Radio frequency resistor, radio frequency system, and communication device

Abstract

A radio frequency resistor, a radio frequency system, and a communication device. The radio frequency resistor comprises: a connection layer, a resistor substrate and a resistor film layer, wherein the resistor substrate is located on the connection layer, the resistor film layer is located on the resistor substrate, and the thermal expansion coefficient of the connection layer is greater than the thermal expansion coefficient of the resistor substrate. When the radio frequency resistor and a single-board structure are attached, the difference value between the thermal expansion coefficient of the connection layer and the thermal expansion coefficient of the single-board structure is less than or equal to a threshold value. By means of providing a connection layer, the difference value between the thermal expansion coefficient of the connection layer and the thermal expansion coefficient of a single-board structure is less than or equal to a threshold value, which can effectively enhance the stability of the connection between a radio frequency resistor and the surface of the single-board structure when the radio frequency resistor works for a long time in an environment with irregular or regular alternating changes between high and low temperatures, and thus the tolerance of the radio frequency resistor to a working environment with temperature changes can be effectively improved.

Description

RF resistors, RF systems and communication equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 19, 2023, with application number 202311212010.7 and application name “RF Resistor, RF System and Communication Equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of radio frequency resistors, and more specifically, to a radio frequency resistor, a radio frequency system, and a communication device. Background Art

[0003] RF resistors are electronic components that use high-frequency current to generate high-frequency electromagnetic waves. They are one of the key components in the field of microwave communications and have good resistance accuracy and return loss performance.

[0004] RF resistors need to work for a long time in environments such as temperature cycling and power changes. For example, they need to experience alternating changes between high and low temperatures, as well as alternating changes between high power and low power.

[0005] However, existing RF resistors cannot be permanently applied to the above working environment. Therefore, how to effectively improve the tolerance of RF resistors in working environments with temperature changes is a technical problem that needs to be solved urgently.

[0006] Summary of the Invention

[0007] The present application provides a radio frequency resistor, a radio frequency system, and a communication device, which can effectively improve the tolerance of the radio frequency resistor to a working environment with temperature changes.

[0008] In a first aspect, a radio frequency resistor is provided, adapted for mounting on a single board structure. The radio frequency resistor comprises a connection layer, a resistor substrate, and a resistor film layer. The resistor substrate is positioned on the connection layer, and the resistor film layer is positioned on the resistor substrate. The difference between the thermal expansion coefficient of the connection layer and the thermal expansion coefficient of the single board structure is less than or equal to a threshold, and the thermal expansion coefficient of the connection layer is greater than the thermal expansion coefficient of the resistor substrate.

[0009] The value of the above threshold is not strictly limited, and it only needs to be used to stabilize the connection between the connection layer and the surface of the single board structure.

[0010] By setting a connecting layer, the difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single board structure is less than or equal to a threshold value. This can effectively enhance the stability of the connection between the RF resistor and the surface of the single board structure when working for a long time in an environment with irregular or regular alternation between high and low temperatures, thereby effectively improving the tolerance of the RF resistor to working environments with changing temperatures.

[0011] In one possible implementation, the RF resistor further includes: a pin, which includes a first end and a second end, the first end is connected to the resistor film layer, the second end is suspended, and the connection length between the second end and the first end is greater than the straight line length between the second end and the first end.

[0012] By setting the connection length between the first and second ends of the pin to be greater than the straight line length between the second and first ends, the impact of temperature stress on the pin's reliability can be reduced. For example, when experiencing thermal stress, this structure can help the pin release the thermal stress, making it less likely that the pin will break from the connection with the board surface.

[0013] In a second aspect, a radio frequency system is provided, comprising: a single-board structure, a connecting layer, a resistor substrate, and a resistor film layer; the connecting layer is used to connect the single-board structure and the resistor substrate; the resistor film layer is located on the resistor substrate; the difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single-board structure is less than or equal to a threshold value, and the thermal expansion coefficient of the connecting layer is greater than the thermal expansion coefficient of the resistor substrate.

[0014] By setting a connecting layer, the difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single board structure is less than or equal to the threshold value. This can effectively enhance the stability of the connection between the RF resistor and the surface of the single board structure when working for a long time in an environment with irregular or regular alternating changes between high and low temperatures, thereby effectively improving the tolerance of the RF resistor to the working environment with changing temperature, and at the same time improving the reliability of the above-mentioned RF system.

[0015] In one possible implementation, the RF system further includes: a pin, which includes a first end and a second end, the first end is connected to the resistive film layer, the second end is connected to the single-board structure, and the connection length between the second end and the first end is greater than the straight line length between the second end and the first end.

[0016] By setting the connection length between the first and second ends of the pin to be greater than the straight line length between the second and first ends, the impact of temperature stress on the pin's reliability can be reduced. For example, when experiencing thermal stress, this structure can help the pin release the thermal stress, making it less likely that the pin will break from the connection with the board surface.

[0017] In addition, the above structure can also enhance the stability of the connection between the pins and the surface of the single board structure.

[0018] In a possible implementation, the single board structure is any one of the following: a power amplifier board, a transceiver board, or a printed circuit board.

[0019] In this way, different types of single board structures can be supported.

[0020] In combination with the solution described in any one of the first and second aspects, the thermal expansion coefficient of the connecting layer is less than or equal to the thermal expansion coefficient of the single board structure.

[0021] In this way, the selection of constituent materials of the connection layer can be increased.

[0022] In combination with the solution described in any one of the first and second aspects, the thermal expansion coefficient of the connecting layer is greater than or equal to the thermal expansion coefficient of the single board structure.

[0023] In this way, the selection of constituent materials of the connection layer can be increased.

[0024] In combination with any one of the solutions of the first aspect and the second aspect, the structure of the pin is any one of the following: Z-shaped, Ω-shaped, or arc-shaped.

[0025] Any one of the above structures can support releasing the temperature stress borne by the pins.

[0026] In combination with any one of the solutions of the first aspect and the second aspect, the component material of the pin is any one of the following: copper, red copper or beryllium copper.

[0027] Since copper materials are easily available and have good mechanical and electrical properties, this can effectively reduce costs and improve performance.

[0028] In combination with the solution described in any one of the first and second aspects, the connecting layer is made of copper.

[0029] In this way, the difference between the thermal expansion coefficient of the single board structure and the thermal expansion coefficient of the connection layer can be made smaller than or equal to the threshold.

[0030] In combination with any one of the solutions of the first aspect and the second aspect, the cross-sectional shape of the connecting layer is any one of the following: rectangular, square or circular.

[0031] Any of the above shapes can support better device processing.

[0032] According to a third aspect, a communication device is provided, comprising the radio frequency system described in the second aspect and any one of the second aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a schematic block diagram of a radio frequency resistor 100 according to an embodiment of the present application.

[0034] FIG2 is a schematic block diagram of a radio frequency resistor 200 according to an embodiment of the present application.

[0035] FIG3 is a schematic diagram illustrating a length relationship 300 between a first end and a second end of a pin.

[0036] FIG4 is a schematic block diagram of a radio frequency system 400 according to an embodiment of the present application. DETAILED DESCRIPTION

[0037] In order to facilitate understanding of the embodiments of the present application, the following points are first explained.

[0038] 1. In the various embodiments of this application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other. The technical features of different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0039] 2. The various numbers used in this application are for ease of description only and are not intended to limit the scope of protection of this application. The order of sequence numbers used in this application does not necessarily imply a specific order of execution. The order of execution of each process should be determined by its function and inherent logic.

[0040] For example, the terms "first," "second," "third," "fourth," and various other terminology and designations, if any, in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequential sequence. Such terms are interchangeable where appropriate, so that the embodiments described herein can be practiced in an order other than that illustrated or described herein.

[0041] At the same time, any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner to facilitate understanding.

[0042] 3. The terms "comprise", "include", "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that comprises a series of units is not necessarily limited to those units expressly listed but may include other units not expressly listed or inherent to such process, method, product or apparatus.

[0043] 4. The dotted arrows or boxes in the schematic diagrams in the accompanying drawings of this application specification represent optional steps or optional modules.

[0044] In order to effectively improve the tolerance of RF resistors in a working environment with temperature changes, the present application provides a RF resistor with a new structure, as shown in FIG1 .

[0045] Fig. 1 is a schematic block diagram of a radio frequency resistor 100 according to an embodiment of the present application. As shown in Fig. 1 , the radio frequency resistor 100 includes: a connection layer, a resistor substrate, and a resistor film layer.

[0046] In Figure 1 , the resistor substrate is located above the connection layer. In other words, the bottom surface of the resistor substrate is connected to the top surface of the connection layer. The bottom surface of the connection layer can also be used to connect to a single-board structure (not shown in Figure 1 ). For example, when the RF resistor 100 is used to be mounted on a single-board structure, the connection layer can be used to connect the resistor substrate and the single-board structure. For example, the connection layer is located above the single-board structure, and the resistor substrate is located above the connection layer.

[0047] Optionally, the connection between the resistor substrate and the connection layer may include high-temperature soldering or bonding with a high-heat-resistant material, so as to stabilize the connection between the resistor substrate and the connection layer.

[0048] Optionally, the surface of the connection layer may be subjected to surface treatment such as electroplating or spraying, so as to effectively improve the solderability of the connection layer and improve the anti-oxidation property of the connection layer.

[0049] In Figure 1 , the resistor film layer is located on a resistor substrate. The connection between the resistor film layer and the resistor substrate can be achieved through processes such as thick film printing and sputtering. For a detailed description of the connection between the resistor film layer and the resistor substrate, please refer to existing processes and will not be elaborated here.

[0050] For the RF resistor 100 shown in Figure 1 , the thermal expansion coefficient of the connecting layer can be greater than that of the resistor substrate, and the difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single-board structure can be less than or equal to a threshold. This can effectively enhance the stability of the connection between the RF resistor and the single-board surface during long-term operation in an environment with irregular or regular fluctuations between high and low temperatures, thereby effectively improving the tolerance and reliability of the RF resistor in temperature-stable operating environments.

[0051] It should be noted that the "difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single board structure is less than or equal to the threshold value" described in the embodiment of the present application can be: the difference between the thermal expansion coefficient of the constituent material of the connecting layer and the thermal expansion coefficient of the constituent material of the single board structure is less than or equal to the threshold value.

[0052] In addition, the “thermal expansion coefficient of the connection layer may be greater than the thermal expansion coefficient of the resistor substrate” described in the embodiment of the present application may mean that the thermal expansion coefficient of the constituent material of the connection layer is greater than the thermal expansion coefficient of the constituent material of the resistor substrate.

[0053] In the embodiment of the present application, the difference between the thermal expansion coefficient of the connection layer and the thermal expansion coefficient of the single board structure is less than or equal to a threshold value, which may include:

[0054] The thermal expansion coefficient of the connecting layer is greater than the thermal expansion coefficient of the single board structure, or the thermal expansion coefficient of the connecting layer is less than or equal to the thermal expansion coefficient of the single board structure. This can increase the selection of constituent materials of the connecting layer.

[0055] Specifically, the selection of the constituent material of the connecting layer is related to the constituent material of the single board structure. For example, if the single board structure uses material 1, the connecting layer needs to use material 2, and the difference between the thermal expansion coefficient of material 2 and the thermal expansion coefficient of material 1 is less than or equal to the threshold; or, if the connecting layer uses material 3, the single board structure needs to use material 4, and the difference between the thermal expansion coefficient of material 4 and the thermal expansion coefficient of material 3 is less than or equal to the threshold.

[0056] As an example, the thermal expansion coefficient of the single board structure is 17 ppm / ° C., and the thermal expansion coefficient of the connection layer may be 17.5 ppm / ° C. or 16.5 ppm / ° C. Accordingly, the threshold value may be 0.5 ppm / ° C.

[0057] In another example, the thermal expansion coefficient of the single-board structure is 18.5 ppm / °C, and the thermal expansion coefficient of the connection layer may be 19.5 ppm / °C or 17.5 ppm / °C. Accordingly, the threshold value may be 1 ppm / °C. For example, the connection layer may be made of copper (with a thermal expansion coefficient of 17.5 ppm / °C) or silver (with a thermal expansion coefficient of 19.5 ppm / °C).

[0058] As another example, the thermal expansion coefficient of the single-board structure is 15.7 ppm / °C, and the thermal expansion coefficient of the connection layer may be 17.5 ppm / °C or 13.9 ppm / °C. Accordingly, the threshold value may be 1.8 ppm / °C. For example, the connection layer may be made of copper (with a thermal expansion coefficient of 17.5 ppm / °C) or an iron-nickel alloy (with a thermal expansion coefficient of 13.9 ppm / °C).

[0059] This application supports the flexible setting of different thresholds based on the operating environment of the RF resistor. For example, as the temperature changes from day to night, the ambient temperature of the access network equipment changes accordingly; or as the communication traffic volume changes, the access network equipment adjusts the transmission power, corresponding to the temperature change inside the access network equipment. Due to the different thermal expansion coefficients of various materials, these temperature changes will cause temperature stress on the components or components inside the access network equipment, such as the RF resistor. Therefore, this application supports the flexible setting of different thresholds based on the operating environment of the RF resistor.

[0060] It should also be noted that the embodiments of the present application do not limit the selection of constituent materials of the resistor substrate and the resistor film layer. For example, the constituent material of the resistor substrate may be aluminum nitride, etc., or other materials may be used, which is not limited.

[0061] In summary, by setting a connecting layer, the difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single board structure is less than or equal to the threshold value, which can effectively enhance the stability of the connection between the RF resistor and the surface of the single board structure when working for a long time in an environment with irregular or regular alternating changes between high and low temperatures, thereby effectively improving the tolerance of the RF resistor to the working environment with temperature changes, and also improving the reliability of the above-mentioned RF resistor in the working environment with temperature changes.

[0062] In one possible implementation, the connecting layer may be made of copper or another metal or alloy material with a thermal expansion coefficient close to that of copper. This allows the difference between the thermal expansion coefficients of the single board structure and the connecting layer to be less than or equal to a threshold.

[0063] In one possible implementation, the cross-sectional shape of the connection layer (which can be understood as the shape corresponding to the top view) is any of the following: rectangular, square, or circular. By using any of the above shapes, the present application can support better device processing.

[0064] Optionally, the cross-sectional shape of the connecting layer may be other shapes, which are not limited.

[0065] In one possible implementation, the cross-sectional shape of the resistor substrate (which can be understood as the shape corresponding to the top view) is any of the following: rectangular, square, or circular. By using any of the above shapes, the present application can support better device processing.

[0066] Optionally, the cross-sectional shape of the resistor substrate may be other shapes, which are not limited.

[0067] In one possible implementation, the cross-sectional shape of the resistive film layer (which can be understood as the shape corresponding to the top view) is any of the following: rectangular, square, or circular. By using any of the above shapes, the present application can support better device processing.

[0068] Optionally, the cross-sectional shape of the resistance film layer may be other shapes, which are not limited.

[0069] Another radio frequency resistor according to an embodiment of the present application is described below with reference to the accompanying drawings.

[0070] Figure 2 is a schematic block diagram of an RF resistor 200 according to an embodiment of the present application. As shown in Figure 2 , RF resistor 200 includes a connection layer, a resistor substrate, a resistor film layer, and pins. The connection layer, resistor substrate, and resistor film layer are described in the same manner as for RF resistor 100 and are not further elaborated here.

[0071] The pins in the RF resistor 200 include a first end and a second end. The first end is connected to the resistor film layer, and the second end can be suspended. In other words, the second end can be not connected to other devices.

[0072] Optionally, the second end may also be connected to other devices, which is not limited.

[0073] Optionally, the second end may be flush with the single board structure, which is beneficial for connection with the surface of the single board structure.

[0074] For the RF resistor 200 shown in Figure 2 , the connection length between the first and second ends of the pin is greater than the straight-line length between the first and second ends of the pin. The connection length can be the actual length of the pin, starting from the first end and ending at the second end. The straight-line length can be the length between the first and second ends in terms of their geometric relationship. For details on the length relationship between the first and second ends, see Figure 3 .

[0075] FIG3 is a schematic diagram of the length relationship 300 between the first end and the second end of a pin. As shown in FIG3(a), the structure of the pin is a right-angle structure, and the connection length between the first end and the second end of the pin (represented by a solid line) is greater than the straight-line length between the first end and the second end of the pin (represented by a dotted line). As shown in FIG3(b), the structure of the pin is an arc structure, and the connection length between the first end and the second end of the pin (represented by a solid line) is greater than the straight-line length between the first end and the second end of the pin (represented by a dotted line). As shown in FIG3(c), the structure of the pin is a Z-shaped structure, and the connection length between the first end and the second end of the pin (represented by a solid line) is greater than the straight-line length between the first end and the second end of the pin (represented by a dotted line). As shown in FIG3(d), the structure of the pin is an Ω structure, and the connection length between the first end and the second end of the pin (represented by a solid line) is greater than the straight-line length between the first end and the second end of the pin (represented by a dotted line).

[0076] It should be noted that the pin structure shown in FIG3 is provided for illustrative purposes only and is not intended to be definitive. The pins of RF resistor 200 may also include other structures, such as regular or irregular structures, as long as they can relieve the thermal stress experienced by the pins and enhance the stability of the connection between the pins and the surface of the board structure. The specific structural form is not limited.

[0077] In summary, by setting the connection length between the first and second ends of the pin to be greater than the straight line length between the second and first ends, the impact of temperature stress on the reliability of the pin can be reduced. For example, when experiencing temperature stress, this structure can help the pin release the temperature stress, making the connection between the pin and the surface of the single board structure less likely to break.

[0078] Alternatively, the pins may be made of copper, red copper, beryllium copper, other metals, or alloys. This allows the thermal expansion coefficient of the pins to be the same as or close to that of the connection layer, thereby enhancing the stability of the connection between the pins and the surface of the board structure.

[0079] In addition, since copper materials are easily available and have good mechanical and electrical properties, this can effectively reduce costs and improve performance.

[0080] Optionally, the surface of the pins can be subjected to surface treatment such as electroplating or spray coating, which can improve the solderability of the pins and also improve the anti-oxidation properties of the pins.

[0081] The radio frequency system according to an embodiment of the present application is described below with reference to FIG4 .

[0082] Fig. 4 is a schematic block diagram of a radio frequency system 400 according to an embodiment of the present application. As shown in Fig. 4 , the radio frequency system 400 includes: a single board structure, a connection layer, a resistor substrate, and a resistor film layer.

[0083] Optionally, the radio frequency system 400 may further include pins. When the radio frequency system 400 further includes pins, the second ends of the pins may be connected to the single board structure.

[0084] In a possible implementation, the single board structure may be any one of the following: a power amplifier board, a transceiver board, or a printed circuit board (PCB), etc. Thus, the embodiment of the present application may support different types of single board structures.

[0085] When the single-board structure is a power amplifier board, the material of the connection layer is related to the material of the power amplifier board; when the single-board structure is a transceiver board, the material of the connection layer is related to the material of the transceiver board; when the single-board structure is a PCB, the material of the connection layer is related to the material of the PCB. This ensures that the difference between the thermal expansion coefficient of the connection layer and the thermal expansion coefficient of the single-board structure is less than or equal to a threshold value, thereby enhancing the stability of the connection between the connection layer and the surface of the single-board structure, thereby effectively improving the tolerance of the RF resistor to operating environments with fluctuating temperatures, and also improving the reliability of the RF resistor in such operating environments.

[0086] It should be noted that the structures or devices described in RF system 400 can be independent or integrated. For example, the connection layer, the resistor substrate, and the resistor film layer are integrated together to form RF resistor 100 or RF resistor 200; for example, the connection layer is connected to the single-board structure, and the resistor substrate and the resistor film layer are integrated together. In other words, this application does not limit the composition relationship between the various structures in RF system 400; they only need to be able to form RF system 400.

[0087] It should be noted that the above-mentioned radio frequency system 400 may also have other names, such as radio frequency component, etc., which is not limited to this.

[0088] By setting a connecting layer, the difference between the thermal expansion coefficient of the connecting layer and the thermal expansion coefficient of the single board structure is less than or equal to a threshold value. This can effectively enhance the stability of the connection between the RF resistor and the surface of the single board structure when working for a long time in an environment with irregular or regular alternating changes between high and low temperatures, thereby effectively improving the tolerance of the RF resistor to working environments with changing temperatures, and at the same time improving the stability and reliability of the above-mentioned RF system.

[0089] The embodiment of the present application may further provide a communication device, which includes a radio frequency system 400. The communication device may be a network device or a terminal device, which is not limited thereto.

[0090] When the communication device is a terminal device, it can be a device with wireless transceiver functions, and can refer to user equipment (UE), access terminal, subscriber unit, user station, mobile station, remote station, remote terminal, mobile device, user terminal, wireless communication device, user agent or user device. The terminal device may also be a satellite phone, a cellular phone, a smart phone, a wireless data card, a wireless modem, a machine type communication device, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), a customer premises equipment (CPE), a smart point of sale (POS) machine, a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, an in-vehicle device, a communication device carried on a high-altitude aircraft, a wearable device, a drone, a robot, a terminal in device-to-device (D2D) communication, a terminal in vehicle-to-everything (V2X), a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a smart grid, etc. This application does not limit the wireless terminals in the wireless grid, transportation safety, smart city, smart home, or terminal devices in the communication network evolved after 5G.

[0091] The communication device used to implement the functions of the terminal device can be the terminal device, or it can be a device that can support the terminal device to implement the functions, such as a chip system. The device can be installed in the terminal device or used in conjunction with the terminal device. In this application, the chip system can be composed of a chip or include a chip and other discrete devices.

[0092] When the communication device is a network device, it can be a device with wireless transceiver functions for communicating with a terminal device. The network device can be a node in a radio access network (RAN), which can also be called a base station, or a RAN node. It can be an evolved Node B (eNB or eNodeB) of LTE; or a base station of a 5G network such as gNodeB (gNB) or a base station in a public land mobile network (PLMN) evolved after 5G, a broadband network gateway (BNG), an aggregation switch or the 3GPP (the 3rd Generation Partnership Project). rd generation partnership project, 3GPP) access equipment, etc.

[0093] The RAN can be configured as a RAN defined by the 3GPP protocol, an open radio access network (O-RAN), or a cloud radio access network (C-RAN). Network equipment can also include various forms of base stations, such as macro base stations, micro base stations (also known as small stations), relay stations, transmission points (transmitting and receiving points, TRPs), transmission points (transmitting points, TPs), mobile switching centers, and devices that perform base station functions in device-to-device (D2D), vehicle-to-everything (V2X), and machine-to-machine (M2M) communications, network equipment in non-terrestrial networks (NTNs), etc., without specific limitation.

[0094] The network equipment may also include network elements or modules that implement some functions of the base station, for example, one or more of the following: a centralized unit (CU), a distributed unit (DU), or a radio unit (RU). Optionally, the CU can be further separated into a CU-control plane (CP) and a CU-user plane (UP). The functions of the CU and DU can be implemented by different network elements, or simultaneously by the baseband unit (BBU) of the base station. The functions of the RU can be implemented by the radio frequency equipment of the base station. For example, the radio frequency equipment of the base station may be a remote radio unit (RRU), a pico remote radio unit (pRRU), an active antenna unit (AAU), or other units, modules or devices with radio frequency processing functions. The communication interface protocol between the BBU and the radio frequency equipment can be a common public radio interface (CPRI) interface protocol, an enhanced common public radio interface (eCPRI) interface protocol, or a fronthaul interface protocol between the DU and RU in the O-RAN system, etc., without limitation.

[0095] The communication device for implementing the function of the network device can be the network device, or a device that can support the network device to implement the function, such as a chip system. The device can be installed in the network device or used in conjunction with the network device.

[0096] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0097] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A radio frequency resistor, characterized in that: The radio frequency resistor is applied to a single board structure mounting, including: A connecting layer, a resistor substrate and a resistor film layer; The resistor substrate is located on the connecting layer, and the resistor film layer is located on the resistor substrate; A difference between a thermal expansion coefficient of the connection layer and a thermal expansion coefficient of the single-board structure is less than or equal to a threshold value, and the thermal expansion coefficient of the connection layer is greater than the thermal expansion coefficient of the resistance substrate.

2. The radio frequency resistor according to claim 1, characterized in that: The radio frequency resistor also includes: A pin includes a first end and a second end, the first end is connected to the resistor film layer, the second end is suspended, and the connection length between the second end and the first end is greater than the straight line length between the second end and the first end.

3. The radio frequency resistor according to claim 2, characterized in that: The structure of the pin is any one of the following: Z-type, Ω-type or arc-type.

4. The radio frequency resistor according to claim 2 or 3, characterized in that: The pin is made of any of the following materials: Copper, copper or beryllium copper.

5. The radio frequency resistor according to any one of claims 1 to 4, characterized in that: The thermal expansion coefficient of the connecting layer is less than or equal to the thermal expansion coefficient of the single board structure.

6. The radio frequency resistor according to any one of claims 1 to 4, characterized in that: The thermal expansion coefficient of the connecting layer is greater than or equal to the thermal expansion coefficient of the single board structure.

7. The radio frequency resistor according to any one of claims 1 to 6, characterized in that: The connecting layer is made of copper.

8. The radio frequency resistor according to any one of claims 1 to 7, characterized in that: The cross-sectional shape of the connecting layer is any one of the following: Rectangular, square or circular.

9. A radio frequency system, characterized in that: include: Single board structure, connecting layer, resistor substrate and resistor film layer; The connecting layer is used to connect the single board structure and the resistor substrate; The resistance film layer is located on the resistance substrate; A difference between a thermal expansion coefficient of the connection layer and a thermal expansion coefficient of the single-board structure is less than or equal to a threshold value, and the thermal expansion coefficient of the connection layer is greater than the thermal expansion coefficient of the resistance substrate.

10. The radio frequency system according to claim 9, characterized in that: The radio frequency system also includes: A pin, wherein the pin includes a first end and a second end, the first end is connected to the resistor film layer, the second end is connected to the single board structure, and the connection length between the second end and the first end is greater than the straight line length between the second end and the first end.

11. The radio frequency system according to claim 10, characterized in that: The structure of the pin is any one of the following: Z-type, Ω-type or arc-type.

12. The radio frequency system according to claim 10 or 11, characterized in that: The pin is made of any of the following materials: Copper, copper or beryllium copper.

13. The radio frequency system according to any one of claims 9 to 12, characterized in that: The thermal expansion coefficient of the connecting layer is less than or equal to the thermal expansion coefficient of the single board structure.

14. The radio frequency system according to any one of claims 9 to 12, characterized in that: The thermal expansion coefficient of the connecting layer is greater than or equal to the thermal expansion coefficient of the single board structure.

15. The radio frequency system according to any one of claims 9 to 14, characterized in that: The connecting layer is made of copper.

16. The radio frequency system according to any one of claims 9 to 15, characterized in that: The cross-sectional shape of the connecting layer is any one of the following: Rectangular, square or circular.

17. The radio frequency system according to any one of claims 9 to 16, characterized in that: The single board structure is any one of the following: Amplifier board, transceiver board or printed circuit board.

18. A communication device, characterized in that: The communication device comprises the radio frequency system according to any one of claims 9 to 17.

Images