Hybrid printed circuit board

Abstract

This hybrid printed circuit board comprises: an insulating substrate; a printed circuit board installed on an upper surface of the insulating substrate and including at least one through-hole in which a surface-mounted component is accommodated; and an adhesive member provided between the insulating substrate and the printed circuit board.

Description

Hybrid printed circuit board

[0001] The present disclosure relates to a printed circuit board, and more particularly, to a hybrid printed circuit board.

[0002] Typically, a display device includes a power board that supplies power to operate the display device.

[0003] The power board may be configured to convert AC power into DC power. The power board may include various electronic components for converting AC power into DC power and a printed circuit board on which these electronic components are installed.

[0004] Typically, the power board is installed on the metal chassis of the display device. For safety reasons, the leads and body of the electronic components on the power board must be separated by a certain distance to prevent electrical contact with the metal chassis.

[0005] Meanwhile, the thickness of display devices continues to decrease. However, the gap between the power board and the metal chassis can be a limiting factor in reducing display device thickness.

[0006] Therefore, in order to reduce the thickness of the display device, it is desirable to reduce the gap between the power board and the metal chassis.

[0007] A hybrid printed circuit board according to one or more embodiments of the present disclosure may include: an insulating substrate; a printed circuit board installed on an upper surface of the insulating substrate and including at least one through hole for accommodating a surface-mount component; and an adhesive member including an adhesive provided between the insulating substrate and the printed circuit board.

[0008] According to one or more embodiments of the present disclosure, the adhesive member may be formed of a no-flow prepreg or a bonding sheet.

[0009] According to one or more embodiments of the present disclosure, the insulating substrate may be formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.

[0010] According to one or more embodiments of the present disclosure, the thickness of the insulating substrate may be at least 0.4 mm.

[0011] According to one or more embodiments of the present disclosure, the printed circuit board may include a base plate; and a copper layer formed on one or both sides of the base plate.

[0012] According to one or more embodiments of the present disclosure, the base plate of the printed circuit board may be formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.

[0013] According to one or more embodiments of the present disclosure, the printed circuit board includes a base plate and a copper layer provided on one surface of the base plate, and the insulating substrate may be formed of the same insulating material as the base plate.

[0014] According to one or more embodiments of the present disclosure, the printed circuit board includes a base plate and a copper layer provided on one surface of the base plate, and the insulating substrate may be formed of an insulating material different from that of the base plate.

[0015] According to one or more embodiments of the present disclosure, the printed circuit board includes a base plate and an upper copper layer and a lower copper layer provided on both sides of the base plate, and the insulating substrate may be formed of the same insulating material as the base plate.

[0016] According to one or more embodiments of the present disclosure, the printed circuit board includes a base plate and an upper copper layer and a lower copper layer provided on both sides of the base plate, and the insulating substrate may be formed of an insulating material different from that of the base plate.

[0017] According to one or more embodiments of the present disclosure, the printed circuit board may include a first printed circuit board and a second printed circuit board that are electrically connected to each other.

[0018] According to one or more embodiments of the present disclosure, the first printed circuit board may include a first terminal pattern formed on an upper surface. The second printed circuit board may include a second terminal pattern formed on an upper surface corresponding to the first terminal pattern. The hybrid printed circuit board may include a connection substrate installed on an upper surface of the first terminal pattern and the second terminal pattern, and electrically connecting the first terminal pattern and the second terminal pattern.

[0019] According to one or more embodiments of the present disclosure, the connecting substrate may include a connecting pattern connecting the first terminal pattern and the second terminal pattern.

[0020] According to one or more embodiments of the present disclosure, the first printed circuit board may be formed as a double-sided printed circuit board, and the second printed circuit board may be formed as a single-sided printed circuit board.

[0021] A hybrid printed circuit board according to one or more embodiments of the present disclosure may further include an anti-warpage reinforcement member installed on an upper surface of the printed circuit board.

[0022] The above-described and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings. In the accompanying drawings:

[0023] FIG. 1 is a perspective view showing a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0024] FIG. 2 is an exploded perspective view showing a printed circuit board (10) and an insulating substrate (20) of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0025] FIG. 3 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0026] FIG. 4 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0027] FIG. 5 is a perspective view showing a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0028] FIG. 6 is an exploded perspective view showing a printed circuit board (10) and an insulating substrate (20) of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0029] FIG. 7 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0030] FIG. 8 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0031] FIG. 9 is a perspective view showing a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0032] FIG. 10 is an exploded perspective view showing a printed circuit board (10) and an insulating substrate (20) of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0033] FIG. 11 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0034] FIG. 12 is a perspective view showing a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0035] FIG. 13 is a plan view showing a first printed circuit board (10) and a second printed circuit board (10') of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0036] FIG. 14 is a bottom perspective view showing a connection substrate (40) of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0037] FIG. 15a, FIG. 15b, and FIG. 15c are drawings for explaining a method of manufacturing a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0038] FIG. 16 is a drawing showing a power board using a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure installed on a metal chassis.

[0039] Fig. 17 is a drawing showing a power board according to a prior art installed on a metal chassis.

[0040] Fig. 18 is a drawing showing a power board using an SMD printed circuit board (10) installed on a metal chassis.

[0041] FIG. 19 is a perspective view showing a state in which a warpage prevention reinforcing member (90) is installed on a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0042] FIG. 20 is a perspective view showing a state in which a warpage prevention reinforcing member (90) is separated from a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0043] It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather include various modifications, equivalents, or alternatives of the embodiments.

[0044] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0045] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0046] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0047] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0048] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0049] When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0050] The terms "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0051] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0052] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0053] In addition, terms such as 'front end', 'rear end', 'upper end', 'lower end', 'top end', and 'bottom end' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0054] The present disclosure relates to a hybrid printed circuit board (1) capable of reducing the separation distance between a power board and a metal chassis.

[0055] Hereinafter, a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure will be described in detail with reference to the attached drawings.

[0056] FIG. 1 is a perspective view illustrating a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure. FIG. 2 is an exploded perspective view illustrating a printed circuit board (10) and an insulating substrate (20) of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure. FIG. 3 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0057] Referring to FIGS. 1 to 3, a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure may include a printed circuit board (10) and an insulating substrate (20).

[0058] The printed circuit board (10) is formed in a flat shape and includes a base plate (11) and two copper layers (12, 13).

[0059] Two copper layers (12, 13) are formed on the upper and lower surfaces of the base plate (11). The base plate (11) is formed of an insulating material. In other words, the printed circuit board (10) may be formed as a double-sided printed circuit board. Alternatively, the printed circuit board (10) may be formed as a multilayer board.

[0060] The printed circuit board (10) may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the printed circuit board (10) upwardly and downwardly. The at least one through hole (15) may be formed to accommodate a surface mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface mount component to be accommodated. For example, as illustrated in FIG. 16, when a surface mount component (70) is installed on the upper surface of the printed circuit board (10), the through hole (15) may be formed so that the lower portion of the body (72) of the surface mount component (70) is accommodated in the through hole (15).

[0061] In this embodiment, two through holes (15) are formed in the printed circuit board (10), but this is only an example, and the number of through holes (15) is not limited thereto. As another example, depending on the number of surface-mount components used, one through hole (15) or three or more through holes (15) may be formed in the printed circuit board (10). A transformer, capacitor, etc. may be installed in the through hole (15).

[0062] In this way, by forming a through hole (15) in a printed circuit board (10) and installing a surface-mount component in the through hole (15), the height from the upper surface of the printed circuit board (10) to the upper end of the surface-mount component can be reduced. That is, the height of a power board (100) (see FIG. 16) using a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure can be reduced.

[0063] The printed circuit board (10) may be formed of FR-4. That is, the base plate (11) may be formed of FR-4 material, and the copper foil layers (12, 13) may be formed of copper (Cu). Here, FR stands for Flame Retardant. FR-4 may be formed by stacking multiple layers of sheets in which glass fibers are combined with epoxy resin, drying them, and then subjecting them to high temperature / high pressure processing. FR-4 has insulating properties.

[0064] The insulating substrate (20) is installed on the lower surface of the printed circuit board (10). That is, the insulating substrate (20) is installed under the lower copper layer (13) of the printed circuit board (10). The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is formed of the same material as the base plate (11) of the printed circuit board (10). That is, the insulating substrate (20) may be formed of an FR-4 material.

[0065] The insulating substrate (20) can be formed to have the same shape and size as the printed circuit board (10).

[0066] The thickness of the insulating substrate (20) can be determined so that the electronic components installed on the metal chassis and the printed circuit board (10) can be insulated from each other. According to safety standards (e.g., IEC62368-1), when the printed circuit board (10) satisfies the creepage distance, the thickness of the insulating substrate (20) can be formed to be 0.4 mm or more.

[0067] The insulating substrate (20) can be formed to have a thickness thinner than the printed circuit board (10).

[0068] The insulating substrate (20) can be attached to the printed circuit board (10) by an adhesive member (30) (e.g., including an adhesive material). That is, the adhesive member (30) can be provided between the insulating substrate (20) and the printed circuit board (10). Specifically, the insulating substrate (20) can be attached to the lower copper layer (13) of the printed circuit board (10) by the adhesive member (30).

[0069] By interposing an adhesive material (30) between an insulating substrate (20) and a printed circuit board (10) and applying pressure to the insulating substrate (20) and the printed circuit board (10), the insulating substrate (20) and the printed circuit board (10) can be joined.

[0070] The adhesive member (30) may include at least one through hole (31) corresponding to at least one through hole (15) formed in the printed circuit board (10).

[0071] The adhesive member (30) can be formed of a material that has insulating properties and can bond the printed circuit board (10) and the insulating substrate (20).

[0072] For example, a no-flow prepreg can be used as the adhesive member (30). When the no-flow prepreg is interposed between the lower surface of the printed circuit board (10) and the insulating substrate (20), the insulating substrate (20) can be attached to the printed circuit board (10). At this time, a portion of the no-flow prepreg corresponding to at least one through-hole (15) can be removed so that the no-flow prepreg does not exist under at least one through-hole (15) of the printed circuit board (10).

[0073] No-flow prepreg has a lower spread thickness than regular prepreg. For example, the spread thickness of no-flow prepreg is 50 μm or less, while that of regular prepreg is approximately 200 μm. Regular prepreg can also be used for bonding a printed circuit board (10) and an insulating substrate (20).

[0074] Therefore, when a printed circuit board (10) is attached to the upper surface of an insulating substrate (20) using a no-flow prepreg to form a hybrid printed circuit board (1), the thickness of the hybrid printed circuit board (1) can be made thinner than when a general prepreg is used.

[0075] As another example, a bonding sheet may be used as the adhesive member (30). By interposing the bonding sheet between the lower surface of the printed circuit board (10) and the insulating substrate (20), the printed circuit board (10) and the insulating substrate (20) can be attached. At this time, a portion of the bonding sheet corresponding to at least one through hole (15) may be removed so that the bonding sheet does not exist under at least one through hole (15) of the printed circuit board (10).

[0076] The bonding sheet has an initial viscosity similar to double-sided tape, enabling the temporary bonding of a printed circuit board (10) and an insulating substrate (20). Then, when heat is applied to harden the bonding sheet, the bonding sheet bonds and fixes the printed circuit board (10) and the insulating substrate (20), thereby forming a hybrid printed circuit board (1).

[0077] In the above, the base plate (11) and the insulating substrate (20) of the printed circuit board (10) are formed of the same material. However, the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure is not limited thereto. As illustrated in FIG. 4, the base plate (11) and the insulating substrate (20) of the printed circuit board (10) may be formed of different materials.

[0078] FIG. 4 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0079] Referring to FIG. 4, a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure may include a printed circuit board (10) and an insulating substrate (20).

[0080] The printed circuit board (10) is formed in a flat shape and includes a base plate (11) and two copper layers (12, 13).

[0081] Two copper layers (12, 13) are formed on the upper and lower surfaces of the base plate (11). The base plate (11) is formed of an insulating material. In other words, the printed circuit board (10) can be formed as a double-sided printed circuit board.

[0082] The printed circuit board (10) may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the printed circuit board (10) vertically. The at least one through hole (15) may be formed to accommodate a surface-mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface-mount component to be accommodated.

[0083] The printed circuit board (10) can be formed of FR-4. That is, the base plate (11) can be formed of FR-4 material, and the copper foil layers (12, 13) can be formed of copper (Cu).

[0084] The insulating substrate (20) is installed on the lower surface of the printed circuit board (10). That is, the insulating substrate (20) is installed under the lower copper layer (13) of the printed circuit board (10). The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is formed of a different material from the base plate (11) of the printed circuit board (10).

[0085] For example, the insulating substrate (20) can be formed of any one of FR-1, FR-3, CEM-1, and CEM-3. Specifically, FR-1 can be formed by laminating multiple sheets of paper combined with phenol resin and drying. FR-3 can be formed by laminating multiple sheets of paper combined with epoxy resin and drying. CEM-1 is a composite material including a paper core combined with a woven glass fiber surface and an epoxy resin. CEM-3 is a composite material including a woven glass fiber surface and a non-woven glass fiber core combined with an epoxy resin. Here, CEM stands for Composite epoxy material.

[0086] The insulating substrate (20) can be formed to have the same shape and size as the printed circuit board (10).

[0087] The thickness of the insulating substrate (20) can be determined so that the surface-mounted components installed on the metal chassis and the printed circuit board (10) can be insulated. According to safety standards (e.g., IEC62368-1), when the printed circuit board (10) satisfies the creepage distance, the thickness of the insulating substrate (20) can be formed to be 0.4 mm or more.

[0088] The insulating substrate (20) can be formed to have a thickness thinner than the printed circuit board (10).

[0089] The insulating substrate (20) can be attached to the printed circuit board (10) by means of an adhesive member (30). That is, an adhesive member (30) can be provided between the insulating substrate (20) and the printed circuit board (10). Specifically, the insulating substrate (20) can be attached to the lower copper layer (13) of the printed circuit board (10) by means of the adhesive member (30).

[0090] As the adhesive material (30), the no-flow prepreg or bonding sheet described above can be used.

[0091] In the above, a double-sided printed circuit board (10) was used as the printed circuit board. However, the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure is not limited thereto. As illustrated in FIGS. 5 to 7, a single-sided printed circuit board (10) may be used.

[0092] FIG. 5 is a perspective view showing a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure. FIG. 6 is an exploded perspective view showing a printed circuit board (10') and an insulating substrate (20) of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure. FIG. 7 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0093] Referring to FIGS. 5 to 7, a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure may include a printed circuit board (10') and an insulating substrate (20).

[0094] The printed circuit board (10') is formed in a flat shape and includes a base plate (11) and a copper foil layer (12). The copper foil layer (12) is formed on the upper surface of the base plate (11). The base plate (11) is formed of an insulating material. In other words, the printed circuit board (10') can be formed as a single-sided printed circuit board.

[0095] The printed circuit board (10') may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the printed circuit board (10') upwardly and downwardly. The at least one through hole (15) may be formed to accommodate a surface mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface mount component to be accommodated. For example, as illustrated in FIG. 16, when the surface mount component (70) is installed on the upper side of the printed circuit board (10'), the lower part of the body (72) of the surface mount component (70) may be formed to be accommodated in the through hole (15).

[0096] In this embodiment, two through holes (15) are formed in the printed circuit board (10'), but this is only an example, and the number of through holes (15) is not limited thereto. As another example, depending on the number of surface-mount components used, one through hole (15) or three or more through holes (15) may be formed in the printed circuit board (10'). A transformer, capacitor, etc. may be installed in the through hole (15).

[0097] In this way, by forming a through hole (15) in a printed circuit board (10') and installing a surface-mount component in the through hole (15), the height from the upper surface of the printed circuit board (10') to the upper end of the surface-mount component can be reduced. That is, the height of a power board using a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure can be reduced.

[0098] The printed circuit board (10') can be formed of FR-1. That is, the base plate (11) can be formed of FR-1 material, and the copper foil layer (12) can be formed of copper (Cu). FR-1 has insulating properties.

[0099] Alternatively, the base plate (11) may be formed of any one of FR-3, CEM-1, and CEM-3 instead of FR-1.

[0100] The insulating substrate (20) is installed on the lower surface of the printed circuit board (10'). That is, the insulating substrate (20) is installed below the base plate (11) of the printed circuit board (10'). The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is formed of the same material as the base plate (11) of the printed circuit board (10'). That is, the insulating substrate (20) may be formed of an FR-1 material.

[0101] When the base plate (11) is formed of any one of the materials of FR-3, CEM-1, and CEM-3, the insulating substrate (20) can also be formed of any one of the materials of FR-3, CEM-1, and CEM-3, similar to the base plate (11).

[0102] The insulating substrate (20) can be formed to have the same shape and size as the printed circuit board (10').

[0103] The thickness of the insulating substrate (20) can be determined so that the electronic components installed on the metal chassis and the printed circuit board (10') can be insulated. According to safety standards (e.g., IEC62368-1), when the printed circuit board (10') satisfies the creepage distance, the thickness of the insulating substrate (20) can be formed to be 0.4 mm or more.

[0104] The insulating substrate (20) can be formed to have a thickness thinner than the printed circuit board (10').

[0105] The insulating substrate (20) can be attached to the printed circuit board (10') by means of an adhesive member (30). That is, an adhesive member (30) can be provided between the insulating substrate (20) and the printed circuit board (10'). Specifically, the insulating substrate (20) can be attached to the lower surface of the base plate (11) of the printed circuit board (10') by means of the adhesive member (30).

[0106] The adhesive member (30) may be formed of a material that is insulating and capable of bonding the printed circuit board (10') and the insulating substrate (20). The no-flow prepreg or bonding sheet described above may be used as the adhesive member (30).

[0107] The adhesive member (30) may include at least one through hole (31) corresponding to at least one through hole (15) formed in the printed circuit board (10').

[0108] In the embodiments of FIGS. 5 to 7, the base plate (11) and the insulating substrate (20) of the printed circuit board (10') are formed of the same material. However, the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure is not limited thereto. As illustrated in FIG. 8, the base plate (11) and the insulating substrate (20) of the printed circuit board (10') may be formed of different materials.

[0109] FIG. 8 is a side view of a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0110] Referring to FIG. 8, a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure may include a printed circuit board (10') and an insulating substrate (20).

[0111] The printed circuit board (10') is formed in a flat shape and includes a base plate (11) and a copper foil layer (12). The copper foil layer (12) is formed on the upper surface of the base plate (11). The base plate (11) is formed of an insulating material. In other words, the printed circuit board (10') can be formed as a single-sided printed circuit board.

[0112] The printed circuit board (10') may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the printed circuit board (10') vertically. The at least one through hole (15) may be formed to accommodate a surface-mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface-mount component to be accommodated.

[0113] The printed circuit board (10') can be formed of FR-1. That is, the base plate (11) can be formed of FR-1 material, and the copper foil layer (12) can be formed of copper (Cu).

[0114] The insulating substrate (20) is installed on the lower surface of the printed circuit board (10'). That is, the insulating substrate (20) is installed on the lower surface of the base plate (11) of the printed circuit board (10'). The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is formed of an insulating material different from that of the base plate (11) of the printed circuit board (10').

[0115] For example, the insulating substrate (20) may be formed of any one of insulating materials other than FR-1, FR-3, FR-4, CEM-1, and CEM-3.

[0116] The insulating substrate (20) can be formed to have the same shape and size as the printed circuit board (10').

[0117] The thickness of the insulating substrate (20) can be determined so that the electronic components installed on the metal chassis and the printed circuit board (10') can be insulated. According to safety standards (e.g., IEC62368-1), when the printed circuit board (10') satisfies the creepage distance, the thickness of the insulating substrate (20) can be formed to be 0.4 mm or more.

[0118] The insulating substrate (20) can be formed to have a thickness thinner than the printed circuit board (10').

[0119] The insulating substrate (20) can be attached to the printed circuit board (10') by means of an adhesive member (30). That is, an adhesive member (30) can be provided between the insulating substrate (20) and the printed circuit board (10'). Specifically, the insulating substrate (20) can be attached to the lower surface of the base plate (11) of the printed circuit board (10') by means of the adhesive member (30).

[0120] As the adhesive material (30), the no-flow prepreg or bonding sheet described above can be used.

[0121] The hybrid printed circuit board (1) described above is formed by one printed circuit board (10') and one insulating substrate (20). However, the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure is not limited thereto.

[0122] As another example, a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure may be formed of two printed circuit boards (10, 10') and one insulating substrate (20), as illustrated in FIGS. 9 and 10.

[0123] Fig. 9 is a perspective view showing a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure. Fig. 10 is an exploded perspective view showing a printed circuit board (10, 10') and an insulating substrate (20) of a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure.

[0124] Referring to FIGS. 9 and 10, a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure may include a first printed circuit board (10), a second printed circuit board (10'), and an insulating substrate (20).

[0125] The first printed circuit board (10) is formed in a flat shape and includes a first base plate (11) and two copper foil layers (12, 13). The two copper foil layers (12, 13) are formed on the upper and lower surfaces of the first base plate (11). The first base plate (11) is formed of an insulating material. In other words, the first printed circuit board (10) can be formed as a double-sided printed circuit board.

[0126] The first printed circuit board (10) may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the first printed circuit board (10) vertically. The at least one through hole (15) may be formed to accommodate a surface-mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface-mount component to be accommodated.

[0127] The first printed circuit board (10) may be formed of FR-4. That is, the first base plate (11) may be formed of FR-4 material, and the copper foil layers (12, 13) may be formed of copper (Cu). FR-4 has insulating properties.

[0128] The second printed circuit board (10') is formed separately from the first printed circuit board (10). The second printed circuit board (10') is formed in a flat shape and includes a second base plate (11') and a copper foil layer (12). The copper foil layer (12) is formed on the upper surface of the second base plate (11'). The second base plate (11') is formed of an insulating material. In other words, the second printed circuit board (10') can be formed as a single-sided printed circuit board.

[0129] The second printed circuit board (10') is formed to have the same thickness as the first printed circuit board (10). When the thickness of the upper copper layer (12) of the first printed circuit board (10) and the thickness of the copper layer (12) of the second printed circuit board (10') are the same, the thickness of the second base board (11') is formed to be thicker than the thickness of the first base board (11).

[0130] The second printed circuit board (10') may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the second printed circuit board (10') vertically. The at least one through hole (15) may be formed to accommodate a surface-mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface-mount component to be accommodated.

[0131] Since the second printed circuit board (10') is a single-sided printed circuit board, it may be formed of a different material from the first printed circuit board (10), which is a double-sided printed circuit board. That is, the second printed circuit board (10') may be formed of FR-1. Specifically, the second base plate (11') may be formed of FR-1, and the copper foil layer (12) may be formed of copper (Cu). FR-1 has insulating properties.

[0132] Alternatively, the second base plate (11') may be formed of any one of FR-3, CEM-1, and CEM-3 instead of FR-1.

[0133] The insulating substrate (20) is installed on the lower surfaces of the first printed circuit board (10) and the second printed circuit board (10'). That is, the first printed circuit board (10) and the second printed circuit board (10') are installed on the upper surface of the insulating substrate (20). Accordingly, the lower copper layer (13) of the first printed circuit board (10) and the second base plate (11') of the second printed circuit board (10') are adjacent to the upper surface of the insulating substrate (20).

[0134] The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is the same as the first base plate (11) of the first printed circuit board (10), and is formed of a different insulating material from the second base plate (11') of the second printed circuit board (10'). That is, the insulating substrate (20) may be formed of an FR-4 material.

[0135] The insulating substrate (20) can be formed to have a shape and size corresponding to the first printed circuit board (10) and the second printed circuit board (10').

[0136] The thickness of the insulating substrate (20) can be determined so that the electronic components installed on the metal chassis and the first and second printed circuit boards (10, 10') can be insulated. According to safety standards (e.g., IEC62368-1), when the first printed circuit board (10) and the second printed circuit board (10') satisfy the creepage distance, the thickness of the insulating substrate (20) can be formed to be 0.4 mm or more.

[0137] The insulating substrate (20) can be formed to have a thickness thinner than the first printed circuit board (10) and the second printed circuit board (10').

[0138] The first printed circuit board (10) and the second printed circuit board (10') can be attached to the insulating substrate (20) by an adhesive member (30). That is, the adhesive member (30) can be provided between the insulating substrate (20) and the first and second printed circuit boards (10, 10'). Specifically, the insulating substrate (20) can be attached to the lower copper layer (13) of the first printed circuit board (10) and the lower surface of the second base plate (11') of the second printed circuit board (10') by the adhesive member (30).

[0139] The adhesive member (30) can be formed of a material that has insulating properties and can bond the first and second printed circuit boards (10, 10') and the insulating substrate (20).

[0140] For example, the no-flow prepreg or bonding sheet described above can be used as the adhesive member (30).

[0141] The adhesive member (30) may include two through holes (31) corresponding to the through hole (15) formed in the first printed circuit board (10) and the through hole (15) formed in the second printed circuit board (10').

[0142] In the embodiments of FIGS. 9 and 10 described above, the first base plate (11) of the first printed circuit board (10) is formed of the same material as the insulating substrate (20). However, the hybrid printed circuit board (1') according to one or more embodiments of the present disclosure is not limited thereto. As illustrated in FIG. 11, the insulating substrate (20) may be formed of the same material as the second base plate (11') of the second printed circuit board (10').

[0143] FIG. 11 is a side view of a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure.

[0144] Referring to FIG. 11, a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure may include a first printed circuit board (10), a second printed circuit board (10'), and an insulating substrate (20).

[0145] The first printed circuit board (10) and the second printed circuit board (10') are the same as the embodiments illustrated in FIGS. 9 and 10, so detailed descriptions are omitted.

[0146] The insulating substrate (20) is installed on the lower surfaces of the first printed circuit board (10) and the second printed circuit board (10'). That is, the first printed circuit board (10) and the second printed circuit board (10') are installed on the upper surface of the insulating substrate (20). Accordingly, the lower copper layer (13) of the first printed circuit board (10) and the second base plate (11') of the second printed circuit board (10') are adjacent to the upper surface of the insulating substrate (20).

[0147] The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is identical to the second base plate (11') of the second printed circuit board (10') and is formed of a different insulating material from the first base plate (11) of the first printed circuit board (10). That is, the insulating substrate (20) may be formed of an FR-1 material.

[0148] If the second base plate (11') is formed of any one of FR-3, CEM-1, and CEM-3 instead of FR-1, the insulating substrate (20) can be formed of any one of FR-3, CEM-1, and CEM-3, the same material as the second base plate (11').

[0149] The insulating substrate (20) has the same characteristics as the insulating substrate (20) of the embodiment illustrated in FIGS. 9 and 10 described above except for the material, so a detailed description thereof is omitted.

[0150] The first printed circuit board (10) and the second printed circuit board (10') can be attached to the insulating substrate (20) by an adhesive member (30). That is, the adhesive member (30) can be provided between the insulating substrate (20) and the first and second printed circuit boards (10, 10'). Specifically, the insulating substrate (20) can be attached to the lower copper layer (13) of the first printed circuit board (10) and the lower surface of the second base plate (11') of the second printed circuit board (10') by the adhesive member (30).

[0151] The adhesive member (30) is the same as the adhesive member (30) of the embodiment illustrated in FIGS. 9 and 10, so a detailed description thereof is omitted.

[0152] Two printed circuit boards (10, 10') can be electrically connected using a connecting substrate (40). Hereinafter, with reference to FIGS. 12 to 14, a hybrid printed circuit board (1') having such a structure according to one or more embodiments of the present disclosure will be described.

[0153] Fig. 12 is a perspective view showing a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure. Fig. 13 is a plan view showing a first printed circuit board (10) and a second printed circuit board (10') of a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure. Fig. 14 is a bottom perspective view showing a connection board (40) of a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure.

[0154] Referring to FIG. 12, a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure may include a first printed circuit board (10), a second printed circuit board (10'), an insulating substrate (20), and a connecting substrate (40).

[0155] The first printed circuit board (10) is formed in a flat shape and includes a first base plate (11) and two copper foil layers (12, 13). The two copper foil layers (12, 13) are formed on the upper and lower surfaces of the base plate (11). That is, the first printed circuit board (10) includes an upper copper foil layer (12) and a lower copper foil layer (13). The first base plate (11) is formed of an insulating material. In other words, the first printed circuit board (10) can be formed as a double-sided printed circuit board.

[0156] The first printed circuit board (10) may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the first printed circuit board (10) vertically. The at least one through hole (15) may be formed to accommodate a surface-mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface-mount component to be accommodated.

[0157] The first printed circuit board (10) may include a first terminal pattern (16) formed on the upper surface. That is, the first terminal pattern (16) may be formed on the upper copper layer (12) of the first printed circuit board (10). The first terminal pattern (16) may be formed to contact one side of the first printed circuit board (10). The first terminal pattern (16) may be formed by the same method as the electronic circuit forming method when forming an electronic circuit on the upper copper layer (12).

[0158] The first terminal pattern (16) may include a plurality of terminals. The plurality of terminals may be formed at regular intervals along the side of the first printed circuit board (10). The first terminal pattern (16) may be connected to an electronic circuit formed on the upper copper layer (12).

[0159] The first printed circuit board (10) may be formed of FR-4. That is, the first base plate (11) may be formed of FR-4 material, and the upper and lower copper layers (12, 13) may be formed of copper (Cu). FR-4 has insulating properties.

[0160] The second printed circuit board (10') is formed in a flat shape and includes a second base plate (11') and a copper foil layer (12). The copper foil layer (12) is formed on the upper surface of the second base plate (11'). The second base plate (11') is formed of an insulating material. In other words, the second printed circuit board (10') can be formed as a single-sided printed circuit board.

[0161] The second printed circuit board (10') is formed to have the same thickness as the first printed circuit board (10). When the thickness of the upper copper layer (12) of the first printed circuit board (10) and the thickness of the copper layer (12) of the second printed circuit board (10') are the same, the thickness of the second base board (11') is formed to be thicker than the thickness of the first base board (11).

[0162] The second printed circuit board (10') may include at least one through hole (15). The at least one through hole (15) may be formed to penetrate the second printed circuit board (10') vertically. The at least one through hole (15) may be formed to accommodate a surface-mount component. That is, the at least one through hole (15) may be formed with an area corresponding to the size of the surface-mount component to be accommodated.

[0163] The second printed circuit board (10') may include a second terminal pattern (16') formed on the upper surface. That is, the second terminal pattern (16') may be formed on the copper layer (12) of the second printed circuit board (10'). The second terminal pattern (16') may be formed to correspond to the first terminal pattern (16) of the first printed circuit board (10). The second terminal pattern (16') may be formed to contact one side of the second printed circuit board (10'). The second terminal pattern (16') may be formed by the same method as the electronic circuit forming method when forming an electronic circuit on the copper layer (12).

[0164] The second terminal pattern (16') may include a plurality of terminals. The plurality of terminals may be formed at regular intervals along the side of the second printed circuit board (10'). The second terminal pattern (16') may be connected to an electronic circuit formed on the copper layer (12).

[0165] Since the second printed circuit board (10') is a single-sided printed circuit board, it may be formed of a different material from the first printed circuit board (10), which is a double-sided printed circuit board. That is, the second printed circuit board (10') may be formed of FR-1. Specifically, the second base plate (11') may be formed of FR-1, and the copper foil layer (12) may be formed of copper (Cu). FR-1 has insulating properties.

[0166] Alternatively, the second base plate (11') may be formed of any one of FR-3, CEM-1, and CEM-3 instead of FR-1.

[0167] The insulating substrate (20) is installed on the lower surfaces of the first printed circuit board (10) and the second printed circuit board (10'). That is, the first printed circuit board (10) and the second printed circuit board (10') are installed on the upper surface of the insulating substrate (20). Accordingly, the lower copper layer (13) of the first printed circuit board (10) and the second base plate (11') of the second printed circuit board (10') are adjacent to the upper surface of the insulating substrate (20).

[0168] The insulating substrate (20) is formed of an insulating material. In the present embodiment, the insulating substrate (20) is the same as the first base plate (11) of the first printed circuit board (10), and is formed of a different insulating material from the second base plate (11') of the second printed circuit board (10'). That is, the insulating substrate (20) may be formed of an FR-4 material.

[0169] As another example, the insulating substrate (20) is identical to the second base plate (11') of the second printed circuit board (10'), and may be formed of a different insulating material from the first base plate (11) of the first printed circuit board (10).

[0170] The insulating substrate (20) can be formed to have a shape and size corresponding to the first printed circuit board (10) and the second printed circuit board (10').

[0171] The thickness of the insulating substrate (20) can be determined so that the electronic components installed on the metal chassis and the first and second printed circuit boards (10, 10') can be insulated. According to safety standards (e.g., IEC62368-1), when the first printed circuit board (10) and the second printed circuit board (10') satisfy the creepage distance, the thickness of the insulating substrate (20) can be formed to be 0.4 mm or more.

[0172] The insulating substrate (20) can be formed to have a thickness thinner than the first printed circuit board (10) and the second printed circuit board (10').

[0173] The first printed circuit board (10) and the second printed circuit board (10') can be attached to the insulating substrate (20) by an adhesive member (30). That is, the adhesive member (30) can be provided between the insulating substrate (20) and the first and second printed circuit boards (10'). Specifically, the insulating substrate (20) can be attached to the lower copper layer (13) of the first printed circuit board (10) and the lower surface of the second base plate (11') of the second printed circuit board (10') by the adhesive member (30).

[0174] The adhesive member (30) may be formed of a material that is insulating and capable of bonding the first and second printed circuit boards (10, 10') and the insulating substrate (20). For example, the no-flow prepreg or bonding sheet described above may be used as the adhesive member (30).

[0175] A connecting substrate (40) is installed on the upper surface of the first terminal pattern (16) and the second terminal pattern (16'). The connecting substrate (40) is formed to connect the first terminal pattern (16) and the second terminal pattern (16'). To this end, the connecting substrate (40) may include a connecting pattern (41) that connects the first terminal pattern (16) and the second terminal pattern (16').

[0176] A connection pattern (41) may be formed on the lower surface of a connection substrate (40). The connection pattern (41) may be formed of a plurality of connection terminals spaced at regular intervals. The plurality of connection terminals may be formed of a copper layer. The plurality of connection terminals are formed to correspond to the plurality of terminals of the first and second printed circuit boards (10, 10').

[0177] Accordingly, when the connection substrate (40) is positioned on the first terminal pattern (16) of the first printed circuit board (10) and the second terminal pattern (16') of the second printed circuit board (10'), the plurality of connection terminals of the connection pattern (41) of the connection substrate (40) are positioned on the plurality of terminals of the first terminal pattern (16) and the plurality of terminals of the second terminal pattern (16'), so that the first terminal pattern (16) and the second terminal pattern (16') can be electrically connected. At this time, for a stable electrical connection, the connection pattern (41) of the connection substrate (40) can be soldered to the first terminal pattern (16) and the second terminal pattern (16').

[0178] As described above, by using the connecting board (40), the first printed circuit board (10) and the second printed circuit board (10') can be electrically connected. Therefore, since there is no need to use a connector to connect the first printed circuit board (10) and the second printed circuit board (10'), the height of the connected portion can be lowered, and material costs can be reduced.

[0179] Hereinafter, a method for manufacturing a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure illustrated in FIG. 12 will be described with reference to FIGS. 15a to 15c.

[0180] FIG. 15a, FIG. 15b, and FIG. 15c are drawings for explaining a method of manufacturing a hybrid printed circuit board (1') according to one or more embodiments of the present disclosure.

[0181] First, as illustrated in Fig. 15a, solder paste (50) is applied to the upper surface of the first terminal pattern (16) of the first printed circuit board (10) and the upper surface of the second terminal pattern (16') of the second printed circuit board (10'). At this time, solder paste may also be applied to the portion where the surface mount device (SMD) of the printed circuit formed on the upper copper layers (12, 12) of the first and second printed circuit boards (10, 10') is to be attached.

[0182] Next, as illustrated in Fig. 15b, the connection substrate (40) is positioned on the solder paste (50) applied to the first terminal pattern (16) and the second terminal pattern (16'). In this case, the connection substrate (40) is positioned so that the connection pattern (41) is in contact with the solder paste (50) of the first terminal pattern (16) and the second terminal pattern (16'). At this time, the surface mount element can also be positioned on the solder paste applied to the attachment portion of the surface mount element of the printed circuit of the first and second printed circuit boards (10, 10').

[0183] In this state, a reflow process is performed on the hybrid printed circuit board (1').

[0184] Then, as illustrated in Fig. 15c, the connection substrate (40) is connected to the first terminal pattern (16) of the first printed circuit board (10) and the second terminal pattern (16') of the second printed circuit board (10') by the solder paste (50). Therefore, the first printed circuit board (10) and the second printed circuit board (10') can be electrically connected by the connection substrate (40). At this time, the solder paste (50) between the connection pattern (41) and the first and second terminal patterns (16, 16') is exposed to the outside. Therefore, by visually checking the exposed solder paste (50), it is possible to check whether the connection pattern (41) and the first and second terminal patterns (16, 16') are well connected.

[0185] In addition, when the reflow process is performed, surface mount elements can be attached to the printed circuits of the first and second printed circuit boards (10, 10') by solder paste (50).

[0186] In the above, the case where two printed circuit boards (10, 10'), i.e., a first printed circuit board (10) and a second printed circuit board (10') installed on the upper surface of an insulating substrate (20) are electrically connected using a connection substrate (40) has been described. However, as another example, the method of connecting two printed circuit boards (10, 10') using a connection substrate (40) as described above can also be applied to the case where two printed circuit boards (10, 10') that do not have an insulating substrate (20) are connected.

[0187] For example, the above-described connection board (40) can be used to connect the T-con (timing controller) board and the power board of the display device. At this time, the T-con board can be formed as a double-sided printed circuit board (10), and the power board can be formed as a single-sided printed circuit board (10').

[0188] Hereinafter, with reference to FIGS. 16 to 18, the thickness of a power board (100) using a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure is compared with the thickness of a power board (101) according to the prior art.

[0189] FIG. 16 is a drawing showing a power board (100) using a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure installed on a metal chassis (200).

[0190] Referring to FIG. 16, a power board (100) according to one or more embodiments of the present disclosure includes a hybrid printed circuit board (1).

[0191] A hybrid printed circuit board (1) includes a double-sided printed circuit board (10) and an insulating substrate (20).

[0192] A printed circuit board (10) includes a base plate (11), an upper copper layer (12), and a lower copper layer (13). Surface mount components (70, 80) are installed on the upper copper layer (12) of the printed circuit board (10). The surface mount components (70, 80) can be fixed to the upper surface of the printed circuit board (10) using surface mount technology.

[0193] The printed circuit board (10) includes a through hole (15). A surface mount component (70) having a high height can be accommodated in the through hole (15). In other words, the lower part of the body (72) of the surface mount component (70) can be accommodated in the through hole (15). At this time, the lead (71) of the surface mount component (70) can be fixed to a printed circuit formed on the upper surface of the printed circuit board (10) by soldering. For example, the surface mount component (70) having a high height can be a transformer.

[0194] A low-height surface-mounted device (80) can be installed in a portion without a through hole (15). At this time, the lead (81) of the surface-mounted device (80) can be fixed to a printed circuit formed on the upper surface of a printed circuit board (10) by soldering.

[0195] The power board (100) can be installed on the metal chassis (200). That is, the power board (100) can be installed on the upper surface of the metal chassis (200). At this time, the lower surface of the insulating substrate (20) of the hybrid printed circuit board (1) can be in contact with the upper surface of the metal chassis (200).

[0196] In this case, the thickness (T) of the hybrid printed circuit board (1) can satisfy the safety standard (e.g., IEC62368-1). For example, the thickness of the hybrid printed circuit board (1) can be 1.8 mm. At this time, the thickness (T1) of the printed circuit board (10) is about 1.2 mm, and the thickness (T2) of the insulating substrate (20) is about 0.6 mm. The thickness (T2) of the insulating substrate (20) includes the thickness of the adhesive member (30).

[0197] Accordingly, the power board (100) using the hybrid printed circuit board (1) according to the present embodiment can satisfy the safety standards since the height from the upper surface of the metal chassis (200) to the upper surface of the hybrid printed circuit board (1) (hereinafter referred to as the installation height of the power board) is 1.8 mm.

[0198] Fig. 17 is a drawing showing a power board (101) according to a conventional technology installed on a metal chassis (200).

[0199] Referring to FIG. 17, a power board (101) according to the prior art includes a printed circuit board (110) according to the prior art.

[0200] A plurality of lead holes are formed in a printed circuit board (110) according to a conventional technology. Leads (71') of electronic components (70) are inserted into the plurality of lead holes and protrude downward from the printed circuit board (10).

[0201] An insulating sheet (210) is installed on the upper surface of the metal chassis (200). The thickness (T3) of the insulating sheet (210) is at least 0.5 mm.

[0202] The power board (101) is installed at a certain distance from the insulating sheet (210) so that the lead (71') of the electronic component (70') does not come into contact with the insulating sheet (210). For this purpose, the distance (D) between the printed circuit board (110) and the insulating sheet (210) needs to be maintained at 2.5 mm.

[0203] The thickness (T1') of the printed circuit board (110) is 1.6 mm. The thickness of the printed circuit board (110) used in the power board (101) must be 1.6 mm or more.

[0204] Accordingly, the power board (101) using the printed circuit board (110) according to the prior art can satisfy the safety standards since the height from the upper surface of the metal chassis (200) to the upper surface of the printed circuit board (110), i.e., the installation height (T') of the power board (101), is 4.6 mm. Here, T' = T1' + D + T3 = 1.6 mm + 2.5 mm + 0.5 mm = 4.6 mm.

[0205] However, since the power board (101) according to the prior art has an installation height (T') of 4.6 mm, it is 2.8 mm higher than the installation height (T) of the power board (100) using the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure, which may limit the reduction in the thickness of the display device.

[0206] Fig. 18 is a drawing showing a power board (102) using an SMD printed circuit board (10") installed on a metal chassis (200).

[0207] Referring to FIG. 18, the power board (102) includes an SMD printed circuit board (10").

[0208] An SMD printed circuit board (10") refers to a printed circuit board on which a surface mount device (SMD) (70) can be mounted.

[0209] The SMD printed circuit board (10") can be formed as a single-sided printed circuit board. That is, the SMD printed circuit board (10") includes a base plate (11) and a copper foil layer (12). A surface mount element (70) is installed on the copper foil layer (12) of the SMD printed circuit board (10"). The surface mount element (70) can be fixed to the upper surface of the SMD printed circuit board (10") using surface mount technology.

[0210] The SMD printed circuit board (10") includes a through hole (15). A surface mount device (70) having a high height can be accommodated in the through hole (15). In other words, the lower part of the body (72) of the surface mount device (70) can be accommodated in the through hole (15). At this time, the lead (71) of the surface mount device (70) can be fixed to a printed circuit formed on the upper surface of the SMD printed circuit board (10") by soldering.

[0211] An insulating sheet (210) is installed on the upper surface of the metal chassis (200). The thickness (T3) of the insulating sheet (210) is at least 0.5 mm.

[0212] The power board (102) is installed on the upper side of the insulating sheet (210). That is, the power board (102) is installed on the upper surface of the insulating sheet (210). At this time, the lower surface of the SMD printed circuit board (10"), that is, the lower surface of the base plate (11), is in contact with the insulating sheet (210).

[0213] The thickness (T1") of the SMD printed circuit board (10") is 1.6 mm. The thickness of the SMD printed circuit board (10") used in the power board (102) must be 1.6 mm or more.

[0214] Accordingly, the power board (102) using the SMD printed circuit board (10") can satisfy the safety standards because the height from the upper surface of the metal chassis (200) to the upper surface of the SMD printed circuit board (10"), i.e., the installation height (T") of the power board (102), is 2.1 mm. Here, T" = T1" + T3 = 1.6 mm + 0.5 mm = 2.1 mm.

[0215] The power board (102) using the SMD printed circuit board (10") has an installation height (T") of 2.1 mm, which is 0.3 mm higher than the installation height (T) of the power board (100) using the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0216] In a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure, since the insulating substrate (20) has the same or similar strength as the base plate (11) of the printed circuit board (10), the sum of the thickness of the printed circuit board (10) and the thickness of the insulating substrate (20) becomes the thickness of the hybrid printed circuit board (1). Therefore, the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure can satisfy the thickness of the printed circuit board of 1.6 mm required for the power board (100, 101, 102).

[0217] However, since the strength of the insulating sheet (210) is lower than the strength of the base plate (11) of the printed circuit board (10), the SMD printed circuit board (10") cannot be made thinner. Accordingly, the power board (102) using the SMD printed circuit board (10") and the insulating sheet (210) cannot be made thinner than the power board (100) using the hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0218] Fig. 19 is a perspective view showing a state in which a warpage prevention reinforcing member (90) is installed on a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure. Fig. 20 is a perspective view showing a state in which a warpage prevention reinforcing member (90) is separated from a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure.

[0219] Referring to FIGS. 19 and 20, a hybrid printed circuit board (1) according to one or more embodiments of the present disclosure may include a warpage-preventing reinforcing member (90). Two warpage-preventing reinforcing members (90) may be installed on the upper surface of the hybrid printed circuit board (1). The warpage-preventing reinforcing members (90) may include a reinforcing material formed to prevent or suppress warpage of the printed circuit board (1).

[0220] The warpage prevention reinforcing member (90) is formed as a flat plate in the shape of a bar with a narrow width and a long length, and a plurality of fixing protrusions (91) may be formed on the lower surface of the warpage prevention reinforcing member (90). In the present embodiment, the warpage prevention reinforcing member (90) includes three fixing protrusions (91). A copper layer may be provided on both sides of the warpage prevention reinforcing member (90) above the plurality of fixing protrusions (91).

[0221] A plurality of fixing holes (92) are formed on the upper surface of the hybrid printed circuit board (1). The plurality of fixing holes (92) are formed in a number corresponding to the plurality of fixing protrusions (91) of the warpage-preventing reinforcing member (90). In the case of the present embodiment, since the warpage-preventing reinforcing member (90) includes three fixing protrusions (91), three fixing holes (92) are formed on the upper surface of the hybrid printed circuit board (1).

[0222] A soldering position (93) may be provided on both sides of each of the plurality of fixing holes (92). The soldering position (93) is provided so that a warpage prevention reinforcing member (90) can be fixed by soldering.

[0223] Accordingly, by inserting a plurality of fixing projections (91) of a warpage-preventing reinforcing member (90) into a plurality of fixing holes (92) on the upper surface of a hybrid printed circuit board (1) and connecting a plurality of soldering points (93) and the warpage-preventing reinforcing member (90) by soldering, the warpage-preventing reinforcing member (90) can be fixed to the upper surface of the hybrid printed circuit board (1).

[0224] When a warpage prevention reinforcing member (90) is installed on a hybrid printed circuit board (1), the strength of the hybrid printed circuit board (1) is improved. Accordingly, even when the thickness of the hybrid printed circuit board (1) is thin, the strength of the hybrid printed circuit board (1) can be maintained.

[0225] While the present disclosure has been illustrated and described above with reference to various embodiments, it will be understood that these various examples are illustrative and not limiting of the present disclosure. It will be understood by those skilled in the art that various changes in form and detail may be made without departing from the scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. Insulating substrate; A printed circuit board mounted on an upper surface of the insulating substrate and including at least one through-hole for accommodating a surface mount component; and A hybrid printed circuit board, comprising: an adhesive member provided between the insulating substrate and the printed circuit board.

2. In paragraph 1, A hybrid printed circuit board, wherein the above adhesive member is formed of a no-flow prepreg or a bonding sheet.

3. In paragraph 1, A hybrid printed circuit board, wherein the above insulating substrate is formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.

4. In paragraph 1, A hybrid printed circuit board, wherein the thickness of the insulating substrate is at least 0.4 mm.

5. In paragraph 1, The above printed circuit board, base plate; and A hybrid printed circuit board comprising a copper layer formed on at least one of the upper and lower surfaces of the base plate.

6. In paragraph 5, A hybrid printed circuit board, wherein the base plate of the above printed circuit board is formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.

7. In paragraph 1, The above printed circuit board includes a base plate and a copper layer provided on one surface of the base plate, A hybrid printed circuit board, wherein the above insulating substrate is formed of the same insulating material as the base plate.

8. In paragraph 1, The above printed circuit board includes a base plate and a copper layer provided on one surface of the base plate, A hybrid printed circuit board, wherein the above insulating substrate is formed of a different insulating material from the base plate.

9. In paragraph 1, The above printed circuit board includes a base plate and an upper copper layer and a lower copper layer provided on the upper and lower surfaces of the base plate, A hybrid printed circuit board, wherein the above insulating substrate is formed of the same insulating material as the base plate.

10. In paragraph 1, The above printed circuit board includes a base plate and an upper copper layer and a lower copper layer provided on the upper and lower surfaces of the base plate, A hybrid printed circuit board, wherein the above insulating substrate is formed of a different insulating material from the base plate.

11. In paragraph 1, The above printed circuit board is a hybrid printed circuit board including a first printed circuit board and a second printed circuit board that are electrically connected to each other.

12. In paragraph 11, The above first printed circuit board includes a first terminal pattern formed on an upper surface, The above second printed circuit board includes a second terminal pattern formed on the upper surface to correspond to the first terminal pattern, A hybrid printed circuit board, wherein the printed circuit board further includes a connection substrate installed on the upper surface of the first terminal pattern and the second terminal pattern and electrically connecting the first terminal pattern and the second terminal pattern.

13. In paragraph 12, A hybrid printed circuit board, wherein the above-mentioned connecting substrate includes a connecting pattern formed to connect the first terminal pattern and the second terminal pattern.

14. In paragraph 11, A hybrid printed circuit board, wherein the first printed circuit board is formed as a double-sided printed circuit board and the second printed circuit board is formed as a single-sided printed circuit board.

15. In paragraph 1, A hybrid printed circuit board further comprising a warpage-preventing reinforcing material installed on the upper surface of the printed circuit board.

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