Position demonstration apparatus and position demonstration method

Abstract

Provided in the present invention are a position demonstration apparatus and a position demonstration method. The position demonstration apparatus is used for demonstrating to a wafer delivering mechanism the position in a wafer chuck for placing a wafer, and the apparatus comprises: a wafer simulation disc; a plurality of detection loops, wherein when feedback elements come into contact with a second positioning face, the detection loops output first feedback signals, and when the feedback elements do not come into contact with the second positioning face, the detection loops output second feedback signals; and a control apparatus, which is configured to control the wafer transmission mechanism to keep the wafer simulation disc and adjust the position of the wafer simulation disc in the wafer chuck, such that each detection loop outputs a second feedback signal, the feedback elements and the wafer chuck are all in a non-contact state, the position of the center of the wafer simulation disc in the state is generated, and the position of the center of the wafer simulation disc is used as a demonstration position for a wafer delivering mechanism to place a wafer in the wafer chuck. The present invention is used for demonstrating to a water delivering mechanism the position in a wafer chuck for placing a wafer, so as to ensure that the center of the wafer is precisely aligned with the center of the wafer chuck.

Description

Position teaching device and position teaching method Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit manufacturing, and in particular relates to a position teaching device and a position teaching method. Background Art

[0002] In semiconductor integrated circuit manufacturing, the chemical plating process for wafers is a critical step. To ensure consistent plating quality, the center of the wafer must be aligned with the center of the chuck when the wafer is placed. If the center of the wafer deviates from the center of the chuck, the plating process will be affected and may even result in wafer fragmentation. Therefore, accurate wafer placement is crucial.

[0003] Currently, alignment between the center of the wafer and the center of the wafer chuck is achieved through visual observation. Visual judgment can be subject to significant errors, making it prone to significant human error. Furthermore, manual observation is inefficient, impacting wafer production efficiency. If the center of the wafer deviates significantly from the center of the wafer chuck, the wafer can easily scratch against the inner surface of the chuck when placed. These scratches can easily cause particles to enter the plating solution, contaminating it. Once these particles are plated onto the wafer during electroplating, they can cause quality issues with the wafer plating. In severe cases, these scratches can also cause wafer fragmentation, resulting in significant losses.

[0004] Summary of the Invention

[0005] In order to avoid a large deviation between the center of the wafer and the center of the wafer chuck when the wafer transfer mechanism transfers the wafer to the wafer chuck, the present invention proposes a position teaching device and a position teaching method.

[0006] In one aspect, the present invention provides a position teaching device for teaching a wafer transfer mechanism how to place a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface and includes:

[0007] The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface;

[0008] a plurality of detection circuits, each detection circuit including a feedback element, wherein the plurality of feedback elements are disposed on the first positioning surface of the wafer simulation disk and are spaced apart along the circumference of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface, the detection circuit where the feedback element is located outputs a second feedback signal;

[0009] The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, make each detection circuit output the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and generate the position of the center of the wafer simulation disk in this state, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0010] According to a specific implementation of an embodiment of the present application, when the wafer simulation disk is built into the wafer chuck, the distance between the edge of the wafer simulation disk and the inner circumference of the wafer chuck does not exceed 0.1 mm.

[0011] According to a specific implementation of the embodiment of the present application, the distribution range of the plurality of feedback elements on the circumference of the wafer simulation disk is greater than one half of the circumference of the wafer simulation disk.

[0012] According to a specific implementation of the embodiment of the present application, the feedback element includes a moving contact, and the second positioning surface of the wafer chuck is provided with a static contact;

[0013] When the movable contact is in contact with the static contact, the detection circuit outputs a first feedback signal; when the movable contact is not in contact with the static contact, the detection circuit outputs a second feedback signal.

[0014] According to a specific implementation of the embodiment of the present application, the moving contact is a metal conductive layer.

[0015] According to a specific implementation of the embodiment of the present application, the feedback element includes a force-sensitive element;

[0016] When the force sensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a first feedback signal; when the force sensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a second feedback signal.

[0017] According to a specific implementation of the embodiment of the present application, the feedback element includes a photosensitive element;

[0018] When the photosensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a first feedback signal; when the photosensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a second feedback signal.

[0019] According to a specific implementation of the embodiment of the present application, each of the detection circuits further includes a signal display element.

[0020] According to a specific implementation of the embodiment of the present application, the signal display element includes: one or more combinations of an ammeter, a voltmeter, and a display light.

[0021] According to a specific implementation of an embodiment of the present application, the wafer simulation disk is made of insulating material.

[0022] In a second aspect, the present application provides a position teaching device for teaching a wafer transfer mechanism the position of a wafer placed in a wafer chuck, wherein the wafer chuck has a second positioning surface, comprising:

[0023] The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface;

[0024] a plurality of detection circuits, each detection circuit including a feedback element, wherein the plurality of feedback elements are arranged on the first positioning surface of the wafer simulation plate, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal;

[0025] The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck based on the position of each feedback element when each detection circuit outputs the first feedback signal, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0026] According to a specific implementation of the embodiment of the present application, the number of the detection loops is at least 3.

[0027] In a third aspect, the present application proposes a position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, comprising:

[0028] The wafer transfer mechanism carries a wafer simulation tray having a first positioning surface;

[0029] The wafer transfer mechanism supports and transfers the wafer dummy plate to a wafer chuck having a second positioning surface. When the wafer dummy plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0030] The relative position of the wafer dummy plate and the wafer chuck is detected using a plurality of detection circuits; each detection circuit includes a feedback element, and the plurality of feedback elements are arranged on the first positioning surface of the wafer dummy plate and are spaced apart along the circumference of the wafer dummy plate, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal;

[0031] A control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and make each detection circuit output the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and generate the position of the center of the wafer simulation disk in this state, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck and store it.

[0032] In a fourth aspect, the present application proposes a position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, comprising:

[0033] The wafer transfer mechanism carries a wafer simulation tray having a first positioning surface;

[0034] The wafer transfer mechanism supports and transfers the wafer dummy plate to a wafer chuck having a second positioning surface. When the wafer dummy plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0035] The relative position of the wafer dummy plate and the wafer chuck is detected using a plurality of detection circuits; each detection circuit includes a feedback element, and the plurality of feedback elements are arranged on the first positioning surface of the wafer dummy plate, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal;

[0036] A control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and based on the position of each feedback element when each detection circuit outputs the first feedback signal, obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the center position as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0037] The position teaching device and position teaching method of the present invention are used to teach a wafer transfer mechanism the position of a wafer placed in a wafer chuck, thereby ensuring that the center of the wafer is accurately aligned with the center of the wafer chuck when the wafer enters the wafer chuck. Other features and advantages of the present invention will be described in the following description and will become apparent from the description or learned through practice of the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures set forth in the description, claims, and drawings.

[0038] Summary of the Figures

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0040] FIG1 shows a cross-sectional structural diagram of an exemplary electroplating device to which the present invention is applied;

[0041] FIG2 a is a schematic structural diagram showing a state in which the center of a wafer and the center of a wafer chuck are not aligned according to an embodiment of the present invention;

[0042] FIG2 b is a schematic structural diagram showing a state in which the center of a wafer and the center of a wafer chuck are aligned according to an embodiment of the present invention;

[0043] FIG3 shows a schematic structural diagram of a position teaching device according to embodiment 1 of the present invention;

[0044] FIG4 shows a schematic flow chart of a position teaching method according to embodiment 1 of the present invention;

[0045] FIG5 is a schematic diagram showing the relative positions of the wafer simulation plate and the wafer chuck after teaching in Example 1 of the present invention;

[0046] FIG6 shows a schematic flow chart of a position teaching method according to Embodiment 2 of the present invention;

[0047] FIG7 a shows a schematic structural diagram of the wafer simulation plate and the wafer chuck in contact at point P1 according to Example 2 of the present invention;

[0048] FIG7 b shows a schematic structural diagram of the wafer simulation plate and the wafer chuck in contact at point P2 according to embodiment 2 of the present invention; and

[0049] FIG. 7 c shows a schematic structural diagram of the wafer simulation plate and the wafer chuck in contact at point P3 according to the second embodiment of the present invention.

[0050] Preferred embodiments of the present invention

[0051] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0052] Please refer to Figure 1, which shows a cross-sectional structural diagram of an exemplary electroplating device to which the present invention is applied. The electroplating device includes a wafer holding device 100, which is configured to clamp a wafer 20. The wafer holding device 100 includes a wafer chuck 110 with a cup-shaped structure, and the wafer chuck 110 has a second positioning surface 1101. In this embodiment, the second positioning surface 1101 is the inner circumferential surface of the wafer chuck 110. During the electroplating process, the wafer 20 is positioned in the wafer chuck 110. The wafer holding device 100 also includes a clamping plate 120 and a driving mechanism 130. The driving mechanism 130 drives the clamping plate 120 to move up and down. Under the drive of the driving mechanism 130, the clamping plate 120 can be lowered into the wafer chuck 110 to clamp the wafer 20 in the wafer chuck 110. Before the electroplating process begins, the wafer transfer mechanism 300 transports the wafer 20 to the wafer chuck 110, and then the drive mechanism 130 drives the clamp 120 to apply a vertical downward force to the wafer 20 to clamp the wafer 20. Subsequently, the wafer holding device 100 holding the wafer 20 enters the electroplating chamber 200 containing the electroplating solution for the electroplating process.

[0053] In the process of the above-mentioned wafer transfer mechanism 300 transporting the wafer 20 to the wafer chuck 110, it is expected that the center A of the wafer 20 is aligned with the center B of the wafer chuck 110 (that is, when observed along the center line direction of the wafer chuck, the center A coincides with the center B, as shown in Figure 2b), and it is not expected that the center A of the wafer 20 is misaligned with the center B of the wafer chuck 110 (that is, when observed along the center line direction of the wafer chuck, the center A does not coincide with the center B, as shown in Figure 2a). If the center A of the wafer 20 is misaligned with the center B of the wafer chuck 110 during the placement of the wafer 20 on the wafer chuck 110, on the one hand, the edge of the wafer 20 will collide with the inner circumference of the wafer chuck 110, generating particles. The particles will fall into the electroplating solution and contaminate the electroplating solution. During electroplating, the particles may be electroplated onto the wafer 20, affecting the quality of the electroplating of the wafer 20. On the other hand, the wafer 20 may be placed at an angle in the wafer chuck 110. When the drive mechanism 130 drives the clamping plate 120 to apply a vertical downward force to the wafer 20 to clamp the wafer 20, the wafer 20 may be easily crushed, resulting in a significant increase in production costs. Therefore, it is necessary to position the wafer 20 in the position shown in FIG. 2 b, with the center A of the wafer 20 coinciding with the center B of the wafer chuck 110.

[0054] Based on this, this application proposes a position teaching device and a position teaching method for teaching a wafer transfer mechanism the position of a wafer placed in a wafer chuck, thereby ensuring that the center of the wafer is accurately aligned with the center of the wafer chuck when the wafer enters the wafer chuck. The position teaching device and teaching method of this application are described in detail below.

[0055] Example 1

[0056] Please refer to Figure 3, which shows a schematic diagram of the structure of a position teaching device according to an embodiment of the present invention. The position teaching device includes: a wafer simulation disk 410, multiple detection circuits and a control device.

[0057] During the process of determining the teach position of the wafer transfer mechanism 300, the wafer dummy tray 410 replaces the wafer 20 in FIG. 1 and is carried and moved by the wafer transfer mechanism 300. When the wafer dummy tray 410 is placed within the wafer chuck 110, the distance between the sidewalls of the wafer dummy tray 410 and the inner circumference of the wafer chuck 110 (i.e., the second positioning surface 1101) does not exceed a preset value. The wafer dummy tray 410 has a first positioning surface 411. In this embodiment, the first positioning surface 411 is a sidewall of the wafer dummy tray 410. When the wafer dummy tray 410 is placed within the wafer chuck 110, the second positioning surface 1101 surrounds the outer side of the first positioning surface 411. It should be understood that when the wafer transfer mechanism 300 is used to move the wafer simulation disk 410 into the wafer chuck 110, out of the wafer chuck 110, and move it within a small range inside the wafer chuck 110, the wafer transfer mechanism 300 does not limit the fixing method of the wafer simulation disk 410, and can use adsorption fixation or non-adsorption fixation.

[0058] Furthermore, the size and shape of the wafer simulation disk 410 can be selected to be the same as the wafer 20 during the electroplating process to better simulate the wafer 20 during the electroplating process. When the size and shape of the wafer simulation disk 410 are the same as the wafer 20 during the electroplating process, when the wafer simulation disk 410 is placed in the wafer chuck 110, the maximum distance between the side wall of the wafer simulation disk 410 and the inner circumference of the wafer chuck 110 does not exceed the preset value, and the preset value can be any value between 0.01mm-3mm. For example, the preset value in the embodiment of the present application is 0.1mm. It is worth noting that the size and shape of the wafer simulation disk 410 are not required to be exactly the same as the wafer 20, and can be designed according to actual needs to meet the teaching requirements. The manufacturing material of the wafer simulation disk 410 in the embodiment of the present invention is an insulating material.

[0059] In this embodiment, the distribution range of the feedback elements 421 of the multiple detection circuits on the circumference of the wafer simulation disk 410 is greater than one-half of the circumference of the wafer simulation disk 410. Furthermore, the multiple feedback elements 421 are arranged on the first positioning surface 411 of the wafer simulation disk 410 and are spaced apart along the circumferential direction of the wafer simulation disk 410. When the feedback element 421 contacts the second positioning surface 1101, the corresponding detection circuit outputs a first feedback signal; when the feedback element 421 is not in contact with the second positioning surface 1101, the corresponding detection circuit outputs a second feedback signal, and the first feedback signal is different from the second feedback signal. The feedback element 421 can be selected from but not limited to conductive contacts, force sensitive elements, photosensitive elements, etc.

[0060] Furthermore, the detection circuit also includes a signal display element, which includes one or more combinations of an ammeter, a voltmeter, and a display light. As long as the display element can display the feedback signal output by the detection circuit, it is applicable to the protection scope of this application.

[0061] The control device is configured to control the wafer transfer mechanism 300 to hold the wafer simulation disk 410, adjust the position of the wafer simulation disk 410 in the wafer chuck 110, and make each detection circuit output a second feedback signal, so that each feedback element 421 and the second positioning surface 1101 of the wafer chuck 110 are in a non-contact state, and generate the position of the center of the wafer simulation disk 410 in this state, and use it as the teaching position for the wafer transfer mechanism 300 to place the wafer in the wafer chuck 110.

[0062] Exemplarily, in this embodiment, the wafer simulation disk 410 is made of insulating material and the size and shape of the wafer simulation disk 410 are the same as the wafer 20 in the actual electroplating process; the feedback element 421 in each detection circuit includes a moving contact, and each detection circuit also includes a conductive member 422, a power supply 423 and a static contact, and the static contact is arranged on the second positioning surface 1101 of the wafer chuck 110, wherein the power supply 423, the moving contact and the static contact form a series circuit through the conductive member 422. During the movement of the wafer simulation disk 410 in the wafer chuck 110, when the moving contact contacts the static contact, the detection circuit is turned on and outputs a first feedback signal; when the moving contact is not in contact with the static contact, the detection circuit is disconnected and outputs a second feedback signal. Exemplarily, in this embodiment, the signal display element can select a display light 424 connected in series in the detection circuit. During the teaching process, if a detection circuit outputs a first feedback signal, it indicates that the moving contact and the stationary contact are in contact. At this time, the detection circuit is conductive, and the first feedback signal output by the detection circuit is manifested as the display light 424 being illuminated. When the moving contact and the stationary contact are not in contact, the detection circuit is disconnected, and the second feedback signal output is manifested as the display light 424 being unlit. When the control device controls the wafer transfer mechanism 300 to hold the wafer dummy disk 410 and adjusts the position of the wafer dummy disk 410 within the wafer chuck 110, each detection circuit outputs a second feedback signal, i.e., the display lights 424 are unlit, indicating that each feedback element 421 is in a non-contact state with the second positioning surface 1101 of the wafer chuck 110. At this point, because the size and shape of wafer dummy plate 410 are identical to those of wafer 20 during the electroplating process, the maximum distance between the edge of wafer dummy plate 410 and the inner circumference of wafer chuck 110 does not exceed the preset value of 0.1 mm. Therefore, it can be considered that the actual wafer 20 is safe when placed in this position, and the electroplating quality can be guaranteed. The control device then generates the position of the center of wafer dummy plate 410 in this state, and uses this position as the teaching position for wafer transfer mechanism 300 to place the wafer in wafer chuck 110. It should be understood that in this embodiment, the signal display element may also be selected from one or more combinations of an ammeter, a voltmeter, and a display light connected in series in the detection circuit.

[0063] It should be noted that the inner circumference of the wafer chuck 110 is generally made of a conductive material. Therefore, in this embodiment, the static contact can be the entire inner circumference of the wafer chuck 110. The moving contact is a metal conductive layer that is as thin as possible to reduce the interference of the thickness of the metal conductive layer on the teaching position. During teaching, because the moving contact is set on the first positioning surface 411 of the wafer simulation disk 410, the thickness of the moving contact itself can also be considered as part of the wafer simulation disk 410 itself. The distance between the wafer simulation disk 410 and the inner circumference of the wafer chuck 110 is already very small. If the thickness of the metal conductive layer is too thick, during teaching, the distance between the first positioning surface 411 provided with the feedback element 421 and the second positioning surface 1101 of the wafer chuck 110 will be significantly different from the distance between the first positioning surface 411 without the feedback element 421 and the second positioning surface 1101 of the wafer chuck 110, and it is impossible to ensure that the distance between the first positioning surface 411 and the second positioning surface 1101 is basically uniform. Therefore, in order to reduce the interference of the thickness of the metal conductive layer on the teaching position, the metal conductive layer can be plated on the first positioning surface 411 of the wafer simulation plate 410.

[0064] In another embodiment, the feedback element 421 includes a force-sensitive element. The pressure between the first positioning surface 411 of the wafer simulation disk 410 and the second positioning surface 1101 of the wafer chuck 110 changes significantly when the two are in contact and when they are not in contact. Therefore, the characteristic of the force-sensitive element that changes in response to changes in external pressure can be utilized to make the detection circuit output different feedback signals, thereby accurately judging the contact state between the wafer simulation disk 410 and the wafer chuck 110. Specifically, when the force-sensitive element is in contact with the second positioning surface 1101 of the wafer chuck 110, the detection circuit outputs a first feedback signal; when the force-sensitive element is not in contact with the second positioning surface 1101 of the wafer chuck 110, the detection circuit outputs a second feedback signal. Exemplarily, force-sensitive elements include but are not limited to resistive, capacitive, piezoelectric, and the like. Taking a force-sensitive resistor as a force-sensitive element and an ammeter connected in series in a detection circuit as a signal display element as an example, when the force-sensitive resistor is in contact with the second positioning surface 1101 of the wafer chuck 110, the force-sensitive resistor has a first resistance value, the ammeter outputs a first current value, and the first current value is used as the first feedback signal output by the detection circuit; similarly, when the force-sensitive resistor is not in contact with the second positioning surface 1101 of the wafer chuck 110, the force-sensitive resistor has a second resistance value, the ammeter outputs a second current value, and the second current value is used as the second feedback signal output by the detection circuit. Based on this, the control device can obtain the center position of the wafer simulation disk when each detection circuit outputs the second current value as the teaching position of the wafer transfer mechanism.

[0065] In another embodiment, the feedback element 421 includes a photosensitive element. The brightness of the light between the first positioning surface 411 of the wafer simulation disk 410 and the second positioning surface 1101 of the wafer chuck 110 is significantly different when the two are in contact and when they are not in contact. Therefore, the characteristic of the photosensitive element that changes with the brightness of the light can be utilized to make the detection circuit output different feedback signals, thereby accurately judging the contact state between the wafer simulation disk 410 and the wafer chuck 110. Specifically, when the photosensitive element is in contact with the second positioning surface of the wafer chuck, the photosensitive element cannot receive light, and at this time, the detection circuit outputs a first feedback signal; when the photosensitive element is not in contact with the second positioning surface of the wafer chuck, the photosensitive element can receive light, and the detection circuit outputs a second feedback signal. Exemplarily, photosensitive elements include but are not limited to resistive, capacitive, piezoelectric, etc. In one example, a photoresistor can be selected as the feedback element 421, and an ammeter can be selected as the signal display element. The ammeter is connected in series in the corresponding detection circuit. The working principle of this example is similar to the example of using a force-sensitive resistor as the feedback element 421 and an ammeter as the signal display element. Please refer to the relevant description above and will not repeat it here.

[0066] It should be noted that the signal display element can be selected based on the specific type of feedback element, and the circuit connection relationship of the signal display element in the detection circuit can be designed accordingly based on the specific type of signal display element. For example, when a force-sensitive capacitor is used as the feedback element, a voltmeter can be selected as the signal display element. This voltmeter is connected in parallel with the force-sensitive capacitor to display the voltage value of the force-sensitive capacitor, and the voltage value is used as the feedback signal output by the detection circuit.

[0067] Furthermore, it should be noted that the feedback element may also be a sensor including a force-sensitive element or a light-sensitive element, such as a pressure sensor or a light sensor. In this case, the corresponding detection value displayed by the sensor can be directly used as the feedback signal output by the detection circuit, so that the control device can control the operation of the wafer dummy disk 410 based on the detection value.

[0068] This embodiment is matched with a position teaching method for teaching the wafer transfer mechanism the position of placing the wafer in the wafer chuck. As shown in FIG4 , the position teaching method includes:

[0069] Step S410: The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface;

[0070] Step S420: The wafer transfer mechanism supports and transfers the wafer dummy plate to a wafer chuck having a second positioning surface. When the wafer dummy plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0071] Step S430: Detecting the relative position of the wafer dummy plate and the wafer chuck using a plurality of detection circuits; each detection circuit includes a feedback element, and the plurality of feedback elements are disposed on a first positioning surface of the wafer dummy plate and spaced apart along the circumference of the wafer dummy plate. When a feedback element contacts a second positioning surface, the detection circuit outputs a first feedback signal; when a feedback element does not contact the second positioning surface of the wafer chuck, the detection circuit outputs a second feedback signal.

[0072] Step S440: Use the control device to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and make each detection circuit output a second feedback signal to make each feedback element and the wafer chuck in a non-contact state, as shown in Figure 5, and generate the position of the center of the wafer simulation disk in this state, and use it as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck and store it.

[0073] Example 2

[0074] This embodiment provides a position teaching device, the structure of which is substantially the same as that of the position teaching device in Embodiment 1, except that the number of feedback elements in this embodiment is at least three. The control device is configured to control the wafer transfer mechanism 300 to maintain the wafer dummy plate 410 while adjusting the position of the wafer dummy plate 410 within the wafer chuck 110. Based on the position of each feedback element 410 when each detection circuit outputs a first feedback signal, the control device obtains the contact point positions of each feedback element 410 with the second positioning surface 1101 of the wafer chuck 110. Based on the multiple contact point positions, the center position of a circle containing the multiple contact points is calculated, and the center position is used as the taught position for the wafer transfer mechanism 300 to place the wafer within the wafer chuck 110. This taught position ensures that the wafer 20 transferred by the wafer transfer mechanism 300 is accurately aligned with the wafer chuck 110 during the actual process, preventing the wafer 20 from colliding with the wafer chuck 110 due to placement deviation.

[0075] At the same time, this embodiment also provides a position teaching method for teaching the wafer transfer mechanism the position of placing the wafer in the wafer chuck. As shown in FIG6 , the position teaching method of this embodiment includes:

[0076] Step S610: enabling a wafer transfer mechanism to carry a wafer simulation plate having a first positioning surface;

[0077] Step S620: The wafer transfer mechanism supports and transfers the wafer dummy plate to a wafer chuck having a second positioning surface. When the wafer dummy plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface.

[0078] Step S630: Detecting the relative position of the wafer dummy plate and the wafer chuck using a plurality of detection circuits; each detection circuit includes a feedback element, and the plurality of feedback elements are disposed on the first positioning surface of the wafer dummy plate. When the feedback element contacts the second positioning surface, the detection circuit outputs a first feedback signal; when the feedback element does not contact the second positioning surface of the wafer chuck, the detection circuit outputs a second feedback signal.

[0079] Step S640: Use the control device to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and based on the position of each feedback element when each detection circuit outputs the first feedback signal, obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck, and calculate the center position of the circle where the multiple contact points are located based on the positions of the multiple contact points, and use the center position as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

[0080] Specifically, referring to Figures 7a, 7b, and 7c, the control device controls the wafer transfer mechanism 300 to hold the wafer dummy plate 410 and drive the wafer dummy plate 410 to move in the wafer chuck 110. The control device first controls the wafer transfer mechanism 300 to drive the wafer dummy plate 410 to move in the direction closest to the feedback element 421A, so that the feedback element 421A is tangent to the second positioning surface of the wafer chuck 110. The contact point when tangent is P1 (x1, y1); then control the wafer transfer mechanism 300 to drive the wafer simulation disk 410 to move in the direction closest to the feedback element 421B, so that the feedback element 421B is tangent to the second positioning surface of the wafer chuck 110, and the contact point when tangent is P2 (x2, y2); then control the wafer transfer mechanism to drive the wafer simulation disk 410 to move in the direction closest to the feedback element 421C, so that the feedback element 421C is tangent to the second positioning surface of the wafer chuck 110, and the contact point when tangent is P3 (x3, y3); the three contact points P1 (x1, y1), P2 (x2, y2) and P3 (x3, y3) are all on the second positioning surface of the wafer chuck 110, and the control device calculates the center coordinates of the circle where the three contact points are located based on the coordinates of the three contact points determined, and the center coordinates are the center coordinates of the wafer chuck 110. In the actual process, if the wafer transfer mechanism 300 aligns the center of the wafer 20 it carries with the center coordinates of the circle for placement, the accuracy of wafer placement can be guaranteed. Therefore, the center coordinates of the circle are used as the teaching position for the wafer transfer mechanism 300 to place the wafer in the wafer chuck 110. When the wafer transfer mechanism 300 transfers the wafer 20 to the wafer chuck 110 in the actual process, the center of the wafer 20 is directly aligned with the obtained teaching position, thereby ensuring the accuracy of wafer 20 placement. Through the position teaching device and teaching method of this embodiment, the position of the wafer transfer mechanism when placing the wafer can be determined more accurately, thereby preventing the risk of collision, scratches or fragments caused by the wafer being placed off-center. The teaching position obtained by the device and method of this embodiment is more accurate, thereby ensuring that the wafer 20 can be more accurately aligned with the wafer chuck 110 when entering the electroplating chamber, avoiding the phenomenon that particles generated by the friction between the wafer and the wafer chuck 110 contaminate the electroplating solution, thereby further improving the working efficiency of the electroplating process while ensuring the quality of electroplating.

[0081] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A position teaching device for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface, characterized in that: include: The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface; A plurality of detection loops, each detection loop comprising a feedback element, wherein the plurality of feedback elements are arranged on a first positioning surface of the wafer simulation disk and are spaced apart along a circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection loop where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface, the detection loop where the feedback element is located outputs a second feedback signal; The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, make each detection circuit output the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and generate the position of the center of the wafer simulation disk in this state, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

2. The position teaching device according to claim 1, characterized in that: When the wafer simulation disk is built into the wafer chuck, the distance between the edge of the wafer simulation disk and the inner circumference of the wafer chuck does not exceed 0.1 mm.

3. The position teaching device according to claim 1, characterized in that: The distribution range of the plurality of feedback elements on the circumference of the wafer simulation disk is greater than one half of the circumference of the wafer simulation disk.

4. The position teaching device according to claim 1, characterized in that: The feedback element comprises a moving contact, and the second positioning surface of the wafer chuck is provided with a stationary contact; When the moving contact contacts the static contact, the detection circuit outputs a first feedback signal; When the moving contact is out of contact with the static contact, the detection circuit outputs a second feedback signal.

5. The position teaching device according to claim 4, characterized in that: The moving contact is a metal conductive layer.

6. The position teaching device according to claim 1, characterized in that: The feedback element includes a force-sensitive element; When the force sensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a first feedback signal; when the force sensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the force sensitive element is located outputs a second feedback signal.

7. The position teaching device according to claim 1, characterized in that: The feedback element includes a photosensitive element; When the photosensitive element contacts the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a first feedback signal; when the photosensitive element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the photosensitive element is located outputs a second feedback signal.

8. The position teaching device according to claim 1, characterized in that: Each of the detection circuits further includes a signal display element.

9. The position teaching device according to claim 8, characterized in that: The signal display element includes: one or more combinations of an ammeter, a voltmeter, and a display light.

10. The position teaching device according to claim 1, characterized in that: The wafer simulation disk is made of insulating material.

11. A position teaching device for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, wherein the wafer chuck has a second positioning surface, characterized in that: include: The wafer simulation plate has a first positioning surface, and when the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface; A plurality of detection circuits, each detection circuit comprising a feedback element, wherein the plurality of feedback elements are arranged on the first positioning surface of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; and when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal; The control device is configured to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and obtain the contact point position of each feedback element with the second positioning surface of the wafer chuck based on the position of each feedback element when each detection circuit outputs the first feedback signal, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the position of the center of the wafer simulation disk as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

12. The position teaching device according to claim 11, characterized in that: The number of the detection loops is at least 3.

13. A position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, characterized in that: include: The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface; The wafer transfer mechanism supports and transports the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface. A plurality of detection circuits are used to detect the relative position of the wafer simulation disk and the wafer chuck; each detection circuit includes a feedback element, and a plurality of the feedback elements are arranged on the first positioning surface of the wafer simulation disk and are spaced apart along the circumferential direction of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; when the feedback element is not in contact with the second positioning surface of the wafer chuck, the detection circuit where the feedback element is located outputs a second feedback signal; A control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, and adjust the position of the wafer simulation disk in the wafer chuck, so that each detection circuit outputs the second feedback signal, so that each feedback element and the wafer chuck are in a non-contact state, and the position of the center of the wafer simulation disk in this state is generated, and the position of the center of the wafer simulation disk is used as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck and is stored.

14. A position teaching method for teaching a wafer transfer mechanism the position of placing a wafer in a wafer chuck, characterized in that: include: The wafer transfer mechanism carries a wafer simulation plate having a first positioning surface; The wafer transfer mechanism supports and transports the wafer simulation plate to a wafer chuck having a second positioning surface. When the wafer simulation plate is placed in the wafer chuck, the second positioning surface surrounds the outer side of the first positioning surface. The relative position of the wafer simulation disk and the wafer chuck is detected by using a plurality of detection circuits; each detection circuit includes a feedback element, and a plurality of the feedback elements are arranged on a first positioning surface of the wafer simulation disk, wherein when the feedback element contacts the second positioning surface, the detection circuit where the feedback element is located outputs a first feedback signal; the feedback element is not in contact with the second positioning surface of the wafer chuck. When in contact, the detection circuit where the feedback element is located outputs a second feedback signal; The control device is used to control the wafer transfer mechanism to hold the wafer simulation disk, adjust the position of the wafer simulation disk in the wafer chuck, and based on the position of each feedback element when each detection circuit outputs the first feedback signal, obtain the contact point position of each feedback element and the second positioning surface of the wafer chuck, and calculate the center position of the circle where the multiple contact points are located based on the multiple contact point positions, and use the center position as the teaching position for the wafer transfer mechanism to place the wafer in the wafer chuck.

Images