Radio frequency chip assembly, distance measurement method and electronic device

Abstract

The present application provides a radio frequency chip assembly, a distance measurement method and an electronic device. The radio frequency chip assembly comprises a transceiver and a coupler assembly, wherein the coupler assembly comprises an input port, a first output port, a first load port and a second load port, the coupler assembly is coupled to the transceiver by means of the input port and the first output port, the first load port is used for coupling a first radiator, the second load port is used for coupling a second radiator, the first load port is coupled to the second load port, and the first output port is coupled to the second load port. The radio frequency chip assembly provided by the present application can improve the measurement effect of distance measurement of a target to be detected.

Description

Radio frequency chip assembly, distance detection method and electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on October 31, 2023, with application number 202311436626.2, and invention name “RF chip component, distance detection method and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to a radio frequency chip component, a distance detection method, and an electronic device. Background Art

[0003] Currently, terminal communication devices can adjust the transmission power to ensure that the specific absorption rate (SAR) of the electronic device meets regulatory requirements by identifying the proximity of the target to be detected. However, the use of capacitive detectors / sensors typically requires a large design space and a specifically designed antenna. Existing load-reflective detectors / sensors have low sensitivity and are difficult to meet usage requirements. Therefore, how to improve the detection sensitivity of the detector and make it applicable to various antenna structures has become a technical problem that needs to be solved.

[0004] Summary of the Invention

[0005] The present application provides a radio frequency chip component, a distance detection method, and an electronic device to improve the sensitivity of distance detection to a target to be detected.

[0006] In a first aspect, the present application provides a radio frequency chip assembly comprising a transceiver and a coupler assembly. The coupler assembly comprises an input port, a first output port, a first load port, and a second load port. The transceiver comprises a transmitting port and a receiving port. The coupler assembly is coupled to the transceiver via the input port and the first output port, wherein the input port of the coupler assembly is coupled to the transmitting port of the transceiver, and the first output port of the coupler assembly is coupled to the receiving port of the transceiver. The first load port of the coupler assembly is used to couple a first radiator, and the second load port is used to couple a second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0007] The RF chip assembly provided in the embodiment of the present application couples a first load port and a second load port for connecting two radiators. After the signal transmitted by the transceiver through the coupler assembly is transmitted by the first radiator, the received reflected signal is coupled to the second radiator, and the target to be detected is detected again. This can increase the strength of the signal output from the coupler assembly to the transceiver, thereby improving the detection effect of the distance detection of the target to be detected. In addition, the RF chip assembly provided in the embodiment of the present application can transmit and receive signals through the radiator and determine the distance of the target to be detected based on the change in the signal load impedance. Therefore, it is applicable to different types of antennas.

[0008] It should be understood that the transceiver in the embodiment of the present application may also be referred to as a transceiver or a radio frequency integrated circuit (RFIC).

[0009] In conjunction with the first aspect, in certain implementations of the first aspect, the coupler assembly includes a first coupler and a second coupler. The first coupler includes an input port, a first load port, a third port, and a fourth port; the second coupler includes a fifth port, a second load port, a seventh port, and an eighth port. The seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0010] The RF chip assembly provided in the embodiment of the present application can couple the first coupler and the second coupler to serve as a coupler assembly, and can couple the first reflected signal received by the first radiator and returned from the target to be detected through the second coupler, so that the signal can be transmitted again through the second radiator and the returned signal can be received, thereby realizing secondary detection of the target to be detected, and then performing distance detection based on the results of the signal coupling by the two couplers, thereby improving the detection effect of the distance detection of the target to be detected.

[0011] Optionally, the first coupler is arranged inside a radio frequency front-end (RFFE), which also includes a power amplifier, a duplexer and other parts.

[0012] Optionally, the coupler assembly may be partially or completely packaged together with the transceiver. For example, the RF front end and the transceiver are designed as one body.

[0013] In conjunction with the first aspect, in certain implementations of the first aspect, the coupler assembly includes a second output port, and the receiving port of the transceiver includes a first receiving port and a second receiving port. The coupler assembly is coupled to the transceiver via the input port, the first output port, and the second output port, wherein the first output port of the coupler assembly is coupled to the first receiving port of the transceiver, the second output port of the coupler assembly is coupled to the second receiving port of the transceiver, and the second output port serves as a fourth port.

[0014] The RF chip assembly provided in the embodiment of the present application can sample the signal transmitted by the transceiver coupled to the input port as a reference signal by coupling the transceiver to the fourth port of the coupler assembly coupled to the input port. Furthermore, by coupling the transceiver to the first output port of the coupler assembly, the signal, after secondary coupling by the second radiator, can be transmitted to the transceiver as a sensing signal. This allows the transceiver to compare the signal, which has been altered by the target to be detected, with the reference signal, thereby improving the accuracy of the transceiver's distance detection of the target to be detected.

[0015] In combination with the first aspect, in some implementations of the first aspect, when the first output port is the seventh port, the eighth port is coupled to the second load port.

[0016] The RF chip assembly provided in the embodiment of the present application couples the two isolated ports of the second coupler so that, when the coupler assembly is coupled to the second radiator, the signal coupled from the first coupler to the fifth port can be simultaneously transmitted to the second radiator through the second load port and the eighth port, or the signal received from the second radiator can be transmitted to the first output port through the second load port and the eighth port, thereby improving the intensity of the signal emission coupled to the second radiator and the signal intensity output by the second coupler to the transceiver, thereby improving the sensitivity of distance detection to the target to be detected.

[0017] In conjunction with the first aspect, in certain implementations of the first aspect, when the coupler assembly is coupled to the transceiver via the input port and the first output port, a first switch is further provided in the connection circuit between the first coupler and the second coupler. The first switch has a first end, a second end, and a third end. The first end and the second end are coupled to the third port and the fourth port of the first coupler, respectively, and the third end is coupled to the fifth port of the second coupler.

[0018] The radio frequency chip assembly provided in the embodiment of the present application can simplify the circuit by providing a first switch on the connection circuit between the first coupler and the second coupler, so that the signals output from the first coupler through the third port and the fourth port are coupled to the second coupler by the switch.

[0019] Optionally, the first switch is a double-pole double-throw (DPDT) switch.

[0020] In conjunction with the first aspect, in certain implementations of the first aspect, the third end of the first switch is further coupled to the second switch, and the receiving port of the transceiver is further coupled to the third switch. The third end of the first switch is selectively coupled to the transceiver via the second switch and the third switch. Alternatively, the third end of the first switch is selectively coupled to the fifth port of the second coupler via the second switch, and the seventh port of the second coupler is selectively coupled to the transceiver via the third switch.

[0021] The RF chip assembly provided in the embodiments of the present application can directly couple the first coupler to the transceiver by coupling the first switch to the second switch and the third switch, thereby detecting and tracking the transmission power of the first radiator and thus enabling power calibration. Alternatively, the second switch and the third switch can also couple the first coupler, the second coupler, and the transceiver, thereby achieving a function of distance detection to a target to be detected.

[0022] Optionally, the second switch and the third switch are single-pole double-throw switches.

[0023] In combination with the first aspect, in some implementations of the first aspect, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

[0024] The RF chip assembly provided in the embodiment of the present application can ensure that the isolation between the first radiator and the second radiator is within a certain range by limiting the distance between the first radiator and the second radiator, so that the influence of the distance of the target to be detected on the isolation can be obtained according to the change of the signal, thereby improving the detection effect of the distance detection of the target to be detected.

[0025] In combination with the first aspect, in some implementations of the first aspect, at least portions of the length directions of the first radiator and the second radiator are the same.

[0026] The radio frequency chip assembly provided in the embodiment of the present application can provide energy superposition in the length direction by making the first radiator and the second radiator at least partially identical, thereby improving the measurement effect of the distance detection of the target to be detected.

[0027] In combination with the first aspect, in some implementations of the first aspect, the first radiator is used to operate as a radiator of the first antenna, and the second radiator is used to operate as a radiator of the second antenna, wherein the resonant frequency bands of the first radiator and the second radiator at least partially overlap.

[0028] The radio frequency chip assembly provided in the embodiment of the present application enables the resonant frequency bands of the first radiator and the second radiator to at least partially overlap, so that the second radiator can receive the signal emitted by the first radiator, thereby improving the sensitivity of distance detection to the target to be detected.

[0029] In a second aspect, the present application provides a distance detection method, which can be applied to a radio frequency chip assembly, the radio frequency chip assembly including a transceiver, a first coupler, a second coupler, a first radiator, and a second radiator. The method includes: the transceiver sends a first signal to the first coupler, the first coupler outputs a first detection signal based on the first signal, the first radiator sends the first detection signal and receives a first reflected signal returned from a target to be detected, the first coupler samples the first reflected signal to output a first sampling signal, the second coupler outputs a second detection signal based on the first sampling signal output by the first coupler, the second radiator sends a second detection signal and receives a signal returned from the target to be detected, and the second coupler outputs a sensing signal based on the signal received by the second radiator. The transceiver detects the distance of the target to be detected based on the sensing signal.

[0030] The method provided in the embodiment of the present application can couple the first reflected signal returned from the target to be detected received by the first coupler through the second coupler and then transmit the signal again through the second radiator, so that distance detection can be performed based on the results of signal coupling by the two couplers, thereby improving the sensitivity of distance detection to the target to be detected.

[0031] In conjunction with the second aspect, in certain implementations of the second aspect, the method further includes: the first coupler outputting a first reference signal to the transceiver, where the first reference signal includes a second sampled signal obtained by the first coupler sampling the first signal. The transceiver performs distance detection on the target to be detected based on the first reference signal and the sensing signal.

[0032] The method provided in the embodiment of the present application sends a reference signal different from the sensing signal to the transceiver, so that the transceiver can compare and process the signal after being changed by the target to be detected with the reference signal, thereby improving the accuracy of the transceiver's distance detection of the target to be detected.

[0033] In conjunction with the second aspect, in certain implementations of the second aspect, the method further includes: the second coupler outputting a second reference signal to the transceiver, where the second reference signal includes a signal output by the second coupler based on a third sampled signal obtained by sampling the first signal by the first coupler. The transceiver performs distance detection on the target to be detected based on the second reference signal and the sensing signal.

[0034] In combination with the second aspect, in some implementations of the second aspect, the second radiator is further used to receive the first detection signal sent by the first radiator.

[0035] In combination with the second aspect, in some implementations of the second aspect, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies N≤L1×3 and / or N≤L2×3.

[0036] In conjunction with the second aspect, in certain implementations of the second aspect, the RF chip assembly further includes a second switch and a third switch. The method further includes: when the first coupler is coupled to the transceiver via the second switch and the third switch, the transceiver is configured to send a second signal to the first coupler, the first coupler is configured to sample the second signal to output a fourth sampled signal, and the transceiver is further configured to adjust the transmit power based on the fourth sampled signal. When the first coupler is coupled to the second coupler via the second switch, and the second coupler is coupled to the transceiver via the third switch, the transceiver is configured to send the first signal to the first coupler.

[0037] In combination with the second aspect, in certain implementations of the second aspect, the method further includes the transceiver adjusting the transmission power according to a distance detection result of the target to be detected.

[0038] In a third aspect, the present application provides an electronic device, comprising a housing. A mainboard, which is disposed in the housing. A first radiator and a second radiator, wherein the first radiator and / or the second radiator are disposed on the mainboard or attached to the housing or are part of the housing. A radio frequency chip assembly, wherein the radio frequency chip assembly is disposed in the housing. The radio frequency chip assembly includes a transceiver and a coupler assembly, the coupler assembly includes an input port, a first output port, a first load port, and a second load port, and the transceiver includes a transmitting port and a receiving port. The coupler assembly is coupled to the transceiver via the input port and the first output port, the input port and the transmitting port are coupled, the first output port and the receiving port are coupled, the first load port is coupled to the first radiator, and the second load port is coupled to the second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0039] In conjunction with the third aspect, in certain implementations of the third aspect, the coupler assembly includes a first coupler and a second coupler, the first coupler including an input port, a first load port, a third port, and a fourth port, and the second coupler including a fifth port, a second load port, a seventh port, and an eighth port. The seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0040] In combination with the third aspect, in certain implementations of the third aspect, the coupler component includes a second output port, the receiving port of the transceiver includes a first receiving port and a second receiving port, and the coupler component is coupled to the transceiver through the input port, the first output port and the second output port, wherein the first output port and the first receiving port are coupled, the second output port and the second receiving port are coupled, and the second output port is a fourth port.

[0041] Optionally, when the first output port is the seventh port, the eighth port is coupled to the second load port.

[0042] In combination with the third aspect, in some implementations of the third aspect, the first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port and the first load port are coupled and connected, and the second feeding port and the second load port are coupled and connected.

[0043] In combination with the third aspect, in some implementations of the third aspect, the second radiator is further used to receive the first detection signal sent by the first radiator.

[0044] In combination with the third aspect, in some implementations of the third aspect, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

[0045] In combination with the third aspect, in some implementations of the third aspect, the first radiator is also used to operate as the radiator of the first antenna, and the second radiator is also used to operate as the radiator of the second antenna, wherein the resonant frequency bands of the first radiator and the second radiator at least partially overlap.

[0046] In combination with the third aspect, in certain implementations of the third aspect, at least portions of the length directions of the first radiator and the second radiator are the same.

[0047] In combination with the third aspect, in some implementations of the third aspect, at least one of the first radiator and the second radiator is provided with a grounding point, and the grounding point is coupled to the floor through a component or directly coupled to the floor.

[0048] In combination with the third aspect, in certain implementations of the third aspect, the transceiver is further configured to adjust the transmission power according to a distance detection result of the target to be detected.

[0049] The technical effects that can be achieved in the second and third aspects mentioned above can be described with reference to the technical effects in the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] FIG1 is a schematic diagram of a directional coupler.

[0051] FIG2 is a schematic diagram of a bidirectional coupler.

[0052] FIG3 is a schematic structural diagram of a radio frequency chip assembly provided in an embodiment of the present application.

[0053] FIG4 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0054] FIG5 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0055] FIG6 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0056] FIG7 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0057] FIG8 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0058] FIG9 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0059] FIG10 is a schematic structural diagram of a radio frequency chip assembly provided in an embodiment of the present application.

[0060] FIG11 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application.

[0061] FIG12 is a schematic diagram of a frequency mixing detection process provided in an embodiment of the present application.

[0062] FIG13 is a schematic diagram of another frequency mixing detection process provided in an embodiment of the present application.

[0063] FIG14 is a schematic diagram of another frequency mixing detection process provided in an embodiment of the present application.

[0064] FIG15 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0065] FIG16 is a partial schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0066] FIG17 is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application.

[0067] FIG18 is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application.

[0068] FIG19 is a flow chart of a distance detection method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0069] The following explains the terms that may appear in the embodiments of the present application.

[0070] It should be understood that the term "and / or" as used herein is simply a term used to describe the existence of three possible relationships between related objects. For example, "A and / or B" can represent the existence of A alone, the existence of both A and B, and the existence of B alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0071] As used in this application, “within the range of…” includes both end values ​​of the range by default. For example, within the range of 1 to 5, the two values ​​1 and 5 are included.

[0072] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupling connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be referred to as "electrical connection", which is understood as the physical contact and electrical conduction between components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be referred to as capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gap between two conductive parts.

[0073] Component / device: includes at least one of lumped component / device and distributed component / device.

[0074] Lumped component / device: This refers to all components whose size is much smaller than the wavelength relative to the circuit's operating frequency. For a signal, the component's characteristics remain constant at all times, regardless of frequency.

[0075] Distributed components / devices: Unlike lumped components, if the size of the component is similar to or larger than the wavelength relative to the circuit operating frequency, then when the signal passes through the component, the characteristics of each point of the component itself will vary due to changes in the signal. At this time, the component as a whole cannot be regarded as a single entity with fixed characteristics, but should be called a distributed component.

[0076] Radiator: A device in an antenna used to receive / send electromagnetic wave radiation. In some cases, the narrow meaning of "antenna" is the radiator, which converts the guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, used to radiate and receive radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via the feeder line, where it is converted into a certain polarized electromagnetic wave energy and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a certain polarization from a specific direction in space into modulated high-frequency current energy and transmits it to the receiver input via the feeder line.

[0077] The radiator may include a conductor with a specific shape and size, such as a linear or sheet shape, etc., and the present application does not limit the specific shape. In one embodiment, the linear radiator can be simply referred to as a linear antenna. In one embodiment, the linear radiator can be implemented by a conductive frame, and can also be called a frame antenna. In one embodiment, the linear radiator can be implemented by a bracket conductor, and can also be called a bracket antenna. In one embodiment, the wire diameter (for example, including thickness and width) of the linear radiator, or the radiator of the linear antenna is much smaller than the wavelength (for example, the wavelength of the medium) (for example, less than 1 / 16 of the wavelength), and the length can be comparable to the wavelength (for example, the wavelength of the medium) (for example, the length is about 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of linear antennas include dipole antennas, half-wave oscillator antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFA, Inverted F Antenna). For example, for a dipole antenna, each dipole antenna typically includes two radiating branches, and each branch is fed by a feeding portion from the feeding end of the radiating branch. For example, an inverted-F antenna (IFA) can be regarded as a monopole antenna with a ground path added. The IFA antenna has a feeding point and a grounding point, and is called an inverted-F antenna because its side view is an inverted-F shape. In one embodiment, the sheet radiator may include a microstrip antenna, or a patch antenna, such as a planar inverted-F antenna (also known as a PIFA, Planar Inverted F Antenna). In one embodiment, the sheet radiator may be implemented by a planar conductor (such as a conductive sheet or a conductive coating, etc.). In one embodiment, the sheet radiator may include a conductive sheet, such as a copper sheet, etc. In one embodiment, the sheet radiator may include a conductive coating, such as a silver paste, etc. The shape of the sheet radiator includes circular, rectangular, annular, etc., and the present application does not limit the specific shape. The structure of a microstrip antenna generally consists of a dielectric substrate, a radiator, and a floor, wherein the dielectric substrate is arranged between the radiator and the floor.

[0078] The radiator may also include a slot or slot formed in a conductor, for example, a closed or semi-closed slot or slot formed in a grounded conductor surface. In one embodiment, a slotted or slotted radiator may be referred to as a slot antenna or slot antenna. In one embodiment, the radial dimension (e.g., including the width) of the slot or slot of the slot antenna / slot antenna is much smaller than the wavelength (e.g., the dielectric wavelength) (e.g., less than 1 / 16 of the wavelength), and the length dimension may be comparable to the wavelength (e.g., the dielectric wavelength) (e.g., the length is approximately 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). In one embodiment, a radiator with a closed slot or slot may be referred to as a closed slot antenna. In one embodiment, a radiator with a semi-closed slot or slot (e.g., a closed slot or slot with an additional opening) may be referred to as an open slot antenna. In some embodiments, the slot is elongated. In some embodiments, the slot is approximately half a wavelength (e.g., the dielectric wavelength). In some embodiments, the slot is approximately an integer multiple of the wavelength (e.g., one wavelength). In some embodiments, the slot can be fed with a transmission line spanning one or both sides, thereby exciting a radio frequency electromagnetic field in the slot and radiating electromagnetic waves into space. In one embodiment, the radiator of a slot antenna or slot antenna can be implemented as a conductive frame with both ends grounded, also known as a frame antenna. In this embodiment, the slot antenna or slot antenna can be considered to include a linear radiator spaced from the floor and grounded at both ends, thereby forming a closed or semi-enclosed slot or slot. In one embodiment, the radiator of a slot antenna or slot antenna can be implemented as a bracket conductor with both ends grounded, also known as a bracket antenna.

[0079] The feed source / feed circuit is a combination of all circuits used for receiving and transmitting radio frequency signals. The feed circuit may include a transceiver and an RF front end circuit. In some cases, the "feed circuit" is understood in a narrow sense as an RF chip RFIC, which can be considered to include an RF front end chip and a transceiver. The feed circuit has the function of converting radio waves (e.g., radio frequency signals) and electrical signals (e.g., digital signals). Generally, it is considered to be part of the radio frequency.

[0080] In some embodiments, the electronic device may also include a test socket (also known as an RF socket, RF test socket, or feed port). This test socket can be used to insert a coaxial cable to test the characteristics of the RF front-end circuit or the antenna radiator through the cable. The RF front-end circuit can be considered as the circuit portion coupled between the test socket and the transceiver.

[0081] In some embodiments, the RF front-end circuit may be integrated into a RF front-end chip in the electronic device, or the RF front-end circuit and the transceiver may be integrated into a RF chip in the electronic device.

[0082] It should be understood that any two of the first / second / ...Nth feeding circuits in the present application can share the same transceiver, for example, transmitting signals through a radio frequency channel in a transceiver (for example, a port (pin) of a radio frequency chip); they can also share a radio frequency front-end circuit, for example, processing signals through a switch or amplifier in a radio frequency front-end.

[0083] It should also be understood that two feeding circuits in the first / second / ...Nth feeding circuit in the present application usually correspond to two radio frequency test sockets in the electronic device.

[0084] Antenna return loss: This can be understood as the ratio of the signal power reflected back to the antenna port by the antenna circuit to the antenna port's transmitted power. The smaller the reflected signal, the larger the signal radiated from the antenna into space, and the greater the antenna's radiation efficiency. The larger the reflected signal, the smaller the signal radiated from the antenna into space, and the lower the antenna's radiation efficiency.

[0085] Antenna return loss can be expressed using the S11 parameter, a type of S parameter. S11 represents the reflection coefficient and characterizes the antenna's transmission efficiency. The S11 parameter is typically negative. A smaller S11 parameter indicates lower antenna return loss and less energy reflected back from the antenna itself, meaning more energy actually enters the antenna and higher system efficiency. A larger S11 parameter indicates greater antenna return loss and lower system efficiency.

[0086] Ground (GND): can generally refer to at least a part of any grounding layer, grounding plate, or grounding metal layer in an electronic device (such as a mobile phone), or at least a part of any combination of any of the above grounding layers, grounding plates, or grounding components, etc. "Ground" can be used for grounding components in an electronic device. In one embodiment, "ground" can be the grounding layer of a circuit board of an electronic device, or it can be the grounding plate formed by the middle frame of the electronic device, or the grounding metal layer formed by the metal film under the screen. In one embodiment, the circuit board can be a printed circuit board (PCB), such as an 8-layer, 10-layer, or 12 to 14-layer board having 8, 10, 12, 13, or 14 layers of conductive material, or an element separated and electrically insulated by a dielectric layer or insulating layer such as fiberglass, polymer, etc. In one embodiment, the circuit board includes a dielectric substrate, a grounding layer, and a routing layer, and the routing layer and the grounding layer are electrically connected through vias. In one embodiment, components such as a display, touch screen, input buttons, transceiver, processor, memory, battery, charging circuit, and system-on-chip (SoC) structures can be mounted on or connected to a circuit board, or electrically connected to a trace layer and / or ground layer in the circuit board. For example, a radio frequency source can be located on the trace layer.

[0087] Any of the above-mentioned grounding layers, grounding plates, or grounding metal layers are made of a conductive material. In one embodiment, the conductive material can be any of the following: copper, aluminum, stainless steel, brass, and alloys thereof, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil and tin-plated copper on an insulating substrate, cloth impregnated with graphite powder, a graphite-coated substrate, a copper-plated substrate, a brass-plated substrate, and an aluminum-plated substrate. Those skilled in the art will appreciate that the grounding layer / grounding plate / grounding metal layer can also be made of other conductive materials.

[0088] Grounding refers to coupling with the ground / floor via a grounding structure and / or grounding circuit. In one embodiment, grounding can be achieved through physical grounding, such as achieving physical grounding at a specific location on the frame through a portion of the middle frame's structural components (or referred to as a physical ground). In one embodiment, grounding can be achieved through device grounding, such as grounding through a capacitor, inductor, resistor, or other device connected in series or parallel (or referred to as a device ground).

[0089] Isolation: This refers to the degree of mutual influence between different signal paths in a radio frequency system. For antennas, isolation describes the degree of mutual interference between different antennas during reception and transmission.

[0090] The technical solutions of the embodiments of the present application will be described below with reference to the accompanying drawings.

[0091] In recent years, with the development of communication technology, the application of wireless communication equipment has become more and more extensive, and wireless communication equipment has been continuously updated. It should be noted that the wireless communication device mentioned in the embodiments of the present application may refer to a device that provides voice and / or data connectivity to users, and can be used to connect people, objects and machines, such as a handheld device with wireless connection function, a vehicle-mounted device, etc. The wireless communication device in the embodiments of the present application may be, for example, a mobile phone, a tablet computer (Pad), a laptop computer, a PDA, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical surgery, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, etc.

[0092] Wireless communication devices typically include a baseband system and a radio frequency system. The baseband system generates baseband signals, while the radio frequency system converts the baseband signals into radio frequency signals, which are then transmitted into wireless channels via antennas.

[0093] Because the SAR value is proportional to the antenna's conducted power, the industry currently uses radio frequency power reduction, or power backoff, to prevent high SAR values. In actual use, the SAR value can be adjusted based on the antenna's radiated power. In some implementations, the antenna's radiated power can be measured by measuring the antenna's forward transmit power or by measuring the antenna's reflected power.

[0094] Since the antenna is the last impedance element in the RF circuit, measuring the reflected power of the antenna can include changes in SAR caused by external influences on the antenna's performance.

[0095] In the RF transmission system of communications equipment, if there is a load mismatch, a portion of the incident power will be reflected back to the signal source. Due to different mismatch conditions, the same incident signal will produce different reflected signals. The degree of mismatch is usually quantified using return loss (RL), also known as reflection loss. RL = incident power / reflected power.

[0096] Return loss is the ratio of incident power to reflected power in an RF circuit. It examines input-output mismatch from a power perspective. For example, if 1mW (0dBm) of power is input to an antenna and 10% of it is reflected (reflected), the return loss is 10dB. Given fixed parameters such as RF circuit component impedance, antenna efficiency, and antenna radiation pattern, the return loss of an RF circuit is also fixed.

[0097] There are many ways to measure the reflected power of an antenna. You can measure the power of the entire reflected signal of the antenna, or you can measure the power of a sampled signal of the reflected signal of the antenna.

[0098] The load reflection detector can use a coupler to transmit a detection signal and receive a load reflection signal. After the detection signal is transmitted, if the distance to the target to be measured changes, the equivalent load impedance of the load reflection signal received by the detector changes, causing the load reflection signal to produce a change in amplitude and / or phase. After receiving the load reflection signal, the system can judge the distance to the target to be measured based on the degree of change in the reflection signal. Among them, the coupler is a power distribution device. In the radio frequency transceiver system, the signal can be "sampled" through the coupler. Figure 1 is a structural diagram of a directional coupler. As shown in Figure 1, the signal size of the coupling path is proportional to the size of the signal passing through the coupler. The ratio of the coupled signal to the input signal is called the coupling coefficient or coupling amount. The coupling coefficient of the coupler is usually fixed. More and more radio frequency systems use couplers as a means of detecting power. Couplers include directional couplers and bidirectional couplers. Directional couplers include forward couplers and backward couplers (or reverse couplers), while bidirectional couplers include bi-directional couplers and dual-directional couplers. In some embodiments, a bidirectional coupler (i.e., a bidirectional directional coupler) can be formed by stacking two directional couplers in opposite directions, where the isolation terminals of the directional couplers can be hidden inside the component.

[0099] Figure 2 is a schematic diagram of a bidirectional coupler. As shown in Figure 2, the bidirectional coupler includes four ports, each of which can receive a forward input signal or output a reverse signal for power coupling. For example, when port 201 serves as the input port (RF input, or input port, or input), port 202 serves as the output port (RF output, or output port, or output), and port 204 serves as the coupled port (coupled port, or coupled forward, or coupled). Assuming the coupling capacity of the coupler is C, the coupled signal at port 204 is equal to C·the input signal at port 201, and the output signal at port 202 is equal to (1-C)·the input signal at port 201. Port 203 serves as an isolated port (or coupled reverse, or isolated), and can be considered as having no signal output from port 203. In one embodiment, the signal output from port 203 is much smaller than the signal output from port 204. In other words, the energy of the input signal at the input port is approximately equal to the sum of the energies of the output signals at the output port and the coupled port.

[0100] Existing distance sensors typically use capacitive sensors. Capacitive sensors generate a fixed-frequency electric field through capacitance and determine the object's distance based on the change in its equivalent dielectric as the object approaches the sensor. Because capacitive sensors reduce their load when grounded, the induced current is directed toward the floor, preventing the sensor from acquiring a valid signal. Therefore, capacitive sensors are only suitable for use with suspended antennas and not grounded antennas. Furthermore, existing load-reflective detectors have low sensitivity, making them difficult to meet practical application requirements.

[0101] In view of the above technical problems, the present application provides a radio frequency chip component, a distance detection method and an electronic device, which can improve the sensitivity of distance detection to the target to be detected.

[0102] The radio frequency chip assembly provided in an embodiment of the present application includes a transceiver and a coupler assembly. The coupler assembly includes an input port, a first output port, a first load port, and a second load port. The coupler assembly is coupled to the transceiver via the input port and the first output port. The first load port is used to couple to a first radiator, and the second load port is used to couple to a second radiator. The first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0103] The RF chip assembly provided in this application is described below with reference to FIG. 3 to FIG. 11 .

[0104] FIG10 is a schematic structural diagram of a radio frequency chip assembly provided in an embodiment of the present application.

[0105] As shown in Figure 10, the RF chip assembly provided in the embodiment of the present application includes a transceiver 1010 and a coupler assembly 1020. The coupler assembly includes an input port 1021, an output port 1035, a first load port 1022, and a second load port 1032. The transceiver includes a transmit port 1011 and a receive port 1012.

[0106] Coupler assembly 1020 is coupled to transceiver 1010 via input port 1021 and output port 1035. Specifically, transceiver 1010 includes a transmit port 1011 and a receive port 1012. Input port 1021 of coupler assembly 1020 is coupled to transmit port 1011 of transceiver 1010, and a first output port of coupler assembly 1020 is coupled to receive port 1012 of transceiver 1010. Transmit port 1011 is used to transmit radio frequency signals, and receive port 1012 is used to receive sensing signals. It should be understood that the sensing signal refers to the signal resulting from the coupling of the two radiators output by coupler assembly 1020. Transmit port 1011 is coupled to input port 1021 of coupler assembly 1020, and receive port 1012 is coupled to output port 1035 of coupler assembly 1020. It should be understood that the transceiver 1010 in the embodiment of the present application may also be referred to as a transceiver or a radio frequency integrated circuit, and the transceiver 1010 may also be replaced by an independent radio frequency transmitter (transmitter) and a radio frequency receiver (receiver), and the combination of a radio frequency transmitter and a radio frequency receiver may also be replaced by a radio frequency transceiver.

[0107] The first load port 1022 in the coupler assembly 1020 is used to couple the first radiator 1051 , and the second load port 1032 is used to couple the second radiator 1052 . The first load port 1022 and the second load port 1032 are coupled, and the output port 1035 and the second load port 1032 are coupled.

[0108] Specifically, a target to be detected is shown on the right side of Figure 10. When the RF chip assembly performs distance detection on the target to be detected, the transceiver 1010 transmits a radio frequency signal to the input port 1021 of the coupler assembly 1020 through the transmitting port 1011. The radio frequency signal is transmitted to the target to be detected through the first radiator 1051 coupled to the first load port 1022. The first radiator 1051 then receives the reflected signal returned from the target to be detected. It should be understood that as the distance to the target to be detected changes, the reflected signal will also change accordingly. It can also be understood that the signal reflected by the target to be detected produces a change in amplitude and / or phase. Therefore, the distance to the target to be detected can be determined based on the degree of change in the signal. The first radiator 1051 couples the reflected signal to the second load port 1032 via the first load port 1022 of the coupler assembly 1020. The reflected signal is then transmitted to the target to be detected by the second radiator 1052 coupled to the second load port 1032. The second radiator 1052 then receives the reflected signal returned from the target to be detected and couples the signal to the receiving port 1012 of the transceiver 1010 via the output port 1035 of the coupler assembly 1020. The transceiver 1010 processes the signal coupled by the coupler assembly 1020 to detect the distance to the target to be detected.

[0109] In this way, by coupling the first load port 1022 and the second load port 1032 for connecting the two radiators, the signal transmitted by the transceiver 1010 through the coupler component 1020 can be transmitted through the first radiator 1051, and the received reflected signal can be coupled to the second radiator 1052, and the target to be detected can be detected again, thereby improving the strength of the signal output from the coupler component 1020 to the transceiver 1010, thereby improving the detection effect of the distance detection of the target to be detected. In addition, the RF chip assembly provided in the embodiment of the present application can transmit and receive signals through the radiator and determine the distance of the target to be detected based on the change in the signal load impedance, and thus can be applied to different types of antennas.

[0110] In some embodiments, as shown in FIG10 , the first radiator 1051 is provided with a first feeding port 1041, and the second radiator 1052 is provided with a second feeding port 1042. The first feeding port 1041 is coupled to the first load port 1022, and the second feeding port 1042 is coupled to the second load port 1032. The first feeding port 1041 and the second feeding port 1042 are fed by the transceiver 1010, and the signals within the transceiver 1010 are synchronized.

[0111] In some embodiments, the coupler assembly 1020 may be partially or completely packaged together with the transceiver 1010. For details, please refer to the description in the subsequent embodiments.

[0112] Specifically, the coupling manner between the first load port 1022 and the second load port 1032 , and the coupling manner between the output port 1035 and the second load port 1032 may refer to the description in subsequent embodiments.

[0113] In the embodiment of the present application, the output port 1035 of the coupler assembly 1020 is further used to output a reference signal to the transceiver 1010 , and the transceiver 1010 is used to detect the distance of the target to be detected based on the reference signal and the sensing signal returned from the target to be detected.

[0114] In this way, the transceiver can compare the signal changed by the target to be detected with the reference signal, thereby improving the accuracy of the transceiver in detecting the distance to the target to be detected.

[0115] In an embodiment of the present application, the transceiver 1010 is also used to perform power detection on the received signal and determine the distance of the target to be detected based on the processing of the amplitude and / or phase of the received signal. Optionally, the transceiver 1010 includes a low noise amplifier (LNA), which is used to amplify the received signal. Optionally, the transceiver 1010 includes a filter, which can be connected to the above-mentioned LNA and is mainly used to filter out in-band interference sources, such as interference signals generated in the LNA and other channels, separate useful signals from noise, and improve the signal's anti-interference ability and signal-to-noise ratio. Optionally, the transceiver 1010 includes a mixer, which can be located after the above-mentioned filter and LNA to process the RF signal amplified by the LNA. The mixer is usually composed of a nonlinear element and a frequency selection circuit. The details will be described below.

[0116] In some embodiments, the coupler assembly includes a second output port, and the coupler assembly is coupled to the transceiver via the input port, the first output port, and the second output port.

[0117] For example, Figure 11 is a schematic diagram of the structure of another RF chip assembly provided in an embodiment of the present application. As shown in Figure 11, compared to the RF chip assembly shown in Figure 10, the RF chip assembly provided in an embodiment of the present application includes a coupler assembly 1030, wherein the coupler assembly 1030 includes an input port 1021, a first output port 1033, a second output port 1024, a first load port 1022, and a second load port 1032.

[0118] Specifically, the coupler assembly 1030 is coupled to the transceiver 1010 via an input port 1021, a first output port 1033, and a second output port 1024. The receiving ports of the transceiver 1010 include a first receiving port 1012 and a second receiving port 1013. The transceiver 1010 includes a transmit port 1011, a first receiving port 1012, and a second receiving port 1013. The transmit port 1011 is used to transmit radio frequency signals, the first receiving port 1012 is used to receive sensing signals, and the second receiving port 1013 is used to receive reference signals. The transmit port 1011 is coupled to the input port 1021 of the coupler assembly 1030, the first receiving port 1012 is coupled to the first output port 1033 of the coupler assembly 1030, and the second receiving port 1013 is coupled to the second output port 1024 of the coupler assembly 1030.

[0119] In some embodiments, the coupler assembly includes a first coupler and a second coupler, the first coupler includes an input port, a first load port, a third port, and a fourth port, the second coupler includes a fifth port, a second load port, a seventh port, and an eighth port, wherein the seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0120] In this way, the first coupler and the second coupler can be coupled and connected as a coupler assembly, so that the first reflected signal returned from the target to be detected and received by the first radiator can be coupled through the second coupler, and the signal can be transmitted again through the second radiator and the signal returned from the target to be detected can be received, thereby realizing secondary detection of the target to be detected, and then the distance detection can be performed based on the results of the signal coupling by the two couplers, thereby improving the detection effect of the distance detection of the target to be detected.

[0121] A detailed description is given below with reference to FIG. 3 to FIG. 9 .

[0122] FIG3 is a schematic diagram of the structure of a radio frequency chip assembly provided in an embodiment of the present application. As shown in FIG3 , the radio frequency chip assembly provided in an embodiment of the present application includes a transceiver 310, a first coupler 320, and a second coupler 330. The first coupler 320 is coupled to a first radiator 351, and the second coupler 330 is coupled to a second radiator 352. The transceiver 310 couples the first coupler 320 and the second coupler 330 via ports 311, 312, and 313. Port 311 is the transmitting port of the transceiver 310, and ports 312 and 313 are the receiving ports of the transceiver 310.

[0123] In the embodiment of the present application, the first coupler 320 includes a port 321, a port 322, a port 323, and a port 324. The second coupler 330 includes a port 331, a port 332, a port 333, and a port 334. Port 311 of the transceiver 310 is coupled to the first coupler 320 via port 321, the first coupler 320 is coupled to the port 331 of the second coupler 330 via port 323, the first coupler 320 is coupled to the port 313 of the transceiver 310 via port 324, and the second coupler 330 is coupled to the port 312 of the transceiver 310 via port 333. The first radiator 351 is provided with a feeding port 341, and the second radiator 352 is provided with a feeding port 342. The first radiator 351 is coupled to the port 322 of the first coupler 320 via the feeding port 341, and the second radiator 352 is coupled to the port 332 of the second coupler 330 via the feeding port 342. The feeding port 341 and the feeding port 342 are fed by the transceiver 310 , and the signals in the transceiver 310 are synchronized.

[0124] It should be understood that the embodiment of the present application may correspond to the embodiment shown in FIG. 11 , wherein the transceiver 1010 shown in FIG. 11 may be the transceiver 310, wherein the transmit port 1011 may be the port 311, the first receive port 1012 may be the port 312, and the second receive port 1013 may be the port 313; the input port 1021 of the coupler assembly 1030 may be the port 321, the first output port 1033 may be the port 333, the second output port 1024 may be the port 324, the first load port 1022 may be the port 322, and the second load port 1032 may be the port 332. When the first coupler 320 and the second coupler 330 are partially or completely packaged with the transceiver 310, the corresponding ports may be concealed by the package. For example, when the first coupler 320 and the transceiver 310 are packaged, the ports 311 and 321 may be concealed by the package. This application will not elaborate on this.

[0125] In this embodiment of the present application, first coupler 320 and second coupler 330 are bidirectional couplers. When port 321 serves as an input port, port 323 serves as an isolation port, meaning that port 321 is isolated from port 323. Port 324 serves as a coupling port, meaning that port 321 is coupled to port 324. Port 322 serves as the output port of port 321. Port 321 can also serve as the output port of port 322. In this case, port 322 serves as the input port, port 323 serves as the coupling port to port 322, and port 324 serves as the isolation port of port 322. The ports of second coupler 330 are similar to those of first coupler 320.

[0126] Specifically, port 321 is isolated from port 323, port 322 is isolated from port 324, port 331 is isolated from port 333, and port 333 is isolated from port 334. Signals can be coupled between other ports. For example, port 333 is coupled to port 332. When a signal is input to port 332, the coupled signal can be output through port 333. In addition, because the first coupler 320 is coupled to port 331 of the second coupler 330 via port 323, ports 322 and 324 in the first coupler 320 can be coupled to ports 334 and 332 in the second coupler 330. For example, port 322 is coupled to port 332. In other words, a signal input to port 322 can be output from port 332 after the coupled signal.

[0127] In the embodiment of the present application, the transceiver 310 is configured to transmit a first signal to the first coupler 320, and the first coupler 320 is configured to output a first detection signal based on the first signal. It should be understood that in the first coupler 320, if the coupling amount of the coupler 320 is C, then the signal input from port 321 can be output through port 322, and the output signal of port 322 is ∝(1-C)·the input signal of port 321. Simultaneously, a coupled signal of the input signal of port 321 is output from port 324, and the coupled signal of port 324 is ∝C·the input signal of port 321, where the symbol ∝ indicates a proportional relationship.

[0128] The right side of Figure 3 shows a target to be detected. After the port 322 outputs a signal, the first radiator 351 is used to send a first detection signal and receive a first reflected signal returned from the target to be detected. It should be understood that as the distance of the target to be detected changes, the first reflected signal will also change accordingly. It can also be understood that the signal after being reflected by the target to be detected has an amplitude and / or phase change, so the distance of the target to be detected can be determined based on the degree of change in the signal. At this time, after receiving the first reflected signal returned from the target to be detected, the first radiator 351 uses the port 322 of the first coupler 320 as the input end.

[0129] The first coupler 320 is further configured to sample the first reflected signal to output a first sampled signal. After the first reflected signal is input from port 322, the first coupler 320 outputs the first sampled signal from the coupled end of port 322, i.e., port 323. The signal sampling process by the first coupler 320 can also be understood as a signal coupling process.

[0130] After the two couplers are coupled, the signal input from port 322 of first coupler 320 can be input into coupler 330 via port 331 coupled to the second coupler, and then detected again from port 332 via radiator 352. In other words, ports 322 and 332 can be signal-coupled. Specifically, second coupler 330 is configured to output a second detection signal based on the first sampling signal. It should be understood that after receiving the first sampling signal from port 331, second coupler 330 can output the second detection signal from the output end of port 331, i.e., port 332.

[0131] The second radiator 352 is used to send a second detection signal and receive a signal returned from the target to be detected. At this time, after receiving the signal returned from the target to be detected, the second radiator 352 uses the port 332 of the second coupler 330 as the input end of the signal.

[0132] The second coupler 330 is further configured to output a sensing signal based on the signal received by the second radiator 352. It should be understood that after the signal is input from port 332, the second coupler 330 can output the sensing signal from the coupled end of port 332, i.e., port 333. The second coupler 330 is coupled to the transceiver 310 via port 333, and port 333 is isolated from port 331.

[0133] The transceiver 310 is configured to perform proximity detection on a target to be detected based on the sensing signal.

[0134] In this way, the RF chip assembly provided in the embodiment of the present application can couple the first reflected signal returned from the target to be detected and received by the first radiator 351 through the coupler 330 by coupling the coupler 320 with the coupler 330, so that the signal can be transmitted again through the second radiator 352 and the returned signal can be received, and then the distance detection can be performed based on the results of the signal coupling by the two couplers, thereby improving the detection effect of the distance detection of the target to be detected.

[0135] In some embodiments, the transceiver 310 is further configured to adjust the transmission power according to the distance detection result of the target to be detected.

[0136] It should be understood that the target to be detected can be a biological body or any object.

[0137] In the embodiment of the present application, the port 312 of the transceiver 310 is a sensing port, and the port 313 is a reference port, wherein the sensing port is used to receive a sensing signal, and the reference port is used to receive a reference signal.

[0138] Specifically, as shown in FIG3 , a reference signal can be output to the transceiver 310 via the first coupler 320. The reference signal includes a second sampling signal obtained by sampling the first signal by the first coupler 320. It should be understood that after the transceiver 310 transmits the first signal to the port 321 of the first coupler 320, the second sampling signal obtained by sampling the first signal can be output from the coupled end of the port 321, i.e., the port 324. It should be understood that in the embodiment of the present application, both the first coupler 320 and the second coupler 330 are coupled to the transceiver 310.

[0139] In an embodiment of the present application, the transceiver 310 is used to perform power detection on the received signal. Optionally, the transceiver 310 includes a low-noise amplifier (LNA) for amplifying the received signal. Optionally, the transceiver 310 includes a filter, which can be connected to the LNA and is primarily used to filter out in-band interference sources, such as interference signals generated within the LNA and other channels, to separate useful signals from noise, thereby improving the signal's anti-interference ability and signal-to-noise ratio. Optionally, the transceiver 310 includes a mixer, which can be located after the filter and LNA to process the RF signal amplified by the LNA. A mixer is typically composed of a nonlinear element and a frequency selection circuit.

[0140] Optionally, after receiving the sensing signal and reference signal, the transceiver 310 can perform frequency mixing detection on the two. The output signal from the frequency mixing detection is processed by the transceiver to obtain a detection result, including the location information or distance of the target to be detected. After obtaining the detection result, the transceiver's transmit power can be adjusted based on the result. The frequency mixing detection process is described in detail below with reference to Figures 12 to 14.

[0141] Specifically, FIG12 is a schematic diagram of a mixing detection process provided by an embodiment of the present application. As shown in FIG12, after the sensing signal and the reference signal are power-adjusted by components such as an LNA, the reference signal is input into the mixer through the local oscillator (LO) port of the mixer, and the sensing signal is input into the mixer through the radio frequency (RF) port of the mixer, that is, the sensing signal and the reference signal are mixed and detected with each other. By mixing the above signals, the mixer can output a signal with an intermediate frequency through the intermediate frequency (IF) port, which is then processed by a low-pass filter (LPF) so that the transceiver 340 can perform detection processing.

[0142] Optionally, Figure 13 is a schematic diagram of another frequency mixing detection process provided in an embodiment of the present application. As shown in Figure 13, compared to the frequency mixing detection process shown in Figure 12, in this embodiment, the sensing signal and reference signal undergo power adjustment by components such as an LNA, and then are each smoothly converted to a DC signal by an RMS detector. The average value is used to represent the effective value. Detection processing is then performed by transceiver 310.

[0143] Optionally, Figure 14 is a schematic diagram of another frequency mixing detection process provided in an embodiment of the present application. As shown in Figure 14, compared to the frequency mixing detection process shown in Figure 13, in this embodiment, the sensing signal and the reference signal are power-adjusted by components such as an LNA, and then mixed by different mixers. Furthermore, an additional local oscillator signal is mixed with the sensing signal and the reference signal in different mixers, thereby generating different intermediate frequency signals based on the sensing signal and the reference signal, which are then detected and processed by transceiver 310.

[0144] In some embodiments, the mapping relationship information between the usage status of the electronic device, the detection results of the transceiver, and the SAR value can be pre-stored. Then, the transmission power of the transceiver can be obtained by searching the mapping relationship information based on the usage status of the electronic device and the detection results of the transceiver.

[0145] In some embodiments, when the first output port is the seventh port, the eighth port is connected to the second load port through coupling.

[0146] Specifically, as shown in FIG3 , the first output port may be port 333 of the second coupler 330, and the eighth port and the second load port may be port 334 and port 332 of the second coupler 330, respectively. Ports 332 and 334 of the second coupler 330 are coupled to each other and then coupled to the second radiator 352 via the feeding port 342. Port 334 of the second coupler 330 is coupled to port 332 via a wiring connection, and port 334 is isolated from port 332. After receiving the reflected signal of the target to be detected, the second radiator 352 can simultaneously input the signal into the second coupler 330 through ports 332 and 334 of the second coupler 330. Alternatively, a signal coupled from the first coupler 320 to port 331 can be simultaneously coupled to the second radiator 352 through ports 332 and 334. In this way, by coupling the two isolated ports of the second coupler and then connecting them to the second radiator at the same time, the strength of the transmitted signal coupled to the second radiator and the signal strength output by the second coupler to the transceiver can be increased, thereby improving the sensitivity of distance detection to the target to be detected.

[0147] It should be understood that the port 332 and the port 334 in the second coupler can be packaged into one port, such as the second load port 1024 shown in FIG. 11 , and coupled to the second radiator 1052 through the second load port 1024 .

[0148] Optionally, port 334 is connected to ground via a resistor.

[0149] As shown in Figure 4, Figure 4 is a schematic structural diagram of another radio frequency chip component provided in an embodiment of the present application. Compared to Figure 3, the difference in Figure 4 is that the port 334 of the second coupler 330 is grounded through a resistor. It should be understood that impedance matching refers to designing the input impedance of the load and / or designing the output impedance of the signal source (output impedance, also known as internal impedance) to maximize the power transmission from the signal source to the load and / or minimize the signal reflection at the load end. In an embodiment of the present application, the second coupler 330 is connected to the second radiator through port 332, and port 334 is grounded through a resistor, which can simplify the circuit while keeping the circuit impedance matching. Exemplarily, the resistor is a 50 ohm resistor.

[0150] It should be understood that the above description of the RF chip components in Figures 3 and 4 can also correspond to the RF chip components in Figure 11, that is, the RF chip components shown in Figure 11 can also implement the functions of the RF chip components described in Figures 3 and 4.

[0151] In some embodiments, when the coupler component is coupled to the transceiver via the input port and the first output port, a first switch is further provided on the connection circuit between the first coupler and the second coupler. The first switch has a first end, a second end, and a third end. The first end and the second end are coupled to the third port and the fourth port of the first coupler, respectively, and the third end is coupled to the fifth port of the second coupler.

[0152] For example, as shown in FIG5 , FIG5 is a schematic diagram of the structure of another RF chip assembly provided in an embodiment of the present application. The input port of the coupler assembly may be port 521, and the first output port may be port 534. A switch 561 is further provided on the connection circuit between the first coupler 520 and the second coupler 530. For example, a double-pole double-throw switch. The switch has a first end, a second end, and a third end. The first end and the second end are respectively connected to the two ports of the first coupler 520, namely port 523 and port 524, and the third end is connected to the second coupler 530. The switch is used to control the connection circuit to be conductive after the transceiver 510 sends a first signal, so that the first coupler 520 outputs a signal to the second coupler 530. At this time, the second coupler 530 in the coupler assembly is coupled to the port 512 of the transceiver 510 via the eighth port, namely port 534. It should be understood that after the connection circuit is conductive, the first coupler 520 can output a signal to the second coupler 530 via ports 523 and port 524. Optionally, the switch further includes a fourth terminal, which is grounded via a resistor, for example, a 50 ohm resistor.

[0153] Optionally, the first output port of the coupler assembly may be the port 533 of the second coupler 530 , that is, the coupler assembly is coupled to the transceiver 510 via the port 533 .

[0154] In the embodiment of the present application, when the first output port is the seventh port, the eighth port is coupled to the second load port.

[0155] Specifically, as shown in Figure 5, the first output port may be port 531 in the second coupler 530, and the seventh port and the second load port may be port 533 and port 532 in the second coupler 530, respectively. Port 533 and port 532 in the second coupler 530 are coupled to each other and then coupled to the second radiator 552 via the feeding port 542. Port 534 of the second coupler 530 is coupled to port 532 via a wire, and port 533 is coupled to port 532.

[0156] The following mainly describes the differences between FIG. 5 and FIG. 3 , and most of the same contents are not repeated here.

[0157] In an embodiment of the present application, as shown in FIG5 , the transceiver 510 includes a port 511 and a port 512. Port 511 is a transmitting port, and port 512 is a receiving port. When the second coupler 530 is coupled to the receiving port of the transceiver 510, that is, port 512, via port 533, the second coupler 530 can output a reference signal and a sensing signal to port 512 of the transceiver 510 via port 533. The reference signal includes a signal output by the second coupler 530 based on a third sampling signal obtained by sampling the first signal by the first coupler 520. Specifically, after the transceiver 510 transmits the first signal to port 521 of the first coupler 520, the signal sampled from the coupling end of port 521, that is, port 524, can be output. The signal is then transmitted from port 524 to port 531 of the second coupler 530. The signal is then input to the receiving end of the transceiver 510, that is, port 512, via the second coupler 530.

[0158] In the embodiment of the present application, specifically, the first coupler 520 has a port 521, a port 522, a port 523, and a port 524. The second coupler 530 has a port 531, a port 532, a port 533, and a port 534. The transceiver 510 is coupled to the first coupler 520 via the port 521. The first coupler 520 is coupled to the port 531 of the second coupler 530 via the port 523 and the port 542. The first radiator 551 is coupled to the port 522 of the first coupler 520. The second radiator 552 is coupled to the port 532 of the second coupler 530. In the embodiment of the present application, the first coupler 520 and the second coupler 530 are bidirectional couplers.

[0159] The transceiver 510 is configured to transmit a first signal to the first coupler 520, and the first coupler 520 is configured to output a first detection signal based on the first signal. Specifically, the signal input from the port 521 can be output through the port 522, while the coupled signal of the signal input from the port 521 is output from the port 524. This signal is the third sampling signal obtained by sampling the first signal, and this application will not elaborate on this.

[0160] After outputting the signal from port 522, the first radiator 551 is used to send the first detection signal and receive the first reflected signal returned from the target to be detected. At this time, after receiving the first reflected signal returned from the target to be detected, the first radiator 551 uses port 522 of the first coupler 520 as the input end.

[0161] The first coupler 520 is further configured to sample the first reflected signal to output a first sampled signal. After the first reflected signal is input from the port 522 , the first coupler 520 outputs the first sampled signal from the coupled end of the port 522 , ie, the port 523 .

[0162] The second coupler 530 is configured to output a second detection signal according to the first sampling signal. It should be understood that after receiving the first sampling signal from the port 531 , the second coupler 530 may output the second detection signal from the output end of the port 531 , ie, the port 532 .

[0163] In the embodiment of the present application, when the first output port is the seventh port, the eighth port is coupled to the second load port. That is, port 532 is coupled to port 534 and is coupled to the second radiator 552, wherein port 531 is coupled to port 534.

[0164] Specifically, as shown in Figure 5, the eighth port and the second load port are port 534 and port 532 of the second coupler 530, respectively. Ports 532 and 534 of the second coupler 530 are coupled to each other and then coupled to the second radiator 552 via the feed port 542. Port 534 of the second coupler 530 is coupled to port 532 via a wire, and port 534 is isolated from port 532. After receiving the reflected signal from the target to be detected, the second radiator 552 can simultaneously input the signal into the second coupler 530 through both ports 532 and 534 of the second coupler 530. Alternatively, a signal coupled from the first coupler 520 to port 531 can simultaneously couple to the second radiator 552 through both ports 532 and 534. Thus, by coupling the two isolated ports of the second coupler and then connecting them to the second radiator, the strength of the transmitted signal coupled to the second radiator and the signal output by the second coupler to the transceiver can be increased, thereby improving the sensitivity of distance detection for the target to be detected.

[0165] It should be understood that the port 532 and the port 534 in the second coupler can be packaged into one port, such as the second load port 1024 shown in FIG. 11 , and coupled to the second radiator 1052 through the second load port 1024 .

[0166] Optionally, port 534 is connected to ground via a resistor.

[0167] The second coupler 530 is further configured to output a sensing signal according to the signal received by the second radiator 552. Specifically, after the signal returned from the target to be detected is input through the port 532 of the second coupler 530, the sensing signal is output to the transceiver 510 through the port 533.

[0168] In this way, after receiving the signal returned from the target to be detected, the second radiator 552 can input the signal into the second coupler 530 through the coupled port 532 and the port 534 , and output the sensing signal to the transceiver 510 through the port 533 .

[0169] It should be understood that the reference signal and the sensing signal are output to the transceiver 510 via the port 533. The transceiver 510 can distinguish different signals based on parameters such as the timing or power of the received signal, which is not limited in this application.

[0170] Figure 6 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. The following mainly describes the differences between Figure 6 and Figure 5, and most of the same contents are not repeated here. As shown in Figure 6, the second coupler 530 has a port 531, a port 532, a port 533, and a port 534. The first coupler 520 is coupled to the port 531 of the second coupler 530 via the port 523 and the port 542, and the second radiator 552 is coupled to the port 532 of the second coupler 530. The second coupler 530 is coupled to the transceiver 510 via the port 533.

[0171] The second coupler 530 can output a reference signal and a sensing signal to the port 541 of the transceiver 510 through the port 533. The reference signal includes a signal output by the second coupler 530 based on a third sampling signal obtained by sampling the first signal by the first coupler 520. Specifically, after the transceiver 510 transmits the first signal to the port 521 of the first coupler 520, it can output a signal sampled from the coupling end of the port 521, i.e., the port 524, which is then transmitted from the port 524 to the port 531 of the second coupler 530.

[0172] In the second coupler 530 , the reference signal is output to port 532 through port 531 , sent by the second radiator 552 and received by the reflected signal, and then coupled to port 533 , and then received by the receiving port of the transceiver 510 , that is, port 512 .

[0173] In the embodiment of the present application, the difference between the sensing signal and the reference signal is that the first signal sent by the transceiver 510 to the first coupler 520 is input from port 521 and output through port 522. After the signal is output from port 522, the first radiator 551 is used to send a first detection signal and receive a first reflected signal returned from the target to be detected. In this case, after receiving the first reflected signal returned from the target to be detected, the first radiator 551 uses port 522 of the first coupler 520 as an input.

[0174] The first coupler 520 is further configured to sample the first reflected signal to output a first sampled signal. After the first reflected signal is input from the port 522 , the first coupler 520 outputs the first sampled signal from the coupled end of the port 522 , ie, the port 523 .

[0175] The second coupler 530 outputs a sensing signal from a port 533 through the same path as the reference signal according to the first sampling signal.

[0176] In this way, the RF chip assembly provided in the embodiment of the present application can simplify the circuit compared to Figure 5.

[0177] Optionally, the port 534 of the second coupler 530 is grounded via a resistor, for example, a 50 ohm resistor.

[0178] Optionally, the port 534 of the second coupler 530 may be coupled to the port 532 and coupled to the second radiator 552 via the feeding port 542 .

[0179] It should be understood that the above description of the RF chip assembly described in Figures 5 and 6 can correspond to the RF chip assembly in Figure 10. When the first coupler and the second coupler are used as a coupler assembly, the coupler assembly is coupled to the transceiver via the input port and the first output port. In this case, the first output port corresponds to port 1035 in Figure 10, and port 1035 in Figure 10 can correspond to port 534 in Figure 5 or port 533 in Figure 6. In other words, the RF chip assembly shown in Figure 10 can also implement the functions of the RF chip assembly described in Figures 5 and 6.

[0180] In some embodiments, the third terminal of the first switch is further coupled to the second switch, and the receiving port of the transceiver is further coupled to the third switch. The third terminal of the first switch is optionally coupled to the transceiver via the second and third switches. Alternatively, the third terminal of the first switch is optionally coupled to the fifth port of the second coupler via the second switch, and the seventh port of the second coupler is optionally coupled to the transceiver via the third switch.

[0181] As shown in Figure 7, Figure 7 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. The following mainly describes the differences between Figure 7 and Figure 6, and most of the same contents are not repeated here.

[0182] Specifically, the third end of switch 561 is further coupled to switch 562, and the receiving port 512 of transceiver 510 is further coupled to switch 563. In the embodiment of the present application, as shown in FIG7 , the third end of switch 561 is coupled to transceiver 510 via switch 562 and switch 563. It should be understood that switches 562 and 563 can switch the connection state of the circuit. For example, the third end of switch 561 is coupled to the fifth port 531 of the second coupler 530 via switch 562, and the seventh port 533 of the second coupler 530 is coupled to the transceiver 510 via switch 563.

[0183] That is, switches 562 and 563 have a first state and a second state. It should be understood that switches 562 and 563 shown in FIG7 are both in the first state. When switches 562 and 563 are both in the first state, the third end of switch 561 is coupled to transceiver 510 via switches 562 and 563. That is, when switches 562 and 563 are both in the first state, the third end of switch 561 can be directly coupled to port 512 of transceiver 510.

[0184] Optionally, the switch 562 and the switch 563 are single-pole double-throw switches.

[0185] In the embodiment of the present application, the transceiver 310 can send a radio frequency signal to the first coupler 520. The port 524 of the first coupler 520 can output a sampled signal after sampling the radio frequency signal, and output it to the port 512 of the transceiver 510 through the switches 561, 562, and 563. By receiving the sampled signal, the transceiver 510 can detect and track the transmit power of the port 511 and adjust the output power in real time to perform power calibration.

[0186] Optionally, the transmit power of the transceiver 510 may be adjusted according to the influence of environmental parameters, such as the influence of temperature or the object to be detected on the signal received by the first radiator 551 .

[0187] In addition, the transceiver 510 can also implement distance detection of a target to be detected by a single coupler through the first coupler 520 and the first radiator 551. This application will not elaborate on this.

[0188] When the switch 562 and the switch 563 are both in the second state, the third end of the switch 561 is coupled to the port 531 of the second coupler 530 via the switch 562, and the port 533 of the second coupler 530 is coupled to the transceiver 510 via the switch 563. In other words, when the switch 562 and the switch 563 are both in the second state, the third end of the switch 561 can be directly coupled to the second coupler 530 into the circuit. In this way, the first coupler 520 can be connected to the port 531 of the second coupler 530 via the switch 561 and the switch 562, and the second coupler 530 can output a signal to the port 512 of the transceiver 510 via the port 533. When the switch 562 and the switch 563 are both in the second state, reference can be made to the embodiment of FIG. 5 .

[0189] It should be understood that the connection method of the second coupler 530 in FIG. 7 may refer to the connection method of the second coupler 530 in FIG. 5 and FIG. 6 , and this application will not elaborate on this.

[0190] In this way, by adding a second switch and a third switch to the RF chip assembly and combining the switching of the second and third switch states, different functions can be switched, thereby enhancing practicality. For example, by coupling the first switch to the second and third switches, the first coupler can be directly coupled to the transceiver, thereby detecting and tracking the transmission power of the first radiator and then enabling power calibration. Alternatively, the second and third switches can also couple the first coupler, the second coupler, and the transceiver, thereby achieving the function of distance detection of the target to be detected.

[0191] In some embodiments, as shown in FIG7 , the first coupler 520 and the switch 561 may be included in an RF front end, which is coupled to the port 511 of the transceiver 510 via the port 521, coupled to the feeding port 541 of the first radiator 551 via the port 522, and connected to the switch 562 via the third end of the switch 561. It should be understood that the RF front end may be included inside the RF chip, that is, the transceiver 510 and the RF front end are integrally packaged, and the external components include the second coupler 530, the switch 562, and the switch 563. The above components may also be packaged in combination in other ways, for example, the switch 562, the switch 563, and the second coupler 530 may be packaged simultaneously, but this application is not limited thereto.

[0192] Optionally, the RF front end also includes a power amplifier, a duplexer and other parts.

[0193] In some embodiments, the second radiator is further configured to receive the first detection signal sent by the first radiator.

[0194] It should be understood that when the distance between the first radiator and the second radiator is less than a certain threshold, there is mutual interference between the first radiator and the second radiator. In radio frequency systems, isolation (ISO) is usually used to describe the degree of mutual influence between different signal paths. As shown in Figure 3, if the reflection coefficient of the first radiator 351 is Γ1, the reflection coefficient of the second radiator 352 is Γ2, and the isolation between the first radiator 351 and the second radiator 352 is ISO, then in addition to the above-mentioned coupling path, the first signal IN sent by the transceiver 310 can also be sent through the first radiator 351 and then received by the second radiator 352. At this time, in addition to receiving the reflected signal returned from the target to be detected, the second radiator 352 will also receive the signal transmitted by the first radiator 351. Part of the signal input by the second radiator 352 to the second coupler 330 is output to the sensing port 312 of the transceiver 310 through the first path, that is, port 333, and the other part is output to the reference port 313 of the transceiver 310 through the second path, that is, port 331, via ports 323 and 324 of the first coupler 320. Regarding the signal transmitted by the first radiator 351 and received by the second radiator 352, the signal SEN received by the sensing port 312 of the transceiver 310 can be expressed as:

[0195] SEN∝IN*a*Γ1*Γ2*ISO, where a is the proportional coefficient of the first signal IN after flowing through the component on the first path.

[0196] The signal REF received by the reference port 342 of the transceiver 310 can be expressed as:

[0197] REF∝IN*b*Γ1*Γ2*ISO, where b is the proportional coefficient of the first signal IN after it flows through the component on the second path.

[0198] In this way, by adjusting the positions of the first radiator and the second radiator, the second radiator can be used to receive the first detection signal sent by the first radiator. As the distance of the target to be detected changes, the degree of interference will also change, that is, the isolation will change. Therefore, after the second radiator receives the first detection signal sent by the first radiator, it can judge the distance of the target to be detected according to the change in signal isolation, thereby improving the sensitivity of distance detection of the target to be detected.

[0199] In some embodiments, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or N≤L2×3.

[0200] In this way, by limiting the distance between the first radiator and the second radiator, the isolation between the first radiator and the second radiator can be ensured, thereby improving the detection effect of the distance detection on the target to be detected.

[0201] In some embodiments, the first radiator and the second radiator have at least a portion of the same length direction. For example, the first radiator or the second radiator can be partially bent, and the extending direction of one radiator after bending is the same as the extending direction of the other radiator.

[0202] It should be understood that when the first radiator and the second radiator have at least a portion of the same length direction, the two radiators can provide energy superposition in the length direction, thereby improving the measurement effect of the distance detection of the target to be detected.

[0203] Optionally, at least a portion of the first radiator and at least a portion of the second radiator extend collinearly. Wherein, A and B extending collinearly can be understood as A and B both extending along a first straight line, for example, the extension direction of A and the extension direction of B are both located on the first straight line.

[0204] Optionally, the first radiator is a bent metal segment, and at least a portion of the first radiator and at least a portion of the second radiator are in the same direction. In this way, the first radiator can detect signals in both bending directions, covering a wider range of directions.

[0205] Optionally, the length directions of the first radiator and the second radiator are different. As shown in Figure 8, Figure 8 is a schematic structural diagram of another radio frequency chip component provided in an embodiment of the present application. Compared with Figure 3, the difference in Figure 8 is that the length directions of the first radiator 451 and the second radiator 452 are different, that is, the signal transmission directions are different. In an embodiment of the present application, the length direction of the first radiator is perpendicular to the length direction of the second radiator. For example, the length direction of the first radiator 451 is the x direction, and the length direction of the second radiator 452 is the y direction. The length directions of the above two radiators can also be any other directions, which is not limited in this application. At this time, since radiators in different directions provide detection signals in different directions, when the transceiver processes the received signals, it can detect the spatial distance of the target to be detected, thereby improving the accuracy of the detection.

[0206] In some embodiments, the first radiator is configured to operate as a radiator of a first antenna, and the second radiator is configured to operate as a radiator of a second antenna, wherein resonant frequency bands of the first radiator and the second radiator at least partially overlap. For example, the first antenna and / or the second antenna are configured to support at least one of the GPS-L1 band, the LB band, the MHB band, the Wi-Fi 2.4G band, the Wi-Fi 5G band, the N28 band, the N40 band, the N41 band, the N78 band, the N79 band, and the ISM band.

[0207] Optionally, the resonance frequency bands of the first radiator and the second radiator may include at least part of the low band (LB) (698MHz-960MHz), the middle band (MB) (1710MHz-2170MHz) and the high band (HB) (2300MHz-2690MHz).

[0208] In this way, by making the resonant frequency bands of the first radiator and the second radiator at least partially overlap, the second radiator can receive part of the signal emitted by the first radiator, thereby improving the sensitivity of distance detection to the target to be detected based on the isolation information that changes with the distance to the target to be detected.

[0209] Optionally, the first antenna and / or the second antenna may be in the form of an antenna based on a flexible printed circuit (FPC), an antenna based on laser direct structuring (LDS), or a microstrip disk antenna (MDA). The antenna structures provided in the embodiments of the present application include wire antennas, dipole antennas, patch antennas, planar inverted-F antennas (PIFA), etc., and the embodiments of the present application are not limited thereto.

[0210] In some embodiments, the radio frequency chip assembly may couple multiple couplers to improve the sensitivity of distance detection to the target to be detected.

[0211] As shown in Figure 9, Figure 9 is a schematic structural diagram of another radio frequency chip assembly provided in an embodiment of the present application. Compared with Figure 3, the difference in Figure 9 is that the radio frequency chip assembly also includes a third coupler 340 and a third radiator 353, the third coupler 340 is coupled to the second coupler 330, and the third radiator 353 is coupled to the third coupler 340. At this time, the coupler assembly may include a first coupler 320, a second coupler 330 and a third coupler 340. The connection method of the third coupler 340 is similar to that of the second coupler 330. The specific structure and function of the third coupler 340 and the third radiator 353 can refer to the above description of the second coupler 330 and the second radiator 352, which will not be repeated here.

[0212] The electronic device provided in this application is described below with reference to Figures 15 to 17.

[0213] It should be understood that the electronic device provided in the present application can be a device that provides voice and / or data connectivity to users and can be used to connect people, objects, and machines, such as a handheld device with wireless connection function, a vehicle-mounted device, etc. The electronic device in the embodiments of the present application can be, for example, a mobile phone, a tablet computer (Pad), a laptop computer, a PDA, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self-driving), a wireless terminal in remote medical surgery, a wireless terminal in a smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in a smart city (smart city), a wireless terminal in a smart home (smart home), etc.

[0214] Specifically, as shown in FIG15 , the electronic device 10 may include a cover 13, a display screen / module 15, a printed circuit board (PCB) 17, a middle frame 19, and a rear cover 21. It should be understood that in some embodiments, the cover 13 may be a glass cover or may be replaced with a cover made of other materials, such as a PET (Polyethylene terephthalate) material.

[0215] The cover plate 13 may be disposed closely against the display module 15 , and may be mainly used to protect the display module 15 and prevent dust.

[0216] In one embodiment, the display module 15 may include a liquid crystal display panel (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., which is not limited in the embodiment of the present application.

[0217] The middle frame 19 primarily supports the entire device. FIG. 14 shows that the PCB 17 is disposed between the middle frame 19 and the back cover 21. It should be understood that, in one embodiment, the PCB 17 may also be disposed between the middle frame 19 and the display module 15, and this embodiment of the present application does not limit this. The printed circuit board PCB 17 may be made of a flame-resistant material (FR-4) dielectric board, a Rogers dielectric board, a mixed Rogers and FR-4 dielectric board, and so on. FR-4 is a designation for a grade of flame-resistant material, and a Rogers dielectric board is a high-frequency board. The PCB 17 carries electronic components, such as radio frequency chips. In one embodiment, a metal layer may be provided on the PCB 17. This metal layer may be used to ground the electronic components carried on the PCB 17, or may be used to ground other components, such as a bracket antenna, a frame antenna, and the like. This metal layer may be referred to as a floor, a ground plane, or a grounding layer. In one embodiment, the metal layer may be formed by etching metal on the surface of any dielectric board in the PCB 17. In one embodiment, the metal layer used for grounding can be provided on the side of the printed circuit board PCB 17 near the middle frame 19. In one embodiment, the edge of the printed circuit board PCB 17 can be considered the edge of its ground layer. In one embodiment, the metal middle frame 19 can also be used to ground the aforementioned components. The electronic device 10 may also have other floor / grounding plates / grounding layers, as previously described and will not be further described here.

[0218] Due to the compactness of electronic devices, a floor / grounding plate / grounding layer is typically provided within a 0-2mm internal space from the inner surface of the frame (for example, the printed circuit board, midframe, screen metal layer, battery, etc. can all be considered part of the floor). In one embodiment, a dielectric is filled between the frame and the floor, and the length and width of the rectangle enclosed by the inner surface contour of the dielectric filling can be simply considered the length and width of the floor. Alternatively, the length and width of the rectangle enclosed by the contour of all conductive parts within the frame can be considered the length and width of the floor.

[0219] The electronic device 10 may further include a battery (not shown). The battery may be disposed between the middle frame 19 and the back cover 21, or between the middle frame 19 and the display module 15, and this is not limited in this embodiment of the present application. In some embodiments, the PCB 17 is divided into a main board and a sub-board, and the battery may be disposed between the main board and the sub-board. The main board may be disposed between the middle frame 19 and the upper edge of the battery, and the sub-board may be disposed between the middle frame 19 and the lower edge of the battery.

[0220] The electronic device 10 may further include a frame 11, which may be formed of a conductive material such as metal. The frame 11 may be disposed between the display 15 and the back cover 21 and extend circumferentially around the periphery of the electronic device 10. The frame 11 may have four sides surrounding the display 15 to help secure the display 15.

[0221] In one implementation, the frame 11 made of a conductive material can directly serve as the conductive frame of the electronic device 10, for example, forming a metallic frame appearance, suitable for a metallic industrial design (ID). In another implementation, the outer surface of the frame 11 can be made of a conductive material, such as a metal material, thereby forming a metallic frame appearance. In these implementations, the conductive portion of the frame 11 can serve as an antenna radiator for the electronic device 10.

[0222] In another implementation, the outer surface of the frame 11 can also be a non-conductive material, such as plastic, to form the appearance of a non-metallic frame, which is suitable for non-metallic ID. In one implementation, the inner surface of the frame 11 may include a conductive material, such as a metal material. In this implementation, the conductive portion of the frame 11 can be used as a radiator of the antenna of the electronic device 10. It should be understood that the radiator provided on the inner surface of the frame 11 (or the conductive material on the inner surface) is arranged in contact with the non-conductive material of the frame 11 to facilitate antenna radiation, and both the conductive material and the non-conductive material should be regarded as part of the frame 11.

[0223] The middle frame 19 may include a border 11, and the middle frame 19 including the border 11 is an integral part that can support the electronic devices in the whole machine. The cover 13 and the back cover 21 are respectively covered along the upper and lower edges of the border to form a shell or housing (housing) of the electronic device. In one embodiment, the cover 13, the back cover 21, the border 11 and / or the middle frame 19 can be collectively referred to as the shell or housing of the electronic device 10. It should be understood that "shell or housing" can be used to refer to part or all of any one of the cover 13, the back cover 21, the border 11 or the middle frame 19, or to part or all of any combination of the cover 13, the back cover 21, the border 11 or the middle frame 19.

[0224] The frame 11 on the middle frame 19 can at least partially serve as an antenna radiator to transmit and receive radio frequency signals. A gap can exist between this portion of the frame serving as the radiator and the rest of the middle frame 19 to ensure a good radiation environment for the antenna radiator. In one embodiment, the middle frame 19 can be provided with an aperture in this portion of the frame serving as the radiator to facilitate antenna radiation.

[0225] Alternatively, the frame 11 may not be considered as part of the middle frame 19. In one embodiment, the frame 11 may be connected to the middle frame 19 and formed as one piece. In another embodiment, the frame 11 may include a protrusion extending inward to be connected to the middle frame 19, for example, by means of a shrapnel, a screw, welding, etc. The protrusion of the frame 11 can also be used to receive a feed signal, so that at least a portion of the frame 11 serves as a radiator of the antenna to receive / transmit radio frequency signals. There may be a gap 42 between this portion of the frame that serves as the radiator and the middle frame 30, thereby ensuring that the antenna radiator has a good radiation environment, so that the antenna has a good signal transmission function.

[0226] The back cover 21 can be made of metal, non-conductive materials such as glass or plastic, or a combination of conductive and non-conductive materials. In one embodiment, the conductive back cover 21 can replace the middle frame 19 and integrate with the frame 11 to support the electronic components within the device.

[0227] In one embodiment, the middle frame 19 and / or the conductive parts in the back cover 21 can serve as a reference ground for the electronic device 10, wherein the frame 11, PCB 17, etc. of the electronic device can be grounded through electrical connection with the middle frame.

[0228] The antenna of the electronic device 10 can also be set in the frame 11. When the frame 11 of the electronic device 10 is a non-conductive material, the antenna radiator can be located in the electronic device 10 and arranged along the frame 11. For example, the antenna radiator is set close to the frame 11 to minimize the volume occupied by the antenna radiator and be closer to the outside of the electronic device 10 to achieve better signal transmission effect. It should be noted that the antenna radiator is set close to the frame 11 means that the antenna radiator can be set close to the frame 11, or it can be set close to the frame 11, for example, there can be a certain small gap between the antenna radiator and the frame 11.

[0229] The antenna of electronic device 10 can also be disposed within the housing, such as a bracket antenna or millimeter-wave antenna (not shown in FIG. 15 ). The clearance for the antenna disposed within the housing can be provided by a slot / opening in any of the middle frame, and / or the frame, and / or the back cover, and / or the display screen, or by a non-conductive gap / aperture formed between any of these. The antenna clearance ensures the antenna's radiation performance. It should be understood that the antenna clearance can be a non-conductive area formed by any conductive component within electronic device 10, through which the antenna radiates signals to the outside world. In one embodiment, antenna 40 can be in the form of an antenna based on a flexible printed circuit (FPC), an antenna based on laser-direct-structuring (LDS), or a microstrip disk antenna (MDA). In one embodiment, the antenna can also be a transparent structure embedded within the screen of electronic device 10, such that the antenna is a transparent antenna unit embedded within the screen of electronic device 10.

[0230] FIG. 15 only schematically illustrates some components included in the electronic device 10 , and the actual shapes, sizes, and structures of these components are not limited by FIG. 15 .

[0231] It should be understood that in the embodiments of the present application, the surface where the display screen of the electronic device is located can be considered as the front surface, the surface where the back cover is located can be considered as the back surface, and the surface where the frame is located can be considered as the side surface.

[0232] It should be understood that in the embodiments of the present application, it is considered that when a user holds the electronic device (for example, the user holds the electronic device and unlocks it, or for example, when the user holds the electronic device vertically and faces the screen), the orientation of the electronic device has a top, a bottom, a left side, and a right side.

[0233] FIG16 is a partial schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0234] As shown in FIG16 , the electronic device 10 provided in an embodiment of the present application includes a housing, wherein the housing includes a frame 11 .

[0235] The mainboard 1 is arranged in the housing.

[0236] First radiator 51 and second radiator 52. It should be understood that the first and second radiators can be formed from conductive parts of the electronic device frame. Either the first and second radiators can also be provided on the mainboard 1, attached to the housing, or be part of the housing. Furthermore, the first radiator is a first antenna, and the second radiator is a second antenna.

[0237] It should be understood that being attached to the shell can be understood as being closely attached to the inner surface of the frame or the back cover, including being fixed to the inner surface of the frame or the back cover, and can also be a part of the frame or the back cover, all of which are attached to the shell.

[0238] In some embodiments, the first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port is coupled to the first load port, and the second feeding port is coupled to the second load port.

[0239] As shown in FIG16 , the first radiator 51 is provided with a first feeding port 61 , and the second radiator 52 is provided with a second feeding port 62 . The first radiator 51 and the second radiator 52 are connected to the coupler assembly through the feeding ports.

[0240] Optionally, the antenna (e.g., the first antenna) further includes a feed port. The feed port can be provided on the mainboard 1, contacting and electrically connected to the radiator. The feed port is coupled to the radiator (e.g., the first radiator) to feed an electrical signal to the radiator.

[0241] In the embodiments of the present application, the antenna may be an antenna module. The antenna includes at least a radio frequency transceiver chip, at least one matching circuit, at least one feed port, and at least one radiator. The first radiator and the second radiator in the embodiments of the present application may belong to the same antenna or to different antennas.

[0242] In an embodiment of the present application, the frame 11 can be composed of a plurality of mutually insulated metal segments. Among them, the space between two adjacent metal segments is filled with insulating material to insulate the two adjacent metal segments from each other. The present application does not specifically limit the length of each metal segment. The length of the metal segment can be designed according to the frequency of the frequency band to be transmitted and received, and each metal segment can serve as a radiator (for example, a first radiator). Optionally, as shown in Figure 15, the radiator in the present application can be a bent metal segment, such as a first radiator 51, and at least a portion of the first radiator 51 and at least a portion of the second radiator 352 have the same direction. In this way, the first radiator 51 has signal detection in both directions of bending, namely the x direction and the y direction, and covers a wider range of directions.

[0243] It should be understood that the resonant frequency band of the radiator includes but is not limited to millimeter wave signals, submillimeter wave signals, terahertz signals, 2.4GHz and 5.0GHz WIFI signals, GSM signals in several frequency bands such as 900MHz, 1800MHz and 1900MHz, GPS signals, Bluetooth signals, etc.

[0244] The electronic device 10 provided in an embodiment of the present application further includes a radio frequency chip assembly, wherein the radio frequency chip assembly is arranged in a shell, and the radio frequency chip assembly includes a transceiver 100 and a coupler assembly (as shown in the dotted box in Figure 10). The coupler assembly includes an input port, a first output port, a first load port, and a second load port. Optionally, the coupler assembly includes a second output port. Specifically, the coupler assembly includes a first coupler 20 and a second coupler 30. The transceiver includes a transmitting port and a receiving port. The coupler assembly is coupled to the transceiver 100 via an input port and a first output port. Specifically, the input port of the coupler assembly is coupled to the transmitting port of the transceiver 100, and the first output port of the coupler assembly is coupled to the receiving port of the transceiver 100. The first load port is coupled to the first radiator, and the second load port is coupled to the second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0245] In some embodiments, a coupler assembly includes a first coupler and a second coupler, wherein the first coupler includes an input port, a first load port, a third port, and a fourth port, and the second coupler includes a fifth port, a second load port, a seventh port, and an eighth port. The seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0246] In some embodiments, the coupler component includes a second output port, the receiving port of the transceiver includes a first receiving port and a second receiving port, and the coupler component is coupled to the transceiver through the input port, the first output port, and the second output port, wherein the first output port and the first receiving port are coupled, the second output port and the second receiving port are coupled, and the second output port is a fourth port.

[0247] In some embodiments, the first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port is coupled to the first load port, and the second feeding port is coupled to the second load port.

[0248] In some embodiments, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N ≤ L1 × 3, and / or N ≤ L2 × 3. In some embodiments, the first radiator is further configured to operate as a radiator of the first antenna, and the second radiator is further configured to operate as a radiator of the second antenna, wherein the resonant frequency bands of the first radiator and the second radiator at least partially overlap.

[0249] In some embodiments, at least portions of the first radiator and the second radiator have the same length direction.

[0250] The description of the coupler assembly in the embodiments of the present application can refer to the description of the coupler assembly in Figures 3 to 11 above, and the present application will not repeat them here.

[0251] Specifically, the transceiver 100 is configured to transmit a first signal to the coupler assembly. The first coupler 20 is configured to output a first detection signal based on the first signal. The first radiator 51 is configured to transmit the first detection signal and receive a first reflected signal returned from the target to be detected. The first coupler 20 is further configured to sample the first reflected signal to output a first sampled signal. The second coupler 30 is configured to output a second detection signal based on the first sampled signal. The second radiator 52 is configured to transmit the second detection signal and receive a signal returned from the target to be detected. The second coupler 30 is further configured to output a sensing signal based on the signal received by the second radiator 52. The transceiver 100 is also configured to detect the distance to the target to be detected based on the sensing signal.

[0252] In some embodiments, the second radiator is further configured to receive the first detection signal sent by the first radiator.

[0253] In some embodiments, the transceiver 100 is further configured to adjust the transmission power according to a distance detection result of the target to be detected.

[0254] In some embodiments, at least one of the first radiator and the second radiator is provided with a grounding point, and the grounding point is coupled to the floor through a component, or directly coupled to the floor.

[0255] In some embodiments, as shown in Figure 15 , the first radiator 51 and the second radiator 52 can be grounded via an adjustable device. For example, grounding can be achieved via a capacitive device and / or an inductive device, or a switching device. Specifically, the grounding point can be set on the middle frame 19 shown in Figure 14 , for example, a connecting rib on the middle frame 19. In the embodiments of the present application, the radiators, connecting ribs, and floor can be integrally formed, and this application does not limit this.

[0256] Specifically, the specific structure and functions of the electronic device 10 provided in the embodiment of the present application can refer to the above description of the radio frequency chip component, which will not be repeated here.

[0257] Figure 17 is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application. As shown in Figure 17, the electronic device 10 provided in an embodiment of the present application includes a radio frequency chip 100 and a second coupler 30. In other words, compared to Figure 16, the electronic device 10 provided in an embodiment of the present application integrates the transceiver 100 and the first coupler 20 of the radio frequency chip assembly in Figure 16 into a single package. It should be understood that the components of the radio frequency chip assembly of the present application can achieve the functions of the above-described embodiments through any packaging combination.

[0258] FIG18 is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application.

[0259] As shown in FIG18 , compared to the electronic device shown in FIG16 , the electronic device 10 provided in the embodiment of the present application includes a first radiator 51 and a second radiator 53. The second radiator belongs to the second antenna, is a suspended antenna radiator, and is a suspended antenna.

[0260] It should be understood that the suspension antenna can be an antenna formed by attaching a thin metal conductor to a grounded dielectric substrate, and the suspension antenna is separated from the mainboard of the terminal device, which can improve the signal strength. Optionally, the suspension antenna is set on the housing.

[0261] In existing capacitive distance sensors, it is usually necessary to generate an electric field of fixed frequency through capacitance, and judge the distance of the object based on the change of the equivalent dielectric when the object to be detected approaches the sensor. Since the capacitive sensor will cause the load to decrease when grounded, that is, the induced current is directed to the floor, causing the sensor to be unable to obtain a valid signal. Therefore, capacitive sensors are only suitable for suspended antennas and cannot be used with grounded antennas. In the embodiment of the present application, the distance to the target to be detected is judged based on the change of the signal load impedance by the radiator, which can be applied to different types of antennas, such as grounded antennas, suspended antennas, etc. Therefore, the radiator in the embodiment of the present application can be grounded through an adjustable device without affecting the distance detection of the target to be detected, thereby improving the compatibility with the antenna.

[0262] FIG19 is a flow chart of a distance detection method provided in an embodiment of the present application.

[0263] It should be understood that the method can be applied to any of the radio frequency chip components or electronic devices 10 described in the above embodiments.

[0264] S1910: The transceiver sends a first signal to the first coupler.

[0265] In one embodiment, the transceiver is a radio frequency chip, the first coupler is a bidirectional coupler, and the transceiver is coupled to the first coupler.

[0266] S1920: The first coupler outputs a first detection signal according to the first signal.

[0267] S1930: The first radiator sends a first detection signal and receives a first reflected signal returned from the target to be detected.

[0268] In one embodiment, the first radiator is coupled to the first coupler.

[0269] It should be understood that as the distance to the target to be detected changes, the load impedance of the first reflected signal will also change accordingly, that is, parameters such as the amplitude and phase of the signal will change.

[0270] S1940: The first coupler samples the first reflected signal to output a first sampling signal.

[0271] S1950: The second coupler outputs a second detection signal according to the first sampling signal output by the first coupler.

[0272] In one embodiment, the first coupler is coupled to the second coupler, and the second coupler is a bidirectional coupler.

[0273] S1960: The second radiator sends a second detection signal and receives a signal returned from the target to be detected.

[0274] In one embodiment, the second radiator is coupled to the second coupler, and the second coupler is a bidirectional coupler.

[0275] S1970: The second coupler outputs a sensing signal according to the signal received by the second radiator.

[0276] S1980: The transceiver detects the distance of the target to be detected according to the sensing signal.

[0277] In one embodiment, the transceiver may determine the distance to the target to be detected based on the load impedance change of the received signal.

[0278] In one embodiment, the method further includes, the transceiver adjusting the transmission power according to the distance detection result of the target to be detected. Specifically, when the distance to the target to be detected is less than the first threshold, the transmission power is adjusted from the first value to the second value so that the SAR generated by the radiator meets the regulatory requirements. For example, when the first threshold is set to 5 cm, if the distance to the target to be detected is greater than 5 cm, no power adjustment is performed. If the distance to the target to be detected is less than 5 cm, the transmission power of the transceiver is reduced. It should be understood that in the embodiment of the present application, the first threshold, the first value and the second value are all preset values, which can be adjusted according to different production or design requirements, and the embodiment of the present application does not limit this.

[0279] In one embodiment, when the first coupler and the second coupler are coupled to the transceiver, the method further includes the first coupler outputting a first reference signal to the transceiver, where the first reference signal includes a second sampled signal obtained by the first coupler from sampling the first signal. Specifically, the transceiver performs distance detection on a target based on the first reference signal and the sensing signal.

[0280] Optionally, when the second coupler is coupled to the transceiver, the method further includes the second coupler outputting a second reference signal to the transceiver, the second reference signal comprising a signal output by the second coupler based on a third sampled signal obtained by sampling the first signal by the first coupler. The transceiver performs distance detection on the target based on the second reference signal and the sensing signal.

[0281] In one embodiment, the second radiator is further configured to receive the first detection signal transmitted by the first radiator. It should be understood that by adjusting the positions of the first radiator and the second radiator, the second radiator can be configured to receive the first detection signal transmitted by the first radiator. As the distance to the target to be detected changes, the degree of interference also changes, i.e., the isolation changes. Therefore, after receiving the first detection signal transmitted by the first radiator, the second radiator can further determine the distance to the target to be detected based on the change in signal isolation, thereby improving the sensitivity of distance detection to the target to be detected.

[0282] In one embodiment, the first radiator is further configured to operate as a radiator of the first antenna, and the second radiator is further configured to operate as a radiator of the second antenna, wherein the resonance frequency bands of the first radiator and the second radiator at least partially overlap.

[0283] In one embodiment, the RF chip assembly further includes a second switch and a third switch. The method further includes: when the first coupler is coupled to the transceiver via the second and third switches, the transceiver is configured to transmit a second signal to the first coupler, the first coupler is configured to sample the second signal to output a fourth sampled signal, and the transceiver is further configured to adjust transmit power based on the fourth sampled signal. When the first coupler is coupled to the second coupler via the second switch, and the second coupler is coupled to the transceiver via the third switch, the transceiver is configured to transmit the first signal to the first coupler.

[0284] The specific steps and designed structure of the above method can refer to any RF chip component or electronic device 10 described in the above embodiments, and will not be repeated here.

[0285] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0286] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0287] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0288] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0289] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0290] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A radio frequency chip assembly, characterized in that: include: A transceiver (310) and a coupler component, wherein the coupler component comprises an input port (321), a first output port (333), a first load port (322) and a second load port (332); the transceiver (310) comprises a transmitting port (311) and a receiving port (312, 313); the input port (321) and the transmitting port (311) are coupled and connected; the first output port (333) and the receiving port (312) are coupled and connected; the first load port (322) is used to couple a first radiator (351); the second load port (332) is used to couple a second radiator (352); wherein the first load port (322) and the second load port (332) are coupled; and the first output port (333) and the second load port (332) are coupled.

2. The radio frequency chip assembly according to claim 1, characterized in that: The coupler assembly comprises a first coupler (320) and a second coupler (330), wherein the first coupler (320) comprises the input port (321), the first load port (322), a third port (323) and a fourth port (324), and the second coupler (330) comprises a fifth port (331), the second load port (332), a seventh port (333) and an eighth port (334), wherein the seventh port (333) and the second load port (332) are coupled, and the eighth port (334) and the second load port (332) are isolated, and the first output port is one of the seventh port (333) and the eighth port (334), and the third port (323) of the first coupler (320) is coupled to the fifth port (331) of the second coupler (330), and the input port (321) and the fourth port (324) are coupled, and the first load port (322) and the fourth port (324) are isolated.

3. The radio frequency chip assembly according to claim 2, characterized in that: The coupler component includes a second output port (324), and the receiving port (312, 313) of the transceiver includes a first receiving port (312) and a second receiving port (313), wherein the first output port (333) and the first receiving port (312) are coupled and connected, the second output port (324) and the second receiving port (313) are coupled and connected, and the second output port (324) is the fourth port (324).

4. The radio frequency chip assembly according to claim 2 or 3, characterized in that: When the first output port (333) is the seventh port (333), the eighth port (334) is coupled to the second load port (332).

5. The radio frequency chip assembly according to any one of claims 2 to 4, characterized in that: When the coupler component is coupled to the transceiver via the input port and the first output port, a first switch (561) is further provided on the connection circuit of the first coupler and the second coupler, the first switch (561) having a first end, a second end and a third end, the first end and the second end being coupled to the third port and the fourth port of the first coupler respectively, and the third end being coupled to the fifth port of the second coupler.

6. The radio frequency chip assembly according to claim 5, characterized in that: The third end of the first switch (561) is also coupled to a second switch (562), and the receiving port of the transceiver is also coupled to a third switch (563). The third end of the first switch (561) is optionally coupled to the transceiver via the second switch (562) and the third switch (563); or The third end of the first switch (561) is optionally coupled to the fifth port of the second coupler through the second switch (562), and the seventh port of the second coupler is optionally coupled to the transceiver through the third switch (563).

7. The radio frequency chip assembly according to any one of claims 1 to 6, characterized in that: The length of the first radiator is L1, the length of the second radiator is L2, and a distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

8. The radio frequency chip assembly according to any one of claims 1 to 7, characterized in that: The first radiator and the second radiator have at least a portion of the same length direction.

9. The radio frequency chip assembly according to any one of claims 1 to 8, characterized in that: The first radiator is used to operate as a radiator of a first antenna, and the second radiator is used to operate as a radiator of a second antenna, wherein resonance frequency bands of the first radiator and the second radiator at least partially overlap.

10. A distance detection method, characterized in that: Applied to a radio frequency chip assembly, the radio frequency chip assembly includes a transceiver, a first coupler, a second coupler, a first radiator and a second radiator, the method includes: The transceiver sends a first signal to the first coupler, the first coupler outputs a first detection signal according to the first signal, the first radiator sends the first detection signal and receives a first reflected signal returned from the target to be detected, the first coupler samples the first reflected signal to output a first sampling signal, and the second coupler samples the first sampling signal output by the first coupler. the second radiator sends the second detection signal and receives a signal returned from the target to be detected, and the second coupler outputs a sensing signal according to the signal received by the second radiator; The transceiver performs distance detection on the target to be detected according to the sensing signal.

11. The method according to claim 10, characterized in that The method further comprises: The first coupler outputs a first reference signal to the transceiver, wherein the first reference signal includes a second sampling signal obtained by sampling the first signal by the first coupler; The transceiver performs distance detection on the target to be detected according to the first reference signal and the sensing signal.

12. The method according to claim 10, characterized in that The method further comprises: The second coupler outputs a second reference signal to the transceiver, the second reference signal comprising a signal output by the second coupler according to a third sampling signal obtained by sampling the first signal by the first coupler; The transceiver performs distance detection on the target to be detected according to the second reference signal and the sensing signal.

13. The method according to any one of claims 10 to 12, characterized in that: The second radiator is further used to receive the first detection signal sent by the first radiator.

14. The method according to claim 13, characterized in that The length of the first radiator is L1, the length of the second radiator is L2, and a distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

15. The method according to any one of claims 10 to 14, characterized in that The radio frequency chip assembly further includes a second switch and a third switch, and the method further includes: When the first coupler is coupled to the transceiver through the second switch and the third switch, the transceiver is used to send a second signal to the first coupler, the first coupler is used to sample the second signal to output a fourth sampling signal, and the transceiver is further used to adjust the transmission power according to the fourth sampling signal; When the first coupler is coupled to the second coupler through the second switch, and the second coupler is coupled to the transceiver through the third switch, the transceiver is used to send the first signal to the first coupler.

16. The method according to any one of claims 10 to 15, characterized in that The method further comprises: The transceiver adjusts the transmission power according to the distance detection result of the target to be detected.

17. An electronic device, characterized in that: include: case; A mainboard, the mainboard being arranged in the housing; A first radiator and a second radiator, wherein the first radiator and / or the second radiator is arranged on the mainboard or attached to the housing or is a part of the housing; And the radio frequency chip assembly according to any one of claims 1 to 9, wherein the radio frequency chip assembly is arranged in the shell.

18. The electronic device according to claim 17, characterized in that: The first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port is coupled to the first load port, and the second feeding port is coupled to the second load port.

19. The electronic device according to claim 17 or 18, characterized in that: The length of the first radiator is L1, the length of the second radiator is L2, and a distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

20. The electronic device according to any one of claims 17 to 19, characterized in that: At least one of the first radiator and the second radiator is provided with a grounding point, and the grounding point is coupled to the floor through a device, or is directly coupled to the floor.

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