Spiral coil inductor, RF filter used for electrostatic chuck heating device, and spiral coil manufacturing device

Abstract

One embodiment provides a spiral coil inductor comprising a plurality of first spiral layers and a plurality of second spiral layers which are alternately arranged, wherein the plurality of first spiral layers are formed by a wire forming a series of curves that start from the inside with respect to a central axis and continuously extend to the outside, and the plurality of second spiral layers, connected to the first spiral layers, are formed by the wire forming a series of curves that continuously decrease from the outside to the inside.

Description

Spiral coil inductors, RF filters used in electrostatic chuck heating devices, and spiral coil manufacturing equipment

[0001] The present invention relates to a spiral coil inductor, a device including the same, and a device for manufacturing the same.

[0002] An electrostatic chuck (ESC) is a device used to secure workpieces, such as wafers, in semiconductor manufacturing processes. An electrostatic chuck plays a crucial role in the semiconductor manufacturing process, electrically securing workpieces, such as wafers.

[0003] Electrostatic chucks use electrical force to secure a workpiece. They generate an electric field by applying a high voltage at the point of contact with the workpiece. This electric field then generates a force that attracts the workpiece.

[0004] An electrostatic chuck device can induce a charge of a specific polarity in a process object through an electric field, and the induced charge causes a force of attraction between the process object and the electrostatic chuck device, and the process object can be fixed to the electrostatic chuck device by this force.

[0005] While processes such as etching, deposition, and exposure are being performed, the electrostatic chuck device can continuously supply an electric field to the process object so that the process object can be fixed. Then, when the process is completed, the electrostatic chuck device can terminate the supply of the electric field.

[0006] The process is performed on the process object while the electrostatic chuck device holds the process object in place. During this process, heat can be supplied to the process object to further increase process efficiency.

[0007] In processes where the process object must be heated to cause a physical or chemical reaction, a heater may be built into the electrostatic chuck.

[0008] Heaters can maintain a constant temperature of a process object or heat the process object to a desired temperature. For example, temperature control is crucial in deposition processes such as CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition), or processes requiring rapid temperature increases such as RTP (Rapid Thermal Processing). Heaters can control temperature by directly supplying heat to the underside of the process object.

[0009] Heaters can heat a process object using various methods, including electrical resistance, conduction, and radiation. For example, electrical resistance is the most commonly used method, heating the process object through heat generated by resistance generated by passing an electric current through the heater material.

[0010] In this way, the heater can generate heat by supplying power to a heating wire having resistance, and at this time, the power can be stabilized by placing a filter on the wiring supplying the power.

[0011] A filter connected to a heater can perform several functions. First, it can prevent electrical noise from being transmitted to the heater, and conversely, it can prevent noise generated by the heater from being transmitted to the process equipment. Another function, a filter containing an inductor and capacitor, can reduce or mitigate power supply fluctuations, thereby stabilizing heater performance and enabling more accurate temperature control of the process object. To achieve these functional benefits, a filter is essential for heaters.

[0012] Meanwhile, the inductors included in filters require high inductance. To achieve this, designers have traditionally used large inductors. However, these large inductors take up a lot of space, resulting in inefficiency.

[0013] Against this backdrop, the purpose of the present invention is, on one hand, to provide an inductor with high inductance while limiting its volume. On the other hand, to provide a filter with high filtering efficiency while having a small volume for use in an electrostatic chuck heating device. Still further, to provide a technique for manufacturing a coil with a small volume and high inductance using a simple device.

[0014] In order to achieve the above-described purpose, one embodiment provides a spiral coil inductor, in which a first spiral layer in which a series of curves formed by wires start from the inside with respect to a central axis and continue to expand and advance outward, and a second spiral layer in which a series of curves formed by wires continue to decrease and advance from the outside to the inside while being connected to the first spiral layer are alternately arranged in a plurality of ways.

[0015] The above wire may have a shape in which the thickness in the direction of the central axis is narrower than the width formed in the direction perpendicular to the central axis.

[0016] The above wire may be viewed as a plate-shaped shape having a width in a direction perpendicular to the central axis.

[0017] The first spiral layer and the second spiral layer have an internal space having a cross-sectional area greater than a certain value near the central axis, and air can be located in the internal space.

[0018] Another embodiment provides a filter for use in an electrostatic chuck heating device, wherein the filter uses an inductor disposed in a wire connected to a heater that supplies power to a heating wire disposed inside a dielectric layer surrounding an ESC (electro-static chuck) electrode, and the inductor is configured as a spiral coil in which a series of curves formed by the wire expand from the inside to the outside or contract from the outside to the inside based on a central axis.

[0019] The above filter can function as a CM (common mode) filter that suppresses common mode noise of the above wiring.

[0020] The above wire may have a shape in which the thickness in the direction of the central axis is narrower than the width formed in the direction perpendicular to the central axis.

[0021] The above inductor may be an air core inductor.

[0022] The above spiral-shaped coil may have a shape in which the plate-shaped wire forms three concentric circles when viewed from above the central axis.

[0023] Another embodiment provides a spiral coil manufacturing device, comprising: a wire discharger that discharges a thin, long plate-shaped wire in a first direction through an outlet formed in a body, and the body reciprocates in a second direction perpendicular to the first direction; and a curve forming device that has a curved surface formed at a point extending from the outlet in the first direction, and bends the wire discharged from the outlet into a curved shape by the curved surface, and increases and decreases the radius of the curve while reciprocating in the first direction.

[0024] The above spiral coil manufacturing device may further include a cutter that cuts the wire at regular intervals.

[0025] A spiral coil inductor is formed by cutting, and the spiral coil inductor may be formed by alternately arranging a first spiral layer in which a series of curves formed by the wire start from the inside with respect to the central axis and continue to expand and advance outward, and a second spiral layer in which a series of curves formed by the wire continue to decrease and advance from the outside to the inside while being connected to the first spiral layer.

[0026] The first spiral layer and the second spiral layer can be arranged alternately according to the second direction reciprocating motion of the wire discharger.

[0027] The above spiral coil inductor can be included in a DM (differential mode) filter.

[0028] As described above, according to the present embodiment, an inductor having high inductance while limiting volume can be provided. Furthermore, according to the present embodiment, a filter having a small volume and high filtering efficiency can be provided as a filter used in an electrostatic chuck heating device. Furthermore, according to the present embodiment, a coil having a small volume and high inductance can be manufactured using a simple device.

[0029] Figure 1 is a configuration diagram of a process device according to one embodiment.

[0030] Figure 2 is a configuration diagram of a filter according to one embodiment.

[0031] Figure 3 is a configuration diagram of a low-pass filter according to one embodiment.

[0032] Figure 4 is a top view image of a typical air core inductor.

[0033] Figure 5 is a side image of a typical air core inductor.

[0034] Figure 6 is a top view of a spiral coil inductor according to one embodiment.

[0035] Figure 7 is a side view of a spiral coil inductor according to one embodiment.

[0036] Fig. 8 is a top view image of a prototype of a spiral coil inductor according to one embodiment.

[0037] Fig. 9 is a side image of a prototype of a spiral coil inductor according to one embodiment.

[0038] Fig. 10 is a configuration diagram of a spiral coil manufacturing device according to one embodiment.

[0039] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When designating components in each drawing, it should be noted that, where possible, identical components will be given the same reference numbers, even if they appear in different drawings. Furthermore, when describing the present invention, detailed descriptions of known related structures or functions will be omitted if they are deemed to obscure the gist of the present invention.

[0040] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of the present invention. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by the terms. When it is described that a component is "connected," "coupled," or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, but another component may also be "connected," "coupled," or "connected" between each component.

[0041] Figure 1 is a configuration diagram of a process device according to one embodiment.

[0042] Referring to FIG. 1, the process device (100) may include a process chamber (20), an ESC electrode (22), an electrostatic chuck voltage supply device (120), and a heater (112).

[0043] A process object (10) can be placed in the process chamber (20), and a specific process can be performed on the process object (10).

[0044] For example, an etching process can be performed in the process chamber (20). The etching process is one of the semiconductor manufacturing processes, and is a process of creating a desired pattern by removing a portion of a process target through a specific reaction. It is mainly used to create circuit patterns in semiconductor manufacturing. There are various known etching processes, and wet etching, dry etching, and RIE (Reactive Ion Etching) are representative processes. Wet etching is a method of etching using a liquid etchant, and mainly etching is done using an acidic etchant such as ferric chloride, hydrochloric acid, or a chemical acid. Dry etching is a method of etching using gas or plasma, and has the advantages of high precision and depth control, and can preserve the characteristics of the semiconductor material because it does not use an acidic etchant. RIE is a type of dry etching that induces a reaction using an ionized gas and an electric field, and is known to have superior accuracy and controllability compared to dry etching.

[0045] In addition, a deposition process, an exposure process, etc. may be performed in the process chamber (20). However, for convenience of explanation, the following description assumes that a process utilizing plasma, such as dry etching, is performed in the process chamber (20). However, the present invention is not limited to these examples.

[0046] An anode electrode (21) may be placed on one side of the process chamber (20), for example, the upper side, and a cathode electrode (24) may be placed on the other side, for example, the lower side.

[0047] An RF power generator (32, RFG: Radio Frequency Generator), an RF matcher (34, RFM: Radio Frequency Matcher), etc. can be electrically connected to the cathode electrode (24).

[0048] The RF power generator (32) can output high-frequency and / or high-voltage RF power, and the RF matcher (34) is a device that matches impedance so that the maximum RF power can be supplied to the process chamber (20) with high efficiency.

[0049] An RF power generator (32) is a device used to generate plasma, and can be found in PECVD (Plasma Enhanced Chemical Vapor Deposition), RIE (Reactive Ion Etching), and other plasma processing processes. The RF power generator (32) generates a high-frequency electrical signal. This signal is mainly used at 13.56 MHz, but frequencies such as 27.12 MHz and 40.68 MHz are also used. An RF electrode is installed inside the process chamber. The RF power transmitted from the RF power generator (32) is transmitted to the gas in the process chamber through this electrode. The RF power generates electrons and ions by colliding with the gas molecules in the chamber. In this process, plasma is generated. Plasma is a hot gaseous state composed of electrons and ions, and can activate the surface of a material or promote various chemical reactions.

[0050] When RF power output from an RF power generator (32) is supplied to the cathode electrode (24), plasma can be formed in the space between the cathode electrode (24) and the anode electrode (21). At this time, a process gas can be supplied to the process chamber (20) to enhance the formation of plasma, and the air pressure of the process chamber (20) can be controlled.

[0051] A dielectric layer (23) may be formed on one side of the cathode electrode (24), for example, the upper side. The dielectric layer (23) may electrically isolate the cathode electrode (24) and the process object (10) and insulate the cathode electrode (24).

[0052] A process object (10) - for example, a wafer, glass, circuit board, etc. - can be placed on one side of the dielectric layer (23) - for example, the upper side.

[0053] The process object (10) can have its placement position—for example, its up-down position—adjusted by a lifter (25). The lifter (25) can support the process object (10) via a lift pin (26), and the placement position of the process object (10) can be changed by adjusting the length of the lift pin (26).

[0054] Meanwhile, in order to fix the process object (10), an ESC electrode (22) may be placed inside the dielectric layer (23).

[0055] A chuck voltage can be supplied to the ESC electrode (22). The chuck voltage is a high voltage and can have a specific polarity—for example, a positive polarity. In addition, depending on this chuck voltage, charges of a specific polarity can be concentratedly formed on the ESC electrode (22).

[0056] When a charge of a specific polarity—for example, a positive polarity—is formed on the ESC electrode (22), a charge of the opposite polarity—for example, a negative polarity—may be induced and formed on a process object (10) placed nearby. In addition, an attractive force may be formed between the ESC electrode (22) and the process object (10) by the electromagnetic force of these charges.

[0057] The electrostatic chuck voltage supply device (120) is electrically connected to the ESC electrode (22) and can supply the chuck voltage to the ESC electrode (22).

[0058] The electrostatic chuck voltage supply device (120) can supply an output voltage to the ESC electrode (22) for fixing the process object (10). In addition, the electrostatic chuck voltage supply device (120) can adjust the level of the output voltage according to a control signal. The control signal can be a digital signal or an analog signal.

[0059] The electrostatic chuck voltage supply device (120) can generate a high voltage of several hundred or more than a thousand volts. In addition, the electrostatic chuck voltage supply device (120) can output this high voltage to the ESC electrode (22).

[0060] A low-pass filter (130) may be placed between the output terminal of the electrostatic chuck voltage supply device (120) and the ESC electrode (22).

[0061] The low-pass filter (130) removes high-frequency noise generated from the electrostatic chuck voltage supply device (120) and minimizes noise generated between the process object (10) and the ESC electrode (22) during the process, thereby maintaining the stability and consistency of the voltage formed at the ESC electrode (22).

[0062] The electrostatic chuck voltage supply device (120) can divide time into a process time period and a dechuck time period.

[0063] The electrostatic chuck voltage supply device (120) can supply a chuck voltage to the ESC electrode (22) during the process time period. Here, the chuck voltage refers to a voltage that enables the process object (10) to be electromagnetically fixed to the ESC electrode (22) according to the high voltage formed at the ESC electrode (22), and may be several hundred volts or more depending on the embodiment.

[0064] In the de-chuck period after the process is completed, the electrostatic chuck voltage supply device (120) can supply a de-chuck voltage to the ESC electrode (22) to remove any remaining charge on the process object (10) and / or the ESC electrode (22) and to allow the process object (10) to be easily separated from the ESC electrode (22). Here, the de-chuck voltage may have an opposite polarity to the chuck voltage, but in some cases, it may have the same polarity.

[0065] The heater (112) can heat the process object (10) by supplying power to a heating wire (25) placed near the process object (10).

[0066] The heating wire (25) can be placed within the dielectric layer (23). For example, the heating wire (25) can be placed on the lower side of the ESC electrode (22) in the dielectric layer (23) - the side opposite to the process object (10).

[0067] A heater (112), a heating wire (25), an ESC electrode (22), an electrostatic chuck voltage supply device (120), etc. are collectively referred to as an electrostatic chuck device. The electrostatic chuck device may further include a filter (110), a low-pass filter (130), etc.

[0068] The filter (110) and / or low-pass filter (130) can remove noise from the power flowing through the wiring and stabilize the power.

[0069] Figure 2 is a configuration diagram of a filter according to one embodiment.

[0070] Referring to FIG. 2, the filter (110) may be a CM (common mode) filter.

[0071] The filter (110) may include two inductors (L) whose magnetic fields are connected to each other. The two inductors (L) may be wound in the same direction to have high resistance to common mode signals. Among the power passing through the filter (110), signals corresponding to common mode noise are attenuated by the two inductors (L), and differential mode signals are passed with minimal attenuation.

[0072] In the case of a common mode signal, since the currents flowing through the two inductors (L) have the same direction and magnitude, the magnetic fields generated in each inductor (L) also overlap in the same direction and can be amplified. As a result, the filter (110) has a high impedance for the common mode signal, thereby suppressing the signal.

[0073] On the other hand, in the case of a differential mode signal, since the directions of the currents flowing in the two inductors (L) are opposite, the magnetic fields generated in each inductor (L) can cancel each other out. Accordingly, the differential mode signal mostly passes through the filter (110).

[0074] To improve the performance of the filter (110), the inductance of the inductor (L) must be high. To increase the inductance of the inductor (L), the number of turns of the inductor (L) can be increased. When a coil with more turns is used, a larger inductance value can be obtained. The inductance can also be increased by increasing the diameter of the coil. However, all of these methods have the problem of low space efficiency because they increase the size of the inductor (L).

[0075] A filter (110) according to one embodiment can have high inductance while occupying a small volume by using an inductor having a spiral coil shape. Since the spiral coil inductor described below has many windings densely arranged on the same plane, the inductance can be increased through the interaction between the densely packed windings. In addition, the spiral coil inductor described below can have a larger number of windings within the same area, thereby having a higher inductance value. Details will be described below with reference to the drawings in FIG. 5 and below.

[0076] Figure 3 is a configuration diagram of a low-pass filter according to one embodiment.

[0077] Referring to FIG. 3, the low-pass filter (130) may be a DM (differential mode) filter.

[0078] The low-pass filter (130) may include an inductor (L) and a capacitor (C).

[0079] A low-pass filter (130) can filter high-frequency noise and pass low-frequency power using an inductor (L) and a capacitor (C).

[0080] The cutoff frequency of the low-pass filter (130) can be determined by the inductance of the inductor (L) and the capacitance of the capacitor (C).

[0081] Once the inductance value of the inductor (L) is determined by design, it may be important to create an inductor (L) that satisfies the corresponding inductance value with a small volume. A low-pass filter (130) according to one embodiment can have a high inductance while occupying a small volume by using an inductor having a spiral coil shape. Details will be described later with reference to the drawings in FIG. 5 and below.

[0082] The inductor described with reference to FIGS. 2 and 3 may be an air-core inductor. An air-core inductor is an inductor that uses only air as a medium, without using a magnetic core (e.g., ferrite, iron, silicon steel, etc.). An air-core inductor may generally have a simple structure made by winding a wire into a specific shape. The inductance of an inductor is determined by several factors, such as the number of turns, the diameter of the wire, the overall length and diameter of the coil, and the inductance of an air-core inductor may generally be lower than that of an inductor that uses a magnetic core.

[0083] Meanwhile, air-core inductors can exhibit excellent performance in high-frequency applications because they are free from issues such as magnetic core saturation, eddy current loss, and hysteresis loss. Furthermore, air-core inductors can possess high Q (quality factor) values. The Q value indicates the efficiency of an inductor, and the absence of eddy current loss allows air-core inductors to exhibit high Q values.

[0084] However, the air core inductor has a problem in that it has a large volume compared to the magnetic core inductor, but the inductor according to one embodiment has a spiral coil shape, so that the volume can be made relatively small.

[0085] Fig. 4 is a top image of a typical air core inductor, and Fig. 5 is a side image of a typical air core inductor.

[0086] Referring to FIGS. 4 and 5, a typical air core inductor has a form in which wires are wound at the same location in each layer. Accordingly, in an air core inductor, one winding is formed in each layer.

[0087] These typical air-core inductors require increased layers to increase inductance. Alternatively, the radius of each layer must be increased to increase inductance. However, because of the limited volume the inductor can occupy, typical air-core inductors may not be able to achieve high inductance values.

[0088] FIG. 6 is a top view of a spiral coil inductor according to one embodiment, FIG. 7 is a side view of a spiral coil inductor according to one embodiment, FIG. 8 is a top view image of a prototype of a spiral coil inductor according to one embodiment, and FIG. 9 is a side image of a prototype of a spiral coil inductor according to one embodiment.

[0089] Referring to FIGS. 6 to 9, the spiral coil inductor (L) may have a form in which a first spiral layer (SP1) in which a series of curves formed by a wire (WR) start from the inside with respect to a central axis (C1) and continue to expand and advance outward, and a second spiral layer (SP2) in which a series of curves formed by a wire (WR) continue to contract and advance from the outside to the inside while being connected to the first spiral layer (SP1) are alternately arranged.

[0090] In a spiral coil inductor (L), the first spiral layer (SP1) and the second spiral layer (SP2) may have an internal space having a certain cross-sectional area and a certain inner diameter or more near the central axis (C1). In addition, air is located in this internal space, so that the spiral coil inductor (L) as a whole may take the form of an air core inductor.

[0091] The wire (WR) may be in the form of a plate having a width (W1) in the direction of the outer diameter (R2) perpendicular to the central axis (C1). The wire (WR) may have a shape in which the thickness in the direction of the central axis (C1) is narrower than the width (W1) formed in the direction perpendicular to the central axis (C1). According to this shape, the cross-sectional area of ​​the wire (WR) can be increased while the thickness in the direction of the central axis (C1) can be reduced, thereby reducing the height of the spiral coil inductor (L).

[0092] The wire (WR) can form a plurality (N1) of concentric circles in the direction of the outer diameter (R2), and the concentric circles in each of the first spiral layer (SP1) and the second spiral layer (SP2) may not overlap each other. However, the distance between each concentric circle can be minimized. According to this form, the maximum number of turns can be formed in a given volume, and the wire (WR) with the largest cross-sectional area can be arranged.

[0093] For example, the wire (WR) can form three concentric circles. At this time, the first spiral layer (SP1) can have a form in which the three concentric circles are connected while expanding from the inside to the outside, and the second spiral layer (SP2) can have a form in which the three concentric circles are connected while contracting from the outside to the inside. In addition, the first spiral layer (SP1) and the second spiral layer (SP2) can be arranged alternately.

[0094] Fig. 10 is a configuration diagram of a spiral coil manufacturing device according to one embodiment.

[0095] Referring to FIG. 10, the spiral coil manufacturing device (1000) may include a wire discharger (1010) and a curve forming device (1020).

[0096] The wire discharger (1010) can discharge a thin and long plate-shaped wire (WR) in a first direction (X) through a discharge port (1011) formed in the body. Here, the first direction (X), the second direction (Y), and the third direction (Z) may be directions perpendicular to each other.

[0097] The wire (WR) can be discharged in a form in which the width when viewed in the second direction (Y) is wider than the thickness when viewed in the third direction (Z).

[0098] The curve forming device (1020) may have a curved surface (1021) formed at a point extending in the first direction (X) from the outlet (1011).

[0099] The wire (WR) discharged in the first direction (X) from the discharge port (1011) can be bent in a curved shape on the curved surface (1021). When the wire (WR) is bent in this way on the curved surface (1021), the curve forming device (1020) can reciprocate in the first direction (X).

[0100] When the curve former (1020) moves toward the outlet (1011) in the first direction (X), the radius of the curve formed by the wire (WR) may decrease, and when it moves to the opposite side of the outlet (1011), the radius of the curve formed by the wire (WR) may increase. When forming the first spiral layer, the curve former (1020) may move to the opposite side of the outlet (1011), and when forming the second spiral layer, it may move toward the outlet (1011).

[0101] The wire ejector (1010) can reciprocate the body in a second direction (Y) perpendicular to the first direction (X). Here, the first direction (X) may be the length direction of the wire (WR), the second direction (Y) may be the thickness direction of the wire (WR), and the third direction (Z) may be the width direction of the wire (WR). As the wire ejector (1010) moves in the second direction (Y), the height of each spiral layer can be formed.

[0102] Although not shown in the drawing, the spiral coil manufacturing device (1000) may further include a cutter that cuts the wire (WR) at regular intervals.

[0103] By cutting with these cutters, spiral coil inductors can be produced one by one.

[0104] As described above, according to the present embodiment, an inductor having high inductance while limiting volume can be provided. Furthermore, according to the present embodiment, a filter having a small volume and high filtering efficiency can be provided for use in an electrostatic chuck heating device. Furthermore, according to the present embodiment, a coil having a small volume and high inductance can be manufactured using a simple device.

[0105] The terms "include," "comprise," or "have" described above, unless otherwise specifically stated, imply that the corresponding component may be included, and therefore should be interpreted to include other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in dictionaries, should be interpreted to be consistent with their meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense, unless explicitly defined herein.

[0106] The above description is merely an illustrative illustration of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate, rather than limit, the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A first spiral layer in which a series of curves formed by the wire start from the inside with respect to the central axis and continue to expand and move outward, A second spiral layer that is connected to the first spiral layer and in which a series of curves formed by the wires continue to decrease from the outside to the inside. This is a spiral coil inductor with multiple alternating arrangements.

2. In paragraph 1, The above wire is a spiral coil inductor having a shape in which the thickness in the direction of the central axis is narrower than the width formed in the direction perpendicular to the central axis.

3. In paragraph 1, The above wire is a spiral coil inductor that appears in a plate shape with a width in a direction perpendicular to the central axis.

4. ESC (electro-static chuck) The power is filtered by using an inductor placed in a wire connected to the heating wire from a heater that supplies power to the heating wire placed on the inside of a dielectric layer surrounding an electrode, and the inductor is configured as a spiral coil in which a series of curves formed by the wire expand from the inside to the outside or contract from the outside to the inside based on a central axis. Filter used in electrostatic chuck heating devices.

5. In paragraph 4, A filter used in an electrostatic chuck heating device, which functions as a CM (common mode) filter that suppresses common mode noise of the above wiring.

6. In paragraph 4, The above inductor is an air core inductor, a filter used in an electrostatic chuck heating device.

7. A wire discharger that discharges a thin, long plate-shaped wire in a first direction through an exhaust port formed in the body, and the body reciprocates in a second direction perpendicular to the first direction; and A curve forming device in which a curved surface is formed at a point extending in the first direction from the discharge port, and the wire discharged from the discharge port is bent into a curved shape by the curved surface, and the radius of the curve increases and decreases while reciprocating in the first direction. A spiral coil manufacturing device including:

8. In paragraph 7, A spiral coil manufacturing device further comprising a cutter for cutting the wire at regular intervals.

9. In paragraph 8, A spiral coil inductor is formed by cutting, The above spiral coil inductor, A first spiral layer in which a series of curves formed by the above wires start from the inside with respect to the central axis and continue to expand and move outward, A spiral coil manufacturing device in which a plurality of second spiral layers are alternately arranged while being connected to the first spiral layer and continuously decreasing from the outside to the inside in a series of curves formed by the wire.

10. In paragraph 9, A spiral coil manufacturing device in which the first spiral layer and the second spiral layer are alternately arranged according to the second direction reciprocating motion of the wire discharger.

Images