Flexible connection member and electronic device comprising same

Abstract

This electronic device comprises a flexible connection member electrically connected to a circuit board and an electric component. The flexible connection member includes: an insulating layer; a signal line disposed on the insulating layer; a first ground line; a second ground line spaced apart from the first ground line; a ground sheet; a first connection line electrically connected to the first ground line and the ground sheet and at least partially connected in a first direction; and a second connection line electrically connected to the second ground line and the ground sheet, at least partially extending in a second direction different from the first direction, and intersecting the first connection line, wherein at least a portion of the second connection line is in contact with at least a portion of the first connection line.

Description

Flexible connecting member and electronic device including the same

[0001] The present disclosure relates to electronic devices, for example, to flexible connecting members and electronic devices including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet personal computers (PCs), audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] The above information is provided solely as background information to aid in understanding the disclosure. No determination has been made, nor is any assertion made, regarding whether any of the above information constitutes prior art related to the disclosure.

[0005] An aspect of the present disclosure is to address at least the problems and / or disadvantages mentioned above and to provide at least the advantages described below. Accordingly, an aspect of the present disclosure is to provide an electronic device, such as a flexible connecting member and an electronic device including the same.

[0006] Additional aspects will be presented in part in the description that follows, and in part will become apparent from the description or can be learned by practicing the examples presented.

[0007] According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes a housing, a circuit board, at least one electrical component disposed within the housing, and a flexible connecting member electrically connected to the circuit board and the at least one electrical component, wherein the flexible connecting member includes an insulating layer, a signal line disposed in the insulating layer, a first ground line disposed in the insulating layer, a second ground line disposed in the insulating layer and spaced apart from the first ground line, a ground sheet disposed in the insulating layer, a first connecting line electrically connected to the first ground line and the ground sheet and extending at least partially along a first direction, and a second connecting line electrically connected to the second ground line and the ground sheet and extending at least partially in a second direction different from the first direction and intersecting the first connecting line, wherein at least a portion of the second connecting line contacts at least a portion of the first connecting line.

[0008] According to another aspect of the present disclosure, a flexible connecting member is provided. The flexible connecting member includes an insulating layer, a signal line disposed in the insulating layer, a first ground line disposed in the insulating layer, a second ground line disposed in the insulating layer and spaced apart from the first ground line, a ground sheet disposed in the insulating layer, a first connecting line electrically connected to the first ground line and the ground sheet and extending at least partially along a first direction, and a second connecting line electrically connected to the second ground line and the ground sheet and extending at least partially in a second direction different from the first direction and intersecting the first connecting line, wherein at least a portion of the second connecting line contacts at least a portion of the first connecting line.

[0009] Other aspects, advantages and important features of the present disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the disclosure taken in conjunction with the accompanying drawings.

[0010] The above and other aspects, features and advantages of specific embodiments of the disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0012] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 6 is a plan view showing a flexible connecting member according to one embodiment of the present disclosure.

[0017] FIG. 7 is a partial perspective view showing a flexible connecting member according to one embodiment of the present disclosure.

[0018] FIG. 8 is a schematic diagram showing a state before connection of a first ground line, a first connection line, and a third connection line according to one embodiment of the present disclosure.

[0019] FIG. 9 is a schematic diagram showing a state after connection of a first ground line, a first connection line, and a third connection line according to one embodiment of the present disclosure.

[0020] FIG. 10 is a schematic diagram showing a state after connection of ground lines and connection lines according to one embodiment of the present disclosure.

[0021] FIG. 11A is a cross-sectional view of a flexible connecting member according to one embodiment of the present disclosure.

[0022] FIG. 11b is a cross-sectional view of a flexible connecting member according to one embodiment of the present disclosure.

[0023] FIG. 12 is a plan view showing a flexible connecting member according to one embodiment of the present disclosure.

[0024] It should be noted that the same reference numbers are used throughout the drawings to describe identical or similar elements, features and structures.

[0025] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While it includes numerous specific details to facilitate understanding, these should be considered illustrative only. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein can be made without departing from the scope and spirit of the present invention. Furthermore, for the sake of clarity and conciseness, descriptions of well-known functions and configurations may be omitted.

[0026] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are used solely to ensure a clear and consistent understanding of the disclosure by the inventors. Therefore, it should be clear to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes only and is not intended to limit the disclosure, as defined by the appended claims and their equivalents.

[0027] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of those surfaces.

[0028] It should be understood that each block in a flowchart and the combination of flowcharts can be executed by one or more computer programs containing computer-executable instructions. The entirety of one or more computer programs may be stored in a single memory device, or the one or more computer programs may be divided into different parts stored in different memory devices.

[0029] Any of the functions or operations described herein may be performed by a processor or a combination of processors. A processor or a combination of processors is a circuit that performs processing and includes an application processor (AP, e.g., a central processing unit (CPU)), a communications processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless fidelity (Wi-Fi) chip, a Bluetooth™ chip, a global positioning system (GPS) chip, a near-field communication (NFC) chip, a connection chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on a chip (SoC), an IC, or similar circuits.

[0030] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment of the present disclosure, the electronic device (101) may communicate with an external electronic device (104) via a server (108). According to one embodiment of the present disclosure, an electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment of the present disclosure, at least one of these components (e.g., the connection terminal (178)) may be omitted, or one or more other components may be added to the electronic device (101). In one embodiment of the present disclosure, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment of the present disclosure, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment of the present disclosure, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment of the present disclosure, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to one embodiment of the present disclosure, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment of the present disclosure, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment of the present disclosure, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment of the present disclosure, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment of the present disclosure, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the external electronic device (102)). According to one embodiment of the present disclosure, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)). According to one embodiment of the present disclosure, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment of the present disclosure, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and moving images. According to one embodiment of the present disclosure, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment of the present disclosure, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). According to one embodiment of the present disclosure, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment of the present disclosure, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

[0048] The wireless communication module (192) can support a 5G network and next-generation communication technologies following the 4th generation (4G) network, for example, new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., millimeter wave (mmWave) band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment of the present disclosure, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment of the present disclosure, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment of the present disclosure, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to one embodiment of the present disclosure, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to one embodiment of the present disclosure, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment of the present disclosure, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment of the present disclosure, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104) or the server (108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service on its own, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment of the present disclosure, an external electronic device (104) or server (108) may be included within a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0054] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together with the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0055] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0056] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0057] According to one embodiment of the present disclosure, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0058] According to various embodiments of the present disclosure, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separately arranged in other components. According to various embodiments of the present disclosure, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments of the present disclosure, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments of the present disclosure, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0059] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0060] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0061] Hereinafter, for convenience of explanation of FIGS. 2 to 10, 11a, 11b, and 12, an orthogonal coordinate system is illustrated in which FIGS. 2 to 10, 11a, 11b, and 12 are defined and interpreted as an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. Hereinafter, for convenience of explanation, the X-axis direction may be defined and interpreted as a width direction of an electronic device or components of an electronic device, the Y-axis direction may be defined and interpreted as a length direction of an electronic device or components of an electronic device, and the Z-axis direction may be defined and interpreted as a height direction (or thickness direction) of an electronic device or components of an electronic device.

[0062] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1, or the embodiments of FIGS. 4 to 10, FIGS. 11a, 11b, and 12.

[0063] Referring to FIGS. 2 and 3 , an electronic device (101) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In an embodiment of the present disclosure, the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B) of FIG. 3 , and the side surface (210C). In an embodiment of the present disclosure, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment of the present disclosure, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0064] Although not shown, the front plate (202) may include a seamlessly extending region(s) that is curved toward the rear plate (211) at least at a portion of an edge thereof. In one embodiment of the present disclosure, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). According to one embodiment of the present disclosure, the front plate (202) or the rear plate (211) may be substantially flat. For example, it may not include a curved extending region. If it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of the other portions.

[0065] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment of the present disclosure, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0066] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment of the present disclosure, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment of the present disclosure, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0067] In one embodiment of the present disclosure, a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment of the present disclosure, at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor, and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment of the present disclosure, the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0068] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sounds, and in one embodiment of the present disclosure, multiple microphones may be disposed so as to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment of the present disclosure, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0069] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (101), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment of the present disclosure, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). In one embodiment of the present disclosure, the flash (213) can emit infrared rays, and the infrared rays emitted by the flash (213) and reflected by the subject can be received through the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when the infrared rays are received by the third sensor module (219).

[0071] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment of the present disclosure, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment of the present disclosure, the key input device (217) may include a sensor module disposed on a second surface (210B) of the housing (210).

[0072] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment of the present disclosure, the light-emitting element (206) may provide, for example, a light source that is linked to the operation of the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0073] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0074] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0075] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0076] The embodiments of FIGS. 4 and 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 10, FIGS. 11a, 11b, and 12.

[0077] Referring to FIGS. 4 and 5 , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 , or the electronic device (101) of FIGS. 2 to 3 ) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1 ), a display (330) (e.g., the display (220) of FIG. 1 ), at least one printed circuit board (or board assembly) (341, 343), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2 ). When including a plurality of printed circuit boards (341, 343), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible connection member (345). For example, the printed circuit boards (341, 343) can include a first circuit board (341) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (343) positioned below (e.g., in the -Y-axis direction), and the flexible connection member (345) can electrically connect the first circuit board (341) and the second circuit board (343).

[0078] According to one embodiment of the present disclosure, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include another component. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and any redundant description will be omitted below.

[0079] According to one embodiment of the present disclosure, the first support member (311) may be provided in at least one portion in a flat shape. In one embodiment of the present disclosure, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (341, 343) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (341, 343). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0080] According to one embodiment of the present disclosure, the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301). According to one embodiment of the present disclosure, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (341, 343) or a battery (350). In one embodiment of the present disclosure, the housing (301) may be understood as including a structure that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). In one embodiment of the present disclosure, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3. In one embodiment of the present disclosure, the first support member (311) is disposed between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the rear plate (380) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (341, 343) or a camera assembly (307).

[0081] According to one embodiment of the present disclosure, the memory may include, for example, volatile memory or non-volatile memory.

[0082] According to one embodiment of the present disclosure, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0083] According to one embodiment of the present disclosure, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment of the present disclosure, the upper support member (360a) may be arranged to surround a printed circuit board (341, 343) (e.g., the first circuit board (341)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (341) interposed therebetween. In one embodiment of the present disclosure, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (343) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (341, 343). According to one embodiment, the printed circuit boards (341, 343) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment of the present disclosure, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment of the present disclosure, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be placed to surround the additional printed circuit board together with another part of the first support member (311). A speaker module or interface arranged on an additional printed circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 209) of FIG. 2.

[0084] According to one embodiment of the present disclosure, the battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (341, 343). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0085] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring method. In one embodiment of the present disclosure, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment of the present disclosure, another antenna structure may be formed by the side structure (310) and / or a portion or a combination of the first support member (311).

[0086] According to one embodiment of the present disclosure, the camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment of the present disclosure, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (341, 343). In one embodiment of the present disclosure, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0087] According to one embodiment of the present disclosure, the electronic device (101) may include a flexible connection member (345). The flexible connection member (345) may include a flexible flat cable (FFC), a flexible printed circuit board (FPCB), or a board to board connector (B2B connector).

[0088] According to one embodiment of the present disclosure, the flexible connecting member (345) is at least partially bendable. For example, the flexible connecting member (345) may be configured to be at least partially folded or unfolded.

[0089] According to one embodiment of the present disclosure, the flexible connecting member (345) can electrically connect a first circuit board (341) (e.g., a main circuit board) and at least one electrical component. For example, one end of the flexible connecting member (345) can be physically and / or electrically connected to at least a portion of the first circuit board (341). For example, the other end of the flexible connecting member (345) can be physically and / or electrically connected to at least a portion of the at least one electrical component. The at least one electrical component may include, for example, a second circuit board (343) (e.g., a sub circuit board). However, the at least one electrical component is not limited thereto and may include various electrical components (e.g., an antenna, a speaker, a battery, a display, or a sensor).

[0090] According to one embodiment of the present disclosure, the flexible connecting member (345) may be configured to transmit power or an electrical signal from the first circuit board (341) to at least one electrical component. The flexible connecting member (345) may be configured to transmit power or an electrical signal from the at least one electrical component to the first circuit board (341). The electrical signal may include a control signal, a power signal, or a communication signal.

[0091] FIG. 6 is a plan view showing a flexible connecting member according to one embodiment of the present disclosure.

[0092] FIG. 7 is a partial perspective view showing a flexible connecting member according to one embodiment of the present disclosure.

[0093] The embodiments of FIGS. 6 to 7 may be combined with the embodiments of FIGS. 1 to 5, or the embodiments of FIGS. 8 to 10, FIGS. 11a, 11b, and 12.

[0094] Referring to FIGS. 6 and 7, the flexible connecting member (400) (flexible flat cable) may include an insulation layer (410), at least one conductive line (420), at least one connection line (430), or a ground sheet (440).

[0095] The configuration of the flexible connecting member (400) of FIGS. 6 and 7 may be partially or entirely identical to the configuration of the flexible connecting member (345) of FIGS. 4 and 5.

[0096] According to one embodiment of the present disclosure, the flexible connecting member (400) can be placed within a housing (e.g., a housing (210) of FIGS. 2 and 3, or a housing (301) of FIGS. 4 to 5) of an electronic device (e.g., an electronic device (101) of FIG. 1, or an electronic device (101) of FIGS. 2 to 5).

[0097] According to one embodiment of the present disclosure, the flexible connecting member (400) may be configured to electrically connect a circuit board (e.g., a first circuit board (341) of FIGS. 4 to 5) disposed within the housing and at least one electrical component (e.g., a second circuit board (343) of FIGS. 4 to 5, or various electrical components).

[0098] According to one embodiment of the present disclosure, the lines (420, 430) of the flexible connecting member (400) may include conductor lines formed of a conductive material or a metallic material.

[0099] Referring to the illustrated embodiment of the present disclosure, at least a portion of a flexible connecting member (400) is illustrated. Hereinafter, for convenience of explanation, a case in which at least a portion of the flexible connecting member (400) illustrated in FIGS. 6 and 7 is connected to a first circuit board (e.g., the first circuit board (341) of FIGS. 4 and 5) will be described as an example, but the description thereof may be applied, applied, and / or interpreted in the same and / or similar manner even when another portion of the flexible connecting member (400) is connected to at least one electrical component.

[0100] According to one embodiment of the present disclosure, the flexible connecting member (400) may include an insulating layer (410), or at least one conductive line (420) disposed in the insulating layer (410). The at least one conductive line (420) may be configured to transmit power or an electrical signal between a first circuit board and at least one electrical component, or may be electrically connected to a ground of the first circuit board.

[0101] According to one embodiment of the present disclosure, the insulating layer (410) may include a film of an insulating material. The insulating layer (410) may be defined and / or referred to as a cover layer or a coating layer of the flexible connecting member (400).

[0102] According to one embodiment of the present disclosure, the insulating layer (410) may include a first insulating layer (411), or a second insulating layer (413) laminated on the first insulating layer (411).

[0103] According to one embodiment of the present disclosure, at least one conductive line (420) may be arranged in the first insulating layer (411). For example, the first insulating layer (411) may be configured to support at least one conductive line (420).

[0104] According to one embodiment of the present disclosure, the second insulating layer (413) may cover a portion of the first insulating layer (411). For example, the second insulating layer (413) may be arranged to cover a portion of the first insulating layer (411) and not cover the remainder of the first insulating layer (411).

[0105] According to one embodiment of the present disclosure, a portion of at least one conductive line (420) positioned on the first insulating layer (411) that is not covered by the second insulating layer (413) may be visually exposed. The portion of the at least one conductive line (420) that is visually exposed may be physically and / or electrically connected to the first circuit board.

[0106] According to one embodiment of the present disclosure, another portion of at least one conductive line (420) positioned on the first insulating layer (411) covered by the second insulating layer (413) may not be visually exposed. The other portion of at least one conductive line (420) that is not visually exposed may be limited or reduced from being broken or cut by being positioned and sealed between the first insulating layer (411) and the second insulating layer (413).

[0107] According to one embodiment of the present disclosure, at least one conductive line (420) may be physically and / or electrically connected to a connector of a first circuit board. The at least one conductive line (420) may include a signal line (421, 422) or at least one ground line (423). The signal line (421) may include a first signal line (421) or a second signal line (422) spaced apart from the first signal line (421).

[0108] According to one embodiment of the present disclosure, the first signal line (421) may include a plurality of first signal lines. The first signal line (421) may be electrically connected to the first circuit board and at least one electrical component. The first signal line (421) may provide a conductive path for transmitting and receiving power or an electrical signal.

[0109] According to one embodiment of the present disclosure, the second signal line (422) may be spaced apart from the first signal line (421). The second signal line (422) may be located between the first ground line (4231) and the second ground line (4232). The second signal line (422) may be electrically connected to the first circuit board and at least one electrical component. The second signal line (422) may provide a conductive path for transmitting and receiving power or an electrical signal. The second signal line (422) may be provided as a high-speed signal line. For example, the data transmission and reception speed of the second signal line (422) may be faster than the data transmission and reception speed of the first signal line (421). As an example, the second signal line (422) may be provided as a radio frequency (RF) signal line, but is not limited thereto.

[0110] According to one embodiment of the present disclosure, the ground line (423) may be positioned between the first signal line (421) and the second signal line (422). The ground line (423) may be electrically connected to the ground of the first circuit board (e.g., the first circuit board (341) of FIGS. 4 to 5). In addition, the ground line (423) may be electrically connected to the ground sheet (440) through at least one connection line (430).

[0111] According to one embodiment of the present disclosure, the ground line (423) may include a first ground line (4231) or a second ground line (4232) spaced apart from the first ground line (4231). A second signal line (422) may be arranged between the first ground line (4231) and the second ground line (4232).

[0112] According to one embodiment of the present disclosure, the first ground line (4231) may be electrically connected to the ground sheet (440) or the second connection part (432) via the first connection part (431). The second ground line (4232) may be electrically connected to the ground sheet (440) or the first connection part (431) via the second connection part (432).

[0113] According to one embodiment of the present disclosure, the ground sheet (440) may be disposed on the second insulating layer (413). For example, the ground sheet (440) may be laminated on at least a portion of the second insulating layer (413). The ground sheet (440) may include a conductive material. For example, the ground sheet (440) may include a tape of a metallic material (e.g., gold, silver, copper, or aluminum).

[0114] According to one embodiment of the present disclosure, the ground sheet (440) may provide a shielding structure for the first signal line (421) or the second signal line (422). For example, the ground sheet (440) may be configured to block electromagnetic waves generated from electrical / electronic components disposed inside an electronic device from being transmitted to the first signal line (421) or the second signal line (422). In addition, the ground sheet (440) may be configured to block electromagnetic waves generated from the first signal line (421) or the second signal line (422) from being transmitted to electrical / electronic components disposed inside an electronic device.

[0115] According to one embodiment of the present disclosure, the ground sheet (440) can be electrically connected to the first ground line (4231) or the second ground line (4232) via at least one connection line (430). As the first ground line (4231) and / or the second ground line (4232) are electrically connected to the ground of the first circuit board, the ground sheet (440) can be electrically connected to the ground of the first circuit board via at least one connection line (430) and the ground lines (4231, 4232).

[0116] According to one embodiment of the present disclosure, at least one connecting line (430) may include a first connecting portion (431) or a second connecting portion (432).

[0117] According to one embodiment of the present disclosure, the first connection portion (431) may be electrically connected to the first ground line (4231). The first connection portion (431) may extend from the first ground line (4231). The first connection portion (431) may include a first connection line (431a) or a third connection line (431b). The first connection line (431a) may be electrically connected to the first ground line (4231). At least a portion of the first connection line (431a) may extend in a first direction. For example, the first connection line (431a) may be arranged or extended to form an acute angle with the first ground line (4231). The first direction may be an inclined direction with respect to the extension direction of the first ground line (4231) (e.g., the Y-axis direction of FIGS. 6 and 7 ). For example, the first direction may form an acute angle with the extension direction of the first ground line (4231) (e.g., the Y-axis direction of FIGS. 6 to 7). The third connection line (431b) may be electrically connected to the first ground line (4231). The third connection line (431b) may extend in a direction different from the first direction. A portion of the first ground line (4231) may overlap a portion of the first connection line (431a) and / or a portion of the third connection line (431b) with respect to the thickness direction of the flexible connecting member (400) (e.g., the Z-axis direction of FIGS. 6 to 7).

[0118] According to one embodiment of the present disclosure, the first connection line (431a) may be in contact with the second connection line (432a). For example, the first connection line (431a) may intersect with the second connection line (432a). A portion of the first connection line (431a) (e.g., a portion intersecting the second connection line (432a)) may be in contact with the second connection line (432a). Accordingly, the first connection line (431a) may be electrically connected to the second connection line (432a).

[0119] According to one embodiment of the present disclosure, the second connection portion (432) may be electrically connected to the second ground line (4232). The second connection portion (432) may extend from the second ground line (4232). The second connection portion (432) may include a second connection line (432a) or a fourth connection line (432b). The second connection line (432a) may be electrically connected to the second ground line (4232). At least a portion of the second connection line (432a) may extend in a second direction. For example, the second connection line (432a) may be arranged or extended to form an acute angle with the second ground line (4232). The second direction may be an inclined direction with respect to the extension direction of the second ground line (4232) (e.g., the Y-axis direction of FIGS. 6 and 7 ). For example, the second direction may form an acute angle with the extension direction of the second ground line (4232) (e.g., the Y-axis direction of FIGS. 6 to 7). The second direction may be a different direction from the first direction, which is the extension direction of the first connection line (431a). The fourth connection line (432b) may be electrically connected to the second ground line (4232). The fourth connection line (432b) may extend in a direction different from the second direction. A portion of the second ground line (4232) may overlap a portion of the second connection line (432a) and / or a portion of the fourth connection line (432b) with respect to the thickness direction of the flexible connecting member (400) (e.g., the Z-axis direction of FIGS. 6 to 7).

[0120] According to one embodiment of the present disclosure, the second connection line (432a) may be in contact with the first connection line (431a). For example, the second connection line (432a) may intersect the first connection line (431a). A portion of the second connection line (432a) (e.g., a portion intersecting the first connection line (431a)) may be in contact with the first connection line (431a). Accordingly, the second connection line (432a) may be electrically connected to the first connection line (431a).

[0121] According to one embodiment of the present disclosure, at least a portion of the third connection line (431b) may be in contact with the ground sheet (440). At least a portion of the fourth connection line (432b) may be in contact with the ground sheet (440).

[0122] According to one embodiment of the present disclosure, the ground sheet (440) may be electrically connected to the first ground line (4231) via the third connection line (431b). In addition, the ground sheet (440) may be electrically connected to the first ground line (4231) via the first connection line (431a). The ground sheet (440) may provide a ground for the first ground line (4231).

[0123] According to one embodiment of the present disclosure, the ground sheet (440) may be electrically connected to the second ground line (4232) via the fourth connection line (432b). In addition, the ground sheet (440) may be electrically connected to the second ground line (4232) via the second connection line (432a). The ground sheet (440) may provide a ground for the second ground line (4232).

[0124] According to one embodiment of the present disclosure, since the second signal line (422) (e.g., a high-speed signal line) is positioned between the first ground line (4231) and the second ground line (4232), the first ground line (4231) and the second ground line (4232) can provide a shielding structure for the second signal line (422). In addition, since the first ground line (4231) and the second ground line (4232) remain electrically connected to the ground of the first circuit board or the ground of the ground sheet (440), an impedance change of the second signal line (422) (e.g., a high-speed signal line) can be limited or reduced. Accordingly, the occurrence of loss of an electrical signal transmitted through the second signal line (422) can be limited or reduced.

[0125] According to one embodiment of the present disclosure, the ground sheet (440) may be configured to provide a shielding structure or a shielding function for the first signal line (421) or the second signal line (422). In addition, the first ground line (4231) and / or the second ground line (4232) may be configured to provide a shielding structure or a shielding function for the second signal line (422). For example, the ground sheet (440), the first ground line (4231) and / or the second ground line (4232) may provide an electromagnetic interference (EMI) shielding structure for the first signal line (421) and / or the second signal line (422). For example, as the ground sheet (440), the first ground line (4231) and / or the second ground line (4232) limit or reduce the occurrence of impedance changes in the first signal line (421) and / or the second signal line (422), the loss of power or electrical signals transmitted through the second signal line (422) can be limited or reduced, and the power integrity (PI) and / or signal integrity (SI) of the second signal line (422) can be improved or enhanced.

[0126] According to one embodiment of the present disclosure, a flexible connecting member (400) may include a first connecting region (401), a second connecting region (402), or a third connecting region (403). The connecting regions (401, 402, 403) may be defined and / or referred to as connecting structures.

[0127] According to one embodiment of the present disclosure, in the first connection area (401), a portion of the first ground line (4231) may be electrically connected to a portion of the first connection line (431a) and / or a portion of the third connection line (431b). The first connection area (401) may be defined as an area where the first ground line (4231), the first connection line (431a), and the third connection line (431b) overlap. A portion of the first connection line (431a) may be in contact with the first ground line (4231) and the third connection line (431b) between the first insulating layer (411) and the second insulating layer (413). The remainder of the first connection line (431a) may not be located between the first insulating layer (411) and the second insulating layer (413), and may extend in the first direction on the second insulating layer (413). A portion of the third connection line (431b) may be in contact with the first connection line (431a) between the first insulating layer (411) and the second insulating layer (413). At least a portion of the third connection line (431b) may overlap with the first connection line (431a) and the first ground line (4231) in a third direction (e.g., the Z-axis direction in FIGS. 6 and 7) from the first insulating layer (411) toward the second insulating layer (413).

[0128] According to one embodiment of the present disclosure, in the second connection area (402), a portion of the second ground line (4232) may be electrically connected to a portion of the second connection line (432a) and / or a portion of the fourth connection line (432b). The second connection area (402) may be defined as an area where the second ground line (4232), the second connection line (432a), and the fourth connection line (432b) overlap. A portion of the second connection line (432a) may be in contact with the second ground line (4232) and the fourth connection line (432b) between the first insulating layer (411) and the second insulating layer (413). The remainder of the second connection line (432a) may not be located between the first insulating layer (411) and the second insulating layer (413) and may extend in the second direction on the second insulating layer (413). For example, a portion of the remainder of the second connection line (432a) may intersect with the first connection line (431a) and may be in contact with the first connection line (431a). At least a portion of the fourth connection line (432b) may overlap with the second connection line (432a) and the second ground line (4232) in the third direction (e.g., the Z-axis direction of FIGS. 6 and 7).

[0129] According to one embodiment of the present disclosure, in the third connection area (403), a portion of the first connection line (431a) may be in contact with a portion of the second connection line (432a). For example, in the third connection area (403), a portion of the first connection line (431a) may be electrically connected to a portion of the second connection line (432a). The third connection area (403) may be defined as a portion (403) where the first connection line (431a) and the second connection line (432a) intersect each other.

[0130] According to one embodiment of the present disclosure, as the first connection line (431a) and the second connection line (432a) are electrically connected in the third connection area (403), the electrical connection state of the ground sheet (440), the first ground line (4231), and the second ground line (4232) can be maintained well.

[0131] According to one embodiment of the present disclosure, the first ground line (4231) may be electrically connected to the ground sheet (440) via a conductive path by the third connection line (431b), a conductive path by the first connection line (431a), or a conductive path by the second connection portion (432) (e.g., the second connection line (432a) and / or the fourth connection line (432b)).

[0132] For example, if the contact state between the third connection line (431b) and the ground sheet (440) is a poor contact state, the first ground line (4231) may not be electrically connected to the ground of the ground sheet (440) through the third connection line (431b). In this case, the first ground line (4231) may be electrically connected to the ground of the ground sheet (440) through the first connection line (431a). In addition, the first ground line (4231) may be electrically connected to the ground of the ground sheet (440) through the second connection line (432a) in contact with the first connection line (431a). In addition, the first ground line (4231) can be electrically connected to the ground of the ground sheet (440) through the second connection line (432a) and the fourth connection line (432b) which are electrically connected to the first connection line (431a). Accordingly, as the electrical connection state between the first ground line (4231) and the ground of the ground sheet (440) is maintained well, the SI of the electrical signal transmitted through the second signal line (422) can be improved or enhanced. The description of the electrical connection state between the first ground line (4231) and the ground of the ground sheet (440) can be identically or similarly applied and / or mutatis mutandis to the electrical connection state between the second ground line (4232) and the ground of the ground sheet (440).

[0133] FIG. 8 is a schematic diagram showing a state before connection of a first ground line, a first connection line, and a third connection line according to one embodiment of the present disclosure.

[0134] FIG. 9 is a schematic diagram showing a state after connection of a first ground line, a first connection line, and a third connection line according to one embodiment of the present disclosure.

[0135] FIG. 10 is a schematic diagram showing a state after connection of ground lines and connection lines according to one embodiment of the present disclosure.

[0136] The embodiments of FIGS. 8 to 10 may be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 11a, 11b, and 12.

[0137] Referring to FIG. 8, the first ground line (4231) (e.g., the first ground line (4231) of FIGS. 6 to 7) may extend along the longitudinal direction (e.g., the Y-axis direction of FIGS. 8 to 10) of the flexible connecting member (e.g., the flexible connecting member (400) of FIGS. 6 to 7).

[0138] According to one embodiment of the present disclosure, the first connection line (431a) (e.g., the first connection line (431a) of FIGS. 6 to 7) may include a first connection portion (4311a) or a first extension portion (4312a). The first connection portion (4311a) may extend in substantially the same direction as the extension direction of the first ground line (4231) (e.g., the Y-axis direction of FIGS. 8 to 10). The first extension portion (4312a) may extend in a first direction from one end of the first connection portion (4311a). The first direction may be inclined with respect to the extension direction of the first connection portion (4311a). For example, the first direction may form an acute angle with the extension direction of the first connection portion (4311a).

[0139] According to one embodiment of the present disclosure, the first extension portion (4312a) may be provided in a folded state relative to the first connection portion (4311a). For example, the first extension portion (4312a) and the first connection portion (4311a) may be provided as at least a portion of the first connection line (431a) is folded.

[0140] According to one embodiment of the present disclosure, the third connection line (431b) (e.g., the third connection line (431b) of FIGS. 6 to 7) may include a third connection portion (4311b) or a third extension portion (4312b). The third connection portion (4311b) may extend in substantially the same direction as the extension direction of the first ground line (4231). The third extension portion (4312b) may extend from one end of the third connection portion (4311b) in a direction different from the first direction. For example, the extension direction of the third extension portion (4312b) may be different from the first direction, which is the extension direction of the first extension portion (4312a). The extension direction of the third extension portion (4312b) may be inclined with respect to the extension direction of the third connection portion (4311b). For example, the third extension portion (4312b) may be positioned or extended to form an acute angle with the third connection portion (4311b).

[0141] According to one embodiment of the present disclosure, the third extension portion (4312b) may be provided in a folded state relative to the third connection portion (4311b). For example, the third extension portion (4312b) and the third connection portion (4311b) may be provided as at least a portion of the third connection line (431b) is folded.

[0142] Referring to FIG. 9, a first connection portion (4311a) of a first connection line (431a) is directly laminated on a first ground line (4231), and a third connection portion (4311b) of a third connection line (431b) is directly laminated on the first connection portion (4311a). According to one embodiment of the present disclosure, as the first ground line (4231), the first connection line (431a), and the third connection line (431b) overlap in the first connection area (401) (e.g., the first connection area (401) of FIG. 7), the first ground line (4231), the first connection line (431a), and the third connection line (431b) can be electrically connected to each other. Although not shown, the lamination state of the first ground line (4231), the first connection line (431a), and the third connection line (431b) may be provided in a state in which the third connection portion (4311b) of the third connection line (431b) is directly laminated on the first ground line (4231), and the first connection portion (4311a) of the first connection line (431a) is directly laminated on the third connection portion (4311b).

[0143] According to one embodiment of the present disclosure, at least a portion of a third connecting portion (4311b) and at least a portion of a third extending portion (4312b) may be disposed between the first connecting portion (4311a) and the first extending portion (4312a). Although not illustrated, at least a portion of the first connecting portion (4311a) and at least a portion of the first extending portion (4312a) may be disposed between the third connecting portion (4311b) and the third extending portion (4312b).

[0144] According to one embodiment of the present disclosure, the first ground line (4231), the first connection portion (4311a), and the third connection portion (4311b) may be positioned between the first insulating layer (e.g., the first insulating layer (411) of FIGS. 6 to 7) and the second insulating layer (e.g., the second insulating layer (413) of FIGS. 6 to 7).

[0145] According to one embodiment of the present disclosure, at least a portion of the first extension portion (4312a) and at least a portion of the third extension portion (4312b) may be positioned between a second insulating layer (e.g., the second insulating layer (413) of FIGS. 6 to 7) and a ground sheet (e.g., the ground sheet (440) of FIGS. 6 to 7).

[0146] Referring to FIG. 10, the second ground line (4232) (e.g., the second ground line (4232) of FIGS. 6 to 7) may extend along the longitudinal direction (e.g., the Y-axis direction of FIGS. 8 to 10) of the flexible connecting member (e.g., the flexible connecting member (400) of FIGS. 6 to 7).

[0147] According to one embodiment of the present disclosure, the second connection line (432a) (e.g., the second connection line (432a) of FIGS. 6 and 7) may include a second connection portion (4321a) or a second extension portion (4322a). The second connection portion (4321a) may extend in substantially the same direction as the extension direction of the second ground line (4232) (e.g., the Y-axis direction of FIGS. 8 to 10). The second extension portion (4322a) may extend in a second direction from one end of the second connection portion (4321a). The second direction may be inclined with respect to the extension direction of the second connection portion (4321a). For example, the second direction may form an acute angle with the extension direction of the second connection portion (4321a).

[0148] According to one embodiment of the present disclosure, the second extension portion (4322a) may be provided in a folded state relative to the second connection portion (4321a). For example, the second extension portion (4322a) and the second connection portion (4321a) may be provided as at least a portion of the second connection line (432a) is folded.

[0149] According to one embodiment of the present disclosure, the fourth connection line (432b) (e.g., the fourth connection line (432b) of FIGS. 6 and 7) may include a fourth connection portion (4321b) or a fourth extension portion (4322b). The fourth connection portion (4321b) may extend in substantially the same direction as the extension direction of the second ground line (4232). The fourth extension portion (4322b) may extend from one end of the fourth connection portion (4321b) in a direction different from the second direction. For example, the extension direction of the fourth extension portion (4322b) may be different from the second direction, which is the extension direction of the second extension portion (4322a). The extension direction of the fourth extension portion (4322b) may be inclined with respect to the extension direction of the fourth connection portion (4321b). For example, the fourth extension portion (4322b) may be positioned or extended to form an acute angle with the fourth connection portion (4321b).

[0150] According to one embodiment of the present disclosure, the fourth extension portion (4322b) may be provided in a folded state relative to the fourth connection portion (4321b). For example, the fourth extension portion (4322b) and the fourth connection portion (4321b) may be provided as at least a portion of the fourth connection line (432b) is folded.

[0151] According to one embodiment of the present disclosure, a state is illustrated in which a fourth connection portion (4321b) of a fourth connection line (432b) is directly laminated on a second ground line (4232), and a second connection portion (4321a) of a second connection line (432a) is directly laminated on the fourth connection portion (4321b). According to one embodiment of the present disclosure, as the second ground line (4232), the second connection line (432a), and the fourth connection line (432b) overlap in the second connection area (402) (e.g., the second connection area (402) of FIG. 7), the second ground line (4232), the second connection line (432a), and the fourth connection line (432b) can be electrically connected to each other. Although not shown, the stacking state of the second ground line (4232), the second connection line (432a), and the fourth connection line (432b) may be provided in a state in which the second connection portion (4321a) of the second connection line (432a) is directly stacked on the second ground line (4232), and the fourth connection portion (4321b) of the fourth connection line (432b) is directly stacked on the second connection portion (4321a).

[0152] According to one embodiment of the present disclosure, at least a portion of the second connecting portion (4321a) and at least a portion of the second extending portion (4322a) may be disposed between the fourth connecting portion (4321b) and the fourth extending portion (4322b). Although not illustrated, at least a portion of the fourth connecting portion (4321b) and at least a portion of the fourth extending portion (4322b) may be disposed between the second connecting portion (4321a) and the second extending portion (4322a).

[0153] According to one embodiment of the present disclosure, the second ground line (4232), the second connection portion (4321a), and the fourth connection portion (4321b) may be positioned between the first insulating layer (e.g., the first insulating layer (411) of FIGS. 6 and 7) and the second insulating layer (e.g., the second insulating layer (413) of FIGS. 6 and 7).

[0154] According to one embodiment of the present disclosure, at least a portion of the second extension portion (4322a) and at least a portion of the fourth extension portion (4322b) may be positioned between a second insulating layer (e.g., the second insulating layer (413) of FIGS. 6 and 7) and a ground sheet (e.g., the ground sheet (440) of FIGS. 6 and 7).

[0155] Referring to FIG. 10, in the third connection area (403) (e.g., the third connection area (403) of FIG. 7), the first extension portion (4312a) and the second extension portion (4322a) may intersect. In the third connection area (403), since the first extension portion (4312a) and the second extension portion (4322a) are in direct contact, the first connection line (431a) may be electrically connected to the second connection line (432a). According to one embodiment of the present disclosure, in the third connection area (403), the first extension portion (4312a) may contact a ground sheet (e.g., the ground sheet (440) of FIGS. 6 and 7), and the second extension portion (4322a) may contact a second insulating layer (e.g., the second insulating layer (413) of FIGS. 6 and 7). Although not shown, in the third connection area (403), the contact state of the first extension portion (4312a) and the second extension portion (4322a) may be provided such that the second extension portion (4322a) contacts the ground sheet and the first extension portion (4312a) contacts the second insulating layer.

[0156] FIG. 11A is a cross-sectional view of a flexible connecting member according to one embodiment of the present disclosure.

[0157] FIG. 11b is a cross-sectional view of a flexible connecting member according to one embodiment of the present disclosure.

[0158] The embodiments of FIGS. 11A and 11B may be combined with the embodiments of FIGS. 1 to 10, or the embodiment of FIG. 12.

[0159] Fig. 11a illustrates the stacking relationship of the first ground line (4231), the first connection line (431a), and the third connection line (431b). The description of the first ground line (4231), the first connection line (431a), and the third connection line (431b) illustrated with reference to Fig. 11a as an example may be identically or similarly applied and / or applied to the second ground line (e.g., the second ground line (4232) of Figs. 6 and 7 or Fig. 10), the second connection line (e.g., the second connection line (432a) of Figs. 6 and 7 or Fig. 10), and the fourth connection line (e.g., the fourth connection line (432b) of Figs. 6 and 7 or Fig. 10) illustrated in Figs. 6 to 10.

[0160] FIG. 11b illustrates a flexible connecting member (400) viewed on a different plane from FIG. 11a (e.g., a virtual plane including the Y-axis and Z-axis of FIGS. 11a to 11b).

[0161] Referring to FIGS. 11A and 11B, a flexible connecting member (400) (e.g., the flexible connecting member (345) of FIGS. 4 and 5, or the flexible connecting member (400) of FIGS. 6 and 7) may include an insulating layer (410), at least one ground line (423), a first connecting line (431a), a third connecting line (431b), or a ground sheet (440).

[0162] The configuration of the insulating layer (410), at least one ground line (423), the first connection line (431a), the third connection line (431b), or the ground sheet (440) of FIGS. 11a and 11b may be partially or entirely the same as the configuration of the insulating layer (410), at least one ground line (423), the first connection line (431a), the third connection line (431b), or the ground sheet (440) of FIGS. 6 and 7.

[0163] According to one embodiment of the present disclosure, the insulating layer (410) may include a first insulating layer (411) (e.g., the first insulating layer (411) of FIGS. 6 to 7), or a second insulating layer (413) spaced apart from the first insulating layer (411) (e.g., the second insulating layer (413) of FIGS. 6 to 7).

[0164] According to one embodiment of the present disclosure, at least one ground line (423) may include a first ground line (e.g., ground line (4231) of FIGS. 6 to 7).

[0165] According to one embodiment of the present disclosure, the first ground line (4231) may be disposed in the first insulating layer (411). For example, the first ground line (4231) may be disposed in a groove (or recess) formed in the first insulating layer (411). For example, the first ground line (4231) may be accommodated in a groove of the first insulating layer (411) having a shape corresponding to the shape of the first ground line (4231). For example, the first thickness (t1) of the first insulating layer (411) in the portion where the first ground line (4231) is positioned (e.g., the thickness (t1) in the Z-axis direction of FIG. 11a) may be smaller than the third thickness (t3) of the first insulating layer (411) in the portion where the first ground line (4231) is not positioned (e.g., the thickness (t3) in the Z-axis direction of FIG. 11b).

[0166] According to one embodiment of the present disclosure, the first connection line (431a) may include a first connection portion (4311a) (e.g., the first connection portion (4311a) of FIGS. 8 to 10) or a first extension portion (4312a) (e.g., the first extension portion (4312a) of FIGS. 8 to 10) extending from one end of the first connection portion (4311a) (e.g., the end facing the +Y direction of FIG. 11a).

[0167] According to one embodiment of the present disclosure, the third connection line (431b) may include a third connection portion (4311b) (e.g., the third connection portion (4311b) of FIGS. 8 to 10) or a third extension portion (4312b) (e.g., the third extension portion (4312b) of FIGS. 8 to 10) extending from one end of the third connection portion (4311b) (e.g., the end facing the +Y direction of FIG. 11a).

[0168] According to one embodiment of the present disclosure, the first connecting portion (4311a) and / or the third connecting portion (4311b) may be disposed in the second insulating layer (413). For example, the first connecting portion (4311a) and / or the third connecting portion (4311b) may be disposed on one surface of the second insulating layer (413) (e.g., the surface facing the +Z direction in FIG. 11A). For example, the first connecting portion (4311a) and / or the third connecting portion (4311b) may be disposed in a groove (or recess) formed in one surface of the second insulating layer (413) (e.g., the surface facing the +Z direction in FIG. 11A). For example, the first connecting portion (4311a) and / or the third connecting portion (4311b) may be accommodated in a groove of the second insulating layer (413) having a shape corresponding to the shape of the first connecting portion (4311a) and / or the third connecting portion (4311b). For example, the second thickness (t2) of the second insulating layer (413) in the portion where the first connecting portion (4311a) and / or the third connecting portion (4311b) is positioned (e.g., the thickness (t2) in the Z-axis direction of FIG. 11a) may be smaller than the fourth thickness (t4) of the second insulating layer (413) in the portion where the first connecting portion (4311a) and / or the third connecting portion (4311b) is not positioned (e.g., the thickness (t4) in the Z-axis direction of FIG. 11b).

[0169] According to one embodiment of the present disclosure, the first extension portion (4312a) and / or the third extension portion (4312b) may be disposed on the second insulating layer (413). For example, the first extension portion (4312a) and / or the third extension portion (4312b) may be disposed on the other surface of the second insulating layer (413) (e.g., the surface facing the -Z direction in FIG. 11A).

[0170] According to one embodiment of the present disclosure, the first connecting portion (4311a) may be positioned between the third connecting portion (4311b) and the first ground line (4231). Although not shown, the third connecting portion (4311b) may be positioned between the first connecting portion (4311b) and the first ground line (4231).

[0171] According to one embodiment of the present disclosure, the ground sheet (440) may be laminated to at least a portion of the second insulating layer (413). For example, the ground sheet (440) may be adhered to at least a portion of the second insulating layer (413).

[0172] According to one embodiment of the present disclosure, the ground sheet (440) can be in contact with the first extension portion (4312a) and electrically connected to the first extension portion (4312a). In addition, the ground sheet (440) can be in contact with the third extension portion (4312b) and electrically connected to the third extension portion (4312b). FIG. 12 is a plan view illustrating a flexible connecting member according to one embodiment of the present disclosure.

[0173] The embodiment of FIG. 12 may be combined with the embodiments of FIGS. 1 to 10, FIG. 11a, and FIG. 11b.

[0174] Referring to FIG. 12, a flexible connecting member (400) (e.g., the flexible connecting member (400) of FIGS. 4 to 5 , the flexible connecting member (400) of FIGS. 6 to 7 , or the flexible connecting member (400) of FIGS. 11A to 11B ) may include an insulating layer (410), at least one conductive line (420), at least one connecting line (430), or a ground sheet (440).

[0175] The configuration of the insulating layer (410), at least one conductive line (420), at least one connection line (430), or ground sheet (440) of FIG. 12 may be partially or entirely identical to the configuration of the insulating layer (410), at least one conductive line (420), at least one connection line (430), or ground sheet (440) of FIGS. 6 to 7.

[0176] According to one embodiment of the present disclosure, the insulating layer (410) may include a first insulating layer (411) (e.g., the first insulating layer (411) of FIGS. 6 and 7) or a second insulating layer (413) (e.g., the second insulating layer (413) of FIGS. 6 and 7).

[0177] According to one embodiment of the present disclosure, at least one conductive line (420) may include a first signal line (421) (e.g., the first signal line (421) of FIGS. 6 and 7), a second signal line (e.g., the second signal line (422) of FIGS. 6 and 7), or at least one ground line (423) (e.g., the at least one ground line (423) of FIGS. 6 and 7). The at least one ground line (423) may include a first ground line (4231) (e.g., the first ground line (4231) of FIGS. 6 and 7), or a second ground line (4232) (e.g., the second ground line (4232) of FIGS. 6 and 7).

[0178] According to one embodiment of the present disclosure, at least one connecting line (430) may include a first connecting line (531) (e.g., the first connecting line (431a) of FIGS. 6 to 10 and FIG. 11a), or a second connecting line (532) (e.g., the second connecting line (432a) of FIGS. 6 to 8 or FIG. 10).

[0179] According to one embodiment of the present disclosure, the first connection line (531) may be electrically connected to the first ground line (4231). In addition, the first connection line (531) may be electrically connected to the ground sheet (440).

[0180] According to one embodiment of the present disclosure, the second connection line (532) may be electrically connected to the second ground line (4232). In addition, the second connection line (532) may be electrically connected to the ground sheet (440).

[0181] According to one embodiment of the present disclosure, in the third connection area (503) (e.g., the third connection area (403) of FIG. 7 or the third connection area (403) of FIG. 10), a portion of the first connection line (531) may be in contact with a portion of the second connection line (532). For example, in the third connection area (503), a portion of the first connection line (531) may be electrically connected to a portion of the second connection line (532). The third connection area (503) may be defined as a portion (503) where the first connection line (531) and the second connection line (532) intersect each other.

[0182] According to one embodiment of the present disclosure, as the first connection line (531) and the second connection line (532) are electrically connected in the third connection area (503), the electrical connection state of the ground sheet (440), the first ground line (4231) and the second ground line (4232) can be maintained well.

[0183] According to one embodiment of the present disclosure, the first ground line (4231) can be electrically connected to the ground sheet (440) via a conductive path by the first connection line (531) or via a conductive path by the second connection line (532) electrically connected to the first connection line (531).

[0184] According to one embodiment of the present disclosure, the second ground line (4232) can be electrically connected to the ground sheet (440) via a conductive path by the second connection line (532) or via a conductive path by the first connection line (531) that is electrically connected to the second connection line (532).

[0185] According to one embodiment of the present disclosure, the ground sheet (440), the first ground line (4231) and / or the second ground line (4232) can provide an electromagnetic interference (EMI) shielding structure for the first signal line (421) and / or the second signal line (422).

[0186] According to one embodiment of the present disclosure, as the ground sheet (440), the first ground line (4231) and / or the second ground line (4232) limit or reduce the occurrence of impedance change of the first signal line (421) and / or the second signal line (422), the loss of power or electrical signal transmitted through the second signal line (422) can be limited or reduced, and the power integrity (PI) and / or signal integrity (SI) of the second signal line (422) can be improved or enhanced.

[0187] According to one embodiment of the present disclosure, in the third connection area (503), the first connection line (531) and the second connection line (532) may intersect. In the third connection area (503), since the first connection line (531) and the second connection line (532) are in direct contact, the first connection line (531) may be electrically connected to the second connection line (532). According to one embodiment of the present disclosure, in the third connection area (503), the first connection line (531) may contact the ground sheet (440), and the second connection line (532) may contact the second insulating layer (413). Although not shown, in the third connection area (503), the contact state of the first connection line (531) and the second connection line (532) can be provided such that the second connection line (532) can contact the ground sheet (440) and the first connection line (531) can contact the second insulating layer (413).

[0188] An electronic device may include a flexible connecting member configured to electrically connect a plurality of circuit boards, or to electrically connect one circuit board and at least one electrical / electronic component. The flexible connecting member may provide a conductive path for power and / or electrical signals to be transmitted between two components connected by the flexible connecting member. In addition, the flexible connecting member may be configured to be at least partially foldable or unfoldable, thereby connecting two components in various shapes (or three-dimensional shapes) within a limited internal space of the electronic device.

[0189] As electronic devices become more sophisticated and / or more integrated, flexible connection elements are required to be equipped with signal lines capable of ultra-high-speed data transmission. Compared to conventional signal lines, these signal lines capable of ultra-high-speed data transmission are more sensitive to impedance changes, which can result in electrical signal loss.

[0190] According to one embodiment of the present disclosure, a flexible connecting member providing a shielding structure for signal lines and an electronic device including the same can be provided.

[0191] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0192] According to one embodiment of the present disclosure, a flexible connecting member and an electronic device including the same can be provided in which a good electrical connection state between ground lines and a ground sheet is maintained, thereby limiting or reducing an impedance change of a high-speed signal line.

[0193] According to one embodiment of the present disclosure, a flexible connecting member providing an electromagnetic interference (EMI) shielding structure for signal lines and an electronic device including the same can be provided.

[0194] According to one embodiment of the present disclosure, a flexible connecting member and an electronic device including the same can be provided that improve or enhance the signal integrity (SI) of a high-speed signal line.

[0195] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0196] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (301), a circuit board (341), at least one electrical component (343), or a flexible connecting member (400). The circuit board (341) may be disposed within the housing (301). The at least one electrical component (343) may be disposed within the housing (301). The flexible connecting member (400) may be electrically connected to the circuit board (341) and the at least one electrical component (343). The flexible connecting member (400) may include an insulating layer (410), signal lines (421, 422), a first ground line (4231), or a second ground line (4232). The signal lines (421, 422) may be disposed on the insulating layer (410). The first ground line (4231) may be disposed on the insulating layer (410). The second ground line (4232) may be disposed on the insulating layer (410). The second ground line (4232) may be spaced apart from the first ground line (4231). The ground sheet (440) may be disposed on the insulating layer (410). The first connection lines (431a, 531) may be electrically connected to the first ground line (4231) and the ground sheet (440). The first connection lines (431a, 531) may extend at least partially along the first direction. The second connection lines (432a, 532) may be electrically connected to the second ground line (4232) and the ground sheet (440). The second ground line (4232) may extend, at least partially, along a second direction different from the first direction. The second ground line (4232) may intersect the first connection line (431a, 531). At least a portion of the second connection line (432a, 532) may contact at least a portion of the first connection line (431a, 531).

[0197] According to one embodiment of the present disclosure, each of the first ground line (4231) and the second ground line (4232) may be electrically connected to the ground of the circuit board (341).

[0198] According to one embodiment of the present disclosure, the first direction may be inclined with respect to the direction in which the first ground line (4231) extends. The second direction may be inclined with respect to the direction in which the second ground line (4232) extends.

[0199] According to one embodiment of the present disclosure, the portion (403, 503) where the first connection line (431a, 531) and the second connection line (432a, 532) intersect each other can be in contact with the ground sheet (440).

[0200] According to one embodiment of the present disclosure, the insulating layer (410) may include a first insulating layer (411) or a second insulating layer (413). The second insulating layer (413) may be spaced apart from the first insulating layer (411). The first ground line (4231) and the second ground line (4232) may be disposed on the first insulating layer (411).

[0201] According to one embodiment of the present disclosure, each of the first ground line (4231) and the second ground line (4232) may be disposed in a recess formed in the first insulating layer (4231).

[0202] According to one embodiment of the present disclosure, the ground sheet (440) may be laminated on the second insulating layer (413). At least a portion of the first connection line (431a, 531) and at least a portion of the second connection line (432a, 532) may be disposed in a recess formed in the second insulating layer (413).

[0203] According to one embodiment of the present disclosure, the first connection line (431a) may include a first connection portion (4311a) or a first extension portion (4312a). The first connection portion (4311a) may be disposed on the first ground line (4231). The first extension portion (4312a) may extend from the first connection portion (4311a). The second connection line (432a) may include a second connection portion (4321a) or a second extension portion (4322a). The second connection portion (4321a) may be disposed on the second ground line (4232). The second extension portion (4322a) may extend from the second connection portion (4321a). At least a portion of the first extension portion (4312a) may be in contact with at least a portion of the second extension portion (4322a).

[0204] According to one embodiment of the present disclosure, the first connecting portion (4311a) may be located at least partially between the first insulating layer (411) and the second insulating layer (413). The first extending portion (4312a) may be located at least partially between the second insulating layer (413) and the ground sheet (440). The second connecting portion (4321a) may be located at least partially between the first insulating layer (411) and the second insulating layer (413). The second extending portion (4322a) may be located at least partially between the second insulating layer (413) and the ground sheet (440).

[0205] According to one embodiment of the present disclosure, the flexible connecting member (400) may further include a third connecting line (431b) or a fourth connecting line (432b). The third connecting line (431b) may be electrically connected to the first connecting line (431a) and the first ground line (4231). The fourth connecting line (432b) may be electrically connected to the second connecting line (432a) and the second ground line (4232).

[0206] According to one embodiment of the present disclosure, the third connection line (431b) may include a third connection portion (4311b) or a third extension portion (4312b). The third connection portion (4311b) may be disposed on the first ground line (4231). The third extension portion (4312b) may extend from the third connection portion (4311b). The fourth connection line (432b) may include a fourth connection portion (4321b) or a fourth extension portion (4322b). The fourth connection portion (4321b) may be disposed on the second ground line (4232). The fourth extension portion (4322b) may extend from the fourth connection portion (4321b).

[0207] According to one embodiment of the present disclosure, the direction in which the third extension portion (4312b) extends may be different from the direction in which the first extension portion (4312a) extends. The direction in which the fourth extension portion (4322b) extends may be different from the direction in which the second extension portion (4322a) extends.

[0208] According to one embodiment of the present disclosure, at least a portion of the third connection line (431b) may overlap with the first connection line (431a) and the first ground line (4231) in a third direction from the first insulation layer (411) toward the second insulation layer (413). At least a portion of the fourth connection line (432b) may overlap with the second connection line (432a) and the second ground line (4232) in the third direction.

[0209] According to one embodiment of the present disclosure, the signal line (421, 422) may include a first signal line (421) or a second signal line (422). The second signal line (422) may be spaced apart from the first signal line (421). The second signal line (422) may be located between the first ground line (4231) and the second ground line (4232).

[0210] According to one embodiment of the present disclosure, the flexible connecting member (400) may include an FFC (flexible flat cable).

[0211] According to one embodiment of the present disclosure, a flexible connecting member (400) may include an insulating layer (410), a signal line (421, 422), a first ground line (4231), or a second ground line (4232). The signal line (421, 422) may be disposed on the insulating layer (410). The first ground line (4231) may be disposed on the insulating layer (410). The second ground line (4232) may be disposed on the insulating layer (410). The second ground line (4232) may be spaced apart from the first ground line (4231). The ground sheet (440) may be disposed on the insulating layer (410). The first connection line (431a, 531) may be electrically connected to the first ground line (4231) and the ground sheet (440). The first connection line (431a, 531) may extend at least partially along a first direction. The second connection line (432a, 532) may be electrically connected to the second ground line (4232) and the ground sheet (440). The second ground line (4232) may extend at least partially along a second direction different from the first direction. The second ground line (4232) may intersect the first connection line (431a, 531). At least a portion of the second connection line (432a, 532) may contact at least a portion of the first connection line (431a, 531).

[0212] According to one embodiment of the present disclosure, the portion (403, 503) where the first connection line (431a, 531) and the second connection line (432a, 532) intersect each other can be in contact with the ground sheet (440).

[0213] According to one embodiment of the present disclosure, the insulating layer (410) may include a first insulating layer (411) or a second insulating layer (413). The second insulating layer (413) may be spaced apart from the first insulating layer (411). The first ground line (4231) and the second ground line (4232) may be disposed on the first insulating layer (411).

[0214] According to one embodiment of the present disclosure, the ground sheet (440) may be laminated on the second insulating layer (413). At least a portion of the first connection line (431a, 531) and at least a portion of the second connection line (432a, 532) may be disposed in a recess formed in the second insulating layer (413).

[0215] According to one embodiment of the present disclosure, the first connection line (431a) may include a first connection portion (4311a) or a first extension portion (4312a). The first connection portion (4311a) may be disposed on the first ground line (4231). The first extension portion (4312a) may extend from the first connection portion (4311a). The second connection line (432a) may include a second connection portion (4321a) or a second extension portion (4322a). The second connection portion (4321a) may be disposed on the second ground line (4232). The second extension portion (4322a) may extend from the second connection portion (4321a). At least a portion of the first extension portion (4312a) may be in contact with at least a portion of the second extension portion (4322a).

[0216] It will be appreciated that the various embodiments of the present disclosure, in accordance with the claims and description of the present disclosure, may be implemented in the form of hardware, software, or a combination of hardware and software.

[0217] Such software may be stored on a non-transitory computer-readable storage medium. The non-transitory computer-readable storage medium stores one or more computer programs (software modules), and the one or more computer programs include computer-executable instructions that, when executed by one or more processors of the electronic device, cause the electronic device to perform the methods of the present disclosure.

[0218] Such software may be stored in the form of volatile or non-volatile storage, such as, for example, a storage device such as read-only memory (ROM), whether erasable or rewritable, or in the form of memory such as, for example, random access memory (RAM), a memory chip, device or integrated circuit, or on, for example, a compact disc (CD), a digital versatile disc (DVD), a magnetic disk or magnetic tape or similar optically or magnetically readable medium. It will be appreciated that the storage device and the storage medium are various embodiments of a computer program or non-transitory machine-readable storage suitable for storing a computer program comprising instructions that, when executed, implement various embodiments of the present disclosure. Accordingly, various embodiments provide a program comprising code for implementing an apparatus or method as claimed in one of the claims of the present disclosure, and a non-transitory machine-readable storage storing such a program.

[0219] While the present disclosure has been shown and described with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. In electronic devices, housing; A circuit board disposed within the housing; At least one electrical component disposed within the housing; and comprising a flexible connecting member electrically connected to the circuit board and at least one electrical component; The above flexible connecting member is, Insulating layer, A signal line arranged on the above insulating layer, A first ground line arranged on the above insulating layer, A second ground line disposed on the above insulating layer, the second ground line spaced apart from the first ground line, A ground sheet placed on the above insulating layer, A first connecting line electrically connected to the first ground line and the ground sheet, the first connecting line extending at least partially along the first direction, and A second connecting line electrically connected to the second ground line and the ground sheet, the second connecting line extending at least partially along a second direction different from the first direction and intersecting the first connecting line, An electronic device in which at least a portion of the second connecting line contacts at least a portion of the first connecting line.

2. In paragraph 1, An electronic device wherein each of the first ground line and the second ground line is electrically connected to the ground of the circuit board.

3. In paragraph 1, The above first direction is inclined with respect to the direction in which the first ground line extends, The second direction is an electronic device inclined with respect to the extended direction of the second ground line.

4. In paragraph 1, An electronic device in which the portion where the first connecting line and the second connecting line intersect each other is in contact with the ground sheet.

5. In paragraph 1, The above insulating layer includes a first insulating layer and a second insulating layer spaced apart from the first insulating layer, The first ground line and the second ground line are an electronic device disposed on the first insulating layer.

6. In paragraph 5, An electronic device in which each of the first ground line and the second ground line is positioned in a recess formed in the first insulating layer.

7. In paragraph 6, The above grounding sheet is laminated on the second insulating layer, An electronic device wherein at least a portion of the first connecting line and at least a portion of the second connecting line are each disposed in a recess formed in the second insulating layer.

8. In paragraph 6, The first connecting line includes a first connecting portion arranged on the first grounding line and a first extension portion extended from the first connecting portion, The second connecting line includes a second connecting portion arranged on the second grounding line and a second extension portion extended from the second connecting portion, An electronic device wherein at least a portion of the first extension portion is in contact with at least a portion of the second extension portion.

9. In paragraph 8, The first connecting portion is at least partially located between the first insulating layer and the second insulating layer, The first extension portion is at least partially positioned between the second insulating layer and the ground sheet, The second connecting portion is at least partially positioned between the first insulating layer and the second insulating layer, An electronic device wherein the second extension portion is at least partially positioned between the second insulating layer and the ground sheet.

10. In paragraph 9, The above flexible connecting member is, a third connecting line electrically connected to the first connecting line and the first grounding line; and An electronic device further comprising a fourth connecting line electrically connected to the second connecting line and the second grounding line.

11. In Article 10, The third connecting line includes a third connecting portion arranged on the first grounding line and a third extension portion extended from the third connecting portion, An electronic device wherein the fourth connecting line includes a fourth connecting portion arranged on the second ground line and a fourth extension portion extended from the fourth connecting portion.

12. In paragraph 11, The direction in which the third extension portion is extended is different from the direction in which the first extension portion is extended. An electronic device in which the direction in which the fourth extension portion extends is different from the direction in which the second extension portion extends.

13. In paragraph 10, At least a portion of the third connecting line overlaps the first connecting line and the first grounding line in a third direction from the first insulating layer toward the second insulating layer, An electronic device wherein at least a portion of the fourth connecting line overlaps the second connecting line and the second ground line with respect to the third direction.

14. In paragraph 1, The above signal line is, first signal line; and An electronic device comprising a second signal line spaced apart from the first signal line, the second signal line positioned between the first ground line and the second ground line.

15. In paragraph 1, The above flexible connecting member is an electronic device including a flexible flat cable (FFC).

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