Mounting device, mounting method, electronic device manufacturing system, electronic device manufacturing method, laser irradiation device, and laser irradiation method

Abstract

This mounting device is provided with: a stage (20) that supports a three-dimensional substrate; a mounting head (24) that mounts a component (2) on the three-dimensional substrate; and a management device (16) that controls the stage (20) so as to make the surface of the three-dimensional substrate at the mounting position of the component (2) horizontal, and controls the mounting head (24) so that the component (2) is mounted at the mounting position. The mounting device sets the rotational speed of the stage (20) when the surface of the three-dimensional substrate at the mounting position of the component (2) is made horizontal, on the basis of component data including at least one of the size, the height, and the weight of the component (2), and the ratio of the region to which a cream solder is applied to the ground contact surface with the surface of the three-dimensional substrate.

Description

Mounting apparatus, mounting method, electronic device manufacturing system, electronic device manufacturing method, laser irradiation apparatus, and laser irradiation method

[0001] The present disclosure relates to a mounting apparatus, a mounting method, an electronic device manufacturing system, an electronic device manufacturing method, a laser irradiation apparatus, and a laser irradiation method.

[0002] 2. Description of the Related Art In the technical field of mounting devices, a three-dimensional mounting device that mounts components on a three-dimensional substrate, such as that disclosed in Patent Document 1, is known.

[0003] International Publication No. 2018 / 207313

[0004] In the mounting device, electronic components are mounted on the area where the cream solder has been applied. The components are then transported to a laser irradiation device, where they are irradiated with laser light to melt the cream solder. The melted cream solder is then cooled, soldering the electronic components to the substrate. When mounting electronic components on a three-dimensional substrate, it is necessary to control the stage supporting the three-dimensional substrate and rotate the three-dimensional substrate on the stage so that the mounting position of the electronic components on the surface of the three-dimensional substrate is horizontal. During this process, the electronic components are held to the three-dimensional substrate only by the adhesive force of the solder, so there is a possibility that the already mounted electronic components may become displaced or come off due to the high-speed rotation of the three-dimensional substrate. Similarly, when soldering electronic components mounted on a three-dimensional substrate, there is a possibility that the unsoldered electronic components may become displaced or come off due to the high-speed rotation of the three-dimensional substrate.

[0005] An object of the present disclosure is to perform mounting processing on a three-dimensional substrate stably and at high speed.

[0006] Another object of the present disclosure is to perform soldering processing on a three-dimensional substrate stably and at high speed.

[0007] A mounting device according to one aspect of the present disclosure includes a stage for supporting a three-dimensional substrate, a mounting head for mounting components onto the three-dimensional substrate, and a management device for controlling the stage to level the surface of the three-dimensional substrate at the mounting position of the component and for controlling the mounting head so that the component is mounted at the mounting position, and sets the rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component based on component data including at least one of the size, height, and weight of the component, and the proportion of the area to which cream solder is applied relative to the contact surface with the surface of the three-dimensional substrate.

[0008] Another aspect of the present disclosure is a laser irradiation device that includes a stage for supporting a three-dimensional substrate, a laser head that irradiates laser light onto cream solder that holds a component mounted on the three-dimensional substrate, and a management device that controls the stage to level the surface of the three-dimensional substrate at the component mounting position and controls the laser head to irradiate laser light onto the cream solder at the mounting position, and sets the rotation speed of the stage when leveling the surface of the three-dimensional substrate at the component mounting position based on component data that includes at least one of the size, height, and weight of the component, and the ratio of the area where the cream solder is applied to the contact surface with the surface of the three-dimensional substrate.

[0009] According to the present disclosure, mounting processing on a three-dimensional substrate can be performed stably and quickly.

[0010] Furthermore, according to the present disclosure, soldering processing on a three-dimensional substrate can be carried out stably and quickly.

[0011] FIG. 1 is a perspective view showing a board and a component according to an embodiment. FIG. 2 is a perspective view showing a pallet supporting a board according to an embodiment. FIG. 3 is an exploded perspective view showing a board and a pallet according to an embodiment. FIG. 4 is a diagram schematically showing a production system for electronic devices according to an embodiment. FIG. 5 is a plan view schematically showing a mounting apparatus according to an embodiment. FIG. 6 is a perspective view showing a pallet and a stage according to an embodiment. FIG. 7 is a diagram schematically showing a mounting head according to an embodiment. FIG. 8 is a diagram for explaining board data and NC data according to an embodiment. FIG. 9 is a diagram for explaining a stage control method. FIG. 10 is a diagram schematically showing the configuration of a management apparatus according to an embodiment. FIG. 11 is a flowchart showing a mounting process according to an embodiment. FIG. 12 is a flowchart showing a laser soldering process according to an embodiment. FIG. 13 is a flowchart showing another example of a laser soldering process according to an embodiment.

[0012] This embodiment will be described below with reference to the drawings. In this embodiment, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. This XYZ Cartesian coordinate system is a relative direction set for the mounting apparatus, laser irradiation apparatus, and electronic device manufacturing system exemplified in this disclosure. The direction parallel to the X axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis of a predetermined plane, which is orthogonal to the X axis, is defined as the Y-axis direction. The direction parallel to the Z axis, which is orthogonal to the predetermined plane, is defined as the Z-axis direction. The rotation direction or tilt direction about the X-axis direction is defined as the θX direction. The rotation direction or tilt direction about the Y axis direction is defined as the θY direction. The rotation direction or tilt direction about the Z axis direction is defined as the θZ direction. In this embodiment, the predetermined plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Note that the above-mentioned phrase "the predetermined plane is parallel to the horizontal plane" does not intend to limit the predetermined plane to being parallel to the horizontal plane. In this embodiment, the predetermined plane may be inclined with respect to the horizontal plane. Furthermore, in this embodiment, the predetermined plane including the X-axis and the Y-axis will be referred to as the XY plane as appropriate.

[0013] [Substrate] Fig. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In this embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0014] An electrical circuit is provided on the surface of substrate 1. In this embodiment, substrate 1 is formed by in-mold molding technology. Substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of base material 1A. Film 1B is flexible. Film 1B is a flexible film. Film 1B includes an electrical circuit. The electrical circuit includes electrodes such as lands and pads. The position (planar coordinates) of each electrode on film 1B is assumed to be known. The surface of substrate 1 includes the surface of film 1B.

[0015] The component 2 includes an electronic component. Although only one component 2 is shown in FIG. 1, in this embodiment, it is assumed that a plurality of components 2 are mounted on one substrate 1. The plurality of components 2 includes a plurality of types of components 2 that differ in size, height, weight, material, etc. The component 2 may be a lead-type electronic component having leads protruding from the body. The component 2 may be a chip-type electronic component having no leads. An electronic device is manufactured by mounting the component 2 on the surface of the substrate 1.

[0016] [Pallet] Fig. 2 is a perspective view showing a pallet 3 that supports a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing the substrate 1 and pallet 3 according to an embodiment. The pallet 3 supports the substrate 1. In this embodiment, the substrate 1 is handled while being supported by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0017] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0018] The base portion 4A is a plate-like member having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the top and bottom surfaces of the base portion 4A.

[0019] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart in the Y-axis direction. One guard portion 4B protrudes toward the +Z side from the +Y side end of the upper surface of the base portion 4A. The other guard portion 4B protrudes toward the +Z side from the -Y side end of the upper surface of the base portion 4A.

[0020] Each of the multiple pin portions 4C protrudes from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the +Y side of the substrate 1. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the -Y side of the substrate 1.

[0021] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the end of the substrate 1 on the -X side, and a movable part 5B that supports the end of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, thereby sandwiching the substrate 1 between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0022] In this embodiment, the pallet 3 may have an information medium 80. The information medium 80 holds board data related to the board 1. In this embodiment, the information medium 80 is a two-dimensional code. However, the information medium 80 may also be a one-dimensional barcode. The information medium 80 may also be an RF tag. In this embodiment, the information medium 80 is attached to a portion of the upper surface of the base portion 4A. The information medium 80 is positioned so as not to overlap the board 1.

[0023] [Production System] Fig. 4 is a diagram schematically illustrating an electronic device production system 10 according to an embodiment. As shown in Fig. 4, the production system 10 includes a mounting device 12, a preheating device 13, a laser irradiation device 14, and a management device 16. The mounting device 12, the preheating device 13, and the laser irradiation device 14 form a production line for electronic devices.

[0024] The mounting device 12 mounts the components 2 on the substrate 1. At least one mounting device 12 is provided in the production line. However, a plurality of mounting devices 12 may be provided.

[0025] 5 is a plan view schematically illustrating a mounting apparatus 12 according to an embodiment. The mounting apparatus 12 includes a base member 18, a transport device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a board camera 25, a height sensor 26, a head moving device 27, a nozzle moving device 28 (see FIG. 7 ), and a chamber 29.

[0026] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , and the head moving device 27 .

[0027] The transport device 19 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 supplied to the mounting device 12 to a processing position of the mounting device 12. The processing position is defined by the transport path of the transport device 19.

[0028] The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0029] The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are spaced apart in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0030] The conveyor belt 19A is circular. A pair of conveyor belts 19A is provided. The conveyor belts 19A are supported by guide members 19B via a drive pulley and a driven pulley. The conveyor belts 19A are looped around the drive pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0031] Of the pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the underside of the pallet 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the pallet 3 in the X-axis direction.

[0032] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0033] FIG. 6 is a perspective view showing a pallet 3 and a stage 20 according to an embodiment. The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side after it has been transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into holes 4D in the pallet 3. The stage 20 and the pallet 3 are positioned by inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hooked onto the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hooked onto the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0034] The stage movement device 21 moves the stage 20. In this embodiment, the stage movement device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage movement device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0035] After the pallet 3 is transported to the processing position by the transport device 19, the stage moving device 21 moves the stage 20 in the +Z direction, so that the stage 20 supports the pallet 3 from below, and the pallet 3 is passed from the transport device 19 to the stage 20. Next, the guide member 19B on the +Y side moves in the Y-axis direction away from the other guide member 19B, thereby releasing support of the pallet 3 by the transport belt 19A. Furthermore, the stage 20 moves in the +Z direction to support the pallet 3, and support of the pallet 3 by the transport belt 19A is released. With the pallet 3 supported on the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is centered between the two guide members 19B, making it possible to move the stage 20 in each of the Z-axis direction, the θX direction, and the θY direction.

[0036] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 is on the transport belt 19A. In addition, the guide member 19B on the +Y side moves in the -Y direction until the other side of the pallet 3 is on the transport belt 19A. After the hooks provided at the upper end of the positioning member 20A are released from fixation, the stage 20 is moved in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0037] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supply device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. In this embodiment, the component supply device 22 is disposed on the -Y side of the conveying device 19. Note that the arrangement of the component supply device 22 is not limited to the above. The component supply device 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0038] The mounting head 24 mounts components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0039] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 in both the X-axis direction and the Y-axis direction. The head moving device 27 has an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. Operation of the X-axis moving device 27X causes the mounting head 24 to move in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. Operation of the Y-axis moving device 27Y causes the X-axis moving device 27X to move in the Y-axis direction, thereby moving the mounting head 24 in the Y-axis direction.

[0040] FIG. 7 is a schematic diagram showing a mounting head 24 according to an embodiment. As shown in FIG. 7 , the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact, a suction operation is performed through the opening provided at the lower end of the nozzle 23, thereby suction-holding the component 2 at the lower end of the nozzle 23. When the suction operation through the opening is released, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that clamps and holds the component 2.

[0041] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in both the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to the plurality of shafts 23A, respectively. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to the plurality of shafts 23A, respectively. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0042] The nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. By moving the nozzle 23, the component 2 held by the nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0043] The board camera 25 images the board 1. In this embodiment, the board camera 25 images the surface of the board 1 from the +Z side of the board 1. The board camera 25 is provided on the mounting head 24. The board camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The board camera 25 can, for example, image an alignment mark provided on the surface of the board 1.

[0044] The height sensor 26 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is provided on the mounting head 24. The height sensor 26 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. In this embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 can detect the distance from the mounting head 24 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0045] The chamber 29 has an internal space that accommodates the base member 18, the transport device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, and the nozzle moving device 28.

[0046] 4 , in this embodiment, the mounting device 12 has a dispenser 34 that applies cream solder to the board 1. The dispenser 34 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transport device 19. The dispenser 34 and the mounting head 24 are movable separately. After the cream solder is applied to the surface of the board 1 by the dispenser 34, the components 2 are mounted on the board 1 by the mounting head 24. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

[0047] The preheating device 13 reduces the liquid component of the cream solder applied to the substrate 1. The cream solder includes flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by activating the flux and vaporizing at least a portion of the liquid component. The preheating device 13 includes a base member 35, a transport device 36 that transports the pallet 3, a heater 37 that heats the substrate 1, and a chamber 38.

[0048] The base member 35 supports a conveying device 36. The conveying device 36 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 36 has a conveying belt 36A that conveys the pallet 3 and a guide member 36B that guides the pallet 3.

[0049] The heater 37 heats the substrate 1 so that at least a part of the liquid component of the flux of the cream solder is vaporized.

[0050] The chamber 38 has an internal space in which the base member 35, the transport device 36, and the heater 37 are housed.

[0051] Preheating device 13 heats substrate 1 supported on pallet 3 so as to reduce the liquid component of the cream solder. Preheating device 13 heats substrate 1 at a temperature lower than the melting point of the cream solder. Preheating device 13 heats substrate 1 for 10 minutes, for example, at a temperature of 80°C or higher and 100°C or lower. Substrate 1 preheated by preheating device 13 is transported to laser irradiation device 14 while fixed to pallet 3.

[0052] The laser irradiation device 14 irradiates the cream solder with laser light so as to melt the cream solder. The laser irradiation device 14 includes a base member 39, a transport device 40 that transports the pallet 3, a stage 41 that supports the pallet 3, a stage moving device 42 that moves the stage 41, a laser head 43 that emits laser light, and a chamber 44.

[0053] The base member 39 supports the conveying device 40, the stage 41, the stage moving device 42, and the laser head 43. The conveying device 40 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 40 has a conveying belt 40A that conveys the pallet 3, and a guide member 40B that guides the pallet 3. The structure and function of the conveying device 40 are substantially the same as the structure and function of the conveying device 19.

[0054] The stage 41 supports the pallet 3 from the -Z side. The stage movement device 42 moves the stage 41 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 41 are substantially the same as the structure and function of the stage 20.

[0055] The laser head 43 irradiates the cream solder with laser light to melt the cream solder. The laser head 43 moves in the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the conveying device 40.

[0056] The chamber 44 has an internal space in which the base member 39, the transport device 40, the stage 41, the stage moving device 42, and the laser head 43 are housed.

[0057] In the laser irradiation device 14, the cream solder is irradiated with laser light emitted from the laser head 43. The cream solder is heated by the laser light and melts. The melted cream solder is cooled, thereby soldering the component 2 to the board 1. In this embodiment, the cream solder is irradiated with laser light after the liquid component of the cream solder is reduced in the preheating device 13. Because the cream solder is irradiated with laser light in a state in which the liquid component of the cream solder has been reduced, solder balls caused by bumping of the cream solder are suppressed.

[0058] When the pallet 3 has an information medium 80, the mounting device 12 may be provided with a reading device 101, the preheating device 13 may be provided with a reading device 102, and the laser irradiation device 14 may be provided with a reading device 103. The reading device 101 reads the board data stored in the information medium 80. When the information medium 80 is a two-dimensional code, the reading device 101 is a two-dimensional code reader. When the information medium 80 is an RF tag, the reading device 101 is an RFID reader. Like the reading device 101, the reading devices 102 and 103 each read the board data stored in the information medium 80.

[0059] 8 is a diagram illustrating board data and NC data according to an embodiment. The board data may be stored, for example, in an information medium 80, or in a storage device provided in each of the mounting device 12, the preheating device 13, and the laser irradiation device 14, or may be stored in an external storage device via a network, such as the storage 49 of the management device 16 (described below) or a storage device on a server that manages the production system 10. In this embodiment, the board data will be described as being stored in the information medium 80.

[0060] The board data includes the mounting position Pp (xp, yp, zp) of the component 2 on the surface of the board 1. The board data also includes, for example, the normal vector (u, v, w) of the surface of the board 1 at the mounting position Pp, surface data of the surface of the board 1, and texture data of the circuit pattern on the surface data. The board data is expressed in a board coordinate system (Xp, Yp, Zp) with the board coordinate reference point Pr fixed to the board 1 or the pallet 3 as its origin. In addition to the above, the board data also includes the number of the component to be mounted, the position of the land where the cream solder is to be applied, the preheating temperature, the preheating time, the laser power, the laser irradiation time, etc., and is used by each device on the production line.

[0061] The stage 20 is used in the mounting device 12. The mounting device 12 is a three-dimensional mounting device. The stage 20 is rotatable while supporting the substrate 1. The stage 20 can rotate in the θX direction around the rotation axis Xt. The stage 20 can rotate in the θY direction around the rotation axis Yt. The stage 20 supports the substrate 1 via a pallet 3. When the stage 20 rotates in the θX direction and the θY direction around the rotation axis Xt and the rotation axis Yt and the substrate 1 tilts, the mounting position Pp rotates around the rotation axis Xt and the rotation axis Yt. The rotation axis Xt and the rotation axis Yt are perpendicular to each other.

[0062] The machine coordinate system (Xm, Ym, Zm) is defined on the mounting device 12. The machine coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12 and serves as a reference when the mounting head 24 moves. The origin of the machine coordinate system may be located anywhere on the mounting device 12. When the stage 20 rotates in the θX and θY directions around the rotation axes Xt and Yt and the board 1 tilts, the mounting position Pp rotates around the rotation axes Xt and Yt. A mounting position Pm (xm, ym, zm) in the machine coordinate system of the rotated mounting position Pp is calculated, and the board camera 25, height sensor 26, and nozzle 23 of the mounting head 24 move using this mounting position Pm (xm, ym, zm). The mounting position Pm (xm, ym, zm) in the machine coordinate system and the rotation angle of the stage 20 are stored as NC data and used as command positions for the drive motors when the mounting device 12 is operating. Similarly, NC data is created and used in each device on the production line other than the mounting device 12. The NC data is calculated based on mechanism parameters such as the positions of the rotation axis Xt and rotation axis Yt of the stage 20, so the NC data for each device will be different.

[0063] 9 is a diagram for explaining a method of controlling the stage 20. When the stage 20 rotates about the rotation axis Rm, the substrate 1 and the substrate coordinate system also rotate. When the stage 20 moves up and down in the Z-axis direction, the substrate 1 and the substrate coordinate system also move up and down. Therefore, the mounting position Pp (xp, yp, zp) is converted to a mounting position Pm (xm, ym, zm) in the machine coordinate system using data on the rotation angle and vertical movement amount of the stage 20, the position of the rotation axis of the stage 20, and the positions of the rotation axis of the stage 20 and the origin of the substrate coordinate system. Furthermore, the position in the machine coordinate system can also be converted to a position in the substrate coordinate system using the control amount of the stage 20.

[0064] As described above, the surface of the substrate 1 at the mounting position Pm can be made horizontal by rotating and moving the stage 20 in the mounting device 12. The stage 20 of the mounting device 12 is substantially identical in structure and function to the stage 41 of the laser irradiation device 14. Therefore, in the laser irradiation device 14, the surface of the substrate 1 at the laser irradiation position can be made horizontal by rotating and moving the stage 41 using the same process as described above.

[0065] 10 is a diagram schematically illustrating the configuration of a management device 16 according to an embodiment. The management device 16 controls the production line. The management device 16 may be present in each of the mounting device 12, the preheating device 13, and the laser irradiation device 14, or may be present separately via a network. The management device 16 includes a computer system.

[0066] The management device 16 includes at least one processor 47, a main memory 48, a storage 49, and an interface 50. The processor 47 is a central processing unit (CPU). The main memory 48 includes nonvolatile memory such as read-only memory (ROM) and volatile memory such as random access memory (RAM). Examples of the storage 49 include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface 50 includes an input / output circuit. The functions of the processor 47 are stored as a program in the storage 49. The processor 47 reads the program from the storage 49, loads it into the main memory 48, and executes processing in accordance with the program. The program may be distributed to the management device 16 via a network.

[0067] [Mounting Process] Figure 11 is a flowchart showing the mounting process according to this embodiment. The board 1 is fixed to the pallet 3. In this embodiment, board data for the board 1 fixed to the pallet 3 is stored on an information medium 80. If the information medium 80 is a two-dimensional code, the two-dimensional code indicating the board data is attached to the pallet 3, and only an identification number is stored on the information medium 80 held on the pallet 3, and board data stored in the storage 49 of the management device 16 or on a server managing the production system 10 may be referenced.

[0068] In this embodiment, the pallet 3 with the information medium 80 attached is transported to the mounting device 12 while supporting the board 1. The reading device 102 reads the information medium 80 attached to the pallet 3, and the management device 16 acquires board data for the board 1 (step SA1). The board data for the board 1 transported to the mounting device 12 includes coordinate data for the mounting position on the surface of the board 1, data for the components 2 to be mounted, and the positions of the soldering lands. The data for the components 2 includes the component number, type, size, height, weight, and so on of the component 2. Conditions such as the ratio of the area to the contact surface to which cream solder is applied vary depending on the type of component 2.

[0069] The management device 16 sets the rotation speed of the stage 20 based on data about the component 2, such as the size, height, and weight of the component 2, and the ratio of the area to the contact surface to which the cream solder is applied. The rotation speed of the stage 20 may be set, for example, based on the sum of the size, height, and weight of the component 2, and the ratio of the area to the contact surface to which the cream solder is applied, each of which has a predetermined weighting coefficient. The rotation speed of the stage 20 may be set to three levels, for example, high speed, medium speed, and low speed, or may be set to two levels, four or more levels, or may be set continuously.

[0070] The management device 16 sets the rotation speed of the stage 20 for each component 2 (step SA2). In this embodiment, the speed is set to one of high, medium, and low speeds as shown in Table 1 below. The management device 16 also sets the order in which the components 2 are to be mounted based on the set rotation speed of the stage 20 (step SA3). At this time, the rotation speed of the stage 20 is set in order from high to low. In this embodiment, the rotation speed is set in three stages: high, medium, and low. Therefore, the order of multiple components 2 set to the same rotation speed stage is arbitrary. For example, the order is set from the center to the periphery of the surface of the board 1 so as to minimize the rotation of the stage 20 and the movement of the mounting head 24.

[0071]

[0072] Next, the dispenser 34 of the mounting device 12 creates NC data using the board data read by the reader 102 from the information medium 80 and the mechanism parameters, and applies cream solder to the board 1 based on the created NC data. The dispenser 34 applies cream solder to the pad positions for the component to be mounted at the mounting position Pp (step SA4). The application of cream solder is repeated for all components 2 to be mounted on the board 1.

[0073] After the solder paste is applied to the board 1, the management device 16 sets the execution count i to i=1 and starts a loop process (step SA5). In the loop process, as long as i≦n holds, the processes from step SA6 to step SA7 are repeated n times. Note that n is the number of components 2 to be mounted on the board 1, and i is the order in which the components 2 are mounted, as set in step SA3.

[0074] The management device 16 controls the stage 20 so that the surface of the board 1 is horizontal at the mounting position Pp of the i-th component 2. At this time, the management device 16 controls the stage 20 so that it rotates and moves at the rotational speed set in step SA2 relative to the i-th component 2 (step SA6). The stage 20 is controlled based on the board data read by the reading device 104 from the information medium 80 and NC data created from the mechanism parameters. The management device 16 controls the mounting head 24 so that the component 2 is mounted on the board 1 supported by the stage 20. The mounting head 24 is controlled based on the NC data. The mounting head 24 mounts the component 2 at the mounting position Pp (step SA7).

[0075] The management device 16 resets the execution count i in the loop processing to i = i + 1 and returns to step SA6. The processing from step SA6 to step SA7 is executed n times, and when all components 2 have been mounted in their respective predetermined positions on the board 1, the loop processing ends (step SA8). Note that the application of cream solder and the mounting of components may be performed after the application of cream solder to all locations, and then the mounting of n components 2 may be performed all at once, or the application of cream solder and the mounting of components 2 may be repeated for each component 2.

[0076] [Preheating Treatment] After the components 2 are mounted on the board 1, the pallet 3 supporting the board 1 is transported to the preheating device 13. The reading device 103 reads the information medium 80 attached to the pallet 3. The preheating device 13 preheats the cream solder applied to the board 1 based on the preheating temperature and preheating time of the board data read by the reading device 103 from the information medium 80.

[0077] [Laser Soldering Process] FIG. 12 is a flowchart illustrating the laser soldering process according to an embodiment. After the cream solder is preheated, the pallet 3 supporting the board 1 is transported to the laser irradiation device 14. The management device 16 acquires board data for the board 1 by reading the information medium 80 attached to the pallet 3 with the reading device 104 (step SB1). The board data for the board 1 transported to the laser irradiation device 14 includes coordinate data for the mounting position on the surface of the board 1, data for the components 2 to be mounted, and the soldering land positions. The data for the components 2 includes the component number, type, size, height, weight, and so on of the component 2. Depending on the type of component 2, different conditions, such as the ratio of the area covered with cream solder to the contact surface, may be required. The board data also includes laser irradiation conditions such as laser power and laser irradiation time.

[0078] The management device 16 sets the rotation speed of the stage 41 based on data about the component 2, such as the size, height, and weight of the component 2, and the ratio of the area where the cream solder is applied to the contact surface. The rotation speed of the stage 41 may be set, for example, based on the sum of the size, height, and weight of the component 2, the ratio of the area where the cream solder is applied to the contact surface, and other data, each of which has a predetermined weighting coefficient. The rotation speed of the stage 41 may be set to three levels, for example, low speed, medium speed, and high speed, or may be set to two levels, four or more levels, or may be set continuously.

[0079] The management device 16 sets the rotation speed of the stage 41 for each component 2 (step SB2). In this embodiment, the speed is set to one of low, medium, and high speeds as shown in Table 2 below. The management device 16 also sets the order in which the laser is to be applied to the cream solder corresponding to the components 2 based on the set rotation speed of the stage 41 (step SB3). The rotation speeds of the stage 41 are set in order from low to high. In this embodiment, the rotation speed is set in three stages: low, medium, and high. Therefore, the order of the components 2 set to the same rotation speed is arbitrary. For example, the rotation speed is set from the center toward the periphery of the surface of the board 1 so as to minimize the rotation of the stage 41 and the movement of the laser head 43.

[0080]

[0081] Next, the management device 16 sets the execution count j to j = 1 and starts loop processing (step SB4). In the loop processing, while j ≤ n is satisfied, the processing from step SB5 to step SB6 is repeated n times, where n is the number of components 2 mounted on the board 1 and j is the laser irradiation order set in step SB3.

[0082] The management device 16 controls the stage 41 so that the surface of the board 1 is horizontal at the position where the jth component 2 is mounted. At this time, the management device 16 controls the stage 41 so that it rotates and moves relative to the jth component 2 at the rotational speed set in step SB2 (step SB5). The stage 41 is controlled based on the board data read by the reading device 104 from the information medium 80 and NC data created from the mechanism parameters. The management device 16 controls the laser head 43 so that a laser beam is irradiated onto the cream solder applied to the area of ​​the board 1 where the jth component 2 is mounted. The laser head 43 is controlled based on the NC data. The cream solder is melted by the irradiation of the laser beam from the laser head 43, and then cooled, thereby soldering the component 2 to the board 1 (step SB6).

[0083] The NC data for component mounting is created so that the surface of the board 1 at the mounting position Pp of the component 2 is horizontal, but the surface of the board 1 during laser light irradiation may be tilted within a range that does not cause the component to shift position due to gravity. By intentionally tilting the surface of the board 1 during laser light irradiation, the direction of the laser light reflected from the solder surface can be controlled, preventing burnout of the board 1. The allowable angle of tilt is determined by the weight of the component 2 and the adhesive strength of the cream solder, and is stored in advance in the board data.

[0084] The management device 16 resets the execution count j in the loop process to j = j + 1 and returns to step SB5. After executing the processes from step SB5 to step SB6 n times and soldering all the components 2 on the board 1, the loop process ends (step SB7).

[0085] [Another Example of Laser Soldering Process] FIG. 13 is a flowchart illustrating another example of the laser soldering process according to the embodiment. Note that in the process illustrated in FIG. 13 , the description of processes common to the process illustrated in FIG. 12 will be omitted as appropriate. In the example illustrated in FIG. 13 , the mounting device 12 uses the data used in the process of the flowchart illustrated in FIG. 11 . Specifically, when the mounting process is performed in the mounting device 12, the rotation speed of the stage 20 corresponding to each component 2 and the order in which the components 2 were mounted are stored in the information medium 80. After the cream solder is preheated, the pallet 3, supporting the board 1, is transported to the laser irradiation device 14. By using the reading device 104 to read the information medium 80 attached to the pallet 3, the management device 16 obtains the board data for the board 1, as well as the rotation speed of the stage 20 and the order in which the components 2 were mounted set in the mounting device 12 (step SC1).

[0086] Next, the management device 16 sets the execution count i to i=n and starts loop processing (step SC2). In the loop processing, while i≧1 holds, the processing from step SC3 to step SC4 is repeated n times. Note that n is the number of components 2 mounted on the board 1, and i is the mounting order of the components 2 set in step SA3 shown in FIG. 11. That is, as shown in Table 3 below, in the processing shown in FIG. 13, the stage 41 is rotated at the same speed as the rotation speed of the stage 20 when mounting the components 2, and the cream solder is irradiated with a laser in the reverse order of the order in which the components 2 were mounted.

[0087]

[0088] The management device 16 controls the stage 41 so that the surface of the board 1 for the i-th component 2 in the reverse order is horizontal. At this time, the management device 16 controls the stage 41 to rotate and move at the rotational speed set in step SA3 shown in FIG. 11 relative to the i-th component 2 in the reverse order (step SC3). The stage 41 is controlled based on the board data read by the reading device 104 from the information medium 80 and NC data created from the mechanism parameters. The management device 16 controls the laser head 43 so that a laser beam is irradiated onto the cream solder applied to the area of ​​the board 1 where the i-th component 2 in the reverse order is mounted. The laser head 43 is controlled based on the NC data. The cream solder is melted by the irradiation of the laser beam from the laser head 43, and then cooled, thereby soldering the component 2 to the board 1 (step SC4).

[0089] The management device 16 resets the execution count i in the loop process to i=i-1 and returns to step SC3. After executing the processes from step SC3 to step SC4 n times and soldering all the components 2 on the board 1, the loop process ends (step SC5).

[0090] [Effects] As described above, according to this embodiment, the rotation speed of the stage 20 when rotating the stage 20 to make the mounting position of the component 2 horizontal can be set based on component data including at least one of the size, height, and weight of the component 2 to be mounted on the surface of the substrate 1 supported by the stage 20, and the ratio of the area to which cream solder is applied to the contact surface with the surface of the substrate 1. As a result, on a substrate 1 on which multiple components 2 are to be mounted, when some of the components 2 have already been mounted and held in place by the adhesive force of the solder, it is possible to prevent the components 2 from shifting or coming off when the stage 20 rotates, and the mounting process can be carried out stably and quickly.

[0091] Furthermore, according to this embodiment, the rotation speed of the stage 41 when rotating the stage 41 to make the mounting position of the components 2 horizontal can be set based on component data including at least one of the size, height, and weight of the components 2 mounted on the surface of the substrate 1 supported by the stage 41, and the ratio of the area where the cream solder is applied to the contact surface with the surface of the substrate 1. As a result, when the stage 41 rotates on the substrate 1 on which multiple components 2 have been mounted and some of the components 2 are not yet soldered and are held in place only by the adhesive force of the solder, it is possible to prevent the components 2 from shifting or coming off, thereby enabling stable and high-speed soldering processing.

[0092] [Other Embodiments] Although the embodiments of the present application have been described above, the present invention is not limited to the contents of these embodiments. The above-described embodiments and variations can be combined as appropriate within the scope of not causing any contradiction in the processing content. Furthermore, the above-described components include those that can be easily imagined by a person skilled in the art, those that are substantially the same, and those that are within the so-called equivalent scope. Furthermore, the above-described components can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made within the scope of not departing from the spirit of the above-described embodiments.

[0093] For example, in this embodiment, the rotation speed of the stage 20 corresponding to each of the components 2 to be mounted on the board 1 is set, and the mounting order of all the components 2 is set in advance, but the rotation speed of the stage 20 when mounting the next component 2 may be set based on the component data of the already mounted component 2. In other words, the rotation speed of the stage 20 is set to match the component 2 that should have the slowest rotation speed of the stage 20 among the multiple components 2 that have already been mounted.

[0094] Furthermore, for example, in this embodiment, the rotation speed of the stage 41 corresponding to each of all components 2 to be soldered to the board 1 is set, and the laser irradiation order corresponding to all of the components 2 is set in advance, but the rotation speed of the stage 41 when the next component 2 is soldered may be set based on the component data of the mounted components 2 that have not yet been soldered. In other words, the rotation speed of the stage 41 is set to match the component 2 that has not yet been soldered, of the plurality of components 2, that should have the slowest rotation speed of the stage 41.

[0095] Furthermore, the pallet 3 may not have the information medium 80, and may instead refer to board data stored in the storage 49 of the management device 16 or in a storage device on a server that manages the production system 10. In this case, the mounting device 12, preheating device 13, and laser irradiation device 14 do not require the reading devices 101, 102, and 103, and no reading operation is required to obtain the board data from the information medium 80. In other words, if board data is stored in the respective storage devices of the mounting device 12, preheating device 13, and laser irradiation device 14, the storage 49, or an external storage device, the mounting process, preheating process, and laser soldering process described in the embodiment will obtain the board data by referring to the board data from the storage device rather than by reading from the information medium 80.

[0096] Furthermore, among the processes described in the above embodiments, all or part of the processes described as being performed automatically can be performed manually, or all or part of the processes described as being performed manually can be performed automatically using a known method. In addition, the information including the processing procedures, specific names, various data, and parameters shown in the above documents and drawings can be changed as desired unless otherwise specified. For example, the various information shown in each drawing is not limited to the information shown in the drawings.

[0097] Furthermore, the components of each device shown in the figure are functional concepts and do not necessarily have to be physically configured as shown. In other words, the specific form of distribution and integration of each device is not limited to that shown in the figure, and all or part of them can be functionally or physically distributed and integrated in any unit depending on various loads, usage conditions, etc. Furthermore, the above-mentioned management device 16 may be configured by multiple computers each divided into several functions, and some of the computer functions may be possessed by a cloud server that executes various functions in the form of cloud computing.

[0098] The present disclosure includes the following aspects. (1) A mounting device comprising: a stage for supporting a three-dimensional substrate; a mounting head for mounting components on the three-dimensional substrate; and a management device for controlling the stage to level the surface of the three-dimensional substrate at the mounting position of the component and controlling the mounting head so that the component is mounted at the mounting position, wherein a rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component is set based on component data including at least one of the size, height, and weight of the component and the ratio of an area to which cream solder is applied to a contact surface with the surface of the three-dimensional substrate. (2) The mounting device described in (1), wherein a rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of a next component to be mounted is set based on component data of the component already mounted on the three-dimensional substrate. (3) The mounting device described in (1), wherein a rotation speed of the stage is set for a plurality of components to be mounted on the three-dimensional substrate based on the component data for each component, and an order in which the components are to be mounted is set based on the set rotation speed of the stage. (4) The mounting apparatus according to any one of (1) to (3), which is set so that the components are mounted in order of the set rotation speed of the stage from fastest to slowest. (5) A manufacturing system for electronic devices, comprising: a pallet that supports the three-dimensional substrate and has an information medium that stores substrate data including component mounting positions on a surface of the three-dimensional substrate, a horizontal direction at the mounting positions, and the component data; and the mounting apparatus according to any one of (1) to (4), which applies cream solder to the three-dimensional substrate that is transported while being fixed to the pallet, and mounts the components at the mounting positions.(6) A mounting method comprising: acquiring substrate data including a mounting position of a component on a surface of a three-dimensional substrate supported by a stage, a horizontal direction at the mounting position, and component data including at least one of the size, height, and weight of the component, and a ratio of an area to be applied with cream solder to a contact surface with the surface of the three-dimensional substrate, setting a rotation speed of the stage when horizontalizing the surface of the three-dimensional substrate at the mounting position of the component based on the component data, controlling the stage to horizontalize the surface of the three-dimensional substrate at the mounting position based on the substrate data and the rotation speed, and mounting the component at the mounting position with a mounting head while the surface of the three-dimensional substrate at the mounting position is horizontal. (7) A method for manufacturing an electronic device comprising: applying cream solder to the three-dimensional substrate, and mounting the component on the three-dimensional substrate by the mounting method described in (6). (8) A laser irradiation device comprising: a stage for supporting a three-dimensional substrate; a laser head for irradiating laser light onto cream solder holding a component mounted on the three-dimensional substrate; and a management device for controlling the stage to level the surface of the three-dimensional substrate at the component mounting position and controlling the laser head to irradiate the laser light onto the cream solder at the mounting position, wherein the laser irradiation device sets a rotation speed of the stage when leveling the surface of the three-dimensional substrate at the component mounting position based on component data including at least one of the size, height, and weight of the component and the ratio of an area where the cream solder is applied to the contact surface with the surface of the three-dimensional substrate. (9) The laser irradiation device according to (8), wherein the rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of a component held in cream solder to be irradiated with laser light next is set based on component data of a component that is not soldered among the components mounted on the three-dimensional substrate. (10) The laser irradiation device described in (8), wherein the rotation speed of the stage is set based on the component data for each of the multiple components mounted on the three-dimensional substrate, and the order in which the laser light is irradiated onto the cream solder holding the components is set based on the set rotation speed of the stage.(11) The laser irradiation device according to any one of (8) to (10), which is set so that the components are mounted in order of decreasing set rotation speed of the stage. (12) A manufacturing system for an electronic device, comprising: a pallet that supports the three-dimensional substrate and has an information medium that stores substrate data including component mounting positions on a surface of the three-dimensional substrate, a horizontal direction at the mounting positions, and the component data; a mounting device that applies cream solder to the three-dimensional substrate transported while fixed to the pallet and mounts the components at the mounting positions; and the laser irradiation device according to any one of (8) to (11), which irradiates laser light onto the cream solder that holds the components mounted by the mounting device to solder them. (13) A laser light irradiation method comprising: acquiring board data including a mounting position where a component is mounted on a surface of a three-dimensional board supported by a stage, a horizontal direction at the mounting position, and component data including at least one of the size, height, and weight of the component, and a ratio of an area where cream solder is applied to a contact surface with the surface of the three-dimensional board, setting a rotation speed of the stage when leveling the surface of the three-dimensional board at the mounting position of the component based on the component data, controlling the stage to level the surface of the three-dimensional board at the mounting position based on the board data and the rotation speed, and soldering the component by irradiating a laser beam onto the cream solder holding the component mounted at the mounting position while the surface of the three-dimensional board at the mounting position is level. (14) The laser light irradiation method according to (13), comprising: acquiring a rotation speed of a stage supporting the three-dimensional board when the component is mounted on the three-dimensional board, and controlling the stage to level the surface of the three-dimensional board at the mounting position where the laser beam is irradiated, based on the board data and the acquired rotation speed. (15) A method for manufacturing an electronic device, comprising: applying cream solder to the three-dimensional substrate; mounting the components on the three-dimensional substrate; and soldering the components using the laser light irradiation method described in (13) or (14).

[0099] This application is based on Japanese Patent Application No. 2023-168558 filed on September 28, 2023 and Japanese Patent Application No. 2023-168559 filed on September 28, 2023, the contents of which are incorporated herein by reference.

Claims

1. A mounting device comprising: a stage for supporting a three-dimensional substrate; a mounting head for mounting components onto the three-dimensional substrate; and a management device for controlling the stage to level the surface of the three-dimensional substrate at the mounting position of the component, and controlling the mounting head so that the component is mounted at the mounting position, wherein the mounting device sets the rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component, based on component data including at least any one of the size, height, and weight of the component, and the proportion of the area to which cream solder is applied to the contact surface with the surface of the three-dimensional substrate.

2. The mounting device according to claim 1, further comprising: a rotation speed of the stage for leveling the surface of the three-dimensional substrate at the mounting position of the next component to be mounted, the rotation speed being set based on component data of the components already mounted on the three-dimensional substrate.

3. The mounting device according to claim 1, further comprising: setting a rotation speed of the stage based on the component data for each of a plurality of components to be mounted on the three-dimensional substrate; and setting an order in which the components are to be mounted based on the set rotation speed of the stage.

4. The mounting device according to claim 3, wherein the components are mounted in order of increasing stage rotation speed.

5. An electronic device manufacturing system comprising: a pallet that supports the three-dimensional substrate and has an information medium that holds substrate data including component mounting positions on the surface of the three-dimensional substrate, the horizontal direction at the mounting positions, and the component data; and a mounting device according to any one of claims 1 to 4 that applies cream solder to the three-dimensional substrate transported while fixed to the pallet, and mounts the components at the mounting positions.

6. A mounting method comprising: acquiring board data including a mounting position of a component on a surface of a three-dimensional substrate supported by a stage, a horizontal direction at the mounting position, and component data including at least one of the size, height, and weight of the component, and the ratio of an area to which cream solder is applied relative to a contact surface with the surface of the three-dimensional substrate; setting a rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component based on the component data; controlling the stage to level the surface of the three-dimensional substrate at the mounting position based on the board data and the rotation speed; and mounting the component at the mounting position with a mounting head while the surface of the three-dimensional substrate at the mounting position is horizontal.

7. A method for manufacturing an electronic device, comprising: applying cream solder to the three-dimensional substrate; and mounting the component on the three-dimensional substrate by the mounting method according to claim 6.

8. A laser irradiation device comprising: a stage for supporting a three-dimensional substrate; a laser head for irradiating laser light onto cream solder that holds a component mounted on the three-dimensional substrate; and a management device for controlling the stage to level the surface of the three-dimensional substrate at the mounting position of the component, and controlling the laser head so that laser light is irradiated onto the cream solder at the mounting position, wherein the laser irradiation device sets the rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component, based on component data including at least any one of the size, height, and weight of the component, and the ratio of the area where the cream solder is applied to the contact surface with the surface of the three-dimensional substrate.

9. The laser irradiation device according to claim 8, wherein the rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component held in the cream solder to be next irradiated with laser light is set based on component data of the components mounted on the three-dimensional substrate that are not soldered.

10. The laser irradiation device according to claim 8, further comprising: setting a rotation speed of the stage based on the component data for each of a plurality of components mounted on the three-dimensional substrate; and setting an order in which the cream solder holding the components is irradiated with laser light based on the set rotation speed of the stage.

11. The laser irradiation device according to claim 10, wherein the components are mounted in the order of decreasing stage rotation speed.

12. An electronic device manufacturing system comprising: a pallet that supports the three-dimensional substrate and has an information medium that holds substrate data including component mounting positions on the surface of the three-dimensional substrate, the horizontal direction at the mounting positions, and the component data; a mounting device that applies cream solder to the three-dimensional substrate transported while fixed to the pallet and mounts the components at the mounting positions; and a laser irradiation device described in any one of claims 8 to 11 that irradiates laser light onto the cream solder that holds the components mounted on the mounting device to solder them.

13. A laser light irradiation method comprising: acquiring board data including a mounting position at which a component is mounted on a surface of a three-dimensional board supported by a stage, a horizontal direction at the mounting position, and component data including at least one of the size, height, and weight of the component, and the ratio of an area applied with cream solder to a contact surface with the surface of the three-dimensional board; setting a rotation speed of the stage when leveling the surface of the three-dimensional board at the mounting position of the component based on the component data; controlling the stage to level the surface of the three-dimensional board at the mounting position based on the board data and the rotation speed; and, while the surface of the three-dimensional board at the mounting position is horizontal, irradiating a laser light onto the cream solder holding the component mounted at the mounting position, to solder the component.

14. A laser light irradiation method as described in claim 13, comprising: acquiring a rotation speed of a stage supporting the three-dimensional substrate when the component is mounted on the three-dimensional substrate; and controlling the stage based on the substrate data and the acquired rotation speed so as to level the surface of the three-dimensional substrate at the mounting position where the laser light is irradiated.

15. A method for manufacturing an electronic device, comprising: applying cream solder to the three-dimensional substrate; mounting the components on the three-dimensional substrate; and soldering the components using the laser light irradiation method described in claim 13 or 14.

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