Substrate processing apparatus and substrate processing method

Abstract

Provided is a substrate processing apparatus for processing a substrate, comprising: a process chamber for processing; a transfer robot for transferring the substrate to the process chamber; and an inspection unit provided on a path along which the transfer robot transfers the substrate, wherein the inspection unit measures a detection time for which the substrate is detected if the transfer robot transfers the substrate, so as to detect whether the detection time exceeds the error range of a pre-stored reference time.

Description

Substrate processing device and substrate processing method

[0001] The present invention relates to a substrate processing device and a substrate processing method for processing a substrate.

[0002] Manufacturing semiconductor devices involves a variety of processes, including photolithography, deposition, ashing, etching, and ion implantation. Furthermore, a cleaning process is performed before and after these processes to remove any remaining particles on the substrate.

[0003] Meanwhile, substrates used to form semiconductor devices are transported between these processes. Most substrates are transported between process chambers by transfer robots. When placed within a process chamber, the substrate undergoes an automatic wafer centering (AWC) process to ensure that its center aligns with the process center.

[0004] The automatic wafer centering operation mainly involves measuring the center of the substrate with a sensor mounted on the hand of the transfer robot, thereby transporting the substrate while checking whether the center of the substrate is aligned with the center of the substrate handling device.

[0005] However, since many of the previous generation of transport robots do not have an automatic wafer centering function, a teaching task is periodically performed to align the center of the hand of the transport robot with the center of the substrate, so that the center of the substrate is aligned with the process center.

[0006] In this case, the transfer robot's hands may slip due to wear and tear on components caused by repetitive tasks, invisible deformation, or momentary acceleration, causing the substrate to shift from the center of the substrate handling device. However, previous-generation transfer robots lacking automatic wafer centering capabilities have the problem of being unable to detect misalignment of mounted substrates.

[0007] In addition, the substrate may be broken due to impact, etc., and the conventional transport robot has a problem in that it cannot detect the breakage of the substrate.

[0008] The technical task of the present invention to solve the above-mentioned problem is to provide a substrate processing device and a substrate processing method that can detect a misalignment between the center of a substrate and the center of a substrate processing device when a transfer robot transfers the substrate.

[0009] Another technical problem of the present invention is to provide a substrate processing device and substrate processing method capable of detecting breakage of a substrate when a transfer robot transfers the substrate.

[0010] The technical problems to be solved by the present invention are not limited thereto, and those skilled in the art will understand that other technical problems not mentioned can be derived from the configurations used in the specification and drawings below.

[0011] In order to achieve the above technical task, the substrate processing device of the present invention comprises a substrate processing device for processing a substrate, comprising: a process chamber for processing a process; a transfer robot for transferring a substrate to the process chamber; and an inspection unit installed on a path along which the transfer robot transfers the substrate; wherein the inspection unit measures a detection time at which the substrate is detected when the transfer robot returns the substrate, and can detect a case where the detection time falls outside an error range of a pre-stored reference time.

[0012] According to one embodiment, the inspection unit may include a sensor unit that is disposed at least at one of the upper and lower portions of a path along which the substrate is returned and generates a detection signal while the substrate passes by; and a calculation unit that receives the detection signal in conjunction with the sensor unit, calculates a detection time while the detection signal is being input, and detects a case where the calculated detection time falls outside an error range of a reference time.

[0013] According to one embodiment, the sensor unit further includes a first sensor installed at a first position among either the upper or lower portion of a path along which the substrate is returned, and detecting the substrate when passing through the first position; and a second sensor installed at a second position among either the upper or lower portion of a path along which the substrate is returned, and detecting the substrate when passing through the second position; wherein the second position may be arranged closer to the center of the substrate than the first position.

[0014] According to one embodiment, the sensor unit further includes a third sensor disposed at a third position on the path along which the substrate is returned; wherein the third position may be any position in a direction opposite to the first position with respect to the second position.

[0015] In one embodiment, the second sensor may be positioned at a position where it detects the substrate before the first sensor detects the substrate.

[0016] In one embodiment, the second sensor may be positioned to detect the substrate for a longer period of time than the first sensor finishes detecting the substrate.

[0017] In one embodiment, the second sensor can detect the substrate and the end effector of the transport robot passing through the second position.

[0018] According to one embodiment, the calculation unit receives a first detection signal in conjunction with the first sensor and calculates a first detection time while the substrate passes the first position, receives a second detection signal in conjunction with the second sensor and calculates a second detection time while the substrate passes the second position, compares the second detection time with a pre-stored second reference time, compares the first detection time with a pre-stored first reference time, and can compare and determine whether the second detection time is outside a predetermined error range of the second reference time and whether the first detection time is outside a predetermined error range of the first reference time.

[0019] According to one embodiment, the calculation unit calculates a start point interval time for the time between the start time of the calculation of the second detection time and the start time of the calculation of the first detection time, calculates an end point interval time for the time between the end time of the first detection time and the end time of the second detection time, compares the start point interval time with a pre-stored start point interval reference time, compares the end point interval time with a pre-stored end point interval reference time, and can compare and determine whether the start point interval time is outside a certain error range of the start point interval reference time and whether the end point interval time is outside a certain error range of the end point interval reference time.

[0020] In one embodiment, the first sensor may include: a first light sensor disposed at the first position, generating light, and generating a first detection signal when receiving reflected light; and a first reflector disposed at the first position, installed above or below the first light sensor and spaced apart from the first light sensor, and reflecting the light generated by the first light sensor to the first light sensor; and the second sensor may include: a second light sensor disposed at the second position, generating light, and generating a second detection signal when receiving reflected light; and a second reflector disposed at the second position, installed above or below the second light sensor and spaced apart from the second light sensor, and reflecting the light generated by the second light sensor to the second light sensor.

[0021] Meanwhile, the substrate processing method of the present invention for achieving the above-mentioned technical task is a processing method in which a transfer robot transfers a substrate to a process chamber, wherein the transfer robot passes the substrate to a position where an inspection unit can detect the substrate while the substrate is mounted on a hand, and the inspection unit measures the detection time at which the substrate is detected, and can detect a case in which the detection time falls outside the error range of a pre-stored reference time.

[0022] In one embodiment, the inspection unit detects the substrate when it passes through each of the first position and the second position, measures the detection time at each of the second position and the first position, and detects a case where the detection time falls outside the error range of each of the pre-stored reference times, and in this case, the second position may be positioned closer to the center of the substrate than the first position.

[0023] In one embodiment, the time at which the inspection unit detects the substrate at the second location may be earlier than the time at which the inspection unit detects the substrate at the first location.

[0024] In one embodiment, the time at which the inspection unit finishes detecting the substrate at the second location may be later than the time at which the inspection unit finishes detecting the substrate at the first location.

[0025] In one embodiment, the inspection unit can detect the substrate and the end effector of the transfer robot at the second position.

[0026] In one embodiment, the inspection unit can detect only the substrate without detecting the end effect of the transfer robot at the first position.

[0027] In one embodiment, the inspection unit calculates a first detection time while the substrate passes the first position, calculates a second detection time while the substrate passes the second position, compares the second detection time with a pre-stored second reference time, compares the first detection time with a pre-stored first reference time, and can compare and determine whether the second detection time is outside a predetermined error range of the second reference time and whether the first detection time is outside a predetermined error range of the first reference time.

[0028] In one embodiment, the inspection unit calculates a start point interval time for the time between the start time of the calculation of the second detection time and the start time of the calculation of the first detection time, calculates an end point interval time for the time between the end time of the first detection time and the end time of the second detection time, compares the start point interval time with a pre-stored start point interval reference time, compares the end point interval time with a pre-stored end point interval reference time, and can compare and determine whether the start point interval time is outside a certain error range of the start point interval reference time and whether the end point interval time is outside a certain error range of the end point interval reference time.

[0029] In one embodiment, the inspection unit may further determine whether the upper limit threshold and the lower limit threshold are greater than the predetermined error range, and if the predetermined error range is exceeded, the substrate may be determined to be in a state of being out of center, and if the upper limit threshold or the lower limit threshold is exceeded, the substrate may be determined to be in a state of being broken.

[0030] In one embodiment, the inspection unit can generate light above or below the path along which the substrate is returned, and determine that the substrate is positioned if there is no reflected light, and determine that the substrate is not positioned if there is reflected light.

[0031] In one embodiment, the inspection unit detects when the substrate passes a third position, wherein the third position may be any position in a direction opposite to the first position with respect to the second position.

[0032] The present invention has the effect of being able to detect a state in which the center of a substrate is shifted from the center of a substrate processing device when a transfer robot transfers the substrate.

[0033] In addition, the present invention has the effect of enabling a transport robot to detect breakage of a substrate when transporting the substrate.

[0034] The effects of the present invention are not limited to the effects described above, and those skilled in the art will understand that other effects not mentioned can be derived from the configurations used in the specification and drawings below.

[0035] Figure 1 is a plan view of a substrate processing device according to one embodiment of the present invention.

[0036] Figure 2 is a side cross-sectional view of the process chamber illustrated in Figure 1.

[0037] Figure 3 is a partial perspective view of the plasma chamber illustrated in Figure 2.

[0038] Figure 4 is a plan view of the plasma chamber illustrated in Figure 3.

[0039] Figure 5 is a schematic plan view illustrating the standard time required for the hand and substrate of the second transport robot to pass through the first sensor and the second sensor.

[0040] Figure 6 is a schematic plan view illustrating the detection time required when the hand and substrate of the second transport robot pass through the first sensor and the second sensor.

[0041] Figure 7 is a plan view of a substrate placed on the hand of a second transport robot sliding a certain distance to the right from its original position.

[0042] Figure 8 is a plan view of a substrate placed on the hand of a second transport robot sliding a certain distance to the left from its original position.

[0043] Figure 9 is a plan view of a substrate placed on the hand of a second transport robot sliding forward a certain distance from its original position.

[0044] Figure 10 is a plan view of a substrate placed on the hand of a second transport robot sliding a certain distance backward from its original position.

[0045] Figure 11 is a plan view of the substrate mounted on the hand of the second transfer robot in a broken state.

[0046] Figure 12 is a plan view of the substrate mounted on the hand of the second transfer robot in a broken state.

[0047] Figure 13 is a flowchart of a substrate processing method according to one embodiment of the present invention.

[0048] Fig. 14 is a plan view of Fig. 5 with a third sensor additionally installed.

[0049] Hereinafter, embodiments for carrying out the present invention will be described with reference to the attached drawings. In this case, when a part is said to "include" a certain component throughout the specification, this is considered to mean that other components can be further included, rather than controlling other components, unless specifically stated otherwise. In addition, terms such as "...unit" described in the specification are considered to mean a unit that processes at least one function or operation when describing electronic hardware or electronic software, and to mean one part, function, purpose, point, or driving element when describing a mechanical device. In addition, in the following, identical or similar components will be described using the same drawing reference numerals, and redundant descriptions of identical components will be omitted.

[0050] Additionally, when an element or layer is referred to herein as being "on," "connected," "bonded," "attached," "adjacent," or "covering" another element or layer, it may be directly on, connected, bonded, attached, adjacent, or covering said other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, it should be understood that no intermediate elements or layers are present. Like reference numerals refer to like elements throughout the specification. The term "and / or" as used herein further encompasses all combinations and subcombinations of one or more of the listed items.

[0051] Fig. 1 is a plan view of a substrate processing device according to one embodiment of the present invention. Fig. 2 is a side cross-sectional view of the process chamber illustrated in Fig. 1.

[0052] As illustrated in FIGS. 1 to 4, a substrate processing device according to one embodiment of the present invention includes a load port (10), a transfer frame (20), a load lock chamber (40), a transfer chamber (50), and a process chamber (60).

[0053] The load port (10) is arranged in front of the transport frame (20) in the first direction (11). The load port (10) has a plurality of support members (720) (6). Each of the support members (720) (6) is arranged in a row in the second direction (12), and a carrier (4) (e.g., a cassette, FOUP, etc.) containing a substrate (W) to be provided to the process and a substrate (W) that has completed the process is mounted. The carrier (4) stores the substrate (W) to be provided to the process and the substrate (W) that has completed the process.

[0054] A transfer frame (20) is arranged between a load port (10) and a processing module (30). The transfer frame (20) includes a first transfer robot (25) arranged therein and transferring a substrate (W) between the load port (10) and a load lock chamber (40). The first transfer robot (25) moves along a transfer rail (27) provided in a second direction (12) to transfer the substrate (W) between a carrier (4) and a processing module (30).

[0055] The load lock chamber (40) is arranged adjacent to the transfer frame (20). For example, the load lock chamber (40) may be arranged between the transfer chamber (50) and the transfer frame (20). The load lock chamber (40) provides a waiting space for a substrate (W) to be provided for a process before being transferred to the process chamber (60), or for a substrate (W) that has completed a process before being transferred to the transfer frame (20).

[0056] The transfer chamber (50) is arranged adjacent to the load lock chamber (40). The transfer chamber (50) has a polygonal body when viewed from above. Referring to FIG. 3, the transfer chamber (50) has a pentagonal body when viewed from above. On the outside of the body, a load lock chamber (40) and a plurality of process chambers (60) are arranged along the periphery of the body. A passage (not shown) through which a substrate (W) enters and exits is formed on each side wall of the body, and the passage connects the transfer chamber (50) and the load lock chamber (40) or the process chambers (60). A door (not shown) that opens and closes the passage to seal the interior is provided in each passage. A second transfer robot (53) is arranged in the inner space of the transfer chamber (50) to transfer the substrate (W) between the load lock chamber (40) and the process chambers (60). The second transport robot (53) transports an unprocessed substrate (W) waiting in the load lock chamber (40) to the process chamber (60), or transports a substrate (W) on which a process has been completed to the load lock chamber (40). In addition, the second transport robot (53) transports the substrate (W) between process chambers (60) in order to sequentially provide the substrate (W) to a plurality of process chambers (60). As an example of such a second transport robot (53), the second transport robot (53) may be configured as a multi-degree-of-freedom robot that transports the substrate (W) by placing it on a hand (53a). Meanwhile, the hand (53a) of the second transport robot (53) may be configured with two support plates protruding when viewed from above, and at this time, the hand (53a) may be configured in a form in which the end effector (53a1) is formed to be larger than the outer diameter of the substrate (W) or extends to a position outside the outer diameter of the substrate (W). However, the shape of the hand (53a) in the present invention is not limited to the shape shown in the drawing, and it goes without saying that the hand (53a) of the second transport robot (53) may be formed in any phenomenon in which the end effector (53a1) is extended outward to settle the substrate (W).Furthermore, in the present invention, the second transport robot (53) is described as an example of a multi-degree-of-freedom robot, but the second transport robot (53) is not limited thereto and can be modified and implemented as any transport device that transports the substrate (W) in one direction.

[0057] Meanwhile, as shown in Fig. 3, when the transfer chamber (50) has a pentagonal body, load lock chambers (40) are arranged on each side wall adjacent to the transfer frame (20), and process chambers (60) are arranged in succession on the remaining side walls. The transfer chamber (50) may be provided in various forms depending on the required process module, in addition to the above shape.

[0058] The process chamber (60) is arranged along the periphery of the transfer chamber (50). A plurality of process chambers (60) may be provided. In each process chamber (60), a process treatment for a substrate (W) is performed. The process chamber (60) receives the substrate (W) from the second transfer robot (53), performs a process treatment, and provides the substrate (W) on which the process treatment has been completed to the second transfer robot (53). The process treatment performed in each process chamber (60) may be different from each other. The process chamber (60) performs a predetermined process on the substrate (W) using plasma. For example, the process chamber (60) may etch or ash a thin film on the substrate (W). The thin film may be various types of films, such as a polysilicon film, a silicon oxide film, and a silicon nitride film. In addition, the thin film may be a natural oxide film or a chemically generated oxide film.

[0059] As an example of such a process chamber (60), the process chamber (60) is configured to include a process treatment unit (200), a plasma generation unit (400), and an exhaust unit (600), thereby processing a substrate (W) with plasma.

[0060] The process treatment unit (200) provides a treatment space (212) in which a substrate (W) is placed and treatment of the substrate (W) is performed. The plasma generation unit (400) discharges a process gas to generate plasma and supplies it to the treatment space (212) of the process treatment unit (200). The exhaust unit (600) discharges the process gas remaining inside the process treatment unit (200) and / or reaction byproducts generated during the substrate treatment process to the outside, and maintains the pressure inside the process treatment unit (200) at a set pressure.

[0061] The process processing unit (200) may include a housing (210), a support unit (230), and a baffle (250).

[0062] The housing (210) may have a processing space (212) inside which a substrate processing process is performed. The housing (210) may be open at the top, and an opening (not shown) may be formed in the side wall. The substrate (W) enters and exits the housing (210) through the opening. The opening may be opened and closed by an opening / closing member such as a door (not shown). In addition, an exhaust hole (214) is formed on the bottom surface of the housing (210). Process gases and / or byproducts within the processing space (212) may be exhausted to the outside of the processing space (212) through the exhaust hole (214). The exhaust hole (214) may be connected to components included in the exhaust unit (600) described below.

[0063] The support unit (230) supports the substrate (W) in the processing space (212). The support unit (230) may include a support plate (232) and a support shaft (234). The support plate (232) may support the substrate (W) in the processing space (212). The support plate (232) may be supported by the support shaft (234). The support plate (232) is connected to an external power source and may generate static electricity by the applied power. The electrostatic force of the generated static electricity may fix the substrate (W) to the support unit (230).

[0064] The support shaft (234) can move an object. For example, the support shaft (234) can move a substrate (W) in an up-and-down direction. For example, the support shaft (234) is coupled to a support plate (232) and can move the substrate (W) by raising and lowering the support plate (232).

[0065] The baffle (250) is positioned on the upper side of the support unit (230) so as to face the support unit (230). The baffle (250) can be positioned between the support unit (230) and the plasma generation unit (400). Plasma generated in the plasma generation unit (400) can pass through a plurality of holes (252) formed in the baffle (250).

[0066] The baffle (250) ensures that the plasma flowing into the processing space (212) is uniformly supplied to the substrate (W). The holes (252) formed in the baffle (250) are provided as through holes from the upper surface to the lower surface of the baffle (250), and can be uniformly formed in each area of ​​the baffle (250).

[0067] The plasma generating unit (400) may be positioned at the upper portion of the housing (210). The plasma generating unit (400) may generate plasma by discharging a process gas and supply the generated plasma to the processing space (212).

[0068] As an example of such a plasma generator (400), the plasma generator (400) includes a plasma chamber (410), a gas supply unit (420), a diffusion chamber (430), a power source (440), and an antenna (432).

[0069] The plasma chamber (410) may have a shape with both ends open. For example, the plasma chamber (410) may be formed with an upper surface and a lower surface open. In addition, the plasma chamber (410) may have a cylindrical shape with an upper surface and a lower surface open. For example, the plasma chamber (410) may be formed with a cylindrical shape with an upper surface and a lower surface open. The plasma chamber (410) may have a plasma generation space (412). In addition, the plasma chamber (410) may be formed of a ceramic material. For example, the plasma chamber (410) may be formed of an insulating material such as quartz or aluminum oxide (Al2O3) among ceramic materials. The upper surface of the plasma chamber (410) may be sealed by a gas supply port (414). The gas supply port (414) may be connected to a gas supply unit (420). The process gas can be supplied to the plasma generation space (412) through the gas supply port (414). The gas supplied to the plasma generation space (412) can be introduced into the treatment space (212) through the baffle (250).

[0070] The gas supply unit (420) can supply process gas. The gas supply unit (420) can be connected to the gas supply port (414). The process gas supplied by the gas supply unit (420) can include fluorine and / or hydrogen.

[0071] The diffusion chamber (430) can diffuse plasma generated in the plasma chamber (410). The diffusion chamber (430) can be disposed at the bottom of the plasma chamber (410). The diffusion chamber (430) can have a shape with an open top and a bottom. The diffusion chamber (430) can have an inverted funnel shape. The top of the diffusion chamber (430) can have a diameter corresponding to that of the plasma chamber (410). The bottom of the diffusion chamber (430) can have a diameter larger than the top of the diffusion chamber (430). The diameter of the diffusion chamber (430) can increase from the top to the bottom. In addition, the diffusion chamber (430) can have a diffusion space (442). The plasma generated in the plasma generation space (412) can diffuse while passing through the diffusion space (442). Plasma introduced into the diffusion space (442) can be introduced into the processing space (412) through the baffle (250).

[0072] The power source (440) can apply power to the antenna (432). The power source (440) can apply a high-frequency alternating current to the antenna (432). The high-frequency alternating current applied to the antenna (432) can form an induced electric field in the plasma generation space (412). The process gas supplied into the plasma generation space (412) can obtain energy required for ionization from the induced electric field and be converted into a plasma state.

[0073] The antenna (432) may have one end connected to a power source (440). In addition, the antenna (432) may surround the outer surface of the plasma chamber (410). For example, the antenna (432) may surround the outer surface of the plasma chamber (410) in a coil shape. In this case, the power source (440) may be connected to one end of the antenna (432) provided at a height corresponding to the upper region of the plasma chamber (410). In addition, the other end of the antenna (432) may be grounded. The other end of the antenna (432) provided at a height corresponding to the lower region of the plasma chamber (410) may be grounded. However, the present invention is not limited thereto, and the power source (440) may be connected to the other end of the antenna (432) and one end of the antenna (432) may be grounded.

[0074] Fig. 3 is a perspective view schematically illustrating the second transport robot illustrated in Fig. 1. Fig. 4 is a cross-sectional view of the inspection unit illustrated in Fig. 1.

[0075] As illustrated in FIGS. 3 and 4, the substrate processing device according to one embodiment of the present invention further includes an inspection unit (700).

[0076] The inspection unit (700) is installed on the path along which the second transport robot (53) transports the substrate (W). The inspection unit (700) measures the detection time at which the substrate (W) is detected when the second transport robot (53) transports the substrate (W) while placing the substrate (W) on the hand (53a), and detects a case where the detection time is outside the error range of the pre-stored reference time, thereby detecting whether the substrate (W) is positioned in the correct position on the hand (53a) of the second transport robot (53) and detecting whether a break has occurred in the substrate (W).

[0077] As an example, the inspection unit (700) may include a sensor unit (710), a support unit (720), and an operation unit (730).

[0078] The sensor unit (710) is placed on the upper part of the second transport robot (53), and when the hand (53a) of the second transport robot (53) transports the substrate (W), it generates a detection signal when the substrate (W) passes by, and does not generate a detection signal when the substrate (W) does not pass by.

[0079] As an example of such a sensor unit (710), the sensor unit (710) may include a first sensor (711) and a second sensor (712).

[0080] The first sensor (711) is installed at a first position (P1) when viewed from above, and can generate a detection signal when the substrate (W) passes the first position (P1).

[0081] As an example of such a first sensor (711), the first sensor (711) may include a first light sensor (712a) and a first reflector (712b).

[0082] The first light sensor (712a) may be composed of a light-emitting sensor that generates light and a light-receiving sensor that receives reflected light. The first light sensor (712a) may be installed at a first position (P1) when viewed from above. The first light sensor (712a) may have a light-emitting sensor that irradiates light to a first reflector (712b) and a light-receiving sensor that receives light reflected from the first reflector (712b). In this way, the first light sensor (712a) does not generate a first detection signal when it receives light reflected from the first reflector (712b), but generates a first detection signal when the substrate (W) and the hand (53a) of the second transport robot (53) pass the first position (P1) and do not receive light from the first reflector (712b).

[0083] The first reflector (712b) is positioned below the path along which the substrate (W) is returned and is positioned opposite the first light sensor (712a). The first reflector (712b) can be installed at a first position (P1) when viewed from above. In the present embodiment, the first reflector (712b) is exemplified as being positioned at the first position (P1) and below the first light sensor (712a). Here, the first reflector (712b) and the first light sensor (712a) may be positioned with their positions swapped while being positioned at the first position (P1).

[0084] The second sensor (712) is installed at a second position (P2) when viewed from above, and can generate a detection signal when the substrate (W) passes the second position (P2). In this case, the second position (P2) can be formed at a position closer to the center of the substrate (W) than the first position (P1). That is, since the second sensor (712) is positioned closer to the center of the substrate (W) than the first sensor (711), the point in time at which it detects the substrate (W) is formed earlier than the point in time at which the first sensor (711) detects the substrate (W). In addition, the point in time at which the second sensor (712) finishes detecting the substrate (W) is formed later than the point in time at which the first sensor (711) detects the substrate (W). Accordingly, the operation unit (730) described below can detect warping and breakage of the substrate (W) in the front, back, left, and right directions by using the difference between the point in time when the second sensor (712) detects the substrate (W) and the point in time when the second sensor (712) detects the substrate (W), and by using the difference between the point in time when the second sensor (712) finishes detecting the substrate (W) and the point in time when the first sensor (711) finishes detecting the substrate (W).

[0085] As an example of such a second sensor (712), the second sensor (712) may include a second light sensor (712a) and a second reflector (712b).

[0086] The second light sensor (712a) may be composed of a light-emitting sensor that generates light and a light-receiving sensor that receives reflected light. The second light sensor (712a) may be installed at a second position (P2) when viewed from above. The second light sensor (712a) may have a light-emitting sensor irradiate light to a second reflector (712b), and a light-receiving sensor receive light reflected from the second reflector (712b). When the second light sensor (712a) receives light reflected from the second reflector (712b), it generates a second detection signal. In this case, the second light sensor (712a) may be installed in an upper space of a path along which a substrate (W) is conveyed, while being spaced apart from the first light sensor (712a). In this way, the second light sensor (712a) does not generate a second detection signal when it receives light reflected from the second reflector (712b), but generates a second detection signal when the substrate (W) and the hand (53a) of the second transport robot (53) pass through the second position (P2) and do not receive light from the second reflector (712b).

[0087] The second reflector (712b) is positioned below the path along which the substrate (W) is returned and is positioned opposite the second light sensor (712a). The second reflector (712b) can be installed at a second position (P2) when viewed from above. In the present embodiment, the second reflector (712b) is exemplified as being positioned at the second position (P2) and below the second light sensor (712a). Of course, the second reflector (712b) and the second light sensor (712a) may be positioned with their positions swapped while being positioned at the second position (P2).

[0088] The first sensor (711) and the second sensor (712) are installed at the first position (P1) and the second position (P2) of the path along which the substrate (W) and the hand (53a) of the second transport robot (53) are transferred while being spaced apart from each other, and generate the first detection signal and the second detection signal, respectively, when the substrate (W) passes through the first position (P1) and the second position (P2).

[0089] In this case, the first sensor (711) can detect only the substrate (W) at the first position (P1), and the second sensor (712) can detect not only the substrate (W) but also the hand (53a) of the second transfer robot (53) at the second position (P2). At this time, the position of the hand (53a) detected by the second sensor (712) may be the end effect (53a1) corresponding to the end point of the hand (53a). Accordingly, the calculation unit (730) described below can detect warping and breakage of the substrate (W) based on the end effect (53a1) of the hand (53a) detected by the second sensor (712).

[0090] Meanwhile, the sensor unit (710) in the present invention is not limited to the above-described example, and the sensor unit (710) can be modified and implemented as any sensor that is installed at the first position (P1) and the second position (P2) of the path along which the substrate (W) is returned and can detect the case where the substrate (W) passes through the first position (P1) and the second position (P2).

[0091] The support (720) is installed on the path for sending the substrate (W) and provides an area where the sensor (710) is coupled. In this case, the support (720) can be installed at a first position (P1) and a second position (P2). In one example, the support (720) can include an upper support (721) to which the first light sensor (712a) and the second light sensor (712a) are coupled, and a lower support (722) to which the first reflector (712b) and the second reflector (712b) are coupled. Since the support (720) is installed when the substrate (W) is returned, it can be installed when the hand (53a) of the second transport robot (53) moves its arm for transport, or it can also be installed at the entrance and exit of the chamber.

[0092] The operation unit (730) may be configured as a device that, in conjunction with the sensor unit (710), converts a detection signal output from the sensor unit (710) into digital data, records the converted digital data, and analyzes the recorded digital data using a preset algorithm. For example, the operation unit (730) may be configured as a signal processing unit or a signal processing computer that is programmable and has a signal processing function.

[0093] This operation unit (730) receives a detection signal generated while the substrate (W) passes through the first position (P1) and the second position (P2) when the hand (53a) of the second transport robot (53) and the substrate (W) pass through the first position (P1) and the second position (P2) from the sensor unit (710), calculates the time during which the detection signal is input as the detection time, and compares and determines whether the calculated detection time matches the stored reference time. In this case, if the detection time is within a certain error range of the reference time, the operation unit (730) determines that the substrate (W) is correctly positioned on the hand (53a) of the second transport robot (53) and determines that the substrate (W) is not broken. In addition, if the detection time is outside a certain error range of the reference time, the operation unit (730) determines that the substrate (W) is not properly positioned on the hand (53a) of the second transfer robot (53) or that the substrate (W) is broken.

[0094] For example, the comparative judgment process of the operation unit (730) will be explained in more detail.

[0095] Accordingly, looking at FIGS. 5 and 6, first, FIG. 5 is a plan view schematically illustrating the reference time taken when the hand and substrate of the second transport robot pass through the first sensor and the second sensor, and FIG. 6 is a plan view schematically illustrating the detection time taken when the hand and substrate of the second transport robot pass through the first sensor and the second sensor.

[0096] First, as illustrated in FIG. 6, when the hand (53a) of the second transport robot (53) and the substrate (W) pass through the first position (P1) and the second position (P2) while facing the second direction (12), the calculation unit (730) calculates the first detection time (T1) using the first detection signal input from the first sensor (711) and calculates the second detection time (T2) using the second detection signal input from the second sensor (712). At this time, since the second sensor (712) is located closer to the center of the substrate (W) than the first sensor (711), the second detection time (T2) is formed as a value greater than the first detection time (T1). Accordingly, the second detection time (T2) is calculated before the first detection time (T1), and at this time, the calculation unit (730) calculates the start point interval time (T3) for the time from the start time at which the second detection time (T2) is calculated to the start time at which the first detection time (T1) is calculated. In addition, the calculation unit (730) calculates the end point interval time (T4) for the time from the end time at which the first detection time (T1) ends to the end time at which the second detection time (T2) ends.

[0097] In this way, the calculation unit (730) calculates the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) when the hand (53a) of the second transport robot (53) and the substrate (W) pass the first position (P1) and the second position (P2). In this case, the hand (53a) of the second transport robot (53) moves along a straight path to transport the substrate (W). At this time, as illustrated in FIG. 5, the calculation unit (730) stores the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4), and the corresponding second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4), respectively. Here, the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) are times for reference values ​​pre-stored in the calculation unit (730), and correspond to values ​​set in advance through experiments based on the transfer speed at which the second transfer robot (53) transfers the substrate (W). In this case, the second reference time (ST2) is set as a reference time for how far the substrate (W) is from the hand (53a) by detecting not only the substrate (W) but also the end effect (53a1). These second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) correspond to values ​​in which the center of the substrate (W) mounted on the hand (53a) of the second transfer robot (53) matches the center of the process when the second transfer robot (53) transfers the substrate (W). In this case, the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) can be set differently depending on the transfer speed of the second transfer robot (53), the size of the substrate (W), and the first position (P1) and second position (P2) of the sensor units (710).

[0098] The calculation unit (730) in which the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) are stored compares and calculates the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) calculated from the time when the hand (53a) of the second transfer robot (53) and the substrate (W) pass the first position (P1) and the second position (P2) until the time when the passage ends with the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4), respectively.

[0099] Accordingly, the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the end point interval time (T4) are each within a certain error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the end point interval reference time (ST4) or are outside the certain error range. In this case, if the certain error range is outside the certain error range, the calculation unit (730) determines that the substrate (W) is not positioned correctly on the hand (53a) of the second transport robot (53) or determines that the substrate (W) is broken. Here, the calculation unit (730) can determine that the substrate (W) is broken if an error exceeding the certain error range occurs.

[0100] Here, in order to explain in more detail the case where the substrate (W) is not positioned correctly on the hand (53a) of the second transfer robot (53), reference will be made to FIGS. 7 to 10. In each of FIGS. 7 to 10, for comparison, the sizes of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) and the sizes of the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are shown as arrows.

[0101] First, referring to Fig. 7, Fig. 7 is a plan view of a substrate mounted on the hand of a second transport robot sliding a certain distance to the right from its original position.

[0102] As illustrated in FIG. 7, the substrate (W) can slide to the right from the fixed position when positioned on the hand (53a) of the second transport robot (53). Here, the fixed position of the substrate (W) is a position preset in the operation unit (730), which corresponds to a position where the center of the substrate (W) matches the process center of the support unit (230) when the substrate (W) is brought into the process chamber (60) by the hand (53a) of the second transport robot (53). Accordingly, the operation unit (730) sets the second reference time (ST2), the first reference time (ST1), the start point interval reference time (ST3), and the end point interval reference time (ST4) corresponding to the fixed position, as illustrated in FIGS. 6 and 7.

[0103] In this way, when the substrate (W) is not in the correct position and slides to the right of the hand (53a) of the second transport robot (53), the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are within a certain error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4), respectively, or are outside the certain error range. At this time, the first detection time (T1) is calculated to be smaller than the certain error range of the first reference time (ST1), which is the correct position, and conversely, the starting point interval time (T3) and the ending point interval time (T4) are calculated to be larger than the starting point interval reference time (ST3) and the ending point interval reference time (ST4), which are the correct positions, respectively. Accordingly, the operation unit (730) can detect that the substrate (W) is twisted by determining that the substrate (W) has slid to the right when the operation result as shown in Fig. 7 appears.

[0104] Next, referring to FIG. 8, FIG. 8 is a plan view of a substrate mounted on the hand of the second transport robot sliding a certain distance to the left from its original position.

[0105] As illustrated in FIG. 8, when the substrate (W) slides to the left on the hand (53a) of the second transfer robot (53), the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are within a predetermined error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4), respectively, or are outside the predetermined error range. In this way, when the substrate (W) slides to the left from the fixed position, the first detection time (T1) is calculated to be greater than the first reference time (ST1), and the starting point interval time (T3) and the ending point interval time (T4) are each calculated to be less than the starting point interval reference time (ST3) and the ending point interval reference time (ST4), respectively. Accordingly, the operation unit (730) can determine whether the substrate (W) is misaligned by determining that the substrate (W) has slid to the right from the original position when the operation result as shown in FIG. 8 appears.

[0106] Next, referring to FIG. 9, FIG. 9 is a plan view of a substrate mounted on the hand of a second transport robot sliding forward a certain distance from its original position.

[0107] As illustrated in FIG. 9, when the substrate (W) is slid forward from the hand (53a) of the second transport robot (53), the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are each within a predetermined error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) or are outside the predetermined error range. In this way, when the substrate (W) is slid forward from the fixed position, the distance from the substrate (W) to the end effect (53a1) of the hand (53a) increases, so the second detection time (T2) is calculated to be greater than the second reference time (ST2), and the ending point interval time (T4) is calculated to be significantly greater than the ending point interval reference time (ST4). Accordingly, the operation unit (730) can detect the distortion of the substrate (W) by determining that the substrate (W) has slid forward when the operation result as shown in Fig. 9 appears.

[0108] Next, referring to FIG. 10, FIG. 10 is a plan view of a substrate placed on the hand of a second transport robot sliding a certain distance backward from its original position.

[0109] As illustrated in FIG. 10, when the substrate (W) is slid backward from the hand (53a) of the second transport robot (53), the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are each within a predetermined error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) or are outside the predetermined error range. In this way, when the substrate (W) is slid backward from the fixed position, the time from the substrate (W) to the end effect (53a1) of the hand (53a) is very short, so the second detection time (T2) is calculated to be less than the second reference time (ST2), and the first detection time (T1) is calculated to be much less than the second reference time (ST1). Accordingly, the operation unit (730) can detect the distortion of the substrate (W) by determining that the substrate (W) has slid backward when the operation result as shown in Fig. 10 appears.

[0110] Next, referring to FIGS. 11 and 12, the detection of breakage of the substrate by the operation unit will be described.

[0111] Figure 11 is a plan view of the substrate mounted on the hand of the second transfer robot in a broken state.

[0112] As illustrated in FIG. 11, when the hand (53a) of the second transport robot (53) and the substrate (W) pass the first position (P1) and the second position (P2) while the front side of the substrate (W) is broken, the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are each within a predetermined error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) or are outside the predetermined error range, and determines whether the upper limit threshold or the lower limit threshold is greater than the predetermined error range.

[0113] In this case, since the substrate (W) illustrated in FIG. 11 is in a state where a break occurs toward the second direction (12), the second detection time (T2) is significantly outside a certain error range of the second reference time (ST2) and is less than the lower limit threshold, so the calculation unit (730) can determine that the substrate (W) is broken. For example, when the error range of the second reference time (ST2) compared to the second detection time (T2) is 0.01% of the diameter of the substrate (W), the substrate (W) can be determined to be broken when it exceeds the error range of 0.01% and is outside the lower limit threshold, such as 10%.

[0114] Referring further to Fig. 12 to examine another example, Fig. 12 is a plan view of a state in which the substrate is mounted on the hand of the second transport robot in a broken state.

[0115] The substrate (W) illustrated in Fig. 12 is in a state where a break occurs toward the first direction (11). As illustrated in Fig. 12, when the hand (53a) of the second transport robot (53) and the substrate (W) pass the first position (P1) and the second position (P2) while the substrate (W) is broken, the calculation unit (730) determines whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are each within a predetermined error range of the second reference time (ST2), the first reference time (ST1), the starting point interval reference time (ST3), and the ending point interval reference time (ST4) or are outside the predetermined error range, and determines whether an upper limit threshold or a lower limit threshold greater than the predetermined error range is exceeded.

[0116] In this case, since the substrate (W) illustrated in FIG. 12 is in a state where a break has occurred toward the first direction (11), the first detection time (T1) is not detected or is detected for only a very short time, and thus is detected below the lower threshold, the operation unit (730) can determine that the substrate (W) is in a broken state.

[0117] In this way, the substrate processing device according to one embodiment of the present invention can detect a case where the center of the substrate (W) is misaligned with the center of the process when the transfer robot transfers the substrate (W), and can detect a state where the substrate (W) is broken.

[0118]

[0119] Below, a substrate processing method of the substrate processing device described above will be described.

[0120] Figure 13 is a flowchart of a substrate processing method according to one embodiment of the present invention.

[0121] Referring further to FIG. 13, a substrate processing method according to one embodiment of the present invention may include a substrate mounting step (S10), a substrate transfer step (S20), and a substrate detection step (S30).

[0122] In the substrate mounting step (S10), the transfer robot mounts the substrate (W) on the hand (53a) in order to insert the substrate (W) into the process chamber. For example, in the substrate mounting step (S10), the second transfer robot (53) in the transfer chamber (50) can receive the substrate (W) from the load lock chamber (40) to the hand (53a) and mount the substrate (W) on the hand (53a).

[0123] In the substrate transfer step (S20), the transfer robot places the substrate (W) mounted on the hand (53a) into the process chamber, and the substrate (W) passes through the first position (P1) and the second position (P2) where the sensor unit (710) is located. For example, in the substrate transfer step (S20), as illustrated in FIGS. 5 to 12, the second transfer robot (53) may transfer the substrate (W) in the second direction (12) toward the process chamber (60) while mounting the substrate (W) on the hand (53a), and the substrate (W) may pass through the first position (P1) and the second position (P2).

[0124] In the substrate detection step (S30), when the second transport robot (53) passes the substrate (W) to the first position (P1) and the second position (P2), the detection signal generated while the substrate (W) passes through the first position (P1) and the second position (P2) is input from the sensor unit (710), the time during which the detection signal is input is calculated as the detection time, and whether the calculated detection time matches the stored reference time is compared and determined. In this case, if the detection time is within a certain error range of the reference time, the calculation unit (730) determines that the substrate (W) is correctly positioned on the hand (53a) of the second transport robot (53) and determines that the substrate (W) is not broken. In addition, if the detection time is outside a certain error range of the reference time, the operation unit (730) determines that the substrate (W) is not properly positioned on the hand (53a) of the second transfer robot (53) or that the substrate (W) is broken. Specifically, in the substrate detection step (S30), as described with reference to FIGS. 5 to 12, the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are compared and calculated with the second reference time (ST2), the first reference time (ST1), the starting point interval time (ST3), and the ending point interval time (ST4), respectively, and it is determined whether the second detection time (T2), the first detection time (T1), the starting point interval time (T3), and the ending point interval time (T4) are within a certain error range of the second reference time (ST2), the first reference time (ST1), the starting point interval time (ST3), and the ending point interval time (ST4), respectively, or are outside the certain error range. Accordingly, the calculation unit (730) can detect whether the center of the substrate (W) is deviated from the process center and whether the substrate (W) is broken, as described above.

[0125] In this way, the substrate processing device according to one embodiment of the present invention can detect a case where the center of the substrate (W) is misaligned with the center of the process when the transfer robot transfers the substrate (W), and can detect a state where the substrate (W) is broken.

[0126] On the other hand, referring further to Fig. 14, Fig. 14 is a plan view of Fig. 5 with a third sensor further installed.

[0127] Referring further to FIG. 14, a substrate processing apparatus according to another embodiment of the present invention may further include a third sensor (713).

[0128] The third sensor (713) may be placed at a third position (P3). In this case, the third position (P3) may be any position facing the first position (P1) with the second position (P2) interposed therebetween. The third sensor (713) may be formed by including a third light sensor and a second reflector. That is, the third sensor (713) may be formed with the same configuration as the first sensor (711) and the second sensor (712), but the position may be placed at the third position (P3).

[0129] According to another embodiment of the present invention, a substrate processing device further including a third sensor (713) detects the substrate (W) at a third position (P3) to generate a third detection signal, and accordingly, the calculation unit (730) can calculate the third detection time (T5) while the substrate (W) passes the third position (P3). At this time, the calculation unit (730) stores a third reference time (not shown) for the third position (P3), compares the third reference time with the third detection time (T5), and determines whether the substrate (W) is warped or whether the substrate (W) is broken when the third detection time (T5) is out of a certain error range of the third reference time. In particular, the third sensor (713) can detect a breakage state of the substrate (W) in the left and right directions together with the first sensor (711). In this case, when the operation unit (730) compares the third detection time (T5) and the third reference time, it goes without saying that it can further compare the start point interval reference time (ST3) and the end point interval reference time (ST4), which are the difference values ​​for the start and end points of the second detection time (T2) and the third detection time (T5), as in the comparison operation at the first position (P1) described above.

[0130] In this way, the substrate processing device according to another embodiment of the present invention can more accurately determine the warping and breakage status of the substrate (W) through the third sensor (713).

[0131] Furthermore, it goes without saying that the present invention can be configured by adding a fourth sensor (not shown) and a fifth sensor (not shown) as needed, in addition to the third sensor (713).

[0132] In addition, the present invention has been exemplified as detecting warping and breakage of a substrate (W) when a transfer robot transfers the substrate (W) between a load lock chamber (40), a transfer chamber (50), and a process chamber (60), but the present invention can be modified and configured for all devices that transfer the substrate (W) in order to process the substrate (W).

[0133] That is, although the present invention has been described with specific details such as specific components and limited examples and drawings, these are provided only to help a more general understanding of the present invention, and the present invention is not limited to the above examples, and those with ordinary knowledge in the field to which the present invention pertains can make various modifications and variations from this description.

[0134] Therefore, the idea of ​​the present invention should not be limited to the described embodiments, and all things that are equivalent or equivalent to the claims described below as well as the claims are considered to fall within the scope of the idea of ​​the present invention.

Claims

1. In a substrate processing device for processing a substrate, Process chamber for handling the process; A transfer robot that transfers the substrate to the above process chamber; and An inspection unit installed on the path along which the above-mentioned transfer robot transfers the substrate; The above inspection unit is a substrate processing device that measures the detection time at which the substrate is detected when the transfer robot returns the substrate, and detects a case where the detection time is outside the error range of a pre-stored reference time.

2. In paragraph 1, The above inspection unit, A sensor unit that is placed at least in one of the upper and lower portions of the path through which the substrate is returned and generates a detection signal while the substrate passes through; and A substrate processing device, comprising: a calculation unit that receives the detection signal in conjunction with the sensor unit, calculates the detection time while the detection signal is being input, and detects a case where the calculated detection time falls outside the error range of the reference time.

3. In paragraph 2, The above sensor part A first sensor installed at a first position among the upper or lower portions of the path along which the substrate is returned, and detecting the substrate when it passes the first position; and A second sensor is installed at a second position among the upper or lower positions of the path along which the substrate is returned, and detects the substrate when it passes through the second position; A substrate processing device, wherein the second position is positioned closer to the center of the substrate than the first position.

4. In paragraph 3, The above sensor part Further comprising a third sensor disposed at a third position on the path along which the substrate is returned; A substrate processing device, wherein the third position is a position in a direction opposite to the first position with respect to the second position.

5. In paragraph 3, A substrate processing device, wherein the second sensor is positioned at a position to detect the substrate before the first sensor detects the substrate.

6. In paragraph 5, A substrate processing device, wherein the second sensor is positioned at a position to detect the substrate longer than the time at which the first sensor finishes detecting the substrate.

7. In paragraph 3, A substrate processing device in which the second sensor detects the substrate passing through the second position and the end effect of the transfer robot.

8. In paragraph 3, The above operation unit, In conjunction with the first sensor, a first detection signal is input and a first detection time is calculated while the substrate passes the first position. In conjunction with the second sensor, a second detection signal is input and a second detection time is calculated while the substrate passes the second position. A substrate processing device that compares the second detection time with a pre-stored second reference time, compares the first detection time with a pre-stored first reference time, and compares and determines whether the second detection time is outside a certain error range of the second reference time and whether the first detection time is outside a certain error range of the first reference time.

9. In paragraph 8, The above operation unit Calculate the starting point interval time for the time between the start point of the calculation of the above second detection time and the start point of the calculation of the above first detection time, Calculate the end point interval time for the time from the end point of the first detection time to the end point of the second detection time, A substrate processing device that compares the above-mentioned starting point interval time with a pre-stored starting point interval reference time, compares the above-mentioned ending point interval time with a pre-stored ending point interval reference time, and compares and determines whether the above-mentioned starting point interval time is outside a certain error range of the starting point interval reference time and whether the above-mentioned ending point interval time is outside a certain error range of the ending point interval reference time.

10. In paragraph 3, The above first sensor, A first light sensor disposed at the first position, generating light and generating a first detection signal when receiving reflected light; and A first reflector is disposed at the first position and is installed above or below the first light sensor, and reflects light generated by the first light sensor to the first light sensor; The above second sensor, A second light sensor disposed at the second position, generating light and generating a second detection signal when receiving reflected light; and A substrate processing device comprising: a second reflector disposed at the second position and spaced apart from the second light sensor above or below, and reflecting light generated by the second light sensor to the second light sensor; 11. In a processing method in which a transfer robot transfers a substrate to a process chamber, A substrate processing method in which a transfer robot passes a substrate through a position where an inspection unit can detect the substrate while the substrate is mounted on a hand, and the inspection unit measures the detection time at which the substrate is detected and detects a case where the detection time is outside the error range of a pre-stored reference time.

12. In paragraph 11, The above inspection unit Detecting the substrate when passing through each of the first and second positions, The detection time is measured at each of the second position and the first position, and a case in which the detection time falls outside the error range of each of the previously stored reference times is detected. A substrate processing method, wherein the second position is positioned closer to the center of the substrate than the first position.

13. In paragraph 12, A substrate processing method, wherein the time at which the inspection unit detects the substrate at the second position is earlier than the time at which the inspection unit detects the substrate at the first position.

14. In paragraph 12, A substrate processing method, wherein the time at which the inspection unit finishes detecting the substrate at the second position is later than the time at which the inspection unit finishes detecting the substrate at the first position.

15. In paragraph 12, A substrate processing method, wherein the inspection unit detects the end effect of the substrate and the transfer robot at the second position.

16. In paragraph 12, The above inspection unit Compute the first detection time while the above substrate passes the first position, Compute the second detection time while the above substrate passes the second position, A substrate processing method comprising: comparing the second detection time with a pre-stored second reference time, comparing the first detection time with a pre-stored first reference time, and comparing and determining whether the second detection time is outside a certain error range of the second reference time and whether the first detection time is outside a certain error range of the first reference time.

17. In paragraph 16, The above inspection unit, Calculate the starting point interval time for the time between the start point of the calculation of the above second detection time and the start point of the calculation of the above first detection time, Calculate the end point interval time for the time from the end point of the first detection time to the end point of the second detection time, A substrate processing method comprising: comparing the above-mentioned starting point interval time with a pre-stored starting point interval reference time, comparing the above-mentioned ending point interval time with a pre-stored ending point interval reference time, and comparing and determining whether the above-mentioned starting point interval time is outside a certain error range of the starting point interval reference time and whether the above-mentioned ending point interval time is outside a certain error range of the ending point interval reference time.

18. In paragraph 16, The above inspection unit Further determine whether the upper and lower thresholds are greater than the above-mentioned error range, If the above specified error range is exceeded, the substrate is judged to be off-center. A substrate processing method, wherein the substrate is judged to be broken when the upper limit threshold or the lower limit threshold is exceeded.

19. In paragraph 12, The above inspection unit A substrate processing method, wherein light is generated above or below a path along which the substrate is returned, and the substrate is determined to be positioned if no reflected light exists, and the substrate is determined not to be positioned if reflected light exists.

20. In paragraph 12, The above inspection unit Detecting when the above substrate passes the third position, A substrate processing method, wherein the third position is a position in a direction opposite to the first position with respect to the second position.

Images