Electronic component and method for manufacturing same

Abstract

[Problem] To provide an electronic component with a structure that facilitates dispersion of stress applied to terminal electrodes from the outside. [Solution] An electronic component 100 includes terminal electrodes E1, E2 located in a conductor layer 71 in a base body 110 and exposed from an outer surface 111, and a coil C1 at least a part of which is located in a conductor layer 74 in the base body 110, one end of which is connected to the terminal electrode E1 via a via conductor 81V, and the other end of which is connected to the terminal electrode E2 via a via conductor 84V. The via conductor 81V has a shape with a diameter that narrows toward the terminal electrode E1, and the via conductor 84V has a shape with a diameter that narrows toward the terminal electrode E2.

Description

Electronic components and their manufacturing method

[0001] The present disclosure relates to electronic components and methods for manufacturing the same.

[0002] Patent Document 1 discloses a surface-mount inductor component with terminal electrodes provided on its bottom surface. The inductor component disclosed in Patent Document 1 is manufactured by forming a linear internal magnetic path portion on a base member and then forming terminal electrodes on both ends of the internal magnetic path.

[0003] Japanese Patent Application Laid-Open No. 2022-038326

[0004] In the inductor component disclosed in Patent Document 1, when stress is applied to the terminal electrodes from the outside, the stress is applied directly to the vertical wiring.

[0005] The present disclosure describes an electronic component having a structure that allows stress applied to terminal electrodes from the outside to be easily dispersed, and a method for manufacturing the same.

[0006] An electronic component according to one aspect of the present disclosure comprises: a base body having a first surface and a second surface located opposite the first surface; a first terminal electrode and a second terminal electrode located on a first conductor layer within the base body, both exposed from the first surface; and a coil, at least a portion of which is located on a second conductor layer within the base body, one end of which is connected to the first terminal electrode via a first via conductor and the other end of which is connected to the second terminal electrode via a second via conductor, wherein at least a portion of the first via conductor has a shape whose diameter decreases toward the first terminal electrode, and at least a portion of the second via conductor has a shape whose diameter decreases toward the second terminal electrode.

[0007] A method for manufacturing an electronic component according to one aspect of the present disclosure includes: a first step of forming a first conductor layer on a support, the first conductor layer including a first terminal electrode, a second terminal electrode, and a first sacrificial pattern; a second step of forming a second conductor layer on the first conductor layer, the second sacrificial pattern including at least a portion of a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode; a third step of removing the first sacrificial pattern and the second sacrificial pattern; a fourth step of forming an element body in an area from which at least the first sacrificial pattern and the second sacrificial pattern have been removed, thereby embedding the first terminal electrode, the second terminal electrode, and the coil in the element body; and a fifth step of peeling off the support to expose the first terminal electrode and the second terminal electrode.

[0008] According to the present disclosure, an electronic component having a structure that easily disperses stress applied to terminal electrodes from the outside, and a method for manufacturing the same are provided.

[0009] FIG. 1 is a schematic see-through perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. FIG. 2 is a schematic see-through top view of the coil component 100. FIG. 3 is a schematic cross-sectional view of the coil component 100 taken along imaginary line L1 shown in FIG. 2. FIG. 4 is a schematic bottom view of the coil component 100. FIG. 5(a) is an enlarged cross-sectional view for describing in more detail the structure of connection portion V1. FIG. 5(b) is an enlarged cross-sectional view for describing in more detail the structure of connection portion V4. FIG. 6(a) is an enlarged cross-sectional view for describing in more detail the structure of connection portion V2. FIG. 6(b) is an enlarged cross-sectional view for describing in more detail the structure of connection portion V3. FIG. 7 is a schematic exploded perspective view of a circuit module 200 including the coil component 100. FIGS. 8(a) to 8(c) are process diagrams for describing a method for manufacturing the coil component 100. FIG. 9 is a schematic cross-sectional view for describing the structure of a coil component 101 according to a first modified example. FIG. 10 is a schematic cross-sectional view for describing the structure of a coil component 102 according to a second modified example. FIG. 11 is a schematic cross-sectional view illustrating the structure of a coil component 103 according to a third modified example.

[0010] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0011] Fig. 1 is a schematic perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. Fig. 2 is a schematic perspective top view of the coil component 100, Fig. 3 is a schematic cross-sectional view of the coil component 100 taken along imaginary line L1 shown in Fig. 2, and Fig. 4 is a schematic bottom view of the coil component 100.

[0012] As shown in FIGS. 1 to 4 , the coil component 100 according to this embodiment includes an element body 110, four coils C1 to C4 embedded in the element body 110, and terminal electrodes E1 to E8 exposed on the surface of the element body 110. The element body 110 may be made of a composite magnetic material in which magnetic particles made of a high-permeability material such as ferrite or permalloy are bound by a resin binder. As shown in FIG. 3 , the element body 110 forms an XY plane and has outer surfaces 111 and 112 located opposite each other. The outer surface 111 forms the mounting surface of the coil component 100. Eight terminal electrodes E1 to E8 are exposed from the outer surface 111. The surfaces of the terminal electrodes E1 to E8 exposed from the outer surface 111 may be flush with the outer surface 111. The outer surface 112 is the upper surface located opposite the outer surface 111.

[0013] 3, four conductor layers 71 to 74 are embedded in the element body 110. Terminal electrodes E1 to E8 are all located on the conductor layer 71. An insulating film 90 made of resin or the like is provided between the conductor layers 71 to 74 so that they do not come into contact with the element body 110.

[0014] Hereinafter, the direction from terminal electrode E1 to terminal electrode E2 may be referred to as the X direction (or +X direction), and the opposite direction may be referred to as the −X direction. Similarly, the direction from terminal electrode E1 to terminal electrode E7 may be referred to as the Y direction (or +Y direction), and the opposite direction may be referred to as the −Y direction. Similarly, the direction from outer surface 111 to outer surface 112 may be referred to as the Z direction (or +Z direction), and the opposite direction may be referred to as the −Z direction. In the specific examples shown in FIGS. 1 to 4 , the X direction, Y direction, and Z direction are orthogonal to each other. Note that the present disclosure also includes cases where the angles formed by the X direction, Y direction, and Z direction differ from a right angle due to manufacturing errors or the like of coil device 100 (for example, a difference of about 5° from a right angle).

[0015] As shown in FIG. 4 , not only terminal electrodes E1 to E8 but also conductor patterns 11, 24, 37, and 40 are exposed on outer surface 111. Terminal electrodes E1 to E8 and conductor patterns 11, 24, 37, and 40 are located on the same conductor layer 71. The surfaces of conductor patterns 11, 24, 37, and 40 exposed from element body 110 may be flush with outer surface 111 of element body 110. As shown in FIG. 4 , terminal electrodes E1 and E2 are arranged in the X direction, with conductor pattern 11 extending in the X direction located between them. Terminal electrodes E3 and E4 are arranged in the X direction, with conductor pattern 24 extending in the X direction located between them. Terminal electrodes E5 and E6 are arranged in the X direction, with conductor pattern 37 extending in the X direction located between them. Terminal electrodes E7 and E8 are arranged in the X direction, with conductor pattern 40 extending in the X direction located between them.

[0016] 1 to 4, the terminal electrodes E1, E3, E5, and E7 are arranged in the Y direction, and the terminal electrodes E2, E4, E6, and E8 are arranged in the Y direction, which allows the size of the element body 110 to be reduced in the X direction.

[0017] 1 to 4, the positions of the conductor patterns 11 and 37 in the X direction may be the same, and the positions of the conductor patterns 24 and 40 in the X direction may be the same. In contrast, the positions of the conductor patterns 11 and 37 in the X direction are different from the positions of the conductor patterns 24 and 40 in the X direction. In the example shown in FIG. 4, the positions of the conductor patterns 11 and 37 in the X direction do not overlap with the positions of the conductor patterns 24 and 40 in the X direction. The edge positions of the conductor patterns 11 and 37 in the −X direction (the side on which the terminal electrodes E1, E3, E5, and E7 are formed in FIG. 4) and the edge positions of the conductor patterns 24 and 40 in the +X direction (the side on which the terminal electrodes E2, E4, E6, and E8 are formed in FIG. 4) may be substantially the same. However, the present invention is not limited to this, and the positions of the conductor patterns 11 and 37 in the X direction and the positions of the conductor patterns 24 and 40 in the X direction may partially overlap in the X direction.

[0018] The coil C1 is connected between the terminal electrode E1 and the terminal electrode E2. One end of the coil C1 is electrically connected to the terminal electrode E1, and the other end of the coil C1 is electrically connected to the terminal electrode E2. The coil C1 has a conductor pattern 11 located on the conductor layer 71, conductor patterns 12 and 13 located on the conductor layer 74, and conductor patterns 81 to 88 located on the conductor layer 72 or conductor layer 73. The conductor patterns 12 and 13 located on the conductor layer 74 are embedded in the element body 110 without being exposed from either the outer surface 111 or 112. Conductor patterns that overlap in a plan view from the Z direction are connected via via conductors. When viewed from the Z direction, the conductor pattern 11 extends linearly in the X direction, while the conductor patterns 12 and 13 extend in the X direction while meandering in the Y direction. Furthermore, as shown in FIG. 3 , the conductor pattern 12 may be curved toward the outer surface 111 of the element body 110 when viewed from the Y direction. Although not shown, the conductive pattern 13 may also be curved toward the outer surface 111 of the element body 110 when viewed in the Y direction.

[0019] 3, conductor layer 72 includes conductor patterns 81 to 84, and conductor layer 73 includes conductor patterns 85 to 88. Conductor patterns 81 and 85 form connection portion V1, conductor patterns 82 and 86 form connection portion V2, conductor patterns 83 and 87 form connection portion V3, and conductor patterns 84 and 88 form connection portion V4. Connection portions V1 to V4 may be arranged in this order in the X direction.

[0020] In addition, in a cross section taken along imaginary line L2 in FIG. 2, connection portions V5 to V8 are formed by conductor patterns located on conductor layers 72 and 73. The connection portions V5 to V8 may be arranged in this order in the X direction. In a cross section taken along imaginary line L3 in FIG. 2, connection portions V9 to V12 are formed by conductor patterns located on conductor layers 72 and 73. The connection portions V9 to V12 may be arranged in this order in the X direction. In a cross section taken along imaginary line L4 in FIG. 2, connection portions V13 to V16 are formed by conductor patterns located on conductor layers 72 and 73. The connection portions V13 to V16 may be arranged in this order in the X direction.

[0021] In the embodiment illustrated in FIG. 2 , in a plan view seen from the Z direction, the conductor pattern 12 has a first linear portion 51 that is linearly formed in the X direction and whose end in the −X direction is connected to the connection portion V1. The conductor pattern 12 further has a second linear portion 52 that extends linearly in the X direction and whose end in the −X direction is connected to the end of the first linear portion 51 in the +X direction via a first bend 61 and whose end in the +X direction is connected to the connection portion V3 via a second bend 62. The first bend 61 illustrated in FIG. 2 may include a bend from the +X direction to the −Y direction and a bend from the −Y direction to the +X direction from the connection portion V1 toward the connection portion V3. The second bend 62 illustrated in FIG. 2 may include a bend from the +X direction to the +Y direction from the connection portion V1 toward the connection portion V3. In the example illustrated in FIG. 2 , the conductor pattern 13 extends linearly in the X direction, and has a third straight portion 53 whose end in the −X direction is connected to the connection portion V2 via a third bend portion 63 and whose end in the +X direction is connected to the connection portion V4 via a fourth bend portion 64.

[0022] One end of conductor pattern 12 in the −X direction is connected to terminal electrode E1 via connection portion V1. One end of conductor pattern 13 in the +X direction is connected to terminal electrode E2 via connection portion V4. One end of conductor pattern 11 located on the terminal electrode E1 side (−X direction side) is connected to the other end of conductor pattern 13 via connection portion V2. The other end of conductor pattern 11 located on the terminal electrode E2 side (+X direction side) is connected to the other end of conductor pattern 12 via connection portion V3.

[0023] As a result, current input from the outside to the terminal electrode E1 flows to the terminal electrode E2 via the connection portion V1, the conductor pattern 12, the connection portion V3, the conductor pattern 11, the connection portion V2, the conductor pattern 13, and the connection portion V4. Here, current flows mainly in the +X direction through the conductor patterns 12 and 13, while current flows in the −X direction through the conductor pattern 11. Furthermore, current flows in the −Z direction through the connection portion V3, while current flows in the +Z direction through the connection portion V2. As a result, the conductor pattern 12, the connection portion V3, the conductor pattern 11, the connection portion V2, and the conductor pattern 13 form a loop with the Y direction as its axial direction. A portion of the element body 110 is embedded in the region surrounded by the loop as viewed from the Y direction. The portion surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C1. Furthermore, in a plan view as viewed from the Z direction, the region surrounded by the conductor patterns 12 and 13 overlaps with a portion of the conductor pattern 11.

[0024] Coil C2 is disposed adjacent to coils C1 and C3 so as to be sandwiched between them in the Y direction, and is connected between terminal electrodes E3 and E4. One end of coil C2 is electrically connected to terminal electrode E3, and the other end of coil C2 is electrically connected to terminal electrode E4. Coil C2 has a conductor pattern 24 located on conductor layer 71, conductor patterns 25 and 26 located on conductor layer 74, and connection portions V5 to V8 located on conductor layer 72 or conductor layer 73. Connection portions V5 to V8 may be arranged in this order in the X direction. While conductor pattern 24 extends linearly in the X direction, conductor patterns 25 and 26 extend in the X direction while meandering in the Y direction.

[0025] In the embodiment illustrated in FIG. 2 , in a plan view seen from the Z direction, the conductor pattern 26 is formed linearly in the X direction and has a fourth straight portion 54 whose end in the +X direction is connected to the connection portion V8. The conductor pattern 26 further includes a fifth straight portion 55 that extends linearly in the X direction and whose end in the +X direction is connected to the −X direction end of the fourth straight portion 54 via a fifth bend 65 and whose end in the −X direction is connected to the connection portion V6 via a sixth bend 66. The fifth bend 65 illustrated in FIG. 2 may include a bend from the −X direction to the −Y direction and a bend from the −Y direction to the −X direction from the connection portion V8 toward the connection portion V6. The sixth bend 66 illustrated in FIG. 2 may include a bend from the −X direction to the +Y direction from the connection portion V8 toward the connection portion V6. In the example illustrated in FIG. 2 , the conductor pattern 25 also has a sixth straight portion 56 that extends linearly in the X direction, and whose end in the +X direction is connected to the connection portion V7 via a seventh bend 67, and whose end in the −X direction is connected to the connection portion V5 via an eighth bend 68.

[0026] One end of conductor pattern 25 in the −X direction is connected to terminal electrode E3 via connection portion V5. One end of conductor pattern 26 in the +X direction is connected to terminal electrode E4 via connection portion V8. One end of conductor pattern 24 located on the terminal electrode E3 side (−X direction side) is connected to the other end of conductor pattern 26 via connection portion V6. The other end of conductor pattern 24 located on the terminal electrode E4 side (+X direction side) is connected to the other end of conductor pattern 25 via connection portion V7.

[0027] As a result, current input from the outside to the terminal electrode E3 flows to the terminal electrode E4 via the connection portion V5, the conductor pattern 25, the connection portion V7, the conductor pattern 24, the connection portion V6, the conductor pattern 26, and the connection portion V8. Here, current flows primarily in the +X direction through the conductor patterns 25 and 26, while current flows in the −X direction through the conductor pattern 24. Furthermore, current flows in the −Z direction through the connection portion V7, while current flows in the +Z direction through the connection portion V6. As a result, the conductor pattern 25, the connection portion V7, the conductor pattern 24, the connection portion V6, and the conductor pattern 26 form a loop with the Y direction as its axial direction. The area surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C2. A portion of the element body 110 is embedded in the region surrounded by the loop when viewed from the Y direction. Furthermore, the region surrounded by the conductor patterns 25 and 26 overlaps with a portion of the conductor pattern 24 in a plan view viewed from the Z direction.

[0028] Coil C3 is disposed adjacent to coils C2 and C4 so as to be sandwiched between them in the Y direction, and is connected between terminal electrodes E5 and E6. One end of coil C3 is electrically connected to terminal electrode E5, and the other end of coil C3 is electrically connected to terminal electrode E6. Coil C3 has a conductor pattern 37 located on conductor layer 71, conductor patterns 38 and 39 located on conductor layer 74, and connection portions V9 to V12 located on conductor layer 72 or conductor layer 73. Connection portions V9 to V12 may be arranged in this order in the X direction. While conductor pattern 37 extends linearly in the X direction, conductor patterns 38 and 39 extend in the X direction while meandering in the Y direction.

[0029] Like conductor pattern 12, conductor pattern 38 has two straight portions and two bends. Like conductor pattern 13, conductor pattern 39 has one straight portion and two bends. One end of conductor pattern 38 in the −X direction is connected to terminal electrode E5 via connection portion V9. One end of conductor pattern 39 in the +X direction is connected to terminal electrode E6 via connection portion V12. One end of conductor pattern 37 located on the terminal electrode E5 side (−X direction side) is connected to the other end of conductor pattern 39 via connection portion V10. The other end of conductor pattern 37 located on the terminal electrode E6 side (+X direction side) is connected to the other end of conductor pattern 38 via connection portion V11.

[0030] As a result, current input from the outside to the terminal electrode E5 flows to the terminal electrode E6 via the connection portion V9, the conductor pattern 38, the connection portion V11, the conductor pattern 37, the connection portion V10, the conductor pattern 39, and the connection portion V12. Here, current flows primarily in the +X direction through the conductor patterns 38 and 39, while current flows in the −X direction through the conductor pattern 37. Furthermore, current flows in the −Z direction through the connection portion V11, while current flows in the +Z direction through the connection portion V10. As a result, the conductor patterns 38, the connection portion V11, the conductor patterns 37, the connection portion V10, and the conductor pattern 39 form a loop with the Y direction as its axial direction. The area surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C3. A portion of the element body 110 is embedded in the region surrounded by the loop when viewed from the Y direction. Furthermore, the region surrounded by the conductor patterns 38 and 39 overlaps with a portion of the conductor pattern 37 in a plan view viewed from the Z direction.

[0031] Coil C4 is disposed adjacent to coil C3 in the Y direction and is connected between terminal electrodes E7 and E8. One end of coil C4 is electrically connected to terminal electrode E7, and the other end of coil C4 is electrically connected to terminal electrode E8. Coil C4 has a conductor pattern 40 located on conductor layer 71, conductor patterns 41 and 42 located on conductor layer 74, and connection portions V13 to V16 located on conductor layer 72 or conductor layer 73. Connection portions V13 to V16 may be arranged in this order in the X direction. Conductor pattern 40 extends linearly in the X direction, while conductor patterns 41 and 42 extend in the X direction while meandering in the Y direction.

[0032] Like the conductor pattern 25, the conductor pattern 41 has one straight portion and two bend portions. Like the conductor pattern 26, the conductor pattern 42 has two straight portions and two bend portions. One end of the conductor pattern 41 in the −X direction is connected to the terminal electrode E7 via a connection portion V13. One end of the conductor pattern 42 in the +X direction is connected to the terminal electrode E8 via a connection portion V16. One end of the conductor pattern 40 located on the terminal electrode E7 side (−X direction side) is connected to the other end of the conductor pattern 42 via a connection portion V14. The other end of the conductor pattern 40 located on the terminal electrode E8 side (+X direction side) is connected to the other end of the conductor pattern 41 via a connection portion V15.

[0033] As a result, current input from the outside to the terminal electrode E7 flows to the terminal electrode E8 via the connection portion V13, the conductor pattern 41, the connection portion V15, the conductor pattern 40, the connection portion V14, the conductor pattern 42, and the connection portion V16. Here, current flows primarily in the +X direction through the conductor patterns 41 and 42, while current flows in the −X direction through the conductor pattern 40. Furthermore, current flows in the −Z direction through the connection portion V15, while current flows in the +Z direction through the connection portion V14. As a result, the conductor patterns 41, the connection portion V15, the conductor pattern 40, the connection portion V14, and the conductor pattern 42 form a loop with the Y direction as its axial direction. The area surrounded by this loop is the region (the inductor core) where magnetic flux is generated when current flows through the coil C4. A portion of the element body 110 is embedded in the region surrounded by the loop when viewed from the Y direction. Furthermore, in a plan view viewed from the Z direction, the region surrounded by the conductor patterns 41 and 42 overlaps with a portion of the conductor pattern 40.

[0034] FIG. 5A is an enlarged cross-sectional view for explaining the structure of the connection portion V1 in more detail.

[0035] As shown in FIG. 5A , the conductor pattern 81 located on the conductor layer 72 is connected to the terminal electrode E1 located on the conductor layer 71 through a via conductor 81V consisting of a part of the conductor pattern 81. The via conductor 81V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the terminal electrode E1. The conductor pattern 85 located on the conductor layer 73 is connected to the conductor pattern 81 located on the conductor layer 72 through a via conductor 85V consisting of a part of the conductor pattern 85. The via conductor 85V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 81. The conductor pattern 12 located on the conductor layer 74 is connected to the conductor pattern 85 located on the conductor layer 73 through a via conductor 12V consisting of a part of the conductor pattern 12. The via conductor 12V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 85.

[0036] As a result, when external stress is applied to terminal electrode E1 in the +Z direction, the diameter of via conductor 81V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 81. The stress applied to conductor pattern 81 is transmitted to conductor pattern 85 through via conductor 85V, but the expanded diameter of via conductor 85V in the direction of stress transmission disperses the stress applied to conductor pattern 85. Furthermore, the stress applied to conductor pattern 85 is transmitted to conductor pattern 12 through via conductor 12V, but the expanded diameter of via conductor 12V in the direction of stress transmission disperses the stress applied to conductor pattern 12. This mechanism internally disperses stress applied to terminal electrode E1 from the outside, thereby improving product reliability.

[0037] FIG. 5B is an enlarged cross-sectional view for explaining the structure of the connection portion V4 in more detail.

[0038] As shown in FIG. 5B , the conductor pattern 84 located on the conductor layer 72 is connected to the terminal electrode E2 located on the conductor layer 71 through a via conductor 84V consisting of a part of the conductor pattern 84. The via conductor 84V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the terminal electrode E2. The conductor pattern 88 located on the conductor layer 73 is connected to the conductor pattern 84 located on the conductor layer 72 through a via conductor 88V consisting of a part of the conductor pattern 88. The via conductor 88V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 84. The conductor pattern 13 located on the conductor layer 74 is connected to the conductor pattern 88 located on the conductor layer 73 through a via conductor 13V consisting of a part of the conductor pattern 13. The via conductor 13V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 88.

[0039] As a result, when external stress is applied to terminal electrode E2 in the +Z direction, the diameter of via conductor 84V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 84. The stress applied to conductor pattern 84 is transmitted to conductor pattern 88 through via conductor 88V, but the diameter of via conductor 88V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 88. Furthermore, the stress applied to conductor pattern 88 is transmitted to conductor pattern 13 through via conductor 13V, but the diameter of via conductor 13V is expanded in the direction of stress transmission, thereby dispersing the stress applied to conductor pattern 13. This mechanism internally disperses stress applied to terminal electrode E2 from the outside, thereby improving product reliability.

[0040] Although not shown, stress applied to the other terminal electrodes E3 to E8 is also dispersed internally by a similar mechanism. That is, the via conductors included in the connection portions V5, V8, V9, V12, V13, and V16 also have a shape in which the diameter expands in the +Z direction (the diameter contracts in the −Z direction), and even when stress in the +Z direction is applied to the terminal electrodes E3 to E8, the stress is dispersed internally.

[0041] FIG. 6A is an enlarged cross-sectional view for explaining the structure of the connection portion V2 in more detail.

[0042] As shown in FIG. 6A , the conductor pattern 82 located on the conductor layer 72 is connected to the conductor pattern 11 located on the conductor layer 71 through a via conductor 82V consisting of a part of the conductor pattern 82. The via conductor 82V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 11. The conductor pattern 86 located on the conductor layer 73 is connected to the conductor pattern 82 located on the conductor layer 72 through a via conductor 86V consisting of a part of the conductor pattern 86. The via conductor 86V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 82. The conductor pattern 13 located on the conductor layer 74 is connected to the conductor pattern 86 located on the conductor layer 73 through a via conductor 13V consisting of a part of the conductor pattern 13. The via conductor 13V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 86.

[0043] As a result, if external stress is applied to connection pattern 11 in the +Z direction, the stress applied to conductor pattern 82 is dispersed because the diameter of via conductor 82V is enlarged in the direction of stress transmission. The stress applied to conductor pattern 82 is transmitted to conductor pattern 86 through via conductor 86V, but the stress applied to conductor pattern 86 is dispersed because the diameter of via conductor 86V is enlarged in the direction of stress transmission. Furthermore, the stress applied to conductor pattern 86 is transmitted to conductor pattern 13 through via conductor 13V, but the stress applied to conductor pattern 13 is dispersed because the diameter of via conductor 13V is enlarged in the direction of stress transmission. This mechanism distributes external stress applied to connection pattern 11 internally, thereby improving product reliability.

[0044] FIG. 6B is an enlarged cross-sectional view for explaining the structure of the connection portion V3 in more detail.

[0045] As shown in FIG. 6( b), the conductor pattern 83 located on the conductor layer 72 is connected to the conductor pattern 11 located on the conductor layer 71 through a via conductor 83V consisting of a part of the conductor pattern 83. The via conductor 83V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 11. The conductor pattern 87 located on the conductor layer 73 is connected to the conductor pattern 83 located on the conductor layer 72 through a via conductor 87V consisting of a part of the conductor pattern 87. The via conductor 87V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 83. The conductor pattern 12 located on the conductor layer 74 is connected to the conductor pattern 87 located on the conductor layer 73 through a via conductor 12V consisting of a part of the conductor pattern 12. The via conductor 12V is provided to penetrate the insulating film 90 and has a shape in which its diameter decreases toward the conductor pattern 87.

[0046] As a result, if external stress is applied to connection pattern 11 in the +Z direction, the stress applied to conductor pattern 83 is dispersed because the diameter of via conductor 83V is enlarged in the direction of stress transmission. The stress applied to conductor pattern 83 is transmitted to conductor pattern 87 through via conductor 87V, but the stress applied to conductor pattern 87 is dispersed because the diameter of via conductor 87V is enlarged in the direction of stress transmission. Furthermore, the stress applied to conductor pattern 87 is transmitted to conductor pattern 12 through via conductor 12V, but the stress applied to conductor pattern 12 is dispersed because the diameter of via conductor 12V is enlarged in the direction of stress transmission. This mechanism distributes external stress applied to connection pattern 11 internally, thereby improving product reliability.

[0047] Although not shown, the via conductors included in the connection parts V6, V7, V10, V11, V14, and V15 connected to other conductor patterns 24, 37, and 40 located on the conductor layer 71 also have a shape in which the diameter expands in the +Z direction (the diameter contracts in the -Z direction), and even if stress in the +Z direction is applied to the conductor patterns 24, 37, and 40, the stress is dispersed internally.

[0048] With the above configuration, the coil component 100 according to this embodiment forms an eight-terminal coil array incorporating four coils. The coil component 100 can be mounted in a mounting area 100A on a substrate 130 shown in Fig. 7 to form a circuit module 200. Land patterns P1 to P8 are provided on the surface of the substrate 130, and the coil component 100 is mounted on the substrate 130 so that the terminal electrodes E1 to E8 are connected to the land patterns P1 to P8, respectively.

[0049] In the coil component 100 according to this embodiment, the coils C1 to C4 are arranged in the Y direction, and each has a loop with its axial direction in the Y direction, which allows the size of the element body 110 to be reduced in the Y direction. In particular, in two coils adjacent in the Y direction, the positions in the X direction of the conductor patterns provided on the outer surface 111 are different from each other, so the sections in which the conductor patterns provided on the conductor layer 74 in each coil overlap in the Y direction can be shifted in the X direction between the adjacent coils. For example, the section in which the conductor patterns 12 and 13 constituting coil C1 overlap in the Y direction and the section in which the conductor patterns 25 and 26 constituting coil C2 overlap in the Y direction can be shifted in the X direction. This allows multiple coils to be embedded in the element body 110 with higher density.

[0050] Furthermore, since the stacking direction of the conductor patterns inside element body 110 is the Z direction, even if the number of coils built into element body 110 increases, the number of stacked conductor patterns does not increase, and manufacturing costs are also reduced.

[0051] 2, if an imaginary line L0 is defined that passes through the centers of coils C1 to C4 in the X direction and extends in the Y direction, conductor patterns 12 and 13 that constitute coil C1 and conductor patterns 25 and 26 that constitute coil C2 have shapes that are line-symmetrical with respect to the imaginary line L0, and conductor patterns 38 and 39 that constitute coil C3 and conductor patterns 41 and 42 that constitute coil C4 have shapes that are line-symmetrical with respect to the imaginary line L0. In other words, when conductor patterns 12 and 13 that constitute coil C1 are flipped around the imaginary line L0, they have the same shape as conductor patterns 25 and 26 that constitute coil C2, and when conductor patterns 38 and 39 that constitute coil C3 are flipped around the imaginary line L0, they have the same shape as conductor patterns 41 and 42 that constitute coil C4.

[0052] Furthermore, when imaginary lines L1 to L4 are defined as passing through the centers of coils C1 to C4 in the Y direction and extending in the X direction, conductor patterns 12 and 13 constituting coil C1 and conductor patterns 38 and 39 constituting coil C3 have shapes that are line-symmetrical with respect to imaginary lines L1 and L3, respectively, and conductor patterns 25 and 26 constituting coil C2 and conductor patterns 41 and 42 constituting coil C4 have shapes that are line-symmetrical with respect to imaginary lines L2 and L4, respectively. In other words, when conductor patterns 12 and 13 constituting coil C1 are flipped around imaginary line L1, they have the same shape as conductor patterns 38 and 39 constituting coil C3, and when conductor patterns 38 and 39 constituting coil C3 are flipped around imaginary line L3, they have the same shape as conductor patterns 12 and 13 constituting coil C1. Similarly, when the conductor patterns 25 and 26 constituting the coil C2 are flipped around the imaginary line L2 as the axis of symmetry, they have the same shape as the conductor patterns 41 and 42 constituting the coil C4, and when the conductor patterns 41 and 42 constituting the coil C4 are flipped around the imaginary line L4 as the axis of symmetry, they have the same shape as the conductor patterns 25 and 26 constituting the coil C2. In other words, the conductor patterns 38 and 39 constituting the coil C3 may be formed in shapes having straight portions and bent portions similar to the conductor patterns 12 and 13 constituting the coil C1, and the conductor patterns 41 and 42 constituting C4 may be formed in shapes having straight portions and bent portions similar to the conductor patterns 25 and 26 constituting the coil C2, respectively.

[0053] Furthermore, if the intersections of virtual line L0 and virtual lines L1 to L4 are designated Q1 to Q4, coils C1 and C4 have shapes that are point-symmetrical with respect to each other, with intersections Q1 and Q4 as the center points, respectively, and coils C2 and C3 have shapes that are point-symmetrical with respect to each other, with intersections Q2 and Q3 as the center points, respectively. In other words, when coil C1 is rotated 180° around intersection Q1, it takes on the same shape as coil C4, and when coil C4 is rotated 180° around intersection Q4, it takes on the same shape as coil C1. Similarly, when coil C2 is rotated 180° around intersection Q2, it takes on the same shape as coil C3, and when coil C3 is rotated 180° around intersection Q3, it takes on the same shape as coil C2.

[0054] In this way, since the coils C1 to C4 have the above-described shapes, the coils C1 to C4 having the same inductance can be arranged at high density, and the pattern design of the conductor pattern becomes easy.

[0055] 8(a) to 8(c) are process diagrams illustrating a method for manufacturing the coil component 100 according to this embodiment. The cross sections shown in Fig. 8(a) to 8(c) correspond to the cross section shown in Fig. 3.

[0056] First, as shown in FIG. 8( a), a support S is prepared, and conductor layers 71 to 74 are formed in this order on the support S. Focusing on the coil C1, the conductor layer 71 includes terminal electrodes E1 and E2, and a conductor pattern 11. Furthermore, the conductor layer 71 includes a sacrificial pattern 91. The terminal electrodes E1 and E2, the conductor pattern 11, and the sacrificial pattern 91 are separated from one another by an insulating film 90. Focusing on the coil C1, the conductor layer 72 includes conductor patterns 81 to 84. Furthermore, the conductor layer 72 includes a sacrificial pattern 92. The conductor patterns 81 to 84 and the sacrificial pattern 92 are separated from one another by the insulating film 90. The sacrificial pattern 92 located on the conductor layer 72 is connected to the sacrificial pattern 91 located on the conductor layer 71.

[0057] Focusing on coil C1, conductor layer 73 includes conductor patterns 85 to 88. Furthermore, conductor layer 73 includes sacrificial pattern 93. Conductive patterns 85 to 88 and sacrificial pattern 93 are separated from each other by insulating film 90. Sacrificial pattern 93 located on conductor layer 73 is connected to sacrificial pattern 92 located on conductor layer 72. Focusing on coil C1, conductor layer 74 includes conductor patterns 12 and 13. Furthermore, conductor layer 74 includes sacrificial pattern 94. Conductive patterns 12 and 13 and sacrificial pattern 94 are separated from each other by insulating film 90. Sacrificial pattern 94 located on conductor layer 74 is connected to sacrificial pattern 93 located on conductor layer 73.

[0058] Next, as shown in Figure 8(b), the sacrificial patterns 91-94 are removed using acid or the like. This forms a space between the conductor patterns 12 and 13 located on the conductor layer 74 and the support S. In other words, both ends of the conductor pattern 12 are supported by the connection portions V1 and V3, and the portion located between the ends is suspended in mid-air. Also, both ends of the conductor pattern 13 are supported by the connection portions V2 and V4, and the portion located between the ends is suspended in mid-air.

[0059] Next, as shown in FIG. 8( c), an element body 110 made of a magnetic material is formed in the area where the sacrificial patterns 91-94 have been removed and in the layer above it, thereby embedding the conductor layers 71-74 in the element body 110. In forming the element body 110, the conductor layers 71-74 are embedded in the uncured element body 110, and then the element body 110 is hardened by applying pressure to the element body 110 toward the support S. Depending on the conditions for applying pressure to the element body 110, the suspended conductor patterns 12 and 13 may deform and bend toward the support S. This changes the length of the conductor patterns 12 and 13, and therefore the inductance of the conductor patterns 12 and 13. The support S is then peeled off to expose the terminal electrodes E1-E8 and conductor patterns 11, 24, 37, and 40 located on the conductor layer 71, thereby completing the coil component 100 according to this embodiment.

[0060] As described above, according to the method for manufacturing coil component 100 of this embodiment, conductor layers 71 to 74 are formed in this order starting from the conductor layer 71 side where terminal electrodes E1 to E8 are located, and this allows the process of forming element body 110 to be completed in one step, compared to a method in which conductor layers 74 to 71 are formed in this order starting from the conductor layer 74 side. In other words, with a method in which conductor layers 74 to 71 are formed in this order starting from the conductor layer 74 side, it is necessary to form conductor layers 74 to 71 on support S in this order, then form element body 110 in which conductor layers 74 to 71 are embedded, and then peel off support S and form another portion of element body 110 starting from the conductor layer 74 side, requiring two steps to form element body 110. Furthermore, if element body 110 is formed in two steps, an interface is formed in element body 110, and the magnetic properties of this portion are reduced. In contrast, in the manufacturing method of the coil component 100 according to this embodiment, the process of forming the base body 110 is completed in one step, thereby reducing manufacturing costs, and since no interface is formed inside the base body 110, it is possible to ensure high magnetic properties.

[0061] Furthermore, according to the method shown in Figures 8(a) to 8(c), the terminal electrodes E1 to E8 and the conductor patterns 11, 24, 37, and 40 are substantially flush with the outer surface 111 of the base body 110, so it is also possible to reduce the height of the coil component 100 in the Z direction.

[0062] 9 is a schematic cross-sectional view for explaining the structure of a coil device 101 according to a first modified example. The cross-sectional position in FIG. 9 is the same as the cross-sectional position in FIG.

[0063] 9, the coil component 101 according to the first modified example differs from the coil component 100 according to the above embodiment in that the outer surface 111 of the element body 110 is covered with a coating layer 95 made of resin or the like. Since the other basic configuration is the same as that of the coil component 100 according to the above embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0064] The coating layer 95 is provided on the outer surface 111 of the element body 110 so as to expose at least a portion of the terminal electrodes E1 to E8. The conductor patterns 11, 24, 37, and 40 located on the conductor layer 71 may be entirely covered with the coating layer 95. Providing such a coating layer 95 makes it possible to prevent short-circuit defects via the conductor patterns 11, 24, 37, and 40, and also to increase the dielectric strength voltage on the outer surface 111 side of the element body 110.

[0065] 10 is a schematic cross-sectional view illustrating the structure of a coil component 102 according to a second modified example, taken at the same cross-sectional position as that of FIG.

[0066] As shown in Fig. 10, in a coil component 102 according to the second modification, a coil C1 is made up of a linear conductor pattern 44. In the example shown in Fig. 10, the conductor pattern 44 is located on a conductor layer 74. One end of the conductor pattern 44 is connected to a terminal electrode E1 via a connection portion V1, and the other end of the conductor pattern 44 is connected to a terminal electrode E2 via a connection portion V4. Although not shown, the other coils C2 to C4 also each comprise a linear conductor pattern.

[0067] As exemplified by the coil component 102 according to the second modified example, the shapes of the coils C1 to C4 are not particularly limited, and they may be linear conductor patterns. This increases the length of the conductor pattern 44 in the X direction, allowing the amount of curvature of the conductor pattern 44 to be increased. Furthermore, the conductor layer on which the linear conductor pattern is arranged is not limited to the conductor layer 74, and it may be arranged on the conductor layer 73 or the conductor layer 72. When the linear conductor pattern is arranged on the conductor layer 73, the conductor layer 74 may be omitted. When the linear conductor pattern is arranged on the conductor layer 72, the conductor layers 73 and 74 may be omitted.

[0068] 11 is a schematic cross-sectional view illustrating the structure of a coil component 103 according to a third modified example. The cross-sectional position in FIG. 11 is the same as the cross-sectional position in FIG.

[0069] As shown in Fig. 11 , in a coil component 103 according to the third modification, a coil C1 is made up of two linear conductor patterns 43, 44. In the example shown in Fig. 11 , the conductor pattern 43 is located on the conductor layer 73, and the conductor pattern 44 is located on the conductor layer 74. One end of the conductor patterns 43, 44 is connected to the terminal electrode E1 via a connection portion V1, and the other end of the conductor patterns 43, 44 is connected to the terminal electrode E2 via a connection portion V4. Although not shown, the other coils C2 to C4 are also made up of linear conductor patterns.

[0070] As exemplified by the coil component 103 according to the third modification, a plurality of conductor patterns may be connected in parallel, which makes it possible to reduce the DC resistance of the coils C1 to C4.

[0071] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0072] For example, in the embodiment illustrated in Figures 1 to 4, a coil component including four coils C1 to C4 is disclosed, but in the technology disclosed herein, the number of coils included in the electronic component (coil component) is not limited.

[0073] In addition, in the embodiment illustrated in FIGS. 1 to 4, four conductor layers 71 to 74 are embedded in element body 110, but in the technology according to the present disclosure, there is no particular limit to the number of conductor layers embedded in the element body.

[0074] Furthermore, two or more types of coils, namely, the coil shown in FIG. 3, the coil shown in FIG. 10, and the coil shown in FIG. 11, may be mixed in one element body.

[0075] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0076] An electronic component according to one aspect of the present disclosure comprises: an element body having a first surface and a second surface opposite to the first surface; first and second terminal electrodes located on a first conductor layer within the element body and both exposed from the first surface; and a coil, at least a portion of which is located on a second conductor layer within the element body, having one end connected to the first terminal electrode through a first via conductor and the other end connected to the second terminal electrode through a second via conductor, wherein at least a portion of the first via conductor has a shape that tapers toward the first terminal electrode, and at least a portion of the second via conductor has a shape that tapers toward the second terminal electrode, whereby external stress applied to the first and second terminal electrodes is dispersed internally.

[0077] In the electronic component, the surfaces of the first and second terminal electrodes exposed from the element body may be flush with the first surface of the element body, thereby enabling the electronic component to be made low-profile.

[0078] In the electronic component, the coil may include a first conductor pattern formed on the first conductor layer, one end of which is located on the first terminal electrode side and the other end of which is located on the second terminal electrode side, a second conductor pattern formed on the second conductor layer, one end of which is electrically connected to the first terminal electrode through the first via conductor and the other end of which is electrically connected to the other end of the first conductor pattern through a third via conductor, and a third conductor pattern formed on the second conductor layer, one end of which is electrically connected to the second terminal electrode through the second via conductor and the other end of which is electrically connected to one end of the first conductor pattern through a fourth via conductor, thereby making it possible to obtain a larger inductance.

[0079] In the electronic component, the second conductor pattern and the third conductor pattern may be embedded in the element body without being exposed from either the first surface or the second surface, thereby making it possible to obtain a larger inductance.

[0080] In the electronic component, the first conductor pattern may be exposed from the first surface, and the surface of the first conductor pattern exposed from the element body may be flush with the first surface of the element body, thereby enabling the electronic component to be made low-profile.

[0081] In the electronic component, at least a portion of the third via conductor may have a shape whose diameter decreases toward the other end of the first conductor pattern, and at least a portion of the fourth via conductor may have a shape whose diameter decreases toward one end of the first conductor pattern, thereby dispersing stress applied to the first conductor pattern from the outside.

[0082] In the electronic component, the portion of the coil located on the second conductor layer may be curved toward the first surface, which allows fine adjustment of the inductance by adjusting the amount of curvature.

[0083] In the electronic component, one end of the coil may be connected to the first terminal electrode through a first via conductor group including a first via conductor, and the other end of the coil may be connected to the second terminal electrode through a second via conductor group including a second via conductor, and at least some of the via conductors in the first via conductor group may have a shape in which the diameter decreases toward the first terminal electrode, and at least some of the via conductors in the second via conductor group may have a shape in which the diameter decreases toward the second terminal electrode, thereby more effectively dispersing stress applied to the first and second terminal electrodes from the outside.

[0084] A method for manufacturing an electronic component according to one aspect of the present disclosure includes: a first step of forming a first conductor layer on a support, the first conductor layer including a first terminal electrode, a second terminal electrode, and a first sacrificial pattern; a second step of forming a second conductor layer on the first conductor layer, the second sacrificial pattern including at least a portion of a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode; a third step of removing the first sacrificial pattern and the second sacrificial pattern; a fourth step of forming an element body in an area from which at least the first sacrificial pattern and the second sacrificial pattern have been removed, thereby embedding the first terminal electrode, the second terminal electrode, and the coil in the element body; and a fifth step of peeling off the support to expose the first terminal electrode and the second terminal electrode. This method enables the manufacture of an electronic component with a reduced number of steps.

[0085] In the third step, a space may be formed between the support and at least a portion of the coil located on the second conductor layer, which allows the element body to be embedded in the space.

[0086] In the fourth step, the element body may be pressed so that at least a portion of the coil is bent toward the support body, thereby enabling fine adjustment of the inductance by adjusting the amount of bending.

[0087] This application claims the benefit of Japanese Patent Application No. 2023-162952, filed on September 26, 2023, the entire disclosure of which is incorporated herein by reference.

[0088] 11 to 13, 24 to 26, 37 to 44, 81 to 88 Conductive patterns 12V, 13V, 81V, 84V, 85V, 88V Via conductors 51 to 56 Straight portions 61 to 68 Bent portions 71 to 74 Conductive layers 90 Insulating films 91 to 94 Sacrificial patterns 95 Coating layers 100 to 103 Coil components (electronic components) 100A Mounting area 110 Body 111, 112 Outer surface 130 Substrate 200 Circuit module C1 to C4 Coils E1 to E8 Terminal electrodes L0 to L4 Virtual lines P1 to P8 Land patterns Q1 to Q4 Intersection S Support V1 to V16 Connection portions

Claims

1. An electronic component comprising: an element body having a first surface and a second surface located opposite to the first surface; a first terminal electrode and a second terminal electrode located on a first conductor layer within the element body, both exposed from the first surface; and a coil, at least a portion of which is located on a second conductor layer within the element body, one end of which is connected to the first terminal electrode via a first via conductor and the other end of which is connected to the second terminal electrode via a second via conductor, wherein at least a portion of the first via conductor has a shape that tapers in diameter toward the first terminal electrode, and at least a portion of the second via conductor has a shape that tapers in diameter toward the second terminal electrode.

2. The electronic component according to claim 1, wherein a surface of the first terminal electrode and a surface of the second terminal electrode exposed from the element body form the same plane as the first surface of the element body.

3. The electronic component according to claim 1, wherein the coil includes: a first conductor pattern formed on the first conductor layer, one end located on the side of the first terminal electrode and the other end located on the side of the second terminal electrode; a second conductor pattern formed on the second conductor layer, one end electrically connected to the first terminal electrode via the first via conductor and the other end electrically connected to the other end of the first conductor pattern via a third via conductor; and a third conductor pattern formed on the second conductor layer, one end electrically connected to the second terminal electrode via the second via conductor and the other end electrically connected to the one end of the first conductor pattern via a fourth via conductor.

4. The electronic component according to claim 3, wherein the second conductor pattern and the third conductor pattern are embedded in the element body without being exposed from either the first surface or the second surface.

5. The electronic component according to claim 3, wherein the first conductor pattern is exposed from the first surface, and a surface of the first conductor pattern exposed from the base body forms the same plane as the first surface of the base body.

6. The electronic component described in claim 3, wherein at least a portion of the third via conductor has a shape whose diameter decreases toward the other end of the first conductor pattern, and at least a portion of the fourth via conductor has a shape whose diameter decreases toward the one end of the first conductor pattern.

7. The electronic component according to any one of claims 1 to 6, wherein a portion of the coil located on the second conductor layer is curved toward the first surface.

8. An electronic component as described in any one of claims 1 to 6, wherein the one end of the coil is connected to the first terminal electrode via a first via conductor group including the first via conductor, the other end of the coil is connected to the second terminal electrode via a second via conductor group including the second via conductor, each of the plurality of via conductors included in the first via conductor group has at least a portion having a shape whose diameter decreases toward the first terminal electrode, and each of the plurality of via conductors included in the second via conductor group has at least a portion having a shape whose diameter decreases toward the second terminal electrode.

9. A method for manufacturing an electronic component, comprising: a first step of forming a first conductor layer on a support, the first conductor layer including a first terminal electrode, a second terminal electrode, and a first sacrificial pattern; a second step of forming a second conductor layer on the first conductor layer, the second sacrificial pattern and at least a part of a coil having one end connected to the first terminal electrode and the other end connected to the second terminal electrode; a third step of removing the first sacrificial pattern and the second sacrificial pattern; a fourth step of forming an element body in an area from which at least the first sacrificial pattern and the second sacrificial pattern have been removed, thereby embedding the first terminal electrode, the second terminal electrode, and the coil in the element body; and a fifth step of exposing the first terminal electrode and the second terminal electrode by peeling off the support.

10. The method for manufacturing an electronic component according to claim 9, wherein in the third step, a space is formed between the support and at least the portion of the coil located on the second conductor layer.

11. The method for manufacturing an electronic component according to claim 9 or 10, wherein in the fourth step, the element body is pressurized to bend at least the portion of the coil toward the support body.

Images