Conveyance parameter adjustment device and conveyance parameter adjustment method

Abstract

This conveyance parameter adjustment device comprises an adjustment unit and a calculation unit. The adjustment unit adjusts, by using a substrate operating machine that performs a prescribed substrate operation on a substrate, a conveyance parameter that is a control parameter for conveying an article in the substrate operating machine. While the adjustment unit is adjusting the conveyance parameter, the calculation unit calculates, in accordance with the parameter value of the conveyance parameter, a cycle time that is a time during which the substrate operation is performed in the substrate operating machine.

Description

Transportation parameter adjustment device and transportation parameter adjustment method

[0001] This specification discloses a technology relating to a transportation parameter adjustment device and a transportation parameter adjustment method.

[0002] The production management device described in Patent Document 1 is configured to be able to execute an automatic production mode in which the automatic exchange operation of an automatic exchange robot is managed according to a production schedule to produce component-mounted boards, as well as a remote operation mode in which a component mounter is remotely operated according to an operator's input operation to perform a test operation. The test operation of the component mounter tests at least one of the following: the suction state of a component picked up by a suction nozzle, image processing of the component, and transport parameters for transporting the component. For example, the test operation involves transporting the component picked up by the suction nozzle while gradually changing the transport parameters (speed, acceleration / deceleration, etc.), and checking for component misalignment using image processing. This operation is repeated to determine the fastest transport parameters within a range that allows stable transport without component misalignment during transport.

[0003] The component mounting line optimization device described in Patent Document 2 includes a cycle time calculation unit and a shortest time calculation unit. The cycle time calculation unit calculates the cycle time required for each mounter to place components of the component type assigned by the optimization process onto one board. The shortest time calculation unit calculates the shortest cycle time required for each mounter to place components of the component type assigned by the optimization process onto one board under hypothetical placement execution conditions that maximize placement efficiency.

[0004] The component mounting system described in Patent Document 3 includes an optimization unit, an apparatus control unit, and a determination unit. The optimization unit optimizes job data based on apparatus information for multiple apparatuses. For example, the optimization unit optimizes the job data to minimize the cycle time of the mounting operation. The apparatus control unit controls the multiple apparatuses based on the job data optimized by the optimization unit. The determination unit determines, at a predetermined timing according to the mounting operation, whether the apparatus information used by the optimization unit in optimization matches the latest apparatus information. If the determination unit determines that the apparatus information does not match, the optimization unit re-optimizes the job data based on the latest apparatus information.

[0005] International Publication No. 2021 / 144921 International Publication No. 2016 / 151833 International Publication No. 2018 / 173114

[0006] When the parameter values ​​of the transfer parameters change, the cycle time may fluctuate. Therefore, when adjusting the transfer parameters using the substrate-related operation machine, the cycle time may be required.

[0007] In view of the above circumstances, this specification discloses a transport parameter adjustment device and a transport parameter adjustment method that are capable of calculating a cycle time in accordance with the parameter value of a transport parameter when adjusting the transport parameter using a substrate-related operation machine.

[0008] This specification discloses a transport parameter adjustment device including an adjustment unit and a calculation unit. The adjustment unit adjusts transport parameters, which are control parameters for transporting an object by a substrate-related performing machine that performs a predetermined substrate-related operation on a substrate, using the substrate-related performing machine. The calculation unit, while adjusting the transport parameters by the adjustment unit, calculates a cycle time, which is the time it takes for the substrate-related performing operation to be performed by the substrate-related performing machine, based on a parameter value of the transport parameters.

[0009] This specification also discloses a transport parameter adjustment method including an adjustment step and a calculation step. The adjustment step adjusts transport parameters, which are control parameters for transporting an object by a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate, using the substrate-related operation machine. The calculation step calculates a cycle time, which is a time required for the substrate-related operation to be performed by the substrate-related operation machine, according to a parameter value of the transport parameters while the adjustment step is adjusting the transport parameters.

[0010] This specification discloses a technical idea in claim 6 of the claims originally attached to the application (hereinafter referred to as the initial claims) in which "the transport parameter adjustment device according to claim 1" is changed to "the transport parameter adjustment device according to any one of claims 1 to 5." Also, this specification discloses a technical idea in claim 10 of the initial claims in which "the transport parameter adjustment device according to claim 1" is changed to "the transport parameter adjustment device according to any one of claims 1 to 9."

[0011] According to the above-described transport parameter adjustment device, when the transport parameters are adjusted using the substrate-related operation machine, the cycle time can be calculated according to the parameter values ​​of the transport parameters. What has been described above about the transport parameter adjustment device can also be applied to the transport parameter adjustment method.

[0012] FIG. 1 is a configuration diagram showing an example of the configuration of a production line. FIG. 2 is a plan view showing an example of the configuration of a component mounting device. FIG. 3 is a side view showing an example of the configuration of a mounting head. FIG. 4 is a block diagram showing an example of a control block of a transport parameter adjustment device. FIG. 5 is a flowchart showing an example of control by the transport parameter adjustment device. FIG. 6 is a schematic diagram showing an example of a pre-transport image. FIG. 7 is a schematic diagram showing an example of a post-transport image. FIG. 8 is a schematic diagram showing an example of an object positional deviation amount and angle deviation amount. FIG. 9 is a schematic diagram showing an example of a display of transport parameters, an object transport result, and a cycle time.

[0013] 1. Embodiment 1-1. Configuration Example of Production Line WL0 The transport parameter adjustment device 60 can be applied to at least one production line WL0 equipped with at least one substrate-related performing machine WM0. As shown in FIG. 1, the production facility of the embodiment includes two production lines WL0: a first production line WL1 and a second production line WL2.

[0014] In each of the two production lines WL0, at least one (five in the figure) substrate-related operation machine WM0 performs a predetermined substrate-related operation on the substrate 90. The type and number of substrate-related operation machines WM0 that make up the production line WL0 are not limited. As shown in Figure 1, the production line WL0 of the embodiment is equipped with multiple substrate-related operation machines WM0, including a printer WM1, a print inspection machine WM2, a component mounting device WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in the above order by a board transport device.

[0015] The printer WM1 prints solder at the mounting positions of multiple components 91 on the board 90. The print inspection machine WM2 inspects the printing condition of the solder printed by the printer WM1. As shown in Figure 2, the component mounting device WM3 mounts multiple components 91 on the board 90 on which solder has been printed by the printer WM1. There may be one or more component mounting devices WM3. When multiple component mounting devices WM3 are provided, the multiple component mounting devices WM3 can share the mounting work of multiple components 91.

[0016] The reflow furnace WM4 heats the board 90 on which multiple components 91 have been mounted by the component mounting device WM3, melting the solder and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components 91 mounted by the component mounting device WM3. In this manner, the production line WL0 uses the substrate-related operation machine WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce the product board 900. The production line WL0 may also be equipped with other substrate-related operation machines WM0, such as a function inspection machine, a buffer device, a substrate supply device, a substrate inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device, as needed.

[0017] At least one substrate-related performing machine WM0 and line management device LC0 that make up production line WL0 are communicably connected by a communication unit. Also, line management device LC0 and management device HC0 are communicably connected by a communication unit. The communication unit only needs to be able to communicably connect them by wire or wirelessly, and various communication methods can be used.

[0018] In the embodiment, a local area network (LAN) is configured by the plurality of substrate-related performing machines WM0, the line management device LC0, and the management device HC0. Therefore, the plurality of substrate-related performing machines WM0 can communicate with each other via a communication unit. Furthermore, the plurality of substrate-related performing machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

[0019] The line management device LC0 controls the multiple substrate-related performing machines WM0 that make up the production line WL0 and monitors the operating status of the production line WL0. The line management device LC0 stores various control data for controlling the multiple substrate-related performing machines WM0. The line management device LC0 transmits the control data to each of the multiple substrate-related performing machines WM0. Each of the multiple substrate-related performing machines WM0 also transmits its operating status and production status to the line management device LC0. The management device HC0 manages at least one line management device LC0 (two in FIG. 1 ). For example, the operating status and production status of the substrate-related performing machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as needed and managed.

[0020] 1-2. Configuration Example of Component Mounting Device WM3 Component mounting device WM3 mounts a plurality of components 91 on a board 90. As shown in Fig. 2, the component mounting device WM3 of this embodiment includes a board transport device 10, a component supply device 20, a component transfer device 30, two sets of component mounting machines 50, 50 each equipped with a component camera 41, a board camera 42, a nozzle station 43, and a protective cover 44, and a control device 45. The two sets of component mounting machines 50, 50 have a common structure and are arranged opposite each other on the same base.

[0021] For ease of explanation, the side where one of the two sets of component mounting machines 50 is located (e.g., the lower side of the paper in FIG. 2) is referred to as the first side S1. The side where the other of the two sets of component mounting machines 50 is located (e.g., the upper side of the paper in FIG. 2) is referred to as the second side S2. The component mounting machine 50 located on the first side S1 is indicated as component mounting machine 50a, and the component mounting machine 50 located on the second side S2 is indicated as component mounting machine 50b.

[0022] 2, the components of the two sets of component mounting machines 50, 50 are distinguished by adding an "a" to the end of their reference numbers for the components located on the first side S1 and adding a "b" to the end of their reference numbers for the components located on the second side S2. In this specification, the conveyance direction of the board 90 is defined as the X-axis direction. Furthermore, the direction perpendicular to the conveyance direction (X-axis direction) in the horizontal plane and in which the two sets of component mounting machines 50 face each other is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the conveyance direction (X-axis direction) and the facing direction (Y-axis direction) is defined as the Z-axis direction.

[0023] The substrate transport device 10 includes transport mechanisms 11 arranged side by side in an opposing direction (Y-axis direction). The transport mechanism 11 includes a pair of guide rails 12, 12 and a conveyor belt 13. Each of the pair of guide rails 12 extends along the transport direction (X-axis direction) of the substrate 90 and can support the peripheral edge of the substrate 90 placed on the conveyor belt 13 for transport. At least one of the pair of guide rails 12 is provided on a base so as to be movable along the opposing direction (Y-axis direction).

[0024] The board transport device 10 transports the board 90 in the transport direction (X-axis direction). The board 90 is a circuit board on which, for example, an electronic circuit, an electric circuit, a magnetic circuit, etc. are formed. The board transport device 10 transports the board 90 into the component mounting machine 50 and positions the board 90 at a predetermined position within the machine. After the component mounting machine 50 has completed the mounting process of the multiple components 91, the board transport device 10 transports the board 90 out of the component mounting machine 50.

[0025] The component supply device 20 supplies components 91 to be mounted on the board 90. The component supply device 20 includes a plurality of slots 21 and a plurality of reel holding units 22. The plurality of slots 21 and the plurality of reel holding units 22 are arranged along the conveyance direction (X-axis direction) of the board 90. A feeder 23 is detachably attached to each of the plurality of slots 21. The feeder 23 pitch-feeds the carrier tape containing the components 91 to supply the components 91 so that they can be picked up at a supply position located at the tip side of the feeder 23. The reel holding unit 22 replaceably holds a reel around which the carrier tape is wound. The component supply device 20 can also supply electronic components (e.g., lead components) that are relatively large compared to chip components and the like, arranged on a tray.

[0026] The component transfer device 30 transfers components 91 supplied by the component supply device 20 to predetermined mounting positions on the board 90 carried into the machine by the board transport device 10. The component transfer device 30 includes a head drive device 31 and a movable table 32. The head drive device 31 moves the movable table 32 in horizontal directions (the transport direction (X-axis direction) and the opposing direction (Y-axis direction)) using a linear motion mechanism. A mounting head 33 is detachably (replaceably) attached to the movable table 32 by a clamp member.

[0027] Various tools, such as a holding member 34, are detachably (replaceably) attached to the mounting head 33. For example, a suction nozzle and a chuck are included in the holding member 34. The suction nozzle uses supplied negative pressure air to suck and hold the component 91. The control device 45 controls the lifting position and angle of the suction nozzle relative to the mounting head 33, as well as the supply state of negative pressure air. In addition, a chuck for clamping the component 91 can also be detachably (replaceably) attached to the mounting head 33.

[0028] 3, the mounting head 33 includes a head main body 33a1 that is clamped to the movable stage 32. The head main body 33a1 is provided with a rotary head 33c that can index a rotation angle at predetermined intervals using an R-axis motor 33b1. The rotary head 33c holds multiple (e.g., eight) tool shafts 33d that are equally spaced circumferentially on a circumference concentric with the R-axis and that are slidable in a θ-axis direction (the vertical direction in FIG. 3) that is parallel to the Z-axis and R-axis, and rotatable about the θ-axis.

[0029] Each of the multiple tool shafts 33d is biased upward relative to the rotary head 33c by the elastic force of a spring. As a result, each tool shaft 33d is positioned at its uppermost position under normal conditions when no external force is applied. For example, a suction nozzle is detachably attached to the lower end of each tool shaft 33d. When a suction nozzle is attached to each tool shaft 33d, the elastic force of the spring within the shaft urges the suction nozzle downward. Each of the multiple suction nozzles holds a component 91 by supplying air to an air passage in the suction nozzle.

[0030] The rotary head 33c rotates in response to the drive of the R-axis motor 33b1, and the multiple suction nozzles are sequentially indexed to predetermined angular positions around the R-axis (for example, the elevation position of the tool shaft 33d). As shown in FIG. 3, the mounting head 33 includes a θ-axis motor 33e fixed to the head body 33a1. All of the tool shafts 33d are connected to the output shaft of the θ-axis motor 33e so that rotational force can be transmitted via multiple gears. The tool shafts 33d and the suction nozzles rotate (spin) together around the θ-axis by the operation of the θ-axis motor 33e, and the rotation angle and rotation speed are controlled.

[0031] The head main body 33a1 is also provided with an actuating member 33f that is movable in the vertical direction (Z-axis direction). The actuating member 33f is raised and lowered in the vertical direction (Z-axis direction) by a ball screw mechanism 33h that is driven by a Z-axis motor 33g. The actuating member 33f includes a lever 33i that contacts the upper end of a tool shaft 33d that is indexed to a raised or lowered position among the multiple tool shafts 33d. The lever 33i descends as the actuating member 33f moves downward in the vertical direction (Z-axis direction). The lever 33i presses the tool shaft 33d downward in the vertical direction (Z-axis direction) against the elastic force of the spring of the tool shaft 33d that it contacts, thereby lowering the tool shaft 33d. The tool shaft 33d, which contacts the lever 33i, and the suction nozzle attached to the lower end of the tool shaft 33d are raised and lowered together in the vertical direction (Z-axis direction) by the drive of the Z-axis motor 33g, and the vertical position (Z-axis direction), movement speed, etc. are controlled.

[0032] The component mounting device WM3 of this embodiment includes an opposing robot in which two mounting heads 33 (mounting head 33a and mounting head 33b) are arranged facing each other. The movable areas of the two mounting heads 33 overlap, and the two mounting heads 33 are configured to be able to access the side (second side S2 in this case) opposite the side on which the head itself is located (e.g., the first side S1 on which the mounting head 33a is located). Thus, the two mounting heads 33 can alternately work on the same board 90. The control device 45 performs non-interference control to prevent the two mounting heads 33 from interfering with each other in the overlapping movable areas.

[0033] The component camera 41 and the board camera 42 may be publicly known imaging devices. The component camera 41 is fixed to the base of the component mounting device WM3 so that its optical axis faces upward in the vertical direction (Z-axis direction). The component camera 41 can capture images of the components 91 held by the holding members 34 from below. The board camera 42 is mounted on the movable stage 32 of the component transfer device 30 so that its optical axis faces downward in the vertical direction (Z-axis direction). The board camera 42 can capture images of the board 90 and the like from above. The component camera 41 and the board camera 42 capture images based on control signals sent from the control device 45. Image data of the images captured by the component camera 41 and the board camera 42 is sent to the control device 45.

[0034] The nozzle station 43 is provided inside the component mounting device WM3. For example, the nozzle station 43 is installed on a base of the component mounting device WM3 in a detachable (replaceable) manner. The nozzle station 43 can detachably hold, for example, multiple suction nozzles. In the suction nozzle replacement process, the nozzle station 43 holds a suction nozzle removed from the mounting head 33 and also holds a suction nozzle different from the removed nozzle so that it can be removed. This allows the component mounting device WM3 to automatically replace suction nozzles depending on the type of component 91 to be mounted, for example, during the mounting process.

[0035] The protective cover 44 protects the operator. As shown in FIG. 2 , the protective cover 44 can cover the entire component mounting machine 50, including the component supply device 20. For example, when an operator is working on the component mounting machine 50a on the first side S1, the operator opens and closes the protective cover 44a on the first side S1 and performs the work on the component mounting machine 50a. Similarly, when an operator is working on the component mounting machine 50b on the second side S2, the operator opens and closes the protective cover 44b on the second side S2 and performs the work on the component mounting machine 50b.

[0036] The control device 45 includes a known arithmetic unit and a storage device, and functions as a control circuit. The control device 45 receives information, image data, and the like output from various sensors provided in the component mounting device WM3. The control device 45 sends control signals to each device based on a control program and predetermined mounting conditions that have been set in advance.

[0037] For example, the control device 45 causes the board camera 42 to capture an image of the board 90 positioned by the board transport device 10. The control device 45 processes the image captured by the board camera 42 to recognize the positioning state of the board 90. The control device 45 also causes the holding member 34 to hold the component 91 supplied by the component supply device 20, and causes the component camera 41 to capture an image of the component 91 held by the holding member 34. The control device 45 processes the image captured by the component camera 41 to recognize the holding posture of the component 91.

[0038] The control device 45 moves the holding member 34 above a planned placement position that is preset by a control program or the like. The control device 45 also corrects the planned placement position based on the positioning state of the board 90, the holding posture of the component 91, and the like, to set the placement position where the component 91 will actually be placed. The planned placement position and placement position include a rotation angle in addition to the position (X and Y coordinates). The control device 45 corrects the target position (X and Y coordinates) and rotation angle of the holding member 34 to match the placement position. The control device 45 lowers the holding member 34 at the corrected rotation angle from the corrected target position to place the component 91 on the board 90. The control device 45 repeats the above pick-and-place cycle to perform the placement process of placing multiple components 91 on the board 90.

[0039] 1-3. Example Configuration of Transport Parameter Adjustment Device 60 For example, a transport test can be performed by actually using component mounting device WM3 that produces product board 900 to transport component 91. Specifically, in the transport test, the parameter values ​​of transport parameters TP0 (e.g., speed, acceleration, deceleration, etc.) when transporting component 91 are increased or decreased to adjust transport parameters TP0 so that the transport results of component 91 fall within a predetermined range.

[0040] In this way, when the parameter value of the transport parameter TP0 changes, there is a possibility that the cycle time TS0, which is the time it takes for the substrate-related operation to be performed by the substrate-related operation machine WM0, will fluctuate. Therefore, the cycle time TS0 may be necessary when adjusting the transport parameter TP0 using the substrate-related operation machine WM0. Therefore, the production facility is provided with a transport parameter adjustment device 60. When adjusting the transport parameter TP0 using the substrate-related operation machine WM0, the transport parameter adjustment device 60 calculates the cycle time TS0 according to the parameter value of the transport parameter TP0.

[0041] Specifically, the transport parameter adjustment device 60 includes an adjustment unit 61 and a calculation unit 62. The transport parameter adjustment device 60 may also include a display unit 63. As shown in FIG. 4 , the transport parameter adjustment device 60 of this embodiment includes the adjustment unit 61, the calculation unit 62, and the display unit 63. The adjustment unit 61, the calculation unit 62, and the display unit 63 can be provided in various control devices and management devices. For example, at least one of the adjustment unit 61, the calculation unit 62, and the display unit 63 can be provided in the control device of the substrate-related performing machine WM0 (for example, the control device 45 in the component mounting device WM3).

[0042] At least one of the adjustment unit 61, the calculation unit 62, and the display unit 63 may be provided in the line management device LC0. At least one of the adjustment unit 61, the calculation unit 62, and the display unit 63 may be provided in the management device HC0. At least one of the adjustment unit 61, the calculation unit 62, and the display unit 63 may be formed on the cloud. As shown in FIG. 4 , in this embodiment, the adjustment unit 61, the calculation unit 62, and the display unit 63 are provided in the control device 45 of the component mounting device WM3. The transport parameter adjustment device 60 also executes control according to the flowchart shown in FIG.

[0043] Specifically, the adjustment unit 61 performs the processes shown in steps S11 and S15. The calculation unit 62 performs the process shown in step S12. The display unit 63 performs the process shown in step S13. The operator or the transport parameter adjustment device 60 makes the determination shown in step S14. The matters described in this specification can be selected and applied as appropriate. The matters described in this specification can also be combined as appropriate.

[0044] 1-3-1. Adjustment Unit 61 Adjustment unit 61 adjusts the transport parameter TP0 using substrate-related operation machine WM0. The transport parameter TP0 refers to a control parameter when substrate-related operation machine WM0 transports item 80. The substrate-related operation machine WM0 and item 80 are not limited. For example, component mounting device WM3 can transport component 91 included in item 80. Specifically, component 91 supplied by component supply device 20 is picked up and held by holding member 34, and then transported to and mounted on board 90.

[0045] In the above-described transport of the component 91, the speed, acceleration, deceleration, etc., when moving the component 91 in the horizontal direction (the transport direction (X-axis direction) and the opposing direction (Y-axis direction)) are included in the transport parameter TP0. Also, as shown in FIG. 3, the speed, acceleration, deceleration, etc., when moving the component 91 around the R axis are included in the transport parameter TP0. Furthermore, the speed, acceleration, deceleration, etc., when moving the component 91 around the θ axis are included in the transport parameter TP0.

[0046] For example, before starting production of a product substrate 900 that uses new components 91, the adjustment unit 61 can adjust the transport parameter TP0 by actually using the component mounting device WM3 that produces the product substrate 900. The adjustment unit 61 can also adjust the transport parameter TP0 during production of the product substrate 900, for example, when the mounting rate of components 91 falls below an allowable value. In either case, the adjustment unit 61 can adjust the transport parameter TP0 by switching the drive mode of the component mounting device WM3 from production mode to test mode.

[0047] The adjustment of the transport parameter TP0 can take various forms. For example, the adjustment unit 61 can adjust the transport parameter TP0 by increasing or decreasing the parameter value of the transport parameter TP0 so that the transport result of the item 80 falls within a predetermined range. Similarly, the determination of whether the transport result of the item 80 falls within a predetermined range can take various forms. For example, the adjustment unit 61 captures images of the item 80 before and after transporting the item 80, and obtains a pre-transport image PC1 captured before the transport and a post-transport image PC2 captured after the transport.

[0048] In the example already described, the substrate-related performing operation machine WM0 is a component mounting device WM3 that mounts components 91 on a substrate 90 using a mounting head 33 equipped with holding members 34 that pick up and hold components 91 included in an item 80. In this case, the adjustment unit 61 can capture images of the components 91 held by the holding members 34 before and after moving the mounting head 33, thereby obtaining a pre-transfer image PC1 and a post-transfer image PC2.

[0049] Specifically, after the component 91 is picked up and held by the holding member 34 at the supply position of the component supply device 20, the adjustment unit 61 moves the mounting head 33 toward above the component camera 41 at a parameter value of the transport parameter TP0 that is unlikely to affect the holding state of the component 91. Then, the adjustment unit 61 uses the component camera 41 to capture an image of the component 91 and obtain a pre-transport image PC1. The parameter value of the transport parameter TP0 that is unlikely to affect the holding state of the component 91 is the transport parameter TP0 when moving the component 91 in the horizontal direction (the transport direction (X-axis direction) and the opposing direction (Y-axis direction)), and refers to a speed that is sufficiently slow and an acceleration and deceleration that are sufficiently small compared to those used during production of the product board 900.

[0050] Once the pre-transport image PC1 is acquired, the adjustment unit 61 moves the mounting head 33 to the supply position of the component supply device 20 using the parameter value of the transport parameter TP0 that is unlikely to affect the holding state of the component 91. Then, the adjustment unit 61 moves the mounting head 33 toward above the component mounting position on the board 90 using the parameter value of the transport parameter TP0 that is predetermined for the transport test (transport test of the item 80). Once the mounting head 33 has moved above the board 90, the adjustment unit 61 moves the mounting head 33 toward above the component camera 41 using the parameter value of the transport parameter TP0 that is unlikely to affect the holding state of the component 91.

[0051] The adjustment unit 61 then uses the component camera 41 to capture an image of the component 91 and acquire a post-transport image PC2. What has been described above about the case where the component 91 is moved in the horizontal direction (the transport direction (X-axis direction) and the opposing direction (Y-axis direction)) also applies to the case where the component 91 is moved around the R-axis. Furthermore, what has been described above about the case where the component 91 is moved in the horizontal direction (the transport direction (X-axis direction) and the opposing direction (Y-axis direction)) also applies to the case where the component 91 is moved around the θ-axis.

[0052] FIG. 6 shows an example of a pre-transport image PC1, and FIG. 7 shows an example of a post-transport image PC2. These figures show example images of multiple (eight) components 91 held by multiple (eight in this figure) holding members 34 of the mounting head 33, captured by the component camera 41. The adjustment unit 61 processes the pre-transport image PC1 and the post-transport image PC2 to recognize the components 91 held by the holding members 34. The larger the parameter value of the transport parameter TP0, the more likely the component 91 will be misaligned during transport. Furthermore, the larger the parameter value of the transport parameter TP0, the more likely the component 91 will be angularly misaligned during transport.

[0053] Therefore, the adjustment unit 61 may adjust the transport parameter TP0 so that the positional deviation amount ΔP0 falls within a predetermined range and the angular deviation amount Δφ0 falls within a predetermined range. The positional deviation amount ΔP0 refers to the difference between the position P1 of the item 80 in the pre-transport image PC1 and the position P2 of the item 80 in the post-transport image PC2. The angular deviation amount Δφ0 refers to the difference between the angle φ1 of the item 80 in the pre-transport image PC1 and the angle φ2 of the item 80 in the post-transport image PC2. The positional deviation amount ΔP0 and the angular deviation amount Δφ0 are examples of the transport result of the item 80. Note that the predetermined range is an allowable range for the transport of the item 80, and is set in advance based on, for example, the required accuracy required for the production of the product substrate 900.

[0054] Furthermore, positions P1 and P2 of the article 80 can be defined using a predetermined position (e.g., the center) of the before-transfer image PC1 and the after-transfer image PC2 as a reference (0 position). Furthermore, a reference mark FM0 is provided on the mounting head 33, etc. In this case, positions P1 and P2 of the article 80 can also be defined using the reference mark FM0 as a reference (0 position). Figure 8 shows an example of the positional deviation amount ΔP0 and angle deviation amount Δφ0 of one component 91 in the before-transfer image PC1 and the after-transfer image PC2.

[0055] In the figure, for convenience of illustration, the part 91 in the pre-transport image PC1 is shown as a dashed rectangle, and the part 91 in the post-transport image PC2 is shown as a solid rectangle. Furthermore, the position P1 of the part 91 in the pre-transport image PC1 is indicated at the center of the part 91, and the position P2 of the part 91 in the post-transport image PC2 is indicated at the center of the part 91. Furthermore, the angle φ1 of the part 91 in the pre-transport image PC1 is indicated in the direction along the longitudinal direction of the part 91, and the angle φ2 of the part 91 in the post-transport image PC2 is indicated in the direction along the longitudinal direction of the part 91.

[0056] The adjustment unit 61 can adjust the transport parameter TP0 by increasing or decreasing the parameter value of the transport parameter TP0 so that the transport result of the item 80 falls within a predetermined range. In the above example, the adjustment unit 61 adjusts the transport parameter TP0 by increasing or decreasing the parameter value of the transport parameter TP0 so that the positional deviation amount ΔP0 falls within a predetermined range and the angle deviation amount Δφ0 falls within a predetermined range. The transport parameter TP0 shown in FIG. 9 includes two types of transport parameter TP1 and transport parameter TP2.

[0057] For example, transport parameter TP1 corresponds to transport parameter TP0 when moving component 91 in the horizontal direction (transport direction (X-axis direction) and opposing direction (Y-axis direction)). Transport parameter TP2 corresponds to transport parameter TP0 when moving component 91 around the R-axis or transport parameter TP0 when moving component 91 around the θ-axis. The transport parameter TP0 when moving component 91 around the R-axis and the transport parameter TP0 when moving component 91 around the θ-axis may be different types of transport parameter TP0.

[0058] As shown in FIG. 9 , the adjustment unit 61 can, for example, fix the transport parameter TP2 at a rate P21 and increase the transport parameter TP1 to a rate P11 and then a rate P12. The rates P11 and P12 indicate the rate (percentage) of the transport parameter TP1 relative to the reference value. Similarly, the rate P21 indicates the rate (percentage) of the transport parameter TP2 relative to the reference value. The reference values ​​of the transport parameters TP1 and TP2 can be set arbitrarily. For example, the reference value can be set to the maximum value at which the substrate-related operation machine WM0 can transport the item 80. The reference value can also be set to the parameter value used in the past production of the product substrate 900.

[0059] The adjustment unit 61 performs the previously described transport test of the item 80 using the transport parameter TP1 as a parameter value obtained by multiplying the reference value by a ratio P11 and the transport parameter TP2 as a parameter value obtained by multiplying the reference value by a ratio P21 (step S11 shown in FIG. 5). In the example shown in FIG. 9, in the transport test of the item 80 using the transport parameter TP0, the positional deviation amount ΔP0 falls within a predetermined range and the angle deviation amount Δφ0 falls within a predetermined range, and the transport result is good.

[0060] Therefore, there is room to increase the parameter values, and the operator or the transport parameter adjustment device 60 can determine not to adopt the parameter values ​​(No in step S14). In this case, the adjustment unit 61 increases the parameter values ​​(step S15). Specifically, the adjustment unit 61 sets the transport parameter TP1 to a parameter value obtained by multiplying the reference value by a ratio P12, and sets the transport parameter TP2 to a parameter value obtained by multiplying the reference value by a ratio P21, and performs the transport test for the item 80 described above (step S11).

[0061] 9, the transport result is also good. Therefore, the operator or the transport parameter adjustment device 60 determines not to adopt the parameter value (No in step S14), and the adjustment unit 61 can increase the parameter value (step S15). Similarly, the adjustment unit 61 can continue the transport test of the item 80 by sequentially increasing the parameter value of the transport parameter TP1 until the transport result becomes bad.

[0062] When the transport result is poor, the parameter value when the transport result was good immediately before that can be said to be the parameter value that allows the item 80 to be transported at the fastest speed. Therefore, the operator or the transport parameter adjustment device 60 can decide to adopt the parameter value (if Yes in step S14). As a result, the transport parameter TP1 is determined, and control by the transport parameter adjustment device 60 is temporarily terminated.

[0063] Next, the adjustment unit 61 can fix the parameter value of the determined transport parameter TP1 and sequentially increase the parameter value of the transport parameter TP2 to adjust the transport parameter TP2. Once all transport parameters TP0 have been determined, control by the transport parameter adjustment device 60 ends. Note that the adjustment unit 61 can also adjust the transport parameter TP0 by decreasing the parameter value of the transport parameter TP0 so that the transport results of the item 80 fall within a predetermined range. In this case, the adjustment unit 61 can, for example, calculate parameter values ​​by sequentially decreasing the rate by which the parameter TP0 is multiplied with the reference value, and perform the transport test of the item 80 described above.

[0064] Furthermore, as will be described later, the transport parameter TP0 does not necessarily have to be set to a parameter value that allows the fastest transport of the item 80. In this case, the operator or the transport parameter adjustment device 60 can stop the transport test of the item 80 midway if good transport results continue to be obtained in the transport test of the item 80 in which the parameter value of the transport parameter TP0 is increased or decreased.

[0065] 1-3-2. Calculation Unit 62 When the adjustment unit 61 adjusts the transport parameter TP0 and the parameter value of the transport parameter TP0 changes, the cycle time TS0 may fluctuate. Therefore, when the adjustment unit 61 adjusts the transport parameter TP0, the calculation unit 62 calculates the cycle time TS0 in accordance with the parameter value of the transport parameter TP0 (step S12 shown in FIG. 5).

[0066] Cycle time TS0 refers to the time it takes for a substrate-related operation to be performed by substrate-related operation machine WM0. For example, the time it takes for a substrate-related operation to be performed can exclude the time required for transporting substrate 90. In this case, cycle time TS0 is the time from when substrate 90 is carried into substrate-related operation machine WM0 until the substrate-related operation is performed by substrate-related operation machine WM0 and the substrate 90 is carried out. For example, when substrate-related operation machine WM0 is component mounting device WM3, cycle time TS0 per one substrate 90 in this case corresponds to the time required for a predetermined number of pick-and-place cycles as described above.

[0067] The parameter value of the transport parameter TP0 may change depending on the type of component 91. When the parameter value changes, the required time for the pick-and-place cycle may also vary. Therefore, the calculation unit 62 calculates the required time for a predetermined number of pick-and-place cycles for each type of component 91, and can use the total required time as the cycle time TS0 for one board 90. When the adjustment unit 61 adjusts the transport parameter TP0, the required time for the component 91 of the component type for which the transport parameter TP0 has been adjusted may vary depending on the change in the parameter value, and the cycle time TS0 for one board 90 may vary.

[0068] The time required for performing the substrate-related operation can also include the time required for the operation of transporting the substrate 90. For example, when the substrate-related operation machine WM0 is the component mounting device WM3, the cycle time TS0 per one substrate 90 in this case corresponds to the total time required for loading the substrate 90, the time required for a predetermined number of pick-and-place cycles, and the time required for unloading the substrate 90.

[0069] 2, the substrate-related operation machine WM0 may be a component mounting apparatus WM3 in which two component mounting machines 50, each having a common structure for mounting components 91 included in an article 80 onto a substrate 90, are arranged facing each other on the same base. As described above, in this case, the movable areas of the two mounting heads 33 overlap. The control device 45 executes non-interference control so that the two mounting heads 33 do not interfere with each other in the overlapping movable areas. In other words, while one of the two component mounting machines 50 is performing a substrate-related operation, the other of the two component mounting machines 50 may be waiting.

[0070] The calculation unit 62 can calculate the cycle time TS0, including the wait time during which one of the two component mounting machines 50 is waiting while the other is performing a substrate-related operation. In this way, for example, when a wait time occurs, the transport parameter TP0 does not necessarily have to be set to a parameter value that allows the item 80 to be transported at the fastest speed. Also, when emphasis is placed on stabilizing the transport state of the item 80, the transport parameter TP0 does not necessarily have to be set to a parameter value that allows the item 80 to be transported at the fastest speed.

[0071] 1-3-3. Display Unit 63 When adjusting the transport parameter TP0, for example, the speed, acceleration, deceleration, etc. when moving the item 80 may be increased to shorten the time required to transport the item 80. Conversely, when adjusting the transport parameter TP0, for example, the speed, acceleration, deceleration, etc. when moving the item 80 may be reduced to improve the transport accuracy of the item 80. In either case, the cycle time TS0 may vary due to the adjustment of the transport parameter TP0, and the calculation unit 62 calculates the cycle time TS0 according to the parameter value of the transport parameter TP0.

[0072] The display unit 63 displays the cycle time TS0 calculated by the calculation unit 62 (step S13 shown in FIG. 5). This allows, for example, an operator to refer to the cycle time TS0 while adjusting the transport parameter TP0 using the adjustment unit 61, and to confirm the effect of adjusting the transport parameter TP0. For example, if the operator has been able to reduce the time required to transport the item 80, but the cycle time TS0 is not reduced, the operator risks a decrease in the transport accuracy of the item 80, and therefore may return the parameter value of the transport parameter TP0 to the parameter value before the change.

[0073] Furthermore, if the worker suppresses the speed when moving the article 80 in order to improve the transport accuracy of the article 80, but the cycle time TS0 increases more than expected, it is expected that the worker will change the parameter value to one that increases the speed when moving the article 80. In this way, by referring to the cycle time TS0, the worker can determine whether or not adjusting the transport parameter TP0 is meaningful overall when adjusting the transport parameter TP0, and can easily determine whether or not to adopt the parameter value of the adjusted transport parameter TP0.

[0074] The display unit 63 may take various forms as long as it can display the cycle time TS0. For example, the display unit 63 may display the cycle time TS0 on a display device 63a. A known display device may be used as the display device 63a. In the embodiment, the display device 63a is provided in the component mounting device WM3, for example.

[0075] 9, the display unit 63 can display the cycle time TS0 for each parameter value of the transport parameter TP0 adjusted by the adjustment unit 61. Specifically, the cycle time TS0 when the transport parameter TP1 is set to a parameter value obtained by multiplying the reference value by a ratio P11 and the transport parameter TP2 is set to a parameter value obtained by multiplying the reference value by a ratio P21 is indicated by the cycle time TS1. Furthermore, the cycle time TS0 when the transport parameter TP1 is set to a parameter value obtained by multiplying the reference value by a ratio P12 and the transport parameter TP2 is set to a parameter value obtained by multiplying the reference value by a ratio P21 is indicated by the cycle time TS2.

[0076] In this way, when the cycle time TS0 is displayed for each parameter value of the transport parameter TP0 adjusted by the adjustment unit 61, for example, the worker can easily compare the cycle time TS0 for each parameter value. Therefore, for example, the worker can easily determine whether or not to adopt the adjusted parameter value of the transport parameter TP0.

[0077] 9, the display unit 63 can also display the transport result of the item 80 along with the cycle time TS0 calculated by the calculation unit 62. The display unit 63 can also display information about the item 80, such as component type information and supply position information. For example, if the component 91 is a resistor, information such as a symbol indicating the resistor and its resistance value is included in the component type information. Furthermore, information about the position of the slot 21 in which the feeder 23 is installed in the component supply device 20 is included in the supply position information.

[0078] The display unit 63 can also display the allowable range of the cycle time TS0 together with the cycle time TS0 calculated by the calculation unit 62. In this case, the operator can easily check whether the cycle time TS0 calculated by the calculation unit 62 is within the allowable range. If the cycle time TS0 calculated by the calculation unit 62 is within the allowable range, the operator can easily stop the transport test of the item 80 midway.

[0079] 1, substrate 90 is transported sequentially across a plurality of (five in this figure) substrate-related performing machines WM0. If a substrate-related performing machine WM0 has an extremely long cycle time TS0, that substrate-related performing machine WM0 may become a bottleneck, potentially reducing the effect of reducing the cycle times TS0 of the other substrate-related performing machines WM0. Therefore, when substrate 90 is transported sequentially across a plurality of (five) substrate-related performing machines WM0, display unit 63 may display an allowable range of cycle times TS0 within which the uniformity of the cycle times TS0 of each of the plurality of (five) substrate-related performing machines WM0 falls within a desired range.

[0080] Specifically, the smaller the difference between the longest cycle time TS0 and the shortest cycle time TS0 among the multiple (five) substrate-related performing machines WM0, the greater the uniformity of the cycle times TS0. By displaying the allowable range of cycle times TS0 within which the uniformity of the cycle times TS0 falls within the desired range, the worker can more easily improve the cycle time TS0 of the substrate-related performing machine WM0 that is causing a bottleneck. In addition, the worker can more easily prevent excessive shortening of the cycle time TS0.

[0081] 2, the substrate-related operation performing machine WM0 of this embodiment includes a component mounting device WM3 in which two component mounting devices 50 having a common structure for mounting components 91 included in an article 80 onto a substrate 90 are arranged facing each other on the same base. However, the component mounting device WM3 is not limited to the above-described embodiment. For example, the component mounting device WM3 may include a single component mounting device 50 for mounting components 91 onto a substrate 90.

[0082] In either configuration, the component mounting device WM3 can also mount solder balls included in the item 80 onto the board 90 using the holding member 34. Solder balls refer to spherical solder that are arranged at the electrode positions of the component 91 on the board 90 on which the component 91 is mounted. Because the solder balls are spherical, there is no need to consider the angle deviation amount Δφ0. In other words, the adjustment unit 61 captures images of the solder balls included in the item 80 before and after transporting them. The adjustment unit 61 can then adjust the transport parameter TP0 so that the position deviation amount ΔP0, which is the difference between the position P1 of the solder ball in the pre-transport image PC1 captured before transport and the position P2 of the solder ball in the post-transport image PC2 captured after transport, falls within a predetermined range.

[0083] When solder balls are picked up and held by the holding member 34, a single holding member 34 often holds a plurality of solder balls in accordance with the arrangement of a plurality of electrode positions. It is important that all of the solder balls to be picked are held by the holding member 34. Therefore, the adjustment unit 61 can adjust the transport parameter TP0 by increasing or decreasing the parameter value of the transport parameter TP0 so that all of the solder balls to be picked are held by the holding member 34.

[0084] The substrate-related performing operation machine WM0 can also transport a substrate 90 included in the item 80. In this case, for example, the adjustment unit 61 captures images of the substrate 90 before and after transporting the substrate 90. Specifically, the adjustment unit 61 can capture a pre-transfer image PC1 at the upstream substrate-related performing operation machine WM0 before transporting the substrate 90, and a post-transfer image PC2 at the downstream substrate-related performing operation machine WM0 after transporting the substrate 90. The pre-transfer image PC1 and the post-transfer image PC2 can be captured by, for example, the substrate camera 42. The substrate 90 has, for example, multiple reference marks FM0 provided diagonally. The adjustment unit 61 can recognize, for example, the center position of the substrate 90 (corresponding to positions P1 and P2) based on the multiple reference marks FM0.

[0085] Furthermore, the adjustment unit 61 can recognize the rotation angle of the board 90 (corresponding to angles φ1 and φ2) based on the multiple reference marks FM0. Therefore, the adjustment unit 61 can adjust the transport parameter TP0 so that the positional deviation amount ΔP0 falls within a predetermined range and the angular deviation amount Δφ0 falls within a predetermined range, just as in the case of the component 91. Note that the substrate-related operation machine WM0 is not limited to the component mounting device WM3. The substrate-related operation machine WM0 may be any of the various substrate-related operation machines WM0 already described, such as the printing machine WM1.

[0086] Furthermore, the substrate-related performing operation machine WM0 can edit various parameters related to substrate-related operations, including the transport parameter TP0, and can store the parameter values ​​in a storage device. Such a function of the substrate-related performing operation machine WM0 is referred to as an on-machine editing function. The adjustment unit 61 can adjust the transport parameter TP0 as the on-machine editing function. In this case, at least the adjustment unit 61 of the adjustment unit 61, calculation unit 62, and display unit 63 can be provided in a control device of the substrate-related performing operation machine WM0 (e.g., control device 45 in the component mounting device WM3). Furthermore, the calculation unit 62 can calculate the cycle time TS0 in the on-machine editing, and the display unit 63 can display the cycle time TS0 in the on-machine editing.

[0087] 3. Transport parameter adjustment method What has already been described about the transport parameter adjustment device 60 also applies to the transport parameter adjustment method. Specifically, the transport parameter adjustment method includes an adjustment step and a calculation step. The adjustment step corresponds to the control performed by the adjustment unit 61. The calculation step corresponds to the control performed by the calculation unit 62. The transport parameter adjustment method can also include a display step. The display step corresponds to the control performed by the display unit 63. Duplicate explanations will be omitted in this specification.

[0088] 4. Example of Effects of the Embodiment According to the transport parameter adjustment device 60, when the transport parameter TP0 is adjusted using the substrate-related performing apparatus WM0, the cycle time TS0 can be calculated according to the parameter value of the transport parameter TP0. What has been described above about the transport parameter adjustment device 60 can also be applied to the transport parameter adjustment method.

[0089] 33: Placement head, 34: Holding member, 50: Component mounting machine, 60: Transport parameter adjustment device, 61: Adjustment unit, 62: Calculation unit, 63: Display unit, 80: Article, 90: Board, 91: Component, PC1: Image before transport, PC2: Image after transport, P1, P2: Position, φ1, φ2: Angle, ΔP0: Positional deviation amount, Δφ0: Angle deviation amount, TP0: Transport parameter, TS0: Cycle time, WM0: Board-related operation machine, WM3: Component mounting device.

Claims

1. A transport parameter adjustment device comprising: an adjustment unit that uses a substrate-related operation machine to adjust transport parameters, which are control parameters for transporting an object in the substrate-related operation machine that performs a specified substrate-related operation on a substrate, and a calculation unit that calculates a cycle time, which is the time it takes for the substrate-related operation to be performed in the substrate-related operation machine, in accordance with a parameter value of the transport parameter while the adjustment unit is adjusting the transport parameters.

2. The transport parameter adjustment device according to claim 1, wherein the adjustment unit adjusts the transport parameter by increasing or decreasing the parameter value of the transport parameter so that the transport result of the item falls within a predetermined range.

3. The transport parameter adjustment device of claim 2, wherein the adjustment unit images the item before and after transporting the item, and adjusts the transport parameters so that a positional deviation amount, which is the difference between the position of the item in a pre-transport image taken before transport and the position of the item in a post-transport image taken after transport, is within the specified range, and an angle deviation amount, which is the difference between the angle of the item in the pre-transport image and the angle of the item in the post-transport image, is within the specified range.

4. The transport parameter adjustment device according to claim 3, wherein the substrate-related operation machine is a component mounting device that mounts a component contained in the object onto the substrate using a mounting head equipped with a holding member that picks up and holds the component, and the adjustment unit captures images of the component held by the holding member before and after moving the mounting head to obtain the pre-transport image and the post-transport image.

5. A transport parameter adjustment device as claimed in any one of claims 1 to 4, wherein the substrate-related operation machine is a component mounting device in which two component mounting machines of a common structure for mounting components contained in the article onto the substrate are arranged facing each other on the same base, and the calculation unit calculates the cycle time including a waiting time during which one of the two component mounting machines is waiting while the other of the two component mounting machines is performing the substrate-related operation.

6. The transportation parameter adjustment device according to claim 1, further comprising a display unit that displays the cycle time calculated by the calculation unit.

7. The transport parameter adjustment device according to claim 6, wherein the display unit displays the cycle time for each parameter value of the transport parameter adjusted by the adjustment unit.

8. The transportation parameter adjustment device according to claim 6 or 7, wherein the display unit displays the cycle time calculated by the calculation unit together with an allowable range of the cycle time.

9. A transport parameter adjustment device as described in claim 8, wherein the display unit displays the allowable range of the cycle time within which the uniformity of the cycle time in each of the substrate-related operation machines is within a desired range when the substrate is transported sequentially across the substrate-related operation machines.

10. A transport parameter adjustment device according to claim 1, wherein the cycle time is the time from when the substrate is carried into the substrate-related operation machine until the substrate-related operation is performed in the substrate-related operation machine and the substrate is carried out.

11. A transport parameter adjustment method comprising: an adjustment step of adjusting, by use of a substrate-related operation machine, a transport parameter which is a control parameter for transporting an object by the substrate-related operation machine that performs a predetermined substrate-related operation on a substrate; and a calculation step of calculating, while the transport parameter is being adjusted by the adjustment step, a cycle time which is a time required for the substrate-related operation to be performed by the substrate-related operation machine, in accordance with a parameter value of the transport parameter.

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