Chip heat dissipation assembly and vehicle

Abstract

Embodiments of the present application relate to the technical field of heat dissipation, and provide a chip heat dissipation assembly and a vehicle, used for reducing the stress borne by a chip while improving the heat dissipation capability of a chip heat dissipation assembly. The chip heat dissipation assembly comprises a circuit board, a chip, a heat dissipation structure, and a heat conduction medium. The chip is located on the circuit board. The heat dissipation structure covers the side of the chip away from the circuit board, and is connected to the circuit board. The heat dissipation structure comprises a heat dissipation plate, an enclosing portion, and a boss portion. The enclosing portion and the boss portion are both located on the side of the heat dissipation plate close to the chip. The enclosing portion and the boss portion are both connected to the heat dissipation plate. The enclosing portion surrounds the boss portion. A closed space is defined between the heat dissipation plate, the enclosing portion, and the boss portion, and the chip. A gap is formed between the boss portion and the chip. The heat conduction medium is filled in the closed space, the heat conduction medium is in a solid state at a first temperature and is in a liquid state at a second temperature, and the second temperature is higher than the first temperature. The chip heat dissipation assembly is applied in a vehicle so as to improve the heat dissipation capability of the chip in the vehicle.

Description

Chip cooling components, vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on September 1, 2023, with application number 202311137997.0 and application name “Chip heat dissipation assembly, vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a chip heat dissipation component and a vehicle. Background Art

[0003] As vehicle automation levels continue to increase, the power consumption of chips used in internal vehicle modules has increased dramatically. Heat dissipation has become a major challenge in increasing chip computing power. Whether chips can effectively dissipate heat directly affects vehicle performance. However, existing chip heat dissipation devices have poor heat dissipation capabilities, subjecting the chips to high stress and resulting in low chip reliability.

[0004] Summary of the Invention

[0005] Embodiments of the present application provide a chip heat dissipation assembly and a vehicle, which are used to improve the heat dissipation capacity of the chip heat dissipation assembly while reducing the stress on the chip.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] In the first aspect, a chip heat dissipation assembly is provided, which includes a circuit board, a chip, a heat dissipation structure and a heat-conducting medium. The chip is located on the circuit board. The heat dissipation structure covers the side of the chip away from the circuit board and is connected to the circuit board. The heat dissipation structure includes a heat sink, an enclosure and a boss portion, and the enclosure and the boss portion are located on the side of the heat sink close to the chip. The enclosure and the boss portion are both connected to the heat sink, and the enclosure is arranged around the boss portion. A closed space is enclosed between the heat sink, the enclosure, the boss portion and the chip, and there is a gap between the boss portion and the chip. A heat-conducting medium is filled in the closed space, and the heat-conducting medium is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

[0008] In the chip heat dissipation assembly provided in the embodiments of the present application, the chip is located between the heat dissipation structure and the circuit board. The heat dissipation structure includes a heat sink, a retaining member, and a boss. The retaining member and the boss are both located on the side of the heat sink closest to the chip and are connected to the heat sink. The retaining member surrounds the boss. An enclosed space is defined between the heat sink, retaining member, boss, and chip, providing space for a thermally conductive medium.

[0009] The heat-conducting medium is in a solid state at the first temperature. During the preparation process of the chip heat dissipation assembly provided in the embodiment of the present application, the heat-conducting medium can be assembled at the first temperature. In this way, the assembly difficulty of the heat-conducting medium can be lower, thereby reducing the difficulty of preparing the chip heat dissipation assembly and improving the preparation efficiency of the chip heat dissipation assembly.

[0010] The thermally conductive medium is liquid at the second temperature. After the solid thermally conductive medium is placed in the enclosed space, the assembled chip heat dissipation assembly can be placed in an environment at the second temperature, causing the solid thermally conductive medium to transform into a liquid state. The liquid thermally conductive medium then fills the gap between the boss portion and the chip. This prevents the liquid thermally conductive medium from exerting stress on either the boss portion or the chip, thereby improving the chip's operating stability and the yield rate of the chip heat dissipation assembly.

[0011] It can be understood that even if the chip heat dissipation assembly is taken out of the environment with the second temperature, the thermal conductive medium changes from liquid to solid again. Since the size of the part of the thermal conductive medium located in the gap in the direction perpendicular to the circuit board is exactly the same as the size of the gap in the direction perpendicular to the circuit board, the thermal conductive medium will not exert stress on the boss portion and the chip, and the working stability of the chip can still be good.

[0012] In some embodiments, the enclosure includes a first end surface facing away from the heat sink, and the chip includes a second end surface facing away from the circuit board, with the first end surface and the second end surface being opposite each other. This simplifies the connection between the enclosure and the chip, and the structure of the enclosure can be relatively simple, thereby simplifying the heat dissipation structure.

[0013] In some embodiments, the barrier portion is provided along the edge of the second end face. This allows the contact area between the heat-conducting medium and the chip to be larger, allowing the heat-conducting medium to better absorb the heat from the chip and transfer the heat from the chip to the heat sink, thereby improving the heat dissipation capacity of the chip heat dissipation assembly.

[0014] In some embodiments, in a direction perpendicular to the circuit board, a size of the blocking portion is larger than a size of the boss portion.

[0015] In some embodiments, the boss portion includes a third end surface facing the chip, the third end surface includes a first microgroove, and an extending direction of the first microgroove is parallel to the third end surface.

[0016] The embodiment of the present application forms a first microgroove on the third end face of the boss portion facing the chip, thereby improving the wettability of the liquid heat-conducting medium on the third end face, reducing the contact thermal resistance between the heat-conducting medium and the boss portion, thereby improving the heat conduction efficiency between the liquid heat-conducting medium and the boss portion, and improving the heat dissipation capacity of the chip heat dissipation assembly.

[0017] In some embodiments, the chip includes a second end surface facing away from the circuit board, the second end surface includes a second microgroove, and an extension direction of the second microgroove is parallel to the second end surface.

[0018] The embodiment of the present application forms a second microgroove on the second end face of the chip, thereby improving the wettability of the liquid heat-conducting medium on the second end face, reducing the contact thermal resistance between the heat-conducting medium and the chip, thereby improving the heat conduction efficiency between the liquid heat-conducting medium and the chip, and improving the heat dissipation capacity of the chip heat dissipation component.

[0019] In some embodiments, the chip heat dissipation assembly further includes a sealing structure, which is located between the enclosure and the chip. By providing a sealing structure between the enclosure and the chip, on the one hand, when there is a deviation in the height of the enclosure and / or the height of the chip, the gap between the enclosure and the chip can be filled to ensure the closedness of the enclosed space. On the other hand, when the heat-conducting medium is in liquid form, the sealing structure can be used to prevent the heat-conducting medium from leaking from the enclosed space, causing a short circuit in the circuit board, thereby effectively improving the yield of the chip heat dissipation assembly.

[0020] In some embodiments, the sealing structure is a porous structure, wherein the diameter of the plurality of pores in the sealing structure is larger than that of air molecules. This allows gas in the enclosed space to be discharged through the sealing structure, thereby reducing the likelihood of bubbles forming in the thermally conductive medium, thereby ensuring the thermal conductivity of the thermally conductive medium and the heat dissipation capacity of the chip heat dissipation assembly.

[0021] In some embodiments, the thermally conductive medium comprises liquid metal. In the embodiments of the present application, the thermally conductive medium is liquid metal. Compared with conventional thermal pads or other silicon-based thermal interface materials, the thermally conductive medium can have higher thermal conductivity and lower thermal resistance at the same thickness, thereby significantly improving the heat dissipation capacity of the chip heat dissipation assembly.

[0022] In a second aspect, a method for preparing a chip heat dissipation assembly is provided, the method comprising: providing a heat dissipation structure. The heat dissipation structure comprises a heat sink, an enclosure, and a boss. The enclosure and the boss are both connected to the heat sink, and the enclosure is arranged around the boss. A receiving groove is formed between the enclosure, the boss, and the heat sink. A solid heat-conducting medium is placed in the receiving groove. A circuit board and a chip are provided, and the chip is arranged on the circuit board. The heat dissipation structure is connected to the circuit board. The heat sink covers the side of the chip facing away from the circuit board. The enclosure and the boss are located on the side of the heat sink close to the chip. A closed space is enclosed between the heat sink, the enclosure, the boss, and the chip, and there is a gap between the boss and the chip. A heat-conducting medium is filled in the closed space. The heat-conducting medium is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

[0023] In a third aspect, a vehicle is provided, comprising a vehicle body, and a chip heat dissipation assembly as described in any one of the above embodiments, wherein the chip heat dissipation assembly is located inside the vehicle body.

[0024] Among them, the technical effects brought about by any design method in the second to third aspects can refer to the technical effects brought about by different design methods in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for use in some embodiments of this application. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of this application.

[0026] FIG1 is a schematic structural diagram of a heat dissipation assembly provided by the related art;

[0027] FIG2 is a schematic structural diagram of a chip heat dissipation assembly provided in an embodiment of the present application;

[0028] FIG3 is a schematic structural diagram of another chip heat dissipation assembly provided in an embodiment of the present application;

[0029] FIG4 is a schematic structural diagram of an enclosure portion, a boss portion, and a heat-conducting medium provided in an embodiment of the present application;

[0030] FIG5 is a schematic structural diagram of another chip heat dissipation assembly provided in an embodiment of the present application;

[0031] FIG6 is a schematic structural diagram of another chip heat dissipation assembly provided in an embodiment of the present application;

[0032] FIG7 is a schematic diagram of a second end surface provided in an embodiment of the present application;

[0033] FIG8 is a flow chart of a method for preparing a chip heat dissipation assembly according to an embodiment of the present application;

[0034] FIG9 is a structural state diagram corresponding to step S100 in the flowchart shown in FIG8 ;

[0035] FIG10 is a structural state diagram corresponding to step S200 in the flowchart shown in FIG8 ;

[0036] FIG11 is a schematic structural diagram of a vehicle provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The following describes the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings. In the description of the present application, unless otherwise specified, " / " indicates that the objects associated with each other are in an "or" relationship. For example, A / B can represent A or B.

[0038] The "and / or" in this application is only a way to describe the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0039] In the description of this application, unless otherwise specified, "plurality" means two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, a and b, a and c, b and c, or a, b, and c, where a, b, and c can be single or plural.

[0040] To facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first" and "second" are used to distinguish between identical or similar items with substantially the same functions and effects. Those skilled in the art will understand that the words "first" and "second" do not limit the quantity or execution order, and the words "first" and "second" do not necessarily mean different.

[0041] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner to facilitate understanding.

[0042] Generally, the level of autonomous driving can be divided into 6 levels (i.e., L0 to L5). Among them, L0: no autonomous driving, only provides early warning prompts, and does not intervene in vehicle control. L1: driving assistance, independent driving assistance system, lane keeping assistance, adaptive cruise control. L2: partial autonomous driving, multiple driving assistance systems, integrated control, need to monitor road conditions and intervene in emergencies. L3: conditional automation, basically realizes autonomous driving functions, needs to monitor road conditions and intervene in emergencies. L4: highly autonomous driving, sometimes requires driver intervention. L5: fully autonomous driving stage, the vehicle completes all car control operations.

[0043] With each level of autonomous driving, the computing power required by the system-on-chip (SOC) in the vehicle increases exponentially, resulting in a significant increase in the power consumption of the system-on-chip, a sharp increase in chip heat, and a significantly increased difficulty in chip heat dissipation.

[0044] At the same time, with the development of electric vehicles, their electrical and electronic architecture (EEA) will evolve from a distributed approach to a centralized domain approach, and ultimately to a vehicle-wide centralized approach. Electronic control units (ECUs) with different functions will be integrated onto a central computing platform, resulting in significant power consumption for the chips within that platform and further increasing the difficulty of heat dissipation for system-level chips.

[0045] FIG1 is a schematic structural diagram of a heat dissipation assembly 100 provided in the related art. As shown in FIG1 , the heat dissipation assembly 100 includes a chip 1 , a circuit board 2 , a heat dissipation structure 3 and a thermal interface material (TIM) layer 4 .

[0046] The chip 1 is located on the circuit board 2, and the heat dissipation structure 3 covers the side of the chip 1 away from the circuit board 2, and the heat dissipation structure 3 is connected to the circuit board 2. The thermal interface material layer 4 is located between the chip 1 and the heat dissipation structure 3. Due to the height tolerance of the chip 1 and the height tolerance of the heat dissipation structure 3, the size of the gap between the chip 1 and the heat dissipation structure 3 in the direction perpendicular to the circuit board 2 reaches 1 mm to 2 mm. The thermal interface material layer 4 fills the gap between the chip 1 and the heat dissipation structure 3 and contacts the chip 1 and the heat dissipation structure 3 at the same time, making the thickness of the thermal interface material layer 4 larger and the thermal resistance of the thermal interface material layer 4 larger, thereby generating a large temperature difference (for example, above 12 degrees Celsius) on the thermal interface material layer 4, resulting in a sharp drop in the heat dissipation performance of the heat dissipation assembly 100 when the chip power consumption in the chip 1 increases.

[0047] To improve the heat dissipation performance of the heat dissipation assembly 100, the thermal interface material layer 4 can be made of a material with high thermal conductivity. However, materials with high thermal conductivity are generally harder. When the thermal interface material layer is placed between the heat dissipation structure 3 and the chip 1, the stress exerted by the thermal interface material layer on the chip is also relatively large, seriously affecting the chip's operating stability.

[0048] Based on this, an embodiment of the present application provides a chip heat dissipation assembly 200. As shown in FIG2 , the chip heat dissipation assembly 200 includes a circuit board 10, a chip 20, a heat dissipation structure 30, and a thermally conductive medium 40. The chip 20 is located on the circuit board 10. The heat dissipation structure 30 covers the side of the chip 20 facing away from the circuit board 10 and is connected to the circuit board 10. The heat dissipation structure 30 includes a heat sink 31, a retaining portion 32, and a boss portion 33. The retaining portion 32 and the boss portion 33 are both located on the side of the heat sink 31 near the chip 20. The retaining portion 32 and the boss portion 33 are both connected to the heat sink 31, and the retaining portion 32 is arranged around the boss portion 33. A closed space M is enclosed between the heat sink 31, the retaining portion 32, the boss portion 33, and the chip 20. A gap exists between the boss portion 33 and the chip 20. The closed space M is filled with a thermally conductive medium 40. The thermally conductive medium 40 is solid at a first temperature and liquid at a second temperature, which is higher than the first temperature.

[0049] Exemplarily, the circuit board 10 may be a printed circuit board (PCB).

[0050] It is understandable that the chip 20 is located on the circuit board 10 and the chip 20 should be electrically connected to the circuit board 10 .

[0051] In some examples, the chip heat dissipation assembly 200 may include one chip 20. In this case, the number of chips 20 in the chip heat dissipation assembly 200 is small, and the chip 20 occupies a small area on the circuit board 10, which is conducive to reducing the size of the circuit board 10 and improving the integration of the circuit board 10.

[0052] In other examples, as shown in FIG2 , the chip heat dissipation assembly 200 may include multiple chips 20. In this case, the multiple chips 20 can share computing power, so that the power consumption of each chip 20 can be relatively low, thereby reducing the heat dissipation difficulty of the chip heat dissipation assembly 200 and improving the performance of the chip heat dissipation assembly 200. When the chip heat dissipation assembly 200 includes multiple chips 20, the specific number of chips 20 is not limited in the embodiments of the present application. For example, the number of chips 20 can be 2, 4, 6, or more.

[0053] In the case where the chip heat dissipation assembly 200 includes a plurality of chips 20 , as shown in FIG. 2 , the heat dissipation structure 30 may include a plurality of enclosures 32 , with each chip 20 corresponding to one enclosure 32 .

[0054] It is understandable that, in addition to the above-mentioned chip 20 , other electronic devices may be provided on the circuit board 10 , and the other electronic devices may be electrically connected to the chip 20 via traces within the circuit board 10 .

[0055] For example, the heat sink 31 may be a thin copper plate with good thermal conductivity, a thin aluminum plate with a heat pipe welded thereto, a thin flat heat pipe, or a graphene sheet, etc. This application does not impose any particular limitation on this.

[0056] In some examples, the enclosure 32 and the heat sink 31 can be an integral structure. In this case, the enclosure 32 and the heat sink 31 are made of the same material, and gaps are less likely to appear at the connection between the enclosure 32 and the heat sink 31, which is beneficial to improving the connection reliability between the enclosure 32 and the heat sink 31 and improving the sealing of the enclosed space M.

[0057] In other examples, the retaining portion 32, the boss portion 33, and the heat sink 31 can be integrally formed. In this case, the retaining portion 32, the boss portion 33, and the heat sink 31 are made of the same material, and the connection stability between the retaining portion 32 and the heat sink 31, and between the boss portion 33 and the heat sink 31, can be improved, thereby reducing the cost of the chip heat sink assembly 200 and improving the operational stability of the chip heat sink assembly 200.

[0058] In some examples, as shown in FIG2 , the heat dissipation structure 30 further includes a connection portion 34 , which is located on a side of the heat dissipation plate 31 close to the circuit board 10 and connected to the heat dissipation plate 31 . The connection portion 34 is connected to the circuit board 10 .

[0059] In the embodiment of the present application, the heat sink 31 is connected and fixed to the circuit board 10 by using the connecting portion 34, so that the connection between the enclosure portion 32, the chip 20 and the heat sink 31 can be stable, which helps to avoid the problem of misalignment between the enclosure portion 32 and the chip 20 due to misalignment between the heat dissipation structure and the circuit board, or misalignment between the heat sink and the circuit board, which in turn causes the enclosed space to be destroyed and the liquid heat-conducting medium 40 to leak from the enclosed space, thereby ensuring the working stability of the chip heat dissipation assembly.

[0060] For example, the connection portion 34 may be fixedly connected to the circuit board 10 by screws.

[0061] In the chip heat dissipation assembly 200 provided in the embodiment of the present application, the chip 20 is located between the circuit board 10 and the heat dissipation structure 30. The heat dissipation structure 30 includes a heat sink 31, a retaining portion 32, and a boss portion 33. The retaining portion 32 and the boss portion 33 are both located on the side of the heat sink 31 close to the chip 20, and are both connected to the heat sink 31. The retaining portion 32 surrounds the boss portion 33. A closed space M is defined between the heat sink 31, the retaining portion 32, the boss portion 33, and the chip 20, thereby providing a space for accommodating the thermal conductive medium 40.

[0062] The heat-conducting medium 40 is in a solid state at the first temperature. During the preparation process of the chip heat dissipation assembly 200 provided in the embodiment of the present application, the heat-conducting medium 40 can be assembled at the first temperature. In this way, the assembly difficulty of the heat-conducting medium 40 can be relatively low, thereby reducing the preparation difficulty of the chip heat dissipation assembly 200 and improving the preparation efficiency of the chip heat dissipation assembly 200.

[0063] The thermal conductive medium 40 is in a liquid state at the second temperature. After the solid thermal conductive medium 40 is placed in the enclosed space M, the assembled chip heat dissipation assembly 200 can be placed in an environment at the second temperature to transform the solid thermal conductive medium 40 into a liquid state. The liquid thermal conductive medium 40 then fills the gap between the boss portion 33 and the chip 20. This prevents the liquid thermal conductive medium 40 from exerting stress on either the boss portion 33 or the chip 20, thereby improving the operational stability of the chip 20 and the yield of the chip heat dissipation assembly 200.

[0064] It can be understood that even if the chip heat dissipation assembly 200 is taken out of the environment with the second temperature, the thermal conductive medium 40 changes from liquid to solid again. Since the size of the part of the thermal conductive medium 40 located in the gap L in the direction perpendicular to the circuit board 10 is exactly the same as the size of the gap L in the direction perpendicular to the circuit board 10, the thermal conductive medium 40 will not exert stress on the boss portion 33 and the chip 20, and the working stability of the chip 20 can still be good.

[0065] In some examples, with continued reference to FIG. 2 , a dimension d1 of the gap L in a direction perpendicular to the circuit board 10 (the Z direction shown in FIG. 2 ) is greater than or equal to 0.1 mm (millimeter) and less than or equal to 1 mm. For example, the dimension d1 of the gap L in a direction perpendicular to the circuit board 10 is 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc.

[0066] Thus, on the one hand, the dimension d1 of the gap L in the direction Z perpendicular to the circuit board 10 is not excessively large, which allows the thickness of the thermal conductive medium 40 located between the boss portion 33 and the chip 20 to be reduced, thereby facilitating a reduction in the thermal resistance of the thermal conductive medium 40 and improving its thermal conductivity efficiency. Furthermore, the dimension d1 of the gap L in the direction perpendicular to the circuit board 10 is not excessively small, which helps reduce the manufacturing requirements for the heat dissipation structure 30 and the chip 20, and improves the manufacturing efficiency of the chip heat dissipation assembly 200.

[0067] In some examples, as shown in FIG2 , the thermal conductive medium 40 can occupy the entire enclosed space M, that is, the thermal conductive medium 40 completely fills the enclosed space M. In this way, the contact area between the thermal conductive medium 40 and the heat sink 31 , the enclosure 32 , the boss 33 , and the chip 20 can be larger, thereby better transferring the heat of the chip 20 to the heat sink 31 , the enclosure 32 , and the boss 33 , allowing the heat of the chip 20 to be dissipated more quickly into the environment through the heat sink 31 , effectively ensuring the heat dissipation performance of the chip heat dissipation assembly 200 .

[0068] In other examples, as shown in FIG3 , the thermal conductive medium 40 occupies a portion of the enclosed space M. That is, the thermal conductive medium 40 may only fill a portion of the enclosed space M. In this way, when the thermal conductive medium 40 is in a liquid state, the thermal conductive medium 40 can flow within the enclosed space M. When the thermal conductive medium 40 contacts the chip 20 , the thermal conductive medium 40 exerts less stress on the chip 20 , thereby ensuring the operating stability of the chip 20 and improving the yield of the chip heat dissipation assembly 200 .

[0069] In some examples, the heat conducting medium 40 may be liquid metal, where liquid metal refers to an amorphous metal and can be considered as a mixture of positive ion fluid and free electron gas.

[0070] In the embodiment of the present application, the heat-conducting medium 40 is liquid metal. Compared with traditional thermal pads or other silicon-based thermal interface materials, the thermal conductivity of the heat-conducting medium 40 can be higher, and the thermal resistance of the heat-conducting medium 40 can be smaller at the same thickness, thereby significantly improving the heat dissipation capacity of the chip heat dissipation component 200.

[0071] By adjusting the liquid metal formula, the melting point of the liquid metal can be adjusted. In some embodiments, the melting point of the liquid metal can be between 35 degrees Celsius and 80 degrees Celsius. For example, the melting point of the liquid metal can be 35 degrees Celsius, 50 degrees Celsius, 60 degrees Celsius, 70 degrees Celsius, or 80 degrees Celsius.

[0072] In this way, the melting point of the liquid metal will not be too low, and at room temperature, the liquid metal can be in a solid state, thereby facilitating the assembly of the thermal conductive medium 40 into the enclosed space M. This reduces the requirements for the assembly environment of the thermal conductive medium 40, reduces the difficulty of assembling the chip heat dissipation assembly 200, and improves the production efficiency of the chip heat dissipation assembly 200. Furthermore, the melting point of the liquid metal will not be too high, so when the chip inside the chip 20 is in operation, the thermal conductive medium 40 can be converted to liquid form earlier, transferring the heat generated by the chip 20 to the external environment more quickly through the heat sink 31, thereby preventing the chip 20 from overheating and affecting its performance.

[0073] It is understandable that different chips have different functions, corresponding to different power consumption and correspondingly different heat generation. Therefore, the melting point of the liquid metal in the embodiments of the present application is not limited to the range provided in the above embodiments.

[0074] In some examples, the first temperature is less than the melting point of the liquid metal, and the second temperature is greater than or equal to the melting point of the liquid metal.

[0075] 2 and 4 , the structures of the enclosing portion 32 and the boss portion 33 in the heat dissipation structure 30 will be described in detail.

[0076] In some embodiments, referring again to FIG2 , the enclosure 32 includes a first end surface S1 facing away from the heat sink 31, and the chip includes a second end surface S2 facing away from the circuit board 10, with the first end surface S1 and the second end surface S2 facing each other. This simplifies the connection between the enclosure 32 and the chip 20, and the structure of the enclosure 32 can be relatively simple, thereby simplifying the structure of the heat dissipation structure 30.

[0077] In some examples, the barrier portion 32 may be provided along the edge of the second end surface S2. In this way, the contact area between the heat conducting medium 40 and the chip 20 can be larger, so that the heat conducting medium 40 can better absorb the heat of the chip 20 and transfer the heat of the chip 20 to the heat dissipation plate 31, thereby improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0078] At this time, for example, the outer edge of the projection of the blocking portion 32 on the circuit board 10 may completely overlap or partially overlap with the edge of the projection of the chip 20 on the circuit board 10 .

[0079] For example, the projection of the chip 20 on the circuit board 10 may be rectangular. The projection of the blocking portion 32 on the circuit board 10 may be circular or square.

[0080] As shown in FIG2 , in some embodiments, the retaining portion 32 can be disposed around a boss portion 33. This allows the enclosed space M formed by the heat sink 31, retaining portion 32, boss portion 33, and chip 20 to have a simpler appearance, making it easier for the solid thermal conductive medium 40 to fit into the enclosed space M. This further reduces the assembly difficulty of the chip heat dissipation assembly 200 and improves the manufacturing efficiency of the chip heat dissipation assembly 200. Furthermore, this configuration simplifies the heat dissipation structure 30, reduces the difficulty of manufacturing the heat dissipation structure 30, and improves the manufacturing efficiency of the heat dissipation structure 30.

[0081] Based on this, in some examples, as shown in FIG4 , a groove 301 can be formed between the boss portion 33 and the enclosure portion 32 , with the projection of the groove 301 on the circuit board 10 being annular. Thus, when the solid thermal conductive medium 40 is placed in the groove 301 between the boss portion 33 and the enclosure portion 32 , even if there are deviations in the size of the solid thermal conductive medium 40 , the solid thermal conductive medium 40 can be easily placed in the groove 301 .

[0082] Of course, in other embodiments, the blocking portion 32 may also be disposed around the plurality of boss portions 33 .

[0083] 2 , in some embodiments, in a direction Z perpendicular to the circuit board 10, dimension d2 of the retaining portion 32 is greater than dimension d3 of the boss portion 33. In the present embodiment, the specific values ​​of dimension d2 of the retaining portion 32 and dimension d3 of the boss portion 33 in the direction Z perpendicular to the circuit board 10 are not limited and can be designed based on actual needs.

[0084] Of course, in other embodiments, in the direction Z perpendicular to the circuit board 10 , the dimension d2 of the blocking portion 32 may also be smaller than or equal to the dimension d3 of the boss portion 33 .

[0085] In some examples, as shown in Figures 2 and 4 , the platform portion 33 includes a third end surface S3 facing the chip 20. Referring to Figure 4 , the third end surface S3 includes a first microgroove 331. The extension direction X1 of the first microgroove 331 is parallel to the third end surface S3. A dimension d4 of the first microgroove 331 is less than 1 mm along a first target direction Y1 perpendicular to the extension direction X1 of the first microgroove 331.

[0086] In some examples, the third end surface S3 may be circular, elliptical, or rectangular.

[0087] In some examples, the third end surface S3 may include multiple first microgrooves 331. In this case, the specific number of the first microgrooves 331 is not limited in the embodiments of the present application and can be designed according to actual needs. When the third end surface S3 includes multiple first microgrooves 331, the extension directions X1 of the multiple first microgrooves 331 may be the same or different.

[0088] In the embodiment of the present application, there is no limitation on the specific values ​​of the size of the first microgroove 331 in the extension direction X1, the size of the first microgroove 331 in the first target direction Y1, and the depth of the first microgroove 331, and they can be designed according to actual needs.

[0089] When the third end surface S3 includes a plurality of first microgrooves 331, the dimensions of the plurality of first microgrooves 331 in the extending direction X1 thereof may be the same or different. Similarly, when the third end surface S3 includes a plurality of first microgrooves 331, the dimensions of the plurality of first microgrooves 331 in the first target direction Y1 may be the same or different. When the third end surface S3 includes a plurality of first microgrooves 331, the depths of the plurality of first microgrooves 331 may be the same or different.

[0090] The embodiment of the present application forms a first microgroove 331 on the third end surface S3 of the boss portion 33 facing the chip 20, thereby improving the wettability of the liquid heat-conducting medium 40 on the third end surface S3, reducing the contact thermal resistance between the heat-conducting medium 40 and the boss portion 33, thereby improving the heat conduction efficiency between the liquid heat-conducting medium 40 and the boss portion 33, and improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0091] In some examples, as shown in FIG5 , when the chip 20 is located above the circuit board 10 along the gravity direction Q and the inclination angle α of the circuit board 10 relative to the horizontal plane W is less than or equal to a preset angle, the thermal conductive medium 40 simultaneously contacts the relative surfaces between the boss portion 33 and the chip 20 .

[0092] The specific value of the preset angle is not limited in the embodiment of the present application and can be designed according to actual needs. For example, the preset angle can be 30 degrees, 40 degrees, 50 degrees or larger.

[0093] In this way, when the chip heat dissipation assembly 200 is tilted, the thermal conductive medium 40 can always be in contact with the boss portion 33 and the chip 20, thereby ensuring that the thermal conductive medium 40 can continuously and efficiently transfer the heat generated by the chip 20 to the heat dissipation plate 31.

[0094] In some embodiments, as shown in FIG. 6 , the chip heat dissipation assembly 200 may further include a sealing structure 50 . The sealing structure 50 is located between the enclosure portion 32 and the chip 20 .

[0095] The sealing structure 50 provided between the enclosure 32 and the chip 20 can, on the one hand, fill the gap between the enclosure 32 and the chip 20 when there is a deviation in the height of the enclosure 32 and / or the height of the chip 20, thereby ensuring the sealing of the enclosed space M. On the other hand, when the thermal conductive medium 40 is in a liquid state, the sealing structure 50 can be used to prevent the thermal conductive medium 40 from leaking from the enclosed space M, which could cause a short circuit in the circuit board 10, thereby effectively improving the yield of the chip heat dissipation assembly 200.

[0096] In some examples, the sealing structure 50 can be a porous structure, with the diameters of the multiple pores in the sealing structure 50 being larger than those of air molecules. This allows gas in the enclosed space M to be discharged through the sealing structure 50, thereby reducing the likelihood of bubbles forming in the thermally conductive medium 40. This helps ensure the thermal conductivity of the thermally conductive medium 40 and the heat dissipation capacity of the chip heat dissipation assembly 200. It will be appreciated that due to surface tension, particles (e.g., ions, atoms, or molecules) in the liquid thermally conductive medium are attracted to each other, preventing the liquid thermally conductive medium from passing through the sealing structure 50.

[0097] For example, the material of the sealing structure 50 may include rubber or foam.

[0098] In some embodiments, as shown in FIG6 , chip 20 includes a wafer 21 and a protective cover 22. Wafer 21 is positioned on circuit board 10. Protective cover 22 covers the side of wafer 21 facing away from circuit board 10. Protective cover 22 protects wafer 21 from damage caused by external forces.

[0099] In some examples, chip 20 may include one wafer 21 . In other examples, chip 20 may include multiple wafers 21 .

[0100] In some examples, the chip 20 may further include a substrate (not shown) on which the wafer 21 is integrated. A protective cover 22 may be connected to the substrate. The wafer 21 may be electrically connected to the substrate via a first connection structure. A conductive layer may be formed within the substrate, the conductive layer including a wiring structure, through which the substrate may establish a signal path between wafers or between a wafer and other electronic devices.

[0101] When the wafer is set on the substrate, flip-chip ball grid array (FCBGA) packaging technology can be used. In some other packaging structures, wire bonding technology can also be used to set the wafer on the substrate. The substrate has a variety of structures to choose from. For example, the substrate can be a packaging substrate (substrate), or a redistribution layer (RDL) substrate made by a redistribution process, or an interposer. Of course, other structures are also possible. Among them, the substrate can be electrically connected to the circuit board through a second connection structure. Exemplarily, the second connection structure can be a ball grid array (BGA), or a plurality of copper pillar bumps arranged in an array, etc.

[0102] In some examples, as shown in FIG6 , the projection of the wafer 21 on the circuit board 10 is located inside the projection of the enclosure 32 on the circuit board 10. Thus, the projection of the wafer 21 on the circuit board 10 can be located inside the projection of the thermal conductive medium 40 on the circuit board 10. Heat generated by the wafer 21 can be quickly transferred to the thermal conductive medium 40 through the protective cover 22, thereby effectively improving the heat dissipation efficiency of the chip heat dissipation assembly 200.

[0103] In other examples, referring again to FIG6 , the projection of the wafer 21 on the circuit board 10 can be located inside the projection of the boss portion 33 on the circuit board 10. In this way, the heat generated by the wafer 21 can be quickly transferred to the thermally conductive medium 40 through the protective cover 22, and then quickly transferred from the thermally conductive medium 40 to the boss portion 33, and then from the boss portion 33 to the heat sink 31, effectively shortening the heat transfer path and improving the heat dissipation efficiency of the chip heat dissipation assembly 200.

[0104] In some examples, as shown in FIG6 , the chip 20 further includes a heat-conducting layer 23, which is located between the protective cover 22 and the wafer 21. Thus, the heat generated by the wafer 21 can be transferred to the protective cover 22 through the heat-conducting layer 23, effectively improving the heat transfer efficiency between the wafer 21 and the protective cover 22, and further improving the heat dissipation capability of the chip heat dissipation assembly 200.

[0105] In other embodiments, the chip 20 may also include only a wafer. In this case, a closed space M may be formed between the blocking portion 32 , the boss portion 33 , the heat sink 31 and the wafer.

[0106] In some embodiments, as shown in Figure 7, the chip 20 may include a second end surface S2 facing away from the circuit board 10, the second end surface S2 includes a second microgroove 201, the extension direction X2 of the second microgroove 201 is parallel to the second end surface S2, and along the second target direction Y2 perpendicular to the extension direction X2 of the second microgroove 201, the size d5 of the second microgroove 201 is less than 1 mm.

[0107] In some examples, the second end surface S2 may include a plurality of second microgrooves 201. In this case, the specific number of the second microgrooves 201 is not limited in the embodiment of the present application and can be designed according to actual needs. When the second end surface S2 includes a plurality of second microgrooves 201, the extension directions X2 of the plurality of second microgrooves 201 may be the same or different.

[0108] In the embodiment of the present application, there is no limitation on the specific values ​​of the size of the second microgroove 201 in its extension direction X2, the size of the second microgroove 201 in the second target direction Y2, and the depth of the second microgroove 201, and they can be designed according to actual needs.

[0109] It is understandable that, when the chip includes the protective cover 22 , the second end surface S2 of the chip 20 facing away from the circuit board 10 may be the surface of the protective cover 22 facing away from the circuit board 10 .

[0110] The embodiment of the present application forms a second microgroove 201 on the second end surface S2 of the chip 20, thereby improving the wettability of the liquid heat-conducting medium 40 on the second end surface S2, reducing the contact thermal resistance between the heat-conducting medium 40 and the chip 20, thereby improving the heat conduction efficiency between the liquid heat-conducting medium 40 and the chip 20, and improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0111] In some embodiments, as shown in FIG6 , the chip heat dissipation assembly 200 may further include a lower housing 60. The lower housing 60 is located on one side of the circuit board 10 and the chip 20. The lower housing 60 is connected to the heat dissipation plate 31 to form a chamber T, in which the circuit board 10 and the chip 20 are both located.

[0112] In the embodiment of the present application, the lower shell 60 is connected to the heat sink 31 to form a chamber T. The circuit board 10 and the chip 20 are both located in the chamber T, so that the heat sink 31 and the lower shell 60 can be used to protect the circuit board 10 and the chip 20.

[0113] As shown in FIG8 , the embodiment of the present application further provides a method for preparing a chip heat dissipation assembly 200 , which includes steps S100 to S400 .

[0114] S100. As shown in FIG9 , a heat dissipation structure 30 is provided. The heat dissipation structure 30 includes a heat dissipation plate 31, a retaining portion 32, and a boss portion 33. The retaining portion 32 and the boss portion 33 are both connected to the heat dissipation plate 31, and the retaining portion 32 is disposed around the boss portion 33. A receiving groove 302 is formed between the retaining portion 32, the boss portion 33, and the heat dissipation plate 31.

[0115] S200 , as shown in FIG10 , placing a solid heat-conducting medium 40 in the containing tank 302 .

[0116] 10 , the volume of the solid thermally conductive medium 40 may be smaller than the volume of the receiving tank 302. In other examples, the volume of the solid thermally conductive medium 40 may be equal to the volume of the receiving tank 302.

[0117] S300 , referring to FIG. 6 , a circuit board 10 and a chip 20 are provided, and the chip 20 is disposed on the circuit board 10 .

[0118] S400. Referring to Figure 6, the heat dissipation structure 30 is connected to the circuit board 10. At this point, the heat dissipation structure 30 covers the side of the chip 20 facing away from the circuit board 10. The retaining portion 32 and the boss portion 33 are located on the side of the heat sink 31 that is closer to the chip 20. A closed space M is defined between the heat sink 31, the retaining portion 32, the boss portion 33, and the chip 20. A gap L is formed between the boss portion 33 and the chip 20. A thermally conductive medium 40 is filled in the closed space M. The thermally conductive medium 40 is solid at a first temperature and liquid at a second temperature, which is higher than the first temperature.

[0119] For example, after the heat dissipation structure 30 is connected to the circuit board 10 , the chip heat dissipation assembly 200 may be placed in a high-temperature oven and baked for a period of time so that the thermal conductive medium 40 changes from solid to liquid and contacts the chip 20 .

[0120] The beneficial effects that can be achieved by the method for preparing the chip heat dissipation assembly 200 provided in the embodiment of the present application are the same as the beneficial effects that can be achieved by the chip heat dissipation assembly 200 provided in any of the above embodiments, and will not be repeated here.

[0121] An embodiment of the present application further provides a vehicle, as shown in FIG11 , wherein the vehicle 300 includes a vehicle body 310 and a chip heat dissipation assembly 200 as described in any of the above embodiments, and the chip heat dissipation assembly 200 is located inside the vehicle body 310 .

[0122] It should be understood that Figure 11 merely illustrates the placement of the vehicle body 310 and the chip heat dissipation assembly 200. In practice, the structure of the vehicle body 310 may differ from that shown in Figure 11 , and the placement of the chip heat dissipation assembly 200 may also differ from that shown in Figure 11 . In the embodiments of this application, the specific structure of the vehicle body 310 and the placement of the chip heat dissipation assembly 200 are not limited, as long as the chip heat dissipation assembly 200 is placed within the vehicle body 310.

[0123] Among them, the vehicle can be, but is not limited to, a pure electric vehicle (pure electric vehicle / battery electric vehicle, PEV / BEV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV), a new energy vehicle (new energy vehicle), a fuel vehicle, etc.

[0124] For example, the chip heat dissipation assembly 200 can be applied to a vehicle's automatic driving module, a braking system module, a steering and braking system module, and other modules.

[0125] The beneficial effects that can be achieved by the vehicle provided by the embodiment of the present application are the same as the beneficial effects that can be achieved by the chip heat dissipation assembly 200 provided by any of the above embodiments, and will not be repeated here.

[0126] It can be understood that the chip heat dissipation assembly 200 provided in the embodiment of the present application can be applied not only to the vehicle 300 as described above, but also to any device that requires chip heat dissipation, such as mobile phones, tablet computers, laptops, smart bracelets, smart watches, and other smart consumer electronic devices, as well as telecommunications room-type equipment such as metropolitan area routers and central routers, IT computer room-type equipment such as data center servers and data center switches, and vehicle-mounted equipment such as mobile data centers (MDCs). It can also be applied to industrial robots, rail transit (such as subways and high-speed railways) or special power supplies (such as ships, airplanes, and vehicles), etc. The embodiments of the present application do not impose any restrictions on this.

[0127] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0128] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A chip heat dissipation component, characterized in that: include: Circuit boards; A chip, located on the circuit board; A heat dissipation structure, covering a side of the chip away from the circuit board and connected to the circuit board; the heat dissipation structure comprises a heat dissipation plate, a baffle and a boss portion, the baffle and the boss portion are located on a side of the heat dissipation plate close to the chip; the baffle and the boss portion are both connected to the heat dissipation plate, the baffle portion is arranged around the boss portion; a closed space is enclosed between the heat dissipation plate, the baffle, the boss portion and the chip, and there is a gap between the boss portion and the chip; A heat-conducting medium is filled in the closed space, wherein the heat-conducting medium is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

2. The chip heat dissipation assembly according to claim 1, characterized in that: The enclosure portion includes a first end surface facing away from the heat sink, the chip includes a second end surface facing away from the circuit board, and the first end surface is opposite to the second end surface.

3. The chip heat dissipation assembly according to claim 2, characterized in that: The blocking portion is arranged along the edge of the second end surface.

4. The chip heat dissipation assembly according to any one of claims 1 to 3, characterized in that: In a direction perpendicular to the circuit board, a size of the blocking portion is larger than a size of the boss portion.

5. The chip heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The boss portion includes a third end surface facing the chip, the third end surface includes a first micro groove, and an extending direction of the first micro groove is parallel to the third end surface.

6. The chip heat dissipation assembly according to any one of claims 1 to 5, characterized in that: The chip comprises a second end surface facing away from the circuit board, the second end surface comprises a second micro groove, and the extension direction of the second micro groove is parallel to the second end surface.

7. The chip heat dissipation assembly according to any one of claims 1 to 6, characterized in that: Also includes: The sealing structure is located between the enclosure and the chip.

8. The chip heat dissipation assembly according to claim 7, characterized in that: The sealing structure is a porous structure, and the diameters of the multiple holes in the sealing structure are larger than the diameters of air molecules.

9. The chip heat dissipation assembly according to any one of claims 1 to 8, characterized in that: The heat conducting medium is liquid metal.

10. A vehicle, characterized in that: include: Car body, The chip heat dissipation assembly according to any one of claims 1 to 9, wherein the chip heat dissipation assembly is located inside the vehicle body.

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