Treatment device

Abstract

This treatment device comprises: a container having formed therein an internal space for accommodating an object to be treated, and an opening leading from the internal space to the outside of the container; a heating mechanism for heating the internal space; a decompression mechanism for decompressing the internal space; a sensor for outputting a signal corresponding to infrared rays arriving from the internal space through the opening; and an opening / closing mechanism for switching a state between a first state, in which the opening is opened, and a second state, in which the opening is closed.

Description

Processing equipment

[0001] The present disclosure relates to a processing device.

[0002] Patent Document 1 discloses a microwave vacuum concentrator / dryer. In this microwave vacuum concentrator / dryer, a microwave irradiator irradiates microwaves toward the material to be concentrated / dried contained in a concentration / drying chamber main body, concentrating and drying the material. A pressure-reducing device reduces the pressure inside the concentration / drying chamber main body. A product temperature sensor measures the temperature of the material to be concentrated / dried during concentration / drying. A control device controls the output of microwaves irradiated from the microwave irradiator based on the product temperature information (paragraphs 0026 and 0030).

[0003] Japanese Patent Application Laid-Open No. 2022-128080

[0004] In the microwave vacuum concentrator / dryer disclosed in Patent Document 1, if the water vapor generated from the material to be concentrated / dried during concentration / drying is not sufficiently exhausted by the pressure reducing device, the water vapor may fog the product temperature detection sensor. If the water vapor fogs the product temperature detection sensor, the product temperature detection sensor will not be able to accurately detect the product temperature. As a result, the control device will not be able to appropriately control the microwave output.

[0005] In view of this problem, an aspect of the present disclosure provides a processing device that can accurately detect temperature.

[0006] A processing apparatus according to one embodiment of the present disclosure includes a container having an internal space for accommodating an object to be processed and an opening extending from the internal space to the outside of the container, a heating mechanism for heating the internal space, a decompression mechanism for decompressing the internal space, a sensor for outputting a signal in response to infrared rays arriving from the internal space via the opening, and an opening / closing mechanism for switching between a first state in which the opening is open and a second state in which the opening is closed.

[0007] 1 is a diagram schematically illustrating a processing apparatus according to a first embodiment; FIG. 2 is a cross-sectional view schematically illustrating an upper wall, a sensor, and an opening and closing mechanism of a shielding container provided in the processing apparatus according to the first embodiment; FIG. 3 is a cross-sectional view schematically illustrating an upper wall, a sensor, and an opening and closing mechanism of a shielding container provided in the processing apparatus according to the first embodiment; FIG. 4 is a timing chart showing changes over time in the states of a heating mechanism, a pressure reducing mechanism, and an opening and closing mechanism provided in the processing apparatus according to the first embodiment; FIG. 5 is a cross-sectional view schematically illustrating a state of the upper wall, a sensor, and an opening and closing mechanism of a shielding container provided in the processing apparatus according to the first embodiment when the processing apparatus performs an operation to dry a workpiece; FIG. 6 is a cross-sectional view schematically illustrating a state of the upper wall, a sensor, and an opening and closing mechanism of a shielding container provided in the processing apparatus according to the first embodiment when the processing apparatus performs an operation to dry a workpiece; 1 is a cross-sectional view showing a schematic diagram of the upper wall, sensor, and opening / closing mechanism of a shielding container provided in a processing apparatus of a first embodiment when the processing apparatus performs an operation to dry a workpiece. 2 is a cross-sectional view showing a schematic diagram of the upper wall, sensor, and opening / closing mechanism of a shielding container provided in a processing apparatus of a first embodiment when the processing apparatus performs an operation to dry a workpiece. 3 is a graph showing the change over time in temperature indicated by a signal output by a sensor provided in the processing apparatus of a first embodiment when the processing apparatus performs an operation to dry a workpiece.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or equivalent elements are designated by the same reference numerals, and redundant description will be omitted.

[0009] 1. First Embodiment 1.1 Processing Apparatus FIG. 1 is a diagram schematically illustrating a processing apparatus according to a first embodiment.

[0010] The processing apparatus 1 of the first embodiment shown in Figure 1 is a reduced-pressure drying apparatus. Therefore, the processing apparatus 1 accommodates an object to be processed 11 and evaporates water from the object to be processed 11 by heating and reducing the pressure in the space where the object to be processed 11 is accommodated, thereby drying the object to be processed 11. The processing apparatus 1 detects the temperature of the object to be processed 11 and controls the heating and reduction of the pressure in the space based on the detected temperature. The processing apparatus 1 prevents water vapor generated by evaporating water from the object to be processed 11 from interfering with temperature detection. The object to be processed 11 may be, but is not limited to, food, for example.

[0011] As shown in FIG. 1, the processing apparatus 1 includes a shielding vessel 21, a stage 22, a vacuum vessel 23, a dielectric heating mechanism 24, a pressure reducing mechanism 25, a sensor 26, an opening / closing mechanism 27, a housing 29, a controller 30, and a power supply 31.

[0012] The shielding container 21 accommodates the workpiece 11 and the stage 22 .

[0013] The stage 22 supports the workpiece 11 .

[0014] The vacuum vessel 23 accommodates the workpiece 11 , the shielding vessel 21 , the stage 22 , the sensor 26 and the opening / closing mechanism 27 .

[0015] The dielectric heating mechanism 24 dielectrically heats the inside of the shielding container 21. As a result, the dielectric heating mechanism 24 dielectrically heats the workpiece 11 placed in the shielding container 21, and evaporates water from the workpiece 11.

[0016] The pressure reduction mechanism 25 reduces the pressure inside the vacuum vessel 23. As a result, the pressure reduction mechanism 25 reduces the pressure inside the shielding vessel 21 arranged inside the vacuum vessel 23. As a result, the pressure reduction mechanism 25 lowers the boiling point of water inside the shielding vessel 21. As a result, the pressure reduction mechanism 25 evaporates water from the workpiece 11 arranged inside the shielding vessel 21.

[0017] The sensor 26 detects the temperature inside the shielding container 21 or the opening / closing mechanism 27 .

[0018] The opening and closing mechanism 27 prevents water vapor generated by evaporating water from the object to be treated 11 from fogging the sensor 26. In this way, the opening and closing mechanism 27 prevents the water vapor from interfering with the temperature detection by the sensor 26.

[0019] The housing 29 accommodates the shielding vessel 21 , the stand 22 , the vacuum vessel 23 , the dielectric heating mechanism 24 , the pressure reducing mechanism 25 , the sensor 26 , the opening / closing mechanism 27 , and the controller 30 .

[0020] The controller 30 controls the dielectric heating mechanism 24, the pressure reducing mechanism 25 and the opening / closing mechanism 27 based on the temperature detected by the sensor 26, and causes the processing device 1 to dry the object 11 under reduced pressure.

[0021] 1, the shielding container 21 includes a wall 41. The wall 41 includes an upper wall 51, a side wall 52, and a lower wall 53.

[0022] The shielding container 21 shields microwaves. A wall 41 of the shielding container 21 has a portion made of a conductor to shield microwaves. The conductor is, for example, a metal. Therefore, the wall 41 is made of, for example, a metal plate, a metal mesh, a punched metal, or the like.

[0023] The shielding container 21 has an internal space 21a, an opening 21b, a vent 21c, a vent 21d, and an opening 21e.

[0024] The internal space 21a of the shielding container 21 is surrounded by a wall 41 of the shielding container 21. As described above, the wall 41 is made of a material that blocks microwaves. Therefore, the wall 41 prevents microwaves from leaking from the internal space 21a to the outside of the shielding container 21.

[0025] The internal space 21a of the shielding container 21 includes a reduced pressure space 21p and a non-reduced pressure space 21q. The reduced pressure space 21p is defined by an upper wall 51 of the shielding container 21, a side wall 52 of the shielding container 21, a peripheral portion of a lower wall 53 of the shielding container 21, and the base 22. The non-reduced pressure space 21q is defined by a central portion of the lower wall 53 of the shielding container 21 and the base 22. The reduced pressure space 21p and the non-reduced pressure space 21q are separated from each other by the base 22. The reduced pressure space 21p serves as a first internal space that accommodates the workpiece 11.

[0026] The opening 21b of the shielding container 21 is formed in the upper wall 51 of the shielding container 21. The opening 21b penetrates the upper wall 51 in the thickness direction. The opening 21b leads from the reduced pressure space 21p of the shielding container 21 to the outside of the shielding container 21. As a result, the opening 21b passes infrared rays and guides the infrared rays from the reduced pressure space 21p to the outside of the shielding container 21. This allows the infrared rays to be detected outside the shielding container 21. This allows the temperature of the reduced pressure space 21p to be detected outside the shielding container 21.

[0027] As shown in FIG. 1, the upper wall 51 of the shielding container 21 includes a protrusion 61 .

[0028] The protrusion 61 protrudes outward from the shielding container 21. The protrusion 61 has a ring shape. The opening 21b of the shielding container 21 passes through the protrusion 61. The protrusion 61 includes a portion made of a conductor. This makes it possible to prevent microwaves from leaking through the opening 21b.

[0029] The vent 21c of the shielding container 21 is formed in the upper wall 51 of the shielding container 21. The vent 21c penetrates the upper wall 51 in the thickness direction. The vent 21c leads from the reduced pressure space 21p of the shielding container 21 to the outside of the shielding container 21. The vent 21c allows air to pass through and guides the air from the reduced pressure space 21p to the outside of the shielding container 21. This allows the reduced pressure in the reduced pressure space 21p to be reduced from outside the shielding container 21.

[0030] The vent hole 21d of the shielding container 21 is formed in the center of the bottom wall 53 of the shielding container 21. The vent hole 21d penetrates the bottom wall 53 in the thickness direction. The vent hole 21d leads from the non-reduced pressure space 21q of the shielding container 21 to the outside of the shielding container 21. The vent hole 21d allows air to pass through and circulate between the non-reduced pressure space 21q and the outside of the shielding container 21.

[0031] The opening 21e of the shielding container 21 is formed in the center of the bottom wall 53 of the shielding container 21. The opening 21e penetrates the bottom wall 53 in the thickness direction thereof. The opening 21e leads from the non-reduced pressure space 21q of the shielding container 21 to the outside of the shielding container 21.

[0032] As shown in FIG. 1 , the shielding container 21 includes a body 71 and a door 72 .

[0033] An internal space 21a, an opening 21b, a vent 21c, a vent 21d, and an opening 21e are formed in a main body 71 of the shielding container 21. In addition, the main body 71 is formed with an opening 71a.

[0034] When the opening 71a of the main body 71 of the shielding container 21 is not blocked by the door 72 of the shielding container 21, the internal space 21a of the shielding container 21 is exposed to the outside of the main body 71 of the shielding container 21. As a result, when the opening 71a is not blocked by the door 72, the workpiece 11 can be put into the internal space 21a from outside the main body 71 via the opening 71a, and the workpiece 11 can be taken out of the main body 71 from the internal space 21a via the opening 71a.

[0035] The door 72 of the shielding container 21 can move between a closed position where it covers the opening 71 a of the main body 71 of the shielding container 21 and an open position where it does not cover the opening 71 a. When the door 72 is in the closed position, it becomes part of the side wall 52 of the shielding container 21.

[0036] 1.3 Table The table 22 is housed in the internal space 21 a of the shielding container 21 and placed on the center of the bottom wall 53 of the shielding container 21 .

[0037] As shown in FIG. 1, the base 22 includes a support 81 and a top plate 82 .

[0038] The support body 81 is disposed on the center of the bottom wall 53 of the shielding container 21. The support body 81 supports the peripheral portion of the top plate 82 from below.

[0039] The peripheral portion of the top plate 82 is placed on the support 81 .

[0040] As a result, a space is defined by the upper wall 51 of the shielding container 21, the side wall 52 of the shielding container 21, the peripheral portion of the lower wall 53 of the shielding container 21, the support body 81, and the top plate 82, and a space is defined by the central portion of the lower wall 53 of the shielding container 21, the support body 81, and the top plate 82. The support body 81 and the top plate 82 separate the former space and the latter space from each other, and prevent air from flowing between the former space and the latter space. As a result, the support body 81 and the top plate 82 define the former space as a reduced-pressure space 21p of the shielding container 21, and the latter space as a non-reduced-pressure space 21q of the shielding container 21.

[0041] The object to be treated 11 is placed on the top plate 82. As a result, the stage 22 supports the object to be treated 11 in a state where the object to be treated 11 is floating above the bottom wall 53 of the shielding container 21.

[0042] The top plate 82 is made of a material that transmits microwaves. The material is, for example, a dielectric, preferably a dielectric with low dielectric loss. Dielectrics with low dielectric loss include, for example, ceramic glass, fluororesin, etc. As a result, the top plate 82 transmits microwaves, allowing the microwaves to reach the workpiece 11 placed above the top plate 82 from the non-reduced pressure space 21q of the shielding container 21 formed below the top plate 82.

[0043] 1, the vacuum vessel 23 includes a wall 91. The wall 91 includes an upper wall 101, a side wall 102, and a lower wall 103.

[0044] The vacuum vessel 23 has an internal space 23a, an exhaust port 23b, an intake port 23c, a vent 23d, and an opening 23e.

[0045] The vacuum vessel 23 has airtightness that allows the pressure inside the internal space 23a to be reduced.

[0046] The internal space 23a of the vacuum vessel 23 is surrounded by a wall 91 of the vacuum vessel 23. The internal space 23a is defined by an upper wall 101, a side wall 102, and a lower wall 103 of the vacuum vessel 23. The internal space 23a serves as a second internal space that accommodates the workpiece 11, the shielding vessel 21, the stage 22, the sensor 26, and the opening / closing mechanism 27. The internal space 23a accommodates the shielding vessel 21 with the lower wall 53 of the shielding vessel 21 placed on the lower wall 103 of the vacuum vessel 23.

[0047] The exhaust port 23b of the vacuum vessel 23 is formed in the upper wall 101 of the vacuum vessel 23. The exhaust port 23b penetrates the upper wall 101 in the thickness direction thereof. As a result, the exhaust port 23b leads from the internal space 23a of the vacuum vessel 23 to the outside of the vacuum vessel 23. As a result, the exhaust port 23b allows air to pass through and guide the air from the internal space 23a to the outside of the vacuum vessel 23. As a result, the internal space 23a can be depressurized from outside the vacuum vessel 23.

[0048] The air intake port 23c of the vacuum vessel 23 is formed in the upper wall 101 of the vacuum vessel 23. The air intake port 23c penetrates the upper wall 101 in the thickness direction thereof. As a result, the air intake port 23c reaches the internal space 23a of the vacuum vessel 23 from outside the vacuum vessel 23. As a result, the air intake port 23c passes through and guides the air from outside the vacuum vessel 23 to the internal space 23a. As a result, the reduced pressure state of the internal space 23a can be released from outside the vacuum vessel 23.

[0049] The vent 23d of the vacuum vessel 23 is formed in the center of the bottom wall 103 of the vacuum vessel 23. The vent 23d penetrates the bottom wall 103 in its thickness direction. The vent 23d leads from the internal space 23a of the vacuum vessel 23 to the outside of the vacuum vessel 23. The vent 23d allows air to pass through, circulating between the internal space 23a and the outside of the vacuum vessel 23. The vent 23d of the vacuum vessel 23 is connected to the vent 21c of the shielding vessel 21. As a result, the vent 21d of the shielding vessel 21 and the vent 23d of the vacuum vessel 23 allow air to pass from the non-reduced pressure space 21q of the shielding vessel 21 to the outside of the vacuum vessel 23, allowing air to circulate between the non-reduced pressure space 21q and the outside of the vacuum vessel 23. As a result, the air pressure in the non-reduced pressure space 21q is maintained at approximately atmospheric pressure. This allows the heat generating element accommodated in the non-reduced pressure space 21q to be cooled by the air present in the non-reduced pressure space 21q.

[0050] The opening 23e of the vacuum vessel 23 is formed in the center of the bottom wall 103 of the vacuum vessel 23. The opening 23e penetrates the bottom wall 103 in the thickness direction. The opening 23e extends from the internal space 23a of the vacuum vessel 23 to the outside of the vacuum vessel 23. The opening 23e of the vacuum vessel 23 is connected to the opening 21e of the shielding vessel 21. As a result, the opening 21e of the shielding vessel 21 and the opening 23e of the vacuum vessel 23 extend from the non-reduced pressure space 21q of the shielding vessel 21 to the outside of the vacuum vessel 23.

[0051] As shown in FIG. 1, the vacuum vessel 23 includes a body 111 and a door 112 .

[0052] An intake port 23c, an exhaust port 23b, a vent 23d, and an opening 23e of the vacuum vessel 23 are formed in the main body 111 of the vacuum vessel 23. In addition, the main body 111 is formed with an opening 111a.

[0053] When the opening 111 a of the main body 111 of the vacuum vessel 23 is not closed by the door 112 of the vacuum vessel 23 , the internal space 23 a of the vacuum vessel 23 is exposed to the outside of the main body 111 .

[0054] The door 112 of the vacuum vessel 23 can move between a closed position in which it covers the opening 111 a of the body 111 of the vacuum vessel 23, and an open position in which it does not cover the opening 111 a. When the door 112 is in the closed position, it becomes part of the side wall 102 of the vacuum vessel 23.

[0055] 1.5 Dielectric Heating Mechanism The dielectric heating mechanism 24 radiates microwaves into the internal space 21a of the shielding container 21 to dielectrically heat the internal space 21a. The dielectric heating mechanism 24 may be replaced with a heating mechanism other than a dielectric heating mechanism. For example, the dielectric heating mechanism 24 may be replaced with an induction heating mechanism that generates an AC magnetic field in the internal space 21a to inductively heat the internal space 21a. When the dielectric heating mechanism 24 is replaced with an induction heating mechanism, the shielding container 21 that shields microwaves is replaced with a shielding container that shields AC magnetic fields.

[0056] As shown in FIG. 1, the dielectric heating mechanism 24 includes a high-frequency oscillator circuit 121 , a coaxial cable 122 , a cable connector 123 , an antenna 124 , a heat sink 125 , and a cooling fan 126 .

[0057] The high-frequency oscillator circuit 121, the coaxial cable 122, the heat sink 125, and the cooling fan 126 are disposed outside the vacuum container 23. The cable connector 123 is disposed across the opening 23e of the vacuum container 23 and the outside of the vacuum container 23. The antenna 124 is disposed across the non-reduced pressure space 21q of the shielding container 21, the opening 21e of the shielding container 21, the opening 23e of the vacuum container 23, and the outside of the vacuum container 23.

[0058] The high-frequency oscillator circuit 121 oscillates high-frequency power. The high-frequency oscillator circuit 121 includes a power semiconductor for oscillating the high-frequency power. The power semiconductor is, for example, a gallium nitride (GaN) semiconductor.

[0059] One end of the coaxial cable 122 is connected to the high-frequency oscillator circuit 121. The other end of the coaxial cable 122 is connected to a cable connector 123. The cable connector 123 is connected to an antenna 124. As a result, the coaxial cable 122 and the cable connector 123 transmit the oscillated high-frequency power from the high-frequency oscillator circuit 121 to the antenna 124.

[0060] As shown in FIG. 1, the antenna 124 includes an antenna connector 131 and an antenna body 132 .

[0061] The antenna connector 131 is disposed across the non-reduced pressure space 21q of the shielding container 21, the opening 21e of the shielding container 21, the opening 23e of the vacuum container 23, and the outside of the vacuum container 23. The antenna main body 132 is disposed in the non-reduced pressure space 21q.

[0062] The cable connector 123 is connected to the antenna connector 131. The antenna connector 131 supplies the transmitted high-frequency power to the antenna body 132.

[0063] The antenna main body 132 radiates microwaves according to the supplied high-frequency power. The antenna main body 132 radiates microwaves to the non-reduced pressure space 21q of the shielding container 21, and then radiates the microwaves to the reduced pressure space 21p of the shielding container 21 via the top plate 82. Most of the microwaves radiated to the non-reduced pressure space 21q and the reduced pressure space 21p are blocked by the wall 41 of the shielding container 21. Therefore, most of the microwaves do not leak outside the shielding container 21.

[0064] The antenna 124 is, for example, a patch antenna.

[0065] The antenna 124 is disposed at a position where the distance from the antenna 124 to the workpiece 11 placed on the top plate 82 is equal to or less than one wavelength of the radiated microwaves. This allows the workpiece 11 to be efficiently heated. Furthermore, the processing apparatus 1 can be made smaller.

[0066] As described above, the air pressure in the non-reduced pressure space 21q of the shielding container 21 in which the antenna body 132 is disposed is maintained at approximately atmospheric pressure, thereby enabling the antenna body 132 to be efficiently cooled by the air present in the non-reduced pressure space 21q.

[0067] The heat sink 125 dissipates the heat generated by the high-frequency oscillation circuit 121 .

[0068] The cooling fan 126 blows air onto the heat sink 125 .

[0069] When the high-frequency oscillation circuit 121 includes a GaN semiconductor and the dielectric heating mechanism 24 has the above-described configuration, the dielectric heating mechanism 24 can be made smaller.

[0070] The processing apparatus 1 may include a plurality of dielectric heating mechanisms 24. If the dielectric heating mechanism 24 can be made smaller as described above, it becomes easy to provide a plurality of dielectric heating mechanisms 24 in the processing apparatus 1. When the processing apparatus 1 includes a plurality of dielectric heating mechanisms 24, selective heating in which microwaves are radiated from a dielectric heating mechanism 24 selected from the plurality of dielectric heating mechanisms 24, uniform heating in which microwaves are radiated simultaneously from all of the plurality of dielectric heating mechanisms 24, and the like become possible.

[0071] The dielectric heating mechanism 24 may include elements other than those described above. For example, the dielectric heating mechanism 24 may include a magnetron.

[0072] 1.6 Decompression Mechanism The decompression mechanism 25 decompresses the internal space 23a of the vacuum vessel 23. In this way, the decompression mechanism 25 decompresses the decompression space 21p of the shielding vessel 21, which communicates with the internal space 23a of the vacuum vessel 23 via the vent 21c of the shielding vessel 21.

[0073] As shown in FIG. 1, the pressure reducing mechanism 25 includes a vacuum nipple 141 , a vacuum hose 142 , a cold trap 143 , a vacuum hose 144 , a vacuum pump 145 , a vacuum hose 146 , a pressure adjusting valve 147 and a vacuum hose 148 .

[0074] One end of the vacuum hose 142 is connected to a vacuum nipple 141. The vacuum nipple 141 is attached to the vacuum vessel 23. The other end of the vacuum hose 142 is connected to a cold trap 143. As a result, the vacuum nipple 141 and the vacuum hose 142 guide air from the reduced pressure space 21p of the shielding vessel 21 to the cold trap 143.

[0075] The cold trap 143 removes water contained in the introduced air.

[0076] One end of the vacuum hose 144 is connected to the cold trap 143. The other end of the vacuum hose 144 is connected to the vacuum pump 145. Thus, the vacuum hose 144 guides the air from which water has been removed from the cold trap 143 to the vacuum pump 145.

[0077] The vacuum pump 145 generates an air flow that flows from the reduced pressure space 21p of the shielding container 21 through the vent 21c of the shielding container 21, the internal space 23a of the vacuum container 23, the vacuum nipple 141, the vacuum hose 142, the cold trap 143, the vacuum hose 144, and the vacuum pump 145 to the outside of the vacuum pump 145. This allows the air present in the reduced pressure space 21p to be exhausted to the outside of the vacuum pump 145. This allows the reduced pressure in the reduced pressure space 21p.

[0078] One end of the vacuum hose 146 is disposed outside the housing 29. The other end of the vacuum hose 146 is connected to the pressure regulating valve 147. Thus, the vacuum hose 146 guides air from outside the housing 29 to the pressure regulating valve 147.

[0079] The pressure regulating valve 147 allows the directed air to pass through.

[0080] One end of the vacuum hose 148 is connected to the pressure adjustment valve 147. The other end of the vacuum hose 148 is connected to a vacuum nipple 149. The vacuum nipple 149 is attached to the vacuum container 23. As a result, the vacuum hose 148 and the vacuum nipple 149 guide the air that has passed through from the pressure adjustment valve 147 to the reduced pressure space 21p of the shielding container 21. This makes it possible to release the reduced pressure state of the reduced pressure space 21p.

[0081] The pressure reduction mechanism 25 does not directly reduce the pressure of the reduced pressure space 21p of the shielding container 21, but reduces the pressure of the reduced pressure space 21p via the internal space 23a of the vacuum container 23. When the pressure reduction mechanism 25 directly reduces the pressure of the reduced pressure space 21p, an exhaust port and an intake port are formed in the wall 41 of the shielding container 21. Therefore, the formed exhaust port and intake port may prevent the shielding container 21 from being able to provide sufficient microwave shielding. Furthermore, when the pressure reduction mechanism 25 directly reduces the pressure of the reduced pressure space 21p, a vacuum nipple 141 and a vacuum nipple 149 are attached to the shielding container 21. Therefore, the vacuum nipple 141 and the vacuum nipple 149 must be made of a material that does not significantly affect microwave shielding, such as a non-metal. Therefore, there is a possibility that the shielding container 21 may not be able to be provided with sufficient airtightness. On the other hand, when the decompression mechanism 25 decompresses the decompression space 21p through the internal space 23a, the exhaust port 23b and the intake port 23c are formed in the wall 91 of the vacuum vessel 23. Therefore, the formed exhaust port 23b and the intake port 23c do not hinder the shielding vessel 21 from being provided with sufficient microwave shielding properties. Furthermore, when the decompression mechanism 25 decompresses the decompression space 21p through the internal space 23a, the vacuum nipple 141 and the vacuum nipple 149 are attached to the vacuum vessel 23. Therefore, the vacuum nipple 141 and the vacuum nipple 149 do not need to be made of a material that does not significantly affect microwave shielding. This allows the shielding vessel 21 to be provided with sufficient airtightness. However, the vacuum vessel 23 may be omitted, and the decompression mechanism 25 may directly decompress the decompression space 21p.

[0082] 1.7 Sensor The sensor 26 outputs a signal corresponding to the received infrared rays. The sensor 26 is disposed above the opening 21b of the shielding container 21. As a result, the sensor 26 faces the opening 21b. As a result, when the opening 21b is open, the sensor 26 receives infrared rays that arrive from the internal space 21a of the shielding container 21 via the opening 21b, and outputs a signal corresponding to the received infrared rays. The output signal indicates the temperature of the internal space 21a. As a result, the sensor 26 constitutes an infrared temperature sensor that indicates the temperature of the internal space 21a.

[0083] Sensor 26 receives infrared rays coming from an object placed within a field of view 151 of sensor 26. When opening 21b of shielding container 21 is open, workpiece 11 placed on top plate 82 is placed within field of view 151. As a result, the signal output indicates the temperature of workpiece 11 when opening 21b is open.

[0084] 1.8 Opening and Closing Mechanism The opening and closing mechanism 27 switches the opening and closing state of the opening 21b of the shielding container 21 between a first state in which the opening 21b is opened and a second state in which the opening 21b is closed.

[0085] When the opening / closing mechanism 27 sets the opening / closing state of the opening 21b of the shielding container 21 to the first state, the sensor 26 and the internal space 21a of the shielding container 21 are not separated from each other. Therefore, the sensor 26 can see into the internal space 21a through the opening 21b. Therefore, the sensor 26 receives the first infrared rays that arrive from the internal space 21a through the opening 21b and outputs a signal corresponding to the received first infrared rays. Therefore, the sensor 26 detects the temperature of the internal space 21a. When the opening / closing mechanism 27 sets the opening / closing state of the opening 21b to the first state, water vapor generated in the internal space 21a may reach the sensor 26 through the opening 21b and cause the sensor 26 to fog up.

[0086] When the opening / closing mechanism 27 sets the opening / closing state of the opening 21b of the shielding container 21 to the second state, the sensor 26 and the internal space 21a of the shielding container 21 are separated from each other by the opening / closing mechanism 27. Therefore, the sensor 26 cannot see through the internal space 21a through the opening 21b. Therefore, the sensor 26 receives the second infrared rays arriving from the opening / closing mechanism 27 and outputs a signal corresponding to the received second infrared rays. Therefore, the sensor 26 detects the temperature of the opening / closing mechanism 27. When the opening / closing mechanism 27 sets the opening / closing state of the opening 21b to the second state, water vapor generated in the internal space 21a does not reach the sensor 26 through the opening 21b and does not fog the sensor 26.

[0087] The opening / closing mechanism 27 does not close the vent 21c of the shielding container 21 even when the opening 21b of the shielding container 21 is closed. Therefore, the vent 21c is not closed even when the opening / closing state of the opening 21b is set to the second state. As a result, even when the opening / closing state of the opening 21b is set to the second state to prevent the sensor 26 from fogging, air can be discharged from the reduced pressure space 21p of the shielding container 21 via the vent 21c. As a result, even when the opening / closing state of the opening 21b is set to the second state to prevent the sensor 26 from fogging, the reduced pressure space 21p can continue to be depressurized. The vent 21c is located far enough from the sensor 26 and the opening 21b that water vapor released from the vent 21c will not fogging the sensor 26.

[0088] 2 and 3 are cross-sectional views that schematically illustrate the upper wall, the sensor, and the opening / closing mechanism of the shielding container provided in the processing apparatus of the first embodiment.

[0089] Fig. 2 is a cross-sectional view of the shielding container 21 when the opening 21b is in a first open / closed state, and Fig. 3 is a cross-sectional view of the shielding container 21 when the opening 21b is in a second open / closed state.

[0090] As shown in FIGS. 2 and 3, the opening / closing mechanism 27 includes a lid 161 and a moving mechanism 162 .

[0091] The lid 161 is made of a material that does not allow water vapor to pass through. Therefore, when the lid 161 closes the opening 21 b of the shielding container 21, water vapor generated in the internal space 21 a of the shielding container 21 can be prevented from heading toward the sensor 26.

[0092] The lid 161 has a portion made of a conductive material. The conductive material is, for example, a metal. The portion may be the entire lid 161 or a part of the lid 161. The portion made of a conductive material is not heated by microwaves.

[0093] The lid 161 has a plate-like shape.

[0094] The lid 161 is disposed outside the shielding container 21 at a position along the outer surface of the upper wall 51 of the shielding container 21. The lid 161 may also be disposed inside the shielding container 21 at a position along the inner surface of the upper wall 51.

[0095] The moving mechanism 162 moves the lid 161 between a first position shown in Fig. 2 where the opening 21b of the shielding container 21 is not covered, and a second position shown in Fig. 3 where the opening 21b is covered. The moving mechanism 162 moves the lid 161 between the first position and the second position by sliding the lid 161. The moving mechanism 162 may also move the lid 161 between the first position where the opening 21b is not covered, and the second position where the opening 21b is covered, by rotating the lid 161. The lid 161 placed in the second position approaches the upper end of the protrusion 61 to bring the opening 21b into a state close to a sealed state, and preferably contacts the upper end of the protrusion 61 to bring the opening 21b into a sealed state.

[0096] When the moving mechanism 162 moves the lid 161 to the first position, the opening / closing mechanism 27 sets the opening / closing state of the opening 21b of the shielding container 21 to the first state. When the moving mechanism 162 moves the lid 161 to the second position, the opening / closing mechanism 27 sets the opening / closing state of the opening 21b to the second state.

[0097] The movement mechanism 162 includes an actuator, a transmission mechanism, etc. The actuator generates a driving force required to move the lid 161. The actuator is, for example, an electromagnetic motor, a piezoelectric actuator, an air actuator, etc. The transmission mechanism transmits the generated driving force to the lid 161, causing the driving force to act on the lid 161. The transmission mechanism is, for example, a gear, a belt, a pulley, a chain, a shaft, a shaft coupling, etc. The transmission mechanism may be omitted, and the driving force generated by the actuator may be applied directly to the lid 161.

[0098] When the lid 161 is disposed at the first position, the field of view 151 of the sensor 26 is not blocked by the lid 161. Therefore, when the lid 161 is disposed at the first position, the sensor 26 receives the first infrared ray that arrives from the internal space 21a of the shielding container 21 via the opening 21b of the shielding container 21 and outputs a signal corresponding to the received first infrared ray. In this way, the sensor 26 detects the temperature of the internal space 21a.

[0099] When lid 161 is disposed in the second position, field of view 151 of sensor 26 is blocked by lid 161. Therefore, when lid 161 is disposed in the second position, sensor 26 receives the second infrared ray coming from lid 161 and outputs a signal corresponding to the received second infrared ray. In this way, sensor 26 detects the temperature of lid 161.

[0100] The lid 161 has a surface 161s that is positioned in the field of view 151 of the sensor 26 when the lid 161 is positioned at the second position. The surface 161s is black. This allows the sensor 26 to receive infrared rays emitted by the black surface 161s when the lid 161 is positioned at the second position. This allows the sensor 26 to accurately detect the temperature of the lid 161 when the lid 161 is positioned at the second position. The black surface 161s can be formed, for example, by painting the base surface with black paint.

[0101] 1.9 Housing As shown in FIG. 1, the housing 29 includes a body 171 and a door 172 .

[0102] The main body 171 of the housing 29 has an internal space 171a and an opening 171b formed therein.

[0103] The internal space 171 a of the main body 171 of the housing 29 accommodates the main body 71 of the shielding vessel 21 , the stand 22 , the main body 111 of the vacuum vessel 23 , the dielectric heating mechanism 24 , the pressure reducing mechanism 25 , the sensor 26 , the opening / closing mechanism 27 , and the controller 30 .

[0104] The door 172 of the housing 29 can move between a closed position where it covers the opening 171b of the main body 171 of the housing 29 and an open position where it does not cover the opening 171b of the main body 171 of the housing 29. The door 72 of the shielding container 21 and the door 112 of the vacuum container 23 are attached to the door 172 of the housing 29. When the door 172 of the housing 29 is positioned at the closed position where it covers the opening 171b of the main body 171 of the housing 29, the door 72 of the shielding container 21 and the door 112 of the vacuum container 23 are positioned at closed positions where they cover the opening 71a of the main body 71 of the shielding container 21 and the opening 111a of the main body 111 of the vacuum container 23, respectively. When the door 172 of the housing 29 is positioned in an open position that does not block the opening 171b of the main body 171 of the housing 29, the door 72 of the shielding container 21 and the door 112 of the vacuum container 23 are each positioned in an open position that does not block the opening 71a of the main body 71 of the shielding container 21 and the opening 111a of the main body 111 of the vacuum container 23.

[0105] 1.10 Controller The controller 30 generates power to be supplied to the high-frequency oscillator circuit 121 from the supplied power. The controller 30 controls the dielectric heating mechanism 24 by controlling the power supplied to the high-frequency oscillator circuit 121. When the controller 30 causes the dielectric heating mechanism 24 to start heating the internal space 21a of the shielding container 21, the controller 30 causes the high-frequency oscillator circuit 121 to start oscillating high-frequency power. When the controller 30 causes the dielectric heating mechanism 24 to stop heating the internal space 21a, the controller 30 causes the high-frequency oscillator circuit 121 to stop oscillating high-frequency power.

[0106] The controller 30 generates, from the supplied power, power to be supplied to the cold trap 143, the vacuum pump 145, and the pressure adjustment valve 147. The controller 30 controls the decompression mechanism 25 by controlling the power supplied to the cold trap 143, the vacuum pump 145, and the pressure adjustment valve 147. When the controller 30 causes the decompression mechanism 25 to start decompressing the decompression space 21p of the shielding container 21, the controller 30 closes the pressure adjustment valve 147 to stop passing air through the pressure adjustment valve 147, and causes the vacuum pump 145 to start generating an air flow. When the controller 30 causes the decompression mechanism 25 to stop decompressing the decompression space 21p, the controller 30 causes the vacuum pump 145 to stop generating an air flow and opens the pressure adjustment valve 147 to start passing air through the pressure adjustment valve 147.

[0107] The controller 30 generates power to be supplied to the movement mechanism 162 from the supplied power. The controller 30 controls the opening / closing mechanism 27 by controlling the power supplied to the movement mechanism 162. When the controller 30 causes the opening / closing mechanism 27 to set the open / closed state of the opening 21b of the shielding container 21 to a first state, the controller 30 causes the movement mechanism 162 to move the lid 161 to a first position. When the controller 30 causes the opening / closing mechanism 27 to set the open / closed state of the opening 21b to a second state, the controller 30 causes the movement mechanism 162 to move the lid 161 to a second position.

[0108] The controller 30 acquires the signal output by the sensor 26 and obtains the temperature indicated by the acquired signal.

[0109] 1.11 Power Supply The power supply 31 supplies power to the controller 30 .

[0110] 1.12 Operation of the Controller Fig. 4 is a timing chart showing the time changes in the states of the heating mechanism, pressure reducing mechanism, and opening / closing mechanism provided in the processing apparatus of Embodiment 1. Fig. 4 shows the time changes in the state of the opening / closing mechanism for each of Control Example 1, Control Example 2, and Control Example 3.

[0111] 4 , when the processing apparatus 1 dries the workpiece 11, the controller 30 causes the decompression mechanism 25 to start decompressing the decompression space 21p of the shielding container 21 at timing T1. The controller 30 causes the dielectric heating mechanism 24 to start heating the internal space 21a of the shielding container 21 at timing T3 after timing T1. The controller 30 causes the dielectric heating mechanism 24 to stop heating the internal space 21a and the decompression mechanism 25 to stop decompressing the decompression space 21p at timing T5 after timing T3. The timing at which the decompression mechanism 25 stops decompressing the decompression space 21p may be different from the timing at which the dielectric heating mechanism 24 stops heating the internal space 21a.

[0112] The controller 30 causes the opening / closing mechanism 27 to switch the open / closed state of the opening 21b of the shielding container 21 from the first state to the second state at timing T1, as in Control Example 1. Alternatively, the controller 30 causes the opening / closing mechanism 27 to switch the open / closed state of the opening 21b from the first state to the second state at timing T2 after timing T1 and before timing T3, as in Control Example 2. Alternatively, the controller 30 causes the opening / closing mechanism 27 to switch the open / closed state of the opening 21b from the first state to the second state at timing T3, as in Control Example 3. Therefore, the controller 30 causes the opening / closing mechanism 27 to switch the open / closed state of the opening 21b from the first state to the second state after causing the decompression mechanism 25 to start decompressing the decompressed space 21p of the shielding container 21, or simultaneously with causing the decompression mechanism 25 to start decompressing the decompressed space 21p. Furthermore, before causing the dielectric heating mechanism 24 to start heating the reduced pressure space 21p, or simultaneously with causing the dielectric heating mechanism 24 to start heating the reduced pressure space 21p, the controller 30 causes the opening / closing mechanism 27 to switch the open / close state of the opening 21b from the first state to the second state. As a result, the controller 30 causes the sensor 26 to receive infrared light coming from the workpiece 11 to acquire the temperature of the workpiece 11 before water vapor generated by evaporating water from the workpiece 11 is likely to cloud the sensor 26. Furthermore, after the water vapor is likely to cloud the sensor 26, the controller 30 prevents the water vapor from reaching the sensor 26, thereby preventing the sensor 26 from clouding. This allows the temperature of the workpiece 11 to be accurately detected.

[0113] As in Control Examples 1, 2, and 3, the controller 30 causes the opening / closing mechanism 27 to switch the open / closed state of the opening 21b of the shielding container 21 from the second state to the first state at timing T4 after timing T3 and before timing T5. Timing T4 is the timing at which the water vapor becomes less likely to cloud the sensor 26. As a result, after the water vapor generated by evaporating water from the workpiece 11 becomes less likely to cloud the sensor 26, the controller 30 causes the sensor 26 to receive infrared light arriving from the workpiece 11 to acquire the temperature of the workpiece 11.

[0114] The controller 30 is implemented by a microcontroller and peripheral circuits. The microcontroller includes a processor and a memory. The processor executes a control program stored in the memory to operate the microcontroller and peripheral circuits as the controller 30. All or part of the processing performed by the processor may be performed by a dedicated electronic circuit.

[0115] 1.13 State of the upper wall of the shielding container, the sensor, and the opening / closing mechanism, and the detected temperature Figures 5 to 9 are cross-sectional views that schematically illustrate the state of the upper wall of the shielding container, the sensor, and the opening / closing mechanism provided in the processing apparatus of the first embodiment when the processing apparatus performs an operation to dry the workpiece. Figure 10 is a graph showing the change over time in the temperature indicated by the signal output by the sensor provided in the processing apparatus of the first embodiment when the processing apparatus performs an operation to dry the workpiece.

[0116] 5 to 9 schematically illustrate states when the control of the above-described Control Example 3 is performed. Fig. 10 shows changes over time when the control of the above-described Control Example 3 is performed. In Fig. 10, the horizontal axis represents the time that has elapsed since the processing device 1 started the operation to dry the workpiece 11, and the vertical axis represents the temperature indicated by the signal output by the sensor 26.

[0117] During a period 191 from timing T1 when pressure reduction mechanism 25 starts reducing the pressure to timing T3 when dielectric heating mechanism 24 starts heating (hereinafter referred to as the "period before heating starts"), lid 161 is placed in the first position as shown in Figure 5. Therefore, the signal output by sensor 26 indicates the temperature of workpiece 11.

[0118] During a period 191 before the start of heating, the workpiece 11 is not heated, and the reduced pressure space 21p of the shielded container 21 is reduced in pressure. This allows water to evaporate gently from the workpiece 11. As a result, as shown in FIG. 5, almost no condensed water adheres to the upper wall 51, sensor 26, and lid 161 of the shielded container 21. Furthermore, as shown in FIG. 10, the temperature indicated by the signal output by the sensor decreases over time. Therefore, the time rate of change of the temperature is negative.

[0119] The period 192 from the timing T3 when the dielectric heating mechanism 24 starts heating to the timing T4 when the opening / closing mechanism 27 switches the opening / closing state of the opening 21b of the shielding container 21 from the first state to the second state (hereinafter referred to as the ``period after heating starts'') is divided into a first period 201, a second period 202, and a third period 203.

[0120] During the first period 201, the lid 161 is placed in the second position, as shown in Figure 6. Therefore, the signal output by the sensor 26 indicates the temperature of the lid 161.

[0121] During the first period 201, the workpiece 11 is heated by microwaves 211, and the reduced pressure space 21p of the shielding container 21 is reduced in pressure. As a result, water evaporates rapidly from the workpiece 11, generating water vapor 212. As a result, as shown in FIG. 6 , condensed water 213 adheres to the upper wall 51 and lid 161 of the shielding container 21. Furthermore, during the first period 201, the condensed water 213 is heated by microwaves 211. As a result, during the first period 201, as shown in FIG. 10 , the temperature indicated by the signal output by sensor 26 increases over time. Therefore, the time rate of change of the temperature is positive.

[0122] In the subsequent second period 202, the workpiece 11 is heated by microwaves 211, and the reduced pressure space 21p of the shielding container 21 is reduced. Therefore, in the second period 202, water evaporates from the workpiece 11, but the evaporation of the water is slower than in the first period 201. Therefore, in the second period 202, condensed water 213 adheres to the upper wall 51 and the lid 161 of the shielding container 21, but the amount of condensed water 213 adhered is less than in the first period 201. Furthermore, in the second period 202, the adhered condensed water 213 is heated by microwaves 211. Furthermore, the adhered condensed water 213 evaporates. The adhesion of the condensed water 213 to the lid 161 and the evaporation of the condensed water 213 adhered to the lid 161 are approximately balanced. 10, the temperature indicated by the signal output by the sensor 26 is generally maintained over time in the second period 202. Therefore, the rate of change of the temperature over time is generally zero.

[0123] 7, the lid 161 is placed in the second position, so that the signal output by the sensor 26 indicates the temperature of the lid 161.

[0124] In the third period 203, the workpiece 11 is heated by the microwaves 211, and the reduced pressure space 21p of the shielding container 21 is reduced in pressure. Therefore, in the third period 203, water evaporates from the workpiece 11, but the evaporation of the water is slower than in the second period 202. Therefore, in the third period 203, condensed water 213 adheres to the upper wall 51 and the lid 161 of the shielding container 21, but the amount of condensed water 213 that adheres is less than in the second period 202. Furthermore, in the third period 203, the adhered condensed water 213 is heated by the microwaves 211. Furthermore, the condensed water 213 that adheres to the lid 161 evaporates. The evaporation of the condensed water 213 that adheres to the lid 161 becomes more prevalent than the adhesion of the condensed water 213 to the lid 161. 10, the temperature indicated by the signal output by the sensor 26 decreases over time in the third period 203. Therefore, the time rate of change of the temperature is negative.

[0125] At timing T4 when the controller 30 detects that the time rate of change of temperature indicated by the signal output by the sensor 26 during the third period 203 has become a negative value that satisfies the set condition, the controller 30 causes the opening / closing mechanism 27 to switch the open / close state of the opening 21b of the shielding container 21 from the second state to the first state. Thus, after the controller 30 has switched the open / close state of the opening 21b from the first state to the second state, if the time rate of change becomes a negative value that satisfies the set condition, the controller 30 causes the opening / closing mechanism 27 to switch the open / close state of the opening 21b from the second state to the first state. This allows the controller 30 to resume acquiring the temperature of the workpiece 11 after the evaporation of water has slowed and the possibility of water vapor fogging the sensor 26 has decreased. This makes it possible to detect the completion of drying of the workpiece 11 based on the temperature of the workpiece 11. The condition that the time rate of change must satisfy is, for example, that the time rate of change is equal to or less than a negative threshold. The negative threshold is set to be smaller than any negative value that the time rate of change may have during the second period 202 .

[0126] The period 193 from the timing T4 when the opening / closing mechanism 27 switches the opening / closing state of the opening 21b of the shielding container 21 from the first state to the second state to the timing T5 when the dielectric heating mechanism 24 finishes heating and the pressure reduction mechanism 25 finishes depressurizing (hereinafter referred to as the ``post-opening period'') is divided into a fourth period 204 and a fifth period 205.

[0127] 8, the lid 161 is placed in the first position, so that the signal output by the sensor 26 indicates the temperature of the workpiece 11.

[0128] During the fourth period 204, the workpiece 11 is heated by the microwaves 211, and the reduced pressure space 21p of the shielding container 21 is reduced in pressure. Therefore, during the fourth period 204, water evaporates from the workpiece 11, but the rate of water evaporation is slower than during the third period 203. The heating of the workpiece 11 by the microwaves 211 and the evaporation of water from the workpiece 11 are generally balanced. Therefore, during the fourth period 204, as shown in FIG. 10 , the temperature indicated by the signal output by the sensor 26 is generally maintained over time after the transition period in which the temperature detection target is changed from the lid 161 to the workpiece 11 ends. Therefore, the rate of change of the temperature over time is generally zero after the transition period ends.

[0129] 9, the lid 161 is placed in the first position, so that the signal output by the sensor 26 indicates the temperature of the workpiece 11.

[0130] In the fifth period 205, the workpiece 11 is heated by the microwaves 211, and the reduced pressure space 21p of the shielding container 21 is reduced in pressure. However, drying of the workpiece 11 is almost complete. Therefore, in the fifth period 205, almost no water evaporates from the workpiece 11. Heating of the workpiece 11 by the microwaves 211 becomes dominant over evaporation of water from the workpiece 11. Therefore, in the fifth period 205, as shown in FIG. 10 , the temperature indicated by the signal output by the sensor 26 increases over time. Therefore, the time rate of change of the temperature is positive.

[0131] Controller 30 causes dielectric heating mechanism 24 to stop heating and pressure reduction mechanism 25 to stop depressurizing at timing T5 when it detects that the time rate of change of temperature indicated by the signal output by sensor 26 has become a positive value that satisfies the set condition during fifth period 205. This allows the operation for drying workpiece 11 to be terminated after drying of workpiece 11 has been completed.

[0132] The present disclosure is not limited to the above-described embodiments, and may be replaced with a configuration that is substantially the same as the configuration shown in the above-described embodiments, a configuration that has the same effect, or a configuration that can achieve the same purpose.

[0133] 1 Processing apparatus, 11 Workpiece, 21 Shielding container, 21a Internal space, 21b Opening, 21c Vent, 21d Vent, 21e Opening, 21p Reduced pressure space, 21q Non-reduced pressure space, 22 Stand, 23 Vacuum container, 23a Internal space, 23b Exhaust port, 23c Intake port, 23d Vent, 23e Opening, 24 Dielectric heating mechanism, 25 Reduced pressure mechanism, 26 Sensor, 27 Opening / closing mechanism, 29 Housing, 30 Controller, 31 Power supply, 41 Wall, 51 Upper wall, 52 Side wall, 53 Lower wall, 61 Protrusion, 71 Main body, 71a Opening, 72 Door, 81 Support, 82 Top plate, 91 Wall, 101 Upper wall, 102 Side wall, 103 Lower wall, 111 Main body, 111a Opening, 112 Door, 121 High frequency oscillator circuit, 122 Coaxial cable, 123 Cable connector, 124 Antenna, 125 Heat sink, 126 Cooling fan, 131 Antenna connector, 132 Antenna body, 141 Vacuum nipple, 142 Vacuum hose, 143 Cold trap, 144 Vacuum hose, 145 Vacuum pump, 146 Vacuum hose, 147 Pressure adjustment valve, 148 Vacuum hose, 149 Vacuum nipple, 151 Field of view, 161 Lid, 161s Surface, 162 Moving mechanism, 171 Body, 171a Internal space, 171b Opening, 172 Door, 191 Period, 192 Period, 193 Period, 201 First period, 202 Second period, 203 Third period, 204 Fourth period, 205 Fifth period, 211 microwaves, 212 water vapor, 213 condensed water.

Claims

1. A processing device comprising: a container having an internal space for accommodating an object to be processed and an opening leading from the internal space to the outside of the container; a heating mechanism for heating the internal space; a decompression mechanism for decompressing the internal space; a sensor for outputting a signal in response to infrared rays arriving from the internal space via the opening; and an opening / closing mechanism for switching between a first state in which the opening is open and a second state in which the opening is closed.

2. The processing apparatus according to claim 1, wherein the heating mechanism is a dielectric heating mechanism that radiates microwaves into the internal space.

3. The processing apparatus according to claim 2, wherein the container is a shielding container that blocks the microwaves.

4. The processing apparatus according to claim 3, wherein the shielding container has a portion made of a conductive material.

5. The processing apparatus according to claim 3 or 4, further comprising a vacuum vessel in which a second internal space is formed to house the shielding vessel, and the pressure reducing mechanism reduces the pressure in the second internal space.

6. The processing apparatus according to claim 5, wherein the shielding container is formed with an air hole that extends from the internal space to the outside of the container and that is not closed when the state becomes the second state.

7. A processing apparatus according to any one of claims 1 to 6, wherein the opening and closing mechanism comprises: a lid; and a moving mechanism that moves the lid between a first position in which the opening is not covered and a second position in which the opening is covered.

8. The processing apparatus according to claim 7, wherein the heating mechanism is a dielectric heating mechanism that radiates microwaves into the internal space, and the lid has a portion made of a conductor.

9. The processing device according to claim 8, wherein the lid has a surface that is positioned within the field of view of the sensor when the lid is positioned in the second position, and the surface is black in color.

10. The processing device according to claim 9, wherein the infrared ray is a first infrared ray, and the sensor outputs a signal corresponding to the first infrared ray when the lid is placed at the first position, and outputs a signal corresponding to a second infrared ray arriving from the lid when the lid is placed at the second position.

11. A processing device as described in any one of claims 1 to 10, further comprising a controller that causes the opening and closing mechanism to switch the state from the first state to the second state before the heating mechanism starts to heat the internal space or at the same time as the heating mechanism starts to heat the internal space.

12. A processing apparatus as described in any one of claims 1 to 11, further comprising a controller that causes the opening / closing mechanism to switch the state from the first state to the second state after the pressure reduction mechanism starts depressurizing the internal space or at the same time as the pressure reduction mechanism starts depressurizing the internal space.

13. A processing device according to any one of claims 1 to 12, further comprising a controller that causes the opening and closing mechanism to switch the state from the second state to the first state when, after the opening and closing mechanism has switched the state from the first state to the second state, the rate of change of temperature with time indicated by the signal becomes a negative value that satisfies a set condition.

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