Composite liquid cooling heat sink

By integrating the composite liquid-cooled radiator with jet flow, two-phase flow circulation and shovel microflow technology, the problem of ultra-high power wafer heat dissipation is solved, and efficient heat exchange and temperature uniformity is achieved.

WO2025044712A1PCT designated stage expired Publication Date: 2025-03-06GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD
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Patent Information

Application Number
PCT/CN2024/110524
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-01-16
Filing Date
2024-08-08
Publication Date
2025-03-06

AI Technical Summary

Technical Problem

Existing cold plate liquid-cooled heat dissipation technology is difficult to effectively dissipate ultra-high power and ultra-high power density wafers, especially in the 3D stacked packaging structure, traditional technology faces bottlenecks in heat relief and heat dissipation.

Method used

A composite liquid cooling radiator is adopted, integrating jet flow heat dissipation technology, two-phase flow circulation heat dissipation technology and shovel microflower heat dissipation technology. The radiator uses a three-dimensional vapor cavity element and a semi-open housing to spray coolant on the surface of the heat source using a spray head, and force heat exchange is carried out through the microflower structure on the upper cover to increase the heat dissipation area and efficiency.

Benefits of technology

Effective heat dissipation and heat dissipation of ultra-high power and ultra-high power density wafers are achieved, the wafer temperature is reduced, and the triple wafer heat dissipation and uniform temperature effect is achieved through the combination of two-phase flow circulation and microflow structure.

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Abstract

A composite liquid cooling heat sink, comprising a vapor chamber component and a half-open housing. The vapor chamber component comprises a lower plate and an upper cover having a hole, the upper cover being provided with an upper cover upper surface, and the lower plate being provided with a lower plate upper surface. The lower plate upper surface is provided with an annular cavity and a recessed opening opposite to the hole. When the upper cover is coupled to the lower plate, the annular cavity forms a closed air cavity, the hole of the upper cover being mutually communicated with the recessed opening of the lower plate. The half-open housing is coupled to the lower plate of the vapor chamber component to form a heat exchange cavity. The half-open housing comprises a spray head and is provided with an input port and an output port, the input port being used for introducing a cooling liquid. The spray head is connected to the input port and is used for splashing the cooling liquid onto an opening surface via the hole and the recessed opening, and then the cooling liquid flows through the upper cover upper surface and the heat exchange cavity and is output from the output port. Thus, the present invention can be applied to the cooling and heat dissipation of chips having ultrahigh power and ultrahigh power density, and can simultaneously achieve triple chip heat dissipation and thermal equilibrium effects, thereby providing better heat dissipation effects.
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Citation Information

Patent Citations

  • Liquid-cooled radiator

    CN1707785A

  • Integrated circuit element with efficient heat dissipation packaging

    CN218918850U

  • Vapor condenser with three-dimensional folded structure

    US20140068942A1

  • Water-cooling heat dissipation device and water block thereof

    US20190254192A1