551results about "Fixed transformers or mutual inductances" patented technology

The invention relates to the technical field of transformers and discloses a high-frequency small planar transformer which comprises a transformer body, the transformer body comprises a lower magnetic core, an upper magnetic core is installed at the top end of the lower magnetic core, and a base plate, a cooling mechanism and a distance adjusting mechanism are arranged on the inner side of the upper magnetic core and the inner side of the lower magnetic core correspondingly. The cooling mechanism is arranged on the transformer body, more excellent heat dissipation and installation functions are achieved, a movable frame and a pull block are driven to move through reset of a first spring, an insertion block is clamped into a positioning groove to form an inverted-L-shaped layout, an upper magnetic core is transversely and longitudinally limited, and the upper magnetic core can be conveniently and rapidly installed. And meanwhile, the substrate is in contact with the cavity network, the internal high-performance fluorinated liquid absorbs heat and is changed from a liquid state to a gas state, enters the condenser through the conveying pipe after phase change, is cooled by the cooling fins to be in a liquid state and then circulates back to the cavity network through the water pump and the conveying pipe, local overheating is avoided, and the heat dissipation efficiency is improved.

The invention discloses a transformer structure and a radio frequency front end module, the transformer structure comprises a secondary coil and M primary coils, the M primary coils are sequentially spaced, and each primary coil surrounds the periphery of a specified point; the first end of each primary coil is configured to be connected to a first signal end, and the second end of each primary coil is configured to be grounded or connected to a power supply port. The secondary coil and the M primary coils are located on the same metal layer, and at least part of the secondary coil is wound in a gap formed by the M primary coils; the first end of the secondary coil is configured to be connected to a second signal end, and the second end of the secondary coil is configured to be grounded. The M primary coils are connected in parallel, so that the equivalent inductance value of the primary coils is reduced, the inductance value ratio between the secondary coils and the primary coils is increased, and the large impedance conversion ratio is achieved.

The invention relates to the technical field of transformers, in particular to a transformer with a high-frequency magnetic material. Comprising a transformer body, a lower base and an upper base, a cooling fan is arranged on the upper base on one side of the transformer body, a liquid cooling system is arranged on the transformer body, and a trigger mechanism is arranged at the top of the transformer body and used for controlling starting and stopping of the cooling fan and the liquid cooling system according to temperature changes in the transformer body. Under the action of the bent end and the first wedge block, the bent end slides along the inclined plane of the first wedge block, the air inducing plates on the two sides rotate clockwise and anticlockwise respectively and overcome the elastic potential energy of the reset spring, and as the rotation amplitude of the air inducing plates is increased, the distance between the air flow channels between the air inducing plates and the transformer body is reduced, and the air flow is discharged. And airflow flowing through the airflow channel can quickly pass through the airflow channel, so that more heat on the leeside can be taken away by utilizing the pressure difference, and heat dissipation on the leeside of the transformer body is facilitated.

A packaged integrated circuit (IC) (300) including a package substrate (110). The package substrate includes pins (321); a first metal layer (323) on the pins; a second metal layer (325) on the first metal layer; vias (322, 324, 326) on the second metal layer; an insulation material (308a, 308b) covering the pins, the first metal layer, the second metal layer, and the vias, and exposing surfaces of the pins and the vias. The packaged IC further includes a semiconductor die (101) on the package substrate, the semiconductor die having a surface (301) opposing the second metal layer; metal posts (305a, 305b) coupled between the semiconductor die and the exposed surfaces of the vias (326); and a mold compound (304, 304a) covering the semiconductor die and the metal posts, in which the surface is separated from the second metal layer (325) by the insulation material (308a) and the mold compound (304a).

There is provided an assembly for regulating temperature in a system for supplying current to a superconducting load. The assembly may comprise a thermal switch positioned between a cryocooler and a length of superconducting material comprised in a loop of superconducting material in which a voltage is generated by a flux pump. The cryocooler may additionally be thermally connected to the superconducting load. The thermal switch may be configured such that the cryocooler cools the superconducting load to a lower temperature than the length of superconducting material. The temperature to which the length of superconducting material is cooled may be substantially close to a critical temperature of the length of superconducting material. Forms of the technology also relate to the thermal switch and the flux pump.

Methods and apparatus for amplifying a signal for transmission via an amplifier circuit are described. An example amplifier circuit generally includes an amplifier configured to amplify a signal for wireless transmission and including a first transistor and a second transistor. The amplifier circuit also includes: a transformer coupled to an output of the amplifier; a first coil coupled to the first transistor and inductively coupled to the transformer; and a second coil coupled to the second transistor and inductively coupled to the transformer.

A voltage regulator having a multiple of main stages and at least one accelerated voltage regulator (AVR) bridge is provided. The main stages may respond to low frequency current transients and provide DC output voltage regulation. The AVR bridges are switched much faster than the main stages and respond to high frequency current transients without regulating the DC output voltage. The AVR bridge frequency response range can overlap with the main stage frequency response range, and the lowest frequency to which the AVR bridges respond may be set lower than the highest frequency to which the main stages respond.

The invention discloses a high-frequency transformer with a leakage protection structure, and relates to the technical field of transformer protection, the high-frequency transformer comprises a bottom frame, a transformer main body is placed at the upper end of the bottom frame, a moisture-proof assembly is mounted in the bottom frame, the moisture-proof assembly comprises a servo motor, the servo motor is fixedly connected with the lower end of the bottom frame, and the output end of the servo motor is fixedly connected with a mounting rack; gear rings are fixedly connected to the outer side walls of the mounting frames. A servo motor is controlled to drive a gear ring to rotate, so that the gear ring drives a gear to rotate by 90 degrees, a moisture-proof baffle is opened or closed after rotating to form an annular frame, the internal transformer body is exposed during opening and closing, the whole transformer body is exposed outside, and then the effects of moisture removal and ventilation are achieved; and the internal overhigh temperature can be reduced along with the air circulation temperature, so that the cooling effect is achieved. And after rotating, the moisture-proof baffle is closed to form an annular frame to protect the transformer main body, so that the use of the transformer main body is prevented from being directly influenced by over-high external humidity.

A circuit device includes a coil component and a substrate. The coil component includes first and second coils whose openings overlap, a terminal connected to one end of the first coil, a terminal connected to another end of the first coil, a terminal connected to one end of the second coil, and a terminal connected to another end of the second coil. The substrate includes a power supply line electrically coupled to the terminal, a power supply line electrically coupled to the terminal, and a wiring line electrically coupled to the terminal and the terminal. The wiring line is also electrically coupled to the capacitor.

A filter circuit includes a pair of balanced input ports, a pair of balanced output ports, first and second resonators provided in parallel between the pair of balanced input ports and the pair of balanced output ports in a circuit configuration, a first capacitor connected in parallel to the first resonator, and a second capacitor connected in parallel to the second resonator. The first and second resonators are magnetically coupled to each other and electrically connected to each other. The first and second capacitors are not electrically connected to ground.

An electronic device may include wireless circuitry having an on-chip transformer. The transformer may convey a radio-frequency signal and may include a primary coil and a secondary coil. The primary coil may have a center tap. A distributed capacitor array (DCA) may be coupled to the primary coil around the center tap. The DCA may include switchable capacitors coupled in parallel between ground and points on the primary coil on either side of the center tap. When active, each switchable capacitor contributes a different weighting to the operation of the transformer based on its distance from the center tap. A set of one or more of the switchable capacitors may be activated to contribute an asymmetric weighting to the operation of the transformer that mitigates process-related asymmetry in the transformer. This may serve to mitigate undesired common mode to direct mode signal conversion by the transformer.

A network unit may be operatively attached to power lines of an interconnected power system and / or a device such as a power module that may further include a communication interface. The network unit may be operable to superimpose a first signal representative of a sensed parameter of the power system onto the power lines, thereby to transmit the first signal to other power modules in the interconnected power system or to a power device in interconnected power system. The network unit may receive a second signal of the parameter superimposed onto the power lines from another network unit.

To provide a coil component in which the leak of a magnetic flex is suppressed.SOLUTION: A coil component A2 includes a coil 3 that generates a magnetic field by input current from the outside. The coil 3 includes a plurality of first circulation parts 31 and a plurality of second circulation parts 32 each having a rectangular annular shape when viewed in a first direction (circumferential direction t). The first circulation parts 31 are arranged in the circumferential direction t and form a first cylindrical part 5A. The second circulation parts 32 are arranged in the circumferential direction t and form a second cylindrical part 5B. The second cylindrical part 5B exists inside the first cylindrical part 5A when viewed in the circumferential direction t. Each of the cylindrical part 5A and the second cylindrical part 5B has an annular shape when viewed in a thickness direction (axial direction s) that is orthogonal to the circumferential direction t. The direction of the input current flowing in each of the first circulation parts 31 and the direction of the input current flowing in each of the second circulation parts 32 are the same.SELECTED DRAWING: Figure 23

The utility model discloses an integrated magnetic element and a switching power supply, the integrated magnetic element comprises a first circuit board, a second circuit board and a magnet, and the first circuit board comprises a primary winding circuit and a secondary winding circuit; the second circuit board comprises a PFC circuit, and the second circuit board and the first circuit board are arranged side by side; the magnet comprises a first cavity used for containing the first circuit board and a second cavity used for containing the second circuit board, the magnet further comprises a partition wall, and the partition wall is arranged between the first cavity and the second cavity so as to separate the first cavity from the second cavity. According to the invention, the transformer and the PFC inductor are integrated into one planar magnetic element, and the size of the magnetic element is reduced, so that the internal structure of the switching power supply is more compact, and the power density is improved.

Exemplary embodiments are disclosed of multichannel EMI inductors. In exemplary embodiments, an inductor comprises a magnetic core and at least eight or more signal lines. The magnetic core includes opposite first and second sides. The magnetic core defines an opening that extends through the magnetic core from the first side to the second side. The at least eight or more signal lines extend through the same single opening of the magnetic core. The at least eight or more signal lines comprise pins partially embedded within a dielectric body such that end portions of the pins are exposed and not embedded within the dielectric body. The end portions of the pins are configured to have a non-linear shape.

The utility model discloses a transformer assembly, power supply equipment and a vehicle. The transformer assembly comprises a first magnetic core and a second magnetic core, the base plates are arranged between the first magnetic core and the second magnetic core, the number of the base plates is multiple, only the upper surface and the lower surface of each base plate in the thickness direction are provided with at least one winding, every two adjacent base plates are arranged in a spaced mode, and a heat exchange channel is formed between every two adjacent base plates. According to the transformer assembly, only the upper surface and the lower surface of each substrate in the thickness direction are provided with at least one winding, the windings on the substrates can be connected through the through holes, parasitic inductance and capacitance parameters are not prone to being introduced, the fault rate of the transformer assembly is reduced, and the service life of the transformer assembly is prolonged. The two adjacent substrates are arranged at intervals and form the heat exchange channels, the heat exchange channels are communicated with the outside of the transformer assembly, external airflow can enter the space between the two adjacent substrates through the heat exchange channels and make direct contact with the winding, and therefore the heat dissipation capacity of the transformer assembly is improved.

A transformer device includes a first coil, a second coil, and a third coil. The first coil includes a first ring structure, a second ring structure, a first connecting portion, and a first terminal, in which the first terminal is arranged on the first connecting portion and is located at a central location between the first ring structure and the second ring structure, the first terminal is connected to the first ring structure through the first connecting portion in a first direction, and connected to the second ring structure through the first connecting portion in a second direction, and the first direction is the opposite of the second direction. The second coil is configured to couple the first ring structure. The third coil is configured to couple the second ring structure, in which the second coil and the third coil have the same structure.

An electrical assembly includes a first substrate, a second substrate, and a magnetic device disposed between the first substrate and the second substrate. The magnetic device includes (1) a magnetic core, (2) a first primary winding extending through the magnetic core and electrically coupling the first substrate to the second substrate, (3) a second primary winding extending through the magnetic core and electrically coupling the first substrate to the second substrate, (4) a first secondary winding wound around at least a portion of the magnetic core, and (5) a second secondary winding wound around at least a portion of the magnetic core. The electrical assembly further includes one or more electrical conductors on the first substrate electrically coupling the first secondary winding in series with the second secondary winding.

The present disclosure relates to semiconductor device packages and methods of manufacturing the same. The semiconductor device package includes a substrate having a first surface and a second surface opposite the first surface. The semiconductor device package also includes a first electrically conductive layer disposed over the first surface of the substrate and an insulating layer disposed over the first surface of the substrate. The semiconductor device package also includes a magnetically conductive layer disposed between the first electrically conductive layer and the insulating layer. The magnetically conductive layer has a bottom surface facing the first surface of the substrate, a top surface opposite the first surface of the substrate, and a side surface extending between the bottom surface of the magnetically conductive layer and the top surface of the magnetically conductive layer. Another embodiment of the present disclosure relates to a method of manufacturing a semiconductor device package.

The invention belongs to the technical field of transformers, and discloses an energy-saving high-frequency electronic transformer which comprises a protection box, a protection door is hinged to one side of the protection box, a transformer body is installed in the protection box, heat dissipation holes and ventilation cavities are formed in the two sides of the protection box, the heat dissipation holes are evenly distributed, and mixing assemblies are arranged in the two ventilation cavities. After the drying agent is used, a motor can be controlled to start through a PLC, all first rotating shafts are driven to rotate through chain transmission, the rotation of the first rotating shafts drives a connecting rod to rotate, the rotation of the connecting rod drives a mixing shaft to rotate, and the rotation of the mixing shaft drives a mixing plate to rotate, so that the drying agent in a ventilation cavity is stirred; and a drying agent arranged in the ventilation cavity absorbs moisture to dehumidify the energy-saving high-frequency electronic transformer, so that the stability and the safety of equipment operation are improved.

Semiconductor package comprising an input side containing input pins, an output side containing high-voltage pins, an isolation structure that galvanically isolates the input side from the output side, an input driver mounted on the input side and electrically connected to the input pins, a first and a second power transistor mounted on the output side, each having a first load terminal electrically connected to the high-voltage pins, an output driver communicatively coupled to the input driver via the isolation structure and electrically connected to the gate terminals of the first and second power transistors, and one or more electrically conductive structures that form a direct electrical connection between the load terminals of the first and second power transistors.wherein the output driver is mounted on one or more electrically conductive structures.

The utility model discloses a transformer shell structure and a transformer, and relates to the field of transformer heat dissipation. The device comprises a transformer shell structure, the transformer shell structure comprises a fixed heat dissipation side shell, side through grooves, heat dissipation inclined plates and heat dissipation side plates are arranged in the fixed heat dissipation side shell, telescopic side through grooves are formed in the two sides of the fixed heat dissipation side shell, and the heat dissipation inclined plates are fixedly connected into the side through grooves and fixed in an inclined array mode. The heat dissipation side plates are fixedly connected to the two sides of the fixed heat dissipation side shell and used for conducting heat dissipation on the interior of the fixed heat dissipation side shell, and the heat dissipation side plates are fixedly connected to the other two sides of the fixed heat dissipation side shell, fixed in an array mode and used for dissipating heat accumulated in the fixed heat dissipation side shell out of each set of heat dissipation side plates. According to the device, the heat dissipation inclined plates and the heat dissipation side plates are arranged, so that heat in the iron core can be transmitted to the heat dissipation inclined plates and the heat dissipation side plates through the transformer shell for heat dissipation, the internal heat cannot be gathered, the service life of the transformer is prolonged, and damage to the transformer is reduced.

The present invention relates to a laminated common mode filter which not only enables a coil pattern forming a channel to have uniform resistance and inductance, but also exhibits broadband characteristics. The laminated common mode filter includes a first capacitor layer and a second capacitor layer, respectively, on a top and a bottom of an electrode stack to overlap a plurality of coil patterns and form an additional capacitance, the electrode stack including an upper electrode layer and a lower electrode layer stacked, each electrode layer being a stack provided with a plurality of coil patterns.

Embodiments of this application provide an integrated circuit, a chip, and a terminal, and relate to the field of circuit technologies, to reduce layout areas occupied by a first inductor and a second inductor in the integrated circuit, thereby reducing a layout area occupied by the integrated circuit. The integrated circuit includes the first inductor and the second inductor. The first inductor includes a first coil, and the first coil is a loop having a first opening. The second inductor includes a second coil and a third coil that are connected in series, and the second coil has a second opening. A magnetic field direction of the second coil is opposite to a magnetic field direction of the third coil. The second coil and the third coil are nested in the first coil, and the first inductor is not in direct contact with the second inductor

The application discloses a planar transformer and a processing equipment thereof, and relates to the technical field of assembling equipment. The planar transformer and the processing equipment thereof comprise a feeding mechanism and a stacking mechanism. The feeding mechanism is connected with the stacking mechanism and is used for transmitting three parts of the planar transformer to the stacking mechanism respectively. The three parts are stacked and bonded by the stacking mechanism. The bottom of the feeding mechanism and the bottom of the stacking mechanism are both arranged to be inclined to facilitate the sliding of the parts. The three sheet-shaped parts of the planar transformer are positioned and stacked and bonded in a folding mode. The assembling precision is ensured, and a mechanical arm and other precise and high-cost equipment and a high-precision control system are not needed, so that the cost is greatly reduced, the same effect can be achieved, the air supply assembly can simultaneously utilize the air suction and air outlet functions, the parts can be sucked to avoid falling during the turning, and the parts can be blown out after the stacking, so that the operation is simple and convenient.

Provided are a coil and a coil component capable of reducing manufacturing costs. 【Solution means】The coil 10 includes parts 22, 24, 32, 34, 36 formed by sandwiching a copper foil L2 between a film-like base material L1 made of a polyimide resin and a coverlay film L4, and connectors 22B, 24B, 32A, 32B, 34A, 34B, 36A, 36B attached to the parts 22, 24, 32, 34, 36. The parts 22, 24, 32, 34, 36 are configured such that the parts 22, 24, 32, 34, 36 are not in close contact with each other by being connected via the connectors 22B, 24B, 32A, 32B, 34A, 34B, 36A, 36B.

The invention relates to a composite pane (1) for a motor vehicle, comprising an outer pane (2), an inner pane (3), a connecting layer (5), and photovoltaic cells (7), the photovoltaic cells (7) being embedded in the connecting layer (5). The connecting layer (5) is provided between the outer pane (2) and the inner pane (3), the composite pane (1) comprises a reflective film (6) which is formed between the inner pane (3) and the connecting layer (5), the reflective film (6) is designed to reflect infrared radiation which passes through the connecting layer (5) and is incident on the reflective film (6), and the region between the reflective film (6) and the inner pane (3) is free of electro-functional elements.

A transformer (100, 100') is disclosed, comprising a first conducting element (110) having a first lobed portion (114) arranged to form a first plurality of lobes (116); and a second conducting element (120) having a second lobed portion (124) arranged to form a second plurality of lobes (126); wherein said first lobed portion (114) overlaps said second lobed portion (124) to define a plurality of enclosed areas (130). The transformer is adapted for applications requiring an autotransformer having a weak, negative magnetic coupling coefficient.

The application discloses a radio frequency power amplifier, which comprises a first power amplifier circuit, a second power amplifier circuit and a voltage synthesis network, wherein the voltage synthesis network comprises a first transformer, a second transformer and a first capacitor unit; the first transformer comprises a first winding and a second winding; the second transformer comprises a third winding and a fourth winding; the first power amplifier circuit is connected with the first winding; the second power amplifier circuit is connected with the third winding; a first end of the second winding is connected to a signal output end; a second end of the second winding is connected with a first end of the fourth winding; and a second end of the fourth winding is connected to a grounding end; wherein the first capacitor unit is connected in parallel with at least part of the coils of the second winding; thus, the problem of excessive loss caused by poor balance of the radio frequency power amplifier can be solved.

A traveling-wave parametric amplifier (TWPA) transmission line having an improved bandwidth includes one or more unit cells. Each unit cell includes a capacitor and a Josephson junction connected in series and leading to ground, configured to provide inductance and non-linearity. One or more distributed resonators are coupled to the transmission line. The distributed resonators are configured to (i) use a first harmonic mode of the resonator for resonance phase matching in the transmission line and (ii) prevent the second mode of the resonator from interacting with the intermodulation product of the transmission line.