Electronic device including heat dissipation structure for providing heat transfer path

Abstract

Disclosed is an electronic device. The electronic device comprises: a first shield can that provides a first space configured to accommodate a component; a second shield can that is spaced apart from the first shield can and provides a second space; a heat dissipation structure which includes a heat dissipation material and of which one end is connected to the first shield can and the other end is connected to the second shield can; and a heat dissipation structure that includes a thermal conductive material and is disposed in at least a portion of an inner space of the heat dissipation structure, extends from the one end of the heat dissipation structure to at least one surface of the component, and extends from the other end of the heat dissipation structure into the second space. The heat generated from the component spreads in the direction of the second shield can through the thermal conductive material.

Description

An electronic device comprising a heat dissipation structure providing a heat transfer path

[0001] The present disclosure relates to a heat dissipation structure that provides a heat transfer path.

[0002] Electronic components embedded within electronic devices can generate heat during their operation. To reduce the temperature of the electronic components, which increases due to the generated heat, a heat dissipation path can be formed between the electronic components and a cooling area with a temperature lower than the electronic components themselves.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a component, a first shield can, a second shield can, and a heat dissipation structure. The component may be configured to dissipate heat during operation of the electronic device. The first shield can may provide a first space for accommodating the component and may have an opening. The second shield can may be spaced apart from the first shield can, provide a second space, and may have an opening. The heat dissipation structure may include a case and a thermally conductive material having viscosity. The thermally conductive material may include a first thermally conductive material, a second thermally conductive material, and a third thermally conductive material. The first thermally conductive material may be disposed within the case. The second thermally conductive material may extend from the first thermally conductive material to the component through the opening of the first shield can. The third thermally conductive material may extend from the first thermally conductive material through the opening of the second shield can into the second space. The thermally conductive material may be configured to thermally connect the component to the interior of the second shield can.

[0005] An electronic device is disclosed. The electronic device may include a substrate, a component, a shield can, a cooling region, and a heat dissipation structure. The component is disposed on the substrate and may dissipate heat during operation of the electronic device. The shield can may be disposed on the substrate. The shield can may enclose at least a portion of the component. The shield can may include an open region formed in a side wall. The cooling region may be spaced apart from the shield can. The cooling region may be configured to absorb the heat. The heat dissipation structure may include a thermally conductive material having viscosity therein. At least a portion of the heat dissipation structure may be disposed within the shield can through the open region. The heat dissipation structure may extend from the shield can to the cooling region. The thermally conductive material may extend from one end of the heat dissipation structure to contact one surface of the component. The thermally conductive material may extend from another end of the heat dissipation structure to be disposed in the cooling region.

[0006] Aspects, features and advantages of embodiments of the present disclosure will become apparent from the detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a diagram illustrating an electronic device according to various embodiments.

[0008] FIG. 2 is an exploded perspective view of an electronic device according to various embodiments.

[0009] FIG. 3 is a diagram illustrating a printed circuit board within an exemplary electronic device according to various embodiments.

[0010] FIG. 4A is a drawing showing the arrangement of an exemplary shield candle and heat dissipation structure according to various embodiments.

[0011] FIG. 4b is a cross-sectional view illustrating an exemplary shield candle and heat dissipation structure according to various embodiments.

[0012] FIGS. 5A and 5B are perspective views illustrating exemplary heat dissipation structures according to various embodiments.

[0013] FIG. 6 is a cross-sectional view of an exemplary shield candle and a heat dissipation structure disposed on a component within the shield can, according to various embodiments.

[0014] FIG. 7 is a perspective view of an exemplary heat dissipation structure having a vent facing a component, according to various embodiments.

[0015] FIG. 8 is a diagram illustrating an exemplary application operation of a heat transfer material transmitted through an exemplary heat dissipation structure according to various embodiments.

[0016] FIG. 9 is a diagram showing a heat transfer path emitted from components inside a shield can according to various embodiments.

[0017] FIG. 10 is a drawing showing the arrangement of shield candles, components, and heat dissipation structures according to various embodiments.

[0018] FIG. 11 is a drawing showing the arrangement of shield candles, elements, and vertically folded heat dissipation structures according to various embodiments.

[0019] FIG. 12 is a block diagram illustrating an exemplary electronic device within a network environment according to various embodiments.

[0020] FIG. 1 is a diagram illustrating an exemplary electronic device according to various embodiments.

[0021] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0022] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0023] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0024] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0025] When the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0026] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0027] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and / or a connector hole (103). In another embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

[0028] In one embodiment, the display (101) (e.g., the display module (1260) of FIG. 12) may be visible or visibly exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0029] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area in which the display (101) is visible or visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0030] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. In another embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0031] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

[0032] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (1280) of FIG. 12) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0033] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0034] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (1270) of FIG. 12) may include a microphone hole (103, 104) and a speaker hole (107).

[0035] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0036] In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0037] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0038] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0039] In one embodiment, a sensor module (not shown) (e.g., sensor module (1276) of FIG. 12) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (1280) of FIG. 12) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0041] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

[0042] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0043] In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0044] In one embodiment, a key input device (117) (e.g., input module (1250) of FIG. 12) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0045] In one embodiment, a connector hole (103) may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (1278) of FIG. 12) electrically connected to the connector of the external device may be arranged within the connector hole (103). The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (1277) of FIG. 12) for processing electrical signals transmitted and received through the connection terminal.

[0046] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0047] FIG. 2 is an exploded perspective view of an electronic device according to various embodiments.

[0048] Hereinafter, duplicate descriptions of configurations having the same reference numerals as the configurations described above may not be repeated.

[0049] Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0050] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 2) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., side surface (100C) of FIG. 2) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0051] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). For another example, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0052] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0053] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0054] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). Through this, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent or suppress detachment of a connector coupled to the first printed circuit board (150).

[0055] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0056] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0057] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0058] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0059] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., processor 1220 of FIG. 12), memory (e.g., memory 1230 of FIG. 12), and / or an interface (e.g., interface 1277 of FIG. 12). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0060] In one embodiment, a battery (170) (e.g., battery (1289) of FIG. 12) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0061] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (1297) of FIG. 12). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0062] In one embodiment, a first camera module (105) (e.g., a front camera) may be positioned on at least a portion of a frame structure (140) (e.g., a support portion (143)) such that the lens can receive external light through a portion of the front plate (102) (e.g., the front (100A) of FIG. 2).

[0063] In one embodiment, a second camera module (112) (e.g., a rear camera) may be disposed between the frame structure (140) and the rear plate (111). In one embodiment, the second camera module (112) may be electrically connected to the first printed circuit board (150) via a connecting member (e.g., a connector). In one embodiment, the second camera module (112) may be disposed such that the lens can receive external light through the camera area (184) of the rear plate (111) of the electronic device (100).

[0064] In one embodiment, the camera area (184) may be formed on a surface of the rear plate (111) (e.g., the rear surface (100B) of FIG. 2). In one embodiment, the camera area (184) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (112). In one embodiment, at least a portion of the camera area (184) may protrude from the surface of the rear plate (111) by a predetermined height. However, the present invention is not limited thereto, and in one embodiment, the camera area (184) may form a plane substantially coextensive with the surface of the rear plate (111).

[0065] In one embodiment, the housing (110) of the electronic device (100) may exemplarily refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0066] FIG. 3 is a diagram illustrating a printed circuit board within an exemplary electronic device according to various embodiments.

[0067] An electronic device (100) may include a heat transfer system that dissipates heat generated (or emitted) from heat-generating components of the electronic device (100) to the outside. The heat transfer system of the electronic device (100) may thermally connect the heat-generating components and a structure of the electronic device to spread heat through the structure. The structure may include a surface area for dissipating heat. For example, the heat-generating components may be an integrated circuit (IC) such as a processor or a chip, and the structure may be a component (e.g., a frame, a bracket, or a case) that forms the exterior of the electronic device or supports internal components.

[0068] A heat transfer system can dissipate heat generated from a heat-generating component to the structure through a heat dissipating structure. The heat dissipating structure can provide a heat diffusion path from the heat-generating component to the structure.

[0069] Since the electronic device (100) includes many high-performance components, the electronic device (100) may include a plurality of heat dissipation structures (330, 340) to separate heat diffusion paths between the heat-generating components.

[0070] Referring to FIG. 3, the electronic device (100) may include a printed circuit board (150) disposed within a housing (110).

[0071] The electronic device (100) may further include components (e.g., electronic components) (311, 312, 321, 351), a first shield can (310), a second shield can (320), and a heat dissipation structure (330). In order to miniaturize the electronic device (100) and implement multiple functions, many components (311, 312, 321, 351) may be arranged on a printed circuit board (150). The electronic device (100) may further include a shield can (310, 320) to shield noise between the components (311, 312, 321, 351). Components (311, 312, 321, 351), the first shield can (310), and the second shield can (320) may be placed on a printed circuit board (150). The heat dissipation structure (330) may be supported by the first shield can (310) and the second shield can (320). For example, one end of the heat dissipation structure (330) may be connected to the first shield can (310), and the other end of the heat dissipation structure (330) may be connected to the second shield can (320).

[0072] The components (311, 312, 321, 351) may emit or generate heat during the operation of the electronic device (100). For example, during the operation of the electronic device (100), the components (311, 312, 321, 351) may generate heat, and the generated heat may be released. Some of the components (311, 312, 321, 351) may be placed within the shield candles (310, 320). For example, the first component (311) and the second component (312) may be placed in a cavity within the first shield can (310). The third component (321) may be placed in a cavity within the second shield can (320). The first component (311) and the second component (312) may emit or generate more heat than the other components (351). For example, the first component (311) and the second component (312) may be an integrated circuit (IC), a chip, a heat-generating component, an application processor (AP), a communication processor (CP), or a power management integrated circuit (PMIC). The component (351) may assist the operation of the components (311, 312, 321). The component (351) may be a device disposed outside the shield candle (310, 320). For example, the component (351) may be at least one of a capacitor, an inductor, or a resistor.

[0073] For example, components (351) may be placed around the first component (311). Passive components such as resistors, capacitors, or inductors may be placed around high-performance components such as the first component (311). Components that dissipate a lot of heat, such as the first component (311) or the second component (312), may be positioned at the periphery of the printed circuit board (150) or the periphery of the space enclosed by the shield can (310). For example, the first component (311) or the second component (312) may be placed adjacent to a side wall of the shield can (310) within the internal space defined by the shield can (310).

[0074] The first shield can (310) can surround some of the components arranged on the printed circuit board (150). For example, the first shield can (310) can provide a space capable of accommodating at least one component. For example, the first shield can (310) can provide a space in which the first component (311) and the second component (312) are arranged. The first shield can (310) can surround the first component (311) and the second component (312). The second shield can (320) can surround other components arranged on the printed circuit board (150). For example, the second shield can (320) can provide a space in which the third component (321) is arranged. The second shield can (320) can surround the third component (321).

[0075] The first shield can (310) and the second shield can (320) may include a metal material. The first shield can (310) and the second shield can (320) may be formed of a metal plate. The first shield can (310) and the second shield can (320) may be metal cases formed from a metal plate through a pressing process having an internal space. The first shield can (310) and / or the second shield can (320) may include a nickel-silver (nickel-brass) material, a copper alloy, and / or stainless steel. The first shield can (310) and the second shield can (320) formed of a metal material can prevent or reduce external noise signals or electromagnetic waves from being transmitted into the first shield can (310) and the second shield can (320), and the first shield can (310) and the second shield can (320) can prevent or reduce electromagnetic waves generated by components (311, 312, 321) inside the first shield can (310) and the second shield can (320) from being transmitted to the outside of the first shield can (310) or the outside of the second shield can (320). For example, the first shield can (310) and the second shield can (320) can block noise transmitted from external components in order to provide stable operation of the components inside the shield cans. The first shield can (310) can block electromagnetic waves resulting from the operation of other components (321, 351) from being transmitted into the first shield can (310) for the operation of the first component (311) and the second component (312) arranged in the internal space of the first shield can (310). The second shield can (320) can block electromagnetic waves resulting from the operation of other components (311, 312, 351) from being transmitted into the second shield can (320) for the operation of the third component (321) arranged in the internal space of the second shield can (320).

[0076] The electronic device (100) may further include a heat transfer material, a heat transfer structure, or a heat dissipation structure to provide a diffusion path for heat generated from the components (311, 312, 321). For example, the electronic device (100) may include a first heat dissipation structure (330) for the component (311) and / or a heat dissipation structure (340) for the second component (312). Each of the heat generated from the first component (311) and the second component (312) may be transferred along an independent path. The heat dissipation structure (330) for the first component (311) may connect the shield candles (310, 320). For example, one end of the heat dissipation structure (330) may be connected to the first shield can (310), and the other end of the heat dissipation structure (330) may be connected to the second shield can (320). The heat dissipation structure (330) may include a thermally conductive material or a heat transfer material therein. The thermally conductive material may be a liquid or gel mixed with particles having high thermal conductivity. The thermally conductive material may have viscosity. For example, the thermally conductive material may include thermal grease. The heat dissipation structure (330) may be thermally connected to the first component (311) inside the first shield can (310). The heat dissipation structure (330) may be thermally connected to the inside of the second shield can (320). The heat dissipation structure (330) can diffuse heat generated from the first component (311) into the interior of the second shield can (320).

[0077] The heat dissipation structure (340) can be thermally connected to the second component (312) within the first shield can (310). The heat dissipation structure (340) can be thermally connected to a cooling area within the electronic device (100). The cooling area can include at least one of a housing (110) of the electronic device (100), a portion of a frame structure (e.g., a frame structure (140) of FIG. 1) (e.g., a support portion (143) of FIG. 2), or an area having no or few heat-generating components. The heat dissipation structure (340) can be thermally connected to the second component (312) via a heat transfer material (e.g., thermal grease, a thermal interface material (TIM), or a nano TIM). The heat dissipation structure (340) may include one of a plate having a thermally conductive material (e.g., a graphite sheet), a metal plate, a structure including a phase change material therein (e.g., a heat pipe), or a vapor chamber. The heat dissipation structure (340) may transfer heat generated from the second component (312) to the cooling region, thereby diffusing it to the outside of the electronic device (100). The first component (311) and the second component (312) within the first shield can (310) may separate the heat dissipation paths. Due to the separated heat dissipation paths, the influence of heat between the first component (311) and the second component (312) may be reduced.

[0078] Since the first component (311) is positioned adjacent to the side of the first shield can (310) and there is insufficient space for application of the heat dissipation structure, it may be difficult for the first component (311) to dissipate heat through a heat pipe or metal plate, such as the heat dissipation structure (340) for the second structure (340). By contacting the first component (311) with a heat conductive material extending from the heat dissipation structure (330) including a heat conductive material (liquid TIM) therein, the first component (311) of the electronic device (100) can spread the generated heat to the second shield can (320).

[0079] The connection structure and heat diffusion path of the heat dissipation structure (330) and shield candle (310, 320) placed within the area P are described in more detail below with reference to FIGS. 4a to 10.

[0080] FIG. 4A is a diagram illustrating an exemplary arrangement of a shield candle and a heat dissipation structure according to various embodiments. FIG. 4B is a cross-sectional view illustrating an exemplary shield candle and a heat dissipation structure according to various embodiments.

[0081] FIG. 4A illustrates area P of FIG. 3 in more detail, and FIG. 4B illustrates a cross-section of the heat dissipation structure (330) and surrounding structures (e.g., the first shield can (310) and the second shield can (320)) of FIG. 4A in more detail. Referring to FIGS. 4A and 4B, the heat dissipation structure (330) may be disposed between the first shield can (310) and the second shield can (320). The first shield can (310) may provide a first space (410) that accommodates a first component (311). For example, the first shield can (310) may enclose the first component (311) and surrounding components. The first component (311) and surrounding components may be disposed within the first space (410). The first component (311) adjacent to the side (411) (or side wall) of the first shield can (310) may have difficulty in connecting to a heat dissipation structure (e.g., heat dissipation structure (340) of FIG. 3) connected to a second component (e.g., second component (312) of FIG. 3) due to insufficient space between the first shield can (310) and the first component (311). In order to spread the heat generated from the first component (311), the heat dissipation structure (330) may be connected to the first component (311), and the heat dissipation structure (330) may be connected to the second shield can (320). The heat dissipation structure (330) may transfer the heat generated from the first component (311) into the interior of the second shield can (320). The second shield can (320) can provide a second space ((420). For example, the second shield can (320) can surround components (e.g., the third component (321) of FIG. 3) placed inside.

[0082] The first shield can (310) may include an opening (412) for connection to the heat dissipation structure (330), and the second shield can (320) may include an opening (422) for connection to the heat dissipation structure (330).

[0083] The opening (412) of the first shield can (310) may be formed on at least one side of the first shield can (310). For example, the opening (412) may be formed on a side (411) of the first shield can (310) that faces the second shield can (320) or is close to the second shield can (320). The opening (412) may be formed on the side (411) and the upper surface (411') of the first shield can (310) that is in contact with the side (411). As one end of the heat dissipation structure (330) is inserted into the opening (412), the heat dissipation structure (330) may be supported on the side (411) of the first shield can (310). The opening (412) of the first shield can (310) may be spaced apart from the first component (311). For example, the first component (311) may overlap the first shield can (310) when one surface of the first component (311) that contacts the thermally conductive material (430) is viewed in a vertical direction. A portion of the upper surface (411') of the first shield can (310) may be placed on the first component (311).

[0084] The opening (422) of the second shield can (320) may be formed on at least one side of the second shield can (320). For example, the opening (422) may be formed on a side (421) of the second shield can (320) that faces the first shield can (310) or is close to the first shield can (310). The opening (422) may be formed on the side (421) and the upper surface (421') of the second shield can (320) that is in contact with the side (421). As the other end of the heat dissipation structure (330) is inserted into the opening (422), the heat dissipation structure (330) may be supported on the side (421) of the second shield can (320).

[0085] The heat dissipation structure (330) may further include a fastening structure for being fixed to the first shield can (310) and the second shield can (320). For example, the heat dissipation structure (330) may include a first leg set (416, 417) for being fastened to the first shield can (310). The heat dissipation structure (330) may include a second leg set (426, 427) for being fastened to the second shield can (320). The first leg set (416, 417) and the second leg set (426, 427) may limit movement of the heat dissipation structure (330) in the x-axis direction and the y-axis direction. For example, the legs (416, 417, 426, 427) of the first leg set (416, 417) and the second leg set (426, 427) may extend from the outer surface of the heat dissipation structure (330) toward the printed circuit board (150). The legs (416, 417, 426, 427) may extend in a direction perpendicular to the printed circuit board (150) and be fixed to the side surface (411) of the first shield can (310) and the side surface (421) of the second shield can (320). For example, the first leg set (416, 417) may be fitted to the side surface (411) of the first shield can (310). The second set of legs (426, 427) can be fitted to the side (421) of the second shield can (320). By the legs (416, 417, 426, 427) that extend perpendicularly to the printed circuit board (150) and are fixed to the shield can (310, 320), the heat dissipation structure (330) can be restricted from moving in a direction parallel to the printed circuit board (150).

[0086] The heat dissipation structure (330) may be formed of a metal material. The heat dissipation structure (330) may be formed of the same material as the shield candle (310, 320). For example, the heat dissipation structure (330) may include nickel silver, a copper alloy, and / or stainless steel. However, the present invention is not limited thereto, and the heat dissipation structure (330) may be formed of a different metal material from the shield candle.

[0087] The heat dissipation structure (330) may be formed integrally with the legs (416, 417, 426, 427). For example, the legs (416, 417, 426, 427) may be welded to the heat dissipation structure (330) at the area (w).

[0088] One of the legs of the first leg set (416, 417) may be joined to the heat dissipation structure (330), and one of the legs of the second leg set (426, 427) may be joined to the heat dissipation structure (330). For example, the leg (417) of the first leg set (416, 417) and the leg (426) of the second leg set (426, 427) may be joined to the heat dissipation structure (330). The legs (417) and (426) may be in contact with the outer surface of the first shield can (310) and the outer surface of the second shield can (320), thereby limiting movement of the heat dissipation structure (330). For another example, a leg (416) of the first set of legs (416, 417) and a leg (427) of the second set of legs (426, 427) may be joined to a heat dissipation structure (330). The legs (416) and (427) may be in contact with the inner surface of the first shield can (310) and the inner surface of the second shield can (320), thereby limiting movement of the heat dissipation structure (330).

[0089] The heat dissipation structure (330) may include a thermally conductive material (430) that occupies at least a portion of the internal space of the heat dissipation structure (330), extends from the heat dissipation structure (330) to contact the first component (311), and extends from the heat dissipation structure (330) to be disposed in a second space (420) of a second shield can (320). The heat dissipation structure (330) may further include an inlet (401), a first opening (402), and a second opening (403). The inlet (401) may be an opening for supplying a thermally conductive material (430) (e.g., liquid TIM or thermal grease) into the interior of the heat dissipation structure (330). The inlet (401) may include a valve for reducing backflow of the thermally conductive material (430) introduced into the interior of the heat dissipation structure (330). The injection port (401) may be arranged between the first opening (402) and the second opening (403). The first opening (402) and the second opening (403) may be arranged at both ends of the heat dissipation structure (330). Using the first opening (402) and the second opening (403), the amount of the thermally conductive material (430) introduced through the injection port (401) may be confirmed. When the thermally conductive material (430) is injected through the injection port (401) and moves to both ends of the heat dissipation structure, the thermally conductive material (430) injected through the first opening (402) and the second opening (403) may be identified from the outside of the heat dissipation structure (330). Based on the thermally conductive material (430) identified from the outside, the thermally conductive material (430) introduced into the shield candle (310, 320) can be confirmed.

[0090] The thermally conductive material (430) may include a first portion (431) disposed in at least a portion of the internal space of the heat dissipation structure (330), a second portion (432) extending from one end of the heat dissipation structure (330) to at least one surface of the first component (311), and a third portion (433) extending from the other end of the heat dissipation structure (330) to the second space (420) of the second shield can (320). The thermally conductive material (430) may be thermally connected to the first component (311). Heat generated from the first component (311) may diffuse to the second space (420) through the thermally conductive material (430).

[0091] The second portion (432) may be a portion where the thermally conductive material (430) introduced through the injection port (401) comes into contact with one surface (e.g., the upper surface) of the first component (311) through an outlet formed at one end of the heat dissipation structure (330). The third portion (433) may be a portion where the thermally conductive material (430) introduced through the injection port (401) comes into contact with the second space (420) through an outlet formed at the other end of the heat dissipation structure (330). The third portion (433) may be placed on a component that does not generate heat or generates little heat within the second space (420). The third portion (433) may be placed on a surface of a printed circuit board (150) that does not have a component within the second space (420). The third portion (433) may contact a part of the second shield can (320) to spread heat to the second shield can (320).

[0092] The tape (450) may be attached to a portion of the outer surface of the first shield can (310), a portion of the outer circumference of the heat dissipation structure (330), and a portion of the outer surface of the second shield can (320). The tape (450) may extend along the outer surface of the first shield can (310), the outer surface of the second shield can (320), and the outer circumference of the heat dissipation structure (330). The outer surface of the first shield can (310), the outer surface of the second shield can (320), and the outer circumference of the heat dissipation structure (330), along which the tape (450) extends, may be substantially continuous surfaces. The tape (450) may be attached to the continuous surfaces to fix the heat dissipation structure to the first shield can and the second shield can. The tape (450) may restrict movement of the heat dissipation structure (330) in the z-axis direction. The tape (450) can reduce or prevent leakage of the thermally conductive material (430) inside the heat dissipation structure (330). The tape (450) can be attached to the outer surface of the heat dissipation structure (330) to isolate the inside and the outside of the heat dissipation structure (330). For example, the tape (450) can wrap the injection port (401), the first opening (402), and the second opening (403).

[0093] The tape (450) may include a conductive material. The tape (450) may be grounded by the conductive material. The tape (450) acting as a ground may improve the shielding performance of the first shield can (310) and the second shield can (320).

[0094] In order to strengthen the fastening force between the heat dissipation structure (330) and the first shield can (310), an adhesive may be placed between the heat dissipation structure (330) and the opening (412) of the first shield can (310). In order to strengthen the fastening force between the heat dissipation structure (330) and the second shield can (320), an adhesive may be placed between the heat dissipation structure (330) and the opening (422) of the second shield can (320).

[0095] According to the above-described embodiment, by including the injection port (401), the first opening (402), and the second opening (403), the heat dissipation structure (330) can transfer a heat transfer material to the first component (311) and the second space (420) after being fixed to the first shield can (310) and the second shield can (320). By diffusing heat generated from the component (311) to the second space (420) through the transferred heat transfer material, stable performance of the electronic device (100) can be maintained.

[0096] FIGS. 5A and 5B are perspective views illustrating exemplary heat dissipation structures according to various embodiments. Referring to FIG. 5A, the heat dissipation structure (330) may include a case (500). The case (500) may have a hollow hole. The case (500) may be a pipe with both ends open. The case (500) may provide an inflow path for a thermally conductive material (e.g., the thermally conductive material (430) of FIG. 4B) introduced through an inlet (401). For example, the case (500) may guide the movement of the thermally conductive material.

[0097] The cross-section of the case (500) may have a pipe shape. The pipe may be a rectangular pipe, a polygonal pipe, or a circular pipe. The shape of the pipe may be determined depending on the location within the electronic device (e.g., the electronic device (100) of FIG. 1) or the surrounding environment of the heat dissipation structure (330).

[0098] The heat dissipation structure (330) may include an injection port (401), a first opening (402), and / or a second opening (403) formed on an outer surface of the case (500). The injection port (401) may be positioned between the first opening (402) and the second opening (403). The injection port (401) may be a passage through which a nozzle for injecting a thermally conductive material passes. The first opening (402) and the second opening (403) may be formed on an outer surface of the case (500) to confirm the thermally conductive material inside the case (500) injected through the injection port (401). The injection port (401), the first opening (402), and the second opening (403) may face the same direction on the outer surface of the heat dissipation structure (330). For example, the injection port (401), the first opening (402), and the second opening (403) may be formed on one surface of the case (500). The injection port (401) may be formed on the upper surface of the case (500) of the heat dissipation structure (330), and the first opening (402) and the second opening (403) may be formed on the upper surface of the case (500) in which the injection port (401) is formed. For example, when the case (500) is circular, the first opening (402) and the second opening (403) may be arranged to face in a direction parallel to the direction in which the injection port (401) faces.

[0099] The heat dissipation structure (330) may further include a first exhaust port (510) and a second exhaust port (520). The first exhaust port (510) may be formed at one end (501) of the heat dissipation structure (330). The second exhaust port (520) may be formed at the other end (502) of the heat dissipation structure (330). The first exhaust port (510) and the second exhaust port (520) may move the thermally conductive material introduced from the inlet (401) to the outside of the case (500). For example, through the first exhaust port (510), a portion of the thermally conductive material within the case (500) may be moved to the first shield can (e.g., the first shield can (310) of FIG. 3). Through the second exhaust port (520), another portion of the thermally conductive material within the case (500) can be transferred to the second shield can (e.g., the second shield can (320) of FIG. 3). The first exhaust port (510) can be formed at one end (501) of the case (500) (or the heat dissipation structure (330)). The second exhaust port (520) can be formed at the other end (502) of the case (500) (or the heat dissipation structure (330)). For example, the first exhaust port (510) and the second exhaust port (520) can be open portions located at both ends (501, 502) of the hollow hole. The first exhaust port (510) can connect the interior of the case (500) and the first space (410) of the first shield can (310). The second exhaust port (520) can connect the interior of the case (500) and the second space (420) of the second shield can (320). The amount of thermally conductive material flowing into the first shield can (310) may be different from the amount of thermally conductive material flowing into the second shield can (320). For example, the amount of thermally conductive material passing through the first exhaust port (510) may be different from the amount of thermally conductive material passing through the second exhaust port (520). The areas of the first exhaust port (510) and the second exhaust port (520) may be the same. For example, the cross-sectional area of ​​the pipe-shaped case (500) may be substantially the same at a plurality of points.Pipes with the same internal cross-sectional area can transfer heat conductive material at the same rate (or in the same amount). In order to differentiate the amounts of heat conductive material transferred from the first outlet (510) and the second outlet (520), the inlet (401) may be positioned offset from one of the ends of the heat dissipation structure (330). For example, as shown in FIG. 5A, the heat dissipation structure (330) may include an inlet (401') that is closer to the second outlet (520) than to the first outlet (510), instead of the inlet (401). The inlet (401') may be positioned closer to the other end (502) of the heat dissipation structure (330) than to one end (501) of the heat dissipation structure (330).

[0100] The amount of thermally conductive material injected through the inlet (401) spaced substantially the same distance from one end (501) of the heat dissipation structure (330) and the other end (502) of the heat dissipation structure (330) and delivered to the first shield can (310) through the first outlet (510) may be substantially the same as the amount of thermally conductive material injected through the inlet (401') and delivered to the first shield can (310) through the first outlet (510). The amount of thermally conductive material injected through the inlet (401') and delivered to the first shield can (310) through the first outlet (510) may be less than the amount of thermally conductive material delivered to the second shield can (310) through the second outlet (520).

[0101] The heat dissipation structure (330) may include outlets (510', 520) of different areas, as shown in FIG. 5B. For example, a first outlet (510') disposed at one end (501) of the heat dissipation structure (330) may be narrower than a second outlet (520) disposed at the other end (502) of the heat dissipation structure (330). The area of ​​the first outlet (510') may be smaller than the area of ​​the second outlet (520). The amount of thermally conductive material transferred to the first shield can (310) through the relatively narrow first outlet (510') may be less than the amount of thermally conductive material transferred to the second shield can (320) through the second outlet (520).

[0102] The heat dissipation structure (330) can control the amount of heat conductive material transferred to the first shield can (310) and the amount of heat conductive material transferred to the second shield can (320) by making the widths of the first discharge port (510 or 510') and the second discharge port (520) different or by arranging the inlet port (401 or 401') differently.

[0103] FIG. 6 is a cross-sectional view of an exemplary shield candle and a heat dissipation structure disposed on a component within the shield candle according to various embodiments. FIG. 7 is a perspective view of an exemplary heat dissipation structure having an exhaust port facing a component according to various embodiments.

[0104] Referring to FIGS. 6 and 7, the first shield can (310) may include an opening (611). The opening (611) may be formed on a side surface (411) that contacts the heat dissipation structure (330) and an upper surface (411') that contacts the side surface (411). The opening (611) may be formed so that the heat dissipation structure (330) can be placed on the first component (311). For example, a portion of the upper surface (411') of the first shield can (310) may be removed. When one surface (311a) of the first component (311) that contacts the second portion (432) of the thermally conductive material (430) is viewed in a vertical direction, the first component (311) may be spaced apart from the upper surface (411') of the first shield can (310). A part of the heat dissipation structure (330) that penetrates the opening (611) of the first shield can (310) and is placed in the first space (410) of the first shield can (310) may be placed on the first part (311).

[0105] The heat dissipation structure (330) may include a first exhaust port (710) facing the first component (311) and a second exhaust port (720) formed at another end (702) of the heat dissipation structure (330). The first exhaust port (710) may be positioned adjacent to one end (701) of the heat dissipation structure (330). When one surface of the first component (311) that contacts the second portion (432) is viewed vertically, the first exhaust port (710) of the heat dissipation structure (330) may overlap the first component (311). The first exhaust port (710) may contact the first component (311). However, the present invention is not limited thereto, and the first exhaust port (710) may be spaced apart from the first component (311).

[0106] A portion of the thermally conductive material (430) introduced through the inlet (401) of the heat dissipation structure (330) may be located inside the heat dissipation structure (330). The thermally conductive material (430) may include a first portion (431) located inside a portion of the heat dissipation structure (330), a second portion (432) in contact with the first component (311), and a third portion (433) disposed in the second space (420) of the second shield can (320) through a second outlet (720) formed in another end (702) of the heat dissipation structure (330).

[0107] When the first exhaust port (710) of the heat dissipation structure (330) comes into contact with the first component (311), the heat conductive material (430) inside the first shield can (310) may not be transferred to the first space (410) of the first shield can (310) through the first exhaust port (710). The second portion (432) of the heat conductive material (430) may absorb only the heat generated from the first component (311), thereby quickly diffusing the heat of the first component (311) to the second space (420) of the second shield can (320).

[0108] FIG. 8 is a diagram illustrating an exemplary application operation of a heat transfer material transmitted through an exemplary heat dissipation structure according to various embodiments.

[0109] Referring to FIG. 8, the injection nozzle (800) can supply a thermally conductive material (e.g., the thermally conductive material (430) of FIG. 4b or FIG. 6) into the interior of the electronic device (100). The injection nozzle (800) can be inserted into the heat dissipation structure (330) through the injection port (401). The thermally conductive material can be injected into the interior of the heat dissipation structure (330) through the injection nozzle (800) inserted into the interior of the heat dissipation structure (330). The injection port (401) can have a backflow prevention valve to reduce the leakage of the injected thermally conductive material to the exterior of the heat dissipation structure (330) through the injection port (401).

[0110] The thermally conductive material transferred into the interior of the heat dissipation structure (330) can be moved to both ends of the heat dissipation structure (330). For example, a portion of the thermally conductive material transferred into the interior of the heat dissipation structure (330) can be transferred to one end (501) of the heat dissipation structure (330), and another portion of the thermally conductive material transferred into the interior of the heat dissipation structure (330) can be transferred to the other end (502) of the heat dissipation structure (330). A portion of the thermally conductive material within the heat dissipation structure (330) can be transferred to one end (501) of the heat dissipation structure (330) along the first path (P1). A portion of the thermally conductive material transferred to one end (501) of the heat dissipation structure (330) can be transferred to the outside of the heat dissipation structure (300) through the first outlet (510). A portion of the thermally conductive material transferred within the heat dissipation structure (330) along the first path (P1) can be identified to an operator via the first opening (402). Another portion of the thermally conductive material within the heat dissipation structure (330) can be transferred to another end (502) of the heat dissipation structure (330) along the second path (P2). Another portion of the thermally conductive material transferred within the heat dissipation structure (330) along the second path (P1) can be identified to an operator via the second opening (403). Another portion of the thermally conductive material transferred to another end (502) of the heat dissipation structure (330) can be transferred to the exterior of the heat dissipation structure (330) via the second outlet (520).

[0111] A portion of the thermally conductive material delivered to the first outlet (510) may be delivered to the first space (410) of the first shield can (310) along the third path (P3). A portion of the thermally conductive material delivered within the first shield can (310) may be placed on the first component (311). Another portion of the thermally conductive material delivered to the second outlet (520) may be delivered to the second space (420) of the second shield can (320) along the fourth path (P4). Another portion of the thermally conductive material delivered within the second shield can (320) may be applied to the inner surface of the second shield can (320) or may be applied on the printed circuit board (150) within the second shield can (320).

[0112] FIG. 9 is a diagram illustrating exemplary heat transfer paths emitted from components inside a shield can according to various embodiments.

[0113] Referring to FIG. 9, heat generated from the first component (311) can be transferred along a path independent of the heat transfer path of the other component (312) disposed within the first shield can (310). For example, heat generated from the first component (311) and heat generated from the second component (312) can be transferred through different paths.

[0114] The first component (311) may be spaced apart from the second component (312). The first component (311) and the second component (312) may be components that generate heat during operation of the electronic device (100). The first component (311) may be positioned adjacent to the first shield can (310), and the second component (312) may be spaced apart from the first shield can (310). For example, the distance (d1) between the first component (311) and a side surface (e.g., the side surface (411) of FIG. 4A) may be smaller than the distance (d2) between the second component (311) and the side surface (411). For example, the first component (311) may be positioned within 1 mm from the side surface (411) of the first shield can (310), and the second component (312) may be spaced apart from the side surface (411) of the first shield can (310) by 1 mm or more. The distance (d1) may be 0.15 mm, and the distance (d2) may be 1 mm or more. Unlike the second component (312), the first component (311) may be positioned adjacent to the side surface (411) of the first shield can (310), so that there may be insufficient attachment space for the first heat transfer material (901) and the second heat transfer material (902) positioned on the second component (312). The first heat transfer material (901) may be a TIM applied on the first component (312). The second heat transfer material (902) may be a nano TIM applied to the first heat transfer material (901), the upper surface of the first shield can (310) (e.g., the upper surface (411') of FIG. 4b). The volume of the first component (311) may be smaller than the volume of the second component (312). The first component (311) smaller than the second component (312) may have difficulty in surface contact with another heat transfer structure (903) different from the heat transfer structure (330) (e.g., the heat transfer structure (340) of FIG. 3). The other heat transfer structure (903) may include one of a vapor chamber, a metal plate, or a heat pipe attached to the bracket (904) (or front metal). The other heat transfer structure (903) is a wide and flat structure that can dissipate heat through surface contact with the heating element.The heat dissipation path of the first component (311) having a small contact area may be difficult to utilize with other heat dissipation structures (903). Heat generated from the first component (311) may spread along a different heat transfer path from the second component (312). The heat generated from the first component (311) may spread to the second shield can (320) or the internal space enclosed by the second shield can (320) along a heat transfer path (H1) formed through the heat dissipation structure (330) including a heat conductive material (430) connected to the first component (311) and disposed inside the second shield can (320).

[0115] Heat generated from the second component (312) can be released to the outside along a heat transfer path (H2). The heat transfer path (H2) can be formed from a first heat transfer material (901) applied on the second component (312), a second heat transfer material (902) disposed on the first heat transfer material (901), another heat dissipation structure (903) in contact with the second heat transfer material (902), a bracket (904) in contact with the other heat dissipation structure (903), a heat dissipation sheet (905) disposed on the bracket (904), and a display (906) or cover in contact with the heat dissipation sheet (905).

[0116] The electronic device (100) can reduce the influence of heat generation between different components (e.g., the first component (311) and the second component (312)) inside one shield can (e.g., the first shield can) by securing a heat dissipation path for each component. The electronic device (100) can spread the heat of a high-heat component disposed on the side of the shield can using a heat dissipation structure (330) according to an embodiment. The noise shielding performance of the first shield can (310) and the second shield can (320) can be improved through a tape (450) disposed on the first shield can (310), the second shield can (320) and the heat dissipation structure (330) and including a conductive material.

[0117] FIG. 10 is a drawing exemplifying the arrangement of shield candles, components, and heat dissipation structures in various embodiments.

[0118] Referring to FIG. 10, the first shield can (310), the second shield can (320), the plurality of elements (1001), and the heat dissipation structure (1030) can be placed on a printed circuit board (150).

[0119] A plurality of elements (1001) may be arranged outside the first shield can (310) and the second shield can (320). The plurality of elements (1001) may be peripheral elements for the operation of components arranged inside the first shield can (310) and / or components arranged inside the second shield can (320). For example, the plurality of elements (1001) may include a resistor, a capacitor, an inductor, or a BGA (ball grid array) IC.

[0120] Since a plurality of elements (1001) are arranged adjacent to the shield candles (310, 320), it may be difficult to arrange a heat dissipation structure extending in one direction. The heat dissipation structure (1030) may have one end connected to the first shield can (310) and the other end connected to the second shield can (320). The heat dissipation structure (1030) extending from the first shield can (310) to the second shield can (320) may form a bend (1031) to avoid the plurality of elements (1001). Depending on the arrangement of the plurality of elements (1001), the heat dissipation structure (1030) may include a plurality of bends.

[0121] In order to avoid the elements (1001) arranged on the printed circuit board (1050), the bending portion (1031) of the heat dissipation structure (1030) is arranged parallel to the printed circuit board (1050), so that the utilization of the narrow space on the printed circuit board (150) can be improved.

[0122] FIG. 11 is a drawing exemplifying the arrangement of shield candles, elements, and vertically folded heat dissipation structures according to various embodiments.

[0123] Referring to FIG. 11, the electronic device (100) may include a first shield can (310), a second shield can (320), a component (311), a plurality of elements (1101), and a heat dissipation structure (1030) on a printed circuit board (150). The plurality of elements (1101) may be disposed between the first shield can (310) and the second shield can (320). The first shield can (310) and the second shield can (320) may have different heights. The heat dissipation structure (1030) may be disposed to connect the first shield can (310) and the second shield can (320) having different heights.

[0124] For example, when the height of the components arranged in the internal space of the second shield can (320) is higher than the height of the components arranged in the internal space of the first shield can (310), the second shield can (320) may have a higher height than the first shield can (310). The first shield can (310) may include an opening (1110) for connection with the heat dissipation structure (1030). The second shield can (320) may include an opening (1120) for connection with the heat dissipation structure (1030). The height (h1) from the printed circuit board (150) to the opening (1110) of the first shield can (310) may be lower than the height (h2) from the printed circuit board (150) to the opening (1120) of the second shield can (320). In order to connect the opening (1110) of the first shield can (310) and the opening (1120) of the second shield can (320), the heat dissipation structure (1130) may include a folded portion (1150). The folded portion (1131) of the heat dissipation structure (1130) may be formed to avoid the elements (1101). The heat dissipation structure (1130) folded in a direction perpendicular to the printed circuit board (150) may thermally connect shield cans having different heights. For example, heat emitted from the first component (311) may diffuse into the interior of the second shield can (320) through a thermally conductive material within the heat dissipation structure (1130).

[0125] The heat dissipation structure (1130) may include an injection port (1101) and a first opening (1102) and a second opening (1103) for checking a thermally conductive material injected into the interior of the heat dissipation structure (1130). The injection port (1101) may be formed at a high position of the heat dissipation structure (1130) to easily supply the thermally conductive material to the first shield can (310) and the second shield can (320). For example, the injection port (1101) may be formed at a portion of the heat dissipation structure (1130) that is connected to an opening (1120) of the second shield can (320) having a relatively high height. The thermally conductive material introduced through the injection port (1101) arranged at a high position may easily move into the interior of the first shield can (310).

[0126] Electronic devices containing multiple heat-generating components may include structures for heat dissipation. Instead of heat pipes or metal plates applied to components adjacent to the shield can, the electronic device may require a structure capable of dissipating heat emitted from components adjacent to the shield can to a relatively cool area.

[0127] An electronic device according to the above-described embodiment may include a first shield can, a second shield can, a heat dissipation structure including a heat dissipation material, and a conductive material. The first shield can may provide a first space configured to accommodate a component. The second shield can may be spaced apart from the first shield can and provide a second space. The heat dissipation structure may have one end connected to the first shield can and another end connected to the second shield can. A first portion of the heat conductive material may be disposed in at least a portion of an internal space of the heat dissipation structure. A second portion of the heat conductive material may extend from the one end of the heat dissipation structure to at least one surface of the component. A third portion of the heat conductive material may extend from the other end of the heat dissipation structure to the second space. The electronic device may be configured to diffuse heat generated in the component toward the second shield can through the heat conductive material.

[0128] In one embodiment, the heat transfer material may be configured to diffuse heat generated from the component during operation of the electronic device to the second shield can by connecting the component and the space within the second shield can.

[0129] According to one embodiment, the electronic device may be configured to transfer the heat generated from the component along a path independent of the transfer path of heat generated from another component disposed within the first shield can.

[0130] According to the above-described embodiment, the plurality of heat-generating components arranged within the first shield can disperse heat through different heat transfer paths, thereby reducing the thermal influence of each component on other components. By reducing the thermal influence of components within the electronic device, the heat dissipation structure including the thermally conductive material can maintain the performance of the electronic device.

[0131] In one embodiment, the component may be spaced apart from the other component. A distance between the component and a side surface of the first shield can in contact with the heat dissipation structure may be shorter than a distance between the other component and the side surface of the first shield can.

[0132] In one embodiment, the distance between the component and the side surface of the first shield can may be less than or equal to 1 mm.

[0133] The heat dissipation structure according to the above-described embodiment can be configured to spread heat generated from a heat-generating component for which it is difficult to place a plate or heat pipe for heat dissipation adjacent to the shield can to a cooling area such as a surrounding shield can.

[0134] According to one embodiment, the heat dissipation structure may include a pipe having a first opening, a second opening, and an inlet formed on an outer surface thereof, the pipe having a hollow hole for accommodating the heat conductive material. The inlet may be positioned between the first opening and the second opening.

[0135] According to the above-described embodiment, the heat dissipation structure includes an injection port configured to inject a heat conductive material therein, and the heat conductive material occupying at least a portion of the interior of the hollow hole can be inspected through the first opening and the second opening. By inspecting the heat conductive material, the performance of the heat dissipation structure can be ensured.

[0136] In one embodiment, the injection port may be closer to the second opening than to the first opening.

[0137] According to the above-described embodiment, the heat dissipation structure can be configured to control the amount of heat conductive material delivered to both ends of the heat dissipation structure depending on the location of the injection port. By controlling the amount of heat conductive material required for each location, manufacturing costs can be reduced.

[0138] According to one embodiment, the heat dissipation structure may include a first outlet formed at one end of the heat dissipation structure, which is disposed at the opening of the first shield can, and a second outlet formed at the other end of the heat dissipation structure, which is disposed at the opening of the second shield can.

[0139] According to the above-described embodiment, the heat dissipation structure can be configured to supply a thermally conductive material to the heat-generating component and the cooling region through outlets formed at both ends. Through the supplied thermally conductive material, heat can be spread from the heat-generating component to the cooling region.

[0140] In one embodiment, the area of ​​the first outlet may be smaller than the area of ​​the second outlet.

[0141] According to the above-described embodiment, the heat dissipation structure can be configured to control the amount of heat conductive material transferred to both ends of the heat dissipation structure depending on the area of ​​the first exhaust port and the second exhaust port. By controlling the amount of heat conductive material required for each location, manufacturing costs can be reduced.

[0142] According to one embodiment, the first exhaust port is formed on a side surface disposed at the one end of the heat dissipation structure, and when one surface of the component in contact with the heat conductive material is viewed in a vertical direction, the component can overlap the first shield can.

[0143] According to the above-described embodiment, the first exhaust port may be configured to transfer a thermally conductive material within the heat dissipation structure to a component disposed within the first shield can. The transferred thermally conductive material may thermally connect the first component and the heat dissipation structure.

[0144] According to one embodiment, the first outlet can be in contact with the component, and when a surface of the component in contact with the thermally conductive material is viewed in a vertical direction, the component can overlap with the first outlet.

[0145] According to the above-described embodiment, the heat dissipation structure disposed on one surface of the component may be configured to directly supply a thermally conductive material to the first component. The component disposed below the heat dissipation structure and in contact with the first exhaust port may be in contact with the thermally conductive material. Thus, a stable thermal connection between the component and the cooling area (e.g., the second shield can) can be maintained.

[0146] In one embodiment, the electronic device may further include a tape. The tape may be configured to be attached to a portion of an outer surface of the first shield can, a portion of an outer circumferential surface of the heat dissipation structure, and a portion of an outer surface of the second shield can. The tape may secure the heat dissipation structure to the first shield can and the second shield can, and may include a conductive material.

[0147] According to the above-described embodiment, the tape can limit vertical movement of the heat dissipation structure by fixing the heat dissipation structure to the first shield can and the second shield can.

[0148] In one embodiment, another portion of the thermally conductive material may be applied to the inner surface of the second shield can.

[0149] According to the above-described embodiment, based on the thermally conductive material being in contact with the inner surface of the second shield can, heat generated from the component can be diffused to the second shield can through the thermally conductive material. The electronic device can be configured to diffuse heat from an internal component that is difficult to dissipate heat to a region having a relatively low temperature located around the heat dissipation structure having the thermally conductive material.

[0150] According to one embodiment, the heat dissipation structure may include a first leg, a second leg, a third leg, and a fourth leg.

[0151] In one embodiment, the first leg and the second leg may extend along a side of the first shield can where the opening of the first shield can is formed and may face each other. The third leg and the fourth leg may extend along a side of the second shield can where the opening of the first leg and the second leg and the second shield can are formed and may face each other.

[0152] In one embodiment, a portion of the side of the first shield can may be positioned between the first leg and the second leg.

[0153] In one embodiment, a portion of the side of the second shield can may be disposed between the third leg and the fourth leg.

[0154] According to the above-described embodiment, the first leg and the second leg may be configured to secure the heat dissipation structure and the first shield can. The third leg and the fourth leg may be configured to secure the heat dissipation structure and the second shield can. By the first leg, the second leg, the third leg, and the fourth leg, the horizontal movement of the heat dissipation structure may be restricted.

[0155] According to one embodiment, the heat dissipation structure may include a pipe made of metal material.

[0156] In one embodiment, the pipe can be joined to the first leg, the second leg, the third leg, and the fourth leg.

[0157] According to the above-described embodiment, the heat dissipation structure and the legs include a metal material and can be welded or joined. The joined legs and the heat dissipation structure can be utilized as a single component.

[0158] According to one embodiment, the electronic device may further include a printed circuit board and components.

[0159] According to one embodiment, the printed circuit board may have the components, the first shield can, and the second shield can arranged thereon. The components may be mounted on the printed circuit board outside the first shield can and the second shield can. To prevent interference with the components, the heat dissipation structure may include a folded portion.

[0160] According to the above-described embodiment, the electronic device can increase space efficiency through a heat dissipation structure manufactured to avoid interference with the components.

[0161] In one embodiment, the distance between the opening of the first shield can and the printed circuit board may be different from the distance between the opening of the second shield can and the printed circuit board. The bent portion may have an incline with respect to the printed circuit board.

[0162] According to the above-described embodiment, the heat dissipation structure having a folded portion can connect first and second shield cans having different heights. By being folded vertically to the printed circuit board, components can be placed between the printed circuit board and the heat dissipation structure, thereby increasing the utilization of vertical space.

[0163] In one embodiment, the thermally conductive material may have viscosity.

[0164] According to the above-described embodiment, since the thermally conductive material is a viscous fluid, the thermally conductive material can be injected into the interior of the heat dissipation structure. The thermally conductive material injected into the interior of the heat dissipation structure can be transferred to the exterior of the heat dissipation structure, so that the thermally conductive material can be applied to a component or introduced into a shield can. After being applied to a component or introduced into a shield can, the thermally conductive material can be cured and take a shape.

[0165] According to one embodiment, the first shield can may include an opening formed on a side surface of the first shield can and another surface contacting the side surface, in which a portion of the heat dissipation structure is disposed, and the second shield can may include an opening in which another portion of the heat dissipation structure is disposed.

[0166] According to the above-described embodiment, the opening formed in the shield can may provide a structure for fastening to a heat dissipation structure. The heat dissipation structure may be secured by a set of legs fitted into the side of the shield can where the opening is formed. Through the opening formed in the shield can, the heat dissipation structure may be inserted into the interior of the shield can.

[0167] According to one embodiment, an electronic device may include a heat dissipation structure including a substrate, a component, a shield can, and a heat dissipation material. The component is mounted on the substrate and is capable of dissipating heat during operation of the electronic device. The shield can is secured to the substrate, surrounds at least a portion of the component, and may include an open area formed in a side wall. A cooling area may be spaced apart from the shield can and configured to absorb the heat by maintaining a relatively lower temperature than the component.

[0168] According to one embodiment, the heat dissipation structure includes a thermally conductive material having viscosity therein, at least a portion of which is disposed within the shield can through the open area, and extends from the shield can to the cooling area.

[0169] In one embodiment, the thermally conductive material may extend from one end of the heat dissipation structure to contact one surface of the component and may extend from the other end of the heat dissipation structure to be positioned in the cooling region.

[0170] According to the above-described embodiment, the plurality of heat-generating components arranged within the first shield can disperse heat through different heat transfer paths, thereby reducing the thermal influence of each component on other components. By reducing the thermal influence of components within the electronic device, the heat dissipation structure including the thermally conductive material can maintain the performance of the electronic device.

[0171] In one embodiment, the electronic device may further include another component. The other component may be positioned within the shield can and may dissipate heat while the electronic device is operating. The heat transfer path of the other component may be independent of the heat transfer path of the other component.

[0172] According to the above-described embodiment, the components have independent heat transfer paths, thereby reducing the influence of heat between the components.

[0173] According to one embodiment, the electronic device may further include a heat dissipation member comprising a heat dissipation material and another thermally conductive material. The heat dissipation member may be disposed on the shield can. The other thermally conductive material may connect the other component to the heat dissipation member and may be applied to one surface of the other component.

[0174] In one embodiment, the shield can may overlap the other component when viewed in a direction perpendicular to the other component and include an opening through which the other thermally conductive material passes.

[0175] In one embodiment, the cooling region may be a shield can distinct from the shield can, a portion of a housing forming the exterior of the electronic device, or a metal portion within the electronic device.

[0176] According to the above-described embodiment, the other thermally conductive material may be configured to diffuse heat from other components to the exterior of the electronic device, such as through another shield can, a portion of the housing, or a metal portion of the bracket. Through the heat diffusion path secured within the electronic device, the electronic device can efficiently control heat generated during operation of the electronic device.

[0177] FIG. 12 is a block diagram of an electronic device within a network environment according to various embodiments.

[0178] Referring to FIG. 12, in a network environment (1200), an electronic device (1201) may communicate with an electronic device (1202) via a first network (1298) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1204) or a server (1208) via a second network (1299) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1201) may communicate with the electronic device (1204) via the server (1208). According to one embodiment, the electronic device (1201) may include a processor (1220), a memory (1230), an input module (1250), an audio output module (1255), a display module (1260), an audio module (1270), a sensor module (1276), an interface (1277), a connection terminal (1278), a haptic module (1279), a camera module (1280), a power management module (1288), a battery (1289), a communication module (1290), a subscriber identification module (1296), or an antenna module (1297). In some embodiments, the electronic device (1201) may omit at least one of these components (e.g., the connection terminal (1278)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1276), camera module (1280), or antenna module (1297)) may be integrated into a single component (e.g., display module (1260)).

[0179] The processor (1220) may include various processing circuits and / or multiple processors. For example, a “processor” as included and used in the claims may include multiple processing circuits or include at least one processor, and one or more of the at least one processors may be configured to perform the multiple functions recited collectively and / or in a distributed manner. As used herein, “processor,” “at least one processor,” and “one or more processors” indicate that the processor is configured to perform multiple functions, and may include one processor performing some of the recited functions and other processor(s) performing other of the recited functions, or a single processor may perform all of the recited functions. Additionally, the at least one processor may include a combination of processors that perform the various functions enumerated or disclosed in a distributed manner. The at least one processor may execute program instructions to achieve or perform various functions. The processor (1220) may control at least one other component (e.g., hardware or software component) of the electronic device (1201) connected to the processor (1220) by executing, for example, software (e.g., program (1240)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1220) may store commands or data received from other components (e.g., sensor module (1276) or communication module (1290)) in volatile memory (1232), process the commands or data stored in volatile memory (1232), and store result data in non-volatile memory (1234).According to one embodiment, the processor (1220) may include a main processor (1221) (e.g., a central processing unit or an application processor) or an auxiliary processor (1223) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1221). For example, when the electronic device (1201) includes the main processor (1221) and the auxiliary processor (1223), the auxiliary processor (1223) may be configured to use less power than the main processor (1221) or to be specialized for a given function. The auxiliary processor (1223) may be implemented separately from the main processor (1221) or as a part thereof.

[0180] The auxiliary processor (1223) may control at least a portion of functions or states associated with at least one component (e.g., a display module (1260), a sensor module (1276), or a communication module (1290)) of the electronic device (1201), for example, on behalf of the main processor (1221) while the main processor (1221) is in an inactive (e.g., sleep) state, or together with the main processor (1221) while the main processor (1221) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1223) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1280) or a communication module (1290)). In one embodiment, the auxiliary processor (1223) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1201) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1208)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0181] The memory (1230) can store various data used by at least one component (e.g., the processor (1220) or the sensor module (1276)) of the electronic device (1201). The data can include, for example, software (e.g., the program (1240)) and input data or output data for commands related thereto. The memory (1230) can include a volatile memory (1232) or a non-volatile memory (1234).

[0182] The program (1240) may be stored as software in memory (1230) and may include, for example, an operating system (1242), middleware (1244), or an application (1246).

[0183] The input module (1250) can receive commands or data to be used in a component of the electronic device (1201) (e.g., a processor (1220)) from an external source (e.g., a user) of the electronic device (1201). The input module (1250) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0184] The audio output module (1255) can output audio signals to the outside of the electronic device (1201). The audio output module (1255) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0185] The display module (1260) can visually provide information to an external party (e.g., a user) of the electronic device (1201). The display module (1260) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (1260) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0186] The audio module (1270) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1270) can acquire sound through the input module (1250), output sound through the sound output module (1255), or an external electronic device (e.g., electronic device (1202)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1201).

[0187] The sensor module (1276) can detect the operating status (e.g., power or temperature) of the electronic device (1201) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1276) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0188] The interface (1277) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1201) with an external electronic device (e.g., the electronic device (1202)). In one embodiment, the interface (1277) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0189] The connection terminal (1278) may include a connector through which the electronic device (1201) may be physically connected to an external electronic device (e.g., the electronic device (1202)). In one embodiment, the connection terminal (1278) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0190] The haptic module (1279) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1279) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0191] The camera module (1280) can capture still images and videos. According to one embodiment, the camera module (1280) may include one or more lenses, image sensors, image signal processors, or flashes.

[0192] The power management module (1288) can manage the power supplied to the electronic device (1201). According to one embodiment, the power management module (1288) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0193] A battery (1289) may power at least one component of the electronic device (1201). In one embodiment, the battery (1289) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0194] The communication module (1290) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1201) and an external electronic device (e.g., electronic device (1202), electronic device (1204), or server (1208)), and the performance of communication through the established communication channel. The communication module (1290) may operate independently from the processor (1220) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1290) may include a wireless communication module (1292) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1294) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1204) via a first network (1298) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1299) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1292) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1296) to verify or authenticate the electronic device (1201) within a communication network such as the first network (1298) or the second network (1299).

[0195] The wireless communication module (1292) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1292) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1292) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1292) may support various requirements specified in the electronic device (1201), an external electronic device (e.g., the electronic device (1204)), or a network system (e.g., the second network (1299)). According to one embodiment, the wireless communication module (1292) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0196] The antenna module (1297) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1297) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1297) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1298) or the second network (1299), may be selected from the plurality of antennas, for example, by the communication module (1290). A signal or power may be transmitted or received between the communication module (1290) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1297).

[0197] According to various embodiments, the antenna module (1297) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0198] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0199] According to one embodiment, commands or data may be transmitted or received between the electronic device (1201) and an external electronic device (1204) via a server (1208) connected to a second network (1299). Each of the external electronic devices (1202 or 1204) may be the same or a different type of device as the electronic device (1201). According to one embodiment, all or part of the operations executed in the electronic device (1201) may be executed in one or more of the external electronic devices (1202, 1204, or 1208). For example, when the electronic device (1201) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1201) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1201). The electronic device (1201) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1201) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1204) may include an Internet of Things (IoT) device. The server (1208) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1204) or server (1208) may be included within the second network (1299). The electronic device (1201) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0200] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0201] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0202] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0203] Various embodiments of the present document may be implemented as software (e.g., a program (1240)) including one or more instructions stored in a storage medium (e.g., an internal memory (1236) or an external memory (1238)) readable by a machine (e.g., an electronic device (1201)). For example, a processor (e.g., a processor (1220)) of the machine (e.g., an electronic device (1201)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0204] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0205] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0206] While the present disclosure has been illustrated and described with reference to various exemplary embodiments, it is to be understood that the various exemplary embodiments are intended to be illustrative and not limiting. It will be understood by those skilled in the art that various changes in form and detail may be made without departing from the true spirit and scope of the present disclosure, including the claims and their equivalents. It will also be understood that any embodiment described herein can be used with any other embodiment described herein.

Claims

1. In an electronic device (100), A first shield can (310) configured to provide a first space (410) for accommodating a component (311); A second shield can (320) spaced apart from the first shield can (310) and configured to provide a second space; A heat dissipation structure (330) having one end connected to the first shield can (310) and the other end connected to the second shield can (320) and including a heat dissipation material; and A thermal conductive material (430) is disposed in at least a part of the internal space of the heat dissipation structure (330), extends from the one end of the heat dissipation structure (330) to at least one surface of the component (311), and extends from the other end of the heat dissipation structure (330) to the second space; The electronic device is configured to spread heat generated in the component (311) to the second shield can (320) through the heat conductive material (430). Electronic devices (100).

2. In paragraph 1, The heat generated from the above component (311) is configured to be transferred along a path independent of the transfer path of the heat generated from another component (312) placed within the first shield can (310). Electronic devices (100).

3. In paragraph 1 or 2, The above part (311) is separated from the other part (312), The distance between the side of the first shield can (310) in contact with the above component (311) and the heat dissipation structure (330) is shorter than the distance between the other component (312) and the side of the first shield can (310). Electronic devices (100).

4. In any one of paragraphs 1 to 3, The distance between the above part (311) and the side surface of the first shield can (310) is 1 mm or less. Electronic devices (100).

5. In any one of paragraphs 1 to 4, The above heat dissipation structure (330) is A case including a first opening (402), a second opening (403) and an inlet (401) formed on an outer surface, The above injection port (401) is positioned between the first opening (402) and the second opening (403). Electronic devices (100).

6. In any one of paragraphs 1 to 5, The above injection port (401) is Closer to the second opening (403) than to the first opening (402), Electronic devices (100).

7. In any one of paragraphs 1 to 6, The above heat dissipation structure (330) is A first outlet (510; 510'; 710) formed at one end of the heat dissipation structure (330) disposed within the first shield can (310) and a second outlet (520; 720) formed at the other end of the heat dissipation structure (330) disposed within the second shield can (320). Electronic devices (100).

8. In any one of paragraphs 1 to 7, The area of ​​the first discharge port (510; 510'; 710) is smaller than the area of ​​the second discharge port (520; 720). Electronic devices (100).

9. In any one of paragraphs 1 to 8, The above first discharge port (510; 510'; 710) is spaced apart from the component (311), When one side of the component (311) in contact with the heat conductive material (430) is viewed in a vertical direction, the component (311) overlaps the first shield can (310). Electronic devices (100).

10. In any one of paragraphs 1 to 9, The above first discharge port (510; 510'; 710) faces the above component (311), When one side of the component (311) in contact with the heat conductive material (430) is viewed in a vertical direction, the component (311) overlaps the first discharge port (510; 510'; 710). Electronic devices (100).

11. In any one of paragraphs 1 to 10, A tape (450) that is attached to a part of the outer surface of the first shield can (310), a part of the outer surface of the heat dissipation structure (330), and a part of the outer surface of the second shield can (320), and includes a conductive material; Electronic devices (100).

12. In any one of paragraphs 1 to 11, The thermally conductive material (430) extended to the second shield can (320) is Applied to the inner surface of the second shield can (320) Electronic devices (100).

13. In any one of paragraphs 1 to 12, The above heat dissipation structure (330) is It includes a first leg (416) and a second leg (417) which extend along the side of the first shield can (310) where the opening of the first shield can (310) is formed and face each other, and a third leg (426) and a fourth leg (427) which extend along the side of the second shield can (320) where the opening of the second shield can (320) is formed and face each other, A part of the side of the first shield can (310) is placed between the first leg (416) and the second leg (417), A part of the side of the second shield can (320) is positioned between the third leg (426) and the fourth leg (427). Electronic devices (100).

14. In any one of paragraphs 1 to 13, The above heat dissipation structure (330) is Contains metal pipes, The above pipe is connected to the first leg (416), the second leg (417), the third leg (426) and the fourth leg (427). Electronic devices (100).

15. In any one of paragraphs 1 to 14, A printed circuit board on which the above component (311), the first shield can (310) and the second shield can (320) are arranged; and It further includes elements (351; 1001) mounted on the printed circuit board outside of the first shield can (310) and the second shield can (320); The heat dissipation structure (330), which is configured to avoid interference with the above elements (351; 1001), includes a folded portion. Electronic devices (100).

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