Laminated core manufacturing device

Abstract

A laminated core manufacturing device 10 comprises: a lower die 20 having a die 23 in which a die hole 26 is formed; an upper die 40 having a punch 45 corresponding to the die hole 26; an adhesive application device 70 for applying an adhesive to the lower surface WL of a metal plate W; and a control device 90 for controlling the upper die 40 and the adhesive application device 70. The control device 90 has: a movement control unit 92 for controlling the movement of the upper die 40 in a vertical direction Z; and an application control unit 94 configured to be capable of changing a start timing which is a timing for starting application of the adhesive from the adhesive application device 70 to the lower surface WL of the metal plate W.

Description

Laminated iron core manufacturing equipment

[0001] The present invention relates to a manufacturing apparatus for a laminated iron core.

[0002] Laminated cores used in motors and the like are formed by punching a strip-shaped metal plate (e.g., a strip-shaped steel plate) into a predetermined shape to form core members (cores), and then stacking and integrating the formed core members. For example, a laminated core is formed by stacking and integrating the core members by caulking, welding, or adhesive. For example, Patent Document 1 discloses a manufacturing apparatus for manufacturing a laminated core in which multiple core members are stacked and bonded together using an adhesive. In Patent Document 1, an adhesive application mechanism is provided in a lower mold having a die, and adhesive is dispensed from a discharge nozzle of the adhesive application mechanism and applied to a predetermined position on the underside of a thin steel plate when the pressing timing reaches the bottom dead center position.

[0003] Japanese Patent Application Publication No. 2001-321850

[0004] When applying the adhesive to the underside of the metal plate, the adhesive must be applied accurately to a predetermined position on the underside of the metal plate. If the adhesive is not applied accurately, the iron core members will not be bonded accurately to each other, which could result in a decrease in the strength of the laminated iron core.

[0005] The present invention has been made in consideration of the above points, and its object is to provide a laminated core manufacturing device that can accurately apply adhesive to predetermined positions on the underside of a metal plate.

[0006] The laminated iron core manufacturing apparatus of the present invention is an apparatus for manufacturing a laminated iron core in which a plurality of iron core components are stacked and bonded to each other, and comprises a lower mold having a die with a die hole formed therein, an upper mold having a punch corresponding to the die hole, an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate, and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the start timing, which is the timing at which the adhesive application device starts applying the adhesive to the underside of the metal plate.

[0007] The laminated core manufacturing apparatus according to the present invention includes a control device that controls the upper die and the adhesive applicator. The application control unit of the control device is configured to change the start timing, which is the timing at which the adhesive applicator starts applying adhesive to the underside of the metal plate. According to the above aspect, the timing at which the adhesive application starts can be changed as needed, so that the adhesive can be applied more accurately to a predetermined position on the underside of the metal plate at a predetermined timing.

[0008] Another laminated iron core manufacturing apparatus according to the present invention is an apparatus for manufacturing a laminated iron core in which multiple iron core components are stacked and bonded to each other, and comprises a lower mold having a die with a die hole formed therein, an upper mold having a punch corresponding to the die hole, an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate, and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the completion timing, which is the timing at which the application of the adhesive from the adhesive application device to the underside of the metal plate is completed.

[0009] Another laminated core manufacturing apparatus according to the present invention includes a control device that controls the upper die and the adhesive applicator. The application control unit of the control device is configured to be able to change the completion timing, which is the timing at which the adhesive applicator completes application of adhesive to the underside of the metal plate. According to this aspect, the timing at which the adhesive application is completed can be changed as needed, so that the adhesive can be applied more accurately to a predetermined position on the underside of the metal plate at a predetermined timing.

[0010] Another laminated iron core manufacturing apparatus according to the present invention is an apparatus for manufacturing a laminated iron core in which multiple iron core components are stacked and bonded to each other, and comprises a lower mold having a die with a die hole formed therein, an upper mold having a punch corresponding to the die hole, an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate, and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the period from when the adhesive application device starts to apply the adhesive to the underside of the metal plate to when it is completed.

[0011] Another laminated core manufacturing apparatus according to the present invention includes a control device that controls the upper die and the adhesive applicator. The application control unit of the control device is configured to change the period from when the adhesive applicator starts to apply adhesive to the underside of the metal plate until it finishes. This aspect allows the adhesive application period to be changed as needed, making it possible to more accurately apply adhesive to a predetermined position on the underside of the metal plate at a predetermined timing.

[0012] According to the present invention, it is possible to provide a laminated core manufacturing device that can accurately apply adhesive to predetermined positions on the lower surface of a metal plate.

[0013] FIG. 1 is a side view showing a laminated core manufacturing apparatus according to one embodiment. FIG. 2 is a perspective view showing a laminated core according to one embodiment. FIG. 3 is a plan view showing a lower die according to one embodiment. FIG. 4A is a cross-sectional view showing a lift member and its surrounding structure according to one embodiment. FIG. 4B is a cross-sectional view showing a state in which a stripper plate according to one embodiment is pressing a metal plate downward. FIG. 4C is a cross-sectional view showing a state in which a metal plate is sandwiched between a stripper plate and a die plate according to one embodiment. FIG. 5 is a cross-sectional view showing a laminated core manufacturing apparatus according to one embodiment. FIG. 6A is a schematic view showing the positional relationship between a pilot pin and a pilot hole according to one embodiment. FIG. 6B is a schematic view showing a state in which a pilot pin according to one embodiment is inserted into a pilot hole. FIG. 6C is a schematic view showing a state in which half of the insertion portion of a pilot pin according to one embodiment is inserted into a pilot hole. FIG. 7A is a cross-sectional view showing a normal state of an adhesive application device according to one embodiment. FIG. 7B is a cross-sectional view showing a state in which adhesive is supplied to an adhesive storage chamber of an adhesive application device according to one embodiment. FIG. 7C is a cross-sectional view showing a state in which adhesive is being discharged from a nozzle of an adhesive application device according to one embodiment. Fig. 7D is a cross-sectional view showing a state in which adhesive ejected from a nozzle of an adhesive application device according to an embodiment is adhered to the underside of a strip-shaped metal plate. Fig. 8 is a cross-sectional view showing a state in which a stripper plate according to an embodiment is at its lowest position pressing a strip-shaped metal plate against a die plate. Fig. 9 is an example of a graph showing the relationship between the vertical position of an upper die according to an embodiment and the state of each component. Fig. 10 is a flowchart of a method for manufacturing a laminated core according to an embodiment.

[0014] Hereinafter, an embodiment of a laminated iron core manufacturing apparatus according to the present invention will be described with reference to the drawings. It should be noted that the embodiment described here is not intended to limit the present invention in any particular way. Furthermore, the same reference numerals are used for components and parts that perform the same functions, and redundant descriptions will be omitted or simplified as appropriate.

[0015] As shown in FIG. 1 , a laminated core manufacturing apparatus 10 (hereinafter referred to as manufacturing apparatus 10) of this embodiment manufactures a laminated core 8 (see FIG. 2 ) in which a plurality of core members 5 (see FIG. 2 ) are stacked and bonded to one another. The manufacturing apparatus 10 is a progressive press die. In the manufacturing apparatus 10, a strip-shaped metal sheet W is intermittently conveyed to a plurality of processing stages 25 (see FIG. 3 ), which will be described later. The strip-shaped metal sheet W is, for example, a coil material (strip-shaped thin steel sheet). The manufacturing apparatus 10 includes a lower die 20, an upper die 40, a pilot pin 50 (see FIG. 5 ), a stripper plate 60, an adhesive application device 70 (see FIG. 5 ), and a control device 90.

[0016] The lower mold 20 is fixed to the floor surface. As shown in FIG. 3 , the lower mold 20 is provided with a plurality of processing stages 25. The processing stages 25 include a pilot hole punching stage 25X, an inner shape punching stage 25A, an adhesive application stage 25B, and an outer shape punching stage 25C. The pilot hole punching stage 25X, the inner shape punching stage 25A, the adhesive application stage 25B, and the outer shape punching stage 25C are arranged in this order in the forward feed direction D (an example of a conveyance direction). The pilot hole punching stage 25X includes a pilot hole forming die plate 22X, a pilot hole forming die 23X, a pilot hole punching die hole 26X, and a pilot hole punching punch 45X (see FIG. 5 ), which will be described later. The inner shape punching stage 25A includes a first die plate 22A, a first die 23A, an inner shape punching die hole 26A, and an inner shape punching punch 45A (see FIG. 5), which will be described later. The outer shape punching stage 25C includes a second die plate 22C, a second die 23C, an outer shape punching die hole 26C, and an outer shape punching punch 45C (see FIG. 5), which will be described later.

[0017] The lower mold 20 has a lower mold body 21, a die plate 22, and a die 23. The die plate 22 and the die 23 are placed on the lower mold body 21. The die plate 22 holds the die 23. The die plate 22 includes a pilot hole forming die plate 22X that holds a pilot hole forming die 23X (described later), a first die plate 22A that holds a first die 23A (described later), and a second die plate 22C that holds a second die 23C (described later). The die 23 includes a pilot hole forming die 23X included in a pilot hole punching stage 25X, a first die 23A included in an inner shape punching stage 25A, and a second die 23C included in an outer shape punching stage 25C. A die hole 26 is formed in the die 23. A pilot hole punching die hole 26X is formed in the pilot hole forming die 23X as the die hole 26. The first die 23A has an inner shape punching die hole 26A formed therein as the die hole 26. The second die 23C has an outer shape punching die hole 26C formed therein as the die hole 26. The upper surface 22T of the die plate 22 and the upper surface 23T of the die 23 are located at the same height. More specifically, the upper surface 22T of the pilot hole forming die plate 22X and the upper surface 23T of the pilot hole forming die 23X are located at the same height as the upper surface 22T of the first die plate 22A and the upper surface 23T of the first die 23A, and the upper surface 22T of the second die plate 22C and the upper surface 23T of the second die 23C. The lower die body 21 includes an adhesive application stage 25B. An adhesive application through hole 27 is formed in the lower die body 21. Note that an adhesive application device 70 (see FIG. 5) is not shown in FIG. 3.

[0018] The strip-shaped metal sheet W is intermittently transported to the lower die 20 by a transport device (not shown) provided near the manufacturing apparatus 10. The strip-shaped metal sheet W is intermittently transported through the pilot hole punching stage 25X, the inner shape punching stage 25A, the adhesive application stage 25B, and the outer shape punching stage 25C in this order. The transport device holds the strip-shaped metal sheet W in a wound state. The strip-shaped metal sheet W is transported to the lower die 20 by an unwinding device (not shown) of the transport device, and scrap material of the pressed strip-shaped metal sheet W is transported from the lower die 20 by a winding device (not shown) of the transport device and wound onto a winding device. Note that instead of the unwinding device and winding device of the transport device, the strip-shaped metal sheet W may be sandwiched between a pair of upper and lower rotating rolls arranged upstream and downstream of the manufacturing apparatus 10 and transported.

[0019] As shown in FIG. 3 , the die 23 of the lower mold 20 has multiple lift members 30. The lift members 30 urge the strip-shaped metal sheet W upward. The lift members 30 are configured to be able to push the strip-shaped metal sheet W upward. When the strip-shaped metal sheet W is intermittently conveyed over the die plate 22 and the die 23, the lift members 30 push the strip-shaped metal sheet W upward and hold the strip-shaped metal sheet W at a predetermined distance above the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23. As shown in FIG. 4A , the lift members 30 are urged upward by urging members 32 provided on the die 23. The urging members 32 are, for example, coil springs. As shown in FIG. 4B , when the stripper plate 60 moves downward and presses the strip-shaped metal sheet W downward by the stripper plate 60, the lift members 30 move downward against the urging force of the urging members 32. As a result, the strip-shaped metal sheet W is pressed by the stripper plate 60 against the upper surface 22T of the die plate 22 of the lower mold 20 (more specifically, the upper surface 22T of the pilot hole forming die plate 22X, the upper surface 22T of the first die plate 22A, and the upper surface 22T of the second die plate 22C) and the upper surface 23T of the die 23 (more specifically, the upper surface 23T of the pilot hole forming die 23X, the upper surface 23T of the first die 23A, and the upper surface 23T of the second die 23C) (see FIG. 4C ). At this time, the stripper plate 60 is located at the lowest position LP. As shown in FIGS. 4A to 4C , the biasing member 32 is configured to allow a portion WC of the metal sheet W, which is located between the portion WA in contact with the lift member 30 and the portion WB in contact with the stripper plate 60, to move downward while remaining horizontal while the stripper plate 60 is pressing the metal sheet W downward against the biasing force of the biasing member 32. In other words, the portions WA, WB, and WC move downward while maintaining a horizontal state. With respect to the width direction E, which is a direction perpendicular to the forward feed direction D in a plan view, which is the direction in which the metal sheet W is transported, the length L1 of the portion WC of the metal sheet W located between the portion WA in contact with the lift member 30 and the portion WB in contact with the stripper plate 60 is equal to or greater than half the length L2 of the lift member 30.In the width direction E, the length L1 of the portion WC of the metal sheet W located between the portion WA in contact with the lifting member 30 and the portion WB in contact with the stripper plate 60 is at least half the length L3 of the portion of the lifting member 30 that can contact the metal sheet W. In this embodiment, the portion of the lifting member 30 that can contact the metal sheet W is linear in side view, but it may also be arc-shaped. Meanwhile, when the stripper plate 60 moves upward and no longer applies its pressing force to the strip-shaped metal sheet W, the lifting member 30 moves upward due to the biasing force of the biasing member 32. That is, the lifting member 30 is configured to be movable to the uppermost position PM (see FIG. 4A ) when the stripper plate 60 is not pressing the strip-shaped metal sheet W. As a result, the lifting member 30 holds the strip-shaped metal sheet W a predetermined distance above the lower mold 20 (more specifically, the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23). During the intermittent conveyance, the strip-shaped metal sheet W moves above the upper surface 30A of the lift member 30. The die 23 of the lower mold 20 has a regulating member 28 that regulates the upward movement of the strip-shaped metal sheet W when the strip-shaped metal sheet W is pushed upward by the lift member 30. The regulating member 28 regulates the gap between the strip-shaped metal sheet W and the lower mold 20 (more specifically, the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23) from widening beyond a predetermined value.

[0020] As shown in FIG. 5 , the upper die 40 is disposed above the lower die 20. The upper die 40 is configured to be able to move toward and away from the lower die 20. The upper die 40 has a plurality of punches 45 corresponding to the die holes 26. The punches 45 include a pilot hole punching punch 45X, an inner shape punching punch 45A, and an outer shape punching punch 45C. The pilot hole punching punch 45X is located above the pilot hole punching die hole 26X. The pilot hole punching punch 45X is configured to be insertable into the pilot hole punching die hole 26X. Two pilot hole punching punches 45X are arranged at a predetermined interval in the width direction E (see FIG. 3 ), which is a direction perpendicular to the forward feed direction D. The inner shape punching punch 45A is located above the inner shape punching die hole 26A. The inner shape punching punch 45A is configured to be insertable into the inner shape punching die hole 26A. The outer shape punching punch 45C is positioned above the outer shape punching die hole 26C. The outer shape punching punch 45C is configured to be insertable into the outer shape punching die hole 26C. In the pilot hole punching stage 25X, after the upper mold 40 descends and approaches the lower mold 20, the pilot hole punching punch 45X and the pilot hole punching die hole 26X punch out the strip-shaped metal sheet W. As a result, pilot holes PH (see FIG. 3) are formed in the strip-shaped metal sheet W. As shown in FIG. 3, two pilot holes PH are formed in the width direction E. A pilot pin 50 is inserted into the formed pilot hole PH. As shown in FIG. 5, in the inner shape punching stage 25A (see FIG. 3), after the upper mold 40 descends and approaches the lower mold 20, the inner shape punching punch 45A and the inner shape punching die hole 26A punch out the strip-shaped metal sheet W. This forms the inner shape of the core member 5 in the strip-shaped metal plate W. In the outer shape punching stage 25C (see FIG. 3), after the upper die 40 descends and approaches the lower die 20, the strip-shaped metal plate W is punched out by the outer shape punching punch 45C and the outer shape punching die hole 26C. This forms the outer shape of the core member 5 in the strip-shaped metal plate W, completing the core member 5 (see also FIG. 2), and the core members 5 are stacked one after another in the outer shape punching die hole 26C.As will be described later, adhesive is applied to the underside of the completed core members 5, so that when the core members 5 are stacked, the core members 5 stacked in the vertical direction Z are adhered to each other.

[0021] As shown in FIG. 5 , the pilot pin 50 is provided on the upper mold 40. As shown in FIG. 6A , the pilot pin 50 is positioned opposite a pilot hole PH formed in the strip-shaped metal plate W. The pilot pin 50 is configured to be movable in the vertical direction Z together with the upper mold 40. The pilot pin 50 is configured to be insertable into the pilot hole PH. As shown in FIG. 6B , the upper mold 40 is lowered, and the pilot pin 50 is inserted into the pilot hole PH. Inserting the pilot pin 50 into the pilot hole PH positions the strip-shaped metal plate W relative to the manufacturing apparatus 10 (e.g., adhesive application apparatus 70). FIG. 6B shows the state in which the pilot pin 50 is positioned at the lowest position, i.e., the state in which the pilot pin 50 is positioned at the bottom dead center. When the upper mold 40 is positioned at the bottom dead center, the pilot pin 50 is positioned at the bottom dead center. As shown in FIG. 6B , the pilot pin 50 has an insertion portion 50A that is inserted into the pilot hole PH. The insertion portion 50A is a portion of the pilot pin 50 that is located below the pilot hole PH when the pilot pin 50 is located at bottom dead center. When the upper die 40 is raised while the pilot pin 50 is inserted into the pilot hole PH, the pilot pin 50 is removed from the pilot hole PH. Figure 6C shows a state in which half of the length of the insertion portion 50A of the pilot pin 50 in the vertical direction Z is inserted into the pilot hole PH. Note that for ease of explanation, the upper die 40 and other components are not shown in Figures 6A to 6C.

[0022] As shown in FIG. 5 , the stripper plate 60 is provided on the upper mold 40. The stripper plate 60 is disposed opposite the die plate 22 of the lower mold 20. The stripper plate 60 is configured to be movable in the vertical direction together with the upper mold 40. The stripper plate 60 is configured to be movable downward to a lowest position LP (see FIG. 8 ), which is the lowest position. The stripper plate 60 restricts the vertical movement of the metal sheet W at the lowest position LP when the punch 45 punches out the strip-shaped metal sheet W. Note that the stripper plate 60 can restrict the movement of the metal sheet W in the vertical direction Z even when positioned slightly above the lowest position LP. When the stripper plate 60 moves to the lowest position LP, it is configured to press the intermittently conveyed strip-shaped metal sheet W against the lower mold 20 (here, the die plate 22 and the die 23) and clamp the strip-shaped metal sheet W together with the lower mold 20 (here, the die plate 22 and the die 23). The stripper plate 60 presses the band-shaped metal sheet W against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23. The stripper plate 60 is formed with a punch insertion hole 60X through which the pilot hole punching punch 45X is inserted, a punch insertion hole 60A through which the inner shape punching punch 45A is inserted, and a punch insertion hole 60C through which the outer shape punching punch 45C is inserted. When the upper die 40 is lowered and the stripper plate 60 presses the band-shaped metal sheet W against the die plate 22, and the upper die 40 is further lowered, the pilot hole punching punch 45X protrudes from the punch insertion hole 60X and is inserted into the pilot hole punching die hole 26X, the inner shape punching punch 45A protrudes from the punch insertion hole 60A and is inserted into the inner shape punching die hole 26A, and the outer shape punching punch 45C protrudes from the punch insertion hole 60C and is inserted into the outer shape punching die hole 26C.

[0023] As shown in FIG. 3 , the adhesive application device 70 is provided on the lower mold body 21 of the lower mold 20. The adhesive application device 70 is disposed between the inner shape punching stage 25A and the outer shape punching stage 25C. In this embodiment, the phrase "the adhesive application device 70 is disposed between the inner shape punching stage 25A and the outer shape punching stage 25C" includes cases where the adhesive application device 70 is provided adjacent to the inner shape punching stage 25A (e.g., when provided on the first die plate 22A) and cases where the adhesive application device 70 is provided adjacent to the outer shape punching stage 25C (e.g., when provided on the second die plate 22C). Note that the adhesive application device 70 does not necessarily have to be provided between the inner shape punching stage 25A and the outer shape punching stage 25C. For example, the adhesive application device 70 may be provided adjacent to the pilot hole punching stage 25X. In the example shown in FIG. 3 , the nozzles 72 of multiple adhesive application devices 70 are illustrated. The nozzles 72 are arranged at approximately equal intervals in a double ring shape. The adhesive applicator 70 is provided on the adhesive application stage 25B (see also FIG. 5 ). More specifically, the adhesive applicator 70 is disposed within the adhesive application through-hole 27. The adhesive applicator 70 is located below the strip-shaped metal plate W. The adhesive applicator 70 applies adhesive to the underside WL of the strip-shaped metal plate W. The adhesive applicator 70 applies adhesive to the underside WL of the strip-shaped metal plate W while the strip-shaped metal plate W is being transported from the inner shape punching stage 25A to the outer shape punching stage 25C. The adhesive applicator 70 of this embodiment applies adhesive to the underside WL of the strip-shaped metal plate W by a non-contact application method (e.g., jet dispensing or spraying). Examples of liquid adhesives used in the adhesive applicator 70 include epoxy-based adhesives, acrylic-based adhesives, silicone-based adhesives, and urethane-based adhesives. However, there is no particular limitation as long as sufficient adhesive strength is obtained to form the laminated iron core 8. The adhesive curing method is not particularly limited, and for example, a solvent volatilization type, a moisture curing type, a heat curing type, a curing agent mixed type, etc. can be used.

[0024] As shown in FIGS. 7A to 7D , the adhesive application device 70 includes a housing 71, a nozzle 72, a plunger 73, and a supply tube 74. The housing 71 includes an adhesive storage chamber 71A filled with adhesive. The housing 71 also includes an insertion hole 71B through which the supply tube 74 is inserted. The adhesive storage chamber 71A and the insertion hole 71B are connected to each other. A nozzle 72 is formed in the housing 71. The nozzle 72 is connected to the adhesive storage chamber 71A. The nozzle 72 is located below the belt-shaped metal sheet W. An outlet 72A of the nozzle 72 is located below the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, which are the uppermost surfaces of the lower mold 20 (see FIG. 5 ). The nozzle 72 sprays adhesive onto the lower surface WL of the belt-shaped metal sheet W. The adhesive sprayed from the outlet 72A of the nozzle 72 forms droplets and is applied to the lower surface WL of the belt-shaped metal sheet W. A portion of the plunger 73 is accommodated in the adhesive storage chamber 71A of the housing. The plunger 73 slides within the adhesive storage chamber 71A. The plunger 73 is configured to be able to open and close the insertion hole 71B. A supply tube 74 is inserted through the insertion hole 71B. The supply tube 74 is connected to an adhesive storage tank (not shown) that stores the adhesive. For example, an application control unit 94 (see FIG. 1 ), which will be described later, of the control device 90 drives a supply pump (not shown) to supply adhesive to the adhesive storage chamber 71A via the supply tube 74.

[0025] As shown in FIG. 7A , when the adhesive application device 70 is not operating, most of the plunger 73 is housed in the adhesive storage chamber 71A. At this time, the plunger 73 closes the insertion hole 71B, preventing communication between the adhesive storage chamber 71A and the insertion hole 71B, and therefore no adhesive is supplied to the adhesive storage chamber 71A. As shown in FIG. 7B , when a signal is supplied to the adhesive application device 70, the plunger 73 moves downward, opening the insertion hole 71B and connecting the adhesive storage chamber 71A and the insertion hole 71B. This causes adhesive to be supplied to the adhesive storage chamber 71A via the supply tube 74, as indicated by arrow F1. As shown in FIG. 7C , once the adhesive storage chamber 71A is completely filled with adhesive, the plunger 73 moves upward. This causes the adhesive G filled in the adhesive storage chamber 71A to be discharged (sprayed) from the nozzle 72. At this time, the plunger 73 closes the insertion hole 71B. 7D , the adhesive G discharged (sprayed) from the nozzle 72 is applied to the lower surface WL of the strip-shaped metal plate W, and the adhesive G adheres to the lower surface WL. Here, the adhesive G, which has been sprayed from the discharge port 72A of the nozzle 72 and formed into droplets, spreads over an area wider than the opening area of ​​the discharge port 72A when it is applied (adheres) to the lower surface WL of the strip-shaped metal plate W.

[0026] Although the adhesive application device 70 applies the adhesive to the underside WL of the belt-shaped metal plate W by a non-contact application method, the present invention is not limited to this. The adhesive application device 70 may also apply the adhesive to the underside WL of the belt-shaped metal plate W by a contact application method. For example, the adhesive application device 70 may transfer the adhesive to the underside WL by bringing a mound of adhesive from the discharge port 72A of the nozzle 72 into contact with the belt-shaped metal plate W.

[0027] Fig. 9 is an example of a graph showing the relationship between the position of the upper die 40 in the vertical direction Z and the state of each member during one cycle from when the upper die 40 is at the top dead center through to when it passes the bottom dead center and returns to the top dead center again. The relationship between the position of the upper die 40 in the vertical direction Z and the state of each member is not limited to that shown in Fig. 9. The vertical axis of Fig. 9 indicates the position of the upper die 40 in the vertical direction Z, and the horizontal axis of Fig. 9 indicates the angle (crank angle) of the upper die 40.

[0028] As shown in FIG. 9 , at time T0 when the upper die 40 is positioned at the top dead center, the strip-shaped metal sheet W is being transported in the forward feed direction D. Then, when the upper die 40 moves downward and reaches time T1, the transport of the strip-shaped metal sheet W is completed. That is, the transport of the strip-shaped metal sheet W is stopped from time T1 to time T13 (described later). When the upper die 40 moves further downward and reaches time T2, the pilot pins 50 begin to be inserted into the pilot holes PH formed in the metal sheet W. That is, the pilot pins 50 are not inserted into the pilot holes PH before time T2. When the upper die 40 moves further downward and reaches time T3, the stripper plate 60 comes into contact with the metal sheet W. At this time T3, the stripper plate 60 begins to press the lifting member 30 downward via the metal sheet W, causing the lifting member 30 to begin moving downward. Furthermore, when time T3 is reached, the adhesive application device 70 may begin applying adhesive to the underside WL of the metal sheet W. When the upper die 40 moves further downward and reaches timing T4, the stripper plate 60 moves to the lowest position LP and presses the metal sheet W against the lower die 20. At this time, the lift member 30 completes its descent and is also positioned at its lowest position. When the upper die 40 moves further downward and reaches timing T5, the adhesive application device 70 may begin applying adhesive to the underside WL of the metal sheet W. When the upper die 40 moves further downward and reaches timing T6, the pilot hole punching punch 45X, the inner shape punching punch 45A, and the outer shape punching punch 45C begin punching the metal sheet W. When the upper die 40 moves further downward and reaches timing T7, the pilot hole punching punch 45X, the inner shape punching punch 45A, and the outer shape punching punch 45C complete punching the metal sheet W. Then, the upper die 40 passes bottom dead center at timing T8 and begins moving upward.

[0029] As shown in FIG. 9 , when the upper die 40 moves upward from the bottom dead center and reaches timing T9, if the adhesive application device 70 has started applying adhesive to the underside WL of the metal sheet W using a non-contact application method at timing T3 or T5, the application of adhesive may be completed. When the upper die 40 moves further upward and reaches timing T10, the stripper plate 60 completes pressing down on the metal sheet W, and the lift member 30 begins to rise due to the biasing member 32. When the upper die 40 moves further upward and reaches timing T11, the stripper plate 60 completely separates from the metal sheet W, and the lift member 30 moves to the uppermost position PM (see FIG. 4A ). Note that if the adhesive application device 70 has started applying adhesive to the underside WL of the metal sheet W at timing T3 or T5 and the application of adhesive has not been completed at timing T9, the application of adhesive is completed. Thus, when applying adhesive using a non-contact application method, the application of adhesive is completed at timing T9 or T11. On the other hand, when applying adhesive using the contact application method, application of the adhesive is completed at timing T11. When the upper die 40 moves further upward and reaches timing T12, the pilot pin 50 inserted in the pilot hole PH is completely removed from the pilot hole PH. Between timing T2 and timing T12, at least a portion of the pilot pin 50 is inserted in the pilot hole PH. When the upper die 40 moves further upward and reaches timing T13, transportation of the strip-shaped metal sheet W begins. That is, between timing T13 and timing T1, the strip-shaped metal sheet W is transported in the forward feed direction D. Then, the upper die 40 passes the top dead center at timing T0 and begins moving downward.

[0030] As shown in FIG. 1 , the control device 90 controls the upper mold 40 and the adhesive application device 70. The control device 90 includes, for example, a central processing unit (CPU) that executes instructions from a control program, a ROM that stores the program executed by the CPU, a RAM used as a working area for expanding the program, and a storage device such as a memory that stores the program and various data. The control device 90 includes a movement control unit 92 and an application control unit 94. The functions of each unit of the control device 90 are realized by a program. This program is downloaded, for example, via the Internet. Note that this program may also be read from a recording medium such as a CD or DVD. The functions of each unit of the control device 90 may also be realized by a processor and / or circuit.

[0031] The movement control unit 92 controls the movement of the stripper plate 60 in the vertical direction Z. In this embodiment, the movement control unit 92 controls the movement of the pilot pin 50 and the stripper plate 60 in the vertical direction Z by moving the upper mold 40 in the vertical direction Z. The movement control unit 92 controls the approach of the upper mold 40 to the lower mold 20 and the separation of the upper mold 40 from the lower mold 20. The movement control unit 92 may be configured to be able to change the ascending speed and descending speed of the upper mold 40. The movement control unit 92 may be configured to be able to change the lowest position LP in accordance with the thickness of the metal sheet W. In other words, the movement control unit 92 may be configured to be able to adjust the distance between the lower surface 60B of the stripper plate 60 located at the lowest position LP and the upper surface 22T of the die plate 22 in accordance with the thickness of the metal sheet W.

[0032] The application control unit 94 controls the adhesive application device 70. The application control unit 94 controls the movement of the plunger 73. The application control unit 94 starts application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W after the pilot pin 50 is inserted into the pilot hole PH (e.g., after timing T2 in FIG. 9 ). The application control unit 94 may start application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W only when at least a portion of the pilot pin 50 is inserted into the pilot hole PH (e.g., between timings T2 and T5 in FIG. 9 ). The application control unit 94 completes application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W before the pilot pin 50 is removed from the pilot hole PH (e.g., before timing T12 in FIG. 9 ). The application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W between when the pilot pin 50 is positioned at the bottom dead center (i.e., when the upper die 40 is positioned at the bottom dead center; see FIG. 6B ) and before the pilot pin 50 moves upward from the bottom dead center and exits the pilot hole PH (e.g., between timing T8 and timing T12 in FIG. 9 ). The application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W between when half the length in the vertical direction Z of the insertion portion 50A of the pilot pin 50 exits the pilot hole PH (see FIG. 6C ) and before the entire insertion portion 50A exits the pilot hole PH (e.g., before timing T12 in FIG. 9 ). The application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W before the lift member 30 moves to the uppermost position PM (see FIG. 4A ) (e.g., before timing T11 in FIG. 9 ). The application control unit 94 may cause the adhesive application device 70 to apply adhesive to the underside WL of the metal sheet W only when the transport of the metal sheet W is stopped (for example, timing T1 to timing T13 in FIG. 9 ). The application control unit 94 may cause the adhesive application device 70 to apply adhesive to the underside WL of the metal sheet W only when at least a portion of the pilot pin 50 is inserted into the pilot hole PH and the transport of the metal sheet W is stopped (for example, timing T2 to timing T12 in FIG. 9 ).

[0033] The application control unit 94 may be configured to change the start timing (timings T3 and T5 in the example shown in FIG. 9 ) at which the adhesive application device 70 starts applying adhesive to the underside WL of the metal plate W. The timing includes both timing based on the crank angle and timing based on elapsed time. The application control unit 94 may be configured to change the start timing depending on the amount of adhesive to be applied per application area on the underside WL of the metal plate W (the amount of adhesive needed to bond the iron core members 5 together). The application control unit 94 may be configured to delay the start timing as the amount of adhesive to be applied per application area decreases. Note that clogging of the nozzle 72 or the like can result in a difference between the amount of adhesive to be applied (i.e., the amount of adhesive applied) and the amount of adhesive actually applied. That is, the amount of adhesive actually applied may be less than the amount of adhesive applied. By providing a sensor that measures the amount of adhesive actually applied, the application control unit 94 may be configured to change the start timing depending on the amount of adhesive actually applied per application portion on the lower surface WL of the metal sheet W. The application control unit 94 may be configured to change the start timing depending on the viscosity of the adhesive (including the temperature of the apparatus itself and the ambient temperature, which affect the viscosity of the adhesive). For example, the manufacturing apparatus 10 may be equipped with a sensor that measures the viscosity of the adhesive, and the application control unit 94 may be configured to change the start timing based on the viscosity of the adhesive measured by the sensor. The application control unit 94 may be configured to advance the start timing as the viscosity of the adhesive increases. The start timing may be the timing at which an adhesive spray start signal is sent to the nozzle 72. The start timing may also be the timing at which the nozzle 72 starts spraying the adhesive. The start timing may also be the timing at which the adhesive application device 70 starts transferring the adhesive to the lower surface WL of the metal sheet W. Furthermore, the start timing may be the timing when the adhesive discharged upward from the discharge port 72A of the nozzle 72 (for example, the adhesive mounding upward from the discharge port 72A) begins to contact the lower surface WL of the metal plate W.

[0034] The application control unit 94 may be configured to change the completion timing (timing T9 and timing T11 in the example shown in FIG. 9 ), which is the timing at which application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W is completed. The application control unit 94 may be configured to change the completion timing depending on the amount of adhesive applied per application portion on the underside WL of the metal sheet W. The application control unit 94 may be configured to make the completion timing earlier as the amount of adhesive applied per application portion decreases. The application control unit 94 may be configured to change the completion timing depending on the viscosity of the adhesive. The application control unit 94 may be configured to make the completion timing later as the viscosity of the adhesive increases. The completion timing may be the timing at which an adhesive spray completion signal is sent to the nozzle 72. Alternatively, the completion timing may be the timing at which spraying of adhesive from the nozzle 72 is completed. Alternatively, the completion timing may be the timing at which transfer of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W is completed. Furthermore, the completion timing may be the timing when the adhesive discharged upward from the discharge port 72A of the nozzle 72 is transferred to the lower surface WL of the metal plate W and leaves the discharge port 72A. At this timing, the adhesive may be swelling upward from the discharge port 72A.

[0035] The application control unit 94 may be configured to change the period from when the adhesive application device 70 starts to when the application of adhesive to the underside WL of the metal sheet W is completed (timings T3 to T11 in the example shown in FIG. 9 ). Changing the period includes both changing the crank angle from when the adhesive application starts to when the application is completed and changing the elapsed time from when the adhesive application starts to when the application is completed. For example, even if the crank angle at the start and end of the adhesive application is constant, the period from when the adhesive application starts to when the application is completed may be changed by changing the lifting speed (i.e., the press speed) of the upper mold 40. The application control unit 94 may be configured to change the period from when the adhesive application device 70 finishes applying the adhesive to when the pilot pin 50 inserted in the pilot hole PH is removed. Changing the period includes both changing the crank angle from when the adhesive application is completed to when the pilot pin 50 is removed from the pilot hole PH and changing the elapsed time from when the adhesive application is completed to when the pilot pin 50 is removed from the pilot hole PH.

[0036] Next, an example of a method for manufacturing the laminated core 8 will be described. Here, a method for manufacturing the laminated core 8 will be described, focusing on one of the core members 5 that make up the laminated core 8. FIG. 10 is a flowchart showing the method for manufacturing the laminated core 8. As shown in FIG. 10, the method for manufacturing the laminated core 8 includes a pilot hole punching step (step S10), an inner shape punching step (step S20), an adhesive application step (step S30), and an outer shape punching step (step S40). Note that for the strip-shaped metal plate W, the pilot hole punching step (step S10), inner shape punching step (step S20), and outer shape punching step (step S40) are performed simultaneously.

[0037] In the pilot hole punching process (step S10), when the stripper plate 60 is located at the lowest position LP (see FIG. 8 ), the pilot hole punching punch 45X punches the strip-shaped metal sheet W to form a pilot hole PH in the metal sheet W. More specifically, as the upper mold 40 moves further downward, the pilot hole punching punch 45X and the pilot hole punching die hole 26X punch out the strip-shaped metal sheet W pressed against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, thereby forming a pilot hole PH in the strip-shaped metal sheet W. In the pilot hole punching process (step S10), the strip-shaped metal sheet W is clamped between the stripper plate 60, the die plate 22, and the die 23.

[0038] In the inner shape punching process (step S20), when the stripper plate 60 is located at the lowest position LP, the band-shaped metal plate W is punched out by the inner shape punching punch 45A to form the inner shape of the iron core member 5. More specifically, as the upper die 40 moves further downward, the inner shape punching punch 45A and the inner shape punching die hole 26A punch out the band-shaped metal plate W pressed against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, and the inner shape of the iron core member 5 is formed in the band-shaped metal plate W. In the inner shape punching process (step S20), the band-shaped metal plate W is clamped between the stripper plate 60, the die plate 22, and the die 23.

[0039] In the adhesive application process (step S30), adhesive is applied (e.g., sprayed) from the adhesive application device 70 to the lower surface WL of the strip-shaped metal plate W. The adhesive application device 70 is controlled by the application control unit 94, and starts applying the adhesive at the timing described above and completes the application of the adhesive.

[0040] In the outline punching process (step S40), when the stripper plate 60 is located at the lowest position LP, the strip-shaped metal sheet W is punched out by the outline punching punch 45C to form the outline of the core member 5. More specifically, as the upper die 40 moves further downward, the outline punching punch 45C and the outline punching die hole 26C punch out the strip-shaped metal sheet W pressed against the upper surface 22T of the die plate 22 and the upper surface 23T of the die 23, thereby forming the outline of the core member 5 in the strip-shaped metal sheet W. The formed core members 5 are pressed by the outline punching punch 45C and sequentially stacked in the outline punching die hole 26C. Because adhesive is applied to the underside of the formed core members 5, additional core members 5 are sequentially stacked on top of the core members 5 already stacked in the outline punching die hole 26C, thereby producing a laminated core 8 including a plurality of core members 5 vertically stacked and bonded to one another. In step S40, the strip-shaped metal sheet W is clamped between the stripper plate 60, the die plate 22 and the die 23.

[0041] As described above, the laminated core manufacturing apparatus 10 of this embodiment includes the control device 90 that controls the upper die 40 and the adhesive applicator 70. The application control unit 94 of the control device 90 is configured to be able to change the start timing, which is the timing at which the adhesive applicator 70 starts applying adhesive to the underside WL of the metal sheet W. According to the above aspect, the timing at which the adhesive application starts can be changed as needed, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W at a predetermined timing.

[0042] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the start timing depending on the amount of adhesive applied per application portion on the lower surface WL of the metal plate W. According to this aspect, the start timing can be set more accurately.

[0043] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to delay the start timing as the amount of adhesive applied per application portion decreases. According to the above-described aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W.

[0044] According to the above-described aspect, the laminated core manufacturing apparatus 10 of this embodiment can set the start timing more accurately.

[0045] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to start the application earlier as the viscosity of the adhesive increases. According to the above-described aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W.

[0046] In the laminated core manufacturing apparatus 10 of this embodiment, the start timing may be the timing at which an adhesive injection start signal is sent to the nozzle 72. According to the above aspect, the start timing can be set more accurately.

[0047] In the laminated core manufacturing apparatus 10 of this embodiment, the start timing may be the timing at which the adhesive starts to be sprayed from the nozzle 72. According to the above aspect, the start timing can be set more accurately.

[0048] In the laminated core manufacturing apparatus 10 of this embodiment, the start timing may be the timing at which the adhesive applicator 70 starts transferring the adhesive to the lower surface WL of the metal plate W. According to the above aspect, the start timing can be set more accurately.

[0049] In the laminated core manufacturing apparatus 10 of this embodiment, the start timing may be the timing when the adhesive discharged upward from the discharge port 72A starts to contact the lower surface WL of the metal plate W. According to the above aspect, the start timing can be set more accurately.

[0050] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the period from when the adhesive application device 70 starts to when it finishes applying the adhesive to the lower surface WL of the metal plate W. According to the above aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W at a predetermined timing.

[0051] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the completion timing, which is the timing at which the adhesive application device 70 completes application of the adhesive to the underside WL of the metal plate W. According to the above aspect, the timing at which the adhesive application is completed can be changed as appropriate, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W at a predetermined timing.

[0052] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the completion timing depending on the amount of adhesive applied per application portion on the lower surface WL of the metal plate W. According to this aspect, the completion timing can be set more accurately.

[0053] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to complete the process earlier as the amount of adhesive applied per application portion decreases. According to the above-described aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W.

[0054] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the completion timing depending on the viscosity of the adhesive. According to this aspect, the completion timing can be set more accurately.

[0055] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to delay the completion timing as the viscosity of the adhesive increases. According to the above aspect, the adhesive can be applied more accurately to a predetermined position on the lower surface WL of the metal plate W.

[0056] In the laminated core manufacturing apparatus 10 of this embodiment, the completion timing may be the timing at which an adhesive spray completion signal is sent to the nozzle 72. According to the above aspect, the completion timing can be set more accurately.

[0057] In the laminated core manufacturing apparatus 10 of this embodiment, the completion timing may be the timing at which the spraying of adhesive from the nozzle 72 is completed. According to the above aspect, the completion timing can be set more accurately.

[0058] In the laminated core manufacturing apparatus 10 of this embodiment, the completion timing may be the timing at which the adhesive application device 70 completes transferring the adhesive to the lower surface WL of the metal plate W. According to the above aspect, the completion timing can be set more accurately.

[0059] In the laminated core manufacturing apparatus 10 of this embodiment, the completion timing may be the timing when the adhesive discharged upward from the discharge port 72A is transferred to the lower surface WL of the metal plate W and leaves the discharge port 72A. According to the above aspect, the completion timing can be set more accurately.

[0060] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may be configured to be able to change the period from when the adhesive application device 70 completes application of adhesive to the underside WL of the metal plate W until the pilot pin 50 inserted into the pilot hole PH is removed. According to the above aspect, the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0061] In the laminated core manufacturing apparatus 10 of this embodiment, the biasing member 32 may be configured to allow a portion WC of the metal plate W located between the portion WA in contact with the lift member 30 and the portion WB in contact with the stripper plate 60 to move downward while maintaining a horizontal state during the period in which the stripper plate 60 presses the metal plate W downward against the biasing force of the biasing member 32. According to the above aspect, bending of the metal plate W is suppressed, and therefore the iron core member 5 can be formed more accurately.

[0062] In the laminated core manufacturing apparatus 10 of this embodiment, the movement control unit 92 may be configured to be able to change the ascending speed and descending speed of the upper die 40. According to the above-described aspect, bending of the metal sheet W is suppressed, and therefore the iron core member 5 can be formed more accurately.

[0063] In the laminated core manufacturing apparatus 10 of the present embodiment, the movement control unit 92 may be configured to be able to change the lowest position LP in accordance with the thickness of the metal sheet W. According to the above-described aspect, the metal sheet W is prevented from being pressed downward excessively by the stripper plate 60.

[0064] The laminated core manufacturing apparatus 10 of this embodiment includes a pilot pin 50 that is provided in the upper mold 40 and that is inserted into a pilot hole PH formed in the strip-shaped metal sheet W to position the metal sheet W relative to the adhesive applicator 70. The application control unit 94 of the control device 90 may then start applying adhesive from the adhesive applicator 70 to the underside WL of the metal sheet W after the pilot pin 50 is inserted into the pilot hole PH. According to the above aspect, the adhesive applicator 70 starts applying adhesive to the underside WL of the metal sheet W after the metal sheet W is positioned relative to the adhesive applicator 70 by inserting the pilot pin 50 into the pilot hole PH, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0065] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal plate W before the pilot pin 50 is removed from the pilot hole PH. According to the above aspect, application of adhesive to the underside WL of the metal plate W is completed in a state in which the metal plate W is positioned relative to the adhesive application device 70 by the pilot pin 50, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal plate W.

[0066] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W during the period from when the pilot pin 50 is located at the bottom dead center to when the pilot pin 50 moves upward from the bottom dead center and before it comes out of the pilot hole PH. According to the above aspect, application of adhesive to the underside WL of the metal sheet W is completed with the pilot pin 50 positioned relative to the adhesive application device 70, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0067] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W after half of the length of the insertion portion 50A in the up-down direction Z has come out of the pilot hole PH and before the entire insertion portion 50A has come out of the pilot hole PH. According to the above aspect, application of adhesive to the underside WL of the metal sheet W is completed with the metal sheet W positioned relative to the adhesive application device 70 by the pilot pin 50, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0068] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may cause the adhesive application device 70 to apply adhesive to the lower surface WL of the metal sheet W only when the transport of the metal sheet W is stopped. According to the above-described aspect, the adhesive can be applied more reliably to a predetermined position on the lower surface WL of the metal sheet W.

[0069] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may complete application of adhesive from the adhesive application device 70 to the underside WL of the metal sheet W before the lift member 30 moves to the uppermost position PM. According to the above-described aspect, the adhesive can be accurately applied to a predetermined position on the underside WL of the metal sheet W while maintaining an appropriate distance in the vertical direction Z between the underside WL of the metal sheet W and the adhesive application device 70.

[0070] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may apply adhesive from the adhesive application device 70 to the underside WL of the metal sheet W only when at least a portion of the pilot pin 50 is inserted into the pilot hole PH. According to the above aspect, the adhesive application device 70 starts applying adhesive to the underside WL of the metal sheet W in a state in which the metal sheet W is positioned relative to the adhesive application device 70 by inserting at least a portion of the pilot pin 50 into the pilot hole PH, so that the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0071] In the laminated core manufacturing apparatus 10 of this embodiment, the application control unit 94 may apply adhesive from the adhesive application device 70 to the underside WL of the metal sheet W only when at least a portion of the pilot pin 50 is inserted into the pilot hole PH and the transport of the metal sheet W is stopped. According to the above aspect, the adhesive application device 70 applies adhesive to the underside WL of the metal sheet W in a state where the metal sheet W is positioned with respect to the adhesive application device 70 by inserting at least a portion of the pilot pin 50 into the pilot hole PH and the transport of the metal sheet W is stopped. Therefore, the adhesive can be applied more accurately to a predetermined position on the underside WL of the metal sheet W.

[0072] Although the preferred embodiments of the present invention have been described above, the above-described embodiments are merely examples, and the present invention can be embodied in various other forms.

[0073] In the above-described embodiment, the lower mold body 21, the die plate 22, and the die 23 of the lower mold 20 are configured as separate bodies, but they may be configured as an integral body as appropriate. For example, the die plate 22 and the die 23 may be configured as an integral body, or the die plate 22, the die 23, and the lower mold body 21 may be configured as an integral body.

[0074] In the above-described embodiment, the upper surface 23T of the die 23 and the upper surface 22T of the die plate 22 are located at the same height, but this is not limiting. For example, the upper surface 23T of the die 23 may be located lower than the upper surface 22T of the die plate 22. In this case, the stripper plate 60 presses the belt-shaped metal sheet W against the upper surface 22T of the die plate 22.

[0075] In the above-described embodiment, the die plate 22 and the die 23 are placed on the lower mold body 21, but this is not limiting. For example, the die plate 22 and the die 23 may be fitted into a recess formed in a downward recess from the upper surface 21T of the lower mold body 21 so that the upper surface 21T of the lower mold body 21, the upper surface 22T of the die plate 22, and the upper surface 23T of the die 23 are positioned at the same height. In this case, the stripper plate 60 presses the band-shaped metal sheet W against the upper surface 21T of the lower mold body 21, the upper surface 22T of the die plate 22, and the upper surface 23T of the die 23.

[0076] In the embodiment described above, the manufacturing apparatus 10 includes the control device 90 including the movement control unit 92 and the coating control unit 94, but is not limited to this. The manufacturing apparatus 10 may include a control device including the movement control unit 92 and another control device including the coating control unit 94. In other words, the manufacturing apparatus 10 may include multiple control devices.

[0077] 5 Iron core member 8 Laminated iron core 10 Manufacturing apparatus (laminated iron core manufacturing apparatus) 20 Lower die 21 Lower die body 22 Die plate 22A First die plate 22C Second die plate 22X Pilot hole forming die plate 22T Upper surface 23 Die 23A First die 23C Second die 23X Pilot hole forming die 23T Upper surface 26 Die hole 26A Die hole for punching inner shape 27 Through hole for adhesive application 26C Die hole for punching outer shape 26X Die hole for punching pilot hole 40 Upper die 45 Punch 45A Punch for punching inner shape 45C Punch for punching outer shape 45X Punch for punching pilot hole 50 Pilot pin 50A Insertion portion 60 Stripper plate 70 Adhesive application device 72 Nozzle 90 Control device 92 Movement control section 94 Application control section G Adhesive PH Pilot hole W Strip-shaped metal plate WL Lower surface

Claims

1. A manufacturing apparatus for a laminated iron core in which a plurality of iron core components are stacked and bonded to each other, comprising: a lower mold having a die with a die hole formed therein; an upper mold having a punch corresponding to the die hole; an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate; and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold, and an application control unit configured to be able to change the start timing, which is the timing at which the adhesive application device starts applying the adhesive to the underside of the metal plate.

2. A manufacturing apparatus as described in claim 1, wherein the application control unit is configured to be able to change the start timing depending on the amount of adhesive applied per application portion on the lower surface of the metal plate.

3. The manufacturing apparatus according to claim 2, wherein the application control unit is configured to delay the start timing as the amount of adhesive applied per application portion decreases.

4. The manufacturing apparatus of claim 3, further comprising a supply pump for supplying adhesive to the adhesive applicator, the adhesive applicator being configured to apply adhesive to the underside of the metal plate by a contact application method.

5. The manufacturing apparatus according to claim 1, wherein the application control unit is configured to be able to change the start timing depending on the viscosity of the adhesive.

6. The manufacturing device according to claim 5, wherein the application control unit is configured to make the start timing earlier as the viscosity of the adhesive increases.

7. The manufacturing apparatus of claim 6, further comprising a supply pump for supplying adhesive to said adhesive applicator, said adhesive applicator being configured to apply adhesive to said underside of said metal plate by a contact application method.

8. The manufacturing apparatus of claim 1, wherein the adhesive application device is located below the metal plate and has a nozzle for spraying the adhesive onto the underside of the metal plate, and the start timing is the timing for sending a signal to start spraying the adhesive to the nozzle.

9. The manufacturing apparatus according to claim 8, wherein the start timing is a timing at which spraying of the adhesive from the nozzle begins.

10. The manufacturing apparatus of claim 1, wherein the adhesive application device is configured to apply the adhesive to the underside of the metal plate by transfer, and the start timing is the timing at which transfer of the adhesive from the adhesive application device to the underside of the metal plate begins.

11. A manufacturing apparatus as described in claim 10, wherein the adhesive application device is located below the metal plate and has an outlet for discharging the adhesive, and the start timing is the timing at which the adhesive discharged upward from the outlet begins to contact the underside of the metal plate.

12. A manufacturing apparatus as described in claim 1, wherein the application control unit is configured to be able to change the period from when the application of the adhesive from the adhesive application device to the underside of the metal plate begins to when it is completed.

13. A manufacturing apparatus for a laminated iron core in which a plurality of iron core components are stacked and bonded to each other, comprising: a lower die having a die with a die hole formed therein; an upper die having a punch corresponding to the die hole; an adhesive application device provided on the lower die and applying adhesive to the underside of a strip-shaped metal plate; and a control device for controlling the upper die and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper die; and an application control unit configured to be able to change the completion timing, which is the timing at which the application of the adhesive from the adhesive application device to the underside of the metal plate is completed.

14. The manufacturing apparatus according to claim 13, wherein the application control unit is configured to be able to change the completion timing depending on the amount of adhesive applied per application portion on the lower surface of the metal plate.

15. The manufacturing apparatus according to claim 14, wherein the application control unit is configured to make the completion timing earlier as the amount of adhesive applied per application portion becomes smaller.

16. The manufacturing apparatus of claim 15, further comprising a supply pump for supplying adhesive to said adhesive applicator, said adhesive applicator configured to apply adhesive to said underside of said metal plate by a contact application method.

17. The manufacturing apparatus according to claim 13, wherein the application control unit is configured to be able to change the completion timing depending on the viscosity of the adhesive.

18. The manufacturing apparatus according to claim 17, wherein the application control unit is configured to delay the completion timing as the viscosity of the adhesive increases.

19. The manufacturing apparatus of claim 18, further comprising a supply pump for supplying adhesive to said adhesive applicator, said adhesive applicator configured to apply adhesive to said underside of said metal plate by a contact application method.

20. A manufacturing apparatus as described in claim 13, wherein the adhesive application device is located below the metal plate and has a nozzle for spraying the adhesive onto the underside of the metal plate, and the completion timing is the timing for sending a signal to the nozzle to complete spraying of the adhesive.

21. The manufacturing apparatus according to claim 20, wherein the completion timing is the timing at which spraying of the adhesive from the nozzle is completed.

22. The manufacturing apparatus of claim 13, wherein the adhesive application device is configured to apply the adhesive to the underside of the metal plate by transfer, and the completion timing is the timing at which transfer of the adhesive from the adhesive application device to the underside of the metal plate is completed.

23. A manufacturing apparatus as described in claim 22, wherein the adhesive application device is located below the metal plate and has an outlet for discharging the adhesive, and the completion timing is the timing at which the adhesive discharged upward from the outlet is transferred to the underside of the metal plate and leaves the outlet.

24. A manufacturing apparatus as described in claim 13, wherein the application control unit is configured to be able to change the period from when the application of the adhesive from the adhesive application device to the underside of the metal plate begins to when the application is completed.

25. A manufacturing apparatus as described in claim 13, further comprising a pilot pin provided on the upper mold and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive application device, and the application control unit is configured to be able to change the period from when the adhesive application device completes application of the adhesive to the underside of the metal plate to when the pilot pin inserted into the pilot hole is removed.

26. A manufacturing apparatus for a laminated iron core in which a plurality of iron core components are stacked and bonded to each other, comprising: a lower mold having a die with a die hole formed therein; an upper mold having a punch corresponding to the die hole; an adhesive application device provided on the lower mold and applying adhesive to the underside of a strip-shaped metal plate; and a control device for controlling the upper mold and the adhesive application device, wherein the control device has a movement control unit that controls the vertical movement of the upper mold; and an application control unit configured to be able to change the period from when the adhesive application device starts to apply the adhesive to the underside of the metal plate to when it is completed.

27. A manufacturing apparatus as described in claim 26, wherein the adhesive application device is located below the metal plate and has a nozzle for spraying the adhesive onto the underside of the metal plate, and the application control unit is configured to be able to change the timing at which spraying of the adhesive from the nozzle begins.

28. A manufacturing apparatus as described in claim 26, wherein the adhesive application device is configured to apply the adhesive to the underside of the metal plate by transfer, and the application control unit is configured to be able to change the timing at which the adhesive application device starts transferring the adhesive to the underside of the metal plate.

29. A manufacturing apparatus as described in claim 26, comprising: a stripper plate provided on said upper die and movable downward to a lowest position which is the lowest position, and which restricts the metal plate from moving in the vertical direction at said lowest position when said metal plate is punched out by said punch; a lift member provided on said lower die and configured to be able to push said metal plate upward, and which moves downward when said metal plate is pressed downward by said stripper plate; and a biasing member which biases said lift member upward, wherein said biasing member is configured to allow a portion of said metal plate located between a portion in contact with said lift member and a portion in contact with said stripper plate to move downward while maintaining a horizontal state during a period when said stripper plate is pressing said metal plate downward against the biasing force of said biasing member.

30. A manufacturing apparatus as described in claim 29, wherein, in a width direction which is perpendicular to the conveying direction in which the metal plate is conveyed in a planar view, the length of the portion of the metal plate located between the portion in contact with the lift member and the portion in contact with the stripper plate is equal to or greater than half the length of the lift member.

31. A manufacturing apparatus as described in claim 29, wherein, in a width direction that is perpendicular to the conveying direction in which the metal plate is conveyed in a planar view, the length of the portion of the metal plate located between the portion in contact with the lift member and the portion in contact with the stripper plate is at least half the length of the portion of the lift member that can come into contact with the metal plate.

32. The manufacturing apparatus according to claim 26, wherein the movement control section is configured to be able to change the ascending speed and descending speed of the upper mold.

33. A manufacturing apparatus as described in claim 26, further comprising a stripper plate provided on the upper mold and movable downward to a lowest position which is the lowest position, and which restricts the metal plate from moving in the vertical direction at the lowest position when the metal plate is punched by the punch, and the movement control unit is configured to be able to change the lowest position depending on the thickness of the metal plate.

34. A manufacturing apparatus as described in claim 26, further comprising a pilot pin provided on the upper mold and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive application device, and the application control unit starts applying the adhesive from the adhesive application device to the underside of the metal plate after the pilot pin is inserted into the pilot hole.

35. The manufacturing apparatus according to claim 34, wherein the application control unit completes application of the adhesive from the adhesive application device to the underside of the metal plate before the pilot pin is removed from the pilot hole.

36. The manufacturing apparatus of claim 35, wherein the application control unit completes application of the adhesive from the adhesive application device to the underside of the metal plate between the time when the pilot pin is located at the bottom dead center and the time when the pilot pin moves upward from the bottom dead center and before it comes out of the pilot hole.

37. The manufacturing apparatus described in claim 36, wherein the pilot pin has an insertion portion that is inserted into the pilot hole, and the application control unit completes application of the adhesive from the adhesive application device to the underside of the metal plate between the time when half of the vertical length of the insertion portion has come out of the pilot hole and before the entire insertion portion has come out of the pilot hole.

38. The manufacturing apparatus of claim 26, further comprising a pilot pin provided on the upper mold and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive application device, the pilot pin having an insertion portion inserted into the pilot hole, the application control unit completing application of the adhesive from the adhesive application device to the underside of the metal plate after half of the vertical length of the insertion portion has come out of the pilot hole and before the entire insertion portion has come out of the pilot hole, and the adhesive application device is configured to apply adhesive to the underside of the metal plate by a contact application method.

39. The manufacturing apparatus according to claim 35, wherein the application control unit causes the adhesive application device to apply the adhesive to the underside of the metal plate only when transportation of the metal plate is stopped.

40. A manufacturing apparatus as described in claim 34, comprising: a stripper plate provided on the upper mold and movable downward to a lowest position which is the lowest position, and which restricts the metal plate from moving in the vertical direction at the lowest position when the metal plate is punched out by the punch; and a lift member provided on the lower mold and configured to be able to push the metal plate upward and move downward when the metal plate is pressed downward by the stripper plate, wherein the lift member is configured to be able to move to the uppermost position when the stripper plate is not pressing against the metal plate, and the application control unit completes application of the adhesive from the adhesive application device to the underside of the metal plate before the lift member moves to the uppermost position.

41. The manufacturing apparatus according to claim 40, wherein the application control unit causes the adhesive application device to apply the adhesive to the underside of the metal plate only when transportation of the metal plate is stopped.

42. A manufacturing apparatus as described in claim 26, further comprising a pilot pin provided on the upper mold and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive application device, and the application control unit starts application of the adhesive from the adhesive application device to the underside of the metal plate only when at least a portion of the pilot pin is inserted into the pilot hole.

43. The manufacturing apparatus according to claim 42, wherein the application control unit causes the adhesive application device to apply the adhesive to the underside of the metal plate only when transportation of the metal plate is stopped.

44. A manufacturing apparatus as described in claim 26, further comprising a pilot pin provided on the upper mold and inserted into a pilot hole formed in the metal plate to position the metal plate relative to the adhesive application device, and the application control unit causes the adhesive application device to apply the adhesive to the underside of the metal plate only when at least a portion of the pilot pin is inserted into the pilot hole and transportation of the metal plate is stopped.

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