900results about "Fixed transformers or mutual inductances" patented technology

A power supply system according to the present invention comprises: a primary side coil; a power transmission apparatus having a primary side circuit for feeding a pulse voltage resulted from switching a DC voltage which is obtained by rectifying and smoothing a commercial power supply to the primary side coil; a secondary side coil magnetically coupled to the primary side coil; and power reception equipment having a secondary side circuit for rectifying and smoothing voltage induced across the secondary side coil, wherein there is provided a power adjusting section for adjusting a level of power to be transmitted according to power required by the power reception equipment. The power adjusting section has, in the primary side circuit, a carrier wave oscillation circuit for supplying a carrier wave to the primary side coil, a demodulation circuit for demodulating a modulated signal transmitted from the secondary circuit and received by the primary side coil, and a power change-over section for selecting a level of power to be transmitted according to an information signal from the power reception equipment and demodulated by the demodulation circuit. The power adjusting section has, in the secondary side circuit, a modulation circuit for modulating the carrier wave fed from the carrier wave oscillation circuit and received by the secondary side coil with the information signal from the power reception equipment and transmitting the modulated signal.

The present invention provides an inductively powered sensor system having a primary conductive path capable of being energized to provide an electromagnetic field in a defined space. An inductive power pick-up is associated with a sensor and is capable of receiving power from the field to supply the sensor. The system includes a first sensing unit to sense the power available to the pick-up and a control unit to increase or decrease the power available to the sensor dependant on the sensed power available. A method of inductively powering a sensor, an inductively powered sensor and an animal enclosure including one or more primary conductive path of an inductive power supply are also disclosed.

A planar coil including and insulating substrate, and a coil conductive filament having a thickness of 20 to 400 mum and formed on at least one surface of the insulating substrate, the coil conductive filament having a gap whose aspect ratio (H/G) is at least 1. The coil conductive filament has a cross-section in a substantially mushroom shape having a head and a neck, the head has a width (L) which is a least twice as large as a width (l) of the neck thereof, at most 1.5 times as large as a height of the head, and at least twice as large as a minimum spacing (G) between adjacent coil conductive filaments.

A first coil element includes a first loop-shaped conductor and a second loop-shaped conductor. A second coil element includes a third loop-shaped conductor and a fourth loop-shaped conductor. The first loop-shaped conductor and the second loop-shaped conductor are sandwiched in a stacking direction between the third loop-shaped conductor and the fourth loop-shaped conductor. A conductive pattern which is a portion of the first loop-shaped conductor and a conductive pattern which is a portion of the second loop-shaped conductor are connected in parallel. Then, each of a conductive pattern which is a remaining portion of the first loop-shaped conductor and a conductive pattern which is a remaining portion of the second loop-shaped conductor is connected in series with the parallel circuit.

A resonant converter is provided which may be used for supplying power to the primary conductive path of an inductively coupled power transfer (ICPT) system. The converter includes a variable reactive element in the resonant circuit which may be controlled to vary the effective inductance or capacitance of the reactive element. The frequency of the converter is stabilised to a nominal value by sensing the frequency of the converter resonant circuit, comparing the sensed frequency with a nominal frequency and varying the effective inductance or capacitance of the variable reactive element to adjust the converter frequency toward the nominal frequency.

A microelectronic assembly including a die substrate, a plurality of electronic components formed in and on the die substrate and connected to one another to form an integrated circuit, a first and a second single-turn inductor, and a magnetic material electro-magnetically coupling the first and the second single-turn inductor to one another to form a transformer, the transformer being connected to the integrated circuit.

A coil device having a core having an intermediate leg and at least a pair of external legs arranged at equal intervals from the intermediate leg; a first printed coil provided on a first substrate which has an intermediate hole and a pair of external holes respectively inserted in the intermediate leg and the pair of external legs of the core, the first printed coil being wound around the intermediate hole; and a second printed coil provided on a second substrate which has an intermediate hole and a pair of external holes respectively inserted in the intermediate leg and the pair of external legs of the core, the second printed coil including a pair of external printed coils which are connected in series and are respectively wound around the pair of the external holes with the same number of turns but in opposite directions.

In one embodiment of the present invention, a wireless interface is provided for supplying all signals and power exclusively wirelessly from a transmitting section to a receiving section. The transmitting section includes a transmitter arranged to modulate a carrier with signals, such as data, control and timing signals. The transmitter is connected to a transmit antenna which comprises a parallel resonant circuit in series with a series resonant circuit. The parallel and series resonant circuits include inductors which are inductively coupled to an inductor of a receive antenna in the receiving section.

A power conversion system includes an input terminal that is arranged to be connected to a voltage source; a transformer having a first winding connected to the input terminal and a second winding connected to an output terminal of the power conversion system, either the first winding or the second winding is provided with at least three taps that are arranged to divide the first winding or the second winding into at least two sub-windings; at least one tap switch connected to the at least two sub-windings; a control circuit connected to the at least one tap switch; and at least one switch connected to the at least one tap switch. The control circuit is arranged to control the at least one tap switch to control the turn ratio of the transformer.

An electronic assembly includes a substrate (66), a balun transformer (42) formed on the substrate (66) and including a first winding (50) and a second winding (52), each having respective first and second ends, and a reaction circuit component (48) formed on the substrate (66) and electrically coupled to the second winding (52) between the first and second ends thereof. The balun transformer (42) and the reaction circuit component (48) jointly form a harmonically suppressed balun transformer having a fundamental frequency, and the reaction circuit component (48) is tuned such that the harmonically suppressed balun transformer resonates at a selected harmonic of the fundamental frequency.

A core assembly used for a wireless power transmitting device and a wireless power transmitting device having the same. The core assembly for the wireless power transmitting device includes: a main coil disposed at a first level; an auxiliary coil disposed at a lower side of the main coil such that the auxiliary coil is located at a second level lower than the first level, and including a first sub coil and a second sub coil, which respectively have a portion overlapped with the main coil and respectively have a size smaller than the main coil; and a core of a magnetic substance configured to accommodate the main coil and the auxiliary coil.

A method of controlling the grid-side current of a single-phase grid-connected converter having an LCL filter connected between the output of the converter and the grid. The method includes measuring a grid voltage (v_S) and at least one signal in a group of signals consisting of a grid-side current (i₀), a converter-side current (i₁) and a capacitor voltage (v_C0). The method includes estimating the fundamental component (v_S,1) of the grid voltage (v_S), forming a grid-side current reference (i₀*), a converter-side current reference (i₁*) and a capacitor voltage reference (v_C0*) for the grid-side current of the LCL filter using the fundamental component of the grid voltage (v_S,1), forming estimates for the non-measured signals in said group of signals, forming a grid-side current difference term (ĩ₀), a converter-side current difference term (ĩ₁) and a capacitor voltage difference term ({tilde over (v)}_C0) from the differences between the references and measured/estimated values of said signals, forming an injection term for damping the resonance of the LCL filter by using an active damping injection mechanism (ADI), in which the grid-side current difference term (ĩ₀), the converter-side current difference term (ĩ₁) and the capacitor voltage difference term ({tilde over (v)}_C0) are used, forming an estimate of harmonic distortion term ({circumflex over (φ)}) using the grid-side current difference term (ĩ₀), and controlling the output voltage (e) of the converter on the basis of the grid voltage, formed injection term and formed estimate of the harmonic distortion term ({circumflex over (φ)}) to produce a grid side (i₀) current corresponding to the current reference.

An integrated circuit die system comprises a first integrated circuit die, a second integrated circuit die and a transformer formed on a dielectric (e.g., quartz) substrate and electrically connected between the first integrated circuit die and the second integrated circuit die to provide galvanic isolation therebetween.