Electronic device including connection member for baseband signal and RF signal

Abstract

This electronic device comprises: a processor; an RF transceiver; a first printed circuit board; a second printed circuit board; an antenna electrically connected to the second printed circuit board; a matching circuit arranged on the second printed circuit board; and a connection member including a third ground layer. The third ground layer is configured to transmit a baseband signal provided from the processor from the first printed circuit board to the second printed circuit board. Various other embodiments may also be possible.

Description

An electronic device comprising a connecting member for a baseband signal and an RF signal.

[0001] The present disclosure relates to an electronic device including a connecting member for a baseband signal and an RF signal.

[0002] An electronic device may include a printed circuit board for electrical connection between a plurality of electronic components. The electronic device may include a plurality of printed circuit boards for electronic components positioned at different locations. The plurality of printed circuit boards may be electrically connected via a connecting member.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a processor. The electronic device may include a radio frequency (RF) transceiver. The electronic device may include a first printed circuit board on which the processor and the RF transceiver are disposed. The electronic device may include a second printed circuit board spaced apart from the first printed circuit board. The electronic device may include an antenna electrically connected to the second printed circuit board. The electronic device may include a matching circuit disposed on the second printed circuit board and electrically connected to the antenna. The electronic device may include a third ground layer electrically separated from a first ground layer of the first printed circuit board and a second ground layer of the second printed circuit board, and a connecting member including an RF line for transmitting an RF signal between the RF transceiver and the antenna. The third ground layer may be configured to transmit a baseband signal provided from the processor from the first printed circuit board to the second printed circuit board.

[0005] An electronic device is provided. The electronic device may include a first printed circuit board. The electronic device may include a second printed circuit board spaced apart from the first printed circuit board. The electronic device may include a first line and a second line electrically isolated from the first line, and a connecting member connected to the first printed circuit board and the second printed circuit board. The connecting member may transmit a first signal on a first frequency band between the first printed circuit board and the second printed circuit board through the first line. The connecting member may transmit a second signal on a second frequency band between the first printed circuit board and the second printed circuit board through the second line. The second line may be a third ground layer of the connecting member, which is electrically isolated from a first ground layer of the first printed circuit board and a second ground layer of the second printed circuit board.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an exemplary electronic device.

[0008] Figure 3 is an exploded perspective view of an exemplary electronic device.

[0009] Figure 4a illustrates an exemplary electronic device with the display omitted.

[0010] Figure 4b is a block diagram of an exemplary electronic device.

[0011] Figure 5 illustrates multiple layers of a first printed circuit board and a second printed circuit board.

[0012] Fig. 6a is a cross-sectional view of an exemplary connecting member taken along line A-A' of Fig. 4a.

[0013] Fig. 6b is a cross-sectional view of an exemplary connecting member taken along line B-B' of Fig. 4a.

[0014] Fig. 7a is a cross-sectional view of an exemplary connecting member taken along line A-A' of Fig. 3a.

[0015] Figure 7b is a graph showing the transmission coefficient of an RF signal depending on whether an exemplary passive component is included.

[0016] Figure 8a is a simplified block diagram of an exemplary electronic device.

[0017] Figure 8b is a graph showing the radiation characteristics of an antenna due to the operation of a matching circuit.

[0018] FIG. 9 illustrates an electronic device including a foldable housing.

[0019] Figure 10 illustrates an electronic device including a sliderable housing.

[0020] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] Figure 2 illustrates an exemplary electronic device.

[0044] Referring to FIG. 2, an exemplary electronic device (101) may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side side) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0045] An exemplary electronic device (101) may include a substantially transparent first plate (202). For example, the first plate (202) may form at least a portion of the first surface (200A). For example, the first plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers. The first plate (202) may be referred to as a window.

[0046] An exemplary electronic device (101) may include a substantially opaque second plate (211). For example, the second plate (211) may form at least a portion of the second surface (200B). For example, the second plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0047] An exemplary electronic device (101) may include a side frame (218). For example, the side frame (218) may be coupled with the first plate (202) and / or the second plate (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the side frame (218) may form the entire third side (200C) of the electronic device (101). For example, the side frame (218) may form the third side (200C) of the electronic device (101) together with the first plate (202) and / or the second plate (211).

[0048] An exemplary electronic device (101) may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light emitting element (not shown), and / or a connector hole (208). For example, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)), or may additionally include other components.

[0049] For example, at least a portion of the display (201) (e.g., the display module (160) of FIG. 1) may be visible through the first plate (202) forming the first surface (200A). For example, the display (201) may be disposed on the back surface of the first plate (202).

[0050] For example, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the first plate (202) adjacent to the display (201). For example, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the first plate (202) may be formed to be substantially the same.

[0051] For example, the display (201) (or the first surface (200A) of the electronic device (101)) may include a screen display area (201A). For example, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the first plate (202)).

[0052] For example, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area that, like other areas of the screen display area (201A), can display visual information by the display (201) and additionally acquire the user's biometric information (e.g., a fingerprint). For example, the sensing area (201B) may also be formed in the key input device (217).

[0053] For example, the display (201) may include an area where a first camera module (205) (e.g., the camera module (180) of FIG. 1) is positioned. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. For example, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to the direction toward the first surface (200A) through the above area of ​​the display (201).

[0054] For example, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0055] For example, an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0056] For example, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones so as to detect the direction of the sound.

[0057] For example, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (212, 213). However, the present invention is not limited thereto.

[0058] For example, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). For example, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, this is not limited thereto, and for example, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the first plate (202) (or, the display (201)) and the side frame (218).

[0059] For example, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0060] For example, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] For example, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0062] For example, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras, and may include one camera.

[0063] For example, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0064] For example, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. For example, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0065] For example, a key input device (217) (e.g., an input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). For example, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0066] For example, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to a connector of the external device may be arranged within the connector hole (208). The exemplary electronic device (101) may include an interface module (e.g., an interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0067] For example, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. For example, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0068] Figure 3 is an exploded perspective view of an exemplary electronic device.

[0069] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0070] Referring to FIG. 3, an exemplary electronic device (101) may include a display (201), a first plate (202), a second plate (211), a side frame (218), a support member (243), a printed circuit board (251), a sub-printed circuit board (255), a cover plate (260), and / or a battery (270).

[0071] An exemplary electronic device (101) may include a side frame (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a support member (243) extending inwardly from the side frame (218). For example, the side frame (218) and the support member (243) may be disposed between the display (201) and the second plate (211). For example, the side frame (218) may surround a space between the second plate (211) and the first plate (202) (and / or the display (201)). For example, the support member (243) may extend from the side frame (218) within the space.

[0072] For example, the support member (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the support member (243) facing one direction (e.g., +z direction), and the display (201) may be supported by the support member (243). For example, a printed circuit board (251), a battery (270), and a second camera module (212) may be disposed on the other side of the support member (243) facing the opposite direction (e.g., -z direction). For example, the printed circuit board (251), the battery (270), and the second camera module (212) may be respectively mounted in recesses defined by the side frame (218) and / or the support member (243).

[0073] For example, the printed circuit board (251) and the battery (270) may be respectively connected to the support member (243). For example, the printed circuit board (251) may be fixedly arranged to the support member (243) via a connecting member such as a screw. For example, the battery (270) may be fixedly arranged to the support member (243) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0074] For example, the cover plate (260) may be placed between the printed circuit board (251) and the second plate (211). For example, the cover plate (260) may be placed on the printed circuit board (251). For example, the cover plate (260) may be placed on a surface of the printed circuit board (251) facing the -z direction.

[0075] For example, the cover plate (260) may at least partially overlap the printed circuit board (251) with respect to the z-axis. For example, the cover plate (260) may cover at least a portion of the printed circuit board (251). In this way, the cover plate (260) may protect the printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the printed circuit board (251).

[0076] For example, the cover plate (260) may be fixedly placed on the printed circuit board (251) via a joining member (e.g., a screw), or may be joined to the support member (243) together with the printed circuit board (251) via the joining member.

[0077] For example, the display (201) may be placed between the support member (243) and the first plate (202). For example, the first plate (202) may be placed on one side (e.g., in the +z direction) of the display (201), and the support member (243) may be placed on the other side (e.g., in the -z direction).

[0078] For example, the first plate (202) can be combined with the display (201). For example, the first plate (202) and the display (201) can be bonded to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0079] For example, the first plate (202) may be coupled with the side frame (218). For example, the first plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the side frame (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the first plate (202) and the side frame (218). However, the present invention is not limited to the above-described example.

[0080] For example, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on a printed circuit board (251). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. For example, the electronic device (101) may include a sub-printed circuit board (255). The printed circuit board (251) and the sub-printed circuit board (255) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0081] For example, a battery (270) (e.g., battery (189) of FIG. 1) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the printed circuit board (251) and / or the sub-printed circuit board (255).

[0082] An exemplary electronic device (101) may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). For example, the antenna module may be disposed between the second plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with the external device.

[0083] For example, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the support member (243) such that the lens can receive external light through a portion (e.g., a camera area (237)) of the first plate (202) (e.g., the front (200A) of FIG. 2).

[0084] For example, a second camera module (212) (e.g., a rear camera) may be disposed between the support member (243) and the second plate (211). For example, the second camera module (212) may be electrically connected to a printed circuit board (251) via a connecting member (e.g., a connector). For example, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the second plate (211) of the electronic device (101).

[0085] For example, the camera area (284) may be formed on the surface of the second plate (211) (e.g., the rear surface (200B) of FIG. 2). For example, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). For example, at least a portion of the camera area (284) may protrude from the surface of the second plate (211) by a predetermined height. However, the present invention is not limited thereto, and for example, the camera area (284) may form a plane that is substantially the same as the surface of the second plate (211).

[0086] For example, the housing (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the first plate (202), the side frame (218), and / or the second plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0087] For example, the support member (243) may include a first surface (243a) and a second surface (243b). The display (201) may be disposed in the housing (210). For example, the display (201) may be disposed on the first surface (243a) of the support member (243) (e.g., in the +z direction). The first surface (243a) may be a surface of the support member (243) facing the display (201). The second surface (243b) may be a surface of the support member (243) opposite to the first surface (243a). For example, the second surface (243b) may be a surface of the support member (243) facing the second plate (211).

[0088] Figure 4a illustrates an exemplary electronic device without a display. Figure 4b is a block diagram of the exemplary electronic device.

[0089] Referring to FIG. 4A, an exemplary electronic device (101) may include a housing (210), a first printed circuit board (251), a second printed circuit board (252), and a connecting member (370).

[0090] For example, the housing (210) may include a support member (243) and a side frame (218). The support member (243) may support components of the electronic device (101) (e.g., a first printed circuit board (251), a second printed circuit board (252)). The side frame (218) may at least partially surround the support member (243). For example, the side frame (218) may laterally surround the support member (243).

[0091] For example, opening areas (360) may be formed between the support member (243) and the side frame (218). The support member (243) and the side frame (218) may be spaced apart from each other in the areas where the opening areas (360) are formed. When the opening areas (360) are filled with a non-conductive material, a non-conductive slot (or non-conductive slit) may be formed. For example, the non-conductive slot may include, but is not limited to, poly carbonate (PC).

[0092] For example, the side frame (218) may include a first side (281-1), a second side (218-2), a third side (218-3), and a fourth side (218-4). The first side (281-1), the second side (218-2), the third side (218-3), and the fourth side (218-4) may form an edge of the electronic device (101). The second side (218-2) may be opposite to the first side (281-1). The fourth side (218-4) may be opposite to the third side (218-3). The length of the third side (218-3) and the length of the fourth side (218-4) may be longer than the length of the first side (281-1) and the length of the second side (218-2). The side frame (218) may have a long bar shape along the y-axis. The first side (281-1) may form a side in the +y direction within the side frame (218). The second side (218-2) may form a side in the -y direction within the side frame (218). The third side (218-3) may form a side in the +x direction within the side frame (218). The first side (281-1) may form a side in the -x direction within the side frame (218).

[0093] For example, the first printed circuit board (251) and the second printed circuit board (252) may provide electrical connections between electronic components of the electronic device (101). The first printed circuit board (251) and the second printed circuit board (252) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. The first printed circuit board (251) and the second printed circuit board (252) may provide electrical connections for the electronic components by using wires and conductive vias formed on the conductive layers. The first printed circuit board (251) and the second printed circuit board (252) may be disposed on one surface of the support member (243) (e.g., the second surface (243b) of FIG. 3b). The side frame (218) can form a side of the electronic device (101) (e.g., the third side (200C) of FIG. 3A).

[0094] For example, the second printed circuit board (252) may be spaced apart from the first printed circuit board (251). The first printed circuit board (251) may be positioned closer to the first side (281-1) among the first side (281-1) and the second side (218-2) on the support member (243). The second printed circuit board (252) may be positioned closer to the second side (218-2) among the first side (281-1) and the second side (218-2) on the support member (243). For example, the first printed circuit board (251) may provide electrical connections for electronic components (e.g., a camera) positioned on an upper side (e.g., in the +y direction) of the electronic device (101). For example, the second printed circuit board (252) may provide electrical connections for electronic components (e.g., speakers) positioned on the lower side (e.g., in the -y direction) of the electronic device (101), but is not limited thereto.

[0095] For example, the connecting member (370) can electrically connect a first printed circuit board (251) and a second printed circuit board (252) that are spaced apart from each other. For example, the connecting member (370) can provide an electrical connection between an electronic component (e.g., a processor (120)) that is electrically connected to the first printed circuit board (251) and an electronic component (e.g., a matching circuit (340)) that is electrically connected to the second printed circuit board (252). For example, the connecting member (370) can include, but is not limited to, a flexible printed circuit board, a coaxial cable, and / or a flexible printed circuit board radio frequency cable (FRC).

[0096] Referring to FIG. 4b, an exemplary electronic device (101) may include a processor (120), an RF transceiver (310), an RFFE (320), an antenna (330), and / or a matching circuit (340).

[0097] For example, the processor (120) may include a processing circuit. The processor (120) may include an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (e.g., a GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless-fidelity (Wi-Fi) chip, and a Bluetooth TMChips, global positioning system (GPS) chips, near field communication (NFC) chips, connectivity chips, sensor controllers, touch controllers, finger-print sensor controllers, display drive integrated circuits (DDIs), audio CODEC chips, universal serial bus (USB) controllers, camera controllers, image processing ICs, microprocessor units (MPUs), system on chip (SoCs), ICs, or similar circuits.

[0098] For example, the processor (120) may generate a baseband signal. The processor (120) may control the RF transceiver (310) to process the generated baseband signal. The processor (120) may control the RF transceiver (310) to transmit a transmission signal through the antenna (330). The processor (120) may control the RF transceiver (310) to transmit the transmission signal in a frequency band that can communicate with an external electronic device.

[0099] For example, the RF transceiver (310) may be implemented as a single chip (e.g., an RFIC chip) or as part of a single package. The RF transceiver (310) may include a digital to analog converter (DAC) for converting a digital signal to an analog signal. The RF transceiver (310) may include a mixer and an oscillator (e.g., a local oscillator (LO)) for up-conversion. The RF transceiver (310) may convert a baseband signal generated by the processor (120) into an RF signal. The RF transceiver (310) may include an analog to digital converter (ADC) for converting an analog signal to a digital signal. The RF transceiver (310) may include a mixer and an oscillator for down-conversion. The RF transceiver (310) can convert an RF signal received from an antenna (330) into a baseband signal so that it can be processed by the processor (120).

[0100] For example, the RFFE (320) may include a plurality of components electrically connected between the RF transceiver (310) and the antenna (330). For example, the RFFE (320) may include, but is not limited to, components such as a coupler, a power amplifier (PA), a low noise amplifier (LNA), a switch circuit (820), and / or a duplexer.

[0101] For example, the RF transceiver (310) may be configured to communicate with an external electronic device using a signal on a designated frequency band. The antenna (330) may be used to transmit and / or receive a signal on a designated frequency band. The antenna (330) may include a feed point to which a feed signal provided from the RF transceiver (310) is provided and a ground point electrically connected to the ground of the electronic device (101). The antenna (330) may include an antenna (330) radiator, which is a physical component for radiating or receiving electromagnetic waves. The antenna (330) radiator is a physical component of the antenna (330) for radiating or receiving electromagnetic waves, and the shape and characteristics (e.g., frequency characteristics of the antenna (330)) of the antenna (330) may be determined by the antenna (330) radiator.

[0102] For example, the matching circuit (340) may be used for impedance tuning of the antenna (330). The matching circuit (340) may be electrically connected to a first transmission path for the antenna (330). The processor (120) may adjust the impedance of the transmission path by controlling the matching circuit (340).

[0103] For example, the matching circuit (340) may be operatively connected to the processor (120). The processor (120) may be configured to control the switch circuit (820) to electrically connect at least one passive element (810) to the transmission path. Depending on a parameter value (e.g., capacitance or inductance) of at least one passive element (810) electrically connected to the transmission path, an S-parameter (e.g., reflection coefficient and / or transmission coefficient) of an RF signal transmitted along the transmission path may be changed. As the S-parameter is changed, the gain of the antenna (330) may be changed.

[0104] For example, an antenna (330) radiator that radiates or receives electromagnetic waves may be implemented as at least some of a plurality of conductive portions (350) formed within a side frame (218). Referring again to FIG. 4A, the electronic device (101) may include a plurality of conductive portions (350) and a plurality of opening areas (360).

[0105] For example, a plurality of conductive portions (350) may be formed on a portion of the side frame (218). The RF transceiver (310) may be configured to communicate with an external electronic device using at least one of the plurality of conductive portions (350). For example, the wireless communication circuit may be configured to power a feed point of at least one of the plurality of conductive portions (350). The at least one conductive portion may be configured to transmit a wireless signal by radiating an electromagnetic wave to the outside of the electronic device (101) as it is powered from the wireless communication circuit.

[0106] For example, the housing (210) may include a plurality of opening areas (360) between the support member (243) and the side frame (218). The support member (243) and the side frame (218) may be partially separated by the plurality of opening areas (360). When a non-conductive material is filled within the plurality of opening areas (360), at least some of the plurality of opening areas (360) may be referred to as non-conductive slots or non-conductive slits for electrically isolating the plurality of conductive portions (350) and the support member (243). For example, the non-conductive slots or non-conductive slits may include, but are not limited to, polycarbonate (PC). For example, the non-conductive slots or non-conductive slits may electrically isolate the plurality of conductive portions (350) by filling a space between the plurality of conductive portions (350). A plurality of non-conductive portions formed between a plurality of conductive portions (350) can limit the length of the conductive portion that operates as an antenna (330) radiator as a dielectric.

[0107] For example, at least some of the plurality of conductive portions (350) used as radiators of the antenna (330) (e.g., the first conductive portion (351) and / or the second conductive portion (352)) may include a ground point electrically connected to the ground of the electronic device (101). The support member (243) may provide the ground of the electronic device (101). The ground point of at least some of the plurality of conductive portions (350) may be electrically connected to the support member (243).

[0108] For example, the plurality of conductive portions (350) may include a first conductive portion (351) and a second conductive portion (352). For example, the first conductive portion (351) may be formed along at least a portion of the first side (281-1). For example, the first conductive portion (351) may be electrically connected to a first printed circuit board (251) disposed close to the first side (281-1). For example, the second conductive portion (352) may be formed along at least a portion of the second side (218-2). For example, the second conductive portion (352) may be electrically connected to a second printed circuit board (252) disposed close to the second side (218-2).

[0109] For example, the first conductive portion (351) may be powered from the RF transceiver (310) to operate as an antenna (330) radiator for a first signal on a first frequency band. The second conductive portion (352) may be powered from the RF transceiver (310) to operate as an antenna (330) radiator for a second signal on a second frequency band. The frequency characteristic (e.g., resonant frequency) of the antenna (330) may be determined based on the electrical length of the antenna (330) radiator. When the wavelength corresponding to the resonant frequency of a signal transmitted and / or received through the antenna (330) is w, the electrical length of the antenna radiator may be 1 / 4w to 1 / 2w. For example, if the electrical length of the first conductive portion (351) is different from the electrical length of the second conductive portion (352), the first frequency band may be different from the second frequency band. Since the plurality of conductive portions (350) may serve as antenna (330) radiators for transmitting and / or receiving signals on different frequency bands, the electronic device (101) may communicate using signals on various frequency bands. The above description has been described with respect to two conductive portions, but is not limited thereto. For example, in addition to the first conductive portion (351) and the second conductive portion (352), a plurality of conductive portions (e.g., a third conductive portion (353)) forming at least a portion of the side frame (218) may act as an antenna (330) radiator. For example, the first printed circuit board (251) may be referred to as a main printed circuit board, and the second printed circuit board (252) may be referred to as a sub printed circuit board. The size of the second printed circuit board (252) may be smaller than the size of the first printed circuit board (251).

[0110] For example, the processor (120) and the RF transceiver (310) may be disposed on a first printed circuit board (251). A power supply signal provided from the RF transceiver (310) to the first conductive portion (351) may be provided to a first power supply point of the first conductive portion (351) electrically connected to the first printed circuit board (251). The electronic device (101) may include a first conductive member (381) (e.g., a c-clip and / or a conductive poron) for electrically connecting the first printed circuit board (251) and the first conductive portion (351).

[0111] For example, the second conductive portion (352) may be electrically connected to the second printed circuit board (252). For example, the electronic device (101) may include a second conductive member (382) for electrically connecting the second printed circuit board (252) and the second conductive portion (352). For example, a power supply signal provided from the RF transceiver (310) to the second conductive portion (352) may be transmitted from the first printed circuit board (251) to the second printed circuit board (252) through the connection member (370) and provided to the second power supply point of the second conductive portion (352) through the second connection member (370).

[0112] For example, the connecting member (370) may be configured to transmit an RF signal between the first printed circuit board (251) and the second printed circuit board (252). For example, the connecting member (370) may include an RF line (610) for transmitting an RF signal between the RF signal and an antenna (330) including at least a portion of the second conductive portion (352). The connecting member (370) may include a ground layer (e.g., the third ground layer (620) of FIG. 6B) for the RF line (610).

[0113] For example, a matching circuit (340) for an antenna (330) including a second conductive portion (352) may be disposed on a second printed circuit board (252). The matching circuit (340) may be operatively connected to a processor (120). For example, the processor (120) may provide a control signal to the matching circuit (340) for controlling the matching circuit (340), and the matching circuit (340) may be configured to operate based on receiving the control signal. For example, the matching circuit (340) may be electrically connected to a first printed circuit board (251) to receive power for the operation of the matching circuit (340). For example, the matching circuit (340) may operate based on a power signal provided from a battery (e.g., battery (189) of FIG. 3). The control signal and the power signal may be baseband signals.

[0114] As described above, in order to provide a control signal and / or a power signal to the matching circuit (340) disposed on the second printed circuit board (252), a separate connection structure may be required between the first printed circuit board (251) and the second printed circuit board (252). For example, an additional connection member may be required to connect the first printed circuit board (251) and the second printed circuit board (252). If the additional connection member is disposed within the housing (210), the additional connection member may occupy space within the housing (210), resulting in insufficient space for arranging other electronic components. For example, if the internal space of the housing (210) is limited due to the structure of the housing (210), it may be difficult to arrange the additional connection member. For example, when the electronic device (101) includes a housing having a deformable foldable structure (e.g., a foldable housing (900) of FIG. 9) and / or a housing having a slideable structure (e.g., a slideable housing (1000) of FIG. 10), the internal space of the housing (210) may be narrow due to components for the deformable structure of the housing (210). When the electronic device (101) including the housing (210) having the deformable structure includes an additional connecting member, there may be insufficient space for arranging electronic components for providing various functions of the electronic device (101).

[0115] An exemplary electronic device (101) can transmit a baseband signal provided to a matching circuit (340) using a connecting member (370) including an RF line (610) and a ground layer, without including additional connecting members.

[0116] Figure 5 illustrates multiple layers of a first printed circuit board and a second printed circuit board.

[0117] For example, the first printed circuit board (251) and the second printed circuit board (252) may include a plurality of layers. The first printed circuit board (251) and the second printed circuit board (252) may include a plurality of conductive layers (e.g., copper foil) and a plurality of non-conductive layers that are alternately laminated. For example, the first printed circuit board (251) may include a plurality of first conductive layers (511) and a plurality of first non-conductive layers (512). For example, the second printed circuit board (252) may include a plurality of second conductive layers (521) and a plurality of second non-conductive layers (522).

[0118] For example, the plurality of first conductive layers (511) and the plurality of second conductive layers (521) can be used as transmission lines to provide electrical connections between electronic components. An electrical signal transmitted between the first printed circuit board (251) and the electronic components that are electrically connected can be transmitted through at least one of the plurality of first conductive layers (511). An electrical signal transmitted between the second printed circuit board (252) and the electronic components that are electrically connected can be transmitted through at least one of the plurality of second conductive layers (521).

[0119] For example, some of the plurality of first conductive layers (511) and at least one of the plurality of second conductive layers (521) may be ground layers. Among the plurality of layers of the first printed circuit board (251), the conductive layer disposed at the outermost may be the first ground layer (511a) that is electrically connected to the ground of the electronic device (101). Among the plurality of layers of the second printed circuit board (252), the conductive layer disposed at the outermost may be the second ground layer (521a) that is electrically connected to the ground of the electronic device (101).

[0120] For example, the first printed circuit board (251) and the second printed circuit board (252) may include a fill cut region (e.g., the first fill cut region (530) and / or the second fill cut region (540)), which is a region where a ground layer (e.g., the first ground layer (511a) and / or the second ground layer (521a)) is removed. Within the fill cut region, the ground layer may be omitted. The fill cut region may improve electrical characteristics of the printed circuit board, thereby enhancing stability, reducing high-frequency noise, and improving heat dissipation of the printed circuit board. For example, the fill cut region may be formed around a high-frequency circuit or around a circuit with a large amount of heat dissipation.

[0121] For example, a first printed circuit board (251) may include a first fill cut area (530). A first ground layer (511a) may be removed within the first fill cut area (530). A second printed circuit board (252) may include a second fill cut area (540). A second ground layer (521a) may be removed within the second fill cut area (540).

[0122] For example, a connecting member (e.g., a connecting member (370) of FIG. 6a) may be connected to a first fill cut area (530) and a second fill cut area (540). For example, one end of the connecting member (370) may be connected to the first fill cut area (530), and the other end of the connecting member (370) may be connected to the second fill cut area (540). For example, by connecting the connecting member (370) to the first fill cut area (530) and the second fill cut area (540) where the ground layer is omitted, a third ground layer (e.g., a third ground layer (620) of FIG. 6a) of the connecting member (370) may be electrically isolated from the first ground layer (511a) and the second ground layer (521a). For example, the third ground layer (e.g., the third ground layer (620) of FIG. 6a), which is the ground layer of the connecting member (370), can be used as a transmission line for a baseband signal by being electrically isolated from the first ground layer (511a) and the second ground layer (521a).

[0123] Fig. 6a is a cross-sectional view of an exemplary connecting member taken along line A-A' of Fig. 4a. Fig. 6b is a cross-sectional view of an exemplary connecting member taken along line B-B' of Fig. 4a.

[0124] Referring to FIG. 6a, the connecting member (370) may include an RF line (610) and a third ground layer (620).

[0125] For example, the connecting member (370) may be connected to a first printed circuit board (251) and a second printed circuit board (252). One end of the connecting member (370) may be connected to the first printed circuit board (251), and the other end of the connecting member (370) may be connected to the second printed circuit board (252).

[0126] For example, the first printed circuit board (251) may include a first ground layer (e.g., the first ground layer (511a) of FIG. 5) and a first fill cut area (530). Within the first fill cut area (530), the first ground layer (511a) may be removed. For example, the second printed circuit board (252) may include a second ground layer (e.g., the second ground layer (521a) of FIG. 5) and a second fill cut area (540). Within the second fill cut area (540), the second ground layer (521a) may be removed.

[0127] For example, since the connecting member (370) is connected to the first printed circuit board (251) within the first fill cut area (530) and to the second printed circuit board (252) within the second fill cut area (540), the third ground layer (620) of the connecting member (370) can be electrically isolated from the first ground layer (511a) and the second ground layer (521a). However, the present invention is not limited thereto. As described below, the third ground layer (620) can be electrically isolated from the first ground layer (511a) and the second ground layer (521a) in terms of a baseband signal, and can also be electrically connected to the first ground layer (511a) and the second ground layer (521a) in terms of an RF signal.

[0128] For example, the RF line (610) may be a transmission path of an RF signal transmitted between the first printed circuit board (251) and the second printed circuit board (252). For example, the RF line (610) of the connecting member (370) may be electrically connected to the RF line (631) of the first printed circuit board (251) and the RF line (632) of the second printed circuit board (252). For example, an RF signal (e.g., a transmission signal) provided from an RF transceiver (e.g., the RF transceiver (310) of FIG. 4A) may be provided to the RF line (610) of the connecting member (370) through the RF line (631) of the first printed circuit board (251). The RF signal may be provided to the RF line (632) of the second printed circuit board (252) through the RF line (610) of the connecting member (370) and then provided to the second conductive portion (352). For example, an RF signal (e.g., a received signal) provided from an external electronic device to the second conductive portion (352) may be provided to the RF line (610) of the connecting member (370) through the RF line (632) of the second printed circuit board (252). The RF signal may be provided to the RF line (631) of the first printed circuit board (251) through the RF line (610) of the connecting member (370) and then provided to the RF transceiver (310).

[0129] For example, the third ground layer (620) can be used as a transmission line for a signal because it is electrically isolated from the first ground layer (511a) and the second ground layer (521a). For example, the third ground layer (620) can be used as a transmission line for a baseband signal between the first printed circuit board (251) and the second printed circuit board (252).

[0130] For example, among the plurality of conductive layers of the first printed circuit board (251), a first line (641) for transmitting a baseband signal may be electrically connected to a third ground layer (620). For example, among the plurality of conductive layers of the second printed circuit board (252), a second line (642) for transmitting a baseband signal may be electrically connected to a third ground layer (620).

[0131] For example, the first line (641) may be electrically connected to a processor (e.g., processor (120) of FIG. 4B) and / or a battery (e.g., battery (189) of FIG. 4B) that is electrically connected to the first printed circuit board (251). For example, the second line (642) may be electrically connected to a matching circuit (e.g., matching circuit (340) of FIG. 4B) that is electrically connected to the second printed circuit board (252). For example, the third ground layer (620) of the connecting member (370) may be used as a transmission line for a baseband signal transmitted to the matching circuit (340).

[0132] For example, the processor (120) may be configured to provide a control signal to the matching circuit (340) for controlling the matching circuit (340). The matching circuit (340) may operate based on receiving the control signal. The control signal transmitted from the processor (120) to the matching circuit (340) may be transmitted to the third ground layer (620) of the connecting member (370) through the first line (641) of the first printed circuit board (251). The control signal may be transmitted to the second line (642) of the second printed circuit board (252) through the third ground layer (620). The control signal may be transmitted to the matching circuit (340) electrically connected to the second line (642). The matching circuit (340) may be configured to operate based on receiving the control signal provided through the path.

[0133] For example, the battery (189) may be configured to provide a power signal to the matching circuit (340) for the operation of the matching circuit (340). For example, the battery (189) may be controlled by a power management module (e.g., the power management module (188) of FIG. 1), such as a power management integrated circuit (PMIC), to provide the power signal to the matching circuit (340) through the first printed circuit board (251). The processor (120) may be configured to control the PMIC so that the power signal is provided to the matching circuit (340). For example, the power signal may be transmitted from the battery (189) to the third ground layer (620) of the connecting member (370) through the first line (641) of the first printed circuit board (251). The above power signal may be transmitted to the second line (642) of the second printed circuit board (252) through the third ground layer (620). The power signal may be transmitted to a matching circuit (340) electrically connected to the second line (642). The matching circuit (340) may be configured to operate based on receiving the power signal provided through the path.

[0134] For example, the connecting member (370) can provide a transmission line for a baseband signal for the matching circuit (340) between the first printed circuit board (251) and the second printed circuit board (252). As described above, the third ground layer (620) of the connecting member (370) can operate as a transmission line for the baseband signal by being electrically isolated from the first ground layer (511a) and the second ground layer (521a). If the third ground layer (620) is electrically connected to the first ground layer (511a) and / or the second ground layer (521a) for the baseband signal, the third ground layer (620) cannot operate as a transmission line for the electrical signal. Since the connecting member (370) is electrically connected to the first printed circuit board (251) within the first fill cut area (530) and the connecting member (370) is electrically connected to the second printed circuit board (252) within the second fill cut area (540), the third ground layer (620) can operate as a transmission line for a baseband signal. Since the connecting member (370) including the RF line (610) can be used as a transmission line for a baseband signal, the electronic device (101) may not require an additional connecting member. Since an additional connecting member disposed in the internal space of a limited housing (e.g., the housing (210) of FIG. 4A) can be omitted, the electronic device (101) can secure a placement space for various electronic components.

[0135] For example, if an RF signal transmitted along an RF line (610) and a baseband signal transmitted along a third ground layer (620) interfere with each other, the quality of the signal may deteriorate and signal distortion may occur. However, since the difference between the frequency band of the RF signal (e.g., about 300 MHz or more) and the frequency band of the baseband (e.g., about 10 MHz or less) is large, the interference between the RF signal and the baseband signal may not occur to the extent that it affects the quality of the signal or causes signal distortion.

[0136] The exemplary electronic device (101) may further include an RF choke (650) to reduce interference between an RF signal and a baseband signal. For example, the RF choke (650) may reduce interference between the RF signal transmitted along the RF line (610) and the baseband signal transmitted along the first line (641) and the second line (642). For example, the RF choke (650) may be configured to pass low frequency signals and block high frequency signals. For example, the RF choke (650) may include, but is not limited to, an insulated wire coil wound around a magnetic core. For example, the RF choke (650) may include a first RF choke (650) electrically connected to the first line (641) and / or a second RF choke (650) electrically connected to the second line (642). For example, the RF choke (650) may be configured to block RF signals from being coupled or excited to the first line (641) and / or the second line (642) by being electrically connected to the first line (641) and / or the second line (642). For example, the RF choke (650) may reduce the interference, thereby improving signal quality and reducing signal distortion.

[0137] Referring to FIG. 6B, the connecting member (370) may include a core portion (661), an insulating portion (662), and a conductive portion (663). The core portion (661) may be formed at the center of the connecting member (370). The insulating portion (662) may surround the core portion (661). The conductive portion (663) may surround the insulating portion (662). By the insulating portion (662), the core portion (661) and the conductive portion (663) may be electrically isolated.

[0138] For example, the aforementioned RF line (610) may be formed within the core portion (661). For example, the core portion (661) may be an RF line (610) for an RF signal. For example, the aforementioned third ground layer (620) may be formed within the conductive portion (663). For example, the conductive portion (663) may be the third ground layer (620).

[0139] Fig. 7a is a cross-sectional view of an exemplary connecting member taken along line A-A' of Fig. 3a. Fig. 7b is a graph showing the transmission coefficient of an RF signal depending on the inclusion or absence of an exemplary passive component.

[0140] Referring to FIG. 7A, an electronic device (e.g., electronic device (101) of FIG. 4A) may include a first passive element (710) and a second passive element (720). The first passive element (710) and the second passive element (720) may electrically connect a third ground layer (620) to a first ground layer (e.g., the first ground layer (511a) of FIG. 5) and a second ground layer (e.g., the second ground layer (521a) of FIG. 5) in a frequency band of an RF signal (e.g., about 300 MHz or higher).

[0141] For example, the first passive element (710) may be configured to electrically connect the first ground layer (511a) and the third ground layer (620) from the perspective of an RF signal. For example, for a baseband signal, the first ground layer (511a) may be electrically isolated from the third ground layer (620), but for an RF signal, the first ground layer (511a) may be electrically connected to the third ground layer (620).

[0142] For example, the second passive element (720) may be configured to electrically connect the second ground layer (521a) and the third ground layer (620) from the perspective of an RF signal. For example, for a baseband signal, the second ground layer (521a) may be electrically isolated from the third ground layer (620), but for an RF signal, the second ground layer (521a) may be electrically connected to the third ground layer (620).

[0143] For example, the third ground layer (620) of the connecting member (370) may be electrically connected to the first ground layer (511a) and the second ground layer (521a) via the first passive element (710) and the second passive element (720) to act as a ground for the RF line (610). For example, when the third ground layer (620) is electrically separated from the first ground layer (511a) and the second ground layer (521a) for an RF signal, distortion due to noise interfering with the RF signal flowing along the RF line (610) may increase, and the stability of the RF signal may be weakened. For example, by electrically connecting the third ground layer (620) to the first ground layer (511a) and the second ground layer (521a) for an RF signal, distortion of the RF signal can be reduced and stability of the RF signal can be secured.

[0144] For example, the first passive element (710) and the second passive element (720) may include a capacitor, an inductor, and / or a filter circuit. For example, the filter circuit may be, but is not limited to, a high pass filter that passes signals having a frequency higher than a specified frequency and reduces signals having a frequency lower than the specified frequency.

[0145] For example, the first passive element (710) and the second passive element (720) may be positioned close to the RF line (610). For example, the first passive element (710) and the second passive element (720) may be positioned on both sides of the RF line (610). For example, the first passive element (710) may be positioned on both sides of the RF line (631) of the first printed circuit board (251). For example, the second passive element (720) may be positioned on both sides of the RF line (632) of the second printed circuit board (252). Since the first passive element (710) and the second passive element (720) are positioned on both sides of the RF line (610), the third ground layer (620) of the third connecting member (370) can be electrically connected to the first ground layer (511a) and the second ground layer (521a) for the entire area of ​​the RF line (610).

[0146] Referring to FIG. 7b, the transmission coefficient of the RF signal may be different based on the presence and location of the first passive element (710) and the second passive element (720). The transmission coefficient may be referred to as a parameter indicating the degree to which power provided to a load (e.g., the antenna (330) of FIG. 4b) through the RF line (610) passes through the RF line (610). As the transmission coefficient increases, the proportion of power passing through the RF line (610) increases, and thus the radiation performance of the antenna (330) may be improved.

[0147] The first graph (701) of FIG. 7b shows the transmission coefficient of a structure in which the connecting member (370) is connected to the first printed circuit board (251) and the second printed circuit board (252) within an area other than the fill cut area. The second graph (702) of FIG. 7b shows the transmission coefficient of a structure in which the connecting member (370) is connected to the first printed circuit board (251) and the second printed circuit board (252) within the fill cut area, and the first passive element (710) and the second passive element (720) are positioned on both sides of the RF line (610). The third graph (703) of FIG. 7b shows the transmission coefficient of a structure in which the connecting member (370) is connected to the first printed circuit board (251) and the second printed circuit board (252) within the fill cut area, and the first passive element (710) and the second passive element (720) are not located on either side of the RF line (610) but are relatively far apart from the RF line (610).

[0148] Comparing the first graph (701), the second graph (702), and the third graph (703), the first graph (701) may exhibit the highest transmittance. For example, when the connecting member (370) is not connected to the first printed circuit board (251) and the second printed circuit board (252) within the fill cut area, the third ground layer (620) may be electrically connected to the first ground layer (511a) and the second ground layer (521a). Since the third ground layer (620) is grounded by being directly connected to the first ground layer (511a) and the second ground layer (521a), the first graph (701) may exhibit the highest transmittance. In this case, the loss of the RF signal may be the smallest, but the third ground layer (620) of the connecting member (370) may not be able to function as a transmission line for the baseband signal.

[0149] The second graph (702) may exhibit a higher transmission coefficient than the third graph (703). For example, if the first passive element (710) and the second passive element (720) are not positioned on both sides of the RF line (610) but are spaced apart from the RF line (610), loss may be caused when the RF signal passes through the RF line (610), thereby lowering the transmission coefficient. Referring to FIG. 7B, if the connecting member (370) is electrically connected to the first printed circuit board (251) and the second printed circuit board (252) within the fill cut area (e.g., the first fill cut area (530) and the second fill cut area (540)), the loss of the RF signal can be reduced by positioning the first passive element (710) and the second passive element (720) on both sides of the RF line (610).

[0150] Fig. 8a is a simplified block diagram of an exemplary electronic device. Fig. 8b is a graph showing the radiation characteristics of an antenna due to the operation of a matching circuit.

[0151] Referring to FIG. 8A, the matching circuit (340) may include at least one passive element (810) and a switch circuit (820). For example, the at least one passive element (810) may include a plurality of capacitors, each having a designated capacitance value, and / or a plurality of inductors, each having a designated inductance value.

[0152] For example, the processor (120) can adjust the impedance of the transmission path between the RF transceiver (310) and the antenna (330) by controlling the matching circuit (340). For example, the matching circuit (340) can include at least one passive element (810) and a switch circuit (820). For example, the at least one passive element (810) can include four capacitors having different capacitance values. For example, the switch circuit (820) can be a single pole four throw (SP4T) switch that can electrically connect any one of the four capacitors to the transmission path. However, the present invention is not limited thereto. For example, the switch circuit (820) can include a single pole single throw (SPST) switch, a single pole double throw (SPDT), or a single pole triple throw (SP3T). For example, the matching circuit (340) can include one or more switch circuits. For example, at least one passive component (810) may include a variable capacitor having a changeable capacitance value and / or a variable inductor having a changeable inductance value.

[0153] For example, the switch circuit (820) may be electrically connected to the RF line (632) of the second printed circuit board (252). The switch circuit (820) may be configured to electrically connect the RF line (632) of the second printed circuit board (252) and the at least one passive element (810) by being electrically connected to at least one passive element (810). The impedance of the RF line (632) of the second printed circuit board (252) may be adjusted based on a parameter value (e.g., capacitance or inductance) of the at least one passive element (810) electrically connected to the at least one switch circuit (820). The matching circuit (340) may reduce power loss and improve the quality of the RF signal through impedance matching.

[0154] For example, a matching circuit (340) electrically connected to an RF line (632) of a second printed circuit board (252) may be configured to adjust a frequency characteristic (e.g., a resonant frequency) of an antenna (330) by adjusting an impedance of the RF line (632) of the second printed circuit board (252). The matching circuit (340) may shift a resonant peak with respect to a center frequency of the antenna (330) by adjusting the impedance of the RF line (632) of the second printed circuit board (252). The resonant peak with respect to the center frequency of the antenna (330) may be changed based on a parameter value of at least one passive element (810) connected to a switch circuit (820). As the resonant peak with respect to the center frequency of the antenna (330) is changed, a bandwidth of the antenna (330) may be expanded.

[0155] Referring to Fig. 8b, the expansion of the bandwidth by the operation of the matching circuit (340) can be confirmed. The x-axis of the graph (800) of Fig. 8b is the frequency (unit: GHz), and the y-axis of the graph (800) is the gain (unit: dB). For example, the first graph (801) of Fig. 8b shows the radiation characteristics of the antenna (330) when the matching circuit (340) is not included. The second graph (802) of Fig. 8b shows the radiation characteristics of the antenna (330) when a passive element having the first parameter value of the matching circuit (340) is electrically connected to the RF line (632) of the second printed circuit board (252). The third graph (803) of FIG. 8b shows the radiation characteristics of the antenna (330) when a passive element having a second parameter value of the matching circuit (340) is electrically connected to an RF line (632) of a second printed circuit board (252). The fourth graph (804) of FIG. 8b shows the radiation characteristics of the antenna (330) when a passive element having a third parameter value of the matching circuit (340) is electrically connected to an RF line (632) of a second printed circuit board (252).

[0156] Referring to the graph (800) of FIG. 8B, the bandwidth of the antenna (330) can be expanded by the matching circuit (340). For example, when the frequency range for a gain of -3 dB or more is referred to as the bandwidth, when the matching circuit (340) is not included, the bandwidth (A) of the antenna (330) can be a frequency range between about 2.6 GHz and about 3.2 GHz. For example, when the matching circuit (340) is included, the bandwidth (B) of the antenna (330) can be a frequency range between about 2.5 GHz and about 3.5 GHz. When the matching circuit (340) is included, the bandwidth of the antenna (330) can be expanded.

[0157] For example, since the second printed circuit board (252) has a relatively small size, it may be difficult to place the processor (120) for controlling the matching circuit (340). For example, the processor (120) may be placed on a first printed circuit board (251) spaced apart from the second printed circuit board (252). Since the processor (120) is placed on the first printed circuit board (251), an additional connecting member connecting the first printed circuit board (251) and the second printed circuit board (252) may be required for a control signal and / or a power signal provided to the matching circuit (340). As described above, since it is difficult to place an additional connecting member in the limited internal space of the housing (210), the mounting space can be secured by transmitting the baseband signal using a connecting member (370) including an RF line (610). For example, by using the third ground layer (620) of the connecting member (370) as a baseband transmission line for the matching circuit (340), the electronic device (101) can expand the bandwidth by using the matching circuit (340).

[0158] The electronic device (101) described above has been described as including a housing (210) of a simple bar structure, but is not limited thereto. For example, the electronic device (101) may include a housing (210) of a deformable structure. For example, the electronic device (101) may include a foldable housing (e.g., the foldable housing (900) of FIG. 9) and / or a sliderable housing (e.g., the sliderable housing (1000) of FIG. 10). When the electronic device (101) includes a housing (210) having a deformable structure, the electronic device (101) may include a structure and components for deforming the housing (210). Because the space inside the housing (210) is narrow due to the structure and the components, there may be insufficient space for additional connecting members. The exemplary electronic device (101) may implement a transmission line of a baseband signal transmitted between a first printed circuit board (251) and a second printed circuit board (252) that are spaced apart from each other without an additional connecting member by using a connecting member (370) including an RF line (610).

[0159] Hereinafter, an electronic device (101) including a housing (210) having a deformable structure is described. The electronic device (101) described below may be substantially the same as the electronic device (101) described above, except for the structure of the deformable housing (210) and the components for the structure. Any overlapping description may be omitted or briefly described.

[0160] FIG. 9 illustrates an electronic device including a foldable housing.

[0161] FIG. 9 illustrates an electronic device including a foldable housing.

[0162] An exemplary electronic device (101) may include a foldable housing (900), a flexible display (940) (e.g., the display module (160) of FIG. 1), and a hinge structure (930).

[0163] For example, the foldable housing (900) may include a first housing part (910), a second housing part (920), and a hinge structure (930).

[0164] For example, the first housing part (910) and the second housing part (920) may be rotatably coupled. For example, the second housing part (920) may be rotatably coupled to the first housing part (910) via a hinge structure (930) with respect to the first housing part (910).

[0165] For example, the hinge structure (930) can rotatably connect the first housing part (910) and the second housing part (920). The hinge structure (930) can be positioned between the first housing part (910) and the second housing part (920) of the electronic device (101) so that the electronic device (101) can be folded. The hinge structure (930) can enable the electronic device (101) to change from an unfolding state to a folding state. The hinge structure (930) can enable the electronic device (101) to change from a folded state to an unfolding state. The hinge structure (930) can maintain the electronic device (101) in an intermediate state between the unfolding state and the folded state.

[0166] For example, the flexible display (940) may be configured to display visual information. For example, the flexible display (940) may include a first display area (941) disposed on a first housing part (910), a second display area (942) disposed on a second housing part, and a third display area (943) disposed between the first display area (941) and the second display area (942). The first display area (941), the second display area (942), and the third display area (943) may at least partially form the front surface of the foldable housing (900). The electronic device (101) may further include a sub-display (950) that is distinct from the flexible display (940). The sub-display (950) may be referred to as a cover display.

[0167] For example, the unfolded state may be referred to as a state in which the first direction toward which the first display area (941) faces and the second direction toward which the second display area (942) faces are the same. For example, the folded state may be referred to as a state in which the first direction is opposite to the second direction. When the electronic device (101) is in the folded state, the first housing part (910) and the second housing part (920) may be covered or overlapped.

[0168] For example, when the electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the electronic device (101) is in an intermediate state, the first direction may have an inclination (e.g., an angle between 0 and 180 degrees) with respect to the second direction.

[0169] For example, the electronic device (101) may be rotatable about a folding axis. The folding axis may be referred to as an imaginary line extending along a direction parallel to the length direction of the electronic device (101) (e.g., the y-axis) or a direction parallel to the width direction of the electronic device (101) (e.g., the x-axis).

[0170] For example, since the first housing part (910) and the second housing part (920) are coupled to each other to form the foldable housing (900), the sizes of each of the first housing part (910) and the second housing part (920) may be relatively small. For example, the hinge structure (930) that rotatably connects the first housing part (910) and the second housing part (920) may include a plurality of components (e.g., hinge gears, hinge plates) for rotational motion. Since the plurality of components of the hinge structure (930) are arranged within the foldable housing (900), it may be difficult to arrange additional connecting members within the internal space of the foldable housing (900).

[0171] For example, the electronic device (101) may include a first printed circuit board (e.g., the first printed circuit board (251) of FIG. 4A) disposed inside a first housing part (910) and a second printed circuit board (e.g., the second printed circuit board (252) of FIG. 4A) disposed inside a second housing part (920). The electronic device (101) may include a connecting member (e.g., the connecting member (370) of FIG. 4A) for electrically connecting the first printed circuit board (251) and the second printed circuit board (252), which are spaced apart from each other. The connecting member (370) may include an RF line (e.g., the RF line (610) of FIG. 6A) and a third ground layer (e.g., the third ground layer (620) of FIG. 6B). As described above, the third ground layer (620) included within the connecting member (370) can be used as a transmission line for baseband signals, and thus, additional connecting members can be omitted. Since the additional connecting members can be omitted, the exemplary electronic device can secure a narrow internal space of the foldable housing (200) to implement a foldable structure.

[0172] Figure 10 illustrates an electronic device including a sliderable housing.

[0173] Referring to FIG. 10, an exemplary electronic device (101) may include a sliderable housing (1000) and a flexible display (1030).

[0174] For example, the slidable housing (1000) may include a first housing part (1010) and a second housing part (1020). The second housing part (1020) may be slidably connected to the first housing part (1010). State (1001) of FIG. 10 illustrates a front view of the electronic device (101) in a first state in which the second housing part (1020) is maximally inserted into the interior of the first housing part (1010). State (1002) of FIG. 10 illustrates a front view of the electronic device (101) in a second state in which the second housing part (1020) is maximally extended out of the exterior of the first housing part (1010). Although not illustrated, the electronic device (101) may also be in a plurality of intermediate states between the first state and the second state. At least a portion of the flexible display (1030) may be exposed to the outside of the slideable housing (1000).

[0175] For example, the size of the flexible display (1030) exposed to the outside of the sliderable housing (1000) may vary based on the state of the electronic device (101). For example, in a first state, the size of the flexible display (1030) exposed to the outside of the sliderable housing (1000) may be minimum. For example, in a second state, the size of the flexible display (1030) exposed to the outside of the sliderable housing (1000) may be maximum. For example, in a plurality of intermediate states, the size of the flexible display (1030) positioned to the outside of the sliderable housing (1000) may be larger than in the first state and smaller than in the second state. The user may adjust the size of the flexible display (1030) exposed to the outside of the sliderable housing (1000) by controlling the state of the electronic device (101).

[0176] For example, the electronic device (101) may include a driving unit for driving the second housing part (1020). For example, the driving unit may include a motor, a rack gear, and a pinion gear.

[0177] For example, since the first housing part (1010) and the second housing part (1020) are coupled to each other to form a slidable housing (1000), the sizes of each of the first housing part (1010) and the second housing part (1020) may be relatively small. For example, a driving unit that slidably connects the first housing part (1010) and the second housing part (1020) may include a plurality of components (e.g., a motor, a pinion gear, a rack gear) for rotational motion. Since the plurality of components of the driving unit are arranged within the slidable housing (1000), it may be difficult to arrange additional connecting members in the internal space of the slidable housing (1000).

[0178] For example, the electronic device (101) may include a first printed circuit board (e.g., the first printed circuit board (251) of FIG. 4A) and a second printed circuit board (e.g., the second printed circuit board (252) of FIG. 4A) that are spaced apart from each other. For example, the electronic device (101) may include a connecting member (e.g., the connecting member (370) of FIG. 4A) for electrically connecting the first printed circuit board (251) and the second printed circuit board (252) that are spaced apart from each other. The connecting member may include an RF line (e.g., the RF line (610) of FIG. 6B) and a third ground layer (e.g., the third ground layer (620) of FIG. 6B). As described above, since the third ground layer (620) included in the connecting member can be used as a transmission line for a baseband signal, the additional connecting member may be omitted. Since additional connecting elements can be omitted, the exemplary electronic device can secure the internal space of the narrow sliderable housing (1000) to implement the sliderable structure.

[0179] An electronic device (101) is provided. The electronic device (101) may include a processor (120). The electronic device (101) may include a radio frequency (RF) transceiver (310). The electronic device (101) may include a first printed circuit board (251) on which the processor (120) and the RF transceiver (310) are disposed. The electronic device (101) may include a second printed circuit board (252) spaced apart from the first printed circuit board (251). The electronic device (101) may include an antenna (330) electrically connected to the second printed circuit board (252). The electronic device (101) may include a matching circuit (340) disposed on the second printed circuit board (252) and electrically connected to the antenna (330). The electronic device (101) may include a third ground layer (620) electrically separated from the first ground layer (511a) of the first printed circuit board (251) and the second ground layer (521a) of the second printed circuit board (252), and a connecting member (370) including an RF line (610) for transmitting an RF signal between the RF transceiver (310) and the antenna (330). The third ground layer (620) may be configured to transmit a baseband signal provided from the processor (120) from the first printed circuit board (251) to the second printed circuit board (252).

[0180] For example, the first printed circuit board (251) may include a first fill cut area (530) in which the first ground layer (511a) is cut (or removed). The second printed circuit board (252) may include a second fill cut area (540) in which the second ground layer (521a) is cut (or removed). The first fill cut area (530) and the second fill cut area (540) may not include a ground layer. The third ground layer (620) may be electrically connected to the first printed circuit board (251) within the first fill cut area (530) and electrically connected to the second printed circuit board (252) within the second fill cut area (540).

[0181] For example, the third ground layer (620) may be electrically connected to the first line (641) of the first printed circuit board (251) that is electrically connected to the processor (120) and the second line (642) of the second printed circuit board (252) that is electrically connected to the matching circuit (340).

[0182] For example, the electronic device (101) may further include an RF choke (650) electrically connected to at least one of the first line (641) or the second line (642) to reduce interference between the baseband signal transmitted along the first line (641) or the second line (642) and the RF signal transmitted along the RF line (610).

[0183] For example, the electronic device (101) may further include a first passive element (710) for electrically connecting the first ground and the third ground in the frequency band of the RF signal. The electronic device (101) may further include a second passive element (720) for electrically connecting the second ground and the third ground in the frequency band of the RF signal.

[0184] For example, the first passive element (710) and the second passive element (720) may include at least one of a capacitor, an inductor, or a filter circuit.

[0185] For example, the connecting member (370) may include a core portion (661), an insulating portion (662) surrounding the core portion (661), and a conductive portion (663) surrounding the insulating portion (662). The RF line (610) may be formed within the core portion (661). The third ground layer (620) may be formed within the conductive portion.

[0186] For example, the baseband signal may include a power signal provided to the matching circuit (340) and a control signal for controlling the matching circuit (340).

[0187] For example, the size of the second printed circuit board (252) may be smaller than the size of the first printed circuit board (251).

[0188] For example, the matching circuit (340) may include at least one passive element (810) including an inductor or a capacitor. The matching circuit (340) may include a switch circuit (820) configured to electrically connect the at least one passive element (810) to a line for the antenna (330).

[0189] For example, the electronic device (101) may further include a housing (210) forming an exterior of the electronic device (101). The antenna (330) may use a conductive portion formed on a portion of an edge of the housing (210) as an antenna (330) radiator for radiating or receiving the RF signal.

[0190] For example, the conductive portion may be positioned closer to the second printed circuit board (252) among the first printed circuit board (251) and the second printed circuit board (252).

[0191] For example, the housing (210) may include a first side (281-1), a second side (218-2) opposite the first side (281-1), a third side (218-3) connected to one end of the first side (281-1) and one end of the second side (218-2), and a fourth side (218-4) opposite the third side (218-3). The length of the third side (218-3) may be longer than the length of the first side (281-1). The first printed circuit board (251) may be arranged closer to the first side (281-1) among the first side (281-1) and the second side (218-2). The second printed circuit board (252) may be positioned closer to the second side (218-2) among the first side (281-1) and the second side (218-2).

[0192] For example, the housing (210) may include a first housing part (910) and a second housing part (920) that is rotatably coupled to the first housing part (910) about a folding axis. The first printed circuit board (251) may be disposed within the first housing part (910). The second printed circuit board (252) may be disposed within the second housing part (920).

[0193] For example, the electronic device (101) may further include a hinge structure that rotatably connects the first housing part (910) and the second housing part (920). The connecting member (370) may extend from the first printed circuit board (251) within the first housing part (910) across the hinge structure to the second printed circuit board (252) within the second housing part (920).

[0194] An electronic device (101) is provided. The electronic device (101) may include a first printed circuit board (251). The electronic device (101) may include a second printed circuit board (252) spaced apart from the first printed circuit board (251). The electronic device (101) may include a first line (610) and a second line (e.g., a ground layer) electrically separated from the first line (610), and may include a connecting member (370) connected to the first printed circuit board (251) and the second printed circuit board (252). The connecting member (370) may transmit a first signal on a first frequency band between the first printed circuit board (251) and the second printed circuit board (252) through the first line (610). The connecting member (370) can transmit a second signal on a second frequency band between the first printed circuit board (251) and the second printed circuit board (252) through the second line. The second line can be a third ground layer (620) of the connecting member (370) that is electrically separated from the first ground layer (511a) of the first printed circuit board (251) and the second ground layer (521a) of the second printed circuit board (252).

[0195] For example, the first signal may be a baseband signal. The second signal may be a radio frequency (RF) signal.

[0196] For example, the electronic device (101) may include a processor (120). The electronic device (101) may include a radio frequency (RF) transceiver (310). The electronic device (101) may include an antenna (330) electrically connected to the second printed circuit board (252). The electronic device (101) may include a matching circuit (340) disposed on the second printed circuit board (252) and electrically connected to the antenna (330). The first signal may include a power signal and a control signal provided from the processor (120) to the matching circuit (340). The second signal may include an RF signal transmitted between the RF transceiver (310) and the antenna (330).

[0197] For example, the first printed circuit board (251) may include a first fill cut area (530) in which the first ground layer (511a) is cut. The second printed circuit board (252) may include a second fill cut area (540) in which the second ground layer (521a) is cut. The third ground layer (620) may be electrically connected to the first printed circuit board (251) within the first fill cut area (530) and electrically connected to the second printed circuit board (252) within the second fill cut area (540).

[0198] For example, the electronic device (101) may further include a first passive element (710) for electrically connecting the first ground and the third ground in the frequency band of the RF signal. The electronic device (101) may further include a second passive element (720) for electrically connecting the second ground and the third ground in the frequency band of the RF signal.

[0199] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0200] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0201] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0202] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0203] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0204] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, processor; RF (radio frequency) transceiver; A first printed circuit board on which the processor and the RF transceiver are arranged; A second printed circuit board spaced apart from the first printed circuit board; An antenna electrically connected to the second printed circuit board; A matching circuit disposed on the second printed circuit board and electrically connected to the antenna; and A third ground layer electrically separated from the first ground layer of the first printed circuit board and the second ground layer of the second printed circuit board, and a connecting member including an RF line for transmitting an RF signal between the RF transceiver and the antenna, The above third ground layer is, configured to transmit a baseband signal provided from the processor from the first printed circuit board to the second printed circuit board, Electronic devices.

2. In paragraph 1, The above first printed circuit board, The first ground layer includes a first fill cut area cut, The above second printed circuit board, The second ground layer includes a second fill cut area cut, The above third ground layer is, Within the first fill cut area of ​​the first printed circuit board, electrically connected to the first printed circuit board, and within the second fill cut area of ​​the second printed circuit board, electrically connected to the second printed circuit board. Electronic devices.

3. In paragraph 1 or 2, The above third ground layer is, A first line of the first printed circuit board electrically connected to the processor and a second line of the second printed circuit board electrically connected to the matching circuit, Electronic devices.

4. In paragraph 3, Further comprising an RF choke electrically connected to at least one of the first line of the first printed circuit board or the second line of the second printed circuit board to reduce interference between the baseband signal transmitted along the first line or the second line and the RF signal transmitted along the RF line. Electronic devices.

5. In any one of paragraphs 1 to 4, A first passive element for electrically connecting the first ground layer and the third ground layer in the frequency band of the RF signal; and In the frequency band of the RF signal, further comprising a second passive element for electrically connecting the second ground layer and the third ground layer. Electronic devices.

6. In paragraph 5, The above first passive element and the above second passive element, comprising at least one of a capacitor, an inductor, or a filter circuit; Electronic devices.

7. In any one of paragraphs 1 to 6, The above connecting member is, Core part, An insulating portion surrounding the above core portion, and Including a conductive portion surrounding the above insulating portion, The above RF line is, formed within the above core portion, The above third ground layer is, Formed within the above challenging portion, Electronic devices.

8. In any one of paragraphs 1 to 7, The above baseband signal is, Including a power signal provided to the above matching circuit and a control signal for controlling the above matching circuit. Electronic devices.

9. In any one of paragraphs 1 to 8, The size of the above second printed circuit board is: Smaller than the size of the first printed circuit board above, Electronic devices.

10. In any one of paragraphs 1 to 9, The above matching circuit, At least one passive component comprising an inductor or a capacitor, and A switching circuit comprising: a switching circuit configured to electrically connect at least one of the passive elements to a line for the antenna; Electronic devices.

11. In any one of paragraphs 1 to 10, Further comprising a housing forming the exterior of the electronic device, The above antenna, A conductive portion formed on a part of the edge of the housing is used as an antenna radiator for radiating or receiving the RF signal. Electronic devices.

12. In paragraph 11, The above challenging part is, Among the first printed circuit board and the second printed circuit board, the one positioned closer to the second printed circuit board, Electronic devices.

13. In paragraph 12, The above housing, comprising a first side, a second side opposite the first side, a third side connected to one end of the first side and one end of the second side, and a fourth side opposite the third side; The length of the third side is, Longer than the length of the first side above, The above first printed circuit board, Among the first side and the second side, it is positioned closer to the first side, The above second printed circuit board, Among the first side and the second side, the one positioned closer to the second side, Electronic devices.

14. In either of paragraphs 12 or 13, The above housing, Part 1 of the housing, and A second housing part is included that is rotatably coupled to the first housing part with respect to the folding axis, The above first printed circuit board, is placed within the first housing part, The above second printed circuit board, Positioned within the second housing part, Electronic devices.

15. In paragraph 14, Further comprising a hinge structure that rotatably connects the first housing part and the second housing part, The above connecting member is, From the first printed circuit board within the first housing part, extending across the hinge structure to the second printed circuit board within the second housing part, Electronic devices.

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