Thermal management device and energy storage system

Abstract

Disclosed in embodiments of the present application are a thermal management device and an energy storage system, which can increase the space utilization rate of the thermal management device and reduce the size of the thermal management device. The thermal management device comprises a cabinet, fans, a first heat dissipation module, and a second heat dissipation module; the fans are arranged on the top surface of the cabinet; the first heat dissipation module and the second heat dissipation module are both of a plate-shaped structure; the included angle between the first heat dissipation module and the top surface is unequal to the included angle between the second heat dissipation module and the top surface; and the distance between the end of the first heat dissipation module close to the top surface and the end of the second heat dissipation module close to the top surface is greater than the distance between the end of the first heat dissipation module distant from the top surface and the end of the second heat dissipation module distant from the top surface.

Description

Thermal management device and energy storage system

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 30, 2023, with application number 202311109264.6 and application name “A Thermal Management Device and Energy Storage System”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of thermal management technology, and in particular to a thermal management device and an energy storage system. Background Art

[0003] With the development of new energy technologies, secondary batteries such as lithium-ion batteries have been widely used in energy storage devices, electric vehicles, power tools, and other industries due to their high volume capacity density, light weight, small size, and environmentally friendly characteristics. For example, in an energy storage device, multiple lithium-ion battery cells are combined to form a battery module, and multiple battery modules are combined to form a battery cluster. When the energy storage battery of an energy storage device is charged or discharged, the energy storage battery generates a large amount of heat. Coupled with the limited space within the energy storage device, the temperature within the energy storage battery rises rapidly, seriously affecting the performance and service life of the lithium-ion battery cells. Therefore, in order to reduce the temperature of the energy storage battery, a heat dissipation system, such as an air cooling system or a liquid cooling system, is generally installed in the energy storage device.

[0004] Air cooling is primarily used in applications with low cooling density, featuring a simple structure and small equipment footprint. Liquid cooling, with its strong heat transfer capability, is often used in equipment that generates large amounts of heat, such as heat dissipation for energy storage batteries. However, due to the large number of internal components and complex structure, liquid cooling systems often occupy a large space.

[0005] Therefore, improving the space utilization of the liquid cooling system and realizing the integration and miniaturization of the liquid cooling system are still issues that need to be urgently addressed in the industry.

[0006] Application Contents

[0007] The embodiments of the present application provide a thermal management device and an energy storage system. Through the internal structural design of the thermal management device, the volume of the thermal management device is reduced under the same heat dissipation conditions, thereby improving the space utilization of the thermal management device.

[0008] Based on this, the embodiments of the present application provide the following technical solutions:

[0009] In a first aspect, an embodiment of the present application first provides a thermal management device that can be used in an energy storage system to perform temperature management on energy storage modules in an energy storage device. The thermal management device includes a cabinet, a fan, a first heat dissipation module, and a second heat dissipation module. The fan is arranged on the top surface of the cabinet. The first heat dissipation module and the second heat dissipation module are both plate-shaped structures and present an approximate V-shaped structure. The distance between the end of the first heat dissipation module close to the top surface and the end of the second heat dissipation module close to the top surface is greater than the distance between the end of the first heat dissipation module away from the top surface and the end of the second heat dissipation module away from the top surface, that is, the opening direction of the approximate V-shaped structure formed by the first heat dissipation module and the second heat dissipation module is toward the top surface of the cabinet. The angle between the first heat dissipation module and the top surface is not equal to the angle between the second heat dissipation module and the top surface, that is, the approximate V-shaped structure formed by the two heat dissipation modules is asymmetric.

[0010] The first and second heat dissipation modules employ the aforementioned approximately asymmetric V-shaped structure. This can increase the area of ​​the air convection heat dissipation region between the two heat dissipation modules while maintaining the same internal space size within the thermal management device, thereby improving the efficiency of air circulation within the thermal management device and thus enhancing heat dissipation efficiency. Conversely, the first and second heat dissipation modules employ the aforementioned approximately asymmetric V-shaped structure, thereby increasing the utilization of the internal space of the thermal management device 1 and reducing the volume of the thermal management device 1 while maintaining the same heat dissipation efficiency.

[0011] In a possible implementation, the cabinet further comprises a frame, which comprises an upper frame, a lower frame, and a plurality of columns connecting the upper frame and the lower frame. The frame can provide structural support for the cabinet.

[0012] In a possible implementation, the surface of the first heat dissipation module away from the second heat dissipation module is covered with a first filter, and one end of the first filter close to the top surface is slidably connected to a sliding component provided on the inner surface of the top surface or the upper frame.

[0013] The first filter is slidably connected to the cabinet via a sliding assembly, so that the first filter can be directly drawn out from the side of the cabinet for maintenance, thereby improving the maintainability of the first filter.

[0014] In one possible implementation, the cabinet further includes a partition, and the internal storage space of the cabinet is divided into an upper space close to the top surface and a lower space away from the top surface by the partition, and the first heat dissipation module and the second heat dissipation module are both located in the upper space.

[0015] Arranging the first heat dissipation module and the second heat dissipation module in the upper space of the cabinet can accelerate the air convection inside the thermal management device by utilizing the phenomenon that hot air floats up and cold air sinks, which is beneficial to energy saving.

[0016] In one possible implementation, the surface of the first heat dissipation module away from the second heat dissipation module is covered with a first filter, and the end of the first filter away from the top surface is slidably connected to the second sliding component provided on the partition, and the second sliding component is provided on the surface of the partition facing the top surface.

[0017] The first filter is slidably connected to the cabinet via a sliding assembly, so that the first filter can be directly drawn out from the side of the cabinet for maintenance, thereby improving the maintainability of the first filter.

[0018] In one possible implementation, the surface of the second heat dissipation module away from the first heat dissipation module is covered with a second filter. The frame also includes a partition frame arranged between the lower frame and the upper frame along the first direction, and a plurality of columns sequentially connect the lower frame, the partition frame and the upper frame along the first direction. The second filter is arranged perpendicular to the partition, and the end of the second filter close to the top surface is detachably fixed to the upper frame, and the end of the second filter away from the top surface is detachably fixed to the partition frame. Exemplarily, the detachable fixing method can be a common detachable fixing method such as connecting two hanging ears with screws, a bayonet, etc.

[0019] The filter is detachably fixed to the frame, so that maintenance personnel can directly remove the filter from the front of the cabinet when performing maintenance on the filter, which reduces the difficulty and time of filter maintenance, saves maintenance labor costs, facilitates operation, avoids the need to remove other components during maintenance, and improves system reliability.

[0020] In one possible implementation, the internal components of the above-mentioned thermal management device also include an expansion tank, a fluid replenishing tank, an oil separator, or a gas-liquid separator. The expansion tank, the fluid replenishing tank, the oil separator, or the gas-liquid separator is arranged on the side of the partition facing the top surface, and is located between the side of the first heat dissipation module away from the second heat dissipation module and the side of the cabinet.

[0021] Some devices that contain liquid or through which liquid passes are placed on the partition. These devices are placed in the upper space and can be separated from other devices in the lower space (such as the electronic control system) by the partition, which can prevent the devices in the lower space from direct contact with water and reduce safety risks such as short circuits.

[0022] In a possible implementation, an angle between the first heat dissipation module and the top surface is smaller than an angle between the second heat dissipation module and the top surface.

[0023] When the angle between the first heat dissipation module and the top surface is smaller than the angle between the second heat dissipation module and the top surface, the space between the first heat dissipation module and the side of the cabinet is larger than the space between the second heat dissipation module and the side of the cabinet. Therefore, arranging the above-mentioned liquid replenishing tank, expansion tank, oil separator or gas-liquid separator between the first heat dissipation module and the side of the cabinet is more conducive to improving space utilization and reducing the volume of the thermal management device.

[0024] In one possible implementation, the thermal management device further includes a coolant system and a refrigerant system. The coolant system includes a water pump, a filter, a three-way valve, a refill pump, a heater, or a sensor, and the refrigerant system includes a compressor or a four-way valve. The coolant system and the refrigerant system are disposed within the lower space of the cabinet and are arranged in complementary, overlapping zones within the lower space. For example, the coolant system and the refrigerant system can be placed in left and right zones within the lower space, allowing for independent maintenance of both systems from the left and right sides.

[0025] In one possible implementation, the above-mentioned thermal management device also includes an electrical control box, which is located in the lower space of the cabinet. The electrical control box is adjacent to the two adjacent sides of the cabinet, that is, there are no other devices between the electrical control box and the two adjacent sides of the cabinet, that is, the electrical control box is arranged in a corner of the lower space.

[0026] Placing the electrical control box in the lower compartment of the cabinet prevents it from blocking the heat dissipation of the two cooling modules in the upper compartment, improving heat dissipation efficiency. Furthermore, the electrical control box is separated from the coolant and refrigerant systems, isolating them from water and electricity, reducing the risk of short circuits and ensuring safe operation of the thermal management system.

[0027] In a possible implementation, the electric control box is connected to one of the plurality of columns via a rotating assembly, which may include a hinge.

[0028] The electric control box is connected to one of the multiple columns of the cabinet frame through the rotating assembly, so that the electric control box can be rotated out of the cabinet for maintenance through the rotating assembly, thereby improving the maintainability of the electric control box.

[0029] In one possible implementation, at least one lifting ring is provided on the outer surface of the upper frame of the cabinet to facilitate a crane to lift the thermal management device through the lifting ring; alternatively, a plurality of rollers may be provided on the outer surface of the bottom surface of the cabinet to facilitate the movement of the thermal management device through the rolling of the rollers; alternatively, at least one forklift opening may be provided on the partition to facilitate a forklift to lift the thermal management device through the forklift opening.

[0030] By setting lifting rings, rollers or forklift openings on the cabinet, the problem of large size, heavy weight and difficulty in handling and transportation of liquid cooling units can be effectively solved, making the thermal management device easy to transport and carry, and easier to move to the application site.

[0031] In a possible implementation, the fan is disposed on the outer surface of the top surface, which can reduce the space occupied by the interior of the cabinet and further reduce the volume of the thermal management module.

[0032] In one possible implementation, the first heat dissipation module includes a first refrigerant flow channel plate and a first coolant flow channel plate, which are bonded and fixed together; the second heat dissipation module includes a second refrigerant flow channel plate and a second coolant flow channel plate, which are bonded and fixed together. For example, the first refrigerant flow channel plate and the first coolant flow channel plate can be fixed together using sheet metal screws or other fixing methods.

[0033] The heat dissipation module is formed by bonding and fixing the refrigerant flow channel plate and the coolant flow channel plate together, which is equivalent to providing two sets of heat exchange structures for the refrigerant and the coolant, and can further improve the heat dissipation efficiency.

[0034] In a second aspect, an embodiment of the present application provides an energy storage system, which includes an energy storage module and the thermal management device described in the first aspect above, wherein the thermal management device is used to dissipate heat from the energy storage module.

[0035] In a possible implementation, the thermal management device is disposed on the top of the energy storage module, or the thermal management device is disposed in contact with the side of the energy storage module.

[0036] The second aspect of the embodiment of the present application can achieve the beneficial effects described in the first aspect. To avoid repetition, it will not be described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1A is a schematic structural diagram of an energy storage system provided in an embodiment of the present application;

[0038] FIG1B is a schematic structural diagram of another energy storage system provided in an embodiment of the present application;

[0039] FIG2 is a perspective schematic diagram of a thermal management device provided in an embodiment of the present application;

[0040] FIG3 is a partial side view of a thermal management device provided in an embodiment of the present application;

[0041] FIG4 is another partial side view of a thermal management device provided in an embodiment of the present application;

[0042] FIG5 is a side view of a thermal management device provided in an embodiment of the present application;

[0043] FIG6 is a schematic diagram of the back side of a thermal management device provided in an embodiment of the present application;

[0044] FIG7 is another perspective schematic diagram of a thermal management device provided in an embodiment of the present application;

[0045] FIG8 is a front view of a thermal management device provided in an embodiment of the present application;

[0046] Reference numerals:

[0047] 1- Thermal management device; 2- Energy storage module; 11- Cabinet; 12- Fan; 13- First heat dissipation module; 14- Second heat dissipation module; 15- Partition; 16- Fluid replenishment tank; 17- Expansion tank; 18- Oil separator; 19- Gas-liquid separator; 110- Water pump; 111- Filter; 112- Three-way valve; 113 Fluid replenishment pump; 114- Compressor; 115- Four-way valve; 116- Evaporation plate Replacement; 117-electrical control box; 118-rotating assembly; 131-first angle; 141-second angle; 132-first filter; 142-second filter; 1101-cabinet top; 1102-cabinet bottom; 1103-cabinet side; 1104-upper space of the cabinet; 1105-lower space of the cabinet; 1106-lifting ring; 1107-roller; 1108-forklift opening. DETAILED DESCRIPTION

[0048] The following describes embodiments of the present invention in conjunction with the accompanying drawings of the embodiments of the present invention. In the following description, specific aspects of the embodiments of the present invention or drawings in which specific aspects of the embodiments of the present invention may be used are shown. It should be understood that the embodiments of the present invention may be used in other aspects and may include structural or logical changes not depicted in the drawings. Therefore, the following detailed description should not be understood in a limiting sense, and the scope of the present invention is defined by the appended claims.

[0049] It should be noted that, in the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in this article is merely a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, “multiple” refers to two or more than two, and “at least one” and “one or more” refer to one, two or more. The singular expressions “a”, “an”, “said”, “the” and “this” are intended to also include expressions such as “one or more”, unless there is a clear indication to the contrary in the context.

[0050] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0051] In the description of the embodiments of the present application, the terms "up", "down", "left", "right", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientation of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0052] In the embodiments of the present application, the same reference numerals are used to represent the same component or the same part. In addition, the various parts in the drawings are not drawn to scale, and the sizes and dimensions of the parts shown in the drawings are only exemplary and should not be understood as limiting the present application.

[0053] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," "fixed," "connected," and "configured" should be interpreted broadly. For example, these terms may include fixed connection, detachable connection, detachable fixation, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two devices or interaction between two devices, unless otherwise expressly specified or limited. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0054] It should be noted that when a device is referred to as being "fixed to," "disposed on," or "configured on" another device, it may be directly on the other device or there may be a central device. When a device is considered to be "connected to" another device, it may be directly connected to the other device or there may be a central device. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0055] The terms used in the embodiments of the present invention are only used to explain the specific embodiments of the present invention and are not intended to limit the present invention.

[0056] With the development of new energy technologies, the importance and complexity of energy storage systems are gradually increasing. In addition to energy storage modules, energy storage systems also need to consider heat dissipation and insulation requirements for these modules under various ambient temperatures. The thermal management devices of energy storage systems must not only dissipate the heat generated by components such as battery modules during operation, but also maintain a suitable operating temperature for these modules in cold weather.

[0057] Typically, thermal management devices in energy storage systems use refrigerant and coolant circuits to connect various components for heat exchange and maintain the heat requirements of each component. However, the large number of coolant and refrigerant circuits and complex piping, coupled with the use of multiple pipe connections, can lead to complex installation of thermal management devices, large space requirements, low thermal efficiency, difficulty in maintenance, and excessive access areas. This increases the operation and maintenance costs of the energy storage system and affects its service life and stability. Therefore, the integration, miniaturization, and ease of maintenance of thermal management devices in energy storage systems have become industry trends.

[0058] The present invention provides a thermal management device that improves space utilization and reduces the size of the device by rationally arranging its internal components. Furthermore, rationally arranging its internal components facilitates maintenance and improves the maintainability of the device.

[0059] The present application also provides an energy storage system, comprising a thermal management device 1 and an energy storage module 2. The thermal management device 1 is configured to exchange heat with the energy storage module 2. Referring to Figures 1A and 1B , Figures 1A and 1B are schematic diagrams of the structure of the energy storage system provided in the present application. The thermal management device 1 provided in the present application can be arranged at a side end of the energy storage module 2 as shown in Figure 1A , or can be arranged at the top of the energy storage module 2 as shown in Figure 1B .

[0060] The thermal management device 1 has two main working modes. In the first working mode, the thermal management device 1 mainly provides cooled liquid for the energy storage module 2. Because the energy storage module 2 generates heat during the charging and discharging process, and excessive heat in the battery cell will affect the service life of the battery cell, the thermal management device 1 is used to cool down the energy storage module 2 to ensure that the operating temperature of the energy storage module 2 is appropriate, thereby increasing the service life of the battery cell. In the second working mode, in extremely cold areas, the temperature of the energy storage module 2 is low and the storage capacity decreases. At this time, the thermal management device 1 can include a heater, which is connected to the liquid pipeline of the thermal management device 1 to heat the liquid in the liquid pipeline, thereby heating the energy storage module 2 to ensure that the battery cell always operates at an appropriate temperature, which is beneficial to increasing the service life of the battery cell.

[0061] In addition to the above-mentioned thermal management device 1, in order to achieve the purpose of thermal management of the energy storage module 2, the thermal management system usually also includes one or more liquid inlet pipes, one or more liquid return pipes and one or more liquid cooling tube plates. Among them, the thermal management device 1 is usually a centralized thermal management cabinet, that is, a thermal management cabinet controls one or more liquid inlet pipes and one or more liquid return pipes, one or more liquid inlet pipes are connected to the liquid outlet of the thermal management cabinet, and one or more liquid return pipes are connected to the liquid inlet of the thermal management cabinet. The liquid cooling tube plate is usually arranged close to the energy storage module to facilitate heat exchange with the energy storage module. One or more liquid inlet pipes are connected to the liquid inlet of one or more liquid cooling tube plates in a one-to-one correspondence, one or more liquid return pipes can be connected to the liquid outlet of one or more liquid cooling tube plates in a one-to-one correspondence, and one or more liquid cooling tube plates are arranged in a one-to-one correspondence with one or more battery modules. In this way, the coolant can circulate back and forth between the thermal management cabinet, the liquid inlet pipe, the liquid return pipe, and the liquid cooling tube plate. On the one hand, it can absorb and conduct the heat generated by the energy storage module, thereby achieving the purpose of cooling the energy storage module. On the other hand, it can heat the coolant and conduct the heat to the energy storage module, thereby achieving the purpose of heating the energy storage module.

[0062] The energy storage system provided in the embodiments of this application can be used, but is not limited to, in industrial and commercial energy storage scenarios such as small-scale industrial and commercial (e.g., small factories), medium-sized industrial and commercial, large-scale industrial and commercial, photovoltaic storage and charging stations, and small and medium-sized microgrids (e.g., islands), as well as power station scenarios such as wind and solar energy storage power stations, grid energy storage power stations, and large microgrids, for storing and releasing electrical energy. In practical applications, the energy storage system can be embodied in the form of energy storage cabinets, energy storage containers, etc.

[0063] Please refer to Figure 2, which is a perspective schematic diagram of a thermal management device 1 provided in an embodiment of the present application. For ease of description, a reference coordinate system is established based on the X, Y, and Z directions in the figure. A first direction Y, a second direction X, and a third direction Z are set. Any two of the first direction Y, the second direction X, and the third direction Z are perpendicular to each other, and the first direction Y is parallel to the direction of gravity. The surface viewed along the third direction Z toward the thermal management device 1 is referred to as the front surface of the thermal management device 1, and the surface viewed along the second direction X toward the thermal management device 1 is referred to as the side surface of the thermal management device 1.

[0064] In an embodiment of the present application, please refer to Figure 3, which is a partial side schematic diagram of the thermal management device 1 provided in an embodiment of the present application. As shown in Figure 3, the thermal management device 1 includes a cabinet 11, a fan 12, a first heat dissipation module 13 and a second heat dissipation module 14.

[0065] The cabinet 11 includes a top surface 1101, a bottom surface 1102, and four side surfaces 1103, which together form a storage space within the cabinet. In one possible implementation, the cabinet may include a frame and a cabinet panel, wherein the frame includes a lower frame, a partition frame, and an upper frame arranged in sequence along a first direction Y, and a plurality of columns connecting the lower frame, partition frame, and upper frame in sequence along the first direction Y. The lower frame, partition frame, and upper frame are generally rectangular frames. The cabinet panel includes a first cabinet panel disposed on the top of the cabinet, a second cabinet panel disposed on the side of the cabinet, and a third cabinet panel disposed on the bottom of the cabinet, wherein the first cabinet panel, the second cabinet panel, and the third cabinet panel together form a storage space within the cabinet. In this case, the first cabinet panel is the top surface 1101 of the cabinet 11, the second cabinet panel is the side surface 1103 of the cabinet 11, and the third cabinet panel is the bottom surface 1102 of the cabinet 11. The first cabinet panel, the second cabinet panel, and the third cabinet panel are detachably connected to the cabinet 11. For example, they can be detachably fixed by screws, bayonets, etc., so that the cabinet panels can be removed during maintenance. According to actual product needs, the cabinet panels can also be set to be partially hollowed out. It should be understood that in actual products, the cabinet panels can be fixedly connected to the frame to form a cabinet, and the cabinet panels and the frame can also be formed into a cabinet in an integral manner. The embodiments of the present application do not limit the specific shape and installation combination of the cabinet.

[0066] Among them, the fan 12 is arranged on the top surface 1101 of the cabinet 11, and can accelerate the air convection inside the thermal management device 1 by utilizing the principle that hot air floats up and cold air sinks, which is beneficial to energy saving. In one possible implementation, the fan 12 can be arranged on the outer surface of the top surface 1101 as shown in Figure 3, which can reduce the occupation of the internal space of the cabinet 11 and further reduce the volume of the thermal management module 1. In another possible implementation, the fan 12 can also be arranged on the inner surface of the top surface 1101. The embodiment of the present application does not limit the specific arrangement of the fan 12. According to actual product requirements, two fans 12 can be set on the top surface 1101 of the cabinet 11, or three fans 12 can be set. The number of fans 12 can be set according to specific product needs. The embodiment of the present application does not limit the specific number of fans. Optionally, considering that the fan 12 may injure workers during operation, a protective cover can be installed outside the fan 12. On the one hand, it can prevent workers from being injured by accidental touch; on the other hand, it can prevent debris in the environment from entering the fan 12 and causing damage to the fan 12.

[0067] The first heat dissipation module 13 and the second heat dissipation module 14 are both plate-like structures, for example, flat plate structures, or plate-like structures with a certain curvature. For the convenience of description, in the embodiment of the present application, the end of the first heat dissipation module 13 close to the top surface 1101 is defined as the first end of the first heat dissipation module 13, the end of the first heat dissipation module 13 away from the top surface 1101 is defined as the second end of the first heat dissipation module 13, the end of the second heat dissipation module 14 close to the top surface 1101 is defined as the first end of the second heat dissipation module 14, and the end of the second heat dissipation module 14 away from the top surface 1101 is defined as the second end of the second heat dissipation module 14.

[0068] In an embodiment of the present application, the two heat dissipation modules are arranged into an approximately asymmetric V-shaped structure. The reason why it is an approximately V-shaped structure is that the ends of the two heat dissipation modules that are close to each other can either touch each other or not touch each other (there is a certain distance). The opening direction of the approximately V-shaped structure is toward the fan 12, that is, the opening direction of the approximately V-shaped structure is toward the top surface 1101. In other words, the distance between the first end of the first heat dissipation module 13 and the first end of the second heat dissipation module 14 is greater than the distance between the second end of the first heat dissipation module 13 and the second end of the second heat dissipation module 14. In a possible implementation, the distance between the first end of the first heat dissipation module 13 and the first end of the second heat dissipation module 14 can be specifically the distance in the third direction Z, which can be measured by measuring the distance between the projections of the first end of the first heat dissipation module 13 and the first end of the second heat dissipation module 14 in the first direction Y. Similarly, the distance between the second end of the first heat dissipation module 13 and the second end of the second heat dissipation module 14 can be specifically the distance in the third direction Z, which can be measured by measuring the distance between the projections of the second end of the first heat dissipation module 13 and the second end of the second heat dissipation module 14 in the first direction Y.

[0069] The first heat dissipation module 13 and the second heat dissipation module 14 release a large amount of heat when working. Therefore, the fan 12 and the opening direction of the approximately V-shaped structure composed of the two heat dissipation modules are arranged relative to each other. This can promptly transfer the heat released by the heat dissipation modules to the outside of the cabinet 11, which is conducive to improving the heat dissipation efficiency.

[0070] There is a first angle 131 between the first heat dissipation module 13 and the top surface 1101, and there is a second angle 141 between the second heat dissipation module 14 and the top surface 1101. It should be noted that the angle between the heat dissipation module and the top surface is the angle (acute angle or right angle) between the surface where the heat dissipation module is located and the top surface. In one possible implementation, the first heat dissipation module 13 may not be a straight plate-like structure. In this case, the angle between the straight line connecting the first end and the second end of the first heat dissipation module 13 and the top surface 1101 can be used as the first angle 131. Similarly, the second heat dissipation module 14 may not be a straight plate-like structure. In this case, the angle between the straight line connecting the first end and the second end of the first heat dissipation module 14 and the top surface 1101 can be used as the second angle 141. In an embodiment of the present application, the first angle is not equal to the second angle, that is, the approximate V-shaped structure formed by the two heat dissipation modules is asymmetric. In one possible implementation, as shown in FIG3 , the angle between the first heat dissipation module 13 and the top surface 1101 is an acute angle, and the angle between the second heat dissipation module 14 and the top surface 1101 is a right angle. That is, the second heat dissipation module 14 is arranged perpendicular to the top surface 1101. In this case, the first angle is smaller than the second angle. In another possible implementation, as shown in FIG4 , the angle between the first heat dissipation module 13 and the top surface 1101 and the angle between the second heat dissipation module 14 and the top surface 1101 are both acute angles, and the first angle 131 is smaller than the second angle 141.

[0071] The first heat dissipation module 13 and the second heat dissipation module 14 adopt an asymmetric V-shaped structure similar to that shown in Figures 3 or 4. This can increase the area of ​​the air convection heat dissipation region between the two heat dissipation modules while maintaining the same internal space size of the thermal management device 1, thereby improving the efficiency of air circulation within the wind field of the thermal management device and improving heat dissipation efficiency. Conversely, the first heat dissipation module 13 and the second heat dissipation module 14 adopt an asymmetric V-shaped structure similar to that shown in Figures 3 or 4, which can improve the utilization rate of the internal space of the thermal management device 1 and reduce the volume of the thermal management device 1 while maintaining the same heat dissipation efficiency.

[0072] Among them, the first heat dissipation module 13 and the second heat dissipation module 14 may include a dual heat dissipation structure. Specifically, the first heat dissipation module 13 may include a first refrigerant flow channel plate and a first coolant flow channel plate, and the second heat dissipation module 14 may include a second refrigerant flow channel plate and a second coolant flow channel plate.

[0073] Taking the first heat dissipation module 13 as an example, the first refrigerant flow channel plate can adopt a circular tube heat exchanger or a microchannel heat exchanger. When a circular tube heat exchanger is adopted, the first refrigerant flow channel plate includes a plurality of fins and circular tubes inserted between the fins. When a microchannel heat exchanger is adopted, the first refrigerant flow channel plate includes a plurality of fins and microchannels inserted between the fins. Similarly, the first cooling liquid channel plate can adopt a circular tube heat exchanger or a microchannel heat exchanger. When a circular tube heat exchanger is adopted, the first cooling liquid channel plate includes a plurality of fins and circular tubes inserted between the fins. When a microchannel heat exchanger is adopted, the first cooling liquid channel plate includes a plurality of fins and microchannels inserted between the fins. The first refrigerant flow channel plate and the first cooling liquid channel plate are fitted and fixed. For example, the first refrigerant flow channel plate and the first cooling liquid channel plate can be fixed by fixing methods such as sheet metal screws. The embodiment of the present application does not limit the fixing method between the first refrigerant flow channel plate and the first cooling liquid channel plate. The first refrigerant flow channel plate and the first coolant flow channel plate can be partially or fully fitted and fixed. The embodiment of the present application does not limit the fitting method and fitting area between the first refrigerant flow channel plate and the first coolant flow channel plate. The first refrigerant flow channel plate and the first coolant flow channel plate can also adopt other heat exchange structures besides circular tube heat exchangers and microchannel heat exchangers. The embodiment of the present application does not limit the specific structure of the first refrigerant flow channel plate and the first coolant flow channel plate. The second heat dissipation module 14 adopts the same or similar structural design as the first heat dissipation module 13. To avoid repetition, it will not be described again.

[0074] For example, refrigerants such as Freon and ammonia can flow through the pipes in the refrigerant flow plate, and coolants such as ethylene glycol, ethylene glycol aqueous solution, and water can flow through the pipes in the coolant flow plate. It should be understood that the above examples of refrigerants and coolants are merely exemplary, and the present embodiments do not limit the composition of the refrigerants and coolants.

[0075] The heat dissipation module is formed by bonding and fixing the refrigerant flow channel plate and the coolant flow channel plate together, which is equivalent to providing two sets of heat exchange structures for the refrigerant and the coolant, and can further improve the heat dissipation efficiency.

[0076] Please refer to FIG5 , which is a side view of a thermal management device provided in an embodiment of the present application. In the embodiment of the present application, as shown in FIG5 , the thermal management device 1 further includes a partition 15, which divides the internal accommodation space of the cabinet 11 into an upper space 1104 and a lower space 1105. The upper space 1104 is closer to the top surface 1101 of the cabinet 11 than the lower space 1105. The first heat dissipation module 13 and the second heat dissipation module 14 are both located in the upper space 1104. Arranging the first heat dissipation module 13 and the second heat dissipation module 14 in the upper space 1104 of the cabinet can accelerate air convection inside the thermal management device by utilizing the upward movement of hot air and the downward movement of cold air, which is beneficial to energy saving.

[0077] In the embodiment of the present application, as shown in FIG5 , the surface of the first heat dissipation module 13 away from the second heat dissipation module 14 is covered with a first filter 132, and the surface of the second heat dissipation module 14 away from the first heat dissipation module 13 is covered with a second filter 142. For ease of description, in the embodiment of the present application, the end of the first filter 132 close to the top surface 1101 is referred to as the first end of the first filter 132, the end of the first filter 132 away from the top surface 1101 is referred to as the second end of the first filter 132, the end of the second filter 142 close to the top surface 1101 is referred to as the first end of the second filter 142, and the end of the second filter 142 away from the top surface 1101 is referred to as the second end of the second filter 142.

[0078] The embodiment of the present application improves the installation method of the first filter 132 and the second filter 142 to make the first filter 132 and the second filter 142 easier to maintain.

[0079] Specifically, when the angle between the heat dissipation module and the top surface 1101 is acute, that is, when the heat dissipation module is not positioned perpendicular to the top surface 1101, the filter corresponding to the heat dissipation module can be slidably connected to the cabinet 11 via a sliding assembly. Taking the first filter 132 as an example, the sliding connection of the first filter 132 to the cabinet 11 allows the first filter 132 to be directly withdrawn from the side of the cabinet 11 for maintenance, thereby improving the maintainability of the first filter 132. In one possible implementation, both ends of the first filter 132 are slidably connected to the cabinet 11 via sliding assemblies. Specifically, the second end of the first filter 132 is slidably connected to the side of the partition 15 facing the top surface 1101. The first end of the first filter 132 can be slidably connected to the top surface 1101 or the upper frame of the cabinet, depending on actual product requirements. For example, in one aspect, a second sliding assembly can be provided on the side of the partition 15 facing the top surface 1101, and the second end of the first filter 132 is slidably connected to the second sliding assembly. Alternatively, a first sliding assembly may be provided on the inner surface of top surface 1101 or the inner side of the upper frame, with the first end of first filter 132 being slidably connected to the first sliding assembly. In another possible implementation, one end of first filter 132 may be slidably connected to cabinet 11 via the sliding assembly, while the other end may be detachably fixed to cabinet 11 or directly rest against cabinet 11. Exemplarily, the sliding assembly may be a device capable of achieving a sliding connection, such as a slide rail, and the specific implementation of the sliding assembly is not limited in this embodiment of the present application.

[0080] The sliding connection between the filter and the cabinet allows maintenance personnel to directly pull out the filter along the direction of the slide rail when maintaining the filter, which reduces the difficulty and time of filter maintenance, saves maintenance labor costs, facilitates operation, avoids the need to remove other components during maintenance, and improves system reliability.

[0081] It should be understood that when the second heat dissipation module 14 is not arranged perpendicular to the top surface 1101, the second filter 142 can also be connected to the cabinet 11 through the above-mentioned sliding connection method. To avoid repetition, it will not be described again.

[0082] When the angle between the heat dissipation module and the top surface 1101 is a right angle, that is, when the heat dissipation module is arranged perpendicular to the top surface 1101 and the partition 15, the filter corresponding to the heat dissipation module can be fixed to the frame of the cabinet 11 in a detachable manner. Taking the second filter 142 as an example, the second filter 142 is arranged perpendicular to the top surface 1101 and the partition 15, and the second filter 142 is fixed to the frame of the cabinet in a detachable manner, so that the second filter 142 can be taken out from the front of the cabinet 11 for maintenance, thereby improving the maintainability of the second filter 142. Specifically, the first end of the second filter 142 is detachably fixed to the upper frame, and the second end of the second filter 142 is detachably fixed to the partition frame. Exemplarily, the detachable fixing method can be a common detachable fixing method such as connecting two hanging ears with screws, a bayonet, etc. This application does not limit the specific detachable fixing method between the filter and the frame.

[0083] The filter is detachably fixed to the frame, so that maintenance personnel can directly remove the filter from the front of the cabinet when performing maintenance on the filter, which reduces the difficulty and time of filter maintenance, saves maintenance labor costs, facilitates operation, avoids the need to remove other components during maintenance, and improves system reliability.

[0084] Next, the arrangement of the multiple components placed within the thermal management device 1 will be described. First, the arrangement of the components within the upper space 1104 of the cabinet 11 will be described. As shown in Figure 5 , components that contain or pass liquids are placed on the partition 15 . These components, placed within the upper space 1104 , can be separated from other components (such as the electronic control system) within the lower space 1105 by the partition 15 . This prevents direct contact between the components within the lower space 1105 and water, reducing safety risks such as short circuits.

[0085] Please refer to Figure 6, which is a schematic diagram of the back of the thermal management device provided in an embodiment of the present application. Specifically, as shown in Figure 6, the devices placed on the partition 15 include a liquid replenishing tank 16, an expansion tank 17, an oil separator 18 and a gas-liquid separator 19. Among them, the liquid replenishing tank 16 contains liquid for replenishing the liquid in the liquid pipeline. Since the liquid operates efficiently under the circulation of the water pump, the liquid will evaporate, leak, and other losses and continue to decrease. The provision of the liquid replenishing tank 16 can ensure the safety of the thermal management device 1 and the temperature control effect. Since the thermal management device 1 can heat the coolant in the liquid pipeline when the energy storage module needs to be heated, when the coolant temperature rises, the liquid volume in the liquid pipeline increases. When the liquid pipeline cannot accommodate this part of the expansion, the pressure in the liquid pipeline increases, which will affect the normal operation of the liquid pipeline. Therefore, one or more expansion tanks 17 can be provided to connect the expansion tank 17 to the liquid pipeline. The use of an expansion tank 17 to accommodate the expansion of the liquid pipeline can reduce the pressure fluctuations in the liquid pipeline caused by the expansion of the liquid, thereby improving the safety and reliability of the operation of the thermal management device 1. The oil separator 18 is used to separate the lubricating oil in the high-pressure steam discharged from the refrigeration compressor to ensure the safe and efficient operation of the thermal management device. The gas-liquid separator 19 is used to separate and preserve the liquid in the return air pipe to prevent liquid hammer on the compressor, thereby protecting the compressor. It should be understood that the relative positions and quantities of the various components in Figure 6 are merely exemplary, and the embodiments of the present application do not limit the relative positions and quantities of the above four devices. It should be understood that the upper space 1104 of the thermal management device 1 can also accommodate other containers that need to contain liquid or flow through liquid, and this application does not limit this.

[0086] In the embodiment of the present application, the aforementioned fluid replenishing tank 16, expansion tank 17, oil separator 18, and gas-liquid separator 19 are all disposed between a side of the first heat dissipation module 13 away from the second heat dissipation module 14 and the side 1103 of the cabinet 11, and the first angle 131 is smaller than the second angle 132. When the first angle 131 is smaller than the second angle 132, the space between the first heat dissipation module 13 and the side 1103 of the cabinet 11 is larger than the space between the second heat dissipation module 14 and the side 1103 of the cabinet 11. Therefore, disposing the aforementioned fluid replenishing tank 16, expansion tank 17, oil separator 18, and gas-liquid separator 19 between the first heat dissipation module 13 and the side 1103 of the cabinet 11 is more conducive to improving space utilization and reducing the volume of the thermal management device 1.

[0087] Next, the arrangement of components in the lower space 1105 of the cabinet 11 is described. The lower space 1105 of the cabinet 11 mainly contains components of the coolant system and the refrigerant system. The two systems are placed in partitions without crossing or interfering with each other, making it convenient for independent maintenance. Specifically, the lower space 1105 of the cabinet 11 includes a first space and a second space that do not overlap. The coolant system is placed in the first space, and the refrigerant system is placed in the second space. The coolant system includes one or more components of a water pump 110, a filter 111, a three-way valve 112, and a replenishing pump 113. The refrigerant system includes one or more components of a compressor 114 and a four-way valve 115. Exemplarily, the coolant system and the refrigerant system can be placed in left and right partitions in the lower space 1105, so that the two systems can be maintained from the left and right sides respectively. The thermal management device also includes an evaporator plate exchanger 116. During the operation of the thermal management device 1, the evaporator plate exchanger 116 will be reused by the coolant system and the refrigerant system. Therefore, the evaporator plate exchanger 116 can be located between the above-mentioned coolant system and the refrigerant system, that is, between the first space and the second space, so as to reduce the length of the liquid pipeline arrangement inside the thermal management device 1.

[0088] In an embodiment of the present application, as shown in FIG2 , the thermal management device 1 further includes an electrical control box 117, which is used to accommodate an electrical control system. The electrical control box 117 is located in the lower space 1105 of the cabinet 11, and the electrical control box 117 is adjacent to the two adjacent sides of the cabinet 11, that is, the electrical control box 117 is located in a corner of the lower space 1105 of the cabinet 11, and is located close to the side of the cabinet. If the electrical control box 117 is located in the lower space 1105 of the cabinet 11, the electrical control box 117 will not block the heat dissipation of the two heat dissipation modules in the upper space 1104, thereby improving the heat dissipation efficiency. In addition, the electrical control box 117 is partitioned from the above-mentioned coolant system and refrigerant system to achieve water and electricity isolation, reduce the risk of short circuits, and ensure the safety of the operation of the thermal management device 1.

[0089] Further preferably, the electrical control box 117 can be connected to one of the multiple columns of the cabinet 11 frame via a rotating assembly, allowing the electrical control box 117 to be rotated out of the cabinet 11 for maintenance as shown in Figure 7, thereby improving the maintainability of the electrical control box 117. Exemplarily, the rotating assembly can be a common rotatable connection assembly such as a hinge or a rotating shaft and a shaft hole. It should be understood that the above examples of rotating assemblies are merely exemplary, and the embodiments of this application do not limit the specific implementation of the rotating assembly.

[0090] Please refer to Figure 8, which is a front schematic diagram of a thermal management device 1 provided in an embodiment of the present application. As shown in Figure 8, in one possible implementation, at least one lifting ring 1106 is provided on the outer surface of the upper frame of the cabinet 11, facilitating a crane to lift the thermal management device 1 via the lifting ring 1106. In another possible implementation, the lifting ring 1106 may also be provided on the outer surface of the first cabinet panel at the top of the cabinet. Furthermore, a plurality of rollers 1107 may also be provided on the outer surface of the bottom surface of the cabinet 11, facilitating the movement of the thermal management device 1 via the rolling motion of the rollers 1107. Furthermore, at least one forklift opening 1108 may also be provided on the partition 15, facilitating a forklift to lift the thermal management device 1 via the forklift opening 1108. In one possible implementation, the forklift opening 1108 may be provided on the side of the partition 15 facing the top surface 1101. In another possible implementation, the forklift opening 1108 may also be provided on the side of the partition 15 facing the bottom surface 1102. It should be understood that the number and specific positions of the lifting rings 1106, rollers 1107 and forklift openings 1108 shown in Figure 8 are merely exemplary and can be adjusted according to specific product requirements. The number and specific positions of the lifting rings 1106, rollers 1107 and forklift openings 1108 in the embodiment of the present application are not limited.

[0091] By setting a lifting ring 1106, rollers 1107 or forklift opening 1108 on the cabinet 11, the problem of the liquid cooling unit being large in size, heavy in weight and difficult to carry and transport can be effectively solved, making the thermal management device 1 easy to transport and carry, and easier to move to the application site.

[0092] It should be understood that the coolant flow plate is only a name reference and does not constitute any special limitation for this application. In some embodiments, it may also be called a water flow plate, a water flow plate, a coolant flow plate, etc., and this application does not make any special limitation on this. The refrigerant flow plate is only a name reference and does not constitute any special limitation for this application. In some embodiments, it may also be called a refrigerant flow plate, a refrigerant flow plate, a refrigerant flow plate, etc., and this application does not make any special limitation on this. Similarly, the thermal management device, energy storage module, cabinet, fan, heat dissipation module, partition, refueling tank, expansion tank, oil separator, gas-liquid separator, water pump, filter, three-way valve, refueling pump, compressor, four-way valve, evaporation plate exchanger, electrical control box, lifting ring, roller, forklift port, etc. mentioned in the embodiments of this application are all referred to by a name, and in some embodiments, they may also be referred to as other similar names, and this application does not make any special limitation on this.

[0093] The above descriptions are merely optional embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. A thermal management device, characterized in that: The thermal management device includes a cabinet, a fan, a first heat dissipation module, and a second heat dissipation module; The fan is arranged on the top surface of the cabinet; The first heat dissipation module and the second heat dissipation module are both plate-shaped structures, and a first angle between the first heat dissipation module and the top surface is not equal to a second angle between the second heat dissipation module and the top surface; The distance between the first end of the first heat dissipation module and the first end of the second heat dissipation module is greater than the distance between the second end of the first heat dissipation module and the second end of the second heat dissipation module, wherein the first end of the first heat dissipation module is an end of the first heat dissipation module close to the top surface, the second end of the first heat dissipation module is an end of the first heat dissipation module away from the top surface, the first end of the second heat dissipation module is an end of the second heat dissipation module close to the top surface, and the second end of the second heat dissipation module is an end of the second heat dissipation module away from the top surface.

2. The thermal management device according to claim 1, characterized in that: The cabinet also includes a frame, which includes an upper frame, a lower frame, and a plurality of columns connecting the upper frame and the lower frame.

3. The thermal management device according to claim 2, characterized in that: The surface of the first heat dissipation module away from the second heat dissipation module is covered with a first filter; The first end of the first filter screen is slidably connected to the first sliding assembly, and the first end of the first filter screen is an end of the first filter screen close to the top surface; The first sliding component is arranged on the inner surface of the top surface or the upper frame.

4. The thermal management device according to claim 2 or 3, characterized in that: The cabinet further comprises a partition, wherein the partition divides the internal space of the cabinet into an upper space and a lower space, wherein the upper space is close to the top surface and the lower space is far from the top surface; The first heat dissipation module and the second heat dissipation module are both located in the upper space.

5. The thermal management device according to claim 4, characterized in that: The surface of the first heat dissipation module away from the second heat dissipation module is covered with a first filter; A second sliding assembly is disposed on a surface of the partition facing the top surface, the second end of the first filter is slidably connected to the second sliding assembly, and the second end of the first filter is an end of the first filter away from the top surface.

6. The thermal management device according to any one of claims 4 or 5, characterized in that: The surface of the second heat dissipation module away from the first heat dissipation module is covered with a second filter; The frame further includes a partition frame disposed between the lower frame and the upper frame along a first direction, and the plurality of columns sequentially connect the lower frame, the partition frame and the upper frame along the first direction; The second filter is arranged perpendicular to the partition, the first end of the second filter is detachably fixed to the upper frame, the second end of the second filter is detachably fixed to the partition frame, the first end of the second filter is an end of the second filter close to the top surface, and the second end of the second filter is an end of the second filter away from the top surface.

7. The thermal management device according to any one of claims 4 to 6, characterized in that: An expansion tank, a fluid replenishing tank, an oil separator, or a gas-liquid separator is placed on the side of the partition facing the top surface, and the expansion tank, the fluid replenishing tank, the oil separator, or the gas-liquid separator is located between a side of the first heat dissipation module away from the second heat dissipation module and the side of the cabinet.

8. The thermal management device according to any one of claims 4 to 7, characterized in that: The lower space includes a first space and a second space that do not overlap; The thermal management device also includes a coolant system and a refrigerant system. The coolant system is placed in the first space, and the refrigerant system is placed in the second space. The coolant system includes a water pump, a filter, a three-way valve, a replenishing pump, a heater, or a sensor, and the refrigerant system includes a compressor or a four-way valve.

9. The thermal management device according to any one of claims 4 to 8, characterized in that: The thermal management device further comprises an electric control box, and the electric control box is located in the lower space; The electric control box is arranged adjacent to two adjacent sides of the cabinet.

10. The thermal management device according to claim 9, characterized in that: The electric control box is connected to one of the plurality of columns via a rotating assembly.

11. The thermal management device according to claim 10, characterized in that: The rotating assembly includes a hinge.

12. The thermal management device according to any one of claims 4 to 11, characterized in that: At least one lifting ring is provided on the outer surface of the upper frame; or, A plurality of rollers are arranged on the outer surface of the bottom surface of the cabinet; or, At least one forklift opening is arranged on the partition.

13. The thermal management device according to any one of claims 1 to 12, characterized in that: The fan is arranged on the outer surface of the top surface.

14. The thermal management device according to any one of claims 1 to 13, characterized in that: The first heat dissipation module comprises a first refrigerant flow channel plate and a first cooling liquid flow channel plate, and the first refrigerant flow channel plate and the first cooling liquid flow channel plate are fitted and fixed; The second heat dissipation module includes a second refrigerant flow channel plate and a second coolant flow channel plate, and the second refrigerant flow channel plate and the second coolant flow channel plate are bonded and fixed.

15. An energy storage system, characterized in that: The energy storage system comprises an energy storage module and a thermal management device according to any one of claims 1 to 13, wherein the thermal management device is used to dissipate heat from the energy storage module.

16. The energy storage system according to claim 15, characterized in that: The thermal management device is arranged on the top of the energy storage module, or the thermal management device is arranged in contact with the side of the energy storage module.

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