Bernoulli chuck and use method

Abstract

The present invention relates to the technical field of semiconductor processing and cleaning, and particularly to a Bernoulli chuck and a use method. The Bernoulli chuck comprises: a supporting seat which is rotatably arranged, wherein a plurality of supporting columns are rotatably arranged at the top of the supporting seat, holding columns are eccentrically arranged at the tops of the supporting columns, a shifting plate is arranged on the side wall of each supporting column, and a through shifting notch is formed in the shifting plate; a rotating seat which is coaxially arranged at the top of the supporting seat, wherein a shifting column is arranged on the rotating seat, the shifting column is always fitted into the shifting notch, and a plurality of elastic structures are arranged between the bottom of the rotating seat and the top of the supporting seat, so that when the supporting seat rotates at a variable speed, the rotating seat can rotate relative to the supporting seat, and when the supporting seat rotates at a constant speed from a variable speed, the rotating seat can return to the initial position; and a suction assembly coaxially arranged on the supporting seat.

Description

Bernoulli chuck and method of use Technical Field

[0001] The invention belongs to the technical field of semiconductor processing and cleaning, and particularly relates to a Bernoulli chuck and a use method thereof. Background Art

[0002] In the semiconductor manufacturing industry, Bernoulli non-contact chucks are a common method for securing wafers. However, existing Bernoulli chucks require several clamping posts on the sidewalls of the wafer to assist in positioning. As a result, the contact points between the clamping posts and the wafer cannot be properly cleaned during wafer cleaning.

[0003] Therefore, it is necessary to provide a Bernoulli chuck and a method for using the chuck that can effectively clean the sidewall of a wafer. Summary of the Invention

[0004] The purpose of the present invention is to provide a Bernoulli chuck and a method of use to solve the technical problem that the side wall of the wafer cannot be properly cleaned.

[0005] In order to solve the above technical problems, the present invention provides a Bernoulli chuck, comprising: a rotatable support seat, a plurality of support columns are rotatably arranged on the top of the support seat, a clamping column is eccentrically arranged on the top of the support column, a toggle plate is provided on the side wall of the support column, and a toggle notch is provided on the toggle plate; a rotating seat coaxially arranged on the top of the support seat, a toggle column is provided on the rotating seat, the toggle column is always stuck in the toggle notch, and a plurality of elastic structures are provided between the bottom of the rotating seat and the top of the support seat, so that when the support seat rotates at a variable speed, the rotating seat can rotate relative to the support seat; when the support seat changes from variable speed rotation to uniform speed rotation, the rotating seat can return to the initial position; an adsorption component coaxially arranged on the support seat.

[0006] The elastic structure includes a fixed block, a spring body and a movable block; the fixed block is arranged on the top of the support seat, the movable block is arranged at the bottom of the rotating seat, the spring body is arranged between the fixed block and the movable block, and the two ends of the spring body are respectively fixed to the side walls of the fixed block and the movable block.

[0007] The side wall of the rotating seat is provided with a plurality of rotating notches, and the movable block is arranged in the rotating notches; the top of the supporting seat is provided with a plurality of supporting grooves, and the fixed block is arranged in the supporting grooves, and the fixed block extends into the rotating notches.

[0008] The rotating seat is provided with a plurality of arc-shaped limiting grooves; the top of the supporting seat is provided with a plurality of travel limiting pins, each of which is respectively inserted into the limiting groove, and the axis of the limiting groove is coaxial with the rotation axis of the rotating seat.

[0009] The side wall of the rotating seat is provided with a plurality of buffer notches, and a damper is arranged in the buffer notch; a damping plate is provided on the top of the supporting seat, and the fixed end of the damper is arranged on the side wall of the buffer notch, and the movable end of the damper is arranged on the damping plate.

[0010] A plurality of toggle grooves are provided on the top of the support seat, and the toggle notches extend above the toggle grooves; a connecting block is integrally provided on the side wall of the rotating seat, and the connecting block extends above the toggle grooves; a toggle block is provided at the bottom of the connecting block, and the toggle column is provided on the top of the toggle block, and the toggle block is clamped in the toggle groove.

[0011] The adsorption assembly includes an air outlet plate coaxially arranged on the support seat, and a plurality of air outlets are opened on the top of the air outlet plate; a support plate is provided above the support seat, and a plurality of support holes are opened on the support plate, and a through hole adapted to the air outlet plate is provided on the support plate, and

[0012] The support column is arranged through the support hole.

[0013] The Bernoulli chuck also includes a base body, a driving motor is provided on the base body, the output shaft of the driving motor is hollow, an outlet column is provided at the bottom of the outlet plate, the interior of the outlet column is hollow and connected to the outlet, and the outlet column is inserted into the output shaft of the driving motor; a rotating ring is integrally provided at the bottom of the rotating seat, and the bottom of the rotating ring is inserted on the output shaft of the driving motor; a supporting ring is integrally provided at the bottom of the supporting seat, and the inner wall of the supporting ring is connected to the outer wall of the rotating ring through a bearing, and a plurality of clamping cylinders are provided on the top of the base body, and a clamping block is provided on the piston rod of the clamping cylinder, and the clamping block can fit the outer wall of the support ring.

[0014] A first connecting ring is integrally provided on the side wall of the output shaft of the drive motor; a second connecting ring is integrally provided on the inner side wall of the rotating ring, the top of the second connecting ring is in contact with the bottom of the first connecting ring, the inner side wall of the second connecting ring is in contact with the side wall of the output shaft of the drive motor, and a magnetic flow groove is provided on the side wall of the output shaft of the drive motor, the magnetic flow groove is in contact with the inner side wall of the second connecting ring, and magnetic fluid is provided in the magnetic flow groove.

[0015] A pull-out rod is slidingly provided between the air outlet column and the output shaft of the drive motor, the top of the pull-out rod is connected to the bottom of the air outlet plate, and the outer wall of the pull-out rod is connected to the output shaft of the drive motor through a keyway and a key block; a first pull-out ring is provided on the inner wall of the through hole, the air outlet plate is clamped in the first pull-out ring, and a second pull-out ring is provided on the side wall of the air outlet plate, the second pull-out ring is clamped above the first pull-out ring, and an annular sealing groove is provided on the top of the first pull-out ring, an O-ring is clamped in the sealing groove, and a detection camera is provided above the support plate.

[0016] An annular supporting groove is provided on the top of the first pull-out ring; an annular supporting ring is provided on the bottom of the second pull-out ring, and the supporting ring is clamped in the supporting groove.

[0017] The bottom of the pulling rod extends out of the bottom of the driving motor, the side wall of the pulling rod is provided with a pulling block, the pulling block is provided with an annular pulling groove, the base body is provided with a pulling motor, the output shaft of the pulling motor is perpendicular to the axis of the pulling rod, the output shaft of the pulling motor is provided with an eccentric pulling column, and the pulling column is inserted into the pulling groove.

[0018] In addition, the present invention also provides a method for using a Bernoulli chuck, including the Bernoulli chuck device mentioned above, first, the clamping cylinder clamps the support seat, and the driving motor drives the rotating seat to rotate, so that the clamping column rotates eccentrically to place the wafer on the top of the support plate; then, the clamping cylinder loosens the support ring, and the clamping column rotates eccentrically to clamp the wafer; secondly, the air outlet starts to blow out protective gas to suck the wafer; again, the driving motor drives the rotating seat to rotate and starts cleaning the wafer; again, during cleaning, the driving motor periodically accelerates and decelerates to make the clamping column rotate eccentrically and loosen the wafer so that the cleaning medium can contact the position where the side wall of the wafer is supported by the clamping column, and after the periodic acceleration and deceleration are completed, the driving motor speed is constant, the clamping column resets, and the wafer is clamped; finally, when cleaning is completed, the clamping cylinder clamps the support seat, and the driving motor drives the rotating seat to rotate, so that the clamping column rotates eccentrically, loosens the wafer, and takes the wafer out.

[0019] The beneficial effects of the present invention are:

[0020] 1. The rotation of the support column can cause the clamping column to rotate eccentrically, thereby facilitating the clamping and loosening of the wafer;

[0021] 2. The rotation of the rotating seat can drive the toggle column to rotate. The toggle column is stuck in the fluctuation gap, thereby driving the toggle plate to rotate so that the support column rotates to complete the clamping and loosening of the wafer;

[0022] 3. When the support seat rotates at a constant speed, the positions of the support seat and the rotating seat are relatively fixed. At this time, the clamping column clamps the wafer, thereby driving the wafer to rotate and clean the wafer; when the support seat rotates at a variable speed, the support seat and the rotating seat rotate relatively. At this time, the toggle column rotates to drive the toggle plate to rotate so that the support column rotates to complete the release of the wafer. At this time, the contact position between the clamping column and the wafer can be cleaned, thereby improving the cleaning effect.

[0023] 4. The adsorption component can effectively adsorb the wafer to avoid axial shaking of the wafer during cleaning, thereby achieving better cleaning effect.

[0024] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present invention.

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] FIG1 is a perspective view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0028] FIG2 is a perspective view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0029] FIG3 is a cross-sectional view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0030] FIG4 is an enlarged view of point A in FIG3 ;

[0031] FIG5 is a perspective view of a preferred embodiment of a Bernoulli chuck of the present invention;

[0032] FIG6 is a schematic structural diagram of a preferred embodiment of a support base and a rotating base of the present invention;

[0033] FIG7 is an enlarged view of point B in FIG6;

[0034] FIG8 is an enlarged view of point C in FIG6 ;

[0035] FIG9 is an enlarged view of point D in FIG6 .

[0036] In the picture:

[0037] 000, wafer;

[0038] 100, support seat, 110, support column, 120, clamping column, 130, toggle plate, 131, toggle notch, 140, elastic structure, 141, fixed block, 142, spring body, 143, movable block, 150, support groove, 160, travel limit pin, 170, damping plate, 180, toggle groove, 190, support ring;

[0039] 200, rotating seat, 210, toggle column, 220, rotating notch, 230, limiting groove, 240, buffer notch, 250, damper, 260, connecting block, 270, toggle block, 280, rotating ring, 281, second connecting ring;

[0040] 300, air outlet plate, 310, air outlet, 320, air outlet column, 330, pull rod, 331, pull block, 332, pull groove, 340, second pull ring, 341, holding ring;

[0041] 400, support plate, 410, support hole, 420, first pull-out ring, 421, sealing groove, 422, O-ring, 423, abutting groove, 430, through hole;

[0042] 500, base body, 510, drive motor, 511, first connecting ring, 512, magnetic flow slot, 520, clamping cylinder, 530, clamping block, 540, pulling motor, 541, pulling column;

[0043] 600. Detection camera. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention. Example 1

[0045] As shown in Figures 1-9, the present invention provides a Bernoulli chuck, comprising: a rotatable support base 100, a plurality of support columns 110 rotatably provided on the top of the support base 100, a clamping column 120 eccentrically provided on the top of the support column 110, the rotation of the support column 110 can cause the clamping column 120 to rotate eccentrically, thereby facilitating the clamping and loosening of the wafer 000, wherein the handling position of the clamping column 120 is on the line connecting the axis of the support column 110 and the support base 100, and at one end close to the axis of the support base 100; the side wall of the support column 110 is provided with a toggle plate 130, The toggle plate 130 is provided with a through toggle notch 131; a rotating seat 200 is coaxially arranged on the top of the support seat 100, and a toggle column 210 is provided on the rotating seat 200, and the toggle column 210 is always stuck in the toggle notch 131. The rotation of the rotating seat 200 can drive the toggle column 210 to rotate, and the toggle column 210 is stuck in the toggle notch 131, thereby driving the toggle plate 130 to rotate so that the support column 110 rotates to complete the clamping and loosening of the wafer 000; and a plurality of elastic members are provided between the bottom of the rotating seat 200 and the top of the support seat 100. The structure 140 is configured so that when the support base 100 rotates at a variable speed, the rotating base 200 can rotate relative to the support base 100; when the support base 100 changes from a variable speed rotation to a uniform speed rotation, the rotating base 200 can return to its initial position. When the support base 100 rotates at a uniform speed, the positions of the support base 100 and the rotating base 200 are relatively fixed. At this time, the clamping column 120 clamps the wafer 000, thereby driving the wafer 000 to rotate and clean the wafer 000; when the support base 100 rotates at a variable speed, the support base 100 and the rotating base 200 rotate relative to each other. The rotation of the toggle column 210 drives the toggle plate 130 to rotate so that the support column 110 rotates to complete the loosening of the wafer 000. At this time, the contact position between the clamping column 120 and the wafer 000 can be cleaned, thereby improving the cleaning effect. Furthermore, after a short period of speed change, the support seat 100 resumes uniform speed movement to reset the rotating seat 200 and re-clamp the side wall of the wafer 000; the adsorption component coaxially arranged on the support seat 100 can effectively adsorb the wafer 000, thereby avoiding axial shaking of the wafer 000 when cleaning the wafer 000, thereby achieving a better cleaning effect.

[0046] The elastic structure 140 includes a fixed block 141, a spring body 142 and a movable block 143; the fixed block 141 is arranged at the top of the support seat 100, the movable block 143 is arranged at the bottom of the rotating seat 200, the spring body 142 is arranged between the fixed block 141 and the movable block 143, and the two ends of the spring body 142 are respectively fixed to the side walls of the fixed block 141 and the movable block 143. When the support seat 100 changes speed and rotates, the rotating seat 200 rotates relatively, so that the movable block 143 squeezes the spring body 142 and rotates. The fixed block 141 can resist the spring body 142. When the support seat 100 rotates at a constant speed, the spring body 142 rebounds to reset the movable block 143 and then reset the rotating seat 200.

[0047] The side wall of the rotating seat 200 is provided with a plurality of rotating notches 220, and the movable block 143 is arranged in the rotating notches 220; the top of the supporting seat 100 is provided with a plurality of supporting grooves 150, and the fixed block 141 is arranged in the supporting grooves 150, and the fixed block 141 extends into the rotating notches 220. The supporting grooves 150 can firmly mount the fixed block 141 and can reduce the vertical space for installing the fixed block 141. The rotating notch 220 leaves space suitable for the rotation of the movable block 143.

[0048] The rotating base 200 is provided with a plurality of arc-shaped limiting grooves 230; the top of the support base 100 is provided with a plurality of travel limiting pins 160, each of which is respectively inserted into the limiting groove 230, and the axis of the limiting groove 230 is coaxial with the rotation axis of the rotating base 200. The limiting pin slides in the limiting groove 230 to limit the travel of the rotating base 200, thereby preventing the rotating base 200 from excessively rotating and affecting the work;

[0049] The side wall of the rotating base 200 is provided with a plurality of buffer notches 240, and dampers 250 are disposed in the buffer notches 240; a damping plate 170 is disposed on the top of the supporting base 100, and the fixed end of the damper 250 is disposed on the side wall of the buffer notch 240, and the movable end of the damper 250 is disposed on the damping plate 170. The buffer notches 240 can stably support the damper 250, and the damping plate 170 can support the damper 250 when the damper 250 moves. The damper 250 can make the rotation and reset of the rotating base 200 more stable;

[0050] The top of the support seat 100 is provided with a plurality of toggle grooves 180, and the toggle notches 131 extend above the toggle grooves 180; the side wall of the rotating seat 200 is integrally provided with a connecting block 260, and the connecting block 260 extends above the toggle grooves 180, and the bottom of the connecting block 260 is provided with a toggle block 270, and the toggle column 210 is provided at the top of the toggle block 270, and the toggle block 270 is clamped in the toggle groove 180, and the connecting block 260 and the toggle block 270 are connected by bolts, and the rotating seat 200 rotates to drive the connecting block 260 to rotate, and the connecting block 260 rotates to drive the toggle block 270 to rotate, and the rotation of the toggle block 270 causes the toggle column 210 to rotate, thereby causing the clamping column 120 to rotate to complete the clamping and release of the wafer 000;

[0051] The adsorption assembly includes an air outlet plate 300 coaxially arranged on the support seat 100, and a plurality of air outlets 310 are opened on the top of the air outlet plate 300. The air outlet 310 can spray out gas suitable for adsorbing the wafer 000, and the Bernoulli principle is used to generate a negative pressure area under the wafer 000, so that the wafer is adsorbed on the top of the air outlet plate 300, and the sprayed gas can be nitrogen; a support plate 400 is provided on the top of the support seat 100, and a plurality of support holes 410 are opened on the support plate 400. The support plate 400 is provided with a through hole 430 adapted to the air outlet plate 300, and a support column 110 is arranged through the support hole 410, so that the support column 110 can fit the side wall of the wafer 000 to assist in clamping the wafer 000.

[0052] The Bernoulli chuck also includes a base body 500, on which a driving motor 510 is provided, and the output shaft of the driving motor 510 is hollow. An outlet column 320 is provided at the bottom of the outlet plate 300, and the outlet column 320 is hollow inside and communicates with the outlet port 310. The outlet column 320 is inserted into the output shaft of the driving motor 510, and the outlet column 320 passes gas that adsorbs the wafer 000. Since the outlet column 320 is hollow, the gas can be transported to the outlet port 310, and the outlet port 310 discharges the gas and adsorbs the wafer 000; a rotating ring 280 is integrally provided at the bottom of the rotating seat 200, and the bottom of the rotating ring 280 is inserted on the output shaft of the driving motor 510; a supporting ring 190 is integrally provided at the bottom of the supporting seat 100, and the inner wall of the supporting ring 190 is connected to the rotating ring 280 through a bearing. The outer wall of the support ring 190 is connected, and a plurality of clamping cylinders 520 are provided on the top of the base body 500. The piston rod of the clamping cylinder 520 is provided with a clamping block 530. The clamping block 530 can fit the outer wall of the support ring 190. When the wafer 000 needs to be cleaned, the clamping cylinder 520 drives the clamping block 530 to clamp the support ring 190 to prevent the support ring 190 from rotating. The driving motor 510 drives the rotating seat 200 to rotate, so that the clamping column 120 rotates eccentrically, and the wafer 000 is placed on the top of the support plate 400. Then, the gas outlet column 320 introduces gas to make the wafer 000 adsorbed on the Bernoulli chuck of the present invention. Then, the clamping cylinder 520 releases the piston rod, and the clamping column 120 rotates eccentrically to clamp the wafer 000, so that the driving motor 510 rotates, thereby driving the wafer 000 to rotate and complete the cleaning of the wafer 000.

[0053] The side wall of the output shaft of the driving motor 510 is integrally provided with a first connecting ring 511; the inner wall of the rotating ring 280 is integrally provided with a second connecting ring 281, the top of the second connecting ring 281 fits in with the bottom of the first connecting ring 511, the inner wall of the second connecting ring 281 fits in with the side wall of the output shaft of the driving motor 510, and the side wall of the output shaft of the driving motor 510 is provided with a magnetic flow groove 512, the magnetic flow groove 512 fits in with the inner wall of the second connecting ring 281, and magnetic fluid is provided in the magnetic flow groove 512, the magnetic flow groove 512 can provide a good working environment for the magnetic fluid, and under the action of the magnetic field, the magnetic fluid fills the annular space and establishes a series of sealing rings, thereby achieving a sealing effect, preventing metal particles generated by wear of the output shaft of the driving motor 510 during operation from flowing to the wafer 000 through the installation gap.

[0054] A pull rod 330 is slidingly provided between the air outlet column 320 and the output shaft of the drive motor 510, the top of the pull rod 330 is connected to the bottom of the air outlet plate 300, and the outer wall of the pull rod 330 is connected to the output shaft of the drive motor 510 through a keyway and a key block; the inner wall of the through hole 430 is provided with a first pull ring 420, the air outlet plate 300 is clamped in the first pull ring 420, and the side wall of the air outlet plate 300 is provided with a second pull ring 340, the second pull ring 340 is clamped above the first pull ring 420, and the top of the first pull ring 420 is provided with an annular sealing groove 421, an O-ring 422 is clamped in the sealing groove 421, and above the support plate 400 A detection camera 600 is provided. When the output shaft of the drive motor 510 rotates, the pulling rod 330 can be driven to rotate through the key slot and the key block. When the pulling rod 330 rotates, the gas outlet plate 300 can be driven to rotate. The O-ring 422 can prevent gas leakage, so that the gas outlet plate 300 can discharge gas most efficiently to adsorb the wafer 000, thereby improving work efficiency. Furthermore, the detection camera 600 can detect whether the wafer 000 is broken during the cleaning process. When the camera 600 detects that the wafer 000 is broken, the drive motor 510 stops rotating, and the pulling rod 330 drives the gas outlet plate 300 to pull down, so that the second pulling ring 340 can press the O-ring 422, thereby preventing the cleaning medium from flowing into the drive motor 510 from the installation gap.

[0055] An annular supporting groove 423 is provided at the top of the first pull-out ring 420; an annular supporting ring 341 is provided at the bottom of the second pull-out ring 340, and the supporting ring 341 is clamped in the supporting groove 423. The supporting groove 423 can firmly support the supporting ring 341 so that the air outlet plate 300 is firmly clamped in the support plate 400, forming a sealed maze, further preventing the inflow of cleaning medium.

[0056] The bottom of the drawer rod 330 extends beyond the bottom of the drive motor 510. A drawer block 331 is provided on the sidewall of the drawer rod 330, and an annular drawer slot 332 is defined within the drawer block 331. A drawer motor 540 is provided on the base body 500. The output shaft of the drawer motor 540 is perpendicular to the axis of the drawer rod 330. An eccentric drawer post 541 is provided on the output shaft of the drawer motor 540, and the drawer post 541 is inserted into the drawer slot 332. Rotation of the output shaft of the drawer motor 540 causes the drawer post 541 to rotate eccentrically, which in turn causes the drawer block 331 to slide up and down. This upward and downward movement of the drawer block 331 drives the drawer rod 330 in turn. The fact that the output shaft of the drawer motor 540 is perpendicular to the drawer rod 330 (i.e., the drawer motor 540 is disposed horizontally) reduces the vertical height of the drawer rod 330 drive device.

[0057] In addition, the present invention also provides a method for using a Bernoulli chuck, including the Bernoulli chuck device described above. First, the clamping cylinder 520 clamps the support base 100, and the driving motor 510 drives the rotating base 200 to rotate. The rotating base 200 rotates relative to the support base 100 to make the clamping column 120 rotate eccentrically and place the wafer 000 on the top of the support plate 400; then, the clamping cylinder 520 releases the support ring 190, and the spring body 142 rebounds to reset the rotating base 200, and the clamping column 120 rotates eccentrically to clamp the wafer 000; secondly, the air outlet 310 starts to blow out protective gas to suck the wafer 000; again, The driving motor 510 drives the rotating seat 200 to rotate and starts cleaning the wafer 000; again, the driving motor 510 periodically accelerates and decelerates during cleaning to make the clamping column 120 rotate eccentrically and loosen the wafer 000 so that the cleaning medium can contact the position where the side wall of the wafer 000 is supported by the clamping column 120. After completing the periodic acceleration and deceleration, the driving motor 510 has a constant speed, the clamping column 120 resets, and clamps the wafer 000; finally, when cleaning is completed, the clamping cylinder clamps the support seat 100 and drives the rotating seat 200 to rotate through the driving motor 510 to make the clamping column 120 rotate eccentrically, loosen the wafer 000, and take out the wafer 000.

[0058] All components used in this application (parts whose specific structures are not described) are standard components or components known to those skilled in the art. Their structures and principles are readily known to those skilled in the art through technical manuals or routine experimental methods. Furthermore, the software programs referred to in this application are all prior art, and this application does not involve any improvements to the software programs.

[0059] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0060] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0061] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. There may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interface, indirect coupling or communication connection of devices or units, which may be electrical, mechanical or other forms.

[0062] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0063] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0064] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A Bernoulli chuck, characterized in that: include: A rotatably arranged support seat, wherein a plurality of support columns (110) are rotatably arranged on the top of the support seat, a clamping column (120) is eccentrically arranged on the top of the support column (110), a toggle plate (130) is arranged on the side wall of the support column (110), and a through toggle notch (131) is provided on the toggle plate (130); A rotating seat (200) is coaxially arranged on the top of the supporting seat, and a toggle post (210) is arranged on the rotating seat (200), and the toggle post (210) is always stuck in the toggle notch (131); and A plurality of elastic structures (140) are provided between the bottom of the rotating seat (200) and the top of the supporting seat so that When the support seat rotates at a variable speed, the rotating seat (200) can rotate relative to the support seat; When the support seat changes from variable speed rotation to uniform speed rotation, the rotating seat (200) can return to the initial position; An adsorption component is coaxially arranged on the support seat.

2. The Bernoulli chuck according to claim 1, characterized in that The elastic structure (140) comprises a fixed block (141), a spring body (142) and a movable block (143); The fixed block (141) is arranged on the top of the support seat, the movable block (143) is arranged on the bottom of the rotating seat (200), the spring body (142) is arranged between the fixed block (141) and the movable block (143), and two ends of the spring body (142) are respectively fixed to the side walls of the fixed block (141) and the movable block (143).

3. The Bernoulli chuck according to claim 2, characterized in that A plurality of rotation notches (220) are formed on the side wall of the rotation seat (200), and the movable block (143) is arranged in the rotation notches (220); A plurality of support grooves (150) are formed on the top of the support seat, and the fixing blocks (141) are arranged in the support grooves (150); and The fixing block (141) extends into the rotation notch (220).

4. The Bernoulli chuck according to claim 1, characterized in that The rotating seat (200) is provided with a plurality of arc-shaped limiting grooves (230); A plurality of travel limit pins (160) are arranged on the top of the support seat, each of the travel limit pins (160) is respectively inserted into the limit slot (230), and The axis of the limiting groove (230) is coaxial with the rotation axis of the rotating seat (200).

5. The Bernoulli chuck according to claim 1, characterized in that: A plurality of buffer notches (240) are formed on the side wall of the rotating seat (200), and a damper (250) is disposed in the buffer notches (240); A damping plate (170) is provided on the top of the support seat, and The fixed end of the damper (250) is arranged on the side wall of the buffer notch (240), and the movable end of the damper (250) is arranged on the damping plate (170).

6. The Bernoulli chuck according to claim 1, characterized in that: A plurality of toggle grooves (180) are formed on the top of the support seat, and the toggle notches (131) extend above the toggle grooves (180); A connecting block (260) is integrally provided on the side wall of the rotating seat (200), the connecting block (260) extends above the toggle groove (180), a toggle block (270) is provided at the bottom of the connecting block (260), and the toggle column (210) is provided on the top of the toggle block (270); and The toggle block (270) is clamped in the toggle slot (180).

7. The Bernoulli chuck according to claim 1, characterized in that: The adsorption assembly comprises an air outlet plate (300) coaxially arranged on the support seat, and a plurality of air outlets (310) are provided on the top of the air outlet plate (300); A support plate (400) is provided on the upper cover of the support seat, a plurality of support holes (410) are provided on the support plate (400), and a through hole (430) adapted to the air outlet plate (300) is provided on the support plate (400); and The support column (110) is disposed through the support hole (410).

8. The Bernoulli chuck according to claim 7, characterized in that The Bernoulli chuck further comprises a base body (500), a driving motor (510) being arranged on the base body (500), an output shaft of the driving motor (510) being arranged hollow, a gas outlet column (320) being arranged at the bottom of the gas outlet plate (300), the gas outlet column (320) being hollow inside and communicating with the gas outlet (310), and the gas outlet column (320) being plugged into the output shaft of the driving motor (510); A rotating ring (280) is integrally provided at the bottom of the rotating seat (200), and the bottom of the rotating ring (280) is plugged onto the output shaft of the driving motor (510); A support ring (190) is integrally provided at the bottom of the support seat, and an inner wall of the support ring (190) is connected to an outer wall of the rotating ring (280) via a bearing, and A plurality of clamping cylinders (520) are arranged on the top of the base body (500), and clamping blocks (530) are arranged on piston rods of the clamping cylinders (520), and the clamping blocks (530) are capable of fitting against the outer wall of the support ring (190).

9. The Bernoulli chuck according to claim 8, characterized in that A first connecting ring (511) is integrally provided on the side wall of the output shaft of the driving motor (510); The inner side wall of the rotating ring (280) is integrally provided with a second connecting ring (281), the top of the second connecting ring (281) is in contact with the bottom of the first connecting ring (511), and the inner side wall of the second connecting ring (281) is in contact with the side wall of the output shaft of the driving motor (510); A magnetic flow groove (512) is provided on the side wall of the output shaft of the drive motor (510), the magnetic flow groove (512) is in contact with the inner side wall of the second connecting ring (281), and a magnetic fluid is arranged in the magnetic flow groove (512).

10. The Bernoulli chuck according to claim 9, characterized in that A pull rod (330) is slidably provided between the air outlet column (320) and the output shaft of the drive motor (510), the top of the pull rod (330) is connected to the bottom of the air outlet plate (300), and the outer side wall of the pull rod (330) is connected to the output shaft of the drive motor (510) via a key slot and a key block; The inner wall of the through hole (430) is provided with a first pull-out ring (420), the air outlet plate (300) is clamped in the first pull-out ring (420), and the side wall of the air outlet plate (300) is provided with a second pull-out ring (340), the second pull-out ring (340) is clamped above the first pull-out ring (420), and An annular sealing groove (421) is provided at the top of the first pull-out ring (420), an O-ring (422) is clamped inside the sealing groove (421), and A detection camera (600) is arranged above the support plate (400).

11. The Bernoulli chuck according to claim 10, characterized in that An annular supporting groove (423) is provided on the top of the first pull-out ring (420); The bottom of the second pull-out ring (340) is provided with an annular supporting ring (341), and The abutting ring (341) is clamped in the abutting groove (423).

12. The Bernoulli chuck according to claim 11, characterized in that The bottom of the pull-out rod (330) extends out of the bottom of the drive motor (510), and a pull-out block (331) is provided on the side wall of the pull-out rod (330). An annular pull-out groove (332) is provided on the pull-out block (331). A pull-out motor (540) is provided on the base body (500), and the output shaft of the pull-out motor (540) is perpendicular to the axis of the pull-out rod (330). An eccentric pull-out column (541) is provided on the output shaft of the pull-out motor (540), and the pull-out column (541) is inserted into the pull-out groove (332).

13. A method for using the Bernoulli chuck according to claim 12, characterized in that: First, the clamping cylinder (520) clamps the support seat, and the driving motor (510) drives the rotating seat (200) to rotate, so that the clamping column (120) rotates eccentrically, and the wafer (000) is placed on the top of the support plate (400); Then, the clamping cylinder (520) releases the support ring (190), and the clamping column (120) rotates eccentrically to clamp the wafer (000); Secondly, the gas outlet (310) starts to blow out protective gas to suck the wafer (000); Next, the driving motor (510) drives the rotating seat (200) to rotate, and the wafer (000) starts to be cleaned; Thirdly, during cleaning, the drive motor (510) periodically accelerates and decelerates to cause the clamping column (120) to rotate eccentrically, loosening the wafer (000) so that the cleaning medium can contact the position where the side wall of the wafer (000) is supported by the clamping column (120); after the periodic acceleration and deceleration is completed, the speed of the drive motor (510) is constant, the clamping column (120) is reset, and the wafer (000) is clamped; Finally, when cleaning is completed, the clamping cylinder clamps the support seat, and drives the rotating seat (200) to rotate through the driving motor (510), so that the clamping column (120) rotates eccentrically, releases the wafer (000), and removes the wafer (000).

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