Printed circuit board (PCB) and automobile electric control module

Abstract

The present application discloses a printed circuit board (PCB) and an automobile electric control module. The PCB comprises: a plurality of wiring layers which are sequentially stacked; and a passive element, the passive element using a metal wiring structure corresponding to the type of the passive element, and the passive element being disposed on at least one of the wiring layers. The metal wiring structure in the PCB is used as the passive element, so that a standard entity passive element is replaced with a PCB layout structure, improving the reliability of the passive element, reducing market after-sales problems caused by the element quality problem, and the performance of the passive element can be changed by adjusting the metal wiring structure of the passive element, thereby more efficiently achieving the optimal design of the circuit or solving the EMC problem, achieving the customization of the element, and reducing the complexity of design work.

Description

PCB board and automobile electronic control module

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application with application number CN202322562386.2 and title “A PCB board and automotive electronic control module” filed with the Patent Office of China on September 20, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of PCB board design, and more specifically, to a PCB board and an automotive electronic control module. Background Art

[0004] Automotive electronic control systems are composed of active components, such as a variety of high-performance integrated circuits, as well as passive components (also known as resistors, capacitors, and inductors). Failure in any of these components can lead to loss of vehicle control or power, potentially causing safety issues.

[0005] Current automotive electronic control products typically utilize passive components such as resistors, capacitors, and inductors soldered to the surface of a printed circuit board (PCB) via pads. These passive components typically fail due to damage caused by prolonged operation in high-temperature, high-humidity environments. To address issues such as high humidity and dust, spraying conformal coatings is currently the preferred method for enhancing the protection of passive components. However, this method can lead to another type of failure in high-temperature, high-humidity environments. The thermal expansion and contraction of the conformal coating can increase stress within the components themselves and between the components and the pads, causing component failure or damage. This can result in cold solder joints, open circuits, or short circuits on resistors, loose copper wire connections on inductors, and cracks on capacitors.

[0006] In addition, resistors, capacitors, and inductors are currently standard parts. In order to match the optimal circuit performance or solve EMC problems, non-standard components are required in some cases. At this time, the components need to be customized. However, customized changes to the supplier's production line are relatively difficult, which increases the complexity of the design work.

[0007] Therefore, how to provide a PCB board that can improve component reliability and achieve component customization is a technical problem that needs to be solved.

[0008] Application Contents

[0009] In view of this, the purpose of this application is to provide a PCB board and an automotive electronic control module to improve the reliability of components in the PCB board and realize the customization of components.

[0010] In a first aspect, the present application provides a PCB board comprising: a plurality of wiring layers, each of the wiring layers being stacked in sequence; a passive component, the structure of the passive component adopting a metal wiring structure corresponding to its own type, and the passive component being arranged on at least one of the wiring layers.

[0011] Beneficial effects: By using the metal wiring structure in the PCB board as a passive component, the PCB layout structure can be used to replace the physical standard passive components, thereby improving the reliability of the passive components and reducing market after-sales problems caused by component quality problems. At the same time, the performance of the passive components can be changed by adjusting the metal wiring structure of the passive components, thereby more efficiently optimizing the matching circuit design or solving EMC problems, realizing the customization of components and reducing the complexity of design work.

[0012] In an optional embodiment, passive components that are in a connection relationship and located in different wiring layers are connected through vias or buried vias.

[0013] In an optional embodiment, the passive element is a combination of any one or more of a resistor, an inductor and a capacitor.

[0014] In an optional embodiment, the metal wiring structure of the resistor includes arc wiring using metal wires, or 45° long-distance winding wiring using metal wires.

[0015] In an optional embodiment, if the resistance of the resistor is R, the conductivity of the metal wire is ρ, the cross-sectional area of ​​the metal wire is A, and the length of the metal wire is L, then the resistance of the resistor satisfies: R = ρ·(L / A), wherein, when the cross-section of the metal wire is rectangular, the thickness of the metal wire is 1-2oz, and the wire diameter of the metal wire is 8-20mil.

[0016] In an optional embodiment, the metal wiring structure of the inductor includes using a metal wire to form a coil in a plane in a circular arc spiral, or using a metal wire to form a coil in a plane in a 45° spiral.

[0017] In an optional embodiment, if the inductance value of the inductor is L, the unit of L is uH, the multi-layer coil coefficient is L0, the number of turns of the coil is W, the outer diameter of the coil is D, and the unit of D is cm, then the inductance value of the inductor satisfies: L = L0 × W 2 ×D×10 -3 , wherein, when the cross section of the metal wire is rectangular, the thickness of the metal wire is 1-2oz, and the wire diameter of the metal wire is 8-20mil.

[0018] In an optional embodiment, the passive component also includes a transformer, and / or a common-mode inductor, and / or a common-mode filter, and the transformer, the common-mode inductor, and the common-mode filter all include a primary coil and a secondary coil, and the primary coil and the secondary coil adopt the same metal wiring structure as the inductor, and the primary coil and the secondary coil are arranged in the same wiring layer or in different wiring layers according to a preset turns ratio.

[0019] In an optional embodiment, the metal wiring structure of the capacitor includes two pieces of metal foil of the same shape as electrode sheets, and the two electrode sheets are relatively arranged in different wiring layers. If the capacitance value of the capacitor is C, the dielectric constant is ε, the surface area of ​​the electrode sheet is A, and the distance between the two electrode sheets is d, then the capacitance value of the capacitor satisfies: C = εA / d.

[0020] In a second aspect, the present application provides an automotive electronic control module, which includes the PCB board as described in the first aspect.

[0021] In a third aspect, the present application provides an electronic device comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the battery abnormality detection model method in the above-mentioned first aspect or any possible implementation of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] FIG1 shows a schematic structural diagram of a PCB board proposed in an embodiment of the present application;

[0024] FIG2 shows a top view of the metal wiring structure of the resistor in an embodiment of the present application;

[0025] FIG3 shows a side view of a metal wiring structure of a resistor in an embodiment of the present application;

[0026] FIG4 shows a side view of a metal wiring structure of a resistor in another embodiment of the present application;

[0027] FIG5 shows a top view of the metal wiring structure of the inductor in an embodiment of the present application;

[0028] FIG6 shows a side view of the metal wiring structure of the inductor in an embodiment of the present application;

[0029] FIG7 shows a top view of the metal wiring structure of a capacitor in an embodiment of the present application;

[0030] FIG8 shows a side view of a metal wiring structure of a capacitor in an embodiment of the present application;

[0031] FIG9 shows a top view of a transformer / common-mode inductor / common-mode filter formed by disposing a primary coil and a secondary coil on the same wiring layer in an embodiment of the present application;

[0032] FIG10 shows a side view of a transformer / common mode inductor / common mode filter formed by disposing the primary coil and the secondary coil on different wiring layers in an embodiment of the present application;

[0033] FIG11 shows a schematic diagram of the principle of an RC filter circuit in an embodiment of the present application;

[0034] FIG12 shows a schematic diagram of the wiring structure of the RC filter circuit in FIG11 in a PCB board;

[0035] FIG13 is a schematic diagram showing a numerical curve of the multi-layer coil coefficient L0. DETAILED DESCRIPTION

[0036] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0037] The present application provides a PCB board, as shown in FIG1 , including:

[0038] A plurality of wiring layers 10, each wiring layer 10 is stacked in sequence;

[0039] The passive component 20 has a structure that uses a metal wiring structure corresponding to its own type. The passive component 20 is disposed on at least one wiring layer 10 .

[0040] In this embodiment, the PCB includes multiple wiring layers 10, which are stacked sequentially to form the various levels of the PCB. Each wiring layer 10 is constructed of dielectric material. The passive components 20 are not standard physical components, but are fabricated using metal wiring structures corresponding to the type of passive component 20. Different types of passive components 20 may utilize different metal wiring structures. The passive components 20 are disposed in at least one wiring layer 10, for example, embedded in the surface of a wiring layer 10.

[0041] Optionally, passive components of the same type can be arranged on the same wiring layer or on different wiring layers. Different types of passive components can be arranged on different wiring layers in different areas of the PCB board, on the same wiring layer, or on different wiring layers in the same area of ​​the PCB board. Persons skilled in the art can flexibly arrange them according to actual needs.

[0042] Optionally, the number of wiring layers may be 2-10 layers.

[0043] By using the metal wiring structure in the PCB board as a passive component, the PCB layout structure can be used to replace the physical standard passive components, thereby improving the reliability of the passive components and reducing market after-sales problems caused by component quality problems. At the same time, the performance of the passive components can be changed by adjusting the metal wiring structure of the passive components, thereby more efficiently optimizing the matching circuit design or solving EMC problems, realizing the customization of components and reducing the complexity of design work.

[0044] In some embodiments of the present application, passive components that are connected and located in different wiring layers are connected through vias or buried vias.

[0045] A via, also known as a through-hole, is a hole that penetrates all the way from the top to the bottom layer of a PCB. A buried via is a hole created in an inner layer of a PCB, with both the top and bottom surfaces of the buried via inside the PCB. In this embodiment, passive components located on different wiring layers are connected. By providing a via or buried via in the PCB to connect the corresponding passive components, a reliable electrical connection is achieved.

[0046] In some embodiments of the present application, the passive component is a combination of any one or more of a resistor, an inductor, and a capacitor.

[0047] In this embodiment, the passive component can be a single resistor, a single inductor, or a single capacitor, or multiple resistors connected in series or parallel, or multiple inductors connected in series or parallel, or multiple capacitors connected in series or parallel, or different combinations of resistors, inductors and capacitors. Those skilled in the art can flexibly adopt different settings to form different passive components according to actual needs.

[0048] In some embodiments of the present application, the metal wiring structure of the resistor includes using metal wires to wire in an arc, or using metal wires to wire in a 45° long-distance winding manner.

[0049] In this embodiment, the resistor's metal wiring structure can adopt two methods. One is to use metal wires in arc-shaped wiring. This design uses elliptical wiring angles, saves horizontal space, and has good EMC characteristics. The other is to use metal wires in a long-distance winding pattern at 45°. This design is a criss-cross design, simple and efficient, and has good EMC performance.

[0050] FIG2 shows a top view of the metal wiring structure of the resistors in an embodiment of the present invention, and FIG3 is a corresponding side view. FIG2 and FIG3 show a series structure of three resistors R1, R2, and R3. The metal wiring structure in the upper portion of FIG2 and FIG3 uses metal wires to be wired in an arc, with one end routing from the first layer (i.e., the top wiring layer of the PCB board) and the other end routing from the nth layer (i.e., the nth wiring layer of the PCB board), where n is an integer greater than 1. The metal wiring structure in the lower portion of FIG2 and FIG3 uses metal wires to be wired in a 45° long-distance winding manner, with one end routing from the first layer and the other end routing from the nth layer. The resistors in different wiring layers are connected through vias or buried vias.

[0051] Figure 4 shows a side view of the metal wiring structure of resistors in another embodiment of the present invention. Figure 4 shows a structure where R2 and R3 are connected in parallel and in series with R1. The upper metal wiring structure in Figure 4 uses metal wires arranged in an arc, with one end routed from the first layer and the other from the nth layer. The lower metal wiring structure in Figure 4 uses metal wires arranged in a 45° long-distance winding pattern, with one end routed from the first layer and the other from the nth layer. Resistors on different wiring layers are connected through vias or buried vias, enabling series or parallel connection of resistors on different wiring layers.

[0052] In Figures 3 and 4, resistors that are connected and located in different wiring layers use the same metal wiring structure. Optionally, resistors that are connected and located in different wiring layers can be set to different metal wiring structures. For example, R2 in Figure 3 can be set to use metal wires in a 45° long-distance winding wiring.

[0053] Optionally, multiple resistors that are connected can be set in the same wiring layer. For example, R2 and R3 in Figure 3 can be set in the same wiring layer. Different resistors in the same wiring layer can use the same metal wiring structure or different metal wiring structures.

[0054] Optionally, the material of the metal wire in the resistor may be copper, silver alloy, etc., and the cross-section of the metal wire may be rectangular, circular, etc.

[0055] In some embodiments of the present application, if the resistance of the resistor is R, the conductivity of the metal wire is ρ, the cross-sectional area of ​​the metal wire is A, and the length of the metal wire is L, then the resistance of the resistor satisfies: R = ρ·(L / A), wherein, when the cross-section of the metal wire is rectangular, the thickness of the metal wire is 1-2oz, and the wire diameter of the metal wire is 8-20mil.

[0056] In this embodiment, the resistor calculation formula is: R = ρ·(L / A), where R is the resistance value of the resistor. After determining the conductivity ρ and cross-sectional area A of the metal wire, a metal wire of a corresponding length is used to form the resistor based on the resistance value. If the cross-sectional shape of the metal wire is rectangular, the cross-sectional area A is calculated based on the product of the wire width (i.e., wire diameter) and thickness. If the cross-sectional shape of the metal wire is circular, the cross-sectional area A is calculated based on the circular area calculation formula. For rectangular cross-sectional shapes, the wire thickness is 1-2 oz, and the wire diameter is 8-20 mil.

[0057] In some embodiments of the present application, the metal wiring structure of the inductor includes using a metal wire to form a coil in a plane in a circular arc spiral, or using a metal wire to form a coil in a plane in a 45° spiral.

[0058] In this embodiment, the inductor's metal wiring structure can adopt two methods. One is to use metal wire to form a coil in a plane in a circular spiral. This design uses elliptical wiring, which saves lateral space and has good EMC characteristics. The other is to use metal wire to form a coil in a plane in a 45° spiral. This design is a crisscross design, which is simple and efficient, and has good EMC performance.

[0059] Figure 5 shows a top view of the metal wiring structure for the resistors in an embodiment of the present invention, while Figure 6 shows a corresponding side view. The metal wiring structure in Figures 5 and 6 utilizes a metal wire spirally wound in a plane to form a coil, with one end routed from the first layer and the other from the nth layer. The inductors of different wiring layers are connected through vias or buried vias, ensuring the connection of the inductors.

[0060] In Figure 6, the inductors that are connected and located in different wiring layers use the same metal wiring structure. Optionally, the inductors that are connected and located in different wiring layers can also be set to different metal wiring structures. For example, the inductor in one wiring layer uses a metal wire to spirally surround a plane in an arc to form a coil, and the inductor in another wiring layer uses a metal wire to spirally surround a plane at 45° to form a coil.

[0061] Optionally, multiple inductors that are connected can be set in the same wiring layer. For example, two of the inductors in Figure 6 can be set in the same wiring layer, and the remaining inductor can be set in another wiring layer. Different inductors in the same wiring layer can use the same metal wiring structure or different metal wiring structures.

[0062] Optionally, the material of the metal wire in the inductor may be copper, silver alloy, etc., and the cross-section of the metal wire may be rectangular, circular, etc.

[0063] In some embodiments of the present application, if the inductance value of the inductor is L, the unit of L is uH, the multi-layer coil coefficient is L0, the number of turns of the coil is W, the outer diameter of the coil is D, and the unit of D is cm, then the inductance value of the inductor satisfies: L = L0 × W 2 ×D×10 -3 , wherein, when the cross section of the metal wire is rectangular, the thickness of the metal wire is 1-2oz, and the wire diameter of the metal wire is 8-20mil.

[0064] In this embodiment, the inductance calculation formula based on the multi-layer coil is: L = L0 × W 2 ×D×10 -3 , where L is the inductance value, L0 is the multi-layer coil coefficient, W is the number of turns of the coil, and D is the outer diameter of the coil. As shown in FIG13 , the multi-layer coil coefficient L0 is obtained from the numerical curve of the multi-layer coil coefficient L0, t=(D-D0) / 2, D0 is the inner diameter of the coil, where when the cross-section of the metal wire is rectangular, the thickness of the metal wire is 1-2 oz, and the wire diameter of the metal wire is 8-20 mil.

[0065] In some embodiments of the present application, the passive component also includes a transformer, and / or a common-mode inductor, and / or a common-mode filter. The transformer, common-mode inductor, and common-mode filter all include a primary coil and a secondary coil. The primary coil and the secondary coil use the same metal wiring structure as the inductor. The primary coil and the secondary coil are arranged in the same wiring layer or in different wiring layers according to a preset turns ratio.

[0066] In this embodiment, the passive component also includes a transformer using a primary coil and a secondary coil, and / or a common-mode inductor, and / or a common-mode filter. The primary coil and the secondary coil use the same metal wiring structure as the inductor, that is, a coil is formed by spirally wrapping a metal wire in a plane in a circular arc, or a coil is formed by spirally wrapping a metal wire in a plane in a 45° angle. The primary coil and the secondary coil can be arranged in the same wiring layer according to a preset turns ratio, or the primary coil and the secondary coil can be arranged in different wiring layers according to a preset turns ratio. It is understood that to ensure reliability, the primary coil and the secondary coil use the same metal wiring structure.

[0067] Figure 9 shows a top view of a transformer / common-mode inductor / common-mode filter formed by placing the primary and secondary coils on the same wiring layer in an embodiment of the present invention. The primary and secondary coils on the left side of Figure 9 are placed on the same wiring layer, and both are formed by metal wire spirally wound in a plane at a 45° angle. The primary and secondary coils on the right side of Figure 9 are placed on the same wiring layer, and both are formed by metal wire spirally wound in a plane at a circular arc angle.

[0068] Figure 10 shows a side view of a transformer / common-mode inductor / common-mode filter formed by disposing the primary and secondary coils in different wiring layers in an embodiment of the present invention. The primary and secondary coils on the left side of Figure 10 are disposed in different wiring layers, and both are formed by metal wires spirally wound in a plane at 45 degrees. The primary and secondary coils on the right side of Figure 10 are disposed in different wiring layers, and both are formed by metal wires spirally wound in a plane in an arc shape. The primary coils in different wiring layers are connected by vias or buried vias, and the secondary coils in different wiring layers are also connected by vias or buried vias.

[0069] In some embodiments of the present application, the metal wiring structure of the capacitor includes two pieces of metal foil of the same shape as electrode sheets, and the two electrode sheets are relatively arranged in different wiring layers. If the capacitance value of the capacitor is C, the dielectric constant is ε, the surface area of ​​the electrode sheet is A, and the distance between the two electrode sheets is d, then the capacitance value of the capacitor satisfies: C = εA / d.

[0070] In this embodiment, two metal foils of the same shape are used as electrode sheets, and the two electrode sheets are arranged opposite to each other in different wiring layers to form a capacitor. The capacitance value can be increased or decreased by stacking different numbers of electrode sheets in different wiring layers.

[0071] Alternatively, the metal foil can be rectangular or square, as shown in the upper metal wiring structure in Figures 7 and 8. This design has a large capacitance and is easy to calculate. The metal foil can also be circular or oval, as shown in the lower metal wiring structure in Figures 7 and 8. This design provides simple and efficient wiring and good EMC performance. The metal foil can be made of copper or other metals. Different capacitors are connected through vias or buried vias to achieve series connection of different capacitors.

[0072] The capacitance calculation formula is: C = εA / d, where C is the capacitance, ε is the dielectric constant, A is the surface area of ​​the electrode, and d is the distance between the two electrodes. ε is determined by the type of PCB substrate. The required capacitance can be determined by selecting the appropriate electrode area and number of electrode layers.

[0073] In some embodiments of the present application, a corresponding RC filter circuit can be designed using the metal wiring structure of the above-mentioned resistors, inductors, and capacitors. For example, FIG11 shows a schematic diagram of the principle of an RC filter circuit in an embodiment of the present invention. R, L, T, and C in FIG11 represent resistors, inductors, transformers, and capacitors, respectively. The RC filter circuit is designed in a PCB board using the corresponding metal wiring structure to obtain a wiring structure as shown in FIG12. In FIG12, R2 and R3 are connected in parallel and then in series with R1. It is understandable that the wiring structure shown in FIG12 is only a specific implementation method in the embodiment of the present application, and those skilled in the art can flexibly adopt other wiring structures according to actual needs.

[0074] Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations shall fall within the scope defined by the appended claims. Industrial Applicability

[0075] The PCB board provided in the present application includes: multiple wiring layers, each of which is stacked in sequence; passive components, the structure of the passive components adopts a metal wiring structure corresponding to their own type, and the passive components are arranged on at least one wiring layer. By using the metal wiring structure in the PCB board as a passive component, the PCB layout structure is used to replace the physical standard passive components, thereby improving the reliability of the passive components and reducing market after-sales problems caused by component quality problems. At the same time, the performance of the passive components can be changed by adjusting the metal wiring structure of the passive components, thereby more efficiently achieving the optimal matching circuit design or solving EMC problems, realizing the customization of the components and reducing the complexity of the design work.

Claims

1. A PCB board, characterized in that: include: A plurality of wiring layers, each of the wiring layers is stacked in sequence; A passive component, the structure of which adopts a metal wiring structure corresponding to its own type, and the passive component is arranged on at least one of the wiring layers.

2. The PCB board according to claim 1, characterized in that: Passive components that are connected and located in different wiring layers are connected through vias or buried vias.

3. The PCB board according to claim 1, characterized in that: The passive element is a combination of any one or more of a resistor, an inductor and a capacitor.

4. The PCB board as claimed in claim 3, characterized in that: The metal wiring structure of the resistor includes arc wiring with metal wires, or 45° long-distance winding wiring with metal wires.

5. The PCB board as claimed in claim 4, characterized in that: If the resistance of the resistor is R, the conductivity of the metal wire is ρ, the cross-sectional area of ​​the metal wire is A, and the length of the metal wire is L, then the resistance of the resistor satisfies: R=ρ·(L / A), wherein when the cross-section of the metal wire is rectangular, the thickness of the metal wire is 1-2oz, and the wire diameter of the metal wire is 8-20mil.

6. The PCB board as claimed in claim 3, characterized in that: The metal wiring structure of the inductor includes using a metal wire to form a coil in a plane in a circular arc spiral, or using a metal wire to form a coil in a plane in a 45° spiral.

7. The PCB board according to claim 6, characterized in that: If the inductance value of the inductor is L, the unit of L is uH, the multi-layer coil coefficient is L0, the number of turns of the coil is W, the outer diameter of the coil is D, and the unit of D is cm, then the inductance value of the inductor satisfies: L = L0 × W 2 ×D×10 -3 , wherein when the cross-section of the metal wire is rectangular, the thickness of the metal wire is 1-2oz, and the wire diameter of the metal wire is 8-20mil.

8. The PCB board as claimed in claim 6, characterized in that: The passive component also includes a transformer, and / or a common-mode inductor, and / or a common-mode filter. The transformer, the common-mode inductor, and the common-mode filter all include a primary coil and a secondary coil. The primary coil and the secondary coil use the same metal wiring structure as the inductor. The primary coil and the secondary coil are arranged in the same wiring layer or in different wiring layers according to a preset turns ratio.

9. The PCB board according to claim 3, characterized in that: The metal wiring structure of the capacitor includes two metal foils of the same shape as electrode sheets, and the two electrode sheets are relatively arranged in different wiring layers. If the capacitance value of the capacitor is C, the dielectric constant is ε, the surface area of ​​the electrode sheet is A, and the distance between the two electrode sheets is d, then the capacitance value of the capacitor satisfies:

10. An automotive electronic control module, characterized in that: The automotive electronic control module comprises a PCB board as described in any one of claims 1-9.

Images