting machine) or a slitting machine.

[0103] Preferably, S3 includes:

[0104] S31: For each resistor substrate, fill the filling cavity with insulating glue, and apply a protective layer on the outer surfaces of the resistor body and the two electrode pins on the side of the resistor substrate facing away from the filling cavity;

[0105] S32: For each resistor substrate coated with the protective layer, electroplating a metal layer on the outer surfaces of the two electrode pins exposed to the outside.

[0106] By filling the filling cavity with insulating glue, it is possible to effectively prevent the welding material (usually solder paste) from climbing onto the resistor body when the electrode pins on both sides are soldered to the circuit board, thereby affecting the resistor performance; by applying a protective layer to the outer surface of the resistor body and the two electrode pins on the side facing away from the filling cavity, the exposed material of the resistor base material can be protected, ensuring the functionality of the resistor product and extending its service life; by electroplating a metal layer on the exposed outer surface of the electrode pins, the oxidation resistance and solderability of the pins can be improved.

[0107] Specifically, the filling insulating glue described in S31 of this embodiment can be achieved by using colloid filling equipment such as a dispensing machine or a plastic sealing machine; the coating of the protective layer can be achieved by silk screen printing, spraying and other technologies, and the main material of the protective layer can be insulating paint or insulating glue, etc.; the electroplated metal layer described in S32 can be achieved by roller plating or continuous plating and other processes, and the metal layer includes any one of a nickel layer, a tin layer and a nickel-tin alloy layer.

[0108] After steps S31 to S32 , the cross-sectional structure of the target resistor is obtained as shown in FIG10 . In FIG10 , 10 is an insulating adhesive, 11 is a protective layer, and 12 is a metal layer.

[0109] Example 2: This example provides a precision resistor based on a three-layer composite material, which is manufactured using the manufacturing method described in Example 1.

[0110] The stacked structure of the precision resistor formed in this embodiment is shown in FIG10 .

[0111] Compared with traditional resistors, the precision resistors manufactured in this embodiment can meet the requirements of ultra-low resistance (less than 0.3mΩ, or even μΩ level), small package (referring to package sizes such as 0805 / 0603 / 0402 / 0201 / 01005), low temperature drift (within ±50ppm / °C, or even within ±10ppm / °C), and high power (the power of the 0805 package size can reach 105W, and the power of the 0402 package size can reach 1W). It can adapt to more usage environments and has high application value.

[0112] The manufacturing method of the precision resistor in this embodiment is the same as the method steps described in the first embodiment. Therefore, for details not yet provided in this embodiment, please refer to the specific description of the first embodiment and Figures 1 to 10, and will not be repeated in this embodiment.

[0113] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention. Such modifications and variations are all within the scope defined by the appended claims. Industrial Applicability

[0114] The subsequent production of the resistor body and electrode pins based on the three-layer composite material of the first copper, the resistor alloy and the second copper can meet the functionality of the resistor and can more accurately control the resistance value and size of the resistor, thereby simultaneously meeting the production requirements of precision resistors with small package and ultra-low resistance; in the production process of the resistor body and the electrode pins, the three-layer composite material is subjected to the resistor alloy removal processing and segmented cutting from the side direction, which can not only ensure the functionality of the resistor alloy, the first copper and the second copper respectively, thereby ensuring the formation of the resistor body and the electrode pins, and realizing the production of the resistor; and can also achieve precise control of the resistance value and size of the resistor through the control of the processing technology, ensuring the production of precision resistors that meet the requirements of ultra-low resistance, small package, low temperature drift and high power, thereby improving the versatility of the precision resistors and adapting to more usage environments; and can also realize mass production of precision resistors with high application value; among them, after the formation of the resistor substrate, the surface treatment of the two electrode pins of the resistor body can ensure the functionality of the resistor body and the two electrode pins, thereby ensuring the functionality of the entire precision resistor.

Claims

1. A method for manufacturing a precision resistor based on a three-layer composite material, characterized in that: include: Three layers of composite material are available; The three-layer composite material includes a resistance alloy and a first copper and a second copper attached to both sides of the resistance alloy; From the side direction of the three-layer composite material, the three-layer composite material is subjected to resistance alloy removal processing and segmented cutting to form a plurality of resistance substrates with filling cavities; wherein each of the resistance substrates comprises a resistance body formed by the resistance alloy close to the filling cavity and two electrode pins formed by the first copper and the second copper on both sides of the resistance body; The resistor body and the two electrode pins in each resistor substrate are subjected to surface treatment respectively to obtain a plurality of target resistors.

2. The method according to claim 1, characterized in that: The three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side direction of the three-layer composite material to form a plurality of resistance substrates with filled cavities, including: According to preset resistor design parameters, pre-acquire the width of the resistor body in the resistor substrate; According to the width of the resistor body, the removal width of the resistor alloy is calculated; Based on the removal width of the resistor body, the resistor alloy on the side of the three-layer composite material is partially removed by a cutting or etching process from the side direction of the three-layer composite material to form a composite substrate with a concave portion; Based on the width of the resistor body, the composite substrate is cut from the side direction of the three-layer composite material to obtain a first composite material to be processed and a first resistor substrate having the filling cavity; wherein the filling cavity of the resistor substrate is formed corresponding to the concave portion in the composite substrate; According to the same method as that of obtaining the first composite material to be processed and the first resistor substrate having the filling cavity, the composite material to be processed is further subjected to resistance alloy removal processing and segmented cutting from the side direction of the composite material to be processed to obtain a second composite material to be processed and the second resistor substrate having the filling cavity; In the same manner, a plurality of the resistor substrates having the filling cavities are formed.

3. The method according to claim 1, characterized in that: The three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side direction of the three-layer composite material to form a plurality of resistance substrates with filled cavities, including: According to preset resistor design parameters, pre-acquire the width of the resistor body in the resistor substrate; Based on the width of the resistor body, the three-layer composite material is segmented and cut from the side direction of the three-layer composite material to obtain a plurality of segmented composite substrates; According to the width of the resistor body, the removal width of the resistor alloy is calculated; For each of the segmented composite substrates, based on the removal width of the resistor alloy, a cutting or etching process is adopted from the side direction of the segmented composite substrate to partially remove the resistor alloy on the side of each segmented composite substrate to form the resistor substrate with the filling cavity corresponding to each segmented composite substrate.

4. The method according to claim 3, characterized in that: The method further comprises: for each of the segmented composite substrates, based on the removal thickness of the resistance alloy, before partially removing the resistance alloy on the side of each segmented composite substrate by cutting or etching, the three-layer composite material is subjected to resistance alloy removal processing and segmented cutting from the side of the three-layer composite material to form a plurality of resistance substrates with filled cavities, and further comprises: After the side surfaces of all the segmented composite substrates are exposed, each of the segmented composite substrates is fixed on a preset fixture.

5. The method according to claim 1, characterized in that: The step of performing surface treatment on the resistor body and the two electrode pins in each resistor substrate comprises: For each resistor substrate, filling the filling cavity with insulating glue, and applying a protective layer on the outer surfaces of the resistor body and the two electrode pins on the side of the resistor substrate facing away from the filling cavity; For each of the resistor substrates after the protective layer is applied, a metal layer is electroplated on the outer surfaces of the two electrode pins exposed to the outside.

6. The method according to claim 5, characterized in that: The metal layer includes any one of a nickel layer, a tin layer and a nickel-tin alloy layer.

7. The production method according to any one of claims 1 to 6, characterized in that: The three-layer composite material is provided, comprising: Providing the resistance alloy according to a preset resistance alloy thickness; According to a preset copper thickness, the first copper and the second copper are provided respectively; The first red copper and the second red copper are respectively pressed onto two sides of the resistance alloy by a rolling composite process to obtain the three-layer composite material.

8. The method according to claim 7, characterized in that: The preset resistance alloy thickness is less than or equal to 3 mm.

9. The manufacturing method according to claim 7, characterized in that: The preset copper thickness is greater than or equal to 0.05 mm.

10. A precision resistor based on a three-layer composite material, characterized in that: The method is manufactured by the manufacturing method according to any one of claims 1 to 9.

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