Semiconductor circuit breaker having water-cooled heat dissipation system

Abstract

The present invention relates to a semiconductor circuit breaker and, more specifically, to a semiconductor circuit breaker having a water-cooled heat dissipation system. According to an embodiment of the present invention, the semiconductor circuit breaker includes a water-cooled heat dissipation system in which cooling water flows in a lower portion of a switching unit and an air gap switch, thereby effectively performing cooling.

Description

Semiconductor circuit breaker with water-cooled heat dissipation system

[0001] The present invention relates to a semiconductor circuit breaker, and more particularly, to a semiconductor circuit breaker having a water-cooled heat dissipation system.

[0002] In general, a semiconductor circuit breaker is a power device designed to interrupt a circuit using a semiconductor switch such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor).

[0003] Semiconductor circuit breakers utilize semiconductor switching elements in circuit breakers used in power equipment, offering a dramatic improvement in tripping time and a simplified structure. Furthermore, semiconductor circuit breakers utilize the current-blocking characteristics of semiconductor switches to interrupt circuits. Therefore, arcs are not generated during circuit breakers, eliminating the need for arc suppression. Consequently, arc extinguishing elements can be eliminated, reducing overall size.

[0004] On the other hand, the use of semiconductor switches has the disadvantage of increasing the manufacturing cost for low-capacity circuit breakers.

[0005] Semiconductor circuit breakers are widely used in systems requiring rapid interruption. While conventional mechanical circuit breakers have interruption speeds of several to several hundred milliseconds, semiconductor circuit breakers can interrupt current in a much shorter time, reaching speeds of tens of microseconds.

[0006] Accordingly, semiconductor circuit breakers are increasingly being utilized in systems such as distribution panels with high current capacity, DC systems with rapid increases in fault current, and Energy Storage Systems (ESS) that require stable current supply and interruption. Recently, Battery Energy Storage Systems (BESS), which utilize batteries as energy sources, have been widely used in electric vehicles and other applications. However, considering recent incidents of fires in ESS systems, the importance of circuit breakers for stable current supply while considering heat generation is becoming increasingly crucial.

[0007] Meanwhile, semiconductor circuit breakers incorporate protection circuits (safety circuits) or safety elements to protect the semiconductors from damage caused by voltage generated during semiconductor switching. A snubber circuit is an example of such a protection circuit. Similarly, power semiconductor circuit breakers require protection circuits like snubber circuits to reduce the voltage generated during switching.

[0008] Additionally, depending on the system, an MOV (Metal Oxide Varistor) may be additionally configured as a protection element. MOV is a component used for surge protection, and is applied to some parts of the circuit to prevent damage to electrical and electronic devices from surges. MOV is a varistor composed of zinc oxide. It is a transient voltage blocking element that allows current to flow when the potential exceeds a certain level. The application of this element eliminates the need for an external internal fuse.

[0009] These semiconductor circuit breakers are typically constructed as a composite of a mechanical circuit breaker and an electronic circuit breaker. That is, the semiconductor circuit breaker is not comprised solely of a semiconductor switch, but also includes a mechanical switch (air gap switch) to mechanically (physically) disconnect the circuit.

[0010] Meanwhile, semiconductor circuit breakers are primarily used in DC power circuits. DC circuit breakers offer the advantage of allowing easy configuration of power and load locations.

[0011] As shown in Figure 1, when DC circuit breakers are arranged in the order of 'power source (3) -> DC circuit breaker (2) -> load (1)' on a system or circuit (case a), current flows from left to right on the drawing.

[0012] And, when the DC circuit breakers are arranged in the order of 'load (1) -> DC circuit breaker (2) -> power source (3)' on the system or circuit (case b), the current flows from right to left on the drawing.

[0013] Additionally, it is also possible to install a DC circuit breaker on a circuit in which current flows in both directions (case c). A first power source (14) and a second power source (5) are configured before and after the DC circuit breaker (2). Here, the first power source (14) or the second power source (5) may be configured as a battery.

[0014] Fig. 2 illustrates a perspective view of a semiconductor circuit breaker. The semiconductor circuit breaker includes a switching unit (6) and an air gap switch (7). Here, the switching unit (6) includes a power semiconductor switch, and the air gap switch (7) refers to a mechanical switch. A heat sink (8) and a heat dissipation fan (9) are provided below the switching unit (6) and the air gap switch (7) for cooling.

[0015] However, switching units generate high temperatures, requiring heat dissipation. Furthermore, mechanical switches (air-gap switches) generate high temperatures at the contact points when shutting off. Consequently, the heat dissipates to the surrounding area, necessitating cooling and a configuration designed for efficient cooling.

[0016] Meanwhile, this heat dissipation performance must be achieved efficiently within the limited space of a semiconductor circuit breaker. It is desirable to make the size of the semiconductor circuit breaker as small as possible, thus ensuring efficient heat dissipation while occupying a small space.

[0017] Additionally, ease of maintenance must be considered. Semiconductor circuit breakers should be designed with maintenance requirements in mind for components such as switching units, air gap switches, and heat sinks.

[0018] The present invention has been devised to solve the above-mentioned problems, and its purpose is to provide a semiconductor circuit breaker having effective cooling performance by a water-cooling cooling system.

[0019] Additionally, the water-cooling cooling system is improved to reduce the space it occupies within the semiconductor circuit breaker.

[0020] In addition, it provides a heat dissipation system that can facilitate maintenance in semiconductor circuit breakers.

[0021] A semiconductor circuit breaker according to one embodiment of the present invention comprises: a switching unit provided inside an outer case and including a power semiconductor element; and a cooling water housing coupled to a lower portion of the switching unit and having an open upper surface, wherein the cooling water housing is provided with a cooling water receiving portion for receiving cooling water, and the cooling water receiving portion is provided with a plurality of partitions to define a plurality of channels through which cooling water (w) flows.

[0022] Here, the cooling water housing is characterized by having an inlet and an outlet formed on opposite sides, respectively.

[0023] In addition, the lower part of the outer case is open, and the coolant housing is exposed to the outside air.

[0024] In addition, the bulkhead is characterized in that it is provided as a plate extending along the length direction of the coolant housing.

[0025] In addition, the bulkhead is characterized in that it has a predetermined distance from the front and rear parts of the coolant housing.

[0026] In addition, the height of the bulkhead is characterized by being the same height as the height of the coolant housing.

[0027] In addition, the front part of the cooling water receiving unit is characterized in that a distribution plate having a plurality of through holes is arranged.

[0028] In addition, the channel is characterized in that guide parts are provided on the left and right walls.

[0029] In addition, the channel has a plurality of divided zones, and the zones are characterized by being divided by horizontal walls, vertical walls, and wall connectors through which the horizontal walls and vertical walls are connected or separated.

[0030] In addition, the wall connector is characterized in that a fitting groove is formed on the side portion into which the horizontal wall and the vertical wall are fitted.

[0031] In addition, the channel is characterized in that it has a plurality of divided zones, and the zone walls forming the zone walls are composed of I-shaped plates, and bending portions that bend in opposite directions are formed at both ends of the zone walls.

[0032] And, it is characterized in that a 'ㄱ' shaped connecting part is provided to which the above-mentioned bending part is joined.

[0033] According to a semiconductor circuit breaker according to one embodiment of the present invention, a water-cooling heat dissipation system in which cooling water flows under a switching unit and an air gap switch is provided, thereby effectively cooling the unit.

[0034] In addition, the water-cooled heat dissipation system maximizes the cooling effect because the cooling water flowing in the open-top cooling water housing directly contacts the switching unit, thereby causing heat transfer.

[0035] In addition, the coolant housing can be divided into a number of sections (cells) that are divided horizontally and vertically to form a specific coolant flow path, thereby allowing coolant to flow intensively in a specific area.

[0036] Additionally, water-cooled heat dissipation systems take up significantly less space than air-cooled systems, which require cooling fans and other equipment.

[0037] Additionally, the water-cooled heat dissipation system is exposed to the outside of the enclosure, making maintenance easy.

[0038] Figure 1 is a schematic diagram of a DC circuit breaker according to the prior art.

[0039] Fig. 2 is a perspective view of a semiconductor circuit breaker according to the prior art.

[0040] FIGS. 3 and 4 are perspective and side views of a semiconductor circuit breaker according to one embodiment of the present invention.

[0041] Fig. 5 is a circuit diagram of a semiconductor circuit breaker according to one embodiment of the present invention.

[0042] FIGS. 6 and 7 are perspective views and plan views of a cooling water housing in a semiconductor circuit breaker according to one embodiment of the present invention.

[0043] FIG. 8 is a perspective view of a packing member applied to a coolant housing according to the embodiment of FIG. 6.

[0044] Fig. 9 is a perspective view of a distribution plate applied to a semiconductor circuit breaker according to one embodiment of the present invention.

[0045] FIG. 10 is a plan view of a coolant housing according to another embodiment of the present invention.

[0046] FIG. 11 is a plan view of a coolant housing according to another embodiment of the present invention.

[0047] Figures 12 and 13 are plan and perspective views of the section wall and wall connector in Figure 11.

[0048] FIG. 14 is a perspective view of a packing member applied to a coolant housing according to the embodiment of FIG. 11.

[0049] FIG. 15 is a plan view of a coolant housing according to another embodiment of the present invention.

[0050] Figure 16 is a plan view of the section wall and wall connector in Figure 15.

[0051] Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings. However, this is intended to be a detailed description to an extent that a person having ordinary skill in the technical field to which the present invention pertains can easily carry out the invention, and it does not mean that the technical idea and scope of the present invention are limited thereby.

[0052] A semiconductor circuit breaker according to each embodiment of the present invention will be described in detail with reference to the drawings.

[0053] <Example 1>

[0054] Figures 3 and 4 illustrate perspective and side views of a semiconductor circuit breaker according to one embodiment of the present invention. Figure 5 illustrates a circuit diagram of a semiconductor circuit breaker according to one embodiment of the present invention.

[0055] A semiconductor circuit breaker (100) according to one embodiment of the present invention is characterized in that it includes a switching unit (120) provided inside an outer case (101) and including a power semiconductor element; and a cooling water housing (200) coupled to a lower portion of the switching unit (120) and having an open upper surface, wherein a plurality of channels (CH.1 to CH.n) through which cooling water (w) flows are defined in the cooling water housing (200).

[0056] The outer case (101) can be formed in a roughly rectangular box shape. The outer case (101) can be manufactured from an insulating material such as a synthetic resin material to insulate it from the outside. The outer case (101) supports internal components such as a switching unit (120) or an electric circuit unit (130) and protects them from the outside.

[0057] The lower surface of the outer case (101) is open. That is, the outer case may have a form in which the upper surface and the front, rear, left, and right sides are closed and the lower surface is open. Accordingly, the lower surface of the switching unit (120) may be exposed to the outside.

[0058] The outer case (101) is provided with ventilation holes on the front or rear. Fig. 3 shows that a first ventilation hole (103) is formed on the rear of the outer case. However, these ventilation holes may be provided on each side of the outer case (101) as needed.

[0059] Let us examine the components placed inside the outer case (101).

[0060] A switching unit (120) is placed within the housing (101). The switching unit (120) includes a power semiconductor switch. The power semiconductor switch may be a MOSFET (Metal Oxide Semiconductor Field Effect transistor) or an IGBT (Insulated Gate Bipolar Transistor).

[0061] Power semiconductor switches are widely used in systems requiring rapid interruption. While conventional mechanical circuit breakers have a tripping speed of several to several hundred milliseconds, semiconductor circuit breakers can interrupt current in a much shorter time, reaching only tens of μs.

[0062] Therefore, it can be applied to distribution panels with large current capacity, DC systems with fast increase rates of fault current, or ESS (Energy Storage System) systems that require stable current supply and interruption.

[0063] A first base plate (110) is provided at the bottom of the switching unit (120).

[0064] An electric circuit section (130) is provided on the upper part of the switching unit (120). Alternatively, the switching unit (120) may be installed on a part of the electric circuit section (130).

[0065] The electric circuit (130) is composed of a gate driver (not shown), a controller (133), a snubber (135), a metal oxide varistor (MOV) (137), a transient voltage suppressor (TVS), etc.

[0066] The gate driver provides the voltage required by the switching unit (120). For this purpose, a separate power circuit and current buffer may be provided. The gate driver is also called a driving driver.

[0067] Additionally, gate drivers electrically isolate and transmit signals between high-voltage power circuits and low-voltage control circuits. Therefore, gate drivers provide greater safety and reliability for driving semiconductor switches.

[0068] The controller (133) connects and controls each part within the circuit. The controller (133) determines overcurrent or fault current based on the current size received from the current sensor (132), and can operate the switching unit (120) and the air gap switch (140) accordingly. The controller (133) can operate the air gap switch (140) through the first driver (134a) and operate the switching unit (120) through the second driver (134b). (See Fig. 5)

[0069] Here, the current sensor (132) is installed in a part of the main circuit. In Fig. 5, the current sensor (132) can be placed at any of the positions ①, ②, and ③. That is, the current sensor (132) can be installed at the front or rear end of the air gap switch (140), or at the front or rear end of the switching unit (120).

[0070] In semiconductor circuit breakers, a protection circuit (safety circuit) or safety element is applied to protect the semiconductor switch from damage caused by high voltages generated during semiconductor switching. A snubber circuit is an example of such a protection circuit. Typically, a protection circuit protects the semiconductor switch by reducing the voltage generated during switching in a semiconductor circuit breaker.

[0071] Examples of snubber circuits include capacitor (C) snubbers, resistor-capacitor (RC) snubbers, charge-discharge type resistor-capacitor-diode (RCD) snubbers, and discharge-suppressing type snubber circuits.

[0072] Additionally, depending on the system, an MOV (Metal Oxide Varistor) (137) may be additionally configured as a protection element. The MOV is a component used for surge protection, and is applied to a part of the circuit to prevent damage to semiconductor switches caused by surge voltage. The MOV is a varistor composed of zinc oxide, and is a transient voltage blocking element that allows current to flow when a potential exceeding a set value occurs. When an MOV element is applied, there is no need to install a separate fuse inside the circuit.

[0073] The above-described protection circuits or protection elements can be provided as protection modules that can be detached from the electrical circuit unit (130). If the protection elements are independently configured as protection modules, maintenance becomes easier. That is, in the event of a failure of the protection module, only the protection module needs to be replaced.

[0074] An air gap switch (140) is arranged. The air gap switch (140) is a mechanical switch. The air gap switch (140) may be configured as a traditional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch (140), when current is supplied, the movable contact is connected to the fixed contact, and when current is cut off, the movable contact is separated from the fixed contact, thereby mechanically cutting off the circuit. Since direct current does not have a current zero point, when a small current flows in the circuit, it may be difficult to cut off the current in some cases. In such cases, in order to completely cut off the current, it is necessary to mechanically cut off the circuit.

[0075] The air gap switch (140) is placed at the front or rear of the switching unit (120). Here, it is preferable that the air gap switch (140) be placed on the power source (80) side. This is because, when the power source is cut off, the circuit can be isolated from the vicinity of the power source, thereby protecting the cutoff unit, other components, and the load (90).

[0076] However, a lot of heat is generated at the contact point of the air gap switch (140). Therefore, a device for cooling the heat of the air gap switch (140) and the switching unit (120) is required.

[0077] A second base plate (145) may be provided at the bottom of the air gap switch (140).

[0078] A cooling water housing (200) is provided at the bottom of the switching unit (120) and the air gap switch (140). The cooling water housing (200) may be formed in the shape of a rectangular parallelepiped with an open upper surface.

[0079] Figures 6 and 7 show a perspective view and a plan view of the coolant housing (200).

[0080] The coolant housing (200) may be formed of a synthetic resin or a metal material. If the coolant housing (200) is formed of a metal material, it is preferably manufactured from a material with excellent thermal conductivity, such as aluminum (Al) or copper (Cu). Accordingly, the heat of the coolant (w) can be quickly released to the outside.

[0081] The coolant housing (200) is coupled to the first base plate (110) forming the lower portion of the switching unit (120). In addition, the coolant housing (200) can be extended and coupled to the second base plate (145) forming the lower portion of the air gap switch (140).

[0082] The coolant housing (200) can be joined to the base plate (110, 145) by adhesive or mechanical joining. Examples of mechanical joining methods include fitting or screw joining.

[0083] The surfaces where the coolant housing (200) and the base plate (110, 145) come into contact with each other have corresponding shapes and sizes. That is, the upper surface of the coolant housing (200) and the lower surface of the base plate (110, 145) have corresponding shapes.

[0084] For example, the upper surface of the coolant housing (200) and the lower surface of the base plate (110, 145) are formed as flat surfaces. The base plates (110, 145) are each formed as flat surfaces. The upper surface of the coolant housing (200) is open, and each side portion (215) is exposed. The upper portion of each side portion (215) and the upper portions of the front portion (203) and the rear portion (204) are formed at the same height.

[0085] A fastening hole (208) is formed at each corner of the coolant housing (200) so that it can be fastened to the base plate (110, 145) by a fastening member.

[0086] A coolant receiving portion (205) is provided in the coolant housing (200). The coolant receiving portion (205) occupies most of the volume of the coolant housing (200). Coolant (w) is received and flows in the coolant receiving portion (205).

[0087] The coolant housing (200) is made of a material with high thermal conductivity and releases heat from the switching unit (120) transmitted through the base plate (110).

[0088] The coolant housing (200) is positioned at the bottom of the outer case (101). The coolant housing (200) is not positioned inside the outer case (101), but is positioned at the bottom of the outer case (101) and exposed to the outside air. Accordingly, the heat dissipation reduction factor is reduced. This effect is further enhanced when the bottom of the outer case (101) is opened.

[0089] Since the lower surface of the outer case (101) is open, the coolant housing (200) is directly coupled to the switching unit (120) or the air gap switch (140). Of course, if there is a base plate (110, 145), it is coupled to the base plate (110, 145) of the coolant housing (200).

[0090] The coolant housing (200) has a sufficient size to quickly absorb the heat of the base plate (110, 145). For example, the coolant housing (200) may be formed to a size corresponding to the area of ​​the base plate (110, 145) or a size greater than the area of ​​the base plate (110, 145).

[0091] A coolant receiving portion (205) is formed in the coolant housing (200). Coolant (w) flows into and out of the coolant receiving portion (205). The coolant housing (200) has an open upper surface. That is, the coolant receiving portion (205) has an open upper surface. Therefore, the coolant (w) rises to the upper surface of the coolant housing (200). Therefore, the coolant (w) directly contacts the lower surface of the base plate (110, 145) and absorbs heat from the switching unit (120) or the air gap switch (140). Since the coolant (w) directly contacts the switching unit (120) or the air gap switch (140), heat transfer is maximized.

[0092] Coolant (w) is stored and flows inside the coolant housing (200). The coolant housing (200) has an inlet (201) and an outlet (202). The inlet (201) and the outlet (202) are arranged on one surface of the coolant housing (200). Alternatively, the inlet (201) and the outlet (202) are arranged on different surfaces of the coolant housing (200), respectively. Preferably, the inlet (201) and the outlet (202) are formed on opposite surfaces of the coolant housing (200), so as to form a flow path through which the coolant (w) flows in a straight line.

[0093] According to a semiconductor circuit breaker according to one embodiment of the present invention, a cooling water housing (200) is provided at the bottom of the switching unit and the air gap switch in which cooling water is received and flows, so that cooling occurs effectively.

[0094] The cooling water housing (200) has an open top surface so that the cooling water comes into direct contact with the switching unit, thereby maximizing the cooling effect.

[0095] This type of water-cooled heat dissipation system takes up significantly less space than air-cooled systems, such as cooling fans.

[0096] Additionally, since the coolant housing (200) is exposed to the outside of the outer case (101), maintenance is easy.

[0097] The coolant receiving portion (205) of the coolant housing (200) is divided into a number of regions. These regions of the coolant receiving portion (205) are referred to as channels. For example, FIGS. 6 and 7 illustrate that the coolant receiving portion (205) is divided into four channels.

[0098] A partition wall (209) forming each channel is provided. Here, the partition wall (209) may be formed of a plate extending along the length of the cooling water housing (200). Accordingly, when viewed in plan view, the cooling water receiving portion (205) and each channel have a shape similar to a lane of a swimming pool.

[0099] It is preferable that the height of the bulkhead (209) be formed to be the same as the height of the coolant receiving portion (205). That is, the upper portion of the bulkhead (209) has the same height as the upper portions of the front portion (203), the rear portion (204), and the side portion (215).

[0100] The bulkhead (209) has a predetermined distance from the front (203) and the rear (204) of the coolant housing (200). That is, the bulkhead (209) is not arranged in the front (206) and the rear (207) of the coolant receiving portion (205). Coolant (w) flowing in from the inlet (201) is distributed to each channel through a shared space formed in the front (206) of the coolant receiving portion (205), and joins through a shared space formed in the rear (207) of the coolant receiving portion (205) and exits through the outlet (202).

[0101] Each channel is distinguished using a subscript. For example, in the present embodiment consisting of four channels, the symbols can be assigned as CH.1, CH.2, CH.3, and CH.4. For the sake of simplicity in the drawing representation and channel distinction, the example of four channels was used, but it is of course possible to form multiple channels.

[0102] Figure 9 illustrates a distribution board (210).

[0103] A distribution plate (210) is provided to evenly distribute the coolant (w) entering the inlet (201) of the coolant housing (200) to each channel.

[0104] The distribution plate (210) is made of a thin plate, and a number of through holes (211) are formed in the distribution plate (210) to allow the cooling water (w) to spread evenly along the width direction.

[0105] The distribution plate (210) is arranged horizontally in the shared space at the front of the cooling water receiving unit (205). That is, the distribution plate (210) is arranged in a direction perpendicular to the bulkhead (209).

[0106] Figure 8 shows a perspective view of a packing member (220).

[0107] A packing member (220) is provided between the coolant housing (200) and the base plate (110, 145) to ensure sealing from the outside. The packing member (220) is also called a gasket.

[0108] The packing member (220) can be formed of a soft material such as rubber.

[0109] The packing member (220) can be formed in a shape similar to that of the upper surface of the coolant housing (200). The packing member (220) is formed of a thin plate. An open hole (221) is formed in the packing member (220). The open hole (221) occupies most of the area of ​​the packing member (220).

[0110] The width of the panel surface (222) of the packing member (220) can be formed to be larger than the thickness of the side surface (215) of the coolant housing (200). Accordingly, the pressing surface for the base plate (110, 145) increases, so that pressing occurs well and assembly is easy.

[0111] A fastening hole (223) corresponding to the fastening hole (208) of the coolant housing (200) is formed at each corner of the packing member (220).

[0112] A bulkhead contact portion (224) corresponding to the position of the bulkhead (209) of the coolant housing (200) may be formed in the packing member (220). The bulkhead contact portion (224) is formed along the longitudinal direction of the packing member (220). The width of the bulkhead contact portion (224) may be formed to be larger than the thickness of the bulkhead (209) of the coolant housing (200).

[0113] <Example 2>

[0114] Fig. 10 illustrates a coolant housing (200A) according to another embodiment of the present invention. It is illustrated in plan view.

[0115] In the cooling water housing (200) of this embodiment, the same parts as in the previous embodiment will be omitted for detailed description.

[0116] In this embodiment, guide parts (231, 232) are provided so that the coolant (w) does not flow in a straight line but flows in a meandering manner within each channel (CH.1, CH.2, ..., CH.n).

[0117] Based on a single channel, the guide portions (231, 232) may be alternately formed on the left and right walls (side walls or bulkheads). In this case, the coolant (w) flows in a meandering S-shape.

[0118] Each guide section (231, 232) can be in contact with the left and right walls of each channel. In addition, the guide sections are alternately arranged to protrude from the walls on both sides. That is, the first guide section (231) is in contact with the left wall (bulkhead or side wall), and the second guide section (232) is in contact with the right wall (bulkhead or side wall).

[0119] Each guide section (231, 232) is formed smaller than the width of each channel.

[0120] It is preferable that the height of each guide section (231, 232) be formed to correspond to the height of the cooling water receiving section (205).

[0121] <Example 3>

[0122] FIG. 11 shows a plan view of a coolant housing (200B) according to another embodiment.

[0123] In this embodiment, description of the same parts as in the previous embodiments will be omitted.

[0124] In this embodiment, each channel is divided into sections along its length. For example, an example is shown where one channel is divided into five sections. For convenience, the example is shown as being divided into five sections, but any number of sections can be divided.

[0125] To distinguish each zone, we will use the symbols d1, d2, d3, ..., dn.

[0126] Meanwhile, to distinguish the zones belonging to each channel, we will use symbols such as CH.n(dn). For example, channel 1 zone 3 will be denoted as CH.1(d3).

[0127] Each zone can be viewed as a single cell. That is, in this embodiment, the cooling water receiving unit (205) is divided into a plurality of zones (cells) aligned in the horizontal and vertical directions.

[0128] As in the previous embodiment, each zone can be equipped with a guide section (231, 232).

[0129] Meanwhile, the parts where each area (cell) touches can be separated.

[0130] These cell connection parts are shown in FIGS. 12 and 13.

[0131] The wall portion forming each section (cell) is composed of a horizontal wall (238), a vertical wall (239), and a wall connector (235). (Here, the horizontal and vertical names are named based on the length direction of the channel.)

[0132] A fitting groove (236) is formed on the side of the wall connector (235). The fitting groove (236) is formed in four directions on both horizontal and vertical sides of the side of the wall connector (235). Accordingly, the horizontal wall (238) and the vertical wall (239) are each fitted in a direction perpendicular to the wall connector (235).

[0133] The heights of the horizontal wall (238), vertical wall (239) and wall connector (235) are formed to correspond to the heights of the front, rear and side parts.

[0134] The wall portions forming each section (cell) can be easily inserted or removed from the wall connector (235) such as the horizontal wall (238) and the vertical wall (239). Therefore, the walls forming each section (cell) can be easily opened or closed. When the horizontal wall (238) or the vertical wall (239) is separated, the two adjacent sections (cells) are opened to each other, and when the horizontal wall (238) or the vertical wall (239) is joined, the two adjacent sections (cells) are closed to each other.

[0135] By separating or combining the horizontal wall (238) and the vertical wall (239), a specific area can be created to form a coolant flow path by opening or closing a channel or area. In Fig. 11, the part indicated by the solid line indicates the place where the horizontal wall (238) and the vertical wall (239) are combined, and the part indicated by the dotted line indicates the place where the horizontal wall (238) and the vertical wall (239) are separated (reconstructed).

[0136] In Figure 11, Channel 1 is shown to be fully open, while Channel 2 is shown to have some sections open. Accordingly, the introduced coolant flows through Channel 1, expands through Channels 1 and 2, and then exits through the outlet.

[0137] In this embodiment, it is possible to arbitrarily control the flow of coolant through a specific area of ​​the coolant housing (200B).

[0138] A packing member (240) applied to this embodiment is illustrated in Fig. 14.

[0139] The packing member (240) can be formed in a shape similar to that of the upper surface of the coolant housing (200B). The packing member (240) is formed of a thin plate. An open hole (241) is formed in the packing member (240). The open hole (241) occupies most of the area of ​​the packing member (240).

[0140] The width of the panel surface (242) of the packing member (240) can be formed to be larger than the thickness of the side surface (215) of the coolant housing (200B). Accordingly, the pressing surface for the base plate (110, 145) increases, so that pressing occurs well and assembly is easy.

[0141] A fastening hole (243) corresponding to the fastening hole (208) of the coolant housing (200B) is formed at each corner of the packing member (240).

[0142] A bulkhead contact portion (244, 245) corresponding to the positions of the horizontal wall (238) and the vertical wall (239) of the coolant housing (200B) may be formed in the packing member (240). The width of the bulkhead contact portion (244, 245) may be formed to be greater than the thickness of the horizontal wall (238) or the vertical wall (239) of the coolant housing (200).

[0143] <Example 4>

[0144] A coolant housing (200C) according to the fourth embodiment is illustrated in Fig. 15.

[0145] In this embodiment, description of the same parts as in the previous embodiments will be omitted.

[0146] In this embodiment, as in the third embodiment, the cooling water receiving unit (205) is divided into a plurality of channels and a plurality of zones (cells).

[0147] Each zone (cell) is divided by a zone wall (250) and a connecting portion (255). A detailed drawing of the zone wall (250) and the connecting portion (255) is shown in Fig. 16.

[0148] The zone wall (250) is composed of a straight plate, and bending portions that bend in opposite directions are formed at both ends of the zone wall (250).

[0149] At one end of the section wall (250), a first bend (251) extending in one direction perpendicular to the longitudinal direction of the section wall (250) is provided, and at the other end of the section wall (250), a second bend (252) extending in the other direction perpendicular to the longitudinal direction of the section wall (250) is provided.

[0150] The connecting portion (255) is composed of an 'ㄱ' shaped member or an 'ㄴ' shaped member. Four connecting portions (255) form one combination. Each connecting portion (255) is arranged to have a predetermined interval from each other, so that the four are arranged to form a 'ㅁ' shape. Here, the predetermined interval is formed to be equal to or slightly larger than the thickness (width) of the section wall (250).

[0151] The height of the section wall (250) and the connecting portion (255) is formed to a height corresponding to the height of the front, rear, and side portions.

[0152] The zone wall (250) can be easily fitted or detached from the connecting portion (255). When the zone wall (250) is detached from the connecting portion (255), adjacent zones (cells) are opened and connected to each other. When the zone wall (250) is attached to the connecting portion (255), adjacent zones (cells) are closed and blocked from each other.

[0153] In Fig. 15, it is shown that some of the zone walls (250) are opened to form a specific cooling water path.

[0154] According to the semiconductor circuit breaker according to each embodiment of the present invention, a water-cooling heat dissipation system in which cooling water flows under the switching unit and the air gap switch is provided, so that cooling occurs effectively.

[0155] In addition, the water-cooled heat dissipation system maximizes the cooling effect because the cooling water flowing in the open-top cooling water housing directly contacts the switching unit, thereby causing heat transfer.

[0156] In addition, the coolant housing can be divided into a number of sections (cells) that are divided horizontally and vertically to form a specific coolant flow path, thereby allowing coolant to flow intensively in a specific area.

[0157] Additionally, water-cooled heat dissipation systems take up significantly less space than air-cooled systems, which require cooling fans and other equipment.

[0158] Additionally, the water-cooled heat dissipation system is exposed to the outside of the enclosure, making maintenance easy.

[0159] The embodiments described above are embodiments that implement the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. In other words, the protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included within the scope of the rights of the present invention.

[0160] [Explanation of symbols]

[0161] 100 semiconductor circuit breakers

[0162] 101 Outer Case

[0163] 103 First ventilation hole

[0164] 110 base plate

[0165] 120 switching units

[0166] 130 Electrical Circuit Section

[0167] 140 air gap switch

[0168] 200 Coolant Housing

[0169] 205 Coolant Receptacle

[0170] 209 bulkhead

[0171] 210 distribution board

[0172] 220 Packing Absence

[0173] 231,232 Guide Department

[0174] 235 wall connector

[0175] 238 Crosswall

[0176] 239 vertical wall

[0177] 250 zone wall

[0178] 255 connector

Claims

1. A switching unit provided inside the outer case and including a power semiconductor element; and It includes a cooling water housing coupled to the lower part of the switching unit and having an open upper surface, The above coolant housing is provided with a coolant receiving portion for receiving coolant, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that a plurality of baffles are provided in the above-mentioned cooling water receiving section to define a plurality of channels through which cooling water flows.

2. In paragraph 1, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that the cooling water housing has an inlet and an outlet formed on opposite sides, respectively.

3. In paragraph 1, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that the lower part of the outer case is open, and the cooling water housing is exposed to the outside air.

4. In paragraph 1, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that the above bulkhead is provided as a plate extending along the length direction of the above cooling water housing.

5. In paragraph 4, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that the above bulkhead has a predetermined distance from the front and rear parts of the above cooling water housing.

6. In paragraph 4, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that the height of the above bulkhead is the same height as the height of the above coolant housing.

7. In paragraph 1, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that a distribution plate having a plurality of through holes is arranged at the front of the cooling water receiving portion.

8. In paragraph 1, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that guide parts are provided on the left and right walls of the above channel.

9. In paragraph 1, The above channel has multiple segmented areas, The above area is, A semiconductor circuit breaker having a water-cooled heat dissipation system characterized by being partitioned by a horizontal wall, a vertical wall, and a wall connection port through which the horizontal wall and the vertical wall are connected or separated.

10. In paragraph 9, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that the wall connection port has a fitting groove formed on the side portion into which the horizontal wall and the vertical wall are fitted.

11. In paragraph 1, The above channel has multiple segmented areas, The zone wall forming the wall of the above zone is composed of a straight plate, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that bending portions that bend in opposite directions are formed at both ends of the above-mentioned section wall.

12. In paragraph 11, A semiconductor circuit breaker having a water-cooled heat dissipation system, characterized in that an 'ㄱ'-shaped connecting portion is provided to which the above-mentioned bending portion is joined.

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