Semiconductor device and shaft adjustment method

Abstract

A semiconductor device and a shaft adjustment method. The semiconductor device (100) comprises: a base (117), the base (117) being used for bearing a wafer (118); a shaft (120), the shaft (120) being connected to the base (117); and a measurement component (301), the measurement component (301) being arranged at the end of the shaft (120) and used for measuring the external force borne by the shaft (120) due to the deviation relative to a central line (130). The semiconductor device provided by the present invention is provided with the measurement component, and the measurement component can measure the external force borne by the shaft due to the deviation relative to the central line, so as to provide convenience when the position of the shaft is adjusted.

Description

Semiconductor equipment and axis adjustment method Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a detection component for an axis of a semiconductor equipment. Background Art

[0002] In the semiconductor field, the results of semiconductor processes are closely related to the state of the process gas flow field in the process chamber of the semiconductor equipment. Taking the epitaxial process as an example, when the wafer is placed on the base in the epitaxial chamber, the process gas related to the desired epitaxial layer needs to be introduced into the chamber, and the corresponding epitaxial layer is grown on the surface of the wafer under a certain temperature and pressure environment. In order to improve the quality and utilization of wafers, the epitaxial layer grown on the surface of the wafer is required to achieve the greatest degree of uniformity. A major manifestation of the uniformity problem is the irregular eccentricity of the thickness of the epitaxial layer on the surface of the wafer. This eccentricity is due to the deviation of the axis connected to the base from the center of the chamber. Therefore, during the rotation of the base, the gap between the preheating ring set around the base and the base will change randomly, resulting in an unstable process gas flow field, which in turn affects the uniformity of film formation.

[0003] Therefore, in the prior art, technicians would use an adjustment device to move the axis of the semiconductor device to coincide with the center of the chamber. However, the following problems still exist when using the adjustment device in the prior art:

[0004] In the prior art, when using the adjustment device, technicians only judge whether the shaft has reached the desired position by observation, which inevitably leads to over-adjustment. This phenomenon may cause excessive stress on the lower dome of the chamber set around the shaft, and more seriously, the lower dome may be broken.

[0005] In summary, it is necessary to provide a device in the semiconductor device that can determine whether the adjustment device is adjusted in place. Technical issues

[0006] The object of the present invention is to provide a semiconductor device and an axis adjustment method, wherein the semiconductor device is provided with a detection component, which can detect the external force applied to the axis when it is offset relative to the center line. Therefore, when adjusting the position of the axis, it can be determined whether the axis is adjusted into place based on the external force detected by the detection component, and at the same time, it can avoid the situation where excessive stress occurs in the lower dome of the semiconductor device chamber arranged around the axis due to excessive adjustment. Technical Solutions

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A semiconductor device is provided, comprising:

[0009] A base, the base being used to support the wafer;

[0010] a shaft, the shaft being directly or indirectly connected to the base;

[0011] The detection component is arranged at the end of the shaft and is used to detect the external force applied to the shaft due to the shaft being offset relative to the center line.

[0012] Furthermore, it also includes:

[0013] a base, the position of the base being fixed relative to the position of the chamber of the semiconductor device; a positioning component, the positioning component being disposed on the base and used to adjust the position of the shaft on a horizontal plane, the detection component being connected to the positioning component;

[0014] The positioning component includes a fixing component, and the fixing component is used to fix the detection component on the positioning component.

[0015] Furthermore, the fixing component is arranged above the detection component.

[0016] Furthermore, the detection component is annular, and the ring includes a through hole passing through the upper and lower surfaces of the ring.

[0017] Furthermore, the end surface of the shaft is disposed in the through hole and is located between the upper surface and the lower surface of the detection component.

[0018] Furthermore, the end surface of the shaft passes through the through hole and exceeds the lower surface of the ring.

[0019] Furthermore, the end surface of the shaft is provided on the fixing component, and the end surface of the shaft is located above the upper surface of the detection component.

[0020] Furthermore, the fixing component includes a hole, and the hole is used to position the shaft.

[0021] Furthermore, the hole is a through hole or a blind hole.

[0022] Furthermore, the diameter of the shaft is the same as the diameter of the through hole of the detection component, and the diameter of the shaft is the same as the diameter of the hole of the fixing component.

[0023] Furthermore, the fixing component is connected to the positioning component through threads, bolts or screws.

[0024] Furthermore, the positioning component includes a first direction positioning portion and a second direction positioning portion located on a horizontal plane, the first direction positioning portion and the second direction positioning portion are arranged crosswise, and an angle between the first direction and the second direction is α.

[0025] Furthermore, the semiconductor device further comprises:

[0026] an adjusting assembly, wherein the adjusting assembly is connected to the base and the positioning component respectively;

[0027] The adjustment assembly includes a first direction adjustment portion and a second direction adjustment portion located on a horizontal plane, the first direction adjustment portion is used to adjust the position of the first direction positioning portion relative to the base, and the second direction adjustment portion is used to adjust the position of the second direction positioning portion relative to the base.

[0028] Furthermore, the adjustment component also includes a connecting part, which is arranged on the base and is used to fix the adjustment component on the base, and the first direction adjustment part and the second direction adjustment part are both micrometer screws, and the side micro screw is fixed on the connecting part, and one end is connected to the first direction positioning part and the second direction positioning part.

[0029] Furthermore, the positioning component further includes a locking member for fixing the positioning component relative to the base at the adjusted position.

[0030] Furthermore, the base includes a central hole, and the locking member includes a plate and a bolt. The plate is arranged below the base, and a threaded hole that cooperates with the bolt is provided on the plate. When the positioning component is adjusted, the bolt is passed through the positioning component and the central hole of the base and connected to the threaded hole on the plate.

[0031] Furthermore, the shapes of the first direction positioning portion and the second direction positioning portion are both "["-shaped, wherein a convex ring facing the base direction is provided in the middle of the second direction positioning portion, and a receiving groove cooperating with the convex ring is provided in the middle of the first direction positioning portion. The convex ring is inserted into the receiving groove, and the first direction positioning portion and the second direction positioning portion can rotate relative to each other with the center of the convex ring as the center of the circle.

[0032] Furthermore, the inner diameter of the convex ring is greater than or equal to the diameter of the through hole of the detection component.

[0033] Furthermore, when the end surface of the shaft passes through the through hole and exceeds the lower surface of the ring, the aperture of the inner hole of the convex ring is larger than the aperture of the through hole of the detection component.

[0034] Furthermore, the detection component is a shear force sensor.

[0035] Furthermore, the angle α is greater than 0° and less than 180°.

[0036] The present invention also provides a method for adjusting the axis of the semiconductor device, comprising:

[0037] S1. Adjust the position of the shaft relative to the center line;

[0038] S2, determining whether the force detected by the detection component exceeds a preset threshold; if so, returning to step S1; if not, executing the next step S3;

[0039] S3. Lock the position of the shaft. Beneficial effects

[0040] Compared with the prior art, the present invention has the following advantages:

[0041] 1. The semiconductor device provided by the present invention is provided with a detection component, which detects the external force exerted on the shaft due to its offset relative to the center line. Therefore, when adjusting the position of the shaft, it can be determined whether the shaft is adjusted to the desired position based on the external force detected by the detection component, thereby improving repeatability and convenience.

[0042] 2. At the same time, avoid the problem of excessive stress on the axis due to excessive adjustment, which may lead to the breakage of the lower dome.

[0043] 3. In addition, the detection component is arranged at the end of the shaft, and the connection between the fixing component and the shaft provides more sensitive force detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for the description. Obviously, the drawings described below are one embodiment of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort:

[0045] FIG1 is a schematic structural diagram of a semiconductor device provided by the present invention;

[0046] FIG2 is a top view of the shaft adjustment device provided by the present invention;

[0047] FIG3 is a cross-sectional view of the shaft adjustment device provided by the present invention in the second direction;

[0048] FIG4 is a schematic structural diagram of the shaft, positioning component and detection component provided by the present invention;

[0049] FIG5 is another structural schematic diagram of the shaft, positioning component and detection component provided by the present invention;

[0050] FIG6 is another structural schematic diagram of the shaft, positioning component and detection component provided by the present invention. Best Mode for Carrying Out the Invention

[0051] The scheme proposed in the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation methods of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the efficacy and purpose that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0052] Figure 1 shows a schematic structural diagram of a semiconductor device provided by the present invention. As shown in Figure 1, the present invention provides a semiconductor device. Optionally, the semiconductor device is at least one of an epitaxial device and a rapid thermal processing device. The present invention uses an epitaxial device as an example, wherein the epitaxial device is used to deposit an epitaxial layer on the surface of a wafer. The epitaxial layer can be a silicon epitaxial layer, a silicon germanium epitaxial layer, or a doped silicon germanium epitaxial layer.

[0053] As shown in FIG1 , the semiconductor device 100 provided by the present invention primarily comprises a chamber and an adjustment device 200. The chamber comprises an upper dome 104, a lower dome 107, and a sealed connection between sidewalls 106. The chamber 100 is symmetrically arranged along the chamber's centerline 130, with the base generally rotating about the centerline 130. The upper dome 104 is generally circular, comprising a circular light-transmitting portion and a flange surrounding the light-transmitting portion. The lower dome 107 is generally umbrella-shaped. Both the upper dome 104 and the lower dome 107 are constructed of quartz. The upper dome 104 is secured to the sidewalls 106 via an upper flange 103. An upper heating lamp assembly 102 is positioned above the chamber, while a lower heating lamp assembly 108 is positioned below the chamber. An air inlet 116 is positioned at one end of the chamber, while an exhaust port 105 is positioned at the other end, opposite the air inlet 116. When the required process is performed in the chamber, the process gas flows into the interior of the chamber from the air inlet 116 and reaches the surface of the wafer 118. The upper heating lamp group 102 and the lower heating lamp group 108 heat the wafer 118 to the required temperature so that the process gas can react. The process gas after the reaction is completed is then discharged from the chamber through the exhaust port 105. On the horizontal plane, in the vertical direction of the line connecting the air inlet and the exhaust port, the chamber is also provided with a wafer transfer port for transferring the wafer 118 into and out of the chamber. In order to facilitate the understanding of the process temperature of the wafer 118 in the chamber, the chamber is also provided with an upper thermometer 101 and a lower thermometer 112 to measure the process temperature of the wafer 118 in real time through the upper dome 104 and the lower dome 107 respectively, so as to regulate the process temperature.

[0054] As shown in FIG1 , the semiconductor device further includes a base 117 for supporting a wafer 118, a rotating support shaft 114, support pins 115, a support frame 113, a shaft 120, and a rotating mechanism 109. The base 117 is connected to the rotating support shaft 114, and the rotating support shaft 114 rotates and moves the base 117 up and down, thereby driving the base 117 and the wafer 118 to rotate integrally about a centerline 130 or driving the base 117 to move up and down. The wafer support pins 115 are movably disposed in pin holes in the base. When the rotating support shaft 114 drives the support pins 115 to move downward, the support frame 113 lifts the support pins 115, thereby separating the wafer from the base 117. The rotating mechanism 109 is connected to the rotating support shaft 114 and is used to drive the rotating support shaft 114 to rotate during the process.

[0055] The shaft 120 is directly or indirectly connected to the base. Optionally, the shaft 120 is connected to the base 117 through the rotating mechanism 109 and the rotating support shaft 114 .

[0056] The adjustment device 200 includes a detection component 301 , as shown in FIG1 . The detection component is disposed at the end of the shaft 120 and is used to detect external forces applied to the shaft 120 due to the shaft 120 being offset relative to the centerline 130 .

[0057] The present invention provides a detection component that can detect the external force applied to the shaft 120 due to its offset relative to the center line 130. Therefore, when the shaft 120 is adjusted using the adjustment device 200, it can be determined whether the shaft 120 has been adjusted to the desired position based on the external force detected by the detection component, thereby avoiding the instability and waste of time caused by relying on experience to adjust the position of the shaft.

[0058] FIG2 shows a top view of the adjustment device 200 provided by the present invention. FIG3 shows a cross-sectional view of the adjustment device 200 provided by the present invention in the second direction. As shown in FIG2 and FIG3, the adjustment device 200 further includes a base 205 and a positioning component. The position of the base is fixed relative to the position of the chamber of the semiconductor device. Optionally, the base 205 is fixedly connected to the chamber of the semiconductor device, or the base 205 is fixedly connected to other fixed position components; the positioning component is provided on the base 205 for adjusting and positioning the position of the shaft 120 on a horizontal plane, and the detection component is connected to the positioning component; optionally, the positioning component is provided above the base 205, and the detection component 301 is provided on the positioning component; optionally, the detection component 301 is provided on the upper surface of the positioning component, and the shaft 120 is provided on or above the positioning component. The positioning component includes a fixing component 240, which is used to fix the detection component 301 on the positioning component; optionally, the fixing component 240 is arranged above the detection component 301, and the fixing component 240 is detachably connected to the positioning component. Optionally, the fixing component 240 is also used to position the shaft 120. Further optionally, the fixing component 240 may be used to withstand the force generated by the shaft 120 being offset relative to the center line 130.

[0059] As shown in Figures 2 and 3, the positioning component includes a first-direction positioning portion 211 and a second-direction positioning portion 209 located on a horizontal plane. The first-direction positioning portion 211 and the second-direction positioning portion 209 are arranged to intersect each other. The first-direction positioning portion 211 extends in a first direction, and the second-direction positioning portion 209 extends in a second direction. The angle between the first and second directions is α. The positioning component can drive the shaft 120 to move in the first or second direction and fix and position the shaft at a desired position.

[0060] Optionally, the adjustment device 200 also includes an adjustment component, which is respectively connected to the base 205 and the positioning component, and the adjustment component includes a first direction adjustment part 203 and a second direction adjustment part 207 located on a horizontal plane, the first direction adjustment part 203 is used to adjust the position of the first direction positioning part 211 relative to the base 205, and the second direction adjustment part 207 is used to adjust the position of the second direction positioning part 209 relative to the base 205.

[0061] Optionally, the adjustment component also includes a connecting part, which is arranged on the base and is used to fix the adjustment component on the base 205, and the first direction adjustment part 203 and the second direction adjustment part 207 are both micrometer screws, and the micrometer screws are fixed on the connecting part, and one end is connected to the first direction positioning part 211 and the second direction positioning part 209. Optionally, the connecting portion includes a first connecting portion 204 and a second connecting portion 206. The first direction adjustment portion 203 is fixed to the first connecting portion 204, and one end of the first direction adjustment portion is connected to the first direction positioning portion 211. The micrometer screw of the first direction adjustment portion 203 can drive the first direction positioning portion 211 to move relative to the first connecting portion in the first direction by being screwed, and rotate slightly about the center 202 of the first connecting portion during movement. The second direction adjustment portion 207 is fixed to the second connecting portion 206, and one end of the second direction positioning portion is connected to the second direction positioning portion 209. The micrometer screw of the second direction adjustment portion 207 can drive the second direction positioning portion 209 to move relative to the second connecting portion in the second direction by being screwed, and rotate slightly about the center 208 of the second connecting portion during movement. The first direction positioning portion 211 and the second direction positioning portion 209 are both shaped like a "[" ( ).

[0062] Optionally, the positioning component further includes a locking member for fixing the positioning component relative to the base 205 at the adjusted position.

[0063] Further optionally, the base 205 includes a central hole 212, and the locking member includes a plate 221 and a bolt 219. The plate 221 is arranged below the base 205, and a threaded hole that cooperates with the bolt 219 is provided on the plate 221. When the positioning component is adjusted, the bolt 219 is passed through the positioning component and the central hole 212 of the base to connect with the threaded hole on the plate.

[0064] Optionally, a convex ring 210 facing the base 205 is provided in the middle of the second direction positioning portion 209, and a receiving groove 225 cooperating with the convex ring 210 is provided in the middle of the first direction positioning portion 211. The convex ring is inserted into the receiving groove, and the first direction positioning portion 211 and the second direction positioning portion 209 can rotate relative to each other with the center of the convex ring 210 as the center of the circle.

[0065] Regarding the connection method between the shaft and the positioning component. Specifically, a mounting groove is provided on the upper surface of the positioning component, and the detection component 301 and the fixing component 240 are provided in the mounting groove. The shape of the mounting groove matches the outer shape of the detection component 301 and the fixing component 240. The mounting groove is a cylindrical groove, and a step portion is provided in the cylindrical groove. The detection component 301 is annular, and the annular detection component 301 also includes a through hole that passes through the upper and lower surfaces of the annular ring. Optionally, the fixing component 240 is annular or quasi-annular, and the lower surface of the fixing component 240 is in contact with the upper surface of the detection component 301. The fixing component 240 includes a hole, and the shaft 120 is provided in the hole to position the shaft. The hole is a through hole or a blind hole. The detection component 301 is arranged at the bottom of the cylindrical groove, and the fixing component 240 is arranged on the stepped portion of the cylindrical groove; preferably, the radius of the fixing component 240 is greater than the radius of the detection component 301, thereby providing a more stable force-bearing contact surface; of course, optionally, the radius of the fixing component 240 can also be equal to the radius of the detection component 301; preferably, the upper surface of the fixing component 240 is higher than the upper surface of the positioning portion to facilitate the detection of force by the detection component 301, of course, optionally, the upper surface of the fixing component 240 is equal to or lower than the upper surface of the positioning portion. The diameter of the shaft 120 is the same as the aperture of the through hole of the detection component to facilitate force detection, and the diameter of the shaft 120 is the same as the aperture of the hole of the fixing component to position the shaft 120. A vertical hole is provided at the bottom of the mounting groove, and the diameter of the vertical hole is greater than or equal to the diameter of the shaft 120; optionally, the vertical hole is provided in the convex ring, that is, forming the inner hole of the convex ring. Of course, optionally, the vertical hole is not provided in the convex ring, but is provided at other positions of the positioning component. In this solution, the convex ring is a protrusion; the details are as follows:

[0066] 4-6 are schematic structural diagrams showing different embodiments of the shaft, positioning component and detection component provided by the present invention.

[0067] In one embodiment, as shown in FIG4 , the end surface of the shaft 120 is disposed within the through-hole and between the annular upper and lower surfaces. The hole of the fixing component 240 is a through-hole. The end surface of the shaft 120 first passes through the hole of the fixing component 240 and then extends downward until it is within the through-hole of the detection component 301. In this embodiment, the hole of the fixing component 240 can position the shaft 120 within the hole. The inner surface of the through-hole of the detection component 301 contacts the shaft 120, and the inner surface of the hole of the fixing component 240 also contacts the shaft 120. When the shaft 120 deviates from the centerline 130, the shaft simultaneously applies a horizontal force to the inner surface of the hole of the fixing component 240 and the inner surface of the through-hole of the detection component 301. The detection component 301 can detect the force applied to the shaft due to the deviation from the centerline. The greater the deviation of the shaft 120 from the centerline, the greater the detection value detected by the detection component 301.

[0068] In one embodiment, as shown in FIG5 , the end face of the shaft 120 passes through the through hole and exceeds the lower surface of the ring, and the hole of the fixing component 240 is a through hole. The diameter of the vertical hole at the bottom of the mounting groove is larger than the aperture of the through hole of the detection component, that is, the aperture of the inner hole of the convex ring is larger than the aperture of the through hole of the detection component. The end face of the shaft first passes through the hole of the fixing component 240, then extends downward, passes through the through hole of the detection component 301, until the end face of the shaft 120 is lower than the lower surface of the detection component 301. In this embodiment, the hole of the fixing component 240 can position the shaft 120 therein; the inner surface of the through-hole of the detection component 301 and the inner surface of the hole of the fixing component 240 contact the shaft 120. When the shaft 120 is offset relative to the centerline 130, the shaft will simultaneously apply a horizontal force to the inner surface of the hole of the fixing component 240 and the inner surface of the through-hole of the detection component 301. The detection component 301 can detect the force applied to the shaft due to the offset relative to the centerline. The greater the offset of the shaft 120 relative to the centerline, the greater the detection value detected by the detection component 301. In this embodiment, because the shaft extends deeper downward, the hole of the positioning component can better position the shaft. In addition, because the diameter of the vertical hole (the inner hole of the convex ring) is larger than the diameter of the shaft, the shaft will not contact the inner surface of the vertical hole, and the detection component 301 can detect larger and more sensitive forces.

[0069] In another embodiment, as shown in FIG6 , the end face of the shaft is disposed on the fixing member 240, and the end face of the shaft is located above the upper surface of the detection member. Specifically, the shaft is located within the hole of the fixing member 240 and between the upper and lower surfaces of the fixing member 240. In this embodiment, the hole of the fixing member 240 can be a through hole or a blind hole. The end face of the shaft 120 first passes through the upper surface of the fixing member 240 and then extends downward until it is within the hole of the fixing member 240. In this embodiment, the hole of the fixing component 240 can position the shaft 120 in the hole; the inner surface of the hole of the fixing component 240 contacts the shaft 120, but the inner surface of the detection component 301 does not contact the shaft 120. When the shaft 120 is offset relative to the center line 130, the shaft will apply a force on the horizontal plane to the inner surface of the hole of the fixing component 240. Due to the balance of forces and the interaction of forces, the detection component 301 will be subjected to the force of the fixing component 240. Therefore, the detection component 301 can detect the force applied to the shaft due to the offset relative to the center line. The greater the offset of the shaft 120 relative to the center line, the greater the detection value detected by the detection component 301.

[0070] Optionally, the fixing component 240 is connected to the positioning component via threads, bolts, or screws. Specifically, the sidewalls of the fixing component 240 are provided with external threads, and the mounting grooves of the positioning component are provided with internal threads that mate with the external threads, thereby achieving a detachable connection between the fixing component 240 and the positioning component. Alternatively, perforations or threaded holes are provided around the fixing component 240 or in other locations, and the fixing component is detachably secured to the positioning component via bolts or screws that mate with the perforations or threaded holes. This connection method is provided for illustrative purposes only and is not specifically limited herein.

[0071] Optionally, the detection component 301 is a shear force sensor.

[0072] Optionally, the angle α between the first direction and the second direction is greater than 0° and less than 180°. Preferably, the angle α is greater than 80° and less than 100°.

[0073] In addition, the semiconductor device further includes a controller and an interactive terminal. The controller is electrically connected to the detection component, and the controller is electrically connected to the interactive terminal. The detection component transmits a signal about the force to the controller. The controller processes the received signal and transmits the processed signal to the interactive terminal. The interactive terminal displays the processed signal, and a technician can view the processed signal through the interactive terminal. Optionally, the controller shown is a host computer, and the interactive terminal shown is a display.

[0074] The present invention also provides a method for adjusting the axis of the semiconductor device:

[0075] S1. Adjust the position of the shaft relative to the center line;

[0076] Specifically, the first direction adjusting part 203 and / or the second direction adjusting part 207 are controlled, that is, the micrometer screw is rotated to adjust the position of the first direction positioning part 211 and the second direction positioning part 209 relative to the base 205, thereby driving the shaft 120 to move in the first direction and / or the second direction until the shaft coincides with the center line.

[0077] S2, determining whether the force detected by the detection component exceeds a preset threshold; if so, returning to step S1; if not, executing the next step S3;

[0078] Specifically, the controller will compare the force detected by the detection component that the shaft is subjected to due to the offset relative to the center line with a preset threshold value, and observe the processing results displayed on the interactive end. If the force applied to the shaft still exceeds the preset force threshold value, step S1 will be continued, that is, the position of the shaft will continue to be adjusted; if the force applied to the shaft does not exceed the preset force threshold value, the adjustment will be stopped.

[0079] S3. Lock the position of the shaft.

[0080] Specifically, after the adjustment is completed, the bolt 219 is passed through the middle hole 212 of the positioning component and the base and connected to the threaded hole on the plate to fix the positioning component relative to the base 205, that is, to fix the position of the shaft 120 relative to the position of the base 205.

[0081] The semiconductor device provided by the present invention is provided with a detection component, which detects the force applied to the shaft due to its offset relative to the center line. Therefore, when adjusting the position of the shaft, it can be determined whether the shaft is adjusted to the desired position based on the external force detected by the detection component, thereby increasing convenience and avoiding the problem of excessive stress on the shaft due to excessive adjustment, which may lead to the breakage of the lower dome.

[0082] It should be noted that, in this document, relational terms such as first and second are used solely to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, the terms "comprise," "include," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the phrase "comprising a..." does not preclude the presence of other identical elements in the process, method, article, or device comprising the element. Furthermore, the term "connected" herein refers to a direct connection between A and B, or an indirect connection between A and B, such as through C, or even through more components such as C and D. The connection between A and B can be integral or separate, removable, or fixed. The term "optional" herein refers to a technical feature that can be combined or not combined with any other feature herein.

[0083] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description is not intended to limit the present invention. After reading the above description, various modifications and substitutions of the present invention will become apparent to those skilled in the art. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A semiconductor device, characterized in that: include: A base, the base is used to support the wafer; A shaft, the shaft being directly or indirectly connected to the base; The detection component is arranged at the end of the shaft and is used to detect the external force applied to the shaft due to the deviation relative to the center line.

2. The semiconductor device according to claim 1, wherein: Also includes: A base, wherein the position of the base is fixed relative to the position of the chamber of the semiconductor device; A positioning component, the positioning component is arranged on the base and is used to adjust the position of the shaft on a horizontal plane, and the detection component is connected to the positioning component; The positioning component includes a fixing component, and the fixing component is used to fix the detection component on the positioning component.

3. The semiconductor device according to claim 2, wherein: The fixing component is arranged above the detecting component.

4. The semiconductor device according to claim 3, wherein: The detection component is in the shape of a ring, and the ring includes a through hole penetrating the upper and lower surfaces of the ring.

5. The semiconductor device according to claim 4, wherein: The end surface of the shaft is disposed in the through hole and is interposed between the upper surface and the lower surface of the detection component.

6. The semiconductor device according to claim 4, wherein: The end surface of the shaft passes through the through hole and exceeds the lower surface of the ring.

7. The semiconductor device according to claim 4, wherein: The end surface of the shaft is disposed on the fixing component, and the end surface of the shaft is located above the upper surface of the detection component.

8. The semiconductor device according to claim 7, wherein: The fixing member includes a hole for positioning the shaft.

9. The semiconductor device according to claim 8, wherein: The hole is a through hole or a blind hole.

10. The semiconductor device according to claim 9, wherein: The diameter of the shaft is the same as the hole diameter of the through hole of the detection component, and the diameter of the shaft is the same as the hole diameter of the fixing component.

11. The semiconductor device according to any one of claims 2 to 10, characterized in that: The fixing component is connected to the positioning component through threads, bolts or screws.

12. The semiconductor device according to any one of claims 2 to 10, characterized in that: The positioning component comprises a first direction positioning portion and a second direction positioning portion located on a horizontal plane, the first direction positioning portion and the second direction positioning portion are arranged crosswise, and an angle between the first direction and the second direction is α.

13. The semiconductor device according to claim 12, wherein: The semiconductor device further comprises: An adjusting component, wherein the adjusting component is connected to the base and the positioning component respectively; The adjustment assembly includes a first direction adjustment portion and a second direction adjustment portion located on a horizontal plane, the first direction adjustment portion is used to adjust the position of the first direction positioning portion relative to the base, and the second direction adjustment portion is used to adjust the position of the second direction positioning portion relative to the base.

14. The semiconductor device according to claim 13, wherein: The adjustment assembly also includes a connecting part, which is arranged on the base and is used to fix the adjustment assembly on the base, and the first direction adjustment part and the second direction adjustment part are both micrometer screws, and the side micro screw is fixed on the connecting part, and one end is connected to the first direction positioning part and the second direction positioning part.

15. The semiconductor device according to claim 14, wherein: The positioning component also includes a locking member for fixing the positioning component relative to the base in the adjusted position.

16. The semiconductor device according to claim 15, wherein: The base includes a central hole, and the locking member includes a plate and a bolt. The plate is arranged below the base, and a threaded hole matching the bolt is arranged on the plate. When the positioning component is adjusted, the bolt is passed through the positioning component and the central hole of the base to connect with the threaded hole on the plate.

17. The semiconductor device according to claim 12, wherein: The shapes of the first direction positioning portion and the second direction positioning portion are both "["-shaped, wherein a convex ring facing the base direction is arranged in the middle of the second direction positioning portion, and a receiving groove cooperating with the convex ring is arranged in the middle of the first direction positioning portion, and the convex ring is inserted into the receiving groove, and the first direction positioning portion and the second direction positioning portion can rotate relative to each other with the center of the convex ring as the center of the circle.

18. The semiconductor device according to claim 17, wherein: The diameter of the inner hole of the convex ring is greater than or equal to the diameter of the through hole of the detection component.

19. The semiconductor device according to claim 18, wherein: When the end surface of the shaft passes through the through hole and exceeds the lower surface of the ring, the inner diameter of the convex ring is larger than the diameter of the through hole of the detection component.

20. The semiconductor device according to any one of claims 1 to 10, characterized in that: The detection component is a shear force sensor.

21. The semiconductor device according to claim 12, wherein: The angle α is greater than 0° and less than 180°.

22. A method for adjusting an axis of a semiconductor device according to any one of claims 1 to 21, characterized in that: include: S1. Adjust the position of the axis relative to the center line; S2, determining whether the force detected by the detection component exceeds a preset threshold; If it exceeds, return to step S1; If not, proceed to the next step S3; S3. Lock the position of the shaft.

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