107results about "Fixed transformers or mutual inductances" patented technology

The present disclosure relates to semiconductor device packages and methods of manufacturing the same. The semiconductor device package includes a substrate having a first surface and a second surface opposite the first surface. The semiconductor device package also includes a first electrically conductive layer disposed over the first surface of the substrate and an insulating layer disposed over the first surface of the substrate. The semiconductor device package also includes a magnetically conductive layer disposed between the first electrically conductive layer and the insulating layer. The magnetically conductive layer has a bottom surface facing the first surface of the substrate, a top surface opposite the first surface of the substrate, and a side surface extending between the bottom surface of the magnetically conductive layer and the top surface of the magnetically conductive layer. Another embodiment of the present disclosure relates to a method of manufacturing a semiconductor device package.

The utility model discloses a transformer shell structure and a transformer, and relates to the field of transformer heat dissipation. The device comprises a transformer shell structure, the transformer shell structure comprises a fixed heat dissipation side shell, side through grooves, heat dissipation inclined plates and heat dissipation side plates are arranged in the fixed heat dissipation side shell, telescopic side through grooves are formed in the two sides of the fixed heat dissipation side shell, and the heat dissipation inclined plates are fixedly connected into the side through grooves and fixed in an inclined array mode. The heat dissipation side plates are fixedly connected to the two sides of the fixed heat dissipation side shell and used for conducting heat dissipation on the interior of the fixed heat dissipation side shell, and the heat dissipation side plates are fixedly connected to the other two sides of the fixed heat dissipation side shell, fixed in an array mode and used for dissipating heat accumulated in the fixed heat dissipation side shell out of each set of heat dissipation side plates. According to the device, the heat dissipation inclined plates and the heat dissipation side plates are arranged, so that heat in the iron core can be transmitted to the heat dissipation inclined plates and the heat dissipation side plates through the transformer shell for heat dissipation, the internal heat cannot be gathered, the service life of the transformer is prolonged, and damage to the transformer is reduced.

The application discloses a planar transformer and a processing equipment thereof, and relates to the technical field of assembling equipment. The planar transformer and the processing equipment thereof comprise a feeding mechanism and a stacking mechanism. The feeding mechanism is connected with the stacking mechanism and is used for transmitting three parts of the planar transformer to the stacking mechanism respectively. The three parts are stacked and bonded by the stacking mechanism. The bottom of the feeding mechanism and the bottom of the stacking mechanism are both arranged to be inclined to facilitate the sliding of the parts. The three sheet-shaped parts of the planar transformer are positioned and stacked and bonded in a folding mode. The assembling precision is ensured, and a mechanical arm and other precise and high-cost equipment and a high-precision control system are not needed, so that the cost is greatly reduced, the same effect can be achieved, the air supply assembly can simultaneously utilize the air suction and air outlet functions, the parts can be sucked to avoid falling during the turning, and the parts can be blown out after the stacking, so that the operation is simple and convenient.

The invention relates to a composite pane (1) for a motor vehicle, comprising an outer pane (2), an inner pane (3), a connecting layer (5), and photovoltaic cells (7), the photovoltaic cells (7) being embedded in the connecting layer (5). The connecting layer (5) is provided between the outer pane (2) and the inner pane (3), the composite pane (1) comprises a reflective film (6) which is formed between the inner pane (3) and the connecting layer (5), the reflective film (6) is designed to reflect infrared radiation which passes through the connecting layer (5) and is incident on the reflective film (6), and the region between the reflective film (6) and the inner pane (3) is free of electro-functional elements.

A signal transmission element includes a first insulating layer on a semiconductor substrate, first and second coils thereon, a second insulating layer covering the first and second coils, third and fourth coils thereon, and a protective film covering the third and fourth coils. The first and third coils are magnetically coupled, the second and fourth coils are magnetically coupled, the first and second coils are connected to each other such that a current generated by mutual induction between the first coil and the third coil flows through the second coil, and the protective film includes a plurality of openings reaching two ends of the third coil and two ends of the fourth coil.

The application discloses an on-chip transformer and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a substrate, the surface of the substrate is provided with an isolation layer; preparing a primary coil assembly on the isolation layer, the primary coil assembly comprises a primary coil and a first lead coil which are electrically contacted, and a first dielectric layer which is located between the primary coil and the first lead coil; preparing a secondary coil assembly on the primary coil assembly, the secondary coil assembly comprises a secondary coil and a second lead coil which are electrically contacted, and a third dielectric layer which is located between the secondary coil and the second lead coil. According to the scheme, the coil and the dielectric layer which are alternately stacked in sequence can be formed on the same substrate through a deposition process, four layers of coils and three layers of dielectric layers can constitute the same on-chip transformer, the frequency and the efficiency can be improved, the area can be greatly reduced, and the structure is simple and small in size.

The invention discloses an on-chip passive transformer Balun with broadband and low phase noise, and belongs to the field of integrated circuit chip design. The invention comprises two primary coils, two secondary coils and a ground plane. The primary coil and the secondary coil are mutually nested to improve the coupling coefficient. The broadband low-phase noise on-chip passive transformer Balun can be used for occasions where differential-single-ended signal conversion or single-ended-differential signal conversion needs to be completed in integrated circuit design, for example, the broadband low-phase noise on-chip passive transformer Balun can work in the frequency band of 4 GHz-23 GHz, and differential signals with the phase difference of 180 degrees output by a double mixer in an IQ modulator module are converted into single-ended signals. The on-chip transformer balun is large in coupling coefficient and small in energy loss, and therefore low phase noise of signals is guaranteed.

To provide a semiconductor device with a seal conductor capable of improving pressure resistance.SOLUTION: In a semiconductor module, a semiconductor device includes: a semiconductor chip 41 having a principal surface 42; an insulating layer 51 formed on the principal surface; functional devices 45, 60 formed on at least one of the semiconductor chip and the insulating layer; at least one terminal 11, 12 formed on the insulating layer and electrically connected to the functional device; and a seal conductor 61 which partitions, in a plan view, a region including the functional device and at least one terminal from other regions and includes a plurality of seal plug conductors 64, and a plurality of seal via conductors 65 positioned between the semiconductor chip and the seal plug conductors, arranged adjacent to each other in the plan view and each having a width in the plan view smaller than that of the seal plug conductors.SELECTED DRAWING: Figure 8

The invention relates to a transformer structure which is arranged on a circuit board, the circuit board is provided with an opening, and the transformer structure comprises a frame unit, a coil unit, an iron core unit and at least one n-shaped conductive piece. The frame unit is arranged on the circuit board, the frame unit is provided with a containing space used for containing the coil unit and the iron core unit, and at least one part of the containing space is located in the open hole. The conductive member is arranged on the frame unit and is electrically connected with the coil unit and the circuit board.

The invention belongs to the technical field of high-frequency planar transformers, and relates to a planar transformer with trapezoidal double-concave waist side columns for a CDR converter, which comprises a primary side 8-shaped winding, a secondary side fractional-turn winding, two circular middle column magnetic cores, two rectangular side column magnetic cores and a trapezoidal double-concave waist side column magnetic core, the trapezoidal double-concave waist core column is positioned on the outer side between the two circular middle columns, and forms a triangular layout with the circular core column; the primary side 8-shaped winding is wound around the two circular core columns in an 8-shaped manner in the anticlockwise direction; the secondary side fractional-turn winding is composed of four independent half-turn windings which are wound around the two rectangular side columns and the two circular middle columns respectively. According to the invention, the problem that the transformer of the CDR topology simultaneously realizes the inductance magnetic integration and the winding fractional turn is solved, so that the converter of the CDR topology can still consider the advantages of the magnetic integration and the fractional turn in a follow current state, and the loss of the whole machine is obviously reduced.

To provide a transformer capable of reducing eddy current losses. [Solution] The transformer 1 comprises a core 2 having a central leg portion 21 extending in the vertical direction, side leg portions 22 extending in the vertical direction and provided away from the central leg portion 21 in the left-right direction, and a connecting portion 23 connecting the central leg portion 21 and the side leg portion 22 to each other; a primary winding 3 wound around the central leg portion 21; a secondary winding 4 provided away from the primary winding 3 in the vertical direction and wound around the central leg portion 21; and a pass core 5 that forms a magnetic path for leakage flux together with the core 2, the pass core 5 extending in the left-right direction and provided between the primary winding 3 and the secondary winding 4, wherein the pass core 5 is provided with a gap G2 located between the inner edge 3A of the primary winding 3 in the left-right direction and the outer edge 3B of the primary winding 3 in the left-right direction when viewed from the vertical direction.

This provides a signal transmission element that eliminates the need for a process of drawing the lower layer coil to the element surface. [Solution] The semiconductor substrate comprises a first insulating layer, first and second coils on the same, a second insulating layer covering the first and second coils, third and fourth coils on the same, and a protective film covering the third and fourth coils. The first and third coils are magnetically coupled, the second and fourth coils are magnetically coupled, and the first and second coils are connected to each other such that the current generated by mutual induction between the first and third coils flows into the second coil. The protective film has multiple openings that reach the two ends of the third coil and the two ends of the fourth coil.

The utility model discloses a small-size multi-pin high-frequency transformer, which relates to the technical field of transformers and comprises a fixer, a shifting connector is slidably clamped in the fixer, and a high-frequency transformer is inserted into the upper end of the shifting connector. The multi-pin high-frequency transformer solves the problems that wiring standards of an existing multi-pin high-frequency transformer are not uniform, and installation difficulty is increased, through the arrangement of the fixing devices, the sliding grooves are formed in the two sides of the high-frequency transformer in an aligned mode, the springs provide extrusion force for the shifting connectors in the sliding grooves from the two ends, the stability of the high-frequency transformer after plugging is kept, and installation is convenient. Through the arrangement of the shifting connectors, the multiple sets of moving assemblies are arranged, the universality is improved, the moving assemblies are externally connected with wires and adjustable in position, the shifting clamping assemblies can slide along the moving assemblies to adjust the distance and are used for being connected with transformers with different distances on the two sides in an inserted mode, the depth of the shifting clamping assemblies is large, and the universality is improved. The arrangement of the structure can be suitable for high-frequency transformers with multiple pin positions and multiple intervals.

Embodiments of this application provide an integrated circuit, a chip, and a terminal, and relate to the field of circuit technologies, to reduce layout areas occupied by a first inductor and a second inductor in the integrated circuit, thereby reducing a layout area occupied by the integrated circuit. The integrated circuit includes the first inductor and the second inductor. The first inductor includes a first coil, and the first coil is a loop having a first opening. The second inductor includes a second coil and a third coil that are connected in series, and the second coil has a second opening. A magnetic field direction of the second coil is opposite to a magnetic field direction of the third coil. The second coil and the third coil are nested in the first coil, and the first inductor is not in direct contact with the second inductor

The invention discloses a high-frequency transformer and an assembling method thereof.The high-frequency transformer comprises a framework, the middle of the framework is cylindrical, a coil is wound around the middle of the framework, a lead is arranged at the end of the coil, a sleeve is arranged on the lead, wire connecting boxes are arranged on the two sides of the bottom of the framework, and a plurality of pins are arranged at the bottoms of the wire connecting boxes; each lead of the coil is connected with a corresponding pin, the coil is wrapped by a separation adhesive tape, a copper foil is wrapped between the separation adhesive tape and the coil, and a high-permeability magnetic core is mounted on the framework. According to the high-frequency transformer, the structure of the framework is improved, so that the leads can be directly welded with the pins before winding, the leads can be directly connected with the corresponding pin supports in the winding process, the problem that the leads and the pins are connected mistakenly is solved, meanwhile, the high-frequency transformer with the structure is convenient to assemble, and the cost is reduced. And the probability of errors in the assembly process of the high-frequency transformer is reduced.

Provided is a transformer capable of reducing eddy current loss. A transformer (1) is provided with: a core (2) having a central leg section (21) extending in the vertical direction, side leg sections (22) extending in the vertical direction and provided apart from the central leg section in the left-right direction, and connecting sections (23) connecting the central leg section and the side leg sections to each other; a primary winding (3) wound around the central leg; a secondary winding (4) that is provided separately from the primary winding in the vertical direction and that is wound around the central leg section (21); and a path iron core (5) that forms a magnetic path for leakage magnetic flux together with the iron core, extends in the left-right direction, and is provided between the primary winding and the secondary winding. A gap (G2) is provided between an inner edge (3A) of the primary winding in the left-right direction and an outer edge (3B) of the primary winding in the left-right direction.

The utility model discloses a high-frequency transformer, which relates to the technical field of high-frequency transformers and is characterized by comprising a high-frequency transformer body. The high-frequency transformer has the technical effects that the panel cleaning mechanism structure is arranged, so that dust can be movably cleaned, and the influence of dust blockage on heat dissipation is avoided; a lead screw in a lead screw machine body of the panel cleaning mechanism rotates forwards and backwards so that a lead screw sliding block in threaded rotation connection can move left and right, the lead screw sliding block can drive a cleaning vertical plate installed through an assembly screw to move left and right in the left-right moving process, and a groove hole cleaning protruding plate is installed on the inner side of the lower end of the cleaning vertical plate. The cleaning vertical plate can drive the groove hole cleaning convex plate to move, the cleaning vertical plate is connected in the inner side groove hole of the heat dissipation panel in a sleeved mode through the groove hole cleaning convex plate, and the cleaning vertical plate can drive the groove hole cleaning convex plate to clean dust in the inner side groove hole of the heat dissipation panel in the moving process.

A transformer comprising a primary winding and a secondary winding. The primary winding has N2 number turns and having a first terminal and a second terminal. The secondary winding has having N1 fractional portions, which together form a full turn, are in close proximity to the primary winding to establish coupling between the primary winding and the N1 fractional coil portions, the transformer turn ratio from the primary winding to the secondary winding is N2:(N3 / N1) where N2 is an integer equal to or greater than 1, N1 is an integer greater than or equal to 2, and N3 is an integer greater than or equal to 1. Also disclosed is a stacked integrated transformer having a primary winding and secondary winding of which one or both have a waterfall structure and a portion of which functions as a ground connected shield between the secondary winding and the primary winding.

A transformer includes an iron core including an iron core main body, a first main winding wire, a second main winding wire, a first detection winding wire, and a second detection winding wire. The iron core main body includes a first through hole, a second through hole, and a first leg portion positioned between the first through hole and the second through hole, the first through hole and the second through hole being positioned at intervals in a first direction. The first main winding wire is wound around the first leg portion and includes winding ends positioned in the first through hole. The second main winding wire is wound around the first leg portion and includes winding ends positioned in the second through hole. The first detection winding wire is wound around the iron core in a state where a magnetic flux generated by a common mode noise is cancelable and configured to detect a normal mode noise current. The second detection winding wire is wound around the iron core in a state where a magnetic flux generated by the normal mode noise current is cancelable and configured to detect the common mode noise current.

An isolation transformer includes an insulation layer and a transformer. The transformer includes a first coil and a second coil embedded in the insulation layer. The first coil and the second coil are opposed to each other in a thickness-wise direction of the insulation layer. The first coil and the second coil include non-overlapping portions that do not overlap each other in the thickness-wise direction of the insulation layer.

This utility model relates to the field of high-frequency power electronics technology and discloses a frameless planar high-frequency transformer, including a PCB board. The outer surface of the PCB board has positioning grooves and clearance holes. A ceramic thick film is disposed on the outer surface of the PCB board, and silver wires are disposed on the outer surface of the ceramic thick film. The silver wires are fixedly connected to the PCB board by solder feet. An insulating film is attached to the surfaces of the ceramic thick film and the silver wires. A magnetic core is disposed on the surface of the PCB board. A shielding cover is fixedly disposed on the outer surface of the PCB board, and contact copper strips are snapped onto the inner surface of the shielding cover. This frameless planar high-frequency transformer, with its ceramic thick film and silver wire design, can reduce the skin effect at high frequencies, optimize inductance, and improve energy transmission efficiency under high-frequency conditions. Simultaneously, the ceramic thick film itself has good thermal conductivity, which, combined with the shielding cover and contact copper strips, forms an effective heat dissipation path, accelerating heat dissipation.

Semiconductor devices and methods of manufacturing a balun having improved common mode rejection ratio. An electronic device has a first transformer and a second transformer. A first winding of the first transformer is coupled to a first winding of the second transformer by an interconnect transmission line. A phase compensation transmission line is coupled to a second winding of the first transformer. The phase compensation transmission line is configured to match an impedance of the interconnect transmission line.

A coil assembly includes a core and a first coil portion and a second coil portion wound on the core to form one or more turns. The core includes a first core portion on which the first coil portion is wound, a second core portion on which the second coil portion is wound, and a third core portion between the first core portion and the second core portion, and the first coil portion and the second coil portion are wound on the third core portion to be superposed on each other.

A transformer includes a core having a center leg portion extending in a first direction, a side leg portion extending in the first direction and provided away from the center leg portion in a second direction, and a coupling portion connecting the center leg portion to the side leg portion, a primary winding wound around the center leg portion, a secondary winding wound around the center leg portion, and a path core forming a magnetic path, extending in the second direction, and being provided between the primary winding and the secondary winding. A gap is formed in the path core and located, as viewed in the first direction, between an inner edge of the primary winding and an outer edge of the primary winding in the second direction.

The application discloses a high-frequency transformer and a manufacturing method thereof, and belongs to the technical field of high-frequency power conversion. The problems of low coupling degree, large leakage inductance, significant skin effect, poor heat dissipation and rust prevention, and large contact resistance of the leading-out end of the traditional high-frequency transformer are solved. The transformer adopts a structure of double-layer iron plates on one side and single-layer iron plates on the other side, a magnetic core is arranged between the double-layer iron plates and the single-layer iron plates, a secondary side adopts an air-core copper pipe to pass through the magnetic core and is led out on one side, a primary side is wound on the outside of the magnetic core, and epoxy resin support columns support the lower layer of the double-layer iron plates. The manufacturing process comprises the following steps of material preparation, pretreatment, initial fixing, winding of the primary side, structural support and final assembly. The magnetic core is fixed and the winding is isolated by connecting the double-sided plate bodies through the copper pipe. The application has the advantages of stable structure, reliable insulation, efficient heat dissipation, suppression of high-frequency loss of large current, high coupling degree, small leakage inductance, and the like, and is suitable for the fields of high-power switching power supply, inverter welding machine, induction heating and high-current high-speed current source.

Disclosed are an embedded water cooling system with a magnetic flux leakage guiding structure, a transformer and a heat dissipation method. In the system, a C-shaped water cooling plate is embedded in a gap region between a secondary winding and a main magnetic core of a high-frequency transformer to directly contact and discharge heat from the gap region. The magnetic flux leakage guiding structure is composed of a plurality of ferrite core pieces, including at least one first magnetic core piece and at least one second magnetic core piece. One end of the second magnetic core piece is directly and closely connected with the main magnetic core to form a low-magnetic-resistance magnetic flux path. The first magnetic core piece is arranged close to the C-shaped water cooling plate and maintains a preset distance from the main magnetic core or is isolated from the main magnetic core via a high-magnetic-resistance medium. The magnetic flux leakage guiding structure is configured to guide high-frequency magnetic flux generated during operation of the high-frequency transformer to preferentially enter the second magnetic core piece and flow to the main magnetic core, so as to reduce the magnetic flux density that penetrates the C-shaped water cooling plate vertically, thereby inhibiting eddy current loss in the C-shaped water cooling plate.

Disclosed is a multilayered common mode filter exhibiting wideband characteristics as well as allowing uniform resistance and inductance in the coil patterns that form the channels. The disclosed multilayered common mode filter includes first and second capacitor layers on top and bottom, respectively, of an electrode stack, to overlap with multiple coil patterns and form additional capacitance, the electrode stack including stacked upper and lower electrode layers each having a stacked body provided with multiple coil patterns.

This disclosure is directed to an electronic circuit, a transmitting apparatus and an electronic device. The electronic circuit generally comprises a transformer and a coupler. The transformer comprises a primary coil and a secondary coil, wherein the primary coil receives a first signal from a power amplifier, and the secondary coil is magnetically coupled with the primary coil and outputs a second signal to an antenna. The coupler comprises two coupling paths for obtaining a forward power and a reflected power for the second signal. Among the two coupling paths, a first coupling path is magnetically coupled with a first part of the primary coil and the secondary coil to generate a first voltage indicating the forward power for the second signal. In addition, a second coupling path is magnetically coupled with a second part of the primary coil and the second coil to generate a second voltage indicating a reflected power for the second signal. According to the embodiments of the present disclosure, bi-directional coupling without sacrificing chip area and insertion loss can be achieved.

The application discloses a staggered parallel winding and magnetic integrated structure suitable for a high-frequency transformer and belongs to the technical field of high-frequency power electronic conversion equipment manufacturing. S1, a supporting base, a magnetic circuit closed unit, a multilayer winding stack and a magnetic field compensation layer embedded in the center between layers are arranged; S2, voltage and current phase are monitored, and equivalent inductance deviation of each branch is evaluated according to a phase deviation angle; S3, when the current of a certain branch abnormally rises, the leakage magnetic flux of the certain branch induces a rotating current in the compensation layer, a reverse eddy current compensation magnetic field is generated, the equivalent inductance of the certain branch is passively increased to force current transfer; S4, the temperature rise rate of the magnetic circuit unit is monitored, the magnetic saturation redundancy of the compensation layer is calculated according to the phase deviation angle, the switching frequency is adjusted in real time, the rotating current intensity is enhanced by high-frequency induction to make up for the loss of magnetic conductivity.

An electronic component includes a body including insulating layers laminated in a Z-axis direction, and a primary coil and a secondary coil inside the body. The secondary coil includes wiring patterns separated by intervals in the Z-axis direction. The primary coil includes wiring patterns separated by intervals in the Z-axis direction, and a gap in a region sandwiched by adjacent wiring patterns. A dimension of the gap is larger than a distance between the adjacent wiring patterns that do not include the gap.