Neural stimulation device

Abstract

A neural stimulation device according to an embodiment comprises: a substrate including a first side and a second side opposite to the first side; a first pattern electrode disposed on the first side; a second pattern electrode disposed on the second side; a first protective layer disposed on the first pattern electrode; and a second protective layer disposed on the second pattern electrode, wherein: the first pattern electrode comprises includes a plurality of branch electrodes, a merged electrode connecting the plurality of branch electrodes, and a protrusion part protruding from the branch electrodes or the merged electrode; the protrusion part includes at least one of a first protrusion part connected to the branch electrodes and a second protrusion part connected to the merged electrode; and a first interval between the branch electrode adjacent to the first protrusion part and the first protrusion part is 5% to 45% of a second interval between the branch electrodes.

Description

neurostimulation device

[0001] The embodiment relates to a neurostimulation device.

[0002] Many patients are being treated for visual disorders. For example, many patients are being treated for visual disorders such as dry eye, decreased vision, or glaucoma.

[0003] Recent technological advancements have led to dramatic advances in neuromodulation. This has led to a growing understanding of nerve cell growth and function. Furthermore, accumulated technology has revealed that nerve regeneration can be controlled through intrinsic properties, and that micro-electrical stimulation can accelerate nerve and tissue regeneration in peripheral nerves.

[0004] Accordingly, neurostimulation devices utilizing microscopic electrical stimulation are being developed. Accordingly, various methods for treating visual disorders by delivering electrical stimulation to the ocular nerves are being proposed.

[0005] Since the above-mentioned neurostimulation device is intended for use on the human body, it contains materials suitable for the human body. Accordingly, the substrate, electrodes, and protective layer all contain materials suitable for the human body.

[0006] The above-described neurostimulation device includes a plurality of pattern electrodes. For example, a first pattern electrode may be arranged on a first surface of the substrate, and a second pattern electrode may be arranged on a second surface. In addition, a chip mounting area may be formed on the second surface.

[0007] The first pattern electrode and the chip mounting area may overlap. In addition, a photosensitive film (dry film resist) may be disposed on the first surface to form the first pattern electrode. Accordingly, the photosensitive film on the first surface that overlaps the chip mounting area and the photosensitive film on the first surface that does not overlap may form a step.

[0008] Accordingly, peeling of the photosensitive film may occur. As a result, a plating layer may be formed in the gap between the first pattern electrodes, thereby forming a pattern electrode. Accordingly, a short circuit of the first pattern electrodes may occur.

[0009] Therefore, a neurostimulation device that can solve the above problems is required.

[0010] As a technology related to the present invention, Korean Patent Publication No. KR10-2018-0125997 is disclosed.

[0011] The embodiment provides a neurostimulation device having improved reliability.

[0012] The technical tasks to be achieved in the proposed embodiment are not limited to the technical tasks mentioned above, and other technical tasks not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the proposed embodiment belongs from the description below.

[0013] A nerve stimulation device according to an embodiment comprises a substrate including a first surface and a second surface opposite to the first surface; a first pattern electrode disposed on the first surface; a second pattern electrode disposed on the second surface; a first protective layer disposed on the first pattern electrode; and a second protective layer disposed on the second pattern electrode, wherein the first pattern electrode includes a plurality of branch electrodes, a merge electrode connecting the plurality of branch electrodes, and a protrusion protruding from the branch electrode or the merge electrode, the protrusion including at least one of a first protrusion connected to the branch electrode and a second protrusion connected to one of the merge electrodes, and a first interval between the branch electrode adjacent to the first protrusion and the first protrusion is 5% to 45% of a second interval between the branch electrodes.

[0014] Additionally, the substrate includes a mounting area where electronic components are placed, and the mounting area does not overlap the first pattern electrode in the thickness direction of the substrate.

[0015] In addition, the line width of the branch electrode is 250 µm to 330 µm, the length of the protrusion is 10 µm to 50 µm, and the second gap is 60 µm to 110 µm.

[0016] Additionally, the sizes of the first protrusion and the second protrusion are different.

[0017] In addition, the substrate includes a mounting area where electronic components are placed, the mounting area does not overlap the branch electrode in the thickness direction of the substrate, and the mounting area overlaps the merge electrode in the thickness direction of the substrate.

[0018] Additionally, the length of the second protrusion is longer than the length of the first protrusion.

[0019] Additionally, the length of the second protrusion is 50% to 100% of the second gap.

[0020] Additionally, the first protrusion overlaps the second protective layer in the thickness direction of the substrate, and the second protrusion does not overlap the second protective layer in the thickness direction of the substrate.

[0021] Additionally, the second pattern electrode is arranged in a closed loop shape.

[0022] In addition, the substrate includes a plurality of vias penetrating the first surface and the second surface, the first pattern electrode and the second pattern electrode are connected by the vias, the first pattern electrode includes a first metal layer and a second metal layer, the first and second metal layers are disposed on the inner surface and the lower surface of the via, and the first protective layer is disposed inside the via.

[0023] Additionally, the thickness of the second pattern electrode is smaller than the thickness of the first pattern electrode.

[0024] In addition, the second pattern electrode includes a plurality of pad portions, a bonding layer is disposed on the pad portions, and the electronic component is disposed on the bonding layer.

[0025] According to another embodiment, a neurostimulation device comprises a substrate including a first surface and a second surface opposite to the first surface; a first pattern electrode on the first surface; a second pattern electrode on the second surface; a first protective layer on the first pattern electrode; and a second protective layer on the second pattern electrode, wherein the substrate includes a plurality of vias, the first pattern electrode and the second pattern electrode are connected by the vias, the first pattern electrode includes a metal layer including a first metal layer and a second metal layer, the metal layer is disposed on an inner surface and a lower surface of the via, and the first protective layer is disposed inside the via, the substrate, the first protective layer, and the second protective layer include a liquid crystal polymer material, and a melting point of the first protective layer is lower than a melting point of the substrate.

[0026] According to another embodiment, a neurostimulation device comprises a substrate including a first surface and a second surface opposite to the first surface; a first pattern electrode on the first surface; a second pattern electrode on the second surface; a bonding layer on the first pattern electrode; a first protective layer on the bonding layer; and a second protective layer on the second pattern electrode, wherein the substrate includes a plurality of vias, the first pattern electrode and the second pattern electrode are connected by the vias, the first pattern electrode includes a metal layer including a first metal layer and a second metal layer, the metal layer is disposed on an inner surface and a lower surface of the via, and the bonding layer is disposed inside the via, the substrate, the first protective layer, and the second protective layer include a liquid crystal polymer material, and the melting point of the bonding layer is lower than the melting points of the substrate, the first protective layer, and the second protective layer.

[0027] Additionally, the melting point of the first protective layer is lower than the melting point of the second protective layer.

[0028] Additionally, the melting point of the first protective layer is 200°C to 280°C.

[0029] Additionally, the melting point of the second protective layer is lower than the melting point of the substrate.

[0030] Additionally, the melting points of the first protective layer and the second protective layer are 200°C to 280°C.

[0031] Additionally, the moisture absorption rate of the bonding layer is 0.04% to 0.08%.

[0032] Additionally, the melting point of the bonding layer is 155°C to 195°C.

[0033] Additionally, the thickness of the first protective layer is greater than the thickness of the bonding layer.

[0034] Additionally, the thickness of the first protective layer is greater than the thickness of at least one of the second protective layer and the substrate.

[0035] Additionally, the first pattern electrode includes a plurality of branch electrodes extending in one direction and a merge electrode connecting the branch electrodes.

[0036] Additionally, the second pattern electrode is arranged in a closed loop shape.

[0037] Additionally, the thickness of the second pattern electrode is smaller than the thickness of the first pattern electrode.

[0038] Additionally, the second pattern electrode includes a plurality of pad portions, and a bonding layer is disposed on the pad portions.

[0039] According to another embodiment, a nerve stimulation device comprises a substrate including a first surface and a second surface opposite to the first surface; a first pattern electrode on the first surface; a second pattern electrode on the second surface; a first protective layer on the first pattern electrode; a second protective layer on the second pattern electrode; an electronic component on the second pattern electrode; and a molding part enclosing the electronic component, wherein the second protective layer includes a plurality of layers, the second protective layer includes a plurality of protective layers disposed on a side surface of the molding part; and a protective layer disposed on an upper surface of the molding part, wherein the protective layers disposed on the side surface of the molding part have a step.

[0040] According to another embodiment, a nerve stimulation device comprises a substrate including a first surface and a second surface opposite to the first surface; a first pattern electrode on the first surface; a second pattern electrode on the second surface; a first protective layer on the first pattern electrode; a second protective layer on the second pattern electrode; an electronic component on the second pattern electrode; and a molding part enclosing the electronic component, wherein the substrate includes a mounting area in which the electronic component is disposed, and the substrate includes a first area overlapping the mounting area and a second area not overlapping the mounting area, and a thickness of the second protective layer on the first area is greater than a thickness of the second protective layer on the second area.

[0041] In addition, the second protective layer includes a 2-1 protective layer to a 2-4 protective layer, and the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer are disposed on a side surface of the molding part, the 2-1 protective layer is disposed on the substrate, the 2-2 protective layer is disposed on the 2-1 Boch layer, and the 2-3 protective layer is disposed on the 2-2 protective layer, and one end of the 2-1 protective layer protrudes more toward the molding part than one end of the 2-2 protective layer and the 2-3 protective layer.

[0042] Additionally, one end of the 2-2 protective layer protrudes toward the molding portion more than one end of the 2-3 protective layer.

[0043] Additionally, one end of the 2-3 protective layer protrudes toward the molding portion more than one end of the 2-2 protective layer.

[0044] Additionally, one end of the 2-3 protective layer protrudes toward the molding portion more than one end of the 2-2 protective layer.

[0045] In addition, the second protective layer includes the 2-1 protective layer to the 2-4 protective layer, and the 2-1 protective layer to the 2-4 protective layer are disposed on the first region, and the 2-1 protective layer is disposed on the second region.

[0046] Additionally, at least one protective layer is further disposed on the second region among the 2-2 protective layer on the 2-1 protective layer and the 2-3 protective layer on the 2-2 protective layer.

[0047] Additionally, the sum of the thicknesses of the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer is greater than or equal to the thickness of the molding portion.

[0048] Additionally, the thickness of the 2-4 protective layer is smaller than the thickness of at least one of the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer.

[0049] Additionally, the mounting area does not overlap with the first pattern electrode in the thickness direction of the substrate.

[0050] Additionally, the moisture absorption rate of the second protective layer is lower than that of the molding portion.

[0051] In addition, the first pattern electrode includes a plurality of branch electrodes extending in one direction and a merge electrode connecting the branch electrodes, and the second pattern electrode is arranged in a closed loop shape.

[0052] Additionally, the substrate includes a plurality of vias, the first pattern electrode and the second pattern electrode are connected by the vias, the first pattern electrode includes a metal layer including a first metal layer and a second metal layer, the metal layer is disposed on an inner surface and a lower surface of the via, and the first protective layer is disposed inside the via.

[0053] A neurostimulation device according to an embodiment includes a first pattern electrode and a second pattern electrode. The first pattern electrode includes a branch electrode and a merge electrode. The first pattern electrode includes a protrusion. The protrusion is connected to at least one of the branch electrode and the merge electrode.

[0054] The size of the protrusion is controlled. Specifically, the size of the protrusion is controlled to be less than the spacing between the branch electrodes. Accordingly, the branch electrodes can be prevented from being connected by contact between the protrusions. Accordingly, the stimulation signal traveling from the branch electrode can be prevented from traveling to other branch electrodes. Consequently, the driving characteristics of the neurostimulation device are improved.

[0055] The strength of the first pattern electrode is enhanced by the protrusion. Accordingly, the first pattern electrode can be prevented from being damaged by stress generated when bending the neurostimulation device. Furthermore, the first pattern electrode can be prevented from being deformed by stress generated when attaching or detaching the neurostimulation device to the face. Consequently, the reliability of the neurostimulation device is enhanced.

[0056] Additionally, the neurostimulation device according to the embodiment includes a first protective layer and a second protective layer. The first protective layer is disposed to fill the interior of the via.

[0057] The melting point of the first protective layer is lower than that of the second protective layer. Accordingly, the first protective layer can be thermo-compression bonded at a low temperature. Accordingly, damage to the metal layer inside the via can be prevented during the process of forming the first protective layer. In addition, since the temperature of the thermo-compression bonding process is lowered, the pressure can be increased. Accordingly, the first protective layer can be sufficiently disposed inside the via. Accordingly, the void area inside the via can be reduced. Accordingly, the reliability of the neurostimulation device is improved.

[0058] Additionally, the neurostimulation device according to the embodiment includes a bonding layer, a first protective layer, and a second protective layer. The bonding layer is disposed to fill the interior of the via. The first protective layer is disposed on the bonding layer.

[0059] The melting point of the bonding layer is lower than the melting points of the first protective layer and the second protective layer. Accordingly, the bonding layer can be thermo-compression bonded at a low temperature. Accordingly, the metal layer inside the via can be prevented from being damaged during the process of forming the bonding layer. In addition, since the temperature of the thermo-compression process is lowered, the pressure can be increased. Accordingly, the bonding layer can be sufficiently disposed inside the via. Accordingly, the void area inside the via can be reduced. Accordingly, the reliability of the neurostimulation device is improved.

[0060] Additionally, the bonding layer has a low moisture absorption rate. Therefore, impurities such as moisture can be prevented from penetrating into the via. Consequently, the reliability of the neurostimulation device is improved.

[0061] In addition, the second protective layer is formed of a plurality of layers. The second protective layer includes the 2-1 protective layer, the 2-2 protective layer, the 2-3 protective layer, and the 2-4 protective layer.

[0062] The above-mentioned 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer are arranged to a thickness equivalent to that of the molding portion protecting the electronic component. In addition, the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer are in contact with the molding portion. Therefore, moisture can be prevented from entering the electronic component.

[0063] Additionally, even if cracks or peeling occur in the molding portion as the neurostimulation device is bent, the electronic component can be protected by the second protective layer.

[0064] Additionally, the 2-4 protective layer is disposed on the 2-3 protective layer and the upper surface of the molding part. Accordingly, the 2nd protective layer is flattened.

[0065] Additionally, the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer may be arranged with steps. Accordingly, the moisture movement path is lengthened. Accordingly, moisture can be prevented from entering the electronic component or the neurostimulation device.

[0066] In addition, the second surface on which the electronic component is placed may include a first region and a second region. The first region is a region overlapping the mounting region. The second region is a region not overlapping the mounting region. The 2-1 protective layer, the 2-2 protective layer, the 2-3 protective layer, and the 2-4 protective layer are placed on the first region. At least one of the 2-2 protective layer, the 2-3 protective layer, and the 2-4 protective layer is not placed on the second region.

[0067] Accordingly, the thickness of the protective layer on the second region becomes thinner. Accordingly, the reception efficiency of the second pattern electrode can be improved.

[0068] Figure 1 is a drawing illustrating an example of use of a neurostimulation device according to an embodiment.

[0069] FIG. 2 is a drawing illustrating an assembly including a neurostimulation device according to an embodiment.

[0070] Figures 3 and 4 are top views of a neurostimulation device according to an embodiment.

[0071] Figures 5 and 6 are bottom views of a neurostimulation device according to an embodiment.

[0072] Fig. 7 is a cross-sectional view taken along the AA' area of ​​Fig. 6 according to the first embodiment.

[0073] Fig. 8 is a cross-sectional view taken along the BB' area of ​​Fig. 6 according to the first embodiment.

[0074] FIG. 9 is an enlarged view of area A of FIG. 3 according to the first embodiment.

[0075] Fig. 10 is a cross-sectional view taken along the DD' area of ​​Fig. 9 according to the first embodiment.

[0076] Fig. 11 is another top view of a neurostimulation device according to the first embodiment.

[0077] Figure 12 is a cross-sectional view taken along the EE' area of ​​Figure 11.

[0078] Figure 13 is an enlarged view of area B of Figure 11.

[0079] Figures 14 to 19 are drawings for explaining a method for manufacturing a neurostimulation device according to the first embodiment.

[0080] Figures 20 to 24 are drawings for explaining a method for manufacturing a neurostimulation device according to the second embodiment.

[0081] Figure 25 is a drawing showing a photograph of a neurostimulation device according to the second embodiment.

[0082] Fig. 26 is a cross-sectional view taken along the BB' area of ​​Fig. 6 according to the second embodiment.

[0083] Figure 27 is a drawing showing a photograph of a neurostimulation device according to Figure 26.

[0084] Fig. 28 is a cross-sectional view taken along the AA' area of ​​Fig. 6 according to the third embodiment.

[0085] Figures 29 to 31 are cross-sectional views taken along the BB' area of ​​Figure 6 according to the third embodiment.

[0086] FIG. 32 and FIG. 33 are other cross-sectional views taken along the AA' area of ​​FIG. 6 according to the third embodiment.

[0087] Figures 34 to 40 are drawings for explaining a method for manufacturing a neurostimulation device according to the third embodiment.

[0088] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to the described embodiments, but may be implemented in various different forms. Within the scope of the technical concept of the present invention, one or more of the components of the embodiments may be selectively combined or substituted for use.

[0089] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0090] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and / or at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0091] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0092] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0093] Additionally, when it is described as being formed or disposed "above or below" each component, above or below includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or disposed between the two components.

[0094] Additionally, when expressed as “upper or lower,” it can include the meaning of not only the upward direction but also the downward direction based on one component.

[0095]

[0096] Hereinafter, a neurostimulation device according to an embodiment will be described with reference to the drawings.

[0097]

[0098] Hereinafter, a neurostimulation device according to an embodiment will be described with reference to the drawings.

[0099] Referring to FIG. 1, the neurostimulation device (1000) is applied to the human body. For example, the neurostimulation device (1000) is attached to the area around the eyes of the human body. For example, the neurostimulation device (1000) may be attached below the eyes.

[0100] Accordingly, the neurostimulation device (1000) transmits stimulation to the eye nerves. Accordingly, ocular diseases can be alleviated or treated. For example, dry eye, ocular inflammation, or decreased vision can be alleviated or treated.

[0101]

[0102] FIG. 2 is a drawing illustrating an assembly (10) including a plurality of neurostimulation devices (1000). Referring to FIG. 2, the neurostimulation devices (1000) can be manufactured at a panel level. Specifically, a plurality of unit areas (UN) are formed on a large-area substrate (100). Subsequently, a plurality of neurostimulation devices (1000) can be formed in each unit area (UN). Accordingly, a plurality of neurostimulation devices (1000) can be manufactured in a single process. Therefore, process efficiency is improved.

[0103]

[0104] Referring to FIGS. 3 to 13, a neurostimulation device (1000) according to an embodiment is described.

[0105] The above-mentioned nerve stimulation device (1000) includes a substrate (100), a pattern electrode (210, 220), and a protective layer (410, 420).

[0106] The above-described substrate (100) may include a flexible material. The shape of each person's face varies. Accordingly, since the substrate (100) includes a flexible material, the neurostimulation device (1000) may also be flexible. Accordingly, the neurostimulation device (1000) can be easily bent to fit the shape of a person's face. Therefore, the nerves of the eye can be stimulated through the neurostimulation device (1000).

[0107] The above substrate (100) may have insulating properties. Accordingly, the pattern electrodes (210, 220) arranged on one side and the other side of the substrate (100) may be insulated from each other.

[0108] The substrate (100) may include a resin material. For example, the substrate (100) may include a thermoplastic resin. In addition, the substrate (100) may include a material having a low water absorption rate. For example, the water absorption rate of the substrate (100) may be 0.02% to 0.05%.

[0109] For example, the substrate (100) may include a liquid crystal polymer (LCP) or polyamide. The neurostimulation device (1000) comes into contact with the human skin. The substrate (100) includes a resin material that is harmless to the human body. Therefore, when using the neurostimulation device, adverse effects that may occur in the human body can be prevented.

[0110] The substrate (100) may be formed as a single layer or multiple layers. For example, the substrate (100) may be formed as a single layer. Alternatively, the substrate (100) may be formed as multiple layers. For example, the substrate (100) may be formed by laminating multiple layers of the same material. Alternatively, the substrate (100) may be formed by laminating multiple layers of multiple materials. The neurostimulation device (1000) may have different sizes depending on the age of use. Since the substrate (100) is formed as a single layer or multiple layers, the neurostimulation device (1000) may be formed in various thicknesses. Accordingly, the neurostimulation device (1000) may be formed in various sizes depending on the intended use.

[0111] For example, the substrate (100) may have a thickness within a set range. Specifically, the thickness of the substrate (100) may be 15 µm to 80 µm, 18 µm to 50 µm, or 20 µm to 30 µm.

[0112] If the thickness of the substrate (100) is less than 15 ㎛, the strength of the substrate (100) decreases. An electronic component (600) is placed on the substrate (100). At this time, heat and pressure are generated. Therefore, the substrate (100) may be damaged. In addition, the substrate (100) may be vulnerable to impact when handling the substrate (100). In addition, if the thickness of the substrate (100) exceeds 80 ㎛, the process efficiency may decrease. A plurality of vias are formed on the substrate (100). If the thickness of the substrate (100) increases, the process time for forming the vias and the process time for filling the interior of the vias with a protective layer may increase. In addition, the flexible characteristics of the neurostimulation device may decrease. Accordingly, a gap may be formed between the neurostimulation device and the human skin, which may decrease the efficiency of the neurostimulation device.

[0113] The above substrate (100) may include at least one via (V). For example, the above substrate (100) may include a plurality of vias (V). The pattern electrodes (210, 220) are electrically connected through the vias (V).

[0114] The above via (V) is formed with a set width. For example, the maximum width of the above via (V) may be 100 ㎛ to 200 ㎛, 120 ㎛ to 180 ㎛, or 140 ㎛ to 160 ㎛.

[0115] The width of the above via (V) is related to the thickness of the above substrate (100). For example, the width of the above via (V) is proportional to the thickness of the above substrate (100).

[0116] If the width of the via (V) is less than 100 ㎛, the thickness of the substrate (100) may become thinner. Accordingly, the strength of the substrate (100) may decrease, and thus the reliability of the neurostimulation device (1000) may decrease. If the width of the via (V) exceeds 200 ㎛, the thickness of the substrate (100) may become thicker. Accordingly, the process efficiency and flexible characteristics of the neurostimulation device may decrease.

[0117]

[0118] The above description includes a first side (1S) and a second side (2S) opposite to the first side (1S).

[0119] The above pattern electrode is placed on the substrate (100). The above pattern electrode may include a first pattern electrode (210) and a second pattern electrode (220).

[0120] The first pattern electrode (210) is disposed on the first surface (1S). The first pattern electrode (210) may include at least one pattern electrode. For example, the first pattern electrode (210) may include a plurality of pattern electrodes (PE) spaced apart from each other. The plurality of pattern electrodes may be electrically connected through vias.

[0121] The first pattern electrode (210) includes a metal. In detail, the first pattern electrode (210) includes a first metal layer (211) and a second metal layer (212).

[0122] The first metal layer (211) is disposed on the substrate (100). The first metal layer (211) is in direct contact with the substrate (100). The first metal layer (211) is disposed inside the via (V). Specifically, the first metal layer (211) is disposed on the inner surface and the lower surface of the via (V). The first metal layer (211) includes a material having good adhesion to the substrate (100). For example, the first metal layer (211) may include titanium (Ti).

[0123] The second metal layer (212) is disposed on the first metal layer (211). The second metal layer (212) is disposed inside the via (V). In detail, the second metal layer (212) is disposed on the inner surface and the lower surface of the via (V).

[0124] The first pattern electrode (210) faces the human skin. Specifically, the nerves of the eye can be stimulated through the first pattern electrode (210). For example, the first pattern electrode (210) may be a stimulus transmission electrode. Accordingly, the second metal layer (212) may include a material with good conductivity. In addition, the second metal layer (212) may be in contact with the human skin. Accordingly, the first-second metal (212) may include a metal that is harmless to the human body. For example, the second metal layer (212) may include gold (Au), silver (Ag), or iridium (Ir).

[0125] The thicknesses of the first metal layer (211) and the second metal layer (212) are different. Specifically, the thickness of the second metal layer (212) is greater than the thickness of the first metal layer (211).

[0126] For example, the thickness of the first metal layer (211) may be 10 nm to 40 nm, 20 nm to 38 nm, or 25 nm to 35 nm. When the thickness of the first metal layer (211) is less than 10 nm, the bonding strength of the second metal layer (212) may decrease. Accordingly, a loss of stimulation transmitted to the human eye may occur. When the thickness of the first metal layer (211) exceeds 40 nm, the thickness of the first metal layer (211) may increase unnecessarily. Accordingly, process efficiency may decrease.

[0127] The thickness of the second metal layer (212) may be 35 µm to 65 µm, 35 µm to 60 µm, or 45 µm to 55 µm. When the thickness of the second metal layer (212) is less than 35 µm, the conductivity of the second metal layer (212) may decrease. Accordingly, the intensity of the stimulus transmitted to the human eye may decrease. When the thickness of the second metal layer (212) exceeds 6 µm, the process cost may increase. In addition, the thickness of the second metal layer (212) may increase unnecessarily. Accordingly, the process efficiency may decrease.

[0128]

[0129] The first pattern electrode (210) may be formed in various shapes. For example, the first pattern electrode (210) may include a plurality of branch electrodes (E1) extending in one direction. The branch electrodes (E1) may be spaced apart from each other. Additionally, the branch electrodes (E1) may be connected by a merge electrode (E2).

[0130] The stimulation transmission area of ​​the first pattern electrode (210) can be increased by the branch electrodes. Furthermore, the stimulation transmitted by the first pattern electrode (210) can be uniformly distributed across different locations. That is, since the stimulation is transmitted by multiple branch electrodes, the stimulation can be prevented from being concentrated in a single area. Consequently, the stimulation transmission efficiency of the neurostimulation device can be increased.

[0131] Additionally, stimulation can be applied to only some of the branch electrodes. Accordingly, the location of the transmitted stimulation can be controlled according to the user's needs.

[0132]

[0133] The second pattern electrode (220) is disposed on the second surface. The first pattern electrode (210) and the second pattern electrode (220) are electrically connected through the via (V).

[0134] The second pattern electrode (220) may be formed in a closed loop shape. For example, the second pattern electrode (220) may be formed in a closed loop shape that is wound one or more times.

[0135] The second pattern electrode (220) can receive electromagnetic energy from an external wireless device. In addition, the second pattern electrode (220) can use the electromagnetic energy to generate power required for the electronic component (600). For example, the second pattern electrode (220) can be an antenna electrode.

[0136] The second pattern electrode (220) includes a metal. For example, the second pattern electrode (220) may include copper (Cu).

[0137] The second pattern electrode (220) overlapping the via (V) is in contact with the first metal layer (211) inside the via (V). Accordingly, the first pattern electrode (210) and the second pattern electrode (220) are electrically connected.

[0138] The thicknesses of the first pattern electrode (210) and the second pattern electrode (220) are different. In detail, the thickness of the second pattern electrode (220) may be smaller than the thickness of the first pattern electrode (210).

[0139] For example, the thickness of the second pattern electrode (220) may be 7 µm to 20 µm, 9 µm to 16 µm, or 11 µm to 13 µm. When the thickness of the second pattern electrode (220) is less than 7 µm, the conductivity of the second pattern electrode (220) may decrease. Accordingly, the reception efficiency of electromagnetic energy through the second pattern electrode may decrease. When the thickness of the second pattern electrode (220) exceeds 20 µm, the process cost may increase. In addition, the thickness of the second pattern electrode (220) may unnecessarily increase. Accordingly, the process efficiency and flexible characteristics may decrease.

[0140] The second pattern electrode (220) includes a plurality of pad portions (300). The electronic component (600) is placed on the second surface (2S). The electronic component (600) is connected to the second pattern electrode (220) by the pad portions (300).

[0141] The above-mentioned substrate (100) includes a mounting area (MR). The electronic component (600) is placed on the mounting area (MR). The electronic component (600) is placed on the second surface (2S).

[0142] The above electronic component (600) is placed using heat and pressure. Since the mounting area (MR) and the first pattern electrode (210) do not overlap, the first pattern electrode (210) can be prevented from being damaged when the electronic component (600) is mounted.

[0143] A bonding layer (250) may be disposed on the pad portion (300). The bonding layer (250) may be formed by plating a metal layer on the pad portion (300). The bonding layer (250) may include a first layer on the pad portion (300) and a second layer on the first layer. The first layer may include nickel (Ni). The first layer may be disposed to a thickness of 0.5 μm to 1.5 μm. The second layer may include gold, platinum, or iridium. The second layer may be disposed to a thickness of 0.03 μm to 0.08 μm.

[0144] Solder is placed between the bonding layer (250) and the electronic component (600), and the electronic component (600) and the second pattern electrode (220) can be connected by the solder. Accordingly, electromagnetic energy received by the second pattern electrode (220) can be transmitted to the electronic component (600).

[0145] A protective layer is disposed on the above substrate (100). The protective layer includes a first protective layer (410) and a second protective layer (420). The first protective layer (410) is disposed on the first surface (1S). The first protective layer (410) surrounds the first pattern electrode (210). In addition, the first protective layer (410) is disposed inside the via (V). The via (V) is filled with the first protective layer (410).

[0146] The second protective layer (420) is disposed on the second surface (2S). The second protective layer (420) surrounds the second pattern electrode (220). The second protective layer (420) is not disposed on the mounting area (MR). Accordingly, the pad portion (300) is exposed to the outside. Accordingly, the electronic component (600) can be connected to the pad portion (300).

[0147] At least one of the first protective layer (410) and the second protective layer (420) may include a resin material. For example, at least one of the first protective layer (410) and the second protective layer (420) may include a thermoplastic resin. In addition, at least one of the first protective layer (410) and the second protective layer (420) may include a material having a low water absorption rate. For example, the water absorption rate of at least one of the first protective layer (410) and the second protective layer (420) may be 0.02% to 0.05%.

[0148] For example, at least one of the first protective layer (410) and the second protective layer (420) may include a liquid crystal polymer (LCP) or polyamide. The neurostimulation device (1000) comes into contact with the human skin. The protective layers (410, 420) include a resin material that is harmless to the human body. Therefore, when using the neurostimulation device, side effects that may occur in the human body can be prevented.

[0149] For example, the first protective layer (410) and the second protective layer (420) may include the same material as the substrate (100). For example, the substrate (100), the first protective layer (410), and the second protective layer (420) may include a liquid crystal polymer (LCP).

[0150] Referring to FIGS. 9 and 10, the first pattern electrode (210) may include a protrusion (215). In detail, the first pattern electrode (210) may include at least one protrusion (215). The protrusion (215) may extend from a side surface of one first pattern electrode (210) toward a side surface of another first pattern electrode (210).

[0151] The thickness of the protrusion (215) and the thickness of the first pattern electrode (210) may be different. In detail, the thickness of the protrusion (215) may be smaller than the thickness of the first pattern electrode (210).

[0152] The above protrusion (215) may be formed during the process of forming the first pattern electrode (210). The first pattern electrode (210) is formed after the second pattern electrode (220) is formed. For example, the process of forming the first pattern electrode (210) may be as follows.

[0153] First, the first metal layer (211) and the second metal layer (212) are placed on the first surface (1S). For example, the first metal layer (211) and the second metal layer (212) are formed by a sputtering process.

[0154] Next, a photosensitive material is placed on the second metal layer (212). Next, the photosensitive pattern is formed through an exposure process. Next, the second metal layer (212) is electroplated. Next, the photosensitive pattern and the first metal layer (211) underneath the photosensitive pattern are etched.

[0155] At this time, the adhesion of the photosensitive material may vary from region to region. Accordingly, after forming the photosensitive pattern, some regions of the photosensitive pattern may be peeled off. Accordingly, the second metal layer (212) may be electroplated in an undesired region. As a result, the protrusion (215) may be formed. In addition, since the photosensitive pattern is arranged on the region where the protrusion (215) is formed, the thickness of the protrusion (215) may be smaller than the thickness of the first pattern electrode (210).

[0156] The strength of the first pattern electrode (210) can be enhanced by the protrusion (215). For example, the stress generated when the neurostimulation device is bent can be distributed in the direction of the protrusion (215), thereby preventing cracks in the branch electrode (E1). In addition, when the neurostimulation device is attached to and detached from the eye, deformation of the first pattern electrode (210) can be prevented by the protrusion (215).

[0157] However, if the size of the protrusion (215) increases, the protrusion (215) may come into contact with an adjacent pattern electrode (PE). Alternatively, the protrusions of adjacent pattern electrodes (PE) may come into contact. Accordingly, adjacent branch electrodes (E1) may be connected. Accordingly, a large stimulus may be generated from one branch electrode. Alternatively, when dividing the stimulus from multiple branch electrodes and delivering the stimulus only to a desired location, the stimulus may be delivered to an undesired location.

[0158] Accordingly, the size of the protrusion (215) can be controlled. In detail, the first pattern electrode (210) includes a first gap (S1) and a second gap (S2). The first gap (S1) is the gap between the branch electrode (E1) adjacent to the protrusion and the protrusion (215). The second gap (S2) is the gap between adjacent branch electrodes.

[0159] The first interval (S1) may be less than 50% of the second interval (S2). In detail, the first interval (S1) may be 5% to 45%, 10% to 43%, or 15% to 40% of the second interval (S2).

[0160] For example, the line width (W) of the branch electrode (E1) may be 250 μm to 330 μm. In addition, the length (L) of the protrusion (215) may be 10 μm to 50 μm. In addition, the second spacing (S2) may be 60 μm to 110 μm.

[0161] If the first gap (S1) is 50% or more of the second gap (S2), the protrusions of the branch electrodes may come into contact with each other. Accordingly, adjacent branch electrodes may be connected, resulting in a defect.

[0162] If the first interval (S1) is less than 5% of the second interval (S2), the intensity of the branch electrode may decrease. Accordingly, damage or deformation of the first pattern electrode may occur when using the neurostimulation device.

[0163] The above first gap (S1) can be controlled by the position of the mounting area (MR). The mounting area (MR) does not overlap with the first pattern electrode (210). Specifically, the mounting area (MR) and the first pattern electrode (210) do not overlap in the thickness direction of the substrate (100).

[0164] The above protrusion (215) is caused by a decrease in the adhesion of the photosensitive material. When the mounting area (MR) overlaps the first pattern electrode (210), a step may be formed in the photosensitive material. The second protective layer (420) is not disposed in the mounting area (MR). Therefore, a step is formed in the second surface (2S) by the second protective layer (420). Accordingly, the adhesion of the photosensitive material disposed in the area corresponding to the mounting area (MR) may be lower than the adhesion of the photosensitive material disposed in another area due to the step.

[0165] Accordingly, the mounting area (MR) does not overlap with the first pattern electrode (210). Accordingly, it is possible to prevent the adhesion of the photosensitive material from decreasing in the area where the first pattern electrode (210) is placed. As a result, it is possible to prevent the size of the protrusion (215) from increasing.

[0166] Alternatively, the first gap (S1) can be controlled by the manufacturing process of the neurostimulation device. The mounting area (MR) can overlap with the first pattern electrode (210). A bonding material can be placed on the second protective layer (420). Accordingly, the step caused by the second protective layer (420) can be eliminated. As a result, the size of the protrusion (215) can be prevented from increasing.

[0167]

[0168] Referring to FIGS. 11 to 13, the protrusion may include a first protrusion (215a) and a second protrusion (215b). The first protrusion (215a) is connected to the branch electrode (E1). At least one first protrusion (215a) may be connected to the branch electrode (E1). The first protrusion (215a) may overlap the second protective layer (420) in the thickness direction of the substrate (100).

[0169] The second protrusion (215b) is connected to the merge electrode (E2). At least one second protrusion (215b) can be connected to the merge electrode (E2). The second protrusion (215b) extends in the direction of the adjacent merge electrode.

[0170] A portion of the above-mentioned combined electrode (E2) may overlap with the second protective layer (420) in the thickness direction of the substrate (100). In addition, the second protrusion (215b) may not overlap with the second protective layer (420) in the thickness direction of the substrate (100).

[0171] The above-mentioned mounting region (MR) may overlap with the first pattern electrode (210). Specifically, the above-mentioned mounting region (MR) does not overlap with the branch electrode (E1). In addition, the above-mentioned mounting region (MR) overlaps with the above-mentioned merged electrode (E2). Specifically, the above-mentioned mounting region (MR) overlaps with a portion of the above-mentioned merged electrode (E2).

[0172] Accordingly, the sizes of the first protrusion (215a) and the second protrusion (215b) may vary. Specifically, the second protrusion (215b) may be larger than the first protrusion (215a). Specifically, the length (L2) of the second protrusion (215b) may be longer than the length (L1) of the first protrusion (215a).

[0173] The size of the first protrusion (215a) can be controlled. In detail, the size of the first protrusion (215a) can be controlled to be the same as the size of the protrusion (215) described above.

[0174] The size of the second protrusion (215b) can be controlled. Specifically, the length (L2) of the second protrusion (215b) can be 50% or more of the second interval (S2). Specifically, the length (L2) of the second protrusion (215b) can be 50% to 100%, 60% to 90%, or 70% to 80% of the second interval (S2).

[0175] For example, the line width of the branch electrode (E1) may be 250 μm to 330 μm. In addition, the length (L) of the protrusion (215) may be 10 μm to 50 μm. In addition, the second spacing (S2) may be 60 μm to 110 μm.

[0176] The size of the second protrusion (215b) can be controlled by the position of the mounting area (MR). Specifically, the size of the second protrusion (215b) can be controlled by the size of the overlapping area between the second protrusion (215b) and the mounting area (MR). Specifically, when the size of the overlapping area increases, the second protrusion (215b) increases, and when the size of the overlapping area decreases, the size of the second protrusion (215b) decreases.

[0177] Since the above-mentioned mounting area overlaps with a portion of the above-mentioned merged electrode, the gap between the pattern electrodes of the first pattern electrode can be prevented from widening to form the above-mentioned mounting area. Accordingly, the size of the neurostimulation device can be reduced.

[0178] Additionally, the strength of the combined electrode can be enhanced by the second protrusion. Accordingly, damage to the combined electrode can be prevented when the neurostimulation device is bent. Furthermore, deformation of the combined electrode can be prevented when attaching or detaching the neurostimulation device. Consequently, the reliability of the neurostimulation device is enhanced.

[0179]

[0180] Hereinafter, a method for manufacturing a neurostimulation device according to an embodiment will be described with reference to FIGS. 14 to 19.

[0181] Referring to Fig. 14, a substrate (100) is prepared. The substrate (100) comprises the resin material described above. A metal layer is disposed on the substrate (100). Specifically, copper is disposed on the second surface (2S). Subsequently, the metal layer is patterned. Accordingly, a second pattern electrode (220) is formed on the second surface (2S).

[0182] Referring to Fig. 15, a second protective layer (420) is disposed on the second surface (2S). The second protective layer (420) is disposed on the second pattern electrode (220). The second protective layer (420) is disposed to fill the area between the second pattern electrodes (220). The second protective layer (420) is not disposed on the pad portion (300). Accordingly, a step is formed on the second surface (2S) by the second protective layer (420). The second pattern electrode (220) is protected by the second protective layer (420).

[0183] The above pad portion (300) is connected to the electronic component (600). Accordingly, the bonding layer (250) is arranged on the pad portion (300).

[0184] Referring to FIGS. 16 and 17, a seed layer (SD) is disposed on the first surface (1S). The seed layer includes the first metal layer and the second metal layer described above. A photosensitive material (M) is disposed on the seed layer (SD). Subsequently, the photosensitive material (M) is patterned. Subsequently, the seed layer (SD) between the photosensitive patterns (MP) is electroplated to form a plating layer (EL).

[0185] Referring to Fig. 16, a bonding layer (800) may be placed on the second surface (2S). The bonding layer (800) may be placed to fill the interior of the mounting area (MR). The step of the second surface (2S) may be eliminated by the bonding layer (800).

[0186] The above-mentioned bonding layer (800) may be selectively arranged. For example, when the first pattern electrode (210) and the mounting area (MR) overlap, the bonding layer (800) may be arranged. Additionally, when the first pattern electrode (210) and the mounting area (MR) do not overlap, the bonding layer (800) may not be arranged.

[0187] Referring to Fig. 18, the photosensitive pattern is etched. In addition, the seed layer under the photosensitive pattern is etched. Accordingly, a first pattern electrode (210) is formed on the first surface (1S). In addition, when the temporary bonding layer (800) is disposed, the temporary bonding layer (800) is removed.

[0188] The first metal layer (211) and the second metal layer (212) are also disposed inside the via (V). In detail, the first metal layer (211) is disposed on the inner surface and the lower surface of the via (V). In addition, the second metal layer (212) is disposed on the first metal layer (211).

[0189] Referring to Fig. 19 (a cross-sectional view taken along the CC' region of Fig. 6), a first protective layer (410) is disposed on the first surface (1S). The first protective layer (420) is disposed on the first pattern electrode (210). The first protective layer (410) is disposed to fill the area between the first pattern electrodes (210).

[0190] The first protective layer (410) is arranged to fill the interior of the via (V). Specifically, after aligning the first protective layer (410) on the first surface (1S), the first protective layer (410) can be thermally compressed. Accordingly, the interior of the via (V) is filled with the first protective layer (410). Accordingly, impurities such as moisture can be prevented from entering the interior of the neurostimulation device through the via.

[0191] Next, the electronic component (600) is placed. Specifically, after aligning the terminal portion of the electronic component (600) and the pad portion (300), the terminal and the pad portion (300) are joined using solder. Next, a molding portion (700) is placed on the electronic component (600). The molding portion (700) surrounds the electronic component (600). Accordingly, impurities such as moisture can be prevented from entering the interior of the electronic component.

[0192]

[0193] A neurostimulation device according to an embodiment includes a first pattern electrode and a second pattern electrode. The first pattern electrode includes a branch electrode and a merge electrode. The first pattern electrode includes a protrusion. The protrusion is connected to at least one of the branch electrode and the merge electrode.

[0194] The size of the protrusion is controlled. Specifically, the size of the protrusion is controlled to be less than the spacing between the branch electrodes. Accordingly, the branch electrodes can be prevented from being connected by contact between the protrusions. Accordingly, the stimulation signal traveling from the branch electrode can be prevented from traveling to other branch electrodes. Consequently, the driving characteristics of the neurostimulation device are improved.

[0195] The strength of the first pattern electrode is enhanced by the protrusion. Accordingly, the first pattern electrode can be prevented from being damaged by stress generated when bending the neurostimulation device. Furthermore, the first pattern electrode can be prevented from being deformed by stress generated when attaching or detaching the neurostimulation device to the face. Consequently, the reliability of the neurostimulation device is enhanced.

[0196]

[0197] A method for manufacturing a neurostimulation device according to a second embodiment is described with reference to FIGS. 20 to 24.

[0198] Referring to FIG. 20, a substrate (100) is prepared. The substrate (100) comprises the resin material described above. A metal layer is disposed on the substrate (100). Specifically, copper is disposed on the second surface (2S). Subsequently, the metal layer is patterned. Accordingly, a second pattern electrode (220) is formed on the second surface (2S).

[0199] Referring to Fig. 21, a second protective layer (420) is disposed on the second surface (2S). The second protective layer (420) is disposed on the second pattern electrode (220). The second protective layer (420) is disposed to fill the area between the second pattern electrodes (220). The second protective layer (420) is not disposed on the pad portion (300). The second pattern electrode (220) is protected by the second protective layer (420).

[0200] The above pad portion (300) is connected to the electronic component (600). Accordingly, the bonding layer (250) is arranged on the pad portion (300).

[0201] Referring to Fig. 22, a metal layer is disposed on the first surface (1S). Specifically, the first metal layer (211) and the second metal layer (212) are disposed on the first surface (1S). Subsequently, the metal layer is patterned. Accordingly, a first pattern electrode (210) is formed on the first surface (1S).

[0202] The first metal layer (211) and the second metal layer (212) are also disposed inside the via (V). In detail, the first metal layer (211) is disposed on the inner surface and the lower surface of the via (V). In addition, the second metal layer (212) is disposed on the first metal layer (211).

[0203] Referring to FIGS. 23 and 24 (cross-sectional views taken along the CC' region of FIG. 6), a first protective layer (410) is disposed on the first surface (1S). The first protective layer (420) is disposed on the first pattern electrode (210). The first protective layer (410) is disposed to fill the area between the first pattern electrodes (210).

[0204] The first protective layer (410) is arranged to fill the interior of the via (V). Specifically, after aligning the first protective layer (410) on the first surface (1S), the first protective layer (410) can be thermally compressed. Accordingly, the interior of the via (V) is filled with the first protective layer (410). Accordingly, impurities such as moisture can be prevented from entering the interior of the neurostimulation device through the via.

[0205] Next, the electronic component (600) is placed. Specifically, after aligning the terminal portion of the electronic component (600) and the pad portion (300), the terminal and the pad portion (300) are joined using solder. Next, a molding portion (700) is placed on the electronic component (600). The molding portion (700) surrounds the electronic component (600). Accordingly, impurities such as moisture can be prevented from entering the interior of the electronic component.

[0206] At this time, the first metal layer (211) and the second metal layer (212) are disposed inside the via (V). The first metal layer (211) and the second metal layer (212) are disposed on the inner surface and the lower surface of the via. Accordingly, a void area (AG) is formed inside the via (V). Accordingly, impurities such as moisture may flow into the inside of the neurostimulation device through the void area (AG). In detail, the neurostimulation device is attached to the skin under the eyes of a person. Accordingly, human sweat or human tears may flow into the inside of the neurostimulation device through the void area.

[0207] Accordingly, a first protective layer (410) is disposed on the first pattern electrode (210). Since the first protective layer (410) is disposed to fill the interior of the via (V), the inflow of impurities through the via (V) can be prevented.

[0208] However, as shown in FIG. 2, the neurostimulation device is manufactured at the panel level. Accordingly, the first protective layer (410) may not be disposed inside the via of some neurostimulation devices. Alternatively, the first protective layer (410) may not be disposed in a sufficient amount inside the via. Accordingly, the area of ​​the void region remaining inside the via (V) may increase.

[0209] In addition, the first protective layer (410) is formed by a thermocompression process. The thermocompression process is performed under a set amount of heat and pressure. Accordingly, the thermocompression process is performed at a temperature higher than the melting point of the first protective layer. When the melting point of the first protective layer is high, the thermocompression process is performed at a high temperature. In addition, the first protective layer is also disposed inside the via. Therefore, the pressure may be greater than that in the process of forming the second protective layer. Accordingly, the metal layer inside the via may be damaged by the high temperature and high pressure. Accordingly, cracks may occur in the metal layer. Accordingly, the reliability of the neurostimulation device may be reduced.

[0210] The embodiment can solve the above problem by adding a material or bonding layer to the first protective layer (410).

[0211] Referring to FIG. 8 and FIG. 25, a protective layer is disposed on the substrate (100). Specifically, the first protective layer (410) is disposed on the first surface (1S). The first protective layer (410) surrounds the first pattern electrode (210). In addition, the first protective layer (410) is disposed inside the via (V).

[0212] The second protective layer (420) is disposed on the second surface (2S). The second protective layer (420) surrounds the second pattern electrode (220).

[0213] The first protective layer (410) may include a different material from the second protective layer (420). The first protective layer (410) and the second protective layer (420) may have different physical properties. For example, the first protective layer (410) and the second protective layer (420) may include liquid crystal polymer materials having different physical properties. For example, the first protective layer (410) may include a CTF type liquid crystal polymer material. In addition, the second protective layer (420) may include a CTQ type liquid crystal polymer material.

[0214] The first protective layer (410) may include a different material from the substrate (100). The first protective layer (410) and the substrate (100) may have different physical properties.

[0215] The melting point of the first protective layer (410) may be different from the melting point of the second protective layer (420). In detail, the melting point of the first protective layer (410) may be lower than the melting point of the second protective layer (420).

[0216] Additionally, the melting point of the first protective layer (410) may be different from the melting point of the substrate (100). In detail, the melting point of the first protective layer (410) may be lower than the melting point of the substrate (100).

[0217] Additionally, the melting point of the second protective layer (420) may be the same as or similar to the melting point of the substrate (100). For example, the second protective layer (420) and the substrate (100) may include the same or similar materials. For example, the physical properties of the second protective layer (420) and the physical properties of the substrate (100) may be the same or similar.

[0218] In detail, the melting point of the first protective layer (410) may be 200°C to 280°C, 230°C to 275°C, or 250°C to 270°C. In addition, the melting point of the second protective layer (410) may be 290°C to 350°C, 295°C to 330°C, or 300°C to 310°C. In addition, the melting point of the substrate (100) may be 290°C to 350°C, 295°C to 330°C, or 300°C to 310°C.

[0219] The melting point of the first protective layer (410) is lower than the melting point of the second protective layer (420). Accordingly, the thermocompression process for forming the first protective layer (410) can be performed at a low temperature. Accordingly, the metal layer inside the via (V) can be prevented from being damaged during the process of forming the first protective layer (410). Accordingly, the reliability of the neurostimulation device can be improved. However, the embodiment is not limited thereto.

[0220] The first protective layer (410) and the second protective layer (420) may include the same or similar materials. In detail, the first protective layer (410) and the second protective layer (420) may have the same or similar physical properties. Accordingly, the melting points of the first protective layer (410) and the second protective layer (420) may be the same or similar.

[0221] Additionally, the first protective layer (410) and the second protective layer (420) may include a different material from the substrate (100). The first protective layer (410) and the second protective layer (420) may have different physical properties from the substrate (100).

[0222] Therefore, the melting points of the first protective layer (410) and the second protective layer (420) may be different from the melting point of the substrate (100). For example, the melting points of the first protective layer (410) and the second protective layer (420) may be lower than the melting point of the substrate (100).

[0223] In detail, the melting points of the first protective layer (410) and the second protective layer (420) may be 200°C to 280°C, 230°C to 275°C, or 250°C to 270°C. In addition, the melting point of the substrate (100) may be 290°C to 350°C, 295°C to 330°C, or 300°C to 310°C.

[0224] The melting point of the first protective layer (410) is lower than the melting point of the substrate (100). Accordingly, the thermocompression process for forming the first protective layer (410) can be performed at a low temperature. Accordingly, the metal layer inside the via (V) can be prevented from being damaged during the process of forming the first protective layer (410). Accordingly, the reliability of the neurostimulation device can be improved.

[0225] In addition, the first protective layer (410) and the second protective layer (420) include the same or similar materials. Accordingly, the first protective layer (410) and the second protective layer (420) have the same or similar melting points. Therefore, the thermocompression process of the first protective layer (410) and the second protective layer (420) can be performed simultaneously. Alternatively, the thermocompression process of the first protective layer (410) and the second protective layer (420) can be performed on the same equipment. Therefore, the process efficiency of the neurostimulation device can be improved.

[0226] The first protective layer (410) and the second protective layer (420) have set thicknesses. The thickness of the first protective layer (410) may be greater than the thickness of the substrate (100). In addition, the thickness of the first protective layer (410) may be greater than the thickness of the second protective layer (420).

[0227] For example, the thickness of the first protective layer (410) may be 35 µm to 100 µm, 40 µm to 90 µm, or 45 µm to 80 µm. The thickness of the first protective layer (410) is defined as the distance from the first surface (1S) to the upper surface of the first protective layer (410).

[0228] If the thickness of the first protective layer (410) is less than 35 μm, the first protective layer (410) does not sufficiently penetrate into the interior of the via (V). Accordingly, the void area of ​​the via (V) increases, thereby reducing the reliability of the neurostimulation device. If the thickness of the first protective layer (410) exceeds 100 μm, the thickness of the neurostimulation device increases, which may make it uncomfortable for the user to use the neurostimulation device. For example, when the neurostimulation device is attached under the eye, the user may experience discomfort due to the neurostimulation device entering the field of vision.

[0229] The thickness of the second protective layer (420) may be the same as or similar to the thickness of the substrate (100). In detail, the thickness of the second protective layer (420) may be 15 µm to 80 µm, 18 µm to 50 µm, or 20 µm to 30 µm.

[0230] If the thickness of the second protective layer (420) is less than 15 μm, the second pattern electrode (220) is not sufficiently protected by the second protective layer (420). In addition, if the thickness of the second protective layer (420) exceeds 80 μm, the reception efficiency of the second electrode pattern (220) may decrease. In detail, the reception efficiency of electromagnetic energy transmitted from the wireless device may decrease due to the thickness of the second protective layer (420).

[0231] The interior of the above via (V) can be filled with another material.

[0232] Referring to FIGS. 26 and 27, a bonding layer (500) may be disposed on the first surface (1S). The bonding layer (500) surrounds the first pattern electrode (210). In addition, the bonding layer (500) is disposed inside the via (V).

[0233] The bonding layer (500) may include a different material from the first protective layer (410) and the second protective layer (420). The bonding layer (500) may have different physical properties from the first protective layer (410) and the second protective layer (420).

[0234] The bonding layer (500) may include a different material from the substrate (100). The bonding layer (500) and the substrate (100) may have different physical properties.

[0235] The bonding layer (500) may include a resin material. The bonding layer (500) may include a material having a low water absorption rate. For example, the water absorption rate of the bonding layer (500) may be similar to the water absorption rate of the substrate (100). For example, the water absorption rate of the bonding layer (500) may be 0.04% to 0.08%.

[0236] The melting point of the bonding layer (500) may be different from the melting points of the first protective layer (410) and the second protective layer (420). In detail, the melting point of the bonding layer (500) may be lower than the melting points of the first protective layer (410) and the second protective layer (420).

[0237] Additionally, the melting point of the bonding layer (500) may be different from the melting point of the substrate (100). In detail, the melting point of the bonding layer (500) may be lower than the melting point of the substrate (100).

[0238] The melting point of the bonding layer (500) may be 155°C to 195°C, 165°C to 190°C, or 175°C to 185°C. In addition, the melting points of the first protective layer (410) and the second protective layer (420) may be 290°C to 350°C, 295°C to 330°C, or 300°C to 310°C. In addition, the melting point of the substrate (100) may be 290°C to 350°C, 295°C to 330°C, or 300°C to 310°C.

[0239] The first protective layer (410) is disposed on the bonding layer (500). The first protective layer (410) and the bonding layer (500) may have different thicknesses. Specifically, the thickness of the first protective layer (410) may be greater than the thickness of the bonding layer (500). The bonding layer (500) may be harmful to the human body. Since the thickness of the first protective layer (410) is greater than the thickness of the bonding layer (500), when the first protective layer (410) is damaged, the bonding layer (500) can be prevented from being exposed.

[0240] The melting point of the bonding layer (500) is lower than the melting points of the first protective layer (410) and the second protective layer (420). Accordingly, the thermocompression process for forming the bonding layer (500) can be performed at a low temperature. Accordingly, the metal layer inside the via (V) can be prevented from being damaged during the process of forming the bonding layer (500). Accordingly, the reliability of the neurostimulation device can be improved.

[0241] In addition, the bonding layer (500) has a low moisture absorption rate. Therefore, moisture can be prevented from penetrating into the interior of the via.

[0242] A neurostimulation device according to an embodiment includes a first protective layer and a second protective layer. The first protective layer is disposed to fill the interior of the via.

[0243] The melting point of the first protective layer is lower than that of the second protective layer. Accordingly, the first protective layer can be thermo-compression bonded at a low temperature. Accordingly, damage to the metal layer inside the via can be prevented during the process of forming the first protective layer. In addition, since the temperature of the thermo-compression bonding process is lowered, the pressure can be increased. Accordingly, the first protective layer can be sufficiently disposed inside the via. Accordingly, the void area inside the via can be reduced. Accordingly, the reliability of the neurostimulation device is improved.

[0244] Additionally, the neurostimulation device according to the embodiment includes a bonding layer, a first protective layer, and a second protective layer. The bonding layer is disposed to fill the interior of the via. The first protective layer is disposed on the bonding layer.

[0245] The melting point of the bonding layer is lower than the melting points of the first protective layer and the second protective layer. Accordingly, the bonding layer can be thermo-compression bonded at a low temperature. Accordingly, the metal layer inside the via can be prevented from being damaged during the process of forming the bonding layer. In addition, since the temperature of the thermo-compression process is lowered, the pressure can be increased. Accordingly, the bonding layer can be sufficiently disposed inside the via. Accordingly, the void area inside the via can be reduced. Accordingly, the reliability of the neurostimulation device is improved.

[0246] Additionally, the bonding layer has a low moisture absorption rate. Therefore, impurities such as moisture can be prevented from penetrating into the via. Consequently, the reliability of the neurostimulation device is improved.

[0247]

[0248] Meanwhile, the second protective layer (420) according to another embodiment may be provided in multiple layers.

[0249] That is, referring to FIGS. 28 to 31, a protective layer is disposed on the substrate (100). The protective layer includes a first protective layer (410) and a second protective layer (420). The first protective layer (410) is disposed on the first surface (1S). The first protective layer (410) surrounds the first pattern electrode (210). In addition, the first protective layer (410) is disposed inside the via (V). The via (V) is filled with the first protective layer (410).

[0250] The second protective layer (420) is disposed on the second surface (2S). The second protective layer (420) surrounds the second pattern electrode (220).

[0251] At least one of the first protective layer (410) and the second protective layer (420) may include a resin material. For example, at least one of the first protective layer (410) and the second protective layer (420) may include a thermoplastic resin. In addition, at least one of the first protective layer (410) and the second protective layer (420) may include a material having a low water absorption rate. For example, the water absorption rate of at least one of the first protective layer (410) and the second protective layer (420) may be 0.02% to 0.05%.

[0252] For example, at least one of the first protective layer (410) and the second protective layer (420) may include a liquid crystal polymer (LCP) or polyamide. The neurostimulation device (1000) comes into contact with the human skin. The protective layer (410M 420) includes a resin material that is harmless to the human body. Therefore, when using the neurostimulation device, side effects that may occur in the human body can be prevented.

[0253] For example, the first protective layer (410) and the second protective layer (420) may include the same material as the substrate (100). For example, the substrate (100), the first protective layer (410), and the second protective layer (420) may include a liquid crystal polymer (LCP).

[0254] The second protective layer (420) is disposed on the second surface (2S). Accordingly, the second protective layer (420) is disposed on the surface on which the electronic component (600) is disposed.

[0255] The second protective layer (420) includes multiple layers. Specifically, the second protective layer may include a second-first protective layer (421), a second-second protective layer (422), a second-third protective layer (423), and a second-fourth protective layer (424).

[0256] The above 2-1 protective layer (421) is disposed on the second pattern electrode (220). The 2-1 protective layer (421) surrounds the second pattern electrode (220). The second pattern electrode (220) is protected by the 2-1 protective layer.

[0257] The above 2-2 protective layer (422) is disposed on the 2-1 protective layer (421). The above 2-3 protective layer (423) is disposed on the 2-2 protective layer (422).

[0258] The above 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are in contact with the molding part (600). In detail, one end of the 2-1 protective layer (421), one end of the 2-2 protective layer (422), and one end of the 2-3 protective layer (423) are in contact with the molding part (600). In detail, the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are disposed on the side surface of the molding part (600).

[0259] The sum of the thicknesses of the second protective layers disposed on the side surface of the molding portion (600) may be equal to or similar to the thickness of the molding portion (600). In detail, the sum of the thicknesses of the second protective layers disposed on the side surface of the molding portion (600) may be greater than or equal to the thickness of the molding portion (600).

[0260] For example, the sum of the thicknesses of the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) may be equal to or similar to the thickness of the molding part (600). In detail, the sum of the thicknesses of the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) may be greater than or equal to the thickness of the molding part (600).

[0261] Accordingly, the electronic component (600) is surrounded by the molding part (700), the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423).

[0262] Accordingly, moisture can be prevented from entering the interior of the electronic component (600). Cracks may occur in the molding portion when the neurostimulation device (1000) is bent. Alternatively, the molding portion (700) may be peeled off. Accordingly, moisture may enter the interior of the electronic component (600), thereby reducing the reliability of the neurostimulation device.

[0263] However, in the embodiment, the electronic component (600) is protected by the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423). The 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) have low moisture absorption rates. In detail, the moisture absorption rates of the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are lower than the moisture absorption rate of the molding portion. In addition, the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are flexible. Accordingly, when the neurostimulation device is bent, peeling or damage to the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) can be prevented. Accordingly, human tears or sweat can be prevented from entering the electronic component or the interior of the neurostimulation device. Accordingly, the reliability of the neurostimulation device is improved.

[0264] The 2-4 protective layer (424) is disposed on the 2-3 protective layer (423). The 2-4 protective layer (423) is in contact with the 2-3 protective layer (423) and the molding part (700). Specifically, the 2-4 protective layer (424) is disposed on the upper surface of the molding part (600). The step between the molding part (700) and the 2nd protective layer (420) can be removed by the 2-4 protective layer (423). Therefore, the lower surface of the neurostimulation device can be flattened.

[0265] The thickness of at least one of the above-mentioned 2-1 protective layer (421), the above-mentioned 2-2 protective layer (422), the above-mentioned 2-3 protective layer (423) and the above-mentioned 2-4 protective layer (424) may be different from the thickness of the other protective layers.

[0266] In detail, the thickness of the 2-4 protective layer (424) may be different from the thicknesses of the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423). In detail, the thickness of the 2-4 protective layer (424) may be smaller than the thicknesses of the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423).

[0267] The above 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are arranged to the same thickness as the molding part (700), and thus have a thickness greater than the set range. The 2-4 protective layer (424) is arranged to flatten the 2nd protective layer, and thus has a minimum thickness. Accordingly, the reliability of the neurostimulation device can be improved while preventing an increase in the thickness of the neurostimulation device. In addition, since the thickness of the 2nd protective layer (420) is reduced, the transmission efficiency of electromagnetic energy transmitted to the 2nd pattern electrode (220) can be improved.

[0268] For example, the thickness of the 2-4 protective layer (424) may be 10% to 40%, 15% to 35%, or 20% to 30% of the thickness of at least one protective layer among the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423).

[0269] Referring to FIGS. 29 to 31, the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) may have steps. That is, the protective layers disposed on the side surfaces of the molding portion may have steps.

[0270] Referring to FIG. 29, one end of the 2-1 protective layer (421) may protrude toward the molding portion (700) more than one end of the 2-2 protective layer (422) and the 2-3 protective layer (423).

[0271] Alternatively, referring to FIG. 30, one end of the 2-1 protective layer (421) may protrude toward the molding portion (700) more than one end of the 2-2 protective layer (422) and the 2-3 protective layer (423). In addition, one end of the 2-2 protective layer (422) may protrude toward the molding portion (700) more than one end of the 2-3 protective layer (423).

[0272] Alternatively, referring to FIG. 31, one end of the 2-1 protective layer (421) may protrude more toward the molding portion (700) than one end of the 2-2 protective layer (422) and the 2-3 protective layer (423). In addition, one end of the 2-3 protective layer (423) may protrude more toward the molding portion (700) than one end of the 2-2 protective layer (422).

[0273] The steps of the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are formed by the manufacturing process of the neurostimulation device. Specifically, the 2-1 protective layer (421) is placed first, and then the molding part (700) is placed. The molding part (700) may be formed in a hemispherical shape. Accordingly, one end of the 2-1 protective layer (421) may protrude further than one end of the 2-2 protective layer (422) and the 2-3 protective layer (423).

[0274] Next, the 2-2 protective layer (422) and the 2-3 protective layer (423) are sequentially disposed. The 2-2 protective layer (422) and the 2-3 protective layer (423) are disposed by a thermocompression process. In detail, the 2-2 protective layer (422) and the 2-3 protective layer (423) are bonded by heat and pressure.

[0275] Depending on the heat and pressure applied when placing the 2-2 protective layer (422) and the 2-3 protective layer (423), the 2-2 protective layer (422) and the 2-3 protective layer (423) may have a step.

[0276] For example, when the heat and pressure of the thermal compression process of the 2-2 protective layer (422) are greater than the heat and pressure of the thermal compression process of the 2-3 protective layer (423), one end of the 2-2 protective layer (422) may protrude more than one end of the 2-3 protective layer (423).

[0277] Alternatively, if the heat and pressure of the thermal compression process of the 2-3 protective layer (423) are greater than the heat and pressure of the thermal compression process of the 2-2 protective layer (422), one end of the 2-3 protective layer (423) may protrude more than one end of the 2-2 protective layer (422).

[0278] Since the above-mentioned 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) have steps, the reliability of the neurostimulation device can be improved. Specifically, the steps increase the movement path of impurities flowing in from the outside. Accordingly, the inflow of the impurities into electronic components or the interior of the neurostimulation device can be minimized.

[0279] Referring to FIGS. 32 and 33, at least one of the 2-2 protective layer (422), the 2-3 protective layer (423), and the 2-4 protective layer (424) may not be disposed in an area other than the mounting area (MR). Accordingly, the thickness of the protective layer disposed on an area overlapping the mounting area (MR) may be greater than the thickness of the protective layer disposed on an area other than the mounting area (MR).

[0280] Referring to Fig. 32, the first protective layer (421), the second-second protective layer (422), the second-third protective layer (423), and the second-fourth protective layer (424) are disposed on an area overlapping the mounting area (MR). In addition, only the first protective layer (421) may be disposed on an area other than the mounting area (MR).

[0281] Referring to FIG. 33, the first protective layer (421), the 2-2 protective layer (422), the 2-3 protective layer (423), and the 2-4 protective layer (424) are disposed on an area overlapping the mounting area (MR). In addition, the first protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) may be disposed on an area other than the mounting area (MR). For example, at least one of the first protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) may be disposed on an area other than the mounting area (MR). That is, the 2-4 protective layer (424) may not be disposed on an area other than the mounting area (MR).

[0282] Accordingly, the electronic component (600) is protected by the first protective layer (421), the second-second protective layer (422), the second-third protective layer (423), and the second-fourth protective layer (424). A second pattern electrode (220) is disposed on an area other than the mounting area (MR). Since the thickness of the protective layer disposed on an area other than the mounting area (MR) is reduced, the transmission efficiency of electromagnetic energy transmitted to the second pattern electrode (220) can be improved. Accordingly, the driving characteristics of the neurostimulation device are improved.

[0283] A method for manufacturing a neurostimulation device according to an embodiment is described with reference to FIGS. 34 to 40.

[0284] Referring to Fig. 34, a substrate (100) is prepared. The substrate (100) comprises the resin material described above. A metal layer is disposed on the substrate (100). Specifically, copper is disposed on the second surface (2S). Subsequently, the metal layer is patterned. Accordingly, a second pattern electrode (220) is formed on the second surface (2S).

[0285] Referring to Fig. 35, a second-first protective layer (421) is disposed on the second surface (2S). The second-first protective layer (421) is disposed on the second pattern electrode (220). The second-first protective layer (421) is disposed to fill the area between the second pattern electrodes (220). The second-first protective layer (421) is not disposed on the pad portion (300). The second pattern electrode (220) is protected by the second-first protective layer (421).

[0286] The above pad portion (300) is connected to the electronic component (600). Accordingly, the bonding layer (250) is arranged on the pad portion (300).

[0287] Referring to Fig. 36, a metal layer is disposed on the first surface (1S). Specifically, the first metal layer (211) and the second metal layer (212) are disposed on the first surface (1S). Subsequently, the metal layer is patterned. Accordingly, a first pattern electrode (210) is formed on the first surface (1S).

[0288] The first metal layer (211) and the second metal layer (212) are also disposed inside the via (V). In detail, the first metal layer (211) is disposed on the inner surface and the lower surface of the via (V). In addition, the second metal layer (212) is disposed on the first metal layer (211).

[0289] Referring to Fig. 37, a first protective layer (410) is disposed on the first surface (1S). The first protective layer (410) is disposed on the first pattern electrode (210). The first protective layer (410) is disposed to fill the area between the first pattern electrodes (210).

[0290] The first protective layer (410) is arranged to fill the interior of the via (V). Specifically, after aligning the first protective layer (410) on the first surface (1S), the first protective layer (410) can be thermally compressed. Accordingly, the interior of the via (V) is filled with the first protective layer (410). Accordingly, impurities such as moisture can be prevented from entering the interior of the neurostimulation device through the via.

[0291] Next, the electronic component (600) is placed. Specifically, after aligning the terminal portion of the electronic component (600) and the pad portion (300), the terminal and the pad portion (300) are joined using solder. Next, a molding portion (700) is placed on the electronic component (600). The molding portion (700) surrounds the electronic component (600). Accordingly, impurities such as moisture can be prevented from entering the interior of the electronic component.

[0292] The above molding portion (700) includes a curved surface. For example, the molding portion (700) may be formed in a hemispherical shape.

[0293] Referring to Fig. 38, the 2-2 protective layer (422), the 2-3 protective layer (423), and the 2-4 protective layer (424) are sequentially disposed on the second surface (2S). The 2-3 protective layer (423) is disposed so that its upper surface has almost no step difference from the upper surface of the molding part (700). The 2-2 protective layer (422), the 2-3 protective layer (423), and the 2-4 protective layer (424) are disposed by a thermal compression process. Accordingly, they are disposed while pushing the molding part (700) inward. Accordingly, the outer shape of the molding part (700) changes.

[0294] Referring to FIGS. 39 and 40, the second surface (2S) may include a first region (1A) and a second region (2A).

[0295] The first region (1A) overlaps with the mounting region (MR). The second region (2A) does not overlap with the mounting region (MR).

[0296] Referring to Fig. 39, the 2-1 protective layer (421), the 2-2 protective layer (422), the 2-3 protective layer (423), and the 2-4 protective layer (424) are disposed on the first region (1A). In addition, only the 2-1 protective layer (421) is disposed on the second region (2A).

[0297] Alternatively, referring to FIG. 40, the 2-1 protective layer (421), the 2-2 protective layer (422), the 2-3 protective layer (423), and the 2-4 protective layer (424) are disposed on the first region (1A). In addition, the 2-1 protective layer (421), the 2-2 protective layer (422), and the 2-3 protective layer (423) are disposed on the second region (2A). That is, the 2-4 protective layer (424) is not disposed on the second region (2A).

[0298] Accordingly, the thickness of the protective layer on the second region (2A) becomes thinner. Accordingly, the electromagnetic energy reception efficiency of the second pattern electrode can be improved.

[0299]

[0300] A neurostimulation device according to an embodiment includes a first protective layer and a second protective layer. The second protective layer is formed of a plurality of layers.

[0301] The second protective layer includes the 2-1 protective layer, the 2-2 protective layer, the 2-3 protective layer, and the 2-4 protective layer.

[0302] The above-mentioned 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer are arranged to a thickness equivalent to that of the molding portion protecting the electronic component. In addition, the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer are in contact with the molding portion. Therefore, moisture can be prevented from entering the electronic component.

[0303] Additionally, even if cracks or peeling occur in the molding portion as the neurostimulation device is bent, the electronic component can be protected by the second protective layer.

[0304] Additionally, the 2-4 protective layer is disposed on the 2-3 protective layer and the upper surface of the molding part. Accordingly, the 2nd protective layer is flattened.

[0305] Additionally, the 2-1 protective layer, the 2-2 protective layer, and the 2-3 protective layer may be arranged with steps. Accordingly, the moisture movement path is lengthened. Accordingly, moisture can be prevented from entering the electronic component or the neurostimulation device.

[0306] In addition, the second surface on which the electronic component is placed may include a first region and a second region. The first region is a region overlapping the mounting region. The second region is a region not overlapping the mounting region. The 2-1 protective layer, the 2-2 protective layer, the 2-3 protective layer, and the 2-4 protective layer are placed on the first region. At least one of the 2-2 protective layer, the 2-3 protective layer, and the 2-4 protective layer is not placed on the second region.

[0307] Accordingly, the thickness of the protective layer on the second region becomes thinner. Accordingly, the reception efficiency of the second pattern electrode can be improved.

[0308]

[0309] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by those skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as being included within the scope of the present invention.

[0310] In addition, although the above description focuses on embodiments, these are merely examples and do not limit the present invention. Those skilled in the art to which the present invention pertains will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiment. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the present invention defined in the appended claims.

Claims

1. A substrate comprising a first side and a second side opposite to the first side; A first pattern electrode disposed on the first surface; A second pattern electrode disposed on the second surface; A first protective layer disposed on the first pattern electrode; and A second protective layer disposed on the second pattern electrode; The first pattern electrode includes a plurality of branch electrodes, a merge electrode connecting the plurality of branch electrodes, and a protrusion protruding from the branch electrode or the merge electrode, The protrusion includes at least one of a first protrusion connected to the branch electrode and a second protrusion connected to one of the merge electrodes. A neurostimulation device wherein a first gap between a branch electrode adjacent to the first protrusion and the first protrusion is 5% to 45% of a second gap between the branch electrodes.

2. In paragraph 1, The above description includes a mounting area where electronic components are placed, A neurostimulation device in which the above-mentioned mounting area does not overlap the first pattern electrode and the thickness direction of the substrate.

3. In paragraph 1, The line width of the above branch electrode is 250㎛ to 330㎛, The length of the above protrusion is 10㎛ to 50㎛, A nerve stimulation device wherein the second gap is 60㎛ to 110㎛.

4. In paragraph 1, A neurostimulation device in which the sizes of the first protrusion and the second protrusion are different.

5. In paragraph 4, The above description includes a mounting area where electronic components are placed, The above mounting area does not overlap the branch electrode and the substrate in the thickness direction, The above-mentioned mounting area is a neurostimulation device in which the merged electrode and the above-mentioned substrate overlap in the thickness direction.

6. In paragraph 4, A neurostimulation device in which the length of the second protrusion is longer than the length of the first protrusion.

7. In paragraph 4, A neurostimulation device wherein the length of the second protrusion is 50% to 100% of the second gap.

8. In paragraph 4, The first protrusion overlaps the second protective layer in the thickness direction of the substrate, A neurostimulation device in which the second protrusion does not overlap the second protective layer in the thickness direction of the substrate.

9. In paragraph 1, A nerve stimulation device in which the second pattern electrode is arranged in a closed loop shape.

10. In paragraph 1, Includes a plurality of vias penetrating the first side and the second side of the above-described substrate, The first pattern electrode and the second pattern electrode are connected by the via, The first pattern electrode includes a first metal layer and a second metal layer, The first and second metal layers are disposed on the inner surface and the lower surface of the via, The above first protective layer is a neurostimulation device disposed inside the via.

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