Sample holder

Abstract

This sample holder is provided with a ceramic substrate, a base plate, a flow path member, and a stirring member. The ceramic substrate has: a first surface on which a sample is placed; a second surface positioned opposite the first surface; and a first flow path penetrating the first surface and the second surface. The base plate is positioned on the second surface of the ceramic substrate and has a third surface facing the second surface, a fourth surface positioned opposite the third surface, and a first through-hole penetrating the third surface and the fourth surface at a position corresponding to the first flow path. The flow path member is positioned in the first through hole, and has a first end portion and a second end portion in the thickness direction of the base plate, the first end portion being positioned on the first flow path side. The flow path member includes a porous body positioned at the first end portion and a second flow path communicating with the first flow path via the porous body. The stirring member is positioned at the second end portion and has a fifth surface positioned on the second flow path side, a sixth surface positioned opposite the fifth surface, and a plurality of second through-holes penetrating the fifth surface and the sixth surface.

Description

Sample holder

[0001] SUMMARY OF THE INVENTION The disclosed embodiments relate to a sample holder.

[0002] In the process of manufacturing semiconductor parts, electrostatic chucks are used as sample holders to hold workpieces such as semiconductor wafers that are to be subjected to plasma processing. These electrostatic chucks are constructed, for example, by bonding a ceramic substrate with an embedded electrode to a metal base plate.

[0003] The electrostatic chuck has a flow path for supplying a heat transfer gas for temperature control to a workpiece placed on the electrostatic chuck. Also, from the viewpoint of reducing the intrusion of plasma into the flow path, an electrostatic chuck has been proposed in which a porous body is disposed within the flow path (see, for example, Patent Document 1).

[0004] Japanese Patent Application Laid-Open No. 2019-165223

[0005] The sample holder of the present disclosure includes a ceramic substrate, a base plate, a flow path member, and a stirring member. The ceramic substrate has a first surface on which a sample is placed, a second surface opposite the first surface, and a first flow path penetrating the first and second surfaces. The base plate is located on the second surface of the ceramic substrate and has a third surface facing the second surface, a fourth surface opposite the third surface, and a first through hole penetrating the third and fourth surfaces at a position corresponding to the first flow path. The flow path member is located at the first through hole and has a pair of first and second ends in the thickness direction of the base plate, the first end being located on the first flow path side, a porous body located at the first end, and a second flow path communicating with the first flow path via the porous body. The stirring member is located at the second end and has a fifth surface located on the second flow path side, a sixth surface opposite the fifth surface, and a plurality of second through holes penetrating the fifth and sixth surfaces.

[0006] FIG. 1 is a perspective view showing the configuration of a sample holder according to an embodiment. FIG. 2 is a schematic diagram showing a longitudinal section of the sample holder according to an embodiment. FIG. 3 is an enlarged longitudinal sectional view showing the configuration of a flow path member and its periphery according to an embodiment. FIG. 4 is a plan view showing an example of the configuration of a stirring member according to an embodiment as viewed from above. FIG. 5 is an enlarged longitudinal sectional view showing the configuration of a stirring member and its periphery according to an embodiment. FIG. 6 is an enlarged longitudinal sectional view showing the configuration of a flow path member and its periphery according to another embodiment 1. FIG. 7 is a plan view showing an example of the configuration of a stirring member according to another embodiment 2 as viewed from above. FIG. 8 is an enlarged longitudinal sectional view showing the configuration of a stirring member and its periphery according to another embodiment 3. FIG. 9 is an enlarged longitudinal sectional view showing the configuration of a stirring member and its periphery according to another embodiment 4. FIG. 10 is a plan view showing an example of the configuration of a stirring member according to another embodiment 5 as viewed from above. FIG. 11 is a diagram for explaining turbulence generated by the stirring member according to another embodiment 5. FIG. 12 is a plan view showing an example of the configuration of a stirring member according to another embodiment 6 as viewed from above. FIG. 13 is a plan view showing an example of the configuration of a stirring member according to another embodiment 6 as viewed from above. FIG. 14 is a plan view showing an example of the configuration of an agitating member according to Alternative Embodiment 7, as viewed from above. FIG. 15 is a plan view showing an example of the configuration of an agitating member according to Alternative Embodiment 8, as viewed from above. FIG. 16 is a plan view showing an example of the configuration of an agitating member according to Alternative Embodiment 9, as viewed from above. FIG. 17 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 10. FIG. 18 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 10. FIG. 19 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 11. FIG. 20 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 11. FIG. 21 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 11. FIG. 22 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 11. FIG. 23 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 11. FIG. 24 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to Alternative Embodiment 11. FIG. 25 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 12. As shown in FIG.FIG. 26 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 12. FIG. 27 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 12. FIG. 28 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 12. FIG. 29 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 13. FIG. 30 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 13. FIG. 31 is an enlarged cross-sectional view showing an example of the configuration of a second flow path according to another embodiment 13. FIG. 32 is an enlarged vertical cross-sectional view showing a configuration of a flow path member according to another embodiment 14 and its periphery. FIG. 33 is a cross-sectional view taken along the line B-B of the flow path member shown in FIG. 32. FIG. 34 is a cross-sectional view taken along the line CC of the flow path member shown in FIG. 32. FIG. 35 is a cross-sectional view taken along the line D-D of the flow path member shown in FIG. 32. FIG. 36 is a cross-sectional view taken along the line E-E of the flow path member shown in FIG. 32. FIG. 37 is an enlarged vertical cross-sectional view showing a configuration of a flow path member according to another embodiment 15 and its periphery. Fig. 38 is a cross-sectional view of the flow path member shown in Fig. 37 taken along line F-F. Fig. 39 is a cross-sectional view of the flow path member shown in Fig. 37 taken along line G-G. Fig. 40 is an enlarged longitudinal cross-sectional view showing a flow path member according to another embodiment 16 and the configuration of its periphery. Fig. 41 is a cross-sectional view of the flow path member shown in Fig. 40 taken along line H-H. Fig. 42 is a cross-sectional view of the flow path member shown in Fig. 40 taken along line J-J. Fig. 43 is an enlarged longitudinal cross-sectional view showing a flow path member according to another embodiment 17 and the configuration of its periphery. Fig. 44 is a cross-sectional view of the flow path member shown in Fig. 43 taken along line K-K. Fig. 45 is a cross-sectional view of the flow path member shown in Fig. 43 taken along line L-L.

[0007] Hereinafter, embodiments of the sample holder disclosed in the present application will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments shown below. Furthermore, each embodiment can be appropriately combined within the scope of not causing contradictions in the content. Furthermore, the same parts in each of the following embodiments will be given the same reference numerals, and duplicated explanations will be omitted.

[0008] Furthermore, in the following embodiments, expressions such as "parallel," "orthogonal," "equal," or "uniform" may be used, but these expressions do not necessarily mean "parallel," "orthogonal," "equal," or "uniform" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0009] In the process of manufacturing semiconductor parts, electrostatic chucks are used as sample holders to hold workpieces such as semiconductor wafers that are to be subjected to plasma processing. These electrostatic chucks are constructed, for example, by bonding a ceramic substrate with an embedded electrode to a metal base plate.

[0010] This electrostatic chuck has a flow path for supplying a heat transfer gas for temperature control to a workpiece placed on the electrostatic chuck. Also, from the viewpoint of reducing the intrusion of plasma into the flow path, an electrostatic chuck has been proposed in which a porous body is disposed within the flow path.

[0011] However, in the above-mentioned conventional technology, the insulating ceramic material located around the flow path has poor cooling properties, which can lead to poor thermal uniformity between the area around the flow path and other areas in the sample holder, which can cause problems with in-plane thermal uniformity of the object to be treated, and can reduce the yield of plasma processing of the object to be treated.

[0012] Therefore, it is desired to realize a sample holder that can solve the above problems and improve the in-plane temperature uniformity of the upper surface.

[0013] <Embodiment> First, the configuration of a sample holder 100 according to an embodiment will be described with reference to Figures 1 to 5. Figure 1 is a perspective view showing the configuration of the sample holder 100 according to an embodiment. As shown in Figure 1, the sample holder 100 has a structure in which a ceramic substrate 110 and a base plate 120 are joined together.

[0014] The ceramic substrate 110 uses electrostatic force to attract a workpiece (not shown) such as a semiconductor wafer on the first surface 110a. The workpiece is an example of a sample. The ceramic substrate 110 is a member formed into a substantially circular disk shape from a ceramic-containing raw material.

[0015] The ceramic substrate 110 is made of, for example, aluminum oxide (alumina) (Al ２ O ３ ), aluminum nitride (AlN), yttria (Y ２ O ３ ), cordierite, silicon carbide (SiC) or silicon nitride (Si ３ N ４ ) as its main ingredient.

[0016] The base plate 120 is a support member that supports the ceramic substrate 110. The base plate 120 is attached to, for example, a semiconductor manufacturing device, and causes the sample holder 100 to function as a semiconductor holder for holding a workpiece such as a semiconductor wafer. The base plate 120 is, for example, a circular metal member that has a cylindrical protrusion on the ceramic substrate 110 side.

[0017] The metal material for forming the base plate 120 may be, for example, aluminum, stainless steel, titanium, or an aluminum-based composite material such as AlSiC.

[0018] 2 is a schematic diagram showing a longitudinal section of the sample holder 100 according to the embodiment. As described above, the sample holder 100 is formed by joining a ceramic substrate 110 and a base plate 120. In this disclosure, the term "longitudinal section" refers to a cross section seen along a plane perpendicular to the first surface 110a of the ceramic substrate 110.

[0019] The ceramic substrate 110 has a first surface 110a and a second surface 110b. A workpiece (not shown) such as a semiconductor wafer is placed on the first surface 110a. The second surface 110b is located opposite the first surface 110a.

[0020] The workpiece placed on the first surface 110a of the ceramic substrate 110 is subjected to plasma processing by generating plasma above the first surface 110a. This plasma can be generated by applying high-frequency power to an electrode (not shown) facing the first surface 110a to excite a gas.

[0021] An electrode 111 is disposed inside the ceramic substrate 110. The electrode 111 is, for example, an electrostatic attraction electrode, and is a conductive member containing a metal such as platinum, tungsten, or molybdenum. When a voltage is applied to the electrode 111, the sample holder 100 generates an electrostatic force, and the sample holder 100 functions as an electrostatic chuck, attracting the workpiece to the first surface 110a of the ceramic substrate 110 by the electrostatic force.

[0022] The base plate 120 is located on the second surface 110b of the ceramic substrate 110 and is bonded to the second surface 110b. The base plate 120 may be bonded to the second surface 110b via a bonding material (not shown), for example. An adhesive such as a silicone resin may be used as the bonding material.

[0023] The base plate 120 has a third surface 120a and a fourth surface 120b. The third surface 120a is opposite to the second surface 110b of the ceramic substrate 110. The fourth surface 120b is located opposite the third surface 120a.

[0024] The base plate 120 may have an internal space 121. The space 121 may be used as a coolant passage for passing a cooling medium such as cooling water or cooling gas. The base plate 120 may also function as a high-frequency electrode to which high-frequency power for generating plasma is applied.

[0025] 2, the ceramic substrate 110 has a first flow path 112 that penetrates the first surface 110a and the second surface 110b. The first flow path 112 is provided, for example, so as to be perpendicular to the first surface 110a.

[0026] The base plate 120 also has a first through-hole 122 that penetrates the third surface 120a and the fourth surface 120b at a position corresponding to the first flow path 112 of the ceramic substrate 110. A flow path member 130 is positioned in the first through-hole 122.

[0027] The flow path member 130 is a cylindrical member made of an insulating material such as aluminum oxide. When the recess 113 is provided on the second surface 110b of the ceramic substrate 110, the flow path member 130 may protrude further toward the ceramic substrate 110 than the third surface 120a of the base plate 120 and be fitted into the recess 113.

[0028] As a result, the length of the first flow passage 112 is shortened at the position corresponding to the recess 113 of the ceramic substrate 110, and therefore, the generation of plasma in the first flow passage 112 can be reduced.

[0029] The flow path member 130 has a pair of first and second ends 130a and 130b in the thickness direction of the base plate 120. The first end 130a is located on the side of the first flow path 112. The second end 130b is located opposite the first end 130a.

[0030] The flow path member 130 has a porous body 131 at the first end 130 a. By positioning the porous body 131 at the first end 130 a in this manner, when plasma is generated above the first surface 110 a of the ceramic substrate 110, it is possible to reduce the problem of the plasma passing through the first flow path 112 and reaching the base plate 120 side.

[0031] The porous body 131 is, for example, an alumina porous body or another ceramic porous body. The porous body 131 only needs to have pores to the extent that gas can flow through it. The porosity of the porous body 131 is, for example, 20% or more and 60% or less. The porous body 131 may be integrated with the flow path member 130 by firing.

[0032] The flow path member 130 also has a second flow path 132 that communicates with the first flow path 112 via the porous body 131. The second flow path 132 is provided so as to be perpendicular to the first surface 110a of the ceramic substrate 110, for example.

[0033] The flow path member 130 also has an agitating member 140 at the second end 130b. The agitating member 140 is made of, for example, high-purity alumina, and is bonded to the flow path member 130 with an adhesive or the like. The agitating member 140 and the flow path member 130 may be integrated by firing. The function of this agitating member 140 will be described later.

[0034] The opening of the first through hole 122, the second flow path 132, and the first flow path 112 form a continuous gas flow path from the lower surface (fourth surface 120b) of the base plate 120, via the stirring member 140 and the porous body 131, to the upper surface (first surface 110a) of the ceramic substrate 110.

[0035] A heat transfer gas such as helium may be flowed through the gas flow path including the opening of first through-hole 122, stirring member 140, second flow path 132, porous body 131, and first flow path 112. By flowing the heat transfer gas through this gas flow path, the heat transfer gas is supplied to the back surface of the workpiece placed on first surface 110a of ceramic substrate 110, improving the heat transfer coefficient between the workpiece and ceramic substrate 110.

[0036] Fig. 3 is an enlarged vertical cross-sectional view showing the configuration of the flow path member 130 and its surroundings according to the embodiment. Fig. 4 is a plan view showing an example of the configuration of the stirring member 140 according to the embodiment as viewed from above.

[0037] 4, in this embodiment, the agitating member 140 located upstream of the second flow path 132 (see FIG. 3) has a plurality of second through-holes 141. The agitating member 140 is, for example, disk-shaped and has a fifth surface 140a and a sixth surface 140b (see FIG. 3).

[0038] 3, the fifth surface 140a is located on the side of the second flow path 132. The sixth surface 140b is located opposite the fifth surface 140a and faces the opening of the first through-hole 122.

[0039] 4, the second through holes 141 have circular planar and cross-sectional shapes and have substantially equal cross-sectional areas. In plan view, one second through hole 141 is located in the center of the stirring member 140, and the other second through holes 141 are located concentrically with the center of the stirring member 140.

[0040] Alternatively, the second through holes 141 may have a circular planar shape and a circular cross-sectional shape, and the second through hole 141 in the center may have a different cross-sectional area from the other second through holes 141. For example, the inner diameter of the second through hole 141 in the center may be smaller than the inner diameters of the other second through holes 141. Alternatively, the inner diameter of the second through hole 141 in the center may be larger than the inner diameters of the other second through holes 141.

[0041] In the present disclosure, the term "transverse cross section" refers to a cross section seen along a plane parallel to the first surface 110a of the ceramic substrate 110.

[0042] Fig. 5 is an enlarged longitudinal cross-sectional view showing the configuration of the stirring member 140 and its surrounding area according to the embodiment, and is a cross-sectional view taken along the arrows corresponding to line A-A in Fig. 4. As shown in Fig. 5, a plurality of second through holes 141 penetrate the fifth surface 140a and the sixth surface 140b of the stirring member 140. The second through holes 141 are provided, for example, so as to be perpendicular to the fifth surface 140a and the sixth surface 140b of the stirring member 140.

[0043] With this configuration, the flow F of heat transfer gas flowing from the opening of the first through hole 122 toward the agitating member 140 passes through the interior of the plurality of second through holes 141 in the agitating member 140, and becomes a turbulent flow T, which flows inside the second flow path 132. That is, in this embodiment, the agitating member 140 forms a turbulent flow T of the heat transfer gas inside the second flow path 132.

[0044] This can promote cooling of the insulating flow path member 130. This is because, when comparing the cooling of a fluid between a laminar flow (for example, flow F) and a turbulent flow T, the heat transfer coefficient is greater in the turbulent flow T, and therefore the inner wall surface 132a of the second flow path 132 is cooled efficiently.

[0045] That is, in the embodiment, the cooling performance of the ceramic flow path member 130 located around the second flow path 132 is improved, thereby improving the thermal uniformity between the area around the gas flow path and other areas in the sample holder 100.

[0046] Therefore, according to the embodiment, it is possible to improve the in-plane temperature uniformity of the upper surface of the sample holder 100 (the first surface 110a of the ceramic substrate 110).

[0047] Alternative Embodiment 1 Next, various alternative embodiments of the present disclosure will be described with reference to Fig. 6 to Fig. 45. Fig. 6 is an enlarged vertical cross-sectional view showing a flow path member 130 according to alternative embodiment 1 and the configuration of the surrounding area.

[0048] As shown in Figure 6, the sample holder 100 according to Alternative Embodiment 1 differs from the above-described embodiment (see Figure 3) in the configuration of the gas flow path. Specifically, in Alternative Embodiment 1, the flow path member 130 has a third flow path 150 located between the second flow path 132 and the stirring member 140. The cross-sectional area of ​​the third flow path 150 is larger than that of the second flow path 132. In other words, the inner diameter of the third flow path 150 is larger than that of the second flow path 132.

[0049] Furthermore, there is an abrupt change in the cross-sectional area between the third flow path 150 and the second flow path 132. This abrupt change in the cross-sectional area of ​​the gas flow path promotes the generation of turbulence T (see FIG. 5 ), thereby further improving the cooling performance of the ceramic flow path member 130.

[0050] Therefore, according to the alternative embodiment 1, the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0051] In another embodiment 1, by positioning the third flow path 150 so that it is in contact with the fifth surface 140a of the stirring member 140, the effective area in which multiple second through holes 141 can be arranged in the stirring member 140 is increased, thereby increasing the freedom of design of the stirring member 140.

[0052] Regarding the method of forming the third flow path 150, for example, the flow path member 130 including the second flow path 132 may be produced by extrusion molding, and then the third flow path 150 may be formed by cutting processing, or the second flow path 132 and the third flow path 150 may be formed together by injection molding.

[0053] <Another Embodiment 2> Fig. 7 is a plan view showing an example of the configuration of a stirring member 140 according to another embodiment 2, as seen from above. As shown in Fig. 7, in the sample holder 100 according to another embodiment 2 (see Fig. 3), the configuration of the plurality of second through-holes 141 in the stirring member 140 differs from that of the embodiment described above (see Fig. 4).

[0054] Specifically, in another embodiment 2, the cross-sectional areas of the plurality of second through holes 141 gradually increase from the center to the outer periphery of the agitating member 140. This increases the flow rate of the heat transfer gas toward the inner wall surface 132a (see FIG. 5) of the second flow path 132 (see FIG. 5), thereby improving the cooling efficiency of the inner wall surface 132a.

[0055] Generally, the flow rate of the liquid flowing through the pipe gradually decreases as it approaches the inner wall surface. On the other hand, in another embodiment 2, by increasing the flow rate toward the inner wall surface 132a when the liquid enters the second flow path 132, it is possible to mitigate the decrease in flow rate near the inner wall surface 132a and improve cooling performance.

[0056] Therefore, according to another embodiment 2, the cooling performance of the ceramic flow path member 130 (see Figure 5) can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0057] Regarding the manufacturing method of the stirring member 140 according to another embodiment 2, for example, after forming a disk, the plurality of second through holes 141 may be individually formed by grinding or laser drilling, or the plurality of second through holes 141 may be molded collectively by injection molding.

[0058] <Another embodiment 3> Figure 8 is an enlarged vertical cross-sectional view showing the configuration of a stirring member 140 and its surroundings according to another embodiment 3. As shown in Figure 8, in the sample holder 100 (see Figure 3) according to another embodiment 3, the vertical cross-sectional configuration of the plurality of second through-holes 141 in the stirring member 140 differs from that of the embodiment described above (see Figure 5).

[0059] Specifically, in Alternative Embodiment 3, the cross-sectional area of ​​the second through hole 141 gradually decreases from the sixth surface 140b toward the fifth surface 140a of the stirring member 140. That is, the inner diameter of the second through hole 141 gradually decreases toward the fifth surface 140a.

[0060] This increases the flow rate of the heat transfer gas at the outlet of the second through-hole 141, and the turbulent flow T is generated by the stirring member 140 more efficiently.

[0061] Therefore, according to another embodiment 3, the cooling performance of the ceramic flow path member 130 (see Figure 5) can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0062] Regarding the manufacturing method of the stirring member 140 according to another embodiment 3, for example, after forming a disk, the plurality of second through holes 141 may be individually formed by laser drilling, or the plurality of second through holes 141 may be molded collectively by injection molding.

[0063] <Alternative Embodiment 4> Fig. 9 is an enlarged vertical cross-sectional view showing the configuration of a stirring member 140 and its surroundings according to alternative embodiment 4. As shown in Fig. 9, in the sample holder 100 (see Fig. 3) according to alternative embodiment 4, the vertical cross-sectional configuration of the plurality of second through-holes 141 in the stirring member 140 differs from that of the above-described embodiment (see Fig. 5).

[0064] Specifically, in the fourth alternative embodiment, the center line of the second through hole 141 located in the peripheral portion is inclined with respect to the inner wall surface 132 a of the second flow path 132 .

[0065] This increases the flow rate of the heat transfer gas directed toward the inner wall surface 132a of the second flow passage 132, thereby improving the cooling efficiency of the inner wall surface 132a.

[0066] Generally, the flow rate of the liquid flowing inside the pipe gradually decreases as it approaches the inner wall surface. On the other hand, in another embodiment 4, by forming a flow toward the inner wall surface 132a when the liquid enters the second flow path 132, it is possible to mitigate the decrease in flow rate near the inner wall surface 132a and improve cooling performance.

[0067] Therefore, according to another embodiment 4, the cooling performance of the ceramic flow path member 130 (see Figure 5) can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0068] Regarding the manufacturing method of the stirring member 140 according to another embodiment 4, for example, after forming a disk, the plurality of second through holes 141 may be individually formed by grinding or laser drilling, or the plurality of second through holes 141 may be molded collectively by injection molding.

[0069] <Another embodiment 5> Fig. 10 is a plan view showing an example of the configuration of an agitating member 140 according to another embodiment 5, as viewed from above. Fig. 11 is a diagram for explaining turbulence T generated by the agitating member 140 according to another embodiment 5.

[0070] As shown in Figures 10 and 11, in a sample holder 100 according to another embodiment 5 (see Figure 3), the center line of the second through hole 141 located at the periphery is inclined so as to generate a vortex in the second flow path 132.

[0071] In this way, by generating a vortex in the second flow passage 132, the time that the heat transfer gas is in contact with the inner wall surface 132a is increased, and therefore the cooling efficiency of the inner wall surface 132a is improved.

[0072] Therefore, according to another embodiment 5, the cooling performance of the ceramic flow path member 130 (see Figure 5) can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0073] In another embodiment 5, the direction of the vortex flow of the turbulent flow T formed by the stirring member 140 may be in accordance with the Coriolis force (for example, counterclockwise if the location where the sample holder 100 is used is in the Northern Hemisphere). This allows the vortex flow of the turbulent flow T to be efficiently formed in the second flow path 132, further improving the cooling efficiency of the inner wall surface 132a.

[0074] Therefore, according to the fifth alternative embodiment, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0075] Regarding the manufacturing method of the stirring member 140 according to another embodiment 5, for example, after forming a disk, the plurality of second through holes 141 may be individually formed by grinding or laser drilling, or the plurality of second through holes 141 may be molded collectively by injection molding.

[0076] 12 and 13 are plan views showing an example of the configuration of a stirring member 140 according to another embodiment 6, as viewed from above. As shown in Fig. 12 and Fig. 13, in the sample holder 100 according to another embodiment 6 (see Fig. 3), the arrangement of the plurality of second through-holes 141 in the stirring member 140 differs from that of the embodiment described above (see Fig. 4).

[0077] For example, in the example of Figure 12, multiple groups of right-angled triangular through holes (four in the figure) composed of multiple second through holes 141 are located around one second through hole 141 located in the center of the stirring member 140.

[0078] In the example of FIG. 13, a plurality of groups of through holes (four in the figure) each having a regular triangle shape and made up of a plurality of second through holes 141 are positioned around the center of the stirring member 140 .

[0079] The arrangement of these second through holes 141 also promotes the generation of turbulent flow T (see FIG. 5) in the stirring member 140, thereby improving the cooling performance of the ceramic flow path member 130 (see FIG. 5). Therefore, according to another embodiment 6, the in-plane temperature uniformity of the upper surface of the sample holder 100 can be improved.

[0080] <Alternative Embodiment 7> Fig. 14 is a plan view showing an example of the configuration of a stirring member 140 according to Alternative Embodiment 7, as viewed from above. As shown in Fig. 14, in the sample holder 100 according to Alternative Embodiment 7 (see Fig. 3), the configuration of the plurality of second through-holes 141 in the stirring member 140 differs from that of Alternative Embodiment 6 (see Fig. 12).

[0081] Specifically, in another embodiment 7, the cross-sectional areas of the plurality of second through holes 141 gradually increase from the center toward the outer periphery of the agitating member 140. This increases the flow rate of the heat transfer gas toward the inner wall surface 132a (see FIG. 5) of the second flow path 132 (see FIG. 5), thereby improving the cooling efficiency of the inner wall surface 132a.

[0082] Therefore, according to another embodiment 7, the cooling performance of the ceramic flow path member 130 (see Figure 5) can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0083] 15 is a plan view showing an example of the configuration of an agitating member 140 according to another embodiment 8, as viewed from above. In the embodiment and various other embodiments described up to this point, examples have been shown in which the planar shape and cross-sectional shape of the second through hole 141 are circular, but the present disclosure is not limited to such examples.

[0084] 15, the planar shape and cross-sectional shape of the second through hole 141 may be a polygonal shape (for example, a rectangular shape in the figure). For example, in the example of Fig. 15, a plurality of second through holes 141 having a rectangular planar shape and cross-sectional shape are arranged in a matrix.

[0085] This also promotes the generation of turbulence T (see FIG. 5) in the stirring member 140, thereby improving the cooling performance of the ceramic flow path member 130 (see FIG. 5). Therefore, according to another embodiment 8, the in-plane temperature uniformity of the upper surface of the sample holder 100 (see FIG. 3) can be improved.

[0086] <Another Embodiment 9> Fig. 16 is a plan view showing an example of the configuration of a stirring member 140 according to another embodiment 9, as seen from above. As shown in Fig. 16, in the sample holder 100 according to another embodiment 9 (see Fig. 3), the configuration of the plurality of second through-holes 141 in the stirring member 140 differs from that of the above-described another embodiment 8 (see Fig. 15).

[0087] Specifically, in another embodiment 9, the cross-sectional areas of the plurality of second through holes 141 gradually increase from the center toward the outer periphery of the agitating member 140. This increases the flow rate of the heat transfer gas toward the inner wall surface 132a (see FIG. 5) of the second flow path 132 (see FIG. 5), thereby improving the cooling efficiency of the inner wall surface 132a.

[0088] Therefore, according to another embodiment 9, the cooling performance of the ceramic flow path member 130 (see Figure 5) can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0089] 17 and 18 are enlarged cross-sectional views showing an example of the configuration of a second flow path 132 according to another embodiment 10. As shown in Fig. 17 and 18, in a sample holder 100 according to another embodiment 10 (see Fig. 3), a flow path member 130 has a plurality of protrusions 133 that protrude inward from an inner wall surface 132a of the second flow path 132.

[0090] For example, in the example of Figure 17, the second flow path 132 has a circular shape in cross section, and two protrusions 133 having a square shape in cross section are provided on the inner wall surface 132a at two locations positioned 180° apart in the circumferential direction.

[0091] In the example of Figure 18, the second flow path 132 has a circular shape in cross section, and four protrusions 133 having a triangular shape in cross section are provided at four locations on the inner wall surface 132a, positioned at 90° intervals in the circumferential direction.

[0092] In this way, by providing the protrusions 133 on the inner wall surface 132a of the second flow path 132, the area of ​​the inner wall surface 132a that comes into contact with the heat transfer gas is increased. This promotes heat exchange between the heat transfer gas and the flow path member 130, thereby facilitating cooling of the flow path member 130. In other words, the protrusions 133 function as fins of a heat exchanger.

[0093] Therefore, according to another embodiment 10, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0094] In addition, in the method of manufacturing the flow path member 130 according to another embodiment 10, the protrusions 133 may be formed on the inner wall surface 132a of the second flow path 132 by using, for example, extrusion molding or injection molding.

[0095] 19 to 24 are enlarged cross-sectional views showing an example of the configuration of a second flow path 132 according to another embodiment 11. In the embodiments described so far and another embodiment 10 (see FIGS. 17 and 18 ), examples have been shown in which the inner wall surface 132 a of the second flow path 132 has a circular shape in cross section, but the present disclosure is not limited to such examples.

[0096] For example, as shown in Figures 19 to 22, the second flow path 132 may have a polygonal shape in cross section, or as shown in Figures 23 and 24, the second flow path 132 may have a star-shaped polygonal shape in cross section.

[0097] For example, in the example of Fig. 19, the second flow path 132 has a triangular cross section, and in the example of Fig. 20, the second flow path 132 has a rectangular cross section. In addition, in the example of Fig. 21, the second flow path 132 has a pentagonal cross section, and in the example of Fig. 22, the second flow path 132 has a hexagonal cross section.

[0098] In the example of FIG. 23, the second flow path 132 has a pentagonal star shape in cross section, and in the example of FIG. 24, the second flow path 132 has a hexagonal star shape in cross section.

[0099] In this way, by forming the second flow passage 132 of the flow passage member 130 into a polygonal or star-shaped polygonal cross section, the area of ​​the inner wall surface 132a that comes into contact with the heat transfer gas is increased, thereby promoting heat exchange between the heat transfer gas and the flow passage member 130 and facilitating cooling of the flow passage member 130.

[0100] Therefore, according to another embodiment 11, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0101] The flow path member 130 according to the eleventh embodiment can be manufactured by extrusion molding or injection molding, for example.

[0102] 25 to 28 are enlarged cross-sectional views showing an example of the configuration of a second flow path 132 according to another embodiment 12. In the above-described another embodiment 10 (see FIGS. 17 and 18 ), the second flow path 132 has a circular shape in cross section and the protrusions 133 are provided on the inner wall surface 132 a. However, the present disclosure is not limited to such an example, and the second flow path 132 may have a polygonal or star-shaped polygonal shape in cross section and the protrusions 133 may be provided on the inner wall surface 132 a.

[0103] For example, in the example of Figure 25, the second flow path 132 is rectangular in cross section, and four protrusions 133 each having a triangular shape in cross section are provided at four locations on the inner wall surface 132a, one on each side.

[0104] In the example of Figure 26, the second flow path 132 is rectangular in cross section, and six protrusions 133 each having a triangular shape in cross section are provided at six locations on the inner wall surface 132a, one on each of two opposing sides and two on each of the other two opposing sides.

[0105] In the example of Figure 27, the second flow path 132 is hexagonal in cross section, and three protrusions 133 each having a triangular shape in cross section are provided on the inner wall surface 132a at three locations, one on each of the three sides located at 120° intervals in the circumferential direction.

[0106] In the example of Figure 28, the second flow path 132 has a star-shaped hexagonal cross section, and two protrusions 133 having a square shape in cross section are provided at two locations on the inner wall surface 132a, one at each of the two corners that face each other and protrude inward.

[0107] In this way, the second flow path 132 has a polygonal or star-shaped polygonal cross section, and the area of ​​the inner wall surface 132a that comes into contact with the heat transfer gas is further increased by providing the protrusions 133 on the inner wall surface 132a, which further promotes heat exchange between the heat transfer gas and the flow path member 130, thereby further accelerating cooling of the flow path member 130.

[0108] Therefore, according to another embodiment 12, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0109] In addition, as for the manufacturing method of the flow path member 130 according to another embodiment 12, for example, by using extrusion molding or injection molding, the second flow path 132 may be made polygonal or star-shaped polygonal in cross section, and a protrusion 133 may be formed on the inner wall surface 132a.

[0110] 29 to 31 are enlarged cross-sectional views showing an example of the configuration of a second flow path 132 according to another embodiment 13. As shown in Fig. 29 to 31, in a sample holder 100 according to another embodiment 13 (see Fig. 3), a flow path member 130 has partition walls 134 that divide the second flow path 132 into a plurality of paths.

[0111] 29, the second flow paths 132 are circular in cross section, the partition wall 134 divides the second flow paths 132 into two substantially equal parts, and the flow path member 130 has two second flow paths 132. In the example of Fig. 30, the second flow paths 132 are circular in cross section, the partition wall 134 divides the second flow paths 132 into four substantially equal parts, and the flow path member 130 has four second flow paths 132.

[0112] In the example of Figure 31, the second flow path 132 is rectangular in cross section, the partition wall 134 divides the second flow path 132 into two approximately equal parts, and the flow path member 130 has two second flow paths 132.

[0113] In this way, the flow path member 130 has the partition wall 134 provided inside the second flow path 132, thereby increasing the area of ​​the inner wall surface 132a that comes into contact with the heat transfer gas. This promotes heat exchange between the heat transfer gas and the flow path member 130, thereby facilitating cooling of the flow path member 130.

[0114] Therefore, according to another embodiment 13, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0115] In addition, in the method of manufacturing the flow path member 130 according to the thirteenth embodiment, the partition wall 134 may be formed on the inner wall surface 132a of the second flow path 132 by using, for example, extrusion molding or injection molding.

[0116] <Another embodiment 14> Fig. 32 is an enlarged longitudinal cross-sectional view showing a configuration of a flow path member 130 and its surroundings according to another embodiment 14. Also, Figs. 33 to 36 are cross-sectional views taken along the arrows BB, CC, DD, and EE of the flow path member 130 shown in Fig. 32.

[0117] As shown in FIGS. 32 to 36, in another embodiment 14, a plurality of (two in the figure) protrusions 133 are positioned in a spiral shape on the inner wall surface 132 a of the second flow path 132 .

[0118] This increases the area of ​​the inner wall surface 132a that comes into contact with the heat transfer gas, which promotes heat exchange between the heat transfer gas and the flow path member 130, thereby accelerating cooling of the flow path member 130.

[0119] Furthermore, in another embodiment 14, the spiral protrusion 133 forms a vortex of turbulent flow T in the second flow path 132, thereby increasing the time that the heat transfer gas is in contact with the inner wall surface 132a, thereby improving the cooling efficiency of the inner wall surface 132a.

[0120] Therefore, according to another embodiment 14, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0121] In another embodiment 14, the direction of the vortex flow of the turbulent flow T formed by the spiral protrusion 133 may be in accordance with the Coriolis force (for example, counterclockwise if the location where the sample holder 100 is used is the northern hemisphere). This allows the vortex flow of the turbulent flow T to be efficiently formed in the second flow path 132, further improving the cooling efficiency of the inner wall surface 132a.

[0122] Therefore, according to another embodiment 14, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0123] <Another embodiment 15> Fig. 37 is an enlarged vertical cross-sectional view showing a configuration of a flow path member 130 and its surroundings according to another embodiment 15. Also, Figs. 38 and 39 are cross-sectional views taken along the lines FF and GG of the flow path member 130 shown in Fig. 37 .

[0124] 37 to 39, in another embodiment 15, a plurality of protrusions 133 are discontinuously positioned between the agitating member 140 and the porous body 131. For example, in the example of Fig. 37, the protrusions 133 formed in a line along the direction of travel of the heat transfer gas are divided into three between the agitating member 140 and the porous body 131.

[0125] As a result, turbulent flows T (see FIG. 5) of the heat transfer gas are generated at the discontinuous portions of the protrusions 133, and the efficiency of heat exchange between the heat transfer gas and the flow path member 130 is improved.

[0126] Therefore, according to another embodiment 15, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0127] In addition, the method for manufacturing the flow path member 130 according to another embodiment 15 may be, for example, formed by connecting a plurality of extrusion molded products having the protrusions 133 formed thereon and a plurality of extrusion molded products having no protrusions 133 formed thereon. Furthermore, discontinuous protrusions 133 may be formed on the inner wall surface 132 a of the second flow path 132 by using injection molding.

[0128] <Another embodiment 16> Figure 40 is an enlarged vertical cross-sectional view showing a flow path member 130 and its surrounding configuration according to another embodiment 16. Figures 41 and 42 are cross-sectional views taken along the lines HH and JJ of the flow path member 130 shown in Figure 40.

[0129] As shown in Figures 40 to 42, in another embodiment 16, the flow path member 130 has a second flow path 132 that alternates between a first portion 135 having a predetermined cross-sectional area and a second portion 136 having a larger cross-sectional area than the first portion 135.

[0130] For example, in the examples of Figures 40 to 42, the second flow path 132 has a first portion 135 that has a circular shape in cross section, and a second portion 136 that also has a circular shape in cross section and has a larger inner diameter than the first portion 135.

[0131] As a result, turbulence T (see Figure 5) is generated when the heat transfer gas flows through the step between the first portion 135 and the second portion 136, thereby improving the efficiency of heat exchange between the heat transfer gas and the flow path member 130.

[0132] Therefore, according to another embodiment 16, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0133] 40 to 42 show examples in which the cross-sectional area of ​​the circular inner wall surface 132a is changed by changing the inner diameter, but the present disclosure is not limited to such examples. For example, the cross-sectional areas of the first portion 135 and the second portion 136 may be changed by changing the size of the first portion 135 and the second portion 136, which have various cross-sectional shapes.

[0134] In addition, the method for manufacturing the flow path member 130 according to another embodiment 16 may be, for example, formed by connecting a plurality of extrusion molded products having different cross-sectional areas. Also, the second flow path 132 having a changed cross-sectional area may be formed by using injection molding.

[0135] <Another embodiment 17> Figure 43 is an enlarged vertical cross-sectional view showing a configuration of a flow path member 130 and its surroundings according to another embodiment 17. Figures 44 and 45 are cross-sectional views taken along the lines K-K and L-L of the flow path member 130 shown in Figure 43.

[0136] As shown in Figures 43 to 45, in another embodiment 17, the second flow path 132 of the flow path member 130 alternates between a third portion 137 having a predetermined cross-sectional shape and a fourth portion 138 having a cross-sectional shape different from that of the third portion 137.

[0137] For example, in the examples of Figures 43 to 45, the third part 137 has two protrusions 133 that are lined up facing each other in a predetermined direction (horizontal in the figures) when viewed in cross section, and the fourth part 138 has two protrusions 133 that are lined up facing each other in a different direction (vertical in the figures) when viewed in cross section.

[0138] As a result, turbulence T (see Figure 5) is generated when the heat transfer gas flows through the step between the third section 137 and the fourth section 138, thereby improving the efficiency of heat exchange between the heat transfer gas and the flow path member 130.

[0139] Therefore, according to another embodiment 17, the cooling performance of the ceramic flow path member 130 can be further improved, and the in-plane temperature uniformity of the upper surface of the sample holder 100 can be further improved.

[0140] 43 to 45 show examples in which the cross-sectional shape is changed by changing the position of protrusion 133 on circular inner wall surface 132a, but the present disclosure is not limited to such examples. For example, the cross-sectional shapes of third portion 137 and fourth portion 138 may be changed by combining third portion 137 and fourth portion 138 having completely different cross-sectional shapes.

[0141] In addition, the method for manufacturing the flow path member 130 according to another embodiment 17 may be, for example, formed by connecting a plurality of extrusion molded products each having a protrusion 133 formed at one location to another extrusion molded product each having a protrusion 133 formed at another location. Also, the second flow path 132 having a modified cross-sectional shape may be formed by using injection molding.

[0142] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments and various modifications are possible without departing from the spirit of the present disclosure. For example, in the above embodiments, an example in which the porous body 131 is provided in the flow path member 130 has been described, but the present disclosure is not limited to such an example and the porous body 131 may be provided in the ceramic substrate 110.

[0143] Further advantages and other aspects may readily occur to those skilled in the art. Therefore, the disclosure in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

[0144] The present technology can also be configured as follows. (1) A sample holder includes a ceramic substrate, a base plate, a flow path member, and a stirring member, wherein the ceramic substrate has a first surface on which a sample is placed, a second surface opposite the first surface, and a first flow path penetrating the first surface and the second surface, the base plate is located on the second surface of the ceramic substrate, and has a third surface facing the second surface, a fourth surface opposite the third surface, and a first through hole penetrating the third surface and the fourth surface at a position corresponding to the first flow path, the flow path member is located at the first through hole, and has a pair of first and second end portions in a thickness direction of the base plate, the first end portion being located on the first flow path side, a porous body located at the first end portion, and a second flow path communicating with the first flow path via the porous body, and the stirring member is located at the second end portion, and has a fifth surface located on the second flow path side, a sixth surface opposite the fifth surface, and a plurality of second through holes penetrating the fifth and sixth surfaces. A sample holder. (2) The flow path member has a third flow path between the second flow path and the stirring member, and the cross-sectional area of ​​the third flow path is larger than that of the second flow path. (3) The sample holder according to (1) or (2) above, in which the cross-sectional areas of the second through holes gradually increase from the center to the outer periphery of the stirring member. (4) The sample holder according to any one of (1) to (3) above, in which the cross-sectional area of ​​the second through holes gradually decreases from the sixth surface to the fifth surface of the stirring member. (5) The sample holder according to any one of (1) to (4) above, in which the center line of the second through holes located in the peripheral portion is inclined with respect to the inner wall surface of the second flow path. (6) The sample holder according to any one of (1) to (4) above, in which the center lines of the second through holes located in the peripheral portion are inclined so as to generate a vortex in the second flow path. (7) The sample holder according to any one of (1) to (6), wherein the flow path member has a plurality of protrusions protruding inward from an inner wall surface of the second flow path. (8) The sample holder according to (7), wherein the second flow path has a circular shape in cross section.(9) The sample holder according to (7), wherein the second flow path has a polygonal or star-shaped polygonal shape in cross section. (10) The sample holder according to any one of (7) to (9), wherein the plurality of protrusions are positioned in a spiral on the inner wall surface of the second flow path. (11) The sample holder according to any one of (7) to (10), wherein the plurality of protrusions are positioned discontinuously between the stirring member and the porous body. (12) The sample holder according to any one of (1) to (6), wherein the second flow path has a polygonal or star-shaped polygonal shape in cross section. (13) The sample holder according to any one of (1) to (6), wherein the flow path member has a partition wall that divides the second flow path into a plurality of sections. (14) The sample holder according to any one of (1) to (9), wherein the second flow path alternates between a first section having a predetermined cross-sectional area and a second section having a cross-sectional area larger than the first section. (15) The sample holder described in any one of (1) to (9), wherein the second flow path alternates between a third section having a predetermined cross-sectional shape and a fourth section having a cross-sectional shape different from that of the third section.

[0145] 100 Sample holder 110 Ceramic substrate 110a First surface 110b Second surface 112 First flow path 120 Base plate 120a Third surface 120b Fourth surface 122 First through-hole 130 Flow path member 130a First end 130b Second end 131 Porous body 132 Second flow path 132a Inner wall surface 133 Projection 134 Partition wall 135 First portion 136 Second portion 137 Third portion 138 Fourth portion 140 Stirring member 140a Fifth surface 140b Sixth surface 141 Second through-hole 150 Third flow path

Claims

1. A sample holder comprising: a ceramic substrate; a base plate; a flow path member; and a stirring member, wherein the ceramic substrate has a first surface on which a sample is placed, a second surface opposite the first surface, and a first flow path penetrating the first and second surfaces, the base plate is located on the second surface of the ceramic substrate and has a third surface which is an opposing surface to the second surface, a fourth surface opposite the third surface, and a first through hole penetrating the third and fourth surfaces at a position corresponding to the first flow path, the flow path member is located at the first through hole and has a pair of first and second ends in a thickness direction of the base plate, the first end being located on the first flow path side, a porous body located at the first end, and a second flow path communicating with the first flow path via the porous body, and the stirring member is located at the second end and has a fifth surface located on the second flow path side, a sixth surface opposite the fifth surface, and a plurality of second through holes penetrating the fifth and sixth surfaces.

2. The sample holder according to claim 1, wherein the flow path member has a third flow path between the second flow path and the stirring member, and the cross-sectional area of ​​the third flow path is larger than that of the second flow path.

3. A sample holder as described in claim 1 or 2, wherein the cross-sectional area of ​​the second through holes gradually increases from the center of the stirring member toward the outer periphery.

4. A sample holder according to any one of claims 1 to 3, wherein the cross-sectional area of ​​the second through hole gradually decreases from the sixth surface toward the fifth surface of the stirring member.

5. A sample holder as described in any one of claims 1 to 4, wherein the center line of the second through hole located on the periphery is inclined with respect to the inner wall surface of the second flow path.

6. A sample holder as described in any one of claims 1 to 4, wherein the center lines of the multiple second through holes located on the periphery are inclined so as to generate a vortex in the second flow path.

7. A sample holder according to any one of claims 1 to 6, wherein the flow path member has a plurality of protrusions protruding inward from the inner wall surface of the second flow path.

8. The sample holder according to claim 7, wherein the second flow path has a circular shape in cross section.

9. The sample holder according to claim 7, wherein the second flow path has a polygonal or star-shaped polygonal shape in cross section.

10. A sample holder as described in any one of claims 7 to 9, wherein the plurality of protrusions are positioned in a spiral shape on the inner wall surface of the second flow path.

11. A sample holder according to any one of claims 7 to 10, wherein the plurality of protrusions are discontinuously positioned between the stirring member and the porous body.

12. A sample holder according to any one of claims 1 to 6, wherein the second flow path has a polygonal or star-shaped polygonal shape in cross section.

13. The sample holder according to any one of claims 1 to 6, wherein the flow path member has a partition wall that divides the second flow path into a plurality of parts.

14. A sample holder as described in any one of claims 1 to 9, wherein the second flow path alternates between a first portion having a predetermined cross-sectional area and a second portion having a cross-sectional area larger than that of the first portion.

15. A sample holder as described in any one of claims 1 to 9, wherein the second flow path alternates between a third portion having a predetermined cross-sectional shape and a fourth portion having a cross-sectional shape different from that of the third portion.

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