Electronic device

Abstract

An earphone (100), comprising: a compartment (200), a circuit board (210) and an antenna assembly (220), wherein the compartment (200) contains a plastic base material and reinforcing fibers doped in the plastic base material; the circuit board (210) is arranged in the compartment (200); and the antenna assembly (220) is arranged on a side wall of the compartment (200), comprising an antenna support (221) and an LDS antenna pattern (222) which is formed on the antenna support (221), the LDS antenna pattern (222) being electrically connected to the circuit board (210). According to the earphone (100), the size of the antenna assembly (220) can be reduced, facilitating the design of a clearance area, improving the space utilization rate inside the compartment (200) of the earphone (100); moreover, the earphone (100) enables the compartment (200) to be made of a material different from that of the antenna support (221), thereby reducing limitations on the material selection for the compartment (200), improving the diversity of the material selection for the compartment (200).

Description

electronic devices

Technical field

[0001] The present application relates to the technical field of electronic devices, and in particular to a headset. [Background Technology]

[0002] With the increasing popularity of electronic devices, they have become indispensable social and entertainment tools in people's daily lives, and people's expectations of electronic devices are becoming increasingly higher. Electronic devices such as headphones and smart glasses have also been widely used in people's daily lives. They can be used in conjunction with terminal devices such as mobile phones and computers to provide users with an auditory feast.

[0003] However, current headphones have the problem of being large in size and having insufficient internal space utilization.

[0004] [Summary of the invention]

[0005] The present application provides headphones, which include: a housing, a circuit board and an antenna assembly, the housing including a plastic base material and reinforcing fibers doped in the plastic base material; the circuit board is arranged in the housing; the antenna assembly is arranged on the side wall of the housing, including an antenna bracket and an LDS antenna pattern formed on the antenna bracket, and the LDS antenna pattern is electrically connected to the circuit board.

[0006] In some embodiments, the side wall includes two main side walls spaced apart from each other, and two auxiliary side walls connecting the two main side walls and spaced apart from each other, the area of ​​the main side wall is larger than the area of ​​the auxiliary side wall, the main surface of the circuit board is arranged toward the main side wall, the antenna bracket is arranged on the main side wall, and the LDS antenna pattern is formed on one side of the antenna bracket.

[0007] This method allows the antenna bracket to be made of LDS plastic and then mounted on the housing. This reduces the size of the antenna assembly, facilitating the design of the clearance area and improving space utilization within the headset housing. Furthermore, the housing can be made of a different material than the antenna bracket, reducing restrictions on the housing material and increasing the diversity of housing material options.

[0008] In some embodiments, a receiving groove is formed in the main side wall, and the antenna bracket is received in the receiving groove.

[0009] In some embodiments, the thickness of the antenna bracket is less than or equal to the depth of the receiving groove.

[0010] In some embodiments, the surface where the LDS antenna pattern is located is set toward the circuit board, and the antenna assembly further includes a feeding portion and a grounding portion electrically connected to the LDS antenna pattern, and the feeding portion and the grounding portion are protrudingly arranged on the side of the LDS antenna pattern facing the circuit board.

[0011] In some embodiments, the receiving groove is located on the inner surface of the main side wall, and the LDS antenna pattern is entirely located on a side of the receiving groove facing away from the circuit board.

[0012] In some embodiments, the surface where the LDS antenna pattern is located is set away from the circuit board, and the antenna assembly also includes a feeding part and a grounding part electrically connected to the LDS antenna pattern. The feeding part and the grounding part pass through the antenna bracket and are exposed from the surface on the other side opposite to the surface where the LDS antenna pattern is located.

[0013] In some embodiments, the receiving groove is located on the outer surface of the main side wall, the LDS antenna pattern is located as a whole on the side of the notch of the receiving groove facing the circuit board, and the housing further includes an elastic coating covering the outer surface of the main side wall and the outside of the antenna assembly.

[0014] In some embodiments, the receiving groove is located on the outer surface of the main side wall, and the main side wall is provided with a first through hole and a second through hole located in the receiving groove. The earphone also includes a first electrical connector and a second electrical connector. The first electrical connector electrically connects the circuit board and the feeding part via the first through hole, and the second electrical connector electrically connects the circuit board and the grounding part via the second through hole.

[0015] In some embodiments, the first electrical connector and the second electrical connector are respectively inserted into the first through hole and the second through hole, or the first through hole and the second through hole are respectively provided with a first adapter portion and a second adapter portion, the first adapter portion connects the first electrical connector and the feeding portion, and the second adapter portion connects the second electrical connector and the grounding portion.

[0016] In some embodiments, in the worn state, the main side wall where the antenna bracket is located is located on the side of the housing away from the user's skin.

[0017] In some embodiments, the content of reinforcing fibers in the silo body is greater than 30%.

Brief Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] FIG1 is a schematic diagram of the overall structure of an embodiment of the earphone of the present application;

[0020] FIG2 is a schematic structural diagram of a core assembly of an earphone embodiment of the present application;

[0021] FIG3 is a schematic diagram of the structure of the interior of the housing of an earphone embodiment of the present application;

[0022] FIG4 is a schematic structural diagram of an LDS antenna pattern of an earphone embodiment of the present application;

[0023] FIG5 is a schematic cross-sectional view of the antenna assembly of an embodiment of the headset of the present application;

[0024] FIG6 is a cross-sectional schematic diagram of a non-limiting embodiment of the interior of the housing of the earphone of the earphone embodiment of the present application;

[0025] Figure 7 is a cross-sectional schematic diagram of another non-limiting embodiment of the interior of the housing of the earphone of the earphone embodiment of the present application. [Specific implementation method]

[0026] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application and do not limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application and not all embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of this application. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0028] Antennas are commonly used components for transmitting and receiving electromagnetic waves. Electromagnetic waves are easily affected by metal, which can reflect, absorb, and offset electromagnetic waves. Therefore, antenna design often requires that the antenna be positioned away from metal components to create a clear area around the antenna and improve communication performance.

[0029] The inventors of this application have discovered through research that PIFA antennas (planar inverted F antennas) are commonly used in existing headphone designs. However, such PIFA antennas are typically large, which reduces the space utilization inside the housing. However, if antennas obtained using laser direct structuring (LDS) technology (also known as LDS antennas) are used in electronic devices such as mobile phones and headphones, a significant amount of design space can be saved, reducing the size of the electronic devices while also increasing the headroom area. However, the housings of existing headphones often cannot be fabricated with LDS antennas using laser direct structuring technology.

[0030] Fabricating an antenna using laser direct structuring generally involves the following process: A housing is made of LDS plastic, a modified plastic containing an organometallic complex. Upon laser irradiation, the organometallic complex releases metal particles. The housing is then irradiated with a laser to form a seed layer, formed from the metal particles released by the LDS plastic. The laser's trajectory is controlled to create a seed layer with a predetermined pattern. Finally, the surface of the seed layer with the predetermined pattern is metallized through a chemical plating process, resulting in a metal layer several microns thick, thus forming the LDS antenna.

[0031] As mentioned above, LDS antennas must be fabricated based on LDS plastics, which typically possess the following properties: ① insulation; ② non-catalytic activity; ③ resistance to visible light; ④ uniform dispersion within the plastic matrix; ⑤ release of metal particles upon laser irradiation; ⑥ high-temperature and chemical resistance; ⑦ low toxicity; ⑧ no emission, no migration, and good resistance to leaching. Common LDS plastics can be made from the following materials: PA4T (a high-temperature resistant polyamide), LCP (Liquid Crystal Polymer), PC / ABS (engineering plastic alloy), PA46 (polybutylene adipamide, also known as polyamide 46 or nylon 46), PPA (Polyphthalamide), PP (Polypropylene), HTN (high-temperature nylon, a heat-resistant polyamide), PA (polyamide resin), PPO (Polyphenylene ether), PEEK (Polyetheretherketone), etc.

[0032] The following earphone embodiments of the present application describe an exemplary structure of an earphone.

[0033] 1 , 2 and 3 , the earphone 100 may include a core component 1 , an ear hook component 2 and a back hook component 3 .

[0034] The number of movement components 1 can be two. The two movement components 1 are respectively used to transmit vibration and / or sound to the user. The movement component 1 may include a shell component 10, a bone conduction speaker 11 and an air conduction speaker 12. The bone conduction speaker 11 and the air conduction speaker 12 can be arranged in the shell component 10. The air conduction speaker 12 conducts sound into the user's ear canal through the principle of air vibration, and the bone conduction speaker 11 conducts sound to the user through bone conduction vibration. The two movement components 1 can be the same or different. For example, one movement component 1 can be provided with a microphone, while the other movement component 1 may not be provided with a microphone. For another example, one movement component 1 can be provided with a button and a corresponding circuit board, while the other movement component 1 may not be provided with the button and the corresponding circuit board. The two movement components 1 can be the same in the movement module (such as the speaker module). The movement component 1 described later in this article can be considered to be described in detail by taking one of the two movement components 1 as an example.

[0035] The number of ear hook components 2 can be two, and the two ear hook components 2 can be hung on the left ear and right ear of the user, respectively, so that the core component 1 can fit the user's face. One end of the ear hook component 2 is connected to the core component 1, and the other end of the ear hook component 2 is connected to the back hanging component 3. The two ear hook components 2 can include an ear hook 20a hung on the user's ear and a compartment component 20b for storing at least one of a battery, a circuit board, and an antenna component. The compartment component 20b can be independent of the ear hook 20a and can be detachably connected. In addition, the two ear hook components 2 can be the same or not completely the same. For example, one of the compartment components 20b can be provided with a battery, and the other compartment component 20b can be provided with a circuit board and an antenna component, etc. The circuit board can be electrically connected to at least one of the battery, the bone conduction speaker, the air conduction speaker, the microphone, and the antenna component.

[0036] The back-hanging assembly 3 connects the two ear-hanging assemblies 2. The back-hanging assembly 3 is designed to wrap around the back of the user's neck or head and provide a clamping force, allowing the two core assemblies 1 to clamp to the sides of the user's face and the ear-hanging assemblies 2 to be more securely attached to the user's ears. Of course, the earphones 100 can also include no back-hanging assembly 3, and the core assembly 1 can be worn on the user's ears via the ear-hanging assemblies 2.

[0037] To this end, in an embodiment of the present application, the material of the shell component 10 can be, but is not limited to, a mixture of materials such as polycarbonate, polyamide, acrylonitrile-butadiene-styrene copolymer and glass fiber or carbon fiber. In some embodiments, the material of the shell component 10 can be a mixture of carbon fiber and polycarbonate in a certain proportion, or a mixture of glass fiber and polycarbonate in a certain proportion, or a mixture of glass fiber and polyamide in a certain proportion. In some other embodiments, the material of the shell component 10 can be a mixture of carbon fiber, glass fiber and polycarbonate in a certain proportion. Among them, by adding different proportions of carbon fiber and / or glass fiber, the hardness of the material is different, and the stiffness of the shell component 10 obtained is also different.

[0038] In some embodiments, the housing component 20b of the ear hook component 2 may also need to take into account both strength and quality factors. For example, the shell portion (i.e., the housing) of the housing component 20b needs to have sufficient strength while also having a smaller mass. Therefore, the housing of the ear hook component 2 will usually also use a reinforced material with glass fiber. In this case, if an organic metal composite is used for modification, the housing will become more brittle as a whole and its toughness will be reduced. Therefore, the housing of the ear hook component 2 is usually not suitable for forming an LDS antenna.

[0039] The following describes an exemplary structure of the ear hook assembly 2 of the present application.

[0040] As described above, referring to Figures 3, 4, and 5, the housing assembly 20b of one of the two ear hook assemblies 2 may include: a housing 200, a circuit board 210, and an antenna assembly 220. The housing 200 includes a plastic substrate and reinforcing fibers doped within the plastic substrate. The circuit board 210 is disposed within the housing 200. The antenna assembly 220 is disposed on a side wall of the housing 200 and includes an antenna bracket 221 and an LDS antenna pattern 222 formed on the antenna bracket 221. The LDS antenna pattern 222 is electrically connected to the circuit board 210.

[0041] Through the above method, the antenna bracket 221 can be made of LDS plastic and then installed on the housing 200. On the one hand, the volume of the antenna assembly 220 can be reduced, which is beneficial for the design of the clearance area and improves the space utilization inside the housing 200 of the ear hook assembly 2. On the other hand, the material of the housing 200 can be different from that of the antenna bracket 221, thereby reducing the restrictions on the material selection of the housing 200 and increasing the diversity of the material selection of the housing 200.

[0042] In some embodiments, the plastic substrate may include plastic materials such as carbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer. In some embodiments, the content of reinforcing fiber in the silo 200 is greater than 30%. For example, the content of reinforcing fiber in the silo 200 may be 30%, 40%, 45%, 50%, 60%, etc. For another example, the content of reinforcing fiber in the silo 200 may be 45% to 60%. The reinforcing fiber may be carbon fiber, glass fiber, etc.

[0043] In some embodiments, the sidewalls of the hopper body 200 include two spaced-apart primary sidewalls 201 and two spaced-apart secondary sidewalls 202 connecting the two primary sidewalls 201. The two primary sidewalls 201 may be substantially parallel plate-like structures, and the two secondary sidewalls 202 may be curved to provide a smooth transition between the two primary sidewalls 201 and the secondary sidewalls 202.

[0044] In some embodiments, the area of ​​the main side wall 201 is larger than the area of ​​the auxiliary side wall 202, and the main surface of the circuit board 210 is arranged toward the main side wall 201. The main surface of the circuit board 210 refers to the surface on which the circuit structure is arranged. In some embodiments, a light guide portion (not shown) may be provided on one of the main side walls 201 of the housing 200, and one of the main surfaces of the circuit board 210 is arranged toward the light guide portion, and an indicator light (not shown) may be provided on the main surface arranged toward the light guide portion. The light emitted by the indicator light can be emitted to the outside of the headset 100 through the light guide portion. In some embodiments, the light guide portion may also be a lampshade.

[0045] The antenna bracket 221 is mounted on the main sidewall 201, and the LDS antenna pattern 222 is formed on one side of the antenna bracket 221. For example, the antenna bracket 221 can be attached to the main sidewall 201, while the LDS antenna pattern 222 can be formed on the side of the antenna bracket 221 facing away from the main sidewall 201. The above-described arrangement of the circuit board 210 and antenna assembly 220 can help reduce the volume of the compartment 200 while also protecting the antenna assembly 220.

[0046] In some embodiments, the antenna support 221 is generally plate-shaped. For example, the antenna support 221 can be a flat plate or a plate-shaped structure with a bend. The antenna support 221 has two opposing surfaces, with the direction from one surface to the other defining the thickness of the antenna support 221. One surface of the antenna support 221 can be attached to one of the main sidewalls 201, while the LDS antenna pattern 222 is provided on the other surface. The LDS antenna pattern 222 is formed directly on the antenna support 221 using LDS technology. The antenna support 221 can be attached to the main sidewall 201, for example, by bonding.

[0047] In some embodiments, when worn, the antenna bracket 221 is located on the main sidewall 201 on the side of the housing 200 away from the user's skin. This reduces the impact of electromagnetic waves emitted by the antenna assembly on the user and facilitates the transmission and reception of electromagnetic waves by the antenna assembly 220. The main sidewall 201 where the antenna bracket 221 is located may also be the main sidewall 201 on which the light guide is located.

[0048] In some embodiments, the main side wall 201 is provided with a receiving groove 203, and the antenna bracket 221 is received in the receiving groove 203. In this case, the distance between the antenna assembly 220 and the circuit board 210 can be further increased, the clearance area can be increased, or the space utilization rate inside the housing 200 can be improved.

[0049] In some embodiments, the thickness of the antenna bracket 221 is less than or equal to the depth of the receiving groove 203. In this case, the antenna assembly 220 can be entirely received within the receiving groove 203 without protruding from the notch of the receiving groove 203, further increasing the distance between the antenna assembly 220 and the circuit board 210, thereby increasing the clearance area or improving the space utilization inside the housing 200.

[0050] In some embodiments, as shown in Figures 3 and 6 , the receiving slot 203 may be located on the inner surface of the main sidewall 201, with the LDS antenna pattern 222 positioned entirely on the side of the receiving slot 203 facing away from the circuit board 210. In this case, the antenna assembly 220 can be entirely disposed within the housing 200, with the LDS antenna pattern 222 positioned substantially flush with the inner surface of the main sidewall 201, or further away from the circuit board 210 relative to the notch of the receiving slot 203 or the inner surface of the main sidewall 201. This arrangement not only protects the antenna assembly 220 but also further increases the spacing between the antenna assembly 220 and the circuit board 210, thereby increasing the clearance area.

[0051] In some embodiments, referring to FIG. 7 , the receiving groove 203 may be located on the outer surface of the main sidewall 201, with the LDS antenna pattern 222 positioned entirely on the side of the receiving groove 203 that faces the circuit board 210. This allows the LDS antenna pattern 222 to be housed within the receiving groove 203 without protruding from the outer surface of the main sidewall 201 (i.e., the LDS antenna pattern 222 is flush with the outer surface of the main sidewall 201, or the LDS antenna pattern 222 is closer to the circuit board 210 than the outer surface of the main sidewall 201), thereby improving the user's wearing experience.

[0052] In some embodiments, the housing 200 further includes an elastic coating 204 that covers the outer surface of the main sidewall 201 and the outer side of the antenna assembly 220. The elastic coating 204 isolates the antenna assembly 220 from the external environment. Furthermore, the elastic coating 204 better conforms to the human head or face, thereby improving the user's wearing experience.

[0053] Referring again to Figures 3-6 , in some embodiments, the surface on which the LDS antenna pattern 222 is located faces the circuit board 210, and the antenna assembly 220 further includes a feed portion 223 and a ground portion 224 electrically connected to the LDS antenna pattern 222. The feed portion 223 and the ground portion 224 protrude from the side of the LDS antenna pattern 222 facing the circuit board 210. In this case, assembly of the antenna assembly 220 and the circuit board 210 is facilitated. The feed portion 223 and the ground portion 224 can abut against the circuit board 210 via a metal elastic member (not numbered) to achieve electrical connection between the antenna assembly 220 and the circuit board 210. The metal elastic member can be a pogo pin or a metal spring. In this case, the metal elastic member can elastically expand and contract, thereby reducing the risk of disconnection between the antenna assembly 220 and the circuit board 210 during movement. The metal elastic member can be fixed to the circuit board 210.

[0054] Referring to Figure 7 , in some embodiments, the surface where the LDS antenna pattern 222 is located faces away from the circuit board 210. In conjunction with Figure 4 , the antenna assembly 220 further includes a feeder 223 and a grounding portion 224 electrically connected to the LDS antenna pattern 222. The feeder 223 and the grounding portion 224 extend through the antenna support 221 and are exposed on the surface opposite to the surface where the LDS antenna pattern 222 is located. This facilitates further increasing the distance between the LDS antenna pattern 222 and the circuit board 210, or improving space utilization within the housing 200.

[0055] Referring to FIG. 7 , the receiving groove 203 is located on the outer surface of the main side wall 201. The main side wall 201 is provided with a first through-hole 2011 and a second through-hole 2012 located within the receiving groove 203. The earhook assembly 2 of the earphone 100 also includes a first electrical connector 205 and a second electrical connector 206. The first electrical connector 205 electrically connects the circuit board 210 to the power feeder 223 via the first through-hole 2011, and the second electrical connector 206 electrically connects the circuit board 210 to the grounding portion 224 via the second through-hole 2012. The provision of the first through-hole 2011 and the second through-hole 2012 provides guidance for the first and second electrical connectors 205, 206, thereby enhancing the reliability of the electrical connection between the first and second electrical connectors 205, 206 and the corresponding power feeder 223 and grounding portion 224.

[0056] In some embodiments, the first electrical connector 205 and the second electrical connector 206 are respectively disposed in the first through hole 2011 and the second through hole 2012. The first electrical connector 205 and the second electrical connector 206 can be elastic pins (pogo pins). In this case, the first electrical connector 205 and the second electrical connector 206 can be elastically extended and retracted, thereby reducing the risk of disconnection between the antenna assembly 220 and the circuit board 210 during movement.

[0057] In some embodiments, the first through hole 2011 and the second through hole 2012 may be conductive through holes. For example, referring to Figures 7 and 4 , the first through hole 2011 and the second through hole 2012 are provided with a first adapter portion 207 and a second adapter portion 208, respectively. The first adapter portion 207 connects the first electrical connector 205 and the feed portion 223, and the second adapter portion 208 connects the second electrical connector 206 and the ground portion 224. This can help reduce the difficulty of assembling and disassembling the antenna assembly 220. In this way, the conductive connection between the feed portion 223 and the first electrical connector 205, as well as the conductive connection between the ground portion 224 and the second electrical connector 206, can be made more reliable. The first transition portion 207 and the second transition portion 208 may also be conductive metal coatings coated or plated on the first through hole 2011 or the second through hole 2012. For example, the first transition portion 207 / the second transition portion 208 may be copper layers electroplated or chemically plated on the first through hole 2011 / the second through hole 2012.

[0058] In summary, some embodiments of the present application provide an earphone 100. The ear hook assembly 2 of the earphone 100 includes an ear hook 20a and a housing assembly 20b. The housing assembly 20b includes a housing 200, a circuit board 210, and an antenna assembly 220. The housing 200 includes a plastic substrate and reinforcing fibers doped in the plastic substrate. The circuit board 210 is disposed in the housing 200. The antenna assembly 220 is disposed on the side wall of the housing 200, and includes an antenna bracket 221 and an LDS antenna pattern 222 formed on the antenna bracket 221, and the LDS antenna pattern 222 is electrically connected to the circuit board 210.

[0059] In the above manner, the antenna bracket 221 can be made of LDS plastic and then installed on the housing 200. On the one hand, the volume of the antenna assembly 220 can be reduced, which is beneficial to the design of the clearance area and improves the space utilization inside the ear hook assembly 2. On the other hand, the material of the housing 200 can be made different from that of the antenna bracket 221, thereby reducing the restrictions on the material selection of the housing 200 and increasing the diversity of the material selection of the housing 200. The above description is only part of the embodiments of the present application and does not limit the scope of protection of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the scope of patent protection of the present application.

Claims

1. A headset, characterized in that: include: A silo body, the silo body comprising a plastic base material and reinforcing fibers mixed in the plastic base material; A circuit board is arranged in the bin body; as well as The antenna assembly is arranged on the side wall of the chamber body, and comprises an antenna bracket and an LDS antenna pattern formed on the antenna bracket, wherein the LDS antenna pattern is electrically connected to the circuit board.

2. The earphone according to claim 1, characterized in that The side wall includes two main side walls spaced apart from each other, and two auxiliary side walls connecting the two main side walls and spaced apart from each other, the area of ​​the main side wall is larger than the area of ​​the auxiliary side wall, the main surface of the circuit board is arranged toward the main side wall, the antenna bracket is arranged on the main side wall, and the LDS antenna pattern is formed on one side of the antenna bracket.

3. The earphone according to claim 2, characterized in that The main side wall is provided with a receiving groove, and the antenna bracket is received in the receiving groove.

4. The earphone according to claim 3, characterized in that: The thickness of the antenna bracket is less than or equal to the depth of the receiving groove.

5. The earphone according to claim 3, characterized in that: The surface where the LDS antenna pattern is located is arranged toward the circuit board. The antenna assembly also includes a feeding portion and a grounding portion electrically connected to the LDS antenna pattern. The feeding portion and the grounding portion are protrudingly arranged on a side of the LDS antenna pattern facing the circuit board.

6. The earphone according to claim 5, characterized in that The receiving groove is located on the inner surface of the main side wall, and the LDS antenna pattern is entirely located on a side of the notch of the receiving groove away from the circuit board.

7. The earphone according to claim 3, characterized in that: The surface where the LDS antenna pattern is located is arranged away from the circuit board, and the antenna assembly also includes a feeding part and a grounding part electrically connected to the LDS antenna pattern. The feeding part and the grounding part pass through the antenna bracket and are exposed from the surface on the other side opposite to the surface where the LDS antenna pattern is located.

8. The earphone according to claim 7, characterized in that: The receiving groove is located on the outer surface of the main side wall, the LDS antenna pattern is located as a whole on the side of the notch of the receiving groove facing the circuit board, and the warehouse body further includes an elastic coating covering the outer surface of the main side wall and the outer side of the antenna assembly.

9. The earphone according to claim 5 or 7, characterized in that: The receiving groove is located on the outer surface of the main side wall, and the main side wall is provided with a first through hole and a second through hole located in the receiving groove. The earphone also includes a first electrical connector and a second electrical connector, the first electrical connector electrically connects the circuit board and the feeding part via the first through hole, and the second electrical connector electrically connects the circuit board and the grounding part via the second through hole.

10. The earphone according to claim 9, characterized in that The first electrical connector and the second electrical connector are respectively inserted into the first through hole and the second through hole, or the first through hole and the second through hole are respectively provided with a first adapter and a second adapter, the first adapter connects the first electrical connector and the feeding part, and the second adapter connects the second electrical connector and the grounding part.

11. The earphone according to claim 2, characterized in that: In the wearing state, the main side wall where the antenna bracket is located is located on the side of the warehouse body away from the user's skin.

12. The earphone according to claim 1, characterized in that The content of the reinforcing fibers in the silo is greater than 30%.

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