Component holding system and method for holding scattered components

Abstract

The present invention provides a component holding system comprising: a stage upon which a plurality of components are scattered; a holding tool that holds the components scattered upon the stage; an image capture device that captures an image of the components scattered upon the stage; a first determination device that uses image capture data captured by the image capture device as a basis for determining whether or not a component to be held that the holding tool is to hold overlaps with something other than the component to be held; and a second determination device that uses image capture data captured by the image capture device as a basis for determining whether or not something other than the component to be held has entered an area containing the outline of the holding tool when holding the component to be held, wherein the holding tool holds the component to be held if the first determination device has determined that the component to be held does not overlap with something other than the component to be held and the second determination device has determined that something other than the component to be held has not entered the area.

Description

Component holding system and method for holding scattered components

[0001] The present invention relates to a component holding system that uses a holder to hold components scattered on a stage.

[0002] The following patent document describes a technique for holding components scattered on a stage using a holder.

[0003] International Publication No. 2022 / 215161

[0004] An object of the present invention is to preferably hold components scattered on a stage using a holder.

[0005] In order to solve the above-mentioned problems, this specification discloses a component holding system comprising: a stage on which a plurality of components are scattered; a holder that holds the components scattered on the stage; an imaging device that images the components scattered on the stage; a first determination device that determines whether a component to be held by the holder overlaps with something other than the component to be held based on image data captured by the imaging device; and a second determination device that determines whether anything other than the component to be held enters an area including the outline of the holder when it holds the component to be held based on image data captured by the imaging device; and when the first determination device determines that the component to be held does not overlap with anything other than the component to be held and the second determination device determines that nothing other than the component to be held enters the area, the holder holds the component to be held.

[0006] This specification also discloses a method for holding scattered components in which a holder for holding a component holds one component from a plurality of components scattered on a stage, the method comprising: a first determination step for determining whether one of the plurality of components scattered on the stage is overlapping with another component based on image data obtained by imaging the one component; and a second determination step for determining whether anything other than the one component has entered an area including the outline of the holder when holding the one component based on the image data and the area; and if it is determined in the first determination step that the one component is not overlapping with anything other than the one component and it is determined in the second determination step that nothing other than the one component has entered the area, the one component is determined to be a component that can be held by the holder, and the holder executes holding of the one component that it has determined to be able to hold.

[0007] According to the present disclosure, the holder holds the component to be held when it is determined that the component to be held is not overlapped with anything other than the component to be held, and when it is determined that nothing other than the component to be held is in the area including the outer shape of the holder when holding the component to be held. This allows the holder to suitably hold components scattered on the stage.

[0008] 1 is a perspective view showing a component mounter. FIG. 2 is a perspective view showing a component mounting device of the component mounter. FIG. 3 is a perspective view showing a bulk component supply device. FIG. 4 is a perspective view showing a component supply unit. FIG. 5 is a see-through view showing a component supply unit. FIG. 6 is a see-through view showing a component supply unit. FIG. 7 is a perspective view showing a component scattering device. FIG. 8 is a perspective view showing a component scattering device. FIG. 9 is a perspective view showing a component holding head. FIG. 10 is a view showing a component receiving member with lead components stored therein. FIG. 11 is a block diagram showing a control device of the component mounter. FIG. 12 is a view showing a state in which lead components are scattered on a stage. FIG. 13 is a view showing image data of lead components used for pattern matching. FIG. 14 is a view explaining a case in which it is determined whether components overlap. FIG. 15 is a view showing a chuck when holding a component to be held. FIG. 16 is a view showing an area including the cross-sectional outline of the chuck when holding a component to be held. FIG. 17 is a view showing an area including the cross-sectional outline of the chuck when holding a component to be held. FIG. 18 is a view explaining a case in which it is determined whether the chuck will come into contact with an object other than the component to be held. FIG. 19 is a view explaining a case in which it is determined whether the chuck will come into contact with an object other than the component to be held. FIG. 19 is a view showing a suction nozzle when holding a component to be held. FIG. 19 is a view showing an area including the cross-sectional outline of the suction nozzle when holding a component to be held. 10 is a diagram showing an area including the outer shape of a cross section of the suction nozzle when holding a component to be held; FIG.

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0010] 1 shows a component mounter 10. The component mounter 10 is a device for performing the operation of mounting components on a circuit board 12. The component mounter 10 includes a device main body 20, a substrate transport and holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 11) 34. Examples of the circuit board 12 include a circuit board, a substrate with a three-dimensional structure, and the like, and examples of the circuit board include a printed wiring board, a printed circuit board, and the like.

[0011] The device main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate transport and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction and includes a transport device 50 and a clamp device 52. The transport device 50 transports the circuit board 12, and the clamp device 52 holds the circuit board 12. As a result, the substrate transport and holding device 22 transports the circuit board 12 and securely holds the circuit board 12 at a predetermined position. In the following description, the transport direction of the circuit board 12 is referred to as the X-direction, the horizontal direction perpendicular to that direction is referred to as the Y-direction, and the vertical direction is referred to as the Z-direction. In other words, the width direction of the component mounter 10 is the X-direction, and the front-to-rear direction is the Y-direction.

[0012] The component mounting device 24 is mounted on the beam 42 and includes two work heads 60, 62 and a work head moving device 64. Each work head 60, 62 has a suction nozzle 66 (see FIG. 2) and holds a component using the suction nozzle 66. The work head moving device 64 also includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60, 62 together to any position on the frame 40. As shown in FIG. 2, each work head 60, 62 is detachably attached to a slider 74, 76, and the Z-direction moving device 72 moves the slider 74, 76 individually in the vertical direction. That is, the work heads 60, 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] The imaging device 26 is attached to the slider 74 facing downward, and moves in the X, Y, and Z directions together with the work head 60. This allows the imaging device 26 to capture an image of any position on the frame 40. As shown in Figure 1, the imaging device 28 is disposed on the frame 40 between the substrate material conveying and holding device 22 and the component supply device 30 facing upward. This allows the imaging device 28 to capture an image of a component held by the suction nozzle 66 of the work heads 60, 62.

[0014] The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device that supplies components placed on a tray. The feeder-type component supply device is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).

[0015] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 aligns a plurality of components scattered loosely and supplies the aligned components. In other words, the bulk component supply device 32 aligns a plurality of components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. The configuration of the component supply device 32 is described in detail below. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0016] As shown in FIG. 3, the bulk component supply device 32 includes a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.

[0017] The component supply unit 82 includes a component supply device 88, a component scattering device (see FIG. 4) 90, and a component returning device (see FIG. 4) 92, and these component supply devices 88, component scattering device 90, and component returning device 92 are integrally configured. The component supply units 82 are detachably attached to a base 96 of the main body 80, and in the bulk component supply device 32, five component supply units 82 are arranged in a row in the X direction.

[0018] The component supply device 88 has a generally rectangular box shape and is disposed so as to extend in the Y direction as shown in Figures 4 and 5. The Y direction is referred to as the front-to-rear direction of the component supply device 88, and the direction toward the side of the component supply unit 82 where the component returning device 92 is disposed is referred to as the front, and the direction toward the side where the component supply device 88 is disposed is referred to as the rear.

[0019] The component supply device 88 has openings on the top and front, with the opening on the top serving as a component inlet 97 and the opening on the front serving as a component outlet 98. In the component supply device 88, an inclined plate 104 is disposed below the inlet 97. The inclined plate 104 is disposed so as to slope downward from the rear end face of the component supply device 88 toward the center.

[0020] 5, a conveyor device 106 is disposed in front of the inclined plate 104. The conveyor device 106 is disposed so as to slope upward from the front end of the inclined plate 104 toward the front of the component supply device 88. The conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 5. In other words, the conveying direction of the conveyor device 106 is diagonally upward from the front end of the inclined plate 104 toward the front.

[0021] An inclined plate 126 is disposed below the front end of the conveyor 106. The inclined plate 126 extends from the front end face of the component supply device 88 toward the bottom of the conveyor 106, with its rear end slanted diagonally downward. Furthermore, an inclined plate 128 is disposed below the inclined plate 126. The inclined plate 128 is inclined from below the center of the conveyor 106 toward the discharge port 98 of the component supply device 88, with its front end positioned downward.

[0022] 4, a pair of side frames 130 are attached to the base 96. The pair of side frames 130 are erected facing each other and parallel to each other, extending in the Y direction. The distance between the pair of side frames 130 is slightly larger than the width dimension of the component supplier 88, and the component supplier 88 is detachably mounted between the pair of side frames 130.

[0023] The component scattering device 90 includes a component support member 150 and a component support member moving device 152. The component support member 150 is composed of a stage 156 and a pair of side walls 158. The stage 156 has a generally longitudinal plate shape and is disposed so as to extend forward from below the component supply device 88, which is mounted between a pair of side frames 130. The upper surface of the stage 156 is generally horizontal and, as shown in FIG. 5, is disposed with a slight clearance from the front end of the inclined plate 128 of the component supply device 88. The pair of side walls 158 are fixed in an upright position on both longitudinal sides of the stage 156, as shown in FIG. 4, and the upper ends of the side walls 158 extend above the upper surface of the stage 156.

[0024] The component support member moving device 152 slides the component support member 150 in the Y direction by operating an air cylinder (see FIG. 11) 166. During this movement, the component support member 150 moves between a stored state (see FIG. 6) in which it is stored below the component feeder 88 and an exposed state (see FIG. 5) in which it is exposed from below the component feeder 88.

[0025] As shown in FIG. 7 , the component returning device 92 includes an object storage container 180 and a container swinging device 181. The object storage container 180 is generally box-shaped with an arc-shaped bottom. The object storage container 180 is held swayably at the front end of the stage 156 of the component support member 150 and swings when the container swinging device 181 is activated. The object storage container 180 swings between a storage position (see FIG. 7 ) in which the opening faces upward and a return position (see FIG. 8 ) in which the opening faces the upper surface of the stage 156 of the component support member 150.

[0026] As shown in FIG. 3 , the imaging device 84 includes a camera 290 and a camera moving device 292. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 above the component supplier 88 and extends in the width direction (X direction) of the bulk component supply device 32. The slider 298 is slidably attached to the guide rail 296 and can slide to any position by the operation of an electromagnetic motor (see FIG. 11 ) 299. The camera 290 is attached to the slider 298 while facing downward.

[0027] As shown in FIG. 3, the component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

[0028] The component holding head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y-slider 316 disposed above the component supply unit 82 so as to extend in the X direction. The Y-slider 316 is moved to any position in the Y direction by driving an electromagnetic motor (see FIG. 11) 319. The X-direction moving device 310 has an X-slider 320 disposed on a side of the Y-slider 316. The X-slider 320 is moved to any position in the X direction by driving an electromagnetic motor (see FIG. 11) 321. The Z-direction moving device 314 has a Z-slider 322 disposed on a side of the X-slider 320. The Z-slider 322 is moved to any position in the Z direction by driving an electromagnetic motor (see FIG. 11) 323.

[0029] As shown in FIG. 9 , the component holding head 302 includes a head body 330, a chuck 332, a swivel device 334, and a rotation device 335. The head body 330 is integrally formed with the Z-slider 322. The chuck 332 includes a chuck body 337 and a pair of gripping jaws 338, and is detachably attached to the lower end of a holder 340. The pair of gripping jaws 338 are held by the chuck body 337 so that they can move toward and away from each other. The pair of gripping jaws 338 grip a component when they move toward each other, and release the gripped component when they move away from each other. The holder 340 is bendable about a support shaft 344, and the orientation of the holder 340 is bent 90 degrees upward by the operation of the swivel device 334. As a result, the chuck 332 attached to the lower end of the holder 340 rotates 90 degrees and is positioned in the rotated position. That is, the chuck 332 rotates between a non-rotating position and a rotating position by the operation of the rotating device 334. Of course, it is also possible to position and stop the chuck 332 at an angle between the non-rotating position and the rotating position. In addition, the rotation device 335 rotates the chuck 332 about its axis.

[0030] 3, each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, and is fixed to the main body 80, side-by-side with the component supply unit 82 in the horizontal direction. Five component receiving members 392 are attached to the component carrier 388, lined up in a horizontal direction, and components are placed on each of the component receiving members 392.

[0031] The bulk component supply device 32 is capable of supplying a variety of components, and various component receiving members 392 are prepared according to the shape of the components. Here, as an example of an electronic circuit component supplied by the bulk component supply device 32, a component receiving member 392 corresponding to a lead component 410 having leads, as shown in Figure 10, will be described. The lead component 410 is composed of a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412.

[0032] The component receiving member 392 is also formed with a component receiving recess 416 shaped to accommodate the lead component 410. The component receiving recess 416 is a stepped recess, and is composed of a main body receiving recess 418 that opens on the top surface of the component receiving member 392, and a lead receiving recess 420 that opens on the bottom surface of the main body receiving recess 418. The lead component 410 is inserted into the component receiving recess 416 with the leads 414 facing downward. As a result, the leads 414 are inserted into the lead receiving recess 420, and the lead component 410 is placed inside the component receiving recess 416 with the component body 412 inserted into the main body receiving recess 418.

[0033] 3, the component carrier moving device 390 is a plate-shaped longitudinal member disposed in front of the component supply unit 82 so as to extend in the front-rear direction. A component carrier 388 is disposed on the upper surface of the component carrier moving device 390 so as to be slidable in the front-rear direction, and is driven by an electromagnetic motor 430 (see FIG. 11) to slide to any position in the front-rear direction. When the component carrier 388 slides toward the component supply unit 82, it slides to a component receiving position located within the range of movement of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides away from the component supply unit 82, it slides to a component supply position located within the range of movement of the work heads 60, 62 by the work head moving device 64.

[0034] 11 , the control device 34 includes an overall control device 450, a plurality of individual control devices (only one of which is shown in the figure), and an image processing device 454. The overall control device 450 is configured mainly by a computer and is connected to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. As a result, the overall control device 450 controls the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 in an overall manner. The plurality of individual control devices 452 are also configured mainly by a computer and are provided corresponding to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 (only the individual control device 452 corresponding to the bulk component supply device 32 is shown in the figure).

[0035] The individual control device 452 of the bulk component supply device 32 is connected to the component scattering device 90, the component returning device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. As a result, the individual control device 452 of the bulk component supply device 32 controls the component scattering device 90, the component returning device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. In addition, the image processing device 454 is connected to the imaging device 84 and processes image data captured by the imaging device 84. The image processing device 454 is also connected to the individual control device 452 of the bulk component supply device 32. As a result, the individual control device 452 of the bulk component supply device 32 acquires the image data captured by the imaging device 84.

[0036] The bulk component supply device 32 also has a storage device 458. The storage device 458 is connected to the individual control device 452, and stores various information in accordance with commands from the individual control device 452.

[0037] The component mounter 10, with the above-described configuration, performs a component mounting operation on the circuit board 12 held by the substrate conveying and holding device 22. Specifically, the circuit board 12 is conveyed to the work position and fixedly held at that position by the clamping device 52. Next, the imaging device 26 moves above the circuit board 12 and captures an image of the circuit board 12. This provides information regarding an error in the holding position of the circuit board 12. Furthermore, the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. Note that the supply of components by the bulk component supply device 32 will be described in detail later. Next, one of the work heads 60, 62 moves above the component supply position and holds the component with the suction nozzle 66. Next, the work head 60, 62 holding the component moves above the imaging device 28. The imaging device 28 then captures an image of the component held by the suction nozzle 66. This provides information regarding an error in the holding position of the component. Then, the work heads 60, 62 holding the components move above the circuit board 12, and the components they are holding are mounted on the circuit board 12 after correcting any errors in the holding position of the circuit board 12, errors in the holding position of the components, etc.

[0038] Next, we will explain the supply of components by the bulk component supply device 32. In the bulk component supply device 32, a worker inserts lead components 410 into the inlet 97 of the component supply device 88. The component supply unit 82 and the component delivery device 86 then operate to supply the inserted lead components 410 placed on the component receiving members 392 of the component carrier 388.

[0039] Specifically, the operator loads lead components 410 through the loading port 97 on the top surface of the component supply device 88. At this time, the component support member 150 has been moved to a position below the component supply device 88 by the operation of the component support member moving device 152, and is in a stored state (see FIG. 6). Note that when the component support member 150 is stored, the component storage container 180 disposed at the front end of the component support member 150 is positioned in front of the component supply device 88, with the opening of the component storage container 180 facing upward (storage position).

[0040] The lead components 410 fed through the inlet 97 of the component supply device 88 fall onto the inclined plate 104 of the component supply device 88 and roll down to the lower end of the front side of the inclined plate 104. At this time, the lead components 410 that have rolled down to the lower end of the front side of the inclined plate 104 are piled up between the lower end of the front side of the inclined plate 104 and the lower end of the rear side of the conveyor device 106. Then, the conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 6. As a result, the lead components 410 piled up between the inclined plate 104 and the conveyor belt 112 are transported diagonally upward by the conveyor belt 112.

[0041] Then, the lead components 410 transported by the conveyor belt 112 drop from the upper front end of the conveyor device 106 onto the inclined plate 126. The lead components 410 that have fallen onto the inclined plate 126 roll backward along the inclined plate 126 and drop onto the inclined plate 128. The lead components 410 that have fallen onto the inclined plate 128 roll forward and are discharged from the discharge port 98 on the front side of the component supply device 88.

[0042] As a result, the lead components 410 discharged from the discharge port 98 of the component supply device 88 are accommodated inside the component storage container 180. Then, when a predetermined amount of lead components 410 has been discharged from the component supply device 88, that is, when the conveyor device 106 has operated a certain amount, the conveyor device 106 stops. Next, the component support member 150 is moved forward from the stored state by operation of the component support member moving device 152.

[0043] Then, when the component support member 150 moves forward a predetermined distance from the stored state, the container swinging device 181 of the component returning device 92 is activated, swinging the component housing container 180. As a result, the orientation of the component housing container 180 changes vigorously from an orientation in which the opening faces upward (storage orientation) to an orientation in which the opening faces the stage 156 (return orientation). At this time, the lead components 410 accommodated in the component housing container 180 are expelled vigorously toward the stage 156. As a result, a plurality of lead components 410 are scattered from the component housing container 180 onto the stage 156, as shown in FIG. 12 .

[0044] A plurality of lead components 410 are scattered on stage 156, and the lead components 410 are scattered on stage 156 in roughly three positions. Specifically, in a first position, the lead components 410 are scattered in a position in which the extending surfaces of the leads 414 face sideways and the two leads 414 are aligned generally horizontally. In a second position, the lead components 410 are scattered in a position in which the extending surfaces of the leads 414 face sideways and the two leads 414 are aligned generally vertically. In a third position, the lead components 410 are scattered in a position in which the extending surfaces of the leads 414 face upward. The three positions in which the lead components 410 are scattered will be referred to as lead component 410a in the first position, lead component 410b in the second position, and lead component 410c in the third position.

[0045] When the lead components 410 are scattered on the stage 156 as described above, the camera moving device 292 operates to move the camera 290 of the imaging device 84 to above the component support member 150. The camera 290 then captures an image of the lead components 410 scattered on the stage 156. Because the viewing angle of the camera 290, i.e., the imaging range, is wider than that of the stage 156, the camera 290 captures an image of the entire stage 156, i.e., all of the lead components 410 scattered on the stage 156, all at once. The individual control device 452 then identifies the orientation of the lead components 410 scattered on the stage 156 by pattern matching based on the imaging data captured by the camera 290.

[0046] Specifically, the individual control device 452 identifies the outline of the lead component 410 based on the image data of the lead component 410 captured by the camera 290, and calculates the shape of the upper surface of the lead component 410, that is, the shape of the lead component 410 as viewed from above. Meanwhile, the storage device 458 stores shape data corresponding to the outline of the lead component 410a in the first orientation, as shown in FIG.

[0047] The individual control device 452 then determines whether the shape of the upper surface of the lead component 410 calculated based on the image data of the lead component 410 captured by the camera 290 matches the shape data stored in the storage device 458. If the individual control device 452 determines that the shape of the upper surface of the lead component 410 matches the shape data, it recognizes the lead component 410 that is determined to match as a lead component 410a in a first orientation. On the other hand, if the individual control device 452 determines that the shape of the upper surface of the lead component 410 does not match the shape data, it recognizes the lead component 410 that is determined to not match as a lead component 410b in a second orientation or a lead component 410c in a third orientation.

[0048] Next, the individual control device 452 determines whether the lead component 410a, which has been determined to be in the first orientation by pattern matching, overlaps with anything other than the lead component 410a, based on the image data of the lead component 410 captured by the camera 290. More specifically, the individual control device 452 identifies the outline of the lead component 410 based on the image data using the pattern matching described above. Therefore, as shown in FIG. 14 , the individual control device 452 first sets a virtual line 470 that is wider than the outline of the lead component 410 by a predetermined distance (e.g., 1 mm) toward the outside of the lead component 410. Then, based on the image data of the lead component 410 captured by the camera 290, the individual control device 452 determines whether anything other than the top surface of the stage 156 exists between the outline of the lead component 410 and the virtual line 470.

[0049] Specifically, for example, the hue of the top surface of stage 156 is stored in storage device 458, and individual control device 452 determines whether or not there is a hue between the outline of lead component 410 and virtual line 470 that is different from the hue of the top surface of stage 156, based on the image data of lead component 410 captured by camera 290 and the hue of the top surface of stage 156 stored in storage device 458. In this case, for example, if there is no hue between the outline of lead component 410 and virtual line 470 that is different from the hue of the top surface of stage 156 stored in storage device 458, individual control device 452 determines that lead component 410 is placed on the top surface of stage 156 without overlapping anything other than lead component 410. On the other hand, if there is a hue between the outline of lead component 410 and virtual line 470 that is different from the hue of the top surface of stage 156 stored in storage device 458, individual control device 452 determines that at least a portion of lead component 410 is placed on something other than the top surface of stage 156. 14, lead component 410 overlaps with other lead components, but lead component 410 may also overlap side wall portion 158 of component support member 150. Therefore, when lead component 410 overlaps with at least one of side wall portion 158 and a lead component other than lead component 410, individual control device 452 determines that lead component 410 overlaps with something other than lead component 410. Individual control device 452 then determines that lead component 410 does not overlap with anything else as the lead component to be picked up, i.e., the component to be picked up.

[0050] In this way, the individual control device 452 determines that the lead component 410a in the first orientation, which is determined not to overlap anything other than the upper surface of the stage 156, is the component to be picked up. On the other hand, the individual control device 452 does not determine that the lead component 410b, which is determined to be in the second orientation, and the lead component 410c, which is determined to be in the third orientation, are the components to be picked up, even though they are lead components 410 determined not to overlap anything other than the upper surface of the stage 156. Furthermore, even if the lead component 410a is determined to be in the first orientation, the lead component 410a, which is determined to overlap anything other than the upper surface of the stage 156, is not determined to be the component to be picked up. This is because the width of the upward-facing surface of the lead component 410b in the second orientation is narrow, and therefore the chuck 332 cannot properly hold the lead component 410b. Furthermore, lead component 410c in the third position has leads 414 arranged on its upper surface facing upward, and the leads 414 get in the way, preventing chuck 332 from properly holding lead component 410c. Also, lead component 410a in the first position overlapping something other than the upper surface of stage 156 has an upper surface that is not horizontal, preventing chuck 332 from properly holding lead component 410a. Furthermore, lead component 410a in the first position overlapping something other than the upper surface of stage 156 has an upper surface that is not at a constant height, so when chuck 332 grips lead component 410a, it may collide with lead component 410a, preventing proper holding.

[0051] However, even if lead component 410a in the first position is determined not to overlap anything other than the upper surface of stage 156, chuck 332 may not be able to hold it properly. Specifically, as shown in FIG. 15 , when chuck 332 is to hold lead component 410A to be held, chuck 332 lowers toward lead component 410A with a pair of gripping claws 338 spaced apart by a distance greater than the width of lead component 410A. At this time, for example, if a lead component 410B other than lead component 410A is located near lead component 410A to be held, lead component 410B will come into contact with the pair of gripping claws 338 of chuck 332 as it lowers toward lead component 410A. When chuck 332 comes into contact with lead component 410B other than lead component 410A to be held, lead component 410A cannot be held properly.

[0052] In consideration of this, individual control device 452 determines that lead component 410 in the first orientation does not overlap anything other than the upper surface of stage 156, and further determines whether chuck 332 will come into contact with lead component 410B other than lead component 410A when chuck 332 holds lead component 410A to be held. More specifically, when chuck 332 descends toward lead component 410A to be held in order to hold lead component 410A, there is a risk that chuck 332 will come into contact with lead component 410B other than lead component 410A. Therefore, individual control device 452 determines whether lead component 410B other than lead component 410A to be held enters an area including the outline of chuck 332 when chuck 332 holds lead component 410A to be held. 15 has been described as a case in which chuck 332 may come into contact with lead components 410B other than lead component 410A when holding lead component 410A, but if chuck 332 holds scattered lead component 410A near sidewall 158 of component support member 150, there is also a risk of chuck 332 coming into contact with sidewall 158 of component support member 150. Therefore, individual control device 452 also determines whether anything other than lead component 410A held by chuck 332 has entered the area including the outline of chuck 332 when holding lead component 410A to be held.

[0053] Specifically, an area including the outer shape of the cross section of chuck 332 when holding lead component 410A to be held is set in storage device 458 as an area including the outer shape of chuck 332 when holding lead component 410A to be held. The cross section of chuck 332 when holding lead component 410A to be held is a cross section of chuck 332 at a position parallel to the upper surface of stage 156, and is a cross section of chuck 332 at a predetermined height. Here, the predetermined height of chuck 332 is the height from the bottom end of chuck 332.

[0054] For example, the area of ​​the chuck 332 when the predetermined height is L1 is set in the memory device 458 as an area including the cross section of the chuck 332 at the position of the dashed line 480. More specifically, the cross section of the chuck 332 at the position of the dashed line 480 has a shape indicated by diagonal lines in Fig. 16, which is a cross section of a pair of gripping jaws 338. The shape obtained by integrating the cross sections of the pair of gripping jaws 338 with outlines is set in the memory device 458 as the area 482 of the chuck 332 when the predetermined height is L1.

[0055] Furthermore, for example, an area including a cross section of the chuck 332 at the position of the dashed line 490 is set in the storage device 458 as the area of ​​the chuck 332 when the predetermined height is L2. More specifically, the cross section of the chuck 332 at the position of the dashed line 490 has a shape indicated by diagonal lines in Fig. 17, which is a cross section of the chuck body 337. The shape of the cross section of the chuck body 337 is set in the storage device 458 as an area 492 of the chuck 332 when the predetermined height is L2.

[0056] Here, when chuck 332 holds lead component 410A to be held, the height at which it may come into contact with something other than lead component 410, such as lead component 410B, is L2, as shown in FIG. 15 . Therefore, when chuck 332 holds lead component 410A to be held, individual control device 452 uses area 492 of chuck 332 set in storage device 458 to determine whether chuck 332 holding lead component 410A will come into contact with something other than lead component 410. Specifically, individual control device 452 superimposes the image of lead component 410A in the imaging data of lead component 410A captured by camera 290 on area 492 of chuck 332 set in storage device 458. At this time, individual control device 452 overlaps area 492 of chuck 332 on lead component 410A with the center of component body 412 of lead component 410A aligned with the center of area 492 of chuck 332. Individual control device 452 then determines whether or not anything other than lead component 410A to be held has entered area 492 of chuck 332.

[0057] More specifically, for example, the hue of the upper surface of stage 156 is stored in storage device 458, and individual control device 452 determines, based on the image data of lead component 410A captured by camera 290, whether or not the area within area 492 of chuck 332 excluding the image of superimposed lead component 410A has a hue different from the hue of the upper surface of stage 156 stored in storage device 458. In this case, for example, if the area excluding superimposed lead component 410A does not have a hue different from the hue of the upper surface of stage 156 stored in storage device 458, as shown in FIG. In this way, if the individual control device 452 determines that nothing other than the lead component 410A to be held has entered the area 492 of the chuck 332, the chuck 332 will not come into contact with anything other than the lead component 410A when holding the lead component 410A to be held, and will therefore determine the lead component 410A to be held as the component to be picked up.

[0058] On the other hand, if the area within area 492 of chuck 332, excluding the image of superimposed lead component 410A, has a hue that is different from the hue of the upper surface of stage 156 stored in storage device 458, as shown in Fig. 19, individual control device 452 determines that something other than lead component 410A to be held has entered chuck area 492. In this way, if something other than lead component 410A to be held has entered area 492 of chuck 332, individual control device 452 does not determine lead component 410A to be held as the component to be picked up, because there is a possibility that chuck 332 may come into contact with something other than lead component 410A when holding lead component 410A to be held.

[0059] In this way, when chuck 332 holds lead component 410A, individual control device 452 determines that nothing other than lead component 410A to be held has entered chuck area 492, and if it determines that chuck 332 will not come into contact with anything other than lead component 410A, it determines lead component 410A to be held as the component to be picked up. By having individual control device 452 determine the component to be picked up in this way, it is possible to appropriately prevent chuck 332 from coming into contact with anything other than the lead component to be held when holding the lead component from stage 156, and it is possible to appropriately hold the lead component to be held. As shown in FIG. 11 , individual control device 452 has a first determination unit 500 that determines whether the lead component to be held overlaps with anything other than itself, and a second determination unit 502 that determines whether chuck 332 will come into contact with anything other than the lead component to be held when holding the lead component to be held.

[0060] After determining the component to be picked up, the individual control device 452 calculates the position information of the determined lead component 410 based on the image data of the lead component 410 captured by the camera. Next, based on the calculated position information of the component to be picked up, the component holding head 302 is moved above the component to be picked up by the operation of the component holding head moving device 300, and the chuck 332 holds the component to be picked up. Note that when the chuck 332 holds the component to be picked up, the chuck 332 is located in the non-rotation position. Next, after the chuck 332 holds the component to be picked up, the component holding head 302 moves above the component carrier 388. At this time, the component carrier 388 has been moved to the component receiving position by the operation of the component carrier moving device 390. Furthermore, when the component holding head 302 moves above the component carrier 388, the chuck 332 rotates to the rotation position. Chuck 332 is rotated by the operation of rotation device 335 so that leads 414 of lead component 410 held by chuck 332 in the rotated position face downward in the vertical direction.

[0061] When the component holding head 302 moves above the component carrier 388, the lead component 410, with its leads 414 facing vertically downward, is inserted into the component receiving recess 416 of the component receiving member 392. As a result, the lead component 410 is placed on the component receiving member 392 with its leads 414 facing vertically downward, as shown in FIG.

[0062] Then, when the lead components 410 are placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by operation of the component carrier moving device 390. Because the component supply position is located within the movement range of the work heads 60, 62, the bulk component supply device 32 supplies the lead components 410 to the component mounter 10 at this position. In this way, the bulk component supply device 32 supplies the lead components 410 with their leads 414 facing downward and their top surfaces, opposite the bottom surfaces to which the leads 414 are connected, facing upward. This allows the suction nozzles 66 of the work heads 60, 62 to properly hold the lead components 410.

[0063] Incidentally, the bulk component supply device 32 is an example of a component holding system. The stage 156 is an example of a stage. The camera 290 is an example of an imaging device. The chuck 332 is an example of a holder. The lead component 410 is an example of a component. The first determination unit 500 is an example of a first determination device. The second determination unit 502 is an example of a second determination device.

[0064] The present invention is not limited to the above-described embodiment, and various modifications and improvements can be made based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, a chuck 332 is used as the holder for holding the component, but a suction nozzle can also be used. When a suction nozzle is used as the holder for holding the component, the area including the outline of the suction nozzle when holding the target component is set as follows. For example, as shown in FIG. 20 , the area including the outline of the suction nozzle 510 when holding the component 512 is set to the area including the outline of the cross section of the suction nozzle 510 at a predetermined height L3. In other words, the area including the cross section of the suction nozzle 510 at the position of the dashed-dotted line 516 is set as the set area. Specifically, the cross section of the suction nozzle 510 at the position of the dashed-dotted line 516 has the shape indicated by the diagonal lines in FIG. 21 . The rectangular outline that contacts and includes the outline of the cross section of the suction nozzle 510 is set as the suction nozzle area 518. In this way, by setting the suction nozzle area 518, even when a suction nozzle is used as a holder, it is possible to preferably determine whether the suction nozzle will come into contact with anything other than the component being held when holding the component.

[0065] Furthermore, in the component holding head 302, as described above, the rotation device 334 is operated to bend the holder 340 upward by 90 degrees. Therefore, when the suction nozzle 510 is attached to the lower end of the holder 340, the rotation device 334 rotates the suction nozzle 510 between a non-rotation position and a rotation position. At this time, the suction nozzle 510 can be positioned and stopped at an angle between the non-rotation position and the rotation position. Therefore, as shown in FIG. 22 , the suction nozzle 510 can be positioned and stopped at an angle between the non-rotation position and the rotation position, tilting the suction nozzle 510 to a predetermined angle to hold a component 520 with its upper surface tilted. The area including the outline of the suction nozzle when holding the component 520 in this tilted state is set as shown below. More specifically, for example, the area including the outline of the suction nozzle 510 when holding a tilted component 520 is the area including the outline of the cross section of the tilted suction nozzle 510 at a predetermined height L4. For this reason, an area is set that includes the cross section of suction nozzle 510 at the position of dashed dotted line 522. Specifically, the cross section of suction nozzle 510 at the position of dashed dotted line 522 has the shape shown by diagonal lines in Fig. 23. Then, the outline of a rectangle that comes into contact with and includes the outline of the cross section of suction nozzle 510 is set as suction nozzle area 528. By setting suction nozzle area 528 in this way, it is possible to preferably determine whether or not the suction nozzle will come into contact with something other than the component to be held when holding the component, even when holding component 520 in an inclined position.

[0066] Furthermore, in the above embodiment, areas 482 and 492 are set to include the cross-sectional outline of chuck 332 when holding lead component 410A to be held, but an area including the outline of chuck 332 when holding lead component 410A to be held may also be set. For example, an area along the outline of chuck 332 when holding lead component 410A to be held, an area including the outline of chuck 332, or an area inside the outline of chuck 332 may be set as the area of ​​chuck 332. Furthermore, for example, an area including the outline of chuck 332 when holding lead component 410A to be held, as viewed from above or below, may also be set as the area of ​​chuck 332.

[0067] In the above embodiment, the present invention is applied to the lead component 410, but the present invention can be applied to various types of components. Specifically, the present invention can be applied to components of solar cells, components of power modules, electronic circuit components without leads, etc.

[0068] 32: Bulk component supply device (component holding system) 156: Stage 290: Camera (imaging device) 332: Chuck (holding tool) 410: Lead component (component) 500: First judgment unit (first judgment device) 502: Second judgment unit (second judgment device)

Claims

1. A part holding system comprising: a stage on which a plurality of parts are scattered; a holder for holding the parts scattered on the stage; an imaging device for imaging the parts scattered on the stage; a first judgment device for judging whether a part to be held by the holder overlaps with something other than the part to be held, based on imaging data captured by the imaging device; and a second judgment device for judging whether anything other than the part to be held enters an area including the outline of the holder when it holds the part to be held, based on imaging data captured by the imaging device; wherein the holder holds the part to be held when the first judgment device judges that the part to be held does not overlap with anything other than the part to be held and the second judgment device judges that nothing other than the part to be held enters the area.

2. A component holding system as described in claim 1, wherein the area including the outer shape of the holder when holding the component to be held is an area including the outer shape of the cross section of the holder when holding the component to be held.

3. A component holding system according to claim 1 or 2, wherein an area including the outer shape of the holder when holding the component to be held is superimposed on the component to be held.

4. A method for holding scattered parts, in which a holder for holding parts holds one part from a plurality of parts scattered on a stage, comprising: a first determination step for determining whether or not one of the plurality of parts scattered on the stage overlaps with something other than the one part, based on image data obtained by imaging the one part; and a second determination step for determining whether or not something other than the one part enters an area including the outline of the holder when holding the one part, based on the image data and the area, wherein if it is determined in the first determination step that the one part is not overlapping with anything other than the one part and it is determined in the second determination step that nothing other than the one part enters the area, the one part is determined to be a part that can be held by the holder, and the holder executes holding of the one part that it has been determined to be able to hold.

Images