Semiconductor circuit breaker having water-cooling heat dissipation system

Abstract

The present invention relates to a semiconductor circuit breaker and, more specifically, to a semiconductor circuit breaker having a water-cooling heat dissipation system. A semiconductor circuit breaker according to one aspect of the present invention is provided with a cooling water plate, through which cooling water flows, below a switching unit and an air gap switch, allowing for effective cooling.

Description

Semiconductor circuit breaker with water-cooled heat dissipation system

[0001] The present invention relates to a semiconductor circuit breaker, and more particularly, to a semiconductor circuit breaker having a water-cooled heat dissipation system.

[0002] In general, a semiconductor circuit breaker is a power device designed to interrupt a circuit using a semiconductor switch such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor).

[0003] Semiconductor circuit breakers utilize semiconductor switching elements in circuit breakers used in power equipment, offering a dramatic improvement in tripping time and a simplified structure. Furthermore, semiconductor circuit breakers utilize the current-blocking characteristics of semiconductor switches to interrupt circuits. Therefore, arcs are not generated during circuit breakers, eliminating the need for arc suppression. Consequently, arc extinguishing elements can be eliminated, reducing overall size.

[0004] On the other hand, the use of semiconductor switches has the disadvantage of increasing the manufacturing cost for low-capacity circuit breakers.

[0005] Semiconductor circuit breakers are widely used in systems requiring rapid interruption. While conventional mechanical circuit breakers have interruption speeds of several to several hundred milliseconds, semiconductor circuit breakers can interrupt current in a much shorter time, reaching speeds of tens of microseconds.

[0006] Accordingly, semiconductor circuit breakers are increasingly being utilized in systems such as distribution panels with high current capacity, DC systems with rapid increases in fault current, and Energy Storage Systems (ESS) that require stable current supply and interruption. Recently, Battery Energy Storage Systems (BESS), which utilize batteries as energy sources, have been widely used in electric vehicles and other applications. However, considering recent incidents of fires in ESS systems, the importance of circuit breakers for stable current supply while considering heat generation is becoming increasingly crucial.

[0007] Meanwhile, semiconductor circuit breakers incorporate protection circuits (safety circuits) or safety elements to protect the semiconductors from damage caused by voltage generated during semiconductor switching. A snubber circuit is an example of such a protection circuit. Similarly, power semiconductor circuit breakers require protection circuits like snubber circuits to reduce the voltage generated during switching.

[0008] Additionally, depending on the system, an MOV (Metal Oxide Varistor) may be additionally configured as a protection element. MOV is a component used for surge protection, and is applied to some parts of the circuit to prevent damage to electrical and electronic devices from surges. MOV is a varistor composed of zinc oxide. It is a transient voltage blocking element that allows current to flow when the potential exceeds a certain level. The application of this element eliminates the need for an external internal fuse.

[0009] These semiconductor circuit breakers are typically constructed as a composite of a mechanical circuit breaker and an electronic circuit breaker. That is, the semiconductor circuit breaker is not comprised solely of a semiconductor switch, but also includes a mechanical switch (air gap switch) to mechanically (physically) disconnect the circuit.

[0010] Meanwhile, semiconductor circuit breakers are primarily used in DC power circuits. DC circuit breakers offer the advantage of allowing easy configuration of power and load locations.

[0011] As shown in Figure 1, when DC circuit breakers are arranged in the order of 'power source (3) -> DC circuit breaker (2) -> load (1)' on a system or circuit (case a), current flows from left to right on the drawing.

[0012] And, when the DC circuit breakers are arranged in the order of 'load (1) -> DC circuit breaker (2) -> power source (3)' on the system or circuit (case b), the current flows from right to left on the drawing.

[0013] Additionally, it is also possible to install a DC circuit breaker on a circuit in which current flows in both directions (case c). A first power source (14) and a second power source (5) are configured before and after the DC circuit breaker (2). Here, the first power source (14) or the second power source (5) may be configured as a battery.

[0014] Fig. 2 illustrates a perspective view of a semiconductor circuit breaker. The semiconductor circuit breaker includes a switching unit (6) and an air gap switch (7). Here, the switching unit (6) includes a power semiconductor switch, and the air gap switch (7) refers to a mechanical switch. A heat sink (8) and a heat dissipation fan (9) are provided below the switching unit (6) and the air gap switch (7) for cooling.

[0015] However, switching units generate high temperatures, requiring heat dissipation. Furthermore, mechanical switches (air-gap switches) generate high temperatures at the contact points when they are closed. Consequently, they release heat to the surrounding area, necessitating cooling and a configuration designed for efficient cooling.

[0016] Meanwhile, this heat dissipation performance must be achieved efficiently within the limited space of a semiconductor circuit breaker. It is desirable to make the size of the semiconductor circuit breaker as small as possible, thus ensuring efficient heat dissipation while occupying a small space.

[0017] Additionally, ease of maintenance must be considered. Semiconductor circuit breakers should be designed with maintenance requirements in mind for components such as switching units, air gap switches, and heat sinks.

[0018] The present invention has been devised to solve the above-mentioned problems, and its purpose is to provide a semiconductor circuit breaker having effective cooling performance by a water-cooling cooling system.

[0019] Additionally, the purpose is to improve heat dissipation while making the DC circuit breaker occupy a small space.

[0020] Additionally, the water-cooling cooling system is improved to reduce the space it occupies within the semiconductor circuit breaker.

[0021] In addition, it provides a heat dissipation system that can facilitate maintenance in semiconductor circuit breakers.

[0022] A semiconductor circuit breaker according to one aspect of the present invention comprises: a switching unit provided in an enclosure; an air gap switch provided in the enclosure and arranged on one side of the switching unit; a base plate forming a lower portion of the switching unit; and a cooling water plate coupled to the base plate and having a cooling water passage through which cooling water flows.

[0023] Here, the upper surface of the cooling plate and the lower surface of the base plate are formed as a plane and are bonded by adhesive or mechanical means.

[0024] In addition, the cooling plate is characterized in that a polygonal protrusion or groove is formed on the upper surface thereof, and a groove or protrusion corresponding to the protrusion or groove is formed on the lower surface of the base plate.

[0025] Additionally, the lower surface of the outer case is characterized by being open.

[0026] In addition, the cooling water passage has an inlet and an outlet, and the inlet and outlet are characterized in that they are arranged together on one side of the cooling water plate or are arranged respectively on different sides.

[0027] In addition, the cooling water passage is characterized by including a reservoir formed between the inlet and the outlet.

[0028] In addition, the cooling water passage is characterized in that it is formed to have a straight section and a curved section extending to both ends of the straight section, and is formed so that a constant flow rate is maintained from the inlet to the outlet.

[0029] In addition, the straight or curved portion is characterized in that an extension portion having a larger diameter than other portions is formed.

[0030] In addition, the lower portion of the cooling water plate is characterized in that a number of fins are formed protrudingly.

[0031] And, it is characterized in that a cooling fan is provided at the bottom of the cooling water plate.

[0032] A semiconductor circuit breaker according to another aspect of the present invention comprises a switching unit provided at the lower part of an open case and including a power semiconductor element; and a cooling water housing coupled to the lower part of the switching unit and having an open upper surface, wherein cooling water accommodated in the cooling water housing flows while contacting the lower surface of the switching unit.

[0033] Here, a base plate is provided at the bottom of the switching unit.

[0034] Additionally, the coolant housing is bonded to the base plate by adhesive or mechanical bonding.

[0035] Additionally, the coolant housing is provided with a coolant receiving portion for receiving coolant.

[0036] Additionally, a fastening hole is formed at each corner of the coolant housing.

[0037] Additionally, the coolant housing is formed with an inlet and an outlet.

[0038] Additionally, the inlet and outlet ports are formed on opposite sides of the cooling water housing, respectively.

[0039] Additionally, the coolant housing is exposed to the outside of the enclosure.

[0040] Additionally, a packing member is provided between the coolant housing and the base plate.

[0041] Additionally, the packing member is formed of a thin plate member.

[0042] Additionally, the width of the panel surface of the packing member is formed to be larger than the thickness of the side surface of the cooling water housing.

[0043] Additionally, a number of fins are formed protrudingly at the bottom of the base plate.

[0044] In addition, an opening that is only partially open is formed on the lower surface of the outer case, and a part of the switching unit is exposed through the opening.

[0045] Additionally, the coolant housing is coupled to the opening.

[0046] According to a semiconductor circuit breaker according to one aspect of the present invention, a cooling plate through which cooling water flows is provided at the lower portion of the switching unit and the air gap switch, thereby effectively cooling the circuit.

[0047] The coolant plate occupies less space, resulting in an overall volume reduction.

[0048] The coolant plate is exposed to the outside, providing excellent assembly and easy maintenance.

[0049] Additionally, if a cooling fan is installed, the cooling effect is increased and heat is dissipated well to the outside of the device.

[0050] That is, since it has a cooling device that combines water cooling and air cooling, the cooling effect is maximized.

[0051] According to another aspect of the present invention, a semiconductor circuit breaker is provided with a water-cooling heat dissipation system in which cooling water flows under the switching unit and the air gap switch, thereby effectively cooling the unit.

[0052] The water-cooled heat dissipation system maximizes cooling effect because the cooling water flowing in the open-top cooling water housing directly contacts the switching unit, thereby causing heat transfer.

[0053] Water-cooled heat dissipation systems take up significantly less space than air-cooled systems, which require cooling fans and other equipment.

[0054] Additionally, the water-cooled heat dissipation system is exposed to the outside of the enclosure, making maintenance easy.

[0055] Figure 1 is a schematic diagram of a DC circuit breaker according to the prior art.

[0056] Fig. 2 is a perspective view of a semiconductor circuit breaker according to the prior art.

[0057] FIG. 3 and FIG. 4 are a perspective view and a side view of a semiconductor circuit breaker according to one aspect of the present invention.

[0058] Fig. 5 is a circuit diagram of a semiconductor circuit breaker according to one aspect of the present invention.

[0059] FIG. 6 is a separation diagram of a switching unit and a cooling water plate in a semiconductor circuit breaker according to one aspect of the present invention.

[0060] FIGS. 7 to 10 are cross-sectional views of cooling water plates according to various embodiments of the present invention.

[0061] FIG. 11 and FIG. 12 are perspective and side views of a semiconductor circuit breaker according to another embodiment of the present invention.

[0062] FIG. 13 and FIG. 14 are perspective and side views of a semiconductor circuit breaker according to another aspect of the present invention.

[0063] Fig. 15 is a circuit diagram of a semiconductor circuit breaker according to another aspect of the present invention.

[0064] Fig. 16 is a perspective view of a cooling water housing in a semiconductor circuit breaker according to another aspect of the present invention.

[0065] Fig. 17 is a perspective view of a packing member in a semiconductor circuit breaker according to another aspect of the present invention.

[0066] FIG. 18 and FIG. 19 are perspective and side views of a semiconductor circuit breaker according to another embodiment of the present invention.

[0067] FIG. 20 and FIG. 21 are side views and exploded perspective views of a semiconductor circuit breaker according to another embodiment of the present invention.

[0068] Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings. However, this is intended to be a detailed description to an extent that a person having ordinary skill in the technical field to which the present invention pertains can easily carry out the invention, and it does not mean that the technical idea and scope of the present invention are limited thereby.

[0069] A semiconductor circuit breaker according to each embodiment of the present invention will be described in detail with reference to the drawings.

[0070] <Example 1>

[0071] Figures 3 and 4 illustrate perspective and side views of a semiconductor circuit breaker according to one aspect of the present invention. Figure 5 illustrates a circuit diagram of a semiconductor circuit breaker according to one aspect of the present invention.

[0072] A semiconductor circuit breaker (100) according to one embodiment of the present invention includes a switching unit (120) provided in an outer case (101); an air gap switch (mechanical switch) (140) provided in the outer case (101) and arranged at a front or rear portion of the switching unit (120); a base plate (110) forming a lower portion of the switching unit (120); and a cooling water plate (150) coupled to the base plate (110) and having a cooling water passage through which cooling water flows.

[0073] The outer case (101) can be formed in a roughly rectangular box shape. The outer case (101) can be manufactured from an insulating material such as a synthetic resin material to insulate it from the outside. The outer case (101) supports the internal components and protects them from the outside.

[0074] The lower surface of the outer case (101) can be open. That is, the outer case can have a closed form on the upper surface and the front, rear, left, and right sides.

[0075] The outer case (101) has a ventilation hole formed on the front or rear side. Fig. 3 shows that the first ventilation hole (103) is formed on the rear side of the outer case. However, such ventilation holes may be formed on each side of the outer case (100) as needed.

[0076] Let us examine the components placed inside the outer case (100).

[0077] A switching unit (120) is placed within the housing (100). The switching unit (120) includes a power semiconductor switch. The power semiconductor switch may be a MOSFET (Metal Oxide Semiconductor Field Effect transistor) or an IGBT (Insulated Gate Bipolar Transistor).

[0078] Power semiconductor switches are widely used in systems requiring rapid interruption. While conventional mechanical circuit breakers have a tripping speed of several to several hundred milliseconds, semiconductor circuit breakers can interrupt current in a much shorter time, reaching only tens of μs.

[0079] Therefore, it can be applied to distribution panels with large current capacity, DC systems with fast increase rates of fault current, or ESS (Energy Storage System) systems that require stable current supply and interruption.

[0080] An electric circuit section (130) is provided on the upper part of the switching unit (120). Alternatively, the switching unit (120) may be installed on a part of the electric circuit section (130).

[0081] The electric circuit (130) is composed of a gate driver (not shown), a controller (133), a snubber (135), a metal oxide varistor (MOV) (137), a transient voltage suppressor (TVS), etc.

[0082] The gate driver provides the voltage required by the switching unit (120). For this purpose, a separate power circuit and current buffer may be provided. The gate driver is also called a driving driver.

[0083] Additionally, gate drivers electrically isolate and transmit signals between high-voltage power circuits and low-voltage control circuits. Therefore, gate drivers provide greater safety and reliability for driving semiconductor switches.

[0084] The controller (133) connects and controls each part within the circuit. The controller (133) determines overcurrent or fault current based on the current size received from the current sensor (132), and can operate the switching unit (120) and the air gap switch (140) accordingly. The controller (133) can operate the air gap switch (140) through the first driver (134a) and operate the switching unit (120) through the second driver (134b). (See Fig. 5)

[0085] Here, the current sensor (132) is installed in a part of the main circuit. In Fig. 6, the current sensor (132) can be placed at any of the positions ①, ②, and ③. That is, the current sensor (132) can be installed at the front or rear end of the air gap switch (140), or at the front or rear end of the switching unit (120).

[0086] In semiconductor circuit breakers, a protection circuit (safety circuit) or safety element is applied to protect the semiconductor switch from damage caused by high voltages generated during semiconductor switching. A snubber circuit is an example of such a protection circuit. Typically, a protection circuit protects the semiconductor switch by reducing the voltage generated during switching in a semiconductor circuit breaker.

[0087] Examples of snubber circuits include capacitor (C) snubbers, resistor-capacitor (RC) snubbers, charge-discharge type resistor-capacitor-diode (RCD) snubbers, and discharge-suppressing type snubber circuits.

[0088] Additionally, depending on the system, an MOV (Metal Oxide Varistor) (137) may be additionally configured as a protection element. The MOV is a component used for surge protection, and is applied to a part of the circuit to prevent damage to semiconductor switches caused by surge voltage. The MOV is a varistor composed of zinc oxide, and is a transient voltage blocking element that allows current to flow when a potential exceeding a set value occurs. When an MOV element is applied, there is no need to install a separate fuse inside the circuit.

[0089] The above-described protection circuits or protection elements can be provided as protection modules that can be detached from the electrical circuit unit (130). If the protection elements are independently configured as protection modules, maintenance becomes easier. That is, in the event of a failure of the protection module, only the protection module needs to be replaced.

[0090] An air gap switch (140) is arranged. The air gap switch (140) is a mechanical switch. The air gap switch (140) may be configured as a traditional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch (140), when current is supplied, the movable contact is connected to the fixed contact, and when current is cut off, the movable contact is separated from the fixed contact, thereby mechanically cutting off the circuit. Since direct current does not have a current zero point, when a small current flows in the circuit, it may be difficult to cut off the current in some cases. In such cases, in order to completely cut off the current, it is necessary to mechanically cut off the circuit.

[0091] The air gap switch (140) is placed at the front or rear of the switching unit (120). Here, it is preferable that the air gap switch (140) be placed on the power source (80) side. This is because, when the power source is cut off, the circuit can be isolated from the vicinity of the power source, thereby protecting the cutoff unit, other components, and the load (90).

[0092] However, a lot of heat is generated at the contact point of the air gap switch (140). Therefore, a device for cooling the heat of the air gap switch (140) and the switching unit (120) is required.

[0093] A cooling plate (150) is provided below the switching unit (120) and the air gap switch (140). The cooling plate (150) may be formed in a flat plate shape. The cooling plate (150) may be made of a material with excellent thermal conductivity, such as aluminum (Al) or copper (Cu).

[0094] The cooling plate (150) can be made of a metal material with high thermal conductivity, such as aluminum (Al) or copper (Cu).

[0095] The cooling plate (150) is coupled to the base plate (110) forming the lower portion of the switching unit (120). The cooling plate (150) can be coupled to the base plate (110) by adhesive or mechanical coupling. Examples of mechanical coupling methods include fitting or screw coupling.

[0096] The surfaces where the cooling plate (150) and the base plate (110) come into contact with each other have corresponding shapes. That is, the upper surface of the cooling plate (150) and the lower surface of the base plate (110) have corresponding shapes.

[0097] For example, the upper surface of the cooling plate (150) and the lower surface of the base plate (110) are configured as flat surfaces.

[0098] In another example, the upper surface of the coolant plate (150) and the lower surface of the base plate (110) are formed as uneven surfaces. This embodiment is shown in Fig. 6. A polygonal protrusion (112) or groove is formed on the upper surface of the coolant plate (150), and a groove (152) or protrusion corresponding to the protrusion (112) is formed on the lower surface of the base plate (110). Accordingly, the joining surface of the coolant plate (150) and the base plate (110) is increased, thereby increasing the stability of the mechanical joint, and increasing the thermal conductivity, thereby being effective in heat dissipation.

[0099] The cooling plate (150) is made of a material with high thermal conductivity and releases heat from the switching unit (120) transmitted through the base plate (110).

[0100] The cooling plate (150) is positioned at the bottom of the housing (100). The cooling plate (150) is not positioned inside the housing (100), but is positioned at the bottom of the housing (100) and exposed to the outside air. Accordingly, the heat dissipation reduction factor is reduced. This effect is further enhanced when the bottom of the housing (100) is opened.

[0101] The cooling plate (150) has a sufficient size to quickly absorb the heat of the base plate (110). For example, the cooling plate (150) may be formed to have a size corresponding to the area of ​​the base plate (110) or a size greater than the area of ​​the base plate (110).

[0102] A coolant passage (160) is formed inside the coolant plate (150). The coolant passage (160) has an inlet (161) and an outlet (162). The inlet (161) and the outlet (162) are arranged on one surface of the coolant plate (150). Alternatively, the inlet (161) and the outlet (162) are arranged on different surfaces of the coolant plate (150).

[0103] Various embodiments of the coolant flow path (160) are illustrated in FIGS. 7 to 10.

[0104] FIG. 7 illustrates a cooling water passage (160) in the form of a reservoir. In this embodiment, the cooling water passage (160) is formed with a reservoir (163) that occupies most of the surface area of ​​the cooling water plate (150) between the inlet (161) and the outlet (162). A large amount of cooling water is stored in the reservoir (163). Of course, the cooling water in the reservoir (163) does not remain stagnant, but moves from the inlet (161) to the outlet (162). Since the cooling water is stored in a large amount in the reservoir (163), the heat exchange area is large. This is advantageous when applied to a switching unit (120) that does not require rapid circulation of the cooling water and has a relatively low heat rise.

[0105] FIG. 7 illustrates a form in which the inlet (161) and the outlet (162) are arranged on the same side of the cooling water plate (150), and FIG. 8 illustrates a form in which the inlet (161) and the outlet (162) are arranged on different sides of the cooling water plate (150).

[0106] Fig. 9 illustrates a coolant flow path (160) formed in a zigzag pipe shape. In this embodiment, the coolant flow path (160) is connected in a meandering manner. The coolant flow path (160) is composed of a straight section (164) and curved sections (165) connected to both ends of the straight section (164). The length of the coolant flow path (160) is increased, and a constant flow rate is maintained from the inlet (161) to the outlet (162). Accordingly, the flow rate of the coolant flowing through the flow path can be maintained constant throughout the entire coolant flow path. Meanwhile, the flow rate can be easily controlled.

[0107] Figure 10 illustrates an example in which the diameter of a coolant passage (160) is changed. In this embodiment, in addition to the straight portion (164) and curved portion (165) of the previous embodiment, an expansion portion (166) is provided. The expansion portion (166) has a larger diameter than other portions. In other words, it has a portion where the coolant flow rate is locally high. In a plan view, the expansion portion (166) has a relatively large area locally. Accordingly, coolant can be concentrated and distributed to a specific portion.

[0108] In addition to these embodiments, the coolant passage (160) can be modified into various shapes to change the flow rate of the coolant.

[0109] <Example 2>

[0110] FIG. 11 illustrates a semiconductor circuit breaker according to another embodiment.

[0111] The semiconductor circuit breaker (100-1) of this embodiment has both a water-cooling cooling device and an air-cooling cooling device.

[0112] The outer case (101) has an upper space (S1) and a lower space (S2). A switching unit (120), an electric circuit unit (130), an air gap switch (140), etc. are arranged in the upper space (S1) of the outer case (101). A cooling water plate (150), a cooling fan (170), etc. are arranged in the lower space (S2) of the outer case (101).

[0113] The switching unit (120), electric circuit unit (130), and air gap switch (140) placed in the upper space (S1) of the outer case (101) may refer to the previous embodiment.

[0114] The lower part of the cooling plate (150) is provided with fins (155). The fins (155) protrude in a number of needle or chip shapes from the lower surface of the cooling plate (150).

[0115] A cooling fan (170) is provided on one side of the lower space (S2) of the outer case (101), and a second ventilation hole (104) is formed on the other side.

[0116] The wind generated by the cooling fan (170) passes through the lower space (S2) of the outer case (101) and exits through the second ventilation hole. Accordingly, the heat dissipated through the fins (155) is quickly released to the outside. Since the fins (155) are maintained at room temperature, the heat of the switching unit (120) is released more quickly. In other words, the heat of the upper space (S1) is quickly discharged to the lower space (S2).

[0117] The heat inside the outer case (101) is released to the outside of the outer case (101) by the cooling plate (150) and cooling fan (170), thereby increasing the cooling effect.

[0118] According to a semiconductor circuit breaker according to one embodiment of the present invention, a cooling plate through which cooling water flows is provided at the lower portion of the switching unit and the air gap switch, thereby effectively cooling the circuit.

[0119] The coolant plate occupies less space, resulting in an overall volume reduction.

[0120] The coolant plate is exposed to the outside, providing excellent assembly and easy maintenance.

[0121] Additionally, if a cooling fan is installed, the cooling effect is increased and heat is dissipated well to the outside of the device.

[0122] That is, since it has a cooling device that combines water cooling and air cooling, the cooling effect is maximized.

[0123] <Example 3>

[0124] Figures 13 and 14 illustrate perspective and side views of a semiconductor circuit breaker according to another aspect of the present invention. Figure 15 illustrates a circuit diagram of a semiconductor circuit breaker according to another aspect of the present invention.

[0125] A semiconductor circuit breaker (100) according to another aspect of the present invention comprises: a switching unit (120) provided at the lower portion of an outer case (101) having an open lower surface and including a power semiconductor element; and a cooling water housing (180) coupled to the lower portion of the switching unit (120) and having an open upper surface, characterized in that cooling water (w) accommodated in the cooling water housing (180) flows while contacting the lower surface of the switching unit.

[0126] The outer case (101) can be formed in a roughly rectangular box shape. The outer case (101) can be manufactured from an insulating material such as a synthetic resin material to insulate it from the outside. The outer case (101) supports internal components such as a switching unit (120) or an electric circuit unit (130) and protects them from the outside.

[0127] The lower surface of the outer case (101) is open. That is, the outer case may have a form in which the upper surface and the front, rear, left, and right sides are closed and the lower surface is open. Accordingly, the lower surface of the switching unit (120) may be exposed to the outside.

[0128] The outer case (101) is provided with ventilation holes on the front or rear. Fig. 3 shows that a first ventilation hole (103) is formed on the rear of the outer case. However, these ventilation holes may be provided on each side of the outer case (101) as needed.

[0129] Let us examine the components placed inside the outer case (101).

[0130] A switching unit (120) is placed within the housing (101). The switching unit (120) includes a power semiconductor switch. The power semiconductor switch may be a MOSFET (Metal Oxide Semiconductor Field Effect transistor) or an IGBT (Insulated Gate Bipolar Transistor).

[0131] Power semiconductor switches are widely used in systems requiring rapid interruption. While conventional mechanical circuit breakers have a tripping speed of several to several hundred milliseconds, semiconductor circuit breakers can interrupt current in a much shorter time, reaching only tens of μs.

[0132] Therefore, it can be applied to distribution panels with large current capacity, DC systems with fast increase rates of fault current, or ESS (Energy Storage System) systems that require stable current supply and interruption.

[0133] A first base plate (110) is provided at the bottom of the switching unit (120).

[0134] An electric circuit section (130) is provided on the upper part of the switching unit (120). Alternatively, the switching unit (120) may be installed on a part of the electric circuit section (130).

[0135] The electric circuit (130) is composed of a gate driver (not shown), a controller (133), a snubber (135), a metal oxide varistor (MOV) (137), a transient voltage suppressor (TVS), etc.

[0136] The gate driver provides the voltage required by the switching unit (120). For this purpose, a separate power circuit and current buffer may be provided. The gate driver is also called a driving driver.

[0137] Additionally, gate drivers electrically isolate and transmit signals between high-voltage power circuits and low-voltage control circuits. Therefore, gate drivers provide greater safety and reliability for driving semiconductor switches.

[0138] The controller (133) connects and controls each part within the circuit. The controller (133) determines overcurrent or fault current based on the current size received from the current sensor (132), and can operate the switching unit (120) and the air gap switch (140) accordingly. The controller (133) can operate the air gap switch (140) through the first driver (134a) and operate the switching unit (120) through the second driver (134b). (See Fig. 5)

[0139] Here, the current sensor (132) is installed in a part of the main circuit. In Fig. 6, the current sensor (132) can be placed at any of the positions ①, ②, and ③. That is, the current sensor (132) can be installed at the front or rear end of the air gap switch (140), or at the front or rear end of the switching unit (120).

[0140] In semiconductor circuit breakers, a protection circuit (safety circuit) or safety element is applied to protect the semiconductor switch from damage caused by high voltages generated during semiconductor switching. A snubber circuit is an example of such a protection circuit. Typically, a protection circuit protects the semiconductor switch by reducing the voltage generated during switching in a semiconductor circuit breaker.

[0141] Examples of snubber circuits include capacitor (C) snubbers, resistor-capacitor (RC) snubbers, charge-discharge type resistor-capacitor-diode (RCD) snubbers, and discharge-suppressing type snubber circuits.

[0142] Additionally, depending on the system, an MOV (Metal Oxide Varistor) (137) may be additionally configured as a protection element. The MOV is a component used for surge protection, and is applied to a part of the circuit to prevent damage to semiconductor switches caused by surge voltage. The MOV is a varistor composed of zinc oxide, and is a transient voltage blocking element that allows current to flow when a potential exceeding a set value occurs. When an MOV element is applied, there is no need to install a separate fuse inside the circuit.

[0143] The above-described protection circuits or protection elements can be provided as protection modules that can be detached from the electrical circuit unit (130). If the protection elements are independently configured as protection modules, maintenance becomes easier. That is, in the event of a failure of the protection module, only the protection module needs to be replaced.

[0144] An air gap switch (140) is arranged. The air gap switch (140) is a mechanical switch. The air gap switch (140) may be configured as a traditional mechanical switch having a contact portion composed of a fixed contact and a movable contact. In the air gap switch (140), when current is supplied, the movable contact is connected to the fixed contact, and when current is cut off, the movable contact is separated from the fixed contact, thereby mechanically cutting off the circuit. Since direct current does not have a current zero point, when a small current flows in the circuit, it may be difficult to cut off the current in some cases. In such cases, in order to completely cut off the current, it is necessary to mechanically cut off the circuit.

[0145] The air gap switch (140) is placed at the front or rear of the switching unit (120). Here, it is preferable that the air gap switch (140) be placed on the power source (80) side. This is because, when the power source is cut off, the circuit can be isolated from the vicinity of the power source, thereby protecting the cutoff unit, other components, and the load (90).

[0146] However, a lot of heat is generated at the contact point of the air gap switch (140). Therefore, a device for cooling the heat of the air gap switch (140) and the switching unit (120) is required.

[0147] A second base plate (145) may be provided at the bottom of the air gap switch (140).

[0148] A coolant housing (180) is provided below the switching unit (120) and the air gap switch (140). The coolant housing (180) may be formed in the shape of a rectangular parallelepiped with an open upper surface. Fig. 6 illustrates a perspective view of the coolant housing (180).

[0149] The coolant housing (180) may be formed of a synthetic resin or a metal material. If the coolant housing (180) is formed of a metal material, it is preferably manufactured from a material with excellent thermal conductivity, such as aluminum (Al) or copper (Cu). Accordingly, the heat of the coolant (w) can be quickly released to the outside.

[0150] The coolant housing (180) is coupled to the first base plate (110) forming the lower portion of the switching unit (120). In addition, the coolant housing (180) may be extended and coupled to the second base plate (145) forming the lower portion of the air gap switch (140).

[0151] The coolant housing (180) can be joined to the base plate (110, 145) by adhesive or mechanical joining. Examples of mechanical joining methods include fitting or screw joining.

[0152] The surfaces where the coolant housing (180) and the base plate (110, 145) come into contact with each other have corresponding shapes and sizes. That is, the upper surface of the coolant housing (180) and the lower surface of the base plate (110, 145) have corresponding shapes.

[0153] For example, the upper surface of the coolant housing (180) and the lower surface of the base plate (110, 145) are formed as flat surfaces. The base plates (110, 145) are each formed as flat surfaces. The upper surface of the coolant housing (180) is open, and each side portion (184) is exposed. The upper portions of each side portion (184) are formed at the same height.

[0154] A fastening hole (183) is formed at each corner of the coolant housing (180) so that it can be fastened to the base plate (110, 145) by a fastening member.

[0155] A coolant receiving portion (185) is provided in the coolant housing (180). The coolant receiving portion (185) occupies most of the volume of the coolant housing (180). Coolant (w) is received and flows in the coolant receiving portion (185).

[0156] The coolant housing (180) is made of a material with high thermal conductivity and releases heat from the switching unit (120) transmitted through the base plate (110).

[0157] The coolant housing (180) is positioned at the bottom of the outer case (101). The coolant housing (180) is not positioned inside the outer case (101), but is positioned at the bottom of the outer case (101) and exposed to the outside air. Accordingly, the heat dissipation reduction factor is reduced. This effect is further enhanced when the bottom of the outer case (101) is opened.

[0158] Since the lower surface of the outer case (101) is open, the coolant housing (180) is directly coupled to the switching unit (120) or the air gap switch (140). Of course, if there is a base plate (110, 145), it is coupled to the base plate (110, 145) of the coolant housing (180).

[0159] The coolant housing (180) has a sufficient size to quickly absorb the heat of the base plate (110, 145). For example, the coolant housing (180) may be formed to have a size corresponding to the area of ​​the base plate (110, 145) or a size greater than the area of ​​the base plate (110, 145).

[0160] A coolant receiving portion (185) is formed in the coolant housing (180). Coolant (w) flows into and out of the coolant receiving portion (185). The coolant housing (180) has an open upper surface. That is, the coolant receiving portion (185) has an open upper surface. Therefore, the coolant (w) rises to the upper surface of the coolant housing (180). Therefore, the coolant (w) directly contacts the lower surface of the base plate (110, 145) and absorbs heat from the switching unit (120) or the air gap switch (140). Since the coolant (w) directly contacts the switching unit (120) or the air gap switch (140), heat transfer is maximized.

[0161] Cooling water (w) is stored and flows inside the cooling water housing (180). The cooling water housing (180) has an inlet (181) and an outlet (182). The inlet (181) and the outlet (182) are arranged on one surface of the cooling water housing (180). Alternatively, the inlet (181) and the outlet (182) are arranged on different surfaces of the cooling water housing (180), respectively. Preferably, the inlet (181) and the outlet (182) are formed on opposite surfaces of the cooling water housing (180), so as to form a flow path through which the cooling water (w) flows in a straight line.

[0162] According to a semiconductor circuit breaker according to another aspect of the present invention, a cooling water housing (180) is provided at the bottom of the switching unit and the air gap switch in which cooling water is received and flows, so that cooling occurs effectively.

[0163] The cooling water housing (180) has an open top surface so that the cooling water comes into direct contact with the switching unit, thereby causing heat transfer, thereby maximizing the cooling effect.

[0164] This type of water-cooled heat dissipation system takes up significantly less space than air-cooled systems, such as cooling fans.

[0165] Additionally, since the coolant housing (180) is exposed to the outside of the outer case (101), maintenance is easy.

[0166] Fig. 17 shows a perspective view of a packing member (190).

[0167] A packing member (190) is provided between the coolant housing (180) and the base plate (110, 145) to ensure sealing from the outside. The packing member (190) is also called a gasket.

[0168] The packing member (190) can be formed of a soft material such as rubber.

[0169] The packing member (190) can be formed in a shape similar to that of the upper surface of the coolant housing (180). The packing member (190) is formed of a thin plate material. An open hole (192) is formed in the packing member (190). The open hole (192) occupies most of the area of ​​the packing member (190).

[0170] The width of the panel surface (191) of the packing member (190) can be formed to be larger than the thickness of the side surface (184) of the coolant housing (180). Accordingly, the pressing surface for the base plate (110, 145) increases, so that pressing occurs well and assembly is easy.

[0171] A fastening hole (193) corresponding to the fastening hole (183) of the coolant housing (180) is formed at each corner of the packing member (190).

[0172] <Example 4>

[0173] Figures 18 and 19 illustrate a semiconductor circuit breaker having a water-cooled heat dissipation system according to another embodiment of the present invention. Figure 8 is a perspective view and Figure 9 is a side view.

[0174] A switching unit (120), an electric circuit unit (130), an air gap switch (140), etc. are arranged in the outer case (101). The switching unit (120), the electric circuit unit (130), and the air gap switch (140) arranged in the outer case (101) may refer to the previous embodiment.

[0175] The lower portions of the base plates (110, 145) are each provided with fins (115). The fins (115) are formed in a plurality of protruding shapes on the lower surface of the base plates (110, 145) in the shape of needles or chips.

[0176] Since fins (115) are formed at the bottom of the base plate (110, 145) to increase the area in contact with the cooling water (w), heat transfer between the switching unit (120) and the cooling water (w) occurs more effectively.

[0177] According to the semiconductor circuit breaker according to the present embodiment, a cooling water housing (180) is provided at the bottom of the switching unit and the air gap switch in which cooling water is received and flows, so that cooling occurs effectively.

[0178] The cooling water housing (180) has an open top surface so that the cooling water comes into direct contact with the switching unit, thereby causing heat transfer, thereby maximizing the cooling effect.

[0179] This type of water-cooled heat dissipation system takes up significantly less space than air-cooled systems, such as cooling fans.

[0180] In particular, in this embodiment, a fin (115) is formed at the bottom of the base plate (110, 145) to increase the area in contact with the cooling water (w), so that heat transfer between the switching unit (120) and the cooling water (w) occurs more effectively.

[0181] <Example 5>

[0182] FIGS. 20 and 21 illustrate a semiconductor circuit breaker according to another embodiment of the present invention.

[0183] A switching unit (120), an electric circuit unit (130), an air gap switch (140), etc. are arranged in the outer case (101). The switching unit (120), the electric circuit unit (130), and the air gap switch (140) arranged in the outer case (101) may refer to the previous embodiment.

[0184] In this embodiment, the lower surface of the housing (101) is only partially open. An opening (102) that is only partially open is formed on the lower surface of the housing (101). Here, the opening (102) is provided in a specific portion of the switching unit (120). For example, the opening (102) is provided corresponding to a portion where the power semiconductor element (125) of the switching unit (120) is arranged.

[0185] A portion of the base plate (110) is exposed through the opening (102). Here, an example in which the first base plate (110) of the switching unit (120) is exposed is shown.

[0186] A portion of the base plate (110) that contains a power semiconductor element (125) may be exposed.

[0187] A coolant housing (180-1) is coupled to the opening (102). The coolant housing (180-1) is formed to correspond to the size and shape of the opening (102).

[0188] At this time, a packing member (190-1) may be provided between the opening (102) and the cooling water housing (180-1). Here, the packing member (190) is also formed to correspond to the size and shape of the opening (102).

[0189] Since the coolant housing (180-1) is formed to be relatively smaller than in the previous embodiments according to the size of the opening (102), the weight can be reduced. In addition, since it is installed in a concentrated manner in the area where heat is released, the heat transfer effect is increased and the required coolant capacity is reduced.

[0190] In addition, the time that the coolant flowing in the coolant housing (180) remains in the coolant receiving portion (185) is shortened, so heat transfer occurs more effectively.

[0191] In this embodiment, the lower surface of the outer case (101) is not completely open, but is locally formed in a part where a lot of heat is generated, thereby reducing the size of the water-cooled heat dissipation system and effectively achieving a heat dissipation effect.

[0192] According to the semiconductor circuit breaker according to each embodiment of the present invention, a water-cooling heat dissipation system in which cooling water flows under the switching unit and the air gap switch is provided, so that cooling occurs effectively.

[0193] The water-cooled heat dissipation system maximizes cooling effect because the cooling water flowing in the open-top cooling water housing directly contacts the switching unit, thereby causing heat transfer.

[0194] Water-cooled heat dissipation systems take up significantly less space than air-cooled systems, which require cooling fans and other equipment.

[0195] Additionally, the water-cooled heat dissipation system is exposed to the outside of the enclosure, making maintenance easy.

[0196] The embodiments described above are embodiments that implement the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. In other words, the protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included within the scope of the rights of the present invention.

[0197] [Explanation of symbols]

[0198] 100 semiconductor circuit breakers

[0199] 101 Outer Case

[0200] 103 First ventilation hole

[0201] 104 Second ventilation hole

[0202] 110 base plate

[0203] 120 switching units

[0204] 130 Electrical Circuit Section

[0205] 140 air gap switch

[0206] 150 Coolant Plate

[0207] 160 coolant euros

[0208] 170 cooling fan

[0209] 180 Coolant Housing

[0210] 190 Packing Absence

Claims

1. Switching unit installed in the outer case; An air gap switch provided in the above enclosure and arranged on one side of the switching unit; A base plate forming the lower portion of the above switching unit; A semiconductor circuit breaker comprising a cooling water plate coupled to the base plate and having a cooling water passage through which cooling water flows.

2. In paragraph 1, A semiconductor circuit breaker characterized in that a polygonal protrusion or groove is formed on the upper surface of the cooling plate, and a groove or protrusion corresponding to the protrusion or groove is formed on the lower surface of the base plate.

3. A semiconductor circuit breaker according to claim 1, characterized in that the lower surface of the outer case is open.

4. In paragraph 1, The above cooling water passage has an inlet and an outlet, A semiconductor circuit breaker characterized in that the inlet and outlet are arranged together on one side of the cooling water plate or are arranged on different sides.

5. In paragraph 4, A semiconductor circuit breaker characterized in that the cooling water passage includes a reservoir formed between the inlet and the outlet.

6. A semiconductor circuit breaker characterized in that, in the fourth paragraph, the cooling water passage is formed by a straight portion and a curved portion extending to both ends of the straight portion, and is formed so that a constant flow rate is maintained from the inlet to the outlet.

7. A semiconductor circuit breaker characterized in that, in the 6th paragraph, an extension portion having a larger diameter than other portions is formed in the straight portion or the curved portion.

8. In paragraph 1, A semiconductor circuit breaker characterized in that a plurality of fins are protruded and formed on the lower portion of the cooling water plate.

9. A semiconductor circuit breaker according to claim 8, characterized in that a cooling fan is provided at the bottom of the cooling water plate.

10. A switching unit provided at the bottom of an open case and including a power semiconductor element; and It includes a cooling water housing coupled to the lower part of the switching unit and having an open upper surface, A semiconductor circuit breaker characterized in that the cooling water accommodated in the cooling water housing flows while contacting the lower surface of the switching unit.

11. In paragraph 10, A semiconductor circuit breaker characterized in that a base plate is provided at the bottom of the above switching unit.

12. In paragraph 10, A semiconductor circuit breaker characterized in that the above cooling water housing is provided with a cooling water receiving portion for receiving cooling water.

13. In paragraph 10, A semiconductor circuit breaker characterized in that a fastening hole is formed at each corner of the above cooling water housing.

14. In paragraph 10, A semiconductor circuit breaker characterized in that the above cooling water housing is formed with an inlet and an outlet.

15. In paragraph 14, A semiconductor circuit breaker characterized in that the inlet and outlet ports are formed on opposite sides of the cooling water housing.

16. In paragraph 14, A semiconductor circuit breaker characterized in that the cooling water housing is exposed to the outside of the outer case.

17. In paragraph 10, A semiconductor circuit breaker characterized in that a packing member having an open hole is provided between the cooling water housing and the base plate.

18. In paragraph 11, A semiconductor circuit breaker characterized in that a plurality of fins are formed protrudingly on the lower portion of the base plate.

19. In paragraph 10, An opening is formed on the lower surface of the above outer case, which is only partially open, and a part of the switching unit is exposed through the opening. A semiconductor circuit breaker characterized in that the cooling water housing is coupled to the opening.

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