Radiographic imaging device and method of manufacturing radiographic imaging device

Abstract

A radiographic imaging device according to an embodiment of the present invention comprises a sensor panel, a control unit, and an enclosure that houses the sensor panel and the control unit. The control unit includes: a control board that controls the reading of a signal from the sensor panel; a mounting member on which the control board is mounted; a side plate which is secured to the mounting member and which has a sidewall section provided with an opening; and a connector provided on the control board for connecting the control board to the outside, the connector passing through the opening in the sidewall section. The enclosure is provided with an opening for inserting the control unit into the enclosure along a second direction.

Description

Radiation imaging device and method for manufacturing the same

[0001] The present disclosure relates to a radiation imaging device and a method for manufacturing a radiation imaging device.

[0002] There is known a radiation imaging device (X-ray image capturing device) that includes a sensor panel (X-ray detection sensor) and a housing that houses the sensor panel and other components (see, for example, Patent Document 1). The radiation imaging device disclosed in Patent Document 1 is provided with a cover that can be opened and closed to house components such as the sensor panel inside the housing. In such a radiation imaging device, a control board for reading out signals from the sensor panel may be housed in the housing together with the sensor panel. Furthermore, a connector for transmitting and receiving signals to and from the outside may be provided on the control board.

[0003] Japanese Patent Application Laid-Open No. 2002-311527

[0004] In the configuration of the radiation imaging device described above, if the portion including the connector insertion port needs to be arranged so as to be exposed on the outside of a side portion (e.g., a lid) of the housing, the connector needs to be positioned relative to the side portion after the control board is housed in the housing, which may make it difficult to position the connector easily and accurately.

[0005] An object of the present disclosure is to provide a radiation imaging device and a method for manufacturing a radiation imaging device that can easily and accurately position a connector.

[0006] The present disclosure includes the following radiation imaging devices [1] to

[16] and methods for manufacturing the radiation imaging devices

[17] to

[20] .

[0007] [1] A radiation imaging device comprising: a sensor panel that detects radiation; a control unit; and a housing that houses the sensor panel and the control unit, wherein the control unit has: a control board that has a main surface facing the sensor panel along a first direction perpendicular to the sensor panel and a back surface opposite the main surface, and that controls reading of signals from the sensor panel; a mounting member on which the control board is mounted; a side plate that is fixed to the mounting member and has a side wall portion with a first opening; and at least one connector that is provided on the control board to connect the control board to the outside, and that passes through the first opening in the side wall portion, and wherein the housing is provided with a second opening for inserting the control unit into the housing along a second direction perpendicular to the first direction.

[0008] The radiation imaging device of [1] above includes a control unit. In this control unit, a control board and a side plate are mounted (fixed) on a mounting member. That is, the control board and the side plate are positioned relative to each other via the mounting member. This allows the connector provided on the control board to be reliably and accurately positioned relative to the side plate (side wall portion). Furthermore, in the radiation imaging device of [1] above, after assembling the control unit outside the housing, the control unit can be housed in the housing by inserting the control unit into the housing through the second opening of the housing. This allows the connector to be positioned relative to the side plate (side wall portion) before the control unit is housed in the housing. As described above, the radiation imaging device of [1] above allows the connector provided on the control board to be positioned easily and accurately.

[0009] [2] The radiation imaging device of [1], wherein when the sensor panel and the control unit are housed in the housing, the side wall portion is positioned at a position corresponding to the second opening.

[0010] According to the configuration [2] above, the accuracy of the connector positioning (e.g., the length by which the connector protrudes from the side wall portion) performed before the control unit was housed in the housing can be easily maintained even when the sensor panel and control unit are housed in the housing.

[0011] [3] The radiation imaging device according to [1] or [2], wherein the sensor panel is fixed to the control unit.

[0012] According to the configuration [3] above, the sensor panel and the control unit can be inserted into the housing as a unit, so that the sensor panel and the control unit can be easily accommodated in the housing.

[0013] [4] The radiation imaging device according to any one of [1] to [3], wherein the at least one connector is attached to the side wall portion.

[0014] According to the configuration [4] above, the position of the connector positioned relative to the side plate (side wall portion) can be easily maintained.

[0015] [5] A radiation imaging device according to [4], wherein the at least one connector is provided on at least one of the main surface and the back surface of the control board, the mounting member has an opposing wall portion that faces the surface of the main surface or the back surface of the control board on which the at least one connector is provided, and the opposing wall portion has at least one notch provided in a position that overlaps with at least a portion of the at least one connector in the first direction.

[0016] According to the configuration [5] above, the connector can be easily accessed through the notch provided in the opposing wall portion of the mounting member, thereby facilitating the work of attaching the connector to the side wall portion.

[0017] [6] The radiation imaging device of [5], wherein the at least one connector has a plurality of connectors, the at least one cutout has a plurality of cutouts, and the opposing wall portion is located between two adjacent connectors when viewed from the first direction, separating the two adjacent cutouts from each other, and has a protrusion portion that contacts the side wall portion.

[0018] According to the configuration [6] above, even if multiple connectors are provided on the control board, each connector can be easily attached to the side wall portion via each notch. Furthermore, since the side wall portion is supported by the protrusion portion that contacts the side wall portion, bending of the side wall portion toward the control board can be suppressed.

[0019] [7] A radiation imaging device according to any one of [4] to [6], further comprising a pair of nuts arranged on either side of the side wall portion, wherein the at least one connector has a shaft portion that passes through the first opening and is threadedly engaged with each of the pair of nuts, and the at least one connector is attached to the side wall portion by threading the pair of nuts onto the shaft portions from both sides of the side wall portion.

[0020] According to the configuration [7] above, the connector can be firmly attached to the side wall by screwing a pair of nuts onto the shank of the connector from both sides of the side wall. Furthermore, since the connector is positioned relative to the side plate (side wall), precision in positioning of the connector (e.g., the length by which the connector protrudes from the side wall) can be ensured when screwing the nuts onto the shank of the connector.

[0021] [8] A radiation imaging device according to [5] or [6], further comprising a pair of nuts arranged on either side of the side wall portion, wherein the at least one connector has a shaft portion that passes through the first opening and is threadedly engaged with each of the pair of nuts, the at least one connector is attached to the side wall portion by the pair of nuts being threadedly engaged with the shaft portions from both sides of the side wall portion, and the at least one notch is provided at a position that overlaps with the nut on the control board side in the first direction.

[0022] According to the configuration [8] above, the worker can easily screw the pair of nuts onto the shanks of the connector because the worker can see the nuts on the control board through the notches, which makes it possible to securely and easily attach the connector to the side wall.

[0023] [9] The radiation imaging device according to any one of [1] to [8], wherein the at least one connector is provided on the rear surface of the control board.

[0024] Typically, light-emitting elements such as LEDs for checking connector operation are provided on the same surface as the connector. According to the configuration [8] above, the light-emitting elements are provided on the back surface of the control board, so the influence of radiation on the light-emitting elements can be reduced compared to when the connector and the light-emitting elements are provided on the main surface of the control board (the surface facing the sensor panel onto which radiation is incident). As a result, the reliability of the components (light-emitting elements) that make up the radiation imaging device can be improved, and ultimately the reliability of the radiation imaging device itself can be improved.

[0025]

[10] The radiation imaging device according to any one of [1] to [9], wherein the housing has a bottom wall portion located on the opposite side to the side where radiation is incident, and the bottom wall portion has at least one through hole.

[0026] According to the configuration

[10] above, it is possible to easily realize a configuration in which the mounting member is fixed to the housing, or a configuration in which the mounting member is fixed to a member disposed outside the housing.

[0027]

[11] The radiation imaging device according to

[10] , wherein the at least one through-hole has at least one first through-hole through which a first fixing member for fixing the mounting member to the housing is inserted.

[0028] According to the configuration

[11] , the mounting member can be fixed to the housing through the through hole. Also, when the housing is set to ground potential, the member housed in the housing (the mounting member) can be easily connected to GND.

[0029]

[12] A radiation imaging device according to

[11] , wherein the at least one through hole further includes at least one second through hole through which a second fixing member for fixing the mounting member to a member arranged outside the housing is inserted.

[0030] According to the configuration

[12] above, it is possible to realize the fixing of the mounting member to the housing as described above, and also to realize the fixing of the radiation imaging device itself by fixing the mounting member to a member arranged outside the housing.

[0031]

[13] The radiation imaging device of any one of [1] to

[12] , further comprising a cover member, wherein a third opening is provided on the side of the housing where radiation is incident and at a position facing the sensor panel, and the cover member is attached to the housing so as to close the third opening.

[0032] According to the configuration

[13] above, since the cover member and the housing are provided separately, the sensor panel or the like can be inspected through the third opening by removing the cover member. That is, the sensor panel or the like can be inspected through the third opening without removing the sensor panel or the like from the housing. As a result, the inspection of the sensor panel or the like can be easily performed.

[0033]

[14] The radiation imaging device according to

[13] , wherein the housing and the cover member are formed of different materials.

[0034] According to the configuration

[14] above, the housing and the cover member can be formed from materials suitable for each. For example, the housing can be made of a material suitable for blocking radiation, and the cover member can be made of a material suitable for transmitting radiation. As a result, it is possible to reduce the effect of radiation on the components inside the housing and to allow the radiation to be detected to be preferably incident on the sensor panel via the cover member.

[0035]

[15] A radiation imaging device according to

[13] or

[14] , wherein the cover member is fixed to both the housing and the side plate at a position where it overlaps with both the housing and the side plate when viewed from the first direction.

[0036] According to the configuration

[15] above, the housing and the side plate can be firmly fixed to each other via the cover member.

[0037]

[16] The radiation imaging device according to any one of [1] to

[15] , wherein the housing has a side portion extending in the first direction and having the second opening, and the mounting member is not in contact with the side portion.

[0038] According to the configuration

[16] above, by separating the side surface of the housing from the mounting member, when an external impact is applied to the housing, the impact is less likely to be transmitted to the mounting member.

[0039]

[17] A method for manufacturing a radiation imaging device according to any one of [1] to

[16] , comprising the steps of assembling the control unit and inserting the control unit into the housing along the second direction, wherein the step of assembling the control unit comprises the steps of mounting the control board on the mounting member and fixing the side plate to the mounting member.

[0040] The manufacturing method for a radiographic imaging device according to

[17] above includes a step of assembling a control unit. In the step of assembling the control unit, a control board is mounted on a mounting member, and a side plate is fixed to the mounting member. That is, the control board and the side plate are positioned relative to each other via the mounting member. This ensures that the connector provided on the control board is positioned with high accuracy relative to the side plate (side wall portion). Then, by inserting the control unit into the housing along the second direction, the control unit can be housed in the housing while maintaining the connector's position relative to the side plate. As described above, according to the manufacturing method for a radiographic imaging device according to

[17] above, the connector provided on the control board can be positioned with ease and high accuracy.

[0041]

[18] The method for manufacturing a radiation imaging device according to

[17] , further comprising the step of fixing the sensor panel to the control unit before the step of inserting the control unit.

[0042] According to the configuration

[18] above, the sensor panel can be easily positioned and electrically connected to the control unit outside the housing, and the sensor panel and the control unit can be easily housed together in the housing.

[0043]

[19] The method for manufacturing a radiation imaging device according to

[17] or

[18] , wherein the step of assembling the control unit further includes a step of attaching the at least one connector to the side wall portion after the step of fixing the side plate.

[0044] According to the configuration

[19] above, since the connector is attached to the side wall portion with the connector positioned, the position of the connector positioned relative to the side wall portion can be easily maintained.

[0045]

[20] The method for manufacturing a radiographic imaging device according to

[19] , wherein the at least one connector has an axial portion that passes through the first opening, and in the step of attaching the at least one connector, a pair of nuts are screwed onto the axial portion from both sides of the side wall portion, thereby attaching the at least one connector to the side wall portion.

[0046] According to the configuration

[20] , the connector can be firmly attached to the side wall by screwing a pair of nuts onto the shank of the connector from both sides of the side wall. Furthermore, since the connector is positioned relative to the side plate (side wall), precision in positioning the connector (e.g., the length by which the connector protrudes from the side wall) can be ensured when screwing the nuts onto the shank of the connector.

[0047] According to one aspect of the present disclosure, it is possible to provide a radiation imaging device and a method for manufacturing a radiation imaging device that allow connector positioning to be performed easily and accurately.

[0048] 1A is a perspective view of a radiation imaging device according to an embodiment; FIG. 1B is an exploded perspective view of the radiation imaging device; FIG. 1C is a perspective view of a housing, and FIG. 1D is a bottom view of the housing; FIG. 1D is an exploded perspective view of a detection unit; FIG. 1E is an exploded perspective view of a control unit; FIG. 1F is a cross-sectional view of the radiation imaging device taken along line VI-VI in FIG. 1; FIG. 1G is a cross-sectional view of the radiation imaging device taken along line VII-VII in FIG. 1; FIG. 1H is a bottom view of a mounting member on which a control board is mounted; FIG. 1H is a perspective view of a side plate; FIG. 1A is an enlarged bottom view of a part of the mounting member on which the control board is mounted, and FIG. 1B is a view showing a state in which a connector is attached to the side plate; FIG. 1G is a diagram for explaining a manufacturing method of a radiation imaging device; FIG. 1H is a diagram for explaining a manufacturing method of a radiation imaging device; FIG. 1H is a cross-sectional view of an enlarged part of a detection unit; FIG. 1H is a cross-sectional view of a sensor panel according to a comparative example, and FIG. 1H is a cross-sectional view of a sensor panel according to an embodiment;

[0049] An embodiment of the present disclosure will be described in detail below with reference to the drawings. In the following description, identical or equivalent elements will be designated by the same reference numerals, and duplicate descriptions will be omitted. Also, in the drawings, some features of the embodiment are exaggerated to make them easier to understand. Therefore, the dimensional ratios of the various parts in the drawings may differ from the actual dimensional ratios.

[0050] [Overall Configuration of Radiation Imaging Apparatus] As shown in FIGS. 1 and 2 , a radiation imaging apparatus 1 according to an embodiment includes a housing 10, a cover member 20, a detection unit 30, and a control unit 50. The radiation imaging apparatus 1 is, for example, a flat panel sensor (X-ray imaging apparatus) used in a medical X-ray imaging system. The detection unit 30 is fixed to the control unit 50 by a plurality of screws S11 (described later). In this specification, a direction perpendicular to the cover member 20 (a direction perpendicular to a sensor panel 31 (described later)) is referred to as the Z-axis direction (first direction). Of the directions perpendicular to the Z-axis direction, a direction perpendicular to a side wall portion 61 of a side plate 60 (described later) is referred to as the X-axis direction (second direction), and a direction perpendicular to the Z-axis direction and the X-axis direction is referred to as the Y-axis direction. The radiation imaging apparatus 1 is disposed such that radiation to be detected enters the cover member 20 along the Z-axis direction. As a result, radiation that passes through the cover member 20 and enters the detection unit 30 is detected in the radiation imaging apparatus 1.

[0051] As shown in FIGS. 3A and 3B , the housing 10 is a hollow container having a substantially rectangular parallelepiped shape. The housing 10 houses the detection unit 30 and the control unit 50, with the detection unit 30 fixed to the control unit 50. The housing 10 has a top wall 11, a bottom wall 12, and side surfaces 13. The housing 10 is formed, for example, from a metal material that shields radiation (e.g., iron, aluminum, stainless steel, etc.). In this embodiment, the housing 10 is formed from aluminum. The top wall 11 and the bottom wall 12 are arranged to face each other and spaced apart along the Z-axis direction. The top wall 11 is located on the side where radiation is incident (i.e., the side facing the lid member 20). The bottom wall 12 is located on the opposite side from the side where radiation is incident.

[0052] The top wall 11 is a rectangular, annular plate member. Specifically, a rectangular opening 11a (third opening) is provided in the center of the top wall 11. The opening 11a is provided in a position facing the sensor panel 31 (see FIGS. 6 and 7 ) in the Z-axis direction. The top wall 11 is provided with three through holes 11b and two screw holes 11c. The three through holes 11b are provided at two corners located on one side of the top wall 11 in the X-axis direction (the right side in FIG. 3A , the side where an opening 13a, described later, is provided) and between the two corners. The two screw holes 11c are provided at two corners located on the other side of the top wall 11 in the X-axis direction (the left side in FIG. 3A ).

[0053] The bottom wall 12 is a rectangular plate member. The bottom wall 12 has a plurality of through holes 12a. The plurality of through holes 12a includes five first through holes 12b and eight second through holes 12c. No thread grooves are formed in the five first through holes 12b and the eight second through holes 12c. The five first through holes 12b are located at a portion slightly offset from two corners of the bottom wall 12 on one side in the X-axis direction (the left side in FIG. 3B ) toward the other side in the X-axis direction (the right side in FIG. 3B ), at two corners of the bottom wall 12 on the other side in the X-axis direction, and at a portion slightly offset from approximately the center of the bottom wall 12 toward the other side in the X-axis direction. The eight second through holes 12c are located at three locations between two first through holes 12b on one side in the Y-axis direction (upper side in Figure 3(b)), three locations between two first through holes 12b on the other side in the Y-axis direction (lower side in Figure 3(b)), one location between two first through holes 12b on one side in the X-axis direction (left side in Figure 3(b)), and one location between two first through holes 12b on the other side in the X-axis direction (right side in Figure 3(b)).

[0054] The side surface portion 13 extends in the Z-axis direction and connects the top wall portion 11 and the bottom wall portion 12. The side surface portion 13 includes a first portion 131, a second portion 132, and a third portion 133. The first portion 131 and the second portion 132 are each formed in a rectangular plate shape and are arranged facing each other at a distance in the Y-axis direction. The third portion 133 extends along the YZ plane and is also formed in a rectangular plate shape to connect the first portion 131 and the second portion 132. The side surface portion 13 has a rectangular opening 13a (second opening) at a position opposite the third portion 133. The opening 13a functions as an opening (insertion port) for inserting the control unit 50 into the housing 10 along the X-axis direction. In other words, after the control unit 50 is assembled outside the housing 10, the control unit 50 can be inserted into the housing 10 through the opening 13a of the housing 10.

[0055] A through hole 131a is provided in a corner of the first portion 131 that is on the ceiling wall 11 side and on the opening 13a side. A through hole (not shown) similar to the through hole 131a is also provided in a corner of the second portion 132 that is on the ceiling wall 11 side and on the opening 13a side. This through hole is provided at a position that overlaps with the through hole 131a in the Y-axis direction.

[0056] As shown in FIGS. 1 and 2 , the cover member 20 is formed in a rectangular plate shape. The cover member 20 functions to protect the components inside the housing 10 and also to transmit the radiation to be detected. For this reason, the cover member 20 is formed of a material different from that of the housing 10 (aluminum in this embodiment). More specifically, the cover member 20 is formed of a material that transmits radiation (e.g., carbon fiber). The cover member 20 is attached to the top wall 11 so as to cover the opening 11a of the housing 10. Three through holes 20a are provided in the cover member 20. The three through holes 20a are provided at two corners on one side in the X-axis direction (the right side in FIG. 2 ) and between the two corners. The cover member 20 is also formed with two through holes 20b located at two corners on the other side in the X-axis direction (the left side in FIG. 2 ).

[0057] 1 and 2 , the shank of screw S1 is inserted through through hole 20a of cover member 20 and through hole 11b of top wall portion 11 in that order and threaded into screw hole 62a of side plate 60, thereby fixing cover member 20, top wall portion 11, and side plate 60 to one another. The shank of screw S2 is inserted through through hole 20b of cover member 20 and threaded into screw hole 11c of top wall portion 11, thereby fixing cover member 20 and top wall portion 11 to one another. The shank of screw S3 is inserted through through hole 131a of first portion 131 and threaded into screw hole 63a of side plate 60, thereby fixing first portion 131 and side plate 60 to one another. The shaft of screw S4 (see Figure 13) is inserted into the through hole (not shown) of second part 132 and threaded into the screw hole 64a (see Figure 9) of side plate 60, thereby fixing second part 132 and side plate 60 to each other.

[0058] 4, 6, and 7, the detection unit 30 will be described. The detection unit 30 has a sensor panel 31, a protective member 32, a shielding member 33, an interposing member 34, and a pressing plate 35. The sensor panel 31 has a sensor substrate 41, a chip 42, an OCA tape 43, and an FOS 44.

[0059] The sensor substrate 41 is formed in a rectangular plate shape. The sensor substrate 41 is, for example, a glass epoxy substrate. The sensor substrate 41 has a main surface 41a on which a chip 42 is provided and a back surface 41b opposite the main surface 41a. The chip 42, OCA tape 43, and FOS 44 are provided in this order on the main surface 41a of the sensor substrate 41. The main surface 41a is the surface facing the lid member 20, and the back surface 41b is the surface facing the bottom wall portion 12. A plurality of through holes 41c and a plurality of through holes 41d are provided along the outer edge of the sensor substrate 41.

[0060] The protective member 32 is a substantially rectangular annular member for protecting the wires 47 (see FIG. 14 ). That is, the protective member 32 has a rectangular opening 32a. The protective member 32 is formed of, for example, a metal material (e.g., aluminum). The protective member 32 is disposed on the main surface 41a of the sensor substrate 41 so as to surround the chip 42, the OCA tape 43, and the FOS 44. That is, the chip 42, the OCA tape 43, and the FOS 44 are located inside the outer edge of the opening 32a when viewed from the Z-axis direction. A plurality of screw holes 32b, a plurality of screw holes 32c, and a plurality of through holes 32d are provided in the protective member 32 around the opening 32a.

[0061] The shielding member 33 is a substantially rectangular annular member for protecting the circuits provided on the chip 42 from radiation. Specifically, the shielding member 33 has a rectangular opening 33a. The shielding member 33 is formed, for example, from a metal material (e.g., lead) that blocks radiation. The shielding member 33 is provided on a surface 32e of the protective member 32 on the side where radiation is incident. The shielding member 33 is fixed to the protective member 32 with double-sided tape 48 (see FIG. 14 ). The double-sided tape 48 is not shown in FIGS. 4 , 6 , and 7 . A plurality of through holes 33b and a plurality of through holes 33c are provided around the opening 33a in the shielding member 33.

[0062] The interposing member 34 is disposed to press down on the FOS 44 and prevent warping of the FOS 44. The interposing member 34 is a conductive sponge formed from a resin such as urethane. The interposing member 34 is disposed on a surface 44a of the FOS 44 on the radiation incident side (a surface 46a of the scintillator 46 described below on the radiation incident side). The interposing member 34 is disposed inside the opening 33a of the shield member 33 when viewed from the Z-axis direction.

[0063] The pressure plate 35 is a rectangular plate member for pressing the interposition member 34 toward the FOS 44. The pressure plate 35 is made of a material (e.g., carbon fiber) that transmits radiation. The pressure plate 35 is formed to a size that covers the entire opening 33a provided in the shield member 33 when viewed from the Z-axis direction. The pressure plate 35 is disposed on the surface 33d of the shield member 33 on the side where radiation is incident, and is also disposed on the surface 44a of the FOS 44 across the interposition member 34. The inner surface 35a of the pressure plate 35, which faces the surface 33d of the shield member 33, is in contact with the interposition member 34. A plurality of through holes 35b and a plurality of through holes 35c are provided along the outer edge of the pressure plate 35.

[0064] The chip 42, OCA tape 43, FOS 44, and intervening member 34 are arranged within a space defined by the sensor substrate 41, the protective member 32 (opening 32a), the shielding member 33 (opening 33a), and the pressure plate 35.

[0065] 4, the shank of screw S5 is inserted through the through hole 41c of the sensor board 41 and threaded into the screw hole 32b of the protective member 32, thereby fixing the sensor board 41 and the protective member 32 to one another. The shank of screw S6 is inserted through the through hole 35b of the presser plate 35 and the through hole 33b of the shield member 33 in that order, and threaded into the screw hole 32c of the protective member 32, thereby fixing the presser plate 35, the shield member 33, and the protective member 32 to one another.

[0066] 5, 6, and 7, the control unit 50 will be described. The control unit 50 includes a support member 51, double-sided tape 52, a shield member 53, a protective member 54, a control board 55, three connectors 56, 57, and 58, a mounting member 59, a side plate 60, a pair of nuts 81A and 81B (see FIG. 10), and a pair of nuts 82A and 82B.

[0067] The support member 51 is a member for supporting (fixing) the sensor panel 31. The support member 51 is formed in a rectangular plate shape. The support member 51 is formed of, for example, a metal material (e.g., aluminum). The support member 51 has a support surface 51a that supports the sensor panel 31 and a back surface 51b opposite the support surface 51a. The support surface 51a is in contact with the back surface of the sensor panel 31 (the back surface 41b of the sensor board 41). The support surface 51a has a recess 51c that is recessed toward the back surface 51b (see FIGS. 5 and 7). The back surface 51b has a recess 51d that is recessed toward the support surface 51a (see FIG. 7). The support member 51 has a through-hole 51e through which a member for connecting the sensor board 41 and the control board 55 is inserted. A plurality of screw holes 51f and a plurality of through holes 51g are provided in the upper end (the end located on the upper side in FIG. 5) and the lower end (the end located on the lower side in FIG. 5) of the support member 51. In addition, a plurality of screw holes 51h are provided in the peripheral portion of the recess 51c so as to surround the recess 51c.

[0068] The surface of the double-sided tape 52 facing the support member 51 is attached to the bottom of the recess 51d of the support member 51, and the shield member 53 is fixed to the opposite surface of the double-sided tape 52. In this way, the shield member 53 is fixed to the support member 51. The double-sided tape 52 is provided with a recess 52a that communicates with the through-hole 51e.

[0069] The shielding member 53 is a member for protecting the circuits provided on the control board 55 from radiation. The shielding member 53 is formed, for example, from a metal material (e.g., lead) that blocks radiation. The shielding member 53 is housed in and fixed to the recess 51d of the support member 51 with double-sided tape 52. The shielding member 53 is provided with a recess 53a that communicates with the recess 52a.

[0070] The protective member 54 is a member for protecting the shield member 53. The protective member 54 is formed of, for example, a metal material (e.g., stainless steel). The protective member 54 is in contact with the back surface 51b of the support member 51 so as to cover the recess 51d of the support member 51. The protective member 54 is provided with a through hole 54a that communicates with the through hole 51e via the recesses 52a and 53a. The upper end (the end located on the upper side in FIG. 5 ) and the lower end (the end located on the lower side in FIG. 5 ) of the protective member 54 are provided with a plurality of through holes 54b and a plurality of through holes 54c.

[0071] The control board 55 is a board that controls the reading of signals from the sensor panel 31. The control board 55 has a main surface 55a and a back surface 55b opposite the main surface 55a. The main surface 55a faces the sensor panel 31 via the protective member 54, the shielding member 53, the double-sided tape 52, and the support member 51. The control board 55 is mounted on the mounting member 59 so that the back surface 55b contacts the supports 59b of the mounting member 59. A plurality of through holes 55c are provided along the outer edge of the control board 55.

[0072] As an example, signals are transmitted and received between the control board 55 and the sensor board 41 (sensor panel 31) via a connector C1 provided on the rear surface 41b of the sensor board 41 and a connector C2 provided on the main surface 55a of the control board 55 (see FIG. 6). The connectors C1 and C2 are configured to be connectable to each other via the through-hole 51e of the support member 51, the recess 52a of the double-sided tape 52, the recess 53a of the shield member 53, and the through-hole 54a of the protection member 54.

[0073] The connector 56 (at least one connector) is a connector for supplying power supplied from an external source to the control board 55. The connector 57 is a connector for transmitting and receiving electrical signals between the control board 55 and the outside (for example, a PC device equipped with a display for displaying a radiographic image detected by the radiographic imaging apparatus 1). The connector 58 is a LAN port for connecting the radiographic imaging apparatus 1 to a local area network. The connectors 56 to 58 are provided on the back surface 55b of the control board 55. Light-emitting elements such as LEDs (not shown) for checking the operation of the connectors 56 to 58 are arranged on the back surface 55b of the control board 55.

[0074] The mounting member 59 is a plate-like member for mounting the control board 55. The mounting member 59 is formed of, for example, a metal material (e.g., aluminum). The mounting member 59 has an opposing wall portion 591 and a pair of side portions 592. The opposing wall portion 591 is formed in a rectangular plate shape. The opposing wall portion 591 faces the rear surface 55b of the control board 55. The pair of side portions 592 are formed on both sides of the opposing wall portion 591 along the Y-axis direction and extend along the X-axis direction. Each side portion 592 protrudes toward the control board 55 (the side onto which radiation is incident) relative to the opposing wall portion 591. As shown in FIG. 6 , the control board 55 is sandwiched between the pair of side portions 592 of the mounting member 59 in the Y-axis direction. The mounting member 59 has an end surface 59a on one side (the side facing the side plate 60) in the X-axis direction. The end surface 59a is a surface of one side surface of the mounting member 59 in the X-axis direction that does not have notches 593 and 594 (described later) (see FIGS. 5 and 8). The end surface 59a faces the inner surface 61d of the side plate 60 (see FIG. 9). A plurality of support posts 59b that protrude toward the control board 55 are provided along the outer edge of the surface of the facing wall portion 591 that faces the control board 55. A screw hole is provided in each support post 59b. A plurality of screw holes 59c are provided in each side portion 592 along the X-axis direction. Three screw holes 59d are provided in the end surface 59a of the facing wall portion 591.

[0075] 8, five first screw holes 59e and eight second screw holes 59f are provided on the bottom surface (the surface facing the bottom wall portion 12 of the housing 10) of the mounting member 59. The five first screw holes 59e are located at a portion slightly offset from two corners of the mounting member 59 on one side in the X-axis direction (the left side in FIG. 8) to the other side in the X-axis direction (the right side in FIG. 8), at two corners of the mounting member 59 on the other side in the X-axis direction (the right side in FIG. 8), and at a portion slightly offset from approximately the center of the mounting member 59 to the other side in the X-axis direction. The eight second screw holes 59f are located at three locations between two first screw holes 59e on one side in the Y-axis direction (upper side in Figure 8), three locations between two first screw holes 59e on the other side in the Y-axis direction (lower side in Figure 8), one location between two first screw holes 59e on one side in the X-axis direction (left side in Figure 8), and one location between two first screw holes 59e on the other side in the X-axis direction (right side in Figure 8).

[0076] As shown in FIG. 6 , the mounting member 59 is fixed to the bottom wall 12 of the housing 10 by a first fixing member 71. The first fixing member 71 is, for example, a screw. The shaft portion of the first fixing member 71 is inserted into the first through-hole 12 b of the bottom wall 12 and screwed into the first screw hole 59 e of the mounting member 59, thereby fixing the mounting member 59 and the bottom wall 12 to each other. The mounting member 59 is fixed to a member M disposed outside the housing 10 by a second fixing member 72. The second fixing member 72 is, for example, a screw. The member M is any member for supporting (fixing) the radiation imaging device 1. In this embodiment, the member M is illustrated in FIG. 6 as a plate member. The shaft portion of the second fixing member 72 is inserted into the through-hole M1 provided in the member M and the second through-hole 12 c of the bottom wall 12, in that order, and screwed into the second screw hole 59 f, thereby fixing the mounting member 59 and the member M to each other. When the mounting member 59 is fixed to the housing 10, the mounting member 59 is not in contact with the side surface 13 (the first portion 131, the second portion 132, and the third portion 133) of the housing 10. In other words, there is a slight gap between the mounting member 59 and the side surface 13 of the housing 10.

[0077] As shown in FIG. 8 , the connector 56 has a shaft portion 56 a on which a thread is formed. The connector 56 is provided at an end portion 55 d on one side in the X-axis direction (the left side in FIG. 8 ) of the back surface 55 b of the control board 55. A portion of the shaft portion 56 a, including the tip 56 b of the connector 56, does not overlap with the control board 55 when viewed in the Z-axis direction. That is, the tip 56 b of the connector 56 protrudes outside the control board 55 when viewed in the Z-axis direction. A space is formed in the shaft portion 56 a for inserting part of a mating connector (not shown). The connector 57 has a shaft portion 57 a on which a thread is formed. The connector 57 is provided at the end portion 55 d and is located on one side in the Y-axis direction (the upper side in FIG. 9 ) of the connector 56. A portion of the shaft portion 57 a, including the tip 57 b of the connector 57, does not overlap with the control board 55 when viewed in the Z-axis direction. That is, the tip 57b of the connector 57 protrudes outside the control board 55 when viewed from the Z-axis direction. A space (see FIG. 7) for inserting part of a mating connector (not shown) is formed in the shaft 57a. The connector 58 is provided at the end 55d and is located on one side of the connector 57 in the Y-axis direction (upper side in FIG. 9). A part of the connector 58, including the tip 58a of the connector 58, does not overlap with the control board 55. That is, the tip 58a of the connector 58 protrudes outside the control board 55 when viewed from the Z-axis direction.

[0078] When viewed from the Z-axis direction, end surface 59a of mounting member 59 does not overlap with control board 55. In other words, when viewed from the Z-axis direction, end surface 59a of mounting member 59 is located outside control board 55. When viewed from the Z-axis direction, tip 56b of connector 56, tip 57b of connector 57, and tip 58a of connector 58 are located outside end surface 59a of mounting member 59 (on the left side in FIG. 9 ).

[0079] The opposing wall portion 591 has cutouts 593 and 594. The cutouts 593 and 594 are provided at an end of the opposing wall portion 591 on one side in the X-axis direction (the left side in FIG. 8 ). The cutout 593 is provided at a position in the Z-axis direction that overlaps with the end portion 55 d of the control board 55 and at least a portion of the connector 56 (in this embodiment, the entire connector 56 excluding the portion including the tip 56 b (the portion that protrudes outward beyond the end face 59 a in the X-axis direction)). The cutout 593 has a rectangular recessed shape that faces the other side in the X-axis direction (the right side in FIG. 8 ). The notch 594 is provided at a position overlapping with the end 55 d of the control board 55, at least a portion of the connector 57 (in this embodiment, the entire connector 57 excluding the portion including the tip 57 b (the portion protruding outward beyond the end face 59 a in the X-axis direction)), and at least a portion of the connector 58 (in this embodiment, substantially the entire connector 58). The notch 594 is located on one side of the notch 593 in the Y-axis direction (the upper side in FIG. 8 ). Like the notch 593, the notch 594 has a rectangular recessed shape facing the other side in the X-axis direction (the right side in FIG. 8 ). The length (width) of the notch 594 along the Y-axis direction is longer than the width of the notch 593. The length (depth) of the notch 594 along the X-axis direction is approximately the same as the depth of the notch 593.

[0080] The opposing wall portion 591 has a protrusion 595. The protrusion 595 is provided between the cutouts 593 and 594. That is, when viewed from the Z axis direction, the protrusion 595 is located between the adjacent connectors 56 and 57, separating the adjacent cutouts 593 and 594. The protrusion 595 protrudes to one side in the X axis direction (the left side in FIG. 8 ). A tip surface 595a of the protrusion 595 forms part of the end surface 59a of the mounting member 59. That is, the tip surface 595a is located on the same plane (a plane perpendicular to the X axis direction) as the end surfaces 59a of both ends of the mounting member 59 in the Y axis direction. The tip portion including the tip surface 595a of the protrusion 595 is located outside the control board 55 when viewed from the Z axis direction.

[0081] The side plate 60 will be described with reference to FIG. 9 . The side plate 60 is a member constituting a portion of the side of the radiation imaging device 1 (in this embodiment, a portion corresponding to one of the four sides of the radiation imaging device 1 when viewed in the Z-axis direction). The side plate 60 has a side wall portion 61 and wall portions 62, 63, and 64. Like the housing 10, the side plate 60 is formed of, for example, a metal material that shields radiation (e.g., iron, aluminum, stainless steel, etc.). In this embodiment, the side plate 60 is formed of aluminum. The side wall portion 61 is a rectangular plate member extending along the YZ plane. The side wall portion 61 is provided with three openings 61a, 61b, and 61c (first openings). The openings 61a, 61b, and 61c are aligned along the Y-axis direction to correspond to the connectors 56, 57, and 58, respectively. The opening 61a is a circular through-hole through which the shaft portion 56a of the connector 56 passes and is exposed to the outside of the side wall portion 61. The opening 61b is a circular through-hole for allowing the shaft 57a of the connector 57 to pass through and be exposed to the outside of the side wall 61. The opening 61c is a rectangular through-hole for allowing the connector 58 to pass through and be exposed to the outside of the side wall 61. An inner surface 61d (the surface facing the mounting member 59) of the side wall 61 is in surface contact with the end surface 59a of the mounting member 59. Three through-holes 61e are provided in the portion of the inner surface 61d that is in surface contact with the end surface 59a.

[0082] 7 , when the detection unit 30 (sensor panel 31) and the control unit 50 are housed in the housing 10, the side wall 61 is disposed at a position corresponding to the opening 13 a. More specifically, the side wall 61 is disposed at a position that blocks the opening 13 a provided in the side surface 13 of the housing 10. In other words, when viewed from the Z-axis direction, three sides of the housing space within the housing 10 of the radiation imaging device 1 are defined by the side surface 13 of the housing 10, and the remaining side of the housing space (the side not defined by the side surface 13) is defined by the side wall 61.

[0083] As shown in FIG. 9 , the wall 62 is a rectangular plate member extending along the XY plane. The wall 62 extends from the outer edge of one side (the upper side in FIG. 9 ) of the side wall 61 in the Z axis direction toward the inner surface 61d. When the control unit 50 is housed in the housing 10, the wall 62 overlaps with the cover member 20, sandwiching the top wall 11, as viewed from the Z axis direction (see FIG. 7 ). The wall 62 has three screw holes 62a formed along the Y axis direction. As described above, the screw S1 shown in FIG. 1 is inserted through the through hole 20a of the cover member 20 and the through hole 11b of the top wall 11 and threaded into the screw hole 62a of the wall 62, thereby fixing the cover member 20, the housing 10 (top wall 11), and the side plate 60 (wall 62) to one another. That is, the cover member 20 is fixed to both the housing 10 and the side plate 60 at a position where it overlaps with both the housing 10 and the side plate 60 when viewed from the Z-axis direction.

[0084] The wall portion 63 is a rectangular plate member extending along the XZ plane. The wall portion 63 extends from the outer edge of one side of the side wall portion 61 in the Y axis direction (the front side in FIG. 9 ) toward the inner surface 61d. The wall portion 63 is connected to the outer edge of one side of the wall portion 62 in the Y axis direction. When the control unit 50 is housed in the housing 10, the wall portion 63 overlaps with the first portion 131 in the Y axis direction (see FIG. 6 ). The wall portion 63 has a screw hole 63a. As described above, the screw S3 shown in FIG. 1 is inserted into the through hole 131a of the first portion 131 and screwed into the screw hole 63a of the wall portion 63, thereby fixing the first portion 131 and the side plate 60 (wall portion 63) to each other.

[0085] The wall portion 64 is a rectangular plate member extending along the XZ plane. The wall portion 64 is provided at a position opposite the wall portion 63 in the Y-axis direction. That is, the wall portion 64 extends from the outer edge of the other side of the side wall portion 61 in the Y-axis direction (the far side in FIG. 9 ) toward the inner surface 61d. The wall portion 64 is connected to the outer edge of the other side of the wall portion 62 in the Y-axis direction. When the control unit 50 is housed in the housing 10, the wall portion 64 overlaps with the second portion 132 in the Y-axis direction (see FIG. 6 ). The wall portion 64 has a screw hole 64a. As described above, the screw S4 shown in FIG. 13 is inserted into the through hole (not shown) of the second portion 132 and screwed into the screw hole 64a of the wall portion 64, thereby fixing the second portion 132 and the side plate 60 (wall portion 64) to each other.

[0086] Next, the fixing structure of the control unit 50 will be described. As shown in Fig. 5 , the shank of a screw S7 is inserted into the through hole 54b of the protective member 54 and threaded into the screw hole 51f of the support member 51, thereby fixing the support member 51 and the protective member 54 to each other. The shank of a screw S8 is inserted into the through hole 55c of the control board 55 and threaded into the support post 59b of the mounting member 59, thereby fixing the control board 55 and the mounting member 59 to each other. The shank of a screw S9 is inserted into the through hole 51g of the support member 51 and the through hole 54c of the protective member 54, in that order, and threaded into the screw hole 59c of the mounting member 59, thereby fixing the support member 51, the protective member 54, and the mounting member 59 to each other. The shank of the screw S10 is inserted into the through hole 61e of the side plate 60 and screwed into the screw hole 59d of the mounting member 59, thereby fixing the mounting member 59 and the side plate 60 to each other.

[0087] Next, the positional relationship and fixing structure between the side plate 60 (side wall portion 61) and each connector provided on the control board 55 will be described. As shown in FIG. 10A , the connector 56 is positioned at a predetermined position relative to the mounting member 59. Specifically, the distance T1 between the tip 56 b and the end face 59 a of the connector 56 in the X-axis direction is adjusted to a predetermined design value. In this state, as shown in FIG. 10B , the side plate 60 is fixed to the mounting member 59, thereby positioning the connector 56 relative to the side plate 60. Specifically, if the thickness of the side wall portion 61 of the side plate 60 in the X-axis direction is represented as T2, the shaft portion 56 a of the connector 56 protrudes outside the side wall portion 61 by "T1 - T2." That is, in the radiation imaging device 1, it is possible to appropriately determine the amount of protrusion "T1-T2" of the connector 56 from the side plate 60 (side wall 61) by adjusting the distance T1 and the thickness T2 of the side wall 61. The connector 57 is also positioned with respect to the side plate 60, similar to the connector 56 described above. In this embodiment, as shown in FIG. 1 , the tip 58a of the connector 58 is positioned with respect to the side plate 60 so as to be substantially flush with the outer surface of the side wall 61.

[0088] As shown in FIG. 10B , the shaft portion 56a is attached to the side wall portion 61 by a pair of nuts 81A and 81B positioned on either side of the side wall portion 61 after passing through the opening 61a of the side wall portion 61. The notch 593 is positioned so as to overlap the nut 81A when viewed from the Z-axis direction. The nut 81A is threaded onto a portion of the shaft portion 56a that is inward from the side wall portion 61. The nut 81B is threaded onto a portion of the shaft portion 56a that protrudes outward from the side wall portion 61. Similarly, the shaft portion 57a ​​of the connector 57 is attached to the side wall portion 61 by a pair of nuts 82A and 82B positioned on either side of the side wall portion 61 after passing through the opening 61b of the side wall portion 61 (see FIG. 7 ). Note that the connector 58 is not attached to the side wall portion 61.

[0089] Next, a structure for fixing the detection unit 30 to the control unit 50 will be described. As shown in FIG. 11 , the shank of a screw S11 is inserted into the through hole 41d of the sensor board 41 and threaded into the screw hole 51h of the support member 51, thereby fixing the sensor board 41 and the support member 51 to each other. In other words, the detection unit 30 (sensor panel 31) is fixed to the control unit 50. The through hole 35c of the presser plate 35, the through hole 33c of the shield member 33, and the through hole 32d of the protective member 32 described above are provided to allow the screw S11 to pass through. The heads of the screws S11 located near the top end (the upper end in FIG. 11 ) and near both end portions (the left and right side end portions in FIG. 11 ) of the presser plate 35 are inserted through the through hole 35c, the through hole 33c, and the through hole 32d (see FIG. 4 ) in that order and contact the main surface 41a of the sensor board 41. The head of the screw S11 located near the lower end of the shield member 33 (the lower end in FIG. 11 ) is inserted through the through hole 33c and the through hole 32d in that order, and is in contact with the main surface 41a of the sensor board 41. The head of the screw S11 located near the lower end of the sensor board 41 (the lower end in FIG. 11 ) is in contact with the main surface 41a of the sensor board 41 so as to be located inside recesses provided in the lower ends (the lower ends in FIG. 11 ) of the protective member 32 and the shield member 33.

[0090] [Manufacturing Method of Radiation Imaging Device] Next, a description will be given of an example of a manufacturing method of the radiation imaging device 1. The manufacturing method of the radiation imaging device 1 includes a step of assembling a detection unit, a step of assembling a control unit, a step of fixing the detection unit (sensor panel) to the control unit, a step of inserting the control unit into a housing, and a step of fixing a cover member to the housing.

[0091] (1. Steps for Assembling the Detection Unit) The steps for assembling the detection unit 30 will be described with reference to FIG. 4 . First, the chip 42 and the FOS 44 are fixed to each other with OCA tape 43. Next, the chip 42 is fixed to the main surface 41 a of the sensor substrate 41 by die bonding. At this time, the chip 42 and the sensor substrate 41 are electrically connected by wires 47 (see FIG. 14 ). Then, the back surface 33 e of the shielding member 33 and the front surface 32 e of the protective member 32 are fixed to each other with double-sided tape 48 (see FIG. 14 ). Then, the protective member 32 is placed on the main surface 41 a so as to cover at least a portion of the wires 47, and the sensor substrate 41 and the protective member 32 are fixed to each other with a plurality of screws S5 (15 in this embodiment). Next, the interposing member 34 is placed on the front surface 44 a of the FOS 44, and the interposing member 34 is pressed toward the FOS 44 by the pressing plate 35. In this state, the presser plate 35, the shield member 33, and the protection member 32 are fixed together by a plurality of (15 in this embodiment) screws S6. In this way, the detection unit 30 is assembled.

[0092] (2. Process of Assembling the Control Unit) The process of assembling the control unit 50 will be described with reference to FIGS. 5 to 7, 10(a) and 10(b), and 11. First, the control board 55 is prepared with the connectors 56 to 58 provided on the back surface 55b. The connectors 56, 57 may be attached to the back surface 55b at any time before the process of attaching the connectors 56, 57 to the side wall portion 61. The process of assembling the control unit 50 includes the steps of mounting the control board on the mounting member, fixing the side plates to the mounting member, and attaching the connectors to the side wall portion. An example of each process in this embodiment will be described below.

[0093] (2-1. Step of Mounting Control Board on Mounting Member) In the present embodiment, the control board 55 is mounted on the mounting member 59 with the back surface 55b facing the opposing wall portion 591, and the control board 55 and the mounting member 59 are fixed to each other by a plurality of screws S8 (sixteen in the present embodiment). This allows the connector 56 to be appropriately positioned with respect to the mounting member 59. Specifically, as shown in FIG. 10(a), the distance T1 is set to a predetermined design value. The connectors 57 and 58 are also appropriately positioned with respect to the mounting member 59, similar to the connector 56. Next, the shielding member 53 is fixed to the recess 51d of the support member 51 by double-sided tape 52. Then, the support member 51 and the protective member 54 are fixed to each other by a plurality of screws S7 (five in the present embodiment). Next, the protective member 54 and the support member 51, which are fixed to each other, are placed on the main surface 55a of the control board 55, which is fixed to the mounting member 59, and the support member 51, the protective member 54, and the mounting member 59 are fixed to each other with a plurality of screws S9 (six in this embodiment). In this way, the components of the control unit 50 other than the side plate 60 are fixed to each other.

[0094] 10B and 11 , the mounting member 59 and the side plate 60 are fixed to each other with a plurality of screws S10 (three in this embodiment) with the inner surface 61d of the side plate 60 (side wall portion 61) in surface contact with the end surface 59a of the mounting member 59. This determines the relative positions of the control board 55 and the side plate 60 via the mounting member 59. That is, the connectors 56 to 58 provided on the control board 55 are positioned relative to the side plate 60 (side wall portion 61). Note that the nuts 81A and 82A (see FIG. 7 ) disposed on the inner side of the side wall portion 61 may be attached to the shafts 56a and 57a of the connectors 56 and 57, respectively, before the side plate 60 is attached to the mounting member 59.

[0095] (2-3. Step of Attaching Connectors to Side Wall Portions) After the step of fixing the side plate 60 to the mounting member 59 described above, a step of attaching the connectors 56, 57 to the side wall portion 61 (a step of attaching at least one connector) is performed. Specifically, as shown in FIG. 10B , a pair of nuts 81A, 81B are threaded onto the shaft portion 56a of the connector 56 from both sides of the side wall portion 61, thereby attaching the connector 56 to the side wall portion 61. At this time, the notch 593 is positioned so as to overlap with at least a portion of the connector 56 (in this embodiment, the entire connector 56 excluding the portion including the tip 56b of the shaft portion 56a (the portion that protrudes outward from the end face 59a in the X-axis direction)). Therefore, the worker can rotate the pair of nuts 81A, 81B to thread the pair of nuts 81A, 81B onto the shaft portion 56a while checking the position of the pair of nuts 81A, 81B. This allows the fastening forces applied by the pair of nuts 81A, 81B from both sides of the side wall portion 61 to be approximately equal, thereby preventing deformation of the side wall portion 61 (for example, curvature of the side wall portion 61 inward or outward). Similarly, the pair of nuts 82A, 82B are threaded onto the shaft portion 57a ​​of the connector 57 from both sides of the side wall portion 61, thereby attaching the connector 57 to the side wall portion 61. This completes the assembly of the control unit 50.

[0096] (3. Step of fixing the sensor panel to the control unit) Referring to FIG. 11 , the step of fixing the detection unit 30 (sensor panel 31) to the control unit 50 will be described. This step is performed before the step of inserting the control unit into the housing. In this embodiment, as described above, the sensor board 41 and the support member 51 are fixed to each other with a plurality of screws S11 (16 in this embodiment), thereby fixing the detection unit 30 to the control unit 50. In this way, the sensor panel 31 included in the detection unit 30 is fixed to the control unit 50.

[0097] 12 , a process of inserting the control unit 50 into the housing 10 will be described. In this embodiment, the detection unit 30 is fixed to the control unit 50, and therefore the integrated detection unit 30 and control unit 50 are inserted (housed) into the housing 10 along the X-axis direction through the opening 13 a. As a result, as shown in FIG. 13 , the detection unit 30 and the control unit 50 are inserted into the housing 10, and the side wall portion 61 is disposed at a position corresponding to the opening 13 a. After the control unit 50 is inserted into the housing 10, the mounting member 59 and the bottom wall portion 12 are fixed to each other by a plurality of (five in this embodiment) first fixing members 71, as shown in FIG. 6 .

[0098] 13, the first portion 131 and the side plate 60 (wall portion 63) are fixed to each other by screws S3, and the second portion 132 and the side plate 60 (wall portion 64) are fixed to each other by screws S4. The lid member 20 and the top wall portion 11 are fixed to each other by a plurality of screws S2 (two in this embodiment), and the lid member 20, the top wall portion 11, and the side plate 60 (wall portion 62) are fixed to each other by a plurality of screws S1 (three in this embodiment). In this manner, the radiation imaging device 1 is manufactured.

[0099] [Operation and Effect] The radiation imaging device 1 described above includes a control unit 50. In the control unit 50, the control board 55 and the side plate 60 are mounted (fixed) on a mounting member 59. That is, the control board 55 and the side plate 60 are positioned relative to each other via the mounting member 59. As a result, the connectors 56 to 58 provided on the control board 55 are reliably and accurately positioned relative to the side plate 60 (side wall portion 61). Furthermore, in the radiation imaging device 1, after assembling the control unit 50 outside the housing 10, the control unit 50 can be housed in the housing 10 by inserting the control unit 50 into the housing 10 through the opening 13a of the housing 10. As a result, the connectors 56 to 58 can be positioned relative to the side plate 60 (side wall portion 61) before the control unit 50 is housed in the housing 10. As described above, according to the radiation imaging device 1, the connectors 56 to 58 provided on the control board 55 can be positioned easily and accurately.

[0100] Furthermore, when the detection unit 30 (sensor panel 31) and the control unit 50 are housed in the housing 10, the side wall 61 is disposed at a position corresponding to the opening 13a. According to the above configuration, the accuracy of the positioning of the connectors 56 to 58 (for example, the length by which the connectors 56 to 58 protrude from the side wall 61) performed before the control unit 50 was housed in the housing 10 can be easily maintained even when the detection unit 30 (sensor panel 31) and the control unit 50 are housed in the housing 10.

[0101] Furthermore, the detection unit 30 (sensor panel 31) is fixed to the control unit 50. According to the above configuration, the sensor panel 31 and the control unit 50 can be inserted into the housing 10 as a unit, and therefore the sensor panel 31 and the control unit 50 can be easily accommodated in the housing 10.

[0102] Furthermore, the connectors 56, 57 are attached to the side wall portion 61. According to the above configuration, the positions of the connectors 56, 57 positioned relative to the side plate 60 (side wall portion 61) can be easily maintained.

[0103] Furthermore, the connectors 56, 57 are provided on the back surface 55b of the control board 55, and the mounting member 59 has an opposing wall portion 591 that faces the back surface 55b of the control board 55, and the opposing wall portion 591 is provided with a notch 593 at a position overlapping with at least a portion of the connector 56 in the Z-axis direction, and a notch 594 at a position overlapping with at least a portion of the connector 57 in the Z-axis direction. According to the above configuration, the connectors 56, 57 can be easily accessed via the notches 593, 594 provided in the opposing wall portion 591 of the mounting member 59, which facilitates the attachment of the connectors 56, 57 to the side wall portion 61.

[0104] Furthermore, the opposing wall portion 591 is located between the two adjacent connectors 56, 57 when viewed from the Z-axis direction, separating the two adjacent cutouts 593, 594, and has a protrusion 595 that comes into contact with the side wall portion 61. According to the above configuration, even if the connectors 56, 57 are provided on the control board 55, the connectors 56, 57 can be easily attached to the side wall portion 61 via the respective cutouts 593, 594. Furthermore, because the side wall portion 61 is supported by the protrusion 595 that comes into contact with the side wall portion 61, bending of the side wall portion 61 toward the control board 55 can be suppressed.

[0105] The radiation imaging device 1 also includes a pair of nuts 81A and 81B disposed on either side of the side wall 61. The connector 56 has a shaft 56a that passes through the opening 61a and is threadedly engaged with each of the pair of nuts 81A and 81B. The connector 56 is attached to the side wall 61 by threading the pair of nuts 81A and 81B onto the shaft 56a from both sides of the side wall 61. According to the above configuration, the connector 56 can be firmly attached to the side wall 61 by threading the pair of nuts 81A and 81B onto the shaft 56a of the connector 56 from both sides of the side wall 61. Furthermore, because the connector 56 is positioned relative to the side plate 60 (side wall 61), accuracy in positioning the connector 56 (e.g., the length (T1-T2) of the connector 56 protruding from the side wall 61) can be ensured when threading the pair of nuts 81A and 81B onto the shaft 56a of the connector 56. Similarly, connector 57 is attached to side wall 61 by a pair of nuts 82A, 82B arranged on either side of side wall 61. This allows connector 57 to be firmly attached to side wall 61. Furthermore, when the pair of nuts 82A, 82B are screwed onto shaft 57a of connector 57, accuracy in positioning of connector 57 (e.g., the length by which connector 57 protrudes from side wall 61) can be ensured.

[0106] Furthermore, the notch 593 is provided at a position overlapping the nut 81A on the control board 55 side in the Z-axis direction. With the above configuration, the operator can visually check the nut 81A on the control board 55 side through the notch 593, and can easily screw the pair of nuts 81A, 81B onto the shaft portion 56a of the connector 56. As a result, the connector 56 can be firmly and easily attached to the side wall portion 61. Furthermore, the notch 594 is provided at a position overlapping the nut 82A on the control board 55 side in the Z-axis direction. With the above configuration, the operator can visually check the nut 82A on the control board 55 side through the notch 594, and can easily screw the pair of nuts 82A, 82B onto the shaft portion 57a ​​of the connector 57. As a result, the connector 57 can be firmly and easily attached to the side wall portion 61.

[0107] The connectors 56 to 58 are also provided on the back surface 55b of the control board 55. Typically, light-emitting elements, such as LEDs, for confirming the operation of the connectors 56 to 58 are provided on the same surface as the connectors 56 to 58. With the above configuration, the light-emitting elements are arranged on the back surface 55b of the control board 55, thereby reducing the influence of radiation on the light-emitting elements compared to when the connectors 56 to 58 and the light-emitting elements are arranged on the main surface 55a of the control board 55 (the surface facing the sensor panel 31 onto which radiation is incident). Similarly, with the above configuration, the influence of radiation on the connectors 56 to 58 can be reduced. As a result, the reliability of the components constituting the radiation imaging device 1 (the connectors 56 to 58 and the light-emitting elements) can be improved, and ultimately, the reliability of the radiation imaging device 1 itself can be improved. From the perspective of further reducing the influence of radiation on the light-emitting elements, at least a portion of the light-emitting elements may overlap the ceiling wall 11, the support member 51, the shield member 53, the protective member 54, the wall 62, etc., when viewed from the Z-axis direction, or the entire light-emitting elements may overlap the above components. Similarly, from the viewpoint of further reducing the influence of radiation on connector 56, at least a portion of connector 56 may overlap with the above-mentioned components when viewed from the Z-axis direction, or the entire connector 56 may overlap with the above-mentioned components. The same applies to connectors 57 and 58.

[0108] The housing 10 also has a bottom wall 12 located on the side opposite to the side where radiation is incident, and a plurality of through holes 12a are provided in the bottom wall 12. According to the above configuration, it is possible to easily realize a configuration in which the mounting member 59 is fixed to the housing 10, or a configuration in which the mounting member 59 is fixed to a member M arranged outside the housing 10.

[0109] The plurality of through holes 12a also include a plurality of first through holes 12b through which first fixing members 71 are inserted to fix the mounting member 59 to the housing 10. According to the above configuration, the mounting member 59 can be fixed to the housing 10 via the first through holes 12b. Furthermore, when the housing 10 is set to ground potential, the member housed within the housing 10 (the mounting member 59) can be easily connected to GND.

[0110] The plurality of through holes 12a also include a plurality of second through holes 12c through which second fixing members 72 for fixing the mounting member 59 to a member M arranged outside the housing 10 are inserted. According to the above configuration, it is possible to realize the fixing of the mounting member 59 to the housing 10 as described above, and also to realize the fixing of the radiation imaging device 1 itself by fixing the mounting member 59 to a member M arranged outside the housing 10. Furthermore, because the mounting member 59 and the member M are directly fixed to each other, when, for example, an external device having the member M moves, the relative positions of the external device and a member (e.g., the sensor panel 31) fixed to the mounting member 59 can be fixed. In other words, the external device and the member fixed to the mounting member 59 are less likely to shift from each other.

[0111] The radiation imaging device 1 also includes a cover member 20, and an opening 11a is provided in the housing 10 on the radiation incident side at a position facing the sensor panel 31, and the cover member 20 is attached to the housing 10 so as to cover the opening 11a. According to the above configuration, the cover member 20 and the housing 10 are provided separately, and therefore, by removing the cover member 20, the sensor panel 31 and the like can be inspected through the opening 11a. In other words, the sensor panel 31 and the like can be inspected through the opening 11a without removing the sensor panel 31 and the like from the housing 10. As a result, the inspection of the sensor panel 31 and the like can be easily performed.

[0112] Furthermore, the housing 10 and the cover member 20 are made of different materials. According to the above configuration, the housing 10 and the cover member 20 can be made of materials suitable for each. For example, a material suitable for shielding radiation can be used for the housing 10, and a material suitable for transmitting radiation can be used for the cover member 20. As a result, it is possible to reduce the effect of radiation on the components inside the housing 10, and to allow the radiation to be detected to be preferably incident on the sensor panel 31 via the cover member 20.

[0113] Furthermore, the cover member 20 is fixed to both the housing 10 and the side plate 60 at a position where it overlaps with both the housing 10 and the side plate 60 when viewed from the Z-axis direction. According to the above configuration, the housing 10 and the side plate 60 can be firmly fixed to each other via the cover member 20.

[0114] Furthermore, the housing 10 has a side surface 13 that extends in the Z-axis direction and is provided with an opening 13a, and the mounting member 59 is not in contact with the side surface 13. According to the above configuration, by separating the side surface 13 of the housing 10 from the mounting member 59, when an impact is applied to the housing 10 from the outside, the impact is less likely to be transmitted to the mounting member 59.

[0115] The manufacturing method of the radiation imaging device 1 includes a step of assembling the control unit 50. In the step of assembling the control unit 50, the control board 55 is mounted on a mounting member 59, and a side plate 60 is fixed to the mounting member 59. That is, the control board 55 and the side plate 60 are positioned relative to each other via the mounting member 59. As a result, the connectors 56 to 58 provided on the control board 55 are reliably and accurately positioned with respect to the side plate 60 (side wall portion 61). Then, by inserting the control unit 50 into the housing 10 along the X-axis direction, the control unit 50 can be housed in the housing 10. As described above, according to the manufacturing method of the radiation imaging device 1, the connectors 56 to 58 provided on the control board 55 can be positioned easily and accurately.

[0116] Furthermore, the manufacturing method of the radiation imaging device 1 includes a step of fixing the detection unit 30 to the control unit 50 before the step of inserting the control unit 50. According to the above configuration, the detection unit 30 (sensor panel 31) can be easily positioned and electrically connected to the control unit 50 outside the housing 10, and the detection unit 30 (sensor panel 31) and the control unit 50 can be easily housed in the housing 10 as a single unit.

[0117] Furthermore, the process of assembling the control unit 50 includes a process of attaching the connectors 56, 57 to the side wall portion 61 after the process of fixing the side plate 60. According to the above configuration, the connectors 56, 57 are attached to the side wall portion 61 after being positioned, so that the positions of the connectors 56, 57 positioned relative to the side wall portion 61 can be easily maintained.

[0118] Furthermore, in the process of attaching the connector 56, the pair of nuts 81A, 81B are threaded onto the shaft portion 56a from both sides of the side wall portion 61, thereby attaching the connector 56 to the side wall portion 61. According to the above configuration, the connector 56 can be firmly attached to the side wall portion 61 by threading the pair of nuts 81A, 81B onto the shaft portion 56a of the connector 56 from both sides of the side wall portion 61. Furthermore, because the connector 56 is positioned relative to the side plate 60 (side wall portion 61), accuracy in positioning the connector 56 can be ensured when the pair of nuts 81A, 81B are threaded onto the shaft portion 56a of the connector 56. Similarly, in the process of attaching the connector 57, the connector 57 is attached to the side wall portion 61 by the pair of nuts 82A, 82B arranged on either side of the side wall portion 61. This allows the connector 57 to be firmly attached to the side wall portion 61. Furthermore, when the pair of nuts 82A, 82B are screwed onto the shaft portion 57a ​​of the connector 57, the accuracy of positioning of the connector 57 can be ensured.

[0119] [Detailed Configuration of Detection Unit] The detailed configuration of the detection unit 30 will be described with reference to FIG. 14 as well.

[0120] The chip 42 is, for example, a rectangular CMOS image sensor. The chip 42 is provided with a light receiving section (not shown) for receiving light from a scintillator 46 (described later). The chip 42 is provided on the main surface 41a of the sensor substrate 41 and is fixed to the main surface 41a by die bonding. The chip 42 has a main surface 42a opposite to the surface facing the main surface 41a of the sensor substrate 41. The surface of the chip 42 is mirror-polished. An FOS 44 is provided on the main surface 42a via an OCA tape 43.

[0121] The OCA tape 43 is a rectangular double-sided tape made of an optically clear adhesive (OCA). The FOS 44 is a fiber optic plate with a scintillator (FOS). The thickness of the OCA tape 43 is, for example, 5 μm or more and less than 30 μm.

[0122] The FOS 44 includes a fiber optic plate (FOP) 45 and a scintillator 46 formed by vapor deposition on the FOP 45. The FOS 44 is disposed on the chip 42 with the OCA tape 43 sandwiched therebetween. The surface of the FOP 45 is mirror-polished. The scintillator 46 is formed of a scintillator material primarily composed of, for example, CsI, GOS (terbium-activated gadolinium oxysulfide), or NaI (sodium iodide). In this embodiment, the scintillator 46 is formed of a scintillator material primarily composed of GOS. The main surface 42a of the chip 42 is fixed to one surface of the OCA tape 43. The surface of the FOP 45 opposite the surface on which the scintillator 46 is vapor-deposited is fixed to the other surface of the OCA tape 43. That is, the chip 42 and the FOS 44 are fixed to each other by the OCA tape 43 .

[0123] The refractive index of the OCA tape 43 may be close to or the same as the refractive index of the FOS 44. In this case, when light is incident on the OCA tape 43 from the FOS 44 side, reflection of the light can be suppressed, thereby improving the efficiency of radiation detection. The refractive index of the OCA tape 43 may be close to or the same as the refractive index of the chip 42. In this case, when light is incident on the chip 42 from the OCA tape 43 side, reflection of the light can be suppressed, thereby improving the efficiency of radiation detection.

[0124] In the detection unit 30 configured as described above, radiation incident through the cover member 20 is converted into light by the scintillator 46. The scintillator 46 outputs the converted light to a light receiving section (not shown) of the chip 42. The light received by the light receiving section is converted into an electrical signal and transmitted from the chip 42 to the sensor substrate 41 via a wire 47 described below.

[0125] When viewed from the Z-axis direction, the outer edge 431 of the OCA tape 43 and the outer edge 441 of the FOS 44 are located inside the outer edge 421 of the chip 42. That is, a portion of the chip 42 near the outer edge 421 is exposed. One end of a wire 47 is connected to the exposed portion. The other end of the wire 47 is connected to the sensor substrate 41. When viewed from the Z-axis direction, the wire 47 extends to the sides of the OCA tape 43 and the FOS 44. In addition, in this embodiment, the outer edge 431 of the OCA tape 43 is located inside the outer edge 441 of the FOS 44 when viewed from the Z-axis direction. As an example, the outer edge 431 is located inside the outer edge 441 by a predetermined distance of 1.0 mm or less.

[0126] The protective member 32 has a side 321 that runs along the outer edge of one side of the opening 32a in the Y-axis direction (the right side in FIG. 14 ). The side 321 extends along the X-axis direction. The side 321 has a step 321a that protrudes toward the opening 32a in the Y-axis direction. With the main surface 41a of the sensor substrate 41 as a reference, the step 321a is located above (at a higher position than) the main surface 42a of the chip 42. The wire 47 is located below the step 321a in the Z-axis direction (the lower side in FIG. 14 ). The step 321a overlaps at least a portion of the wire 47 when viewed from the Z-axis direction. This protects the wire 47 by the protective member 32 (the step 321a). In this embodiment (Figure 14), the portion of the wire 47 including the end connected to the main surface 42a of the chip 42 does not overlap with the step portion 321a in the Z-axis direction, but the step portion 321a may be arranged to overlap with the entire wire 47.

[0127] When viewed from the Z-axis direction, the outer edge 33f of the opening 33a of the shield member 33 is located inside (toward the interposition member 34) the outer edge 441 of the FOS 44 (the outer edge 451 of the FOP 45 and the outer edge 461 of the scintillator 46). That is, when viewed from the Z-axis direction, the outer edge 33f of the shield member 33 is located inside the outer edge of the opening 32a of the protective member 32, the outer edge 421 of the chip 42, and the outer edge 431 of the OCA tape 43. That is, when viewed from the Z-axis direction, the shield member 33 overlaps the outer peripheral edge portion of the chip 42 (portion including the outer edge 421), the outer peripheral edge portion of the OCA tape 43 (portion including the outer edge 431), and the outer peripheral edge portion of the FOS 44 (portion including the outer edge 451 of the FOP 45 and the outer edge 461 of the scintillator 46). A signal readout circuit including, for example, a charge amplifier is provided in a part of the chip 42 that overlaps the shield member 33 and the FOS 44 in the Z-axis direction.

[0128] The shield member 33 is fixed to the surface 32e of the protective member 32 on the side where radiation is incident, using double-sided tape 48. The shield member 33 has a back surface 33e facing the surface 32e of the protective member 32. The back surface 33e of the shield member 33 is fixed to one surface of the double-sided tape 48, and the surface 32e of the protective member 32 is fixed to the other surface of the double-sided tape 48. The double-sided tape 48 is provided over the entire back surface 33e of the shield member 33. In other words, the double-sided tape 48 also covers the portion of the back surface 33e of the shield member 33 that does not overlap with the surface 32e of the protective member 32. In addition, in the Z-axis direction, the surface 32e of the protective member 32 is located higher (closer to the presser plate 35) than the surface 44a of the FOS 44 (the surface 46a of the scintillator 46). In other words, the shield member 33 and the double-sided tape 48 are located higher (closer to the presser plate 35) than the FOS 44 in the Z-axis direction. The interposing member 34 is located inside the outer edge 33 f of the opening 33 a of the shield member 33 .

[0129] The screw S6 penetrates the double-sided tape 48 and is then threaded into the screw hole 32c of the protective member 32. The screw S6 fixes the presser plate 35, the shield member 33, and the protective member 32 together. At the same time, the inner surface 35a of the presser plate 35 presses the interposing member 34 toward the scintillator 46 (FOS 44).

[0130] In the process of assembling the detection unit included in the manufacturing method of the radiation imaging device 1 described above, after the process of fixing the chip 42 and the FOS 44 to each other with the OCA tape 43, the process of fixing the chip 42 to the main surface 41 a of the sensor substrate 41 by die bonding is performed. In other words, with the chip 42 and the FOS 44 fixed to each other via the OCA tape 43, the chip 42 is fixed to the main surface 41 a of the sensor substrate 41 by die bonding.

[0131] The detection unit 30 of the radiation imaging device 1 described above has a sensor substrate 41 having a main surface 41a, a chip 42 provided on the main surface 41a, an OCA tape 43 provided on the chip 42, and an FOS 44 provided on the chip 42 with the OCA tape 43 sandwiched therebetween, and the FOS 44 is fixed to the chip 42 by the OCA tape 43. The effects of the sensor panel 31 configured in this manner will be described in comparison with the configuration of a sensor panel 31A, which is a comparative example.

[0132] As shown in FIG. 15A , the sensor panel 31A of the comparative example includes a sensor substrate 41, a chip 42 provided on the sensor substrate 41, and an FOS 44 provided on the chip 42. Unlike the sensor panel 31, the FOS 44 is not fixed to the chip 42 in the sensor panel 31A. Specifically, in the sensor panel 31A, an air layer is formed between the chip 42 and the FOS 44, and the chip 42 and the FOS 44 are air-coupled. Therefore, when the chip 42 is fixed to the sensor substrate 41 by die bonding, the chip 42 curves in accordance with the warping of the sensor substrate 41. In this case, the thickness of the air layer between the chip 42 and the FOS 44 changes, which may result in interference fringes appearing in the image captured by the radiation imaging device 1. For example, if the chip 42 and the FOP 45 are mirror-polished, light is reflected on the surfaces of the chip 42 and the FOP 45, resulting in interference fringes such as Newton's rings.

[0133] 15(b), in the sensor panel 31 of this embodiment, the FOS 44 is fixed to the chip 42 by the OCA tape 43. This prevents the chip 42 from bending in accordance with the warp of the sensor substrate 41, thereby preventing the occurrence of interference fringes as described above. Therefore, the radiation imaging device 1 can improve the accuracy of images.

[0134] The detection unit 30 has a shield member 33 provided on the main surface 41a of the sensor substrate 41, and the shield member 33 has an opening 33a, and the outer edge 33f of the opening 33a is located inside the outer edge 421 of the chip 42, the outer edge 431a of the OCA tape 43, and the outer edge 441a of the FOS 44 when viewed from the Z-axis direction. This makes it possible to protect from radiation the signal readout circuit provided in the part of the chip 42 that overlaps the shield member 33 and the FOS 44 in the Z-axis direction, thereby improving the reliability of the signal readout circuit. Furthermore, because the part of the OCA tape 43 that overlaps the shield member 33 in the Z-axis direction is also protected from radiation, deterioration of the adhesiveness of the OCA tape 43 can be suppressed.

[0135] The detection unit 30 has a protective member 32 provided on the main surface 41a of the sensor substrate 41. The shield member 33 is fixed to the surface 32e of the protective member 32, on the radiation-incident side, with double-sided tape 48. The double-sided tape 48 is provided on the entire back surface 33e of the shield member 33, which faces the front surface 32e of the protective member 32. This prevents powder particles (e.g., lead particles) from being generated by the shield member 33 from adhering to the sensor substrate 41, the chip 42, and the FOS 44. That is, the portion of the double-sided tape 48 located inside the opening 32a of the protective member 32 prevents the particles from peeling off. Furthermore, because the double-sided tape 48 is provided on the entire back surface 33e of the shield member 33, the component intended to become the shield member 33 can be processed together with the double-sided tape 48 while the double-sided tape 48 is attached to the component. This allows the double-sided tape 48 to be easily processed to fit the shape of the shield member 33.

[0136] The detection unit 30 has an intervening member 34 arranged on a surface 44a of the FOS 44 on the side where radiation is incident, and a pressing plate 35 arranged on the surface 44a of the FOS 44 across the intervening member 34 to press the intervening member 34 toward the FOS 44. According to the above configuration, the pressing force of the intervening member 34 can prevent the occurrence of warping of the sensor substrate 41.

[0137] The thickness of the OCA tape 43 may be less than 30 μm. By configuring the OCA tape 43 to be somewhat thin as described above, it is possible to suppress a decrease in resolution of the image captured by the radiation imaging device 1, which would be caused by the thickness of the OCA tape 43. On the other hand, the thinner the OCA tape 43, the higher the risk of air bubbles being trapped when the OCA tape 43 is adhered, and the greater the risk of interference fringes caused by the air bubbles appearing in the image. Therefore, the thickness of the OCA tape 43 may be 5 μm or greater. By ensuring that the OCA tape 43 has a certain thickness or greater as described above, it is possible to reduce the risk of air bubbles being trapped, and ultimately to suppress the occurrence of interference fringes caused by the air bubbles.

[0138] The sensor substrate 41 and the chip 42 are connected by a wire 47, which extends laterally to the OCA tape 43 and the FOS 44 when viewed from the Z-axis direction. The outer edge 431 of the OCA tape 43 is located inside the outer edge 441 of the FOS 44 when viewed from the Z-axis direction. This prevents the OCA tape 43 from contacting the wire 47. Regarding the above, a supplementary note is provided. As shown in FIG. 14 , the wire 47 and the FOS 44 are very close to each other. Therefore, if the area of ​​the OCA tape 43 were to be increased (for example, if the outer edge 431 of the OCA tape 43 were extended outward beyond the outer edge 441 of the FOS 44), the risk of contact between the OCA tape 43 and the wire 47 would increase. From the perspective of reducing this risk, it is preferable to configure the outer edge 431 of the OCA tape 43 to be located slightly inside the outer edge 441 of the FOS 44, as described above.

[0139] On the other hand, if the area of ​​the OCA tape 43 is made too small (i.e., if the outer edge 431 of the OCA tape 43 is located inside the outer edge 441 of the FOS 44 and the distance between the outer edges 431 and 441 is made too large), a portion of the outer edge of the light receiving section of the chip 42 may be left without the OCA tape 43. In this case, the presence or absence of the OCA tape 43 between the chip 42 and the FOS 44 may cause variations in light receiving sensitivity within the light receiving section. Therefore, from the perspective of suppressing the variations in light receiving sensitivity (i.e., so that substantially the entire light receiving section of the chip 42 is covered with the OCA tape 43), the outer edge 431 of the OCA tape 43 may be positioned inside the outer edge 441 of the FOS 44 by a predetermined distance of 1.0 mm or less when viewed in the Z-axis direction.

[0140] In the manufacturing method of the radiation imaging device 1, a step of fixing the chip 42 and the FOS 44 to each other with the OCA tape 43 is followed by a step of fixing the chip 42 to the main surface 41 a of the sensor substrate 41. As a result, when fixing the chip 42 to the main surface 41 a of the sensor substrate 41, the chip 42 can be prevented from bending in accordance with the warping of the sensor substrate 41 because the chip 42 and the FOS 44 are fixed to each other in advance.

[0141] [Modifications] The present disclosure is not limited to the above-described embodiment. The materials and shapes of the components described above are not limited to those described above, and various materials and shapes can be used. Furthermore, some of the components included in the radiation imaging device 1 according to the above-described embodiment may be omitted or modified as appropriate. For example, the above-described embodiment describes several characteristic components included in the radiation imaging device 1 and several effects achieved by each component. However, the radiation imaging device according to the present disclosure does not necessarily need to be configured to achieve all of the effects described in the above-described embodiment, and may be configured to achieve only some of the effects described in the above-described embodiment. In the latter case, the radiation imaging device only needs to include components essential for achieving at least some of the effects, and components that are not essential for achieving some of the effects may be omitted or modified as appropriate. Note that, when focusing on one effect, the components essential for achieving that effect should be reasonably understood by those skilled in the art based on common technical knowledge and the description in this specification. Below, several specific modifications of the radiation imaging device according to the present disclosure are illustrated.

[0142] In the above embodiment, the sensor panel 31 (detection unit 30) is fixed to the control unit 50, but the sensor panel 31 does not have to be fixed to the control unit 50. For example, the sensor panel 31 may be attached to the housing 10 separately from the control unit 50. In this case, the sensor panel 31 may be electrically connected to the control unit 50 via the housing 10 or via a connecting member connected to the housing 10.

[0143] In the above embodiment, when the control unit 50 is housed in the housing 10, the side wall 61 is located at a position corresponding to the opening 13a. However, the side wall 61 does not necessarily have to be located at a position corresponding to the opening 13a. For example, the side wall 61 may be located at a position overlapping the side surface 13 (a position overlapping any of the first portion 131, the second portion 132, and the third portion 133). In this case, an opening (an opening different from the opening 13a; hereinafter referred to as "another opening") for exposing the connectors 56 to 58 to the outside of the housing 10 may be provided in the portion of the side surface 13 that overlaps with the side wall 61. In other words, the opening 13a for inserting the control unit 50 into the housing 10 and the opening for exposing the connectors 56 to 58 of the control unit 50 housed in the housing 10 to the outside of the housing 10 may be different from each other. Even in such a case, the connectors 56-58 can be positioned relative to the side plate 60 (side wall portion 61) outside the housing 10. The control unit 50 is then housed and positioned at a predetermined position relative to the housing 10. Therefore, the connectors 56-58 positioned relative to the side wall portion 61 can be exposed to the outside of the housing 10 through another opening in the side surface portion 13. When the side wall portion 61 is positioned so as to overlap the side surface portion 13, the control unit 50 may have another side plate (a side plate provided separately from the side plate 60) to cover the position corresponding to the opening 13a. However, as in this embodiment, by configuring the side wall portion 61 to be positioned at a position corresponding to the opening 13a when the control unit 50 is housed in the housing 10, the following advantages are obtained. First, there is no need to provide another opening or another side plate as described above. Furthermore, in the configuration in which the side wall portion 61 overlaps the side surface portion 13 as described above, if a slight misalignment occurs between the housing 10 and the control unit 50, the positions of the connectors 56 to 58 relative to the housing 10 (for example, the amount of protrusion relative to the outer wall of the housing 10) will also be affected by the misalignment.In contrast, with the configuration of this embodiment in which the side wall 61 is disposed at a position corresponding to the opening 13a, even if a slight misalignment occurs between the housing 10 and the control unit 50 (for example, variations in the amount of depression of the control unit 50 into the housing 10), the amount of protrusion of the connectors 56 to 58 from the side wall 61 is not affected by this misalignment. Therefore, with the configuration of this embodiment, the positioning accuracy of the connectors 56 to 58 can be more reliably ensured.

[0144] In the above embodiment, the opening 61a of the side plate 60 is a through hole, but the opening 61a may have any shape that allows the shaft 56a of the connector 56 to pass through. For example, the opening 61a may be a notch. Similarly, the openings 61b and 61c may have a shape other than a through hole (for example, a notch).

[0145] In the above embodiment, the side wall portion 61 of the side plate 60 extends along the YZ plane. However, the side wall portion 61 may extend along two or more planes. For example, the side wall portion 61 may have a portion extending along the YZ plane and a portion extending along the XZ plane. Specifically, the side wall portion 61 may be L-shaped when viewed from the Z-axis direction to define two sides of the storage space within the housing 10. Alternatively, the side wall portion 61 may be C-shaped when viewed from the Z-axis direction to define three sides of the storage space within the housing 10. In addition, in the above embodiment, the opening 13a is provided only at a position facing the third portion 133 of the side surface portion 13. However, an opening may also be provided in the first portion 131 or the second portion 132 to correspond to the shape of the side wall portion 61 of the side plate 60. For example, the side surface portion 13 may be configured to have an L-shaped or C-shaped opening when viewed from the Z-axis direction.

[0146] In the above embodiment, multiple connectors 56 to 58 are provided on the control board 55, but it is sufficient that at least one connector is provided on the control board 55. Similarly, in the above embodiment, multiple notches 593 and 594 are provided in the opposing wall portion 591, but, for example, if there is only one connector, only one notch corresponding to that connector may be provided. Furthermore, the connectors 56 to 58 may be provided on the main surface 55a of the control board 55. Furthermore, the mounting member 59 may have a wall portion facing the main surface 55a of the control board 55. If the connectors 56 to 58 are provided on the main surface 55a of the control board 55 and the mounting member 59 has a wall portion facing the main surface 55a, the wall portion may be provided with notches similar to the notches 593 and 594 in the above embodiment.

[0147] 1...radiation imaging device, 10...housing, 11a...opening (third opening), 12...bottom wall portion, 12a...through hole, 12b...first through hole, 12c...second through hole, 13...side portion, 13a...opening (second opening), 20...lid member, 31...sensor panel, 50...control unit, 55...control board, 55a...main surface, 55b...rear surface, 56, 57, 58...connectors, 56a, 57a...shaft portion, 59...mounting member, 60...side plate, 61...side wall portion, 61a, 61b, 61c...openings, 71...first fixing member, 72...second fixing member, 81A, 81B, 82A, 82B...nuts, 591...opposing wall portion, 593, 594...cutout, 595...protrusion portion, M...member.

Claims

1. A radiation imaging device comprising: a sensor panel that detects radiation; a control unit; and a housing that houses the sensor panel and the control unit, wherein the control unit has a main surface that faces the sensor panel along a first direction perpendicular to the sensor panel and a back surface opposite the main surface, and the control board controls reading of signals from the sensor panel; a mounting member on which the control board is mounted; a side plate fixed to the mounting member and having a side wall portion with a first opening; and at least one connector that is provided on the control board for connecting the control board to the outside and passes through the first opening in the side wall portion, and the housing is provided with a second opening for inserting the control unit into the housing along a second direction perpendicular to the first direction.

2. The radiation imaging device according to claim 1, wherein when the sensor panel and the control unit are housed in the housing, the side wall portion is disposed at a position corresponding to the second opening.

3. The radiation imaging device according to claim 1 or 2, wherein the sensor panel is fixed to the control unit.

4. The radiation imaging device according to any one of claims 1 to 3, wherein the at least one connector is attached to the side wall portion.

5. A radiation imaging device as described in claim 4, wherein the at least one connector is provided on at least one of the main surface and the back surface of the control board, the mounting member has an opposing wall portion facing the surface of the main surface or the back surface of the control board on which the at least one connector is provided, and the opposing wall portion is provided with at least one notch at a position overlapping with at least a portion of the at least one connector in the first direction.

6. The radiation imaging device according to claim 5, wherein the at least one connector has a plurality of connectors, the at least one cutout has a plurality of cutouts, and the opposing wall portion is located between two adjacent connectors when viewed from the first direction, separating the two adjacent cutouts from each other, and has a protrusion portion in contact with the side wall portion.

7. A radiation imaging device as described in any one of claims 4 to 6, further comprising a pair of nuts arranged on either side of the side wall portion, wherein the at least one connector has a shaft portion that passes through the first opening and is screwed into each of the pair of nuts, and the at least one connector is attached to the side wall portion by the pair of nuts being screwed into the shaft portions from both sides of the side wall portion.

8. A radiation imaging device as described in claim 5 or 6, further comprising a pair of nuts arranged on either side of the side wall portion, the at least one connector having a shaft portion that passes through the first opening and is screwed into each of the pair of nuts, the at least one connector being attached to the side wall portion by the pair of nuts being screwed into the shaft portions from both sides of the side wall portion, and the at least one notch being provided in a position that overlaps with the nut on the control board side in the first direction.

9. The radiation imaging device according to any one of claims 1 to 8, wherein the at least one connector is provided on the rear surface of the control board.

10. A radiation imaging device according to any one of claims 1 to 9, wherein the housing has a bottom wall portion located on the side opposite to the side where radiation is incident, and the bottom wall portion is provided with at least one through hole.

11. The radiation imaging device according to claim 10, wherein the at least one through hole includes at least one first through hole through which a first fixing member for fixing the mounting member to the housing is inserted.

12. The radiation imaging device according to claim 11, wherein the at least one through hole further includes at least one second through hole through which a second fixing member for fixing the mounting member to a member arranged outside the housing is inserted.

13. A radiation imaging device as described in any one of claims 1 to 12, further comprising a cover member, wherein a third opening is provided on the side of the housing where radiation is incident and facing the sensor panel, and the cover member is attached to the housing so as to cover the third opening.

14. The radiation imaging device according to claim 13, wherein the housing and the cover member are made of different materials.

15. The radiation imaging device according to claim 13 or 14, wherein the cover member is fixed to both the housing and the side plate at a position where the cover member overlaps both the housing and the side plate when viewed from the first direction.

16. A radiation imaging device as claimed in any one of claims 1 to 15, wherein the housing has a side portion extending in the first direction and having the second opening, and the mounting member is not in contact with the side portion.

17. A method for manufacturing a radiation imaging device according to any one of claims 1 to 16, comprising: a step of assembling the control unit; and a step of inserting the control unit into the housing along the second direction, wherein the step of assembling the control unit comprises: a step of mounting the control board on the mounting member; and a step of fixing the side plate to the mounting member.

18. The method for manufacturing a radiation imaging device according to claim 17, further comprising the step of fixing the sensor panel to the control unit before the step of inserting the control unit.

19. The method for manufacturing a radiation imaging device according to claim 17 or 18, wherein the step of assembling the control unit further comprises the step of attaching the at least one connector to the side wall portion after the step of fixing the side plate.

20. A method for manufacturing a radiation imaging device as described in claim 19, wherein the at least one connector has an axis portion that passes through the first opening, and in the step of attaching the at least one connector, a pair of nuts are screwed onto the axis portion from both sides of the side wall portion, thereby attaching the at least one connector to the side wall portion.

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