Cooking apparatus

Abstract

The present invention relates to a cooking apparatus in which an edge region in which a working coil pattern is not disposed is formed between the outer edge of a coil circuit board module and the working coil pattern, and high-power terminal patterns of the working coil pattern are collectively formed and arranged in the edge region, thereby minimizing the space occupied by the terminal patterns and maximizing the space occupied by the working coil pattern, and ensuring that the output of individual burners is sufficient.

Description

Cooking appliances

[0001] The present invention relates to a cooking appliance, and more particularly, to a cooking appliance in which an edge area is formed between an outer edge of a coil circuit board module and a working coil pattern, where a working coil pattern is not arranged, and a high-power terminal pattern of the working coil pattern is formed and arranged in a lump in the edge area, thereby minimizing the space occupied by the terminal pattern and maximizing the space occupied by the working coil pattern, thereby sufficiently securing the output of each burner.

[0002]

[0003] Cooking appliances are a type of home appliance used for cooking food. They are installed in kitchens and cook food according to the user's preferences. These cooking appliances can be categorized in various ways based on the heat source, form, or type of fuel used.

[0004] Cooking appliances can be categorized by their cooking method. They can be categorized into open and closed types, based on the space in which the food is placed. Closed types include ovens and microwave ovens, while open types include cooktops and hobs.

[0005] Among open cooking appliances, a cooktop may be provided with at least one burner to heat a food item contained in a cooking vessel.

[0006] These cooktops may be provided with an electric burner or with a gas burner.

[0007] Additionally, the cooktop may be implemented as a standalone unit or as an oven range that includes an oven beneath the cooktop.

[0008] An example of a cooktop with an electric burner is an induction cooker.

[0009] An induction cooking appliance is a cooking device that performs cooking functions using induction heating. In an induction cooking appliance, when high-frequency power is applied to a working coil, a magnetic field can be formed around the working coil.

[0010] Eddy currents are generated in the magnetic cooking container due to the generated magnetic field, and food can be cooked by the cooking container that is heated by acting as resistance to these eddy currents.

[0011] These induction cookers do not require gas combustion and therefore do not produce exhaust gases. Furthermore, by generating heat immediately within the container itself, induction cookers minimize heat transfer through radiation or conduction, allowing for rapid heating of food.

[0012] A conventional induction heating cooktop is configured to form individual burners by twisting a plurality of Litz wires to form a working coil and winding the working coil in a spiral shape in multiple layers.

[0013] At this time, each crater must be equipped with a coil frame to maintain and support the winding shape of the working coil.

[0014] Therefore, the vertical size of each burner, which is the sum of the vertical size of the working coil wound in a multi-layer structure and the vertical size of the coil frame, cannot help but occupy a considerably large proportion of the vertical size of the entire cooktop.

[0015] Due to the limitations in the size of the individual burners that make up a cooktop like this, conventional cooktops inevitably had limitations in increasing the output of each burner.

[0016] In addition, when constructing a cooktop with multiple burners, conventional cooktops have spatial limitations in that there is very little space for installing other components or parts, and therefore the total number of burners that can be installed on the cooktop is inevitably very limited.

[0017] As an alternative to the Litz wire-type working coil, a technology for a cooktop has been developed that forms a burner by forming the working coil in a spiral multilayer pattern on a printed circuit board. (Prior Document 001, Design and Optimization of Small Inductors on Extra-Thin PCB for Flexible Cooking Surfaces / IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, VOL. 53, NO. 1, JANUARY / FEBRUARY 2017)

[0018] The cooktop disclosed in prior art document 001 can be configured to form a burner by forming a single or multiple layer working coil pattern wound in a spiral shape on a single printed circuit board.

[0019] In this way, the cooktop disclosed in prior art document 001 has the advantage that the vertical size of the cooktop can be significantly reduced compared to a conventional cooktop since the working coil patterns forming the burner are integrally formed on a single printed circuit board, thereby improving vertical space utilization, and the number of burners can be significantly increased compared to a conventional cooktop, thereby improving horizontal space utilization.

[0020]

[0021] The cooktop disclosed in the aforementioned prior art document 001 must have terminals for supplying high-frequency power to the working coil patterns constituting the individual burners, which are provided integrally or separately on the printed circuit board.

[0022] At this time, the cooktop disclosed in prior art document 001 has a problem in that, since high-frequency power of 20 A or more is applied to the working coil pattern, it is impossible to apply a conventional simple insertion type board connector to the terminal of the working coil pattern.

[0023] In addition, in the case where the cooktop disclosed in prior art document 001 is equipped with multiple burners, a pair of terminals must be individually provided for each working coil pattern constituting the individual burners, which increases the space where the terminals are arranged, which relatively reduces the size of the working coil pattern and increases the possibility that the output of each burner will not be sufficiently secured, which is a problem.

[0024] In addition, in the case where the cooktop disclosed in prior art document 001 is equipped with multiple burners, the arrangement structure of the multiple terminals on the printed circuit board and the connection structure between the multiple terminals and the inverter module may be formed to be considerably complex, which may lead to a problem in that the manufacturing cost and assembly time are likely to increase significantly.

[0025] The present invention has been devised to solve the problems of the prior art, and the first object of the present invention is to provide a cooking appliance that forms an edge area where a working coil pattern is not arranged between an outer edge of a coil circuit board module and a working coil pattern, and configures a high-power terminal pattern of the working coil pattern to be uniformly formed and arranged in the edge area, thereby minimizing the space occupied by the terminal pattern and maximizing the space occupied by the working coil pattern, thereby sufficiently securing the output of each burner.

[0026] In addition, the present invention provides a cooking appliance in which high-power terminal patterns are arranged and grouped in an edge region and individual high-power terminal patterns are connected to an inverter circuit board module through a high-power connector, thereby simplifying the arrangement structure of a plurality of high-power terminal patterns and the connection structure between the high-power terminal patterns and the inverter circuit board module, thereby minimizing manufacturing costs and assembly time.

[0027] The objectives of the present invention are not limited to those mentioned above. Other objectives and advantages of the present invention not mentioned above can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the objectives and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0028]

[0029] A cooking appliance according to the present invention comprises: a top plate on which a container is placed; a coil circuit board module disposed below the top plate and having a working coil pattern that generates a magnetic field when power is applied thereto to heat the container; and an inverter circuit board module disposed below the coil circuit board module and generating the power; wherein the coil circuit board module has a power connection portion that is electrically connected to the working coil pattern and to which the power generated in the inverter circuit board module is supplied, and the power connection portion is characterized in that it includes a terminal pattern disposed between an outer edge of the coil circuit board module and the working coil pattern.

[0030] Additionally, an edge area is formed between the working coil pattern and the outer edge of the coil circuit board module, and the terminal pattern can be placed in the edge area.

[0031] Additionally, the terminal pattern may be arranged so as not to overlap with the working coil pattern in the edge area.

[0032] In addition, the outer edge includes a front edge, a rear edge, a left edge, and a right edge, and the edge region can be formed in at least one of the front edge and the working coil pattern, the rear edge and the working coil pattern, the left edge and the working coil pattern, and the right edge and the working coil pattern.

[0033] Additionally, the power connection unit may further include a lead pattern having one end electrically connected to the high-power terminal pattern and the other end electrically connected to the working coil pattern.

[0034] Additionally, the edge area may further be provided with a screw hole formed through the edge area for fixing the coil circuit board module.

[0035] Additionally, the terminal pattern may be arranged on the upper or lower surface of the coil circuit board module.

[0036] In addition, the working coil pattern includes a first working coil pattern forming a first crater and a second working coil pattern forming a second crater, and the terminal pattern includes a first terminal pattern, a second terminal pattern, and a third terminal pattern which are arranged to be separated from each other and spaced apart from each other along an outer edge of the coil circuit board module, and the first working coil pattern and the second working coil pattern can receive the power from the inverter circuit board module through the first terminal pattern, the second terminal pattern, and the third terminal pattern.

[0037] Additionally, the power connection unit may further include a high-power connector having one end electrically connected to the terminal pattern and the other end electrically connected to the inverter circuit board module.

[0038] Additionally, the high-power connector may extend toward the inverter circuit board module at least partially penetrating the coil circuit board module.

[0039] Additionally, the coil circuit board module may be provided with an edge notch through which the high-power connector extends, and the edge notch may be arranged in the edge area so as to be at least partially surrounded by the terminal pattern.

[0040] Additionally, the coil circuit board module may be provided with a coupling hole through which the high-power connector extends, and the coupling hole may be arranged in the edge region in a state at least partially surrounded by the terminal pattern.

[0041] In addition, the coil circuit board module further includes a temperature sensing circuit that detects the temperature of the top plate, and a terminal portion of the temperature sensing circuit can be formed in the edge region.

[0042] Additionally, the terminal portion of the temperature sensing circuit may be provided in the edge area in the form of a via hole.

[0043] In addition, the coil circuit board module further includes a container sensing circuit that detects whether the container is seated, and a terminal portion of the container sensing circuit can be formed in the edge region.

[0044] Additionally, the terminal portion of the container sensing circuit may be provided in the edge area in the form of a via hole.

[0045] In addition, the main circuit board module for determining whether to supply power to the working coil pattern is further included, and the coil circuit board module further includes a low-power connector for integrally connecting a terminal portion of the temperature sensing circuit and a terminal portion of the container sensing circuit to the main circuit board module side, and the low-power connector can be arranged in the edge region.

[0046]

[0047] The cooking appliance according to the present invention forms an edge area where a working coil pattern is not arranged between the outer edge of a coil circuit board module and a working coil pattern, and is configured such that high-power terminal patterns of the working coil pattern are uniformly formed and arranged in the edge area, thereby minimizing the space occupied by the terminal pattern and maximizing the space occupied by the working coil pattern, thereby having the effect of sufficiently securing the output of each burner.

[0048] In addition, the cooking appliance according to the present invention is configured such that high-power terminal patterns are arranged and grouped in an edge region and individual high-power terminal patterns are connected to an inverter circuit board module through a high-power connector, thereby simplifying the arrangement structure of a plurality of high-power terminal patterns and the connection structure between the high-power terminal patterns and the inverter circuit board module, thereby having the effect of minimizing manufacturing costs and assembly time.

[0049] In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention.

[0050]

[0051] Figure 1 is a front perspective view of a cooking appliance according to one embodiment of the present invention.

[0052] Fig. 2 is a plan view of the cooking appliance illustrated in Fig. 1, showing a state in which the indicator line is lit.

[0053] Figure 3 is a perspective view of the cooking appliance illustrated in Figure 1.

[0054] Figure 4 is an exploded perspective view of the cooktop of the cooking appliance illustrated in Figure 1.

[0055] Figure 5 is a partially enlarged view of Figure 4.

[0056] Figure 6 is a plan view of the cooktop illustrated in Figure 4, and is a view looking down at the top plate.

[0057] FIG. 7 is a schematic cross-sectional view for explaining the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0058] FIG. 8 is a plan view of the first layer constituting the layered structure of the first coil circuit board module illustrated in FIG. 4, and FIG. 9 is a partial enlarged view of FIG. 8.

[0059] Fig. 10 is a plan view of the second layer constituting the layered structure of the first coil circuit board module illustrated in Fig. 4.

[0060] Figure 11 is a partial enlarged view of Figure 8, showing patterns formed in the first to twelfth layers.

[0061] FIG. 12 is a plan view of the third to seventh layers constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0062] FIG. 13 is a plan view of the 8th to 12th layers constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0063] Fig. 14(a) is a plan view illustrating a part of the first type pattern illustrated in Fig. 12, and Fig. 13(b) is a plan view illustrating a part of the second type pattern illustrated in Fig. 13.

[0064] Figure 15(a) is a partial enlarged view of Figure 14(a), and Figure 15(b) is a partial enlarged view of Figure 14(b).

[0065] FIG. 16 is a schematic cross-sectional view for explaining a structure in which the first type pattern constituting the third to seventh layers shown in FIG. 4 and the second type pattern constituting the eighth to twelfth layers are collectively connected through working coil via holes.

[0066] Fig. 17(a) is a partial enlarged view of Fig. 14(a), and Fig. 17(b) is a partial enlarged view of Fig. 14(b), which are partial enlarged views for explaining the common terminal of the first type pattern and the common terminal of the second type pattern, respectively.

[0067] Fig. 18 is a vertical cross-sectional view of the cooktop illustrated in Fig. 3, and Fig. 18 is a partial enlarged view of Fig. 17.

[0068] Fig. 18 is a schematic cross-sectional view illustrating a state in which a temperature sensor is mounted on a first coil circuit board module with the sensor body of the temperature sensor in contact with the upper surface of the first coil circuit board module.

[0069] FIG. 19 is a plan view of a first coil circuit board module for explaining a configuration in which high-power terminal patterns are arranged at the front edge and the rear edge of the coil circuit board module according to one embodiment of the present invention.

[0070] Figure 20 is a plan view showing a state in which a first coil circuit board module is placed on a substrate supporter.

[0071] FIG. 21 is a partial enlarged view of FIG. 20, and is a plan view showing a state in which a high-power pattern is arranged in an edge region according to the first embodiment of the present invention.

[0072] Figure 22 is a partial enlarged view of Figure 21, and Figure 23 is a rear view of Figure 22.

[0073] FIGS. 24 and 25 are a plan view and a partially enlarged view of a first coil circuit board module for explaining a configuration in which high-power terminal patterns are arranged on the left and right edges of the coil circuit board module according to another embodiment of the present invention.

[0074]

[0075] The above-described objects, features, and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can easily practice the technical idea of ​​the present invention. In describing the present invention, if it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0076] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a "first" component may also be a "second" component.

[0077] Throughout the specification, unless otherwise specifically stated, each element may be singular or plural.

[0078] Hereinafter, the phrase "any configuration is placed on (or below)" a component or "on (or below)" a component may mean that any configuration is placed in contact with the upper surface (or lower surface) of said component, and that other configurations may be interposed between said component and any configuration placed on (or below) said component.

[0079] Additionally, when it is described that a component is "connected," "coupled," or "connected" to another component, it should be understood that the components may be directly connected or connected to one another, but that other components may also be "interposed" between the components, or that each component may be "connected," "coupled," or "connected" through another component.

[0080] As used herein, singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consisting of" or "comprising" should not necessarily be construed to include all of the components or steps described in the specification, and should be construed to mean that some of the components or steps may not be included, or that additional components or steps may be included.

[0081] Additionally, the singular expressions used herein include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consist of" or "comprises" should not be construed to necessarily include all of the various components or various steps described in the specification, and should be construed to mean that some of the components or some of the steps may not be included, or that additional components or steps may be included.

[0082] Throughout the specification, when we refer to "A and / or B", this means A, B, or A and B, unless otherwise stated, and when we refer to "C through D", this means C or more and D or less, unless otherwise stated.

[0083] [Overall structure of the cooking appliance]

[0084] Hereinafter, the overall structure of a cooking appliance (1) according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

[0085] FIG. 1 is a perspective view showing a cooking appliance (1) according to one embodiment of the present invention, and FIG. 2 is a plan view of a cooktop (20) constituting the cooking appliance (1) shown in FIG. 1 as viewed from above.

[0086] Referring to FIGS. 1 to 3, a cooking appliance (1) according to one embodiment of the present invention may be configured to include a cooktop (20) and an oven section (10) disposed below the cooktop (20).

[0087] In this way, the cooking appliance (1) according to the embodiment of the present invention may be an oven range type in which a cooktop (20) is arranged on the upper side and an oven section (10) is arranged on the lower side. However, the present invention is not limited thereto, and may be configured as a cooking appliance (1) in which a cooktop (20) is provided alone. Hereinafter, a cooking appliance (1) configured as an oven range type as illustrated will be described as an example.

[0088] The cooking appliance (1) of the embodiment of the present invention can provide both the function of an oven, which is a closed cooking means, and the function of a cooktop, which is an open means, by being provided in the form of an oven range.

[0089] A cooking chamber may be formed inside an oven section (10) that serves as a sealed cooking device. In the oven section (10), food may be cooked as the interior of the cooking chamber is heated.

[0090] For this purpose, although not shown, the oven section (10) may be equipped with a heating unit that heats the interior of the cooking chamber. The heating unit may be a heating device that uses gas fuel or electricity.

[0091] The oven section (10) of the cooking appliance (1) may be provided with a rotatably-mounted door (11) that selectively opens and closes the cooking chamber.

[0092] For example, the door (11) may be provided in the oven section (10) in a form that opens and closes the cooking chamber in a pull-down manner in which the upper part rotates in the up-and-down direction with the lower part as the center.

[0093] A control panel (30) for operating the oven section (10) and cooktop (20) may be provided on the upper front surface of the cooking appliance (1).

[0094] As it is placed on the front surface of the cooking appliance (1), the control panel (30) can form a part of the front surface appearance of the cooking appliance (1).

[0095] Such a control panel (30) may be provided with multiple switches for controlling the operation of the cooking appliance (1) and a display (31) for displaying the operating status of the cooking appliance (1).

[0096] In addition, as illustrated, a plurality of knobs (32) may be further provided on the control panel (30) of the cooking appliance (1). That is, the control panel (30) provided on the upper front surface of the cooking appliance (1) may be provided with a plurality of knobs (32) for controlling the operation of the cooking appliance (1) together with a display (31).

[0097] Each knob (32) may be provided in a form that can be rotated. These knobs (32) may be provided so that either one of the oven section (10) and the cooktop (20) can be operated, or they may be provided so that both the oven section (10) and the cooktop (20) can be operated.

[0098] By operating the knob provided as described above, one of a number of preset cooking modes can be selected, or a heating temperature or heating stage can be selected.

[0099] In addition, the control panel (30) of the cooking appliance (1) according to the present embodiment may further include a knob ring (33). The knob ring (33) may be positioned radially outside the knob (32). For example, the knob ring (33) may be provided in a ring shape that surrounds the knob (32) radially outside.

[0100] The knob ring (33) can play a role in supporting the knob (32) and in finishing the outer appearance of the knob (32) to improve the outer appearance quality of the cooking appliance (1).

[0101] In addition, the knob ring (33) of this embodiment can simultaneously serve as a timer operation switch and a function of indicating the timer time and the intensity of the fire.

[0102] The knob ring (33) is installed so as to be independently rotatable relative to the knob (32), and the timer time can be set through the rotation operation of the knob ring (33) installed in this manner.

[0103] Meanwhile, as described above, a cooktop (20) may be placed on the upper side of the oven section (10).

[0104] The cooktop (20) is installed on the upper surface of the cooktop (20) and can perform the function of heating food or a container containing food.

[0105] For this purpose, the cooktop (20) may include a top plate (21) that forms the upper surface of the cooktop (20) and on which a container containing food is placed.

[0106] Additionally, a heating unit for heating a container containing food may be provided inside the cooktop (20) below the top plate (21).

[0107] The heating unit may be configured to include at least one burner. For example, the burner constituting the heating unit may be provided in the form of a working coil that converts supplied electric power into magnetic power or a heating coil that converts supplied electric power into thermal energy.

[0108] The cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be equipped with an induction heating method.

[0109] To this end, the burner of the cooktop (20) may be configured to include a working coil. The burner including the working coil in this way can generate a strong magnetic field by being operated by a high-frequency current generated and supplied by an inverter.

[0110] In this way, the magnetic field generated from the burner including the working coil generates an eddy current in a container containing a metal component, and as the eddy current flows in the container, heat is generated, which can heat the container, and as the container is heated, food contained in the container can be heated.

[0111] However, the working coil applied to conventional induction heating cooktops was generally formed by twisting a number of electrically conductive wires to form a cable and winding the cable in a spiral shape.

[0112] However, as described later, the working coil constituting the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be configured as a plurality of patterns formed by being spirally stacked on a printed circuit board.

[0113] As such, the working coil of the cooking device (1) according to the present invention may be referred to as a working coil pattern since it has a structure formed by laminating on a printed circuit board.

[0114] The detailed configuration of the heating unit having a working coil pattern is described below with reference to Fig. 3 and below.

[0115] [Overall composition of the cooktop]

[0116] The configuration of a cooktop (20) constituting a cooking appliance (1) according to one embodiment of the present invention will be described with reference to FIGS. 3 to 5 below.

[0117] Fig. 3 is a plan view of the cooktop (20) viewed from the top with the indicator line (L) lit, Fig. 4 is an exploded perspective view of the cooktop (20) shown in Fig. 3, and Fig. 5 is a plan view of the inside of the cooktop (20) shown in Fig. 3.

[0118] First, referring to FIGS. 3 and 4, similar to the oven section (10) described above, the cooktop (20) according to the present embodiment may be equipped with a control panel (22).

[0119] As shown, the control panel (22) of the cooktop (20) is placed on the top plate (21), but may be placed in a position tilted toward the front for the convenience of the user.

[0120] This control panel (22) may be equipped with various switches for controlling the operation of the cooktop (20) and a display panel (221) for displaying the operating status of the cooktop (20).

[0121] As described below, when it is detected that a container is placed on the upper surface (21a) of the top plate (21) through the sensing coil pattern (2514), an icon corresponding to the container may be displayed on the display panel (221) of the control panel (22) provided on the cooktop (20). For example, the icon may be provided in a form corresponding to the size and shape of the container, and may be positioned on the display panel (221) corresponding to the position of the cooking appliance (1).

[0122] The user can select a container that is the target of the icon by pressing the displayed icon, and perform an operation to control the operation of the cooking appliance (1) with respect to the selected container.

[0123] For example, a user can select a container to be manipulated by pressing an icon, and then select a desired heating temperature for that container.

[0124] When heating of the container is started through the operation of the control panel (22) in this way, as shown in Fig. 3, the start of heating of the container can be indicated on the top plate (21) through the indication line (L).

[0125] As shown in Fig. 3, a plurality of display lines (L) may be provided on the top plate (21) of the cooktop (20).

[0126] The display line (L) can visually convey information related to the location of the container, the heating status of the container, temperature, etc. to the user by displaying the information in the form of a light-emitting area on the top plate (21).

[0127] FIG. 3 illustrates an embodiment in which a total of seven display lines (L) are provided. These display lines (L) may be conveniently referred to as first to seventh display lines (L1, L2, L3, L4, L5, L6, L7) from the left side based on the top plate (21). The present invention is not limited thereto, but for convenience, the following description will be based on an embodiment in which a total of seven display lines (L) are provided as illustrated.

[0128] These indicator lines (L) can be a light-emitting area formed such that the width in the left-right direction is much smaller than the width in the front-back direction, as shown.

[0129] In order for each display line (L) to be formed in the form of a light-emitting area, the display line (L) can be implemented by a light source module (23) placed on a substrate supporter (26) described below, below the top plate (21).

[0130] The light source module (23) can be configured to include a plurality of light source elements (231) that generate visible light and a light source circuit board (232) on which the plurality of light source elements (231) are mounted.

[0131] A plurality of light source elements (231) can be arranged to irradiate visible light toward the lower surface of the top plate (21), and the incident visible light can be irradiated to the lower surface of the top plate (21) by passing through a light transmitting hole formed through the substrate supporter (26), a light transmitting slit hole (H_sl) formed in each coil circuit board module constituting the heating unit (25), and a gap formed between adjacent coil circuit board modules, as described later.

[0132] The light source module (23) may be configured to include a plurality of light source elements (231) that receive power and generate visible light, and a light source circuit board (232) on which the plurality of light source elements (231) are mounted.

[0133] The light source element (231) may be applied without limitation to any means capable of receiving power and generating a predetermined amount of visible light, and may be, for example, an LED element. The present invention is not limited thereto, but the following description will be based on an embodiment in which an LED element is applied as the light source element (231).

[0134] As shown, in correspondence with each linearly extending display line (L), each light source circuit board (232) can be linearly extended along the front-back direction, and on each light source circuit board (232), a plurality of light source elements (231) can be linearly arranged and placed so as to have equal or unequal intervals along the front-back direction.

[0135] In addition, as described above, a plurality of light source modules (23) may be provided so that visible light can be independently irradiated to the first to seventh display lines (L1, L2, L3, L4, L5, L6, L7), and these plurality of light source modules (23) may be conveniently referred to as the first to seventh light source modules (23a, 23b, 23c, 23d, 23e, 23f, 23g) from the left with respect to the top plate (21).

[0136] Corresponding to the first to seventh display lines (L1, L2, L3, L4, L5, L6, L7), the first to seventh light source modules (23a, 23b, 23c, 23d, 23e, 23f, 23g) can be spaced apart from each other in the left-right direction at a predetermined interval.

[0137] As described below, the spacing between adjacent display lines (L) and the spacing between adjacent light source modules (23) can be formed to have a width equal to or slightly larger than the left-right width of the working coil pattern (2512) constituting the heating unit (25).

[0138] Meanwhile, as illustrated, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may include a bottom case (24) that forms the front side, the rear side, the front side, both sides, and the lower side of the exterior of the cooktop (20).

[0139] The bottom case (24) can be formed with the upper surface entirely open, and the top plate (21) described above can be combined to the open upper surface.

[0140] As shown in Fig. 3, a fastening bracket (211) for coupling to a bottom case (24) may be provided on the lower surface of the top plate (21) at a position corresponding to the upper end of the bottom case (24).

[0141] As the top plate (21) is connected to the upper side of the bottom case (24) in this way, the internal space surrounded by the top plate (21) and the bottom case (24) can accommodate a number of internal components that constitute the cooktop (20).

[0142] Additionally, the bottom case (24) may be provided with a plurality of mount brackets (241) integrally or separately.

[0143] The mount bracket (241) is placed in the internal space of the cooktop (20) and can be formed to protrude upward from the lower surface of the mount bracket (241) toward the electrical components.

[0144] These mount brackets (241) can support various electrical components (28) constituting the cooktop (20) from the lower side, thereby limiting the occurrence of sagging of components such as the main circuit board module (281), SMPS circuit board module (282), inverter circuit board module (283), resonant circuit board module (284), EMI filter module (285), etc., and supporting them.

[0145] In addition, as illustrated in FIG. 4, an intake hole (242) and an exhaust hole (243) can be formed in the vertical direction through which air can flow in and out for cooling various electrical components constituting the cooktop (20) on the lower surface (24a) of the bottom case (24).

[0146] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include a heating unit (25) having a working coil that heats a container by induction heating, and as described above, the working coil may be formed by a plurality of working coil patterns (2512) that are formed by being spirally stacked on a printed circuit board.

[0147] Considering that a plurality of working coil patterns (2512) are laminated in a plurality of layered structures to form a crater, a printed circuit board formed by laminating working coil patterns (2512) can be referred to as a coil circuit board module.

[0148] The coil circuit board module constituting the heating unit (25) may be provided in multiple units in consideration of manufacturing convenience and efficiency.

[0149] FIGS. 4 and 6 illustrate an embodiment of a cooktop (20) having a heating element (25) including a total of three coil circuit board modules. The present invention is not limited thereto, but will be described below based on an embodiment in which three coil circuit board modules are provided as illustrated.

[0150] The three coil circuit board modules (251, 252, 253) are referred to in order from the left as the first coil circuit board module (251), the second coil circuit board module (252), and the third coil circuit board module (253).

[0151] Each coil circuit board module (251, 252, 253) may be formed with a plurality of burners (2511) for heating the container.

[0152] FIG. 6 illustrates an embodiment in which the first coil circuit board module (251) and the third coil circuit board module (253) may each be provided with eight burners (2511), and the second coil circuit board module (252) may be provided with six burners (2511). As described below, the number of burners (2511) and the size of the burners (2511) may be set differently depending on the size and output of the cooktop (20). Hereinafter, an embodiment in which eight first coil circuit board modules (251) and the third coil circuit board module (253) are each provided with eight burners (2511), and the second coil circuit board module (252) is provided with six burners will be described as an example.

[0153] In addition, although the shape and size of each burner (2511) are shown as being the same in FIG. 6, this is merely exemplary, and similarly, the shape and size of the burner (2511) may be set differently depending on the size and output of the cooktop (20).

[0154] In each coil circuit board module (251, 252, 253), a working coil pattern (2512) forming a plurality of craters (2511) can be formed by stacking multiple layers.

[0155] Additionally, a sensing coil pattern (2514) may be laminated and formed on each coil circuit board module (251, 252, 253) as a means for detecting whether a container is seated at a specific location on the upper surface (21a) of the top plate (21).

[0156] Additionally, each coil circuit board module (251, 252, 253) may be equipped with a temperature sensor (2515) for detecting the temperature of each top plate (21).

[0157] At this time, as described later, the working coil pattern (2512), the sensing coil pattern (2514), and the temperature sensor (2515) can be provided in a form that is integrated into each coil circuit board module (251, 252, 253). Therefore, the heating unit (25) of the cooktop (20) according to the present invention can reduce the vertical size of the cooktop (20) as the vertical width of the heating unit (25) is significantly reduced compared to the conventional one, so that the space utilization can be significantly improved, and the manufacturing process of the cooktop (20) can be significantly simplified.

[0158] The working coil pattern (2512) and the sensing coil pattern (2514) may be provided in a form that extends in a spiral shape and is stacked in the vertical direction.

[0159] At this time, as described later, the first to third coil circuit board modules (251, 252, 253) may be formed in a form in which the working coil pattern (2512) is stacked in 10 to 12 layers and the sensing coil pattern (2514) is stacked in 2 layers in the vertical direction, respectively. Accordingly, each coil circuit board module (251, 252, 253) may have a layered structure having 12 to 14 layers.

[0160] Meanwhile, each sensing coil pattern may be placed inside an area occupied by a working coil pattern (2512) forming an individual crater (2511), or may be placed in an area between an adjacent pair of working coil patterns (2512).

[0161] In this embodiment, considering the efficiency and accuracy of container detection, a pair of sensing coil patterns (2514) may be placed inside the area occupied by each working coil pattern (2512), and a pair of sensing coil patterns (2514) may be placed in the area between adjacent pairs of working coil patterns (2512), as described below.

[0162] Meanwhile, a temperature sensor (2515) for detecting the temperature of the top plate (21) can be placed at the center of each sensing coil pattern (2514).

[0163] Details regarding the working coil pattern (2512), sensing coil pattern (2514), and temperature sensor (2515) constituting the first to third coil circuit board modules (251, 252, 253) are described below with reference to FIG. 7.

[0164] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include a substrate supporter (26).

[0165] The substrate supporter (26) is installed inside the cooktop (20) and serves to support the internal components.

[0166] More specifically, as illustrated in FIGS. 4 and 5, the first to third coil circuit board modules (251, 252, 253) and the ferrite core module (27) can be mounted on the upper side of the substrate supporter (26). Accordingly, the substrate supporter (26) functions as a coil base on which a conventional working coil and a ferrite core are mounted.

[0167] Additionally, as shown in FIGS. 4 and 5, several electrical components (28) constituting the cooktop (20) can be installed on the lower side of the substrate supporter (26).

[0168] These electrical components (28) may include a main circuit board module (281), an SMPS circuit board module (switching mode power supply, 282), an inverter circuit board module (283), a resonant circuit board module (284), an EMI filter module (285), a blower fan module (286), a light source module (23), etc.

[0169] These electric components (28) can be placed in the space formed between the lower surface (24a) of the bottom case (24) and the substrate supporter (26) as the lower side of the substrate supporter (26).

[0170] For example, to effectively accommodate these components (28), the substrate supporter (26) may have an inverted box shape configured so that the lower surface facing the bottom case (24) is entirely open.

[0171] Accordingly, the main circuit board module (281), SMPS circuit board module (switching mode power supply, 282), inverter circuit board module (283), resonant circuit board module (284), EMI filter module (285), blower fan module (286), and light source module (23) can be assembled to the board supporter (26) in a manner of being stacked in a receiving space formed inside the board supporter (26).

[0172] In this way, as the first to third coil circuit board modules (251, 252, 253) are mounted on the upper surface (21a) of the board supporter (26) and the electrical component (28) is mounted on the lower surface of the board supporter (26) as the interior of the board supporter (26), the wiring structure between the electrical component (28) and the wiring structure between the electrical component (28) and the first to third coil circuit board modules (251, 252, 253) can be significantly simplified and streamlined.

[0173] In particular, in the case of the conventional cooktop (20), it had a structure that required disassembly of almost all components in the reverse order of the assembly process in order to repair the inverter circuit board module, which is the main cause of failure and malfunction.

[0174] In contrast, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention is configured so that the electrical components (28) such as the inverter circuit board module (283) can be easily accessed by disassembling only the bottom case (24) while the bottom case (24) is turned over so that it faces upward, thereby having the effect of allowing easy repair or replacement of a faulty electrical component (28).

[0175] In this regard, the assembly process of the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention will be briefly described.

[0176] As shown in Fig. 5, first, a plurality of ferrite core modules (27) can be assembled on the upper surface (261) of the substrate supporter (26).

[0177] The ferrite core module (27) according to an embodiment of the present invention may be configured by combining multiple ferrite cores into a modular structure. This is in consideration of the possibility of cracking or magnetic field loss when a ferrite core is applied that is formed as a single body and has a relatively large volume.

[0178] By modularizing multiple ferrite cores in this way to form a ferrite core module (27) and installing it on a substrate supporter (26), the number of parts can be reduced and the assembly process can be simplified.

[0179] For example, the ferrite core module (27) can be manufactured by insert injection molding. By manufacturing the ferrite core module (27) by insert injection molding, a separate jig for fixing the ferrite core unit during assembly of the cooktop (20) as in the past can be omitted.

[0180] In addition, by modularizing the ferrite core in this way to form a plurality of ferrite core modules (27), it has the advantage of being able to be repaired by simply replacing some of the ferrite cores even if they are damaged.

[0181] Meanwhile, when the arrangement of a plurality of ferrite core modules (27) on the upper surface (261) of the substrate supporter (26) is completed, the first to third coil circuit board modules (251, 252, 253) can be installed on the upper side of the ferrite core module (27).

[0182] Next, with the first to third coil circuit board modules (251, 252, 253) installed, the board supporter (26) can be flipped upside down and assembly of the electric components (28) can proceed.

[0183] As described above, several electrical components (28) can be installed and assembled on the lower surface of the substrate supporter (26). At this time, these electrical components (28) can be installed and assembled on the substrate supporter (26) in an upside-down state.

[0184] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include an insulating material (291) disposed on the upper side of the first to third coil circuit board modules (251, 252, 253) between the first to third coil circuit board modules (251, 252, 253) and the top plate (21).

[0185] The insulation (291) is placed on the upper surface (21a) of the top plate (21) and serves to minimize the heat generated from the container heated by the working coil pattern (2512) from being transferred to the working coil pattern (2512).

[0186] To perform this insulation function, the insulation material (291) can be arranged in the form of a pad that entirely covers the first to third coil circuit board modules (251, 252, 253).

[0187] Meanwhile, in this embodiment, the insulation material (291) may be provided divided into a plurality of pads.

[0188] More specifically, each insulation material (291) can be divided into a plurality of pads so as to have a left-right width corresponding to the left-right width of the crater (2511) formed on the first to third coil circuit board modules (251, 252, 253).

[0189] In this way, by dividing the insulation material (291) into multiple pieces and arranging them, a predetermined gap can be formed between adjacent insulation materials (291), and visible light generated from the aforementioned light source module (23) passing through the predetermined gap can be irradiated to the lower surface of the top plate (21), so that the aforementioned display line (L) can be displayed on the top plate (21).

[0190] Meanwhile, the insulation material (291) can additionally perform the role of electrically insulating between the working coil pattern (2512) or sensing coil pattern (2514) formed on the first to third coil circuit board modules (251, 252, 253) and the top plate (21).

[0191] In this case, the insulation material (291) can be made of a material having both insulation performance and insulating performance.

[0192] Meanwhile, although not shown, in order to further improve the insulation performance of the insulation material (291), an insulation material may be added between the insulation material (291) and the top plate (21) on the upper side of the insulation material (291). For example, the insulation material may be a mica sheet having a thickness thinner than the vertical thickness of the insulation material (291).

[0193] [Detailed configuration of the coil circuit board module]

[0194] Hereinafter, with reference to FIGS. 7 to 16, the detailed configuration of the coil circuit board module (251, 252, 253) of the cooktop (20) constituting the cooking appliance (1) according to one embodiment of the present invention will be described.

[0195] As described above, embodiments of the present invention may be configured to include first to third coil circuit board modules (251, 252, 253).

[0196] At this time, the first to third coil circuit board modules (251, 252, 253) can be configured substantially the same except for the number of working coil patterns (2512) and the number of sensing coil patterns (2514) constituting the crater (2511).

[0197] Therefore, the following description will be based on the first coil circuit board module (251), and unless otherwise stated, the contents described below can be applied almost identically to the second coil circuit board module (252) and the third coil circuit board module (253).

[0198] First, as described above, the first coil circuit board module (251) can be formed by stacking multiple working coil patterns (2512) forming a plurality of craters (2511) in multiple layers.

[0199] As illustrated in FIG. 7, the first coil circuit board module (251) may be configured to include working coil patterns (2512) arranged in a ten-layer structure, sensing coil patterns (2514) arranged in a two-layer structure, and an insulating material disposed between each working coil pattern (2512) and each sensing coil pattern (2514) and insulating them.

[0200] Therefore, based on the working coil pattern (2512) and the sensing coil pattern (2514), the first coil circuit board module (251) can have a layered structure having a total of 12 layers from the first layer (251a) forming the top layer to the 12th layer (251l) forming the bottom layer in the vertical direction.

[0201] At this time, a first sensing coil pattern (2514a) constituting a sensing coil pattern (2514) may be arranged on the first layer (251a) of the first coil circuit board module (251) having a 12-layer structure.

[0202] In addition, a lead pattern (2513) may be arranged on the first layer (251a) to electrically connect the first sensing coil pattern (2514a) to a signal processing unit (2518) described later, or to electrically connect the working coil pattern (2512) arranged on the third to twelfth layers (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l) to a high-power terminal pattern (2516).

[0203] Here, the lead pattern (2513) can be divided into a first lead pattern (2513a) that electrically connects the working coil pattern (2512) arranged in the third to twelfth layers (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l) to the high-power terminal pattern (2516), and a second lead pattern (2513b) that electrically connects the first sensing coil pattern (2514a) to the signal processing unit (2518). The high-power terminal pattern (2516) and the first lead pattern (2513a) can be defined as power connecting units in consideration of the function of supplying power generated in the inverter circuit board module (283) to the working coil pattern (2512).

[0204] In addition, although not shown in FIG. 7, the first layer (251a) may further include a temperature sensor (2515) for detecting the temperature of the top plate (21), a high-power terminal pattern (2516) supplied with high-power from the inverter circuit board module (283), a signal processing unit (2518) for processing the output signal of the sensing coil pattern (2514) and the output signal of the temperature sensor (2515), and a third lead pattern (2513c) for electrically connecting the temperature sensor (2515) and the signal processing unit (2518).

[0205] Meanwhile, a second sensing coil pattern (2514b) constituting a sensing coil pattern (2514) and a second lead pattern (2513b) electrically connecting the second sensing coil pattern (2514b) to a signal processing unit (2518) may be arranged on the second layer (251b) of the first coil circuit board module (251).

[0206] That is, in order to increase the efficiency and effectiveness of detection for the container, the sensing coil pattern (2514) may be divided and arranged into a first sensing coil pattern (2514a) arranged in the first layer (251a) and a second sensing coil pattern (2514b) arranged in the second layer (251b).

[0207] At this time, as described later, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are configured to be connected in series through a sensing coil via hole (H_v2) extending through the first layer (251a) and the second layer (251b), so that they can function as one sensing coil pattern (2514).

[0208] Meanwhile, a second sensing coil pattern (2514b) constituting the sensing coil pattern (2514) may be arranged on the second layer (251b) of the first coil circuit board module (251).

[0209] As described below, the working coil pattern (2512) provided on the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may include a first type pattern (2512a) and a second type pattern (2512b) in which the traveling direction or winding direction of individual pattern strands (2512a-1, 2512b-1) are formed in opposite directions so that a magnetic field can be applied evenly to the container.

[0210] As illustrated in FIG. 7, a working coil pattern (2512) may be formed in the third to seventh layers (251c, 251d, 251e, 251f, 251g), for example, and a first type pattern (2512a) configured such that the progress direction or winding direction of the individual pattern strands (2512a-1) becomes the first direction may be arranged.

[0211] In addition, for example, the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) may be configured to have a working coil pattern (2512) formed, and a second type pattern (2512b) configured such that the progress direction or winding direction of the individual pattern strands (2512b-1) is in the second direction.

[0212] At this time, as illustrated, the first lead pattern (2513a) formed on the first layer (251a), the first type pattern (2512a) arranged on the third to seventh layers (251c, 251d, 251e, 251f, 251g), and the second type pattern (2512b) arranged on the eighth to twelfth layers (251h, 251i, 251j, 251k, 251l) can be configured to be connected in batches through a working coil via hole (H_v1) continuously formed to penetrate from the first layer (251a) to the twelfth layer (251l).

[0213] Accordingly, among the plurality of craters described below, a plurality of first type patterns (2512a) and a plurality of second type patterns (2512b) forming a specific crater can be connected in series through a working coil via hole (H_v1).

[0214] Meanwhile, although not shown, an insulating material may be additionally formed on the upper side of the first layer (251a) and on the lower side of the 12th layer (251l).

[0215] Meanwhile, the layered structure of the first coil circuit board module (251) illustrated in FIG. 7 is merely exemplary.

[0216] That is, the layered structure may be modified so that the second sensing coil pattern (2514b) is placed on a layer other than the second layer (251b), such as the sixth layer (251f) or seventh layer (251g) which is an intermediate layer, or on the twelfth layer (251l) which is the lowest layer.

[0217] In addition, FIG. 7 illustrates that the first type pattern (2512a) is arranged continuously from the third layer (251c) to the seventh layer (251g), and the second type pattern (2512b) is arranged continuously from the eighth layer (251h) to the twelfth layer (251l); however, the first type pattern (2512a) and the second type pattern (2512b) may be modified to alternately and repeatedly arrange.

[0218] Such variations are considered to fall within the scope of the present invention. However, the present invention is not limited thereto, and the following description will be made based on the layered structure of the first coil circuit board module (251) as illustrated in FIG. 7.

[0219] The first coil circuit board module (251) having such a multi-layered structure can be formed by printing the shape of the working coil pattern (2512), which becomes the second type pattern (2512b), by masking it on a copper film, removing unnecessary parts through etching to form a pattern, and coating an insulating material on the formed pattern to form the 12th layer (251l), which becomes the lowest layer.

[0220] The thickness of the copper foil applied in this embodiment may be in the range of 0.13 mm to 0.15 mm, and preferably 0.14 mm.

[0221] Therefore, if no additional surface treatment is performed during the lamination process, the vertical thickness of the individual pattern formed through the copper film can be 0.13 mm to 0.15 mm.

[0222] Additionally, the thickness of the insulating material applied in this embodiment may be in the range of 0.09 mm to 0.11 mm, and preferably 0.1 mm.

[0223] After the 12th layer (251l), which is the lowest layer, is formed in this way, a multi-layered structure as shown in Fig. 7 can be formed by repeating the same process as the formation method of the 12th layer (251l) thereon.

[0224] Therefore, when the formation of the first coil circuit board module (251) is completed with a total of 12 layers, the vertical thickness of the first coil circuit board module (251) can be in the range of 2.7 mm to 3.3 mm, and preferably 3 mm.

[0225] A method for manufacturing a multilayer printed circuit board for forming a first coil circuit board module (251) having such a shape and structure can be applied using means already known in the art, and therefore, a description of the specific manufacturing method will be omitted below.

[0226] Figures 8 and 9 illustrate the planar structures of the first layer (251a) and the second layer (251b) of the first coil circuit board module (251) having a multilayer structure, respectively.

[0227] In this embodiment, the first coil circuit board module (251) may be configured to have a rectangular plate shape in which the width in the front-back direction is greater than the width in the left-right direction when placed on the cooktop (20). That is, when placed on the cooktop (20), the first coil circuit board module (251) may have a rectangular plate shape in which, among the outer edges, a front edge (251s1) and a rear edge (251s2) extend in the left-right direction, and, among the outer edges, a left edge (251s3) and a right edge (251s4) extend in the front-back direction.

[0228] In response to this, the first layer (251a), which is the uppermost layer, and the second layer (251b), which is the next upper layer, can be configured to have a rectangular plate shape in which the width in the front-back direction is greater than the width in the left-right direction.

[0229] As described above, in the first layer (251a), a first sensing coil pattern (2514a) forming the first layer among the sensing coil patterns (2514) arranged in two layers may be arranged, and in the second layer (251b), a second sensing coil pattern (2514b) forming the second layer among the sensing coil patterns (2514) arranged in two layers may be arranged.

[0230] At this time, as shown, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be wound in a different shape from the working coil pattern (2512).

[0231] That is, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be wound in a circular spiral shape. For example, the number of turns of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be set to be 18, and the outer diameter can have a range of 32 mm to 34 mm, preferably a range of 33 mm. In addition, the width of the individual pattern strands constituting the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be a range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0232] As described below, the working coil pattern (2512) is wound in a square spiral shape.

[0233] Additionally, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are arranged so that a region partially overlaps with the working coil pattern (2512) in the vertical direction.

[0234] Therefore, due to such overlapping areas, there is a possibility that malfunction or detection error of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may occur.

[0235] In this way, by winding the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) in a circular spiral shape, interference with the working coil pattern (2512) wound in a square spiral shape can be minimized, and the possibility of malfunction and detection errors of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be minimized.

[0236] Meanwhile, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be wound so that a starting point is not formed at the center of the circular spiral. That is, a central internal region in which the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are not formed may be formed at the center of the circular spiral shape.

[0237] A temperature sensor (2515) can be mounted in the central inner region of the first sensing coil pattern (2514a) as described below.

[0238] The specific configuration regarding placement of the temperature sensor (2515) is described later with reference to FIG. 10.

[0239] In this embodiment, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be provided in multiple numbers.

[0240] More specifically, the plurality of first sensing coil patterns (2514a) and the plurality of second sensing coil patterns (2514b) may include patterns that are arranged entirely within a specific crater and patterns that are arranged across a pair of adjacent craters (2511).

[0241] For example, in an embodiment as illustrated in FIG. 8, when the first coil circuit board module (251) has a total of eight craters (2511), a total of 28 first sensing coil patterns (2514a) and a total of 28 second sensing coil patterns (2514b) may be provided.

[0242] However, this is merely an example, and the number of first sensing coil patterns (2514a) may be adjusted and provided differently depending on the size of the individual crater (2511) and the size of the first coil circuit board module (251). The present invention is not limited thereto, but the following description will be made based on an embodiment in which 28 first sensing coil patterns (2514a) and second sensing coil patterns (2514b) are provided on the first coil circuit board module (251).

[0243] The first sensing coil patterns (2514a) arranged at different locations can be configured to have substantially the same number of turns, and similarly, the second sensing coil patterns (2514b) arranged at different locations can be configured to have the same number of turns.

[0244] A sensing coil via hole (H_v2) may be formed at a starting point or an ending point of a first sensing coil pattern (2514a), and the sensing coil via hole (H_v2) may be connected to an ending point or a starting point of a second sensing coil pattern (2514b). Through this, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be connected in series to form one sensing coil pattern (2514).

[0245] A starting point or an ending point that is not connected to a sensing coil via hole (H_v2) can be electrically connected to a signal processing unit (2518) provided in the first layer (251a) through a second lead pattern (2513b) formed in the first layer (251a) or the second layer (251b), as illustrated in FIGS. 8 and 9.

[0246] Meanwhile, a temperature sensor (2515) to be described later may be electrically connected to the signal processing unit (2518) via a third lead pattern (2513c). As illustrated in FIG. 9, the third lead pattern (2513c) may be formed on the second layer (251b).

[0247] In the case where a total of 28 sensing coil patterns (2514) are provided as in the embodiment illustrated in FIG. 8, a total of four signal processing units (2518) may be provided, and a pair of signal processing units (2518) may be formed adjacent to each other at the center of the rear edge (251s2) of the first layer (251a), and another pair of signal processing units (2518) may be arranged adjacent to each other at the center of the front edge (251s1) of the first layer (251a).

[0248] For example, based on the embodiment illustrated in FIG. 8, among a pair of signal processing units (2518) arranged at the leading edge (251s1) of the first layer (251a), a left signal processing unit (2518) may be assigned a group of six sensing coil patterns (2514) arranged on the left side among a plurality of sensing coil patterns (2514) that are divided left and right and arranged rearward from the leading edge (251s1) of the first layer (251a), and a temperature sensor (2515) arranged on each of them, and a right signal processing unit (2518) may be assigned a group of six sensing coil patterns (2514) arranged on the right side among a plurality of sensing coil patterns (2514) that are arranged rearward from the leading edge (251s1) of the first layer (251a), and a temperature sensor (2515) arranged on each of them.

[0249] In the same manner, a group of sensing coil patterns (2514) and a temperature sensor (2515) can be assigned to a pair of signal processing units (2518) arranged at the rear edge (251s2) of the first layer (251a).

[0250] In this way, by arranging the two pairs of signal processing units (2518) at positions that are maximally spaced apart along the front-back direction, the structure of the second lead pattern (2513b) that connects the individual sensing coil pattern (2514) to the signal processing unit (2518) and the third lead pattern (2513c) that connects the individual temperature sensor (2515) to the signal processing unit (2518) can be simplified, and their lengths can be minimized.

[0251] Meanwhile, a first lead pattern (2513a) for transmitting high-frequency power to each of the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) may be formed in the first layer (251a), as described later.

[0252] As illustrated, each first lead pattern (2513a) can be configured to be divided into multiple pattern strands.

[0253] Accordingly, the first lead pattern (2513a) is formed by dividing into multiple pattern strands, so that power loss that may occur due to the skin effect when high-frequency power is applied can be minimized.

[0254] Meanwhile, considering the efficiency of power supply, a plurality of pattern strands may be concentrated at one end and the other end of the first lead pattern (2513a) to form a common lead terminal (2513a1).

[0255] A common lead terminal (2513a1) formed at one end of the first lead pattern (2513a) can be connected to a high-power terminal pattern (2516) formed at the front edge (251s1) and the rear edge (251s2) of the first layer (251a), respectively.

[0256] Meanwhile, the first lead pattern (2513a) may be arranged inside the first layer (251a) from one end and may extend toward a common lead terminal (2513a1) formed at the other end.

[0257] Meanwhile, in this embodiment, a pair of working coil patterns (2512) arranged adjacent to each other can be configured to supply high-frequency power through three high-power terminal patterns (2516) and three first lead patterns (2513a).

[0258] That is, if high-power is supplied to each working coil pattern (2512) through a pair of high-power terminal patterns (2516) and a pair of first lead patterns (2513a), two pairs of high-power terminal patterns (2516) and two pairs of first lead patterns (2513a) must be allocated to each pair of working coil patterns (2512).

[0259] The present invention is configured so that high-frequency power is supplied to a pair of working coil patterns (2512) through three high-power terminal patterns (2516) and three first lead patterns (2513a) arranged adjacent to each other, so that the number of high-power terminal patterns (2516) and the number of first lead patterns (2513a) are minimized, and thus the circuit configuration can be simplified.

[0260] This will be explained in more detail with reference to Figure 9.

[0261] FIG. 9 is a partial enlarged view of FIG. 8, showing the detailed configuration of a high-power terminal pattern (2516) and a first lead pattern (2513a) for supplying power to a pair of working coil patterns (2512) arranged adjacent to the left rear side based on the state illustrated in FIG. 8.

[0262] Based on the illustrated state, the leftmost high-power terminal pattern (2516) is referred to as the first high-power terminal pattern (2516a), the middle high-power terminal pattern (2516) is referred to as the second high-power terminal pattern (2516b), and the rightmost high-power terminal pattern (2516) is referred to as the third high-power terminal pattern (2516c).

[0263] In addition, the first lead pattern (2513a) connected to the first high-power terminal pattern (2516a) is referred to as the 1-1 lead pattern (2513a-1), the first lead pattern (2513a) connected to the second high-power terminal pattern (2516b) is referred to as the 1-2 lead pattern (2513a-2), and the first lead pattern (2513a) connected to the third high-power terminal pattern (2516c) is referred to as the 1-3 lead pattern (2513a-3).

[0264] As illustrated, the first high-power terminal pattern (2516a) can be electrically connected to the external common terminal of the working coil pattern (2512) positioned further rearward among the pair of working coil patterns (2512) through the first-1 lead pattern (2513a-1).

[0265] Hereinafter, the external common terminal of the working coil pattern (2512) is referred to as the second common terminal (2512a-3, 2512b-3), and the internal common terminal of the working coil pattern (2512) is referred to as the first common terminal (2512a-2, 2512b-2).

[0266] As described below, the first common terminals (2512a-2, 2512b-2) include a first common terminal (2512a-2) of a first type pattern (2512a) and a first common terminal (2512b-2) of a second type pattern (2512b), and the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) may be connected in series through a working coil via hole (H_v1). As described below, the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) may be formed at positions where they vertically overlap each other.

[0267] Likewise, the second common terminals (2512a-3, 2512b-3) include the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b), and the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b) can be connected in series through the working coil via hole (H_v1). As described below, the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b) can be formed at positions where they vertically overlap each other.

[0268] At this time, the common lead terminal (2513a1) formed at the other end of the 1-1 lead pattern (2513a-1) can be formed at a position that vertically overlaps with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) arranged at the rear, and can be connected in series with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) through the working coil via hole (H_v1).

[0269] Meanwhile, as illustrated, the second high-power terminal pattern (2516b) can be electrically connected to the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) positioned further forward among the pair of working coil patterns (2512) through the first-second lead pattern (2513a-2).

[0270] At this time, the common lead terminal (2513a1) formed at the other end of the first-second lead pattern (2513a-2) can be formed at a position that vertically overlaps the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) arranged in the front, and can be connected in series with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) through the working coil via hole (H_v1).

[0271] Additionally, the third high-power terminal pattern (2516c) can be electrically connected to the first common terminals (2512a-2, 2512b-2) of a pair of working coil patterns (2512) simultaneously through the first-third lead pattern (2513a-3).

[0272] That is, as illustrated, the 1-3 lead pattern (2513a-3) has a common lead terminal (2513a1) formed at the other end, and a common lead terminal (2513a1) may be additionally provided at an intermediate position between one end and the other end.

[0273] A common lead terminal (2513a1) formed at the other end of the 1-3 lead pattern (2513a-3) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of the working coil pattern (2512) positioned at the front among a pair of working coil patterns (2512) through a working coil via hole (H_v1).

[0274] In addition, the common lead terminal (2513a1) formed at the middle position of the 1-3 lead pattern (2513a-3) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of the working coil pattern (2512) positioned at the rear among a pair of working coil patterns (2512) through a working coil via hole (H_v1).

[0275] That is, the 1-3 lead pattern (2513a-3) can be configured to act as a common lead pattern capable of simultaneously supplying power to a pair of working coil patterns (2512).

[0276] Accordingly, when only the rear working coil pattern (2512) is driven, power is supplied to the first high-power terminal pattern (2516a) and the third high-power terminal pattern (2516c) and power to the second high-power terminal pattern (2516b) is blocked, and when only the front working coil pattern (2512) is driven, power is supplied to the second high-power terminal pattern (2516b) and the third high-power terminal pattern (2516c) and power to the first high-power terminal pattern (2516a) is blocked, and when a pair of working coil patterns (2512) are driven simultaneously, power is supplied to all of the first to third high-power terminal patterns (2516c). The driving of a pair of working coil patterns (2512) can be controlled.

[0277] Meanwhile, based on the state illustrated in FIGS. 8 and 9, a plurality of edge notches (2517) may be formed at the front edge (251s1) and the rear edge (251s2) of the first layer (251a).

[0278] The edge notch (2517) serves to provide a mating space into which a connector (not shown) that supplies high-frequency power to the high-power terminal pattern (2516) can be fitted.

[0279] As illustrated, the individual high-power terminal patterns (2516) can be arranged in a split form with the edge notches (2517) interposed therebetween so that the connector can be connected to the high-power terminal patterns (2516) while being fitted into the edge notches (2517).

[0280] To reduce manufacturing costs through component commonality, connectors having the same shape and structure can be coupled to each edge notch (2517). To this end, each edge notch (2517) can be formed to have the same shape and size.

[0281] Meanwhile, as illustrated in FIG. 10, the edge notch (2517) can be formed entirely from the first layer (251a) of the first coil circuit board module (251) through the second layer (251b) to the twelfth layer (251l).

[0282] Additionally, a screw hole (H_sc) may be formed through the first coil circuit board module (251). The screw hole (H_sc) may be formed through the first layer (251a) to the twelfth layer (251l) in the same manner as the edge notch (2517).

[0283] A fastening means such as a screw bolt not shown can be connected to the aforementioned substrate supporter (26) through the screw hole (H_sc), and through this, the first coil circuit board module (251) can be firmly connected to the aforementioned substrate supporter (26).

[0284] For example, the screw holes (H_sc) can be placed on the four corner sides so as not to cause interference with the patterns constituting the first coil circuit board module (251).

[0285] Additionally, a ground terminal for grounding the first coil circuit board module (251) can be formed in the first layer (251a) around the screw hole (H_sc).

[0286] Meanwhile, the first coil circuit board module (251) may be provided with a light-transmitting slit hole (H_sl) formed penetrating from the first layer (251a) to the twelfth layer (251l).

[0287] The aforementioned light source module (23) can be placed below the light projection slit hole (H_sl), and visible light generated from the light source module (23) can pass through the light projection slit hole (H_sl) and be irradiated to the lower surface of the top plate (21). Through this, a linearly extending display line (L) can be formed on the top plate (21).

[0288] In order to implement a linearly extended display line (L), the light-transmitting slit hole (H_sl) can be linearly extended corresponding to the shape of the display line (L).

[0289] However, as shown in Fig. 8, in order to prevent the rigidity of the first coil circuit board module (251) from rapidly decreasing, the light transmitting slit hole (H_sl) may be formed by being divided into multiple pieces, and the divided light transmitting slit holes (H_sl) may be arranged linearly.

[0290] Hereinafter, with reference to FIG. 11, the relative arrangement position of the sensing coil pattern (2514) and the arrangement and arrangement structure of the temperature sensor (2515) will be described.

[0291] Fig. 11 is a partially enlarged view of a plan view of the first coil circuit board module (251) as viewed from above, in which the sensing coil pattern (2514) and the working coil pattern (2512) are illustrated together for the purpose of explaining and understanding their relative positions. However, in the present embodiment, the sensing coil pattern (2514) and the working coil pattern (2512) are actually arranged on different layers, so the sensing coil pattern (2514) and the working coil pattern (2512) cannot be observed together.

[0292] As described above, the individual sensing coil patterns (2514) wound in a circular spiral shape can be arranged so that a region partially overlaps with the working coil patterns (2512) wound in a square spiral shape in the vertical direction.

[0293] At this time, some of the plurality of sensing coil patterns (2514) may be entirely arranged within a single crater (2511) formed through the working coil pattern (2512), and other some of the plurality of sensing coil patterns (2514) may be arranged across an adjacent pair of craters (2511).

[0294] Fig. 11(a) illustrates a state in which a sensing coil pattern (2514) is arranged entirely within a working coil pattern (2512), and Fig. 11(b) illustrates a state in which a sensing coil pattern (2514) is arranged between a pair of adjacent working coil patterns (2512).

[0295] First, referring to FIG. 11(a), a working coil pattern (2512) formed by stacking a plurality of first type patterns (2512a) and a plurality of second type patterns (2512b) can be wound multiple times to have a square spiral shape.

[0296] For example, the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) can be wound a total of 9 times. That is, they can be wound to have a total of 9 turns.

[0297] Additionally, for example, six to five pattern strands (2512a-1, 2512b-1) can be tied together to form one turn.

[0298] At this time, as shown, the interval between each turn forming the first type pattern (2512a) and the second type pattern (2512b) is maintained approximately constant, but the horizontal interval between the third turn and the fourth turn can be formed to be much larger.

[0299] Internal clearance (D1) can be formed through the horizontal gap formed relatively larger in this way.

[0300] In addition, as shown in Fig. 11(b), an external gap (D2) that is a front-back gap similar to the internal gap (D1) can be formed between a pair of working coil patterns (2512) that are arranged adjacently along the front-back direction based on the state in which the first coil circuit board module (251) is arranged.

[0301] The internal clearance (D1) and the external clearance (D2) can be formed to have the same size, and for example, the internal clearance (D1) and the external clearance (D2) can have a range of 3.8 mm to 4.2 mm, and preferably, 4 mm.

[0302] As illustrated, the sensing coil pattern (2514) can be arranged so that the center point is located at the inner clearance (D1) and the outer clearance (D2).

[0303] Preferably, when the center point of the sensing coil pattern (2514) is located at the internal clearance (D1) as in Fig. 11(a), the center point of the sensing coil pattern (2514) may roughly coincide with the middle position between the third turn and the fourth turn.

[0304] In addition, preferably, when the center point of the sensing coil pattern (2514) is located at the external clearance (D2) as in FIG. 11(b), the center point of the sensing coil pattern (2514) may roughly coincide with the middle position between a pair of adjacently arranged working coil patterns (2512).

[0305] In addition, as described above, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) each have an area where no pattern is formed inside, through which a central inner area (2514c) can be formed on the inner side of the sensing coil pattern (2514).

[0306] As illustrated, the central inner region (2514c) of the sensing coil pattern (2514) may have a disk shape, and the diameter of the inner region of the disk shape may be formed to be equal to or slightly smaller than the size of the inner clearance (D1) and the outer clearance (D2).

[0307] In this way, the internal clearance (D1) and external clearance (D2) of the working coil pattern (2512) and the central internal area (2514c) of the sensing coil pattern (2514) can provide a space in which a temperature sensor (2515) can be mounted.

[0308] As illustrated, a temperature sensor (2515) for detecting the temperature of the top plate (21) may be mounted in the central inner region (2514c) of each sensing coil pattern (2514) of the first layer (251a). At this time, the size of the internal clearance (D1) and the external clearance (D2) and the diameter of the sensing coil pattern (2514) may be formed to be larger than the size of the temperature sensor (2515), i.e., the longitudinal width.

[0309] Through this, when viewed from the top plate (21), individual temperature sensors (2515) can be placed in the first layer (251a) so as to belong to the central inner region (2514c) as a position surrounded by each sensing coil pattern (2514).

[0310] Additionally, to prevent interference with the sensing coil pattern (2514), the temperature sensor (2515) may be positioned at a location where vertical overlap with the sensing coil pattern (2514) does not occur, as shown inside the central inner region (2514c).

[0311] Meanwhile, as an example, a temperature sensor (2515) may be a SMD (Surface Mounted Devices) type thermistor in chip form that is relatively small, easy to mount on the first layer (251a), and has excellent detection capability.

[0312] However, in the case where an SMD type thermistor is mounted on the first coil circuit board module (251) as a temperature sensor (2515), there is a very high possibility that it will be affected by heat generated from the working coil pattern (2512).

[0313] In order to minimize the influence of heat generation from such a working coil pattern (2512), it is necessary to place it as far away as possible from the working coil pattern (2512) in the horizontal direction.

[0314] As locations where the influence of such heat generation can be minimized, an area where the central inner region (2514c) of the sensing coil pattern (2514) and the internal clearance (D1) overlap, and an area where the central inner region (2514c) of the sensing coil pattern (2514) and the external clearance (D2) overlap can be selected.

[0315] Although FIG. 11 illustrates that the temperature sensor (2515) is positioned at a position where the center point of the temperature sensor (2515) and the center point of the central inner region (2514c) of the sensing coil pattern (2514) roughly coincide, this is merely exemplary, and the influence of heat generation of the working coil pattern (2512) can be minimized simply by positioning the temperature sensor (2515) at any position in the region where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the internal clearance (D1), and in the region where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the external clearance (D2).

[0316] In addition, by configuring the temperature sensor (2515) to be placed in an area where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the internal clearance (D1), and an area where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the external clearance (D2), a space for installing a third lead pattern (2513c) that electrically connects the temperature sensor (2515) and the signal processing unit (2518), and a temperature sensor via hole (H_v3) through which the temperature sensor (2515) and the third lead pattern (2513c) are connected can be effectively secured.

[0317] At this time, as shown, the temperature sensor (2515) as an SMD type thermistor may have first and second electrodes formed at each end in the longitudinal direction, and the first layer (251a) may be provided with a pair of pads soldered to the first and second electrodes.

[0318] As illustrated, in the present embodiment, the direction in which the first electrode and the second electrode provided at both ends of the temperature sensor (2515) are arranged to be spaced apart from each other may be arranged in a direction parallel to the direction in which the working coil pattern (2512) is arranged adjacent to the temperature sensor (2515) or may be arranged in a direction intersecting the direction in which the working coil pattern (2512) is arranged. In other words, the direction in which the first electrode (2515c) and the second electrode (2515d) are arranged to be spaced apart from each other may be, based on the state illustrated in FIG. 11(a), an extension direction of the outer edge of the first coil circuit board module (251), that is, an extension direction of the rear edge (251s2) and the front edge (251s1), and may be parallel to the left edge (251s3) and the right edge (251s4), and based on the state illustrated in FIG. 11(b), may be parallel to the extension direction of the rear edge (251s2) and the front edge (251s1), and may intersect the left edge (251s3) and the right edge (251s4).

[0319] That is, when the temperature sensor (2515) is arranged in the region of the first gap (D1) as illustrated in Fig. 11(a), the individual pattern strands (2512a-1, 2512b-1) of the working coil pattern (2512) arranged adjacent to both sides of the temperature sensor (2515) proceed along the front-back direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor (2515) arranged in the region of the first gap (D1) are arranged spaced apart from each other may be the front-back direction or the left-right direction intersecting the front-back direction.

[0320] In addition, when the temperature sensor (2515) is arranged in the area of ​​the second gap (D2) as illustrated in FIG. 11(b), the individual pattern strands (2512a-1, 2512b-1) of the working coil pattern (2512) arranged adjacent to both sides of the temperature sensor (2515) advance along the left-right direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor (2515) arranged in the area of ​​the second gap (D2) are arranged to be spaced apart from each other may be the left-right direction or the front-back direction intersecting the left-right direction.

[0321] At this time, a pair of pads corresponding to the first electrode and the second electrode of the temperature sensor (2515) arranged in the area of ​​the first gap (D1), and the first electrode and the second electrode of the temperature sensor (2515) arranged in the second gap (D2) can be arranged with the same direction as these.

[0322] Through this, the third lead pattern (2513c) for transmitting an electrical signal generated from the temperature sensor (2515) to the signal processing unit (2518) can be extended toward the signal processing unit (2518) without interference with the working coil pattern (2512) or with interference with the working coil pattern (2512) being minimized.

[0323] More specifically, the portion where the third lead pattern (2513c) overlaps with the sensing coil pattern (2514) and extends across the sensing coil pattern (2514) may be provided in any one of the third to seventh layers (251c, 251d, 251e, 251f, 251g) on ​​which the first type pattern (2512a) is formed, or may be provided in any one of the eighth to twelfth layers (251h, 251i, 251j, 251k, 251l) on which the second type pattern (2512b) is formed.

[0324] By way of example, in the present embodiment, as illustrated in FIG. 14, a third lead pattern (2513c) may be provided in any one of the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) on which a second type pattern (2512b) is formed, and the third lead pattern (2513c) formed in any one of the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) may extend parallel to the pattern strand (2512b-1) of the second type pattern (2512b) within the first gap (D1) and the second gap (D2).

[0325] Through this, the third lead pattern (2513c) can be extended while effectively avoiding the working coil pattern (2512).

[0326] The remaining portion of the third lead pattern (2513c) can be formed on the first layer (251a) or the second layer (251b) that does not cause interference with the working coil pattern (2512), as shown in FIGS. 10 and 11.

[0327] Hereinafter, the detailed configuration of the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) will be described with reference to FIGS. 12 to 17.

[0328] Figure 12 illustrates the planar structure of the third layer (251c) of the first coil circuit board module (251) having a multi-layer structure.

[0329] The configuration of the third layer (251c) of the first coil circuit board module (251) described below can be applied equally to the fourth to seventh layers (251d, 251e, 251f, 251g) unless otherwise described.

[0330] Referring to FIG. 12, a first type pattern (2512a) of a working coil pattern (2512) consisting of a total of eight pieces can be arranged on a third layer (251c) of a first coil circuit board module (251) so as to form a total of eight craters (2511).

[0331] As illustrated, one first type pattern (2512a) can be assigned to one crater (2511), and the size of each first type pattern (2512a) can be formed to be the same so that the size of each crater (2511) can be formed to be the same.

[0332] At this time, for example, eight craters (2511) can be arranged in a grid shape, and accordingly, the first type pattern (2512a) can be arranged in a grid shape.

[0333] Accordingly, as the first type pattern (2512a) is arranged in a grid shape like this, a heating area can be evenly formed inside the third layer (251c) by being configured to be wound in a square spiral shape.

[0334] Meanwhile, in a case where a plurality of first type patterns (2512a) are arranged in a grid shape, the second type patterns (2512b) can be arranged symmetrically.

[0335] That is, a plurality of first type patterns (2512a) can be arranged in a left-right symmetrical shape centered on the light-transmitting slit hole (H_sl), which becomes the left-right center line of the third layer (251c).

[0336] Additionally, a plurality of first type patterns (2512a) can be arranged to have a front-back symmetrical shape centered on the front-back center line of the third layer (251c).

[0337] By arranging a plurality of first type patterns (2512a) in a symmetrical manner, the length of the first lead pattern (2513a) for supplying high-frequency power to the individual third layer (251c) can be minimized, and the structure of the first lead pattern (2513a) can be simplified.

[0338] Figure 13 illustrates the planar structure of the eighth layer (251h) of the first coil circuit board module (251) having a multi-layer structure.

[0339] The configuration of the 8th layer (251h) of the first coil circuit board module (251) described below can be equally applied to the 9th to 12th layers (251i, 251j, 251k, 251l) unless otherwise described.

[0340] As illustrated in FIG. 13, a second type pattern (2512b) of a working coil pattern (2512) consisting of a total of eight pieces can be arranged on the eighth layer (251h) of the first coil circuit board module (251) so as to form a total of eight craters (2511).

[0341] As illustrated, one second type pattern (2512b) can be assigned to one crater (2511), and the size of each second type pattern (2512b) can be formed to be the same so that the size of each crater (2511) can be formed to be the same.

[0342] At this time, the second type pattern (2512b) can be arranged in a grid shape, similar to the first type pattern (2512a).

[0343] In addition, similarly to the first type pattern (2512a) described above, a plurality of second type patterns (2512b) may be arranged to have a left-right symmetrical shape centered on the light-transmitting slit hole (H_sl), and a plurality of second type patterns (2512b) may be arranged to have a front-back symmetrical shape centered on the front-back center line of the third layer (251c).

[0344] Figure 14 illustrates a first type pattern (2512a) and a second type pattern forming one identical crater (2511).

[0345] The first type pattern (2512a) and the second type pattern (2512b) illustrated in FIG. 14 can be arranged in a layered structure along the vertical direction as described above so as to form the same crater (2511).

[0346] As illustrated in FIG. 14, the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) can be wound to have a square spiral shape from the first common terminal (2512a-2, 2512b-2) formed on the inside to the second common terminal (2512a-3, 2512b-3) formed on the outside as described above.

[0347] For example, it can be wound a total of 9 times from the first common terminal (2512a-2, 2512b-2) to the second common terminal (2512a-3, 2512b-3). That is, it can be wound to have 9 turns.

[0348] As illustrated, the first common terminals (2512a-2, 2512b-2) may be formed at positions eccentric outward from the center of the crater (2511). That is, an area in which the first type pattern (2512a) and the second type pattern (2512b) are not formed may be formed in the center of the crater (2511). This is to prevent overheating that may occur due to heat generated by individual pattern strands (2512a-1, 2512b-1) being concentrated in the center of the crater (2511). Although not illustrated, a means for preventing overheating on the center side of the crater (2511) may be additionally provided in the form of a via hole on the center side of the crater (2511).

[0349] Additionally, as described above, the spacing between each turn forming the first type pattern (2512a) and the second type pattern (2512b) is maintained approximately constant, but an internal clearance (D1) for placement of a temperature sensor (2515) may be formed between the third turn and the fourth turn.

[0350] Meanwhile, for example, the first type pattern (2512a) may be formed by binding six pattern strands (2512a-1) to form one turn, and the second type pattern (2512b) may be formed by binding five pattern strands (2512b-1) to form one turn.

[0351] The widths of the individual pattern strands (2512a-1, 2512b-1) constituting the first type pattern (2512a) and the second type pattern (2512b) can be formed identically in a range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0352] However, although the first type pattern (2512a) has six individual pattern strands (2512a-1) that constitute one turn, the ninth turn from the first turn does not proceed with only six individual pattern strands (2512a-1).

[0353] Likewise, the second type pattern (2512b) has five individual pattern strands (2512b-1) that constitute one turn, but the ninth turn does not proceed from the first turn with only five individual pattern strands (2512b-1).

[0354] That is, the first type pattern (2512a) can be arranged by dividing a plurality of pattern strands (2512a-1) in such a way that when one turn is completed while progressing from the first turn to the ninth turn, one of the six individual pattern strands (2512a-1) is stopped and a new individual pattern strand (2512a-1) is newly progressed.

[0355] Similarly, the second type pattern (2512b) can be arranged by dividing multiple pattern strands (2512b-1) in such a way that when one turn is completed while progressing from the first turn to the ninth turn, one of the five individual pattern strands (2512b-1) is stopped and a new individual pattern strand (2512b-1) is newly progressed.

[0356] By configuring the first type pattern (2512a) and the second type pattern (2512b) to be formed through a plurality of divided individual pattern strands (2512a-1, 2512b-1) in this way, it is possible to achieve the effect of a bundle of wires being bundled similar to the Litz wire applied to conventional cooktops.

[0357] At this time, the starting point and the ending point of the individual pattern strand (2512a-1) of the first type pattern (2512a) arranged to form a new turn as illustrated in FIG. 15, and the starting point and the ending point of the individual pattern strand (2512b-1) of the second type pattern (2512b) arranged to form a new tube in the same manner can be connected in series through the working coil via hole (H_v1).

[0358] At this time, the working coil via hole (H_v1) connecting the starting point and the ending point of the individual pattern strand (2512a-1) of the first type pattern (2512a) to the starting point and the ending point of the individual pattern strand (2512b-1) of the second type pattern (2512b) can be configured to collectively connect the individual pattern strands (2512a-1, 2512b-1) arranged in each layer by penetrating the entirety from the third layer (251c) to the twelfth layer (251l), as illustrated in FIG. 16.

[0359] However, as illustrated in FIG. 15, the individual pattern strands (2512a-1) constituting the first type pattern (2512a) and the individual pattern strands (2512b-1) constituting the second type pattern (2512b) may be configured to extend in opposite directions.

[0360] For example, individual pattern strands (2512a-1) constituting a first type pattern (2512a) may extend along a first direction (W1), and individual pattern strands (2512b-1) constituting a second type pattern (2512b) may extend along a second direction (W2) opposite to the first direction (W1).

[0361] As illustrated by way of example, the first direction (W1) can be clockwise, and the second direction (W2) can be counterclockwise.

[0362] Therefore, when high-frequency power is supplied through the same working coil via hole (H_v1), currents having opposite directions may flow in the individual pattern strands (2512a-1) of the first type pattern (2512a) and the individual pattern strands (2512b-1) of the second type pattern (2512b), which are electrically connected simultaneously to the same working coil via hole (H_v1), and magnetic fields having opposite directions may be formed.

[0363] As magnetic fields in opposite directions are formed in the first type pattern (2512a) and the second type pattern (2512b) in this way, a magnetic field dispersion effect similar to a conventional twisted Litz wire can be created.

[0364] Accordingly, the magnetic field generated from the first type pattern (2512a) and the second type pattern (2512b) is evenly transmitted to the container without being concentrated on a specific part of the container, thereby improving the heating efficiency and heating effect for the container.

[0365] Meanwhile, as illustrated in FIG. 17, a plurality of working coil via holes (H_v1) may be formed in the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) to minimize loss due to resistance.

[0366] These multiple working coil via holes (H_v1) can be formed to penetrate the entire layer from the first layer (251a) to the twelfth layer (251l) so as to be electrically connected to the first lead pattern (2513a) formed on the first layer (251a).

[0367] As a common working coil via hole (H_v1) is formed through the entire layer in this way, heat generated by individual working coil patterns (2512) can be effectively released from the first coil circuit board module (251) through the working coil via hole (H_v1). That is, the working coil via hole (H_v1) can function as a ventilation hole that prevents overheating of the first coil circuit board module (251).

[0368] Although not shown in FIG. 17, a plurality of working coil via holes (H_v1) may be formed to penetrate the entire area from the first layer (251a) to the twelfth layer (251l) in the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b), similarly to the first common terminals (2512a-2, 2512b-2).

[0369] [Terminal layout structure of the coil circuit board module]

[0370] Referring to FIGS. 18 to 24 below, the arrangement structure of the terminal portion of the temperature sensing circuit, the terminal portion of the container sensing circuit, and the terminal portion of the working coil pattern (2512) provided in the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention will be described.

[0371] As described above, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention is integrally provided with a temperature sensing circuit for detecting the temperature of the top plate (21), and the temperature sensing circuit may include a plurality of temperature sensors (2515) each of which is arranged at different locations.

[0372] As illustrated in Fig. 18, each temperature sensor (2515) can be mounted on the top surface of a coil circuit board module (251, 252, 253) surrounded by a sensing coil pattern (2514) constituting a container sensing circuit so as to effectively detect the temperature of the top plate (21) at different locations.

[0373] That is, each temperature sensor (2515) may be mounted on a coil circuit board module (251, 252, 253), and may be positioned on the upper surface of the coil circuit board module (251, 252, 253) facing the top plate (21).

[0374] At this time, as described above, each temperature sensor (2515) may be applied with an SMD type thermistor to facilitate integration into the coil circuit board module (251, 252, 253) through mounting on the coil circuit board module (251, 252, 253).

[0375] In Fig. 18, a state in which an SMD type thermistor applied as an individual temperature sensor (2515) is mounted on a first coil circuit board module (251) is illustrated. Hereinafter, as illustrated, a state in which the temperature sensor (2515) is placed on the first coil circuit board module (251) will be described as an example, and the configuration described below can be equally applied to a second coil circuit board module (252) and a third coil circuit board module (253) that are not described otherwise.

[0376] Referring to FIG. 18, a temperature sensor (2515) that is an SMD type thermistor may be configured to include a sensing chip (2515a) that generates an output signal containing information related to a sensed temperature, a sensor body (2515b) that houses the sensing chip (2515a) therein, and a first electrode (2515c) and a second electrode (2515d) that are spaced apart from each other with the sensor body (2515b) interposed therebetween and electrically connected to the sensing chip (2515a), respectively.

[0377] At this time, the first electrode (2515c) and the second electrode (2515d) can be directly soldered and connected to the sensor pad formed on the upper surface (251t) of the first coil circuit board module (251).

[0378] As described above, the sensor pad is connected to a second lead pattern (2513b) that constitutes a temperature sensing circuit, and an output signal of the first electrode (2515c) or the second electrode (2515d) can be transmitted to a signal processing unit through the sensor pad and the second lead pattern (2513b).

[0379] The signal processing unit is provided between the individual temperature sensor (2515) and the main circuit board module (281) and performs a function for converting the output signal of the individual temperature sensor (2515) into a temperature-based data signal, and may be provided in the main circuit board module (281) or may be arranged in the installation area (A1) of the edge area (251sa) of the first coil circuit board module (251) as described below.

[0380] When the signal processing unit is integrally provided in the edge area (251sa) of the first coil circuit board module (251), the signal processing unit can form a temperature sensing circuit together with a plurality of temperature sensors (2515).

[0381] The signal processing unit may include, for example, a multiplexer, a pull-up / pull-down element, a signal amplifier element, a signal conversion element, and a connection pattern electrically connecting them.

[0382] The output signal of the temperature sensor (2515) converted through the signal processing unit can be transmitted to the main circuit board module (281) through a low-power connector (2518g) that is electrically connected to a temperature sensor via hole (H_v3) that is arranged in the edge area (251sa) of the first coil circuit board module (251) and functions as a terminal of the temperature sensing circuit, and a temperature sensor via hole (H_v3) that functions as a terminal of the container sensing circuit.

[0383] For example, in the case where a total of 28 temperature sensors (2515) are provided on the first coil circuit board module (251), a common input via hole (H_v311) functioning as the initial input terminal for 14 temperature sensors (2515) based on the first coil circuit board module (251) and a first via hole group (H_v31) functioning as the final output terminal may be allocated and arranged in the right area of ​​the edge area (251sa) of the front edge (251s1) and the rear edge (251s2) of the first coil circuit board module (251), respectively.

[0384] Additionally, a common input via hole (H_v311) that functions as the initial input terminal for the remaining 14 temperature sensors (2515) and a first via hole group (H_v31) that functions as the final output terminal may be allocated and arranged in the left area of ​​the edge area (251sa) of the front edge (251s1) and the rear edge (251s2) of the first coil circuit board module (251), respectively.

[0385] FIGS. 20 to 23 illustrate a configuration in which a common input via hole (H_v311) functioning as an initial input terminal for seven temperature sensors (2515) and a first via hole group (H_v31) functioning as a final output terminal are arranged in the right area of ​​the edge area (251sa) formed in the exemplary rear edge (251s2). Although not illustrated, the contents described below can be equally applied to the right area and the left area of ​​the edge area (251sa) formed in the front edge (251s1) of the first coil circuit board module (251), and descriptions of overlapping configurations will be omitted.

[0386] The via holes arranged in two rows together with the first via hole group (H_v31) constitute the aforementioned container sensing circuit and can be the first via hole group (H_v21) of the sensing coil via holes (H_v2) that function as the initial input terminal and output terminal of the seven sensing coil patterns (2514) based on the first coil circuit board module (251).

[0387] Additionally, the via holes additionally arranged on the right side of these first via hole groups (H_v21, H_v31) constitute a temperature sensing circuit and a container sensing circuit and correspond to the second via hole group (H_v22, H_v32) that serves as an intermediate terminal.

[0388] That is, seven temperature sensors (2515) are commonly connected to a single common input via hole (H_v311), and the output signals of the seven temperature sensors (2515) can be ultimately output through seven first via hole groups (H_v31) that are individually allocated.

[0389] In this way, the first via hole group (H_v31) and the common via hole (H_v311) that become input / output terminals of the temperature sensing circuit, and the first via hole group (H_v21) that become input / output terminals of the container sensing circuit can be electrically contacted to the main circuit board module (281) through a low-power connector (2518g), as illustrated in FIG. 23.

[0390] As the first via hole group (H_v31) and the common via hole (H_v311) of the temperature sensing circuit and the first via hole group (H_v21) of the container sensing circuit are arranged in the edge area (251sa), the low-power connector (2518g) can be arranged in the edge area (251sa) together with them.

[0391] However, since the vertical gap between the first coil circuit board module (251) and the top plate (21) is formed very narrow, it is preferable that the low-power connector (2518g) be arranged on the lower surface (251v) rather than the upper surface (251t) of the first coil circuit board module (251).

[0392] As described later, a second through hole (264) may be formed through the substrate supporter (26) corresponding to the position of the low-power connector (2518g) positioned in the edge area (251sa) as the lower surface (251v) of the first coil circuit board module (251).

[0393] In this way, the temperature sensing circuit and the container sensing circuit can be electrically connected to the main circuit board module (281) collectively and integrally via a low-power connector (2518g). This has the effect of significantly simplifying the connection structure between the first coil circuit board module (251) and the main circuit board module (281).

[0394] Meanwhile, referring to FIG. 20, a plurality of high-power terminal patterns (2516) as terminals for supplying high-frequency power to the working coil pattern (2512) can be integrally formed on the first coil circuit board module (251) together with the working coil pattern (2512).

[0395] As illustrated, these multiple high-power terminal patterns (2516) can be formed in an edge region (251sa) close to the front edge (251s1) and the rear edge (251s2) of the first coil circuit board module (251), and can be arranged along the extension direction of the front edge (251s1) and the rear edge (251s2), respectively.

[0396] As illustrated, since the edge region (251sa) is formed on the front edge (251s1) and rear edge (251s2) sides of the first coil circuit board module (251), the edge region (251sa) can be defined as a rectangular region whose width in the front-back direction is maintained approximately constant and extends along the left-right direction.

[0397] The high-power terminal pattern (2516) can be arranged in an edge region (251sa) where the working coil pattern (2512) forming the crater (2511) is not formed. Accordingly, the high-power terminal pattern (2516) can be arranged so as not to overlap with the working coil pattern (2512) in the vertical direction, and thus interference with the working coil pattern (2512) due to the formation of the high-power terminal pattern (2516) can be minimized.

[0398] Meanwhile, in the illustrated embodiment, the high-power terminal pattern (2516) is illustrated as being formed on the upper surface (251t) of the first coil circuit board module (251), but, unlike this, it may be formed on the lower surface (251v) of the first coil circuit board module (251), or the high-power terminal pattern (2516) may be formed on the upper surface (251t) and the lower surface (251v) of the first coil circuit board module (251), respectively, depending on the embodiment.

[0399] The high-power terminal pattern (2516) is configured to be applied with a high-frequency power having an effective value of approximately 20 A or more. Therefore, it is virtually impossible to apply a connector having a simple insertion method, such as a conventional board connector such as a low-power connector (2518g), to the high-power terminal pattern (2516).

[0400] Accordingly, high-frequency power can be transmitted to the high-power terminal pattern (2516) through a high-power connector (254) having one side connected to the high-power terminal pattern (2516) of the first coil circuit board module (251) and the other side electrically connected to the inverter of the inverter circuit board module (283) via a power cable. Accordingly, the high-power connector (254) can form a power connection part together with the aforementioned high-power terminal pattern (2516) and the first lead pattern (2513a).

[0401] Additionally, as high-frequency power having an effective value of approximately 20 A or more is applied, the contact resistance between the high-power terminal pattern (2516) and the high-power connector (254) needs to be kept low.

[0402] To this end, the high-power terminal pattern (2516) and the high-power connector (254) are configured to be in contact in a surface-to-surface contact state, and the individual high-power terminal pattern (2516) may be provided in a large-area pattern shape having a predetermined left-right width and a predetermined front-back width as illustrated in FIGS. 20 and 21 to expand the contact area for the high-power connector (254).

[0403] At this time, in order to secure the maximum width in the front-back direction, the front-back width of the individual high-power terminal pattern (2516) may be set to be the same as the front-back width of the edge region (251sa). That is, the front-back width of the high-power terminal pattern (2516) may be set to be the same as the front-back width between the front edge (251s1) and the working coil pattern (2512) or the front-back width between the rear edge (251s2) and the working coil pattern (2512).

[0404] In addition, as illustrated, in order to expand the contact area, the individual high-power terminal patterns (2516) may be configured in an 11-shape that is arranged to be separated and spaced apart from each other, or may be formed in a U-shape that is arranged to be connected integrally. FIGS. 20 and 21 illustrate the configuration of a high-power terminal pattern (2516) having an 11-shape. Although the present invention is not limited thereto, the configuration of a high-power terminal pattern (2516) having the illustrated shape will be described below based on the configuration of the high-power terminal pattern (2516).

[0405] Meanwhile, an edge notch (2517) may be formed between high-power terminal patterns (2516) having an 11-character shape, as illustrated. That is, the edge notch (2517) may be positioned and formed in the edge region (251sa) in a state in which it is at least partially surrounded by the high-power terminal patterns (2516).

[0406] The high power connector (254) may extend downwardly toward the inverter circuit board module (283) through the edge notch (2517) and at least partially through the first coil circuit board module (251).

[0407] However, in order to allow the high-power connector (254) to pass through, the first coil circuit board module (251) may be formed with a connecting hole instead of a notch. Although not shown, even when a connecting hole is provided instead of an edge notch (2517), the connecting hole may be positioned and formed in the edge area (251sa) so as to be at least partially surrounded by a high-power terminal pattern (2516) so that connection and fixation to the high-power connector (254) can be smoothly performed.

[0408] Meanwhile, as illustrated in FIG. 20, the substrate supporter (26) may be provided with a plurality of first through holes (263) formed along the upper surface (261) and the lower surface (262) so that the lower end of a high-power connector (254) to which a power cable is connected can be inserted and passed through.

[0409] In addition, a second aperture (264) disposed adjacent to the first aperture (263) and having a larger open area than the first aperture (263) may be additionally formed, and the second aperture (264) may function to allow a low-power connector (2518g) disposed in the edge region (251sa) as described above to be directly inserted therein or a flat cable connected to the low-power connector (2518g) to pass therethrough.

[0410] Meanwhile, FIGS. 24 and 25 illustrate a configuration in which an edge region (251sa) is formed at a left edge (251s3) and a right edge (251s4) of a first coil circuit board module (251) according to another embodiment of the present invention.

[0411] That is, in a case where the front-to-back size of the first coil circuit board module (251) is reduced or limited, such as when the front-to-back size of the cooktop (20) must be kept to a minimum, an edge area (251sa) where a working coil pattern (2512) is not formed can be configured to be arranged at the left edge (251s3) and the right edge (251s4) as shown in FIG. 24.

[0412] As illustrated, since the edge region (251sa) is formed on the left edge (251s3) and the right edge (251s4) of the first coil circuit board module (251), the edge region (251sa) can be defined as a rectangular region that extends along the front-back direction while maintaining a roughly constant width in the left-right direction.

[0413] Accordingly, as described in the above-described embodiment, the high-power terminal pattern (2516), the high-power connector (254), the temperature sensor via hole (H_v3) functioning as a terminal portion of the temperature sensing circuit, the temperature sensor via hole (H_v3) functioning as a terminal portion of the container sensing circuit, and the low-power connector (2518g) arranged in the edge region (251sa) can be arranged along the left edge (251s3) and the right edge (251s4) of the first coil circuit board module (251).

[0414] That is, compared to the above-described embodiment, the detailed structures of the high-power terminal pattern (2516), the high-power connector (254), the temperature sensor via hole (H_v3) functioning as a terminal portion of the temperature sensing circuit, the temperature sensor via hole (H_v3) functioning as a terminal portion of the container sensing circuit, and the low-power connector (2518g) can be applied in the same manner, except that the arrangement direction is set differently.

[0415] However, in the above-described embodiment, power is simultaneously supplied to the first common terminals (2512a-2, 2512b-2) of a pair of working coil patterns (2512) that are arranged adjacently and each constitutes a crater (2511) through the third high-power terminal pattern (2516c) among the high-power terminal patterns (2516). That is, the first common terminals (2512a-2, 2512b-2) of the pair of working coil patterns (2512) are simultaneously connected to the third high-power terminal pattern (2516c) through the first-second lead pattern (2513a-2).

[0416] However, when the high-power terminal pattern (2516) is arranged along the left edge (251s3) or the right edge (251s4) of the first coil circuit board module (251) as in the embodiment illustrated in FIGS. 24 and 25, the second high-power terminal pattern (2516b) can be positioned at a position advantageous for simultaneously supplying power to the first common terminals (2512a-2, 2512b-2) of a pair of working coil patterns (2512).

[0417] That is, since the second high-power terminal pattern (2516b) can be placed at an intermediate position between a pair of working coil patterns (2512) based on the front-back direction, the connection structure and extension structure of the first lead pattern (2513a) for the first common terminal (2512a-2, 2512b-2) of the pair of working coil patterns (2512) can be simplified.

[0418] Accordingly, based on the arrangement of the working coil pattern (2512) exemplarily illustrated in FIG. 25, the first-second lead pattern (2513a-2) for supplying simultaneous power can extend in the left-right direction in the turn-to-turn region between a pair of working coil patterns (2512), branch toward a pair of first common terminals (2512a-2, 2512b-2), and then extend in a T shape toward the rear and front, respectively. Through this, the extension length of the first-second lead pattern (2513a-2) can be minimized and the branching structure can be simplified.

[0419] Meanwhile, in the illustrated embodiment, the first high-power terminal pattern (2516a) may be configured to be connected to the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) positioned at the rear among a pair of working coil patterns (2512) through the first-first lead pattern (2513a-1).

[0420] Additionally, in the illustrated embodiment, the third high-power terminal pattern (2516c) may be configured to be connected to the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) positioned forward among a pair of working coil patterns (2512) through the first-third lead pattern (2513a-3).

[0421] Through this, the extension length of the 1-1 lead pattern (2513a-1) and the 1-3 lead pattern (2513a-3) can be minimized and the branch structure can be simplified.

[0422] Additionally, as the positions of the high-power terminal pattern (2516), the high-power connector (254), and the low-power connector (2518g) change, the first through hole (263) and the second through hole (264) formed in the substrate supporter (26) can be arranged along the left edge (251s3) and the right edge (251s4).

[0423] However, the left-right width of the individual high-power terminal patterns (2516) may be configured to be set to be the same as the left-right width of the edge region (251sa) as they are arranged along the left-hand edge (251s3) and the right-hand edge (251s4) of the first coil circuit board module (251). That is, in order to secure the left-hand width as much as possible, the left-hand width of the high-power terminal pattern (2516) may be set to be the same as the left-hand width between the left-hand edge (251s3) and the working coil pattern (2512) or the left-hand width between the right-hand edge (251s4) and the working coil pattern (2512).

[0424] Although the present invention has been described with reference to the drawings exemplified above, it is to be understood that the present invention is not limited to the embodiments and drawings disclosed herein, and that various modifications may be made by those skilled in the art within the scope of the technical idea of ​​the present invention. Furthermore, even if the operational effects according to the configuration of the present invention have not been explicitly described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be acknowledged.

Claims

1. Top plate on which the container is mounted; A coil circuit board module having a working coil pattern disposed below the top plate and configured to generate a magnetic field when power is applied thereto to heat the container; and An inverter circuit board module that is positioned below the coil circuit board module and generates the power; Including, The above coil circuit board module is electrically connected to the working coil pattern and has a power connection to which the power generated from the inverter circuit board module is supplied, The above power connection part is, A cooking appliance comprising a terminal pattern disposed between the outer edge of the coil circuit board module and the working coil pattern.

2. In paragraph 1, An edge region is formed between the above working coil pattern and the outer edge of the coil circuit board module, A cooking appliance wherein the terminal pattern is arranged in the edge area.

3. In paragraph 2, A cooking appliance in which the terminal pattern is positioned so as not to overlap with the working coil pattern in the edge area.

4. In paragraph 2, The above outer edges include a front edge, a rear edge, a left edge, and a right edge, A cooking appliance in which the edge region is formed in at least one of the following areas: between the front edge and the working coil pattern, between the rear edge and the working coil pattern, between the left edge and the working coil pattern, and between the right edge and the working coil pattern.

5. In paragraph 2, A cooking appliance wherein the power connection part further includes a lead pattern having one end electrically connected to the high-power terminal pattern and the other end electrically connected to the working coil pattern.

6. In paragraph 2, A cooking appliance further provided with a screw hole formed through the edge area to secure the coil circuit board module.

7. In paragraph 2, The above terminal pattern is a cooking appliance arranged on the upper or lower surface of the coil circuit board module.

8. In paragraph 2, The above working coil pattern includes a first working coil pattern forming a first crater and a second working coil pattern forming a second crater, The terminal pattern includes a first terminal pattern, a second terminal pattern, and a third terminal pattern, which are arranged separately and spaced apart from each other along the outer edge of the coil circuit board module, A cooking appliance in which the first working coil pattern and the second working coil pattern receive power from the inverter circuit board module through the first terminal pattern, the second terminal pattern, and the third terminal pattern.

9. In paragraph 2, A cooking appliance wherein the power connection part further includes a high-power connector having one end electrically connected to the terminal pattern and the other end electrically connected to the inverter circuit board module.

10. In paragraph 9, A cooking appliance wherein the high-power connector extends toward the inverter circuit board module at least partially penetrating the coil circuit board module.

11. In paragraph 10, The above coil circuit board module is provided with an edge notch through which the high-power connector extends, A cooking appliance wherein the edge notch is positioned in the edge area so as to be at least partially surrounded by the terminal pattern.

12. In paragraph 10, The above coil circuit board module is provided with a coupling hole through which the high-power connector extends, A cooking appliance in which the above-mentioned joining hole is placed in the edge region while being at least partially surrounded by the above-mentioned terminal pattern.

13. In paragraph 2, The above coil circuit board module further comprises a temperature sensing circuit that detects the temperature of the top plate, A cooking appliance in which the terminal portion of the above temperature sensing circuit is formed in the edge area.

14. In paragraph 13, A cooking appliance in which the terminal portion of the above temperature sensing circuit is provided in the edge area in the form of a via hole.

15. In paragraph 13, The above coil circuit board module further comprises a container sensing circuit that detects whether the container is seated, A cooking appliance in which the terminal portion of the above container sensing circuit is formed in the edge area.

16. In paragraph 15, A cooking appliance in which the terminal portion of the above container sensing circuit is provided in the edge area in the form of a via hole.

17. In paragraph 15, A main circuit board module that determines whether to supply power to the above working coil pattern; Including more, The above coil circuit board module further includes a low-power connector that integrally connects the terminal portion of the temperature sensing circuit and the terminal portion of the container sensing circuit to the main circuit board module side. The above low-power connector is a cooking appliance placed in the edge area.

Images